Test socket

Abstract

The present invention relates to an inspection socket, and more specifically, to an inspection socket disposed between a device to be inspected and an inspection device to electrically connect a terminal of the device to be inspected to a pad of the inspection device, comprising: an anisotropic conductive sheet comprising a conductive portion in which a plurality of conductive particles are arranged in an up-and-down direction within an elastic insulating material at each position corresponding to a terminal of the device to be inspected, and an insulating portion that supports and insulates the conductive portion; and a frame comprising an inspection area and a peripheral portion disposed around the inspection area, wherein the anisotropic conductive sheet is disposed in the inspection area and a positioning hole is formed in the peripheral portion; wherein the frame comprises a core substrate made of a glass material and a surface layer formed by casting a polyimide solution or a fluorine solution onto the surface of the core substrate.

Description

Technology Field

[0001] The present invention relates to an inspection socket, and more specifically, to an inspection socket advantageous for large-area inspection. Background Technology

[0002] To inspect a device under test, such as a semiconductor device, a test socket is used that is positioned between a test device and the device under test. The test socket used for inspecting the device under test electrically connects the test device and the device under test. As an example of such a test socket, an anisotropic conductive sheet capable of elastically deforming in response to pressure applied through the device under test is known in the field.

[0003] FIG. 1 illustrates a conventional inspection socket (10). The inspection socket (10) is composed of an anisotropic conductive sheet (20) and a frame (30).

[0004] The anisotropic conductive sheet (20) has a plurality of conductive portions (21) and an insulating portion (22) that insulates the plurality of conductive portions (21) from each other. A plurality of metal particles are assembled to be conductive in the vertical direction to form each conductive portion (21). Each conductive portion (21) performs signal transmission between the inspection device and the device under inspection. The insulating portion (22) is made of an elastic insulating material and maintains the conductive portions (21) in the vertical direction.

[0005] The frame (30) is attached to the lower surface of the anisotropic conductive sheet (20) so as to support the anisotropic conductive sheet (20). At this time, the frame (30) is made of a material such as FR4. The frame (30) is formed in the form of a thin sheet. During the process of installing the frame (30) in the inspection device, the frame (30) performs the function of guiding the position of the anisotropic conductive sheet (20) and the function of supporting the anisotropic conductive sheet (20).

[0006] FIG. 2 illustrates a different conventional inspection socket (10).

[0007] The anisotropic conductive sheet (20) is the same as the embodiment of FIG. 1. The frame (30) is used in combination with a polyimide film (31) and a metal sheet (32). The insulating polyimide film (31) supports the bottom surface of the anisotropic conductive sheet (20). The metal sheet (32) is placed around the periphery of the anisotropic conductive sheet (20) and on the upper surface of the polyimide film (31). The frame (30) of FIG. 2 is used in combination with the polyimide film (31) and the metal sheet (32) to enhance durability.

[0008] Recently, semiconductor devices have been becoming larger, and accordingly, the number of terminals tends to increase to, for example, 15,000 or more. As semiconductor devices become larger in this way, not only do the dimensions of the anisotropic conductive sheet (20) increase, but the size of the frame (30) also increases. As the size of the frame (30) increases in this way, there is a disadvantage of insufficient dimensional stability. In particular, the frame (30), which is made of FR4, polyimide film, metal sheet, etc., has a high coefficient of thermal expansion and is susceptible to deformation.

[0009] In addition, it has the disadvantage of being unsuitable for large-scale, large-area devices due to its high moisture absorption rate.

[0010] In particular, as the conventional frame (30) becomes larger, warpage becomes severe, and as a result, contact instability occurs between the conductive part (21) of the anisotropic conductive sheet (20) and the terminal of the device to be tested, and as a result, resistance increases and there are problems with the reliability of the test.

[0011] As such, existing materials are difficult to utilize for large-area applications due to issues such as thermal expansion coefficient, moisture absorption rate, dimensional stability, and bending, creating a situation where it is necessary to replace existing frames. The problem to be solved

[0012] The present invention was created to solve the aforementioned problems, and its technical objective is to provide an inspection socket having a frame that is easy to utilize for large-area applications. means of solving the problem

[0013] The inspection socket of the present invention for achieving the above-mentioned purpose is,

[0014] In a test socket disposed between a device to be tested and a test device and electrically connecting a terminal of the device to be tested to a pad of the test device,

[0015] A conductive part in which a plurality of conductive particles are arranged in the vertical direction within an elastic insulating material at each position corresponding to a terminal of the device under test, and

[0016] An anisotropic conductive sheet comprising an insulating portion that supports and insulates the conductive portion; and

[0017] It consists of an inspection area and a peripheral area positioned around the inspection area, and

[0018] The anisotropic conductive sheet is placed in the above inspection area, and

[0019] The above peripheral portion is composed of a frame in which a positioning hole is formed, and

[0020] The above frame is,

[0021] A core substrate made of glass material, and

[0022] It includes a surface layer formed by casting a polyimide solution or a fluorine solution onto the surface of the core substrate.

[0023] The inspection socket of the present invention for achieving the aforementioned technical purpose is,

[0024] In a test socket disposed between a device to be tested and a test device and electrically connecting a terminal of the device to be tested to a pad of the test device,

[0025] A conductive part in which a plurality of conductive particles are arranged in the vertical direction within an elastic insulating material at each position corresponding to a terminal of the device under test, and

[0026] An anisotropic conductive sheet comprising an insulating portion that supports and insulates the conductive portion; and

[0027] It consists of an inspection area and a peripheral area positioned around the inspection area, and

[0028] The anisotropic conductive sheet is placed in the above inspection area, and

[0029] The above peripheral portion is composed of a frame in which a positioning hole is formed, and

[0030] The above frame is,

[0031] A core substrate made of glass material, and

[0032] It includes a surface sheet bonded to the surface of the core substrate and composed of at least one of a polyimide sheet, a metal sheet, or an FR4 sheet. Effects of the invention

[0033] The inspection socket according to the present invention has the effect of having minimal deformation even in high-temperature environments, high dimensional stability, and minimal bending, even when used for large-area applications by applying a glass material to the frame.

[0034] The inspection socket according to the present invention can have excellent characteristics in terms of durability, as the frame is manufactured by forming a surface layer by casting a polyimide solution or a fluorine solution onto a glass material.

[0035] The inspection socket according to the present invention can have excellent characteristics in terms of durability as the frame is manufactured by attaching a polyimide sheet, a metal sheet, or an FR4 sheet to a glass material. Brief explanation of the drawing

[0036] FIG. 1 is a drawing illustrating an example of a conventional inspection socket. FIG. 2 is a drawing illustrating another example of a conventional inspection socket. FIG. 3 is a drawing of an inspection socket according to an embodiment of the present invention. FIG. 4 is a plan view of a frame that is a component of the inspection socket of FIG. 3. FIG. 5 is a drawing showing an inspection being performed using the inspection socket of FIG. 3. FIG. 6 is a schematic diagram illustrating the process of manufacturing a frame, which is a component of the inspection socket of FIG. 3. FIG. 7 is a drawing illustrating a frame of an inspection socket according to another embodiment of the present invention. FIG. 8 is a plan view of an inspection socket according to another embodiment of the present invention. FIG. 9 is a front view of the inspection socket of FIG. 8. Specific details for implementing the invention

[0037] The embodiments of the present disclosure are illustrative for the purpose of explaining the technical concept of the present disclosure. The scope of rights according to the present disclosure is not limited to the embodiments presented below or the specific description thereof.

[0038] All technical and scientific terms used in this disclosure, unless otherwise defined, have the meaning generally understood by those skilled in the art to which this disclosure pertains. All terms used in this disclosure are selected for the purpose of further clarifying this disclosure and are not selected to limit the scope of the rights under this disclosure.

[0039] Expressions such as 'comprising', 'having', 'having', etc. used in this disclosure should be understood as open-ended terms implying the possibility of including other embodiments, unless otherwise stated in the phrase or sentence containing such expressions.

[0040] Unless otherwise stated, singular expressions described in this disclosure may include a plural meaning, and this applies likewise to singular expressions described in the claims.

[0041] Expressions such as 'first', 'second', etc. used in this disclosure are used to distinguish multiple components from one another and do not limit the order or importance of said components.

[0042] In the present disclosure, where it is stated that a component is 'connected' or 'combined' to another component, it should be understood that the component may be directly connected or combined to the other component, or connected or combined through a new component.

[0043] As used in this disclosure, the direction indicator 'upward' is based on the direction in which the inspection socket is positioned relative to the inspection device, and the direction indicator 'downward' means the opposite direction of upward. As used in this disclosure, the direction indicator 'upward and downward direction' includes both upward and downward directions, but it should be understood that it does not mean any specific direction between the upward and downward directions.

[0044] Embodiments are described with reference to the examples illustrated in the attached drawings. In the attached drawings, identical or corresponding components are given the same reference numerals. Additionally, in the description of the following embodiments, the description of identical or corresponding components may be omitted. However, even if a description of a component is omitted, it is not intended that such component is not included in any embodiment.

[0045] The embodiments described below and the examples illustrated in the attached drawings relate to a test socket used for testing a device under test. The test socket of the embodiments may be placed between a test device and a device under test during the testing of the device under test and used for testing the device under test. As an example, the test socket of the embodiments may be used for final testing of a semiconductor device in a post-process during the manufacturing process of a semiconductor device. However, the examples of testing to which the test socket of the embodiments is applied are not limited to the aforementioned testing.

[0046] Refer to FIG. 4, which schematically illustrates an example of the use of an inspection socket according to embodiments of the present disclosure.

[0047] The inspection socket (100) according to the embodiment is positioned between the inspection device (150) and the device to be inspected (140). When inspecting the device to be inspected (140), the inspection socket (100) contacts the inspection device (150) and the device to be inspected (140) in an up-and-down direction, thereby electrically connecting the inspection device (150) and the device to be inspected (140) to each other.

[0048] The device to be tested (140) may be a semiconductor device in which a semiconductor IC chip and a plurality of terminals (141) are packaged in a cuboid shape using a resin material, but is not limited thereto. The device to be tested (140) has a plurality of terminals (141) on its lower side. The terminals (141) of the device to be tested (140) shown in FIG. 4 are of the ball type. The terminals (141) are not limited to the ball type and may be of the land type. Additionally, the terminals (141) may include terminals (141) for signal transmission and terminals (141) for grounding.

[0049] The inspection device (150) can inspect various operational characteristics of the device under inspection (140). The inspection device (150) may have a board on which inspection is performed, and the board may be equipped with an inspection circuit for inspecting the device under inspection (140). Additionally, the inspection circuit has a plurality of pads (151) that are electrically connected to a terminal (141) of the device under inspection (140) through an inspection socket (100). The pads (151) of the inspection device (150) can transmit an electrical test signal and receive a response signal.

[0050] When inspecting the device to be inspected (140), the terminal (141) of the device to be inspected (140) is electrically connected to the pad (151) of the inspection device (150) through the inspection socket (100). The inspection socket (100) electrically connects each terminal (141) of the device to be inspected (140) and each pad (151) of the inspection device (150) corresponding thereto in the vertical direction (VD), and the inspection of the device to be inspected (140) is performed by the inspection device (150) through the inspection socket (100).

[0051] An inspection socket (100) according to one embodiment of the present invention is composed of an anisotropic conductive sheet (110) and a frame (120).

[0052] The above anisotropic conductive sheet (110) is composed of a conductive portion (111) and an insulating portion (112). The conductive portion (111) is composed of a plurality of portions. The plurality of conductive portions (111) are arranged and positioned in the vertical direction (VD) and are configured to conduct in the vertical direction (VD) respectively. The insulating portion (112) separates the plurality of conductive portions (111) from the horizontal direction (HD) and insulates the plurality of conductive portions (111) from each other. The insulating portion (112) maintains the plurality of conductive portions (111) in the vertical direction (VD).

[0053] The conductive portion (111) of the anisotropic conductive sheet (110) may take a roughly cylindrical shape. The conductive portion (111) comprises a plurality of conductive particles and an elastic insulating material. In the conductive portion (111), a plurality of conductive particles are assembled in a columnar shape so as to be conductive in the vertical direction (VD). Among the plurality of conductive particles assembled in a columnar shape, neighboring conductive particles may be in contact so as to be conductive in any direction. The plurality of conductive particles assembled so as to be conductive in the vertical direction function as a conductor. For example, the conductive particles may be made of a highly conductive metal material. Alternatively, the conductive particles may have a form in which the highly conductive metal material is coated onto a core made of a resin material or a metal material.

[0054] In each conductive part (111), the elastic insulating material is in a cured state and has elasticity. The elastic insulating material can be filled between the conductive particles. The elastic insulating material and the conductive particles are integrally formed to constitute each conductive part (111). For example, the elastic insulating material may be cured silicone rubber, but is not limited thereto. The conductive part (111) containing the elastic insulating material may be elastically deformed in the vertical direction (VD) and the horizontal direction (HD).

[0055] The insulating portion (112) is made of an elastic insulating material that has elasticity and insulating properties, and has elasticity in the vertical direction (VD) and the horizontal direction (HD). The elastic insulating material forming the insulating portion (112) may include silicone rubber identical to the elastic insulating material of the conductive portion (111), but is not limited thereto. The insulating portion (112) maintains the plurality of conductive particles, which are assembled to be conductive in the vertical direction (VD), as the conductive portion (111). Additionally, the elastic insulating material constituting the insulating portion (112) may fill the spaces between the conductive particles of the conductive portion (111). That is, the conductive portion (111) partially includes the elastic insulating material forming the insulating portion (112), and this elastic insulating material of the conductive portion (111) may exist from the bottom to the top of the conductive portion (111). A conductive part (111) containing an elastic insulating material and an insulating part (112) made of an elastic insulating material can be elastically deformed in the vertical direction (VD) and the horizontal direction (HD).

[0056] The insulating portion (112) can form a rectangular elastic region of the anisotropic conductive sheet (110). A plurality of conductive portions (111) are spaced apart from each other and insulated by the insulating portion (112) in the horizontal direction (HD) at equal or unequal intervals. The insulating portion (112) is formed as a single elastic body, and a plurality of conductive portions (111) may exist in a form arranged in the vertical direction (VD) on the insulating portion (112). The insulating portion (112), made of an elastic body, not only maintains the conductive portions (111) in their shape but also maintains the conductive portions (111) in the vertical direction.

[0057] For example, an anisotropic conductive sheet (110) comprising a conductive portion (111) and an insulating portion (112) can be formed from a liquid molding material in which a plurality of conductive particles are mixed with a liquid elastic insulating material. The liquid elastic insulating material refers to a liquid state material of the elastic insulating material constituting the insulating portion (112). The liquid molding material is injected into a molding die, and a magnetic field can be applied in the up and down direction at each location where the conductive portion (111) is to be formed. The conductive particles are gathered by the magnetic field so that they can come into contact with each other in a cylindrical shape at each location of the conductive portion (111). Then, by curing the liquid molding material, the conductive portion (111) and the insulating portion (112) are formed simultaneously, thereby forming the anisotropic conductive sheet (110). As another example, an insulating portion (112) made of the solid state elastic insulating material is formed first, and through holes can be formed in this insulating portion (112) at each location of the conductive portion (111). The above liquid molding material is injected into the through hole and a magnetic field is applied in the vertical direction to aggregate the conductive particles in the vertical direction, and the liquid molding material injected into the through hole can be cured.

[0058] The above frame (120) is formed in the shape of a rectangular sheet. The frame (120) consists of an inspection area (A) and a surrounding area (B) placed around the inspection area (A).

[0059] The anisotropic conductive sheet (110) is placed in the inspection area (A). The frame (120) is configured to pass over the lower surface of the anisotropic conductive sheet (110). A plurality of through holes (125) are formed in the frame (120). The through holes (125) are provided at positions corresponding to the conductive portion (111). The conductive portion (111) passes through the through holes (125) and protrudes downward from the frame (120). The conductive portion (111) protruding from the frame (120) comes into contact with the pad (151) of the inspection device (150). The frame (120) and the anisotropic conductive sheet (110) can be bonded to each other by means of an adhesive or the like.

[0060] The frame (120) can prevent the anisotropic conductive sheet (110) from expanding excessively in a high-temperature environment. Additionally, it can prevent the anisotropic conductive sheet (110) from being excessively deformed by external force. As a result, the conductive portion (111) of the anisotropic conductive sheet (110) and the terminal (141) of the device under inspection (140) or the pad (151) of the inspection device (150) can be reliably in contact with each other.

[0061] The above peripheral area (B) is a part that surrounds the inspection area (A) and corresponds to the edge of the frame (120). The above peripheral area (B) is configured to protrude outward from the anisotropic conductive sheet (110). The above peripheral area (B) is a part that does not come into contact with the anisotropic conductive sheet (110). A positioning hole (124) is formed in the above peripheral area (B). A positioning pin (152) provided in the inspection device (150) is inserted into the positioning hole (124). When the positioning pin (152) is inserted into the positioning hole (124), the conductive part (111) of the anisotropic conductive sheet (110) and the pad (151) of the inspection device (150) are precisely aligned with each other.

[0062] The above frame (120) is composed of a core substrate (121) and a surface layer (122).

[0063] The core substrate (121) is made of glass material. Specifically, it is made of glass material having a coefficient of thermal expansion (CTE) of 1 to 10 ppm and a moisture absorption rate of 0.1 to 0.5%. The core substrate (121) made of glass material does not expand excessively in a high-temperature environment, thereby improving the reliability of the inspection.

[0064] In addition, it has excellent dimensional stability and excellent moisture absorption rate, making it suitable as a frame (120) material.

[0065] The surface layer (122) is formed on the surface of a glass substrate by casting. Specifically, a polyimide solution (122a) is cast to form a polyimide surface layer (122) on the surface of the core substrate (121). The surface layer (122), made of a polyimide material, is integrated with the core substrate (121). The polyimide surface layer (122) enhances the durability of the frame (120). While durability is reduced when made solely of glass material, durability can be reinforced by using a polyimide material for the surface layer (122).

[0066] FIG. 6 briefly illustrates the manufacturing process of the frame (120).

[0067] To form a surface layer (122), a polyimide solution is applied to the surface of a core substrate (121) made of glass material and scraped with a spatula (130) to form a surface layer (122) with a uniform thickness. Afterward, the polyimide surface layer (122) can be integrated with the core substrate (121) through a drying process.

[0068] Meanwhile, after casting a surface layer (122) on the surface of the core substrate (121), hole processing is performed using a laser. It is not easy to perform hole processing on a core substrate (121) made of glass material by mechanical processing. Accordingly, in this embodiment, as shown in FIG. 6(b), a laser is irradiated at the location where a positioning hole (124) is to be formed to form a positioning hole (124) on the edge of the frame (120).

[0069] The inspection socket (100) according to the present embodiment is suitable for large-area applications as it has excellent surface roughness and small bending because it uses a glass material for the frame (120).

[0070] In addition, the size of the frame (120) increases as the number of terminals (141) of the device under inspection (140) increases, and the disadvantage of the existing FR4 material having limitations can be overcome by using glass material. In the case of metal material, it is impossible to use it as an individual hole because there is a risk of short circuit as it is a conductor, but this disadvantage can also be overcome by using glass material.

[0071] The inspection socket (100) according to the present invention can be modified as follows.

[0072] In the above-described embodiment, a surface layer (122) formed by casting a polyimide solution (122a) on the surface of a core substrate (121) made of glass material was exemplified, but it is not limited thereto, and as shown in FIG. 7, it is possible to form a surface layer (122) formed by casting a fluorine solution on the surface of a core substrate (121).

[0073] It is possible to cast fluorine with excellent water repellency to increase the water absorption rate. A surface layer (122) made of such fluorine is suitable for semiconductor devices requiring high frequency for large-area applications, and can increase dielectric constant and dielectric loss characteristics.

[0074] In the above-described embodiment, a polyimide solution (122a) or a fluorine solution is cast on the surface of the core substrate (121), but this is not limited thereto, and as shown in FIGS. 8 and 9, it is possible to attach a surface sheet (123) to the surface of the core substrate.

[0075] At this time, the surface sheet (123) is bonded to the surface of the core substrate (121) and may be made of at least one of a polyimide sheet, a metal sheet, or an FR4 sheet.

[0076] There is a disadvantage that the product yield is low when more than 10,000 terminals (141) are manufactured as an improved structure for large-area devices. In this case, the core substrate (121) is made of glass material, and a polyimide sheet and an FR4 sheet can be divided and attached on the core substrate (121) made of glass material.

[0077] At this time, a positioning hole (124) is formed in the core substrate (121), so that it can have a structure with excellent dimensional precision.

[0078] In this embodiment, two substrates of different materials are attached, so the yield can be improved even for products with 15,000 terminals (141) or more. It is preferable to attach the surface sheet (123) by dividing it into multiple sheets rather than a single sheet. In this case, the core substrate (121) is made of a single sheet, so it can have the advantages of dimensional stability and coefficient of thermal expansion, which are unique advantages of glass material.

[0079] An anisotropic conductive sheet (110) can be formed on each surface sheet (123) in a one-to-one matching manner. At this time, by varying the thickness of each anisotropic conductive sheet (110), it is possible to effectively respond even when the device under inspection (140) is bent. That is, by varying the thickness of the anisotropic conductive sheet (110) to form a height step, it is possible to effectively respond even when the device under inspection (140) is bent under a large area.

[0080] Meanwhile, if a surface sheet (123) made of a metal material is attached to the surface of the core substrate (121), it can be connected to a ground terminal to provide a shielding effect for Coax purposes. In addition, the surface sheet (123) made of a metal material can also enhance the durability of the core substrate (121) made of a glass material.

[0081] Although the technical concept of the present disclosure has been described by some embodiments and examples illustrated in the accompanying drawings, it should be understood that various substitutions, modifications, and changes may be made without departing from the technical concept and scope of the present disclosure as understood by those skilled in the art to which the present disclosure pertains. Furthermore, such substitutions, modifications, and changes should be considered to fall within the scope of the appended claims. Explanation of the symbols

[0082] 100...Test socket 110...Anisotropic conductive sheet 111...conductive part 112...insulating part 120...Frame 121...Core board 122...Surface layer 123...Surface sheet 124...Positioning hole

Claims

Claim 1 An inspection socket for electrically connecting a terminal of a device to be inspected and a pad of an inspection device, comprising: an anisotropic conductive sheet comprising a conductive portion in which a plurality of conductive particles are arranged in an up-and-down direction within an elastic insulating material at each position corresponding to the terminal of the device to be inspected, and an insulating portion that supports the conductive portion while insulating each other; and a frame supporting the anisotropic conductive sheet, wherein the frame comprises an inspection area and a peripheral area on its outer periphery, and the anisotropic conductive sheet is disposed in the inspection area, and the frame comprises a core substrate made of a glass material and a surface layer formed on the surface of the core substrate. Claim 2 An inspection socket according to claim 1, characterized in that the anisotropic conductive sheet is disposed on the upper surface of the frame. Claim 3 An inspection socket according to claim 1, characterized in that the surface layer is a coating layer formed by casting a polyimide solution or a fluorine solution onto the surface of the core substrate. Claim 4 An inspection socket according to claim 1, wherein a through hole is formed in the frame at a position corresponding to the conductive portion of the anisotropic conductive sheet, and the conductive portion passes through the through hole and protrudes downward from the frame. Claim 5 An inspection socket according to claim 1, characterized in that the frame and the anisotropic conductive sheet are bonded to each other by an adhesive. Claim 6 In claim 1, the inspection socket is characterized in that the surface layer is formed on at least one of the upper or lower surface of the core substrate. Claim 7 In claim 1, the inspection socket is characterized in that the surface layer is formed on the upper and lower surfaces of the core substrate. Claim 8 An inspection socket according to claim 1, characterized in that the core substrate is made of a glass material having a coefficient of thermal expansion (CTE) of 1 to 10 ppm and a moisture absorption rate of 0.1 to 0.5%. Claim 9 In claim 1, the inspection socket is characterized in that the frame is formed in the shape of a square sheet. Claim 10 An inspection socket for electrically connecting a terminal of a device to be inspected and a pad of an inspection device, comprising: an anisotropic conductive sheet comprising a conductive portion in which a plurality of conductive particles are arranged in an up-and-down direction within an elastic insulating material at each position corresponding to the terminal of the device to be inspected, and an insulating portion that supports the conductive portion while insulating each other; and a frame supporting the anisotropic conductive sheet, wherein the frame comprises an inspection area and a peripheral area on its outer periphery, and the anisotropic conductive sheet is disposed in the inspection area, and the frame comprises a core substrate made of a glass material and a surface sheet bonded to the surface of the core substrate. Claim 11 An inspection socket according to claim 10, characterized in that the surface sheet comprises at least one of a polyimide sheet, a metal sheet, or an FR4 sheet. Claim 12 An inspection socket according to claim 10, characterized in that the surface sheet is divided into two or more parts and attached to the core substrate. Claim 13 An inspection socket according to claim 12, wherein the anisotropic conductive sheet is divided into a plurality of parts corresponding to the divided surface sheet, and the divided anisotropic conductive sheets are each disposed one-to-one on each of the divided surface sheets, and the thicknesses of the plurality of anisotropic conductive sheets are formed differently from each other. Claim 14 An inspection socket according to claim 10, wherein the surface sheet is made of a metal sheet, and a through hole is formed in the frame at a position corresponding to the conductive portion of the anisotropic conductive sheet, and the conductive portion protrudes downward from the frame through the through hole, and a part of the through hole is formed to correspond to the outer diameter of the conductive portion and contacts the outer circumference of the conductive portion to provide a shielding effect. Claim 15 In item 10, an inspection socket characterized by having a positioning hole formed in the surrounding area. Claim 16 An inspection socket for electrically connecting a terminal of a device to be inspected and a pad of an inspection device, comprising: an anisotropic conductive sheet comprising a conductive portion in which a plurality of conductive particles are arranged in an up-and-down direction within an elastic insulating material at each position corresponding to the terminal of the device to be inspected, and an insulating portion that supports the conductive portion while insulating each other; and a frame supporting the anisotropic conductive sheet, wherein the frame comprises a core substrate made of a glass material and a surface sheet made of a metal sheet on the surface of the core substrate, wherein through holes are formed in the frame at positions corresponding to the conductive portion of the anisotropic conductive sheet, wherein the conductive portion protrudes downward from the frame through the through holes, and a portion of the through holes is formed to correspond to the outer diameter of the conductive portion so as to come into contact with the conductive portion, thereby providing a shielding effect.

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