Semiconductor package.

Abstract

A semiconductor package is proposed at least comprising a lead frame made from an electrically conductive metal material as well as at least two terminals; at least one semiconductor die structure having a first die side and a second die side opposite to the first die side and mounted with its second die side on the lead frame; a plurality of connections electrically and mechanically connecting the at least one semiconductor die structure with the at least two terminals of the lead frame; at least one heat sink pad having a first pad surface side and a second pad surface side opposite to the first pad surface side and mounted with its second pad surface side to the first die side of the semiconductor die structure; and a moulding resin encapsulating the lead frame, the at least one semiconductor die structure, the plurality of connections, the at least one heat sink pad and the at least two terminals leaving at least a portion of the first pad side of the heat sink pad and at least a portion of the at least two terminals exposed, wherein the exposed first pad surface side comprises at least one recess extending from the first pad surface side towards the second pad surface side.