A plating device for processing an integrated circuit board

Abstract

The application belongs to the technical field of circuit board processing machines, and relates to an electroplating device for integrated circuit board processing, which comprises a groove body, a protective cover horizontally and slidingly installed in the groove body, a drilling assembly rotatably installed on the protective cover, and a first driving assembly installed between the protective cover and the drilling assembly; the groove body has a vertical second partition plate inside, the groove body between the second partition plate and the protective cover has a vertical first partition plate, the first partition plate is provided with a clearance hole matched with the drilling, the first partition plate and the second partition plate have a polishing assembly; the protective cover and the first partition plate are provided with a collecting hopper below; the sidewall of the groove body between the first partition plate and the protective cover is provided with an air hole; the groove body is provided with a U-shaped frame, the U-shaped frame is provided with a clamping assembly, the lower portion of the U-shaped frame is provided with a drying assembly, and the groove body is provided with an electroplating assembly at the end away from the protective cover; the electroplating device can clean the circuit board in time after polishing and improve the subsequent electroplating quality. The circuit board can be dried in time after electroplating, which facilitates subsequent assembly work.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit board processing machines, and relates to a plating device for integrated circuit board processing. BACKGROUND

[0002] Circuit board plating is a process of depositing a thin layer of metal on the surface of a circuit board through electrolysis to enhance its conductivity, corrosion resistance and mechanical properties. The plating process usually includes cleaning, activation, copper plating, tin plating and other steps, and the metals used include copper, nickel, gold, etc.

[0003] A circuit board plating device in a low-oxygen environment is disclosed in Chinese Patent No. CN114481246B, which includes a tank body, a cover plate connected to one side of the tank body through a hinge, a first partition plate welded between the two inner walls of the tank body, an electroplating tank arranged between the first partition plate and the tank body, a gas cylinder three hinged between the cover plate and the tank body, a vacuum pump connected to one side of the tank body through bolts, an air inlet of the vacuum pump connected to the tank body through a pipeline, a sealing ring arranged on the top outer wall of the tank body, a third partition plate welded between the two inner walls of the tank body, and a moving shell connected to the tank body on one side of the third partition plate.

[0004] In the above prior art, after the circuit board is polished, there will be residual grinding dust on the circuit board, which will affect the subsequent plating quality if not cleaned before plating. In addition, after plating is completed, there will be residual wet plating solution on the circuit board, which will affect the subsequent assembly and welding process.

[0005] To solve the above problems, the application provides a plating device for integrated circuit board processing. SUMMARY

[0006] To solve the problems in the background art, the application provides a plating device for integrated circuit board processing.

[0007] To achieve the above purpose, the application adopts the following technical scheme: a plating device for integrated circuit board processing, comprising a tank body, a protective cover horizontally slidingly installed in the tank body, a drilling assembly rotatably installed on the protective cover, and a first drive assembly installed between the protective cover and the drilling assembly to drive the drilling assembly to rotate;

[0008] A second partition plate is fixedly installed in the tank body vertically, a first partition plate is fixedly installed in the tank body vertically between the second partition plate and the protective cover, a clearance hole is formed in the first partition plate to cooperate with the drilling, and a polishing assembly is installed between the first partition plate and the second partition plate;

[0009] A collecting bucket for collecting drill cuttings is detachably installed below the protective cover and the first partition plate.

[0010] The side wall of the groove between the first partition plate and the protective cover is provided with air holes;

[0011] A U-shaped frame is horizontally slidably installed on the groove, a clamping assembly is vertically slidably installed on the U-shaped frame, a drying assembly is installed below the U-shaped frame, and an electroplating assembly is installed at an end of the groove away from the protective cover.

[0012] Preferably, a first electric push rod is fixedly installed on the groove, the extension shaft of the first electric push rod is parallel to the moving direction of the protective cover, the extension end of the first electric push rod penetrates the side wall of the groove and is fixedly connected with the side wall of the protective cover, two slide rods parallel to the axis of the first electric push rod are fixedly installed on the protective cover, the two slide rods are arranged on the two sides of the first electric push rod, and the slide rods are slidably connected with the groove.

[0013] Preferably, the drilling assembly comprises a connecting shaft, the connecting shaft is rotatably connected with the protective cover;

[0014] A drill bit is fixedly installed at one end of the connecting shaft, a micro motor is installed on the output shaft of the micro motor, and the drill bit is connected with the output shaft of the micro motor through a fastening screw;

[0015] The first driving assembly comprises a rack, the rack is fixedly installed on the bottom wall of the groove, the rack is located in the protective cover, and a slot is formed in the side wall of the protective cover and used for allowing the rack to pass through;

[0016] A first gear is fixedly installed on the inner wall of the protective cover, the axis of the first gear is arranged in a horizontal direction, the first gear is rotatably connected with the connecting block, the axis of the first gear is perpendicular to the moving direction of the protective cover, and the first gear is meshed with the rack;

[0017] A second bevel gear is fixedly installed at one end of the connecting shaft away from the drill bit, a first bevel gear is fixedly installed on the first gear, and the second bevel gear is meshed with the first bevel gear.

[0018] Preferably, the polishing assembly comprises polishing rollers, the polishing rollers are arranged in two, the two polishing rollers are arranged in parallel, the axes of the two polishing rollers are located on the same horizontal plane, the axes of the polishing rollers are perpendicular to the moving direction of the protective cover, and the polishing rollers are rotatably connected with the groove;

[0019] Two second gears are arranged, the two second gears are respectively corresponding to the polishing rollers, the second gears are respectively fixedly installed at one end of the corresponding polishing rollers, the two second gears are meshed with each other, and the second gears are inlaid in the side wall of the groove.

[0020] A third motor is fixedly installed on the sidewall of the groove body, and an output shaft of the third motor penetrates the sidewall of the groove body and is fixedly connected with one of the polishing rollers.

[0021] Preferably, the U-shaped frame comprises two vertical rods and a horizontal rod, and the two vertical rods are fixedly installed at two ends of the horizontal rod, respectively.

[0022] A guide rod parallel to the moving direction of the protective cover is fixedly installed on the sidewall of the groove body, and the lower end of the vertical rod of the U-shaped frame is slidably connected with the guide rod.

[0023] A first screw rod parallel to the axis of the guide rod is arranged above the guide rod, and the first screw rod is threadedly connected with the groove body.

[0024] A first motor is fixedly installed at one end of the groove body, and an output shaft of the first motor is fixedly connected with the first screw rod.

[0025] Preferably, a sliding plate is vertically slidably installed on the vertical rod of the U-shaped frame, and a second driving assembly for driving the sliding plate to move up and down is installed between the sliding plate and the U-shaped frame.

[0026] The second driving assembly comprises two second screw rods arranged in parallel, and the second screw rods are arranged in parallel with the vertical rods of the U-shaped frame and are fixedly connected with the corresponding vertical rods of the U-shaped frame.

[0027] The sliding plate is threadedly connected with the second screw rods.

[0028] A second motor is fixedly installed on the horizontal rod of the U-shaped frame, an output shaft of the second motor is fixedly connected with one of the second screw rods, and the second motor is connected with the other second screw rod through a transmission belt assembly.

[0029] Preferably, two sets of clamping assemblies are arranged, and the clamping assemblies are installed on the sliding plate; the clamping assembly comprises a clamping plate, the clamping plate is arranged below the sliding plate, a second electric push rod is fixedly installed on the sliding plate, the clamping plate is arranged in two, the two clamping plates are arranged in parallel, one of the clamping plates is fixedly installed on the lower sidewall of the sliding plate, and the other clamping plate is fixedly connected with the output rod of the second electric push rod.

[0030] Preferably, a fixing shell is fixedly installed at each end of the U-shaped frame, a hair dryer is fixedly installed on the sidewall of the fixing shell, the fixing shell is arranged on the two sides of the clamping assembly, and the air outlet of the hair dryer faces the clamping assembly.

[0031] Preferably, the electroplating assembly comprises: an electroplating tank fixed in the groove body with an opening upward;

[0032] A cover plate is connected to the electroplating tank in a sliding manner; the cover plate comprises a horizontal plate and two vertical plates, the two vertical plates are respectively fixed at the two ends of the horizontal plate, and the two vertical plates are respectively located on the upper and lower sides of the horizontal plate, and the height of the upper vertical plate is higher than the height of the fixed shell;

[0033] A reset structure is installed between the cover plate and the side wall of the groove body;

[0034] The reset structure comprises a fixed plate fixedly installed on the groove body, and the fixed plate is located at one end of the groove body away from the protective cover;

[0035] A first spring is provided with a clearance slot on the fixed plate, the vertical plate of the cover plate is connected to the clearance slot in a sliding manner, the first spring is fixedly installed in the clearance slot of the fixed plate, one end of the first spring is fixed to the side wall of the clearance slot, and the other end of the first spring is fixed to the vertical plate of the cover plate;

[0036] A connecting plate is connected to the upper side wall of the fixed plate in a vertical sliding manner, the lower end of the connecting plate penetrates through the upper side wall of the clearance slot and is located in the clearance slot, an inclined block is fixedly installed at the lower end of the connecting plate, one end of the inclined block close to the cover plate is provided as an inclined surface, and a clamping groove matched with the inclined block is formed in the cover plate;

[0037] A second spring is fixed between the connecting plate and the fixed plate.

[0038] Preferably, one side of the polishing assembly is provided with a cleaning assembly;

[0039] The cleaning assembly comprises a liquid storage tank fixedly installed on the groove body, and a liquid adding port provided above the liquid storage tank and communicated with the inner chamber of the liquid storage tank;

[0040] A rectangular frame is fixedly installed below the cleaning assembly, and a horizontal spray head is formed in the rectangular frame, and a liquid discharge port is formed in the bottom wall of the groove body corresponding to the rectangular frame;

[0041] A connecting pipe is connected to the liquid storage tank and the rectangular frame, and a water pump is installed on the connecting pipe.

[0042] Compared with the prior art, the present application has the following beneficial effects:

[0043] 1. When the protective cover moves to the position of the circuit board for punching, the drill bit is rotated by the first driving unit, and the drill bit is cleaned through the air hole during the rotation.

[0044] 2. The debris generated in the polishing process will all fall into the collecting hopper through the opening below the groove body, and be uniformly collected, and the protective cover can also push the debris above the groove body into the collecting hopper for uniform collection with the movement of the protective cover. The accumulation of debris above the groove body is prevented, and subsequent manual cleaning is required.

[0045] 3. By arranging the drying assembly, the drying effect of the circuit board after electroplating after cleaning is ensured, so that the surface of the dried circuit board is cleaner and smoother, which is beneficial to subsequent assembly and welding work.

[0046] 4. When the circuit board is in electroplating operation, the cover plate will automatically open, and after the circuit board is in electroplating operation, the cover plate will automatically seal the electroplating tank, so that the cover plate automatically covers the top of the electroplating tank, without manual control, thereby preventing dust and impurities from falling into the tank and affecting the plating layer quality, and improving the convenience during use. BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 is the front view of the axial measurement structure of the present application;

[0048] Figure 2 is the front view of the axial measurement structure of the present application;

[0049] Figure 3 is the front view of the axial measurement structure of the present application; Figure 2 is the front view of the axial measurement structure of the present application;

[0050] Figure 4 is the front view of the axial measurement structure of the present application;

[0051] Figure 5 is the front view of the axial measurement structure of the present application;

[0052] Figure 6 is the front view of the axial measurement structure of the present application; Figure 5 is the front view of the axial measurement structure of the present application;

[0053] Figure 7 is the front view of the axial measurement structure of the present application;

[0054] Figure 8 is the front view of the axial measurement structure of the present application;

[0055] Figure 9 is the front view of the axial measurement structure of the present application;

[0056] Figure 10 is the front view of the axial measurement structure of the present application;

[0057] Figure 11 is the front view of the axial measurement structure of the present application;

[0058] Figure 12 is the structural schematic diagram of the installation of the U-shaped frame and the clamping assembly of the present application;

[0059] Figure 13 is the cross-sectional structural schematic diagram of the connection of the U-shaped frame and the clamping assembly of the present application;

[0060] Figure 14 is the structural schematic diagram of the connection of the cover plate and the electroplating tank of the present application;

[0061] Figure 15 is the cross-sectional structural schematic diagram of the opening of the electroplating tank opening by the cover plate of the present application.

[0062] In the figure: 1, groove body; 2, sliding rod; 3, first electric push rod; 4, protective cover; 5, first partition; 6, first motor; 7, first screw; 8, guide rod; 9, guide plate; 10, collecting hopper; 11, U-shaped frame; 12, second motor; 13, cover plate; 14, fixed plate; 15, first spring; 16, connecting plate; 17, fixed shell; 18, second screw; 19, second electric push rod; 20, clamping plate; 21, polishing roller; 22, first bevel gear; 23, first gear; 24, rack; 25, connecting shaft; 26, rectangular frame; 27, second partition; 28, liquid discharge port; 29, electroplating tank; 30, sliding plate; 31, second spring; 32, inclined block; 33, third motor; 34, liquid storage tank; 35, liquid inlet; 36, water pump; 37, connecting block; 38, second bevel gear; 39, slot; 40, spray head; 41, connecting pipe; 42, second gear; 43, fastening screw; 44, hair dryer; 45, transmission belt assembly; 46, clamping groove; 47, drill bit. DETAILED DESCRIPTION

[0063] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0064] As Figures 1-15 shown, the technical solutions adopted by the present application are as follows: a plating device for integrated circuit board processing. It comprises a groove body 1. A protective cover 4 is horizontally slidably installed in the groove body 1.

[0065] Specifically, the first electric push rod 3 is fixedly installed on the groove body 1. The extension shaft of the first electric push rod 3 is parallel to the moving direction of the protective cover 4. The extension end of the first electric push rod 3 penetrates the side wall of the groove body 1 and is fixedly connected with the side wall of the protective cover 4. Two slide rods 2 parallel to the axis of the first electric push rod 3 are fixedly installed on the protective cover 4. The two slide rods 2 are arranged on the two sides of the first electric push rod 3, and the slide rods 2 are slidingly connected with the groove body 1.

[0066] The first electric push rod 3 is started, and the extension of the first electric push rod 3 drives the protective cover 4 to reciprocate in the groove body 1.

[0067] The drilling assembly is rotatably installed on the protective cover 4. The first driving assembly for driving the drilling assembly to rotate is installed between the protective cover 4 and the drilling assembly. The side wall of the groove body 1 between the first partition plate 5 and the protective cover 4 is provided with an air hole. The air hole is not shown in the drawings. The air hole can be opened according to the position of the drilling assembly.

[0068] The drilling assembly is used for drilling work on the circuit board. When the protective cover 4 reciprocates, the drilling assembly is driven to rotate by the first driving assembly. In the process of rotating the drilling assembly, gas can be blown into the air hole, and the gas blown to the drilling assembly can clean the drill chips on the drilling assembly.

[0069] Specifically, the drilling assembly comprises a connecting shaft 25 and a drill bit 47.

[0070] The connecting shaft 25 is rotatably connected with the protective cover 4.

[0071] One end of the connecting shaft 25 is fixedly installed with a micro motor, the output shaft of the micro motor is installed with the drill bit 47, and the drill bit 47 is connected with the output shaft of the micro motor through a fastening screw 43. The micro motor is used to provide power for the drill bit 47. The fastening screw 43 is connected with the micro motor to facilitate the replacement of drill bits 47 of different specifications. The first driving assembly is connected with the connecting shaft 25. The first driving assembly drives the drill bit 47 to rotate through the connecting shaft 25. The air hole blows and cleans the drill chips on the drill bit 47.

[0072] Further, the first driving assembly comprises a rack 24, a first gear 23 and a second bevel gear 38.

[0073] The rack 24 is fixedly installed on the bottom wall of the groove body 1. The rack 24 is located in the protective cover 4. The side wall of the protective cover 4 is provided with a slot 39 for the rack 24 to pass through. The slot 39 is provided so that the rack 24 does not interfere with the movement of the protective cover 4 when the protective cover 4 moves.

[0074] The inner wall of the protective cover 4 is fixedly provided with a connecting block 37. The axis of the first gear 23 is arranged in a horizontal direction. The first gear 23 is rotationally connected with the connecting block 37. The axis of the first gear 23 is perpendicular to the moving direction of the protective cover 4. The first gear 23 is engaged with the rack 24.

[0075] The second bevel gear 38 is fixedly arranged at the end of the connecting shaft 25 away from the drill bit 47. The gear shaft of the first gear 23 is fixedly provided with a first bevel gear 22. The second bevel gear 38 is engaged with the first bevel gear 22.

[0076] When the protective cover 4 moves, the rack 24 drives the first gear 23 to rotate under the engagement of the first gear 23 and the rack 24. The rotation of the first gear 23 drives the connecting shaft 25 to rotate through the engagement of the first bevel gear 22 and the second bevel gear 38. The rotation of the connecting shaft 25 drives the drilling assembly to rotate together. In this way, the air hole can clean the circumference of the drilling assembly.

[0077] The second partition plate 27 is vertically arranged in the groove 1. The first partition plate 5 is vertically arranged in the groove 1 between the protective cover 4 and the second partition plate 27. The first partition plate 5 is provided with a clearance hole matched with the drill hole.

[0078] When drilling, the circuit board abuts against the first partition plate 5, so that stable drilling can be realized. The clearance hole avoids the drill bit 47 from drilling into the first partition plate 5.

[0079] The first partition plate 5 and the second partition plate 27 are provided with a polishing assembly.

[0080] Specifically, the polishing assembly comprises a polishing roller 21, a second gear 42 and a fastening screw 43.

[0081] The polishing roller 21 is arranged in two. The two polishing rollers 21 are arranged in parallel, and the axes of the two polishing rollers 21 are located on the same horizontal plane. The axis of the polishing roller 21 is perpendicular to the moving direction of the protective cover 4. The polishing roller 21 is rotationally connected with the groove 1.

[0082] The second gear 42 is arranged in two. The two second gears 42 correspond to the two polishing rollers 21 respectively. The second gear 42 is fixedly arranged at one end of the corresponding polishing roller 21. The two second gears 42 are engaged with each other. The second gear 42 is inlaid in the side wall of the groove 1.

[0083] The third motor 33 is fixedly arranged on the side wall of the groove 1. The output shaft of the third motor 33 penetrates the side wall of the groove 1 and is fixedly connected with one of the polishing rollers 21.

[0084] The third motor 33 is started, and the third motor 33 drives the two polishing rollers 21 to rotate reversely through the engagement of the two second gears 42. The circuit board after the drilling is placed between the two polishing rollers 21, and the polishing rollers 21 polish the drilling position of the circuit board to remove burrs.

[0085] The polishing assembly is provided with a cleaning assembly on one side.

[0086] The cleaning assembly comprises a liquid storage tank 34, a rectangular frame 26 and a connecting pipe 41.

[0087] The liquid storage tank 34 is fixed on the groove body 1. A liquid adding port 35 is arranged above the liquid storage tank 34 and communicates with the inner chamber of the liquid storage tank 34.

[0088] The rectangular frame 26 is fixedly installed below the cleaning assembly. A horizontal spray head 40 is arranged on the rectangular frame 26. A liquid discharge port 28 is arranged on the bottom wall of the groove body 1 corresponding to the rectangular frame 26.

[0089] The connecting pipe 41 communicates the liquid storage tank 34 and the rectangular frame 26. A water pump 36 is installed on the connecting pipe 41.

[0090] When the circuit board needs to be cleaned in the future, the circuit board is moved to the rectangular frame 26, and the circuit board is moved downward to the middle cavity position of the rectangular frame 26. The water pump 36 is started to pump out the liquid in the liquid storage tank 34, and the liquid is sprayed out through the spray head 40 arranged on the rectangular frame 26, so that the front and back sides of the circuit board are cleaned in the process of moving downward. The water washing can ensure that the surface of the circuit board is clean and free of impurities, and provides a good environment for electroplating.

[0091] The collecting hopper 10 for collecting drill cuttings is detachably installed below the protective cover 4 and the first partition plate 5.

[0092] Specifically, two guide plates 9 are fixedly installed at the lower end of the groove body 1, and the guide plates 9 are L-shaped. The collecting hopper 10 is slidingly connected between the two guide plates 9. The bottom wall of the groove body 1 between the collecting hopper 10 and the polishing assembly and the drilling assembly is removed.

[0093] Pulling out the collecting hopper 10 can easily remove the collecting hopper 10. It is convenient to pour the drill cuttings in the collecting hopper 10.

[0094] A U-shaped frame 11 is horizontally slidingly installed on the groove body 1, and a clamping assembly is vertically slidingly installed on the U-shaped frame 11. The clamping assembly is used for clamping the circuit board. The U-shaped frame 11 horizontally slides to match the vertical sliding of the clamping assembly, so that the circuit board can be transferred to different workstations to realize different process treatments.

[0095] Specifically, the U-shaped frame 11 includes two vertical rods and a horizontal rod, and the two vertical rods are fixed at the two ends of the horizontal rod. The sidewall of the groove body 1 is fixedly provided with a guide rod 8, and the axis of the guide rod 8 is parallel to the moving direction of the protective cover 4. The lower end of the vertical rod of the U-shaped frame 11 is slidably connected with the guide rod 8. A first screw rod 7 parallel to the axis of the guide rod 8 is arranged above the guide rod 8, and the first screw rod 7 is threadedly connected with the groove body 1. One end of the groove body 1 is fixedly provided with a first motor 6, and the output shaft of the first motor 6 is fixedly connected with the first screw rod 7.

[0096] The first motor 6 is started, and the first motor 6 drives the first screw rod 7 to rotate. Since the first screw rod 7 is threadedly connected with the U-shaped frame 11, the first screw rod 7 drives the U-shaped frame 11 to move along the axis direction of the guide rod 8.

[0097] A sliding plate 30 is slidably arranged on the vertical rod of the U-shaped frame 11. A second driving assembly for driving the sliding plate 30 to move up and down is arranged between the sliding plate 30 and the U-shaped frame 11.

[0098] Specifically, the second driving assembly includes a second screw rod 18 and a second motor 12.

[0099] The second screw rod 18 is provided in two. The two second screw rods 18 are arranged in parallel. The second screw rod 18 is arranged in parallel with the vertical rod of the U-shaped frame 11. The second screw rod 18 is fixedly connected with the corresponding vertical rod of the U-shaped frame 11. The sliding plate 30 is threadedly connected with the second screw rod 18.

[0100] The second motor 12 is fixedly arranged on the horizontal rod of the U-shaped frame 11, and the output shaft of the second motor 12 is fixedly connected with one of the second screw rods 18. The second motor 12 is connected with the other second screw rod 18 through a transmission belt assembly 45.

[0101] The second motor 12 is started, and the second motor 12 drives the two second screw rods 18 to rotate synchronously through the transmission belt assembly 45. The second screw rod 18 drives the sliding plate 30 to move up and down.

[0102] The clamping assembly is provided in two groups. The clamping assembly is arranged on the sliding plate 30. Specifically, the clamping assembly includes a clamping plate 20. The clamping plate 20 is located below the sliding plate 30. A second electric push rod 19 is fixedly arranged on the sliding plate 30. The clamping plate 20 is provided in two, and the two clamping plates 20 are arranged in parallel. One of the clamping plates 20 is fixedly arranged on the lower sidewall of the sliding plate 30, and the other clamping plate 20 is fixedly connected with the output rod of the second electric push rod 19.

[0103] The circuit board is placed between the two clamping plates 20. The second electric push rod 19 is started to make the second electric push rod 19 shorter, and the two clamping plates 20 clamp the circuit board.

[0104] The drying assembly is installed below the U-shaped frame 11.

[0105] Specifically, the drying assembly includes two fixed shells 17. The two fixed shells 17 are fixedly installed at the two ends of the U-shaped frame 11 respectively. The side wall of the fixed shell 17 is fixedly installed with a blower 44. The fixed shell 17 is located on both sides of the clamping assembly, and the air outlet of the blower 44 faces the circuit board in the clamping assembly.

[0106] The electroplating assembly is installed at the end of the groove body 1 away from the protective cover 4.

[0107] Specifically, the electroplating assembly includes an electroplating box 29, a cover plate 13, and a reset structure.

[0108] The electroplating box 29 is fixedly installed in the groove body 1 with the opening upward.

[0109] The cover plate 13 is connected to the electroplating box 29 in sliding mode. The cover plate 13 includes a horizontal plate and two vertical plates. The two vertical plates are fixedly installed at the two ends of the horizontal plate, and the two vertical plates are located on the upper and lower sides of the horizontal plate respectively. The height of the upper vertical plate is higher than the height of the fixed shell 17.

[0110] The reset structure is installed between the cover plate 13 and the side wall of the groove body 1.

[0111] Further, the reset structure includes a fixed plate 14, a first spring 15, a connecting plate 16, and a second spring 31.

[0112] The fixed plate 14 is fixedly installed on the groove body 1. The fixed plate 14 is located at the end of the groove body 1 away from the protective cover 4.

[0113] The fixed plate 14 is provided with a clearance groove. The vertical plate of the cover plate 13 is connected to the clearance groove in sliding mode. The first spring 15 is fixedly installed in the clearance groove of the fixed plate 14. One end of the first spring 15 is fixed to the side wall of the clearance groove, and the other end of the first spring 15 is fixed to the vertical plate of the cover plate 13.

[0114] The connecting plate 16 is connected to the upper side wall of the fixed plate 14 in vertical sliding mode. The lower end of the connecting plate 16 penetrates the upper side wall of the clearance groove and is located in the clearance groove. The lower end of the connecting plate 16 is fixedly installed with an inclined block 32. One end of the inclined block 32 close to the cover plate 13 is provided with an inclined surface, and the cover plate 13 is provided with a clamping groove 46 matched with the inclined block 32.

[0115] The second spring 31 is fixed between the connecting plate 16 and the fixed plate 14.

[0116] When the circuit board is electroplated, the U-shaped frame 11 is moved to the side close to the electroplating box 29. The fixed shell 17 on the U-shaped frame 11 first contacts the cover plate 13. During the continuous movement of the U-shaped frame 11, the fixed shell 17 continuously presses the cover plate 13, so that the cover plate 13 and the electroplating box 29 are relatively displaced, and the cover plate 13 is moved to one side from the electroplating box 29. This facilitates the circuit board to enter the electroplating box 29 for electroplating treatment. During the movement of the cover plate 13 to open the electroplating box 29, the first spring 15 is deformed under pressure. When the cover plate 13 completely opens the electroplating box 29, the connecting plate 16 is placed into the clamping groove 46 to prevent the cover plate 13 from rebounding. After the fixed shell 17 is separated from the cover plate 13, the connecting plate 16 is pulled out upward, so that the limit of the inclined block 32 to the cover plate 13 is released. Under the elastic force of the first spring 15, the cover plate 13 moves reversely to reset and cover the electroplating box 29.

[0117] The specific use method of the present application is as follows:

[0118] When it is necessary to punch the circuit board, the circuit board is placed between the two clamping plates 20. The second electric push rod 19 is started to make the second electric push rod 19 shorter, so that the two clamping plates 20 clamp the circuit board.

[0119] Then the first motor 6 is started, the first motor 6 drives the first screw 7 to rotate, and the first screw 7 drives the U-shaped frame 11 to move towards the protective cover 4. When the circuit board is located at the left side position of the first partition plate 5, the first motor 6 is turned off, and the second motor 12 is started. The second motor 12 drives the second screw 18 to rotate, so that the sliding plate 30 moves downward. The sliding plate 30 drives the circuit board to move downward, so that the circuit board is attached to the left side of the first partition plate 5. During subsequent punching work, the first partition plate 5 can support the circuit board.

[0120] After the above work is completed, the punching work is started. The first electric push rod 3 is started, and the first electric push rod 3 pushes the protective cover 4 to move towards the first partition plate 5. During the movement of the protective cover 4 towards the first partition plate 5, the first gear 23 is driven to rotate by the meshing of the first gear 23 and the rack 24. The first gear 23 rotates to drive the connecting shaft 25 to rotate through the meshing of the first bevel gear 22 and the second bevel gear 38. The rotation of the connecting shaft 25 drives the drilling assembly to rotate together. In this way, the air hole can clean the circumference of the drill bit 47.

[0121] When the drill bit 47 contacts the circuit board, the micro motor is started. The micro motor drives the drill bit 47 to rotate to perform the drilling operation on the circuit board.

[0122] The drillings produced by the drill bit 47 will all fall into the collecting hopper 10 through the openings below the groove body 1, and are collected uniformly, so that the drillings can be prevented from accumulating in the groove body 1 and then cleaned manually. After the drilling is completed, the drill bit 47 is retracted away from the circuit board after the drilling is completed by the first electric push rod 3. During the process that the drill bit 47 is retracted away from the circuit board, the connecting shaft 25 drives the drill bit 47 to rotate reversely, and the air hole still blows air to clean the drillings in the guide groove of the drill bit 47 after the drilling is completed.

[0123] When it is necessary to polish the burrs on the surface of the circuit board after the drilling, the second motor 12 is started to drive the sliding plate 30 to move upward and lift the circuit board after the drilling away from the first partition plate 5. Then, the first motor 6 is started to drive the U-shaped frame 11 to move above the two polishing rollers 21. The third motor 33 is started to drive the two polishing rollers 21 to rotate, and at the same time, the second motor 12 is started to drive the circuit board to move downward, so that the surface of the circuit board is polished by the polishing rollers 21 during the process that the circuit board moves downward, so as to remove the burrs on the surface of the circuit board.

[0124] When it is necessary to clean the surface of the circuit board after the polishing is completed, the first motor 6 is started to drive the U-shaped frame 11 to move above the rectangular frame 26. Then, the second motor 12 is started to drive the circuit board to move downward, so that the circuit board is located at the middle position of the rectangular frame 26. During the process that the circuit board moves downward, the water pump 36 is started to pump the liquid in the liquid storage tank 34 out and spray the liquid out through the nozzles 40 arranged on the rectangular frame 26. The front and rear sides of the circuit board are cleaned during the process that the circuit board moves downward, and the water cleaning can ensure that the surface of the circuit board is clean and free of impurities, so as to provide a good environment for electroplating.

[0125] After the cleaning of the circuit board is completed, the second motor 12 is started to drive the circuit board to move upward, and during the process that the circuit board moves upward, the hair dryer 44 is started. Since the hair dryer 44 is arranged on the left and right sides of the U-shaped frame 11, the hair dryer 44 can dry the water remaining on the two sides of the circuit board after the cleaning. The drying treatment can ensure that there is no water remaining on the surface of the circuit board, so as to provide a dry surface for electroplating. The moisture in the circuit board can be quickly converted into water vapor during the high-temperature electroplating process, which can form bubbles and affect the firmness of the welding points and the reliability of the electrical connection. The drying treatment can remove these moisture in advance, which can significantly reduce the risk of welding bubbles.

[0126] The circuit board is then electroplated. The first motor 6 is started, causing the U-shaped frame 11 to move the circuit board closer to the electroplating tank 29. During the movement of the U-shaped frame 11, the fixing shell 17 on the side of the U-shaped frame 11 closest to the electroplating tank 29 first contacts the cover plate 13. As the U-shaped frame 11 continues to move, the fixing shell 17 continuously presses against the cover plate 13, causing a relative displacement between the cover plate 13 and the electroplating tank 29, thus moving the cover plate 13 from the electroplating tank 29 to one side. This opens the opening of the electroplating tank 29.

[0127] When the circuit board is moved as shown in the attached Figure 15 After reaching the indicated position, start the second motor 12 to move the circuit board downwards and immerse it in the electroplating tank 29 for electroplating. After the electroplating is completed, start the second motor 12 again to move the circuit board upwards for resetting. During the resetting process, start the blower 44 to dry the surface of the circuit board. The dried circuit board surface is cleaner and flatter, which is beneficial for subsequent assembly and soldering.

[0128] As the fixed housing 17 pushes the cover plate 13 to move, the first spring 15 is compressed. When the circuit board moves to the attached... Figure 15 After the position is determined, the inclined block 32 enters the slot 46, limiting the position of the cover plate 13. This ensures that the circuit board does not come into contact with the cover plate 13 during the up-and-down movement of the circuit board above the electroplating tank 29, thus protecting the circuit board.

[0129] When the fixed shell 17 is not in contact with the cover plate 13, the connecting plate 16 is pulled upward, causing the inclined block 32 to release its restriction on the cover plate 13. The cover plate 13 will move through the elastic reset of the first spring 15, so that the cover plate 13 automatically closes the top of the electroplating tank 29, thereby preventing dust and impurities from falling into the tank and affecting the plating quality.

[0130] When adding electroplating solution to the electroplating tank 29, the slot 46 on the cover plate 13 can be engaged with the inclined block 32 by manual operation or by pushing the fixed shell 17, thereby limiting the cover plate 13 to facilitate the addition of solution. After the solution is added, the inclined block 32 can be disengaged from the slot 46 by moving the connecting plate 16, thereby sealing the electroplating tank 29.

[0131] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electroplating apparatus for processing an integrated circuit board, comprising a tank body (1), characterized in that, The groove body (1) is horizontally slidably installed with a protective cover (4), the protective cover (4) is rotatably installed with a drilling assembly, and the protective cover (4) and the drilling assembly are installed with a first driving assembly for driving the drilling assembly to rotate; The groove body (1) is fixedly installed with a vertical second partition plate (27), the groove body (1) between the second partition plate (27) and the protective cover (4) is fixedly installed with a vertical first partition plate (5), the first partition plate (5) is provided with a clearance hole matched with the drill hole, and the first partition plate (5) and the second partition plate (27) are installed with a polishing assembly; The protective cover (4) and the first partition plate (5) are detachably installed with a collecting hopper (10) below for collecting drill cuttings; The sidewall of the groove body (1) between the first partition plate (5) and the protective cover (4) is provided with an air hole; The groove body (1) is horizontally slidably installed with a U-shaped frame (11), the U-shaped frame (11) is vertically slidably installed with a clamping assembly, the lower portion of the U-shaped frame (11) is installed with a drying assembly, and the groove body (1) is installed with an electroplating assembly away from the protective cover (4); One side of the polishing assembly is installed with a cleaning assembly; The cleaning assembly comprises a liquid storage tank (34) fixed on the groove body (1), and a liquid inlet (35) is arranged above the liquid storage tank (34) and communicates with the inner chamber of the liquid storage tank (34); A rectangular frame (26) is fixedly installed below the cleaning assembly, and a horizontal spray head (40) is arranged on the rectangular frame (26), and a liquid outlet (28) is arranged on the bottom wall of the groove body (1) corresponding to the rectangular frame (26); A connecting pipe (41) connects the liquid storage tank (34) and the rectangular frame (26), and a water pump (36) is installed on the connecting pipe (41).

2. The electroplating apparatus for processing an integrated circuit board according to claim 1, wherein: A first electric push rod (3) is fixedly installed on the groove body (1), the extension shaft of the first electric push rod (3) is parallel to the moving direction of the protective cover (4), the extension end of the first electric push rod (3) penetrates the sidewall of the groove body (1) and is fixedly connected with the sidewall of the protective cover (4), two slide rods (2) parallel to the axis of the first electric push rod (3) are fixedly installed on the protective cover (4), the two slide rods (2) are arranged on the two sides of the first electric push rod (3), and the slide rods (2) are slidably connected with the groove body (1).

3. The electroplating apparatus for processing an integrated circuit board according to claim 1, wherein: The drilling assembly comprises a connecting shaft (25) rotatably connected with the protective cover (4); A drill bit (47) is fixedly installed on one end of the connecting shaft (25), a micro motor is installed on the output shaft of the micro motor, and the drill bit (47) is connected with the output shaft of the micro motor through a fastening screw (43). The first driving assembly comprises a rack (24) fixedly installed on the bottom wall of the groove body (1), the rack (24) being located in the protective cover (4), and a slot (39) being formed in the side wall of the protective cover (4) and allowing the rack (24) to pass through; A first gear (23) is fixedly installed on the inner wall of the protective cover (4), the axis of the first gear (23) being arranged in a horizontal direction, the first gear (23) being rotationally connected with the connecting block (37), the axis of the first gear (23) being perpendicular to the moving direction of the protective cover (4), and the first gear (23) being engaged with the rack (24); A second bevel gear (38) is fixedly installed on the end of the connecting shaft (25) away from the drill bit (47), a first bevel gear (22) being fixedly installed on the first gear (23), and the second bevel gear (38) being engaged with the first bevel gear (22).

4. The electroplating apparatus for processing an integrated circuit board according to claim 1, wherein: The polishing assembly comprises polishing rollers (21), the polishing rollers (21) being arranged in two, the two polishing rollers (21) being arranged in parallel, the axes of the two polishing rollers (21) being located on the same horizontal plane, the axes of the polishing rollers (21) being perpendicular to the moving direction of the protective cover (4), and the polishing rollers (21) being rotationally connected with the groove body (1); Second gears (42) are arranged in two, the two second gears (42) being respectively corresponded to the polishing rollers (21), the second gears (42) being respectively fixedly installed on one end of the corresponding polishing rollers (21), the two second gears (42) being engaged with each other, and the second gears (42) being inlaid in the side wall of the groove body (1); A third motor (33) is fixedly installed on the side wall of the groove body (1), and the output shaft of the third motor (33) penetrates the side wall of the groove body (1) and is fixedly connected with one of the polishing rollers (21).

5. The electroplating apparatus for processing an integrated circuit board according to claim 1, wherein: The U-shaped frame (11) comprises two vertical rods and a horizontal rod, the two vertical rods being respectively fixed on the two ends of the horizontal rod; A guide rod (8) having an axis parallel to the moving direction of the protective cover (4) is fixedly installed on the side wall of the groove body (1), and the lower end of the vertical rod of the U-shaped frame (11) is slidably connected with the guide rod (8); A first screw rod (7) having an axis parallel to the axis of the guide rod (8) is arranged above the guide rod (8), and the first screw rod (7) is threadedly connected with the groove body (1); A first motor (6) is fixedly installed on one end of the groove body (1), and the output shaft of the first motor (6) is fixedly connected with the first screw rod (7).

6. The electroplating apparatus for processing an integrated circuit board according to claim 1, wherein: A sliding plate (30) is vertically and slidably installed on the vertical rod of the U-shaped frame (11), and a second driving assembly for driving the sliding plate (30) to move up and down is installed between the sliding plate (30) and the U-shaped frame (11). The second driving assembly comprises two second screws (18) arranged in parallel, the second screws (18) are arranged in parallel with the vertical rods of the U-shaped frame (11), and the second screws (18) are fixedly connected with the corresponding vertical rods of the U-shaped frame (11); The sliding plate (30) is threadedly connected with the second screw (18); A second motor (12) is fixedly installed on the cross rod of the U-shaped frame (11), an output shaft of the second motor (12) is fixedly connected with one of the second screws (18), and the second motor (12) is connected with the other second screw (18) through a transmission belt assembly (45).

7. The electroplating apparatus for processing an integrated circuit board according to claim 6, wherein: The clamping assembly is arranged in two groups and is installed on the sliding plate (30); the clamping assembly comprises two clamping plates (20) arranged in parallel, one clamping plate (20) is fixedly installed on the lower side wall of the sliding plate (30), and the other clamping plate (20) is fixedly connected with the output rod of the second electric push rod (19).

8. The electroplating apparatus for processing an integrated circuit board according to claim 1, wherein: The drying assembly comprises two fixed shells (17) fixedly installed at two ends of the U-shaped frame (11), a blower (44) is fixedly installed on the side wall of the fixed shell (17), the fixed shell (17) is located on the two sides of the clamping assembly, and the air outlet of the blower (44) faces the clamping assembly.

9. The electroplating apparatus for processing an integrated circuit board according to claim 8, wherein: The electroplating assembly comprises an electroplating box (29) fixedly installed in the tank body (1) with an upward opening; A cover plate (13) is slidably connected between the electroplating box (29); the cover plate (13) comprises a horizontal plate and two vertical plates, the two vertical plates are fixedly installed at two ends of the horizontal plate, and the two vertical plates are located on the upper side and the lower side of the horizontal plate respectively, and the height of the upper vertical plate is higher than that of the fixed shell (17); A reset structure is installed between the cover plate (13) and the side wall of the tank body (1); The reset structure comprises a fixed plate (14) fixedly installed on the tank body (1), and the fixed plate (14) is located at one end of the tank body (1) away from the protective cover (4); A first spring (15) is arranged in a clearance groove in the fixed plate (14), a vertical plate of the cover plate (13) is slidably connected with the clearance groove, the first spring (15) is fixedly installed in the clearance groove of the fixed plate (14), one end of the first spring (15) is fixedly connected with the side wall of the clearance groove, and the other end of the first spring (15) is fixedly connected with the vertical plate of the cover plate (13); The connecting plate (16) is connected with the upper side wall of the fixed plate (14) vertically sliding, the lower end of the connecting plate (16) penetrates the upper side wall of the accommodation slot and is located in the accommodation slot, the lower end of the connecting plate (16) is fixedly installed with an inclined block (32), one end of the inclined block (32) close to the cover plate (13) is provided as an inclined surface, and the cover plate (13) is provided with a clamping groove (46) matched with the inclined block (32); and the second spring (31) is fixed between the connecting plate (16) and the fixed plate (14).

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