Inline air milling and mixing apparatuses for processing electrode film mixtures, and methods thereof

Abstract

An electrode film mixture processing system and a method thereof are disclosed, comprising an inline air milling device coupled to a mixing device. Such a system can help improve the material uniformity of the electrode film mixture by adjusting the particle size distribution and temperature of the electrode film material and distributing the material more effectively.

Description

Technology Field

[0001] This application claims the benefit of priority to U.S. Patent Application No. 19 / 016,706, filed January 10, 2025, “Inline air milling and mixing apparatus for processing electrode film mixtures and method thereof,” the entirety of which is incorporated herein by reference.

[0002] The present disclosure relates to a system and method for processing an electrode film mixture and a product thereof. In particular, the system and method relate to processing an electrode film mixture using an air milling apparatus. Background Technology

[0003] A typical electrode film mixture for energy storage devices comprises a binder material that is combined with an active electrode material. Generally, the electrode film mixture requires effective distribution of the binder material prior to the assembly of the energy storage device. In the dry electrode film manufacturing process, the effective distribution of the dry binder combines with the active electrode material and is calendered without the use of solvents to form the dry electrode film. However, energy storage devices containing the processed dry electrodes may exhibit issues related to the high utilization, uniformity, and optimal particle size distribution of the binder material, which are critical parameters for the electrochemical and mechanical properties of the electrode. Conventional systems and methods for addressing binder distribution problems can lead to unwanted material aggregation and yield loss.

[0004] To summarize the invention and explain the advantages achieved over the prior art, specific objects and advantages of the invention are described herein. Not all such objects or advantages may be achieved in any specific embodiment of the invention. Accordingly, for example, those skilled in the art will recognize that the invention may be embodied or practiced in a manner that achieves or optimizes one or a group of advantages as taught herein, without necessarily achieving other objects or advantages that may be taught or suggested herein.

[0005] In one embodiment, a method for processing an electrode film mixture is described. The method comprises: a step of forming an air-milled binder material by air-milling a binder material by applying a temperature-controlled gas to an air milling device comprising an air milling chamber and a pressurization insert positioned within the air milling chamber, wherein the air milling device is attached to a mixing device comprising a mixing chamber, and the pressurization insert comprises an outlet configured to provide fluid communication between the air milling chamber and the mixing chamber; a step of dispersing the air-milled binder material into a mixing chamber comprising an active material; and a step of mixing the air-milled binder material and the active material within the mixing chamber to form an electrode film material mixture.

[0006] In another embodiment, a system for processing an electrode film mixture is described. The system comprises: a mixing device including a mixing chamber; and an air milling device including an air milling chamber and a pressurized insert located within the air milling chamber, wherein the air milling device is attached to the mixing device and the pressurized insert includes an outlet configured to provide fluid communication between the air milling chamber and the mixing chamber.

[0007] In some embodiments, the outlet includes a dispersion nozzle. In some embodiments, the mixing device is a fluidized bed mixing device. In some embodiments, the mixing chamber includes a mixing blade. In some embodiments, the system further includes a pressurized tank in fluid communication with the air milling device.

[0008] In another embodiment, a method for preparing an electrode film mixture is described. The method comprises: air milling a material to form an air-milled material; dispersing the air-milled material into a mixing chamber containing an active material; and mixing the air-milled material and the active material in the mixing chamber to form an electrode film material mixture.

[0009] In some embodiments, the method further comprises the step of gravity-feeding the air-milled material into the mixing chamber. In some embodiments, the method further comprises the step of premixing the material with a conductive additive. In some embodiments, mixing the air-milled material with the active material in the mixing chamber is performed by a high-shear process. In some embodiments, the air-milled material has a D of less than about 30 μm. 50It includes the average particle size distribution.

[0010] In some embodiments, air milling involves applying a temperature-controlled gas to the material. In some embodiments, the temperature-controlled gas comprises a gas selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof. In some embodiments, air milling of the material is performed at a gauge pressure between 0.1 atm and 4 atm.

[0011] In some embodiments, mixing is performed at a temperature of at least about 20°C. In some embodiments, the method further includes the step of coating the active material with a carbon material before dispersion or mixing. In some embodiments, the carbon material comprises activated carbon. In some embodiments, the active material is selected from the group consisting of graphite, lithium nickel manganese cobalt oxide (NMC), lithium nickel cobalt aluminum oxide (NCA), and combinations thereof.

[0012] In some embodiments, the method further includes a step of preprocessing the material before air milling. In some embodiments, the preprocessing includes temperature-controlled treatment of the material to a temperature of about -200 to 300°C.

[0013] In some embodiments, the material is a binder material. In some embodiments, the binder material comprises a dry fibrillizable binder. In some embodiments, the binder material is selected from the group consisting of polytetrafluoroethylene (PTFE), polyethylene (PE), polypropylene (PP), polyvinylidene fluoride (PVDF), polyvinylene chloride, poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), poly(ethylene oxide) (PEO), poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), polydimethylsiloxane (PDMS), polydimethylsiloxane-coalkylmethylsiloxane, polyalkylenes, polyethers, styrene-butadiene, styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), co-polymers of polysiloxanes and polysiloxanes, branched polyethers, polyvinylethers, copolymers thereof, and combinations thereof. In some embodiments, the electrode film material mixture is substantially free of solvent residue. Brief explanation of the drawing

[0014] FIG. 1 is a schematic illustration of a processing system including an air milling device and a mixing device according to some embodiments. FIG. 2 is a schematic illustration of an air milling device according to some embodiments. FIG. 3 is a schematic illustration of a part of an air milling device according to some embodiments. FIG. 4 is a schematic flowchart of an air milling device and a mixing device according to some embodiments. FIG. 5 is a flowchart showing a method for processing an electrode film mixture including air milling according to some embodiments. FIG. 6 is a data plot showing the deagglomeration of binder materials based on volume % and size according to some embodiments. FIG. 7 is a data plot showing particle size distribution based on cumulative volume % and particle diameter when using air-milled binder material and non-milled binder material according to some embodiments. FIG. 8a is a flow vector diagram showing the flow rate of a binder material moving through a vertical cross-section of an air milling device according to some embodiments. FIG. 8b is a schematic example diagram comparing an air flow path and a powder flow path according to some embodiments. FIG. 9 is a data plot showing the pressure profile of air flowing from an air milling chamber to a mixing chamber according to some embodiments. Figure 10a is an energy dispersive spectral analysis (EDS) image of an unmilled binder material that has undergone homogenization. FIG. 10b is an EDS image of an air-milled binder material that has undergone homogenization according to some embodiments. FIG. 10c is a data plot showing line speed versus expected standard deviation of various air-milled binder materials and unmilled binder materials according to some embodiments. FIG. 11a is a data plot showing the amount (weight %) of attached fibrous binder and unattached fibrous binder based on sieve size according to some embodiments. FIG. 11b is a scanning electron microscope (SEM) image of an unmilled binder material on a stiff cathode according to some embodiments. FIG. 11c is an SEM image of an air-milled binder material on a hard anode according to some embodiments. It will be clearly understood that the embodiments and drawings are for illustrative purposes only and do not necessarily limit the scope of the invention. Specific details for implementing the invention

[0015] While specific preferred embodiments and examples are disclosed below, the subject matter of the invention extends beyond the specifically disclosed embodiments to other alternative embodiments and / or uses and variations and equivalents thereof. Accordingly, the scope of the appended claims is not limited by the specific embodiments described below. For example, in any method or process disclosed herein, the actions or operations of said method or process may be performed in any appropriate order and are not necessarily limited to the specific order disclosed. Various operations may be described in sequence as a number of individual operations, which may be helpful in understanding the specific embodiments; however, the order of description should not be interpreted to mean that these operations are order-dependent. Furthermore, structures, systems, and / or devices described herein may be implemented as integrated components or as separate components. To compare various embodiments, specific aspects and advantages of such embodiments are described. Not all such aspects or advantages are necessarily achieved by any specific embodiment. Accordingly, for example, various embodiments may be performed in a manner that achieves or optimizes one or a group of advantages taught in this specification, without necessarily achieving other aspects or advantages that may be taught or suggested in this specification.

[0016] A system and method for processing an electrode film mixture using an air milling device are described. Generally, an electrode film mixture may comprise a mixture of an active material and a binder material. However, conventional systems and methods for processing electrode film mixtures can result in poor material uniformity, metallic contamination, material damage, unwanted material aggregation, and long mixing cycle times. Furthermore, if binder particles are highly aggregated or do not adhere to a bonding network, film defects (e.g., microstructure, density, local variations in film loading, reduced electrochemical performance) may occur in the electrode film.

[0017] Therefore, when a material (e.g., electrode material) is fed into a mixing device (e.g., gravity feed, pneumatically fed), it can be air-milled in an air milling device using a gas (e.g., temperature-controlled gas, pressurized cooling air). The material can be uniformly distributed into the mixing device by crushing aggregated particles and achieving an optimal particle size distribution (e.g., small and well-distributed fiberized binder material).

[0018] In some embodiments, the material comprises an electrode material. In some embodiments, the electrode material comprises an active material (e.g., an active electrode material, a positive electrode active material, a negative electrode active material), a carbon material, a conductive additive, a binder material, and combinations thereof. In some embodiments, the material may be in the form of particles (e.g., powder).

[0019] In some embodiments, the binder material is fibrillated or fibrillized within an air milling device and / or mixing device. In some embodiments, fibrillation within the air milling device and / or mixing device may help control the particle size of the binder material. Additionally, the formulation of a high-density, uniform electrode film mixture containing an air-milled material (e.g., an air-milled electrode material) may help create a sufficient bonding network for enhanced mechanical strength and packing density during electrode manufacturing. In some embodiments, the air-milled material includes an air-milled electrode material. In some embodiments, the air-milled electrode material includes an air-milled active material (e.g., an air-milled active electrode material, an air-milled positive active material, an air-milled negative active material), an air-milled carbon material, an air-milled conductive additive, an air-milled binder material, and combinations thereof.

[0020] In some embodiments, as a result of achieving an optimal particle size distribution for the electrode material, electrode films, electrodes, and electrode film mixtures used to form energy storage devices may possess enhanced electrochemical and / or mechanical properties. Effective distribution and utilization of the material can enable the maximum use of inactive additives in electrode fabrication, thereby allowing more active components to be used to achieve enhanced electrode mechanical properties. Furthermore, effective distribution of the material can help improve the energy density and cost-effectiveness ($ / kWh) of the electrode assembly. Additionally, fabricating electrodes with uniformly distributed additives can improve electrochemical performance, for example, by reducing lithium ion transport pathways and pathways that contribute to hot spots, lithium plating, and reduced cycle life. Moreover, high localized additive concentrations during the electrode film fabrication process can negatively affect the mechanical and thermal properties of the electrode film and may cause additional defects such as roll build-up and pull-out.

[0021] In addition, air milling enables temperature control of the material, thereby controlling aggregation of the material itself and other additive particles within the mixing device.

[0022] In some embodiments, the material particle size and morphology can be adjusted by changing the motive pressure (e.g., fluid velocity) corresponding to the milling force of the air milling device. In some embodiments, the air milling device can be modified based on specific fluid and particle trajectories. Modifying the material particle size and other elements of the air milling device can improve mixing uniformity and prevent unwanted particle aggregation.

[0023] Air milling device and mixing device

[0024] FIG. 1 is a schematic example of a processing system including an air milling device and a mixing device. As illustrated in FIG. 1, the processing system (100) includes an air milling device (110) including a pressurized insert (120), and a mixing device (150) including a mixer or mixing chamber (160) and a mixing blade (170). The air milling device (110) is directly attached to the top of the mixing device (150), where the pressurized insert (120) is positioned within the mixing device (150) and allows the air milling device (110) to be in fluid communication with the mixing device (150). The pressurized insert (120) includes a bottom insert length (130) and injection angles (135a, 135b). The upper part (not shown) of the pressurized insert (120) is positioned within the air milling device (110), and the lower part of the pressurized insert (120) is positioned within the mixing chamber (160). The lower part of the pressurized insert (120) includes a lower insert length (130) that can reach toward the bottom of the mixing chamber (160) or where the mixing blade (170) is positioned. The injection angle (135a, 135b) is associated with the lower insert length (130), so that a change in the lower insert length (130) will affect the injection angle (135a, 135b).

[0025] In some embodiments, the air milling device is attached to, connected to, and / or fluidly connected to the mixing device. In some embodiments, the air milling device may be detached or disconnected from the mixing device. In some embodiments, a pressure insert is configured to be attached between the air milling device and the mixing device. In some embodiments, the shape of the pressure insert may be configured to air mill the material to form an air-milled material when the air mill is in use. In some embodiments, the shape of the pressure insert is configured to augment the particle size distribution of the material milled by the milling device. In some embodiments, the shape of the pressure insert may be used to increase the gas flow rate, material flow rate, and / or pressure range within the air milling device. In some embodiments, the pressure insert may be detachably coupled so that it can be separated and / or replaced with a pressure insert of a different shape that can be attached to, connected to, and / or fluidly connected to the mixing device according to air milling requirements.

[0026] In some embodiments, the processing system includes an inline connection between the milling device and the mixing device so that the milling device is in fluid communication with the mixing device.

[0027] In some embodiments, the mixing device may be a fluidized bed mixing device. In some embodiments, the fluidized bed mixing device includes a fluidizing medium inlet containing a fluidizable medium (e.g., a fluidizable material). In some embodiments, the fluidizable medium is sprayed or mixed into a mixing chamber. In some embodiments, the fluidizable medium is fluidized within the mixing chamber. In some embodiments, the fluidized bed mixing device is configured to suspend active material precursor particles within the fluidizable medium by gravity and / or recirculation of the fluidizable medium. In some embodiments, the fluidizable medium is fluidized by a gas such as air or nitrogen, and / or a liquid such as water or a solvent.

[0028] In some embodiments, the mixing device may include one or more mixing chambers. In some embodiments, the mixing device may include a material diverter valve that allows air-milled material to flow between one or more mixing chambers. In some embodiments, the mixing device may include an air separator for switching gas between one or more mixing chambers. In some embodiments, the mixing device may include an air filter to prevent gas accumulation within one or more mixing chambers.

[0029] In some embodiments, the mixing chamber may include a plurality of mixing blades. In some embodiments, the mixing chamber may further include a deflector. In some embodiments, the mixing blades are configured to rotate clockwise or counterclockwise. In some embodiments, the mixer and / or mixing chamber is a high-shear mixer and / or mixing chamber. In some embodiments, the mixer and / or mixing chamber is a low-shear mixer and / or mixing chamber. In some embodiments, the mixing chamber includes an exhaust port for removing gas within the mixing chamber. In some embodiments, the exhaust port is attached to, connected to, and / or fluidly connected to the mixing device. In some embodiments, the exhaust port may be detached from or disconnected from the mixing device. In some embodiments, the exhaust port prevents the material from being short-circuited to the exhaust port and prevents the maximum allowable pressure within the mixing chamber from being exceeded by allowing the material to remain within the mixing chamber. In some embodiments, the mixing chamber includes a tangential gas inlet to help the air-milled material be mixed within the mixing chamber.

[0030] In some embodiments, the spray angle may be positive (e.g., greater than about 0°). In some embodiments, the spray angle may be less than about 90°. In some embodiments, the spray angle is a range of values ​​of 1°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, or 90°, or any value in between, or is about that value, or is at most that value, or at most about that value. In some embodiments, the spray angle may be negative (e.g., less than about 0°). In some embodiments, the spray angle may be about -90°. In some embodiments, the spray angle is a range of -1°, -5°, -10°, -15°, -20°, -25°, -30°, -35°, -40°, -45°, -50°, -55°, -60°, -65°, -70°, -75°, -80°, -85°, or -90°, or any value in between, or is approximately that value, or at least that value, or at least approximately that value.

[0031] The bottom insert length may be referred to as the travel distance between the air milling chamber and the mixing chamber. In some embodiments, the injection angle and / or travel distance may affect the particle size distribution. In some embodiments, the bottom insert length may be configured so that the injection angle corresponds to the travel distance. In some embodiments, a longer bottom insert length may reduce the injection angle. In some embodiments, a shorter bottom insert length may increase the injection angle. In some embodiments, the length of the bottom insert is a range of 10 cm, 11 cm, 12 cm, 13 cm, 14 cm, 15 cm, 16 cm, 17 cm, 18 cm, 19 cm, 20 cm, 21 cm, 22 cm, 23 cm, 24 cm, 25 cm, 26 cm, 27 cm, 28 cm, 29 cm, 30 cm, 31 cm, 32 cm, 33 cm, 34 cm, 35 cm, 36 cm, 37 cm, 38 cm, 39 cm, or 40 cm, or any value in between, approximately that value, at least that value, or at least approximately that value.

[0032] FIG. 2 is a schematic example of an air milling device. As shown in FIG. 2, the air milling device (200) includes a hopper (210) (i.e., a funnel), an inlet valve (220), a material dispenser (230), and a pressurized insert (240). The hopper (210) is in fluid communication with the inlet valve (220), which opens or closes entry into the material dispenser (230). The material dispenser (230) is positioned between the inlet valve (220) and the pressurized insert (240). The hopper (210), the inlet valve (220), the material dispenser (230), and the pressurized insert (240) are in fluid communication with each other.

[0033] In some embodiments, the hopper may include a suction air supply, wherein the suction air supply provides low friction roughness to the hopper surface. In some embodiments, the suction air supply may include a permeable metal for fluidization that directs the gas flow toward the material through the hopper. In some embodiments, the pressurized insert is detachable from the material dispenser, the inlet valve, and / or the funnel. In some embodiments, the material valve and / or the material dispenser may be detachable from the air milling device. In some embodiments, the center of the material dispenser is configured to be off-centered from the center of the air milling chamber to prevent short circuiting. In some embodiments, the material dispenser includes a dispenser valve to prevent positive pressure and / or backflow.

[0034] FIG. 3 is a schematic illustration of a part of an air milling device. As illustrated in FIG. 3, a part of the air milling device (300) includes a part of a material dispenser (310), a gas inlet (320A, 320B), a pressurized insert (325), an upper part of the pressurized insert or an air milling chamber (330), a gas outlet (335A, 335B), and a lower part of the pressurized insert or an outlet (340). The outlet (340) further includes a dispersion nozzle (350). The outlet (340) is attached to or connected to the air milling chamber (330) so that the outlet (340) extends into a mixing device. The part of the material dispenser (310), the air milling chamber (330), and the outlet (340) are fluidly connected to each other. The gas inlets (320A, 320B) are fluidly connected to the air milling chamber (330), so that the gas inlets (320A, 320B) supply gas to the air milling chamber (330) through the gas outlets (335A, 335B), respectively. The gas outlets (335A, 335B) serve as channels for the gas flowing from the gas inlets (320A, 320B) to the air milling chamber (330).

[0035] In some embodiments, the air milling device may include one or more gas inlets. In some embodiments, the air milling device may include one or more gas outlets. In some embodiments, the gas outlet may include an air plenum to assist in gas flow control. In some embodiments, the air plenum includes a high-cross-sectional chamber that generates a low-velocity gas flow. In some embodiments, the air plenum creates a pressure drop within the high-cross-sectional chamber. In some embodiments, the gas outlet may further include a gas nozzle. In some embodiments, the gas nozzle is a sonic or supersonic gas nozzle having a converging flow of gas at or above the speed of sound. In some embodiments, the nozzle may provide a spiral flow profile of the gas to increase particle-to-particle collisions and generate a uniform velocity profile. In some embodiments, the nozzle may provide a non-spiral (e.g., straight) flow profile of the gas to generate a non-uniform velocity profile. In some embodiments, the gas inlet may include a gas valve to allow and prevent gas from flowing into the air milling chamber. In some embodiments, the air milling device may include a gas flow controller. In some embodiments, the dispersion nozzle may be separated from the air milling device. In some embodiments, the air milling chamber includes a chamber outlet that controls the gas entering the pressurized insert.

[0036] FIG. 4 is a schematic flowchart of an air milling device and a mixing device for processing electrode film mixtures. As illustrated in FIG. 4, the flow process (400) includes a material dispenser (410) that provides material to be supplied to an air milling device (420). The air milling device (420) includes a hopper (425), an inlet valve (430), and a pressurized insert (435). The material flows through the air milling device (420) to a mixing device (440). The flow process (400) further includes a pressurized tank (450) in fluid communication with a pressure regulating valve (460). The pressurized tank (450) provides a gas stream (455) to the pressure regulating valve (460). The pressure regulating valve (460) is in fluid communication with an air processing element (470). The air processing element (470) is configured to control the flow rate, temperature, and pressure of the gas flowing from the pressurized tank (450). The air processing element (470) has additional fluid communication with the air milling device (420), the pressurized insert (435), and the mixing device (440), respectively.

[0037] In some embodiments, the flow process may include one or more pressurized tanks. In some embodiments, the pressurized tank contains a gas selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof. In some embodiments, the flow process may include one or more air processing elements. In some embodiments, the air processing element may include a gas flow controller, a temperature controller, and / or a pressure controller. In some embodiments, the air processing element may be in fluid communication with one or more elements of the milling device. In some embodiments, the air processing element may be in fluid communication with one or more elements of the mixing device. In some embodiments, the gas stream may include pressurized cooling air and / or temperature-controlled gas. In some embodiments, the gas stream may act as a suction gas stream (e.g., gas directed from the air milling device into the mixing device) and / or a motive gas stream (e.g., gas directed into the air milling device). In some embodiments, the gas is supplied to the air milling device for the purpose of air milling the material and / or supplied to the mixing device to fluidize the material within the mixing device. In some embodiments, the gas supplied to the mixing device fluidizes the material within the mixing device together with the mixing blades.

[0038] Air Milling and Mixing Method

[0039] The described method may be utilized in the related systems and devices described throughout. FIG. 5 is a flowchart showing a method (500) for processing an electrode film mixture including air milling. As shown in FIG. 5, in step 510, a material is air milled to form an air-milled material. In step 520, the air-milled material is dispersed into a mixer (e.g., a mixing chamber), and in step 530, the air-milled material is mixed with an active material within the mixer (e.g., a mixing chamber) to form an electrode film mixture in step 540.

[0040] In some embodiments, the electrode film mixture processing may include gravity feeding the air-milled material into a mixing chamber. In some embodiments, the electrode film mixture processing may include pneumatically feeding the air-milled material into a mixing chamber. In some embodiments, the air-milled material may be pneumatically fed into one or more mixing chambers.

[0041] In some embodiments, the material may be pretreated prior to air milling. In some embodiments, the pretreatment may include a cooling process to increase the brittleness of the material and / or a heating process to melt or soften the material. In some embodiments, the pretreatment may include pre-mixing the material with other solid or liquid additives that can make it easier to mill and disperse the material. In some embodiments, the pretreatment may include coating the active material with a carbon material prior to dispersion or mixing.

[0042] In some embodiments, the pretreatment is at -200°C, -150°C, -100°C, -50°C, -25°C, -10°C, -5°C, 0°C, 10°C, 15°C, 20°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, 120°C, 140°C, 160°C, 180°C, 200°C, 220°C, 240°C, 260°C, 280°C, 300°C, 320°C, 340°C, It may be operated at a pretreatment temperature of 360°C, 380°C, or 400°C, or any value in between, approximately that value, maximum that value, or maximum approximately that value. In some embodiments, pretreatment may involve temperature-controlled treatment of the material to a temperature of approximately -200 to 300°C. In some embodiments, the material is melted without the use of a solvent to achieve a small particle size. In some embodiments, a lower pretreatment temperature (e.g., less than approximately 5°C) may form a more brittle material compared to a higher pretreatment temperature. In some embodiments, a lower pretreatment temperature may form a binder material with a low tendency to fiberize, thereby reducing the particle size of the material.

[0043] In some embodiments, mixing of the air-milled material and the active material within the mixing chamber may be performed at a mixing temperature that is 15°C, 16°C, 17°C, 18°C, 19°C, 20°C, 21°C, 22°C, 23°C, 24°C, 25°C, 26°C, 27°C, 28°C, 29°C, or 30°C, or any value in between, approximately that value, maximum that value, or maximum approximately that value.

[0044] In some embodiments, air milling may be performed at a gauge pressure that is 0 atm, 0.1 atm, 0.2 atm, 0.3 atm, 0.4 atm, 0.5 atm, 0.6 atm, 0.7 atm, 0.8 atm, 0.9 atm, 1 atm, 2 atm, 3 atm, 4 atm, or 5 atm, or any value in between, approximately that value, maximum that value, or maximum approximately that value.

[0045] In some embodiments, air milling is a range of -200°C, -150°C, -100°C, -50°C, -25°C, -10°C, -5°C, 0°C, 1°C, 2°C, 3°C, 4°C, 5°C, 6°C, 7°C, 8°C, 9°C, 10°C, 11°C, 12°C, 13°C, 14°C, 15°C, 16°C, 17°C, 18°C, 19°C, 20°C, 21°C, 22°C, 23°C, 24°C, 25°C, 26°C, 27°C, 28°C, 29°C, or 30°C, or any value in between, approximately that value, or at most that value, It may include applying a temperature-controlled gas to the material at a temperature that is approximately the maximum value. In some embodiments, air milling is 0 m / s, 5 m / s, 10 m / s, 15 m / s, 20 m / s, 25 m / s, 30 m / s, 35 m / s, 40 m / s, 45 m / s, 50 m / s, 55 m / s, 60 m / s, 65 m / s, 70 m / s, 75 m / s, 80 m / s, 85 m / s, 90 m / s, 95 m / s, 100 m / s, 110 m / s, 120 m / s, 130 m / s, 140 m / s, 150 m / s, 160 m / s, 170 m / s, 180 m / s, 190 m / s, 200 m / s, 210 m / s, 220 m / s, 230 m / s, 240 m / s, 250 m / s, 260 m / s, 270 m / s, 280 m / s, 290 m / s, 300 m / s, 310 m / s, 320 m / s, 330 m / s, 340 m / s, 350 m / s, 360 m / s, 370 m / s, 380 m / s, 390 m / s, 400 m / s, 410 m / s, 420 m / s, 430 m / s, 440 m / s, 450 m / s, 460 m / s, 470 m / s, 480 m / s, 490 m / s, or 500 m / s, or a range of any value in between, or approximately that value, or at least that It may include applying a temperature-controlled gas to the material that provides a speed of value or at least approximately that value.In some embodiments, the temperature-controlled gas may include a gas selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof.

[0046] In some embodiments, the material has a size of 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm. μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm, 390 μm, 400 μm, 410 μm, 420 μm, 430 μm, 440 μm, 450 μm, 460 μm, 470 μm, 480 μm, 490 μm, or 500 μm, or a range of any value in between, or approximately D of that value 50 It may include an average particle size distribution. In some embodiments, the air-milled material is 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, or 60 μm, or a range of any value in between, or approximately D of that value. 50 It may include an average particle size distribution. In some embodiments, the air-milled material has a D of less than about 30 μm. 50 It includes the average particle size distribution.

[0047] In some embodiments, the material is a binder material. In some embodiments, the air-milled material is an air-milled binder material. In some embodiments, the binder material (e.g., binder, fiberizable binder, fiberized binder) has a D between 40 μm and 500 μm. 50It includes the average particle size distribution. In some embodiments, the binder material has a size of 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm, 390 μm, 400 μm, 410 μm, 420 μm, 430 μm, 440 μm, 450 μm, 460 μm, 470 μm, 480 μm, 490 μm, or 500 μm, or a range of any value in between, or approximately D of that value 50 It may include an average particle size distribution. In some embodiments, the air-milled binder material (e.g., air-milled binder, air-milled fiberizable binder, air-milled fiberizing binder) is a range of values ​​of 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, or 60 μm, or any value in between, or approximately D of that value. 50 It may include an average particle size distribution. In some embodiments, the air-milled binder material has a D of less than about 30 μm. 50 It includes the average particle size distribution.

[0048] In some embodiments, the components and / or particle size of the electrode film mixture may be reduced using air milling and / or high-shear equipment and processes. In some embodiments, the components and / or particle size of the electrode film mixture may be reduced using air milling and / or non-destructive (e.g., low-shear) equipment and processes. High-shear or low-shear forces may be provided to separate the material from aggregating into finely divided particles and / or to fiberize the material so that the material can coat other electrode film components. In some embodiments, the resulting processed electrode film mixture (e.g., powder) may be compressed with heat and pressure using a roll mill to form a film, for example, by the material cohering and adhering to other components of the film within a fiberized matrix.

[0049] In some embodiments, the electrode film mixture may be formed by mixing components of a composite material (e.g., carbon additive and active material; carbon additive, active material and binder; or carbon additive, carbon active material and binder) with or without a liquid. In some embodiments, the binder or binder material may include an air-milled binder, an air-milled fiberizable binder, or an air-milled fiberizing binder. In some embodiments, the liquid may include an aqueous solvent and / or an organic solvent. In some embodiments, the liquid may include water. In some embodiments, the components of the electrode film mixture (e.g., carbon additive, active material, binder and liquid) may be substantially homogeneously mixed and / or distributed within the mixture. In some embodiments, the electrode film material mixture may be substantially free of solvent residues.

[0050] In some embodiments, the carbon additive can be released from aggregation on the surface of the active particle and uniformly coated. In some embodiments, uniformly coating the surface of the active particle with the carbon additive can improve the electrical conductivity of the electrode, increase the surface energy attraction between the carbon additive and the binder, and improve the packing density of the carbon additive particles.

[0051] In some embodiments, the electrode film mixture may be formed by mixing a mixture comprising a carbon additive and a binder with a carbon active material. In some embodiments, the binder material or the binder may essentially consist of a single binder. In some embodiments, the binder material may be selected from the group consisting of polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), copolymers thereof, and combinations thereof. In some embodiments, the conductive additive is activated carbon. In some embodiments, the mixture may include an additional silicon active material. In some embodiments, the mixture may contain carbon additives in a range of values ​​between 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1.0 wt%, 1.1 wt%, 1.2 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%, 3.5 wt%, or 4 wt%, for example, about 0.1 wt% to about 4 wt%, where wt% is based on the weight of the mixture.

[0052] In some embodiments, the mixture may contain a binder in a range of values ​​between 0.5 wt%, 1 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%, 3.5 wt%, 4 wt%, 4.5 wt%, 4.9 wt%, 5 wt%, 5.5 wt%, 6 wt%, 6.5 wt%, 7 wt%, 7.5 wt%, 8 wt%, 8.5 wt%, 9 wt%, 9.5 wt%, or 10 wt%, for example, about 0.5 wt% to about 10 wt%, where wt% is based on the weight of the mixture.

[0053] In some embodiments, the electrode film mixture may be formed by mixing a mixture (e.g., the mixture may include a carbon additive, a binder, and a carbon active material) using a mixing device for a certain period of time. In some embodiments, the mixing time in the mixing chamber may be 200 seconds, 250 seconds, 300 seconds, 350 seconds, 365 seconds, 400 seconds, 450 seconds, 500 seconds, 550 seconds, or 600 seconds, or any value in between, for example, about 200 seconds to about 600 seconds or about that value. In some embodiments, mixing in the mixing chamber may be performed one or more times, two, three, four, five, six times, or as many times as necessary. In some embodiments, the mixing speed in the mixing chamber may be 500 rpm, 600 rpm, 700 rpm, 750 rpm, 800 rpm, 850 rpm, 900 rpm, 1000 rpm, 1100 rpm, 1200 rpm, 1300 rpm, 1400 rpm, or 1500 rpm, or any value in between, for example, about 500 rpm to about 1500 rpm or about that value. In some embodiments, the mixing blade in the mixing chamber may have a tip speed of about 10 meters / min to about 40 meters / min.

[0054] In some embodiments, after the electrode film mixture is formed, the electrode film mixture may be further diluted. In some embodiments, diluting the electrode film mixture may include diluting the electrode film mixture to achieve a solid content of 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, or 60 wt%, or any value in between, for example, about 20 wt% to about 60 wt%, where wt% is based on the weight of the electrode film mixture. In some embodiments, diluting the electrode film mixture may include diluting the electrode film mixture to achieve a viscosity of 500 cp, 450 cp, 400 cp, 350 cp, 300 cp, 250 cp, 200 cp, 150 cp, or 100 cp, or any value in between, for example, about 100 cp to about 500 cp, about that viscosity, less than that viscosity, or about less than that viscosity. In some embodiments, dilution may be achieved using a mixing device.

[0055] Electrode film material and electrode film

[0056] Electrode film mixtures and electrode films formed using materials and / or air-milled materials are described herein. In some embodiments, the components of the active layer or electrode film may include particles such as composite materials. The particles for forming the active layer or electrode film may be combined with the materials and / or air-milled materials to provide an electrode film mixture. In some embodiments, the active layer or electrode film may be formed from the electrode film mixture, such that the weight percentage of the components of the active layer or electrode film and the weight percentage of the components of the electrode film mixture are substantially the same.

[0057] Active materials (e.g., positive active materials, negative active materials) can be used in the manufacture of electrode films and / or electrodes for energy storage devices.

[0058] In some embodiments, the active material is a positive electrode active material. In some embodiments, the positive electrode active material is selected from at least one of a metal oxide, a metal sulfide, a sulfur-carbon complex, a lithium metal oxide, and a material containing sulfur. In some embodiments, the positive electrode active material is a lithium iron phosphate (i.e., LiFePO4 or “LFP”), a lithium manganese iron phosphate (e.g., LiMn 0.6 Fe 0.4 PO4 or “LMFP”), lithium nickel manganese cobalt oxide (i.e., LiNi x Mn y Co 1-x-y O2 or “NMC”), lithium nickel cobalt aluminum oxide (i.e., LiNi x Co y Al z O2 or “NCA”), lithium manganese oxide (“LMO”), lithium nickel manganese oxide (“LNMO”), lithium cobalt oxide (“LCO”), lithium titanate (“LTO”), or a combination thereof is selected. In some embodiments, the cathode active material comprises at least two of LFP, LMFP, NMC, NCA, LMO, LNMO, LCO, LTO, and combinations thereof. In some embodiments, the cathode active material is an iron phosphate-based active material. In some embodiments, the iron phosphate-based active material is LiFePO4 (i.e., “lithium iron phosphate” and “LFP”) and LiMn 1-x Fe x PO4 (i.e., “lithium manganese iron phosphate” and “LMFP”) (e.g., LiMn 0.6 Fe 0.4 PO4 or LiMn 0.8 Fe 0.2It includes PO4). In some embodiments, the iron phosphate-based active material includes LFP. In some embodiments, the iron phosphate-based active material includes LMFP. In some embodiments, the iron phosphate-based active material includes LFP and / or LMFP.

[0059] In some embodiments, the active material is a cathode active material. In some embodiments, the cathode active material may include, for example, an insertion material (carbon, graphite and / or graphene, etc.), an alloying / dealloying material (silicon, silicon oxide, tin and / or tin oxide, etc.), a metal alloy or compound (Si-Al and / or Si-Sn, etc.), and / or a conversion material (manganese oxide, molybdenum oxide, nickel oxide and / or copper oxide, etc.). The cathode active material may be used alone or mixed together to form multi-phase materials (Si-C, Sn-C, SiOx-C, SnOx-C, Si-Sn, Si-SiOx, Sn-SnOx, Si-SiOx-C, Sn-SnOx-C, Si-Sn-C, SiOx-SnOx-C, Si-SiOx-Sn, or Sn-SiOx-SnOx, etc.). The cathode active material includes ordinary natural graphite, synthetic or artificial graphite, surface-modified graphite, spherical graphite, plate-like graphite, and mixtures or combinations of these types of graphite, metal elements and their compounds, as well as metal-C complexes for the cathode.

[0060] In some embodiments, the electrode film mixture and / or electrode film comprises an active material in an amount of 70 wt%, 75 wt%, 80 wt%, 85 wt%, 86 wt%, 87 wt%, 88 wt%, 89 wt%, 90 wt%, 91 wt%, 92 wt%, 93 wt%, 94 wt%, 95 wt%, 96 wt%, 97 wt%, 98 wt%, 98.5 wt%, 99 wt%, 99.5 wt%, 99.8 wt%, or 99.9 wt%, or any value in between, about that value, at least that value, or at least about that value.

[0061] In some embodiments, the electrode film mixture and / or the electrode film comprises a carbon material configured to reversibly intercalate lithium ions. In some embodiments, the lithium intercalation carbon is selected from graphitic carbon, graphite, hard carbon, soft carbon, and combinations thereof. For example, the electrode film mixture and / or the electrode film of the electrode may comprise a binder material, one or more of graphitic carbon, graphite, graphene-containing carbon, hard carbon, and soft carbon, and an electrical conductivity promoting material. In some embodiments, the electrode is mixed with lithium metal and / or lithium ions. In some embodiments, the electrode comprises the carbon material in a total amount of 20 wt%, 15 wt%, 10 wt%, 9 wt%, 8 wt%, 7 wt%, 6 wt%, 5 wt%, 4 wt%, 3 wt%, 2 wt%, 1 wt%, or any value in between, approximately that value, maximum that value, or maximum approximately that value.

[0062] In some embodiments, the electrode film mixture and / or electrode film comprises a conductive additive. In some embodiments, the conductive additive may comprise a conductive carbon additive such as carbon black. In some embodiments, the conductive additive may comprise a conductive carbon additive. In some embodiments, the conductive carbon additive comprises carbon black, carbon nanotubes, e.g., single-walled carbon nanotubes (SWCNT) and multi-walled carbon nanotubes (MWCNT). In some embodiments, the electrode film mixture and / or electrode film comprises the conductive additive in a total amount of 10 wt%, 9 wt%, 8 wt%, 7 wt%, 6 wt%, 5 wt%, 4 wt%, 3 wt%, 2 wt%, 1 wt%, 0.5 wt%, 0.25 wt%, 0.1 wt%, or any value in between, approximately that value, maximum that value, or maximum approximately that value. In some embodiments, each conductive additive is present in an amount of 10 wt%, 9 wt%, 8 wt%, 7 wt%, 6 wt%, 5 wt%, 4 wt%, 3 wt%, 2 wt%, 1 wt%, 0.5 wt%, 0.25 wt%, 0.1 wt%, or any value in between in the electrode film mixture and / or electrode film, approximately that value, maximum that value, or maximum approximately that value. In some embodiments, the conductive additive is carbon black.

[0063] In some embodiments, the electrode film mixture and / or electrode film comprises a binder or binder material. In some embodiments, the binder may comprise polytetrafluoroethylene (PTFE), a polyolefin, polyalkylenes, polyethers, styrene-butadiene, co-polymers of polysiloxanes and polysiloxane, branched polyethers, polyvinylethers, a carboxymethylcellulose (CMC), copolymers thereof, and / or combinations thereof. In some embodiments, the polyolefin is polyethylene (PE), polypropylene (PP), polyvinylidene fluoride (PVDF), co-polymers thereof, and / or combinations thereof. For example, the binder can include polyvinylene chloride, poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), poly(ethylene oxide) (PEO), poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), polydimethylsiloxane (PDMS), polydimethylsiloxane-coalkylmethylsiloxane, copolymers thereof, and / or combinations thereof. In some embodiments, the binder may include a thermoplastic resin. In some embodiments, the binder includes a fiberizable and / or fiberized polymer. In certain embodiments, the binder includes, is essentially composed of, or is composed of a single fiberizable and / or fiberized binder such as PTFE.In some embodiments, the electrode film mixture and / or electrode film comprises a binder in a range of values ​​of 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, or any value in between, or about that amount, or up to that amount, or up to about that amount.

[0064] In some embodiments, the electrode film may be a wet-processed electrode film. In some embodiments, the electrode film is manufactured by a wet or slurry-based electrode manufacturing process. In some embodiments, the electrode film of the present disclosure may be a dry-processed electrode film. In some embodiments, the electrode film is manufactured by a dry electrode manufacturing process. As used herein, a dry electrode manufacturing process may refer to a process in which no solvent is used at all or substantially no solvent is used to form a dry electrode film. For example, the components of the active layer or electrode film, including a carbon material and a binder, may consist of dry particles, are essentially composed of dry particles, or contain dry particles. The dry particles for forming the active layer or electrode film may be combined to provide a dry particle active layer mixture. In some embodiments, the active layer or electrode film may be formed from a dry particle active layer mixture, such that the weight percentage of the components of the active layer or electrode film and the weight percentage of the components of the dry particle active layer mixture are substantially the same. In some embodiments, the active layer or electrode film formed from a dry particle active layer mixture using a dry manufacturing process may be free of or substantially free of processing additives, such as solvents and solvent residues generated therefrom. In some embodiments, the resulting active layer or electrode film is a self-supporting film formed from a dry particle mixture using a dry process. In some embodiments, the resulting active layer or electrode film is a free-standing film formed from a dry particle mixture using a dry process. The process of forming the active layer or electrode film may include fiberizing the fiberizable binder component(s) so that the film comprises a fiberized binder. In additional embodiments, the free-standing active layer or electrode film may be formed without a current collector.In another additional embodiment, the active layer or electrode film may comprise a fibrillated polymer matrix to make the film self-supporting. It is thought that a matrix, lattice, or web of fibrils may be formed to provide a mechanical structure to the electrode film.

[0065] In some embodiments, an electrode film is disposed over a current collector to form an electrode. In some embodiments, the current collector may comprise a metallic material such as aluminum, nickel, copper, or a combination of the aforementioned. In some embodiments, the current collector comprises a pure metal. In some embodiments, the current collector comprises a metallized polymer film or a metal-coated polymer film. In some embodiments, the polymer comprises polyethylene terephthalate (PET), biaxially oriented polypropylene (BOPP), or a combination thereof. In some embodiments, the metal coating comprises aluminum. In some embodiments, coating the final electrode film mixture comprises forming a uniform electrode film mixture coating. In some embodiments, the current collector comprises a thickness of 200 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 15 μm, 10 μm, 5 μm, or any value in between, approximately that value, a maximum of that value, or a maximum of approximately that value.

[0066] Electrode and energy storage device

[0067] An energy storage system or device comprises a positive electrode (cathode), a negative electrode (anode), a separator disposed between them, and an electrolyte located within a housing. Each electrode comprises an electrode film disposed on a current collector. The electrode comprises an electrode film disposed on a current collector. In some embodiments, the current collector is a foil. In some embodiments, the current collector is an aluminum foil, a copper foil, or a combination thereof. In some embodiments, the current collector may comprise a metallic material such as a material comprising aluminum, nickel, copper, or a combination thereof. In some embodiments, the current collector comprises a pure metal. In some embodiments, the current collector comprises a metallized polymer film or a metal-coated polymer film. In some embodiments, the polymer comprises polyethylene terephthalate (PET), biaxially oriented polypropylene (BOPP), or a combination thereof. In some embodiments, the metal coating comprises aluminum. In some embodiments, coating the final electrode film mixture comprises forming a uniform electrode film mixture coating. In some embodiments, the current collector comprises a thickness of 200 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 15 μm, 10 μm, 5 μm, or any value in between, approximately that value, maximum that value, or maximum approximately that value. In some embodiments, the active layer is disposed on each side of the current collector.

[0068] In some embodiments, the electrode is a double-sided electrode. In some embodiments, the double-sided electrode comprises two electrode films. In some embodiments, the double-sided electrode may comprise a current collector, an upper electrode film, and a lower electrode film. In some embodiments, each of the two electrode films may have any suitable shape, size, and thickness.

[0069] In some embodiments, the energy storage device comprises a separator, a negative electrode, an anode electrode, an electrolyte, and a housing, wherein the electrolyte, the separator, the negative electrode, and the anode electrode are disposed within the housing and the separator is positioned between the negative and anode electrodes. In some embodiments, the energy storage device is formed by placing the electrolyte, the separator, the negative electrode, and the anode electrode described herein within the housing, wherein the separator is placed between the negative electrode and the anode electrode.

[0070] The electrode assembly includes an anode, a cathode, and a separator located between the anode and the cathode. In some embodiments, the electrode assembly is a wound electrode (i.e., rolled electrode) assembly (e.g., a jelly roll). In some embodiments, the energy storage device is selected from the group consisting of a cylindrical energy storage device, a stacked prismatic energy storage device, and a spirally wound prismatic energy storage device.

[0071] Normalized circularity can be used to determine and / or correlate relatively weak core points (e.g., points that may cause electrode buckling) in wound electrode assemblies. For a non-ideal spiral, normalized circularity is defined as the minimum ratio between the non-ideal (real) geometry and the ideal geometry on a point-by-point basis according to the equation below.

[0072]

[0073] Non-ideal (real) spiral geometry is given by measured orthogonal and polar coordinates, and ideal spiral geometry is derived from the Archimedean spiral according to . The geometry of a spiral (ideal or non-ideal) can be characterized by curvature such as the polar curvature parameterization below.

[0074]

[0075] In some embodiments, the electrode assembly is 0.7, 0.705, 0.71, 0.715, 0.72, 0.725, 0.73, 0.735, 0.74, 0.745, 0.75, 0.76, 0.77, 0.78, 0.79, 0.8, 0.805, 0.81, 0.815, 0.82, 0.825, 0.83, 0.835, 0.84, 0.845, 0.85, 0.86, 0.87, 0.88, 0.89, 0.90, 0.91, 0.92, 0.93, 0.94, 0.95, 0.96, 0.97, It is a range of values ​​such as 0.98, 0.99, 1, 1.05, 1.1, 1.15, 1.2, or any value in between, or is approximately that value, or at least that value, or includes a normalized circular value of at least approximately that value.

[0076] The electrodes disclosed herein may be used in an energy storage device. In some embodiments, the energy storage device comprises a separator, a negative electrode, a positive electrode, an electrolyte, and a housing, wherein the electrolyte, the separator, the negative electrode, and the positive electrode are disposed within the housing and the separator is positioned between the negative and positive electrodes. In some embodiments, the energy storage device is formed by placing the electrolyte, the separator, the negative electrode, and the positive electrode described herein within the housing, wherein the separator is placed between the negative electrode and the positive electrode. In some embodiments, the energy storage device comprises a negative electrode positioned between two positive electrodes. In some embodiments, the negative electrode and / or positive electrode comprises a shaped electrode film. In some embodiments, the energy storage device is a lithium-ion battery. In some embodiments, the energy storage device may be a battery, a capacitor, a capacitor-battery hybrid, a fuel cell, or a combination thereof. In some embodiments, the energy storage system or energy storage device may be used for electromobility. In some embodiments, the energy storage device may be used in vehicles including hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and / or electric vehicles (EVs). In some embodiments, the energy storage device used in vehicles including hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and / or electric vehicles (EVs) reduces greenhouse gas emissions.

[0077] In some embodiments, the energy storage device is charged with a suitable lithium-containing electrolyte. For example, the energy storage device may include a lithium salt and a solvent such as a non-aqueous or organic solvent. Generally, the lithium salt contains a redox-stable anion. In some embodiments, the anion may be monovalent. In some embodiments, the lithium salt may be selected from lithium hexafluorophosphate (LiPF6), lithium bis(trifluoromethanesulfonyl)imide (LiFSI), lithium tetrafluoroborate (LiBF4), lithium perchlorate (LiClO4), lithium bis(trifluoromethansulfonyl)imide (LiN(SO2CF3)2), lithium trifluoromethansulfonate (LiSO3CF3), lithium bis(oxalato)borate (LiB(C2O4)2), lithium bis(fluorosulfonyl)imide (LiN(SO2F)2), lithium difluoro(oxalato)borate (LiC2BF2O4), and combinations thereof. In some embodiments, the electrolyte may comprise a quaternary ammonium cation and an anion selected from the group consisting of hexafluorophosphate, tetrafluoroborate, and iodide. In some embodiments, the salt concentration is about 0.1 mol / L (M) to about 5 M, about 0.2 M to about 3 M, or may be about 0.3 M to about 2 M. In additional examples, the salt concentration of the electrolyte may be about 0.7 M to about 2 M. In specific examples, the salt concentration of the electrolyte is about 0.2 M, about 0.3 M, about 0.4 M, about 0.5 M, about 0.6 M, about 0.7 M, about 0.8 M, about 0.9 M, about 1 M, about 1.1 M, about 1.2 M, 1.3 M, 1.4 M, 1.It can be 5M or a value in between.

[0078] In some embodiments, the energy storage device may include a liquid solvent. The solvent does not need to dissolve all components of the electrolyte, nor does it need to completely dissolve any component. In additional embodiments, the solvent may be an organic solvent. In some embodiments, the solvent may include one or more functional groups selected from dioxathiolan (e.g., 1,3,2-dioxathiolan-2,2-dioxide (i.e., “DTD”)), carbonates, ethers, and / or esters. In some embodiments, the solvent may include carbonates. In additional embodiments, the carbonate may be selected from cyclic carbonates, such as, for example, ethylene carbonate (EC), propylene carbonate (PC), vinyl ethylene carbonate (VEC), vinylene carbonate (VC), fluoroethylene carbonate (FEC), and combinations thereof, or acyclic carbonates, such as, for example, dimethyl carbonate (DMC), diethyl carbonate (DEC), ethyl methyl carbonate (EMC), 1,3-propene sulfone (PRS), and combinations thereof. In some embodiments, the solvent may comprise an ester. In some embodiments, the ester is selected from methyl acetate (MA), methyl propionate (MP), ethyl acetate (EA), methyl butyrate (MB), and combinations thereof. In some embodiments, the solvent may comprise EC, PC, VEC, VC, FEC, DMC, DEC, EMC, MA, MP, EA, MB, and combinations thereof. In some embodiments, the solvent may include EC, DMC, DEC, EMC, MA, and combinations thereof. In some embodiments, the solvent may include EC, DMC, EMC, and combinations thereof. In some embodiments, the solvent may include an EC:DMC:EMC ratio of 10-30:0-90:0-70.

[0079] In some embodiments, one or more solvents may be used at a concentration of 30 wt%, 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, or 90 wt%, or any value in between, or about that value, at least that value, or at least about that value. In some embodiments, the solvent is utilized as an additive to the electrolyte system and is 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, 2 wt%, 2.1 wt%, 2.2 wt%, 2.3 wt%, 2.4 wt%, 2.5 wt%, 2.6 wt%, 2.7 wt%, 2.8 wt%, 2.9 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt% or it may be used at a concentration of 10 wt%, or a range of any value in between, approximately that value, maximum that value, or maximum approximately that value. For example, in some embodiments, the amount of additive in the electrolyte is any one of the following ranges or approximately that range: 0.1-10 wt%, 1-6 wt%, 2-5 wt%, 0.1-6 wt%, 2-8 wt%, 2-3 wt%, or 1-4 wt%.

[0080] In some embodiments, the energy storage device is created such that one electrode (e.g., negative electrode) is larger and overhangs another electrode (e.g., positive electrode). One electrode may overhang the other electrode in the winding direction and / or non-winding direction of the electrode assembly. Such electrode overhangs can prevent yield losses. In some embodiments, when there is no or substantially no overlap and / or mixing of the separator and the shaped electrode film (e.g., positive electrode film), the boundary of the shaped electrode film becomes easier to identify, thereby improving the ability to form a counter electrode (e.g., negative electrode) having overhangs.

[0081] Examples

[0082] Examples of the present disclosure, including processes, materials, and / or resulting products, are described in the following examples.

[0083] Example 1 - Particle Size Analysis

[0084] Figure 6 is a data plot showing the release of aggregation of the binder material based on volume % and size, measuring particle friability. As shown in Figure 6, the PTFE binder material can be air-milled at various pressures to adjust the particle size distribution. Particle friability was measured using a particle size analyzer, and high friability indicated a change in the particle size distribution.

[0085] Figure 7 is a data plot showing the particle size distribution of air-milled binder materials and unmilled binder materials based on cumulative volume % and particle diameter. As shown in Figure 7, the air-milled binder material has improved particle size distribution uniformity, which can result in an improved cohesive electrode film structure.

[0086] Example 2 - Flow Rate and Pressure Profile

[0087] Figure 8a is a flow vector diagram showing the flow rate of binder material moving through an air milling device. Figure 8b is a schematic example diagram comparing the air flow path and the powder flow path.

[0088] Figure 9 is a data plot showing the pressure profile of air flowing from the air milling chamber to the mixing chamber. This data plot is based on Computational Fluid Dynamics (CFD). As illustrated in Figure 9, the data demonstrates the Venturi effect, indicating that as the material or gas passes through the constricted section of the air milling chamber, the fluid velocity increases and the pressure decreases. The pressure was measured along the center of the air milling chamber. Pressurized cooling air supplied to the annulus accelerated the internal gas within the air milling chamber, creating a local vacuum (e.g., negative static pressure) to help orient the material into the air milling chamber. Air milling was achieved by a combination of particle / gas friction shear, particle acceleration, and particle collisions with other material particles and the walls of the air milling chamber.

[0089] Example 3 - Mixing Profile

[0090] The particle size of the PTFE binder was modified by tuning and adjusting the pressure of the air milling device. Increased pressure resulted in finer PTFE particles (i.e., powder). Figure 10a is an Energy Dispersive Spectroscopy (EDS) image of the unmilled binder material (i.e., using pristine PTFE) under standard homogenization. Figure 10b is an EDS image of the air-milled binder material (i.e., 140 kPa milled PTFE) under homogenization for 3 minutes. As shown in Figures 10a and 10b, the fibril size was larger in the unmilled PTFE binder, as indicated by a strong fluorescent signal. Compared to the unmilled PTFE binder, the air-milled PTFE binder exhibited reduced homogenization and fibrillation mixing times. Figure 10c is a data plot showing line speed versus expected standard deviation of various air-milled binder materials and unmilled binder materials.

[0091] Figure 11a is a data plot showing the amounts (weight %) of attached and unattached fibrous binders based on sieve size. A sieve retainer pan was used to show the amount of unattached binder particles. Unattached binder particles smaller than 63 μm passed through the sieve retainer pan. As shown in Figure 11a, a large portion (weight %) of the unmilled fibrous binder particles passed through the sieve retainer pan, resulting in a smaller number of attached binders. In contrast, a large portion (weight %) of the air-milled fibrous binder particles were captured in the sieve retainer pan, resulting in a larger number of attached binder particles.

[0092] Figures 11b and 11c are scanning electron microscope (SEM) images of an unmilled binder material and an air-milled binder material on a hard anode, respectively. As shown in Figures 11b and 11c, processing the electrode film mixture using the unmilled binder material produced large fibrils with a low surface area, whereas the electrode film mixture using the air-milled binder material was reduced to smaller fibrils with more surface area and bonding ability.

[0093] Although specific embodiments of the present invention have been described, such embodiments are presented merely as examples and are not intended to limit the scope of the disclosure. In practice, the new methods and systems described herein may be implemented in various other forms. Furthermore, various omissions, substitutions, and modifications to the systems and methods described herein may be made without departing from the spirit of the disclosure. The appended claims and their equivalents are intended to encompass such forms or modifications that fall within the scope and spirit of the disclosure. Accordingly, the scope of the invention is defined only by reference to the appended claims.

[0094] Features, materials, properties, or groups described in connection with a particular embodiment, example, or illustration should be understood to be applicable to any other embodiment, example, or illustration described in this section of the specification or elsewhere, except where incompatible. All features disclosed in this specification (including the appended claims, abstract, and drawings) and / or any steps of any method or process so disclosed may be combined in any combination, except for combinations where at least some of such features and / or steps are mutually exclusive. The scope of protection is not limited to the details of the embodiments described above. The scope of protection extends to any new or any new combination of features disclosed in this specification (including the appended claims, abstract, and drawings), or any new or any new combination of steps of any method or process so disclosed.

[0095] Additionally, specific features described in this disclosure in a separate implementation context may be implemented in combination in a single implementation. Conversely, various features described in a single implementation context may be implemented individually or in any suitable sub-combination in multiple implementations. Additionally, while features may be described above as functioning as a specific combination, one or more features of the claimed combination may be excluded from the combination as applicable, and the combination may be claimed as a sub-combination or a variation of the sub-combination.

[0096] Furthermore, although operations are depicted in the drawings or described in a specific order in the specification, this does not mean that such operations must be performed in the specific order depicted or in a sequential order, or that all operations must be performed to achieve a desired result. Other operations not depicted or described may be incorporated into the exemplary methods and processes. For example, one or more additional operations may be performed before, after, simultaneously with, or in between any of the described operations. Additionally, operations may be rearranged or reordered in different implementations. Those skilled in the art will recognize that the actual steps taken in the processes depicted and / or disclosed in some embodiments may differ from those depicted in the drawings. Depending on the embodiment, some of the steps described above may be omitted, and others may be added. Furthermore, the features and attributes of the specific embodiments disclosed above may be combined in various ways to form additional embodiments, all of which fall within the scope of this disclosure. Additionally, the separation of various system components in the implementations described above should not be understood as requiring such separation in all implementations, and it should be understood that the described components and systems may generally be integrated together in a single product or packaged into multiple products. For example, any component of the energy storage system described in this specification may be provided separately or integrated together (e.g., packaged together or attached together) to form an energy storage system.

[0097] For the purposes of this disclosure, specific embodiments, advantages, and novel features are described herein. Not all of these advantages may necessarily be achieved according to any specific embodiment. Accordingly, for example, those skilled in the art will recognize that this disclosure may be embodied or practiced in a manner that achieves one or a group of advantages taught herein, without necessarily achieving other advantages that may be taught or suggested herein.

[0098] Conditional language such as “can,” “could,” “might,” or “may” is generally intended to convey that a particular embodiment includes a particular feature, element, and / or step, while another embodiment does not, unless otherwise specifically stated or otherwise understood within the context in which it is used. Accordingly, such conditional language is generally not intended to imply that a feature, element, and / or step is required in any way for one or more embodiments, or that one or more embodiments contain logic for determining whether such feature, element, and / or step should be included in or performed in any particular embodiment, regardless of user input or prompt.

[0099] Conjunctional language, such as the phrase “at least one of X, Y, and Z,” is understood in the context in which it is generally used to convey that an item, term, etc., may be X, Y, or Z, unless otherwise specifically stated. Accordingly, such conjunctional language is not generally intended to imply that a particular embodiment requires the existence of at least one of X, at least one of Y, and at least one of Z.

[0100] Language of degree as used herein, such as “approximately,” “about,” “generally,” and “substantially,” indicates a value, quantity, or characteristic that is close to a specified value, quantity, or characteristic that performs a desired function or achieves a desired result. For example, the terms “approximately,” “about,” “generally,” and “substantially” may refer to quantities that are within 10%, within 5%, within 1%, within 0.1%, and within 0.01% of a specified quantity, depending on the desired function or desired result.

[0101] The scope of the present disclosure is not intended to be limited by the specific disclosure of preferred embodiments in this section or elsewhere in this specification, but may be defined by claims presented in this section or elsewhere in this specification or to be presented in the future. The language of the claims should be interpreted broadly based on the language used in the claims and is not limited to the examples described in this specification or during the examination of the application, and such examples should be interpreted as non-exclusive.

Claims

Claim 1 A method for processing an electrode film mixture, comprising the steps of: air-milling a binder material to form an air-milled binder material by applying a temperature-controlled gas to an air-milling device; wherein the air-milling device comprises an air-milling chamber and a pressurized insert located within the air-milling chamber, and the air-milling device is attached to a mixing device comprising a mixing chamber, and the pressurized insert comprises an outlet providing fluid communication between the air-milling chamber and the mixing chamber; dispersing the air-milled binder material into a mixing chamber comprising an active material; and mixing the air-milled binder material and the active material within the mixing chamber to form an electrode film material mixture. Claim 2 A system for processing an electrode film mixture, comprising: a mixing device including a mixing chamber; and an air milling device including an air milling chamber and a pressurized insert located within the air milling chamber, wherein the air milling device is attached to the mixing device and the pressurized insert includes an outlet providing fluid communication between the air milling chamber and the mixing chamber. Claim 3 In paragraph 2, the system, wherein the discharge port includes a dispersion nozzle. Claim 4 In paragraph 2, the mixing device is a fluidized bed mixing device, in a system. Claim 5 In paragraph 2, the system, wherein the mixing chamber includes a mixing blade. Claim 6 A system according to paragraph 2, further comprising a pressurized tank in fluid communication with the air milling device. Claim 7 A method for manufacturing an electrode film mixture, comprising the steps of: air milling a material to form an air-milled material; dispersing the air-milled material into a mixing chamber containing an active material; and mixing the air-milled material and the active material in the mixing chamber to form an electrode film material mixture. Claim 8 A method according to claim 7, further comprising the step of gravity-supplying the air-milled material into the mixing chamber. Claim 9 A method according to claim 7, further comprising the step of pre-mixing the above material with a conductive additive. Claim 10 In claim 7, the method wherein mixing the air-milled material with the active material in the mixing chamber is performed by a high-shear process. Claim 11 In claim 7, the air-milled material has a D of less than about 30 μm. 50 A method including an average particle size distribution. Claim 12 In claim 7, the air milling method comprises applying a temperature-controlled gas to the material. Claim 13 In claim 12, the temperature-controlled gas comprises a gas selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof. Claim 14 In claim 7, the air milling of the material is performed at a gauge pressure between 0.1 atm and 4 atm. Claim 15 In claim 7, the mixing is performed at a temperature of at least about 20°C. Claim 16 A method according to claim 7, further comprising the step of coating the active material with a carbon material before dispersion or mixing. Claim 17 In paragraph 16, the carbon material comprises activated carbon. Claim 18 In claim 7, the method wherein the active material is selected from the group consisting of graphite, lithium nickel manganese cobalt oxide (NMC), lithium nickel cobalt aluminum oxide (NCA), and combinations thereof. Claim 19 A method according to claim 7, further comprising the step of pre-treating the material before air milling. Claim 20 In claim 19, the method comprises pretreatment including temperature control of the material to a temperature of about -200 to 300°C. Claim 21 In claim 7, the above material is a binder material, method. Claim 22 In claim 21, the method comprises a binder material comprising a dry fiberizable binder. Claim 23 The method according to claim 21, wherein the binder material is selected from the group consisting of polytetrafluoroethylene (PTFE), polyethylene (PE), polypropylene (PP), polyvinylidene fluoride (PVDF), polyvinylene chloride, poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), poly(ethylene oxide) (PEO), poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), polydimethylsiloxane (PDMS), polydimethylsiloxane-coalkylmethylsiloxane, polyalkylene, polyether, styrene-butadiene, styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), copolymers of polysiloxane and polysiloxane, branched polyether, polyvinyl ether, copolymers thereof, and combinations thereof. Claim 24 In claim 7, the electrode film material mixture is substantially free of solvent residues.

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