Electronic device

Abstract

The present application discloses an electronic device, comprising: a rotating shaft, and a first body and a second body which are respectively arranged on both sides of the rotating shaft, wherein the first body comprises: a first circuit board, a gap being present between the first circuit board and the rotating shaft; and a connecting wire which is provided between the first circuit board and the rotating shaft and at least partially extends in an axial direction of the rotating shaft. In this way, the connecting wire can be arranged outside a circuit board rather than on the first circuit board, so that occupancy of the layout area of the first circuit board can be reduced, and the first circuit board has more layout area for arranging other functional devices. In addition, signal interference on the connecting wire caused by the first circuit board can be avoided, thereby ensuring the signal quality.

Description

An electronic device

[0001] This application claims priority to Chinese patent application number 2023107223866, filed on June 16, 2023, entitled “An Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the technical field of terminal equipment, and in particular to an electronic device. Background Art

[0003] Electronic devices are generally provided with connecting wires, which are used to connect various electronic components in the electronic device. For example, the connecting wires can realize signal transmission between two electronic components.

[0004] Connecting wires are usually routed on the circuit boards of electronic devices. However, this routing method not only occupies the layout area of ​​the circuit board, making it impossible to set up other functional devices on the circuit board, but also causes the circuit board to interfere with the connecting wires, affecting signal quality.

[0005] Summary of the Invention

[0006] The present application provides an electronic device to solve the problem that the existing wiring method not only occupies the layout area of ​​the circuit board but also affects the signal quality.

[0007] The present application provides an electronic device comprising: a hinge, and a first body and a second body disposed on either side of the hinge; the first body comprising: a first circuit board, the first circuit board being spaced apart from the hinge; and a connecting wire disposed between the first circuit board and the hinge and extending at least partially along the axial direction of the hinge. This arrangement allows the connecting wire to be routed off the board rather than on the first circuit board. This routing method does not occupy the layout area of ​​the first circuit board, leaving more space on the first circuit board for arranging other functional components. Furthermore, it reduces signal interference from the first circuit board to the connecting wire, thereby ensuring signal quality.

[0008] In some embodiments of the present application, the first body further includes a bracket disposed between the first circuit board and the rotating shaft; the bracket includes a wire trough, the wire trough being arranged parallel to the rotating shaft and used for routing the connecting wires. This can better constrain the routing path of the connecting wires and prevent them from bending or deflecting.

[0009] In some embodiments of the present application, the bracket includes a main bracket, a side plate, and a support plate. The main bracket is adjacent to the rotating shaft, and the side plate is adjacent to the first circuit board. A gap is formed between the main bracket and the side plate. The main bracket is connected to the side plate via the support plate to form a wire trough. This creates a wire trough with one side open, facilitating the routing of connecting wires.

[0010] In some embodiments of the present application, the bracket further includes a baffle located at the outlet of the cable trough and connected to the support plate, the baffle being perpendicular to the cable routing direction. The baffle is used to restrict the position of the connecting wires. Thus, the baffle can prevent the connecting wires from routing outside the bracket's area and can also change the routing direction of the connecting wires.

[0011] In some embodiments of the present application, a first distance L1 is provided between the baffle and the side panel, so that an outlet is formed between the baffle and the side panel, and the outlet faces the first circuit board. In this way, the connecting wire can change direction at the outlet and continue to be routed toward the first circuit board.

[0012] In some embodiments of the present application, the bracket further includes a guide plate located at the junction of the support plate and the baffle plate, and forming a sloped surface toward the side plate; the guide plate is used to guide the connecting wire. In this way, the guide plate can be used not only to support the connecting wire but also to guide the connecting wire.

[0013] In some embodiments of the present application, the main bracket includes a first side wall facing the side panel, the first side wall including at least one first wire clamp portion spaced apart and protruding toward the side panel; the side panel includes a second side wall facing the first side wall, the second side wall including at least one second wire clamp portion spaced apart and protruding toward the first side wall; the first wire clamp portion and the second wire clamp portion are used to secure the connecting wire. In this way, the connecting wire can be secured using each first wire clamp portion and each second wire clamp portion, preventing the connecting wire from falling out of the wire groove, thereby preventing the connecting wire from interfering with other components within the first body.

[0014] In some embodiments of the present application, the main bracket includes a first chamfer located at the edge of the first sidewall away from the support plate, and the side panel includes a second chamfer located at the edge of the second sidewall away from the support plate. This facilitates the routing of the connecting wires and prevents the bracket from scratching the wires.

[0015] In some embodiments of the present application, it also includes: a flexible circuit board; the first body also includes: a middle frame, the area of ​​the middle frame adjacent to the hinge includes a through hole, the first circuit board is arranged in the middle frame and adjacent to the through hole; the first end of the flexible circuit board is connected to the first circuit board, and the second end of the flexible circuit board passes through the through hole to be connected to the second body; the bracket is arranged in the through hole and connected to the middle frame, and the bracket is used to seal the through hole.

[0016] In some embodiments of the present application, the middle frame includes a first portion located on the side of the through-hole away from the rotation axis and a second portion located on the side of the through-hole closer to the rotation axis. The first portion includes a first side surface facing the through-hole, and the second portion includes a second side surface facing the through-hole. The first side surface is provided with a sealing portion, which extends along the first side surface toward the second side surface. A gap is formed between the sealing portion and the second side surface, forming a first passage for the flexible circuit board to pass through. The second end of the flexible circuit board extends along the sealing portion and passes through the first passage to the second body. This facilitates the flexible circuit board to pass through the middle frame and connect between the first and second bodies.

[0017] In some embodiments of the present application, the sealing portion is attached to the flexible circuit board via an adhesive layer. In this way, the flexible circuit board and the sealing portion can be fixed, and the flexible circuit board can also function as a sealant for the through hole.

[0018] In some embodiments of the present application, the bracket includes a first contact surface facing the sealing portion, a second contact surface facing the second side surface, and third contact surfaces located at both ends of the first contact surface along the wiring direction. The middle frame includes two third side surfaces along the wiring direction for connecting the first side surface and the second side surface. The first contact surface abuts the area of ​​the flexible circuit board that is intended to mate with the sealing portion, the second contact surface abuts the second side surface, and the third contact surface abuts the third side surface to seal the through-hole. In this way, each contact surface of the bracket can abut against the corresponding side surface of the middle frame, improving the sealing effect of the through-hole.

[0019] In some embodiments of the present application, the bracket includes a receiving opening formed continuously on the first, second, and third contact surfaces. Sealing ribs are filled into the receiving opening, and the sealing ribs abut the flexible printed circuit board and the second and third side surfaces of the middle frame, respectively, to seal the through-hole. Thus, the use of the sealing ribs to achieve abutment between the bracket and the middle frame can further enhance the sealing effect.

[0020] In some embodiments of the present application, the bracket includes a first fixing portion and a second fixing portion located at either end of the bracket along the wiring direction. The first fixing portion and the second fixing portion are used to connect to the middle frame. This ensures that the bracket is stably fixed to the middle frame and effectively seals the through-hole.

[0021] Some embodiments of the present application further include: a second circuit board and a radio frequency chip module; the radio frequency chip module is disposed on and connected to the first circuit board; and the second circuit board is disposed on a side of the first circuit board, away from the radio frequency chip module, along the axial direction of the rotating shaft. This facilitates laying connecting wires between the second circuit board and the first circuit board to enable signal transmission between the second circuit board and the radio frequency chip module.

[0022] In some embodiments of the present application, the connecting wire is a radio frequency connecting wire; one end of the radio frequency connecting wire is connected to the second circuit board, and the other end of the radio frequency connecting wire passes through a wire slot and extends to the first area of ​​the first circuit board to connect to the first circuit board; the first area refers to the area of ​​the first circuit board adjacent to the radio frequency chip module. In this way, the connecting wire connected to the second circuit board can receive signals and transmit them to the first circuit board, facilitating signal transmission.

[0023] In some embodiments of the present application, the connecting wire is a radio frequency connecting wire; one end of the radio frequency connecting wire is connected to the second area of ​​the first circuit board, and the other end of the radio frequency connecting wire passes through a wire slot and is connected to the first area of ​​the first circuit board. The first area refers to the area of ​​the first circuit board adjacent to the radio frequency chip module, and the second area refers to the area of ​​the first circuit board distal to the radio frequency chip module. In this way, different connecting wires can be used to transmit different signals.

[0024] In some embodiments of the present application, the side panel includes an opening that communicates with a wire trough and faces the second region of the first circuit board. The other end of the RF cable passes through the opening and the wire trough and connects to the first region of the first circuit board. This enables signal transmission within the board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] FIG1 is a schematic structural diagram of a radio frequency connecting line provided in an embodiment of the present application;

[0027] FIG2A is a schematic diagram of the internal structure of an electronic device;

[0028] FIG2B is a partial schematic diagram of area A in FIG2A ;

[0029] FIG3 is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application;

[0030] FIG4 is a first schematic diagram of the internal structure of the electronic device 100 provided in an embodiment of the present application;

[0031] FIG5 is a second schematic diagram of the internal structure of the electronic device 100 provided in an embodiment of the present application;

[0032] FIG6 is a first structural diagram of the first body 110 provided in an embodiment of the present application;

[0033] FIG7 is a schematic structural diagram of area B in FIG6 ;

[0034] FIG8 is a first structural schematic diagram of the bracket 204 provided in an embodiment of the present application;

[0035] FIG9 is a second structural schematic diagram of the bracket 204 provided in an embodiment of the present application;

[0036] FIG10 is a partial view of the DD section in FIG8;

[0037] FIG11 is a schematic structural diagram of area E in FIG9 ;

[0038] FIG12 is a side view of a bracket 204 provided in an embodiment of the present application;

[0039] FIG13A is a partial schematic diagram of a middle frame 201 provided in an embodiment of the present application;

[0040] FIG13B is a first partial schematic diagram of the CC section in FIG7 ;

[0041] FIG14 is a schematic diagram of the assembly structure of the bracket 204 and the RF connecting line 205 provided in an embodiment of the present application;

[0042] FIG15 is a second structural diagram of the first body 110 provided in an embodiment of the present application;

[0043] FIG16 is a third structural diagram of the bracket 204 provided in an embodiment of the present application;

[0044] FIG17 is a fourth structural diagram of the bracket 204 provided in an embodiment of the present application;

[0045] FIG18 is a fifth structural diagram of the bracket 204 provided in an embodiment of the present application;

[0046] FIG19 is a second partial schematic diagram of the CC section in FIG7 ;

[0047] FIG20 is a schematic structural diagram of a sealing rib 20481 provided in an embodiment of the present application;

[0048] FIG21 is a schematic diagram of the assembly structure of the bracket 204 and the sealing rib 20481 provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] The following will clearly describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments of the present application, other embodiments obtained by ordinary technicians in this field without making any creative work are all within the scope of protection of this application.

[0050] In the description of this application, it should be understood that the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this invention based on specific circumstances.

[0052] The following explains the professional terms mentioned in the embodiments of the present application to facilitate understanding by those skilled in the art.

[0053] RF cable (hereinafter referred to as cable) is a common signal line in electronic devices. Cables can include an inner conductor and an outer conductor wrapped around the inner conductor. The inner and outer conductors are coaxial and form a current loop for signal transmission. An insulating medium is placed between the inner and outer conductors to ensure a consistent distance between them to avoid reducing the transmitted signal power and, in turn, signal strength. The outer conductor is wrapped with an insulating layer to insulate and shield against electromagnetic interference. Cables are often used for long-distance RF, communication, and other signal transmission.

[0054] FIG1 is a schematic structural diagram of a radio frequency connecting line provided in an embodiment of the present application.

[0055] As shown in FIG1 , a cable 40 may include a cable body 41 and cable connectors 42 located at both ends of the cable body 41 . The cable connectors 42 are used to be fastened to a circuit board so as to transmit signals to a radio frequency processor near the circuit board.

[0056] The cable 40 is used to connect the radio frequency circuit and the antenna in the electronic device so that the electronic device can perform radio frequency communication through the connected radio frequency circuit and antenna. The radio frequency circuit can be located on the main circuit board of the electronic device, and the antenna can be located in the middle frame of the electronic device.

[0057] Figure 2A is a schematic diagram of the internal structure of an electronic device. Figure 2B is a partial schematic diagram of area A in Figure 2A.

[0058] As shown in Figures 2A and 2B, the electronic device includes a central frame 10, on which are mounted a main circuit board 20 and a secondary circuit board 50. The main circuit board 20 is located in the upper half of the central frame 10, and the secondary circuit board 50 is located in the lower half of the central frame 10. The main circuit board 20 is responsible for most system functions and overall control of the electronic device; the secondary circuit board 50 is responsible for charging, headphone audio signal transmission, signal connection processing, communication processing, and sound conversion processing.

[0059] The RF processor 30 is located near the top of the middle frame 10 of the main circuit board 20 and is connected to the main circuit board 20. A cable 40 is connected between the main circuit board 20 and the auxiliary circuit board 50. The auxiliary circuit board 50 transmits the collected signal to the main circuit board 20 via the cable 40. The main circuit board 20 then transmits the signal to the RF processor 30, which processes the signal.

[0060] The middle frame 10 may include an antenna (not shown in the figure); the main circuit board 20 may include a radio frequency circuit and a connecting socket connected to the radio frequency circuit; the auxiliary circuit board 50 may include a connecting socket connected to the antenna and corresponding one to one.

[0061] The RF circuit may include one or more of a power amplifier, a filter, a linear amplifier, and a switch. The RF circuit may also be coupled to the RF processor 30. The RF processor 30 is used to generate a transmit signal. The RF circuit transmits the transmit signal to the antenna via a cable 40, and the antenna transmits the generated wireless signal. The antenna may also receive RF signals. The antenna transmits the received RF signal to the RF circuit via the cable 40, and the RF circuit transmits the received RF signal to the RF processor 30.

[0062] When using cable 40 for signal transmission, it connects the RF circuit and antenna via connectors on the main circuit board 20 and the auxiliary circuit board 50. For example, one cable connector 42 of cable 40 snaps onto the main circuit board 20 and couples to the corresponding connector for the RF circuit. The other cable connector 42 snaps onto the auxiliary circuit board 50 and couples to the corresponding connector for the antenna. In this way, cable 40 enables signal transmission between different circuit boards. During RF communication within the electronic device, the RF circuit can transmit RF signals to the antenna via cable 40, and the antenna can both receive and transmit RF signals, thus achieving RF communication within the electronic device.

[0063] Taking a mobile phone as an example, the middle frame 10 is a relatively large structural component that supports all components such as circuit boards and batteries. Its structural integrity and relatively large size facilitate the routing of cables 40. Therefore, a groove 11 can be provided in the middle frame 10. The cables 40 are routed within this groove until they reach the circuit boards (main circuit board 20 and auxiliary circuit board 50) and connect to them. Routing refers to laying the cables 40.

[0064] When using cable 40 to transmit signals to the RF processor 30 mounted on the main circuit board 20, to minimize signal insertion loss, the cable connector 42 is preferably positioned as close to the RF processor 30 as possible on the main circuit board 20. However, based on a conventional routing scheme, the cable 40 is routed within the groove 11 of the middle frame 10. Upon encountering the main circuit board 20 at position T1, it turns left and routes along the edge of the main circuit board 20. This T1 position is located at the end of the main circuit board 20 away from the RF chip 30. Therefore, the cable 40 must route along the edge of the main circuit board 20 to position T2 before turning upward to allow the cable connector 42 to engage with the main circuit board 20 near the RF processor 30. This creates a significant distance between the cable 40's routing to the main circuit board 20 and the RF processor 30, necessitating a longer cable run.

[0065] However, routing the cable on the main circuit board 20 of the electronic device prevents other functional components from being soldered to the main circuit board 20, resulting in wasted circuit board layout area. Furthermore, to prevent damage to the cable 40 from other components in the electronic device, hardware must be soldered separately to the main circuit board 20 to prevent the cable 40 from bending or deviating. This not only complicates manufacturing and increases costs, but also further wastes circuit board layout area.

[0066] Furthermore, due to the structural characteristics of cable 40, signals running within its conductors are susceptible to electromagnetic radiation and dissipate energy outward, resulting in differences between the signals entering and exiting cable 40, leading to signal damage. The outermost layer of cable 40 is an insulating layer, which generally prevents signal dissipation. However, if cable 40 is routed on the main circuit board 20, the insulating layer will not provide adequate electromagnetic shielding. Consequently, for the same routing distance, routing on the main circuit board 20 will result in greater signal dissipation, leading to signal damage. Therefore, when cable 40 is routed over a longer distance on the main circuit board 20, the main circuit board 20 will cause electromagnetic interference to the cable 40, thereby damaging the transmitted signal.

[0067] In order to increase the layout area of ​​the circuit board, reduce costs, and avoid signal damage, an embodiment of the present application provides an electronic device 100, which lays routing paths on other structural components to reduce the routing distance of the RF connection line on the circuit board.

[0068] The electronic devices described in the embodiments of the present application include but are not limited to mobile phones, foldable screen mobile phones, notebook computers, tablet computers, laptop computers, personal digital assistants or wearable devices, etc. The following description uses the electronic device as a foldable screen mobile phone.

[0069] To facilitate understanding of the electronic device 100 provided in the embodiment of the present application, its structure is described in detail below with reference to the accompanying drawings.

[0070] FIG3 is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application.

[0071] As shown in Figure 3, in some embodiments, the electronic device 100 may include a first body 110, a second body 120, a hinge 130, a screen 140, a first rear cover, and a second rear cover (not shown). The first body 110 and the second body 120 are respectively arranged on either side of the axis of the hinge 130; the screen 140 covers the first body 110, the second body 120, and the hinge 130, and is connected to the first body 110 and the second body 120 respectively; the first rear cover is connected to the side of the first body 110 away from the screen 140, and the second rear cover is connected to the side of the second body 120 away from the screen 140.

[0072] The first body 110 and the second body 120 are respectively rotatably connected to the hinge 130, so that the angle between the first body 110 and the second body 120 decreases until the electronic device 100 is in a folded state, or the angle between the first body 110 and the second body 120 increases until the electronic device 100 is in an unfolded state.

[0073] The screen 140 can be a bendable flexible screen. FIG3 shows a schematic diagram of the electronic device 100 in an unfolded state, where the first body 110 and the second body 120 are parallelly distributed on both sides of the hinge 130, flattening the flexible screen.

[0074] Depending on the rotational direction of the first body 110 and the second body 120, the flexible screen may be hidden inside the electronic device 100 when it is in the folded state, or it may be wrapped around the outside of the body. Specifically, when the first body 110 and the second body 120 are folded toward the front of the flexible screen, the flexible screen is hidden inside the body when the electronic device 100 is in the folded state. Such an electronic device can be referred to as an internal folding screen electronic device, such as an internal folding screen mobile phone. When the first body 110 and the second body 120 are folded toward the back of the flexible screen, the flexible screen wraps around the outside of the body when the electronic device 100 is in the folded state. Such an electronic device 100 can be referred to as an external folding screen electronic device, such as an external folding screen mobile phone.

[0075] To facilitate description of the internal structure of electronic device 100, the body of electronic device 100 (first body 110 and second body 120) is defined as comprising a first surface 100a and a second surface 100b. First surface 100a is the surface of the body facing the rear housing; second surface 100b is the surface of the body facing screen 140. In other words, first surface 100a and second surface 100b are opposing surfaces.

[0076] FIG4 is a first schematic diagram of the internal structure of the electronic device 100 provided in an embodiment of the present application.

[0077] FIG5 is a second schematic diagram of the internal structure of the electronic device 100 provided in an embodiment of the present application.

[0078] The state shown in FIG4 is a schematic structural diagram of the first surface 100 a of the electronic device 100 , and the state shown in FIG5 is a schematic structural diagram of the second surface 100 b of the electronic device 100 .

[0079] As shown in Figures 4 and 5, in some embodiments, if the electronic device 100 is a foldable screen mobile phone, a flexible printed circuit (FPC) 150 connected to the main circuit board is usually arranged between the first body 110 and the second body 120. The flexible printed circuit 150 has excellent characteristics such as light weight, thin thickness, and free bending and folding.

[0080] The flexible circuit board 150 extends across the hinge 130 in a first direction and is connected between the first body 110 and the second body 120. The flexible circuit board 150 includes a first end 151 and a second end 152. The first end 151 is connected to the first body 110 at the first surface 100a of the electronic device 100. The second end 152 first passes from the first surface 100a into the second surface 100b, then passes from the second surface 100b to the first surface 100a, and finally connects to the second body 120 at the first surface 100a. The first direction is perpendicular to the axis of the hinge 130.

[0081] The main circuit board of the electronic device 100 can be disposed within the first body 110 or the second body 120. The routing path of the RF cable is determined by the layout of the main circuit board. For example, when the main circuit board is disposed in the first body 110, the routing path of the RF cable is also laid out in the first body 110.

[0082] FIG6 is a first structural schematic diagram of the first body 110 provided in an embodiment of the present application.

[0083] The state shown in FIG6 is a schematic structural diagram of the first surface 100 a of the first body 110 .

[0084] As shown in conjunction with Figures 4 and 6 , in some embodiments, the first body 110 includes a first circuit board 202 and a connecting wire 205. A gap is defined between the first circuit board 202 and the rotating shaft 130. The connecting wire 205 is disposed between the first circuit board 202 and the rotating shaft 130 and extends at least partially along the axial direction of the rotating shaft 130.

[0085] The first circuit board 202 may be the main circuit board of the electronic device 100. The connecting cable 205 may be a radio frequency connecting cable or other connecting cable configured in the electronic device for signal transmission. The following description uses the connecting cable 205 as an example. The radio frequency connecting cable 205 is used to transmit signals between the various circuit boards in the electronic device 100. The signals may include radio frequency signals and / or communication signals. The structural characteristics of the radio frequency connecting cable 205 can be compared to the structural characteristics of the cable 40 shown in Figure 1 and are not further described here.

[0086] Thus, the electronic device 100 provided in the embodiment of the present application provides a routing method that allows the connecting wire 205 to be routed off-board, rather than on the first circuit board 202. This routing method does not occupy the layout area of ​​the first circuit board 202, leaving more space on the first circuit board 202 for other functional components. It also reduces the number of hardware components installed on the first circuit board 202, thereby reducing costs. Furthermore, it reduces signal interference from the first circuit board 202 on the connecting wire 205, thereby ensuring signal quality.

[0087] In some embodiments, referring again to Figures 4 and 6, the embodiments of the present application lay the RF connection line 205 on the side of the first body 110 close to the hinge 130, but not on the side away from the hinge 130. This is because the side of the first body 110 away from the hinge 130 is the button side. In this way, the first body 110 includes a side button position, and a groove has been opened on the first body 110 corresponding to the side button position to accommodate the side button and related electronic components. There is also adhesive between the first body 110 and the battery cover for sealing, so that the first body 110 on the button side is already the narrowest sealed position. If the RF connection line 205 is routed at this position, a corresponding wire groove needs to be added to the first body 110. Then, the vertical wall of the first body 110 needs to continue to expand to the right. The right side is the battery compartment 207. Expanding to the right requires the battery to be narrowed as a whole, which is not conducive to laying the battery. Therefore, in the embodiment of the present application, the RF connection line 205 is laid on the side of the first body 110 close to the rotation shaft 130 , which will not affect other components in the electronic device 100 .

[0088] FIG. 7 is a schematic structural diagram of area B in FIG. 6 .

[0089] 4 and 7 , in some embodiments, the first body 110 may further include a radio frequency chip module 203 and a bracket 204 .

[0090] The RF chip module 203 is disposed on the first circuit board 202 and is electrically connected to the first circuit board 202. Based on the layout characteristics of each component in the electronic device 100, the RF chip module 203 can be disposed in an area of ​​the first circuit board 202 near the top of the first body 110.

[0091] The RF chip module 203 is used to receive the signal transmitted by the RF connection line 205 through the first circuit board 202 and process the signal; the RF chip module 203 is also used to generate a signal and transmit the signal to the antenna through the RF connection line 205 so as to be emitted by the antenna.

[0092] The bracket 204 is disposed between the first circuit board 202 and the rotating shaft 130. The bracket 204 is used to guide the routing path of the radio frequency connecting line 205. For example, the bracket 204 can be made of stainless steel, plastic, or aluminum alloy.

[0093] FIG8 is a first structural schematic diagram of the bracket 204 provided in an embodiment of the present application.

[0094] FIG9 is a second structural schematic diagram of the bracket 204 provided in an embodiment of the present application.

[0095] The structure shown in FIG9 is a schematic diagram of the structure shown in FIG8 from another perspective.

[0096] 4 , 7 , 8 and 9 , in some embodiments, the bracket 204 includes a wire groove 2041 , a wiring direction D0 of the wire groove 2041 is parallel to the rotation axis 130 , and the wire groove 2041 is used for routing the RF connection line 205 .

[0097] The wire trough 2041 can pass through both ends of the bracket 204 in the longitudinal direction. The routing direction D0 of the wire trough 2041 is the longitudinal direction of the bracket 204, so that the entrance 204a of the wire trough 2041 along the routing direction D0 can be located at one end of the bracket 204 in the longitudinal direction, and the exit 204b along the routing direction D0 can be located at the other end of the bracket 204 in the longitudinal direction. In this way, routing the wires along the longitudinal direction of the bracket 204 can increase the routing distance, thereby better arranging the RF connection wires 205 and reducing the routing of the RF connection wires 205 on other devices.

[0098] In some embodiments, the wire groove 2041 can be formed by being recessed to a first depth along the surface of the bracket 204 toward the inside of the bracket 204. In this way, the wire groove 2041 can be a groove with one end open to facilitate wiring.

[0099] In some embodiments, the wire groove 2041 can be formed in the center of the length direction of the bracket 204, and the bracket 204 has a hollow structure. In this way, the bracket 204 can wrap the RF connection line 205, stably fixing the RF connection line 205 and preventing the RF connection line 205 from falling out of the wire groove 2041.

[0100] The RF connection line 205 is routed in the wire groove 2041 . To constrain the position of the RF connection line 205 and prevent the routing path of the RF connection line 205 from bending or deflecting, the depth of the wire groove 2041 is greater than or equal to the diameter of the RF connection line 205 .

[0101] One end of the RF cable 205 is used to receive signals, and the other end passes through the cable slot 2041 and extends to the first region 2021 of the first circuit board 202. The first region 2021 includes a connector (not shown), onto which the other end of the RF cable 205 engages to connect to the first circuit board 202. The first region 2021 refers to the area of ​​the first circuit board 202 adjacent to the RF chip module 203.

[0102] The outlet 204b of the cable trough 2041 along the routing direction D0 is adjacent to the RF chip module 203. The RF connecting line 205 exits the outlet 204b of the cable trough 2041 and meets the first circuit board 202. This allows the RF connecting line 205 to be routed to the first circuit board 202 at a location adjacent to the RF chip module 203. This allows the RF connecting line 205 to be routed to the first circuit board 202 and further extended to an area adjacent to the RF chip module 203. The first circuit board 202 may include RF circuitry. The RF connecting line 205 can then be connected to the RF chip module 203 via the RF circuitry of the first circuit board 202 to transmit signals into the RF chip module 203. This allows the RF connecting line 205 to be routed off-board to a location closest to the RF chip module 203. It then enters the area of ​​the first circuit board 202 adjacent to the RF chip module 203, i.e., the area above the first circuit board 202, ensuring that the routing minimizes the layout area of ​​the first circuit board 202.

[0103] The electronic device 100 provided in the embodiment of the present application utilizes a bracket 204 to lay the RF connection line 205, and the RF connection line 205 is routed in the wire groove 2041 on the bracket 204, which can better constrain the routing path of the RF connection line 205 and avoid bending or offset. In this way, the RF connection line 205 can be routed outside the board to a position almost closest to the RF chip module 203. Afterwards, it enters the area of ​​the first circuit board 202 close to the RF chip module 203, which can reduce the routing distance of the RF connection line 205 on the first circuit board 202 and ensure that the routing occupies the minimum layout area of ​​the first circuit board 202. In addition, the RF connection line 205 can be connected to the area adjacent to the RF chip module 203, which can not only reduce the electromagnetic interference of the first circuit board 202 on the RF connection line 205 and avoid signal damage, but also reduce the layout area occupied by the first circuit board 202, so that the first circuit board 202 has more layout area for arranging other functional components. At the same time, the RF connection line 205 can be fixed by the bracket 204 to reduce the number of hardware components arranged on the first circuit board 202, which can not only further reduce the layout area occupied by the first circuit board 202, but also reduce costs.

[0104] FIG10 is a partial view of the DD section in FIG8 .

[0105] 10 only shows the structure of the main bracket 2042 , the side plate 2043 and the support plate 2044 included in the bracket 204 , and other structures of the bracket 204 are not shown.

[0106] 7 , 8 , and 10 , in some embodiments, the bracket 204 may include a main bracket 2042, a side plate 2043, and a support plate 2044. The main bracket 2042 is adjacent to the rotating shaft 130, and the side plate 2043 is adjacent to the first circuit board 202. A gap is provided between the main bracket 2042 and the side plate 2043. The main bracket 2042 is connected to the side plate 2043 via the support plate 2044 to form a wire groove 2041.

[0107] In this way, a wire groove 2041 with an opening on one side can be formed, and the radio frequency connecting line 205 can be laid in the wire groove 2041 from the opening, which facilitates the laying of the radio frequency connecting line 205 .

[0108] In some embodiments, the bracket 204 may further include a first fixing portion 20491 and a second fixing portion 20492. The first fixing portion 20491 and the second fixing portion 20492 are located at two ends of the bracket 204 along the routing direction D0 and may be located on the same side of the routing direction.

[0109] Exemplarily, the first fixing portion 20491 may be connected to a region of the side plate 2043 corresponding to an entrance of the wire trough 2041 , and the second fixing portion 20492 may be connected to a region of the support plate 2044 corresponding to an exit of the wire trough 2041 .

[0110] The first fixing portion 20491 and the second fixing portion 20492 are used to connect to the first body 110. For example, the first fixing portion 20491 and the second fixing portion 20492 can both adopt a ring structure.

[0111] FIG11 is a schematic structural diagram of the E region in FIG9 .

[0112] FIG12 is a side view of the bracket 204 provided in an embodiment of the present application.

[0113] As shown in FIG. 11 and FIG. 12 , in some embodiments, the bracket 204 may further include a baffle 2045 , and the baffle 2045 is used to limit the position of the RF connection line 205 .

[0114] Baffle 2045 is located at one end of the bracket 204 in the longitudinal direction, at the exit 204b of the cable trough 2041. Baffle 2045 can be located at the junction of the second fixing portion 20492 and the support plate 2044. Baffle 2045 is connected to the support plate 2044 and is perpendicular to the longitudinal direction of the bracket 204. In this way, baffle 2045 can be used to prevent the RF cable 205 from being routed outside the area where the bracket 204 is located, for example, preventing the RF cable 205 from being routed to the second fixing portion 20492. Using baffle 2045 to define the routing position of the RF cable 205 can prevent the RF cable 205 from interfering with other components within the first body 110.

[0115] In some embodiments, the length of the side panel 2043 along the routing direction D0 is less than the length of the main bracket 2042 along the routing direction, so that there is a first distance L1 between the baffle 2045 and the side panel 2043, so that an outlet 204b is formed between the baffle 2045 and the side panel 2043, and the outlet 204b is facing the first circuit board 202 and is adjacent to the RF chip module 203.

[0116] In this way, the baffle 2045 can be used to change the routing direction D0 of the RF connection line 205 routed to the exit 204b position, so that the RF connection line 205 can change direction at the exit position and continue to be routed toward the first circuit board 202, so that when the RF connection line 205 transmits signals between the RF chip module 203, it can have the shortest routing distance on the first circuit board 202.

[0117] In some embodiments, the bracket 204 may further include a guide plate 2046 . The guide plate 2046 is located at the connection between the support plate 2044 and the baffle 2045 and forms a slope facing the side plate 2043 .

[0118] The guide plate 2046 is used to increase the strength of the bracket 204. Thus, the guide plate 2046 not only supports the RF cable 205 but also guides it. Thus, the guide plate 2046 assists the baffle 2045 in changing the routing direction D0 of the RF cable 205, directing it toward the first circuit board 202.

[0119] 10 and 11 , in some embodiments, the main support 2042 may include a first side wall 20421 facing the side panel 2043 , the first side wall 20421 including at least one first clip portion 20422 spaced apart, and the first clip portion 20422 protruding toward the side panel 2043 .

[0120] The side plate 2043 may include a second side wall 20431 facing the first side wall 20421 . The second side wall 20431 includes at least one second clip portion 20432 spaced apart from each other. The second clip portion 20432 protrudes toward the first side wall 20421 .

[0121] The number of the first wire clamping parts 20422 can be the same as or different from the number of the second wire clamping parts 20432. The first wire clamping parts 20422 and the second wire clamping parts 20432 can be staggered or arranged in a one-to-one correspondence. The first wire clamping parts 20422 and the second wire clamping parts 20432 protrude toward each other in the wire groove 2041. When the RF connection line 205 is routed in the wire groove 2041, the RF connection line 205 can be fixed by using the first wire clamping parts 20422 and the second wire clamping parts 20432. This can prevent the RF connection line 205 from falling out of the wire groove 2041 and prevent the routing path of the RF connection line 205 from being bent or offset. By constraining the position of the RF connection line 205 by the first wire clamping parts 20422 and the second wire clamping parts 20432, it is possible to prevent the RF connection line 205 from interfering with other components in the first body 110.

[0122] In some embodiments, the main support 2042 may include a first chamfer 20423 located at an edge of the first sidewall 20421 away from the support plate 2044. The side plate 2043 may include a second chamfer 20433 located at an edge of the second sidewall 20431 away from the support plate 2044.

[0123] The first chamfer 20423 and the second chamfer 20433 are located at the opening of the wire groove 2041. In this way, when the RF connecting line 205 is laid in the wire groove 2041, the first chamfer 20423 and the second chamfer 20433 can facilitate the laying of the RF connecting line 205 and prevent the bracket 204 from scratching the RF connecting line 205.

[0124] 6 and 7 , in some embodiments, the first body 110 may further include a middle frame 201. The middle frame 201 is a structural component of the electronic device 100 for supporting other components, and antennas (not shown) are provided in different areas of the middle frame 201.

[0125] FIG13A is a partial schematic diagram of the middle frame 201 provided in an embodiment of the present application.

[0126] FIG13B is a first partial schematic diagram of the CC section in FIG7 .

[0127] 13B only shows the structure in which the middle frame 201 includes the through hole 2011 , and the rest of the structure is not shown.

[0128] 4 , 7 , 13A and 13B , in some embodiments, the area of ​​the middle frame 201 adjacent to the rotation axis 130 includes a through hole 2011 , and the through hole 2011 communicates with the first surface 100 a and the second surface 100 b .

[0129] Similarly, the second body 120 includes a second middle frame (not shown in the figure), and the second middle frame includes a second through hole (not shown in the figure) in a region adjacent to the hinge 130. The second through hole connects the first surface 100a and the second surface 100b. The second through hole may be symmetrical with the through hole 2011 with respect to the hinge 130. Thus, the through hole 2011 and the second through hole may be used to allow the flexible circuit board 150 to pass through, thereby connecting the flexible circuit board 150 to the first body 110 and the second body 120, respectively.

[0130] The first circuit board 202 is arranged on the first surface 100a of the middle frame 201, in the upper half of the middle frame 201, adjacent to the through-hole 2011. The first circuit board 202 is located on the side of the through-hole 2011 away from the hinge 130. The through-hole 2011 is positioned near the first circuit board 202 to facilitate the insertion of the flexible circuit board 150 through the through-hole 2011 for connection to the first circuit board 202. Thus, the first circuit board 202 is connected to the first end 151 of the flexible circuit board 150. The second end 152 of the flexible circuit board 150 passes through the through-hole 2011, enters the second surface 100b, and then penetrates the first surface 100a through the second through-hole to connect to the second body 120.

[0131] Based on the layout characteristics of each device in the electronic device 100 , the RF chip module 203 can be arranged in an area of ​​the first circuit board 202 close to the top of the middle frame 201 , so that the RF chip module 203 can be close to the through hole 2011 .

[0132] When the electronic device 100 is folded, the hinge 130 of an inward-folding screen phone is exposed to the outside world. The flexible circuit board 150 is placed across the hinge 130, and the presence of a through hole 2011 in the middle frame 201 for the flexible circuit board 150 to pass through can allow dust or liquid to enter the device, for example, into the circuit board area, potentially damaging the circuit board and other components.

[0133] To this end, in some embodiments, the bracket 204 is disposed in the through hole 2011 and connected to the middle frame 201, and the bracket 204 is used to seal the through hole 2011. In this way, the wire groove 2041 can be formed along the surface of the bracket 204 away from the through hole 2011 and recessed into the bracket 204 by a first depth.

[0134] The electronic device provided in the embodiment of the present application uses the bracket 204 to seal the through hole 2011, thereby preventing external dust or liquid from entering the body.

[0135] In some embodiments, when connecting the bracket 204 to the middle frame 201, screws can be used to fix the first fixing part 20491 and the second fixing part 20492 of the bracket 204 on the middle frame 201 at the edge of the through hole 2011, respectively, to achieve the fixation of the bracket 204 to the first body 110 and ensure that the bracket 204 seals the through hole 2011.

[0136] The electronic device 100 provided in an embodiment of the present application is used in a foldable screen mobile phone scenario. The first body 110 and the second body 120 are disposed on either side of a hinge 130. The middle frame 201 of the first body 110 includes a through hole 2011, which is adjacent to the hinge 130. The first circuit board 202 is located on the side of the through hole 2011 away from the hinge 130, and the radio frequency chip module 203 is disposed on the first circuit board 202. The first end 151 of the flexible circuit board 150 is connected to the first circuit board 202, and the second end 152 extends through the through hole 2011 to the second body 120 and is connected to the second body 120. A bracket 204 is disposed in the through hole 2011 to seal the through hole 2011, so that the bracket 204 is adjacent to the first circuit board 202. Therefore, when laying the RF connecting wire 205, the RF connecting wire 205 is routed within the wire groove 2041 on the bracket 204, that is, routed outside the board to the position closest to the RF chip module 203. Then, it is routed into the area of ​​the first circuit board 202 near the RF chip module 203. This can reduce the routing distance of the RF connecting wire 205 on the first circuit board 202 and ensure that the routing occupies the minimum layout area of ​​the first circuit board 202. In addition, the RF connecting wire 205 can be connected to the area adjacent to the RF chip module 203. This not only reduces electromagnetic interference from the first circuit board 202 to the RF connecting wire 205 and prevents signal damage, but also reduces the layout area occupied by the first circuit board 202, so that the first circuit board 202 has more layout area for other functional components. At the same time, the RF connecting wire 205 can be fixed by the bracket 204 to reduce the number of hardware components arranged on the first circuit board 202, further reducing the layout area occupied by the first circuit board 202 and reducing costs.

[0137] Referring again to Figures 4, 6, 7, and 8, in some embodiments, the first body 110 may further include a second circuit board 206 and a battery compartment 207, both of which are disposed on the first surface 100a of the middle frame 201. The second circuit board 206 may be a secondary circuit board of the electronic device 100, configured to connect to the antenna on the middle frame 201 to collect signals. The battery compartment 207 is configured to accommodate a battery.

[0138] The second circuit board 206 is disposed on a side of the first circuit board 202 away from the RF chip module 203 along the axial direction of the rotating shaft 130. The second circuit board 206 and the first circuit board 202 are respectively disposed on either side of the battery compartment 207 along the axial direction of the rotating shaft 130. The battery compartment 207 is located between the first circuit board 202 and the second circuit board 206, so that both the first circuit board 202 and the second circuit board 206 can be connected to the battery in the battery compartment 207. For example, the first circuit board 202 is located in the upper area of ​​the middle frame 201, the battery compartment 207 is located in the middle area of ​​the middle frame 201, and the second circuit board 206 is located in the lower area of ​​the middle frame 201.

[0139] The second circuit board 206 includes a connector that can be connected to an antenna located in the area of ​​the middle frame 201 corresponding to the second circuit board 206. The receiving end of the RF cable 205 snaps onto the connector on the second circuit board 206 to connect the RF cable 205 to the second circuit board 206. This connects the receiving end of the RF cable 205 to the second circuit board 206, receiving the signal collected by the antenna. The other end of the RF cable 205 passes through the cable slot 2041 and connects to the first area 2021 of the first circuit board 202, transmitting the signal to the RF chip module 203 connected to the first area 2021.

[0140] In some embodiments, the RF connection line 205 may include multiple lines to transmit different signals. For example, the RF connection line 205 may include a first RF connection line 2051 and a second RF connection line 2052, wherein the first RF connection line 2051 is used to transmit one of a RF signal and a communication signal, and the second RF connection line 2052 is used to transmit the other of the RF signal and the communication signal.

[0141] When the electronic device 100 adopts a signal transmission method in which signals are collected at the bottom and processed at the top, the ends of the first RF connection line 2051 and the second RF connection line 2052 for receiving signals are both connected to the second circuit board 206 .

[0142] Because there is a certain distance between the second circuit board 206 and the bracket 204, to facilitate wiring, referring again to Figures 6 and 7 , a second wiring groove 201a can be provided in the area of ​​the middle frame 201 adjacent to the second circuit board 206. The second wiring groove 201a is connected to the wiring groove 2041. The other ends of the first RF connection line 2051 and the second RF connection line 2052 then pass through the second wiring groove 201a, then enter the wiring groove 2041, and finally are routed to the first circuit board 202 and connected to the first area 2021.

[0143] In the electronic device 100 provided in the embodiment of the present application, the other end of the RF connection line 205 (the first RF connection line 2051 and the second RF connection line 2052) can be routed directly from the second cable groove 201a on the middle frame 201 to the cable groove 2041 on the bracket 204. When extending from the cable groove 2041 to the first circuit board 202, it only needs to turn in one direction to extend to the first area 2021 of the first circuit board 202 and connect to the RF chip module 203. In contrast, in the existing routing method shown in Figure 2B, the cable 40 is routed from the groove 11 of the middle frame 10, and it must first turn in one direction (position T1) to the main circuit board 20, then turn in another direction on the main circuit board 20 (position T2) to extend to the area of ​​the RF processor 30. As can be seen, the existing routing method requires the cable 40 to rotate in two directions before transmitting signals to the RF processor 30. However, in the embodiment of the present application, the RF connection line 205 only needs to rotate in one direction to transmit signals to the RF chip module 203. The RF connection line 205 has one less rotation, which can reduce stress and improve the performance of the RF connection line 205. In addition, most of the routing distance of the first RF connection line 2051 and the second RF connection line 2052 is routed outside the board, which can reduce the routing distance of the first RF connection line 2051 and the second RF connection line 2052 on each circuit board and avoid excessive layout space occupation on each circuit board.

[0144] FIG14 is a schematic diagram of the assembly structure of the bracket 204 and the RF connecting line 205 provided in an embodiment of the present application.

[0145] As shown in FIG14 , in some embodiments, when the electronic device 100 uses two RF cables 205 to implement signal transmission, a first RF cable 2051 and a second RF cable 2052 are laid in a cable groove 2041 of the bracket 204. The first RF cable 2051 and the second RF cable 2052 can be laid in a stacked manner in the cable groove 2041. For example, the first RF cable 2051 is located at the bottom of the cable groove 2041, and the second RF cable 2052 is located above the first RF cable 2051. The depth of the cable groove 2041 is greater than or equal to the total height of the first RF cable 2051 and the second RF cable 2052.

[0146] When routing to the baffle 2045, the baffle 2045 can be used to change the routing direction of the second RF connection line 2052, and the guide plate 2046 can be used to change the routing direction of the first RF connection line 2051. At the same time, both the baffle 2045 and the guide plate 2046 can prevent the first RF connection line 2051 and the second RF connection line 2052 from being routed outside the area where the bracket 204 is located, allowing the first RF connection line 2051 and the second RF connection line 2052 to be routed according to the designed routing path.

[0147] FIG15 is a second structural diagram of the first body 110 provided in an embodiment of the present application.

[0148] As shown in FIG15 , in some embodiments, an antenna may also be provided in the area of ​​the middle frame 201 corresponding to the first circuit board 202. Signals can then be collected by the first circuit board 202 and transmitted to the RF chip module 203 connected to the first circuit board 202 via the RF cable 205, thereby achieving intra-board signal transmission. Thus, one end of the RF cable 205 is connected to the second area 2022 of the first circuit board 202, and the other end of the RF cable 205 passes through the cable slot 2041 and is connected to the first area 2021 of the first circuit board 202.

[0149] When transmitting signals within the board, the first circuit board 202 includes a second area 2022, which includes a connector that can be connected to an antenna provided in an area of ​​the middle frame 201 corresponding to the first circuit board 202. The second area 2022 refers to an area of ​​the first circuit board 202 that is away from the RF chip module 203.

[0150] Thus, the first circuit board 202 includes two connectors. For example, one end of the second RF connection line 2052, which is used for receiving signals, is snapped onto the connector in the second region 2022 to connect to the first circuit board 202 in the second region 2022; the other end of the second RF connection line 2052 passes through the wire slot 2041 and is snapped onto the connector in the first region 2021 to connect to the first circuit board 202 in the first region 2021.

[0151] One end of the first RF connecting line 2051 for receiving signals is buckled into the connecting seat of the second circuit board 206 to be connected to the second circuit board 206; the other end passes through the second wire groove 201a and the wire groove 2041 in sequence and is buckled into the connecting seat of the first area 2021 to be connected to the first circuit board 202 in the first area 2021.

[0152] It should be noted that in the embodiment of the present application, one of the two RF connection lines can be used for intra-board signal transmission, and the other can be used for bottom acquisition signal and upper processing signal transmission; both can also be used for intra-board signal transmission; both can also be used for bottom acquisition signal and upper processing signal transmission, which is not limited here.

[0153] FIG16 is a third structural schematic diagram of the bracket 204 provided in an embodiment of the present application.

[0154] FIG17 is a fourth structural schematic diagram of the bracket 204 provided in an embodiment of the present application.

[0155] FIG18 is a fifth structural schematic diagram of the bracket 204 provided in an embodiment of the present application.

[0156] As shown in conjunction with Figures 15, 16, 17, and 18, in some embodiments, the side panel 2043 of the bracket 204 includes an opening 20434. The opening 20434 communicates with the wire trough 2041 and faces the second region 2022 of the first circuit board 202. Thus, the wire trough 2041 includes two entrances (204a and 204c). The entrance 204c facing the second region 2022 is used for routing the second RF connection line 2052, and the entrance 204a facing the second circuit board 206 is used for routing the first RF connection line 2051.

[0157] One end of the second RF connection line 2052 is connected to the second area 2022 of the first circuit board 202, and is used to receive the signal collected by the antenna corresponding to the second area 2022. The other end of the second RF connection line 2052 is routed from the entrance 204c through the opening 20434 to the wire slot 2041, and is routed within the wire slot 2041 to the first circuit board 202, and is connected to the first circuit board 202 in the first area 2021 to achieve intra-board signal transmission. In this way, the second RF connection line 2052 can be connected to the RF chip module 203, and the second RF connection line 2052 transmits the signal to the RF chip module 203 for processing. The routing path of the first RF connection line 2051 refers to the content described in the previous embodiment and is not repeated here.

[0158] Referring again to FIG. 13B , in some embodiments, when the bracket 204 is used to seal the through-hole 2011, the middle frame 201 may include a first portion 2012 located on a side of the through-hole 2011 away from the rotation axis 130, and a second portion 2013 located on a side of the through-hole 2011 closer to the rotation axis 130. The first portion 2012 includes a first side surface 2014 facing the through-hole 2011, and the second portion 2013 includes a second side surface 2015 facing the through-hole 2011. The first side surface 2014 and the second side surface 2015 are both perpendicular to the first surface 100a, facing each other, and having a height difference between them.

[0159] A sealing portion 2016 is provided on the first side 2014, extending along the first side 2014 toward the second side 2015. The bracket 204 is inserted into the through hole 2011 from the first surface 100a of the middle frame 201. To facilitate sealing between the bracket 204 and the middle frame 201, the sealing portion 2016 can be located on the side of the first side 2014 adjacent to the second surface 100b.

[0160] A gap L2 is defined between the sealing portion 2016 and the second side surface 2015 to form a first passage for the flexible printed circuit board 150 to pass through.

[0161] FIG19 is a second partial schematic diagram of the CC section in FIG7 .

[0162] As shown in FIG. 19 , in some embodiments, the first end 151 of the flexible circuit board 150 is connected to the first circuit board 202 , and the second end 152 of the flexible circuit board 150 extends along the sealing portion 2016 and passes through the first channel to the second body 120 .

[0163] The sealing portion 2016 is attached to the flexible circuit board 150 via the adhesive layer 2017. The adhesive layer 2017 is used to fix the flexible circuit board 150 and the sealing portion 2016, so that the flexible circuit board 150 can also play the role of sealing the through hole 2011.

[0164] In combination with the contents shown in Figures 8, 12, 13B and 19, in some embodiments, the bracket 204 may include a first contact surface 20471 facing the sealing portion 2016, a second contact surface 20472 facing the second side surface 2015, and a third contact surface 20473 located at both ends of the first contact surface 20471 along the routing direction D0.

[0165] Illustratively, the first contact surface 20471 can be formed by the surfaces of the main bracket 2042 and the support plate 2044 facing the sealing portion 2016; the second contact surface 20472 can be formed by the surface of the main bracket 2042 away from the through hole 2011 along the routing direction D0 perpendicular to the routing direction D0; the third contact surface 20473 can be formed by the two end surfaces of the main bracket 2042 along the routing direction D0.

[0166] First contact surface 20471 may be perpendicular to third contact surface 20473, first contact surface 20471 may be perpendicular to second contact surface 20472, second contact surface 20472 may be perpendicular to third contact surface 20473, and the two third contact surfaces 20473 are parallel. First contact surface 20471, second contact surface 20472, and two third contact surfaces 20473 in bracket 204 are configured to cooperate with middle frame 201 to seal through-hole 2011.

[0167] Correspondingly, the middle frame 201 may include two third side surfaces 2018 (see FIG. 13A ) along the routing direction D0, for connecting the first side surface 2014 and the second side surface 2015. The first third side surface 2018 is used to connect one end of the first side surface 2014 and one end of the second side surface 2015, and the second third side surface 2018 is used to connect the other end of the first side surface 2014 and the other end of the second side surface 2015. The first third side surface 2018 is opposite to the second third side surface 2018. In this way, the four side surfaces are sequentially connected to form a through hole 2011.

[0168] The first contact surface 20471 abuts against the area of ​​the flexible circuit board 150 for bonding with the sealing portion 2016 , the second contact surface 20472 abuts against the second side surface 2015 , and the two third contact surfaces 20473 abut against the two third side surfaces 2018 in a one-to-one correspondence to seal the through hole 2011 .

[0169] In some embodiments, to improve the sealing effect, the bracket 204 may include a receiving opening 2048 , which is continuously formed on the first contact surface 20471 , the second contact surface 20472 , and the third contact surface 20473 , so that the receiving opening 2048 may be an annular structure.

[0170] Figure 20 is a schematic structural diagram of the sealing rib 20481 provided in an embodiment of the present application.

[0171] As shown in FIG20 , in some embodiments, the receiving opening 2048 is filled with a sealing rib 20481. The sealing rib 20481 may be an annular structure and may be made of a material having elasticity and deformability, such as rubber.

[0172] FIG21 is a schematic diagram of the assembly structure of the bracket 204 and the sealing rib 20481 provided in an embodiment of the present application.

[0173] 19 and 21 , in some embodiments, a sealing rib 20481 is embedded in the receiving opening 2048. Since the sealing rib 20481 is deformable, it can be deformed according to the structure of the receiving opening 2048 to tightly fit the receiving opening 2048 and ensure a sealing effect.

[0174] Sealing rib 20481 protrudes from the corresponding contact surface relative to accommodating opening 2048 (see the dashed line portion of sealing rib 20481 in FIG19 ). Thus, when bracket 204 is installed in through-hole 2011, sealing rib 20481 abuts against flexible printed circuit board 150. Leveraging its elasticity, sealing rib 20481 is flattened by flexible printed circuit board 150 and sealing portion 2016, elastically deforming to apply pressure to flexible printed circuit board 150. Similarly, sealing rib 20481 abuts against second side surface 2015 and third side surface 2018 of middle frame 201. Sealing rib 20481 is flattened by the side surfaces of middle frame 201 and elastically deforming to apply pressure to second side surface 2015 and third side surface 2018, thereby enhancing the sealing effect of through-hole 2011.

[0175] In the electronic device 100 provided in the embodiment of the present application, the bracket 204 not only seals the through-hole 2011 through which the flexible printed circuit board 150 passes, but also provides routing for the RF connection line 205. This eliminates the need for a dedicated device for routing the RF connection line 205 within the electronic device 100. By integrating multiple functions into a single device, the internal space occupied by the electronic device 100 can be reduced.

[0176] In some embodiments, the number of RF connection lines 205 may be multiple, for example, three or four. When routing the lines in the wire groove 2041, the depth of the wire groove 2041 is greater than or equal to the total height of the stack of RF connection lines 205, so as to constrain the position of the RF connection lines 205 and prevent the routing paths of the RF connection lines 205 from being bent or offset.

[0177] In some embodiments, the RF cable 205 can also be laid in an area of ​​the middle frame 201 where no buttons are provided. For example, if both the primary and secondary circuit boards are provided in the second body 120, since the middle frame of the second body 120 does not need to be provided with buttons, a cable trough can be provided in the middle frame of the second body 120 for routing the RF cable 205.

[0178] It should be noted that those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope of this application is indicated by the following claims.

[0179] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: include: A rotating shaft (130); A first body (110) and a second body (120) are arranged on both sides of the rotating shaft (130); The first body (110) comprises: A first circuit board (202), wherein a gap is provided between the first circuit board (202) and the rotating shaft (130); as well as, The connecting line (205) is arranged between the first circuit board (202) and the rotating shaft (130), and at least partially extends along the axial direction of the rotating shaft (130).

2. The electronic device according to claim 1, characterized in that: The first body (110) further includes: A bracket (204) is arranged between the first circuit board (202) and the rotating shaft (130); The bracket (204) comprises a wire groove (2041), the wiring direction of the wire groove (2041) is parallel to the rotating shaft (130), and the wire groove (2041) is used for routing the connecting wire (205).

3. The electronic device according to claim 2, characterized in that: The bracket (204) comprises a main bracket (2042), a side plate (2043) and a support plate (2044), the main bracket (2042) is adjacent to the rotating shaft (130), the side plate (2043) is adjacent to the first circuit board (202), and there is a gap between the main bracket (2042) and the side plate (2043); The main bracket (2042) is connected to the side plate (2043) via the support plate (2044) to form the wire trough (2041).

4. The electronic device according to claim 3, characterized in that: The support (204) further includes: a baffle (2045); The baffle (2045) is located at the outlet end of the wire trough (2041) and is connected to the support plate (2044), and the baffle (2045) is perpendicular to the routing direction; The baffle (2045) is used to limit the position of the connecting line (205).

5. The electronic device according to claim 4, characterized in that: There is a first distance L1 between the baffle plate (2045) and the side plate (2043), so that an outlet is formed between the baffle plate (2045) and the side plate (2043), and the outlet faces the first circuit board (202).

6. The electronic device according to claim 5, characterized in that: The support (204) further includes: a guide plate (2046); The guide plate (2046) is located at the connection between the support plate (2044) and the baffle plate (2045), and forms a slope facing the side plate (2043); The guide plate (2046) is used to guide the connecting line (205).

7. The electronic device according to claim 3, characterized in that: The main support (2042) includes a first side wall (20421) facing the side plate (2043), wherein the first side wall (20421) comprising at least one first wire clamp portion (20422) arranged at intervals, wherein the first wire clamp portion (20422) protrudes toward the side plate (2043); The side plate (2043) comprises a second side wall (20431) facing the first side wall (20421), the second side wall (20431) comprises at least one second wire clamp portion (20432) arranged at intervals, and the second wire clamp portion (20432) protrudes in the direction of the first side wall (20421); The first wire clamp portion (20422) and the second wire clamp portion (20432) are used to fix the connecting wire (205).

8. The electronic device according to claim 7, characterized in that: The main support (2042) comprises a first chamfer (20423), wherein the first chamfer (20423) is located at an edge of the first side wall (20421) away from the support plate (2044); The side plate (2043) includes a second chamfer (20433), and the second chamfer (20433) is located at an edge of the second side wall (20431) away from the support plate (2044).

9. The electronic device according to claim 2, characterized in that: Also includes: A flexible circuit board (150); The first body (110) further comprises: a middle frame (201), a region of the middle frame (201) adjacent to the rotating shaft (130) comprising a through hole (2011), and the first circuit board (202) is arranged on the middle frame (201) and adjacent to the through hole (2011); The first end (151) of the flexible circuit board (150) is connected to the first circuit board (202), and the second end (152) of the flexible circuit board (150) passes through the through hole (2011) to be connected to the second body (120); The bracket (204) is arranged in the through hole (2011) and connected to the middle frame (201), and the bracket (204) is used to seal the through hole (2011).

10. The electronic device according to claim 9, characterized in that: The middle frame (201) comprises a first portion (2012) located on a side of the through hole (2011) away from the rotating shaft (130) and a second portion (2013) located on a side of the through hole (2011) adjacent to the rotating shaft (130); the first portion (2012) comprises a first side surface (2014) facing the through hole (2011), and the second portion (2013) comprises a second side surface (2015) facing the through hole (2011); The first side surface (2014) is provided with a sealing portion (2016), and the sealing portion (2016) extends along the first side surface (2014) toward the second side surface (2015); There is a gap between the sealing portion (2016) and the second side surface (2015), which is used to form a first channel for the flexible circuit board (150) to pass through; The second end (152) of the flexible circuit board (150) extends along the sealing portion (2016) and passes through the first channel to the second body (120).

11. The electronic device according to claim 10, characterized in that: The sealing portion (2016) is bonded to the flexible circuit board (150) via an adhesive layer (2017).

12. The electronic device according to claim 11, characterized in that: The bracket (204) comprises a first contact surface (20471) facing the sealing portion (2016), a second contact surface (20472) facing the second side surface (2015), and third contact surfaces (20473) located at both ends of the first contact surface (20471) along the routing direction; The middle frame (201) comprises two third side surfaces (2018) along the routing direction and used to connect the first side surface (2014) and the second side surface (2015); The first contact surface (20471) abuts against the area of ​​the flexible circuit board (150) for bonding with the sealing portion (2016), the second contact surface (20472) abuts against the second side surface (2015), and the third contact surface (20473) abuts against the third side surface (2018) to seal the through hole (2011).

13. The electronic device according to claim 12, characterized in that: The bracket (204) comprises a receiving opening (2048), wherein the receiving opening (2048) is continuously formed on the first contact surface (20471), the second contact surface (20472), and the third contact surface (20473); A sealing rib (20481) is filled in the accommodating opening (2048), and the sealing rib (20481) respectively abuts against the flexible circuit board (150), and the second side surface (2015) and the third side surface (2018) of the middle frame (201) to seal the through hole (2011).

14. The electronic device according to claim 9, characterized in that: The bracket (204) comprises a first fixing portion (20491) and a second fixing portion (20492); The first fixing portion (20491) and the second fixing portion (20492) are located at two ends of the bracket (204) along the routing direction; The first fixing portion (20491) and the second fixing portion (20492) are used to connect to the middle frame (201).

15. The electronic device according to claim 3, characterized in that: The first body (110) further includes: a second circuit board (206) and a radio frequency chip module (203); The radio frequency chip module (203) is arranged on the first circuit board (202) and connected to the first circuit board (202); The second circuit board (206) is arranged on a side of the first circuit board (202) away from the radio frequency chip module (203) along the axial direction of the rotating shaft (130).

16. The electronic device according to claim 15, characterized in that: The connecting line (205) is a radio frequency connecting line; One end of the radio frequency connection line is connected to the second circuit board (206), and the other end of the radio frequency connection line passes through the wire slot (2041) and extends to the first area (2021) of the first circuit board (202) to be connected to the first circuit board (202); The first area (2021) refers to an area of ​​the first circuit board (202) adjacent to the radio frequency chip module (203).

17. The electronic device according to claim 15, characterized in that: The connecting line (205) is a radio frequency connecting line; One end of the radio frequency connection line is connected to the second area (2022) of the first circuit board (202), and the other end of the radio frequency connection line passes through the wire slot (2041) and is connected to the first area (2021) of the first circuit board (202); The first area (2021) refers to an area of ​​the first circuit board (202) adjacent to the radio frequency chip module (203), and the second area (2022) refers to an area of ​​the first circuit board (202) away from the radio frequency chip module (203). area.

18. The electronic device according to claim 17, characterized in that: The side plate (2043) includes an opening (20434); The opening (20434) is in communication with the wire slot (2041), and the opening (20434) faces the second area (2022) of the first circuit board (202); The other end of the radio frequency connection line passes through the opening (20434) and the wire slot (2041) and is connected to the first area (2021) of the first circuit board (202).

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