Display panel and tiled display module

Abstract

Provided in the present invention are a display panel and a tiled display module. The display panel comprises a substrate, a transparent cover plate, a filling portion and a plurality of light-emitting chips, wherein the plurality of light-emitting chips and the filling portion are both located between the substrate and the transparent cover plate. The filling portion comprises a first filling portion and second filling portions, wherein the first filling portion is located on the side of the light-emitting chips facing away from the substrate; each second filling portion is located between two adjacent light-emitting chips; and the first filling portion is transparent or translucent to visible light, and the second filling portions are translucent or opaque to visible light. By means of the display panel and the tiled display module provided in the present invention, not only can the transmittance of the display panel be increased, but also an adequate black level can be ensured.

Description

Display panels and spliced ​​display modules Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a spliced ​​display module. Background Art

[0002] At present, mini-LED display panels use glue-filled packaging. This packaging structure is thicker and has a higher risk of splicing. At the same time, the rework characteristics are poor and it is difficult to remove the surface packaging glue.

[0003] Another packaging method uses a film. This packaging method achieves ideal optical performance through a flexible laminate design. The soft adhesive used in this packaging also makes it easier to remove during rework. In the existing packaging laminate structure, the black layer is the top layer. To increase the transmittance of the display module, the transmittance of the black layer needs to be improved, but this also carries the risk of not being dark enough in the dark state, resulting in poor black levels.

[0004] Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a display panel and a spliced ​​display module, which can not only improve the transmittance of the display panel but also ensure a sufficient black level.

[0006] To achieve the above objectives, an embodiment of the present disclosure provides a display panel, comprising a substrate, a transparent cover, a filling portion, and a plurality of light-emitting chips, wherein the plurality of light-emitting chips and the filling portion are both located between the substrate and the transparent cover; the filling portion comprises a first filling portion and a second filling portion, wherein the first filling portion is located on a side of the light-emitting chip facing away from the substrate; and the second filling portion is located between two adjacent light-emitting chips;

[0007] The first filling portion is transparent or translucent to visible light, and the second filling portion is translucent or opaque to visible light.

[0008] In some embodiments, the substrate includes a driving circuit and a pad, and the light-emitting chip includes a pin, and the pin is fixedly connected to the pad;

[0009] The driving circuit provides a driving signal to the light-emitting chip through the pad.

[0010] In some embodiments, the first filling portion is disposed in contact with the second filling portion;

[0011] The second filling part is in contact with the transparent cover plate and the substrate respectively; the first filling part is in contact with the light emitting chip and the transparent cover plate respectively.

[0012] In some embodiments, the orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip on the plane where the transparent cover plate is located.

[0013] In some embodiments, the orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the orthographic projection of the light-emitting area of ​​the light-emitting chip on the plane where the transparent cover plate is located.

[0014] In some embodiments, the second filling portion includes a matrix and a light-absorbing material mixed in the matrix, and the light-absorbing material includes at least one of light-absorbing particles and light-absorbing dyes.

[0015] In some embodiments, the second filling part further includes scattering particles mixed in the matrix.

[0016] In some embodiments, the matrix is ​​an ultraviolet-cured product or a thermally cured product.

[0017] In some embodiments, the first filling part and the second filling part are made of the same material.

[0018] In some embodiments, the transmittance of the first filling portion is in the range of 45% to 80%;

[0019] The transmittance of the second filling part is in the range of 10% to 20%.

[0020] In some embodiments, the thickness of the first filling portion is greater than or equal to 20 μm.

[0021] In some embodiments, the first filling portion is transparent to visible light;

[0022] The light-emitting chips are arranged in a one-to-one correspondence with the first filling parts, and the volume V of the first filling part corresponding to each light-emitting chip satisfies:

[0023] V = k × S × H1;

[0024] Wherein, S is the area of ​​the light-emitting region of the light-emitting chip; H1 is the thickness of the first filling portion, the value range of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.5.

[0025] In some embodiments, the plurality of light-emitting chips are all blue light chips;

[0026] The first filling portion includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion;

[0027] The first sub-filling portion includes a first color conversion material that converts blue light into red light; the second sub-filling portion includes a second color conversion material that converts blue light into green light; and the third sub-filling portion is configured to transmit blue light.

[0028] In some embodiments, the filling portion further includes a third filling portion disposed around the light emitting chip;

[0029] The third filling portion is located between the second filling portion and the light emitting chip;

[0030] The third filling part is respectively arranged in contact with the first filling part, the second filling part, and the light emitting chip;

[0031] The first filling part and the third filling part are made of the same material.

[0032] In some embodiments, the plurality of light emitting chips are separated by the second filling portion, and the light emitting chips are in direct contact with the second filling portion.

[0033] In some embodiments, the plurality of light emitting chips include a blue light chip, a green light chip, and a red light chip;

[0034] The light-emitting chip is a mini-LED chip or a micro-LED chip.

[0035] As another technical solution, the present invention further provides a spliced ​​display module, comprising a plurality of the above-mentioned display panels provided by the present invention, wherein the plurality of display panels are arranged in an array. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] FIG1 is a partial cross-sectional view of a display panel in the related art;

[0037] FIG2 is a partial cross-sectional view of a display panel provided by an embodiment of the present invention;

[0038] FIG3 is a diagram showing a process of laminating a display panel according to an embodiment of the present invention;

[0039] FIG4 is another partial cross-sectional view of a display panel provided by an embodiment of the present invention;

[0040] FIG5 is another partial cross-sectional view of a display panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0041] To make the objectives, technical solutions, and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] The shapes and sizes of the components in the drawings do not reflect the actual proportions, and are only intended to facilitate understanding of the contents of the embodiments of the present invention.

[0043] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0044] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings are schematic in nature, and the shapes of the regions shown in the drawings illustrate the specific shapes of the regions of the elements, but are not intended to be limiting.

[0045] FIG1 is a partial cross-sectional view of a display panel according to related art. Referring to FIG1 , the display panel includes a transparent cover plate 12 and a substrate 11, and a plurality of light-emitting chips 13 and an encapsulation stack 14 disposed therebetween, sequentially arranged away from the substrate 11. The plurality of light-emitting chips 13 include blue, green, and red chips, and are arranged in an alternating pattern. The encapsulation stack 14 includes a diffusion adhesive layer 141, a transparent adhesive layer 142, and a black adhesive layer 143, sequentially arranged away from the substrate 11. The black adhesive layer 143 has a matrix containing black particles or a black dye; the diffusion adhesive layer 141 has a matrix containing white particles and transparent particles; and the transparent adhesive layer 142 is used to compensate for its thickness, ensuring that the plurality of light-emitting chips 13 are not squeezed. However, in order to increase the transmittance of the display panel, the transmittance of the black adhesive layer 143 must be increased, but this also carries the risk of insufficient darkness in the dark state, resulting in a poor black level.

[0046] In order to solve the above problems, an embodiment of the present invention provides a display panel that can not only improve the transmittance of the display panel, but also ensure a sufficient black level. Referring to Figure 1, the display panel includes a substrate 21, a transparent cover plate 22, a filling portion 24 and a plurality of light-emitting chips 23. In some embodiments, the transparent cover plate 22 is, for example, a transparent polyethylene terephthalate (PET) material, which can be formed into an integrated film material with the filling material of the filling portion 24 before lamination. The filling material is located on the surface of the transparent cover plate 22 facing the substrate 21. When vacuum lamination is performed, the entire cavity for the lamination process is first evacuated, and then air is introduced into the side of the transparent cover plate 22 in the cavity facing away from the substrate 21, so that there is an air pressure difference on both sides of the transparent cover plate 22. By utilizing this air pressure difference, the integrated film formed by the transparent cover plate 22 and the filling material can be pressed onto the substrate 21 (on which a plurality of light-emitting chips 23 are mounted), thereby pressing the filling material between the transparent cover plate 22 and the substrate 21, and finally forming the filling portion 24 after a curing process.

[0047] It should be noted that the transparent cover plate 22 is a cover plate that is transparent to the visible light band.

[0048] In some embodiments, the transparent cover 22 is a rigid cover, for example, made of glass.

[0049] In some embodiments, the transparent cover 22 is a flexible cover, for example, made of PET film.

[0050] In some embodiments, the substrate 21 may include a driving circuit and a pad, wherein the light-emitting chip 23 includes pins fixedly connected to the pad; the driving circuit provides a driving signal to the light-emitting chip 23 via the pad. The driving circuit may be an active driving circuit or a passive driving circuit.

[0051] Multiple light-emitting chips 23 and a filling portion 24 are located between the substrate 21 and the transparent cover 22. The filling portion 24 includes a first filling portion 241 and a second filling portion 242. The first filling portion 241 is located on the side of the light-emitting chip 23 facing away from the substrate 21, and the second filling portion 242 is located between two adjacent light-emitting chips 23. The first filling portion 241 is transparent or translucent to visible light, while the second filling portion 242 is translucent or opaque to visible light. It should be noted that in this embodiment of the present invention, the transparency or translucency of the first filling portion 241 and the translucency or opacity of the second filling portion 242 can be set according to specific circumstances. That is, different states correspond to different desired transmittances. Specifically, "transparent" refers to a state where the transmittance is greater than a first predetermined percentage, such as 85%, 90%, or 95%, and "translucent" refers to a state where the transmittance is less than or equal to the first predetermined percentage and greater than or equal to a second predetermined percentage, such as 5%, 10%, or 15%, etc. “Opaque” refers to a state where the transmittance is less than a second preset percentage.

[0052] The display panel provided by an embodiment of the present invention adopts the above-mentioned filling part 24 to replace the packaging stack 14 (i.e., the diffusion glue layer 141, the transparent glue layer 142 and the black glue layer 143) in the related art, which not only simplifies the structure, but also the filling part 24 can realize multiple functions of the packaging stack 14, which can not only improve the transmittance of the display panel, but also ensure a sufficient black level. Specifically, the first filling portion 241 located on the side of the light-emitting chip 23 facing away from the substrate 21 can, on the one hand, prevent the light-emitting chip 23 from being squeezed and deformed. On the other hand, because the first filling portion 241 is transparent or translucent to visible light and its thickness between the transparent cover plate 22 and the light-emitting chip 23 is smaller than that of the second filling portion 242, and the smaller the thickness, the higher the transmittance, the transparent or translucent first filling portion 241 has a higher transmittance. At the same time, the second filling portion 242 located between two adjacent light-emitting chips 23 is translucent or opaque to visible light and has a greater thickness than the first filling portion 241, so its transmittance is lower than that of the first filling portion 241, thereby ensuring a sufficient black level. As can be seen from the above, the combined use of the first filling portion 241 and the second filling portion 242 not only improves the transmittance of the display panel but also ensures a sufficient black level.

[0053] In some embodiments, the first filling portion 241 and the second filling portion 242 are arranged in contact with each other. In this case, the thickness of the second filling portion 242 is greater than the thickness of the light-emitting chip 23, so that the first filling portion 241 and the second filling portion 242 are in contact with each other. In this way, each light-emitting chip 23 can be completely covered by the first filling portion 241 and the second filling portion 242, thereby better protecting the light-emitting chip 23 and preventing compression damage caused by contact between the light-emitting chip 23 and the transparent cover plate 22 after lamination.

[0054] In some embodiments, the first filling portion 241 and the second filling portion 242 are arranged in contact with each other, with the second filling portion 242 contacting the transparent cover plate 22 and the substrate 21, respectively; and the first filling portion 241 contacting the light-emitting chip 23 and the transparent cover plate 22, respectively. In this case, as shown in FIG2 , the thickness H2 of the second filling portion 242 is equal to or approximately equal to the sum of the thickness of the light-emitting chip 23 and the thickness H1 of the first filling portion 241. In this way, the first filling portion 241 and the second filling portion 242 can completely fill the space between the transparent cover plate 22 and the substrate 21, thereby better protecting the light-emitting chip 23. In a specific embodiment, the thickness of the light-emitting chip 23 is 80 μm, the thickness H2 of the second filling portion 242 is 100 μm, and the thickness H1 of the first filling portion 241 is 20 μm.

[0055] In some embodiments, the plurality of light emitting chips 23 are separated by the second filling portion 242, and the light emitting chips 23 are in direct contact with the second filling portion 242. In this way, the second filling portion 242 can protect the outer periphery of the light emitting chip 23, thereby preventing the light emitting chip 23 from being squeezed and damaged by contact with the transparent cover plate 22 after pressing.

[0056] In some embodiments, the orthographic projection of the first filling portion 241 on the plane where the transparent cover plate 22 is located covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip 23 on the plane where the transparent cover plate 22 is located. The first filling portion 241 can partially cover the light-emitting area of ​​the light-emitting chip 23, that is, cover the center of the light-emitting area, so that the light emitting effect of the display panel is better.

[0057] In some embodiments, the orthographic projection of the first filling portion 241 on the plane where the transparent cover 22 is located covers the orthographic projection of the light emitting area of ​​the light emitting chip 23 on the plane where the transparent cover 22 is located. The first filling portion 241 can completely cover the light emitting area of ​​the light emitting chip 23.

[0058] In some embodiments, the second filling portion 242 includes a matrix and a light-absorbing material mixed in the matrix. The light-absorbing material includes at least one of light-absorbing particles and a light-absorbing dye. The light-absorbing material in the second filling portion 242 can ensure that the black level of the second filling portion 242 meets the required level. The matrix may include, for example, acrylic resin, epoxy resin, etc. The light-absorbing particles may include, for example, carbon black particles (which may have a particle size greater than or equal to 400 nm and less than or equal to 600 nm, for example, 500 nm). The light-absorbing dye may include, for example, black organic pigments.

[0059] On the basis that the second filling portion 242 includes a matrix and a light-absorbing material mixed in the matrix, in some embodiments, the second filling portion 242 also includes scattering particles mixed in the matrix. The scattering particles in the matrix of the second filling portion 242 can scatter light to produce a uniform light-emitting effect. Scattering particles include, for example, silicon dioxide (SiO2) particles, transparent polystyrene (PS) particles, transparent polymethyl methacrylate (PMMA) particles, etc. The particle size of these particles can be greater than or equal to 4μm and less than or equal to 6μm, for example, 5μm. In some embodiments, the mass percentage of the scattering particles is, for example, greater than or equal to 10% and less than or equal to 20%. The above-mentioned scattering particles are transparent to prevent the matrix from forming other colors that are not close to black.

[0060] In some embodiments, the second filling portion 242 includes a matrix and a light-absorbing material mixed within the matrix. Ultraviolet (UV) particles or thermally cured particles are incorporated into the matrix of the second filling portion 242 prior to curing. After the matrix containing these particles undergoes a curing treatment (UV irradiation or heat treatment), they are cured. This results in the overall hardening of the matrix of the second filling portion 242, eliminating any uncured portions and reducing creep by approximately 50%, significantly reducing adhesion during assembly and disassembly. The curing treatment is the process by which a substance (the matrix containing the UV particles or thermally cured particles) transforms from a low molecular weight to a high molecular weight (the substance formed after curing). For example, the principle behind UV curing is that UV particles are photosensitized and, under UV light, photoinitiate to form excited biomolecules, which decompose into free radicals or ions, causing unsaturated organic matter to undergo chemical reactions such as polymerization, grafting, and crosslinking, ultimately achieving the desired curing effect.

[0061] In some embodiments, as shown in Figure 2, the first filling portion 241 and the second filling portion 242 are made of the same material. That is, the first filling portion 241 includes the aforementioned matrix and a light-absorbing material mixed within the matrix. Because the thickness H1 of the first filling portion 241 is smaller than the thickness H2 of the second filling portion 242, and because smaller thicknesses result in higher transmittance, the first filling portion 241 has a higher transmittance than the second filling portion 242, thereby still improving the transmittance of the display panel. In practical applications, the thickness H1 of the first filling portion 241 can be minimized to maximize transmittance while avoiding compression damage caused by contact between the light-emitting chip 23 and the transparent cover plate 22 after lamination. Furthermore, in some embodiments, the first filling portion 241 also includes scattering particles mixed within the matrix to scatter light for a uniform light output. In some embodiments, the first filling portion 241 also includes ultraviolet light particles or thermosetting particles mixed within the matrix. This hardens the matrix of the first filling portion 241 as a whole, significantly reducing adhesion during assembly and disassembly.

[0062] If the first filling portion 241 and the second filling portion 242 are made of the same material, the first filling portion 241 and the second filling portion 242 can be simultaneously manufactured by lamination. That is, the filling materials of the first filling portion 241 and the second filling portion 242 form an integrated film material with the transparent cover plate 22 on the surface of the transparent cover plate 22 facing the substrate 21. During vacuum lamination, the entire cavity undergoing the lamination process is first evacuated. Then, air is introduced into the cavity on the side of the transparent cover plate 22 facing away from the substrate 21 to create an air pressure difference on both sides of the transparent cover plate 22. This air pressure difference is utilized to press the integrated film material formed by the transparent cover plate 22 and the filling material onto the substrate 21 (on which multiple light-emitting chips 23 are mounted). The vacuum lamination process is illustrated, for example, in FIG3. The filling material on the surface of the light-emitting chip 23 facing away from the substrate 21 is squeezed and overflows between two adjacent light-emitting chips 23. After lamination, the remaining filling material on the surface of the light emitting chip 23 facing away from the substrate 21 forms the first filling portion 241 , and a second filling portion 242 is formed between two adjacent light emitting chips 23 .

[0063] In other embodiments, as shown in FIG4 , the materials of the first filling portion 241 and the second filling portion 242 may be different. For example, the first filling portion 241 may be made of a filling material that is transparent to visible light, while the second filling portion 242 may be made of a filling material that is translucent or opaque to visible light. In this case, the filling material of the first filling portion 241 (e.g., a filling material that is transparent to visible light) may be dispensed onto the surface of the light-emitting chip 23 facing away from the substrate 21 using a dispensing method. The filling material of the second filling portion 242 (e.g., a filling material that is translucent or opaque to visible light) and the transparent cover plate 22 may then be formed into an integrated film using the aforementioned vacuum lamination method. The film is then laminarized onto the substrate 21 (on which multiple light-emitting chips 23 are mounted). Since the filling material of the first filling portion 241 is already dispensed onto the surface of the light-emitting chip 23 facing away from the substrate 21, during lamination, the filling material of the second filling portion 242 will be squeezed out to both sides of the light-emitting chip 23, forming the second filling portion 242.

[0064] In some embodiments, the transmittance of the first filling portion 241 is greater than or equal to 45%. Furthermore, when the first filling portion 241 and the second filling portion 242 are made of the same material, the transmittance of the first filling portion 241 is within a range of 45% to 80%, and the transmittance of the second filling portion 242 is within a range of 10% to 20%. When the first filling portion 241 and the second filling portion 242 are made of different materials, and the first filling portion 241 is transparent to visible light and the second filling portion 242 is translucent or opaque to visible light, the transmittance of the first filling portion 241 is greater than or equal to 80%, and the transmittance of the second filling portion 242 is within a range of 10% to 20%.

[0065] By adopting the above-mentioned ranges for the first filling portion 241 and the second filling portion 242, the overall transmittance of the filling portion 24 is greater than 50%, and the lightness value of the Lab color system of the filling portion 24 (called L value, used to characterize the black level, the lower the L value, the darker) is less than 31.5, thereby not only improving the transmittance of the display panel, but also ensuring a sufficient black level.

[0066] In some embodiments, the thickness H1 of the first filling portion 241 is greater than or equal to 20 μm. The thickness H1 of the first filling portion 241 is set to take into account the height tolerance of the light-emitting chip (for example, ±15 μm) and the thickness tolerance of the first filling portion 241 (±5 μm). This ensures that the light-emitting chip 23 does not contact the transparent cover plate 22 after pressing, thereby preventing the light-emitting chip 23 from being squeezed and damaged. At the same time, it can also improve the transmittance, for example, to more than 50%.

[0067] Specifically, the thickness H1 of the first filling portion 241 can be 20 μm, and its transmittance can reach 60%. The thickness H2 of the second filling portion 242 can be 80 μm, and its transmittance can reach 10%. The overall transmittance of the filling portion 24 can reach approximately 55%, and the lightness value of the filling portion 24 in the Lab color system (called the L value, which is used to represent the black level, the lower the L value, the darker) is approximately 30, which is comparable to the L value of the encapsulation stack used in related arts. This not only improves the transmittance of the display panel, but also ensures a sufficient black level.

[0068] In some embodiments, the first filling portion 241 is transparent to visible light. For example, the transparent first filling portion 241 may be a transparent adhesive that does not contain scattering particles. This maximizes the light energy from the light-emitting chip 23, achieving a transmittance of over 80%. Furthermore, the first filling portion 241 protects the light-emitting chip 23, preventing it from contacting the transparent cover plate 22 and causing damage.

[0069] In some embodiments, the light emitting chips 23 are arranged in a one-to-one correspondence with the first filling portions 241 , and the volume V of the first filling portion 241 corresponding to each light emitting chip 23 satisfies:

[0070] V = k × S × H1;

[0071] Wherein, S is the area of ​​the light-emitting region of a light-emitting chip 23; H1 is the thickness of the first filling portion 241, which is equal to the difference between the thickness H2 of the second filling portion 242 and the height of the light-emitting chip 23, the value range of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.5.

[0072] In other embodiments, as shown in Figure 5 , the filling portion 24 further includes a third filling portion 243 disposed around the light-emitting chip 23. The third filling portion 243 is located between the second filling portion 242 and the light-emitting chip 23, and is disposed in contact with the first filling portion 241, the second filling portion 242, and the light-emitting chip 23, respectively. The third filling portion 243 protects the light-emitting chip 23 from damage. Furthermore, in some embodiments, the first filling portion 241 and the third filling portion 243 are made of the same material. In this case, the first filling part 241, the second filling part 242 and the third filling part 243 can be made by dispensing and pressing, that is, a certain amount of filling materials of the first filling part 241 and the third filling part 243 are first dispensed on the surface of the light-emitting chip 23 on the side away from the substrate 21 by dispensing, and then the filling material of the second filling part 242 and the transparent cover plate 22 are formed into an integrated film material by the above-mentioned vacuum pressing method, and pressed onto the substrate 21 (on which a plurality of light-emitting chips 23 are mounted). Since the filling materials of the first filling part 241 and the third filling part 243 are already dispensed on the surface of the light-emitting chip 23 on the side away from the substrate 21, during pressing, the filling material will squeeze and expel all the filling materials of the second filling part 242 to both sides of the light-emitting chip 23 to form the second filling part 242; at the same time, part of the filling materials of the first filling part 241 and the third filling part 243 will also be squeezed and expelled to both sides of the light-emitting chip 23, and the above-mentioned third filling part 243 will be formed around the light-emitting chip 23. The remaining filling material on the surface of the light-emitting chip 23 facing away from the substrate 21 forms the aforementioned first filling portion 241. It can be seen from this that the manufacturing method of the first filling portion 241, the second filling portion 242, and the third filling portion 243 is simple, and compared to only applying the filling material to the surface of the light-emitting chip 23 facing away from the substrate 21, the glue dispensing accuracy requirements are lower, thereby reducing the manufacturing difficulty. It is easy to understand that when only the filling material of the first filling portion 241 is applied to the surface of the light-emitting chip 23 facing away from the substrate 21, due to its smaller amount, during pressing, only the filling material of the second filling portion 242 is squeezed and expelled to the sides of the light-emitting chip 23. When the first filling portion 241 and the third filling portion 243 are dotted on the surface of the light-emitting chip 23 facing away from the substrate 21, a larger amount of filling material is used so that a portion of the filling material of the first filling portion 241 and the third filling portion 243 can be squeezed and expelled to both sides of the light-emitting chip 23 during pressing, and the above-mentioned third filling portion 243 can be formed around the light-emitting chip 23.

[0073] In some embodiments, the plurality of light emitting chips 23 include a blue light chip 23 a , a green light chip 23 b , and a red light chip 23 c .

[0074] In other embodiments, all of the light-emitting chips 23 are blue light chips. Based on this, the first filling portion 241 includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion. The first sub-filling portion includes a first color-conversion material, such as red quantum dots, which converts blue light into red light. The second sub-filling portion includes a second color-conversion material, such as green quantum dots, which converts blue light into green light. The third sub-filling portion is configured to transmit blue light and may be, for example, a transparent resin (i.e., the wavelength of the blue light may not be adjusted) or blue quantum dots. When the third sub-filling portion is composed of blue quantum dots, blue light of a first wavelength can be converted into blue light of a second wavelength.

[0075] In some embodiments, the light emitting chip 23 is a mini-LED chip or a micro-LED chip.

[0076] To sum up, the display panel provided by the embodiment of the present invention adopts the above-mentioned filling part 24 to replace the packaging stack (i.e., the diffusion glue layer, the transparent glue layer and the black glue layer) in the related technology, which not only simplifies the structure, but also the filling part 24 can realize multiple functions of the packaging stack, which can not only improve the transmittance of the display panel, but also ensure a sufficient black level. Specifically, the first filling portion 241 located on the side of the light-emitting chip 23 facing away from the substrate 21 can, on the one hand, prevent the light-emitting chip 23 from being squeezed and deformed. On the other hand, because the first filling portion 241 is transparent or translucent to visible light and its thickness between the transparent cover plate 22 and the light-emitting chip 23 is smaller than that of the second filling portion 242, and the smaller the thickness, the higher the transmittance, the transparent or translucent first filling portion 241 has a higher transmittance. At the same time, the second filling portion 242 located between two adjacent light-emitting chips 23 is translucent or opaque to visible light and has a greater thickness than the first filling portion 241, so its transmittance is lower than that of the first filling portion 241, thereby ensuring a sufficient black level. As can be seen from the above, the combined use of the first filling portion 241 and the second filling portion 242 not only improves the transmittance of the display panel but also ensures a sufficient black level.

[0077] As another technical solution, embodiments of the present invention further provide a spliced ​​display module comprising a plurality of the aforementioned display panels provided in embodiments of the present invention, the plurality of display panels being arranged in an array. By employing the aforementioned display panels provided in embodiments of the present invention, the plurality of display panels can not only improve the transmittance of the display panels but also ensure a sufficient black level.

[0078] It should be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and essence of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: The invention comprises a substrate, a transparent cover, a filling part and a plurality of light-emitting chips, wherein the plurality of light-emitting chips and the filling part are both located between the substrate and the transparent cover; the filling part comprises a first filling part and a second filling part, wherein the first filling part is located on a side of the light-emitting chip away from the substrate; and the second filling part is located between two adjacent light-emitting chips; The first filling portion is transparent or translucent to visible light, and the second filling portion is translucent or opaque to visible light.

2. The display panel according to claim 1, characterized in that: The substrate includes a driving circuit and a pad, and the light-emitting chip includes a pin, and the pin is fixedly connected to the pad; The driving circuit provides a driving signal to the light-emitting chip through the pad.

3. The display panel according to claim 1, characterized in that: The first filling part is arranged in contact with the second filling part; The second filling part is in contact with the transparent cover plate and the substrate respectively; the first filling part is in contact with the light emitting chip and the transparent cover plate respectively.

4. The display panel according to claim 3, characterized in that: The orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip on the plane where the transparent cover plate is located.

5. The display panel according to claim 3, characterized in that: The orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the orthographic projection of the light emitting area of ​​the light emitting chip on the plane where the transparent cover plate is located.

6. The display panel according to any one of claims 1 to 5, characterized in that: The second filling part includes a matrix and a light-absorbing material mixed in the matrix, and the light-absorbing material includes at least one of light-absorbing particles and light-absorbing dyes.

7. The display panel according to claim 6, characterized in that: The second filling part also includes scattering particles mixed in the matrix.

8. The display panel according to claim 6, characterized in that: The matrix is ​​an ultraviolet curing product or a thermal curing product.

9. The display panel according to claim 6, characterized in that: The first filling part and the second filling part are made of the same material.

10. The display panel according to claim 9, characterized in that: The transmittance of the first filling portion is in the range of 45% to 80%; The transmittance of the second filling part is in the range of 10% to 20%.

11. The display panel according to claim 9, characterized in that: The thickness of the first filling portion is in a range of greater than or equal to 20 μm.

12. The display panel according to claim 6, characterized in that: The first filling portion is transparent to visible light; The light-emitting chips are arranged in one-to-one correspondence with the first filling parts, and the volume V of the first filling part corresponding to each light-emitting chip satisfies: V = k × S × H1; Wherein, S is the area of ​​the light-emitting region of the light-emitting chip; H1 is the thickness of the first filling portion, the value range of H1 is greater than or equal to 20 μm, k is greater than or equal to 0.5, and less than is equal to 1.

5.

13. The display panel according to claim 6, characterized in that: The multiple light-emitting chips are all blue light chips; The first filling portion includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion; The first sub-filling portion includes a first color conversion material, which converts blue light into red light; the second sub-filling portion includes a second color conversion material, which converts blue light into green light; and the third sub-filling portion is configured to transmit blue light.

14. The display panel according to claim 1, characterized in that: The filling part further includes a third filling part arranged around the light emitting chip; The third filling portion is located between the second filling portion and the light emitting chip; The third filling part is respectively arranged in contact with the first filling part, the second filling part, and the light-emitting chip; The first filling part and the third filling part are made of the same material.

15. The display panel according to any one of claims 1 to 5, characterized in that: The plurality of light emitting chips are separated by the second filling portion, and the light emitting chips are in direct contact with the second filling portion.

16. The display panel according to any one of claims 1 to 5, characterized in that: The plurality of light emitting chips include a blue light chip, a green light chip and a red light chip; The light-emitting chip is a mini-LED chip or a micro-LED chip.

17. A spliced ​​display module, comprising a plurality of display panels according to any one of claims 1 to 16, wherein the plurality of display panels are arranged in an array.

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