Apparatus and method for testing a semiconductor package

Abstract

This application provides an apparatus for testing semiconductor packages, comprising: a test board; an adapter socket disposed on and electrically coupled to the test board; a first reference module and a second reference module, each detachably disposed in a reference socket of the adapter socket; and a test socket disposed on the adapter socket. The test socket includes: a socket body having a test socket for housing the semiconductor package, and defining a lower cavity below the test socket, together with the adapter socket, for receiving the first reference module or the second reference module; and a plurality of contact posts extending perpendicularly through the socket body between the test socket and the lower cavity, and movable perpendicularly relative to the socket body.

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