Plating equipment and resistors for plating equipment

Abstract

A plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated is proposed. The plating apparatus resistor is a plating apparatus resistor for adjusting an electric field, which is placed between an anode and a holder that holds an object to be plated in a plating apparatus, the plating apparatus resistor having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the plating apparatus resistor further having an insert placed inside the body, the insert having a plurality of through holes, the insert being movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

Description

[Technical field]

[0001] The present application relates to a plating apparatus and a resistor for use in a plating apparatus. [Background technology]

[0002] As an example of a plating apparatus using electrolytic plating, there is known a so-called dip-type plating apparatus in which a substrate (e.g., a semiconductor wafer) and an anode are arranged to face each other horizontally (see, for example, Patent Document 1). As another example of a plating apparatus using electrolytic plating, there is known a cup-type plating apparatus (see, for example, Patent Document 2). In the cup-type plating apparatus, a substrate held by a substrate holder with the surface to be plated facing downward is immersed in a plating solution, and a voltage is applied between the substrate and the anode to deposit a conductive film (plating film) on the surface of the substrate.

[0003] In such plating apparatus, the substrate generally has an electrical contact on its periphery. Due to the difference in distance from the electrical contact, a potential difference occurs between the periphery and the center of the substrate during plating, which may cause bias in the plating current. For this reason, it has been known to place a resistor for adjusting the electric field between the substrate and the anode in order to improve the uniformity of the thickness of the plating film formed on the substrate. Also, a plating apparatus has been proposed in which the size of the hole in the resistor is variable in order to allow greater freedom in adjusting the electric field (see Patent Document 3). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7462125 [Patent Document 2] Patent No. 7079388 [Patent Document 3] Patent No. 7204060 Summary of the Invention [Problem to be solved by the invention]

[0005] In a plating apparatus, in addition to the distance relationship with the electrical contacts, the resist pattern formed on the substrate may cause deviation in the thickness of the plating film. In other words, if the surface to be plated of the substrate contains a certain amount of regions (non-opening regions) where resist openings are not formed, the plating current does not flow in the non-opening regions, and the plating current concentrates on the periphery of the non-opening regions, resulting in a large thickness of the plating film. As a specific example, when resist openings are formed only in a roughly cross-shaped region on the substrate, the resist openings are not formed in the region outside the cross, so that no current flows, and the uniformity of the thickness of the plating film may be impaired. Here, for example, in Patent Document 1, an anode mask capable of adjusting the dimensions of the anode opening is used to adjust the electric field between the anode and the substrate. However, the conventional configuration was designed to deal with the variation in the plating film thickness caused by the configuration of the plating apparatus, such as the electrical contacts, and there were cases where it was not possible to adequately deal with the variation in the plating film thickness caused by the resist pattern of the substrate. It is possible to form dummy openings in the non-opening regions to make the thickness of the plating film uniform, but this increases the cost of the plating process because a process for forming the dummy openings is required and unnecessary plating is formed in the dummy openings.

[0006] The present invention has been made in view of the above problems, and one of its objects is to provide a plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated.

[0007] According to one embodiment, a resistor for a plating apparatus is provided, the resistor for the plating apparatus being a resistor for adjusting an electric field that is arranged in a plating apparatus between an anode and a holder that holds an object to be plated, the resistor for the plating apparatus having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the resistor for the plating apparatus further having an insert arranged inside the body, the insert having a plurality of through holes, the insert being movable between a first position in which the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position in which the plurality of through holes of the insert do not communicate with the plurality of through holes of the body. [Brief description of the drawings]

[0008] [Figure 1] 1 is a perspective view showing an overall configuration of a plating apparatus according to an embodiment; [Diagram 2] 1 is a plan view showing an overall configuration of a plating apparatus according to an embodiment; [Diagram 3] 1 is a vertical cross-sectional view showing a schematic configuration of a plating module according to one embodiment; [Figure 4A] 4 is a cross-sectional schematic diagram of a resistor that can be used in the plating module shown in FIG. 3, according to one embodiment. [Figure 4B] FIG. 4B is a vertical cross-sectional view that illustrates the resistor shown in FIG. 4A. [Figure 5A] 4 is a cross-sectional schematic diagram of a resistor that can be used in the plating module shown in FIG. 3, according to one embodiment. [Figure 5B] FIG. 5B is a vertical cross-sectional view that illustrates a schematic view of the resistor shown in FIG. 5A. [Figure 6] 4 is a cross-sectional schematic diagram of a resistor that can be used in the plating module shown in FIG. 3, according to one embodiment. [Figure 7] 4 is a cross-sectional schematic diagram of a resistor that can be used in the plating module shown in FIG. 3, according to one embodiment. [Figure 8]4 is a cross-sectional schematic diagram of a resistor that can be used in the plating module shown in FIG. 3, according to one embodiment. [Figure 9A] FIG. 4 is a schematic perspective view of a portion of a resistor that can be used in the plating module shown in FIG. 3, according to one embodiment. [Figure 9B] FIG. 9B is a cross-sectional perspective view showing a portion of the resistor shown in FIG. 9A. [Figure 9C] FIG. 9B is a cross-sectional perspective view showing a portion of the resistor shown in FIG. 9A. [Figure 10] FIG. 13 is a top view showing the placement of an insert according to one embodiment. [Figure 11] FIG. 13 is a top view showing the placement of an insert according to one embodiment. [Figure 12] 1 is a flow chart illustrating an example of a method for setting an operating recipe for resistors, anode masks, and shields by a control module. [Figure 13] FIG. 2 is a diagram showing a schematic diagram of a resist pattern formed on a surface to be plated of a substrate according to an embodiment of the present invention. [Figure 14] 1 is a flow chart illustrating an example of a method for setting a recipe for resistor, anode mask, and shield operation by a control module during a plating process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and redundant description will be omitted.

[0010] <Overall configuration of plating equipment> Fig. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. Fig. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0011] The load port 100 is a module for loading a substrate stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading a substrate from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring a substrate, and is configured to transfer the substrate between the load port 100, the aligner 120, and the transfer device 700. When transferring the substrate between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrate via a temporary placement table (not shown).

[0012] The aligner 120 is a module for aligning the position of an orientation flat, a notch, etc. of a substrate to a predetermined direction. In this embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 wets the surface to be plated of the substrate before plating with a treatment liquid such as pure water or degassed water, thereby replacing air inside a pattern formed on the substrate surface with the treatment liquid. The pre-wet module 200 is configured to perform a pre-wet process that makes it easier to supply plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with a plating liquid during plating. In this embodiment, two pre-wet modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wet modules 200 are arbitrary.

[0013] The presoak module 300 is configured to perform a presoak process in which an oxide film with high electrical resistance present on the surface of a seed layer formed on the plated surface of a substrate before plating is etched away with a treatment liquid such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are arbitrary. The plating module 400 performs plating on the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged in a vertical arrangement of three modules and a horizontal arrangement of four modules, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0014] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers are arranged vertically, but the number and arrangement of the spin rinse dryers are arbitrary. The transport device 700 is a device for transporting the substrate between multiple modules in the plating apparatus 1000. The control module 800 is configured to control multiple modules of the plating apparatus 1000, and can be configured from a general computer or a dedicated computer equipped with an input / output interface with an operator, for example.

[0015] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is carried into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette in the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, etc. of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the transfer apparatus 700.

[0016] The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wet module 200. The pre-wet module 200 performs a pre-wet process on the substrate. The transfer device 700 transfers the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transfer device 700 transfers the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0017] The transfer device 700 transfers the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer device 700 delivers the dried substrate to the transfer robot 110. The transfer robot 110 transfers the substrate received from the transfer device 700 to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0018] <Plating module configuration> Next, a description will be given of the configuration of the plating module 400. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described.

[0019] Fig. 3 is a vertical cross-sectional view showing a schematic configuration of a plating module 400 of this embodiment. As shown in Fig. 3, the plating module 400 includes a plating tank 410 for containing a plating solution. The plating tank 410 includes a cylindrical inner tank with an open top, and an outer tank (not shown) provided around the inner tank to collect plating solution that overflows from the upper edge of the inner tank.

[0020] The plating module 400 includes a substrate holder 440 for holding the substrate Wf with the plating surface Wf-a facing downward. The substrate holder 440 also includes a power supply contact (not shown) for supplying power to the substrate Wf from a power source (not shown). In one embodiment, the power supply contact is in contact with the outer edge of the substrate Wf to supply power to the outer edge of the substrate Wf. The plating module 400 includes a lifting mechanism 442 for lifting and lowering the substrate holder 440. In one embodiment, the plating module 400 also includes a rotation mechanism 448 for rotating the substrate holder 440 around a vertical axis. The lifting mechanism 442 and the rotation mechanism 448 can be realized by known mechanisms such as motors.

[0021] The plating module 400 includes a membrane 420 that vertically divides the inside of a plating tank 410. The inside of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the membrane 420. The cathode region 422 and the anode region 424 are each filled with a plating solution. Note that, although an example in which the membrane 420 is provided has been shown in this embodiment, the membrane 420 may not be provided.

[0022] An anode 430 is provided on the bottom surface of the anode region 424 of the plating tank 410. The anode 430 is, for example, a circular member having a plate surface with dimensions approximately equal to the plate surface of the substrate Wf. In addition, an anode mask 426 for adjusting the electric field between the anode 430 and the substrate Wf is arranged in the anode region 424. The anode mask 426 is provided near the anode 430 and is, for example, a substantially plate-shaped electric field shield made of a dielectric material. The anode mask 426 has an opening through which a current flows between the anode 430 and the substrate Wf. In this embodiment, the anode mask 426 is configured to be able to change the opening dimensions, and the opening dimensions are adjusted by the control module 800. Here, the opening dimensions refer to the diameter when the opening is circular, and the length of one side or the longest opening width when the opening is polygonal. A known mechanism can be adopted to change the opening dimensions in the anode mask 426. In the present embodiment, an example in which the anode mask 426 is provided has been shown, but the anode mask 426 may not be provided. Furthermore, the membrane 420 described above may be provided in the opening of the anode mask 426.

[0023] The plating module 400 includes a resistor 450 disposed between the substrate Wf and the anode 430. In this embodiment, the resistor 450 is disposed in the cathode region 422. The resistor 450 is a member for adjusting the electric field to uniformize the plating process on the plated surface Wf-a of the substrate Wf. The resistor 450 increases the resistance value between the anode 430 and the substrate Wf, making it difficult for the electric field to spread, and as a result, the distribution of the plating film thickness formed on the plated surface Wf-a of the substrate Wf can be made uniform. Therefore, when the distance between the substrate Wf and the resistor 450 increases, the space in which the electric field between the substrate Wf and the resistor 450 can spread increases. For this reason, it is preferable that the resistor 450 is disposed near the plated surface Wf-a of the substrate Wf. The resistor 450 will be described in detail later.

[0024] The plating module 400 also includes a paddle 480 disposed between the substrate Wf held by the substrate holder 440 and the resistor 450, and a paddle stirring mechanism 482 for moving the paddle 480 in the plating solution to stir the plating solution. The paddle 480 can be formed, for example, by a plate member having a number of honeycomb-shaped holes formed therein, but is not limited thereto. The paddle stirring mechanism can be realized, for example, by a known mechanism such as a motor. The paddle stirring mechanism 482 is configured to stir the plating solution in the vicinity of the plating surface Wf-a of the substrate Wf by reciprocating the paddle 480 along the plating surface Wf-a of the substrate Wf. However, the present invention is not limited to this example, and the paddle stirring mechanism 482 may be configured to reciprocate the paddle 480 perpendicularly to the plating surface Wf-a, for example. In addition, in the present embodiment, an example in which the paddle 480 and the paddle stirring mechanism 482 are provided has been shown, but the paddle 480 and the paddle stirring mechanism 482 may not be provided.

[0025] Further, the cathode region 422 is provided with a sensor 460 for detecting a parameter related to the plating film formed on the plating surface Wf-a of the substrate Wf. In this embodiment, the parameter related to the plating film means a physical quantity for estimating the thickness of the plating film or the formation speed of the plating film. The sensor 460 is arranged to face the plating surface Wf-a. In this embodiment, the sensor 460 is configured to be movable so that the detection position can be changed along the radial direction of the substrate Wf. However, this is not limited to this example, and a plurality of sensors 460 facing the plating surface Wf-a may be provided. Furthermore, in one embodiment, the detection end of the sensor 460 is arranged inside the resistor 450. However, this is not limited to this example, and the sensor 460 may be provided in another location outside the resistor 450, for example.

[0026] The detection signal by the sensor 460 is input to the control module 800. In this embodiment, a potential sensor having a detection electrode (not shown) is used as the sensor 460. The detection electrode of the sensor 460 may be arranged so as to face the surface Wf-a to be plated, or may be arranged in a conduit arranged so as to face the surface Wf-a to be plated and the inside of which is filled with a plating solution. When a potential sensor is used as the sensor 460, at least one reference potential sensor 462 may be provided in the plating tank 410. The reference potential sensor 462 may be provided outside the region between the substrate Wf and the anode 430. In other words, the reference potential sensor 462 may be provided at a position that does not overlap the substrate Wf and the anode 430 when viewed from a direction perpendicular to the surface Wf-a to be plated of the substrate Wf. The control module 800 can estimate the formation speed of the plating film formed on the surface Wf-a to be plated based on the potential difference between the sensor 460, which is a potential sensor, and the reference potential sensor 462, and can measure the thickness of the plating film. This is based on the correlation between the plating current and the potential in the plating process. However, the sensor 460 may be any sensor capable of detecting parameters related to the plating film, and other sensors such as optical distance sensors such as white light confocal sensors, magnetic field sensors, or eddy current sensors may be used instead of or in addition to the potential sensor. Note that, although an example in which the sensor 460 for detecting parameters related to the plating film is provided has been shown in the present embodiment, the sensor 460 may not be provided.

[0027] A shield 470 for shielding a current flowing from the anode 430 to the substrate Wf is provided in the cathode region 422. In this embodiment, the shield 470 is provided at the same height as the paddle 480, but is not limited to this example. The shield 470 is, for example, a substantially plate-shaped member made of a dielectric material. The shield 470 is configured to be movable between a shielding position interposed between the plating surface Wf-a of the substrate Wf and the anode 430, and a retreated position retreated from between the plating surface Wf-a and the anode 430. In other words, the shield 470 is configured to be movable between a shielding position below the plating surface Wf-a and a retreated position away from below the plating surface Wf-a. The position of the shield 470 is controlled by a drive mechanism 472 that receives a command from the control module 800. The drive mechanism 472 can be realized by a known mechanism such as a motor or a solenoid.

[0028] <Resistor> The resistor 450 of this embodiment will be described in detail. FIG. 4A is a cross-sectional view that shows a resistor 450 shown in FIG. 3 according to one embodiment. FIG. 4B is a vertical-sectional view that shows a resistor 450 shown in FIG. 4A. The resistor 450 of this embodiment includes a disk-shaped main body 452, a first insert 456A in the shape of an arc plate disposed inside the main body 452, and a second insert 456B. In other words, the main body 452 includes an annular space 455 inside, and the first insert 456A and the second insert 456B in the shape of an arc plate are disposed in the annular space 455. The main body 452 and the two inserts 456A and 456B are members having a higher electrical resistivity than the plating solution, and are preferably dielectric materials. The main body 452 and the inserts 456A and 456B may be formed of the same material or different materials.

[0029] In one embodiment, the main body 452 is a circular plate-like member fixed to the plating tank 410 and slightly larger than the substrate Wf when viewed from above. The main body 452 may be configured to be movable up and down in the plating tank 410, for example. As shown in FIGS. 4A and 4B, the main body 452 has a plurality of through holes 453 that communicate with the upper surface 452-a and the lower surface 452-b of the main body 452. In other words, the main body 452 has a plurality of through holes 453 that open to the substrate holder 440 side and the anode 430 side. In FIG. 4A, the through holes 453 are indicated by dashed lines. Each of the plurality of through holes 453 is a through hole of the same size, and defines an elongated opening whose circumferential length is about twice its radial length. However, the present invention is not limited to such an example, and each of the plurality of through holes 453 may be a perfect circle when viewed from above, or may have any other shape, and may be a through hole of different dimensions. In one embodiment, the through holes 453 are arranged on two or more imaginary reference circles (see dashed lines in FIG. 4A) that are concentric and have different diameters. In this case, in one embodiment, the through holes 453 arranged on adjacent reference circles are arranged at positions where the angular positions on the reference circles are shifted from each other. In other words, the through holes 453 arranged on adjacent reference circles are arranged so that the centers of the through holes 453 are not aligned on a straight line extending in the radial direction, but are shifted in the circumferential direction. However, the arrangement of the through holes 453 is not limited to this example, and the through holes 453 may be aligned on a straight line extending in the radial direction, or the above-mentioned arrangement of the through holes 453 may be adopted only in a part of the region. Note that in FIG. 4A, the through holes 453 are sparsely illustrated for clarity of illustration, but in an actual design, more through holes 453 are formed in the main body 452.

[0030] As shown in FIG. 4A, the first insert 456A and the second insert 456B are arcuate plate-shaped members when viewed from above. As described above, the first insert 456A and the second insert 456B are disposed in an annular space 455 formed inside the main body 452. Also, the first insert 456A and the second insert 456B are disposed concentrically with the substrate Wf or the anode 430 when viewed from above. In one embodiment, the first insert 456A and the second insert 456B have a smaller size than the substrate Wf or the anode 430 when viewed from above, and are disposed closer to the center than the periphery of the substrate Wf or the anode 430 (see FIG. 3). As described later, the first insert 456A and the second insert 456B are each movable in the circumferential direction within the annular space 455 formed inside the main body 452.

[0031] The first insert 456A has a through hole 457A that communicates with the upper surface and the lower surface of the first insert 456A. ​​In other words, the first insert 456A has a plurality of through holes 457A that open to the substrate holder 440 side and the anode 430 side. In FIG. 4A, the through hole 457A is indicated by a solid line. In one embodiment, the plurality of through holes 457A are arranged on two or more imaginary reference circles (see the dashed line in FIG. 4A) that are concentric and have different diameters. In other words, the plurality of through holes 457A are arranged so as to be dispersed in the radial direction of the first insert 456A. ​​In this case, in one embodiment, the plurality of through holes 457A arranged on adjacent reference circles are arranged at positions where the angular positions on the reference circles are shifted from each other. In other words, the centers of the through holes 457A arranged on adjacent reference circles are not aligned on a straight line extending in the radial direction, but are shifted in the circumferential direction. However, the multiple through holes 457A are not limited to this example, and may be arranged side by side on a straight line extending in the radial direction. In one embodiment, each of the multiple through holes 457A defines an opening having the same dimensions as the through holes 453 of the main body 452. That is, in the embodiment shown in FIG. 4A, the multiple through holes 457A of the first insert 456A define an elongated hole-shaped opening whose circumferential length is about twice its radial length, similar to the through holes 453 of the main body 452. However, the multiple through holes 457A of the first insert 456A are not limited to being elongated hole-shaped when viewed from above, and may be a perfect circle or any other shape. As an example, the multiple through holes 457A of the first insert 456A may be elongated hole-shaped defining an opening whose dimension is longer in the circumferential direction than the through holes 453 of the main body 452. In one embodiment, the through holes 457A are arranged so as to have the same distribution as the through holes 453 of the main body 452. That is, the plurality of through holes 457A are configured to be able to overlap with the plurality of through holes 453 of the main body 452. Fig. 4A shows a state in which the plurality of through holes 457A overlap with the plurality of through holes 453 of the main body 452. Note that in Fig. 4A, the plurality of through holes 457A and 457B are sparsely illustrated for clarity of illustration, but in an actual design, a greater number of through holes 457A and 457B are formed in the inserts 456A and 456B.

[0032] The second insert A 456B has a plurality of through holes 457B that open to the substrate holder 440 side and the anode 430 side. The dimensions of the second insert 456B and the through holes 457B of the second insert 456B are the same as those of the first insert 456A, so a description thereof will be omitted.

[0033] As shown in FIG. 4A, the first insert 456A and the second insert 456B are connected by the elastic member 454 at one end of each. Also, as shown in FIGS. 4A and 5A, the resistor 450 according to one embodiment includes a biasing member 490 for moving the first insert 456A and the second insert 456B in the circumferential direction within the annular space 455 of the main body 452. As shown in FIG. 4A, the biasing member 490 is a wedge-shaped member, and is a plate-like member having the same thickness as the first insert 456A and the second insert 456B. As shown in the figure, the biasing member 490 is disposed at the end of the first insert 456A and the second insert 456B opposite to the end where the elastic member 454 is disposed. Also, the biasing member 490 is provided with a plurality of through holes 494, similar to the first insert 456A and the second insert 456B. A drive mechanism 492 is connected to the urging member 490, and the urging member 490 is configured to be movable in the radial direction by the drive mechanism 492. The drive mechanism 492 for moving the urging member 490 in the radial direction may be any mechanism, and for example, a cam mechanism or a ball screw may be adopted.

[0034] FIG. 4A shows a state where no force is applied to the elastic member 454. The positions of the first insert 456A and the second insert 456B shown in FIG. 4A are referred to as the "first position" in this specification. In the first position, the through holes 453 of the body 452 of the resistor 450 are aligned so as to communicate with the through holes 457A of the first insert 456A and the through holes 457B of the second insert 456B. FIG. 4B is a vertical cross-sectional view showing a state where the through holes 453 of the body 452 of the resistor 450 are aligned so as to communicate with the through holes 457A of the first insert 456A and the through holes 457B of the second insert 456B. In addition, in the first position, the through holes 494 of the biasing member 490 are aligned so as to communicate with the through holes 453 of the body 452 of the resistor 450. It should be noted that in FIG. 4A, for clarity of illustration, the biasing member 490 is illustrated as having one through hole 494, however, in an actual design, the biasing member 490 may have multiple through holes 494.

[0035] When the biasing member 490 is moved radially inward by the driving mechanism 492 from the first position shown in FIG. 4A, the first insert 456A and the second insert 456B are moved in the circumferential direction, and the elastic member 454 is compressed. It can be said that the driving mechanism 492 moves the biasing member 490 in the circumferential direction against the force applied to the first insert 456A and the second insert 456B by the elastic member 454. FIG. 5A shows a state in which the first insert 456A and the second insert 456B are moved in the circumferential direction and a force is applied to the elastic member 454. The position of the first insert 456A and the second insert 456B shown in FIG. 5A is referred to as the "second position" in this specification. In the second position, the through holes 453 of the body 452 of the resistor 450 are not in communication with the through holes 457A of the first insert 456A and the through holes 457B of the second insert 456B. In other words, in the second position, the through holes 453 of the body 452 of the resistor 450 are blocked by the first insert 456A and the second insert 456B. FIG. 5B is a vertical cross-sectional view showing a state in which the through holes 453 of the body 452 of the resistor 450 are not in communication with the through holes 457A of the first insert 456A and the through holes 457B of the second insert 456B. In addition, in the second position, the through holes 494 of the biasing member 490 are not in communication with the through holes 453 of the body 452 of the resistor 450. In other words, the multiple through holes 453 in the main body 452 of the resistor 450 are blocked by the biasing member 490 .

[0036] When the biasing member 490 moves radially outward from the second position shown in FIG. 5A, the compressive force applied to the elastic member 454 moves the first insert 456A and the second insert 456B toward the first position. In other words, the elastic member 454 applies a biasing force to the first insert 456A and the second insert 456B toward the first position. The first position shown in FIG. 4A is a state in which the multiple through holes 453 of the body 452 of the resistor 450 are aligned with the multiple through holes 457A of the first insert 456A and the multiple through holes 457B of the second insert 456B, and the multiple through holes 453 of the body 452 are completely opened, and the second position is a state in which the multiple through holes 453 of the body 452 of the resistor 450 are completely blocked by the first insert 456A and the second insert 456B. In one embodiment, the first insert 456A and the second insert 456B can be at any position between the first position and the second position, and the plurality of through holes 453 of the body 452 can be partially blocked by the first insert 456A and the second insert 456B. In one embodiment, the radial position of the biasing member 490 can position the first insert 456A and the second insert 456B at any position between the first position and the second position. That is, the radial position of the biasing member 490 can adjust the opening amount of the plurality of through holes 453 of the body 452 of the resistor 450.

[0037] In one embodiment, the inner diameters of the first insert 456A and the second insert 456B are 50% to 70% of the diameter of the main body 452 or the substrate Wf, and preferably 55% to 65%. In one embodiment, the outer diameters of the first insert 456A and the second insert 456B are 70% to 90% of the diameter of the main body 452 or the substrate Wf, and preferably 80% to 90%. The inner and outer diameters of the first insert 456A and the second insert 456B can also be said to be the inner and outer diameters of the annular space 455 inside the main body 452. In one embodiment, the radial dimensions of the first insert 456A and the second insert 456B may be determined to match the intermediate region B2 shown in FIG. 13, which will be described later.

[0038] In one embodiment, the main body 452 is formed with a groove 459 for accommodating at least a part of the sensor 460. In one embodiment, the groove 459 penetrates from the substrate holder 440 side to the anode 430 side, but as an example, the anode 430 side may be closed. In addition, in FIG. 4 to FIG. 5, the groove 459 is formed on the outer periphery side of the annular space 455 for accommodating the first insert 456A and the second insert 456B, and is radially separated from the annular space 455, but as an example, the annular space 455 and the groove 459 may be in communication with each other. In one embodiment, the groove 459 extends inward from the outer periphery of the main body 452 when viewed from above. In one embodiment, as shown in FIG. 3, the sensor 460 is disposed in the groove 459 so as not to protrude above the upper surface 452-a of the main body 452. As described above, the resistor 450 is preferably disposed near the plated surface Wf-a, and the sensor 460 for detecting the parameters related to the plating film is also preferably disposed near the plated surface Wf-a of the substrate Wf. By disposing the sensor 460 in the groove 459, the distance between the resistor 450 and the plated surface Wf-a of the substrate Wf can be reduced, and the parameters related to the thickness of the plating film can be suitably detected. In addition, in this embodiment, the paddle 480 is disposed between the resistor 450 and the substrate Wf. By disposing the sensor 460 in the groove 459, interference between the sensor 460 and the paddle 480 can be prevented without restricting the movement for stirring by the paddle 480.

[0039] FIG. 6 is a cross-sectional view showing a resistor 450 according to an embodiment that can be used in the plating module 400 shown in FIG. 3. The resistor 450 in the embodiment shown in FIG. 6 has a double insert arrangement. As shown in FIG. 6, the body 452 of the resistor 450 has an outer annular space 455A and an inner annular space 455B. The first insert 456A and the second insert 456B are arranged in the outer annular space 455A. The third insert 456C and the fourth insert 456D are arranged in the inner annular space 455B. The first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D according to the embodiment shown in FIG. 6 have the same structure as the first insert 456A and the second insert 456B shown in FIGS. 4 and 5, except for the radial width. The first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D each include a plurality of through holes 457A-D, although for clarity of illustration, the plurality of through holes 457A-D are not shown in FIG.

[0040] As shown in Fig. 6, the first insert 456A and the second insert 456B are connected at one end by an elastic member 454A, and the third insert 456C and the fourth insert 456D are connected at one end by an elastic member 454B. As shown in Fig. 6, the main body 452 includes a biasing member 490 for moving the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert D in the circumferential direction within the annular spaces 455A and 455B of the main body 452. The biasing member 490 shown in Fig. 6 may have a similar configuration to the biasing member 490 shown in Figs. 4 and 5. In the embodiment shown in Fig. 6, the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert D have a plurality of through holes 457A-D that can move between a first position where they communicate with the plurality of through holes 453 of the main body 452, and a second position where they do not communicate. The biasing member 490 has a plurality of through holes 494 that can move between a position where they communicate with the plurality of through holes 453 of the main body 452, and a position where they do not communicate. In the state shown in Fig. 6, the plurality of through holes 494 of the biasing member 490 are aligned so as to communicate with the plurality of through holes 453 of the main body 452.

[0041] 7 shows the biasing member 490 moved partway radially inward such that the through holes 457A,B of the first and second inserts 456A, 456B communicate with the through holes 453 of the body 452, while the through holes 457C,D of the third and fourth inserts 456C, 456D do not communicate with the through holes 453 of the body 452. Also, in the position shown in FIG. 7, the through holes 494 of the biasing member 490 may not communicate with the through holes 453 of the body 452 at the radial position where the first and second inserts 456A, 456B are located, and the biasing member 490 may be configured to block the through holes 453 of the body 452. 8 shows a state in which the biasing member 490 has moved further radially inward and none of the through holes 457A-D of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D communicates with the through holes 453 of the main body 452. In addition, in the position shown in FIG. 8, the through holes 494 of the biasing member 490 may be configured not to communicate with the through holes 453 of the main body 452 at the radial positions where the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D are disposed, and the biasing member 490 may be configured to block the through holes 453 of the main body 452.

[0042] In one embodiment, with respect to the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D, the inner diameters of the third insert 456C and the fourth insert 456D are 50% to 70% of the diameter of the main body 452 or the substrate Wf, and preferably 55% to 65%. Also, in one embodiment, the outer diameters of the first insert 456A and the second insert 456B are 70% to 90% of the diameter of the main body 452 or the substrate Wf, and preferably 80% to 90%. In one embodiment, the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert D may be determined to correspond to the intermediate region B2 shown in FIG. 13 described later.

[0043] FIG. 9A is a schematic perspective view of a portion of a resistor 450 according to an embodiment that can be employed in the plating module 400 shown in FIG. 3. FIGS. 9B and 9C are cross-sectional perspective views of a portion of the resistor 450 shown in FIG. 9A. The resistor 450 of this embodiment includes a disk-shaped main body 452 and a cylindrical insert 560 disposed inside the main body 452, as in the previously described embodiment. In other words, the main body 452 includes a cylindrical space 455 therein, and the cylindrical insert 560 is disposed in the cylindrical space 455. The insert 560 is inserted into the cylindrical space 455 from the outer periphery of the main body 452 toward the radially inward direction. The main body 452 and the insert 560 are members having a higher electrical resistivity than the plating solution, and are preferably dielectric materials. The main body 452 and the insert 560 may be formed of the same material or different materials.

[0044] In the embodiment shown in FIG. 9A, the main body 452 is formed with a plurality of through holes 453 that open to the substrate holder 440 side (upper surface side) and the anode 430 side (lower surface side). In FIG. 9A, for clarity of illustration, the plurality of through holes 453 of the main body 452 are illustrated only in the portion related to the insert 560, but the plurality of through holes 453 are formed throughout the main body 452. In FIG. 9A, each of the plurality of through holes 453 is a through hole of the same size and has a perfect circular shape when viewed from above. However, the present invention is not limited to such an example, and each of the plurality of through holes 453 may define an elongated opening whose circumferential length is about twice its radial length, as in the embodiment of FIGS. 4 and 5, or may have any other shape, and may be a through hole of different dimensions.

[0045] As shown in FIG. 9A, the insert 560 is a cylindrical member. As shown in FIG. 9B, the insert 560 has a plurality of through holes 562 that open to the substrate holder 440 side and the anode 430 side. In the embodiment shown in FIG. 9B, the plurality of through holes 562 of the insert 560 have openings of the same size as the plurality of through holes 453 of the main body 452, and have the same distribution. As shown in FIG. 9A, the insert 560 is connected to a driving mechanism 564 and is configured to be rotatable inside the main body 452. The driving mechanism 564 can be any driving mechanism including a motor or the like. As shown in FIG. 9A, the plurality of through holes 562 of the insert 560 are formed in a partial region in the axial direction of the insert 560 (the radial direction of the main body 452). The axial dimension (radial direction of main body 452) of the region where through hole 562 of insert 560 is formed can be any dimension, but as an example, it can be the radial dimension of inserts 456A-D in the embodiment of Figures 4-8. In one embodiment, the axial dimension (radial direction of main body 452) of the region where through hole 562 of insert 560 is formed may be determined to match intermediate region B2 shown in Figure 13 described later.

[0046] 9B shows a state where the through holes 453 of the body 452 and the through holes 562 of the insert 560 are aligned so as to communicate with each other. The position of the insert 560 shown in FIG. 9B is referred to herein as the "first position." FIG. 9C shows a state where the insert 560 is rotated 90 degrees so that the through holes 453 of the body 452 and the through holes 562 of the insert 560 are not in communication with each other. The position of the insert 560 shown in FIG. 9C is referred to herein as the "second position." In other words, in the second position, the through holes 453 of the body 452 of the resistor 450 are blocked by the insert 560. Furthermore, by slightly rotating the insert 560 from the first position, the multiple through holes 453 of the main body 452 and the multiple through holes 562 of the insert 560 can be partially aligned, so that the multiple through holes 453 of the main body 452 are partially blocked by the insert 560.

[0047] FIG. 10 is a diagram showing the arrangement of the inserts 560 according to an embodiment. As shown in FIG. 10, in one embodiment, the inserts 560 are arranged at equal intervals on the outer periphery of the main body 452. In addition, in the embodiment shown in FIG. 10, the inserts 560 have the same configuration. In the embodiment shown in FIG. 10, the inserts 560 can be configured to be independently rotatable. By independently rotating each of the inserts 560 between the first position and the second position, the opening amount of the through holes 453 can be adjusted. In one embodiment, the inserts 560 may be configured to rotate synchronously.

[0048] FIG. 11 is a diagram showing the arrangement of the inserts 560 according to an embodiment. As shown in FIG. 11, in one embodiment, the inserts 560 are arranged at equal intervals on the outer periphery of the main body 452. In the embodiment shown in FIG. 11, the inserts 560 have different lengths. In the embodiment shown in FIG. 11, the inserts 560 of different lengths can have different sizes and positions of the regions in which the through holes 562 are formed. Therefore, in the embodiment shown in FIG. 11, the opening amounts of the through holes 453 can be adjusted at different radial positions. Note that in FIGS. 10 and 11, the through holes 453 and 562 are not shown for clarity.

[0049] <Plating process> Next, the plating process in the plating module 400 of this embodiment will be described in more detail. The substrate Wf is exposed to the plating solution by immersing it in the plating solution in the cathode region 422 using the lifting mechanism 442. In this state, the plating module 400 can perform plating on the plating surface Wf-a of the substrate Wf by applying a voltage between the anode 430 and the substrate Wf. In one embodiment, the plating process is performed while rotating the substrate holder 440 using the rotation mechanism 448. A conductive film (plating film) is deposited on the plating surface Wf-a of the substrate Wf-a by the plating process.

[0050] In one embodiment, the control module (controller) 800 can improve the uniformity of the plating film thickness distribution over the entire substrate Wf by controlling the driving mechanisms 492, 564 to adjust the resistor 450 (the position of the insert). As one example, the adjustment of the resistor 450 using the driving mechanisms 492, 564 is performed before the plating process is started. Also, as another example, the adjustment of the resistor 450 using the driving mechanisms 492, 564 is performed in real time during the plating process based on the detection value by the sensor 460.

[0051] FIG. 12 is a flow chart showing an example of a method for setting operation recipes of the resistor 450, the anode mask 426, and the shield 470 by the control module 800. The method shown in FIG. 12 is executed, as an example, when a new substrate lot is processed. The control module 800 may set operation recipes for only a part of the resistor 450, the anode mask 426, and the shield 470. Here, the operation recipe of the resistor 450 is a recipe indicating the positions of the inserts 456A-D, 560, that is, the opening amount of the through hole 453 of the main body 452. The operation recipe of the anode mask 426 is a recipe indicating the opening dimension of the anode mask 426. The operation recipe of the shield 470 is a recipe indicating the advance / retract position of the shield 470. The operation recipe may be set by a computer outside the plating apparatus 1000 and transmitted to the plating apparatus 1000, instead of being set by the control module 800 of the plating apparatus 1000.

[0052] In the example shown in FIG. 12, first, the control module 800 acquires a resist pattern of the substrate Wf to be processed (step S110). The resist pattern means a pattern of a resist layer formed on the surface Wf-a to be plated so that a desired plating pattern is formed by plating. The resist pattern may be acquired by detecting the substrate Wf with a sensor provided in the plating apparatus 1000. As an example, the plating apparatus 1000 may be equipped with an imaging sensor (not shown), such as a camera, that captures the surface Wf-a to be plated of the substrate Wf. The control module 800 may acquire imaging data detected by the imaging sensor and analyze the imaging data to acquire the resist pattern of the surface Wf-a to be plated. The resist pattern may be acquired from the imaging data using a known method based on the shading or feature points of the imaging data. In addition, the control module 800 may acquire the resist pattern by an external input via wired or wireless communication, as an example.

[0053] Then, the control module 800 sets the operation recipes of the resistor 450, the anode mask 426, and the shield 470 based on the acquired resist pattern (step S120). As a specific example, the control module 800 calculates a plating growth coefficient for each predetermined region of the plated surface Wf of the substrate Wf based on the acquired resist pattern, and sets the operation recipes of each control target based on the calculated plating growth coefficient. Here, the plating growth coefficient is a parameter indicating the growth rate (formation rate) of the plating film in a state in which each of the resistor 450, the anode mask 426, and the shield 470 least shields the current. As an example, the plating growth coefficient can be the formation amount (e.g., nanometers) of the plating film per unit time (e.g., 1 second). As a specific example, the control module 800 can calculate the aperture ratio of the resist layer for each predetermined region based on the resist pattern, and calculate the plating growth coefficient based on the calculated aperture ratio. This is because in areas with a large aperture ratio of the resist layer, the area over which plating is deposited and the amount of plating required to form a certain amount of plating film are large, and the growth rate of the plating film tends to be slower than in areas with a small aperture ratio of the resist layer.

[0054] FIG. 13 is a diagram showing a resist pattern formed on the plated surface Wf-a of the substrate Wf in one embodiment. In FIG. 13, resist openings are formed only in the cross-shaped region A1 with hatching, and the region A2 outside the cross-shaped region A1 is a non-opening region where no resist openings are formed. When plating is performed on the substrate Wf with such a resist pattern, no plating current flows in the non-opening region A2, and only the opening region A1. In this embodiment, plating is performed while rotating the substrate holder 440 using the rotation mechanism 448, and the plating current is concentrated in the cross-shaped convex region including the region A2 in the circumferential direction of the region A1, and the plating film thickness increases. In this specification, the region in which resist openings are formed in almost all areas when viewed along the circumferential direction is called the "center region B1" (in the example shown in FIG. 13, the circular region surrounded by the inner dashed line C1). Moreover, when viewed along the circumferential direction, a region that includes both a region where a resist opening is formed (opening region A1) and a region where a resist opening is not formed (non-opening region A2), and the area of ​​the opening region A1 is larger than the area of ​​the non-opening region A2 in the circumferential direction, is called an "intermediate region B2" (in the example shown in FIG. 13, a circular ring-shaped region surrounded by dashed lines C1 and C2). Furthermore, when viewed along the circumferential direction, a region that includes both the opening region A1 and the non-opening region A2, and the area of ​​the opening region A1 is smaller than the area of ​​the non-opening region A2 in the circumferential direction is called an "outer peripheral region B3" (in the example shown in FIG. 13, a circular ring-shaped region surrounded by dashed lines C2 and C3). In the example shown in FIG. 13, the central region B1, the intermediate region B2, and the outer peripheral region B3 are located in this order from the center to the outer peripheral side of the plating surface Wf-a, and no resist opening is formed on the outer peripheral side of the outer peripheral region B3. However, the present invention is not limited to this example, and any resist pattern may be formed on the substrate Wf.

[0055] Here, the anode mask 426 or the shield 470 provided in the plating module 400 can suitably adjust the plating film formation speed near the outer periphery of the plating surface Wf-a. However, when a substrate Wf as shown in Fig. 13 is plated, the plating film formation speed in the region on the inner periphery side (particularly, the middle region B2) becomes relatively faster than near the outer periphery, which may impair the uniformity of the thickness of the plating film.

[0056] In contrast, the plating module 400 of the above embodiment is configured to adjust the opening amount of the through hole 453 of the main body 452 by moving or rotating the inserts 456A-D, 560 arranged inside the resistor 450. This allows the current flowing through the intermediate region B2 to be adjusted to adjust the plating formation speed in the intermediate region B2. As an example, in the substrate Wf of FIG. 13, when the plating formation speed in the intermediate region B2 surrounded by the dashed lines C1 and C2 is relatively high, the opening amount of the through hole 453 of the main body 452 can be reduced by moving or rotating the inserts 456A-D, 560, thereby reducing the plating film thickness formed in the intermediate region B2. This allows the uniformity of the thickness of the plating film to be improved even when plating is performed on the substrate Wf as shown in FIG. 13 as an example. In addition, the plating module 400 of the present embodiment includes an anode mask 426 and a shield 470. As a result, the plating speed can be adjusted for the intermediate region B2 by moving or rotating the inserts 456A-D, 560, and for the peripheral region B3 by the anode mask 426 and the shield 470. Thus, by controlling the resistor 450, the anode mask 426, and the shield 470, the plating speed can be adjusted for each region of the substrate Wf, improving the uniformity of the thickness of the plating film. The radial dimensions of the above-mentioned various inserts 456A-D of the resistor 450 and the radial dimension of the region in which the through hole 562 of the insert 560 is formed may be determined based on the intermediate region B2, for example, to be approximately the same as the intermediate region B2.

[0057] Fig. 14 is a flow chart showing an example of a method for setting the operation recipe of the resistor 450, the anode mask 426, and the shield 470 during the plating process by the control module 800. The method shown in Fig. 14 is executed during the plating process instead of the method shown in Fig. 12 or to correct the operation recipe set by the method shown in Fig. 12. Note that the control module 800 may set the operation recipe for only a part of the resistor 450, the anode mask 426, and the shield 470.

[0058] When the plating process is started (step S210), the control module 800 acquires the parameters related to the plating film from the sensor 460 in real time (step S220). In this embodiment, the parameters related to the plating film are detected by the sensor 460 with the rotation of the substrate Wf, and in one embodiment, the parameters related to the plating film are detected at a plurality of points along the radial direction on the plating surface Wf-a. The control module 800 calculates the film thickness distribution of the plating film on the plating surface Wf-a based on the detection value by the sensor 460 (step S230). Next, the control module 800 sets the operation recipes of the resistor 450, the anode mask 426, and the shield 470 based on the calculated film thickness distribution (step S240). The control module 800 repeats the processes of steps S220 to S240 until the plating process is completed (step S250) to set the operation recipes of the control object. Then, the control module 800 controls the resistor 450, the anode mask 426, and the shield 470 based on the set operation recipe. In this way, by setting or correcting the operation recipe of the resistor 450, etc. during the plating process based on the parameters related to the plating film acquired from the sensor 460, the uniformity of the thickness of the plating film can be further improved.

[0059] The present invention can also be described in the following forms. [Form 1] According to Form 1, there is provided a plating apparatus resistor for adjusting an electric field, which is arranged in a plating apparatus between an anode and a holder that holds an object to be plated, the plating apparatus resistor having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the plating apparatus resistor further having an insert arranged inside the body, the insert having a plurality of through holes, the insert being movable between a first position in which the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position in which the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

[0060] [Mode 2] According to mode 2, in the resistor for use in a plating apparatus according to mode 1, the plurality of through holes of the insert communicate with an upper surface and a lower surface of the insert.

[0061] [Form 3] According to Form 3, in the resistor for use in a plating apparatus according to Form 2, the insert has a first insert having an arc-shaped plate shape and a second insert having an arc-shaped plate shape, and the resistor for use in a plating apparatus further has an elastic member connecting between the first insert and the second insert, and the elastic member is configured to apply a bias force to the first insert and the second insert in the direction of the first position.

[0062] [Mode 4] According to Mode 4, the resistor for a plating apparatus according to Mode 3 further includes a biasing member that moves the first insert and the second insert toward the second position against the bias force of the elastic member.

[0063] [Form 5] According to Form 5, in the resistor for use in a plating apparatus according to Form 3, the insert has a third insert having an arc-shaped plate shape and a fourth insert having an arc-shaped plate shape, and the resistor for use in a plating apparatus further has a second elastic member connecting the third insert and the fourth insert, and the second elastic member is configured to apply a bias force to the third insert and the fourth insert in the direction of the first position.

[0064] [Form 6] According to Form 6, in the resistor for plating equipment according to Form 1, the insert is a cylindrical member having the plurality of through holes, is inserted into the plate-like main body from a side surface, and is movable between the first position and the second position by rotating about the central axis of the cylindrical member.

[0065] [Form 7] According to Form 7, in the resistor for plating equipment according to Form 6, the plate-shaped body is disk-shaped, the insert has a plurality of the cylindrical members, and the plurality of cylindrical members are inserted radially into the plate-shaped body.

[0066] [Mode 8] According to Mode 8, in the resistor for use in a plating apparatus according to Mode 7, the plurality of cylindrical members have different longitudinal dimensions.

[0067] [Form 9] According to Form 9, there is provided a plating apparatus having a plating tank, an anode disposed in the plating tank, a holder for holding an object to be plated, and a resistor for adjusting an electric field disposed between the anode and the holder, the resistor having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the resistor further having an insert disposed inside the body, the insert having a plurality of through holes, the insert being movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the body and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the body. [Explanation of symbols]

[0068] Wf-a: Surface to be plated Wf...Substrate 400…Plating module 410…Plating tank 420…Membrane 422…Cathode region 424…Anode region 430…Anode 440...Substrate holder 442…Lifting mechanism 448…Rotation mechanism 450…Resistor 452...Main body 453...Through hole 456A~D…insertion body 457A~D…Through hole 459...Groove 460…Sensor 470…shielding body 480…Paddle 490... Urging member 492...Drive mechanism 494…Through hole 560…insertion body 562...Through hole 564...Drive mechanism 800…Control module 1000...Plating equipment

Claims

1. A resistor for use in a plating apparatus for adjusting an electric field, the resistor being disposed between an anode and a holder for holding an object to be plated, comprising: The plating apparatus resistor has a plate-shaped body, the plate-shaped body having an upper surface, a lower surface, and a plurality of through holes communicating between the upper surface and the lower surface, The plating apparatus resistor further includes an insert disposed inside the body, the insert having a plurality of through holes, the insert is movable between a first position in which the through holes of the insert communicate with the through holes of the body and a second position in which the through holes of the insert do not communicate with the through holes of the body. Resistors for plating equipment.

2. 2. The resistor for use in a plating apparatus according to claim 1, The plurality of through holes of the insert communicate with an upper surface and a lower surface of the insert. Resistors for plating equipment.

3. 3. The resistor for use in a plating apparatus according to claim 2, The insert body includes a first insert body having an arc-shaped plate shape and a second insert body having an arc-shaped plate shape, The plating apparatus resistor further includes an elastic member connecting the first insert body and the second insert body, The resilient member is configured to bias the first insert and the second insert toward the first position. Resistors for plating equipment.

4. 4. The resistor for use in a plating apparatus according to claim 3, further comprising: a biasing member for moving the first insert and the second insert toward the second position against the biasing force of the resilient member; Resistors for plating equipment.

5. 4. The resistor for use in a plating apparatus according to claim 3, The insert body includes a third insert body having an arc-shaped plate shape and a fourth insert body having an arc-shaped plate shape, The plating apparatus resistor further includes a second elastic member connecting the third insert body and the fourth insert body, The second resilient member is configured to bias the third insert and the fourth insert toward the first position. Resistors for plating equipment.

6. 2. The resistor for use in a plating apparatus according to claim 1, The insert is a cylindrical member having the plurality of through holes, and is inserted into the plate-like main body from a side surface thereof, and is movable between the first position and the second position by rotating about a central axis of the cylindrical member. Resistors for plating equipment.

7. 7. The resistor for use in a plating apparatus according to claim 6, The plate-shaped body is disc-shaped, The insert body has a plurality of the cylindrical members, and the plurality of cylindrical members are inserted in a radial direction of the plate-like main body. Resistors for plating equipment.

8. 8. The resistor for use in a plating apparatus according to claim 7, the plurality of cylindrical members having different longitudinal dimensions; Resistors for plating equipment.

9. A plating apparatus comprising: A plating tank; an anode disposed in the plating tank; a holder for holding an object to be plated; A resistor for adjusting an electric field is disposed between the anode and the holder, The resistor is A plate-shaped main body has an upper surface, a lower surface, and a plurality of through holes communicating between the upper surface and the lower surface, The resistor further includes an insert disposed within the body, the insert having a plurality of through holes; the insert is movable between a first position in which the through holes of the insert communicate with the through holes of the body and a second position in which the through holes of the insert do not communicate with the through holes of the body. Plating equipment.