Substrate processing apparatus

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus comprises: a chamber; a jig module receiving a substrate; a variable unit positioned on the chamber, receiving one or more of the jig modules receiving the substrate, and variably moving the jig modules within a preset range; and a source providing unit that, based on the variable movability, provides a source for deposition on a preset exposed area of ​​the substrate so as to form a metal conductive layer on the exposed area.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing apparatus. Background Technology

[0002] The substrate of an electronic device enables inter-component connections, power supply, and the transmission and reception of electrical signals through circuit patterns. To ensure the uniform formation of these circuit patterns, it is necessary to form a base metal layer with a uniform thickness. Furthermore, it is necessary to form this metal layer rapidly and uniformly over designated areas on multiple substrates. means of solving the problem

[0003] A substrate processing apparatus according to one embodiment of the present disclosure comprises: a chamber; a jig module in which a substrate is received; a variable unit positioned on the chamber, receiving one or more of the jig modules in which the substrate is received, and variably moving the jig modules within a preset range; and a source providing unit that, based on the variable movability, provides a source for deposition on a preset exposed area of ​​the substrate so as to form a metal conductive layer on the exposed area. Brief explanation of the drawing

[0004] FIG. 1 is a block diagram illustrating the configuration of a substrate processing apparatus according to one embodiment of the present disclosure. Figure 2 is a block diagram illustrating the configuration according to Figure 1 in detail. Figure 3 is a block diagram illustrating the configuration according to Figure 2 in detail. Figure 4 is a drawing illustrating the configuration according to Figure 2. FIG. 5 is a drawing illustrating a first method for forming a film layer of a substrate among the configurations according to FIG. 2. FIG. 6 is a drawing illustrating a second method for forming a film layer of a substrate among the configurations according to FIG. 2. FIG. 7a is a perspective view illustrating the state in which a substrate is seated on a jig module among the configurations according to FIG. 2. FIG. 7b is a perspective view illustrating the state in which a substrate is fastened to a jig module among the configurations according to FIG. 2. FIG. 8 is a drawing illustrating a variable unit among the configurations according to FIG. 2. FIG. 9 is a drawing illustrating the state in which the variable unit is movable among the configurations according to FIG. 8. FIG. 10 is a drawing illustrating the detailed configuration of a variable unit according to FIG. 9. FIG. 11 is a diagram illustrating a method in which a substrate is processed through a variable unit and a source providing unit among the configurations according to FIG. 2. FIGS. 12a to 12c are photographs illustrating a state in which a metal layer is formed on a substrate through the configuration according to FIG. 2. Specific details for implementing the invention

[0005] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0006] The terms and words used in the following description and claims are not limited to their bibliographic meanings and are used merely by the inventors to enable a clear and consistent understanding of the present disclosure. Accordingly, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided merely for illustrative purposes and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0007] Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms may be used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present disclosure, the first component may be named the second component, and similarly, the second component may be named the first component.

[0008] Unless otherwise defined, the terms used in the embodiments of the present disclosure may be interpreted in the sense commonly known to those skilled in the art. Additionally, terms such as 'front end', 'rear end', 'upper part', 'lower part', 'upper part', and 'lower part' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms. Hereinafter, a washing machine (1) with drying function according to one embodiment of the present disclosure will be described in detail with reference to the attached drawings.

[0009] FIG. 1 shows a block diagram relating to the configuration of a substrate processing device (100) according to one embodiment of the present disclosure. FIG. 2 and FIG. 3 show detailed configurations of the substrate processing device (100) according to FIG. 1.

[0010] Referring to FIGS. 1 and 2, a substrate processing device (hereinafter referred to as "device (100)") includes a jig module (110), a variable unit (120), a source providing unit (130), and a chamber (140). The jig module (110) includes a downward jig (111), an upward jig (112), a first side jig (113), and a second side jig (114).

[0011] In addition, the variable unit (120) includes a body part (121), an upper plate part (122), a lower plate part (123), an upper plate mounting part (124), a lower plate mounting part (125), a variable driving part (126), and an interlocking body (127). The source providing unit (130) includes a first source providing part (131) and a second source providing part (132).

[0012] The chamber (140) of the device (100) includes, for example, a first chamber (141), a second chamber (142), and a third chamber (143). A deposition process is performed on a substrate (S) as it passes through the first chamber (141) to the third chamber (143).

[0013] Here, the number of chambers (140) is exemplary and is not limited to the first chamber (141) to the third chamber (143). It goes without saying that the quantity may be reduced or increased when processing the substrate (S).

[0014] FIG. 4 shows the overall configuration of the device (100) according to FIG. 2. Referring to FIG. 3 and FIG. 4, the chamber (140) of the device (100) performs deposition processing on a substrate (S) inside.

[0015] Here, the variable unit (120) of the device (100) is positioned to perform substrate (S) processing on the chamber (140). The variable unit (120) accommodates one or more jig modules (110) in which the substrate (S) is accommodated.

[0016] The variable unit (120) serves to variably move the jig module (110) within a preset range. The source providing unit (130) of the device (100) provides a source for deposition on a preset exposure area (S0) of the substrate (S) based on the variable movement.

[0017] The source providing unit (130) enables a metal conductive layer to be formed on the exposed area (S0). The source providing unit (130) enables deposition on the substrate (S) to be performed based on a sputtering method.

[0018] In addition, the exposed area (S0) of the substrate (S) is exposed on the jig module (110) as at least one of a first area on one side and a second area on the other side opposite the first area.

[0019] The first-1 source providing part (1311) of the first source providing part (131) provides a first source. The first-2 source providing part (1312) of the first source providing part (131) provides a second source different from the first source to the first area where the first source is provided.

[0020] Meanwhile, the first-1 sauce providing unit (1311) to the first-3 sauce providing unit (1313) may each be provided with the first to third sauces under either a predetermined first condition or a second condition.

[0021] In the case of the first condition, the first-third source providing part (1313) of the first source providing part (131) provides a third source different from the second source to the first area where the second source is provided. The first source and the third source include titanium (Ti), etc.

[0022] The second source includes copper (Cu), etc. The first source is formed on the first region with a thickness in the range of about 20 nm to 30 nm. The second source is formed on the first region with a thickness in the range of about 1 µm to 2 µm.

[0023] In addition, the third source is formed on the first region with a thickness ranging from about 50 nm to 80 nm. In the case of the second condition, the first source and the third source include nickel-chromium (NiCr), etc.

[0024] Meanwhile, in the case of the second condition, the second source includes copper (Cu), etc. Here, the first source is formed on the first region with a thickness in the range of about 20 nm to 40 nm. The third source is formed on the first region of the substrate (S) with a thickness in the range of about 50 nm to 80 nm.

[0025] The first-1 driving unit (1311a) of the first-1 source providing unit (1311) provides a predetermined driving force. The first-1 source unit (1311b) of the first-1 source providing unit (1311) is configured to rotate axially in conjunction with the first-1 driving unit (1311a) to provide a first source.

[0026] In addition, the first-1 source section (1311b) sets the direction in which the first source is provided through the first magnet. The first-2 driving section (1312a) of the first-2 source providing section (1312) provides a predetermined driving force.

[0027] The first-2 source section (1312b) of the first-2 source providing section (1312) is configured to be axially rotatable in conjunction with the first-2 driving section (1312a) to provide the second source. The direction of the second source provision of the first-2 source section (1312b) is set through the second magnet.

[0028] The first-third driving unit (1313a) of the first-third source providing unit (1313) provides a predetermined driving force. The first-third source unit (1313b) of the first-third source providing unit (1313) is coupled with the first-third driving unit (1313a) to provide a third source.

[0029] These first-third source sections (1313b) are configured to enable forward and backward movement from the first-third driving section (1313a) toward the substrate (S) on the variable unit (120). In addition to the first-third source providing section (1313), the first-first source providing section (1311) and the first-second source providing section (1312) are also equipped with separate actuators to enable forward and backward movement toward the substrate (S).

[0030] If the first region is defined, for example, as the front surface of the substrate (S), the second region can be the rear surface. Conversely, if the first region is the rear surface, the second region can be the front surface. The source providing unit (130) provides a source to the exposed area (S0) on the substrate (S). The first source providing part (131) of the source providing unit (130) is located on one side of the variable unit (120).

[0031] The first source providing unit (131) provides a source to the first region when the first region of the substrate (S) is exposed to the outside. The second source providing unit (132) of the source providing unit (130) is located on the other side of the variable unit (120), which is opposite to the first source providing unit (131).

[0032] Meanwhile, the second source providing unit (132) provides a source to the second area when the second area of ​​the substrate (S) is exposed to the outside. The body part (121) of the variable unit (120) is provided with a pre-set shape and specifications for receiving and processing the substrate (S).

[0033] The 2-1 source providing section (1321) to the 2-3 source providing section (1323) are provided to correspond to the 1-1 source providing section (1311) to the 1-3 source providing section (1313) with the substrate (S) in between.

[0034] Accordingly, the first source providing unit (131) and the second source providing unit (132) can perform simultaneous deposition processing on the exposed areas (S0) of one side and the other side of the substrate (S).

[0035] The exposed area (S0) of the substrate (S) includes a first exposed area (S1), a second exposed area (S2), and a third exposed area (S3), etc. The first exposed area (S1) is formed on the upper surface of the substrate (S). The second exposed area (S2) is formed on the lower surface of the substrate (S).

[0036] In addition, a third exposed area (S3) of the substrate (S) is formed on a side portion between the upper and lower portions of the substrate (S). The substrate (S) is provided with a film layer (F) to form an exposed area (S0).

[0037] The film layer (F) is provided on the substrate (S) in a first method or a second method. In the first method and the second method, there is a difference in the timing of the formation of the corresponding area (L) corresponding to the exposed area (S0) of the substrate (S) during the attachment of the film.

[0038] FIG. 5 illustrates a first method for forming a film layer (F) of a substrate (S) among the configurations according to FIG. 2. Referring to FIG. 5, in the first method, the film layer (F) is attached to the substrate (S). After the film layer (F) is attached to the substrate (S), a corresponding region (L) of the film layer (F) corresponding to the exposed region (S0) is removed. The exposed region (S0) is formed through this corresponding region (L).

[0039] The first method involves forming an exposed area (S0) on a film layer (F) through an etching process on the substrate (S). Subsequently, UV light irradiation is performed on at least the exposed area (S0) of the substrate (S) to remove residues on the surface.

[0040] Here, the exposed area (S0) of the substrate (S) is provided such that the first exposed area (S1), the second exposed area (S2), and the third exposed area (S3) form a predetermined shape. For example, such a shape may be provided to form a cross-sectional "C" shape.

[0041] FIG. 6 illustrates a second method for forming a film layer (F) of a substrate (S) among the configurations according to FIG. 2. Referring to FIG. 6, in the second method, an exposed area (S0) is formed by attaching a film layer (F), in which a corresponding area (L) has already been formed, to the substrate (S).

[0042] Since the second method can be applied similarly to the first method described, except that the corresponding area (L) is formed, the explanation that overlaps with the first method will be omitted.

[0043] FIGS. 7A and 7B illustrate a substrate (S) and a jig module (110) among the configurations according to FIG. 2. Referring to FIGS. 7A and 7B, the substrate (S) is placed on the lower jig (111) of the jig module (110).

[0044] In addition, the upper jig (112) of the jig module (110) covers the substrate (S) of the lower jig (111) so that the exposed area (S0) is exposed. The lower jig (111) and the upper jig (112) cover at least a portion of the remaining area of ​​the substrate (S), excluding the exposed area (S0).

[0045] Through the combination of the downward jig (111) and the downward jig (111) with respect to the substrate (S), the jig module (110) enables the formation of an exposed area (S0). The substrate (S) is provided with a first film area (F1) adjacent to one side of the exposed area (S0) on both sides.

[0046] Referring to FIGS. 5 and FIGS. 7b, the substrate (S) is provided with a second film region (F2) adjacent to the other side. The first side jig (113) of the jig module (110) is positioned to cover the side (SL1) of the first film region (F1).

[0047] The second side jig (114) of the jig module (110) is positioned to cover the side (SL2) of the second film area (F2) on the substrate (S). FIGS. 8 and 9 illustrate the operation of a variable unit among the configurations according to FIG. 2.

[0048] Referring to FIGS. 8 and 9, the top plate portion (122) of the variable unit (120) is positioned on the body portion (121). The top plate mounting portion (124) of the variable unit (120) is provided to be rotatable in the left and right directions on the top plate portion (122).

[0049] Here, the lower plate portion (123) of this variable unit (120) is positioned on the body portion (121). The lower plate portion (123) is spaced apart from the upper plate portion (122) to form a predetermined spacing (SP) between them.

[0050] The lower plate mounting portion (125) of the variable unit (120) is provided to be rotatable in the left and right directions on the lower plate portion (123). The jig module (110) rotates in the left and right directions on the spacing space (SP). More specifically, the jig module (110) rotates in the left and right directions on the spacing space (SP) via the upper plate mounting portion (124) and the lower plate mounting portion (125). Here, the left and right directions include at least the left and right diagonal directions.

[0051] FIG. 10 illustrates the detailed configuration of the variable unit (120) according to FIG. 9. FIG. 11 illustrates the method in which a substrate (S) is processed through the variable unit (120) and the source providing unit (130) among the configurations according to FIG. 2.

[0052] Referring to FIGS. 10 and 11, when the jig module (110) is moved diagonally to one side by the variable unit (120), the source providing unit (130) first provides a source to the substrate (S) on the jig module (110).

[0053] Subsequently, the jig module (110) moves in the opposite diagonal direction. At this time, the source providing unit (130) provides a source to the substrate (S) a second time. The source provided in the first time is deposited in a first shape, such as an "L" shape or a symmetrical "L" shape, on the exposed area (S0) on the substrate (S), based on a planar or cross-sectional view.

[0054] The source for the second provision is deposited in a second shape symmetrical to the first shape on the exposed area (S0) on the substrate (S). By repeating this process, a metal conductive layer (PT) of uniform thickness is formed on the exposed area (S0).

[0055] In addition, through the processing of the metal conductive layer (PT), it becomes possible to form circuit wiring with a uniform thickness. The part regarding the processing of the metal conductive layer (PT) will be omitted.

[0056] The variable drive unit (126) of the variable unit (120) provides a driving force for rotation in the left and right directions. The interlocking body (127) of the variable unit (120) is provided on the body part (121) as a bar-shaped body.

[0057] The variable unit (120) and the interlocking body (127) are configured to interlock with an object that is either the upper plate mounting part (124) or the lower plate mounting part (125). The interlocking body (127) causes the object to move based on the forward and backward movement driven by the driving force of the variable drive unit (126).

[0058] In addition, the linkage body (127) may be provided, for example, with a first linkage body (1271) and a second linkage body (127) facing the first linkage body (1271). The first linkage body (1271) is mounted at either the front or the rear of the object.

[0059] The second linkage body (127) is mounted on the target body so as to be located on the opposite side of the first linkage body (1271). Here, the upper plate mounting part (124) and the lower plate mounting part (125), which are the target bodies, are each rotatably mounted on the upper plate part (122) or the lower plate part (123).

[0060] In addition, based on the driving force of the variable drive unit (126), longitudinal flow of the first linkage body (1271) and the second linkage body (127) is performed, and the object can rotate.

[0061] FIGS. 12a, 12b, and 12c illustrate a state in which a metal conductive layer (PT) is formed on a substrate (S) through the configuration according to FIG. 2. Referring to FIGS. 12a, 12b, and 12c, it can be seen that each part of the metal conductive layer (PT) for forming a circuit on the substrate (S) is uniformly formed.

[0062] Therefore, the substrate (S) has reliable operating characteristics on an electronic device (e.g., a display device, etc.). Even when multiple substrates (S) are mounted on an electronic device and operated together, efficient space utilization becomes possible.

[0063] Since the formation of a metal conductive layer (PT) on a substrate (S) is performed by simultaneously processing a large number of multiple substrates (S), the workability of processing the substrates (S) can be significantly improved. The circuit pattern wiring path of the substrate can be minimized, thereby enabling an optimized substrate placement on an electronic device (e.g., a display device).

[0064] The problems of the present disclosure are not limited to those mentioned herein, and other problems not mentioned will be clearly understood by those skilled in the art from the description below. Although the present disclosure has been illustrated and described with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents. Explanation of the symbols

[0065] S: Substrate 123: Bottom plate 110: Jig module 124: Top plate mounting part 111: Downward support 125: Downward mounting part 112: Upward buffer 126: Variable drive unit 113: First side jig 127: Interlocking body (127) 114: Second side jig 130: Source providing unit 120: Variable unit 131: 1st source providing unit 121: Body part 132: Second sauce providing part 122: Top plate 140: Chamber

Claims

Claim 1 A substrate processing device comprising: a chamber; a jig module receiving a substrate; a variable unit inserted into the chamber, receiving one or more of the jig modules, and variablely moving the jig modules within a preset range; and a source providing unit located on the chamber, providing a source for deposition on a preset exposed area of ​​the substrate based on the variable movement, thereby forming a metal conductive layer on the exposed area, wherein the variable unit comprises a body portion, an upper plate portion located on the body portion, an upper plate mounting portion rotatably mounted in the left-right direction on the upper plate portion, a lower plate portion located on the body portion and spaced apart from the upper plate portion to form a spaced-apart space, and a lower plate mounting portion rotatably mounted in the left-right direction on the lower plate portion, and wherein the jig module rotates in the left-right direction on the spaced-apart space via the upper plate mounting portion and the lower plate mounting portion. Claim 2 In claim 1, the exposed area of ​​the substrate is such that at least one of a first area on the jig module and a second area on the opposite side of the first area is exposed, and the source providing unit is a substrate processing device that provides a source to the exposed area. Claim 3 A substrate processing device according to claim 2, wherein the source providing unit comprises a first source providing portion located at one side of the variable unit, and the first source providing portion provides a source to the first portion when the first portion of the substrate is exposed to the outside. Claim 4 A substrate processing device according to claim 3, wherein the source providing unit comprises a second source providing unit located on the other side of the variable unit opposite to the first source providing unit, and the second source providing unit provides a source to the second region when the second region of the substrate is exposed to the outside. Claim 5 delete Claim 6 A substrate processing apparatus according to claim 1, wherein the variable unit further comprises a variable driving part that provides driving force, and a linking part that is provided on the body part as a bar-shaped body to be linked with an object which is either the upper plate mounting part or the lower plate mounting part, and moves the object in a left-right diagonal direction based on the forward-and-backward movement caused by the driving force of the variable driving part. Claim 7 A substrate processing apparatus according to claim 1, wherein the exposed area of ​​the substrate comprises a first exposed area formed on an upper surface, a second exposed area formed on a lower surface, and a third exposed area formed on a side surface between the upper surface and the lower surface, wherein the substrate is provided with a film layer for forming the exposed area, and the film layer is provided in one of the following ways: a first method in which the exposed area is formed by removing a corresponding area of ​​the film layer corresponding to the exposed area after being attached to the substrate, and a second method in which the exposed area is formed by attaching the film layer having a pre-formed corresponding area to the substrate. Claim 8 In claim 7, the substrate is a substrate processing apparatus in which, as the first method, the exposed area is formed by etching the film layer, and at least the exposed area is subjected to UV light irradiation treatment to remove residues on the substrate. Claim 9 The jig module of claim 1 comprises a lower jig on which the substrate is placed and an upper jig placed on the lower jig to cover the substrate so as to expose the exposed area, and the jig module is a substrate processing device in which the lower jig and the upper jig cover at least a portion of the remaining area excluding the exposed area of ​​the substrate to form the exposed area. Claim 10 A substrate processing apparatus according to claim 9, wherein the substrate is provided with a first film area adjacent to one side of the exposure area and a second film area adjacent to the other side on both sides, and the jig module further comprises a first side jig positioned to cover the side of the first film area and a second side jig positioned to cover the side of the second film area.

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