Substrate Processing Apparatus

Abstract

The present invention provides a substrate processing device including a seismic isolation unit. By providing a seismic isolation unit between the frame and the process chamber, it is possible to reduce vibrations transmitted to the process chamber.

Description

Technology Field

[0001] The present invention relates to a substrate processing device. Background Technology

[0002] Generally, various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed to manufacture semiconductor devices.

[0003] Generally, in flat panel display device manufacturing or semiconductor manufacturing processes, various processes such as photoresist coating, developing, etching, and ashing are performed to process glass substrates or wafers.

[0004] In each process, the wafer is mounted in a process chamber that provides optimal conditions for the progress of the corresponding process and processed.

[0005] Recently, with the miniaturization and high integration of semiconductor devices, there is a demand for higher precision and complexity in processes, as well as larger wafer diameters. Consequently, multi-chamber semiconductor manufacturing equipment is attracting attention in terms of improving throughput associated with the increase in complex processes and single-wafer production.

[0006] A multi-chamber type semiconductor manufacturing device consists of process equipment and an Equipment Front End Module (EFEM) for loading and unloading wafers into and out of the process equipment, and the process equipment has a configuration including a loading / unloading unit, an index robot, a buffer unit, process chambers, and a substrate transfer robot.

[0007] Each piece of equipment is fitted into a single chamber frame in a slot shape and fastened with bolts to generate strong restraint force.

[0008] At this time, vibrations generated during the process of the equipment fixed to the chamber frame, as well as vibrations from the surrounding environment, are transmitted to each piece of equipment, causing process defects. The problem to be solved

[0009] One objective of the present invention is to provide a substrate processing apparatus and method that suppresses vibration transmission occurring between process chambers.

[0010] The objectives of the present invention are not limited thereto, and other unmentioned objectives will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0011] A substrate processing device according to one embodiment of the present invention may include a frame; a chamber installed in the frame; and a seismic isolation unit provided between the chamber and the frame.

[0012] According to one embodiment, the seismic isolation unit may include a chamber-side seismic isolation member fixed to the chamber; and a frame-side seismic isolation member fixed to the main frame.

[0013] According to one embodiment, the chamber-side seismic isolation member can be fixed to the lower surface of the chamber.

[0014] According to one embodiment, the friction coefficient between the chamber-side seismic isolation member and the frame-side seismic isolation member can be provided to be smaller than the friction coefficient between the chamber and the frame.

[0015] According to one embodiment, the chamber-side seismic isolation member and the frame-side seismic isolation member may be provided as resin material.

[0016] According to one embodiment, the seismic isolation unit may include a plurality of rolling members disposed between the chamber and the frame.

[0017] According to one embodiment, it further includes a support member provided between the seismic isolation unit and the frame; and the rolling member may be provided movably on the upper surface of the support member.

[0018] According to one embodiment, the upper surface of the support member may be provided in a concave shape.

[0019] According to one embodiment, the apparatus comprises: a frame providing a plurality of insertion spaces; a plurality of chambers inserted into different insertion spaces among the plurality of insertion spaces; and a seismic isolation unit installed between at least one of the plurality of chambers and the frame, wherein the plurality of chambers may include a conveying chamber for conveying a substrate or a process chamber for processing a substrate while rotating the substrate.

[0020] According to one embodiment, the plurality of chambers includes the return chamber and the process chamber, and the return chamber is inserted into one of the insertion spaces of the frame, and the process chamber can be inserted into another of the insertion spaces of the frame.

[0021] According to one embodiment, the seismic isolation unit may include a chamber-side seismic isolation member fixed to the chamber; and a frame-side seismic isolation member fixed to the main frame.

[0022] According to one embodiment, the friction coefficient between the chamber-side seismic isolation member and the frame-side seismic isolation member can be provided to be smaller than the friction coefficient between the chamber and the frame.

[0023] According to one embodiment, the seismic isolation unit may include a plurality of rolling members disposed between the chamber and the frame. Effects of the invention

[0024] According to one embodiment of the present invention, a substrate can be processed efficiently.

[0025] In addition, according to one embodiment of the present invention, vibrations transmitted to the chamber can be minimized by removing the constraints between the frame and the chamber. Brief explanation of the drawing

[0026] FIG. 1 is a front view of a substrate processing apparatus according to the present invention. FIG. 2 is a plan view of a substrate processing apparatus according to the present invention. Figure 3 is a perspective view showing the configuration of the process equipment of Figures 1 and 2. Figure 4 is an exploded perspective view of the process equipment of Figure 3. Figure 5 is a cross-sectional view along the line A-A' of Figure 2. FIG. 6 is a front view showing a part of a substrate processing apparatus according to one embodiment of the present invention. FIG. 7 is a front view showing a part of a substrate processing device according to another embodiment of the present invention. FIG. 8 is a front view showing a part of a substrate processing apparatus according to another embodiment of the present invention. FIG. 9 is a front view showing a part of a substrate processing device according to another embodiment of the present invention. FIG. 10 is a front view showing a part of a substrate processing apparatus according to another embodiment of the present invention. FIG. 11 is a perspective view showing a part of a substrate processing apparatus according to another embodiment of the present invention. Specific details for implementing the invention

[0027] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in describing preferred embodiments of the present invention in detail, specific descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions would unnecessarily obscure the essence of the present invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations.

[0028] The term 'comprising' a component means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. Specifically, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0029] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0030] FIG. 1 is a front view of a substrate processing apparatus according to the present invention. FIG. 2 is a plan view of a substrate processing apparatus according to the present invention. FIG. 3 is a perspective view showing the configuration of the process equipment of FIG. 1 and FIG. 2. FIG. 4 is an exploded perspective view of the process equipment of FIG. 3. FIG. 5 is a cross-sectional view along the line A-A' of FIG. 2. FIG. 6 is a front view showing a part of a substrate processing apparatus according to one embodiment of the present invention. FIG. 7 is a front view showing a part of a substrate processing apparatus according to another embodiment of the present invention. FIG. 8 is a front view showing a part of a substrate processing apparatus according to yet another embodiment of the present invention. FIG. 9 is a front view showing a part of a substrate processing apparatus according to yet another embodiment of the present invention. FIG. 10 is a front view showing a part of a substrate processing apparatus according to yet another embodiment of the present invention. FIG. 11 is a perspective view showing a part of a substrate processing apparatus according to yet another embodiment of the present invention.

[0031] Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 11.

[0032] Referring to FIGS. 1 and 2, a substrate processing device (1) according to the present invention is for cleaning a substrate and includes a process facility (10) and a front end module (20) of the facility.

[0033] The process equipment (10) performs a process of cleaning the substrate in a single-wafer manner.

[0034] The equipment front end module (20) is mounted at the front of the process equipment (10) and transports substrates between the container (C) containing the substrates and the process equipment (10). The equipment front end module (20) has a plurality of load ports (22) and a frame (24).

[0035] The load ports (22) are arranged side by side in one direction, and the frame (24) is located between the load ports (22) and the process equipment (10). A container (C) for receiving substrates is placed on the load ports (22) by a transport means (not shown), such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. A sealed container, such as a Front Open Unified Pod (FOUP), may be used for the container (C). A frame robot (not shown) and a door opener (not shown) are installed within the frame (24). The frame robot (not shown) transports substrates between the container (C) placed on the load ports (22) and the process equipment (10), and the door opener (not shown) automatically opens and closes the door of the container (C). And the frame (24) may be provided with a fan filter unit (not shown) that supplies clean air into the frame (24) so ​​that clean air flows downstream within the frame (24).

[0036] The process equipment (10) includes a frame (100), a plurality of process units (200, 300, 400, 500), and a seismic isolation unit (600).

[0037] The frame (100) is a structure installed to form the framework of the process equipment (10) according to the layout of the process equipment (10). The frame (100) may be provided as a structure made of linear structural members, as shown in FIG. 4. The frame (100) may have a base plate (110) formed so that process units (200, 300, 400, 500) are installed.

[0038] Process units (200, 300, 400, 500) are for cleaning a substrate and are installed in a frame (100) according to the layout of the process equipment (10). The process units (200, 300, 400, 500) are divided into a substrate transfer unit (200), a buffer unit (300), cleaning units (400), and a processing liquid distribution unit (500) according to the function of the cleaning process.

[0039] The substrate transfer unit (200) is positioned vertically on the other side of the equipment front end module (20).

[0040] The buffer unit (300) is positioned between the substrate transfer unit (200) and the equipment front end module (20) and provides a space for the substrate loaded into the process equipment (10) and the substrate unloaded from the process equipment (10) to temporarily stay.

[0041] The cleaning units (400: 400a, 400b, 400c, 400d) are arranged parallel along the longitudinal direction on both sides of the substrate transfer unit (200) and perform a process of cleaning the substrate. Between the buffer unit (300) and the cleaning units (400a, 400b, 400c, 400d), and between the cleaning units (400a, 400b, 400c, 400d), the substrate is transferred by the substrate transfer unit (200).

[0042] The processing liquid distribution unit (500) is positioned vertically at the longitudinal end of the substrate transfer unit (200) and distributes the processing liquid to be used for processing the substrate supplied from a processing fluid source (not shown) to each cleaning unit (400).

[0043] The substrate transfer unit (200), buffer unit (300), cleaning units (400), and processing liquid distribution unit (500) may be provided in the form of independent modules. A module refers to a configuration in which the relevant parts are installed within a single independent housing so that each process unit (200, 300, 400, 500) can operate independently in performing the respective functions described above. The substrate transfer unit (200), buffer unit (300), cleaning units (400), and processing liquid distribution unit (500) provided in the form of modules may be detachably installed on a frame (100) according to the layout of the process equipment (10), as illustrated in FIGS. 3 and 4. For convenience, the substrate transfer unit (200) and the buffer unit (300) are not illustrated in FIGS. 3 and 4.

[0044] The cleaning units (400a, 400b, 400c, 400d) are arranged side by side on both sides of the substrate transfer unit (200). For example, as shown in FIG. 3, four cleaning units (400a, 400b, 400c, 400d) may be arranged, two on each side of the substrate transfer unit (200). The cleaning units (400a, 400b, 400c, 400d) have the same configuration, and the cleaning unit (400a) and the cleaning unit (400c), and the cleaning unit (400b) and the cleaning unit (400d) are arranged symmetrically with respect to the substrate transfer unit (200). Hereinafter, one of the cleaning units (400a, 400b, 400c, 400d), cleaning unit (400a), will be described as an example.

[0045] As shown in FIG. 5, the cleaning unit (400a) includes an upper cleaning chamber (420), a lower cleaning chamber (440), and a processing liquid supply member (460), and the upper and lower cleaning chambers (420, 440) and the processing liquid supply member (460) are provided as a single module. The upper and lower cleaning chambers (420, 440) are arranged in an up-and-down direction, and a process of cleaning a substrate in a single-wafer manner is carried out.

[0046] At this time, the substrate transfer unit (200) may be provided in a multilayer structure of a first substrate transfer unit (200a) and a second substrate transfer unit (200b) to correspond to the upper cleaning chamber (420) and the lower cleaning chamber (440), respectively.

[0047] A processing liquid supply member (460) is positioned below the lower cleaning chamber (440). The processing liquid supply member (460) supplies a processing liquid for cleaning the substrate to the upper and lower cleaning chambers (420, 440), and the processing liquid used for the substrate processing is discharged from the upper and lower cleaning chambers (420, 440).

[0048] The upper cleaning chamber (420) includes a substrate support member (422) on which a substrate is placed and which is rotatable, a nozzle assembly (424) that supplies a processing liquid to the substrate placed on the substrate support member (422), and a recovery member (426) disposed around the substrate support member (422). A processing liquid is supplied from the nozzle assembly (424) onto the substrate, and the substrate is cleaned by the processing liquid, and the processing liquid used for cleaning the substrate is recovered through the recovery member (426). During the process, the substrate support member (422) is rotated by a driving unit (423). And, while the process is being carried out in the upper cleaning chamber (420), clean air flows from the top to the bottom by forming a downward airflow through a fan filter unit (428) installed at the top of the upper cleaning chamber (420), and the clean air is exhausted through an exhaust member (not shown).

[0049] The lower cleaning chamber (440) has the same configuration as the upper cleaning chamber (420), and a description thereof is omitted. Here, unexplained drawing reference number 442 in FIG. 5 is a substrate support member, 443 is a driving unit, 444 is a nozzle assembly, 446 is a recovery member, and 448 is a fan filter unit.

[0050] A seismic isolation unit (600) is provided between the frame (100) and the process units (200, 300, 400, 500) installed on the frame (100). The seismic isolation unit (600) minimizes the transmission of vibrations generated during process execution to the process units (200, 300, 400, 500) through the frame (100), which is formed as a single body. In the following description, the seismic isolation unit (600) is described as being provided between the upper cleaning chamber (420) and the frame (100).

[0051] Referring to FIG. 6, the seismic isolation unit (600) includes a chamber-side seismic isolation member (610) fixed to the chamber (420) and a frame-side seismic isolation member (620) fixed to the frame.

[0052] The chamber-side seismic isolation member (610) is fixed to the lower surface of the chamber (420). One side of the chamber-side seismic isolation member (610) is in contact with the lower surface of the chamber (420), and the other side is in contact with the frame-side seismic isolation member (620).

[0053] The frame-side seismic isolation member (620) is fixed to the frame (100) in a manner facing the chamber-side seismic isolation member (610). One side of the frame-side seismic isolation member (620) is in contact with the frame, and the other side is in contact with the chamber-side seismic isolation member (61).

[0054] The chamber-side seismic isolation member (610) and the frame-side seismic isolation member (610) can be fixed to the frame (100) by bolts. The chamber-side seismic isolation member (610) and the frame-side seismic isolation member (620) can be provided with a smooth shape so that the contact surface can minimize friction. The friction coefficient between the chamber-side seismic isolation member (610) and the frame-side seismic isolation member (620) can be provided to be smaller than the friction coefficient between the chamber (420) and the frame (100). The chamber-side seismic isolation member (610) and the frame-side seismic isolation member (620) can be provided with a material having less friction than the chamber (420) and the frame (100). For example, the chamber-side seismic isolation member (610) and the frame-side seismic isolation member (620) can be provided with a resin material.

[0055] In the example described above, one chamber-side seismic isolation member (610) and one frame-side seismic isolation member (620) are provided, but as shown in FIG. 7, the chamber-side seismic isolation member (610) and the frame-side seismic isolation member (620) may each be provided in multiple numbers. The detailed configuration and function of the seismic isolation unit (600) are as described above.

[0056] In the example described above, the seismic isolation unit (600) is described as being located only between the lower surface of the chamber (420) and the frame (100), but as shown in FIG. 8, the seismic isolation unit (600) may be provided in multiple numbers. At least one seismic isolation unit (600) may be provided on each of the upper and lower parts of the chamber (420). The detailed configuration and function of the seismic isolation unit (600) are as described above.

[0057] In the example described above, the seismic isolation unit (600) is shown as being provided in a plate shape. However, as shown in FIG. 9, the seismic isolation unit (600) may be provided as a plurality of rolling members (630). The rolling members (630) may be provided in a roller shape.

[0058] The rolling member (630) minimizes the transmission of vibrations generated during the process to the chamber (420) through the frame (100) formed as a single body. The rolling member (630) may include a rotation axis (632) formed horizontally on the ground, a roller (634) provided on the rotation axis (632), and a support (636) connecting the rotation axis (632) and the chamber (420).

[0059] As illustrated in FIG. 10, the substrate processing device may further include a support member (640) provided between the lower part of the cloud member (630) and the frame (100).

[0060] The support member (640) may be provided with a shape in which the upper surface becomes concave downwards toward the center.

[0061] For example, if the upper surface of the support member (640) is provided in a concave shape, the length of the support (636) provided close to the center can be extended so that the chamber (420) maintains a horizontal position. Since the support member (640) is provided in a concave shape, the chamber (420), which has been moved by vibration, can be easily returned to its original position by the rolling member (630). As another example, the lower part of the chamber (420) can be provided in a shape that is convex downward toward the center.

[0062] Although not shown in the drawing, the cloud member (630) and the support member (640) may be provided in multiple numbers, with at least one provided on each of the upper and lower parts of the chamber (420).

[0063] In the example described above, the rolling member (630) is shown as being provided in a roller shape. However, alternatively, although not shown in the drawing, the rolling member (630) may be provided in a spherical shape.

[0064] When the cloud member (630) is provided in a spherical shape, the substrate processing device may further include a support member (640) provided between the lower part of the cloud member (630) and the frame (100).

[0065] The support member (640) may be provided with a shape in which the upper surface becomes concave downward toward the center. At this time, the lower part of the chamber (420) may be provided with a convex shape corresponding to the support member (640).

[0066] Since the support member (640) is provided in a downwardly concave shape, the chamber (420), whose position has been changed by vibration, can be easily moved back to its initial position by the rolling member (630). Since the rolling member (630) is provided in a spherical shape, it has the effect of easily absorbing horizontal vibrations.

[0067] As described above, the present invention modularizes the substrate transfer unit (200), buffer unit (300), cleaning units (400), and processing liquid distribution unit (500) of the process equipment (10), and installs a seismic isolation unit (600) between the modularized process units (200, 300, 400, 500) and the frame (100) so that the process units (200, 300, 400, 500) are not constrained by the frame (100), thereby having the effect of minimizing vibrations transmitted between the process units (200, 300, 400, 500).

[0068] The above detailed description is illustrative of the present invention. Furthermore, the foregoing describes preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, modifications or alterations are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the disclosed content, and / or the scope of the art or knowledge. The described embodiments describe the best state for implementing the technical concept of the present invention, and various modifications required for specific fields of application and uses of the present invention are possible. Accordingly, the above detailed description of the invention is not intended to limit the present invention to the disclosed embodiments. Additionally, the appended claims should be interpreted as including other embodiments. Explanation of the symbols

[0069] 600: Seismic isolation unit 610: Chamber-side seismic isolation member 620: Frame-side seismic isolation member 630: Rolling member 632 : Rotating shaft 634 : Roller 636 : Support 640 : Base member

Claims

Claim 1 A substrate processing apparatus comprising: a frame providing a plurality of insertion spaces; a plurality of chambers inserted into different insertion spaces among the plurality of insertion spaces; and a seismic isolation unit installed between at least one of the plurality of chambers and the frame, wherein the plurality of chambers include a conveying chamber for conveying a substrate or a process chamber for processing a substrate while rotating the substrate, and the seismic isolation unit comprises a chamber-side seismic isolation member fixed to the lower surface of the chamber; and a frame-side seismic isolation member fixed to the frame, wherein the chamber-side seismic isolation member contacts the chamber and the frame-side seismic isolation member, and the frame-side seismic isolation member contacts the chamber-side seismic isolation member and the frame, and the friction coefficient between the chamber-side seismic isolation member and the frame-side seismic isolation member is provided to be smaller than the friction coefficient between the chamber and the frame. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 A substrate processing apparatus according to claim 1, wherein the plurality of chambers includes the return chamber and the process chamber, the return chamber is inserted into one of the insertion spaces of the frame, and the process chamber is inserted into another of the insertion spaces of the frame. Claim 6 In claim 1, the chamber-side seismic isolation member and the frame-side seismic isolation member are a substrate processing device provided with a resin material. Claim 7 A substrate processing apparatus comprising: a frame providing a plurality of insertion spaces; a plurality of chambers inserted into different insertion spaces among the plurality of insertion spaces; and a seismic isolation unit installed between at least one of the plurality of chambers and the frame, wherein the plurality of chambers include a conveying chamber for conveying a substrate or a process chamber for processing a substrate while rotating the substrate, and the seismic isolation unit includes a plurality of rolling members disposed between the chamber and the frame. Claim 8 A substrate processing device according to claim 7, further comprising a support member provided between the seismic isolation unit and the frame, wherein the rolling member is movably provided on the upper surface of the support member. Claim 9 In claim 8, the support member is a substrate processing device provided with an upper surface that is concave downward. Claim 10 delete Claim 11 delete Claim 12 delete Claim 13 delete

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