Dual Active Surface Integrated Power Management and Distribution Architecture

Abstract

This invention relates to a dual active surface power architecture where power regulation modules (e.g., voltage regulator modules – VRMs) are integrated into the inner side of the computing surface. These modules are positioned directly opposite the processing units, limiting the power transmission path to the carrier layer thickness and minimizing the power distribution network impedance. A hybrid transmission architecture is used, featuring short-distance vertical transmission paths for high-current power lines and horizontal distribution structures for signal and control lines. The power regulation modules are cooled by an internal cooling loop independent of the processing units on the outer surface. Independent power regulation modules corresponding to each processing unit or die group enable asymmetric power distribution.