Photovoltaic module and packaging method therefor

Abstract

The present application relates to a photovoltaic module and a packaging method therefor. The photovoltaic module comprises a photovoltaic main body part (120) and a packaging assembly (110), wherein the photovoltaic main body part (120) comprises a perovskite battery layer (121); the packaging assembly (110) comprises a first substrate (111), a second substrate (112), a first packaging part (113), and a second packaging part (114), and the first substrate (111) is located on one side of the photovoltaic main body part (120) in a first direction (X); the second substrate (112) is located on the other side of the photovoltaic main body part (120) in the first direction (X); the first packaging part (113) is arranged around the photovoltaic main body part (120), and the first packaging part (113) is connected between the first substrate (111) and the second substrate (112); the second packaging part (114) is located on the side of the first packaging part (113) facing away from the photovoltaic main body part (120), and the second packaging part (114) is used for packaging the end surfaces of the first substrate (111), the second substrate (112), and the first packaging part (113) in a second direction (Y).

Description

Photovoltaic module and packaging method thereof

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 2023107236300, filed on June 16, 2023, entitled “Photovoltaic Module and Its Packaging Method,” the entire text of which is hereby incorporated by reference. Technical Field

[0003] The present application relates to the field of photovoltaic cell technology, and in particular to photovoltaic modules and packaging methods thereof. Background Art

[0004] With the development of solar cell technology, improving energy conversion efficiency while reducing device costs have become key to the large-scale application of solar cell technology. Compared to crystalline silicon cells, perovskite solar cells have the advantages of solution processing, abundant raw materials, and low production costs. In the laboratory, the efficiency of a single cell can reach 25.7%, and the efficiency of a tandem cell combining perovskite cells and crystalline silicon cells can reach 32%. This makes perovskite cells, or tandem cells containing perovskite cells, promising to become the next generation of commercial photovoltaic cells.

[0005] Due to the unique properties of perovskite cells, their photoelectric conversion layer is easily affected by water vapor and undergoes irreversible decomposition and deterioration, thereby affecting the photoelectric conversion efficiency of the perovskite cell. Therefore, in order to ensure the outdoor service life of photovoltaic modules containing perovskite cells, the packaging of cells in photovoltaic modules becomes particularly important.

[0006] In the prior art, butyl adhesive is typically applied between the upper and lower glass cover plates of photovoltaic modules containing perovskite cells during encapsulation. During outdoor use, the adhesive interface between the butyl adhesive and the glass is susceptible to moisture intrusion, which reduces the adhesion between the butyl adhesive and the glass. This can cause the butyl adhesive to delaminate from the glass, leading to encapsulation failure of the photovoltaic module, reducing its reliability, and shortening its service life.

[0007] Summary of the Invention

[0008] Based on this, the present application provides a photovoltaic module and a packaging method thereof to improve the reliability of the packaging module, thereby improving the reliability of the photovoltaic module and extending the service life of the photovoltaic module.

[0009] An embodiment of the first aspect of the present application provides a photovoltaic module, comprising a photovoltaic main body and a packaging assembly, wherein the photovoltaic main body comprises a perovskite cell layer; and the packaging assembly comprises:

[0010] a first substrate, located on one side of the photovoltaic main body along a first direction, where the first direction is the thickness direction of the photovoltaic module;

[0011] a second substrate located on the other side of the photovoltaic main body along the first direction;

[0012] a first packaging portion, disposed around the photovoltaic main portion, and connected between the first substrate and the second substrate;

[0013] The second packaging part is located on a side of the first packaging part away from the photovoltaic main part, and is used to package the end surfaces of the first substrate, the second substrate and the first packaging part along a second direction, and the second direction is perpendicular to the first direction.

[0014] In some embodiments, end surfaces of the first substrate, the second substrate, and the first packaging portion along the second direction are sealed and attached to the second packaging portion; or

[0015] End surfaces of the first substrate and the second substrate along the second direction are sealed and adhered to the second packaging portion, and a gap exists between the second packaging portion and the first packaging portion in the second direction.

[0016] In some embodiments, the second packaging portion includes a first portion, the first portion is disposed around the first packaging portion, and an end surface of the first portion close to the first packaging portion is flush with end surfaces of the first substrate and the second substrate along the second direction.

[0017] In some embodiments, the second packaging part further includes a second part connected to the first part, the second part is located on a side of the first part close to the first packaging part, and the second part extends between the first substrate and the second substrate, and the second part is arranged around the first packaging part.

[0018] In some embodiments, the material of the first packaging portion is one of butyl rubber, silicone rubber, polyurethane, and epoxy resin.

[0019] In some embodiments, the material of the second packaging portion is one of ethylene-vinyl acetate copolymer, ethylene-octene copolymer, polyvinyl butyral, silicone, acrylic acid, and epoxy resin.

[0020] In some embodiments, the photovoltaic main body includes the perovskite cell layer stacked on the first substrate, a first adhesive film layer covering the side of the perovskite cell layer facing away from the first substrate, and the side of the first adhesive film layer facing away from the first substrate is connected to the second substrate.

[0021] In some embodiments, the orthographic projection of the first adhesive film layer on the first substrate covers the orthographic projection of the perovskite cell layer on the first substrate.

[0022] In some embodiments, the photovoltaic main body includes the perovskite cell layer stacked on the first substrate, a second adhesive film layer covering the side of the perovskite cell layer facing away from the first substrate, a crystalline silicon cell layer stacked on the side of the second adhesive film layer facing away from the first substrate, and a third adhesive film layer covering the side of the crystalline silicon cell layer facing away from the first substrate, and the side of the third adhesive film layer facing away from the crystalline silicon cell layer is connected to the second substrate.

[0023] In some embodiments, the orthographic projection of the second adhesive film layer on the first substrate covers the orthographic projection of the perovskite cell layer on the first substrate; the orthographic projection of the third adhesive film layer on the first substrate covers the orthographic projection of the crystalline silicon cell layer on the first substrate.

[0024] An embodiment of the second aspect of the present application provides a packaging method based on the photovoltaic module in the first aspect, comprising:

[0025] The photovoltaic main body is provided on the first substrate, wherein the photovoltaic main body includes a perovskite cell layer;

[0026] forming the first packaging portion on the first substrate around the photovoltaic main portion;

[0027] forming a second encapsulation portion on a side of the first encapsulation portion away from the photovoltaic main portion;

[0028] Place the second substrate on the side of the photovoltaic main body away from the first substrate, and press the first substrate, the first packaging part, the second packaging part, the photovoltaic main body and the second substrate together, and use the second packaging part to encapsulate the end faces of the first substrate, the second substrate and the first packaging part along the second direction.

[0029] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the application will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the disclosed drawings without any creative work.

[0031] FIG1 is a schematic diagram of a first structure of a photovoltaic module in some embodiments of the present application.

[0032] FIG2 is a schematic diagram of a second structure of a photovoltaic module in some embodiments of the present application.

[0033] FIG3 is a schematic diagram of a third structure of a photovoltaic module in some embodiments of the present application.

[0034] FIG4 is a schematic diagram of a fourth structure of a photovoltaic module in some embodiments of the present application.

[0035] FIG5 is a fifth structural schematic diagram of a photovoltaic module in some embodiments of the present application.

[0036] FIG6 is a sixth structural schematic diagram of a photovoltaic module in some embodiments of the present application.

[0037] FIG7 is a seventh structural schematic diagram of a photovoltaic module in some embodiments of the present application.

[0038] FIG8 is a schematic diagram of an eighth structure of a photovoltaic module in some embodiments of the present application.

[0039] FIG9 is a flow chart of a method for packaging a photovoltaic module in some embodiments of the present application.

[0040] Explanation of the accompanying drawings: 10, photovoltaic module; 110, packaging component; 111, first substrate; 112, second substrate; 113, first packaging part; 114, second packaging part; 1141, first part; 1142, second part; 120, photovoltaic main body; 121, perovskite cell layer; 122, crystalline silicon cell layer; 123, first adhesive film layer; 124, second adhesive film layer; 125, third adhesive film layer; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0043] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0044] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0045] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0046] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0047] Due to the unique properties of perovskite cells, their photoelectric conversion layer is easily affected by water vapor and undergoes irreversible decomposition and deterioration, thereby affecting the photoelectric conversion efficiency of the perovskite cell. Therefore, in order to ensure the outdoor service life of photovoltaic modules containing perovskite cells, the packaging of cells in photovoltaic modules becomes particularly important.

[0048] In the prior art, butyl adhesive is typically applied between the upper and lower glass cover plates of photovoltaic modules containing perovskite cells during encapsulation. During outdoor use, the adhesive interface between the butyl adhesive and the glass is susceptible to moisture intrusion, which reduces the adhesion between the butyl adhesive and the glass. This can cause the butyl adhesive to delaminate from the glass, leading to encapsulation failure of the photovoltaic module, reducing its reliability, and shortening its service life.

[0049] Based on the above problems, the present application provides a photovoltaic module and a packaging method thereof, which improves the reliability of the packaging module, thereby improving the reliability of the photovoltaic module and extending the service life of the photovoltaic module.

[0050] FIG1 shows a schematic diagram of a first structural configuration of a photovoltaic assembly in some embodiments of the present application; FIG2 shows a schematic diagram of a second structural configuration of a photovoltaic assembly in some embodiments of the present application; FIG3 shows a schematic diagram of a third structural configuration of a photovoltaic assembly in some embodiments of the present application; FIG4 shows a schematic diagram of a fourth structural configuration of a photovoltaic assembly in some embodiments of the present application; FIG5 shows a schematic diagram of a fifth structural configuration of a photovoltaic assembly in some embodiments of the present application; FIG6 shows a schematic diagram of a sixth structural configuration of a photovoltaic assembly in some embodiments of the present application; FIG7 shows a schematic diagram of a seventh structural configuration of a photovoltaic assembly in some embodiments of the present application; and FIG8 shows a schematic diagram of an eighth structural configuration of a photovoltaic assembly in some embodiments of the present application. 1 to 8 , an embodiment of the first aspect of the present application provides a photovoltaic module 10, comprising a photovoltaic main body 120 and a packaging component 110, wherein the photovoltaic main body 120 includes a perovskite cell layer 121; the packaging component 110 includes a first substrate 111, a second substrate 112, a first packaging component 113, and a second packaging component 114, wherein the first substrate 111 is located on one side of the photovoltaic main body 120 along a first direction X, where the first direction X is the thickness direction of the photovoltaic module 10; the second substrate 112 is located on the other side of the photovoltaic main body 120 along the first direction X; the first packaging component 113 is arranged around the photovoltaic main body 120, and the first packaging component 113 is connected between the first substrate 111 and the second substrate 112; the second packaging component 114 is located on a side of the first packaging component 113 facing away from the photovoltaic main body 120, and the second packaging component 114 is used to encapsulate the end surfaces of the first substrate 111, the second substrate 112, and the first packaging component 113 along a second direction Y, where the second direction Y is perpendicular to the first direction X.

[0051] It should be noted that the photovoltaic module 10 is generally a rectangular structure, and the photovoltaic module 10 has two long sides and two short sides. The second packaging part 114 can be arranged on a side of the first packaging part 113 corresponding to a long side or a short side. The second packaging part 114 can also be arranged around the first packaging part 113, and can be arranged according to actual conditions.

[0052] The photovoltaic module 10 provided in the embodiment of the present application is constructed by disposing a first encapsulation portion 113 around a photovoltaic main body portion 120, with the first encapsulation portion 113 connected between a first substrate 111 and a second substrate 112. A second encapsulation portion 114 is located on a side of the first encapsulation portion 113 facing away from the photovoltaic main body portion 120, and is used to encapsulate the end surfaces of the first substrate 111, the second substrate 112, and the first encapsulation portion 113. In this way, the isolation provided by the first encapsulation portion 113 reduces the possibility of water vapor intruding into the second encapsulation portion 114, thereby reducing the probability of encapsulation failure of the encapsulation component 110 due to water vapor intrusion, improving the reliability of the encapsulation component 110, and thereby improving the reliability of the photovoltaic module 10, thereby extending the service life of the photovoltaic module 10.

[0053] 1 , 2 , 5 , and 6 , in some embodiments, the end surfaces of the first substrate 111, the second substrate 112, and the first packaging portion 113 along the second direction Y are sealed and bonded to the second packaging portion 114. This improves the connection strength between the first substrate 111, the second substrate 112, the first packaging portion 113, and the second packaging portion 114, thereby enhancing the structural stability of the packaging assembly 110.

[0054] As shown in Figures 2, 3, 7, and 8, in some embodiments, the end surfaces of the first substrate 111 and the second substrate 112 along the second direction Y are sealed against the second encapsulation portion 114, and a gap exists between the second encapsulation portion 114 and the first encapsulation portion 113 in the second direction Y. This prolongs the flow path of water vapor toward the second encapsulation portion 114, reducing the likelihood of water vapor intrusion into the second encapsulation portion 114. This, in turn, reduces the probability of encapsulation failure of the encapsulation assembly 110 due to water vapor intrusion, thereby improving the reliability of the photovoltaic module 10 and extending the service life of the photovoltaic module 10.

[0055] As shown in conjunction with Figures 1 to 8 , in some embodiments, the second encapsulation portion 114 includes a first portion 1141, which is disposed around the first encapsulation portion 113, and the end surface of the first portion 1141 proximal to the first encapsulation portion 113 is flush with the end surfaces of the first substrate 111 and the second substrate 112 along the second direction Y. In this way, the first portion 1141 can completely isolate the first encapsulation portion 113 from the outside world, further reducing the possibility of water vapor intruding into the first encapsulation portion 113 and the photovoltaic main body 120, further improving the reliability of the encapsulation assembly 110, and enhancing the stability of the photovoltaic performance of the perovskite cell layer 121, thereby improving the reliability of the photovoltaic module 10 and extending the service life of the photovoltaic module 10.

[0056] As shown in Figures 5 to 8, in some embodiments, the second packaging portion 114 further includes a second portion 1142 connected to the first portion 1141, the second portion 1142 is located on a side of the first portion 1141 close to the first packaging portion 113, and the second portion 1142 extends between the first substrate 111 and the second substrate 112, and the second portion 1142 is arranged around the first packaging portion 113. Specifically, the material of the second packaging portion 114 is one of ethylene-vinyl acetate copolymer (abbreviated as EVA), ethylene-octene copolymer (abbreviated as POE), polyvinyl butyral (abbreviated as PVB), silicone, acrylic acid, and epoxy resin. Of course, the material of the second packaging portion 114 is not limited to the above materials, and may also be other materials.

[0057] In this embodiment, the second packaging part 114 includes a first part 1141 and a second part 1142. The end surface of the first part 1141 close to the first packaging part 113 is flush with the end surfaces of the first substrate 111 and the second substrate 112 along the second direction Y, and the second part 1142 extends between the first substrate 111 and the second substrate 112. In this way, the bonding interface area between the second packaging part 114 and the first substrate 111 and the second substrate 112 can be increased, the connection strength between the first substrate 111 and the second substrate 112 can be improved, and the structural stability of the packaging component 110 can be improved; in addition, the sealing effect between the second packaging part 114 and the first substrate 111 and the second substrate 112 is further improved, thereby effectively improving the reliability of the packaging component 110, and then improving the reliability of the photovoltaic component 10, and extending the service life of the photovoltaic component 10.

[0058] In some embodiments, the material of the first packaging portion 113 is one of butyl rubber, silicone rubber, polyurethane, and epoxy resin. Of course, the material of the first packaging portion 113 is not limited to the above materials, and can also be other materials.

[0059] As shown in Figures 1, 3, 5 and 7, in some embodiments, the photovoltaic main body 120 includes a perovskite cell layer 121 stacked on a first substrate 111, a first adhesive film layer 123 covering the side of the perovskite cell layer 121 facing away from the first substrate 111, and the side of the first adhesive film layer 123 facing away from the first substrate 111 is connected to the second substrate 112. The perovskite cell layer 121 can be encapsulated on the first substrate 111 by the first adhesive film layer 123. There is no need to set an adhesive film layer between the perovskite cell layer 121 and the first substrate 111, which can reduce the use of consumables and reduce production costs. At the same time, the first adhesive film layer 123 can block the erosion of the perovskite cell layer 121 by water vapor, protect the perovskite cell layer 121, and improve the stability of the photovoltaic performance of the cells in the photovoltaic module 10. In addition, the side of the first adhesive film layer 123 facing away from the first substrate 111 is connected to the second substrate 112, which can facilitate the connection between the photovoltaic main body 120 and the first substrate 111 and the second substrate 112, thereby improving the structural stability of the entire photovoltaic module 10. In addition,

[0060] It should be noted that the perovskite cell layer 121 may include a plurality of perovskite cells arrayed on the first substrate 111 , the plurality of perovskite cells are connected in series, and the first adhesive film layer 123 covers the plurality of perovskite cells and the first substrate 111 between two adjacent perovskite cells.

[0061] In some embodiments, the orthographic projection of the first adhesive film layer 123 on the first substrate 111 covers the orthographic projection of the perovskite cell layer 121 on the first substrate 111. Specifically, the size of the first adhesive film layer 123 in the second direction Y is larger than the maximum size of the perovskite cell layer 121 in the second direction Y, and the size of the second adhesive film layer 124 in the second direction Y is smaller than the size of the first substrate 111. In this way, the first adhesive film layer 123 can cover and protect the perovskite cell layer 121. At the same time, the connection strength between the entire photovoltaic main body 120 and the first substrate 111 and the second substrate 112 can be ensured, thereby improving the structural stability of the entire photovoltaic module 10.

[0062] As shown in Figures 2, 4, 6, and 8, in some embodiments, the photovoltaic main body 120 includes a perovskite cell layer 121 stacked on the first substrate 111, a second adhesive film layer 124 covering the side of the perovskite cell layer 121 facing away from the first substrate 111, a crystalline silicon cell layer 122 stacked on the side of the second adhesive film layer 124 facing away from the first substrate 111, and a third adhesive film layer 125 covering the side of the crystalline silicon cell layer 122 facing away from the first substrate 111, with the side of the third adhesive film layer 125 facing away from the crystalline silicon cell layer 122 being connected to the second substrate 112. The stacking of the perovskite cell layer 121 and the crystalline silicon cell layer 122 facilitates maximizing the conversion of light energy into electrical energy, improving the utilization rate of the solar spectrum, and increasing the efficiency of the photovoltaic module 10. By providing the second adhesive film layer 124 and the third adhesive film layer 125 , the packaging and fixation of the perovskite cell layer 121 and the crystalline silicon cell layer 122 can be facilitated, while facilitating the connection between the entire photovoltaic main body 120 and the first substrate 111 and the second substrate 112 , thereby improving the structural stability of the photovoltaic module 10 .

[0063] It should be noted that the crystalline silicon cell layer 122 may include a plurality of crystalline silicon cell groups arrayed on the side of the second adhesive film layer 124 away from the first substrate 111 . The plurality of crystalline silicon cell groups may be connected in series, and each crystalline silicon cell group includes a plurality of crystalline silicon cells connected in series.

[0064] Furthermore, the crystalline silicon cell may include an interdigitated back contact cell (IBC), an HJT cell (Heterojunction with Intrinsic Thin film), a TOPCon cell (Tunnel Oxide Passivated Contact), an MWT cell (Metallization wrapthrough), or a PERC cell (Passivated Emitter and Rear Cell).

[0065] In some embodiments, the circuit loop of the perovskite cell layer 121 and the circuit loop of the crystalline silicon cell layer 122 are independent of each other.

[0066] In some embodiments, the orthographic projection of the second adhesive film layer 124 on the first substrate 111 covers the orthographic projection of the perovskite cell layer 121 on the first substrate 111 ; the orthographic projection of the third adhesive film layer 125 on the first substrate 111 covers the orthographic projection of the crystalline silicon cell layer 122 on the first substrate 111 .

[0067] In this embodiment, specifically, the size of the second adhesive film layer 124 in the second direction Y is larger than the maximum size of the perovskite cell layer 121 in the second direction Y, and the size of the second adhesive film layer 124 in the second direction Y is smaller than the size of the first substrate 111; the size of the third adhesive film layer 125 in the second direction Y is larger than the maximum size of the perovskite cell layer 121 in the second direction Y, and the size of the third adhesive film layer 125 in the second direction Y is smaller than the size of the first substrate 111. In this way, the second adhesive film layer 124 can cover the perovskite cell layer 121, and the third adhesive film layer 125 can cover the crystalline silicon cell layer 122, protecting the perovskite cell layer 121 and the crystalline silicon cell layer 122. At the same time, the connection strength between the entire photovoltaic main body 120 and the first substrate 111 and the second substrate 112 can be ensured, thereby improving the structural stability of the entire photovoltaic module 10.

[0068] In some embodiments, the material of the first film layer 123, the second film layer 124, and the third film layer 125 can be one of ethylene-vinyl acetate copolymer (EVA), ethylene-octene copolymer (POE), polyvinyl butyral (PVB), silicone glue, and ethylene-butyl acrylate copolymer (EBA).

[0069] In some embodiments, the first substrate 111 may be glass, and the second substrate 112 may be glass.

[0070] FIG9 shows a flow chart of a method for packaging a photovoltaic module in some embodiments of the present application. Referring to FIG9 , an embodiment of a second aspect of the present application provides a packaging method based on the photovoltaic module 10 in the first aspect, comprising:

[0071] S1. Disposing a photovoltaic main body 120 on a first substrate 111 , wherein the photovoltaic main body 120 includes a perovskite cell layer 121 ;

[0072] S2, forming a first packaging portion 113 on the first substrate 111 around the photovoltaic main portion 120;

[0073] S3, forming a second packaging portion 114 on a side of the first packaging portion 113 away from the photovoltaic main portion 120;

[0074] S4. Place the second substrate 112 on the side of the photovoltaic main body 120 away from the first substrate 111, and press the first substrate 111, the first packaging part 113, the second packaging part 114, the photovoltaic main body 120 and the second substrate 112, and use the second packaging part 114 to encapsulate the end faces of the first substrate 111, the second substrate 112 and the first packaging part 113 along the second direction Y.

[0075] The photovoltaic module 10 obtained by the packaging method of this embodiment has a first packaging portion 113 disposed around the photovoltaic main body 120 and connected between the first substrate 111 and the second substrate 112. The second packaging portion 114 is located on the side of the first packaging portion 113 facing away from the photovoltaic main body 120, and is used to encapsulate the end surfaces of the first substrate 111, the second substrate 112, and the first packaging portion 113. In this way, the isolation provided by the first packaging portion 113 reduces the possibility of water vapor intruding into the second packaging portion 114, thereby reducing the probability of packaging failure of the packaging component 110 due to water vapor intrusion, improving the reliability of the packaging component 110, and thus improving the reliability of the photovoltaic module 10, thereby extending the service life of the photovoltaic module 10.

[0076] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A photovoltaic module, characterized in that: It includes a photovoltaic main body and a packaging component, wherein the photovoltaic main body includes a perovskite cell layer; the packaging component includes: A first substrate, located at one side of the photovoltaic main body along a first direction, where the first direction is a thickness direction of the photovoltaic module; A second substrate, located at the other side of the photovoltaic main body along the first direction; A first packaging part is arranged around the photovoltaic main body, and the first packaging part is connected between the first substrate and the second substrate; The second packaging part is located on a side of the first packaging part away from the photovoltaic main body, and is used to package the end surfaces of the first substrate, the second substrate and the first packaging part along a second direction, and the second direction is perpendicular to the first direction.

2. The photovoltaic module according to claim 1, characterized in that: The end surfaces of the first substrate, the second substrate and the first packaging part along the second direction are sealed and attached to the second packaging part; or The end surfaces of the first substrate and the second substrate along the second direction are sealed and bonded to the second packaging portion, and a gap exists between the second packaging portion and the first packaging portion in the second direction.

3. The photovoltaic module according to claim 1 or 2, characterized in that: The second packaging portion includes a first portion, the first portion is disposed around the first packaging portion, and an end surface of the first portion close to the first packaging portion is flush with end surfaces of the first substrate and the second substrate along the second direction.

4. The photovoltaic module according to claim 3, characterized in that: The second packaging part also includes a second part connected to the first part, the second part is located on a side of the first part close to the first packaging part, and the second part extends between the first substrate and the second substrate, and the second part is arranged around the first packaging part.

5. The photovoltaic module according to claim 1, characterized in that: The material of the first packaging part is one of butyl rubber, silicone rubber, polyurethane and epoxy resin.

6. The photovoltaic module according to claim 1, characterized in that: The material of the second packaging part is one of ethylene-vinyl acetate copolymer, ethylene-octene copolymer, polyvinyl butyral, silica gel, acrylic acid, and epoxy resin.

7. The photovoltaic module according to claim 1, characterized in that: The photovoltaic main body includes the perovskite cell layer stacked on the first substrate, a first adhesive film layer covering the side of the perovskite cell layer away from the first substrate, and the side of the first adhesive film layer away from the first substrate is connected to the second substrate.

8. The photovoltaic module according to claim 7, characterized in that: The orthographic projection of the first adhesive film layer on the first substrate covers the orthographic projection of the perovskite cell layer on the first substrate.

9. The photovoltaic module according to claim 1, characterized in that: The photovoltaic main body includes the perovskite cell layer stacked on the first substrate, a second adhesive film layer covering the side of the perovskite cell layer facing away from the first substrate, a crystalline silicon cell layer stacked on the side of the second adhesive film layer facing away from the first substrate, and a third adhesive film layer covering the side of the crystalline silicon cell layer facing away from the first substrate, and the side of the third adhesive film layer facing away from the crystalline silicon cell layer is connected to the second substrate.

10. The photovoltaic module according to claim 9, characterized in that: The orthographic projection of the second adhesive film layer on the first substrate covers the orthographic projection of the perovskite battery layer on the first substrate; the orthographic projection of the third adhesive film layer on the first substrate covers the orthographic projection of the crystalline silicon battery layer on the first substrate.

11. A method for encapsulating a photovoltaic module according to any one of claims 1 to 10, characterized in that: include: Disposing a photovoltaic main body on the first substrate; Forming the first packaging part on the first substrate around the photovoltaic main body; forming a second packaging portion on a side of the first packaging portion away from the photovoltaic main body portion; The second substrate is placed on the side of the photovoltaic main body away from the first substrate, and the first substrate, the first packaging part, the second packaging part, the photovoltaic main body and the second substrate are pressed together, and the end faces of the first substrate, the second substrate and the first packaging part along the second direction are packaged by the second packaging part.

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