Copper plating solution adding device for PCB copper plating process

Abstract

The utility model discloses a PCB copper deposition process copper deposition liquid adding device relates to PCB copper deposition technical field, including copper deposition pool, one side fixed mounting of copper deposition pool has the base, the upper surface fixed mounting of base has the support, the top fixed mounting of support has the liquid storage bucket, the fixed mounting of liquid storage bucket on has the supporting block, the fixed mounting of supporting block on has the rotating rod, be provided with the apron on the liquid storage bucket, the fixed mounting of apron on has the swivel, swivel rotation installs on the rotating rod, the one side fixed mounting of supporting block is close to swivel has the torsional spring, the other end fixed mounting on swivel of torsional spring, be provided with valve mechanism on the liquid storage bucket, the fixed mounting of liquid outlet pipe in the liquid storage bucket, in the utility model, through the setting of supporting block, rotating rod, swivel, first powerful magnetic block and valve mechanism etc.

Description

Technical Field

[0001] This utility model relates to the field of PCB copper plating technology, and in particular to a copper plating solution addition device for the PCB copper plating process. Background Technology

[0002] PCB copper plating, also known as chemical copper plating or plated through-hole (PTH), is a key process in PCB manufacturing. Its main purpose is to deposit a thin layer of chemical copper on the non-conductive hole wall substrate through a chemical method, which serves as the base for subsequent electroplating of copper. During the copper plating process, the copper ions in the copper plating tank will continuously decrease. In order to replenish the copper ions in the copper plating tank, new copper plating solution needs to be added continuously at regular intervals.

[0003] The current method of replenishing copper plating solution generally relies on workers adding copper plating solution to the copper plating tank at regular intervals and in fixed quantities. However, since frequent additions are required, workers usually need to stay by the copper plating tank at all times. This method is not only time-consuming and labor-intensive, but also increases labor costs. Furthermore, if the container for replenishing copper plating solution is not easy to open and close, it may affect the replenishment efficiency. Therefore, a copper plating solution addition device is needed for the PCB copper plating process. Utility Model Content

[0004] The purpose of this invention is to provide a device for adding copper plating solution in the PCB copper plating process, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a copper plating solution addition device for PCB copper plating process, comprising a copper plating tank, a base fixedly installed on one side of the copper plating tank, a bracket fixedly installed on the upper surface of the base, a storage tank fixedly installed on the top of the bracket, a support block fixedly installed on the storage tank, a rotating rod fixedly installed on the support block, a cover plate provided on the storage tank, a rotating block fixedly installed on the cover plate, the rotating block being rotatably mounted on the rotating rod, a torsion spring fixedly installed on the side of the support block near the rotating block, the other end of the torsion spring being fixedly installed on the rotating block, a valve mechanism provided on the storage tank, and an outlet pipe fixedly installed inside the storage tank.

[0006] Preferably, a first strong magnetic block is fixedly installed on the liquid storage tank, a second strong magnetic block is fixedly installed on the cover plate, the second strong magnetic block is magnetically connected to the first strong magnetic block, and a sealing strip is fixedly installed at the bottom of the cover plate.

[0007] Preferably, the valve mechanism includes a mounting block fixedly installed on the liquid outlet pipe, a fixing sleeve fixedly installed on the upper surface of the mounting block, a sliding rod slidably installed inside the fixing sleeve, and a connecting block fixedly installed on the top of the sliding rod.

[0008] Preferably, a mounting plate is fixedly installed at the bottom of the slide bar, a rotating bar is rotatably installed on the mounting plate, a connecting plate is fixedly installed on the rotating bar, and a blocking block is fixedly installed on the other side of the connecting plate. The blocking block is slidably installed inside the liquid outlet pipe.

[0009] Preferably, a control panel is fixedly installed on the liquid storage tank, a connecting line is fixedly installed on one side of the control panel, an electric telescopic rod is fixedly installed on the liquid storage tank, the output end of the electric telescopic rod is fixedly installed on the upper surface of the connecting block, a signal receiver is fixedly installed on the side of the electric telescopic rod near the connecting line, and the other end of the connecting line is fixedly installed on the signal receiver.

[0010] Preferably, a sliding sleeve is fixedly installed on the liquid storage tank, and the output end of the electric telescopic rod is slidably installed inside the sliding sleeve.

[0011] Preferably, a support plate is fixedly installed on the other side of the block, and a rotating wheel is rotatably installed on the support plate, the rotating wheel being slidably installed inside the liquid outlet pipe.

[0012] The beneficial effects of this utility model are:

[0013] In this invention, by setting up a support block, a rotating rod, a rotating block, a first strong magnetic block, and a second strong magnetic block, the second strong magnetic block is pulled to separate from the first strong magnetic block. Due to the setting of the torsion spring, the cover plate will automatically unfold. After adding the copper plating solution, press the cover plate to press the second strong magnetic block onto the first strong magnetic block, thus fixing the cover plate on the storage tank. In this way, copper plating solution can be added into the storage tank, making it convenient to replenish the copper plating solution.

[0014] In this invention, by setting a valve mechanism, a timer is first used on the control panel. When the time is up, the signal is transmitted to the signal receiver via a connecting line. The signal receiver then drives the electric telescopic rod to move, which in turn moves the block. Once the block is in place, the copper precipitating solution in the storage tank flows into the copper precipitating tank through the outlet pipe. By setting a fixed time, a fixed amount of copper precipitating solution can be added to the copper precipitating tank. This design eliminates the need for long-term manual monitoring, reducing labor costs, while also ensuring accurate addition of a specific amount of copper precipitating solution to the tank. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the copper plating solution addition device for the PCB copper plating process proposed in this utility model.

[0016] Figure 2 This is a schematic diagram of the rotating block, torsion spring, and other structures of the copper plating solution addition device for the PCB copper plating process proposed in this utility model.

[0017] Figure 3This is a cross-sectional structural schematic diagram of the copper plating solution addition device for the PCB copper plating process proposed in this utility model;

[0018] Figure 4 This is a schematic diagram of part A of the copper plating solution addition device for the PCB copper plating process proposed in this utility model.

[0019] In the diagram: 1. Copper settling tank; 2. Base; 3. Bracket; 4. Storage tank; 5. Support block; 6. Rotating rod; 7. Cover plate; 8. Rotating block; 9. Torsion spring; 10. First strong magnetic block; 11. Second strong magnetic block; 12. Valve mechanism; 13. Discharge pipe; 14. Sealing strip; 121. Mounting block; 122. Fixing sleeve; 123. Slide rod; 124. Connecting block; 125. Mounting plate; 126. Rotating bar; 127. Connecting plate; 128. Block; 129. Control panel; 1210. Connecting wire; 1211. Electric telescopic rod; 1212. Signal receiver; 1213. Slide sleeve; 1214. Support plate; 1215. Rotating wheel. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example:

[0022] like Figure 1-4 As shown, this embodiment provides a copper plating solution addition device for PCB copper plating process, including a copper plating tank 1, a base 2 fixedly installed on one side of the copper plating tank 1, a bracket 3 fixedly installed on the upper surface of the base 2, a storage tank 4 fixedly installed on the top of the bracket 3, a support block 5 fixedly installed on the storage tank 4, a rotating rod 6 fixedly installed on the support block 5, a cover plate 7 provided on the storage tank 4, a rotating block 8 fixedly installed on the cover plate 7, the rotating block 8 rotatably installed on the rotating rod 6, a torsion spring 9 fixedly installed on the side of the support block 5 near the rotating block 8, the other end of the torsion spring 9 fixedly installed on the rotating block 8, a valve mechanism 12 provided on the storage tank 4, and a liquid outlet pipe 13 fixedly installed inside the storage tank 4;

[0023] Pull the second strong magnetic block 11 to separate it from the first strong magnetic block 10. Due to the setting of the torsion spring 9, the torsion spring 9 will drive the rotating block 8 to rotate. The rotation of the rotating block 8 will drive the cover plate 7 to rotate. The cover plate 7 will automatically unfold when it rotates. After adding the copper immersion liquid, press the cover plate 7 and press the second strong magnetic block 11 onto the first strong magnetic block 10 to fix the cover plate 7 onto the storage tank 4. In this way, copper immersion liquid can be added into the storage tank 4 for easy replenishment. The valve mechanism 12 can control the flow rate of the copper immersion liquid in the outlet pipe 13 at timed intervals, so that copper immersion liquid can be added to the copper immersion tank 1 at timed intervals and in a quantitative manner. The sealing strip 14 can prevent the copper immersion liquid from flowing out, making the sealing of the storage tank 4 better.

[0024] In this embodiment of the utility model, specifically, a first strong magnetic block 10 is fixedly installed on the liquid storage tank 4, and a second strong magnetic block 11 is fixedly installed on the cover plate 7. The second strong magnetic block 11 is magnetically connected to the first strong magnetic block 10. A sealing strip 14 is fixedly installed at the bottom of the cover plate 7. The valve mechanism 12 includes a mounting block 121 fixedly installed on the liquid outlet pipe 13. A fixing sleeve 122 is fixedly installed on the upper surface of the mounting block 121. A sliding rod 123 is slidably installed inside the fixing sleeve 122. A connecting block 124 is fixedly installed on the top of the sliding rod 123. A mounting plate 125 is fixedly installed on the bottom of the sliding rod 123. A rotating bar is rotatably installed on the mounting plate 125. 126. A connecting plate 127 is fixedly installed on the rotating bar 126. A blocking block 128 is fixedly installed on the other side of the connecting plate 127. The blocking block 128 is slidably installed in the outlet pipe 13. A control panel 129 is fixedly installed on the storage tank 4. A connecting line 1210 is fixedly installed on one side of the control panel 129. An electric telescopic rod 1211 is fixedly installed on the storage tank 4. The output end of the electric telescopic rod 1211 is fixedly installed on the upper surface of the connecting block 124. A signal receiver 1212 is fixedly installed on the side of the electric telescopic rod 1211 near the connecting line 1210. The other end of the connecting line 1210 is fixedly installed on the signal receiver 1212.

[0025] To add copper plating solution to the copper plating tank 1 at regular intervals and in precise quantities, a timer is first set using the control panel 129. At the set time, a signal is transmitted via the connecting cable 1210 to the signal receiver 1212. The signal receiver 1212 then drives the electric telescopic rod 1211, which in turn moves the connecting block 124. The movement of the connecting block 124 moves the sliding rod 123, which in turn moves the mounting plate 125. The movement of the mounting plate 125 then rotates the rotating bar 126, which in turn moves the connecting plate 127. The movement of the connecting plate 127 then moves the blocking block 128, which moves into the mounting block 121. This allows the copper plating solution in the storage tank 4 to flow into the copper plating tank 1 through the outlet pipe 13. By setting a fixed time, a precise amount of copper plating solution can be added to the copper plating tank 1. This setup eliminates the need for long-term manual monitoring, reducing labor costs, while ensuring accurate addition of a specific amount of copper plating solution to the copper plating tank 1.

[0026] In this embodiment of the utility model, a sliding sleeve 1213 is fixedly installed on the liquid storage tank 4, the output end of the electric telescopic rod 1211 is slidably installed in the sliding sleeve 1213, a support plate 1214 is fixedly installed on the other side of the block 128, a rotating wheel 1215 is rotatably installed on the support plate 1214, and the rotating wheel 1215 is slidably installed in the liquid outlet pipe 13.

[0027] The sliding sleeve 1213 restricts the position of the output end of the electric telescopic rod 1211, so that the output end of the electric telescopic rod 1211 can only move within the sliding sleeve 1213. The support plate 1214 and the rotating wheel 1215 make it easier to move the block 128 and reduce friction.

[0028] Working principle: In use, pull the second strong magnetic block 11 to separate it from the first strong magnetic block 10. Due to the setting of the torsion spring 9, the torsion spring 9 will drive the rotating block 8 to rotate. The rotation of the rotating block 8 will drive the cover plate 7 to rotate, and the cover plate 7 will automatically open. After adding the copper plating solution, press the cover plate 7 to press the second strong magnetic block 11 onto the first strong magnetic block 10, which will fix the cover plate 7 onto the liquid storage tank 4. In this way, copper plating solution can be added into the liquid storage tank 4 for easy replenishment. First, use the control panel 129 to set a timer. After the time is up, the signal will be transmitted to the signal receiver 1212 through the connecting line 1210. The signal receiver 1212 will drive the electric telescopic rod 12. 11. When in operation, the electric telescopic rod 1211 drives the connecting block 124 to move, the connecting block 124 moves the sliding rod 123 to move, the sliding rod 123 moves the mounting plate 125 to move, the mounting plate 125 moves the rotating bar 126 to rotate, the rotating bar 126 moves the connecting plate 127 to move, the connecting plate 127 moves the blocking block 128 to move, and the blocking block 128 moves into the mounting block 121, so that the copper precipitating solution in the storage tank 4 can flow into the copper precipitating tank 1 through the outlet pipe 13. By setting a fixed time, a certain amount of copper precipitating solution can be added to the copper precipitating tank 1. This setting eliminates the need for long-term manual supervision, reduces labor costs, and at the same time allows for the accurate addition of a certain amount of copper precipitating solution to the copper precipitating tank 1.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A copper plating solution addition device for PCB copper plating process, comprising a copper plating tank (1), characterized in that: A base (2) is fixedly installed on one side of the copper sink (1). A bracket (3) is fixedly installed on the upper surface of the base (2). A storage tank (4) is fixedly installed on the top of the bracket (3). A support block (5) is fixedly installed on the storage tank (4). A rotating rod (6) is fixedly installed on the support block (5). A cover plate (7) is provided on the storage tank (4). A rotating block (8) is fixedly installed on the cover plate (7). The rotating block (8) is rotatably installed on the rotating rod (6). A torsion spring (9) is fixedly installed on the side of the support block (5) near the rotating block (8). The other end of the torsion spring (9) is fixedly installed on the rotating block (8). A valve mechanism (12) is provided on the storage tank (4). An outlet pipe (13) is fixedly installed inside the storage tank (4).

2. The copper plating solution addition device for the PCB copper plating process according to claim 1, characterized in that: A first strong magnetic block (10) is fixedly installed on the liquid storage tank (4), and a second strong magnetic block (11) is fixedly installed on the cover plate (7). The second strong magnetic block (11) is magnetically connected to the first strong magnetic block (10), and a sealing strip (14) is fixedly installed at the bottom of the cover plate (7).

3. The copper plating solution addition device for the PCB copper plating process according to claim 1, characterized in that: The valve mechanism (12) includes a mounting block (121) fixedly mounted on the liquid outlet pipe (13). A fixing sleeve (122) is fixedly mounted on the upper surface of the mounting block (121). A slide rod (123) is slidably mounted inside the fixing sleeve (122). A connecting block (124) is fixedly mounted on the top of the slide rod (123).

4. The copper plating solution addition device for the PCB copper plating process according to claim 3, characterized in that: A mounting plate (125) is fixedly installed at the bottom of the slide bar (123). A rotating bar (126) is rotatably installed on the mounting plate (125). A connecting plate (127) is fixedly installed on the rotating bar (126). A blocking block (128) is fixedly installed on the other side of the connecting plate (127). The blocking block (128) is slidably installed inside the liquid outlet pipe (13).

5. The copper plating solution addition device for the PCB copper plating process according to claim 2, characterized in that: A control panel (129) is fixedly installed on the liquid storage tank (4). A connecting line (1210) is fixedly installed on one side of the control panel (129). An electric telescopic rod (1211) is fixedly installed on the liquid storage tank (4). The output end of the electric telescopic rod (1211) is fixedly installed on the upper surface of the connecting block (124). A signal receiver (1212) is fixedly installed on the side of the electric telescopic rod (1211) near the connecting line (1210). The other end of the connecting line (1210) is fixedly installed on the signal receiver (1212).

6. The copper plating solution addition device for the PCB copper plating process according to claim 5, characterized in that: A sliding sleeve (1213) is fixedly installed on the liquid storage tank (4), and the output end of the electric telescopic rod (1211) is slidably installed in the sliding sleeve (1213).

7. The copper plating solution addition device for the PCB copper plating process according to claim 4, characterized in that: A support plate (1214) is fixedly installed on the other side of the block (128), and a rotating wheel (1215) is rotatably installed on the support plate (1214). The rotating wheel (1215) is slidably installed inside the liquid outlet pipe (13).

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