Method for manufacturing laminated boards and wiring boards

Abstract

A laminate according to the present disclosure comprises a copper layer with a thickness of 5 μm or less and a resin layer provided on the surface of the copper layer, and after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours, the absorption rate of the resin layer is 1% or less. A method for manufacturing a wiring board according to the present disclosure comprises a process of preparing a laminate having a copper layer with a thickness of 5 μm or less, a resin layer, and a support substrate in this order, and after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours, the absorption rate of the resin layer is 1% or less; a process of forming a seed layer on the surface of the copper layer by electroless copper plating; a process of forming a resist pattern on the surface of the seed layer having a groove that reaches to the surface of the seed layer; and a process of filling the groove with a conductive material containing copper by electrolytic copper plating.

Description

Technology Field

[0001] The present disclosure relates to a laminate having a copper layer with a thickness of 5 μm or less and a method for manufacturing a wiring board using the same. Background Technology

[0002] Recently, technological innovations such as the IoT (Internet of Things) integration of electronics-related products and AI are underway. For their widespread adoption, 5G (the 5th generation mobile communication system), which enables high speed, large capacity, low latency, and multiple connections, is indispensable. In the field of 5G, it is necessary to use higher frequency bands than the electrical signals used in 4G (the 4th generation mobile communication system). However, high-frequency electrical signals have a characteristic of significant attenuation (transmission loss), so circuit boards for high frequencies are required to suppress transmission loss to a low level.

[0003] Patent Document 1 discloses an invention relating to a roughened copper foil, a copper-clad laminate, and a printed circuit board. According to Patent Document 1, the roughened copper foil described herein is capable of significantly improving the heat peel strength against a low dielectric constant thermoplastic resin. Prior art literature

[0004] Patent Document 1: Japanese Published Patent Application No. 2019-218602 The problem to be solved

[0005] However, according to the inventors' review, as the copper foil for forming fine wiring becomes thinner, oxidation of the copper foil surface tends to cause a decrease in the reliability of the wiring board. The present disclosure provides a laminate useful for improving the reliability of a wiring board and a method for manufacturing a wiring board using the same. means of solving the problem

[0006] One aspect of the present disclosure relates to a laminate. The laminate comprises a copper layer with a thickness of 5 μm or less and a resin layer provided on the surface of the copper layer, and after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours, the absorption rate of the resin layer is 1% or less. Hereinafter, "after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours" is referred to as "after a high-accelerated life test" depending on the case. Additionally, "high-accelerated life test" is referred to as HAST (Highly Accelerated Stress Test) depending on the case.

[0007] Since the absorption rate of the resin layer after an accelerated life test is 1% or less, the oxidation (formation of rust) of the copper layer caused by moisture contained in the resin layer can be suppressed. The fine wiring of the wiring board is formed through a process of processing this copper layer. Since the formation of rust in the copper layer is suppressed, the fine wiring can maintain its required performance for a sufficiently long period.

[0008] In order to further improve the reliability of a wiring board having fine wiring, it is desirable that the 90° peel strength of the interface between the copper layer and the resin layer satisfy the following conditions.

[0009] · The 90° peel strength of the interface between the copper layer and the resin layer is 0.4 N / mm or higher.

[0010] After the high-accelerated life test, the 90° peel strength of the interface between the copper layer and the resin layer is 0.25 N / mm or higher.

[0011] · The rate of change in 90° peel strength before and after the high-altitude accelerated life test is -30 to 0%.

[0012] The above laminate may further comprise an anti-corrosion layer between the resin layer and the copper layer. In a process for manufacturing a wiring board, the anti-corrosion layer inhibits the oxidation of the copper layer and the fine wiring formed by processing it.

[0013] One aspect of the present disclosure relates to a method for manufacturing a wiring board. The manufacturing method comprises the following steps.

[0014] A process for preparing a laminated board in which a copper layer with a thickness of 5 μm or less, a resin layer, and a support substrate are arranged in this order, and after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours, the absorption rate of the resin layer is 1% or less.

[0015] · A process of forming a seed layer on the surface of the copper layer by electroless copper plating.

[0016] A process of forming a resist pattern having a groove extending to the surface of the seed layer on the surface of the seed layer.

[0017] · A process of filling the above groove with a conductive material containing copper by electrolytic copper plating.

[0018] The method for manufacturing a wiring board according to the present disclosure may manufacture a multilayer wiring board having a bias hole and a conductive material filled therein. The method for manufacturing the wiring board comprises the following steps.

[0019] A process for preparing a laminated board in which a copper layer with a thickness of 5 μm or less, a resin layer, and a support substrate are arranged in this order, and after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours, the absorption rate of the resin layer is 1% or less.

[0020] · A process of forming a first opening that penetrates the copper layer and the resin layer and reaches the surface of the supporting substrate.

[0021] · A process of forming a seed layer by electroless copper plating on the surface of the copper layer and on the side of the first opening.

[0022] · A process of forming a resist pattern having a second opening communicating with a first opening on the surface of a seed layer.

[0023] · A process of filling the first opening and the second opening with a conductive material containing copper by electrolytic copper plating. Effects of the invention

[0024] According to the present disclosure, a laminate useful for manufacturing a wiring board of excellent reliability and a method for manufacturing a wiring board using the same are provided. Brief explanation of the drawing

[0025] FIG. 1 is a cross-sectional view schematically illustrating one embodiment of a laminated plate according to the present disclosure. Figures 2(a) to 2(c) are cross-sectional views schematically illustrating the manufacturing process of a wiring board. Figures 3(a) to 3(c) are cross-sectional views schematically illustrating the manufacturing process of a wiring board. Figures 4(a) to 4(c) are cross-sectional views schematically illustrating the manufacturing process of a wiring board. FIG. 5 is a cross-sectional view schematically illustrating another embodiment of a laminated plate according to the present disclosure. Specific details for implementing the invention

[0026] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the following description, identical or substantial parts are denoted by the same reference numerals, and redundant descriptions are omitted. Furthermore, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings unless otherwise specifically stated. The dimensional ratios in the drawings are not limited to the ratios shown.

[0027] Where terms such as "left," "right," "front," "back," "top," "bottom," "upward," and "downward" are used in the description and claims of this specification, they are intended for illustrative purposes and do not necessarily imply that these are permanent relative positions. Furthermore, the term "layer" includes not only the structure of a shape formed on the entire surface when viewed in a planar view, but also the structure of a shape formed on a part thereof. "A or B" may include either A or B, or both.

[0028] In this specification, the term "process" includes not only independent processes but also processes that cannot be clearly distinguished from other processes, provided that the intended function of such process is achieved. Additionally, numerical ranges indicated by "~" represent a range that includes the values ​​listed before and after "~" as the minimum and maximum values, respectively.

[0029] In this specification, the content of each component in the composition refers to the total amount of said multiple substances present in the composition, unless specifically explained otherwise, when multiple substances corresponding to each component exist in the composition. Also, unless specifically explained otherwise, the exemplary materials may be used alone or in combination of two or more types. Furthermore, regarding numerical ranges described stepwise in this specification, the upper or lower limit of a numerical range in a given step may be substituted with the upper or lower limit of a numerical range in another step. Also, regarding numerical ranges described in this specification, the upper or lower limit of said numerical range may be substituted with the values ​​shown in the examples.

[0030] [Laminated]

[0031] FIG. 1 is a cross-sectional view schematically showing a laminate according to the present embodiment. The laminate (5) shown in this figure comprises a copper layer (1) with a thickness of 5 μm or less and a resin layer (3) provided on the surface of the copper layer (1). The laminate (10) is used to manufacture a wiring board for high frequency of 1 to 50 GHz (more preferably 10 to 50 GHz).

[0032] (Copper layer)

[0033] As described above, the thickness of the copper layer (1) is 5 μm or less, and may be 3 μm or less. Since the thickness of the copper layer (1) is 5 μm or less, the etching time for forming fine wiring after the formation of the conductive part (9a) can be short, and the amount of etching can also be suppressed (see FIG. 3 (c) and FIG. 4 (a)). As for the copper layer (1) with a thickness of 5 μm or less, for example, copper foil can be used. The lower limit of the thickness of the copper foil is, for example, 1.5 μm from the perspective of handling. Copper foil of such thickness is available on the market in a state laminated to a copper foil called a carrier through a release layer. For example, the Micro Thin (trademark) manufactured by Mitsui Kinzoku Kogyo Co., Ltd. is composed of a copper foil with a thickness of 1.5 to 5 μm, a release layer, and a copper foil (carrier) with a thickness of 18 μm.

[0034] The copper layer (1) may be formed by electroless plating. The thickness range of the copper layer (1) that is easy to manufacture by electroless plating is, for example, 50 to 500 nm. By undergoing the following process, the copper layer (1) can be formed by electroless plating. First, the surface on which the copper layer (1) is to be formed is cleaned using an acidic cleaner (for example, MCD (product name) manufactured by Uemura Kogyo Co., Ltd.). Next, the surface is acid-cleaned with an aqueous sulfuric acid solution at 25°C. The surface is immersed in a pre-dip solution (for example, MDP (product name) manufactured by Uemura Kogyo Co., Ltd.). Next, the surface is immersed in an activator solution (MAT manufactured by Uemura Kogyo Co., Ltd.). Next, a palladium catalyst is attached by immersing the surface in an activator solution (MAT manufactured by Uemura Kogyo Co., Ltd.). Next, the palladium catalyst is reduced using a reducer solution (for example, MAB (product name) manufactured by Uemura Kogyo Co., Ltd.). Next, an accelerator solution (e.g., MEL (product name) manufactured by Uemura Kogyo Co., Ltd.) is used to impart activity to the palladium catalyst. Subsequently, copper is deposited on the surface using an electroless copper plating solution (e.g., PEAV2 (product name) manufactured by Uemura Kogyo Co., Ltd.).

[0035] The electroless copper plating layer formed as described above may be used as a seed layer, and a copper layer may be formed on the surface of the electroless copper plating layer by electroplating. Electroless plating and electroplating may be used in combination to form, for example, a copper layer (1) with a thickness of 1 to 5 μm.

[0036] (Resin layer)

[0037] In this embodiment, the resin layer (3) is provided in contact with the surface of the copper layer (1). The resin layer (3) has an absorption rate of 1% or less after an accelerated life test (after being placed for 200 hours in an environment of 130°C and 85% relative humidity, hereinafter simply referred to as "after HAST"). By having an absorption rate of 1% or less of the resin layer (3) after HAST, oxidation (the occurrence of rust) of the copper layer (1) due to moisture contained in the resin layer (3) can be suppressed. From the perspective of further suppressing oxidation of the copper layer (1), the absorption rate of the resin layer (3) after HAST is preferably 0.5% or less, and more preferably 0.2% or less. In addition, the lower limit of this absorption rate is, for example, 0.2%.

[0038] In order to further improve the reliability of a wiring substrate having fine wiring, the material constituting the resin layer (3) preferably satisfies the following conditions for the 90° peel strength at the interface between the copper layer (1) and the resin layer (3). The 90° peel strength is measured on a sample made by cutting the laminated plate (10) into a predetermined size.

[0039] · The 90° peel strength of the interface between the copper layer (1) and the resin layer (3) is 0.4 N / mm or more (e.g., 0.5 to 1.2 N / mm).

[0040] · After HAST, the 90° peel strength of the interface between the copper layer (1) and the resin layer (3) is 0.25 N / mm or more (e.g., 0.4 to 1.2 N / mm).

[0041] · The rate of change in 90° peel strength before and after HAST is -30 to 0% (more preferably -10 to 0%).

[0042] The adhesion strength (90° peel strength) of the interface between the copper layer (1) and the resin layer (3) can be improved, for example, by harmonizing the surface of the copper layer (1) (the side in contact with the resin layer (3)) to the extent that it does not impair high-frequency transmission performance. For this treatment, for example, an organic acid-based micro-etching agent (manufactured by MEK Co., Ltd.) may be used. Instead of harmonizing treatment with an agent, the surface of the copper layer (1) (the side in contact with the resin layer (3)) may be appropriately harmonized by irradiating plasma using, for example, oxygen, argon, or nitrogen as a gas species, or by irradiating ultraviolet rays.

[0043] The resin layer (3) is preferably satisfied with the following conditions in order to suppress transmission loss of the wiring board for high frequency.

[0044] · The dielectric constant of the resin layer (3) at 10 GHz is 4.5 or less (more preferably 3.5 to 2.5).

[0045] · The dielectric tangent of the resin layer (3) at 10 GHz is 0.05 or less (more preferably 0.04 to 0.03).

[0046] The resin layer (3) is mainly composed of a resin composition, and may, for example, be composed of a resin composition and a glass cloth impregnated with the resin composition. The resin composition may, for example, be thermosetting, thermoplastic, or photocurable. From the perspective of reliability of the wiring board, it is preferable that the resin composition include a thermosetting resin composition. From the perspective of heat resistance, the resin layer (3) may contain a heat-resistant resin (for example, epoxy resin).

[0047] When the resin layer (3) is a thermosetting resin composition, it is preferable that the resin layer (3) contains silica filler. Based on the total mass of the resin included in the thermosetting resin composition, the content of silica filler is, for example, 65 mass% or less, and may be 65 to 53 mass%. Based on the total volume of solids included in the thermosetting resin composition, the content of silica filler is, for example, 85 volume% or less, and may be 60 to 80 volume%. When the content of silica filler is 80 volume% or less, compared to when it exceeds 80 volume%, the sidewall of the beam after laser beam processing becomes smoother, and the reliability of the beam connection tends to improve; on the other hand, when it is 60 volume% or more, compared to when it is less than 60 volume%, the bending of the wiring board tends to be suppressed.

[0048] As the resin layer (3), a prepreg available on the market may be used. According to the inventors' evaluation, for example, prepregs E-705G, E-770G, HS-200 and LW-910G manufactured by Showa Denko Materials Co., Ltd. can all be used as the resin layer (3). These prepregs are in a semi-cured state (B-stage) and become a cured state (C-stage) after undergoing heat treatment.

[0049] [Method for manufacturing laminated boards]

[0050] The laminated plate (5) is manufactured, for example, through the following process.

[0051] · A process for preparing a copper layer (1) laminated on a carrier with a peeling layer interposed therebetween.

[0052] · A process for preparing a resin layer (3) (e.g., prepreg).

[0053] · A process of attaching a copper layer (1) to the surface of a resin layer (3) and then peeling off the carrier.

[0054] [Method for manufacturing a wiring board]

[0055] Referring to the drawings, a method for manufacturing a wiring board according to the present embodiment will be described. The wiring board (20) shown in Fig. 4 (c) is manufactured through the following process.

[0056] (A) A process of preparing a laminate (10) having a copper layer (1), a resin layer (3), and a support substrate (7) in this order (see (a) of FIG. 2). This laminate (10) may be manufactured by first preparing a laminate (5) having a copper layer (1) and a resin layer (3) and then laminating a support substrate (7) onto the laminate (5), or by first preparing a laminate having a resin layer (3) and a support substrate (7) and then laminating a copper layer (1) onto the laminate. As for the support substrate (7), for example, a copper-clad laminate may be used and has a copper layer (7a) on its surface.

[0057] (B) A process of forming an opening (H1) (first opening) that penetrates the copper layer (1) and the resin layer (3) and reaches the surface of the support substrate (7) (copper layer (7a)) (see (b) in FIG. 2). The opening (H1) can be formed, for example, by laser irradiation. If residue is found in the opening (H1), desmearing treatment can be performed after process (B).

[0058] (C) A process of forming a seed layer (8) by electroless copper plating on the surface of the copper layer (1) and on the side of the opening (H1) (see (c) of FIG. 2). The seed layer (8) is a feed layer for performing electrolytic plating in the following process (E).

[0059] (D) A process of forming a resist pattern (11) on the surface of a seed layer (8), having an opening (H2) (second opening) communicating with an opening (H1) and a plurality of grooves (G) reaching to the surface of the seed layer (8) (see FIG. 3 (a)).

[0060] (E) A process of filling the opening (H2) and the groove (G) with a conductive material containing copper by electrolytic copper plating (see (b) of FIG. 3).

[0061] A conductive material containing copper is filled into the groove (G) by electrolytic copper plating, thereby forming a conductive portion (9a) that constitutes part of the fine wiring. A conductive portion (9b) (part of the interlayer conductive portion) is formed by filling the openings (H1, H2) by electrolytic copper plating with a conductive material containing copper.

[0062] (F) A process for peeling off the resist pattern (11) (see (c) in FIG. 3).

[0063] (G) A process of removing the seed layer (8) exposed by peeling off the resist pattern (11), and removing the copper layer (1) exposed by removing the seed layer (8) (see (a) of FIG. 4).

[0064] Fine wiring is formed by removing unnecessary parts of the seed layer (8) and the copper layer (1), respectively, by etching, for example, through the conductive part (9a), the remaining part (8a) of the seed layer (8), and the remaining part (1a) of the copper layer (1).

[0065] (H) A process of forming a resin layer (12) to cover the surface of the copper layer (7a), fine wiring, and conductive part (9b) (see (b) of FIG. 4).

[0066] (I) A process of forming an opening (H3) (third opening) that extends to the conductive portion (9b) in the resin layer (12) (see (c) of FIG. 4).

[0067] Bias holes are formed by the openings (H1, H2, H3). A wiring board is completed by filling the bias holes with conductive material and performing surface finishing processes.

[0068] Although embodiments of the present disclosure have been described in detail above, the present invention is not limited to the above embodiments. For example, in the above embodiments, a copper layer (1) and a resin layer (3) are in direct contact as a laminated plate (5), but a rust-preventing layer may be provided between these layers. In the laminated plate (15) shown in FIG. 5, a rust-preventing layer (2) is formed at the interface between the copper layer (1) and the resin layer (3). The rust-preventing layer (2) can be formed, for example, using a triazole compound or a silane coupling agent (see paragraph

[0028] of Patent Document 1).

[0069] Examples

[0070] The present disclosure is described below based on examples. Furthermore, the present invention is not limited to the following examples.

[0071] In order to manufacture a laminate having an ultra-thin copper foil layer on the outermost layer, the following materials were prepared.

[0072] · Micro new copper foil (manufactured by Mitsui Kinzoku Kogyo Co., Ltd.)

[0073] Thickness of ultra-thin copper foil: 3μm

[0074] Carrier layer thickness: 18μm

[0075] · Double-sided copper-clad laminate: MCL-E705G (Manufactured by Showa Denko Materials Co., Ltd.)

[0076] Thickness of copper layer: 12μm

[0077] Thickness of resin layer: 25μm

[0078] Thickness of copper layer: 12μm

[0079] · The four types of prepregs shown in Table 1 (all manufactured by Showa Denko Materials Co., Ltd.)

[0080] [Table 1]

[0081]

[0082] In the table, the amount of silica filler (mass%) is a value based on the total mass of the resin included in the thermosetting resin composition.

[0083] The amount of silica filler listed in Table 1 is the amount (volume part) when the total volume of solids included in the thermosetting resin composition is 100 volume parts. The absorption rate listed in Table 1 is a value calculated from the mass before and after placing the prepreg in an environment of 130°C and 85% relative humidity for 200 hours (before and after HAST). In addition, prior to performing HAST, the prepreg was placed in an environment of 130°C and 85% relative humidity for 500 hours.

[0084] Absorption Rate (%) = 100 × [(Mass after HAST) - (Mass before HAST)] / (Mass before HAST)

[0085] The "specific permittivity" and "dielectric tangent" listed in Table 1 are values ​​measured using a network analyzer (manufactured by Keysight Technologies).

[0086] <Example 1>

[0087] A sheet of prepreg E-705G was superimposed on the surface of the above-described double-sided copper-clad laminate (MCL-E705G). Subsequently, the prepreg and the micro-thin copper foil were laminated so that the surface of the prepreg and the surface of the ultra-thin copper foil were in contact. The laminate obtained in this manner was pressed while sandwiched between the end plates. The pressing conditions were set to temperature: 200°C, pressure: 3.0 MPa, and time: 70 minutes. Afterward, only the carrier layer of the micro-thin copper foil was peeled off, and the laminate according to Example 1 having an ultra-thin copper foil (thickness: 3 μm) on the outermost layer was obtained.

[0088] <Examples 2-4>

[0089] The laminated plates for Examples 2 to 4 were each manufactured in the same manner as in Example 1, except that E-770G, HS-200, or LW-910G was used as the prepreg instead of E-705G.

[0090] <Example 5>

[0091] The surface of the ultra-thin copper foil of the above-mentioned micro-new copper foil was treated with an organic acid-based micro-etching agent (CZ-8401, manufactured by MEK Corporation). The treatment conditions were as follows.

[0092] · Temperature: 25℃

[0093] · Time: 30 seconds

[0094] Meanwhile, a sheet of prepreg E-705G was superimposed on the surface of the above-mentioned double-sided copper-clad laminate (MCL-E705G). Subsequently, the prepreg and the micro-thin copper foil were laminated so that the surface of the prepreg and the surface to be treated of the ultra-thin copper foil were in contact. The laminate obtained in this manner was placed between the end plates and subjected to press processing. The press conditions were set to temperature: 200℃, pressure: 3.0MPa, and time: 70 minutes. Afterward, only the carrier layer of the micro-thin copper foil was peeled off, and the laminate according to Example 5 having an ultra-thin copper foil (thickness: 3μm) on the outermost layer was obtained.

[0095] <Examples 6~8>

[0096] Laminated plates according to Examples 6 to 8 were each prepared in the same manner as Examples 2 to 4, except that the surface of the ultra-thin copper foil of the micro new copper foil was treated with an organic acid-based micro-etching agent (CZ-8401, manufactured by MEK Co., Ltd.) in the same manner as Example 4.

[0097] Adhesion was evaluated for the laminated plates according to the examples as follows. Specifically, using a bench peel tester (manufactured by Shimadzu Seisakusho Co., Ltd., EZ-FX), the peel strength at the interface between the ultra-thin copper foil and the prepreg was measured under conditions of a peel width of 10 mm, a peel angle of 90°, and a peel speed of 10 mm / min. Adhesion was evaluated for the laminated plates before and after the following moisture-absorbing heat treatment. The results are shown in Tables 2 and 3.

[0098] (Moisture absorption heat treatment)

[0099] A laminate was placed in an advanced accelerated life test apparatus (EHS-222MD, manufactured by Espect Co., Ltd.) and treated for 100 hours at a temperature of 130°C and a relative humidity of 85%. The rate of change in adhesion before and after HAST was calculated using the following formula.

[0100] Rate of change in 90° peel strength (%) = 100 × [(Peel strength after HAST) - (Peel strength before HAST)] / (Peel strength before HAST)

[0101] [Table 2]

[0102]

[0103] [Table 3]

[0104]

[0105] Industrial applicability

[0106] According to the present disclosure, a laminate useful for manufacturing a wiring board of excellent reliability and a method for manufacturing a wiring board using the same are provided. Explanation of the symbols

[0107] 1… copper layer 1a… Remnants of the copper layer 2… audience floor 3, 12… resin layer 5, 10, 15… laminated board 7… support substrate 7a… copper layer 8… Seed layer 8a… Remnants of the seed layer 9a, 9b… Challenge section 11… Resist pattern 20… wiring board G… Homebo H1… opening (first opening) H2… opening (second opening) H3… opening

Claims

Claim 1 A laminated plate having a copper layer with a thickness of 5 μm or less and a resin layer provided on the surface of the copper layer, wherein the surface of the copper layer in contact with the resin layer is treated with a flaking process, and there is no adhesive layer between the copper layer and the resin layer, and the absorption rate of the resin layer is 1% or less after being placed for 200 hours in an environment of 130°C and 85% relative humidity. Claim 2 A laminate according to claim 1, wherein the 90° peel strength of the interface between the copper layer and the resin layer is 0.4 N / mm or more. Claim 3 A laminate according to claim 1 or claim 2, wherein, after being placed in an environment of 130°C and 85% relative humidity for 200 hours, the 90° peel strength of the interface between the copper layer and the resin layer is 0.25 N / mm or more. Claim 4 A laminate according to claim 1 or claim 2, wherein the rate of change in 90° peel strength before and after an accelerated life test in which a sample of the laminate is placed in an environment of 130°C and 85% relative humidity for 200 hours is -30 to 0%. Claim 5 A laminate according to claim 1 or claim 2, further comprising a rust-preventing layer between the resin layer and the copper layer. Claim 6 A laminate according to claim 1 or claim 2, wherein the dielectric constant of the resin layer at 10 GHz is 4.5 or less. Claim 7 A laminate according to claim 1 or claim 2, wherein the dielectric tangent of the resin layer at 10 GHz is 0.05 or less. Claim 8 A laminate according to claim 1 or claim 2, wherein the resin layer comprises a thermosetting resin composition. Claim 9 A laminate according to claim 8, wherein the resin layer comprises a glass cloth impregnated with the thermosetting resin composition. Claim 10 A laminate according to claim 8, wherein the thermosetting resin composition comprises a silica filler, and the content of the silica filler is 65 mass% or less based on the total mass of the resins included in the thermosetting resin composition. Claim 11 A method for manufacturing a wiring board comprising: a process of preparing a laminate having a copper layer with a thickness of 5 μm or less, a resin layer, and a support substrate in this order; a process of forming a seed layer on the surface of the copper layer by electroless copper plating; a process of forming a resist pattern on the surface of the seed layer having a groove extending to the surface of the seed layer; and a process of filling the groove with a conductive material containing copper by electrolytic copper plating, wherein the surface of the copper layer in contact with the resin layer is treated with a patina, and there is no adhesive layer between the copper layer and the resin layer, and the absorption rate of the resin layer is 1% or less after the laminate is placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours. Claim 12 A method for manufacturing a wiring board comprising: a process of preparing a laminate having a copper layer with a thickness of 5 μm or less, a resin layer, and a support substrate in this order; a process of forming a first opening that penetrates the copper layer and the resin layer and reaches the surface of the support substrate; a process of forming a seed layer by electroless copper plating on the surface of the copper layer and the side of the first opening; a process of forming a resist pattern having a second opening communicating with the first opening on the surface of the seed layer; and a process of filling the first opening and the second opening with a conductive material containing copper by electrolytic copper plating, wherein the surface of the copper layer in contact with the resin layer is treated with a tack treatment, and there is no adhesive layer between the copper layer and the resin layer, and the laminate has an absorption rate of 1% or less of the resin layer after being placed in an environment of 130°C and 85% relative humidity for 200 hours.

Images