Display panel and display apparatus

Abstract

Disclosed are a display panel and a display apparatus. The display panel comprises an array substrate (101), a color filter substrate (102), a binding terminal (103), a connecting metal wire (104) and a chamfered structure (333), wherein one end of the connecting metal wire (104) at least covers a part of the binding terminal (103), and the other end of the connecting metal wire (104) is bent relative to the chamfered structure (333) and is attached onto a side surface of the array substrate (101). By means of the chamfered structure (333), the connecting metal wire (104) is directly electrically connected to a surface of the binding terminal (103), thereby improving the comprehensive performance of a narrow-bezel panel.

Description

Display panel and display device Technical Field

[0001] The present application relates to the technical field of display panel manufacturing, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display panel manufacturing technology, people have put forward higher requirements on various performances of display panels and devices.

[0003] Currently, market demand for narrower bezels for display panels is increasing. By reducing the bezels in the non-display area of ​​the display panel, the screen-to-body ratio of the display panel is increased, thereby improving the display quality. In traditional panel structures, narrow bezels are often achieved by modifying the display panel's binding structure to reduce the width of the panel's bezel area. For example, chip-on-flexible (COF) technology addresses the need for smaller electronic products by securing the control chip IC to a flexible circuit board and using side-bonding to reduce the bezel width of the binding area. However, in these technical solutions, because the width of the reserved binding area in existing display panels is generally narrow, the structural design of the side-mounted binding metal traces connecting to the binding terminals is unreasonable, resulting in a small contact area between the two. Furthermore, because the binding metal traces are located on the side of the panel, they are relatively thin. This further reduces the contact area between the thinner binding metal traces and the binding terminals, resulting in poor contact and conductivity between the side-mounted binding traces and the binding terminals, hindering further improvement in the overall performance of the display panel.

[0004] Therefore, it is necessary to propose solutions to the problems in the prior art. SUMMARY OF THE INVENTION

[0005] In summary, in the prior art, when setting up a narrow-frame display panel, the structure of the binding metal traces in the frame area of ​​the display panel and the contact effect between them are not ideal, which is not conducive to further improving the comprehensive performance of the narrow-frame display panel.

[0006] To solve the above problems, the embodiments of the present application provide a display panel and a display device to effectively improve the existing narrow-border display panel frame area, where the structural design and contact effect between the binding metal traces are not ideal, thereby reducing the quality and overall performance of the display panel.

[0007] To solve the above technical problems, a first aspect of an embodiment of the present application provides a display panel, including:

[0008] array substrate;

[0009] a color filter substrate, arranged in a box with the array substrate, with one end edge of the array substrate protruding from the color filter substrate;

[0010] binding terminals, at least part of which is arranged in a region of the array substrate protruding from the color filter substrate; and

[0011] a connecting metal wire electrically connected to the binding terminal;

[0012] The edge of the array substrate on the side where the binding terminal is provided is provided with a chamfered structure, one end of the connecting metal wire covers a portion of the surface of the binding terminal on the side opposite to the color filter substrate, and the other end of the connecting metal wire is bent along the chamfered structure and extends to the side surface of the array substrate;

[0013] The plurality of binding terminals are arranged at intervals, and each of the connecting metal wires is correspondingly arranged above each of the binding terminals and symmetrically arranged relative to the central axis of the binding terminal.

[0014] According to an embodiment of the present application, the display panel includes a display area and a non-display area arranged on one side of the display area;

[0015] The array substrate further includes a protrusion arranged in the non-display area, the binding terminal is arranged on a surface of the protrusion facing the color film substrate, and the overlapping area of ​​the connecting metal wire and the binding terminal is at least one third of the area of ​​the binding terminal.

[0016] According to one embodiment of the present application, the display panel further includes a sealant, which is correspondingly arranged between the color filter substrate and the array substrate. The sealant covers a portion of the binding terminal, and the edge of the sealant away from the display area is flush with the edge of the color filter substrate.

[0017] According to an embodiment of the present application, the length of the protrusion is set to 20um~35um.

[0018] According to an embodiment of the present application, the connecting metal wire includes a first connecting portion, a second connecting portion, and a third connecting portion;

[0019] The first connecting portion is in contact with the surface of the binding terminal, the second connecting portion is in contact with the surface of the chamfered structure, and the third connecting portion is in contact with the side surface in the thickness direction of the first substrate.

[0020] According to an embodiment of the present application, the thickness of the second connecting portion is greater than the film thickness of the third connecting portion.

[0021] According to an embodiment of the present application, the first substrate includes a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface are connected by the chamfered structure, and the first bonding surface faces the second substrate;

[0022] Wherein, the curvature between the chamfered structure and the first fitting surface is smaller than the curvature between the chamfered structure and the second fitting surface.

[0023] According to an embodiment of the present application, a plurality of grooves are further provided on the surface of the chamfered structure, the extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each of the connecting metal wires is correspondingly provided in each of the grooves.

[0024] According to an embodiment of the present application, the display panel further includes a flexible circuit board and a driving chip;

[0025] The driver chip is arranged on a side of the flexible circuit board close to the first substrate, and one end of the flexible circuit board is electrically attached to the connecting metal wire on the side of the first substrate, and the other end of the flexible circuit board is electrically connected to the driver chip.

[0026] According to a second aspect of the embodiments of the present application, a display panel is provided, including:

[0027] array substrate;

[0028] a color filter substrate, arranged in a box with the array substrate, with one end edge of the array substrate protruding from the color filter substrate;

[0029] binding terminals, at least part of which is arranged in a region of the array substrate protruding from the color filter substrate; and

[0030] a connecting metal wire electrically connected to the binding terminal;

[0031] In which, the edge of the array substrate on one side of the binding terminal is provided with a chamfered structure, one end of the connecting metal wire covers a portion of the surface of the binding terminal opposite to the color film substrate, and the other end of the connecting metal wire is bent along the chamfered structure and extends to the side of the array substrate.

[0032] According to an embodiment of the present application, the display panel includes a display area and a non-display area arranged on one side of the display area;

[0033] The array substrate further includes a protrusion arranged in the non-display area, the binding terminal is arranged on a surface of the protrusion facing the color film substrate, and the overlapping area of ​​the connecting metal wire and the binding terminal is at least one third of the area of ​​the binding terminal.

[0034] According to one embodiment of the present application, the display panel further includes a sealant, which is correspondingly arranged between the color filter substrate and the array substrate. The sealant covers a portion of the binding terminal, and the edge of the sealant away from the display area is flush with the edge of the color filter substrate.

[0035] According to an embodiment of the present application, the length of the protrusion is set to 20um~35um.

[0036] According to an embodiment of the present application, the connecting metal wire includes a first connecting portion, a second connecting portion, and a third connecting portion;

[0037] The first connecting portion is in contact with the surface of the binding terminal, the second connecting portion is in contact with the surface of the chamfered structure, and the third connecting portion is in contact with the side surface in the thickness direction of the first substrate.

[0038] According to an embodiment of the present application, the thickness of the second connecting portion is greater than the film thickness of the third connecting portion.

[0039] According to an embodiment of the present application, the first substrate includes a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface are connected by the chamfered structure, and the first bonding surface faces the second substrate;

[0040] Wherein, the curvature between the chamfered structure and the first fitting surface is smaller than the curvature between the chamfered structure and the second fitting surface.

[0041] According to an embodiment of the present application, a plurality of grooves are further provided on the surface of the chamfered structure, the extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each of the connecting metal wires is correspondingly provided in each of the grooves.

[0042] According to an embodiment of the present application, the display panel further includes a flexible circuit board and a driving chip;

[0043] The driver chip is arranged on a side of the flexible circuit board close to the first substrate, and one end of the flexible circuit board is electrically attached to the connecting metal wire on the side of the first substrate, and the other end of the flexible circuit board is electrically connected to the driver chip.

[0044] According to a third aspect of the embodiments of the present application, a display device is further provided, the display device including the display panel provided in the embodiments of the present application, the display panel including:

[0045] array substrate;

[0046] a color filter substrate, arranged in a box with the array substrate, with one end edge of the array substrate protruding from the color filter substrate;

[0047] binding terminals, at least part of which is arranged in a region of the array substrate protruding from the color filter substrate; and

[0048] a connecting metal wire electrically connected to the binding terminal;

[0049] In which, the edge of the array substrate on one side of the binding terminal is provided with a chamfered structure, one end of the connecting metal wire covers a portion of the surface of the binding terminal opposite to the color film substrate, and the other end of the connecting metal wire is bent along the chamfered structure and extends to the side of the array substrate.

[0050] According to an embodiment of the present application, the connecting metal wire includes a first connecting portion, a second connecting portion, and a third connecting portion;

[0051] The first connecting portion is in contact with the surface of the binding terminal, the second connecting portion is in contact with the surface of the chamfered structure, and the third connecting portion is in contact with the side surface of the array substrate in the thickness direction. Beneficial effects

[0052] In summary, the beneficial effects of the embodiments of the present application are:

[0053] The embodiment of the present application provides a display panel and a display device. The display panel includes a first substrate, a second substrate arranged in a box with the first substrate, a binding terminal and a connecting metal wire. A chamfered structure is provided on the edge of the first substrate close to the binding terminal, one end of the connecting metal wire at least covers a portion of the binding terminal, and the other end of the connecting metal wire is bent relative to the chamfered structure and attached to one side surface of the first substrate. In the embodiment of the present application, a chamfered structure is provided at the edge of the first substrate, and the connecting metal wire is directly electrically connected to the surface of the binding terminal, thereby ensuring the contact effect between the connecting metal wire and the binding terminal. At the same time, the chamfered structure effectively improves the bending effect of the connecting metal wire, and ensures the transfer stress and connection quality of the connecting metal wire, thereby effectively improving the quality and overall performance of the narrow-frame display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] FIG1 is a schematic structural diagram of a display panel provided in the prior art;

[0055] FIG2 is a schematic structural diagram of a display panel provided in an embodiment of the present application;

[0056] FIG3 is a schematic plan view of a portion of the connection between the binding terminal and the connecting metal wire in the non-display area provided in an embodiment of the present application;

[0057] 4 to 8 are film layer structure diagrams corresponding to the manufacturing process of the display panel provided in the embodiments of the present application;

[0058] 9 to 11 illustrate the corresponding structures of the connecting metal wires in the coating process provided in the embodiments of the present application;

[0059] FIG12 is a schematic diagram of a film structure of another display panel provided in an embodiment of the present application;

[0060] FIG13 is a schematic diagram of a film layer structure of another display panel provided in an embodiment of the present application. Best Mode for Carrying Out the Invention

[0061] The following descriptions of the embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present disclosure may be implemented.

[0062] As shown in FIG1 , FIG1 is a schematic diagram of the structure of the display panel provided in the prior art. In the prior art, after the array substrate 101' and the color filter substrate 102' are assembled into a box, they are usually cut on one edge to form the panel structure shown in FIG1 . When the display panel is bound, a binding terminal 103' is provided on one side of the array substrate 101' and a connecting metal wire 104' is provided on the side. The connecting metal wire 104' is usually provided on one side of the array substrate 101' and the color filter substrate 102'. In this way, the side of the binding terminal 103' contacts and is electrically connected to the side of the connecting metal wire 104, and the height of the contact area between the two is only about 0.7um. The contact area is small, and poor connection is likely to occur, which in turn leads to panel failure, which is not conducive to further improvement of the overall performance of the panel.

[0063] The embodiments of the present application provide a display panel and a display device to effectively realize a narrow-frame design of the display panel and effectively improve the electrical connection effect of metal traces in a binding area.

[0064] As shown in Figure 2, which is a schematic structural diagram of a display panel provided in an embodiment of the present application, the display panel includes a first substrate, a second substrate, a binding terminal 103, and a connecting metal wire 104.

[0065] Specifically, in the embodiment of the present application, the first substrate is an array substrate 101, and the second substrate is a color filter substrate 102. Specifically, the array substrate 101 is disposed on one side of the color filter substrate 102, such that the array substrate 101 and the color filter substrate 102 are arranged in a box.

[0066] Furthermore, when setting the display panel provided in the embodiment of the present application, the display panel may further include a display area 20 , a non-display area 21 , a frame glue 105 , and a sealant 106 .

[0067] Specifically, the non-display area 21 of the display panel is provided on at least one side of the display area 20. For example, in the embodiment of the present application, the non-display area 21 may be provided around the display area 20. In the embodiment of the present application, the non-display area 21 may be a frame area or a binding area of ​​the display panel. By providing other binding structures in the frame area or the binding area, such as providing metal traces in the frame area, the pixels in the display area can be controlled through the metal traces, and the normal light-emitting display of the display panel can be driven.

[0068] Furthermore, when the sealant 105 and the sealant 106 in the embodiment of the present application are provided, the sealant 105 is provided at a corresponding position between the array substrate 101 and the color filter substrate 102. For example, if the sealant 105 is provided on a side close to the edge of the color filter substrate 102, the sealant 105 can achieve a sealing and support function for the array substrate 101 and the color filter substrate 102, thereby ensuring the lamination effect of other film layers between the array substrate and the color filter substrate.

[0069] Specifically, the frame glue 105 and the sealant 106 are both disposed between the array substrate and the color filter substrate, with the sealant 106 disposed on a side of the frame glue 105 away from the display area 20 and adjacent to the frame glue 105. In the embodiment of the present application, the sealant partially covers the binding terminals, and the edge of the sealant 106 away from the display area can be flush with the edge of the color filter substrate 102, thereby ensuring a sealed effect on the display panel and preventing external substances such as moisture from entering the display panel.

[0070] In the embodiment of the present application, when the array substrate 101 and the color filter substrate 102 are provided, the length of the array substrate 101 may be greater than the length of the color filter substrate 102. As shown in FIG1 , the length of the right side of the array substrate 101 protrudes beyond the edge of the color filter substrate, i.e., the length of the right side of the array substrate is greater than the length of the color filter substrate 102.

[0071] Furthermore, the display panel's binding terminals 103 are disposed on the array substrate. The binding terminals 103 are at least partially disposed within the non-display area 21. In the following embodiments, the binding terminals 103 are disposed on the surface of the array substrate 101 facing the color filter substrate 102. They are electrically connected to traces within the array substrate 101 to enable transmission of control signals.

[0072] In the embodiment of the present application, as shown in FIG2 , when the array substrate 101 is provided, the array substrate 101 further includes a protrusion 204. The protrusion 204 is provided within the non-display area 21 and protrudes beyond the edge of the color filter substrate 102. Thus, on the right side of the display panel, the length of the array substrate 101 is greater than that of the color filter substrate 102.

[0073] At the same time, the binding terminal 103 is correspondingly disposed on the protrusion 204. For example, the binding terminal 103 is disposed on the surface of the array substrate 101 facing the color filter substrate 102. In the embodiment of the present application, when the binding terminal 103 is disposed, the edge of the binding terminal 103 on the side close to the display area 20 can abut against the sealant 106. At the same time, the edge of the binding terminal 103 on the side away from the display area 20 extends toward the edge of the array substrate 101, thereby forming a binding terminal of a certain length on the array substrate 101.

[0074] In the embodiment of the present application, when the protrusion 204 is provided, the length of the protrusion 204 is set to D1. Specifically, the length D1 of the protrusion 204 can be set to 20 μm to 35 μm. Optionally, the length D1 of the protrusion 204 is set to 28 μm, thereby effectively increasing the area of ​​the binding terminal 103 and ensuring its contact effect.

[0075] Furthermore, in an embodiment of the present application, when the connecting metal wire 104 is provided, the connecting metal wire 104 is electrically connected to the binding terminal 103. Specifically, the connecting metal wire 104 is provided on a side close to the edge of the array substrate 101. Since the non-display area is mainly the binding area of ​​the display panel, the binding of the display panel and the transmission of the control signal within the display area of ​​the display panel are achieved through the binding terminal 103 and the connecting metal wire 104. At the same time, in order to achieve the effect of a narrow bezel, the connecting metal wire 104 is fitted with the side of the array substrate 101 to reduce the bezel width of the display panel as much as possible, thereby reducing the width of the bezel while ensuring the connection effect of the connecting metal wire 104.

[0076] Specifically, when setting the above-mentioned connecting metal wire 104, one end of the connecting metal wire 104 at least covers a portion of the binding terminal 103, and the other end of the connecting metal wire 104 extends to the second bonding surface 303 of the array substrate 101, fits tightly with the second bonding surface 303, and continues to extend downward and bind.

[0077] In the embodiment of the present application, to improve contact performance, the projection of the connecting metal wire 104 overlying the binding terminal on the array substrate is located within the projection area of ​​the binding terminal on the array substrate. Specifically, the area covered by the connecting metal wire 104 and the binding terminal 103 is at least one-third of the total area of ​​the binding terminal 103. Preferably, the area covered by the connecting metal wire 104 is half of the total surface area of ​​the binding terminal 103. This effectively increases the contact performance between the two different metal layers and effectively improves the performance of the panel.

[0078] Furthermore, in the embodiment of the present application, when the display panel is provided, the display panel also includes a chamfered structure 333. Specifically, the chamfered structure 333 is provided on a side edge of the array substrate 101, for example, the chamfered structure 333 is provided on a side edge of the protrusion 204 within the non-display area. The chamfered structure 333 is provided between the upper surface of the array substrate 101 and the second bonding surface 303 of the array substrate 101. The chamfered structure 333 achieves a smooth transition between the array substrate 101 and the second bonding surface 303, thereby improving the connection between different film layers.

[0079] In the embodiment of the present application, the second bonding surface 303 is mainly a side surface of the array substrate 101 in the thickness direction, and the second bonding surface 303 is mainly used to bind and bond the connecting metal wires 104 .

[0080] Specifically, when providing the above-mentioned connecting metal wire 104, the connecting metal wire 104 may further include a first connecting portion 4011, a second connecting portion 4012, and a third connecting portion 4013. The first connecting portion 4011 is provided on a side close to the display area 20, and the third connecting portion 4013 is provided on a side away from the display area. The first connecting portion 4011 and the third connecting portion 4013 are connected via the second connecting portion 4012, ultimately forming the connecting metal wire 104 provided in the embodiment of the present application.

[0081] As shown in Figure 2 , the first connecting portion 4011 is correspondingly disposed on the upper surface of the array substrate 101 and covers at least a portion of the binding terminal 103. The second connecting portion 4012 is correspondingly disposed at the chamfered structure 333 and adheres to the surface of the chamfered structure 333. Meanwhile, the third connecting portion 4013 is disposed on the second bonding surface 303 of the array substrate 101 and adheres closely thereto. In the embodiment of the present application, by providing the aforementioned chamfered structure, the chamfered structure can smoothly transition the connecting metal wire 104 in the bent region, thereby reducing the bending stress of the connecting metal wire 104. Furthermore, the curved surface of the chamfered structure can further reduce the width of the border corresponding to the region, thereby achieving a narrow border.

[0082] In the embodiment of the present application, since the connecting metal wire 104 is electrically connected to the binding terminal 103, the connecting metal wire 104 can transmit the control signal on the array substrate, and there is a large coverage area between the binding terminal 103 and the connecting metal wire 104. At the same time, the connecting metal wire 104 has a smooth transition at the chamfer structure, thereby effectively ensuring the contact effect between different metal wires in the frame area, effectively reducing the stress of the connecting metal wire, and improving the overall performance of the display panel.

[0083] Furthermore, when setting the above-mentioned different connection parts, in order to ensure the comprehensive performance and quality of the panel, the film thickness of the second connection part 4012 can be greater than the film thickness of the third connection part 4013. At the same time, the film thickness of the third connection part 4013 can be greater than the film thickness of the first connection part 4011.

[0084] In the embodiments of the present application, when the chamfered structure 333 is provided, the chamfered structure 333 can be configured as an arcuate transition surface or a circular transition surface, such as a rounded structure, or configured as other structures according to the requirements of different products and processes. This will not be described in detail here. In the following embodiments, the configuration of the chamfered structure 333 on different bonding surfaces is described using an arcuate transition surface as an example.

[0085] Specifically, the side of the array substrate 101 facing the color filter substrate is the first bonding surface, and the first bonding surface is connected to the second bonding surface 303 through the chamfer structure 333. The curvature between the chamfer structure 333 and the first bonding surface is smaller than the curvature between the chamfer structure and the second bonding surface. Optionally, the curvature of the chamfer structure 333 can be set to 0.1 μm. -1 ~0.4um -1 Specifically, the curvature of the chamfered structure 333 at the first bonding surface is set to 0.1um-1, and the curvature at the second bonding surface is set to 0.3um. -1, thereby setting the bonding surfaces at two different positions to different curvatures to effectively ensure the bonding effect of the connecting metal wire 104 and reduce the stress problem generated inside the wiring after bonding, thereby improving its quality.

[0086] Furthermore, as shown in Figure 3, Figure 3 is a schematic plan view of a portion of the connection between the binding terminals 103 and the connecting metal wires 104 in the non-display area provided in an embodiment of the present application. In conjunction with the film layer structure in Figure 2, when arranging the above-mentioned binding terminals and connecting metal wires 104, multiple binding terminals 103 can be arranged at intervals. For example, each binding terminal 103 is arranged at equal intervals on the surface of the array substrate.

[0087] At the same time, each connecting metal wire 104 is correspondingly arranged above each binding terminal 103. In order to ensure consistency, the connecting metal wires 104 can be symmetrically arranged relative to the central axis of the binding terminal 103, thereby ensuring consistency and stability of signal transmission.

[0088] 3 , and in combination with the structure in FIG2 , when setting the above-mentioned chamfered structure 333 and the corresponding connecting metal wire 104, a plurality of grooves 456 may be further provided on the surface of the chamfered structure 333 , each groove 456 corresponding to each connecting metal wire 104 , that is, the extension direction of the groove 456 is the same as the bending direction of the connecting metal wire 104 , so that the connecting metal wire 104 can be correspondingly fitted in the groove 456 , and the connecting metal wire 104 can be positioned by the groove 456 , thereby ensuring the reliability and overall performance of the display panel.

[0089] Furthermore, as shown in FIG12 , FIG12 is a schematic diagram of the film layer structure of another display panel provided in an embodiment of the present application. In combination with the structures in FIG2-FIG3 , in an embodiment of the present application, the display panel further includes a protective layer 888. When the protective layer 888 is provided, at least a portion of the protective layer 888 is provided correspondingly on the binding terminal 103 between the connecting metal wire 104 and the color filter substrate 102. For example, the protective layer 888 covers a portion of the binding terminal 103. As shown in FIG12 , one end of the protective layer 888 abuts against the color filter substrate 102, and the other end of the protective layer 888 covers the connecting metal wire 104. In this way, the protective layer 888 can protect a portion of the connecting metal wire 104 and a portion of the binding terminal 103. At the same time, since the protective layer 888 covers one end of the connecting metal wire 104, it can better protect the connecting metal wire 104 and prevent the connecting metal wire 104 from warping or other quality problems during the binding or bending process.

[0090] In the embodiment of the present application, the thickness of the protective layer 888 may be greater than the thickness of the sealant 106. In this way, the protective layer 888 can further seal the color filter substrate and the array substrate 101, thereby effectively preventing external impurities such as water vapor from entering the interior of the panel.

[0091] See Figure 13 for details. Figure 13 is a schematic diagram of the film structure of another display panel provided in an embodiment of the present application. In conjunction with other embodiments, when providing the protective layer 888, one end of the protective layer 888 can be attached to the side of the color filter substrate 102, with the other end of the protective layer 888 extending to one side of the connecting metal wire. Alternatively, a gap can be maintained between the other end of the protective layer 888 and the connecting metal wire 104, or the protective layer 888 can directly cover the connecting metal wire 104. The details are not further described.

[0092] In the embodiment of the present application, since the protective layer 888 is attached to the side of the color film substrate 102 and bent to the surface of the binding terminal 103, the protective layer 888 forms an angled structure, which can well seal the panel, thereby improving its protective effect on the panel.

[0093] Furthermore, the surface of the bonding terminal 103 on the side away from the color filter substrate 102 is further provided with micro-bumps 666. The micro-bumps 666 can be arranged in a structure of alternating convex and concave portions. Correspondingly, the connecting metal wire 104 is provided with a concave or convex portion that matches the convex or concave portion. The two are matched and aligned with each other. Thus, the micro-bumps 666 effectively increase the contact area between the connecting metal wire 104 and the bonding terminal 103, thereby further improving the connection between the bonding terminal and the connecting metal wire and ensuring the reliability and overall performance of the display panel.

[0094] Furthermore, in the embodiment of the present application, the display panel further includes a flexible circuit board 401 and a driver chip 402. Specifically, one end of the flexible circuit board 401 is electrically connected to the third connection portion of the connecting metal wire 104, and the other end of the flexible circuit board 401 is electrically connected to the driver chip 402, thereby forming a side-binding structure, and transmitting control signals through the flexible circuit board and the corresponding connecting metal wires.

[0095] In an embodiment of the present application, a method for manufacturing a display panel and a display device is also provided, as shown in Figures 4-8. Figures 4 to 8 are film layer structure diagrams corresponding to the manufacturing process of the display panel provided in an embodiment of the present application.

[0096] As shown in Figure 4 , after the array substrate 101 and color filter substrate 102 are assembled into a cell, they are then cut in an offset manner. Specifically, the color filter substrate 102 is cut within the non-display area. In this embodiment, the cut occurs outside the sealant 105. After the cut is complete, the excess color filter substrate is removed, forming a stepped structure. At this point, the binding terminals 103 are exposed outside the sealant 105, i.e., within the non-display area.

[0097] As shown in Figure 5, after the offset cutting is completed, the sealant 106 is applied. At this time, the sealant 106 is applied on the side of the frame glue 105 away from the display area, and the sealant 106 contacts the frame glue 105 and covers the binding terminals 103 in the corresponding area. In this embodiment of the present application, the sealant 106 is applied to further improve the sealing effect and quality of the display panel.

[0098] As shown in Figure 6 , after the sealant 106 is applied, it is further processed, such as by cutting and shaping. Specifically, if the shape and structure of the sealant 106 are not ideal during application, laser cutting can be used to remove excess sealant 106. This ensures the structure of the sealant 106 and effectively prevents interference between the sealant 106 and other film layers. After cutting, the sealant 106 is flush with the side edges of the color filter substrate 102.

[0099] As shown in Figure 7, in the embodiment of the present application, after the sealant 106 is processed, a chamfer structure 333 is set at the side position of the array substrate. First, the binding terminal 103 is processed, and the redundant binding terminal 103 at the chamfer structure 333 can be removed. After the removal is completed, the array substrate is further processed. Specifically, the above-mentioned chamfer structure 333 can be set to a fillet R. Specifically, the setting parameters of the chamfer structure 333 can be set according to the parameters provided in the embodiment of the present application. For example, the fillet radius of the chamfer structure 333 is set to 5um~10um, or it can be set according to the requirements of different products. In this way, by setting the chamfer structure 333 and processing the binding terminal 103, the foundation is laid for the subsequent setting of other wiring.

[0100] 8 , after the chamfer structure 333 is processed, other film layers are then formed. Specifically, a pad printing process is used to form connecting metal wires 104 at positions corresponding to the non-display area.

[0101] In the embodiment of the present application, when preparing the connecting metal wire 104, a coating process can also be used for preparation, thereby further improving its preparation efficiency and accuracy. Specifically, as shown in Figures 9-11, Figures 9 to 11 are the corresponding structures of the connecting metal wire provided in the embodiment of the present application in the coating process. In conjunction with Figures 4 to 8, after the chamfer structure processing is completed, a protective film 666 is set on the display panel. In the embodiment of the present application, the protective film 666 is set on the upper surface of the color filter substrate 102 and the upper surface of the binding terminal 103, and is protected by the protective film 666 to prevent other structures from being formed on unnecessary film layers.

[0102] As shown in FIG10 , after the protective film 666 is laid, a coating process is performed. The materials used in the coating process are mainly metal materials such as Cu, Al, TiAlTi, etc., and the metal traces of the specified structure, shape and size are formed by coating. At this time, the chamfered structure 333 and the second bonding surface 303 and the first bonding surface 302 of the array substrate 101 are coated, and finally the connecting metal wires 104 in the embodiment of the present application are formed. In the embodiment of the present application, by adopting a coating process, the connecting metal wires of the required structure are directly deposited at the corresponding positions, thereby effectively improving the manufacturing process of the display panel, improving the manufacturing efficiency, and improving the quality and overall performance of the film layer.

[0103] As shown in Figure 11, after the coating is completed, the protective film 666 is removed, and the binding terminal 103 and the connecting metal wire 104 are further processed. Specifically, a laser process is used to process the binding terminal and the connecting metal wire 104, and different connecting terminals and corresponding binding structures are formed by laser. And finally, a one-to-one binding and connection structure between the binding terminal 103 and the connecting metal wire 104 provided in the embodiment of the present application is formed. In the embodiment of the present application, by adopting a coating process and combining the laser process to process different film layers, the preparation efficiency is effectively improved, and the preparation accuracy of the above process is higher, thereby effectively ensuring the preparation accuracy and connection effect between the film layers.

[0104] Furthermore, an embodiment of the present application also provides a display device, which includes the display panel in the embodiment of the present application, and when preparing the display panel in the embodiment of the present application, the preparation process provided above is adopted, thereby effectively improving the preparation effect, while improving the binding structure of the display panel and improving the overall performance of the display device.

[0105] To sum up, the above is a detailed introduction to a display panel and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core ideas of the present application. Although the present application is disclosed as above with preferred embodiments, the above preferred embodiments are not used to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application is based on the scope defined by the claims.

Claims

1. A display panel, comprising: An array substrate; A color filter substrate is arranged in a box with the array substrate, and one end edge of the array substrate protrudes from the color filter substrate; Binding terminals, at least part of which is arranged in a region of the array substrate protruding from the color filter substrate; as well as, A connecting metal wire electrically connected to the binding terminal; The edge of the array substrate on the side where the binding terminal is provided is provided with a chamfer structure, one end of the connecting metal wire covers a portion of the surface of the binding terminal on the side opposite to the color filter substrate, and the other end of the connecting metal wire is bent along the chamfer structure and extends to the side of the array substrate; The plurality of binding terminals are arranged at intervals, and each of the connecting metal wires is correspondingly arranged above each of the binding terminals and symmetrically arranged relative to the central axis of the binding terminal.

2. The display panel according to claim 1, wherein the connection metal line comprises a first connection portion, a second connection portion and a third connection portion; in, The first connection portion is in contact with the surface of the binding terminal, the second connection portion is in contact with the surface of the chamfered structure, and the third connection portion is in contact with the side surface of the array substrate in the thickness direction. 3 . The display panel according to claim 2 , wherein a thickness of the second connection portion is greater than a film thickness of the third connection portion.

4. The display panel according to claim 1, wherein the array substrate comprises a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface are connected through the chamfer structure, and the first bonding surface faces the color filter substrate; in, The curvature between the chamfered structure and the first fitting surface is smaller than the curvature between the chamfered structure and the second fitting surface. 5 . The display panel according to claim 1 , wherein a plurality of grooves are further arranged on the surface of the chamfered structure, the extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each of the connecting metal wires is correspondingly arranged in each of the grooves.

6. The display panel according to claim 1, wherein the display panel further comprises a display area and a non-display area arranged on one side of the display area; in, The array substrate also includes a protrusion arranged in the non-display area, the binding terminal is arranged on a side surface of the protrusion facing the color film substrate, and the projection of the connecting metal wire overlapped on the binding terminal on the array substrate is located within the projection area of ​​the binding terminal on the array substrate.

7. The display panel according to claim 6, wherein the display panel further comprises a sealant, the sealant is correspondingly arranged between the color film substrate and the array substrate, the sealant covers a portion of the binding terminals, and an edge of the sealant away from the display area is flush with an edge of the color film substrate.

8. The display panel according to claim 1, wherein the display panel further comprises a protective layer; in, At least a portion of the protection layer is correspondingly arranged on the binding terminal between the connecting metal wire and the color filter substrate. 9 . The display panel according to claim 8 , wherein one end of the protective layer is attached to a side surface of the color filter substrate, and the other end of the protective layer extends to one side of the connecting metal wire.

10. A display panel, comprising: An array substrate; A color filter substrate is arranged in a box with the array substrate, and one end edge of the array substrate protrudes from the color filter substrate; Binding terminals, at least part of which is arranged in a region of the array substrate protruding from the color filter substrate; as well as, A connecting metal wire electrically connected to the binding terminal; Among them, the edge of the array substrate on one side of the binding terminal is provided with a chamfer structure, one end of the connecting metal wire covers a portion of the surface of the binding terminal opposite to the color film substrate, and the other end of the connecting metal wire is bent along the chamfer structure and extends to the side of the array substrate.

11. The display panel according to claim 10, wherein the connection metal line comprises a first connection portion, a second connection portion and a third connection portion; in, The first connection portion is in contact with the surface of the binding terminal, the second connection portion is in contact with the surface of the chamfered structure, and the third connection portion is in contact with the side surface of the array substrate in the thickness direction. 12 . The display panel according to claim 11 , wherein a thickness of the second connection portion is greater than a film thickness of the third connection portion.

13. The display panel according to claim 10, wherein the array substrate comprises a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface are connected via the chamfer structure, and the first bonding surface faces the color filter substrate; in, The curvature between the chamfered structure and the first fitting surface is smaller than the curvature between the chamfered structure and the second fitting surface. 14 . The display panel according to claim 10 , wherein a plurality of grooves are further arranged on the surface of the chamfered structure, the extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each of the connecting metal wires is correspondingly arranged in each of the grooves.

15. The display panel according to claim 10, wherein the display panel further comprises a display area and a non-display area arranged on one side of the display area; in, The array substrate also includes a protrusion arranged in the non-display area, the binding terminal is arranged on a side surface of the protrusion facing the color film substrate, and the projection of the connecting metal wire overlapped on the binding terminal on the array substrate is located within the projection area of ​​the binding terminal on the array substrate.

16. The display panel according to claim 15, wherein the display panel further comprises a sealant, the sealant is correspondingly arranged between the color film substrate and the array substrate, the sealant covers a portion of the binding terminals, and an edge of the sealant away from the display area is flush with an edge of the color film substrate.

17. The display panel according to claim 10, wherein the display panel further comprises a protective layer; in, At least a portion of the protection layer is correspondingly arranged on the binding terminal between the connecting metal wire and the color filter substrate. 18 . The display panel according to claim 17 , wherein one end of the protection layer is attached to a side surface of the color filter substrate, and the other end of the protection layer extends to one side of the connecting metal wire.

19. A display device, comprising a display panel, the display panel comprising: An array substrate; A color filter substrate is arranged in a box with the array substrate, and one end edge of the array substrate protrudes from the color filter substrate; Binding terminals, at least part of which is arranged in a region of the array substrate protruding from the color filter substrate; as well as, A connecting metal wire electrically connected to the binding terminal; Among them, the edge of the array substrate on one side of the binding terminal is provided with a chamfer structure, one end of the connecting metal wire covers a portion of the surface of the binding terminal opposite to the color film substrate, and the other end of the connecting metal wire is bent along the chamfer structure and extends to the side of the array substrate.

20. The display device according to claim 19, wherein the connection metal line comprises a first connection portion, a second connection portion, and a third connection portion; in, The first connection portion is in contact with the surface of the binding terminal, the second connection portion is in contact with the surface of the chamfered structure, and the third connection portion is in contact with the side surface of the array substrate in the thickness direction.

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