Dimming panel and preparation method therefor, and dimming structure

Abstract

A preparation method for a dimming panel (100) comprises: preparing a dimming panel motherboard (1100); cutting the dimming panel motherboard (1100) to form an initial dimming panel (220), wherein the initial dimming panel (220) comprises a first transition board (221) and a second transition board (222), the orthographic projection of the second transition board (222) on a reference plane coincides with the orthographic projection of the first transition board (221) on the reference plane, at least part of a side wall of the first transition board (221) is flush with at least part of a side wall of a dye liquid crystal layer (113), and the reference plane is parallel to the surface of a first substrate motherboard (111) close to the dye liquid crystal layer (113); cutting the second transition board (222) along a first cutting line (X1) to form a second substrate (20), wherein the second substrate (20) exposes a first area (2) of the first transition board (221), the first area (2) forms a first binding area (102), and the dye liquid crystal layer (113) is located between the first transition board (221) and the second substrate (20); and forming a first edge-sealing adhesive (50) along the first cutting line (X1), wherein the first edge-sealing adhesive (50) comprises a first sub-portion (51) which is located between the first transition board (221) and the second substrate (20) and is disposed along an edge of the second substrate (20) close to the first binding area (102).

Description

Dimming panel, preparation method, and dimming structure

[0001] This application claims priority to Chinese patent application No. 202310696654.1, filed on June 12, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of dimming technology, and in particular to a dimming panel, a preparation method thereof, and a dimming structure. Background Art

[0003] Dimming panels have been widely used in residential buildings, rail transit vehicles, automobiles, and agricultural greenhouses due to their advantages in privacy protection, projection, environmental protection, and sound insulation.

[0004] Summary of the Invention

[0005] In one aspect, a method for preparing a dimming panel is provided. The method includes preparing a dimming panel motherboard, the dimming panel motherboard including a first substrate motherboard, a second substrate motherboard, a dye liquid crystal layer, multiple spacers, and a sealant; the first substrate motherboard and the second substrate motherboard are arranged opposite each other; the dye liquid crystal layer is located between the first and second substrate motherboards; multiple spacers are located between the first and second substrate motherboards; and the sealant is located between the first and second substrate motherboards and surrounds the dye liquid crystal layer. The dimming panel motherboard is cut to form an initial dimming panel. The initial dimming panel includes a first transition plate and a second transition plate. The orthographic projection of the second transition plate on a reference surface coincides with the orthographic projection of the first transition plate on the reference surface. At least a portion of the sidewalls of the first transition plate are flush with at least a portion of the sidewalls of the dye liquid crystal layer. The reference surface is parallel to the surface of the first substrate motherboard proximal to the liquid crystal layer. The second transition plate is cut along a first cutting line to form a second substrate. The second substrate exposes a first region of the first transition plate, which forms a first binding region. The dye liquid crystal layer is located between the first transition plate and the second substrate. A first edge sealant is formed along the first cutting line. The first edge sealant includes a first sub-portion, which is located between the first transition plate and the second substrate and disposed along an edge of the second substrate near the first binding region.

[0006] In some embodiments, the orthographic projection of the first cutting line on the reference surface is located in the orthographic projection of the frame sealing adhesive on the reference surface.

[0007] In some embodiments, a portion of the sealant located on a side of the first cutting line away from the dye liquid crystal layer is removed along the first cutting line, and a portion of the sealant located on a side of the first cutting line and the dye liquid crystal layer forms the first sub-portion.

[0008] In some embodiments, the orthographic projection of the first cutting line on the reference plane is located in the orthographic projection of the dye liquid crystal layer on the reference plane.

[0009] In some embodiments, glue is applied to form a first edge-sealing glue; the glue portion is located between the dye liquid crystal layer and the first cutting line to form a first sub-portion; the first edge-sealing glue also includes a second sub-portion, the glue portion is located in the first binding area, and extends along the side wall of the second substrate close to the first binding area to form a second sub-portion; wherein, the second sub-portion is connected to the first sub-portion.

[0010] In some embodiments, after forming the first edge sealing adhesive, the preparation method further includes binding a first circuit board to a first binding area of ​​the first transition plate; a gap is provided between the first circuit board and the first edge sealing adhesive.

[0011] In some embodiments, after binding the first circuit board, the preparation method further includes forming a first protective adhesive between the first circuit board and the first edge sealing adhesive, and bonding the first edge sealing adhesive to the first circuit board, the first protective adhesive also covering a second area, and the area of ​​the first binding area exposed by the first circuit board and the first edge sealing adhesive forms the second area.

[0012] In some embodiments, cutting the dimming panel motherboard to form the initial dimming panel includes: using a press to press the dimming panel motherboard; cutting the dimming panel motherboard along a second cutting line to form the initial dimming panel; the press is spaced apart from the second cutting line.

[0013] In some embodiments, during the process of cutting the second transition plate to form the second substrate, the second transition plate is cut along the outer edge of the press, and the second substrate further exposes a third region of the first transition plate, wherein the width of the third region is smaller than the width of the second region; the second substrate has a second sidewall, and the first transition plate has a first sidewall, the second sidewall is substantially parallel to the first sidewall, and an orthographic projection of the second sidewall on the first substrate is spaced apart from the first sidewall. During the process of forming the first edge-sealing adhesive, the preparation method further includes: applying glue to form the second edge-sealing adhesive, wherein the glue portion is located between the dye liquid crystal layer and the second sidewall to form a third sub-portion, the glue portion is located in the third region, and extends along the second sidewall to form a fourth sub-portion, wherein the fourth sub-portion is bonded to the second sidewall and connected to the third sub-portion, and in an orthographic projection onto the first transition plate, the fourth sub-portion covers the region between the first and second sidewalls.

[0014] In some embodiments, the second substrate has a fourth sidewall, and the first substrate has a third sidewall, the third sidewall being substantially parallel to the fourth sidewall, and the orthographic projection of the first sidewall on a reference surface coincides with the orthographic projection of the second sidewall on the reference surface. During the process of forming the first edge-sealing adhesive, the preparation method further includes: applying glue to form a third edge-sealing adhesive, wherein the glue portion is positioned between the dye liquid crystal layer and the third sidewall to form a fifth sub-portion, and the glue portion extends along the third and fourth sidewalls to form a sixth sub-portion, wherein the sixth sub-portion is bonded to the third and fourth sidewalls and connected to the fifth sub-portion.

[0015] In some embodiments, cutting the dimming panel motherboard to form the initial dimming panel includes: cutting the dimming panel motherboard to form the initial dimming panel includes: cutting the dimming panel motherboard along a third cutting line to form the first dimming panel; the first dimming panel has a panel area and a liquid leakage area, the liquid leakage area is located at least on one side of the panel area, and in the liquid leakage area, there is no dye liquid crystal layer and frame sealing glue between the first substrate and the second substrate. Cutting the first dimming panel along a fourth cutting line to form the initial dimming panel; the fourth cutting line is located in the panel area.

[0016] In some embodiments, the first substrate has a fifth sidewall, the second substrate has a sixth sidewall, the fifth sidewall is substantially parallel to the sixth sidewall, and in an orthographic projection onto the first substrate, the fifth sidewall, the sixth sidewall, and a portion of the sidewall of the dye liquid crystal layer are substantially flush. During the process of forming the first edge-sealing adhesive, the preparation method further includes applying glue to form a fourth edge-sealing adhesive, the glue extending along the fifth sidewall, the sixth sidewall, and the sidewall of the dye liquid crystal layer to form the fourth edge-sealing adhesive, and bonding to the fifth and sixth sidewalls.

[0017] In some embodiments, preparing a dimming panel motherboard includes forming an initial support layer on the first substrate motherboard, performing direct write exposure on the initial support layer using a digital mask, and developing, cleaning, and curing the initial support layer to form a plurality of spacers.

[0018] In another aspect, a dimming panel is provided. The dimming panel includes a first substrate, a second substrate, a dye liquid crystal layer, multiple spacers, and a first edge-sealing adhesive. The first and second substrates are disposed opposite each other; the first substrate has a first binding region. The orthographic projection of the second substrate on the first substrate does not overlap with the first binding region. The dye liquid crystal layer is located between the first and second substrates. The multiple spacers are located between the first and second substrates. The first edge-sealing adhesive includes a first sub-section, which is located between the first and second substrates and disposed along an edge of the second substrate near the first binding region.

[0019] The first edge sealing glue also includes a second sub-portion, the orthographic projection of the second sub-portion on the first substrate is located in the first binding area, the second sub-portion is arranged along the edge of the first binding area close to the second substrate, and is connected to the side wall of the first sub-portion close to the first binding area, and the side wall of the second substrate close to the first binding area.

[0020] In some embodiments, the first edge sealing glue further includes a second sub-portion, the orthographic projection of the second sub-portion on the first substrate is located in the first binding area, the second sub-portion is arranged along the edge of the first binding area close to the second substrate, and is connected to the side wall of the first sub-portion close to the first binding area, and the side wall of the second substrate close to the first binding area.

[0021] In some embodiments, the dimming panel further includes a first circuit board and a first protective adhesive. An orthographic projection of the first circuit board on the first substrate is located in the first binding area. At least a portion of the first protective adhesive is located between the first edge sealant and the first circuit board, and is bonded to the first edge sealant and the first circuit board.

[0022] In some embodiments, in an orthographic projection onto the first substrate, an area formed by the first edge sealing adhesive, the first protective adhesive, and the first circuit board covers the first binding area.

[0023] In some embodiments, the first substrate has a first side wall, the second substrate has a second side wall, the second side wall is substantially parallel to the first side wall, and the orthographic projection of the second side wall on the first substrate is spaced apart from the first side wall. The dimming panel further includes a second edge-sealing adhesive. The second edge-sealing adhesive includes a third sub-section and a fourth sub-section, the third sub-section being located between the first substrate and the second substrate and being arranged along the edge of the second substrate close to the second side wall. The fourth sub-section is arranged along the second side wall and is bonded to the second side wall and the side wall of the third sub-section close to the fourth sub-section. In the orthographic projection onto the first substrate, the fourth sub-section covers the area between the first side wall and the second side wall.

[0024] In some embodiments, the first substrate has a third sidewall, and the second substrate has a fourth sidewall. The third sidewall is substantially parallel to the fourth sidewall, and the orthographic projection of the third sidewall on a reference plane coincides with the orthographic projection of the fourth sidewall on the reference plane. The dimming panel further includes a third edge-sealing adhesive. The third edge-sealing adhesive includes a fifth sub-section, which is located between the first and second substrates and disposed along an edge of the first substrate proximate to the third sidewall.

[0025] In some embodiments, the third edge sealing adhesive further includes a sixth sub-portion, which is arranged along the third side wall and the fourth side wall and is bonded to the third side wall, the fourth side wall and the side wall of the fifth sub-portion close to the third side wall.

[0026] In some embodiments, the second substrate has a second binding area, and the orthographic projection of the first substrate on the second substrate does not overlap with the second binding area. The dimming panel also includes a fifth edge-sealing adhesive and a second circuit board. The fifth edge-sealing adhesive includes a seventh sub-section and an eighth sub-section. The seventh sub-section is located between the first substrate and the second substrate and is arranged along the edge of the first substrate close to the second binding area. The orthographic projection of the eighth sub-section on the second substrate is located in the second binding area. The eighth sub-section is arranged along the second binding area close to the edge of the second substrate and is bonded to the side wall of the seventh sub-section close to the second binding area, as well as the side wall of the second substrate close to the second binding area. The orthographic projection of the second circuit board on the second substrate is located in the second binding area.

[0027] In some embodiments, the dimming panel further includes a second protective adhesive, at least a portion of which is located between the third edge sealing adhesive and the second circuit board, and is bonded to the second edge sealing adhesive and the second circuit board.

[0028] In some embodiments, in an orthographic projection onto the second substrate, an area formed by the second edge sealing adhesive, the second protective adhesive, and the second circuit board covers the second binding area.

[0029] In some embodiments, the second substrate includes a second substrate and a second electrode layer. The second substrate is provided with a through hole. The second electrode layer is located on a side of the second substrate proximal to the dye liquid crystal layer, and covers the second substrate. The dimming panel also includes a second circuit board, located on a side of the second substrate distal to the first substrate, and at least partially electrically connected to the second electrode layer through the through hole.

[0030] In some embodiments, the spacer is provided on the first substrate, and an orthographic projection of the spacer on the plane where the second substrate is located is at least partially located outside the second substrate.

[0031] In some embodiments, at least one spacer is located in the first binding area.

[0032] In another aspect, a dimming structure is provided, comprising: a dimming panel as described in any of the above embodiments, wherein the dimming structure includes at least one of a curtain wall, a skylight, a rail vehicle, and a passenger car. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0034] 1A to 16B are diagrams showing steps of a method for preparing a dimming panel according to some embodiments;

[0035] FIG17 is a structural diagram showing a first circuit board and a second circuit board arranged on the same side according to some embodiments;

[0036] FIG18A is a cross-sectional view along section line II in FIG17;

[0037] FIG18B is another cross-sectional view along section line II in FIG17;

[0038] FIG18C is another cross-sectional view along section line II in FIG17;

[0039] FIG18D is another cross-sectional view along section line II in FIG17;

[0040] FIG18E is a cross-sectional view along section line II in FIG17;

[0041] FIG18F is another cross-sectional view along section line II in FIG17;

[0042] FIG18G is another cross-sectional view along section line II in FIG17;

[0043] FIG18H is another cross-sectional view along section line II in FIG17;

[0044] FIG19 is another cross-sectional view along section line JJ in FIG17;

[0045] FIG20 is a structural diagram of a first circuit board and a second circuit board arranged adjacent to each other according to some embodiments;

[0046] FIG21 is a structural diagram illustrating relative positions of a first circuit board and a second circuit board according to some embodiments;

[0047] FIG22 is a block diagram illustrating sizes of a first binding area and a second binding area according to some embodiments;

[0048] FIG23 is a structural diagram of a second substrate provided with through holes according to some embodiments;

[0049] FIG. 24 is a block diagram of a vehicle according to some embodiments. DETAILED DESCRIPTION

[0050] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0051] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0052] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0053] When describing some embodiments, the word "connected" and its derivatives may be used. The term "connected" should be understood broadly. For example, "connected" can mean fixed, removable, or integrated; it can be directly connected or indirectly connected through an intermediary. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0054] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0055] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0056] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0057] As used herein, “approximately” includes the stated value and an average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0058] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0059] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0060] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0061] The directional words such as "up", "down", "left" and "right" described in the embodiments of this document are described based on the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of this application.

[0062] In the related art, the manufacturing method of the dimming panel is as follows: a plurality of frame-sealing glues distributed in an array are formed on the first substrate motherboard; a plurality of dye liquid crystal layers corresponding to the plurality of frame-sealing glues are formed on the second substrate motherboard, and then the first substrate motherboard and the second substrate motherboard are assembled into a dimming panel motherboard, and finally the dimming panel motherboard is cut along the edge of each frame-sealing glue to obtain the dimming panel. In the process of preparing the dimming panel motherboard, the specifications of the dimming panel are varied, resulting in inconsistent shapes and circumferences of the frame-sealing glue. Therefore, in the process of preparing the dimming panel motherboard, it is necessary to frequently switch the parameters of the frame-sealing glue in the coating equipment, resulting in waste of the coating equipment's production capacity. When producing smaller-sized dimming panels, the total circumference of the frame-sealing glue on the dimming panel motherboard is longer, resulting in a longer time for the coating equipment to form the frame-sealing glue, which in turn causes the speed of the entire production line to decrease, resulting in lower production capacity of the production line. In addition, during the production of dimming panels, considering the product qualification rate, the actual number of products produced is greater than the required number. The excess dimming panels need to be put into the warehouse. Only when the dimming panels of the same specifications are produced again can the dimming panels in the warehouse be reused, which leads to a large amount of inventory in the warehouse and a long inventory cycle.

[0063] In order to solve the above problems, an embodiment of the present disclosure provides a method for preparing a dimming panel 100 , which includes steps S100 to S400 .

[0064] S100 , as shown in FIG1A , prepare a dimming panel motherboard 1100 .

[0065] Figure 1B is a cross-sectional view taken along section line AA in Figure 1A. As shown in Figure 1B, the dimming panel motherboard 1100 includes a first substrate motherboard 111, a second substrate motherboard 112, a dye liquid crystal layer 113, multiple spacers 114, and a sealant 115. As shown in Figure 1B, the first substrate motherboard 111 and the second substrate motherboard 112 are arranged opposite each other. The first substrate motherboard 111 includes a first substrate 11, a first electrode layer 12, and a first alignment layer 13. The first electrode layer 12 is located on the side of the first substrate 11 close to the second substrate motherboard 112, covering the first substrate 11. The first alignment layer 13 is located on one side of the first electrode layer. The second substrate motherboard 112 includes a second substrate 21, a second electrode layer 22, and a second alignment layer 23. The second electrode layer 22 is located on the side of the second substrate 21 close to the first substrate motherboard 111, covering the second substrate 21. The second alignment layer 23 is located on the side of the second electrode layer 23 away from the second substrate 21. The materials of the first substrate 11 and the second substrate 12 may include materials with high light transmittance (for example, light transmittance greater than 85%). The materials of the first substrate 11 and the second substrate 21 may include glass or plastic. The first substrate 11 and the second substrate 12 may include polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), tri-cellulose acetate (TAC), cellulose acetate propionate (CAP), polyphenylene sulfone resin (PPSU), cycloolefin polymer (Cycloolefin), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyimide (PI), polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), Polymer (abbreviated as COP) and polymethyl methacrylate (English: Polymethyl Methacrylate, abbreviated as PMMA) or one or more thereof. For example, the material of the first substrate 11 and the second substrate 21 is polyimide.The first electrode layer 12 and the second electrode layer 22 may be made of a conductive material with high light transmittance, such as indium tin oxide (ITO). For example, the first alignment layer 13 and the second alignment layer 23 may be made of polyimide.

[0066] As shown in Figure 1B, the dye liquid crystal layer 113 is located between the first substrate motherboard 111 and the second substrate motherboard 112. Specifically, the first electrode layer 12 is located on the side of the first substrate 11 near the dye liquid crystal layer 113, and the second electrode layer 22 is located on the side of the second substrate 21 near the dye liquid crystal layer 113. The dye liquid crystal layer 113 includes dye molecules and liquid crystal molecules. The first and second alignment layers 13 and 23 are used to align the liquid crystal molecules in a specific direction and angle. In other words, the first and second alignment layers 13 and 23 can align the liquid crystal molecules at a predetermined pretilt angle. The amount of light absorbed by the dye molecules varies depending on the angle between the long axis of the dye molecules and the first substrate 11. Changing the voltage between the first and second electrode layers 12 and 22 can change the angle between the long axis of the liquid crystal molecules and the first substrate 11, thereby changing the amount of light absorbed by the dye molecules. This, in turn, can adjust the light transmittance of the dye liquid crystal layer 113 and, consequently, the light transmittance of the dimming panel 100.

[0067] As shown in FIG1B , a plurality of spacers 114 are distributed in an array. The spacing between two adjacent spacers 114 ranges from 0.2 mm to 1 mm. For example, the spacing between two adjacent spacers 114 is 0.2 mm, 0.5 mm or 1 mm, which are not listed one by one in the embodiments of the present disclosure. The height of the spacer 114 ranges from 5 μm to 30 μm. For example, the height of the spacer 114 is 5 μm, 8 μm, 12 μm, 15 μm, 18 μm, 20 μm, 25 μm or 30 μm, which are not listed one by one in the embodiments of the present disclosure. For example, the shape of the spacer 114 is a truncated cone, that is, the shape of the longitudinal cross-section of the spacer 114 is a trapezoid, and the diameter of the spacer 114 ranges from 5 μm to 25 μm. For example, the diameter of the spacer 114 is 5 μm, 15 μm or 25 μm, which are not listed one by one in the embodiments of the present disclosure.

[0068] As shown in FIG1B , a sealant 115 is located between the first substrate motherboard 111 and the second substrate motherboard 112 and surrounds the dye liquid crystal layer 113. The sealant 115 can be made of a sealant. In the embodiment of the present application, the dimming panel motherboard 1100 is provided with the sealant 115 only at the edges and not within the interior of the dimming panel motherboard 1100.

[0069] In some embodiments, S100 includes S110 to S140 .

[0070] S110 , as shown in FIG. 2A , forming an initial support layer 401 on the first substrate motherboard 111 .

[0071] For example, the support material can be applied to the first substrate motherboard 111 using a roll-to-roll slit coating method or a micro-dimpled coating method. The thickness of the coated material is 30 μm to 100 μm. The coated material is pre-cured to form the initial support layer 401. The pre-curing heating temperature is 90° C. to 120° C., and the heating time is 80 seconds to 150 seconds. The thickness of the initial support layer 401 after pre-curing is 5 μm to 30 μm.

[0072] S120 , as shown in FIG2A , performing direct-write exposure on the initial support layer 401 using a digital mask.

[0073] Laser may be used to perform direct writing exposure on the initial support layer 401 .

[0074] S130 , as shown in FIG. 2B , developing, cleaning, and curing the initial support layer 401 to form a plurality of spacers 114 .

[0075] For example, the development time is 120s to 300s. The height, spacing and diameter of the spacers 114 are as described above and will not be repeated here.

[0076] S140 , as shown in FIG1B , align the first substrate motherboard 111 and the second substrate motherboard 112 to form a dimming panel motherboard 1100 .

[0077] In the embodiment of the present disclosure, a laser and a digital mask are used to expose the initial support layer 401. The laser has good straightness, ensuring that the exposure amount of the initial support layer 401 is approximately the same along a direction perpendicular to the first substrate motherboard 111. The angle between the sidewall of the spacer 141 and the first substrate motherboard 111 is greater than 80°, and / or the diameter of the end of the spacer 141 away from the first substrate motherboard 111 is greater than the product of the diameter of the end of the spacer 141 close to the first substrate motherboard 111 and 0.9. In this way, along a direction perpendicular to the first substrate motherboard 111 and pointing from the first substrate motherboard 111 to the second substrate motherboard 112, the cross-sectional area of ​​the spacer 114 parallel to the first substrate motherboard 111 has a small difference. This reduces the contact stress and maximum shear stress between the second substrate motherboard 112 and the spacer 114, thereby reducing the risk of cracks in the second substrate motherboard 112 and shortening the life of the second substrate motherboard 112. The laser has good straightness and can be directly used in a digital mask plate without complicated processing, thereby reducing the preparation cost of the dimming panel motherboard 1100.

[0078] S200 , cutting the dimming panel motherboard 1100 to form an initial dimming panel 220 .

[0079] Since the dye liquid crystal has fluidity, in order to reduce the loss of the dye liquid crystal, the following method can be used to prepare the initial dimming panel 220.

[0080] In some embodiments, S200 includes S210 and S220.

[0081] S210 , as shown in FIG. 3A and FIG. 3B , use a pressing tool 1 to press the dimming panel motherboard 1100 .

[0082] As shown in FIG. 3B , a press 1 is placed on the dimming panel motherboard 1100 , and a force is applied to the press 1 so that the first substrate motherboard 111 and the second substrate motherboard 112 are in contact at the press 1 .

[0083] S220 , as shown in FIG. 4A and FIG. 4B , cutting the dimming panel motherboard 1100 along the second cutting line X2 to form an initial dimming panel 220 .

[0084] FIG4B is a cross-sectional view taken along section line CC in FIG4A . As shown in FIG4B , the initial dimming panel 220 includes a first transition plate 221 and a second transition plate 222. The orthographic projection of the second transition plate 222 on the reference plane coincides with the orthographic projection of the first transition plate 221 on the reference plane. At least a portion of the sidewall of the first transition plate 221 is flush with at least a portion of the sidewall of the dye liquid crystal layer 113. The initial dimming panel 220 can be shaped like a circle, triangle, rectangle, or an irregular shape. The reference plane is parallel to the plane of the first transition plate 221 that is closest to the dye liquid crystal layer 113.

[0085] The first transition plate 221 and the second transition plate 222 contact at the press 1, thereby isolating the dye liquid crystal layer 113 in the contact position of the first transition plate 221 and the second transition plate 222 from the atmosphere, thereby reducing the risk of air intruding into the dye liquid crystal layer 113 and maintaining the vacuum state of the dye liquid crystal layer 113.

[0086] In some other embodiments, S200 includes S230 and S240.

[0087] S230 , as shown in FIG5A , cutting the dimming panel motherboard 1100 along a third cutting line X3 to form a first dimming panel 330 .

[0088] As shown in Figure 5B , the first dimming panel 330 has a panel area 331 and a leakage area 332. In the leakage area 332, there is no dye liquid crystal layer 113 or sealant 115 between the first substrate motherboard 111 and the second substrate motherboard 112. As shown in Figure 5A , the leakage area 332 surrounds the panel area 331 and extends along the third cutting line X3. The dye liquid crystal layer 113 of the first dimming panel 330 is exposed to air, which can intrude into the dye liquid crystal layer 113. The dye liquid crystal is fluid, causing the dye liquid crystal to leak from the edges of the first dimming panel 330. Due to the viscosity of the dye liquid crystal, after a certain amount of dye liquid crystal has been lost, the air pressure in the dye liquid crystal layer 113 equals the air pressure, and the dye liquid crystal no longer leaks. The area where the dye liquid crystal has leaked is the leakage area 332, and the remaining area is the panel area 331.

[0089] S240 , as shown in FIG5A , cutting the first dimming panel 330 along a fourth cutting line X4 to form an initial dimming panel 220 .

[0090] As shown in FIG5C , the initial dimming panel 220 includes a first transition plate 221 and a second transition plate 222. The orthographic projection of the second transition plate 222 on the reference plane coincides with the orthographic projection of the first transition plate 221 on the reference plane. At least a portion of the sidewalls of the first transition plate 221 are flush with at least a portion of the sidewalls of the dye liquid crystal layer 113. As shown in FIG6A , the fourth cutting line X4 is located in the panel area 331. In S230 , the air pressure of the dye liquid crystal layer 113 is equal to the air pressure of the air. In other words, the air pressure of the dye liquid crystal layer 113 and the air pressure of the air have reached equilibrium. Therefore, during the process of cutting the first dimming panel 330 along the fourth cutting line X4 to form the initial dimming panel 220, the dye liquid crystal layer 113 will no longer leak.

[0091] S300 , as shown in FIG. 6A , FIG. 6B , FIG. 7A and FIG. 7B , cutting the second transition plate 222 along a first cutting line X1 to form a second substrate 20 .

[0092] The second substrate 20 exposes the first region 2 of the first transition plate 221, which forms the first binding region 102. The remaining region of the first transition plate 221 forms the first main body region 101, with the first binding region 102 located on one side of the first main body region 101. For example, as shown in FIG6A , the first binding region 102 is located on the lower side of the first main body region 101, or as shown in FIG7A , the first binding region 102 is located on the upper side of the first main body region 101.

[0093] Furthermore, the size and shape of the first binding region 102 can be adjusted based on practical needs. For example, as shown in FIG8A , the first binding region 102 is rectangular, and the dimension of the first binding region 102 along the width of the first transition plate 221 is equal to the width of the first transition plate 221. For another example, as shown in FIG8B , the dimension of the first binding region 102 along the width of the first transition plate 221 is smaller than the width of the first transition plate 221. The dye liquid crystal layer 113 is located between the first transition plate 221 and the second substrate 20.

[0094] In some embodiments, as shown in Figures 7A and 7B , the orthographic projection of the first cutting line X1 on the reference surface is located within the orthographic projection of the frame sealant 115 on the reference surface. A portion of the second transition plate 222 located on the side of the first cutting line X1 away from the dye liquid crystal layer 113 is removed along the first cutting line X1 to form the second substrate 20. During the formation of the second substrate 20, no portion of the dye liquid crystal layer 113 is removed, maximizing the area of ​​the dye liquid crystal layer 113 and thereby increasing the dimming region of the resulting dimming panel 100. The dimming region refers to the region of the dimming panel 100 where light transmittance can be adjusted.

[0095] In other embodiments, as shown in FIG9 , the orthographic projection of the first cutting line X1 on the reference plane is located in the orthographic projection of the dye liquid crystal layer 113 on the reference plane, and the portion of the second transition plate 222 in contact with the dye liquid crystal layer 113 is removed along the first cutting line X1 to form the second substrate 20 .

[0096] In some embodiments, as shown in FIG. 1A , the dimming panel motherboard 1100 can be cut along different cutting lines X according to actual needs. FIG. 1A shows a structural diagram of the shape of the cutting line X.

[0097] In some embodiments, the cutting line X includes a, and the cutting line a intersects two opposite side edges. That is, three sides of the initial dimming panel 220 obtained along the cutting line a include the frame sealant 115 .

[0098] In other embodiments, the cutting line X is located at the corner of the dimming panel motherboard 1100, that is, the cutting line X includes b, and the cutting line b intersects with two adjacent side edges, that is, the adjacent two sides of the initial dimming panel 220 obtained along this cutting line X both include frame sealing glue.

[0099] In some other embodiments, the cutting line X is located at the edge of the dimming panel motherboard 1100 and does not pass through the corner of the dimming panel motherboard 1100. The cutting line X includes c, and the cutting line c intersects with a side edge, that is, one side of the initial dimming panel 220 obtained along this cutting line c includes frame sealing glue.

[0100] In some other embodiments, the cutting line X is located inside the dimming panel motherboard 1100, and the cutting line X includes d. The cutting line d does not intersect the side edge, that is, the initial dimming panel 220 obtained along the cutting line d does not include a frame sealant. The shape enclosed by the cutting line X is a circle, a rectangle, a diamond, a pentagon, or a cross, and the embodiments of the present disclosure are listed one by one.

[0101] When cutting the dimming panel motherboard 1100, the shapes of the four cutting lines X can be reasonably combined to maximize the utilization of the dimming panel motherboard 1100. The embodiment of the present disclosure is described by taking the cutting line X as c.

[0102] Different cutting tools can be used to cut the dimming panel motherboard 1100 depending on the material of the first substrate 11. When the first substrate 11 and the second substrate 21 are made of rigid materials, a cutting wheel can be used to cut the dimming panel motherboard 1100. When the first substrate 11 and the second substrate 21 are made of flexible materials, a laser or a mold cutter head can be used to cut the dimming panel motherboard 1100.

[0103] In some implementations, as shown in FIG10A and FIG10B , when the preparation method includes a press 1, during S300 of cutting the second transition plate 222 to form the second substrate 20, the second transition plate 222 is also cut along the outer edge of the press 1, exposing the third region 4 of the second transition plate 222 on the second substrate 20. The width of the third region 4 is smaller than the width of the first region 2. The second substrate 20 has a second sidewall 203, and the first transition plate 221 has a first sidewall 103. The second sidewall 203 is substantially parallel to the first sidewall 103, and the orthographic projection of the second sidewall 203 on the first substrate 10 is spaced apart from the first sidewall 103.

[0104] In other embodiments, as shown in Figures 11A and 11B, when the preparation method includes the press 1, in the process of cutting the second transition plate 222 to form the second substrate 20 at S300, the first transition plate 221 has a third side wall 104, the second substrate 20 has a fourth side wall 204, the third side wall 104 is substantially parallel to the fourth side wall 204, and the orthographic projection of the third side wall 104 on the reference plane coincides with the orthographic projection of the fourth side wall 204 on the reference plane.

[0105] In some other embodiments, as shown in Figures 6A and 6B, in the process of cutting the second transition plate 222 to form the second substrate 20 in S300, the first transition plate 221 has a fifth side wall 105, the second substrate 20 has a sixth side wall 205, the fifth side wall 105 is substantially parallel to the sixth side wall 205, and in the orthographic projection onto the reference plane, the fifth side wall 105, the sixth side wall 205, and the orthographic projection of the dye liquid crystal layer 113 on the reference plane coincide with each other.

[0106] S400 , as shown in FIG. 6A , FIG. 6B and FIG. 9 , forming a first edge sealing adhesive 50 along the first cutting line X1 .

[0107] In some embodiments, as shown in FIG. 6A and FIG. 6B , the first edge sealant 50 includes a first sub-portion 51 . The first sub-portion 51 is located between the first transition plate 221 and the second substrate 20 and is disposed along an edge of the second substrate 20 near the first binding region 102 .

[0108] When the orthographic projection of the first cutting line X1 on the reference surface is located within the orthographic projection of the frame sealant 115 on the reference surface, in the process of cutting the second transition plate 222 along the first cutting line X1 to form the second substrate 20 in S300, the portion of the frame sealant 115 located on the side of the first cutting line X1 away from the dye liquid crystal layer 113 is removed along the first cutting line X1. The portion of the frame sealant 115 located between the first cutting line X1 and the dye liquid crystal layer 113 forms the first sub-portion 51. The formation of the first edge sealant 50 utilizes the frame sealant 115 of the dimming panel motherboard 1100, eliminating the need to apply additional glue to form the first edge sealant 50. This can reduce the manufacturing cost of the dimming panel 100.

[0109] In other embodiments, as shown in FIG9 , the first edge-sealing adhesive 50 includes a first sub-portion 51 and a second sub-portion 52. The first sub-portion 51 is located between the first transition plate 221 and the second substrate 20 and is disposed along the edge of the second substrate 20 near the first binding region 102. The second sub-portion 52 is disposed along the edge of the first binding region 102 near the second substrate 20. The second sub-portion 52 is also bonded to the side wall of the second substrate 20 near the first binding region 102. The second sub-portion 52 wraps around the side wall of the second substrate 20 near the first binding region 102, that is, the second sub-portion 52 isolates the side wall of the second substrate 20 near the first binding region 102 from the air, thereby reducing the risk of moisture intruding into the dimming panel 100 from the side wall of the second substrate 20 near the first binding region 102, reducing the risk of material aging of the dimming panel 100, and thereby increasing the service life.

[0110] When the orthographic projection of the first cutting line X1 on the reference plane is located within the orthographic projection of the dye liquid crystal layer 113 on the reference plane, glue is applied to the first binding area 102. The portion of the glue between the dye liquid crystal layer 113 and the first cutting line X1 forms a first sub-portion 51. The first edge-sealing adhesive 50 also includes a second sub-portion 52. The portion of the glue located in the first binding area 102 and extending along the sidewall of the second substrate 20 near the first binding area 102 forms the second sub-portion 52.

[0111] The material of the first edge sealant 50 can be the same as that of the frame sealant 115, for example, the first edge sealant 50 and the frame sealant 115 can include sealant. Alternatively, the material of the first edge sealant 50 can be different from that of the frame sealant, for example, the frame sealant 115 can be sealant and the material of the first edge sealant 50 can be UV adhesive.

[0112] In some embodiments, as shown in Figure 12, when the second substrate 20 has a second side wall 203 and the first transition plate 221 has a first side wall 103, a second edge sealing glue 80 is also formed during the process of forming the first edge sealing glue 50. The second edge sealing glue 80 includes a third sub-portion 81 and a fourth sub-portion 82. The third sub-portion 81 is located between the first substrate 10 and the second substrate 20 and is arranged along the edge of the second substrate 20 close to the second side wall 203. The third sub-portion 81 is used to separate the dye liquid crystal and the air.

[0113] The fourth sub-section 82 is disposed along the second side wall 203 and bonded to the second side wall 203. Thus, the fourth sub-section 82 encases the second side wall 203. Specifically, the second sub-section 52 isolates the second side wall 203 from the air, thereby reducing the risk of moisture intruding into the dimming panel 100 through the second side wall 203 and the risk of material degradation of the dimming panel 100. The fourth sub-section 82 is connected to the side wall of the third sub-section 81 near the fourth sub-section 82.

[0114] The fourth sub-portion 82 also covers the third area 4. In this way, the fourth sub-portion 82 isolates the first transition plate 221 located in the third area 4 from the air, thereby reducing the risk of water vapor corroding the first transition plate 221.

[0115] For example, the second edge-sealing adhesive 80 can be formed using the following method. A dust-free cloth or plasma is used to remove the dye liquid crystal from the third region 4. Glue is then applied to the third region 4. The glue is located between the dye liquid crystal layer 113 and the second sidewall 203, forming a third sub-portion 81. The glue is located in the third region 4 and extends along the second sidewall 203, forming a fourth sub-portion 82. The third region 4 only has the first transition plate 221, i.e., there is no second substrate 20 above the first transition plate 221, which makes cleaning the dye liquid crystal and applying the glue easier.

[0116] In other embodiments, as shown in FIG. 13 , when the first transition plate 221 has the third side wall 104 and the second substrate 20 has the fourth side wall 204 , a third edge sealing adhesive 90 is also formed during the process of forming the first edge sealing adhesive 50 .

[0117] The third edge-sealing adhesive 90 includes a fifth sub-section 91 and a sixth sub-section 92. The fifth sub-section 91 is located between the first substrate 10 and the second substrate 20 and is positioned along the edge of the first substrate 10 near the third sidewall 104. The fifth sub-section 91 is used to separate the dye liquid crystal from air. The sixth sub-section 92 is positioned along and bonded to the third sidewall 104. The sixth sub-section 92 wraps around the third sidewall 104, isolating it from air and reducing the risk of material degradation within the dimming panel 100. The sixth sub-section 92 is positioned along and bonded to the fourth sidewall 204. The sixth sub-section 92 wraps around the fourth sidewall 204, isolating it from air and reducing the risk of material degradation within the dimming panel 100. The sixth sub-section 92 is also connected to the sidewall of the fifth sub-section 91 near the third sidewall 104.

[0118] For example, as shown in FIG13 , the third edge-sealing adhesive 90 can be formed in the following manner. First, a force is applied to the portion of the second substrate 20 located between the press 1 and the second substrate 20, causing the portion of the second substrate 20 located between the press 1 and the second substrate 20 to bend away from the first transition plate 221, thereby creating a larger clean space. Next, the dye liquid crystal between the press 1 and the first transition plate 221 is cleaned using a dust-free cloth or plasma. Then, glue is applied to the cleaned dye liquid crystal area. Finally, a force is applied to the portion of the second substrate 20 located between the press 1 and the second substrate 20, causing the portion of the second substrate 20 located between the press 1 and the second substrate 20 to bend toward the first substrate 10, thereby squeezing the glue between the first transition plate 221 and the second substrate 20, thereby forming the third edge-sealing adhesive 90. The glue portion is located between the dye liquid crystal layer 113 and the third sidewall 104, forming a fifth subsection 91. The glue portion extends along the third sidewall 104 and the fourth sidewall 204, forming a sixth subsection 92.

[0119] Alternatively, the third edge-sealing adhesive 90 only includes the fifth sub-portion 91. The fifth sub-portion 91 is located between the first substrate 10 and the second substrate 20 and is disposed along the edge of the first substrate 10 near the third sidewall 104. The fifth sub-portion 91 is used to separate the dye liquid crystal from air.

[0120] In some other embodiments, as shown in Figure 14, when the first transition plate 221 has a fifth side wall 105 and the second substrate 20 has a sixth side wall 205, a fourth edge sealing glue 110 is also formed during the process of forming the first edge sealing glue 50. The fourth edge sealing glue 110 is arranged along the fifth side wall 105, the sixth side wall 205 and along the edge of the first substrate 10 close to the fifth side wall 105.

[0121] The fourth edge-sealing adhesive 110 is bonded to the fifth side wall 105 and wraps around the fifth side wall 105. This means that the fourth edge-sealing adhesive 110 isolates the fifth side wall 105 from the air, thereby reducing the risk of moisture intruding into the dimming panel 100 through the fifth side wall 105 and the risk of material degradation of the dimming panel 100. The fourth edge-sealing adhesive 110 is bonded to the sixth side wall 205 and wraps around the sixth side wall 205. This means that the fourth edge-sealing adhesive 110 isolates the sixth side wall 205 from the air, thereby reducing the risk of moisture intruding into the dimming panel 100 through the sixth side wall 205 and the risk of material degradation of the dimming panel 100.

[0122] Illustratively, the fourth edge-sealing adhesive 110 can be formed in the following manner. For example, the fifth sidewall 105 and the sixth sidewall 205 can be placed below the liquid surface of the glue. Under the action of the surface tension of the glue, the glue will wrap around the fifth sidewall 105, the sixth sidewall 205, and part of the sidewall of the dye liquid crystal layer 113, forming the fourth edge-sealing adhesive 110. For another example, the fourth edge-sealing adhesive 110 can be formed by applying glue to the edges of the fifth sidewall 105, the sixth sidewall 205, and the dye liquid crystal layer 113 near the fifth sidewall 105.

[0123] The size and shape of the sealant 115 in the dimming panel motherboard 1100 provided in the embodiments of the present disclosure are consistent. During the process of forming the sealant 115, the coating equipment forms the sealant 115 at a consistent time, eliminating the need to frequently switch the sealant parameters in the coating equipment and reduce the speed of the production line. When reproducing any specification of dimming panel 100, the dimming panel motherboards 1100 in the warehouse can be reused, reducing warehouse inventory and, in other words, shortening inventory cycles.

[0124] In some embodiments, after forming the first edge sealing adhesive 50 along the first cutting line X1 in S400 , the preparation method further includes S500 and S600 .

[0125] S500 , as shown in FIG. 15 , the first circuit board 60 is bound to the first binding area 102 of the first transition plate 221 .

[0126] There is a gap between the first circuit board 60 and the first edge sealing adhesive 50. Exemplarily, the first circuit board 60 and the first transition plate 221 are bonded together using an anisotropic conductive adhesive.

[0127] S600 , forming a first protective adhesive 70 between the first circuit board 60 and the first edge sealing adhesive 50 .

[0128] As shown in Figure 16A, when the first edge sealant 50 includes a first sub-section 51 and a second sub-section 52, the first protective adhesive 70 is bonded to the first edge sealant 50 and the first circuit board 60. The first protective adhesive 70 can enhance the securement between the first circuit board 60 and the first electrode layer 12. The first protective adhesive 70 also covers a second region, which is formed by the first circuit board 60 and the exposed first bonding area 102 of the first edge sealant 50. That is, in an orthographic projection onto the first substrate 10, the region formed by the first edge sealant 50, the first protective adhesive 70, and the first circuit board 60 covers the first bonding area 102. In this way, the first edge sealant 50, the first protective adhesive 70, and the first circuit board 60 work together to isolate the first transition plate 221 in the first bonding area 102 from the air, reducing the risk of oxidation of the first transition plate 221 in the first bonding area 102. The material of the first protective adhesive 70 includes UV adhesive.

[0129] As shown in Figure 16B, when the first edge sealing glue 50 only includes the first sub-portion 51, the difference from the above is that the first protective glue 70 is bonded to the side wall of the second substrate 20 close to the first binding area 102. In this way, the first protective glue 70 wraps the side wall of the second substrate 20 close to the first binding area 102, that is, the first protective glue 70 separates the side wall of the second substrate 20 close to the first binding area 102 from the air, reducing the risk of water vapor invading the dimming panel 100 from the side wall of the second substrate 20 close to the first binding area 102, and reducing the risk of material aging of the dimming panel 100.

[0130] The embodiments of the present disclosure further provide a dimming panel 100, which includes a polymer dispersed liquid crystal (PDLC) dimming panel 100, an electrochromic (EC) dimming panel 100, a dye liquid crystal dimming panel 100, or a suspended particle device (SPD) dimming panel 100. The embodiments of the present disclosure illustrate the dimming panel 100 as a dye liquid crystal dimming panel 100.

[0131] In some embodiments, as shown in FIG. 17 and FIG. 18A to FIG. 18H , the dimming panel 100 includes a first substrate 10 , a second substrate 20 , a dye liquid crystal layer 30 , a plurality of spacers 40 and a first edge-sealing adhesive 50 .

[0132] As shown in Figures 18A to 18H, a first substrate 10 and a second substrate 20 are disposed opposite each other. The first substrate 10 includes a first substrate 11 and a first electrode layer 12. The material of the first substrate 11 may include a material with high light transmittance (e.g., a light transmittance greater than 85%). The materials of the first substrate 11 and the second substrate 21 may include glass or plastic. The first substrate 11 and the second substrate 12 may include polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), tri-cellulose acetate (TAC), cellulose acetate propionate (CAP), polyphenylene sulfone resin (PPSU), cycloolefin polymer (Cycloolefin), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyimide (PI), polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), polyvinyl alcohol (PVA), Polymer (abbreviated as COP) and polymethyl methacrylate (English: Polymethyl Methacrylate, abbreviated as PMMA) or one or more thereof. For example, the material of the first substrate 11 and the second substrate 21 is polyimide.

[0133] The first electrode layer 12 is located on a side of the first substrate 11 close to the second base plate 20 . The first electrode layer 12 covers the first substrate 11 . The material of the first electrode layer 12 includes a conductive material with high light transmittance. For example, the material of the first electrode layer 12 includes indium tin oxide (ITO).

[0134] The first substrate 10 has a first main body area 101 and a first binding area 102. The first binding area 102 is located on one side of the first main body area 101. The orthographic projection of the second substrate 20 on the first substrate 10 is located in the first main body area 101 and does not overlap with the first binding area 102. The sizes and shapes of the first main body area 101 and the first binding area 102 are as described above.

[0135] The shape of the first substrate 10 may be circular, triangular, rectangular or irregular. The embodiments of the present disclosure are not listed one by one. The implementation of the present disclosure is illustrated by taking the shape of the first substrate 10 as a rectangle.

[0136] As shown in Figures 18A to 18H, the second substrate 20 includes a second substrate 21 and a second electrode layer 22. The material of the second substrate 21 can be the same as that of the first substrate 11. For example, the materials of the first substrate 11 and the second substrate 21 both include glass. This can improve the identity of the materials in the dimming panel 100 and reduce the preparation cost of the dimming panel 100.

[0137] The second electrode layer 22 is located on a side of the second substrate 21 close to the first substrate 10 and covers the second substrate 21. The material of the second electrode layer 22 can be the same as that of the first electrode layer 12. For example, both the first electrode layer 12 and the second electrode layer 22 include ITO.

[0138] The dye liquid crystal layer 30 is located between the first substrate 10 and the second substrate 20 . That is, the first electrode layer 12 is located on the side of the first substrate 11 close to the dye liquid crystal layer 30 , and the second electrode layer 22 is located on the side of the second substrate 21 close to the dye liquid crystal layer 30 .

[0139] As shown in Figures 18A to 18H , a plurality of spacers 40 are located between the first substrate 10 and the second substrate 20 and are provided on the first substrate 10. The plurality of spacers 40 are used to support the first substrate 10 and the second substrate 20 to reduce the risk of uneven spacing between the first substrate 10 and the second substrate 20. When the first substrate 10 includes the first electrode layer 12, the plurality of spacers 40 are provided on the first electrode layer 12.

[0140] In some embodiments, as shown in Figures 18A to 18H, a plurality of spacers 40 are arranged in an array. The height, spacing, and shape of the spacers 40 are as described above and will not be repeated here. For example, the spacers 40 are in the shape of a truncated cone.

[0141] Figures 18A to 18D illustrate the structure of the first edge-sealing adhesive 50, including a first sub-section 51. As shown in Figures 18A to 18D, the first edge-sealing adhesive 50 includes the first sub-section 51, which is located between the first substrate 10 and the second substrate 20 and along the edge of the second substrate 20 near the first binding region 102. The first sub-section 51 is used to separate the dye liquid crystal from air. It also reduces the risk of moisture in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0142] Figures 18E to 18H illustrate the structure of the first edge-sealing adhesive 50, which includes a first sub-section 51 and a second sub-section 52. In other embodiments, as shown in Figures 18E to 18H, the first edge-sealing adhesive 50 includes a first sub-section 51 and a second sub-section 52. The first sub-section 51 is located between the first substrate 10 and the second substrate 20, and is disposed along the edge of the second substrate 20 near the first binding region 102. The first sub-section 51 is used to separate the dye liquid crystal from air. It also reduces the risk of moisture in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0143] The orthographic projection of the second sub-portion 52 on the first substrate 10 is located in the first binding region 102. The second sub-portion 52 is disposed along the edge of the first binding region 102 near the second substrate 20. The second sub-portion 52 is connected to the sidewall of the first sub-portion 51 near the first binding region 102. This allows the first edge-sealing adhesive 50 to have a larger dimension along the first direction Y1, further improving the problem of moisture in the air entering the dye liquid crystal layer 30 and causing failure of the dimming panel 100. The second sub-portion 52 is also bonded to the sidewall of the second substrate 20 near the first binding region 102. Thus, the second sub-portion 52 encases the sidewall of the second substrate 20 near the first binding region 102, isolating it from the air. This reduces the risk of moisture intruding into the dimming panel 100 from the sidewall of the second substrate 20 near the first binding region 102, reduces the risk of material degradation within the dimming panel 100, and thereby increases the service life of the dimming panel 100. The first direction Y1 is parallel to the first substrate 10 and perpendicular to the first edge sealing adhesive 50 .

[0144] In some embodiments, as shown in Figures 18A to 18H , the dimming panel 100 further includes a first circuit board 60. The first circuit board 60 is located on a side of the first substrate 10 close to the second substrate 20, and the orthographic projection of the first circuit board 60 on the first substrate 10 is located in the first binding area 102, so that the first circuit board 60 and the first electrode layer 12 can be electrically connected.

[0145] In some embodiments, as shown in Figures 18A to 18H, the dimming panel 100 also includes a first anisotropic conductive adhesive 5 (English: Anisotropic Conductive Film, abbreviated as: ACF), which is located between the first circuit board 60 and the first electrode layer 12. The first anisotropic conductive adhesive 5 is used to bond the first circuit board 60 and the first electrode layer 12.

[0146] In some embodiments, as shown in Figures 18A to 18H , the dimming panel 100 further includes a first protective adhesive 70. At least a portion of the first protective adhesive 70 is located between the first edge-sealing adhesive 50 and the first circuit board 60 and is bonded to the first edge-sealing adhesive 50 and the first circuit board 60. The first protective adhesive 70 can enhance the securement between the first circuit board 60 and the first electrode layer 12. Furthermore, the first protective adhesive 70 isolates a portion of the first electrode layer 12 from air, thereby reducing the risk of oxidation of the first electrode layer 12 and thereby increasing the service life of the first electrode layer 12. Exemplarily, the material of the first protective adhesive 70 includes UV adhesive.

[0147] Figures 18A to 18H illustrate the structure of the area formed by the first edge sealant 50, the first protective sealant 70, and the first circuit board 60, covering the first binding area 102. In some embodiments, as shown in Figures 18A to 18H, in an orthographic projection onto the first substrate 10, the area formed by the first edge sealant 50, the first protective sealant 70, and the first circuit board 60 covers the first binding area 102. Thus, the first edge sealant 50, the first protective sealant 70, and the first circuit board 60 work together to isolate the first electrode layer 12 in the first binding area 102 from the air, thereby reducing the risk of oxidation of the first electrode layer 12 in the first binding area 102.

[0148] As shown in Figures 18A to 18D , when the first edge-sealing adhesive 50 includes only the first sub-portion 51 , the first protective adhesive 70 is also bonded to the side wall of the second substrate 20 near the first binding area 102 . Thus, the first protective adhesive 70 wraps around the side wall of the second substrate 20 near the first binding area 102 , that is, the first protective adhesive 70 isolates the side wall of the second substrate 20 near the first binding area 102 from the air. This can improve the problem of moisture in the air entering the dimming panel 100 through the side wall of the second substrate 20 near the first binding area 102 and causing aging of the materials in the dimming panel 100 , thereby reducing the risk of failure of the dimming panel 100 due to aging of the materials in the dimming panel 100 . This can further increase the service life of the dimming panel 100 .

[0149] Figure 18A illustrates a structure in which a first substrate 10 has a first sidewall 103 and a second substrate 20 has a second sidewall 203. In some embodiments, as shown in Figure 18A , the first substrate 10 has the first sidewall 103, and the second substrate 20 has the second sidewall 203. The second sidewall 203 is substantially parallel to the first sidewall 103, and the orthographic projection of the second sidewall 203 on the first substrate 10 is spaced apart from the first sidewall 103. The dimming panel 100 also includes a second edge-sealing adhesive 80, which includes a third sub-portion 81 and a fourth sub-portion 82. The third sub-portion 81 is positioned between the first substrate 10 and the second substrate 20 and is disposed along the edge of the second substrate 20 near the second sidewall 203. The third sub-portion 81 is used to separate the dye liquid crystal from air. It also reduces the risk of moisture in the air entering the dye liquid crystal layer 30 and causing failure of the dimming panel 100.

[0150] As shown in Figure 18A, the fourth sub-section 82 is disposed along the second sidewall 203 and bonded to the second sidewall 203. This way, the fourth sub-section 82 encases the second sidewall 203, meaning that the second sub-section 52 isolates the second sidewall 203 from the air. This reduces the risk of moisture intruding into the dimming panel 100 through the second sidewall 203, and reduces the risk of material degradation within the dimming panel 100. This, in turn, improves the service life of the dimming panel 100. The fourth sub-section 82 is connected to the sidewall of the third sub-section 81 near the fourth sub-section 82. This allows the second edge-sealing adhesive 80 to have a larger dimension along the second direction Y2, further mitigating the problem of moisture in the air entering the dye liquid crystal layer 30 and causing failure of the dimming panel 100. The second direction Y2 is parallel to the first substrate 10 and perpendicular to the second edge-sealing adhesive 80.

[0151] As shown in FIG18A , in an orthographic projection onto the first substrate 10, the fourth sub-portion 82 covers the area between the first sidewall 103 and the second sidewall 203. Thus, the fourth sub-portion 82 isolates the first substrate 10 located between the first sidewall 103 and the second sidewall 203 from the air, thereby preventing moisture in the air from entering the dimming panel 100 through the first substrate located between the first sidewall 103 and the second sidewall 203, thereby preventing degradation of the materials within the dimming panel 100.

[0152] As shown in Figure 18A, when the first substrate 10 includes a first underlayer 11 and a first electrode layer 12, the fourth sub-section 82 separates the first electrode layer 12 between the first side wall 103 and the second side wall 203 from the air, which can improve the problem of the first electrode layer 12 being oxidized and causing the first electrode layer 12 to fail, reduce the risk of the dimming panel 100 failing due to the failure of the first electrode layer 12, and improve the service life of the dimming panel 100.

[0153] Figure 18B shows a structure in which the first substrate 10 has a third sidewall 104 and the second substrate 20 has a fourth sidewall 204. As shown in Figure 21, the first substrate 10 has the third sidewall 104, and the second substrate 20 has the fourth sidewall 204. The third sidewall 104 and the fourth sidewall 204 are substantially parallel, and the orthographic projection of the third sidewall 104 on the reference plane coincides with the orthographic projection of the fourth sidewall 204 on the reference plane. The dimming panel 100 also includes a third edge-sealing adhesive 90, which includes a fifth sub-portion 91. The fifth sub-portion 91 is located between the first substrate 10 and the second substrate 20 and is arranged along the edge of the first substrate 10 near the third sidewall 104. The fifth sub-portion 91 is used to separate the dye liquid crystal from air. It also reduces the risk of moisture in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0154] Figure 18C shows the structure of the third edge-sealing adhesive 90, including the fifth sub-section 91 and the sixth sub-section 92. As shown in Figure 18C , the third edge-sealing adhesive 90 includes the fifth sub-section 91 and the sixth sub-section 92. The fifth sub-section 91 is located between the first substrate 10 and the second substrate 20, and is positioned along the edge of the first substrate 10 near the third sidewall 104. The fifth sub-section 91 is used to separate the dye liquid crystal from air. It also reduces the risk of moisture in the air entering the dye liquid crystal layer 30 and causing failure of the dimming panel 100. The sixth sub-section 92 is positioned along the third sidewall 104 and the fourth sidewall 204.

[0155] As shown in FIG18C , the sixth sub-portion 92 is bonded to the third side wall 104 , so that the sixth sub-portion 92 wraps the third side wall 104 , that is, the sixth sub-portion 92 separates the third side wall 104 from the air, thereby reducing the risk of water vapor invading the dimming panel 100 from the third side wall 104 and reducing the risk of aging of the material in the dimming panel 100 .

[0156] The sixth sub-portion 92 is also bonded to the fourth side wall 204. In other words, the sixth sub-portion 92 is bonded to the fourth side wall 204. Thus, the sixth sub-portion 92 wraps around the fourth side wall 204, that is, the sixth sub-portion 92 isolates the fourth side wall 204 from the air, thereby reducing the risk of moisture intruding into the dimming panel 100 through the fourth side wall 204 and reducing the risk of material aging within the dimming panel 100. This in turn increases the service life of the dimming panel 100.

[0157] As shown in Figure 18C, the sixth sub-section 92 is also connected to the side wall of the fifth sub-section 91 close to the third side wall 104. In this way, the second edge-sealing glue 80 has a larger size along the third direction Y3, which can further improve the problem of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail, wherein the third direction Y3 is parallel to the first substrate 10 and perpendicular to the third edge-sealing glue 90.

[0158] Figure 18D shows a structure in which the first substrate 10 has a fifth sidewall 105 and the second substrate 20 has a sixth sidewall 205. As shown in Figure 18D , the first substrate 10 has the fifth sidewall 105, and the second substrate 20 has the sixth sidewall 205. The fifth sidewall 105 and the sixth sidewall 205 are substantially parallel. In an orthographic projection onto the first substrate 10, the fifth sidewall 105, the sixth sidewall 205, and a portion of the sidewall of the dye liquid crystal layer 30 are substantially flush. The dimming panel 100 also includes a fourth edge-sealing adhesive 110, which is disposed along the fifth sidewall 105, the sixth sidewall 205, and the edge of the first substrate 10 near the fifth sidewall 105. This fourth edge-sealing adhesive 110 serves to separate the dye liquid crystal from air and also reduces the risk of moisture in the air entering the dye liquid crystal layer 30 and causing failure of the dimming panel 100.

[0159] The fourth edge-sealing adhesive 110 is bonded to the fifth side wall 105. Thus, the fourth edge-sealing adhesive 110 wraps around the fifth side wall 105, that is, the fourth edge-sealing adhesive 110 isolates the fifth side wall 105 from the air, thereby reducing the risk of water vapor intruding into the dimming panel 100 through the fifth side wall 105, and reducing the risk of aging of the materials within the dimming panel 100. The fourth edge-sealing adhesive 110 is also bonded to the sixth side wall 205. Thus, the fourth edge-sealing adhesive 110 wraps around the sixth side wall 205, that is, the fourth edge-sealing adhesive 110 isolates the sixth side wall 205 from the air, thereby reducing the risk of water vapor intruding into the dimming panel 100 through the sixth side wall 205, and reducing the risk of aging of the materials within the dimming panel 100.

[0160] In some embodiments, the second substrate 20 has a second main area 201 and a second binding area 202. As shown in FIG17 , the second substrate 20 has the second main area 201 and the second binding area 202. The second binding area is located on one side of the second main area 201. For example, the second binding area 202 is located above, below, to the left, or to the right of the second main area 201. The orthographic projection of the first substrate 10 on the second substrate 20 is located in the second main area 201 and does not overlap with the second binding area 202. The shape of the second substrate 20 can be the same as that of the first substrate 10.

[0161] The size of the second binding area 202 can be set according to actual conditions. For example, the shape of the second binding area 202 is rectangular, and the size of the second binding area 202 along the length direction of the second substrate 20 is equal to the length of the second substrate 20, or the size of the second binding area 202 along the width direction of the second substrate 20 is equal to the width of the second substrate 20. For example, the size of the second binding area 202 along the length direction of the second substrate 20 is smaller than the length of the second substrate 20, or the size of the second binding area 202 along the width direction of the second substrate 20 is smaller than the width of the second substrate 20.

[0162] As shown in Figure 19, the dimming panel 100 also includes a fifth edge sealing glue 120, and the fifth edge sealing glue 120 includes a seventh sub-section 121 and an eighth sub-section 122. The seventh sub-section 121 is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the first substrate 10 close to the second binding area 202. In this way, the seventh sub-section 121 is used to separate the dye liquid crystal and the air. At the same time, the seventh sub-section 121 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0163] As shown in FIG19 , the orthographic projection of the eighth sub-portion 122 on the second substrate 20 is located in the second binding region 202 . The eighth sub-portion 122 is arranged along the second binding region 202 near the edge of the second substrate 20 , and together with the seventh sub-portion 121, is close to the sidewall of the second binding region 202 . Thus, the fifth edge-sealing adhesive 120 has a larger dimension along the fourth direction Y4, further alleviating the problem of moisture in the air entering the dye liquid crystal layer 30 and causing failure of the dimming panel 100 . The fourth direction Y4 is parallel to the first substrate 10 and perpendicular to the fifth edge-sealing adhesive 120 .

[0164] As shown in Figure 19, the eighth sub-section 122 is bonded to the side wall of the first substrate 10 near the second binding area 202, so that the eighth sub-section 122 wraps the side wall of the first substrate 10 near the second binding area 202, that is, the eighth sub-section 122 separates the side wall of the first substrate 10 near the second binding area 202 from the air, which can reduce the risk of water vapor entering the dimming panel 100 from the side wall of the second binding area 202 and reduce the risk of material aging of the dimming panel 100.

[0165] In some embodiments, Figure 19 is a structural diagram of the dimming panel 100 that also includes a second circuit board 130. As shown in Figure 19, the dimming panel 100 also includes a second circuit board 130. The second circuit board 130 is located on the side of the second substrate 20 close to the first substrate 10, and the part of the positive projection of the second circuit board 130 on the second substrate 20 is located in the second binding area 202. In this way, the second circuit board 130 and the second electrode layer 22 can be bound.

[0166] In some embodiments, as shown in FIG19 , the dimming panel 100 further includes a second anisotropic conductive film 6 (ACF), which is located between the second circuit board 130 and the second electrode layer 22 . The second anisotropic conductive film 6 is used to bond the second circuit board 130 to the second electrode layer 22 .

[0167] In some embodiments, as shown in FIG19 , the dimming panel 100 further includes a second protective adhesive 140. At least a portion of the second protective adhesive 140 is located between the third edge-sealing adhesive 90 and the second circuit board 130 and is bonded to the third edge-sealing adhesive 90 and the second circuit board 130. The second protective adhesive 140 can enhance the securement between the second circuit board 130 and the second electrode layer 22. Furthermore, the second protective adhesive 140 isolates a portion of the second electrode layer 22 from air, reducing the risk of oxidation of the second electrode layer 22 and thereby increasing the service life of the second electrode layer 22. The material of the second electrode layer 22 can be the same as that of the first electrode layer 12. For example, the material of the first electrode layer 12 includes UV adhesive.

[0168] In some embodiments, as shown in FIG19 , in the orthographic projection onto the second substrate 20 , the area formed by the fifth edge sealant 120 , the second protective sealant 140 , and the second circuit board 130 covers the second binding area 202 . In this way, the third edge sealant 90 , the second protective sealant 140 , and the second circuit board 130 work together to isolate the second electrode layer 22 located in the second binding area 202 from the air, thereby reducing the risk of oxidation of the second electrode layer 22 located in the second binding area 202

[0169] In some embodiments, the relative positions of the first circuit board 60 and the second circuit board 130 can be set according to actual conditions.

[0170] For example, Figure 17 shows a structure in which the first circuit board 60 and the second circuit board 130 are arranged on the same side. As shown in Figure 17, the first circuit board 60 and the second circuit board 130 are arranged on the same side. For example, the first circuit board 60 is located on the left side of the first main body area 101, and the second circuit board 130 is located on the left side of the second main body area 201. In another example, the first circuit board 60 is located on the right side of the first main body area 101, and the second circuit board 130 is located on the right side of the second main body area 201. In another example, the first circuit board 60 is located on the upper side of the first main body area 101, and the second circuit board 130 is located on the upper side of the second main body area 201. In another example, the first circuit board 60 is located on the lower side of the first main body area 101, and the second circuit board 130 is located on the lower side of the second main body area 201. In this way, if the dimming panel 100 is rectangular, since the first circuit board 60 and the second circuit board 130 are only located on one side of the dimming panel 100, a three-sided narrow bezel design of the dimming panel 100 can be achieved.

[0171] Alternatively, for example, FIG20 shows a structure in which the first circuit board 60 and the second circuit board 130 are arranged adjacent to each other. As shown in FIG20 , the first circuit board 60 and the second circuit board 130 are arranged adjacent to each other. The circuit board binding process is simple and the production efficiency is high. For example, the first circuit board 60 is located on the left side of the first main body area 101, and the second circuit board 130 is located on the upper side or lower side of the second main body area 201. For another example, the first circuit board 60 is located on the right side of the first main body area 101, and the second circuit board 130 is located on the upper side or lower side of the second main body area 201.

[0172] Alternatively, for example, Figure 21 is a structural diagram of the first circuit board 60 and the second circuit board 130 arranged relative to each other. As shown in Figure 21, the first circuit board 60 and the second circuit board 130 are arranged relative to each other. The circuit board binding process is simple and has high production efficiency. For example, the first circuit board 60 is located on the left side of the first main body area 101, and the second circuit board 130 is located on the right side of the second main body area 201. For another example, the first circuit board 60 is located on the upper side of the first main body area 101, and the second circuit board 130 is located on the lower side of the second main body area 201.

[0173] In some embodiments, the first binding area 102 and the second binding area 202 can be configured according to actual conditions. As shown in FIG22 , the first binding area 102 is rectangular in shape, and the dimension of the first binding area 102 along the width direction of the first substrate 10 is smaller than the width of the first substrate 20. The second binding area 202 is rectangular in shape, and the dimension of the second binding area 202 along the width direction of the second substrate 20 is smaller than the width of the second substrate 20.

[0174] Figure 23 illustrates a structure in which the second substrate 21 is provided with a through-hole 2100. In some embodiments, as shown in Figure 23, the second substrate 21 is provided with a through-hole 2100. The dimming panel 100 further includes a second circuit board 130. The second circuit board 130 is located on the side of the second substrate 20 away from the first substrate 10 and is at least partially electrically connected to the second electrode layer 22 through the through-hole 2100. The orthographic projection of the through-hole 2100 on the dye liquid crystal layer 30 is located within the dye liquid crystal layer 30. This means that the through-hole 2100 does not reduce the area of ​​the dye liquid crystal layer 30, thereby maximizing the area of ​​the dye liquid crystal layer 30 and, in turn, maximizing the dimming area of ​​the dimming panel 100. The dimming area refers to the area within the dimming panel 100 where light transmittance can be adjusted. The second circuit board 130 is located on the side of the first electrode layer 12 away from the second electrode layer 22. This means that the second circuit board 130 does not occupy the edge area between the first electrode layer 12 and the second electrode layer 22, thereby achieving a narrow-frame design for the dimming panel 100.

[0175] In some embodiments, as shown in FIG. 18A , the spacer 40 is disposed on the first substrate 10 , and an orthographic projection of the spacer 40 on the plane where the second substrate 20 is located is at least partially located outside the second substrate 20 .

[0176] Exemplarily, at least one spacer 40 is located in the first binding area 102. In this way, when the first protective glue 70 is formed in the first binding area 102, at least one spacer 40 is located in the first protective glue 70, which is enough to increase the contact area of ​​the first protective glue 70, thereby reducing the risk of the first protective glue 70 falling off from the first binding area 102.

[0177] Exemplarily, at least one spacer 40 is located in the first binding area 102. In this way, when the first edge sealing glue 50 is formed in the first binding area 102, at least one spacer 40 is located in the first edge sealing glue 50, which is enough to increase the contact area of ​​the first edge sealing glue 50, thereby reducing the risk of the first edge sealing glue 50 falling off from the first binding area 102.

[0178] In some embodiments, the embodiments of the present disclosure further provide a dimming structure, the dimming structure including a dimming panel 100, and the dimming structure includes one of a skylight, a curtain wall, a rail vehicle, a car, and a billboard.

[0179] The dimming panel 100 can be used in the construction field. For example, the dimming panel 100 is used in skylights or curtain walls. The dimming panel 100 can be used in partition glass. Compared with brick walls in related technologies, the dimming panel 100 is thinner. The dimming panel 100 can save space and the company logo can be displayed on the partition glass.

[0180] The dimming panel 100 can also be used in the transportation field, for example, in rail vehicles or automobiles. Rail vehicles can include subways, light rails, skytrains, trams, and maglev trains, which are not listed in the embodiments of this disclosure. Automobiles can include passenger cars, commercial vehicles, trucks, or buses, which are not listed in the embodiments of this disclosure.

[0181] Figure 24 is a structural diagram of an automobile. As shown in Figure 24 , automobile 1000 includes a body 1010 and window glass 1020 mounted on body 1010. Window glass 1020 can be one or more of the following: front window, sunroof, rear window, or side window. Window glass 1020 includes a dimming panel 100 according to any of the aforementioned embodiments. The dimming panel 100 can also be used on the central control touchscreen in automobile 1000.

[0182] The dimming panel 100 may also be applied in the field of advertising. For example, the dimming panel 100 may be applied in billboards.

[0183] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0184] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A method for preparing a dimming panel, comprising: Prepare dimming panel motherboard; The dimming panel motherboard includes a first substrate motherboard, a second substrate motherboard, a dye liquid crystal layer and a sealing glue; The first substrate motherboard and the second substrate motherboard are arranged opposite to each other; the dye liquid crystal layer is located between the first substrate motherboard and the second substrate motherboard; the frame sealant is located between the first substrate motherboard and the second substrate motherboard and surrounds the dye liquid crystal layer; The dimming panel motherboard is cut to form an initial dimming panel; the initial dimming panel comprises a first transition plate and a second transition plate, the orthographic projection of the second transition plate on a reference plane coincides with the orthographic projection of the first transition plate on the reference plane, and at least a portion of the side wall of the first transition plate is flush with at least a portion of the side wall of the dye liquid crystal layer; the reference plane is parallel to a surface of the first substrate motherboard close to the dye liquid crystal layer; The second transition plate is cut along a first cutting line to form a second substrate, wherein the second substrate exposes a first region of the first transition plate, and the first region forms a first binding region; the dye liquid crystal layer is located between the first transition plate and the second substrate; A first edge-sealing adhesive is formed along the first cutting line; the first edge-sealing adhesive includes a first sub-portion, the first sub-portion is located between the first transition plate and the second substrate, and is arranged along the edge of the second substrate close to the first binding area.

2. The preparation method according to claim 1, wherein The orthographic projection of the first cutting line on the reference surface is located in the orthographic projection of the frame sealing glue on the reference surface.

3. The preparation method according to claim 2, wherein The forming of a first edge sealing glue along the first cutting line comprises: A portion of the frame sealant located on a side of the first cutting line away from the dye liquid crystal layer is removed along the first cutting line, and a portion of the frame sealant located on a side of the first cutting line and the dye liquid crystal layer forms the first sub-portion.

4. The preparation method according to claim 1, wherein The orthographic projection of the first cutting line on the reference plane is located in the orthographic projection of the dye liquid crystal layer on the reference plane.

5. The preparation method according to claim 4, wherein The forming of a first edge sealing glue along the first cutting line comprises: Glue is applied to form a first edge-sealing glue; the glue portion is located between the dye liquid crystal layer and the first cutting line to form a first sub-portion; the first edge-sealing glue also includes a second sub-portion, the glue portion is located in the first binding area, and extends along the side wall of the second substrate close to the first binding area to form a second sub-portion; wherein the second sub-portion is connected to the first sub-portion.

6. The preparation method according to any one of claims 1 to 5, wherein After forming the first edge sealing glue along the first cutting line, the preparation method further includes: The first circuit board is bound to the first binding area of ​​the first transition plate; and there is a gap between the first circuit board and the first edge sealing adhesive.

7. The preparation method according to claim 6, wherein: After the first binding area of ​​the first transition plate is bound to the first circuit board, the preparation method further includes: A first protective adhesive is formed between the first circuit board and the first edge sealing adhesive; the first protective adhesive is bonded to the first edge sealing adhesive and the first circuit board, the first protective adhesive also covers a second area, and an area of ​​the first binding area exposed by the first circuit board and the first edge sealing adhesive forms the second area.

8. The preparation method according to any one of claims 1 to 7, wherein The step of cutting the dimming panel motherboard to form an initial dimming panel comprises: Using a press to press the dimming panel motherboard; The dimming panel motherboard is cut along a second cutting line to form an initial dimming panel; and a gap is formed between the pressing tool and the second cutting line.

9. The preparation method according to claim 8, wherein In the process of cutting the second transition plate to form the second substrate, the second transition plate is cut along the outer boundary of the press, and the second substrate also exposes a third area of ​​the first transition plate, wherein the width of the third area is smaller than the width of the first area; The second substrate has a second side wall, the first transition plate has a first side wall, the second side wall is substantially parallel to the first side wall, and an orthographic projection of the second side wall on the first substrate is spaced apart from the first side wall; In the process of forming the first edge sealing glue, the preparation method further comprises: The glue is applied to form a second edge sealing glue, wherein the glue portion is located between the dye liquid crystal layer and the second side wall to form a third sub-portion, and the glue portion is located in the third area and extends along the second side wall to form a fourth sub-portion, wherein the fourth sub-portion is bonded to the second side wall and connected to the third sub-portion, and in the orthographic projection to the first transition plate, the fourth sub-portion covers the third area.

10. The preparation method according to claim 8 or 9, wherein: The second substrate has a fourth side wall, the first substrate motherboard has a third side wall, the third side wall is substantially parallel to the fourth side wall, and the orthographic projection of the third side wall on the reference plane coincides with the orthographic projection of the fourth side wall on the reference plane; In the process of forming the first edge sealing glue, the preparation method further comprises: The glue is applied to form a third edge-sealing glue, wherein the glue portion is located between the dye liquid crystal layer and the third side wall to form a fifth sub-portion, and the glue portion extends along the third side wall and the fourth side wall to form a sixth sub-portion, wherein the sixth sub-portion is bonded to the third side wall and the fourth side wall, and connected to the fifth sub-portion.

11. The preparation method according to any one of claims 1 to 7, wherein The step of cutting the dimming panel motherboard to form an initial dimming panel comprises: The dimming panel motherboard is cut along the third cutting line to form a first dimming panel; the first dimming panel has a panel area and a liquid leakage area, the liquid leakage area is at least located on one side of the panel area, and in the liquid leakage area, there is no dye liquid crystal layer and frame sealing glue between the first substrate motherboard and the second substrate; The first dimming panel is cut along a fourth cutting line to form the initial dimming panel; the fourth cutting line is located in the panel area.

12. The preparation method according to claim 11, wherein The first substrate motherboard has a fifth side wall, the second substrate has a sixth side wall, the fifth side wall is substantially parallel to the sixth side wall, and in an orthographic projection onto the first substrate motherboard, the fifth side wall, the sixth side wall and a part of the side wall of the dye liquid crystal layer are substantially flush; In the process of forming the first edge sealing glue, the preparation method further comprises: The glue is applied to form a fourth edge-sealing glue, and the glue extends along the fifth side wall, the sixth side wall and the side wall of the dye liquid crystal layer to form the fourth edge-sealing glue, and is bonded to the fifth side wall and the sixth side wall.

13. The preparation method according to any one of claims 1 to 12, wherein the dimming panel motherboard further comprises a plurality of spacers, and the plurality of spacers are located between the first substrate motherboard and the second substrate motherboard; in, Preparation of dimming panel motherboard includes: forming an initial support layer on the first substrate motherboard; Direct-write exposure of the initial support layer using a digital mask; The initial support layer is developed, cleaned, and cured to form a plurality of spacers.

14. A dimming panel, comprising: A first substrate and a second substrate arranged opposite to each other; The first substrate has a first binding area, and the orthographic projection of the second substrate on the first substrate does not overlap with the first binding area; A dye liquid crystal layer, located between the first substrate and the second substrate; A plurality of spacers, located between the first substrate and the second substrate; The first edge sealing adhesive comprises a first sub-portion, wherein the first sub-portion is located between the first substrate and the second substrate and is arranged along an edge of the second substrate close to the first binding area.

15. The dimming panel according to claim 14, wherein: The first edge sealing glue also includes a second sub-portion, the orthographic projection of the second sub-portion on the first substrate is located in the first binding area, the second sub-portion is arranged along the edge of the first binding area close to the second substrate, and is connected to the side wall of the first sub-portion close to the first binding area, and the second substrate is bonded to the side wall close to the first binding area.

16. The dimming panel according to claim 14 or 15, further comprising: A first circuit board, a portion of an orthographic projection on the first substrate is located in the first binding area; A first protective adhesive, at least a portion of which is located between the first edge sealing adhesive and the first circuit board, and is bonded to the first edge sealing adhesive and the first circuit board.

17. The dimming panel according to claim 16, wherein: In an orthographic projection onto the first substrate, an area formed by the first edge sealing adhesive, the first protective adhesive, and the first circuit board covers the first binding area.

18. The dimming panel according to any one of claims 14 to 17, wherein: The first substrate has a first side wall, the second substrate has a second side wall, the second side wall is substantially parallel to the first side wall, and an orthographic projection of the second side wall on the first substrate is spaced apart from the first side wall; The dimming panel also includes: The second edge sealing adhesive comprises a third sub-section and a fourth sub-section, wherein the third sub-section is located between the first substrate and the second The fourth sub-section is disposed between the substrates and along the edge of the second substrate close to the second side wall; the fourth sub-section is disposed along the second side wall and is bonded to the second side wall, and is connected to the side wall of the third sub-section close to the fourth sub-section; Wherein, in the orthographic projection onto the first substrate, the fourth sub-portion covers the area between the first side wall and the second side wall.

19. The dimming panel according to any one of claims 14 to 18, wherein: The first substrate has a third side wall, the second substrate has a fourth side wall, the third side wall is substantially parallel to the fourth side wall, and the orthographic projection of the third side wall on the reference plane coincides with the orthographic projection of the fourth side wall on the reference plane; The dimming panel also includes: The third edge sealing adhesive comprises a fifth sub-portion, wherein the fifth sub-portion is located between the first substrate and the second substrate and is arranged along an edge of the first substrate close to the third side wall.

20. The dimming panel according to claim 19, wherein: The second edge sealing adhesive further includes a sixth sub-portion, which is disposed along the third side wall and the fourth side wall and is bonded to the third side wall, the fourth side wall and the side wall of the fifth sub-portion close to the third side wall.

21. The dimming panel according to any one of claims 14 to 20, wherein: The second substrate has a second binding area, and the orthographic projection of the first substrate on the second substrate does not overlap with the second binding area; The dimming panel also includes: a fifth edge-sealing adhesive, comprising a seventh sub-portion and an eighth sub-portion, wherein the seventh sub-portion is located between the first substrate and the second substrate and is arranged along an edge of the first substrate close to the second binding region, the orthographic projection of the eighth sub-portion on the second substrate is located in the second binding region, the eighth sub-portion is arranged along an edge of the second binding region close to the second substrate, and is connected to a side wall of the seventh sub-portion close to the second binding region, and is bonded to a side wall of the second substrate close to the second binding region; The second circuit board has an orthographic projection on the second substrate located in the second binding area.

22. The dimming panel according to claim 21, further comprising: A second protective adhesive, at least a portion of which is located between the fifth edge-sealing adhesive and the second circuit board, and is bonded to the fifth edge-sealing adhesive and the second circuit board.

23. The dimming panel according to claim 22, wherein: In the orthographic projection onto the second substrate, the area formed by the fifth edge sealing adhesive, the second protective adhesive and the second circuit board covers the second binding area.

24. The dimming panel according to any one of claims 14 to 20, wherein: The second substrate comprises: A second substrate having a through hole; A second electrode layer is located on a side of the second substrate close to the dye liquid crystal layer, and the second electrode layer covers the second substrate; The dimming panel also includes: A second circuit board is located on a side of the second substrate away from the first substrate and at least partially passes through the through hole. The second electrode layer is electrically connected to the second electrode layer.

25. The dimming panel according to any one of claims 14 to 24, wherein: The spacer is disposed on the first substrate, and an orthographic projection of the spacer on the plane where the second substrate is located is at least partially located outside the second substrate.

26. The dimming panel according to claim 25, wherein: At least one spacer is located in the first binding area.

27. A dimming structure, wherein: It comprises a dimming panel as described in any one of claims 14 to 26; the dimming structure comprises at least one of a curtain wall, a skylight, a rail transportation vehicle and a passenger car.

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