Light emitting device package and display device using same

Abstract

The present invention is applicable to technical fields related to display devices, and, for example, relates to a light-emitting element package and a display device using a micro LED (Light Emitting Diode). The present invention may be configured to include: a first layer having a terminal portion; a second layer having a light-emitting portion including light-emitting elements forming a unit subpixel, located adjacent to the first layer; a third layer located adjacent to the second layer through which light emitted from the light-emitting portion passes; a plurality of connecting electrodes located between the second layer and the third layer to connect the light-emitting elements to the terminal portion; and a protective layer located at least on the side of the second layer.

Description

Technology Field

[0001] The present invention is applicable to the field of technology related to display devices, and, for example, relates to a light-emitting device package and a display device using a micro LED (Light Emitting Diode). Background Technology

[0002] Recently, display devices with excellent characteristics such as thinness and flexibility are being developed in the field of display technology. Currently, the major commercially available displays are represented by LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diodes).

[0003] Meanwhile, light-emitting diodes (LEDs) are semiconductor light-emitting devices well known for converting electric current into light. Starting with the commercialization of red LEDs using GaAsP compound semiconductors in 1962, they have been used as light sources for display images in electronic devices, including information and communication equipment, along with green LEDs of the GaP:N series.

[0004] Recently, these light-emitting diodes (LEDs) have been gradually miniaturized and manufactured into micrometer-sized LEDs, which are being used as pixels in display devices.

[0005] Compared to other display devices / panels, such LED technology exhibits characteristics of low power consumption, high brightness, and high reliability, and can also be applied to flexible devices. Consequently, it has recently been actively researched by research institutions and companies.

[0006] Various markets for LED displays are expanding through applications that leverage the high brightness and high reliability characteristics of LEDs. The field leading the market most significantly due to these characteristics is signage displays.

[0007] White resin is applied to improve luminous efficiency in applications where luminous efficiency is critical, such as LED lighting and displays.

[0008] To this end, a method is used to improve light efficiency by reflecting light in one direction using a white reflector composed of high-refractive-index micro or nano particles and a polymer binder.

[0009] Due to limitations in physical properties, such as reduced intensity when excessive particles are included, these white reflective structures are constrained by their ratio; therefore, a method is adopted to increase reflectivity by increasing the thickness.

[0010] White materials require an excessive amount of exposure compared to general photoresist due to light absorption and diffraction of UV light, and have a severe negative PR slope, which poses a problem when inserted into the intermediate layer of the device to serve as an electrode connection via.

[0011] When creating a photolithography pattern, the higher the content of high-refractive index particles, the higher the reflectivity, and the more severe the negative shape of the white pattern becomes.

[0012] Meanwhile, regarding environmental reliability, solder resistor (SR) is commonly applied as a finishing material on PCB substrates.

[0013] Photoresist has characteristics that make it less optically reliable, such as browning, compared to general thermosetting type materials.

[0014] Generally, acrylic-based materials have been replaced by materials such as epoxy, silicone, and Teflon, which have proven reliability, due to their vulnerability to heat, humidity, and chemical reactions.

[0015] Even in the case of signage display PCBs requiring high environmental reliability, epoxy or silicone resin materials are applied as molding materials after chip mounting.

[0016] Resins such as silicone and Teflon are excellent chemical and physical materials, but they are difficult to manufacture as photoresist materials.

[0017] When forming via patterns through etching after coating and curing materials such as silicon or Teflon, an increase in process costs is unavoidable due to the addition of etching mask formation, etching, and cleaning processes.

[0018] Therefore, measures to resolve these problems are required. The problem to be solved

[0019] The technical problem to be solved by the present invention is to provide a light-emitting device package with enhanced environmental reliability and a display device using the same.

[0020] In addition, we aim to provide a light-emitting device package capable of improving efficiency and a display device using the same.

[0021] In addition, we aim to provide a light-emitting device package capable of improving process margins for structures using white resin, and a display device using the same.

[0022] Furthermore, according to other embodiments of the present invention, those skilled in the art will understand from the entire context of the specification and drawings that there may be additional technical problems not mentioned herein. means of solving the problem

[0023] As a first aspect for achieving the above technical problem, the present invention may be configured to include: a first layer having a terminal portion; a second layer having a light-emitting portion located adjacent to the first layer and including light-emitting elements forming a unit subpixel; a third layer located adjacent to the second layer through which light emitted from the light-emitting portion passes; a plurality of connecting electrodes located between the first layer and the second layer to connect the light-emitting elements to the terminal portion; and a protective layer located on at least the side of the second layer.

[0024] As an exemplary embodiment, the protective layer may include at least one of acrylic, epoxy, silicone, silicone acrylic, silicone epoxy composite, Teflon, and fluorine-based material.

[0025] As an exemplary embodiment, at least one of the first layer, the second layer, the third layer, and the protective layer may include fine particles.

[0026] As an exemplary embodiment, the fine particles may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, Silica, and PMMA.

[0027] As an exemplary embodiment, a through electrode connecting the connecting electrode and the terminal portion may be further included.

[0028] As an exemplary embodiment, it may further include a sloped layer located on the side of at least one of the first layer, the second layer, and the third layer.

[0029] As an exemplary embodiment, a reflective layer may be provided on the outer side of the inclined layer.

[0030] As an exemplary embodiment, an inorganic barrier layer may be further provided between the second layer and the third layer.

[0031] As an exemplary embodiment, the inorganic barrier layer may be further provided between at least one of the first layer and the second layer and the protective layer.

[0032] As a second aspect for achieving the above technical problem, the present invention comprises a display device including a light-emitting element package positioned on a wiring substrate to define individual pixels, wherein the light-emitting element package may be configured to include: a first layer having a terminal portion; a second layer having a light-emitting portion positioned adjacent to the first layer and including light-emitting elements forming a unit subpixel; a third layer having a portion positioned adjacent to the second layer through which light emitted from the light-emitting portion passes; a plurality of connecting electrodes positioned between the first layer and the second layer to connect the light-emitting elements to the terminal portion; and a protective layer positioned on at least the side of the second layer. Effects of the invention

[0033] First, according to one embodiment of the present invention, environmental reliability can be enhanced, thereby improving the durability and reliability of the light-emitting device package.

[0034] In addition, the fabrication efficiency of the light-emitting device package can be improved.

[0035] Furthermore, according to another embodiment of the present invention, there are additional technical effects not mentioned herein. Those skilled in the art will understand this from the entire context of the specification and drawings. Brief explanation of the drawing

[0036] FIG. 1 is a plan view showing a light-emitting element package according to a first embodiment of the present invention. Figure 2 is a cross-sectional view along line A-A' of Figure 1. FIG. 3 is a plan view showing a light-emitting element package according to a second embodiment of the present invention. Figure 4 is a cross-sectional view along line B-B' of Figure 3. FIG. 5 is a plan view showing a light-emitting element package according to a third embodiment of the present invention. Figure 6 is a cross-sectional view along line C-C' of Figure 5. FIG. 7 is a plan view showing a light-emitting element package according to a fourth embodiment of the present invention. FIG. 8 is a plan view showing a light-emitting element package according to the fifth embodiment of the present invention. FIGS. 9 to 12 are schematic diagrams illustrating examples of applying exposure during the process of fabricating a light-emitting device package according to embodiments of the present invention. FIGS. 13 and 14 briefly illustrate the process of fabricating a light-emitting device package according to the first embodiment of the present invention using double-sided exposure. FIGS. 15 and 16 briefly illustrate the process of fabricating a light-emitting device package according to the fourth embodiment of the present invention using double-sided exposure. FIGS. 17 to 20 are cross-sectional views showing a light-emitting device package including a gradient layer according to embodiments of the present invention. FIGS. 21 to 27 are cross-sectional views showing a light-emitting device package including an inorganic barrier layer according to embodiments of the present invention. Specific details for implementing the invention

[0037] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components, regardless of drawing symbols, are assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, when describing the embodiments disclosed in this specification, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions could obscure the essence of the embodiments disclosed in this specification. Additionally, it should be noted that the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification and should not be interpreted as limiting the technical concept disclosed in this specification.

[0038] Furthermore, for the convenience of explanation, each drawing is described, but it is also within the scope of the present invention that a person skilled in the art combines at least two drawings to implement other embodiments.

[0039] Furthermore, when elements such as layers, regions, or substrates are referred to as existing "on" other components, it can be understood that this means they exist directly on the other elements or that there may be an intermediate element between them.

[0040] The concept of a display device as described in this specification includes all display devices that display information as a unit pixel or a set of unit pixels. Therefore, it is not limited to finished products but can also be applied to components. For example, a panel corresponding to a component of a digital TV also independently corresponds to a display device as defined in this specification. Finished products may include mobile phones, smartphones, laptop computers, digital broadcasting terminals, PDAs (personal digital assistants), PMPs (portable multimedia players), navigation systems, Slate PCs, Tablet PCs, Ultra Books, digital TVs, desktop computers, etc.

[0041] However, those skilled in the art will readily understand that the configuration according to the embodiments described in this specification may be applied to displayable devices, even in the form of new products developed in the future.

[0042] In addition, the semiconductor light-emitting device mentioned in this specification is a concept that includes LEDs, micro LEDs, etc., and may be used interchangeably.

[0044] FIG. 1 is a plan view showing a light-emitting element package according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1.

[0045] Referring to FIGS. 1 and 2, a light-emitting element package (200) according to a first embodiment of the present invention may include a first layer (210) having terminal portions (211 to 214) on the upper side.

[0046] Additionally, a second layer (240) may be provided, which includes a light-emitting part (260) located adjacent to the first layer (210) and comprising light-emitting elements (261, 262, 263) forming a unit subpixel.

[0047] Additionally, a third layer (220) may be provided that is located adjacent to the second layer (240) and through which light emitted from the light-emitting part (260) passes.

[0048] Between the first layer (210) and the second layer (240), a plurality of connecting electrodes (271, 272, 273, 274) may be provided to connect light-emitting elements (261, 262, 263) to terminal portions (211 to 214).

[0049] A protective layer (230) may be provided on at least the side of the second layer (240). In FIG. 2, a protective layer (230) may also be located on the side of the second layer (240). This protective layer (230) may contain fine particles (231).

[0050] For example, at least one of the first layer (210), second layer (240), third layer (220), and protective layer (230) may include fine particles (231).

[0051] As an exemplary embodiment, the microparticle (231) may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, Silica, and PMMA.

[0052] The white photoresist (White PR) forming each layer can reflect the path of incident light by diffracting it to a certain extent according to its thickness due to high refractive index particles.

[0053] The protective layer (230) may include at least one of acrylic, epoxy, silicone, silicone acrylic, silicone epoxy composite, Teflon, and fluorine-based materials.

[0054] Referring to FIG. 2, as an exemplary embodiment, a through electrode (275, 276) connecting the connecting electrode (271, 272) and the terminal portion (211 to 214) may be provided.

[0055] Referring to FIG. 1, the light-emitting element (260) may include a first light-emitting element (261), a second light-emitting element (262), and a third light-emitting element (263). For example, the first light-emitting element (261) may be a red light-emitting element (R), the second light-emitting element (262) may be a green light-emitting element (G), and the third light-emitting element (263) may be a blue light-emitting element (B). In some cases, at least one of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may include two or more light-emitting elements.

[0056] When the light-emitting element package (200) is used in a display device, each of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may correspond to an individual subpixel. The first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may constitute a unit pixel.

[0057] The light-emitting elements (261, 262, 263) forming the light-emitting part (260) may be mini LEDs having a size in millimeters or micro LEDs having a size in micrometers.

[0058] Referring to FIG. 2, terminal portions (211 to 214) may be located on the outer side of the first layer (210). In FIG. 2, two terminal portions (211, 212) are shown as a cross-sectional view.

[0059] In the structure illustrated in FIG. 2, the light-emitting element package (200) may be configured to include a first layer (210) having terminal portions (211 to 214), a second layer (240) having a light-emitting portion (260) that is located adjacent to the first layer (210) and includes light-emitting elements (261, 262, 263) forming a unit subpixel, a third layer (220) that is located adjacent to the second layer (240) and through which light emitted from the light-emitting portion (260) passes, a plurality of connecting electrodes (271, 272, 273, 274) that are located between the first layer (210) and the second layer (240) and connect the light-emitting elements (261, 262, 263) to the terminal portions (211 to 214), and a protective layer (230) located on the side of at least the second layer (240).

[0060] Here, although not separately illustrated, a driver IC (250; see FIG. 5) for driving a light-emitting unit (260) may be located in the second layer (240). Alternatively, a separate layer (not illustrated) in which the driver IC (250) for driving the light-emitting unit (260) is located may be located between the first layer (210) and the second layer (240). Such a driver IC (250) is connected to each light-emitting unit (260) so that when this light-emitting element package (200) is composed of pixels of a display, Active Matrix (AM) driving can be implemented.

[0061] A pair of connecting electrodes (271, 272) may be connected to each light-emitting element (261, 262, 263) forming the light-emitting part (260). As shown in FIG. 1, these connecting electrodes (271, 272) may connect each light-emitting element (261) to terminal parts (211 to 213). For example, if a driving chip (250) for driving the light-emitting part (260) is provided, the connecting electrodes (271, 272) may further include a portion connecting the light-emitting part (260) to the driving chip (250).

[0062] Referring to FIG. 2, the connecting electrodes (271, 272) may include a reflective portion (273, 274) in the form of a reflective cup that reflects light emitted from the light-emitting elements (261, 262, 263). For example, the reflective portion (273, 274) may be electrically connected to each electrode of the light-emitting elements (261, 262, 263).

[0063] An insulating layer (230) may be positioned between the reflective portion (273, 274) forming the shape of a reflective cup and the light-emitting element (261, 262, 263). This insulating layer (230) may be formed of a transparent material. In some cases, the insulating layer (230) may contain light-scattering particles.

[0064] As an exemplary embodiment, the connecting electrodes (271, 272) and the terminal portions (211, 212) may be electrically connected by a through electrode (275, 276). That is, referring to FIG. 2, as an exemplary embodiment, a through electrode (275, 276) connecting the connecting electrodes (271, 272) and the terminal portions (211, 212) may be further provided.

[0065] For example, the light-emitting element package (200) according to the present embodiment may be a bottom emission package in which light is emitted in a downward direction in the state shown in FIG. 2. Meanwhile, the light-emitting element package (200) according to the present embodiment may be a top emission package in which light is emitted in an upward direction with the up and down directions reversed in the state shown in FIG. 2.

[0066] As an exemplary embodiment, the light-emitting element (261) may be connected to a driving chip (not shown) or to a terminal portion (211, 212) by means of a connecting electrode (273, 274).

[0067] These connecting electrodes (273, 274) may be located on the interface (RDL1; first reconstructed layer) between the first layer (210) and the second layer (240).

[0068] Additionally, referring to FIG. 2, terminal portions (211, 212) may be provided on the upper side surface (RDL2; second reconstructed layer) of the first layer (210).

[0069] At least one of these connection electrodes (271, 272) and terminal portions (211, 212) can be fabricated using a redistribution layer (RDL) process used in semiconductor packaging processes.

[0070] Such a light-emitting device package (200) may include a protective layer (230) provided to wrap the exterior with a high reliability material against the external environment.

[0071] This protective layer (230) can be formed using a white material (resin). Referring to FIG. 2, it can be seen that the outer surfaces of the first layer (210) and the second layer (240) are covered by the protective layer (230).

[0072] Additionally, the first layer (210) may be divided and positioned corresponding to the shape of each terminal part (211 to 214). In this way, a protective layer (230) may also be positioned between the divided first layers (210).

[0074] FIG. 3 is a plan view showing a light-emitting element package according to a second embodiment of the present invention. FIG. 4 is a cross-sectional view along line B-B' of FIG. 3.

[0075] Referring to FIG. 3, it can be seen that the arrangement of light-emitting elements (261, 262, 263) in the light-emitting element package (201) according to the second embodiment is different from that of the light-emitting element package (200) according to the first embodiment. The light-emitting element package (201) according to the second embodiment may have a more efficient spatial arrangement.

[0076] According to the present embodiment, a plurality of connecting electrodes (271a, 272a, 277) may be provided between the first layer (210) and the second layer (240) to connect light-emitting elements (261, 262, 263) to terminal portions (211 to 214).

[0077] Here, a connecting electrode (277) connecting two light-emitting elements (261, 262) to each other may be provided.

[0078] Other details may be common to the light-emitting element package (200) according to the first embodiment described above. Therefore, redundant descriptions are omitted.

[0080] FIG. 5 is a plan view showing a light-emitting element package according to a third embodiment of the present invention. FIG. 6 is a cross-sectional view along line C-C' of FIG. 5.

[0081] As mentioned above, according to the light-emitting element package (202) of the third embodiment, a driver IC (250) for driving a light-emitting part (260) may be located in the second layer (240). This driver IC (250) is connected to each light-emitting part (260), so that when this light-emitting element package (200) is composed of pixels of a display, Active Matrix (AM) driving can be implemented.

[0082] Connecting electrodes (271b, 277a, 278, 279) may be connected to each light-emitting element (261, 262, 263) and driving chip (250) forming the light-emitting part (260). These connecting electrodes (271b, 277a, 278, 279) may connect each light-emitting element (261, 262, 263) and driving chip (250) to terminal parts (211 to 213).

[0083] Other details may be common to the light-emitting element package (200) according to the first embodiment described above. Therefore, redundant descriptions are omitted.

[0085] FIG. 7 is a plan view showing a light-emitting element package according to a fourth embodiment of the present invention.

[0086] The light-emitting element package (203) according to the fourth embodiment of the present invention represents a top emission package.

[0087] According to the present embodiment, a terminal portion is configured on the RDL1 layer, and a first layer (210a) may be located on the upper side of the terminal portion.

[0088] A second layer (241) in which a light-emitting element (261) is located may be located on the upper side of the first layer (210a). Here, the second layer (241) may have the shape of a reflective cup.

[0089] A protective layer (230) may be located on the sides of the first layer (210a) and the second layer (241). Thus, the protective layer (230) may form a reflective surface for the second layer (241) in the shape of a reflective cup.

[0090] A third layer (220) through which light emitted from a light-emitting element (261) is transmitted may be located on the second layer (241).

[0091] A connecting electrode (271c, 272c, 273a, 274a) connecting a light-emitting element (261) to a terminal portion may be located between the first layer (210a) and the second layer (241). The connecting electrode (271c, 272c) and the terminal portion may be connected to each other by a through electrode (275, 276).

[0092] At this time, a protective layer (230) may also be located between the first layer (210a) and the second layer (241).

[0093] Other details may be common to the light-emitting element package (200) according to the first embodiment described above. Therefore, redundant descriptions are omitted.

[0095] FIG. 8 is a plan view showing a light-emitting element package according to the fifth embodiment of the present invention.

[0096] The light-emitting device package according to the fifth embodiment of the present invention represents a top emission package, similar to the fourth embodiment.

[0097] According to the present embodiment, a driving chip (250) may be located on one side of the light-emitting element (261).

[0098] At this time, connecting electrodes (271d, 272d, 273b, 274b) connecting the light-emitting element (261) and the driving chip (250) to the terminal portion may be provided.

[0099] Other details may be common to the light-emitting element package (200) according to the fourth embodiment (203) and the first embodiment described above. Therefore, redundant descriptions are omitted.

[0101] FIGS. 9 to 12 are schematic diagrams illustrating examples of applying exposure during the process of fabricating a light-emitting device package according to embodiments of the present invention.

[0102] Referring to FIGS. 9 to 12, an example is shown in which the shape of a package structure formed through exposure can be controlled.

[0103] For example, referring to FIGS. 9 and 10, a state is shown in which a package structure is formed through upper surface exposure (L1) using a mask layer (m1).

[0104] Here, when the light intensity is increased during top surface exposure, the shape can change from the state of FIG. 9 to FIG. 10.

[0105] In addition, referring to FIGS. 11 and 12, a state is shown in which a package structure is formed through double-sided exposure (L1, L2) using upper and lower mask layers (m1, m2).

[0106] If the lower exposure amount (L2) becomes larger than the upper exposure amount (L1), the shape can change from FIG. 11 to FIG. 12.

[0107] Through this process, the first layer (210), the second layer (240), and the third layer (220) can be partially removed through an etching selectivity using an etching mask of the RDL1 or RDL2 layer.

[0108] In addition, various etching masks, such as metals, PR, and inorganic films, can be utilized by employing a photolithography process.

[0109] Here, the third layer (220) can be formed by various methods such as general photolithography, etching, and polishing.

[0110] By utilizing a metal pattern mask of the substrate, a double-sided exposure photolithography method can be applied, thereby enabling control of the side structure of the package.

[0112] FIGS. 13 and 14 briefly illustrate the process of fabricating a light-emitting device package according to the first embodiment of the present invention using double-sided exposure.

[0113] Referring to FIG. 13, a separate mask (400) may be used on the upper surface. Meanwhile, a metal or black matrix (310) located on the support substrate (300) may be used as a mask on the lower surface. This metal or black matrix (310) may also be used as an align key.

[0114] In this way, individual packages can be produced as shown in FIG. 14 through double-sided exposure (L1, L2) using masks (400, 310).

[0116] FIGS. 15 and 16 briefly illustrate the process of fabricating a light-emitting device package according to the fourth embodiment of the present invention using double-sided exposure.

[0117] Referring to FIG. 15, as in FIG. 13, a separate mask (400) may be used on the upper surface. Meanwhile, on the lower surface, a metal or black matrix (310) located on the support substrate (300) may be used as a mask. This metal or black matrix (310) may also be used as an align key.

[0118] In this way, individual packages can be produced as shown in FIG. 14 through double-sided exposure (L1, L2) using masks (400, 310).

[0119] At this time, a recess can be formed so that a second layer (241) in the shape of a reflective cup can be positioned inside the protective layer (232).

[0121] FIGS. 17 to 20 are cross-sectional views showing a light-emitting device package including a gradient layer according to embodiments of the present invention.

[0122] As an exemplary embodiment, a sloped layer (280) may be provided on the side of at least one of the first layer (210), second layer (240), and third layer (220) constituting the light-emitting element package.

[0123] In this way, when the inclined layer (280) is provided, a protective layer (230) may be located on the outside of the inclined layer (280).

[0124] A side slope layer (280) can be formed by coating a liquid containing solids in the lower light-emitting structure using gravity and surface tension.

[0125] As a solid component, at least one material among acrylic, epoxy, silicone, Teflon, silicone acrylic, and silicone epoxy composites may be used.

[0126] Referring to FIG. 17, an inclined layer (280) may be located continuously on the sides of the first layer (210), the second layer (240), and the third layer (220). Additionally, an inclined layer (280) may be located between the first layers (210) that are separated.

[0127] Referring to FIG. 18, a reflective layer (282), such as a metal thin film, may be additionally provided on the side inclined layers (280, 281). This reflective layer (282) can improve the light efficiency of the display by changing the light path of the side light emission of the light-emitting part (260).

[0128] Here, the package structure illustrated in FIGS. 17 and FIGS. 18 is related to the light-emitting element package (200) structure according to the first embodiment described with reference to FIG. 1.

[0129] Referring to FIG. 19, an example is shown in which a first inclined layer (283) is located on the first layer (210), and a second inclined layer (284), separated from the first inclined layer (283), is located on the second layer (240) and the third layer (220). Additionally, an inclined layer (285) may be located between the separated first layers (210).

[0130] Referring to FIG. 20, a reflective layer (286), such as a metal thin film, may be additionally provided on the side inclined layers (283, 284, 285). This reflective layer (286) can improve the light efficiency of the display by changing the light path of the side light emission of the light-emitting part (260).

[0131] Here, the package structure illustrated in FIGS. 19 and FIGS. 20 is related to the light-emitting element package (201) structure according to the second embodiment described with reference to FIG. 4.

[0133] FIGS. 21 to 27 are cross-sectional views showing a light-emitting device package including an inorganic barrier layer according to embodiments of the present invention.

[0134] To enhance environmental reliability, a first inorganic barrier layer (290) may be provided on the outer side of at least one of the first layer (210), the second layer (240), and the third layer (220). For example, a first inorganic barrier layer (290) may be provided between at least one of the first layer (210), the second layer (240), and the third layer (220) and the protective layer (230).

[0135] Referring to FIG. 21, a first inorganic barrier layer (290) may be located inside the protective layer (230) of the light-emitting element package (200) according to the first embodiment described with reference to FIG. 1.

[0136] In an exemplary embodiment, a first inorganic barrier layer (290) may be provided between at least one of the first layer (210), the second layer (240), and the third layer (220). For example, a second inorganic barrier layer (291) may be further provided between the second layer (240) and the third layer (220).

[0137] Referring to FIG. 22, a third weapon barrier layer (292) may be positioned on the outer side of the protective layer (230). Additionally, the third weapon barrier layer (292) may be positioned to cover the portion excluding the upper terminal portions (211, 212).

[0138] Additionally, a fourth weapon barrier layer (293) may be provided that is connected to the second weapon barrier layer (291) and the third weapon barrier layer (292) and is located between the second layer (240) and the third layer (220).

[0139] FIG. 23 shows that a fifth inorganic barrier layer (294) may be provided between the second layer (240) and the third layer (220) of the light-emitting device package (201) according to the second embodiment described with reference to FIG. 4.

[0140] Referring to FIG. 24, a sixth inorganic barrier layer (295) may be further provided on the outer side of at least one of the first layer (210), the second layer (240), and the third layer (220).

[0141] Referring to FIG. 25, a seventh weapon barrier layer (296) may be located on the outer side of the protective layer (230). This seventh weapon barrier layer (296) may be connected to the fifth weapon barrier layer (294).

[0142] Referring to FIG. 26, an example is illustrated in which an eighth inorganic barrier layer (297) is provided in a light-emitting device package (203) according to the fourth embodiment described with reference to FIG. 7.

[0143] This eighth weapon barrier layer (297) can be positioned to continuously cover the protective layer (230) and the third layer (220).

[0144] Referring to FIG. 27, a ninth weapon barrier layer (298) may be located outside the protective layer (230). This ninth weapon barrier layer (298) may be located connected between the second layer (241) and the third layer (220).

[0145] Such inorganic barrier layers (291 to 298) can be formed by depositing an inorganic film. If an inorganic film is additionally deposited before forming the third layer (220), it is possible to form an inorganic barrier layer wrapped in an inorganic film without exposing the first layer (210) and the second layer (240).

[0146] In addition, as shown in FIGS. 22, 26, and 27, a structure can be fabricated in which the outer surface of the chip is wrapped with an inorganic film through inorganic film deposition after the individual package separation process is completed.

[0147] The inorganic film formed by the inorganic barrier layer (291 to 298) can be a single layer or a multilayer structure using at least one of SiO2, SiNx, Al2O3, SnOx, TiO2, ZnO2, ZrO2, and MgF2. Additionally, a single or multilayer metal layer such as Al, Au, Sn, Ti, Cu, Pt, Ni, Ag Ti / Al / Ti, or Ni / Ag / Ni may be further added.

[0148] The inorganic barrier layers (291, 293, 294) located between each layer and the inorganic barrier layers (290, 292, 297, 298) located on the sides of the package can be formed of different materials.

[0149] With such inorganic barrier layers (291 to 298), the prevention of moisture penetration into the package can be maximized. In addition, these inorganic barrier layers (291 to 298) can be utilized as a DBR (Distributed Bragg reflector) structure.

[0150] A display device can be implemented by implementing the light-emitting element package (200 to 203) described above as individual pixels on a wiring substrate (not shown).

[0152] The above description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention.

[0153] Accordingly, the embodiments disclosed in this invention are intended to explain, not limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments.

[0154] The scope of protection of the present invention shall be interpreted by the claims below, and all technical ideas within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention. Explanation of the symbols

[0155] 200, 201, 202, 203: Light-emitting device package 210: 1st Floor 220: 3rd Floor 230: Protective Layer 240: Second Layer 250: Driving chip 260: Light emitting part 271, 272, 273, 274: Connecting electrodes 275, 276: Penetrating electrodes 280: Gradient layer 282, 286: Reflection layer 290 ~ 298: Weapon Barrier Layer

Claims

Claim 1 A light-emitting element package characterized by comprising: a first layer having a terminal portion; a second layer having a light-emitting portion located adjacent to the first layer and including light-emitting elements forming a unit subpixel; a third layer located adjacent to the second layer through which light emitted from the light-emitting portion passes; a plurality of connecting electrodes located between the first layer and the second layer and connecting the light-emitting elements to the terminal portion; a protective layer located on the side of at least the second layer; and an inorganic barrier layer provided between at least one of the first layer and the second layer and the protective layer. Claim 2 A light-emitting device package according to claim 1, wherein the protective layer comprises at least one of acrylic, epoxy, silicone, silicone acrylic, silicone epoxy composite, Teflon, and fluorine-based material. Claim 3 A light-emitting device package according to claim 1, characterized in that at least one of the first layer, the second layer, the third layer, and the protective layer comprises fine particles. Claim 4 A light-emitting device package according to claim 3, wherein the fine particles comprise at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, Silica, and PMMA. Claim 5 A light-emitting element package according to claim 1, further comprising a through electrode connecting the connecting electrode and the terminal portion. Claim 6 A light-emitting device package according to claim 1, further comprising a sloped layer located on the side of at least one of the first layer, the second layer, and the third layer. Claim 7 A light-emitting device package according to claim 6, characterized in that a reflective layer is provided on the outer side of the inclined layer. Claim 8 A light-emitting device package according to claim 1, characterized in that the inorganic barrier layer is further provided between the second layer and the third layer. Claim 9 delete Claim 10 A display device comprising a light-emitting element package positioned on a wiring board to define individual pixels, wherein the light-emitting element package comprises: a first layer having a terminal portion; a second layer having a light-emitting portion positioned adjacent to the first layer and including light-emitting elements forming a unit subpixel; a third layer positioned adjacent to the second layer through which light emitted from the light-emitting portion passes; a plurality of connecting electrodes positioned between the first layer and the second layer to connect the light-emitting elements to the terminal portion; a protective layer positioned on the side of at least the second layer; and an inorganic barrier layer positioned between at least one of the first layer and the second layer and the protective layer.

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