HIGH CURRENT COMPOSITE CIRCUIT BOARD EASY TO ASSEMBLE AND ITS MANUFACTURING PROCESS
MX435490BActive Publication Date: 2026-06-12GUANGDONG EREVO ELECTRICAL TECHNOLOGY CO LTD
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Patent Information
- Application Number
- MX2025008127
- Authority / Receiving Office
- MX · MX
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-07-11
- Filing Date
- 2025-07-10
- Publication Date
- 2026-06-12
- Estimated Expiration
- 2045-07-10
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Figure MX435490B0
Abstract
A high-current, easy-to-assemble composite circuit board and a manufacturing process for the same are described. The high-current, easy-to-assemble composite circuit board comprises a base board assembly. The base board assembly consists of an outer casing, an insulating plate, a composite circuit board, and an insulating coating layer arranged successively from top to bottom. The composite circuit board is provided with insulating grooves and mounting holes for conducting electricity. Through-holes corresponding to the mounting hole positions are formed in the outer casing and the insulating plate. The composite circuit board of the invention has a simple structure.The motherboard assembly, based on the composite circuit board manufacturing process, offers improved load-bearing capacity. The conductive posts are riveted to the composite circuit board using a riveting technique, and the connecting wires are then attached to the top ends of the conductive posts with conductive screws, thus electrically connecting the components to the composite circuit board. This design simplifies the assembly process and improves assembly efficiency. Therefore, testing can be performed as soon as the conductive posts are riveted.In this way, the problem of motherboard assembly defects only being discoverable after components have been assembled can be effectively avoided, reducing the generation of defective products and rework and maintenance rates, thus ensuring the acceptance rate of finished products and reducing companies' production costs.
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