Sheet-type sintered bonding material

JPWO2026009882A5Active Publication Date: 2026-06-09NIHON SUPERIOR CO LTD +1

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NIHON SUPERIOR CO LTD
Filing Date
2025-07-01
Publication Date
2026-06-09

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Abstract

The present invention relates to a sheet-like sintered bonding material having a metal layer made of a plate-like or foil-like metal and a tacky adhesive layer containing metal nanoparticles and a solvent on both sides of the metal layer, wherein the metal nanoparticles are composite metal nanoparticles in which an organic coating layer made of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms is formed around a metal core with an average particle size of 1 to 200 nm made of an aggregate of metal atoms; a joint formed by joining the sheet-like sintered bonding material and a bonding member; and electrical equipment, electronic equipment, semiconductor components, or heat dissipation components using the said joint.
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