Composite seal for semiconductor manufacturing device

USD1071887SActive Publication Date: 2025-04-22VALQUA LTD
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Patent Information

Application Number
US35/518613
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2023-01-31
Filing Date
2023-07-25
Publication Date
2025-04-22
Estimated Expiration
2040-04-22

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Description

[0001] 1. Composite seal for semiconductor manufacturing device

[0002] 1.1 : Perspective

[0003] 1.2 : Top

[0004] 1.3 : Front

[0005] 1.4 : Cross section taken along line 1.4-1.4 in view 1.2

[0006] 1.5 : Enlarged portion view taken from encircled portion labeled, “1.5,” in view 1.4

[0007] 1.6 : Right

[0008] 1.7 : Bottom

[0009] 1.8 : Back

[0010] 1.9 : Left

[0011] The dot-dashed lines show the boundary of the enlarged view of 1.5 in views 1.4 and 1.5 and form no part of the claimed design.

Claims

The ornamental design for a composite seal for semiconductor manufacturing device as shown and described.

Citation Information

Patent Citations

  • Composite sealing material

    CN304331390S

  • Composite sealant

    JP1397981S

  • Composite sealing material

    JP1599351S

  • Composite seal material

    JP1607739S

  • Deep learning system based on lidar sensor characteristics for compatibility with artificial intelligence recognition models of heterogeneous autonomous vehicles and method thereof

    KR102918002B1

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