Thermal-mechanical testing device for platform integration

Abstract

A testing device, related method for using the testing device and a production device arranged based on a predicted ambient temperature determined using the testing device, the testing device including a circuitry of a first form factor that corresponds to a second form factor of the production device. Circuitry includes heat-generating electrical components to simulate thermal generation of the production device. The circuitry also includes sensors to measure at least one characteristic of airflow of the testing device and at least one temperature of the testing device. The sensors include a first sensor disposed upstream of the airflow, and a second sensor disposed downstream of the airflow. The circuitry also includes processing circuitry to receive sensor data from the sensors indicative the characteristics of airflow and the temperatures of the testing device, and to determine a predicted ambient temperature proximate to the production device based on the sensor data.

Description

[Technical Field]

[0001] This disclosure relates to a testing apparatus for optimizing the heat distribution of a production facility simulated by the testing apparatus. [Previous Technology]

[0002] and [Summary of the Invention]

[0003] According to this disclosure, a testing apparatus and a method for using the testing apparatus are provided to diagnose or design a production apparatus simulated by the testing apparatus. The testing apparatus may include a circuit system whose form factor matches or corresponds to that of the production apparatus. The production apparatus may be any functional device that can be replaced by the testing apparatus. For example, the production apparatus may be a storage device (e.g., a solid-state drive (SSD) device). The circuit system may include: a thermoelectric component for simulating heat generation in the production apparatus; and sensors for measuring the characteristics of airflow in the testing apparatus and measuring the temperature of the testing apparatus. The sensors may include temperature sensors and airflow sensors, wherein at least a first sensor is mounted on the circuit system upstream of the airflow and a second sensor is mounted on the circuit system downstream of the airflow. The circuit system also includes a processing circuit system for receiving sensor data from the sensors and determining, based on the sensor data, a predicted ambient temperature close to that of the production apparatus.

[0004] The test apparatus and methods disclosed herein are provided to optimize the heat distribution of a production unit simulated by the test apparatus. The optimized heat distribution ensures that the production unit can operate at a specific operating rate and thus generates a certain amount of heat without thermal throttling or the need to increase airflow between production units. In some specific examples, the test apparatus includes a housing surrounding the circuit system, the housing including a top cover and a bottom cover, each made of a thermally conductive material. In some specific examples, a thermal interface material (TIM) layer is disposed between the circuit system and each of the top cover and the bottom cover.

Implementation Method

[0012] According to this disclosure, a testing apparatus and a method of using the same are provided to optimize the heat distribution of a production device (e.g., a solid-state drive (SSD)). The testing apparatus includes a circuit system whose form factor matches or corresponds to that of the production device. The circuit system of the testing apparatus includes heat-generating electrical components used to simulate the heat generation of electrical components of the production device during operation. Sensors are also mounted on the circuit system to measure the characteristics of airflow in the testing apparatus and the temperature of the testing apparatus. In some specific examples, the airflow is provided by at least one fan positioned close to the testing apparatus, wherein the airflow travels along the testing apparatus to facilitate heat dissipation from the testing apparatus to the ambient air. The sensors may include temperature sensors and airflow sensors, wherein at least a first sensor is mounted on the circuit system upstream of the airflow and a second sensor is mounted on the circuit system downstream of the airflow. The circuit system also includes a processing circuit system for receiving sensor data from the sensors and determining a predicted ambient temperature close to the production device based on the sensor data.

[0013] The test apparatus disclosed herein may be enclosed by any suitable package / housing of the circuit system, including electrical components mounted on the circuit system. The circuit system or the package / housing surrounding the circuit system may have any suitable form factor corresponding to the form factor of the production apparatus simulated by the test apparatus. For example, the test apparatus may be surrounded by a housing having a top cover and a bottom cover, each of which is thermally conductive to facilitate heat dissipation from the circuit system of the test apparatus to the ambient air close to the test apparatus. The circuit system may include one or more integrated circuits or chips. In some specific instances, the circuit system itself is a printed circuit board (PCB) in which conductive traces are integrated within the layers of the PCB. Any heat generated by the circuit system may refer to the heat output of the heat-generating electrical components of the circuit system (e.g., high-performance integrated circuit chips or cores).

[0014] In some specific examples, the circuit system includes a processing circuit system, which may include a processor or processing unit implemented by hardware, software, or a combination thereof. The processing circuit system receives sensor data from sensors (e.g., airflow sensors and temperature sensors) indicating the characteristics and temperature of the airflow of the test apparatus. The processing circuit system receives sensor data from each of the airflow sensors and temperature sensors. The processing circuit system then determines, based on the sensor data, a predicted ambient temperature close to that of the production apparatus simulated by the test apparatus. In some specific examples, the circuit system has a first shape factor corresponding to a second shape factor of the production apparatus simulated by the test apparatus. The shape factor of the circuit system may be defined as the area occupied for thermal production or a three-dimensional (3-D) shape factor. In some specific examples, the components of the production apparatus simulated by the test apparatus are replicated in the test apparatus, wherein each individual component has the same configuration and position.

[0015] Temperature sensors are mounted on and electrically coupled to the circuit system, and each temperature sensor measures the individual temperature of the test device at different locations on the test device. More than two temperature sensors can be mounted on the circuit system to provide more granular temperature sensor data for the temperature of the test device. In some specific examples, the processing circuit system processes the temperature sensor data by determining the temperature difference between a first side of the test device upstream of the free airflow and a second side of the test device downstream of the free airflow.

[0016] The airflow sensor is mounted to and communicatively coupled to the processing circuitry via the circuitry. In some specific examples, at least a first airflow sensor is positioned upstream of the airflow and a second airflow sensor is positioned downstream of the airflow to determine specific characteristics of the airflow (e.g., fluid pressure drop along the test apparatus). In some specific examples, the airflow sensor measures at least one characteristic of the airflow, including any of the following: fluid pressure, airflow velocity, or airflow rate.

[0017] The thermoelectric component can be any suitable high-performance electrical component (e.g., an integrated circuit device, such as an application-specific integrated circuit (ASIC) device). In some specific instances, the circuit system includes a printed circuit board (PCB), which may include multiple dielectric layers on which the electrical component can be mounted. In some specific instances where the circuit system is enclosed by a top and bottom cover of a housing, the TIM can be positioned between at least one of the thermoelectric component of the circuit system and a thermally conductive cover (e.g., the top and bottom covers).

[0018] For the purposes of brevity and clarity, the features of this disclosure described herein are in the context of a package having an outer layer, an interface layer, a heat dissipation layer, and a circuit system. However, the principles of this disclosure can be applied to any other suitable context in which a package using a circuit system is employed.

[0019] In detail, this disclosure provides a testing apparatus and a method of using it, wherein the testing apparatus simulates a production unit to optimize the heat distribution of the production unit. The testing apparatus and the method of using it are provided to diagnose or design a production unit simulated by the testing apparatus. This ensures that the production unit can operate at a specific operating rate and generate a certain amount of heat without thermal throttling or the need to increase airflow between production units.

[0020] In some specific instances, the circuitry of the test apparatus may include any suitable processing circuitry, which may include any suitable processing chip (e.g., an application-specific integrated circuit (ASIC) chip) or processing core.

[0021] In some specific instances, the test apparatus and the method of using the test apparatus disclosed herein may include a circuit system that acts as a storage device system (e.g., an SSD storage system) including storage devices such as solid-state drives.

[0022] An SSD is a data storage device that uses integrated circuit assemblies as memory to persistently store data. SSDs do not have moving mechanical components, and this characteristic distinguishes them from traditional mechanical disks such as hard disk drives (HDDs) or floppy disks, which contain spinning platters and removable read / write heads. Compared to mechanical disks, SSDs are typically more resistant to physical shocks, operate quietly, and have shorter access times and less latency.

[0023] Many types of SSDs use NAND-based flash memory that retains data in the absence of power, and include a type of non-volatile storage technology. The Quality of Service (QoS) of an SSD can be related to the predictability of low latency and the consistency of high input / output operations per second (IOPS) when serving read / write input / output (I / O) workloads. This means that latency or I / O command completion time needs to be within a specified range without unexpected outliers. Transfer throughput or I / O rates may also need to be strictly controlled without causing a sharp drop in performance levels.

[0024] The subject matter of this disclosure can be better understood by referring to Figures 1 to 7.

[0025] FIG1 shows an exemplary perspective view through the top cover of the test apparatus 100 according to some specific embodiments of the present disclosure. In some specific embodiments, as illustrated in FIG1, the test apparatus 100 includes a top cover 102 enclosing a circuit system 104. The top cover 102 may include an airflow 101 or an inlet / outlet 103 for ambient air, which is positioned along or near the top cover. The circuit system 104 includes sensors 106 mounted on and communicatively coupled to the circuit system 104, including at least a first sensor located upstream of the airflow 101 and a second sensor located downstream of the airflow 101. In some specific embodiments, each of the first and second sensors is an airflow sensor (e.g., airflow sensor 110). The sensors 106 also include a temperature sensor 108 located at various positions along the circuit system 104. In some specific instances, depending on the device being simulated by the test apparatus 100, the test apparatus 100 may not include the top cover 102. Although the circuit system 104 is shown as a printed circuit board (PCB), it should be understood that the circuit system 104 can be any form of circuit system (e.g., flexible circuit system, PCB) including a plurality of sensors and thermoelectric components. In some specific instances, the circuit system 104 includes at least one electrical component that generates heat when the test apparatus 100 is in operation. In some specific instances, the test apparatus 100 includes a thermal interface material (TIM) layer (not shown) disposed between and in thermal contact with the top cover 102 and the circuit system 104. In some specific instances, the TIM layer improves heat transfer from the thermoelectric components of the circuit system 104 to the top cover 102.

[0026] In some specific examples, the top cover 102 is thermally conductive to facilitate heat dissipation from the top cover 102 of the test apparatus 100 to the air near the test apparatus 100. In some specific examples, the airflow 101 travels along the test apparatus 100, wherein the airflow 101 can facilitate heat dissipation from the top cover 102 to the ambient air near the test apparatus 100. In some specific examples, the top cover 102 is part of the housing surrounding the circuit system 104, the shape factor of which matches the shape factor of the production apparatus simulated by the test apparatus. In some specific examples, the test apparatus 100 does not include the top cover 102, and the circuit system 104 is exposed to the ambient air and airflow 101 near the test apparatus. The test apparatus 100 may be positioned at least in proximity to a fan that provides the airflow 101 from upstream to downstream. In some specific examples, the test apparatus 100 is positioned within a rack housing having the production apparatus simulated by the test apparatus 100. In such a specific example, the testing device 100 and each production device are positioned parallel to each other, such that an airflow 101 formed by at least one fan flows along the space formed between each of the testing devices and the production devices.

[0027] In some specific embodiments, the circuit system 104 includes a processing circuit system. The processing circuit system may include a processor or processing unit implemented by hardware, software, or a combination thereof. The processing circuit system is used to receive sensor data from the sensor 106 indicating at least one characteristic of the airflow 101 of the test apparatus 100 and the temperature of the test apparatus 100. The processing circuit system is used to receive sensor data from each of the airflow sensors 110 and each of the temperature sensors 108. The processing circuit system then determines, based on the sensor data, a predicted ambient temperature close to that of the production facility simulated by the test apparatus 100. In some specific embodiments, an electrical pad or padded via penetrates the circuit system 104 and is configured to receive and electrically couple to the pins or pads of the sensor 106. In some specific embodiments, the circuit system 104 includes electrical components or sensors mounted on each side of the circuit system 104 (e.g., each side of the PCB). In some specific instances, circuit system 104 has a first shape factor that corresponds to a second shape factor of the production apparatus simulated by the test apparatus. The shape factor of circuit system 104 can be defined as the area occupied for thermal production or a three-dimensional (3-D) shape factor. In some specific instances, components of the production apparatus simulated by test apparatus 100 are replicated in test apparatus 100, wherein the configuration and position of each individual component are identical.

[0028] The test apparatus 100 includes temperature sensors 108 mounted on and electrically coupled to the circuit system 104. Each temperature sensor 108 measures the temperature of the test apparatus 100 at different locations within the test apparatus 100. In some embodiments, the test apparatus includes at least two temperature sensors 108 for measuring a first temperature of the test apparatus 100 upstream of the airflow 101 and a second temperature of the test apparatus 100 downstream of the airflow 101. In some embodiments, more than two temperature sensors 108 may be mounted on the circuit system 104 to provide more granular sensor data on the temperature of the test apparatus 100. Each temperature sensor 108 partially provides the temperature data of the test apparatus 100 to a processing circuit system to determine a predicted ambient temperature approximating the production facility simulated by the test apparatus 100. In some specific examples, the processing circuit system processes sensor data by determining the temperature difference between the test device 100 on the first side upstream of the free airflow 101 and the test device 100 on the second side downstream of the free airflow 101.

[0029] The airflow sensor 110 is communicatively coupled to the processing circuitry via the circuitry 104. In some specific embodiments, there is at least a first airflow sensor disposed upstream of the airflow 101 and a second airflow sensor disposed downstream of the airflow 101. In some specific embodiments, the airflow sensor 110 measures at least one characteristic of the airflow 101, including any of the following: fluid pressure drop along the test device, airflow velocity, or airflow rate.

[0030] Once the processing circuitry of circuitry system 104 receives sensor data from sensor 106, it determines a predicted ambient temperature close to the production facility based on the sensor data. In some instances, the sensor data includes airflow sensor data and temperature sensor data. In some instances, the processing circuitry system calculates the average temperature of the received temperature sensor data. In other instances, the processing circuitry system determines the highest temperature value among the received temperature sensor data. The processing circuitry system can use the airflow sensor data to calculate processed data indicating at least one characteristic of the airflow 101 of test apparatus 100. The processing circuitry system then uses this data to determine a predicted ambient temperature close to the production facility under the same conditions of the test apparatus. The processing circuitry system can determine a predicted ambient temperature close to the production facility based on airflow velocity and any of the following: temperature of test apparatus 100, fluid pressure drop along the test apparatus, and airflow rate. In some instances, the processing circuitry system determines a predicted ambient temperature close to the production facility based on previous data collection iterations.

[0031] In some specific examples, the testing device 100 may include additional sensors, including accelerometers and strain gauges, to determine sensor data indicating mechanical stress on the testing device 100. This additional sensor data received by the processing circuitry of the circuitry 104 enables the processing circuitry to determine the expected amount of mechanical stress applied to the production equipment simulated by the testing device 100. The collection and determination of mechanical stress data on the testing device 100 may lead to design modifications or changes to the production equipment. In addition, the testing device 100 may be used as a diagnostic tool to determine the mechanical stress applied to the production equipment during operation. The testing device 100 may include at least one accelerometer mounted on the circuitry 104 to determine movement, acceleration, or jerk in any three-dimensional direction. Strain gauges may be mounted on the circuitry 104 to determine strain on the circuitry 104. Mechanical strain on the testing device 100 may cause operational malfunctions or damage to the testing device 100.

[0032] It should be understood that although the test apparatus 100 depicts a specific instance in which the circuit system 104 is enclosed by a top cover 102 according to this disclosure, any other suitable enclosure may be implemented in a similar manner.

[0033] For purposes of clarity and brevity, and not as a limitation, this disclosure is provided in the context of the test apparatus 100 and its method, providing the features and functionality disclosed herein. The test apparatus 100 can be used to optimize at least one electrical device, such as a server device or storage device having various form factors. In some specific instances, the test apparatus 100 can also be used as a post-manufacturing verification device for production equipment, or as a thermal cooling diagnostic device for production equipment.

[0034] FIG2 shows an exemplary perspective view through a bottom cover 202 of a test apparatus 200 (similar to the test apparatus 100 of FIG1) according to some specific embodiments of the present disclosure. In some specific embodiments, as illustrated in FIG2, the test apparatus 200 includes a bottom cover 202 enclosing a circuit system 104. Similarly depicted in FIG1, the test apparatus 200 includes a sensor 106 mounted on and communicatively coupled to this bottom side of the circuit system 104, wherein the bottom side is defined as one side of the circuit system 104 facing the bottom cover 202. In some specific embodiments, the circuit system is enclosed by a housing including a top cover 102 and a bottom cover 202. A temperature sensor 108 is disposed at various locations along the circuit system 104. In some specific embodiments, the test apparatus 200 may not include the bottom cover 202, thereby exposing the circuit system 104 to ambient air and airflow 101.

[0035] In some specific examples, the circuit system 104 includes at least one thermoelectric component 204 that generates heat when the test apparatus 200 is in operation. The thermoelectric component 204 is used to simulate the heat generation of a production apparatus optimized by the test apparatus 200. In some specific examples, the thermoelectric component 204 includes at least one resistor to act as a heat-generating load when current passes through each individual resistor. In some specific examples, the heat generated by the thermoelectric component 204 can be configured by the circuit system 104. For example, the processing circuitry of the circuit system 104 can cause a change in the current supplied to the thermoelectric component 204 to alter the heat generated by the test apparatus 200. When more current is supplied to the thermoelectric component 204 (e.g., the resistor), the thermoelectric component 204 generates more heat. Therefore, for each form factor of the apparatus simulated by the test apparatus 200, there is a range of applications for which the test apparatus 200 can be used.

[0036] In some specific examples, the test apparatus 200 includes a thermal interface material (TIM) layer (not shown) disposed between and in thermal contact with the thermoelectric component 204 and the base cover 202. In some specific examples, the TIM layer improves heat transfer from the thermoelectric component 204 of the circuit system 104 to the base cover 202. In some specific examples, the base cover 202 is thermally conductive to facilitate further heat dissipation.

[0037] FIG3 illustrates an exemplary depiction of a sensor system 300 for determining at least one airflow characteristic of an airflow traveling along a test apparatus, according to some specific embodiments of the present disclosure. In some specific embodiments, the sensor system 300 includes a breakout printed circuit board (PCB) 302, which may be part of the circuit system 104 of the test apparatus (e.g., test apparatus 100). In some specific embodiments, the breakout PCB 302 is communicatively coupled to a processing circuit system so that the processing circuit system receives measured sensor data indicating at least one characteristic of the airflow of the test apparatus. In some specific embodiments, the sensor 110 includes a pin 304 electrically coupled to the breakout PCB 302. In some specific embodiments, the sensor 110 is mounted on the breakout PCB 302 by solder mounts or by any other suitable mount. Additionally, sensor 110 includes a pathway to inlet / outlet point 103 for measuring at least one characteristic of the airflow (e.g., airflow 101) of the test apparatus. In some embodiments, inlet / outlet point 103 allows sensor 110 to allow ambient air or the airflow (e.g., airflow 101) of the test apparatus to enter or exit, which may be located outside the housing surrounding circuitry 104. In some embodiments, sensor 110 collects data on the airflow traveling along the test apparatus or ambient air data. In some embodiments, sensor 110 collects data indicating at least one of the following: fluid pressure drop along the test apparatus, airflow velocity, or airflow rate.

[0038] Figure 4 shows an exemplary cross-sectional view of a test apparatus 400, including a circuit system 104 enclosed by a top cover 102 and a bottom cover 102. In some specific examples, the test apparatus 400 includes a sensor 106 mounted on the circuit system 104. The test apparatus 400 also includes a thermoelectric component 204 to simulate the heat generated by components of a production apparatus during operation. As seen in the previous figures, the sensor 106 includes at least one temperature sensor 108 for determining the temperature of the test apparatus 400, and at least two airflow sensors (e.g., a first airflow sensor 402 and a second airflow sensor 404) for determining at least one airflow characteristic of the airflow 101. In some specific examples, the first airflow sensor 402 is positioned upstream of the airflow 101 and the second airflow sensor 404 is positioned downstream of the airflow 101. In some specific examples, the processing circuitry of circuit system 104 receives sensor data from each of temperature sensor 108 and airflow sensors (e.g., first airflow sensor 402 and second airflow sensor 404). In some specific examples, the processing circuitry of circuit system 104 determines a predicted ambient temperature close to the production facility simulated by the test apparatus based on the airflow sensor data and temperature sensor data. In some specific examples, the processing circuitry calculates an ambient air temperature close to the test apparatus. In some specific examples, the processing circuitry calculates the average temperature of the received temperature sensor data. In some specific examples, the processing circuitry uses the airflow sensor data to calculate processed data indicating at least one characteristic of the airflow 101 of test apparatus 400. The processing circuitry then uses this data to determine a predicted ambient temperature close to the production facility under the same conditions of test apparatus 400. The processing circuitry can determine a predicted ambient temperature close to the production facility based on airflow velocity and any of the following: temperature of the test apparatus, fluid pressure drop along the test apparatus, and airflow rate. In some specific examples, the fluid pressure drop along the testing device is determined by measuring the fluid pressure from each of the first airflow sensor 402 and the second airflow sensor 404 and calculating the difference between the respective measured fluid pressures. In some specific examples, the processing circuitry determines the predicted ambient temperature of the production facility based on previous data collection.

[0039] Figure 5 shows an exemplary exploded view of a test package 500 according to some specific embodiments of the present disclosure. In some specific embodiments, the test package 500 includes at least one thermal interface material (TIM) layer 502 disposed between the circuit system 104 and at least one of: a top cover 102 or a bottom cover 202. In some specific embodiments, each TIM layer 502 is disposed in thermal contact with and coplanar with a thermoelectric component and any of: the top cover 202 or the bottom cover 202. Each TIM layer 502 is configured to transfer heat from the thermoelectric component to either the top cover 102 or the bottom cover 202. The TIM layer assists in the heat dissipation of heat generated by the thermoelectric component throughout the test package 500. The TIM layer 502 is made of any thermally conductive material to transfer heat from the thermoelectric element of the circuit system 104 to either the top cover 102 or the bottom cover 202.

[0040] Figure 6 illustrates a flowchart of exemplary steps of process 600 according to some specific embodiments of the present disclosure, used to determine at least one airflow characteristic for optimizing the temperature distribution of the device. In some specific embodiments, the mentioned test device, airflow of the test device, top cover, inlet / outlet point, circuit system, sensor, temperature sensor, airflow sensor, bottom cover, and thermoelectric component can be implemented as test device 100, airflow 101 of the test device, top cover 102, inlet / outlet point 103, circuit system 104, sensor 106, temperature sensor 108, airflow sensor 110, bottom cover 202, and thermoelectric component 204, respectively. In some specific embodiments, process 600 can be modified by, for example, reconfiguration, alteration, addition, and / or removal steps.

[0041] At step 602, a plurality of sensors are used to determine at least one airflow characteristic of the airflow of the test device and at least one temperature of the test device, wherein the plurality of sensors includes a first sensor disposed upstream of the airflow and a second sensor disposed downstream of the airflow. In some specific examples, at least one temperature of the test device is determined by a temperature sensor mounted on the circuit system. In some specific examples, at least one airflow characteristic of the airflow of the test device is determined by at least two sensors (e.g., airflow sensors), with the first sensor disposed upstream of the airflow and the second sensor disposed downstream of the airflow. In some specific examples, at least one airflow characteristic includes any of the following: fluid pressure drop along the test device, airflow velocity, and airflow rate.

[0042] At step 604, sensor data indicating at least one characteristic of the airflow of the test apparatus and at least one temperature of the test apparatus are received from a plurality of sensors. In some specific embodiments, the sensor data includes temperature sensor data and airflow sensor data. In some specific embodiments, a processing circuit system receives sensor data from each of the sensors via a circuit system on which sensors (e.g., temperature sensors and airflow sensors) are mounted. In some specific embodiments, the circuit system includes surface traces or internal electrical traces within the circuit system to transmit signals (e.g., sensor data) from each sensor to the processing circuit system of the circuit system for processing.

[0043] At step 606, a predicted ambient temperature close to the production facility is determined based on sensor data. In some specific examples, the processing circuitry of the circuit system determines the predicted ambient temperature close to the production facility simulated by the test apparatus based on airflow sensor data and temperature sensor data. In some specific examples, the processing circuitry calculates the ambient air temperature close to the test apparatus. In some specific examples, the processing circuitry calculates the average temperature of the received temperature sensor data. In other specific examples, the processing circuitry determines the highest temperature value among the received temperature sensor data. In some specific examples, the processing circuitry uses airflow sensor data to calculate processed data indicating at least one characteristic of the airflow of the test apparatus. The processing circuitry then uses this data to determine the predicted ambient temperature close to the production facility under the same conditions of the test apparatus. The processing circuitry may determine the predicted ambient temperature close to the production facility based on airflow velocity and any of the following: the temperature of the test apparatus, the fluid pressure drop along the test apparatus, and the airflow rate. In some specific instances, the processing circuitry determines the predicted ambient temperature of the production facility based on previous data collection. In some specific instances, the processing circuitry can perform a repetitive process 600 for any thermal regeneration generated by thermoelectric components configured by the processing circuitry.

[0044] Unless otherwise expressly specified, the terms "a specific instance", "specific instance (embodiment)", "specific instances (embodiments)", "the specific instance", "these specific instances", "one or more specific instances", "some specific instances" and "a specific instance" mean "one or more (but not all) specific instances".

[0045] Figure 7 shows a flowchart illustrating exemplary steps of a subprocess 700, based on sensor data, to determine a predicted ambient temperature close to that of the production facility (as shown in step 606 of Figure 6) according to some specific examples of this disclosure. In some specific examples, the mentioned test apparatus, airflow of the test apparatus, top cover, inlet / outlet point, circuit system, sensor, temperature sensor, airflow sensor, bottom cover, thermoelectric component, first airflow sensor, and second airflow sensor can be implemented as test apparatus 100, airflow 101 of the test apparatus, top cover 102, inlet / outlet point 103, circuit system 104, sensor 106, temperature sensor 108, airflow sensor 110, bottom cover 202, thermoelectric component 204, first airflow sensor 402, and second airflow sensor 404, respectively. In some specific examples, subprocess 700 can be modified by, for example, reconfiguration, alteration, addition, and / or removal steps.

[0046] At step 702, the processing circuitry calculates processed data indicating at least one characteristic of the airflow of the test apparatus based on the received airflow sensor data. For example, the processing circuitry can use the airflow sensor data received from the airflow sensor to calculate the value of the fluid pressure drop along the test apparatus. In such an example, the fluid pressure drop along the test apparatus is calculated by determining the difference between a first fluid pressure determined at a first airflow sensor located upstream of the airflow and a second fluid pressure determined at a second airflow sensor located downstream of the airflow. The fluid pressure drop is an indicator of at least one characteristic of the airflow, which can be calculated by the processing circuitry based on the airflow sensor data. In some specific examples, the processing circuitry can determine the airflow velocity or airflow rate of the airflow of the test apparatus based on the airflow sensor data.

[0047] At step 704, the processing circuitry determines a predicted ambient temperature close to the production facility based on the calculated processed data and at least one temperature of the test apparatus. In some specific instances, the processing circuitry calculates the predicted ambient temperature close to the production facility based on airflow sensor data and temperature sensor data. The processing circuitry can determine the predicted ambient temperature close to the production facility based on previous iterations of data collection, and thus can correlate sensor data indicating at least one characteristic of the airflow with the predicted ambient temperature close to the production facility. In some specific instances, the predicted ambient temperature close to the production facility is determined without processing the airflow sensor data into processed data indicating at least one characteristic of the airflow. The processing circuitry determines the predicted ambient temperature close to the production facility based on the calculated processed data indicating two of the characteristics of the airflow to the test apparatus, including: fluid pressure drop along the test apparatus, airflow velocity, airflow rate, or ambient temperature.

[0048] For example, the processing circuitry may receive temperature sensor data indicating a test device temperature of 55°C, and airflow sensor data processed at step 702 to calculate a fluid pressure drop of 56 Pa along the test device. In some specific instances, the processing circuitry determines the corresponding airflow velocity of the airflow in the test device to be 524 linear feet per minute (LFM) based on the fluid pressure drop. Based on previous data collection, the processing circuitry determines that the temperature rise corresponding to 524 LFM is 20°C. Therefore, the processing circuitry calculates a predicted ambient temperature close to 35°C for the production facility simulated by the test device.

[0049] Unless otherwise expressly specified, the terms "including", "comprise", "have" and variations thereof mean "including but not limited to".

[0050] Unless otherwise expressly specified, the list of items does not imply that any or all of the items are mutually exclusive.

[0051] Unless otherwise expressly specified, the terms “a”, “an” and “the” mean “one or more”.

[0052] Unless otherwise expressly specified, devices communicating with each other need not be in constant communication with each other. In addition, devices communicating with each other may communicate directly or indirectly through one or more intermediaries.

[0053] Describing a specific instance of several components communicating with each other does not imply the need for all such components. Instead, describing a variety of components, chosen as appropriate, illustrates a wide range of possible specific instances. Furthermore, while process steps, method steps, algorithms, or the like may be described sequentially, such processes, methods, and algorithms may be configured to operate in an alternating order. In other words, any sequence or order of steps that can be described does not necessarily indicate the need for steps to be performed in that order. The process steps described herein can be performed in any actual order. Moreover, some steps may be performed simultaneously.

[0054] When this document describes a single device or article, it will be apparent that more than one device or article (whether or not they collaborate) may be used in place of the single device / article. Similarly, when this document describes more than one device or article (whether or not they collaborate), it will be apparent that a single device / article may be used in place of more than one device or article, or a different number of devices / articles may be used instead of the number of devices or programs shown. The functionality and / or features of a device may alternatively be embodied by one or more other devices that are not explicitly described as having such functionality / features. Therefore, other specific instances need not include the device itself.

[0055] At least some operations may be illustrated in the diagrams as events occurring in a certain order. In alternative concrete instances, some operations may be performed, modified, or removed in a different order. Furthermore, steps may be added to the logic described above while still conforming to the described concrete instances. In addition, the operations described herein may occur sequentially or some operations may be processed in parallel. Furthermore, operations may be performed by a single processing unit or by distributed processing units.

[0056] The foregoing description of various specific examples is presented for illustrative and descriptive purposes. It is not intended to be exhaustive or limited to the precise form disclosed. In view of the foregoing teachings, various modifications and variations are possible. [Simplified Explanation of the Diagram]

[0005] The following description includes discussions of figures that illustrate specific implementations of the present disclosure by way of example. The figures should be understood as examples rather than limitations. As used herein, references to one or more “specific examples” should be understood as describing a particular feature, structure, and / or characteristic included in at least one implementation. Therefore, phrases such as “in one specific example” or “in an alternative specific example” appearing herein describe various specific examples and implementations and do not necessarily refer to the same specific example. However, these phrases are not necessarily mutually exclusive.

[0006] [Figure 1] shows an illustrative perspective view through the top cover of the test apparatus according to some specific examples of the present disclosure;

[0007] [Figure 2] shows an exemplary perspective view of the bottom cover through the test apparatus (similar to the test apparatus in Figure 1) according to some specific examples of this disclosure;

[0008] [Figure 3] shows an illustrative depiction of a sensor for determining at least one airflow characteristic of the airflow of a test apparatus according to some specific examples of the present disclosure;

[0009] [Figure 4] shows an exemplary cross-sectional view of a test apparatus according to some specific examples of this disclosure;

[0010] [Figure 5] An exemplary exploded view showing a test apparatus according to some specific examples of this disclosure;

[0011] [Figure 6] shows a flowchart illustrating exemplary steps of using a test apparatus according to some specific examples of the present disclosure; and [Figure 7] shows a flowchart illustrating exemplary steps of a subprocess based on sensor data to determine the predicted ambient temperature close to the production facility according to some specific examples of the present disclosure.

Claims

1. A testing apparatus comprising: a circuit system having a first shape factor corresponding to a second shape factor of a production apparatus, the circuit system comprising: a plurality of thermoelectric components for simulating heat generation of the production apparatus; a plurality of sensors for measuring at least one characteristic of an airflow of the testing apparatus and measuring at least one temperature of the testing apparatus, wherein the plurality of sensors includes a first sensor disposed upstream of the airflow and a second sensor disposed downstream of the airflow; and a processing circuit system for: receiving sensor data from the plurality of sensors indicating the at least one characteristic of the airflow of the testing apparatus and the at least one temperature of the testing apparatus, and determining, based on the sensor data, a predicted ambient temperature close to that of the production apparatus.

2. The test apparatus of claim 1, further comprising: a housing including a top cover and a bottom cover; and at least one thermal interface material (TIM) layer disposed between the circuit system and at least one of the following: the top cover or the bottom cover.

3. The test apparatus of claim 1, wherein the plurality of sensors includes at least one temperature sensor.

4. The test apparatus of claim 1, wherein each of the first sensor and the second sensor is a fluid pressure sensor.

5. The test apparatus of claim 1, wherein the at least one characteristic of the airflow includes at least one of the following: fluid pressure drop along the test apparatus, airflow velocity, airflow rate, or ambient temperature.

6. The test apparatus of claim 1, further comprising a power generation circuit system, wherein the heat generated by the plurality of thermoelectric components can be configured by changing the amount of power supplied by the power generation circuit system to the plurality of thermoelectric components.

7. The test apparatus of claim 1, further comprising at least one fan positioned close to the test apparatus to provide the airflow from the upstream to the downstream.

8. The test apparatus of claim 1, wherein the circuit system includes a printed circuit board (PCB) on which the plurality of sensors and the plurality of thermoelectric components are mounted.

9. The test apparatus of claim 1, wherein the processing circuit system is further configured to: determine the ambient temperature of the test apparatus based on the sensor data; and determine the predicted ambient temperature of the production apparatus based on the determined ambient temperature of the test apparatus.

10. The testing apparatus of claim 1, wherein the first shape factor of the circuit system is the same as the second shape factor of the production apparatus.

11. A method of using a testing apparatus, the testing apparatus comprising: a circuit system having a first shape factor corresponding to a second shape factor of a production apparatus, the circuit system comprising: a plurality of thermoelectric components, the method comprising: using a plurality of sensors to determine at least one airflow characteristic of an airflow of the testing apparatus and at least one temperature of the testing apparatus, wherein the plurality of sensors includes a first sensor disposed upstream of the airflow and a second sensor disposed downstream of the airflow; receiving sensor data from the plurality of sensors indicating the at least one characteristic of the airflow of the testing apparatus and the at least one temperature of the testing apparatus; and determining a predicted ambient temperature close to the production apparatus based on the sensor data.

12. The method of using a test apparatus as claimed in claim 11, wherein receiving data from the plurality of sensors includes: receiving sensor data from at least one temperature sensor.

13. The method of using a test apparatus as claimed in claim 11, wherein the plurality of sensors are used to determine at least one characteristic of the airflow of the test apparatus, wherein the plurality of sensors includes a first sensor disposed upstream of the airflow and a second sensor disposed downstream of the airflow, comprising: using the first sensor and the second sensor to determine at least one airflow characteristic of the airflow of the test apparatus, wherein each of the first sensor and the second sensor is a fluid pressure sensor.

14. The method of using a test apparatus as claimed in claim 11, wherein determining at least one characteristic of the airflow of the test apparatus and the at least one temperature of the test apparatus comprises: determining at least one of the following: fluid pressure drop along the test apparatus, airflow velocity, airflow rate, or ambient temperature.

15. The method of using a test apparatus as claimed in claim 11, wherein the test apparatus further includes a power generation circuit system, the method further comprising: changing the heat generated by the plurality of heat-generating electrical components by changing the amount of power supplied by the power generation circuit system to the plurality of heat-generating electrical components of the test apparatus.

16. The method of using the test apparatus as claimed in claim 11, further comprising positioning a fan close to the test apparatus to provide the airflow from the upstream to the downstream.

17. The method for using a testing apparatus as claimed in claim 11, further comprising: determining the ambient temperature of the testing apparatus based on the sensor data; and determining a predicted ambient temperature close to that of the production apparatus based on the determined ambient temperature of the testing apparatus.

18. The method of using a testing apparatus as described in claim 11, wherein the first shape factor of the circuit system is the same as the second shape factor of the production apparatus.

19. A production apparatus comprising a production circuit system configured based on a predicted ambient temperature determined using a testing device, the testing device comprising: a testing circuit system having a first shape factor corresponding to a second shape factor of the production apparatus, the testing circuit system comprising: a plurality of thermoelectric components for simulating heat generation of the production apparatus; a plurality of sensors for measuring at least one characteristic of an airflow of the testing device and measuring at least one temperature of the testing device, wherein the plurality of sensors includes a first sensor disposed upstream of the airflow and a second sensor disposed downstream of the airflow; and a processing circuit system for: receiving sensor data from the plurality of sensors indicating the at least one characteristic of the airflow of the testing device and the at least one temperature of the testing device, and determining, based on the sensor data, that the predicted ambient temperature is close to that of the production apparatus.

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