Light-emitting panel, preparation method therefor, and display device

Abstract

A light-emitting panel (11), a preparation method therefor, and a display device (1). The light-emitting panel (11) comprises a first substrate (111), a second substrate (112), a driving circuit layer (113), a plurality of welding pad pairs (114), a plurality of light-emitting devices (115), a plurality of bonding portions (116), and a frame sealant (117). The second substrate (112) is arranged opposite to the first substrate (111). At least one of the first substrate (111) and the second substrate (112) can be deformed. The driving circuit layer (113) is provided on the side of the first substrate (111) close to the second substrate (112). The welding pad pairs (1141) are provided on the side of the driving circuit layer (113) close to the second substrate (112) and are electrically connected to the driving circuit layer (113). The light-emitting devices (115) are provided on the side of the second substrate (112) close to the first substrate (111). Each bonding portion (116) connects a welding pad (114) to a light-emitting device (115) corresponding thereto. The frame sealant (117) is located between the first substrate (111) and the second substrate (112) and connects the first substrate (111) to the second substrate (112), so as to enclose to form a cavity (118). The air pressure in the interior of the cavity (118) is lower than the air pressure on the exterior of the cavity (118).

Description

Luminous panel, manufacturing method thereof, and display device

[0001] This application claims priority to Chinese patent application No. 202310714281.6, filed on June 15, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a light-emitting panel, a manufacturing method thereof, and a display device. Background Art

[0003] Light-emitting devices, as key components of display devices, are widely used in the display field. Submillimeter light-emitting diodes (Mini LEDs) and micro LEDs (Micro LEDs) have attracted widespread attention and application due to their numerous advantages, including self-luminescence, high efficiency, high brightness, high reliability, energy saving, and fast response speed.

[0004] Summary of the Invention

[0005] In one aspect, a light-emitting panel is provided. The light-emitting panel includes a first substrate, a second substrate, a driving circuit layer, multiple pad pairs, multiple light-emitting devices, multiple bonding portions, and a sealant. The second substrate is arranged opposite to the first substrate; at least one of the first substrate and the second substrate can be deformed. The driving circuit layer is arranged on a side of the first substrate close to the second substrate. Multiple pad pairs are arranged on a side of the driving circuit layer close to the second substrate and are electrically connected to the driving circuit layer; the pad pairs include two pads. Multiple light-emitting devices are arranged on a side of the second substrate close to the first substrate; the multiple light-emitting devices are respectively arranged corresponding to the multiple pad pairs. The bonding portions are located between the pads and the corresponding light-emitting devices, and connect the pads and the corresponding light-emitting devices. The sealant is located between the first substrate and the second substrate, and connects the first substrate and the second substrate to enclose a cavity; the air pressure inside the cavity is lower than the air pressure outside the cavity.

[0006] In some embodiments, the interior of the cavity is vacuum-set.

[0007] In some embodiments, along a direction perpendicular to the thickness of the light-emitting panel, the size of the frame sealant is positively correlated with the area of ​​the light-emitting surface of the light-emitting panel.

[0008] In some embodiments, the first substrate is made of glass and has a thickness ranging from 0.1 mm to 0.4 mm; or the first substrate is made of polyimide. And / or the second substrate is made of glass and has a thickness ranging from 0.1 mm to 0.4 mm; or the second substrate is made of transparent polyimide.

[0009] In some embodiments, there is a negative correlation between the thickness of at least one of the first substrate and the second substrate and the distribution density of the plurality of light-emitting devices.

[0010] In some embodiments, the material of the bonding portion includes at least one of tin and indium.

[0011] In some embodiments, the light-emitting panel further includes a dimming structure, and the dimming structure is disposed on a side of the second substrate away from the first substrate.

[0012] In some embodiments, the light-emitting panel includes a first light-shielding layer, which is disposed on a side of the second substrate close to the first substrate; the first light-shielding layer has a plurality of openings, and the plurality of light-emitting devices are respectively located in the plurality of openings.

[0013] On the other hand, a method for preparing a light-emitting panel is provided. The preparation method includes: providing a first substrate. Forming a driving circuit layer on the first substrate. Forming a pair of solder pads on a side of the driving circuit layer away from the first substrate, the solder pad pair being electrically connected to the driving circuit layer, the solder pad pair including two solder pads. Providing a second substrate. Fixing a light-emitting device on the second substrate. Forming a bonding portion on the solder pad or the light-emitting device. Flipping the second substrate so that the plurality of light-emitting devices are aligned with the plurality of solder pads, respectively. Disposing a frame sealant between the first substrate and the second substrate. Aligning the first substrate and the second substrate in a vacuum bonding system to form a panel box. Heating the panel box and increasing the air pressure outside the panel box.

[0014] In some embodiments, the material of the first substrate comprises polyimide; before forming the driving circuit layer on the first substrate, the preparation method further comprises: providing a first supporting substrate, disposing the first supporting substrate on a side of the first substrate away from the driving circuit layer to form the first supporting substrate; after aligning the first substrate and the second substrate in a vacuum bonding system to form a panel box, the preparation method further comprises: peeling the first supporting substrate from the first substrate using a peeling technique. And / or, the material of the second substrate comprises transparent polyimide; before forming the light-emitting device on the second substrate, the preparation method further comprises: providing a second supporting substrate, disposing the second supporting substrate on a side of the second substrate away from the light-emitting device to form the second supporting substrate; after aligning the first substrate and the second substrate in a vacuum bonding system to form a panel box, the preparation method further comprises: peeling the second supporting substrate from the second substrate using a peeling technique.

[0015] In some embodiments, along the thickness direction of the light-emitting panel, the size of the sealing glue set between the first substrate and the second substrate is equal to the sum of the average size of the plurality of the pads, the size of the light-emitting device corresponding to the pad, the average size of the plurality of the bonding parts, and the size of the driving circuit layer.

[0016] In some embodiments, fixing the light-emitting device on the second substrate further comprises: fixing an elastic stamp on the second substrate; and fixing the light-emitting device on a side of the elastic stamp away from the second substrate.

[0017] In some embodiments, along the thickness direction of the light-emitting panel, the size of the sealing glue arranged between the first substrate and the second substrate is equal to the sum of the average size of the plurality of the pads, the size of the light-emitting device corresponding to the pad, the average size of the plurality of the bonding portions, the size of the elastic stamp corresponding to the pad, and the size of the driving circuit layer.

[0018] In another aspect, a display device is provided, comprising a light-emitting panel, an array substrate, and a color filter substrate. The light-emitting panel is the light-emitting panel described in the above embodiment. The array substrate is located on the light-emitting side of the light-emitting panel. The color filter substrate is located on a side of the array substrate away from the light-emitting panel.

[0019] On the other hand, a display device is provided, comprising a housing and a light-emitting panel, wherein the light-emitting panel is the light-emitting panel described in any one of the above embodiments, and the light-emitting panel is disposed in the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0021] FIG1 is a structural diagram of a display device according to some embodiments;

[0022] FIG2 is a structural diagram of another display device according to some embodiments;

[0023] FIG3 is a structural diagram of a light emitting panel according to some embodiments;

[0024] FIG4 is a structural diagram of another light-emitting panel according to some embodiments;

[0025] FIG5 is a structural diagram of another light-emitting panel according to some embodiments;

[0026] FIG6 is a structural diagram of another light-emitting panel according to some embodiments;

[0027] FIG7 is a structural diagram of another light-emitting panel according to some embodiments;

[0028] FIG8 is a structural diagram of another light-emitting panel according to some embodiments;

[0029] FIG9 is a structural diagram of another light-emitting panel according to some embodiments;

[0030] FIG10 is a structural diagram of another light-emitting panel according to some embodiments;

[0031] FIG11 is a structural diagram of another light-emitting panel according to some embodiments;

[0032] FIG12 is a structural diagram of another light emitting panel according to some embodiments;

[0033] FIG13 is a structural diagram of another light-emitting panel according to some embodiments;

[0034] FIG14 is a top view of a light emitting panel according to some embodiments;

[0035] FIG15 is a structural diagram of another light-emitting panel according to some embodiments;

[0036] FIG16 is a flow chart of a method for preparing a light-emitting panel according to some embodiments;

[0037] 17A to 17S are structural diagrams corresponding to steps in a method for manufacturing a light-emitting panel according to some embodiments. DETAILED DESCRIPTION

[0038] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0039] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to." In the description of the specification, the terms "some embodiments," "exemplary embodiments," "examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0040] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0041] When describing some embodiments, the word "connected" and its derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connected" can mean fixed connection, detachable connection, or integration; it can be directly connected or indirectly connected through an intermediate medium.

[0042] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0043] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0044] As used herein, "equal" includes the stated conditions and conditions that are similar to the stated conditions, where the range of the similar conditions is within an acceptable range of deviation, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "equal" includes absolute equality and approximate equality, where the acceptable range of deviation for approximate equality can be, for example, that the difference between the two is less than or equal to 5% of either.

[0045] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0046] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0047] With the development of display technology, various display devices have appeared in life. The display devices can provide people with various display services to meet people's needs.

[0048] Based on this, the present disclosure provides a display device, which can be any device that displays either moving (e.g., video) or stationary (e.g., still images), and whether text or images. More specifically, it is contemplated that the embodiments described may be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal digital assistants (PDAs), handheld or portable computers, Global Positioning System (GPS) receivers / navigators, cameras, Moving Picture Experts Group 4 (MP4) video players, camcorders, game consoles, watches, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., speedometer displays), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), and the like.

[0049] In some embodiments, the display device may be an LCD (Liquid Crystal Display) device.

[0050] In this case, as shown in FIG1 , the display device 1 may include a light-emitting panel 11, an array substrate 12, a color filter substrate 13, and a liquid crystal layer 14. The array substrate 12 is located on the light-emitting side of the light-emitting panel 11. The color filter substrate 13 is located on the side of the array substrate 12 away from the light-emitting panel 11. The liquid crystal layer 14 is located between the color filter substrate 13 and the array substrate 12.

[0051] It is understood that the light-emitting panel 11 can also be referred to as a backlight module, which is used to provide backlight. For example, the backlight provided by the light-emitting panel 11 can be white light or blue light, which is not specifically limited in this disclosure. The light-emitting side of the light-emitting panel 11 refers to the side from which the light-emitting panel 11 emits light.

[0052] For example, the array substrate 12 may include a plurality of transistors and a plurality of pixel electrodes, wherein the plurality of transistors may be arranged in an array shape, wherein the plurality of transistors are electrically connected to the plurality of pixel electrodes in a one-to-one correspondence, and the transistors transmit pixel voltages to the corresponding pixel electrodes.

[0053] Exemplarily, the color filter substrate 13 may include a variety of color filters. For example, if the backlight provided by the light-emitting panel 11 is white light, the color filters may include a red filter, a green filter, and a blue filter. For example, a red filter may only transmit red light from the incident light, a green filter may only transmit green light from the incident light, and a blue filter may only transmit blue light from the incident light. For another example, if the backlight provided by the light-emitting panel 11 is blue light, the color filters may also include a red filter and a green filter.

[0054] Exemplarily, the display device 1 further includes a common electrode. The common electrode can receive a common voltage. The common electrode can be disposed in the color filter substrate 13 or in the array substrate 12, which is not specifically limited in this disclosure.

[0055] For example, the liquid crystal layer 14 includes a plurality of liquid crystal molecules. For example, an electric field may be formed between the pixel electrode and the common electrode, and the liquid crystal molecules may be deflected under the action of the electric field.

[0056] With the above arrangement, when the display device 1 is working, the light emitting panel 11 can emit light, and then the light will sequentially pass through the array substrate 12 , the liquid crystal layer 14 and the color filter substrate 13 , and finally realize image display.

[0057] Specifically, when light strikes the liquid crystal layer 14, the liquid crystal molecules are deflected by the electric field formed between the pixel electrode and the common electrode, thereby changing the amount of light passing through the liquid crystal molecules so that the light emitted after passing through the liquid crystal molecules reaches a preset brightness. Then, as the light passes through the color filter substrate 13, it passes through different color filters and emits light of different colors, such as red, blue, and green. These colors of light complement each other to achieve a display.

[0058] In other embodiments, the display device 1 may also be a LED (Light Emitting Diode) display device.

[0059] In this case, as shown in Fig. 2, the display device 1 may include a housing 15 and a light emitting panel 11, wherein the light emitting panel 11 is disposed in the housing 15. The light emitting panel 11 itself can emit light to realize image display.

[0060] The housing 15 should have a certain strength so as to provide support and protection for the light emitting panel 11. For example, the housing 15 may be made of plastic.

[0061] In some embodiments, as shown in FIG3 , the light-emitting panel 11 includes a first substrate 111, a second substrate 112, a driving circuit layer 113, and a plurality of light-emitting devices 115. The first substrate 111 and the second substrate 112 are disposed opposite each other, and the driving circuit layer 113 is disposed on a side of the first substrate 111 close to the second substrate 112. The light-emitting devices 115 are disposed on a side of the second substrate 112 close to the first substrate 111, and are electrically connected to the driving circuit layer 113.

[0062] It can be understood that the first substrate 111 can provide support for the driving circuit layer 113 .

[0063] By way of example, the material of the first substrate 111 may include glass, which has high hardness and good light transmittance. Alternatively, the material of the first substrate 111 may also include PI (Polyimide). PI has advantages such as high temperature resistance and good flexibility. By way of example, the material of the second substrate 112 may include glass. Alternatively, the material of the second substrate 112 may also include CPI (Colorless Polyimide). CPI has advantages such as high temperature resistance, good flexibility, and good light transmittance.

[0064] For example, the dimensions of the first substrate 111 and the second substrate 112 can be selected based on actual conditions. For example, the length of the first substrate 111 is 470 mm and the width is 370 mm; or the length of the first substrate 111 is 1850 mm and the width is 1500 mm. Alternatively, any other suitable dimensions can be used and can be manufactured according to specific needs.

[0065] Among them, the length of the first substrate 111 can be consistent with the length of the second substrate 112, or they can have a certain deviation; the width of the first substrate 111 can be consistent with the width of the second substrate 112, or they can have a certain deviation, but this deviation should not affect the normal function of the light-emitting panel 11.

[0066] It is understandable that the driving circuit layer 113 may be of various types, which are specifically related to the driving method of the light-emitting device 115 and may be selected and set according to actual needs.

[0067] In some examples, as shown in FIG4 , the light emitting device 115 is driven by active driving. Accordingly, the driving circuit layer 113 is an AM (Active Matrix) circuit layer.

[0068] Specifically, when the driving circuit layer 113 is an AM circuit layer, as shown in FIG4 , the driving circuit layer 113 includes a plurality of pixel driving circuits 1130. The structures of the pixel driving circuits 1130 include various types and can be selected based on actual needs. For example, the structure of the pixel driving circuit 1130 includes, but is not limited to, a "3T1C," "6T1C," "7T1C," "6T2C," or "7T2C" structure. Here, "T" represents a transistor, and the number preceding "T" represents the number of transistors. "C" represents a storage capacitor, and the number preceding "C" represents the number of storage capacitors.

[0069] 4 shows a thin film transistor (TFT) 1131 as a pixel driver circuit 1130. The driver circuit layer 113 further includes a plurality of common voltage signal lines 1132. The plurality of pixel driver circuits 1130 may be arranged as a plurality of pixel driver circuit columns, and the plurality of pixel driver circuit columns and the plurality of common voltage signal lines may be alternately arranged.

[0070] The thin film transistor 1131 may be a low temperature polysilicon (LTPS) thin film transistor, or an oxide thin film transistor.

[0071] 4 , the driving circuit layer 113 further includes a first buffer layer 1133 disposed between the first substrate 111 and the pixel driving circuit 1130. The first buffer layer 1133 may be made of any suitable material such as SiO2 (silicon dioxide).

[0072] By providing the first buffer layer 1133 , when the first substrate 111 is impacted, the first buffer layer 1133 can slow down the transfer of force, thereby providing protection for the pixel driving circuit 1130 .

[0073] In other examples, the driving mode of the light emitting device 115 is passive driving. Accordingly, the driving circuit layer 113 may also be a PM (Passive Matrix, passive driving) circuit layer.

[0074] Specifically, when the driving circuit layer 113 is a PM circuit layer, as shown in FIG5 , the driving circuit layer 113 includes a conductive layer 1134, which includes a plurality of signal lines 11341. The conductive layer 1134 is disposed on a side of the first substrate 111 close to the second substrate 112. Of course, the driving circuit layer 113 may also include multiple conductive layers 1134, with different types of signal lines 11341 disposed in different conductive layers 1134, but this is not limited in the present embodiment.

[0075] Exemplarily, as shown in FIG5 , the driving circuit layer 113 further includes a second buffer layer 1135 , which is disposed between the first substrate 111 and the conductive layer 1134 . The second buffer layer 1135 is utilized to provide a buffer for the conductive layer 1134 , thereby preventing the conductive layer 1134 from being damaged when the first substrate 111 is subjected to external force.

[0076] The material of the second buffer layer 1135 may include any suitable material such as SiO 2 .

[0077] Exemplarily, the light emitting device 115 may be a Micro LED (Micro Light Emitting Diode) or a Mini LED (Mini Light Emitting Diode).

[0078] For example, the structure of the light emitting device 115 may be any one of a face-up structure, a vertical structure or a flip-chip structure. For ease of description, the following description will take the flip-chip structure of the light emitting device 115 as an example.

[0079] In addition, for the convenience of subsequent description, the following description is made by taking the driving circuit layer 113 as an AM circuit layer as an example.

[0080] In some embodiments, as shown in FIG6 , the light emitting panel 11 further includes a plurality of pad pairs 114 . The pad pairs 114 are disposed on a side of the driving circuit layer 113 close to the second substrate 112 and are electrically connected to the driving circuit layer 113 . The pad pairs 114 include two pads 1141 .

[0081] Among them, the material of the pad 1141 can include one or more of copper (Cu), nickel (Ni), titanium (Ti), gold (Au), platinum (Pt), aluminum (Al), and silver (Ag), for example, it can be copper, nickel, copper-nickel alloy, copper-aluminum alloy, copper-nickel-platinum alloy, etc.

[0082] It can be understood that the two pads 1141 included in the pad pair 114 can be respectively referred to as a first pad (for example, electrically connected to the pixel driving circuit and used to transmit the driving signal) and a second pad (for example, electrically connected to the common voltage signal line and used to transmit the common voltage signal).

[0083] The plurality of light-emitting devices 115 are disposed correspondingly to the plurality of pad pairs 114, and the light-emitting devices 115 are electrically connected to the corresponding pad pairs 114. For example, the plurality of light-emitting devices 115 correspond one-to-one to the plurality of pad pairs 114, the anode pin of the light-emitting device 115 is electrically connected to the first pad of the corresponding pad pair 114, and the cathode pin of the light-emitting device 115 is electrically connected to the second pad of the corresponding pad pair 114.

[0084] In some embodiments, as shown in Figure 6, the above-mentioned light-emitting panel 11 also includes a plurality of bonding portions 116, and the plurality of bonding portions 116 correspond one-to-one to the plurality of solder pads 1141. Each bonding portion 116 is located between each solder pad 1141 and the corresponding light-emitting device 115, and connects the solder pad 1141 and the corresponding light-emitting device 115.

[0085] Exemplarily, the material of the bonding portion 116 includes at least one of tin (Sn) and indium (In). For example, the material of the bonding portion 116 may include tin or indium, or the material of the bonding portion 116 may also include a tin-indium alloy. The specific material can be selected according to actual conditions.

[0086] When the bonding portion 116 is made of the above-mentioned material, under the action of high temperature, the soldering pad 1141 can undergo a eutectic reaction with the anode pin and the cathode pin of the light-emitting device 115 to bond the soldering pad 1141 and the light-emitting device 115 together, thereby realizing an electrical connection between the soldering pad 1141 and the light-emitting device 115, and then realizing an electrical connection between the driving circuit layer 113 and the light-emitting device 115. In this way, the driving circuit layer 113 can drive the light-emitting device 115 to emit light.

[0087] Since the light-emitting device 115 is generally grown on a sapphire substrate, before bonding the light-emitting device 115 to the pad 1141, it is first necessary to use mass transfer technology to transfer the light-emitting device 115 located on the sapphire substrate to the second substrate 112, and then make the second substrate 112 face the first substrate 111, and finally use wafer bonding technology to make the anode pins and cathode pins of multiple light-emitting devices 115 respectively bonded to the pads 1141 in the corresponding multiple pad pairs 114 on the first substrate 111.

[0088] However, due to the different wiring conditions at different positions in the driving circuit layer 113, different pads 1141 located on the driving circuit layer 113 are arranged at different heights. For example, based on the plane where the first substrate 111 is located, the height of the lowest pad 1141 may be only 75% of the height of the highest pad 1141. In this way, when multiple light-emitting devices 115 are bonded to multiple pads 1141 at the same time, there will be a problem that the lower pad 1141 cannot contact the anode pin and cathode pin of the light-emitting device 115. In this way, the lower pad 1141 cannot complete bonding with the corresponding light-emitting device 115, resulting in a low bonding yield.

[0089] In addition, when bonding the light emitting device 115 to the pad 1141, the wafer alignment bonding machine currently used can bond a size of about 6 inches at one time. If a larger light emitting panel 11 is to be bonded, multiple bonding steps are required, which results in low bonding efficiency.

[0090] Based on this, as shown in FIG7 , at least one of the first substrate 111 and the second substrate 112 can be deformed ( FIG7 shows a case where both the first substrate 111 and the second substrate 112 are deformed). The light-emitting panel 11 further includes a sealant 117. The sealant 117 is located between the first substrate 111 and the second substrate 112, and connects the first substrate 111 and the second substrate 112 to form a cavity 118. The air pressure inside the cavity 118 is lower than the air pressure outside the cavity 118.

[0091] Because the pressure inside cavity 118 is lower than the pressure outside cavity 118, the first substrate 111 and the second substrate 112 are subjected to pressure from the external atmosphere, causing at least one of the first substrate 111 and the second substrate 112 to deform. This reduces the average spacing between the first substrate 111 and the second substrate 112, thereby bringing the light-emitting device 115 and the pad 1141 closer together. Because bonding portion 116 is located between the light-emitting device 115 and the pad 1141, when bonding portion 116 contacts both the light-emitting device 115 and the pad 1141, bonding portion 116 can be heated, causing bonding portion 116 to be molten, thereby bonding the light-emitting device 115 to the pad 1141 via bonding portion 116, thereby completing the bonding process.

[0092] Because the different pads 1141 are arranged at different heights, the portions of the first substrate 111 and / or second substrate 112 corresponding to the higher pad pairs 114 will experience slight deformation, allowing the higher pads 1141 to be bonded to the light-emitting device 115. Meanwhile, the portions of the first substrate 111 and / or second substrate 112 corresponding to the lower pad pairs 114 will experience greater deformation, allowing the lower pads 1141 to be bonded to the light-emitting device 115. In other words, both the higher pads 1141 and the lower pads 1141 can be bonded to the light-emitting device 115 using the same pressure, avoiding problems such as solder leaks and cold solder joints. This ensures a high bonding yield.

[0093] At the same time, since the cavity 118 is a sealed environment, external moisture can be prevented from entering the cavity 118 , thereby preventing moisture from corroding the pad 1141 and the driving circuit layer 113 , thereby extending the service life of the light-emitting panel 11 .

[0094] In addition, since the light-emitting panel 11 in some embodiments of the present application utilizes the external atmosphere to form pressure on the first substrate 111 and the second substrate 112 during bonding, and the sizes of the first substrate 111 and the second substrate 112 are consistent with the sizes of the light-emitting panel 11, when preparing a larger-sized light-emitting panel 11, the bonding can be completed in one go, which has higher bonding efficiency than the current wafer bonding technology.

[0095] For example, as shown in FIG8 , the external structure of the light-emitting panel 11 is shown in which the first substrate 111 is deformed while the second substrate 112 is not deformed. In this case, the second substrate 112 is not deformed, so that the light-emitting device 115 located on the second substrate 112 does not deviate, thereby enabling it to emit light better.

[0096] For example, FIG9 shows an external structure of the light-emitting panel 11 in which the first substrate 111 does not deform, while the second substrate 112 does deform. In this case, the first substrate 111 does not deform, so the driving circuit layer 113 located on the first substrate 111 does not deform, thereby ensuring its electrical performance.

[0097] In order to allow at least one of the first substrate 111 and the second substrate 112 to be deformed, the first substrate 111 and / or the second substrate 112 should be made of a suitable material and have a suitable thickness.

[0098] For example, the first substrate 111 may be made of glass and have a thickness ranging from 0.1 mm to 0.4 mm. In this case, the first substrate 111 has good deformation capability and can avoid breakage when deformed by external pressure.

[0099] For example, the thickness of the first substrate 111 may be 0.1 mm, 0.11 mm, 0.2 mm, 0.21 mm, 0.3 mm, 0.35 mm, or 0.4 mm.

[0100] On this basis, the thickness of the first substrate 111 may be in the range of 0.1 mm to 0.2 mm. Within this range, the deformability and structural reliability of the first substrate 111 can be guaranteed to the greatest extent.

[0101] Alternatively, the material of the first substrate 111 may also include PI, which has good flexibility and can enable the first substrate 111 to have good rollability.

[0102] When the material of the first substrate 111 includes PI, the thickness of the first substrate 111 may be 5 μm to 30 μm, so as to ensure that the first substrate 111 has good flexibility and can be sufficiently deformed when subjected to a certain force.

[0103] For example, the thickness of the first substrate 111 may be 5 μm, 6 μm, 10 μm, 20 μm, 25 μm, or 30 μm, etc. Of course, the thickness of the first substrate 111 may also be any other appropriate value.

[0104] For example, the second substrate 112 is made of glass and has a thickness ranging from 0.1 mm to 0.4 mm. In this case, the second substrate 112 has a high deformability and can avoid breakage when deformed by external pressure.

[0105] For example, the thickness of the second substrate 112 may be 0.1 mm, 0.13 mm, 0.25 mm, 0.27 mm, 0.32 mm, 0.37 mm, or 0.4 mm.

[0106] On this basis, the thickness of the second substrate 112 may be in the range of 0.1 mm to 0.2 mm, within which the deformability and structural reliability of the second substrate 112 can be guaranteed to the greatest extent.

[0107] Alternatively, the material of the second substrate 112 includes CPI. CPI firstly does not affect light extraction, and secondly has good flexibility, which can make the second substrate 112 have good rollability.

[0108] When the material of the second substrate 112 includes CPI, the thickness of the second substrate 112 may be 5 μm to 30 μm, so as to ensure that the second substrate 112 has good flexibility and can be sufficiently deformed when subjected to a certain force.

[0109] For example, the thickness of the second substrate 112 may be 5 μm, 6 μm, 11 μm, 23 μm, 25 μm, or 30 μm, etc. Of course, the thickness of the second substrate 112 may also be any other appropriate value.

[0110] It is understood that the thickness of the first substrate 111 and the second substrate 112 can be the same. For example, the thickness of the first substrate 111 and the second substrate 112 are both 0.15 mm. Alternatively, the thickness of the first substrate 111 and the second substrate 112 are both 0.19 mm.

[0111] Alternatively, the thicknesses of the first substrate 111 and the second substrate 112 may be different.

[0112] For example, the thickness of the first substrate 111 is greater than that of the second substrate 112. Thus, under the same pressure, the deformation of the first substrate 111 is reduced, thereby reducing the deformation of the driving circuit layer 113 on the first substrate 111, thereby ensuring the electrical performance of the driving circuit layer 113.

[0113] For example, the thickness of the first substrate 111 is 0.16 mm, and the thickness of the second substrate 112 is 0.14 mm. Alternatively, the thickness of the first substrate 111 is 0.15 mm, and the thickness of the second substrate 112 is 0.13 mm.

[0114] For example, the thickness of the second substrate 112 is greater than that of the first substrate 111. This can reduce deformation of the second substrate 112, thereby reducing displacement of the light emitting device 115 on the second substrate 112, thereby enabling it to emit light better.

[0115] For example, the thickness of the second substrate 112 is 0.17 mm, while the thickness of the first substrate 111 is 0.13 mm. Alternatively, the thickness of the second substrate 112 is 0.16 mm, while the thickness of the first substrate 111 is 0.13 mm.

[0116] It is understood that the sealant 117 surrounds the first substrate 111 or the second substrate 112 circumferentially to form a sealed space between the first substrate 111 and the second substrate 112 . This sealed space is the cavity 118 . The driving circuit layer 113 , the pad pair 114 , the light-emitting device 115 , and the bonding portion 116 are all disposed within the cavity 118 .

[0117] In some embodiments, the interior of the cavity 118 is vacuum-set. Thus, when the air pressure outside the cavity 118 is a standard atmospheric pressure, that is, when the first substrate 111 and the second substrate 112 are placed in a normal atmospheric environment, the air pressure inside the cavity 118 is lower than the air pressure outside the cavity 118. At this time, the external atmosphere will form pressure on the first substrate 111 and the second substrate 112, which will squeeze the first substrate 111 and the second substrate 112, causing the first substrate 111 and / or the second substrate 112 to deform, so that the uneven solder pads 1141 can all be bonded to the corresponding light-emitting devices 115, thereby improving the bonding yield between the solder pads 1141 and the light-emitting devices 115. This eliminates the need to intentionally apply external force to the first substrate 111 and / or the second substrate 112.

[0118] In addition, if the air pressure outside the cavity 118 is one standard atmospheric pressure, then the force acting on the first substrate 111 and the second substrate 112 will be less than or equal to the force acting on them by one standard atmospheric pressure. In this way, the pressure acting on the driving circuit layer 113 will be very small, which can avoid damage to the thin film transistor 1131 in the driving circuit layer 113, so as to avoid affecting its threshold voltage and ensure its electrical performance.

[0119] At the same time, since the interior of the cavity 118 is a vacuum environment, the oxygen content therein is low or no oxygen, which can prevent oxygen from corroding the pad 1141 and the driving circuit layer 113, thereby extending the service life of the light-emitting panel 11.

[0120] It is understood that the higher the vacuum level inside the cavity 118, the better. This is because when the vacuum level inside the cavity 118 is higher, the pressure actually transmitted to the bonding surface between the light-emitting device 115 and the pad 1141 will be greater, which can make the pad 1141 and the light-emitting device 115 bonded more tightly together, thereby increasing the bonding strength between the two, better bonding the light-emitting device 115 to the pad 1141, and ensuring a stable electrical connection between the two.

[0121] Of course, when the interior of the cavity 118 is set to a vacuum, the external air pressure may also be greater than one standard atmospheric pressure, or less than one standard atmospheric pressure, as long as the air pressure inside the cavity 118 is less than the air pressure outside the cavity 118.

[0122] In some embodiments, there is a negative correlation between the thickness of at least one of the first substrate 111 and the second substrate 112 and the distribution density of the plurality of light-emitting devices 115 .

[0123] It can be understood that there is a negative correlation between the thickness of at least one of the first substrate 111 and the second substrate 112 and the distribution density of the multiple light-emitting devices 115, which means that: the thickness of at least one of the first substrate 111 and the second substrate 112 decreases as the distribution density of the multiple light-emitting devices 115 increases; or, the thickness of at least one of the first substrate 111 and the second substrate 112 increases as the distribution density of the multiple light-emitting devices 115 decreases.

[0124] The negative correlation may be a negative correlation at a fixed ratio, or a negative correlation at a non-fixed ratio.

[0125] It can be understood that when the first substrate 111 and the second substrate 112 are subjected to pressure, the greater the distribution density of the light-emitting devices 115, the smaller the force exerted by a single light-emitting device 115 on the first substrate 111 and the second substrate 112. In this way, the thickness of the first substrate 111 and / or the second substrate 112 can be made thinner, thereby reducing the thickness of the light-emitting panel 11, so that the light-emitting panel 11 is lighter and thinner as a whole.

[0126] If the distribution density of the light-emitting devices 115 is small, the force exerted by a single light-emitting device 115 on the first substrate 111 and the second substrate 112 will be greater. In this way, the thickness of the first substrate 111 and / or the second substrate 112 can be made thicker to avoid the first substrate 111 and the second substrate 112 from being broken.

[0127] In some embodiments, the size of the sealant 117 is positively correlated with the area of ​​the light emitting surface of the light emitting panel 11 along a direction perpendicular to the thickness of the light emitting panel 11. The light emitting surface of the light emitting panel 11 refers to the side of the light emitting panel 11 that emits light.

[0128] In the thickness direction perpendicular to the light emitting panel 11 , the size of the frame sealant 117 may be between 1 mm and 4 mm.

[0129] For example, the size of the sealant 117 may be 1 mm, 1.5 mm, 2.5 mm, 3.5 mm, or 4 mm.

[0130] It can be understood that the positive correlation between the size of the frame sealant 117 and the area of ​​the light-emitting surface of the light-emitting panel 11 means that, along the thickness direction perpendicular to the light-emitting panel 11, the size of the frame sealant 117 increases as the area of ​​the light-emitting surface of the light-emitting panel 11 increases. Alternatively, along the thickness direction perpendicular to the light-emitting panel 11, the size of the frame sealant 117 decreases as the area of ​​the light-emitting surface of the light-emitting panel 11 decreases.

[0131] The positive correlation may be a positive correlation at a fixed ratio, or a positive correlation at a non-fixed ratio.

[0132] In this way, when the light-emitting surface of the light-emitting panel 11 has a large area, even if the size of the frame sealant 117 is relatively thick in the direction perpendicular to the thickness of the light-emitting panel 11, the area of ​​the vertical projection of the frame sealant 117 on the first substrate 111 accounts for a small proportion of the area of ​​the light-emitting surface of the light-emitting panel 11. This will prevent the black border formed by the frame sealant 117 from appearing too wide. This can ensure the aesthetics of the light-emitting panel 11 and achieve a narrow frame design.

[0133] At the same time, since the size of the frame sealing glue 117 is larger at this time, the contact area between the frame sealing glue 117 and the first substrate 111 and the second substrate 112 is larger, which can increase the stability of the connection and sealing between the frame sealing glue 117 and the first substrate 111, and at the same time, increase the stability of the connection and sealing between the frame sealing glue 117 and the second substrate 112.

[0134] When the light emitting surface of the light emitting panel 11 is small, the size of the frame sealant 117 can be made smaller along the thickness direction perpendicular to the light emitting panel 11 , thereby preventing the black border from being too wide and achieving a narrow frame design.

[0135] In some embodiments, the area of ​​the first substrate 111 is positively correlated with the thickness of the first substrate 111 .

[0136] The positive correlation may be a positive correlation at a fixed ratio, or a positive correlation at a non-fixed ratio.

[0137] When the first substrate 111 is in an environment with a stable atmospheric pressure, the pressure exerted on the first substrate 111 is positively correlated with the area of ​​the first substrate 111 subjected to the force. That is, the larger the area of ​​the first substrate 111, the greater the pressure exerted on the first substrate 111. Therefore, the first substrate 111 can be thicker to ensure the structural strength of the first substrate 111. Similarly, the smaller the area of ​​the first substrate 111, the less pressure exerted on the first substrate 111. Therefore, the first substrate 111 can be thinner, thereby ensuring the lightness and thinness of the light-emitting panel 11.

[0138] In some embodiments, the area of ​​the second substrate 112 is positively correlated with the thickness of the second substrate 112 .

[0139] The positive correlation may be a positive correlation at a fixed ratio, or a positive correlation at a non-fixed ratio.

[0140] When the second substrate 112 is in an environment with a stable atmospheric pressure, the pressure exerted on the second substrate 112 is positively correlated with the area of ​​the second substrate 112 subjected to the force. That is, the larger the area of ​​the second substrate 112, the greater the pressure exerted on the second substrate 112. Therefore, the second substrate 112 can be thicker to ensure the structural strength of the second substrate 112. Similarly, the smaller the area of ​​the second substrate 112, the less pressure exerted on the second substrate 112. Therefore, the second substrate 112 can be thinner, thereby ensuring a lightweight and thin light-emitting panel 11.

[0141] In some embodiments, as shown in FIG10 , the light-emitting panel 11 further includes a first light-shielding layer 119, which is disposed on a side of the second substrate 112 adjacent to the first substrate 111. The first light-shielding layer 119 has multiple openings, and the multiple light-emitting devices 115 are respectively located within the multiple openings. The first light-shielding layer 119 absorbs light emitted by the light-emitting devices 115 toward their surroundings, thereby preventing color mixing and pixel cross-color phenomena.

[0142] The first light shielding layer 119 may include a black matrix (BM).

[0143] In some embodiments, as shown in FIG11 , the light-emitting panel 11 further includes a dimming structure 120, which is disposed on a side of the second substrate 112 away from the first substrate 111. The dimming structure 120 is disposed on the second substrate 112 to regulate light output, for example, to adjust the angle and brightness of the light output.

[0144] For example, as shown in FIG12 , the dimming structure 120 may include a plurality of lens structures 122. The plurality of lens structures 122 correspond one-to-one to the plurality of light-emitting devices 115, and the lens structures 122 are arranged directly opposite to the corresponding light-emitting devices 115. By adjusting the angle of light emission through the lens structures 122, the viewing angle can be adjusted to increase the viewing angle when needed.

[0145] Alternatively, as shown in FIG13 , the dimming structure 120 may also include a grating structure 121 . The grating structure 121 may adjust the angle of light emission, thereby adjusting the viewing angle to increase the viewing angle when needed.

[0146] For example, as shown in Figures 12, 13, and 14, the dimming structure 120 may further include a second light-shielding layer 123, which is disposed on a side of the second substrate 112 away from the first substrate 111. The second light-shielding layer 123 has a plurality of through holes, which correspond one-to-one to the plurality of light-emitting devices 115, such that the through holes are directly opposite to the corresponding light-emitting devices 115.

[0147] By providing the second light shielding layer 123 , the second light shielding layer 123 can absorb the light emitted from the light emitting device 115 to its surroundings, so as to prevent the occurrence of color mixing and pixel cross-color phenomena.

[0148] The second light shielding layer 123 may include a black matrix (BM).

[0149] It can be understood that the above-mentioned first shading layer 119, lens structure 122, grating structure 121 and second shading layer 123 can be set according to actual needs. The light-emitting panel 11 in this application can include one, any two, any three or four of the above four.

[0150] In some embodiments, the light emitting panel 11 may further include a plurality of sensors disposed on the second substrate 112. The sensors are provided to control the light emission of the light emitting device 115.

[0151] In some embodiments, as shown in FIG. 15 , the light emitting panel 11 may further include a plurality of spacers 124 . The spacers 124 are disposed between the first light shielding layer 119 and the driving circuit layer 113 , and one end of the spacers 124 is connected to the driving circuit layer 113 .

[0152] By providing the spacers 124 , the spacers 124 are used to provide certain support for the first light shielding layer 119 and the second substrate 112 , so as to prevent a portion of the second substrate 112 where the light emitting device 115 is not provided from being greatly deformed.

[0153] It can be understood that the provision of the spacer 124 cannot affect the bonding between the light emitting device 115 and the pad 1141 , and cannot affect the provision of the vacuum environment inside the cavity 118 .

[0154] The present disclosure further provides a method for preparing a light-emitting panel 11 , as shown in FIG16 , the method includes: S100 to S1000 .

[0155] S100: As shown in FIG17A , a first substrate 111 is provided.

[0156] For example, the material of the first substrate 111 may include glass, and the thickness of the first substrate 111 may be between 0.1 mm and 0.4 mm. Furthermore, the thickness of the first substrate 111 may be between 0.1 mm and 0.2 mm.

[0157] Alternatively, the material of the first substrate 111 may also include PI.

[0158] S200 : As shown in FIG. 17B , a driving circuit layer 113 is formed on the first substrate 111 .

[0159] For example, the driving circuit layer 113 may be an AM circuit layer or a PM circuit layer. Please refer to the above description for details, which will not be repeated here.

[0160] S300 : As shown in FIG17C , a pad pair 114 is formed on a side of the driving circuit layer 113 away from the first substrate 111 . The pad pair 114 is electrically connected to the driving circuit layer 113 and includes two pads 1141 .

[0161] The number and height of the pads 1141 can be set as needed.

[0162] Illustratively, the pad 1141 may be formed on the driving circuit layer 113 by using an etching process. For example, the etching may be dry etching or wet etching.

[0163] Exemplarily, the material of the pad 1141 may include one or more of copper (Cu), nickel (Ni), titanium (Ti), gold (Au), platinum (Pt), aluminum (Al), and silver (Ag), that is, copper, nickel, copper-nickel alloy, copper-aluminum alloy, copper-nickel-platinum alloy, and the like.

[0164] S400: As shown in FIG17D , a second substrate 112 is provided.

[0165] For example, the material of the second substrate 112 may include glass, and the thickness of the second substrate 112 may be between 0.1 mm and 0.4 mm. Furthermore, the thickness of the second substrate 112 may be between 0.1 mm and 0.2 mm.

[0166] Alternatively, the material of the second substrate 112 may include CPI.

[0167] For example, the first substrate 111 and the second substrate 112 have the same thickness and are made of the same material, so that when the first substrate 111 and the second substrate 112 are subjected to the same pressure, the first substrate 111 and the second substrate 112 can undergo the same deformation, thereby achieving better bonding.

[0168] S500 : As shown in FIG. 17E , the light emitting device 115 is fixed on the second substrate 112 .

[0169] Exemplarily, the light-emitting device 115 may be a Micro LED or a Mini LED.

[0170] It is understandable that the number of light-emitting devices 115 is generally multiple, and can be set according to needs. Multiple light-emitting devices 115 can be arranged in an array on the second substrate 112, or multiple light-emitting devices can also be set on the second substrate 112 in a random arrangement.

[0171] For example, when the light emitting device 115 is fixed, the lamp bead portion of the light emitting device 115 (ie, the portion excluding the anode pin and the cathode pin of the light emitting device 115 ) may be fixed to the second substrate 112 .

[0172] Since the light-emitting device 115 is generally grown on a sapphire substrate, in order to transfer the light-emitting device 115 on the sapphire substrate to the second substrate 112, a mass transfer technology is generally used. For example, the mass transfer technology can be a pick-up and release technology of an elastic stamp, which uses the van der Waals force to absorb the light-emitting device 115 from the sapphire substrate and then transfers it to the second substrate 112 for release, thereby transferring the light-emitting device 115 on the sapphire substrate to the second substrate 112.

[0173] In this case, in order to fix the light emitting device 115 on the second substrate 112, as shown in FIG. 17F, fixing the light emitting device 115 on the second substrate 112 includes S510 to S520.

[0174] S510: Fix the elastic stamp 125 on the second substrate 112.

[0175] S520 : Fixing the light emitting device 115 on the side of the elastic stamp 125 away from the second substrate 112 .

[0176] By providing the elastic stamp 125 , the light emitting device 115 can be adsorbed by the elastic stamp 125 , thereby fixing the light emitting device 115 on the second substrate 112 .

[0177] The elastic stamp 125 can be disposed on the second substrate 112 by injection molding.

[0178] For example, in order to fix the light-emitting device 115 on the second substrate 112, the light-emitting device 115 can also be directly fixed on the second substrate 112. For example, the light-emitting device 115 can be adhered to the second substrate 112 using optical adhesive or the like. Of course, other suitable methods can also be used to achieve the fixing of the light-emitting device 115.

[0179] For example, the mass transfer technology may also be laser dissociation technology, fluid transfer technology, etc. When the above technologies are used, there is no need to use an elastic stamp.

[0180] S600 : as shown in FIG. 17G , forming a bonding portion 116 on the pad 1141 ; or, as shown in FIG. 17H , forming a bonding portion 116 on the light emitting device 115 .

[0181] It can be understood that when the bonding portion 116 is disposed on the light emitting device 115 , the bonding portion 116 can be disposed on the anode pin and the cathode pin of the light emitting device 115 .

[0182] Illustratively, the material of the bonding portion 116 includes at least one of tin (Sn) and indium (In). For example, the material of the bonding portion 116 may include tin (Sn) or indium (In). Alternatively, the material of the bonding portion 116 may include a tin alloy or an indium alloy. The specific material can be selected based on actual conditions.

[0183] For example, when setting the bonding portion 116 on the solder pad 1141 or the light-emitting device 115, the bonding portion 116 can be first heated by a bonding instrument, and then the bonding portion 116 is put into a molten state, and then the bonding portion 116 is placed on the solder pad 1141 or the light-emitting device 115. After the bonding portion 116 cools down, the bonding portion 116 can be fixed together with the solder pad 1141 or the light-emitting device 115, thereby realizing the production of the bonding portion 116.

[0184] For ease of description, the following description is given assuming that the bonding portion 116 is formed on the pad 1141 .

[0185] S700 : As shown in FIG. 17I , the second substrate 112 is turned over so that the plurality of light-emitting devices 115 are respectively opposite to the plurality of pad pairs 114 .

[0186] Specifically, the anode pin of the light emitting device 115 is aligned with one of the pads 1141 in the pad pair 114 , and the cathode pin of the light emitting device 115 is aligned with the other pad 1141 in the pad pair 114 .

[0187] S800 : As shown in FIG. 17J and FIG. 17K , a sealing adhesive 117 is provided between the first substrate 111 and the second substrate 112 .

[0188] For example, to dispose the sealant 117 between the first substrate 111 and the second substrate 112, as shown in FIG17J , the sealant 117 may be first bonded to the first substrate 111. Alternatively, as shown in FIG17K , the sealant 117 may be bonded to the second substrate 112.

[0189] For example, the sealant 117 can be bonded to the one with higher hardness between the first substrate 111 and the second substrate 112. In this way, when the sealant 117 is set, the first substrate 111 or the second substrate 112 can provide sufficient support for the sealant 117. This can facilitate the setting and bonding of the sealant 117.

[0190] For example, when the hardness of the first substrate 111 and the second substrate 112 are equal, the frame sealing glue 117 can be disposed on either the first substrate 111 or the second substrate 112 .

[0191] S900: As shown in FIG17L , the first substrate 111 and the second substrate 112 are assembled into a box in a vacuum assembly system (VAS) to form a panel box.

[0192] It will be appreciated that the cavity 118 is located within the panel box.

[0193] For example, when the sealing glue 117 is bonded to the first substrate 111, in order to achieve the box-matching of the first substrate 111 and the second substrate 112, the first substrate 111 and the second substrate 112 can be brought close to each other. When the sealing glue 117 contacts the second substrate 112, the second substrate 112 and the sealing glue 117 are also bonded together by thermal curing or ultraviolet light curing.

[0194] Similarly, when the sealing glue 117 is bonded to the second substrate 112, in order to achieve the box-matching of the first substrate 111 and the second substrate 112, the first substrate 111 and the second substrate 112 can be brought close to each other. When the sealing glue 117 contacts the first substrate 111, the first substrate 111 and the sealing glue 117 are also bonded together by thermal curing or ultraviolet light curing.

[0195] For example, in order to put the vacuum bonding system into a vacuum state, a molecular pump may be used to evacuate the vacuum bonding system.

[0196] S1000: As shown in FIG17M , the panel box is heated and the air pressure outside the panel box is increased.

[0197] It is understood that when the panel box is heated, the heating temperature should be such that the bonding portion 116 is in a molten state. The temperature setting should be set according to the material of the bonding portion 116.

[0198] For example, the panel box may be placed in a heating device having a heating cavity for heating.

[0199] For example, when the material of the bonding portion 116 includes tin (Sn), the temperature in the heating chamber may be approximately 250° C. Alternatively, when the material of the bonding portion 116 includes indium (In), the temperature in the heating chamber may be approximately 160° C.

[0200] Since the bonding portion 116 is in a molten state and since the first substrate 111 and / or the second substrate 112 are subjected to pressure at this time, as shown in FIG17M , the first substrate 111 and / or the second substrate 112 will deform to squeeze the bonding portion 116, so that the pad 1141 can be bonded to the light-emitting device 115 through the bonding portion 116.

[0201] During the bonding process, the portion of the first substrate 111 and / or the second substrate 112 corresponding to the higher portion of the pad 1141 undergoes minor deformation, allowing the higher portion of the pad 1141 to be bonded to the light-emitting device 115. The portion of the first substrate 111 and / or the second substrate 112 corresponding to the lower portion of the pad 1141 undergoes significant deformation, allowing the lower portion of the pad 1141 to be bonded to the light-emitting device 115. In other words, both the higher portion of the pad 1141 and the lower portion of the pad 1141 can be bonded to the light-emitting device 115 using the same pressure, thereby avoiding problems such as solder leaks and cold solder joints, thereby ensuring the bonding yield of the light-emitting device 115.

[0202] In addition, since the pressure generated by the external atmosphere is applied to the first substrate 111 and the second substrate 112 during bonding, and the size of the first substrate 111 and the second substrate 112 is consistent with the size of the light-emitting panel 11, when preparing a larger-sized light-emitting panel 11, for example, 100 inches, the bonding can be completed in one go, which has a higher bonding efficiency than the current wafer bonding technology.

[0203] It is understood that S400 to S500 can also be performed before S100 to S300. That is, the second substrate 112 can be provided first, and the light-emitting device 115 and the like can be fabricated on the second substrate 112. Then, the first substrate 111 can be provided, and the driving circuit layer 113, the pad pairs 114 and the like can be fabricated on the first substrate 111. Alternatively, S400 to S500 can be performed simultaneously with S100 to S300.

[0204] In some embodiments, when the material of the first substrate 111 includes polyimide, in order to facilitate the disposition of the driving circuit layer 113 , before manufacturing the driving circuit layer 113 on the first substrate 111 , as shown in FIG. 17N , the preparation method further includes: S190 .

[0205] S190 : providing a first supporting substrate 126 , and disposing the first supporting substrate 126 on a side of the first substrate 111 away from the driving circuit layer 113 .

[0206] It is understandable that the hardness of the first support substrate 126 should be greater than that of the first substrate 111 , so that the first support substrate 126 can provide support for the first substrate 111 to ensure that the driving circuit layer 113 can be successfully fabricated on the first substrate 111 .

[0207] For example, the first support substrate 126 may be made of glass, or any other suitable material.

[0208] In this case, after the first substrate 111 and the second substrate 112 are aligned in a vacuum bonding system to form a panel box, as shown in FIG. 17O and FIG. 17P , the preparation method provided by the present disclosure further includes: S910.

[0209] S910: Using a peeling technique, the first support substrate 126 is peeled off from the first substrate 111. This allows external force to directly act on the first substrate 111 when bonding the light-emitting device 115 to the pad 1141, thereby ensuring that the first substrate 111 can be deformed, thereby allowing the light-emitting device 115 to be bonded to the pad 1141.

[0210] For example, the lift-off technique may be laser lift-off (LLO), or any other suitable lift-off technique.

[0211] In some embodiments, when the material of the second substrate 112 includes transparent polyimide, in order to facilitate the arrangement of the light-emitting device 115 , before fixing the light-emitting device 115 on the second substrate 112 , as shown in FIG. 17Q , the preparation method provided by the present disclosure further includes: S490 .

[0212] S490 : providing a second support substrate 127 , and disposing the second support substrate 127 on a side of the second substrate 112 away from the light emitting device 115 .

[0213] It is understandable that the hardness of the second support substrate 127 should be greater than the hardness of the second substrate 112 , so that the second support substrate 127 can provide support for the second substrate 112 to ensure that the light-emitting device 115 can be successfully manufactured on the second substrate 112 .

[0214] For example, the second support substrate 127 may be made of glass, or any other suitable material.

[0215] In this case, after the first substrate 111 and the second substrate 112 are aligned in a vacuum bonding system to form a panel box, as shown in FIG. 17R and FIG. 17S , the above-mentioned preparation method further includes: S1200 .

[0216] S1200 : using a peeling technique to peel off the second support substrate 127 from the second substrate 112 .

[0217] For example, the lift-off technique may be laser lift-off (LLO), or any other suitable lift-off technique.

[0218] In some embodiments, when the light-emitting device 115 is fixed to the second substrate 112 via the elastic stamp 125, the size of the sealant 117 disposed between the first substrate 111 and the second substrate 112 along the thickness direction of the light-emitting panel 11 is equal to the sum of the size of the solder pad 1141, the size of the light-emitting device 115 corresponding to the solder pad 1141, the average size of the plurality of bonding portions 116, the size of the elastic stamp 125 corresponding to the solder pad 1141, and the size of the driving circuit layer 113. In other words, the height of the sealant 117 is appropriately adjusted.

[0219] In this way, when the frame-sealing glue 117 is in contact with both the first substrate 111 and the second substrate 112 (but not cured), the distance between the first substrate 111 and the second substrate 112 can be maintained within an appropriate range. Therefore, the larger of the sum of the height of the solder pad 1141 and the height of the bonding portion 116 can be reduced from abutting against the light-emitting device 115, thereby avoiding the support force exerted on the light-emitting device 115 and further exerting support force on the second substrate 112. In this way, the frame-sealing glue 117 can be fully in contact with both the first substrate 111 and the second substrate 112, thereby facilitating the curing of the frame-sealing glue 117 and ensuring the stability of the connection between the frame-sealing glue 117 and the first substrate 111 and the second substrate 112.

[0220] At the same time, when the bonding portion 116 is heated for bonding, since the distance between the first substrate 111 and the second substrate 112 is relatively appropriate, that is, the distance of the light-emitting device 115 will not be too far from the lower part of the multiple pads 1141, so when at least one of the first substrate 111 and the second substrate 112 has just undergone a small degree of deformation, the light-emitting device 115 can contact the lower part of the pad 1141 through the bonding portion 116 and quickly complete the bonding, so that the deformation of the first substrate 111 and / or the second substrate 112 is avoided. Excessive, thereby making the surface of the light-emitting panel 11 smooth.

[0221] It can be understood that in order to obtain the average height of multiple bonding portions 116, the height of each bonding portion 116 can be first measured using an optical instrument, and then the number of bonding portions 116 can be measured. The heights of all bonding portions 116 are added together to obtain the total height value of the bonding portions 116, and then the total height value of the multiple bonding portions 116 is divided by the number of bonding portions 116 to obtain the average height of the bonding portions 116.

[0222] Similarly, in order to obtain the average height of multiple pads 1141, the height of each pad 1141 can be first measured using an optical instrument, and then the number of pads 1141 can be measured. Then, the heights of all pads 1141 can be added together to obtain the total height value of multiple pads 1141, and then the total height value of multiple pads 1141 can be divided by the number of pads 1141 to obtain the average height of pads 1141.

[0223] In other embodiments, when the light-emitting device 115 is directly fixed on the second substrate 112, the size of the sealing glue 117 arranged between the first substrate 111 and the second substrate 112 along the thickness direction of the light-emitting panel 11 is equal to the sum of the size of the pad 1141, the size of the light-emitting device 115 corresponding to the pad 1141, the average size of the multiple bonding portions 116 and the size of the driving circuit layer 113.

[0224] In this way, when the frame sealing glue 117 is in contact with both the first substrate 111 and the second substrate 112 (but not cured), since the distance between the first substrate 111 and the second substrate 112 is relatively appropriate, the larger sum of the height of the solder pad 1141 and the height of the bonding portion 116 can be reduced to abut against the light-emitting device 115, thereby avoiding it from generating a supporting force on the light-emitting device 115 and then generating a supporting force on the second substrate 112. In this way, the frame sealing glue 117 can be fully in contact with both the first substrate 111 and the second substrate 112, thereby facilitating the curing of the frame sealing glue 117 and ensuring the stability of the connection between the frame sealing glue 117 and the first substrate 111 and the second substrate 112.

[0225] At the same time, when the bonding portion 116 is heated for bonding, since the distance between the first substrate 111 and the second substrate 112 will not be too far, that is, the distance of the light-emitting device 115 will not be too far from the lower part of the multiple pads 1141, so when at least one of the first substrate 111 and the second substrate 112 has just undergone a small degree of deformation, the light-emitting device 115 can contact the lower part of the pad 1141 through the bonding portion 116 and quickly complete the bonding, so that the deformation of the first substrate 111 and / or the second substrate 112 is avoided. The surface of the light-emitting panel 11 is smooth.

[0226] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A light-emitting panel, include: a first substrate; A second substrate is arranged opposite to the first substrate; at least one of the first substrate and the second substrate can be deformed; A driving circuit layer is arranged on a side of the first substrate close to the second substrate; A plurality of pad pairs, arranged on a side of the driving circuit layer close to the second substrate and electrically connected to the driving circuit layer; the pad pair includes two pads; A plurality of light-emitting devices are arranged on a side of the second substrate close to the first substrate; the plurality of light-emitting devices are respectively arranged corresponding to the plurality of pad pairs; A plurality of bonding parts, wherein the bonding parts are located between the pads and the light emitting devices corresponding thereto, and connect the pads and the light emitting devices corresponding thereto; The frame sealing glue is located between the first substrate and the second substrate, and connects the first substrate and the second substrate to enclose a cavity; the air pressure inside the cavity is lower than the air pressure outside the cavity.

2. The light emitting panel according to claim 1, in, The interior of the cavity is in a vacuum setting.

3. The light emitting panel according to claim 1, in, Along a thickness direction perpendicular to the light emitting panel, there is a positive correlation between the size of the frame sealant and the area of ​​the light emitting surface of the light emitting panel.

4. The light emitting panel according to claim 1, in, The material of the first substrate includes glass, and the thickness of the first substrate ranges from 0.1 mm to 0.4 mm; or, the material of the first substrate includes polyimide; and / or, The material of the second substrate includes glass, and the thickness of the second substrate ranges from 0.1 mm to 0.4 mm; or, the material of the second substrate includes transparent polyimide.

5. The light emitting panel according to claim 4, in, There is a negative correlation between the thickness of at least one of the first substrate and the second substrate and the distribution density of the plurality of light-emitting devices.

6. The light emitting panel according to claim 1, in, The material of the bonding portion includes at least one of tin and indium.

7. The light emitting panel according to any one of claims 1 to 6, in, The light emitting panel further includes a dimming structure, and the dimming structure is disposed on a side of the second substrate away from the first substrate.

8. The light emitting panel according to any one of claims 1 to 6, in, The light emitting panel comprises a first light shielding layer, and the first light shielding layer is arranged on a side of the second substrate close to the first substrate; The first light shielding layer has a plurality of openings, and the plurality of light emitting devices are respectively located in the plurality of openings.

9. A method for preparing a light-emitting panel, in, The preparation method comprises: providing a first substrate; Manufacturing a driving circuit layer on the first substrate; A pad pair is formed on a side of the driving circuit layer away from the first substrate, the pad pair is electrically connected to the driving circuit layer, and the pad pair includes two pads; providing a second substrate; fixing a light emitting device on the second substrate; Making a bonding portion on the pad or the light-emitting device; Turning over the second substrate so that the plurality of light-emitting devices are aligned with the plurality of pads respectively; Disposing a frame sealant between the first substrate and the second substrate; Aligning the first substrate with the second substrate in a vacuum bonding system to form a panel box; The panel box is heated, and the air pressure outside the panel box is increased.

10. The preparation method according to claim 9, in, The material of the first substrate includes polyimide; before manufacturing the driving circuit layer on the first substrate, the preparation method further includes: Providing a first supporting substrate, and disposing the first supporting substrate on a side of the first substrate away from the driving circuit layer; After the first substrate and the second substrate are aligned in a vacuum bonding system to form a panel box, the preparation method further includes: Using a peeling technique, peeling the first supporting substrate from the first substrate; and / or, The material of the second substrate includes transparent polyimide; before fixing the light-emitting device on the second substrate, the preparation method further includes: Providing a second supporting substrate, and disposing the second supporting substrate on a side of the second substrate away from the light-emitting device; After the first substrate and the second substrate are aligned in a vacuum bonding system to form a panel box, the preparation method further includes: The second supporting substrate is peeled off from the second substrate by using a peeling technique.

11. The preparation method according to claim 9, in, Along the thickness direction of the light-emitting panel, the size of the frame sealant arranged between the first substrate and the second substrate is equal to the sum of the average size of the plurality of pads, the size of the light-emitting device corresponding to the pad, the average size of the plurality of bonding portions and the size of the driving circuit layer.

12. The preparation method according to claim 9, in, The step of fixing the light emitting device on the second substrate comprises: fixing an elastic stamp on the second substrate; The light emitting device is fixed on a side of the elastic stamp away from the second substrate.

13. The preparation method according to claim 12, in, Along the thickness direction of the light-emitting panel, the size of the frame sealing glue arranged between the first substrate and the second substrate is equal to the sum of the average size of the plurality of solder pads, the size of the light-emitting device corresponding to the solder pads, the average size of the plurality of bonding portions, the size of the elastic stamp corresponding to the solder pads, and the size of the driving circuit layer.

14. A display device, include: A light-emitting panel, which is a light-emitting panel as claimed in any one of claims 1 to 8; An array substrate, located at the light emitting side of the light emitting panel; The color filter substrate is located on a side of the array substrate away from the light emitting panel.

15. A display device, include: case; The light emitting panel is the light emitting panel according to any one of claims 1 to 8, and the light emitting panel is arranged in the housing.

Images