Substrate processing system and substrate processing method

Abstract

[Project] Provides a technology that can improve the productivity of a substrate processing system. [Solution] A substrate processing system according to one embodiment of the present disclosure has an incoming / outgoing unit for receiving and receiving a cassette that accommodates a plurality of substrates, a batch processing unit for processing a lot containing the plurality of substrates in a batch, a single-wafer processing unit for processing the substrates of the lot one by one, and an interface unit for transferring the substrates between the batch processing unit and the single-wafer processing unit. The batch processing unit has a processing tank for immersing and processing the lot and a first transfer device for transferring the lot to the processing tank. The interface unit has an immersion tank for immersing the lot and positioned outside the movement range of the first transfer device, and a second transfer device for transferring the lot between the first transfer device and the immersion tank.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing system and a substrate processing method. Background Technology

[0002] The substrate processing system described in Patent Document 1 comprises a batch processing unit and a single-wafer processing unit. The batch processing unit holds a washed semiconductor wafer in water. Multiple semiconductor wafers are placed on a single holding stand and treated with a chemical solution. The transfer unit lifts the semiconductor wafers one by one from the buffer tank and transfers them to the single-wafer processing unit. The single-wafer processing unit supports the semiconductor wafer transferred by the transfer unit so that its main surface is horizontal and dries the substrate. Prior art literature

[0003] Patent Document 1: Japanese Patent Publication No. 2021-064654 The problem to be solved

[0004] The present disclosure provides a technology that can improve the productivity of a substrate processing system. means of solving the problem

[0005] A substrate processing system according to one embodiment of the present disclosure has an input / output unit for receiving and outputting a cassette that accommodates a plurality of substrates, a batch processing unit for processing a lot containing the plurality of substrates in a batch, a single-wafer processing unit for processing the substrates of the lot one by one, and an interface unit for transferring the substrates between the batch processing unit and the single-wafer processing unit, wherein the batch processing unit has a processing tank for processing the lot by immersion and a first transfer device for transferring the lot to the processing tank, and the interface unit has an immersion tank for immersing the lot and disposed outside the movement range of the first transfer device, and a second transfer device for transferring the lot between the first transfer device and the immersion tank. Effects of the invention

[0006] According to the present disclosure, the productivity of a substrate processing system can be improved. Brief explanation of the drawing

[0007] FIG. 1 is a schematic plan view illustrating a substrate processing system according to an embodiment. FIG. 2 is a flowchart illustrating a substrate processing method according to an embodiment. FIG. 3 is a schematic perspective view illustrating the operation of the second interface section. FIG. 4 is a schematic perspective view illustrating the operation of the second interface section. FIG. 5 is a schematic perspective view illustrating the operation of the second interface section. FIG. 6 is a schematic perspective view illustrating the operation of the second interface section. FIG. 7 is a diagram illustrating the operation of the second return device. FIG. 8 is a schematic perspective view illustrating the second interface portion of the first variant example. FIG. 9 is a schematic perspective view illustrating the second interface portion of the second variant example. FIG. 10 is a schematic perspective view illustrating the second interface portion of the third variant example. FIG. 11 is a schematic perspective view illustrating the second interface portion of the fourth variant example. FIG. 12 is a schematic perspective view illustrating the second interface portion of the fifth variant example. FIG. 13 is a schematic perspective view illustrating the second interface portion of the sixth variant example. FIG. 14 is a schematic plan view illustrating a substrate processing system according to a modified example of an embodiment. Specific details for implementing the invention

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In the entire set of accompanying drawings, identical or corresponding members or parts are denoted by identical or corresponding reference numerals, and redundant descriptions are omitted.

[0009] (Substrate processing system)

[0010] Referring to FIG. 1, a substrate processing system according to an embodiment will be described. As shown in FIG. 1, the substrate processing system (1) has an incoming / outgoing unit (2), a first interface unit (3), a batch processing unit (4), a second interface unit (5), a single-wafer processing unit (6), and a control device (9).

[0011] The receiving and discharging unit (2) serves as both a receiving and discharging unit. Because of this, the substrate processing system (1) can be miniaturized. The receiving and discharging unit (2) has a load port (21), a stocker (22), a loader (23), and a cassette transport device (24).

[0012] A load port (21) is positioned on the negative side of the X-axis direction of the loading / unloading section (2). A plurality of load ports (21) are arranged along the Y-axis direction (e.g., 4). However, the number of load ports (21) is not particularly limited. A cassette (C) is placed in the load port (21). The cassette (C) accommodates a plurality of substrates (W) (e.g., 25) and is loaded and unloaded with respect to the load port (21). Inside the cassette (C), the substrates (W) are maintained horizontally and are maintained in the vertical direction at a second pitch (P2) (P2 = N × P1) which is N times the first pitch (P1). N is a natural number greater than or equal to 2, and in this embodiment, it is 2, but it may be 3 or greater.

[0013] A number of stokers (22) are arranged along the Y-axis direction at the center of the X-axis direction of the incoming / outgoing unit (2) (e.g., 4). A number of stokers (22) are arranged along the Y-axis direction adjacent to the first interface unit (3) on the positive side of the X-axis direction of the incoming / outgoing unit (2) (e.g., 2). The stokers (22) may be arranged in multiple stages in the vertical direction. The stokers (22) temporarily store a cassette (C) containing a substrate (W) before cleaning treatment, a cassette (C) with the substrate (W) removed and the interior empty, etc. Also, the number of stokers (22) is not particularly limited.

[0014] The loader (23) is adjacent to the first interface section (3) and is positioned on the positive side of the X-axis direction of the incoming / outgoing section (2). A cassette (C) is placed in the loader (23). A cover opening / closing mechanism (not shown) for opening and closing the cover of the cassette (C) is installed in the loader (23). Multiple loaders (23) may be installed. The loaders (23) may be arranged in multiple stages in the vertical direction.

[0015] The cassette conveyor (24) is, for example, a multi-joint conveyor robot. The cassette conveyor (24) conveys the cassette (C) between the load port (21), the stocker (22), and the loader (23).

[0016] The first interface unit (3) is positioned on the positive side of the X-axis direction of the input / output unit (2). The first interface unit (3) transports a substrate (W) between the input / output unit (2), the batch processing unit (4), and the single-wafer processing unit (6). The first interface unit (3) has a substrate transfer device (31), a lot forming unit (32), and a first transfer unit (33).

[0017] The substrate transfer device (31) transfers the substrate (W) between the cassette (C) placed on the loader (23), the lot forming unit (32), and the first transfer unit (33). The substrate transfer device (31) is composed of a multi-axis (e.g., 6-axis) arm robot and has a substrate holding arm (31a) at its tip. The substrate holding arm (31a) has a plurality of holding hooks (not shown) capable of holding multiple substrates (e.g., 25 sheets) of substrate (W). The substrate holding arm (31a) can assume any position and posture in three-dimensional space while holding the substrate (W) by the holding hooks.

[0018] The lot forming section (32) is positioned on the positive side in the X-axis direction of the first interface section (3). The lot forming section (32) holds a plurality of substrates (W) at a first pitch (P1) and forms a lot (L).

[0019] The first transfer unit (33) is adjacent to the single-wafer processing unit (6) and is positioned on the positive side of the Y-axis direction of the first interface unit (3). The first transfer unit (33) receives the substrate (W) from the fourth transfer device (61) and temporarily stores it until it is transferred to the receiving / export unit (2).

[0020] The batch processing unit (4) is positioned on the X-axis direction plus side of the first interface unit (3). That is, the incoming / outgoing unit (2), the first interface unit (3), and the batch processing unit (4) are positioned in this order from the X-axis direction minus side toward the X-axis direction plus side. The batch processing unit (4) processes a lot (L) containing multiple substrates (W) (e.g., 50 or 100 sheets) in the first pitch (P1) in batches. One lot (L) consists of, for example, M substrates (W) in cassettes (C). M is a natural number greater than or equal to 2. M may be the same natural number as N, or may be a natural number different from N. The batch processing unit (4) has a chemical solution tank (41), a rinse solution tank (42), a first conveying device (43), a processing mechanism (44), and a driving device (45).

[0021] The chemical tank (41) and the rinse tank (42) are arranged along the X-axis direction. For example, the chemical tank (41) and the rinse tank (42) are arranged in this order from the positive side of the X-axis direction toward the negative side of the X-axis direction. Also, the chemical tank (41) and the rinse tank (42) are collectively referred to as a treatment tank. The number of chemical tanks (41) and rinse tanks (42) is not limited to that of FIG. 1. For example, although there is only one chemical tank (41) and one rinse tank (42) in FIG. 1, there may be multiple tanks.

[0022] The chemical tank (41) stores the chemical solution in which the lot (L) is immersed. The chemical solution is, for example, an aqueous phosphoric acid solution (H3PO4). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film among the silicon oxide film and the silicon nitride film. The chemical solution is not limited to an aqueous phosphoric acid solution. For example, it may be DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixture of ammonia, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), plating solution, etc. The chemical solution may be for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited and may be multiple.

[0023] The rinse solution tank (42) stores a first rinse solution in which the lot (L) is immersed. The first rinse solution is pure water that removes the chemical solution from the substrate (W), and is, for example, DIW (deionized water).

[0024] The first conveying device (43) has a guide rail (43a) and a first conveying arm (43b). The guide rail (43a) is positioned on the negative side of the Y-axis direction relative to the processing tank. The guide rail (43a) extends along the horizontal direction (X-axis direction) from the first interface section (3) to the batch processing section (4). The first conveying arm (43b) moves along the guide rail (43a) in the horizontal direction (X-axis direction). The first conveying arm (43b) may move in the vertical direction or rotate around the vertical axis. The first conveying arm (43b) conveys a lot (L) in bulk between the first interface section (3) and the batch processing section (4).

[0025] The processing mechanism (44) receives and holds a lot (L) from the first return arm (43b). The processing mechanism (44) holds a plurality of substrates (W) in the Y-axis direction at a first pitch (P1) and holds each of the plurality of substrates (W) vertically.

[0026] The driving device (45) moves the processing mechanism (44) in the X-axis direction and the Z-axis direction. The processing mechanism (44) immerses the lot (L) in the chemical solution stored in the chemical solution tank (41), then immerses the lot (L) in the first rinse solution stored in the rinse solution tank (42), and then transfers the lot (L) to the first conveying device (43).

[0027] In this embodiment, the number of units of the processing mechanism (44) and the driving device (45) is one, but it may be multiple. In the latter case, one unit immerses the lot (L) in the chemical solution stored in the chemical solution tank (41), and a separate unit immerses the lot (L) in the first rinse solution stored in the rinse solution tank (42). In this case, the driving device (45) moves the processing mechanism (44) in the Z-axis direction, and does not need to move the processing mechanism (44) in the X-axis direction.

[0028] The second interface unit (5) is positioned on the positive side of the Y-axis direction of the batch processing unit (4). The second interface unit (5) transports the substrate (W) between the batch processing unit (4) and the single-wafer processing unit (6). The second interface unit (5) has an immersion tank (51), a second transport device (52), a third transport device (53), and a second transfer unit (54).

[0029] The immersion tank (51) is positioned outside the range of movement of the first return arm (43b). For example, the immersion tank (51) is positioned offset in the positive direction of the Y-axis relative to the processing tank. The immersion tank (51) stores a second rinse solution in which the lot (L) is immersed. The second rinse solution is, for example, DIW (deionized water). The substrate (W) is maintained in the second rinse solution until it is pulled up from the second rinse solution by the third return device (53). Since the substrate (W) is located below the liquid level of the second rinse solution, the surface tension of the second rinse solution does not act on the substrate (W), thereby preventing the collapse of the uneven pattern of the substrate (W). The immersion tank (51) may be configured to be movable in the X-axis direction. In this case, when immersing a lot (L) in the immersion tank (51), the positional misalignment in the X-axis direction between the immersion tank (51) and the lot (L) can be corrected. An X-axis driving device (not shown) that moves the immersion tank (51) in the X-axis direction is attached, for example, to the lower surface of the immersion tank (51).

[0030] The second conveying device (52) has a Y-axis drive device (52a), a Z-axis drive device (52b), and a second conveying arm (52c).

[0031] The Y-axis drive unit (52a) is positioned on the X-axis direction plus side of the second interface unit (5). The Y-axis drive unit (52a) extends along the horizontal direction (Y-axis direction) from the second interface unit (5) to the placement processing unit (4). The Y-axis drive unit (52a) moves the Z-axis drive unit (52b) and the second return arm (52c) in the Y-axis direction. The Y-axis drive unit (52a) may include a ball screw. The Y-axis drive unit (52a) is an example of a horizontal drive unit.

[0032] The Z-axis drive unit (52b) is movably attached to the Y-axis drive unit (52a). The Z-axis drive unit (52b) moves the second return arm (52c) in the Z-axis direction. The Z-axis drive unit (52b) may include a ball screw. The Z-axis drive unit (52b) is an example of a vertical drive unit.

[0033] The second return arm (52c) is movably attached to the Z-axis drive device (52b). The second return arm (52c) receives and holds a lot (L) from the first return arm (43b). The second return arm (52c) holds a plurality of substrates (W) in the Y-axis direction at a first pitch (P1) and holds each of the plurality of substrates (W) in the vertical direction. The second return arm (52c) moves in the Y-axis direction and the Z-axis direction by means of the Y-axis drive device (52a) and the Z-axis drive device (52b). The second return arm (52c) is movably configured to have a plurality of positions including a transfer position (A1), an immersion position (A2), and a standby position (A3) as shown in FIG. 7. The second return arm (52c) may be configured to be movable in the X-axis direction. In this case, when immersing the lot (L) in the immersion tank (51), the positional misalignment in the X-axis direction between the immersion tank (51) and the lot (L) can be corrected. An X-axis drive device (not shown) that moves the second return arm (52c) in the X-axis direction is movably attached to, for example, a Z-axis drive device (52b). In this case, the second return arm (52c) is movably attached to the X-axis drive device.

[0034] The transfer position (A1) is a position for transferring a lot (L) between the first transfer arm (43b) and the second transfer arm (52c). The transfer position (A1) is a position on the negative side in the Y-axis direction and on the positive side in the Z-axis direction.

[0035] The immersion position (A2) is the position where the lot (L) is immersed in the immersion tank (51). The immersion position (A2) is the position that is positive in the Y-axis direction and negative in the Z-axis direction compared to the transfer position (A1).

[0036] The standby position (A3) is a position where the second conveying arm (52c) waits when the transfer of lot (L) and the immersion of lot (L) into the immersion tank (51) are not performed. The standby position (A3) is located directly below the transfer position (A1) (negative side in the Z-axis direction) and is a position that does not hinder the movement of the first conveying arm (43b). In this case, the throughput is improved because the second conveying arm (52c) can move to the transfer position (A1) only by moving upward (positive side in the Z-axis direction). The standby position (A3) may be the same position as the immersion position (A2). In this case, it is possible to prevent particles that may be generated as the first conveying device (43) operates from adhering to the second conveying arm (52c). The standby position (A3) may be located directly above the immersion position (A2) (positive side in the Z-axis direction). In this way, by setting the standby position (A3) to a position different from the transfer position (A1), contact between the first return arm (43b) and the second return arm (52c) can be prevented.

[0037] This second return device (52) moves the second return arm (52c) to the immersion position (A2) or standby position (A3) while the first return device (43) is in operation. By doing so, contact between the first return arm (43b) and the second return arm (52c) can be prevented.

[0038] The third conveying device (53) is composed of a multi-axis (e.g., 6-axis) arm robot and has a third conveying arm (53a) at its tip. The third conveying arm (53a) has a holding hook (not shown) capable of holding one substrate (W). The third conveying arm (53a) can assume any position and orientation in three-dimensional space while holding the substrate (W) by the holding hook. The third conveying device (53) conveys the substrate (W) between the second conveying arm (52c) at the immersion position (A2) and the second conveying unit (54). At this time, since the immersion tank (51) is positioned outside the movement range of the first conveying arm (43b), the first conveying arm (43b) and the third conveying arm (53a) do not interfere with each other. By this, one of the first conveying device (43) and the third conveying device (53) can be operated independently regardless of the operating state of the other. Because of this, the first conveying device (43) and the third conveying device (53) can be operated at any timing, thereby reducing the time required for conveying the substrate (W). As a result, the productivity of the substrate processing system (1) is improved.

[0039] The second transfer unit (54) is adjacent to the single-wafer processing unit (6) and is positioned on the negative side of the X-axis direction of the second interface unit (5). The second transfer unit (54) receives the substrate (W) from the third conveying device (53) and temporarily stores it until it is transferred to the single-wafer processing unit (6). That is, the substrate (W) extracted from the immersion tank (51) is placed on the second transfer unit (54). It is preferable that the substrate (W) placed on the second transfer unit (54) has, for example, a surface wet with the second rinse liquid. In this case, the surface tension of the second rinse liquid does not act on the substrate (W), thereby suppressing the collapse of the uneven pattern of the substrate (W). Multiple substrates (e.g., two) are placed on the second transfer unit (54).

[0040] The single-wafer processing unit (6) is positioned on the negative side in the X-axis direction of the second interface unit (5) and on the positive side in the Y-axis direction of the incoming / outgoing unit (2), the first interface unit (3), and the batch processing unit (4). The single-wafer processing unit (6) processes substrates (W) one by one. The single-wafer processing unit (6) has a fourth conveying device (61), a liquid processing device (62), and a drying device (63).

[0041] The fourth conveying device (61) has a guide rail (61a) and a fourth conveying arm (61b). The guide rail (61a) is positioned on the negative side of the Y-axis direction of the single-wafer processing unit (6). The guide rail (61a) extends along the horizontal direction (X-axis direction) in the single-wafer processing unit (6). The fourth conveying arm (61b) moves along the guide rail (61a) in the horizontal direction (X-axis direction) and the vertical direction, and rotates around the vertical axis. The fourth conveying arm (61b) conveys the substrate (W) between the second conveying unit (54), the liquid processing unit (62), the drying unit (63), and the first conveying unit (33). The number of the fourth return arms (61b) may be one or multiple, and in the latter case, the fourth return device (61) returns multiple substrates (W) (e.g., 5 sheets) in bulk.

[0042] The liquid treatment device (62) is positioned on the X-axis direction plus side and the Y-axis direction plus side of the single-wafer processing unit (6). The liquid treatment device (62) is single-wafer type and processes substrates (W) one by one with the treatment liquid. The liquid treatment device (62) is arranged in multiple stages (e.g., three stages) in the vertical direction (Z-axis direction). By doing so, multiple substrates (W) can be processed simultaneously with the treatment liquid. The treatment liquid may be multiple, and may be, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, an alcohol such as IPA (isopropyl alcohol).

[0043] The drying device (63) is positioned adjacent to the negative side in the X-axis direction relative to the liquid processing device (62). In this case, the end surface on the positive side in the Y-axis direction of the single-wafer processing unit (6) can be positioned such that there is no step difference or almost no step difference with the end surface on the positive side in the Y-axis direction of the second interface unit (5). Because of this, almost no dead space is created, so the footprint of the substrate processing system (1) can be made small. In contrast, if the drying device (63) is positioned adjacent to the positive side in the Y-axis direction relative to the liquid processing device (62), the end surface on the positive side in the Y-axis direction of the single-wafer processing unit (6) protrudes beyond the end surface on the positive side in the Y-axis direction of the second interface unit (5), and dead space may be created. The drying device (63) is single-wafer type and dries the substrate (W) one by one with a supercritical fluid. The drying device (63) is arranged in multiple stages (e.g., three stages) in the vertical direction. By doing so, multiple substrates (W) can be dried simultaneously.

[0044] The liquid treatment device (62) and the drying device (63) do not necessarily have to be single-wafer type, and the liquid treatment device (62) may be single-wafer type and the drying device (63) may be batch type. The drying device (63) may dry multiple substrates (W) in batches using a supercritical fluid. The number of substrates (W) processed in batches by the drying device (63) may be greater than or equal to the number of substrates (W) processed in batches by the liquid treatment device (62), but may be less. Devices other than the liquid treatment device (62) and the drying device (63) may be placed in the single-wafer processing section (6).

[0045] The control device (9) is, for example, a computer and is equipped with a CPU (Central Processing Unit) (91) and a recording medium (92), such as memory. A program for controlling various processes executed in the substrate processing system (1) is stored in the recording medium (92). The control device (9) controls the operation of the substrate processing system (1) by executing the program stored in the recording medium (92) on the CPU (91). The control device (9) is equipped with an input interface (93) and an output interface (94). The control device (9) receives a signal from the outside through the input interface (93) and transmits a signal to the outside through the output interface (94).

[0046] The above program is stored, for example, on a computer-readable recording medium and installed from the recording medium to the recording medium (92) of the control device (9). Examples of computer-readable recording media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), a memory card, etc. Additionally, the program may be downloaded from a server via the Internet and installed to the recording medium (92) of the control device (9).

[0047] In this substrate processing system, the substrate (W) is returned from the receiving / exporting unit (2) in the order of the first interface unit (3), the batch processing unit (4), the second interface unit (5), and the single-wafer processing unit (6), and then returned to the receiving / exporting unit (2).

[0048] (Operation of the substrate processing system)

[0049] With reference to FIG. 2, the operation of a substrate processing system (1) according to an embodiment, that is, a substrate processing method, will be described. The processing shown in FIG. 2 is carried out under the control of a control device (9).

[0050] First, the cassette (C) is brought into the receiving / exporting section (2) with a plurality of substrates (W) contained therein and placed in the load port (21). Inside the cassette (C), the substrates (W) are maintained horizontally and in the vertical direction at a second pitch (P2) (P2=N×P1). N is a natural number greater than or equal to 2, and in this embodiment it is 2, but it may be 3 or greater.

[0051] Next, the cassette return device (24) returns the cassette (C) from the load port (21) to the loader (23). The cover of the cassette (C) returned to the loader (23) is opened by a cover opening / closing mechanism.

[0052] Next, the substrate transfer device (31) receives the substrate (W) contained in the cassette (C) (S101 in FIG. 2) and returns it to the lot forming unit (32).

[0053] Next, the lot forming unit (32) holds a plurality of substrates (W) at a first pitch (P1) (P1=P2 / N) and forms a lot (L) (S102 in FIG. 2). One lot (L) consists of, for example, M substrates (W) of cassettes (C). Since the pitch of the substrates (W) narrows from the second pitch (P2) to the first pitch (P1), the number of substrates (W) processed in batches can be increased.

[0054] Next, the first return device (43) receives the lot (L) from the lot forming unit (32) and returns it to the processing mechanism (44).

[0055] Next, the treatment mechanism (44) descends from the upper side of the chemical solution tank (41) and immerses the lot (L) in the chemical solution to perform chemical solution treatment (S103 in FIG. 2). After that, the treatment mechanism (44) rises to pull the lot (L) up from the chemical solution and then moves horizontally (negative side in the X-axis direction) toward the upper side of the rinse solution tank (42).

[0056] Next, the processing mechanism (44) descends from the upper side of the rinse liquid tank (42) and immerses the lot (L) in the first rinse liquid to perform rinse liquid treatment (S103 in FIG. 2). After that, the processing mechanism (44) rises to pull the lot (L) up from the first rinse liquid. Subsequently, the first conveying device (43) receives the lot (L) from the processing mechanism (44) and transfers it to the second conveying device (52).

[0057] Next, the second return arm (52c) of the second return device (52) moves in a horizontal direction (positive side of the Y-axis direction) and descends from the upper side of the immersion tank (51) to immerse the lot (L) in the second rinse liquid (S104 of FIG. 2). A plurality of substrates (W) of the lot (L) are maintained in the second rinse liquid until they are pulled up from the second rinse liquid by the third return device (53). Since the substrate (W) is located below the liquid level of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate (W), thereby preventing the collapse of the uneven pattern of the substrate (W).

[0058] Next, the third conveying device (53) conveys the substrate (W) of the lot (L) held by the second conveying arm (52c) in the second rinse liquid to the second conveying unit (54). The third conveying device (53) conveys the substrate (W) one by one to the second conveying unit (54).

[0059] Next, the fourth return device (61) receives the substrate (W) from the second transfer unit (54) and returns it to the liquid treatment device (62).

[0060] Next, the liquid treatment device (62) treats the substrate (W) with liquid one by one (S105 in FIG. 2). The liquid may be multiple, and may be, for example, pure water such as DIW and a dry liquid having a lower surface tension than pure water. The dry liquid may be, for example, an alcohol such as IPA. The liquid treatment device (62) supplies pure water and the dry liquid in this order to the upper surface of the substrate (W) to form a liquid film of the dry liquid.

[0061] Next, the fourth conveying device (61) receives the substrate (W) from the liquid treatment device (62) and holds the substrate (W) horizontally with the liquid film of the drying liquid facing upward. The fourth conveying device (61) conveys the substrate (W) from the liquid treatment device (62) to the drying device (63).

[0062] Next, a drying device (63) dries the substrate (W) one by one with a supercritical fluid (S105 in FIG. 2). The drying liquid can be replaced with a supercritical fluid, and the collapse of the uneven pattern of the substrate (W) due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure vessel, the process is performed by single-wafer processing rather than batch processing in order to miniaturize the pressure vessel.

[0063] Additionally, the drying device (63) is of the single-wafer type in this embodiment, but may be of the batch type as described above. The batch type drying device (63) dries multiple substrates (W) that have formed a liquid film in a batch with a supercritical fluid. While the single-wafer type drying device (63) has one conveying arm that holds the substrate (W), the batch type drying device (63) has multiple conveying arms.

[0064] Next, the fourth conveying device (61) receives the substrate (W) from the drying device (63) and conveys it to the first conveying unit (33).

[0065] Next, the substrate transfer device (31) receives the substrate (W) from the first transfer unit (33) and stores it in the cassette (C) (S106 of FIG. 2). The cassette (C) is then discharged from the receiving / discharging unit (2) while containing multiple substrates (W).

[0066] (Operation of the second interface section)

[0067] With reference to FIGS. 3 to 7, the operation of the second interface unit (5) will be explained. The operation of the second interface unit (5) is controlled by a control device (9).

[0068] First, as illustrated in FIG. 3, the first return arm (43b) receives a lot (L) from the processing mechanism (44) and moves along the guide rail (43a) to a position where it transfers the lot (L) to the second return arm (52c) in the negative direction of the X-axis. At this time, the second return arm (52c) waits at the waiting position (A3). By doing so, the first return arm (43b) can move to a position where it transfers the lot (L) to the second return arm (52c) without coming into contact with the second return arm (52c).

[0069] Next, as illustrated in FIG. 4, the second return arm (52c) moves from the standby position (A3) to the transfer position (A1) and receives and holds the lot (L) from the first return arm (43b). That is, as illustrated by arrow F1 in FIG. 7, the second return arm (52c) moves upward (positive side in the Z-axis direction) from the standby position (A3) and receives the lot (L) from the first return arm (43b).

[0070] Next, as shown in FIG. 5, the second return arm (52c) moves from the transfer position (A1) to the immersion position (A2) to immerse the lot (L) in the immersion tank (51). That is, as shown by arrow F2 in FIG. 7, the second return arm (52c) moves horizontally (positive side of the Y-axis direction) from the transfer position (A1) to the upper side of the immersion tank (51). Subsequently, as shown by arrow F3 in FIG. 7, the second return arm (52c) descends from the upper side of the immersion tank (51) to the immersion position (A2) and immerses the lot (L) in the second rinse liquid stored in the immersion tank (51).

[0071] Next, as illustrated in FIG. 6, the third conveying device (53) conveys the substrate (W) of lot (L), which is held by the second conveying arm (52c) in the second rinse liquid, to the second conveying unit (54). The third conveying device (53) conveys the substrate (W) one by one to the second conveying unit (54). At this time, since the immersion tank (51) is positioned outside the movement range of the first conveying arm (43b), the first conveying arm (43b) and the third conveying arm (53a) do not interfere with each other. By this, one of the first conveying device (43) and the third conveying device (53) can be operated independently regardless of the operating state of the other. In other words, exclusive control becomes unnecessary. For this reason, since the first conveying device (43) and the third conveying device (53) can be operated at any timing, the time required for conveying the substrate (W) can be shortened. As a result, the productivity of the substrate processing system (1) is improved.

[0072] Next, when all substrates (W) of the lot (L) held by the second return arm (52c) are removed, the second return arm (52c) moves to a standby position (A3) and waits until the next lot (L) is returned by the first return arm (43b). As shown by arrow F4 in FIG. 7, the second return arm (52c) moves upward (upward in the Z-axis direction) from the immersion position (A2) to the same height as the standby position (A3), and then moves horizontally (negative side in the Y-axis direction) to the standby position (A3) as shown by arrow F5 in FIG. 7. In this case, since the second return arm (52c) moves to the standby position (A3) via a position lower than the transfer position (A1), contact with the first return arm (43b) can be prevented. Additionally, the path along which the second return arm (52c) moves from the immersion position (A2) to the standby position (A3) may be the same as the path along which the second return arm (52c) moves from the standby position (A3) to the immersion position (A2).

[0073] According to the second interface unit (5) described above, the substrate (W) being returned from the batch processing unit (4) to the single-wafer processing unit (6) is maintained in the second rinse liquid until it is pulled up from the second rinse liquid by the third return device (53). Since the substrate (W) is located below the liquid level of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate (W), thereby preventing the collapse of the uneven pattern of the substrate (W).

[0074] (Variation Example)

[0075] Referring to FIG. 8, a second interface section (5A) according to a first modified example will be described. The second interface section (5A) differs from the second interface section (5) in that the third conveying device (53) is attached above the upper surface of the immersion tank (51). Other configurations in the second interface section (5A) may be the same as those in the second interface section (5).

[0076] As illustrated in FIG. 8, the third conveying device (53) is attached to a frame member (55) that extends in the X-axis direction above the immersion tank (51) among the frame members defining the second interface section (5A), for example. The third conveying device (53) may be supported so as to be movable along the X-axis direction by the frame member (55). The third conveying device (53) may be attached to a frame member (not shown) that extends in the Y-axis direction above the immersion tank (51) among the frame members defining the second interface section (5A).

[0077] Referring to FIG. 9, a second interface section (5B) according to a second modified example will be described. The second interface section (5B) is different from the second interface section (5) in that the second return arm (52c) is supported so as to be movable along the Y-axis direction by a Y-axis drive device (52a), and the Y-axis drive device (52a) is supported so as to be movable along the Z-axis direction by a Z-axis drive device (52b). Other configurations in the second interface section (5B) may be the same as those in the second interface section (5).

[0078] As illustrated in FIG. 9, the Y-axis drive unit (52a) is attached to the negative side of the X-axis direction of the Z-axis drive unit (52b). The Y-axis drive unit (52a) is supported so as to be movable along the Z-axis direction by the Z-axis drive unit (52b). The second return arm (52c) is supported so as to be movable along the Y-axis direction by the Y-axis drive unit (52a).

[0079] Referring to FIG. 10, a second interface section (5C) according to a third variant is described. The second interface section (5C) differs from the second interface section (5B) in that two Z-axis drive devices (52b) are installed, and a Y-axis drive device (52a) is supported so as to be movable along the Z-axis direction by the two Z-axis drive devices (52b). Other configurations in the second interface section (5C) may be the same as those in the second interface section (5B).

[0080] As shown in FIG. 10, two Z-axis drive units (52b) are installed parallel to each other with a gap in the Y-axis direction. The Y-axis drive unit (52a) is supported by the two Z-axis drive units (52b) so as to be movable along the Z-axis direction.

[0081] Referring to FIG. 11, a second interface section (5D) according to a fourth variant is described. The second interface section (5D) differs from the second interface section (5) in that the Y-axis driving device (52a) is installed on the lower side of the Z-axis driving device (52b). Other configurations of the second interface section (5D) may be the same as those of the second interface section (5).

[0082] As illustrated in FIG. 11, the Y-axis drive unit (52a) extends along the Y-axis direction from the second interface unit (5D) to the batch processing unit (4) on the lower side of the Z-axis drive unit (52b). The Z-axis drive unit (52b) is attached to the Z-axis direction plus side of the Y-axis drive unit (52a). The Z-axis drive unit (52b) is supported so as to be movable along the Y-axis direction by the Y-axis drive unit (52a).

[0083] Referring to FIG. 12, a second interface section (5E) according to a fifth variant is described. The second interface section (5E) differs from the second interface section (5) in that the Y-axis driving device (52a) is installed on the upper side of the Z-axis driving device (52b). Other configurations of the second interface section (5E) may be the same as those of the second interface section (5).

[0084] As illustrated in FIG. 12, the Y-axis drive unit (52a) extends along the Y-axis direction from the second interface unit (5) to the batch processing unit (4) above the Z-axis drive unit (52b). The Z-axis drive unit (52b) is attached to the negative side of the Z-axis direction of the Y-axis drive unit (52a). The Z-axis drive unit (52b) is supported by the Y-axis drive unit (52a) so as to be movable along the Y-axis direction.

[0085] Referring to FIG. 13, a second interface unit (5F) according to a sixth variant is described. The second interface unit (5F) differs from the second interface unit (5) in that it has a multi-axis (e.g., 6-axis) robot arm (52d) instead of a Y-axis drive unit (52a) and a Z-axis drive unit (52b). Other configurations of the second interface unit (5F) may be the same as those of the second interface unit (5).

[0086] As illustrated in FIG. 13, the second conveying device (52) has a multi-axis robot arm (52d) and a second conveying arm (52c). The multi-axis robot arm (52d) may be, for example, a 6-axis robot arm. The second conveying arm (52c) is attached to the tip of the multi-axis robot arm (52d). The second conveying arm (52c) can assume any position and posture in three-dimensional space while holding a plurality of substrates (W) by the multi-axis robot arm (52d).

[0087] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or modified in various forms without departing from the appended claims and their intent.

[0088] In the above embodiment, the drying device (63) dries the substrate (W) with a supercritical fluid, but the drying method is not particularly limited. The drying method may be one that can suppress the collapse of the uneven pattern of the substrate (W), and may be, for example, spin drying, scan drying, or water-repellent drying. Spin drying is performed by rotating the substrate (W) to shake off the liquid film from the substrate (W) by centrifugal force. Scan drying is performed by rotating the substrate (W) while moving the supply position of the drying liquid from the center of the substrate (W) toward the outer circumference of the substrate (W) to shake off the liquid film from the substrate (W) by centrifugal force. Scan drying may also be performed by moving the supply position of a drying gas, such as N2 gas, from the center of the substrate (W) toward the outer circumference of the substrate (W) so as to follow the supply position of the drying liquid.

[0089] FIG. 14 is a schematic plan view illustrating a substrate processing system (1A) according to a modified embodiment. The substrate processing system (1A) illustrated in FIG. 14 may employ a drying method such as spin drying, scan drying, or water-repellent drying.

[0090] As illustrated in FIG. 14, in the substrate processing system (1A), a liquid processing device (62) is disposed instead of a drying device (63). That is, the substrate processing system (1A) has a single-wafer processing unit (6A) having a fourth conveying device (61) and a liquid processing device (62).

[0091] The liquid treatment device (62) is single-wafer type and processes substrates (W) one by one with a treatment liquid. The liquid treatment device (62) is configured to perform at least one of spin drying, scan drying, and water-repellent drying. The liquid treatment device (62) is arranged in multiple rows (e.g., 2 rows) in the horizontal direction (X-axis direction) and in multiple stages (e.g., 3 stages) in the vertical direction (Z-axis direction). By doing so, multiple substrates (W) can be processed simultaneously with a treatment liquid.

Claims

Claim 1 An interface device for transferring substrates between a batch processing unit that processes a lot containing multiple substrates in bulk and a single-wafer processing unit that processes the substrates of the lot one by one, the interface device comprising: an immersion tank disposed outside the movement range of a first conveyor device that conveys the lot in bulk in the batch processing unit and immersing the lot, and a second conveyor device that transfers the lot between the first conveyor device and the immersion tank. Claim 2 An interface device according to claim 1, wherein the second conveying device comprises a conveying arm that holds the lot and a driving device that moves the conveying arm in a horizontal and vertical direction. Claim 3 An interface device according to paragraph 2, wherein the return arm is movable to a plurality of positions including a transfer position for receiving the lot from the first return device, an immersion position for immersing the lot in the immersion tank, and a standby position provided immediately below the transfer position, and the driving device moves the return arm to the immersion position or the standby position while the first return device is operating. Claim 4 An interface device according to claim 1, further comprising a transfer unit disposed adjacent to the single-wafer processing unit and transferring the substrate between the single-wafer processing unit and the transfer unit, and a third transfer device for transferring the substrate from the immersion tank to the transfer unit. Claim 5 An interface device according to claim 1, wherein the immersion tank stores pure water in which the lot is immersed. Claim 6 An interface device according to claim 4, wherein the substrate returned to the single-wafer processing unit is dried by a supercritical fluid.

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