Connector packages for fastenerless circuit coupling

Abstract

A system for high-voltage interconnection and interfacing comprises a circuit package including a circuit housing and a gate connector located at the center of a face on the outer surface of the housing, wherein the gate connector allows wiring outside the package to be coupled to the gate connector in any of a plurality of directions. In some embodiments, the package for the housing further comprises a pressure applicator around the outer surface of the housing, and the system further comprises a lead line extending from a circuit inside the housing through an opening in the housing beyond the outer surface, wherein the lead line can be deformed over the pressure applicator on the outer surface so that the pressure applicator can apply pressure to the lead line against a contact surface of a second structure.

Description

Technology Field

[0001] Statements regarding federally sponsored research or development

[0002] This invention was made with government support pursuant to Contract No. DE-EE0009135 granted by the DOE. The government holds specific rights to this invention. Background Technology

[0003] In power electronic devices, voltage is converted by converter circuits, which are coupled to other components via buses or other interconnect or interface structures. Traditionally, silicon-based semiconductors have been widely used for these converter circuits. However, wide-bandgap semiconductors are increasingly being used in converter circuits due to their superior physical properties, including operation over a wider range of temperatures, voltages, and frequencies. This combination enables faster and more efficient designs that can be implemented in more compact architectures.

[0004] To cope with faster wide-bandgap semiconductor transistors such as silicon carbide MOSFETs, converter circuits must significantly reduce parasitic components (e.g., components introducing inductance and capacitance)—by at least tenfold. State-of-the-art interconnect structures use bolts, nuts, and screws to connect to packages. The insertion of bolts and nuts results in a loss of power density due to dimensional allowances required for electrical insulation and mechanical placement. Furthermore, the use of large bolts, nuts, and screws further increases the dimensions when arranging the conductive plates of interconnect structures, as the package housing design must align the semiconductor switch power terminals. This increase in dimensions leads to an increase in parasitic components and degrades semiconductor switch performance.

[0005] A connector package for fastener-free circuit coupling is provided. Instead of connecting terminals using holes and corresponding screws or nuts, terminals can be connected by applying direct contact and pressure to interconnect or interface structures. Fastener-free packages not only provide a compact and low-parasitic architecture but also offer greater flexibility in the geometry of the underlying circuit and terminal placement compared to fastener-based packages. The described connector package configuration makes the entire package rotatable to accommodate different wire / package connection configurations.

[0006] A system for high-voltage interconnection and interfacing comprises a circuit package—the package includes a circuit housing and a pressure applicator around the outer surface of the housing—; and a lead line extending from the circuit within the housing through an opening within the housing beyond the outer surface, wherein the lead line can be deformed over the pressure applicator on the outer surface so that the pressure applicator can apply pressure to the lead line against the contact surface of a second structure.

[0007] This summary is provided to introduce a selection of concepts in a simplified form, which is further explained in the detailed description below. This summary is not intended to identify the principal or essential features of the claimed invention, nor is it intended to be used to limit the scope of the claimed invention. Brief explanation of the drawing

[0008] FIGS. 1A and FIGS. 1B illustrate a system for high-voltage interconnection and interfacing. Figure 2 illustrates a system composed of two assemblies that insert a bus line interface. Figures 3a and 3b illustrate examples of pressure applicators for systems for high-voltage interconnection and interfacing. Figures 4a and 4b illustrate exemplary housings of a package. FIGS. 5a-5c illustrate additional embodiments of the package. Specific details for implementing the invention

[0009] A connector package for fastenerless circuit coupling is provided. Instead of connecting terminals using holes and corresponding screws or nuts, terminals can be connected by direct contact and pressure with interconnecting or interfacing structures. Fastener-free packages not only provide a compact and low-parasitic architecture but also offer greater flexibility in the geometry of the underlying circuit and terminal placement compared to fastener-based packages. Using the described connector package configuration, the entire package can be rotated to accommodate different wire / package connection configurations.

[0010] The described connector package can be directly connected to interconnect or interfacing structures via compression (e.g., without using fasteners such as nuts, bolts, and screws). This feature provides a housing that allows for the free use of any geometry within the package and enables power and control terminals to be located anywhere within the enclosure, without alignment requirements or limitations on the number of terminals for a given switch. These elements reduce parasitic components in the package and provide an optimal framework for balancing transmission line effects between the switch die population in power connections and control connections, such as gate and Kelvin terminals. In practice, this allows the entire package to be rotated to accommodate different wire / package connection configurations.

[0011] Advantageously, the total circuit parasitic components can be potentially reduced by more than 10 times. Additionally, using the described package allows terminals to be placed on both sides of the interconnect or interfacing structure, whereas current solutions only allow placement on one side. As a result, not only are parasitic components reduced by 10 times, but unprecedented power density can also be achieved.

[0012] The described package is suitable for technologies integrating wide-bandgap silicon carbide and gallium nitride, as well as faster ultra-wide-bandgap diamond semiconductor switches. In some cases, the described package is suitable for high-voltage interconnection and interfacing in the voltage range of 0.6 kV to 60 kV. Accordingly, as used herein, "high voltage" means a voltage of 600 V or higher.

[0013] FIGS. 1A and FIGS. 1B illustrate a system for high-voltage interconnection and interfacing. FIGS. 1A illustrates a side view showing the location of the lead line. FIGS. 1B illustrates a top view showing the location of the pressure applicator and the lead line. Referring to FIGS. 1A, the system for high-voltage interconnection and interfacing may include a package for a circuit (105). The package may include a housing (100) for the circuit (105) and a pressure applicator (110) around the outer surface of the housing (100). The package may further include a lead line (115) extending from a circuit (105) within a housing (100) through an opening (120) within the housing (100) beyond an outer surface, and the lead line (115) is deformable over a pressure applicator (110) on an outer surface so that a pressure applicator (110) can apply pressure to the lead line (115) against a contact surface of a second structure, such as a bus line interface shown in FIG. 2. The circuit (105) may be a power electronic circuit including a power electronic circuit including a wide bandgap transistor. The lead line (115) may be a connection between the circuit and any external element, for example, a second structure. The lead line (115) may be, for example, a wire and may include an insulating coating on a portion of the lead line (115). The lead line (115) may also include a lead line package outside the housing that may be at least partially made of a more durable material to prevent damage to the lead line (115) when acted upon by the pressure applicator (110).

[0014] Referring to FIG. 1b, there may be at least one pressure applicator (110) spaced apart over the entire outer surface of the housing (100). The pressure applicators (110) may be spaced evenly over the entire outer surface, for example. Four pressure applicators (110) may be shown, but fewer or more pressure applicators may be used. One or more pressure applicators (110) may be positioned in close proximity to a corresponding opening (120) that allows a lead line (115) to extend through the surface of the housing (100). In FIG. 1b, as shown on the right side of FIG. 1a, only one of the lead lines is shown deformed over the pressure applicator (110).

[0015] FIG. 2 illustrates a system composed of two assemblies that accommodate a bus line interface. Referring to FIG. 2, the assembly (200) may be formed from a plurality of packages (205). Each package may be configured as described, for example, for FIG. 1a and FIG. 1b. The assembly may further include a heat sink (210). The heat sink (210) may be formed as individual heat sinks for each package, or may be formed as a larger heat sink to which a plurality of packages of the assembly are joined. The assembly (200) is coupled to the bus line interface (215). The bus line interface may be used to connect one or more circuits (e.g., embedded in the package (205)) to an external bus or system. Accordingly, the lead line (220) of the package (205) makes physical and electrical contact with the contact surface of a second structure in the form of a conductive pad on the bus line interface (215) due to pressure applied by a corresponding pressure applicator on the outer surface of the housing on the lead line (220) deformed thereon. Since the lead line (220) can be connected to the bus line interface (215) via mechanical pressure applied by a pressure applicator instead of using screws and bolts, the entire package can be rotatably adapted to different wire / package connection configurations.

[0016] At least the second assembly (230) formed by the second package (235) may face the first assembly (200), and a bus line interface (215) may be inserted between the two assemblies. The second assembly (230) may be identical or similar to the first assembly (200), for example, by including the second package (235) and a heat sink (240). The second package (235) may be configured as described for FIGS. 1a and FIGS. 1b. For example, the second package (235) may include a second housing for the second circuit, a second pressure applicator around the outer surface of the second housing, and a second lead line (245) extending from the second circuit over the outer surface through a second opening of the second housing within the second housing, and the second lead line (245) may be deformed over the second pressure applicator on the outer surface so that the second pressure applicator can apply pressure to the second lead line (245) against the second contact surface (250) of the bus line interface (215) (wherein the second contact surface is the opposite surface of the bus line interface (215) contacted by the first assembly (200)).

[0017] FIGS. 3A and 3B illustrate examples of pressure applicators for systems for high-voltage interconnection and interfacing. FIG. 3A illustrates the appearance of a pressure applicator independent of the system and housing. The pressure applicator may include various types of inserts (302), a device (304) for storing potential energy, and a base (306). The insert (302) may include a wider circumference at one end to enable better contact. The insert (302) may be manufactured from various materials, including non-conductive materials as well as conductive materials such as brass. The device (304) for storing potential energy may be various types of devices, such as a stack of Belleville washers, for example, as illustrated in the drawings. Other spring systems or pneumatic systems may potentially be used. The base (306) can be used to better maintain potential energy by securing the pressure applicator to the housing or by providing a hard surface that does not allow energy supply and thereby reduces the stored energy. Referring to FIG. 3b, a cross-sectional view of the pressure applicator housed in a support for the pressure applicator within the housing can be seen. The lead line (308) can be deformed over the pressure applicator and, consequently, can receive pressure from the pressure applicator as discussed in relation to FIG. 1a and FIG. 1b.

[0018] FIGS. 4a and 4b illustrate an exemplary housing of a package. FIG. 4a shows the peripheral substructure of the housing, and FIG. 4b shows the finished housing. Referring to FIG. 4a, the peripheral substructure of the housing may include a rib (405), an attachment (410), and a support (415) for a pressure applicator. The housing may be at least partially composed of an insulating material such as polyphenylene sulfide resin.

[0019] The ribs (405) may allow wires or other materials to be routed around the housing. The ribs (405) may also maximize creepage distance along the surface. The attachment (410) allows the housing (and thus the entire package) to be attached to other surfaces, such as a base plate or a lid. Attaching the housing allows access to additional heat sinks for further stabilization or the addition of modules such as measuring tools. The attachment (410) may be, for example, screw holes and corresponding screws. The support (415) for the pressure applicator can accommodate the pressure applicator and ensure clearance by isolating other internal parts of the package from the pressure application. The support (415) also ensures that the maximum force is applied toward the outer surface by increasing the force applied by the corresponding pressure applicator by providing a rigid surface that remains firm. Referring to FIG. 4b, the finished housing can be seen. The pressure applicator (420) and the associated lead line (425) can be seen. The outer surface may include divots and slits (430) to allow for additional wiring. Laser marking can be used on the surrounding surface to label a specific system.

[0020] FIGS. 5a–5c illustrate additional embodiments of the package. FIG. 5a shows a schematic diagram illustrating how to add a gate connector to the circuit diagram shown in FIG. 1a. A circuit (505) within the package (500) may extend outside the housing of the package (500) by a lead line (510) extending through an opening in the housing. However, the circuit (505) may also be connected to internal wiring connected to a gate connector (515), which also serves as an opening that allows the circuit (505) to be coupled outside the package (500).

[0021] Referring to FIG. 5b, a gate connector (515) can be seen in the design of the package (500). The gate connector (515) may be a female gate connector (520) as shown in FIG. 5b. The gate connector (515) may be located at the center of the face of the package (500) and may be located on the same outer surface as the pressure applicator. The package (500) may feature ribbing (e.g., ribs (405) in FIG. 4a) that allows wiring from outside the package to reach the gate connector (515) through the periphery face from, for example, in multiple directions. Referring to FIG. 5c, the gate connector (515) may alternatively be a male gate connector (525). The gate connector (515) may be rotatable. The female gate connector (520) may be configured to allow connection by the male connector / wiring in any direction, for example, by having a circular receptacle that does not require a specific direction. The male gate connector (525) may rotate so that the "L" shape allows connection in any direction (for example, from the ribs on the surface).

[0022] Advantageously, by incorporating a gate connector (515) at a central position of the package (500), the impedance distribution between circuits (e.g., circuit (105)) within the package housing can be optimized in a manner suitable for wide bandgap and ultra-wide bandgap circuits. Additionally, since the ribbing allows access to the gate connection from any direction, the length of the gate connection to the driving device is minimized. Furthermore, the rotatable nature of the gate connector supports connections in various directions. In fact, as illustrated in FIG. 5b, the female gate connector (520) (or the male gate connector (525) as illustrated in FIG. 5c) can be rotated to support connections from at least four directions (530A, 530B, 530C, 530D). Additionally, the configuration of the gate connector (515) (e.g., the female gate connector (520) and / or the male gate connector (525)) can be applied to a package that does not include pressure applicator-based interconnects.

[0023] As mentioned above, the entire package can be rotated to accommodate various wire / package connection configurations. For example, as illustrated in FIGS. 1b and 5b, the package may have four applicators (each of which may have a corresponding lead line) positioned symmetrically with respect to a central axis (e.g., a gate connector). If the package is rotated, for example, 90 degrees, the package can be easily connected to the bus line interface just as before the rotation. The rotational function of the gate connector can support the rotational function of the package.

[0024] In certain cases, a system for interconnection and interfacing includes a circuit package and a gate connector located in the center of the outer surface of the housing. The package includes a circuit housing. The gate connector allows wiring outside the package to be coupled to the gate connector in any of a plurality of directions (e.g., four directions (530A, 530B, 530C, 530D)).

[0025] In some cases, the housing of these cases includes ribs that allow wiring outside the package to reach the gate connector from multiple directions. In some cases, the gate connector in any of the above cases is rotatable. In some cases, one of the gate connectors in the above cases is L-shaped. In some cases, the housing in one of the above examples includes ribs that allow wiring outside the package to reach the gate connector through the periphery surface.

[0026] In some cases, any of the above circuit packages further include a pressure applicator around the outer surface of the housing and a lead line extending from the circuit within the housing beyond the outer surface through an opening within the housing. The lead line may be deformed on the pressure applicator on the outer surface so that the pressure applicator can apply pressure to the lead line against the contact surface of the second structure. In some cases, the pressure applicators of any of the above cases are provided in multiple numbers around the outer surface of the housing and positioned symmetrically with respect to a rotatable gate connector. In some cases, a stack of Belleville washers is included in any of the above pressure applicators.

[0027] In some cases, the second structure among the above cases is a bus line interface. In some cases, the bus line interface of any of the above cases includes a contact surface for contacting a lead line on one side and a second contact surface on the opposite side. The system of any of the above cases further includes a second package for a second circuit and a second lead line extending from the second circuit within the second housing through a second opening of the second housing over an outer surface. The second package includes a second housing for the second circuit and a second pressure applicator located around the outer surface of the second housing. The second lead line may be deformed over the second pressure applicator on the outer surface so that the second pressure applicator can apply pressure to the second lead line against the second contact surface of the bus line interface.

[0028] In some cases, any of the above cases is a power electronic circuit. In some cases, the power electronic circuit of any of the above cases includes a wide bandgap transistor. In some cases, the housing of any of the above cases includes an insulating material. In some cases, the insulating material is polyphenylene sulfide resin. In some cases, the system of any of the above cases further includes a heat sink.

[0029] Although the subject matter of the invention has been described in specific language regarding structural features and / or operations, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or operations described above. Rather, the specific features and operations described above are disclosed as examples of implementing the claims, and other equivalent features and operations are intended to be within the scope of the claims.

Claims

Claim 1 A system for interconnection and interfacing, comprising: a circuit package — said package comprises a circuit housing and a pressure applicator around an outer surface of said housing —; and a leadline extending from a circuit inside said housing through an opening of said housing beyond said outer surface — said leadline may be deformed over said pressure applicator on said outer surface so that said pressure applicator may apply pressure to said leadline against a contact surface of a second structure — a system for interconnection and interfacing. Claim 2 In claim 1, the system is a system for interconnection and interfacing that further includes a heat sink. Claim 3 In claim 1, the lead line is a system for interconnection and interfacing comprising a wire having a portion including an insulating coating. Claim 4 In claim 1, the lead line is a system for interconnection and interfacing comprising a lead line package on which the pressure applicator acts. Claim 5 A system for interconnection and interfacing according to claim 1, comprising a plurality of pressure applicators, wherein the pressure applicators are uniformly spaced around the outer surface of the housing. Claim 6 A system for interconnection and interfacing according to claim 5, further comprising a plurality of lead lines corresponding to the plurality of pressure applicators, wherein each pressure applicator of the plurality of pressure applicators is positioned in close proximity to a corresponding opening to which the corresponding lead line of the plurality of lead lines extends. Claim 7 A system for interconnection and interfacing according to claim 1, wherein the housing comprises a gate connection opening located at the center of the outer surface of the housing. Claim 8 A system for interconnection and interfacing according to claim 7, wherein the housing further comprises slits that allow wiring outside the package to reach the gate connection opening from a plurality of directions along the outer surface of the housing. Claim 9 In claim 1, the circuit is a system for interconnection and interfacing including a power electronic circuit. Claim 10 In claim 9, the power electronic circuit is a system for interconnection and interfacing comprising a wide bandgap transistor. Claim 11 In claim 1, the housing is a system for interconnection and interfacing comprising an insulating material. Claim 12 In claim 11, the insulating material is a polyphenylene sulfide resin, a system for mutual connection and interfacing. Claim 13 In claim 1, the pressure applicator is a system for interconnection and interfacing comprising a stack of Belleville washers. Claim 14 In claim 1, the second structure is a system for mutual connection and interfacing, which is a bus line interface. Claim 15 In claim 14, the bus line interface comprises a contact surface on one side for contacting the lead line and a second contact surface on the opposite side, and the system further comprises: a second package for a second circuit — the second package comprises a second housing for a second circuit and a second pressure applicator around the outer surface of the second housing — and a second lead line extending from the second circuit within the second housing through a second opening of the second housing beyond the outer surface — the second lead line may be deformed over the second pressure applicator on the outer surface so that the second pressure applicator can apply pressure to the second lead line against the second contact surface of the bus line interface — a system for interconnection and interfacing.

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