Semiconductor element test socket

Abstract

A semiconductor element test socket according to the present invention comprises: a contactor for electrically connecting a contact terminal of a semiconductor element to a contact pad of a test device, the contactor having a contact connection part formed by multiple columns, which are separated from each other, longitudinally parallel to each other, and elastically deformable to support a lower contact part in contact with the contact pad and an upper contact part in contact with the contact terminal; a shielding structure wrapped around the contactor to form an inner space and electrically grounded; and an elastic material filling the inner space to support the contactor and the shielding structure.

Description

Semiconductor device test socket

[0001] The present invention relates to a semiconductor device test socket that electrically connects a contact terminal of a semiconductor device and a contact pad of a test device using a contactor of an improved structure.

[0002] After the assembly process of various electronic products such as semiconductor devices is performed, in order to inspect for defects in the IC package within the product, a test device that applies an electrical signal to the semiconductor device corresponding to the inspection target and analyzes the electrical characteristics of the inspection target must be electrically connected to the inspection target, and for this purpose, a separate semiconductor device test socket is required in the inspection process.

[0003] Examples of sockets for electrical components equipped with probe pins called pogo pins, which are used as contactors for electrically connecting semiconductor devices such as IC packages, include Japanese Patent No. 5276430 and Japanese Patent No. 6116112. The probe pins in these documents have a complex pin structure in which a plunger and a coil spring are inserted and combined inside a barrel, requiring various equipment and molds to manufacture the pins, which not only increases the manufacturing cost, but also makes manufacturing more difficult when the pin length is short.

[0004] Other conventional contactors, which fill through-holes in the body with elastically compressible conductive particles, and when an external force is applied to the semiconductor device under test, the conductive particles are compressed and electrically connected, examples of which include U.S. Patent No. 9,696,344 and Korean Patent No. 1,593,936. However, the conductive particles used in these documents have poor electrical connection performance due to foreign substances generated as the inspection process increases, and in particular, have low reliability for high-speed signal transmission. In addition, if the shape of the conductive particles is deformed or dislodged, the electrical connection function is damaged, and if excessive pressure is applied due to repeated inspection, damage to the conductive particles can be accelerated. Due to these drawbacks, semiconductor device test sockets that use conductive particles filled in through-holes as contactors have short lifespans and low test accuracy.

[0005] [Document 1] Japanese Patent No. 5276430

[0006] [Document 2] Japanese Patent No. 6116112

[0007] [Document 3] U.S. Patent No. 9696344

[0008] [Document 4] Korean Patent No. 1593936

[0009] [Document 5] Korean Patent Publication No. 10-2011-0101986

[0010] [Document 6] U.S. Patent No. 11204369

[0011] The rapid growth of IT devices has accelerated the miniaturization and thinning of packages, leading to increasingly finer pitches, with 0.3mm-pitch devices becoming commercially available. To reliably test these fine-pitch devices, a semiconductor device test socket that can flexibly accommodate ultra-fine-pitch packages is needed, moving beyond conventional methods.

[0012] In U.S. Patent No. 11,204,369, the applicant proposed a socket device for testing BGA-type semiconductor packages. To minimize electrical interference during the testing process, impedance matching is required to match the characteristic impedance of the semiconductor device test socket transmitting the test signal. The shape and geometry of the shielding structure and contactor are critical factors in the impedance matching design.

[0013] In the above U.S. Patent No. 11,204,369, as illustrated in FIG. 1, an electrically grounded shielding structure (3) surrounds a contactor (2) like a fence to form an internal space (4), and the contactor has a buffer portion. The buffer portion has a plurality of first and second extension portions formed at intervals in the Z-axis direction at the center, and first and second connecting beams bent in the XY plane are formed between the first and second extension portions, and the first and second connecting beams are respectively connected to both ends of the eccentric extension portion. In view of the geometric structure of the buffer portion, the interval between the first and second extension portions and the shielding structure is relatively long, the interval between the eccentric extension portion and the eccentric structure is relatively short, and the first and second connecting beams have relative distances from the shielding structure that vary depending on the bent portion. The spacing between all parts of the contactor and the shielding structure is not the same, which can cause impedance matching errors and signal interference when transmitting test signals, which can adversely affect electrical characteristics.

[0014] In addition, the upper contact terminal (27) of the contactor (2) has a structure in which a first extension portion (26) is supported by a shaft in the center. When the upper contact terminal (27) of the exposed contactor contacts the ball, the phenomenon of the first extension portion (26), which corresponds to the neck, tilting continues, causing deformation of the contactor, which weakens the durability of the contactor. In addition, when the heights of the balls of the connection terminals of a semiconductor device, for example, BGA type, are different, the contact ability of multiple contactors that are densely arranged may be reduced overall depending on the height deviation of the balls.

[0015] The purpose of the present invention is to provide a semiconductor device test socket that can ensure a simple path for a signal transmitted to a contact terminal of a semiconductor device, guarantee signal integrity characteristics, and enhance the durability of the contactor by using a contactor having a contact connection formed of a plurality of elastically deformable pillars.

[0016] In order to achieve the above object, a semiconductor device test socket according to the present invention is characterized by including: a contactor having a contact connection portion formed of a plurality of longitudinally parallel pillars that are elastically deformable and separated from each other to electrically connect a contact terminal of a semiconductor device and a contact pad of a test device and support a lower contact portion that contacts the contact pad and an upper contact portion that contacts the contact terminal; a shielding structure that wraps around the contactor to form an internal space and is electrically grounded; and an elastic body filled in the internal space to support the contactor and the shielding structure.

[0017] In addition, the plurality of columns of the contact connection portion are characterized in that they form a step by combining vertical legs extending in the vertical direction and horizontal legs extending in the horizontal direction.

[0018] In addition, the plurality of columns are characterized in that they are bent in a snake shape by combining the vertical legs and horizontal legs.

[0019] Additionally, the horizontal leg is characterized by having an arc shape.

[0020] In addition, the lower contact portion and the upper contact portion are characterized by being plate-shaped.

[0021] In addition, the upper surface of the lower plate of the lower contact portion faces the lower surface of the upper plate of the upper contact portion, the central region and the border region of the lower plate correspond to the central region and the border region of the upper plate, and the plurality of pillars of the contact connection portion are positioned in a space connecting the border region of the lower plate and the border region of the upper plate, and at the same time do not encroach on the space connecting the central region of the lower plate and the central region of the upper plate.

[0022] In addition, the shielding structure is characterized in that it is formed of a grid partition.

[0023] According to an embodiment, a shielding structure is applied to suppress signal interference and noise and distortion caused by high-frequency signals, and a test signal is stably transmitted through a contact connection formed by a plurality of pillars that maintain a certain distance from the shielding structure, thereby ensuring good electrical characteristics and signal integrity.

[0024] According to an embodiment, the contact connection portion can suppress physical deformation of the contactor by applying a geometric structure formed by a plurality of elastically deformable pillars that compensate each other so as not to tilt, thereby enhancing the durability of the contactor.

[0025] Figure 1 is a perspective view of a conventional semiconductor device test socket.

[0026] FIG. 2a is a perspective view of a semiconductor device test socket according to an embodiment of the present invention;

[0027] Figure 2b is a cross-sectional view of a semiconductor device test socket according to an embodiment of the present invention;

[0028] FIG. 3 is a drawing for explaining a contactor according to an embodiment of the present invention;

[0029] FIG. 4 is a diagram illustrating an example of a semiconductor device test socket according to an embodiment of the present invention that electrically connects a semiconductor device to be tested and a test device for testing.

[0030] Figure 5 is a cross-sectional view showing an elastic deformation state of a contactor according to an embodiment of the present invention when in contact;

[0031] FIG. 6a is a perspective view of a semiconductor device test socket according to another embodiment of the present invention;

[0032] Figure 6b is a plan view and a bottom view of the semiconductor device test socket of Figure 6a.

[0033] Fig. 7 is a test graph for signal transmission characteristics of a semiconductor device test socket according to an embodiment of the present invention.

[0034] The present invention will be described by describing an embodiment of the present invention with reference to the attached drawings below.

[0035] Referring to FIG. 2a, a semiconductor device test socket (10) according to an embodiment of the present invention may include a contactor (100) and a shielding structure (103) that surrounds the contactor (100) to form an internal space (104).

[0036] In a semiconductor device test socket (10) according to an embodiment, a plurality of contactors (100) are arranged at regular intervals, and a plurality of shielding structures (103) are arranged corresponding to the plurality of contactors (100). The number and pitch of the contactors (100) arranged to form the semiconductor device test socket (10) may be modified depending on the contact terminal of the semiconductor device to be inspected.

[0037] Additionally, if the shielding structure (103) can perform a grounding function, the shape of the shielding structure can be modified in various ways.

[0038] Referring to Fig. 2b, a plurality of contactors (100) are isolated by a plurality of shielding structures (103), and the lower portions of the plurality of shielding structures (103) are electrically connected by a common ground portion (102) that is electrically grounded. An elastic body (101) is filled not only in the inner space (104) of the shielding structure (103) but also in the outer surface of the shielding structure (103).

[0039] An elastic body (101) supports a contactor (100) and a shielding structure (103). At this time, the upper and lower parts of the plurality of contactors (100) are exposed. The elastic body (101) may be formed of an elastically deformable material, for example, various synthetic rubbers and resins such as PDMS (Polydimethylsiloxane), polyurethane (PU), polyurethane acrylate (PUA), silicone rubber, and PMMA (Polymethylmethacrylate). The method for forming the elastic body (101) may apply a manufacturing method using MEMS technology as in U.S. Patent No. 11,204,369. In addition, the method for forming the contactor (100) may be formed by stacking conductive materials in layers (L1 to L9) using the MEMS technology as in U.S. Patent No. 11,204,369.

[0040] Referring to FIGS. 3 and 4, the contactor (100) may include a lower contact portion (110) that contacts a contact pad (31) of a test device (30), an upper contact portion (130) that contacts a contact terminal (21) of a semiconductor element (20), and a contact connection portion (120) that connects the lower contact portion (110) and the upper contact portion (130).

[0041] The lower contact portion (110) has a lower tip (111) protruding from the lower surface of the disc-shaped lower plate (112). The lower tip (111) is electrically connected to a test device (30), for example, a contact pad (31) of a substrate, and for this purpose, the lower tip (111) is not sealed to the elastic body (101) but is exposed to the outside.

[0042] The upper contact portion (130) has an upper tip (132) protruding from the upper surface of the disc-shaped upper plate (131). The upper tip (132) may be formed in a cross shape, but may be formed in various shapes as long as it can transmit a signal by contacting a contact terminal, for example, a solder ball.

[0043] The lower plate (112) and the upper plate (131) face each other, and the upper surface of the lower plate (112) and the lower surface of the upper plate (131) are supported by both sides of the contact connection portion (120).

[0044] The contact connection portion (120) may be formed by a plurality of elastically deformable columns. In an embodiment, the contact connection portion (120) is implemented by two columns, which are formed to be parallel in the longitudinal direction and have the same shape and are arranged separately from each other. As long as the lower contact portion (110) and the upper contact portion (130) can be connected, the number and shape of the columns may be changed.

[0045] The contact connection part (120) forms a step by combining vertical legs (121) (123) (125) extending in the vertical direction and horizontal legs (122) (124) extending in the horizontal direction, and forms a column structure of a certain height according to a connection structure in which, for example, one side of a horizontal leg is connected to one side of a vertical leg and one side of another vertical leg is connected to the other side of the horizontal leg. The vertical leg is formed in the shape of a bar, and the horizontal leg is formed in the shape of an arc, for example, a semicircle.

[0046] In one embodiment, a column extending in the longitudinal direction is formed by zig-zag connecting vertical and horizontal legs to form a kind of snake shape. The shape of the column can be modified, and for example, it can be formed by bending into a step shape.

[0047] The central region (A2) and the border region (A1) of the lower plate (112) correspond to the central region (A2) and the border region (A1) of the upper plate (131), and a plurality of pillars of the contact connection portion (120) are positioned in a space connecting the border region (A1) of the lower plate (112) and the border region (A1) of the upper plate (131). For example, the lower end (121-1) of the lower vertical leg (121) is formed in the border region (A1) of the lower plate (112), and the upper end (125-1) of the upper vertical leg (125) is formed in the border region (A1) of the upper plate (131). At this time, the pillars do not encroach on the space connecting the central region (A2) of the lower plate (112) and the central region (A2) of the upper plate (131). Another column placed on the opposite side also has the lower end (121-2) of the lower vertical leg formed in the edge area (A1) of the lower plate (112), and the upper end (125-2) of the upper vertical leg formed in the edge area (A1) of the upper plate (131).

[0048] When the upper tip (132) of the contactor (100) comes into contact with the contact terminal (21) of the semiconductor element (20) and is pressed, the contact connection portion (120) embedded in the elastic body (101) can be elastically deformed. Referring to FIG. 5, one side of the lower vertical leg (121) and one side of the upper vertical leg (125) come closer to each other, the gap between them becomes narrow, the lower vertical leg (121) and the upper vertical leg (125) tilt inward, and the lower horizontal leg (122) and the upper horizontal leg (124) tilt in the vertical direction. This elastic deformation of the contact connection portion (120) occurs in a plurality of pillars. Here, when elastic deformation occurs in one pillar, elastic deformation occurs in the opposite pillar in a direction that compensates for the tilt, so that the upper plate (131) is pressed in the vertical direction without tilting to one side. When the inspection process is completed and the external force on the upper tip (132) of the contactor (100) is removed, the contact connection portion (120) returns to its original position. In this way, the contact connection portion (120) can suppress physical deformation of the contactor by applying a geometric structure formed by a plurality of elastically deformable pillars that compensate for each other to prevent tilting, thereby enhancing the durability of the contactor.

[0049] Another embodiment described below is an example in which the shape of the shielding structure surrounding the contactor (100) is modified.

[0050] Referring to FIG. 6A, in a semiconductor device test socket (10A) according to another embodiment, a plurality of contactors (100) are isolated and an electrically grounded shielding structure (103A) is formed as a grid partition.

[0051] Referring to Fig. 6b, the contactor (100) can be divided into a first contactor (100-1) for transmitting a test signal of the test device (30) and a second contactor (100-2) for supplying power and grounding. Both the first contactor (100-1) and the second contactor (100-2) are each isolated by a grid-structured shielding structure (103A). The lower plate (112) of the first contactor (100-1) is not connected to the common ground portion (102), and the lower plate (112) of the second contactor (100-2) is connected to the common ground portion (102).

[0052] FIG. 7 is a test graph for signal transmission characteristics of a semiconductor device test socket according to an embodiment of the present invention, in which a plurality of contactors (100-1) are set to transmit test signals, and another plurality of contactors (100-2) are set to supply power and ground, and the contactor pitch is set to 0.6 mm. Here, the loss coefficient (Insertion Loss) represents the signal loss rate when a test signal is input to Port 1 and output to Port 2 from one contactor (100-1), for example. The reflection coefficient (Return Loss) represents the value at which a signal input to Port 1 from one contactor (100-1) is reflected and returns to Port 1, and it is necessary to design the reflection coefficient to be small. Crosstalk is, for example, a signal input to Port 1 of one contactor (100-1) that interferes with the signal input to Port 3 of another adjacent contactor (100-1) and the signal output to Port 4. Therefore, it is necessary to design the electrical grounding to prevent signal interference.

[0053] As a result of the test, the return loss S11 was -10 dB for a 67 GHz signal, the insertion loss S21 was -1 dB for a 69 GHz signal, and the crosstalk S31 and S41 were -40 dB for >80 GHz signals, confirming that the semiconductor test socket according to the embodiment can be used in an inspection process using a high-speed signal.

[0054] The above description of the present invention is for illustrative purposes only, and a person having ordinary skill in the art to which the present invention pertains will understand that the present invention can be easily modified into other specific forms without changing the technical idea or essential characteristics of the present invention.

[0055] The present invention can be applied to a semiconductor device test socket for applying an electrical signal to a semiconductor device to analyze its electrical characteristics.

Claims

1. A contactor having a contact connection portion formed of a plurality of columns that are elastically deformable and separated from each other and are parallel in the longitudinal direction to electrically connect a contact terminal of a semiconductor device and a contact pad of a test device and to support a lower contact portion that contacts the contact pad and an upper contact portion that contacts the contact terminal; An electrically grounded shielding structure surrounding the contactor to form an internal space; A semiconductor device test socket characterized by including an elastic body filled in the internal space to support the contactor and shielding structure.

2. In paragraph 1, A semiconductor device test socket characterized in that the plurality of pillars of the above contact connection portion form a step by combining vertical legs extending in a vertical direction and horizontal legs extending in a horizontal direction.

3. In paragraph 2, A semiconductor device test socket characterized in that the above plurality of pillars are bent in a snake shape by combining the vertical legs and horizontal legs.

4. In paragraph 2, A semiconductor device test socket characterized in that the above horizontal leg has an arc shape.

5. In paragraph 1, A semiconductor device test socket characterized in that the lower contact portion and the upper contact portion are plate-shaped.

6. In paragraph 5, The upper surface of the lower plate of the lower contact portion faces the lower surface of the upper plate of the upper contact portion, The central region and border region of the lower plate correspond to the central region and border region of the upper plate, A semiconductor device test socket characterized in that the plurality of pillars of the contact connection portion are positioned in a space connecting the edge area of ​​the lower plate and the edge area of ​​the upper plate and at the same time do not encroach on the space connecting the central area of ​​the lower plate and the central area of ​​the upper plate.

7. In paragraph 1, A semiconductor device test socket, characterized in that the above shielding structure is formed of a grid partition.

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