Vehicle lamp module and manufacturing method therefor, and vehicle

Abstract

A vehicle lamp module and a manufacturing method therefor, and a vehicle. The vehicle lamp module comprises a support layer (10), a packaging layer (20), a light-emitting layer (30), a cover plate (50) and a conductive adhesive tape (70), wherein the packaging layer (10) is disposed on one side of the support layer (10); the light-emitting layer (30) is disposed on the side of the packaging layer (20) away from the support layer (10); the cover plate (50) is located on the side of the light-emitting layer (30) away from the packaging layer (20); and the conductive adhesive tape (70) is connected to the cover plate (50), and the conductive adhesive tape (70) is grounded. The cover plate (50) is grounded by means of the conductive adhesive tape (70), such that electrostatic charges generated by the cover plate (50) due to the reasons such as friction can be effectively eliminated, and thus preventing components from damage caused by the electrostatic charges.

Description

Vehicle light module, manufacturing method thereof, and vehicle Technical Field

[0001] The present application relates to the automotive field, and in particular to a vehicle lamp module, a manufacturing method thereof, and a vehicle. Background Art

[0002] The integration of OLED light-emitting layers into automotive lamp housings is gaining momentum, both in technology and in the market. However, the static charge generated by friction in existing integrated lamp modules is difficult to eliminate or remove from the module, significantly increasing the risk of component damage.

[0003] Summary of the Invention

[0004] The purpose of this application is to provide an anti-static vehicle lamp module, a manufacturing method thereof, and a vehicle.

[0005] The present application discloses a vehicle lamp module, which includes: a supporting layer; an encapsulation layer, which is arranged on one side of the supporting layer; a light-emitting layer, which is arranged on a side of the encapsulation layer away from the supporting layer; a cover plate, which is located on a side of the light-emitting layer away from the encapsulation layer; and a conductive tape, which is connected to the cover plate and is grounded.

[0006] In some embodiments, the headlight module also includes a circuit board, the light-emitting layer includes a middle area bonded to the packaging layer and an edge area located around the middle area, and the circuit board is bonded to the side of the edge area close to the packaging layer; the conductive tape is arranged on the surrounding sides of the support layer, the light-emitting layer, the packaging layer and the cover plate and avoids the circuit board.

[0007] In some embodiments, the conductive tape is connected to a side of the cover plate away from the light-emitting layer.

[0008] In some embodiments, the conductive tape is connected to a side of the support layer away from the packaging layer, and the conductive tape is directly grounded.

[0009] In some embodiments, the conductive tape is connected to a side of the support layer close to the encapsulation layer.

[0010] In some embodiments, the supporting layer is provided with a grounding mechanism; a portion of the grounding mechanism is located in a connection area between the supporting layer and the conductive tape; and the portion of the grounding mechanism is connected to the conductive tape.

[0011] In some embodiments, the vehicle lamp module further includes a circuit board, wherein the circuit board is in contact with an edge of the light-emitting layer, and the grounding mechanism avoids the circuit board.

[0012] In some embodiments, a middle portion of the conductive tape is connected to a side of the encapsulation layer away from the light-emitting layer.

[0013] In some embodiments, the conductive tape is connected to a side of the encapsulation layer away from the light-emitting layer.

[0014] In some embodiments, a portion of the conductive tape is disposed in an interlayer between the support layer and the encapsulation layer.

[0015] In some embodiments, a double-sided adhesive layer is provided between the support layer and the encapsulation layer; the thickness of the conductive tape is not less than the thickness of the double-sided adhesive layer and is not more than 1.5 times the thickness of the double-sided adhesive layer.

[0016] In some embodiments, a light filter film is provided on a side of the cover plate close to the light-emitting layer; or a light filter film is provided on a side of the cover plate away from the light-emitting layer.

[0017] In some embodiments, an optically transparent adhesive layer is disposed on a side of the light-emitting layer close to the cover plate.

[0018] In some embodiments, the circuit board and the light-emitting layer are connected via anisotropic conductive adhesive; the outer side of the anisotropic conductive adhesive is coated with shadowless adhesive; and the outer side of the shadowless adhesive is coated with waterproof adhesive.

[0019] The present application also discloses a method for manufacturing a vehicle lamp module, comprising: encapsulating a light-emitting layer to form an encapsulation layer; laminating a support layer on a side of the encapsulation layer away from the light-emitting layer; laminating a cover plate on a side of the light-emitting layer away from the encapsulation layer; and bonding a conductive tape, wherein the conductive tape is grounded and connected to the cover plate.

[0020] The present application also discloses a method for manufacturing a vehicle lamp module, comprising: encapsulating a light-emitting layer to form an encapsulation layer; laminating a cover plate on a side of the light-emitting layer away from the encapsulation layer; bonding a conductive tape, wherein the conductive tape is grounded and connected to the cover plate; and laminating a support layer on a side of the encapsulation layer away from the light-emitting layer.

[0021] The present application also discloses a vehicle, comprising the vehicle light module as described above. It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and do not limit the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0023] FIG1 is a schematic diagram of a vehicle light module according to an embodiment of the present application.

[0024] FIG2 is a front view schematic diagram of a vehicle light module according to an embodiment of the present application.

[0025] FIG3 is a partial cross-sectional schematic diagram of the connection between the circuit board and the light-emitting layer of the vehicle light module according to an embodiment of the present application.

[0026] FIG4 is a partial cross-sectional schematic diagram of the area A in FIG2 according to an embodiment of the present application.

[0027] FIG5 is a partial cross-sectional schematic diagram of area A in FIG2 according to another embodiment of the present application.

[0028] FIG6 is a partial cross-sectional schematic diagram of area A in FIG2 according to another embodiment of the present application.

[0029] FIG. 7 is a flow chart of a method for manufacturing a vehicle lamp module according to an embodiment of the present application.

[0030] FIG. 8 is a flow chart of a method for manufacturing a vehicle lamp module according to another embodiment of the present application.

[0031] Explanation of the accompanying drawings: supporting layer, 10; grounding mechanism, 11; double-sided adhesive layer, 12; encapsulation layer, 20; light-emitting layer, 30; optically transparent adhesive layer, 31; middle area, 32; edge area, 33; circuit board, 40; anisotropic conductive adhesive, 41; shadowless adhesive, 42; waterproof adhesive, 43; cover plate, 50; filter film, 60; conductive tape, 70. DETAILED DESCRIPTION

[0032] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.

[0033] The terminology used herein is for the purpose of describing specific embodiments only and is not intended to limit the present disclosure. Unless otherwise defined, technical or scientific terms used in this specification should have the same ordinary meaning as those having ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this specification and claims do not denote any order, quantity, or importance, but are used solely to distinguish between different components. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather indicate presence. "Multiple" or "several" refer to two or more. Unless otherwise indicated, terms such as "front," "rear," "lower," and / or "upper" are used for convenience only and are not intended to limit the scope of the present disclosure to a specific location or spatial orientation. Terms such as "include" or "comprising" mean that the elements or objects listed before "include" or "comprising" encompass the elements or objects listed after "include" or "comprising," and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections and may include electrical connections, whether direct or indirect.

[0034] The terminology used in this specification is for the purpose of describing specific embodiments only and is not intended to limit the present disclosure. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0035] Static electricity is a significant issue for electronic products, especially for highly sensitive electronic displays like OLEDs (Organic Light-Emitting Diodes), LEDs (Light-Emitting Diodes), and LCDs. The material of headlight housings is primarily antistatic, with a surface impedance greater than or equal to 10^11Ω. This property makes it difficult for static electricity on the housing to dissipate quickly. Friction in the housing of a headlight module generates static electricity, which significantly increases the risk of damage to OLED headlights.

[0036] In order to solve the above technical problems, the present application provides a car lamp module, which includes: a supporting layer; an encapsulation layer, arranged on one side of the supporting layer; a light-emitting layer, arranged on the side of the encapsulation layer away from the supporting layer; a cover plate, located on the side of the light-emitting layer away from the encapsulation layer; a conductive tape, connected to the cover plate, and the conductive tape is grounded.

[0037] In order to solve the above technical problems, the present application also provides a method for manufacturing a vehicle lamp module, which includes: encapsulating the light-emitting layer to form an encapsulation layer; laminating the support layer on the side of the encapsulation layer away from the light-emitting layer; laminating the cover plate on the side of the light-emitting layer away from the encapsulation layer; and bonding the conductive tape, which is grounded and connected to the cover plate.

[0038] In order to solve the above technical problems, the present application also provides a method for manufacturing a vehicle lamp module, which includes: encapsulating the light-emitting layer to form an encapsulation layer; laminating a cover plate on the side of the light-emitting layer away from the encapsulation layer; bonding a conductive tape, the conductive tape is grounded and connected to the cover plate; and laminating a support layer on the side of the encapsulation layer away from the light-emitting layer.

[0039] In order to solve the above technical problems, the present application further provides a vehicle, which includes the headlight module as described above.

[0040] The present application provides a conductive tape to ground the cover plate, which can quickly dissipate the static charge generated on the cover plate. In some embodiments, the conductive tape is provided around the periphery of the lamp module to enhance the sealing performance of the lamp module and thus increase its durability.

[0041] The following is a detailed description of various embodiments of the present application.

[0042] The embodiment of the present application discloses a vehicle light module, which can be applied to scenarios such as vehicle taillights, roof decorative lights, and vehicle side decorative lights.

[0043] As shown in Figure 1, the vehicle lamp module includes a support layer 10, an encapsulation layer 20, a light-emitting layer 30, a cover plate 50, and a conductive tape 70. The encapsulation layer 20 is located on one side of the support layer 10, the light-emitting layer 30 is located on the side of the encapsulation layer 20 away from the support layer 10, and the cover plate 50 is located on the side of the light-emitting layer 30 away from the encapsulation layer 20. The conductive tape 70 is connected to the cover plate 50 and is grounded.

[0044] As shown in FIG1 , in some embodiments, the vehicle lamp module further includes a circuit board 40, which is aligned with the edge of the light-emitting layer 30. In some embodiments, the vehicle lamp module further includes a filter film 60, which is disposed on a side of the cover plate 50 close to the light-emitting layer 30 or on a side of the cover plate 50 away from the light-emitting layer 30.

[0045] In some embodiments, the support layer 10 is made of ABS composite material. In some embodiments, the support layer 10 can also be made of stainless steel, aluminum alloy, titanium alloy, or other materials. The thickness of the support layer 10 can be no less than 0.5 mm. For example, the thickness of the support layer 10 can be 0.5 mm, 0.52 mm, 0.55 mm, 0.58 mm, or 0.6 mm.

[0046] Referring to Figures 1 and 2 , in some embodiments, a grounding mechanism 11 is disposed around the edge of the support layer 10. This grounding mechanism 11 can be a conductive structure such as a copper-leaking structure or a metal area that connects to the vehicle body or interior assembly. This grounding mechanism 11 avoids the contact area between the circuit board 40 and the light-emitting layer 30 and is positioned at a distance of at least 5 mm from this contact area. For example, the distance between the grounding mechanism 11 and the contact area can be 5 mm, 5.2 mm, 5.5 mm, 6 mm, or 7 mm, etc.

[0047] In some embodiments, a double-sided adhesive layer 12 may be disposed between the support layer 10 and the encapsulation layer 20. The double-sided adhesive layer 12 may be formed of a thermally conductive adhesive having a thermal conductivity of not less than 0.5 W / (m·K). The support layer 10 and the encapsulation layer 20 are secured together by the double-sided adhesive layer 12. The orthographic projection of the double-sided adhesive layer 12 onto the support layer 10 falls within the support layer 10; the orthographic projection of the double-sided adhesive layer 12 onto the encapsulation layer 20 falls within the encapsulation layer 20.

[0048] The side of the encapsulation layer 20 away from the support layer 10 is attached to the light emitting layer 30. In one embodiment, the encapsulation adopts a glass encapsulation process, such as Frit encapsulation. In another embodiment, the encapsulation adopts a thin film encapsulation (TFE) process.

[0049] In one embodiment, the light-emitting layer 30 may be an OLED light-emitting layer. In one embodiment, the OLED light-emitting layer is used for illumination. In one embodiment, the OLED light-emitting layer is also used for display. For example, the brightness and color of pixels in each region can be controlled based on user input or manipulation to display a specific image. In one embodiment, the OLED light-emitting layer includes an anode, a cathode, and an organic light-emitting material layer. By applying different voltages to the anode and cathode, the organic light-emitting material layer is driven to emit light.

[0050] In one embodiment, encapsulation layer 20 includes an inorganic insulating layer. In one embodiment, encapsulation layer 20 comprises a laminated structure of an inorganic insulating layer, an organic material layer, and an inorganic insulating layer. The inorganic insulating layer may be made of silicon oxide, silicon nitride, silicon oxynitride, or the like. The organic material layer may be made of a polymer. The encapsulation layer 20 effectively blocks water and oxygen from entering the light-emitting layer 30.

[0051] As shown in Figure 3, in some embodiments, a circuit board 40 is connected to the edge of the light-emitting layer 30. The light-emitting layer 30 includes a middle area 32 that is bonded to the encapsulation layer 20 and an edge area 33 located on the periphery of the middle area 32. For example, the area on the left side of the dotted line in Figure 3 is the middle area 32, and the area on the right side of the dotted line is the edge area 33. The dotted lines in the figure do not represent any physical structure and only illustrate the middle area 32 and the edge area 33. The circuit board 40 is bonded to the side of the edge area 33 close to the encapsulation layer 20. In one embodiment, the circuit board 40 is a flexible printed circuit board (FPC). The orthographic projection of the encapsulation layer 20 onto the light-emitting layer 30 falls within the light-emitting layer 30 and overlaps with the projection of the middle area 32. The edge area 33 extends outward from the periphery of the middle area 32. The circuit board 40 is bonded to the edge area 33 of the light-emitting layer 30. The circuit board 40 is bonded to the side of the edge area 33 close to the encapsulation layer 20.

[0052] In some embodiments, the circuit board 40 is bonded to the light-emitting layer 30 via anisotropic conductive adhesive 41. Shadowless adhesive 42 is applied to the outside of the bonding area between the circuit board 40 and the light-emitting layer 30 to protect this area. Waterproof adhesive 43 is also applied to the outside of the shadowless adhesive 42 to enhance the packaging quality of the circuit board 40. The projection of the anisotropic conductive adhesive 41 perpendicular to the light-emitting layer 30 falls within the projection of the shadowless adhesive 42 perpendicular to the light-emitting layer 30; and the projection of the shadowless adhesive 42 perpendicular to the light-emitting layer 30 falls within the projection of the waterproof adhesive 43 perpendicular to the light-emitting layer 30. The three-layer adhesive structure of anisotropic conductive adhesive 41, shadowless adhesive 42, and waterproof adhesive 43 achieves connection between the circuit board 40 and the light-emitting layer 30, resulting in excellent electrical connection performance between the circuit board 40 and the light-emitting layer 30, while also ensuring excellent packaging quality between the circuit board 40 and the light-emitting layer 30.

[0053] In some embodiments, the cover plate 50 may be a composite material cover plate. In some embodiments, the cover plate 50 may also be made of other materials such as glass. In this embodiment, the cover plate 50 is made of a composite material. Composite materials are less expensive than glass materials, which helps save costs, and its safety level after processing is also higher. The cover plate 50 is used to protect the light-emitting layer 30. The transmittance of the cover plate 50 is not less than 88%. For example, the transmittance of the cover plate 50 can be 88%, 89%, 90%, 91%, 92%, etc. The edge of the cover plate 50 on the side close to the light-emitting layer 30 is provided with an anti-static adhesive mechanism, and the anti-static adhesive avoids the bonding area between the circuit board 40 and the light-emitting layer 30. In one embodiment, the edge of the cover plate 50 on the side close to the light-emitting layer 30 is provided with an anti-static foam mechanism, and the anti-static foam avoids the bonding area between the circuit board 40 and the light-emitting layer 30.

[0054] In one embodiment, the cover plate 50 undergoes surface strengthening treatments, such as anti-glare, anti-reflection, and surface hardening. In another embodiment, the cover plate 50 undergoes light filtering treatment, providing it with a light filtering function. The cover plate 50 selectively transmits light within a specified wavelength range emitted by the luminescent layer 30, thereby enhancing the display effect of the vehicle light module. The cover plate 50 also prevents harmful light, i.e., light with a wavelength of 500 nm or less, from entering the luminescent layer 30, thereby preventing damage to the structure of the luminescent layer 30.

[0055] In another embodiment, the cover plate 50 is not treated with light filtering and does not have a light filtering function. A filter film 60 is also provided in the vehicle light module. The filter film 60 can be provided on the side of the cover plate 50 close to the light-emitting layer 30 or on the side of the cover plate 50 away from the light-emitting layer 30. When the filter film 60 is provided on the side of the cover plate 50 close to the light-emitting layer 30, an optically transparent adhesive layer 31 is provided between the filter film 60 and the light-emitting layer 30, connecting the filter film 60 and the light-emitting layer 30 via the optically transparent adhesive layer 31. When the filter film 60 is provided on the side of the cover plate 50 away from the light-emitting layer 30, an optically transparent adhesive layer 31 is provided between the cover plate 50 and the light-emitting layer 30, connecting the cover plate 50 and the light-emitting layer 30 via the optically transparent adhesive layer 31. The projection of the optically transparent adhesive layer 31 in a direction perpendicular to the light-emitting layer 30 falls within the projections of the light-emitting layer 30, the cover plate 50, and the filter film 60 in the direction perpendicular to the light-emitting layer 30. The filter film 60 can selectively absorb or transmit light of a specific color to enhance the luminescence effect of the light-emitting layer 30. The filter film 60 can also prevent harmful light, i.e., light with a wavelength of 500 nm or less, from entering the light-emitting layer 30, thereby avoiding damage to the light-emitting layer 30.

[0056] In some embodiments, the conductive tape 70 can be made of conductive adhesive. In some embodiments, the conductive tape 70 can also be conductive cloth or conductive cloth tape with a thickness not exceeding 0.5 mm. For example, the thickness of the conductive cloth or conductive cloth tape can be 0.5 mm, 0.55 mm, 0.53 mm, 0.4 mm, or 0.3 mm.

[0057] In some embodiments, the conductive tape 70 is arranged around the supporting layer 10, the light-emitting layer 30, the encapsulation layer 20 and the cover plate 50. When the conductive tape 70 is arranged, it avoids the bonding area between the circuit board 40 and the light-emitting layer 30, and the distance from the bonding area is not less than 2 mm. For example, the distance between the conductive tape 70 and the bonding area can be 2 mm, 2.5 mm, 2.8 mm, 3 mm, or 4 mm, etc. In one embodiment, the conductive tape 70 starts from 2 mm on one side of the bonding area between the circuit board 40 and the light-emitting layer 30, surrounds the side of the headlight module, and reaches 2 mm on the other side of the bonding area between the circuit board 40 and the light-emitting layer 30.

[0058] The conductive tape 70 is secured to the support layer 10 and the cover plate 50 to seal the perimeter of the light module. This wraparound design enhances the module's waterproof and moisture-proof properties, increasing its durability. Compared to related technologies, this wraparound design avoids obstructing the light path of the light-emitting layer 30, providing the light module with a larger effective light-emitting area.

[0059] As shown in FIG4 , in one embodiment, one side of the conductive tape 70 is bonded and fixed to the side of the cover plate 50 away from the light-emitting layer 30. The other side of the conductive tape 70 is bonded and fixed to the side of the support layer 10 near the encapsulation layer 20, and is also bonded and fixed to the side of the encapsulation layer 20 near the support layer 10. The effective bonding length of the cross-section where the conductive tape 70 bonds with the encapsulation layer 20 is greater than or equal to 0.5% of the maximum length of the encapsulation layer 20 in the longitudinal direction. For example, the effective bonding length of the cross-section where the conductive tape 70 bonds with the encapsulation layer 20 is 0.5%, 1%, 3%, 5%, 10%, or the like, of the maximum length of the encapsulation layer 20 in the longitudinal direction. A portion of the conductive tape 70 is disposed in the interlayer between the support layer 10 and the encapsulation layer 20.

[0060] In one embodiment, the thickness of the conductive tape 70 connected to the encapsulation layer 20 is no less than the thickness of the double-sided adhesive layer 12 and no more than 1.5 times the thickness of the double-sided adhesive layer 12. For example, the thickness of the conductive tape 70 is 1 times, 1.1 times, 1.2 times, 1.3 times, 1.5 times, etc., of the thickness of the double-sided adhesive layer 12. The peel force of the conductive tape 70 after attachment is greater than or equal to 1200 gf / inch.

[0061] In one embodiment, the connection / attachment area between the conductive tape 70 and the support layer 10 covers the entire grounding mechanism 11 on the support layer 10, and the conductive tape 70 is grounded through the grounding mechanism 11. In another embodiment, the connection area between the conductive tape 70 and the support layer 10 covers a portion of the grounding mechanism 11 on the support layer 10, and the conductive tape 70 is grounded through this portion of the grounding mechanism 11. When static electricity is generated in the cover plate 50 or the packaging layer 20, the cover plate 50 or the packaging layer 20 can be grounded through the conductive tape 70, thereby dissipating the static charge and preventing damage to the components.

[0062] As shown in FIG5 , in another embodiment, one side of the conductive tape 70 is bonded and fixed to the side of the cover plate 50 away from the light-emitting layer 30. The other side of the conductive tape 70 is bonded and fixed to the side of the support layer 10 away from the encapsulation layer 20. The effective bonding length of the cross-section where the conductive tape 70 bonds with the support layer 10 is greater than or equal to 5% of the maximum length of the support layer 10 in that direction. For example, the effective bonding length of the cross-section where the conductive tape 70 bonds with the support layer 10 can be 5%, 5.3%, 5.5%, 6%, or 8%, etc., of the maximum length of the support layer 10 in that direction. The peel force of the conductive tape 70 after bonding and fixing is greater than or equal to 1200 gf / inch.

[0063] The portion of the conductive tape 70 located on the side of the support layer 10 away from the encapsulation layer 20 directly contacts the vehicle body shell or interior assembly, thereby achieving direct grounding. In one embodiment, the contact area / connection area between the conductive tape 70 and the support layer 10 covers the entire grounding structure 11 on the support layer 10, thereby achieving grounding. In one embodiment, the connection area between the conductive tape 70 and the support layer 10 covers a portion of the grounding structure 11 on the support layer 10, and the conductive tape 70 is grounded through this portion of the grounding structure 11. The conductive tape 70 can achieve grounding in two ways, which can more effectively eliminate the static charge generated on the cover plate 50, thereby protecting components.

[0064] As shown in Figure 6, in another embodiment, one side of the conductive tape 70 is adhered and fixed to the side of the cover plate 50 away from the light-emitting layer 30. The other side of the conductive tape 70 is adhered and fixed to the side of the support layer 10 away from the encapsulation layer 20. The middle section / middle portion of the conductive tape 70 is adhered and fixed to the side of the encapsulation layer 20 close to the support layer 10 (or the side of the encapsulation layer 20 away from the light-emitting layer 30). The effective adhesion length of the cross-section of the conductive tape 70 and the encapsulation layer 20 is greater than or equal to 0.5% of the maximum length of the encapsulation layer 20 in this length direction. For example, the effective adhesion length of the cross-section of the conductive tape 70 and the encapsulation layer 20 is 0.5%, 1%, 3%, 5%, 10%, etc. of the maximum length of the encapsulation layer 20 in this length direction. The peel force of the conductive tape 70 after adhesion and fixation is greater than or equal to 1200 gf / inch.

[0065] In one embodiment, the thickness of the conductive tape 70 connected to the packaging layer 20 is not less than 1.5 mm. For example, the thickness of the conductive tape 70 may be 1.5 mm, 1.53 mm, 1.55 mm, 1.6 mm, or 1.7 mm.

[0066] The portion of the conductive tape 70 located on the side of the support layer 10 away from the packaging layer 20 is in direct contact with the vehicle body shell or the vehicle interior assembly, thereby achieving grounding. In one embodiment, the bonding area / connection area between the conductive tape 70 and the support layer 10 covers the entire grounding mechanism 11 on the support layer 10, thereby achieving grounding. In one embodiment, the connection area between the conductive tape 70 and the support layer 10 covers part of the grounding mechanism 11 on the support layer 10, and the conductive tape 70 is grounded through this part of the grounding mechanism 11. The conductive tape 70 can be grounded in two ways, and the conductive tape 70 is simultaneously connected to the cover plate 50 and the packaging layer 20, which can more efficiently eliminate the electrostatic charge generated on the cover plate 50 and the packaging layer 20, thereby protecting the components.

[0067] In order to solve the problem that static electricity generated by the friction of the headlight housing is difficult to eliminate in a short time, the headlight module of the present application proposes a solution of providing conductive tape to ground the cover plate, which can quickly dissipate the static charge generated by the cover plate. At the same time, the conductive tape is arranged around the periphery of the headlight module, which can enhance the sealing performance of the headlight module and thus increase its durability. The headlight module of the present application improves its anti-static ability, so that the product has a higher ESD (Electro-Static discharge) level. The headlight module of the present application integrates the electrostatic protection mechanism into the headlight module itself, so that the end customer does not need to integrate the anti-static mechanism, improves the assembly yield of the terminal product, lowers the entry barrier for the end customer, and facilitates the promotion of the product. At the same time, the present application also solves the technical bottleneck for the subsequent development of touch and other functions of the headlight module.

[0068] As shown in Figure 7, this application also discloses a method for manufacturing an automotive light module, which can be used to manufacture the aforementioned automotive light module. The manufacturing method may include: step 101, encapsulating the light-emitting layer to form an encapsulation layer; step 102, attaching a support layer to the side of the encapsulation layer away from the light-emitting layer; step 103, attaching a cover plate to the side of the light-emitting layer away from the encapsulation layer; and step 104, bonding a conductive tape, wherein the conductive tape is grounded and connected to the cover plate.

[0069] For example, the manufacturing method may include: first encapsulating the light-emitting layer 30 to form the encapsulation layer 20; then laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30; then laminating the cover plate 50 on the side of the light-emitting layer 30 away from the encapsulation layer 20; and finally bonding the conductive tape 70, which is grounded and connected to the cover plate 50.

[0070] In some embodiments, after step 101 and before step 102, the manufacturing method may include: bonding the circuit board 40 to the edge of the light-emitting layer 30 through the anisotropic conductive adhesive 41, then coating the outside of the bonding area between the circuit board 40 and the light-emitting layer 30 with shadowless adhesive 42, and coating the outside of the shadowless adhesive 42 with waterproof adhesive 43, thereby forming a three-layer adhesive structure consisting of the anisotropic conductive adhesive 41, the shadowless adhesive 42 and the waterproof adhesive 43 from the inside to the outside.

[0071] In some embodiments, the manufacturing method may include: laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30, wherein a double-sided adhesive layer 12 is provided on one side of the support layer 10, and the double-sided adhesive layer 12 is used to achieve lamination and fixation between the support layer 10 and the encapsulation layer 20.

[0072] In some embodiments, the manufacturing method may include laminating a cover plate 50 and a light filter film 60 to a side of the light-emitting layer 30 away from the encapsulation layer 20, wherein the cover plate 50 and the light filter film 60 are attached to the light-emitting layer 30 via an optically transparent adhesive layer 31. In one embodiment, the cover plate 50 may be attached first, followed by the light filter film 60; in another embodiment, the light filter film 60 may be attached first, followed by the cover plate 50. In yet another embodiment, only the cover plate 50 may be attached, without the light filter film 60.

[0073] In some embodiments, step 104 includes bonding a conductive tape 70 to the edge areas of the support layer 10, encapsulation layer 20, light-emitting layer 30, cover plate 50, and film filter 60, with the conductive tape 70 avoiding the contact area between the circuit board 40 and the light-emitting layer 30. In one embodiment, the conductive tape 70 begins 2 mm to one side of the contact area between the circuit board 40 and the light-emitting layer 30, wraps around the perimeter of the lamp module, and reaches 2 mm to the other side of the contact area between the circuit board 40 and the light-emitting layer 30. The two long edges of the conductive tape 70 adhere to the support layer 10 and the cover plate 50, covering the encapsulation layer 20, light-emitting layer 30, and film filter 60 between the support layer 10 and the cover plate 50 with the conductive tape 70, thereby enhancing the sealing performance and durability of the lamp module.

[0074] As shown in Figure 8 , this application also discloses another method for manufacturing an automotive light module, which can be used to manufacture the aforementioned automotive light module. The manufacturing method may include: step 201, encapsulating the light-emitting layer to form an encapsulation layer; step 202, attaching a cover plate to the side of the light-emitting layer away from the encapsulation layer; step 203, bonding a conductive tape to ground and connect the conductive tape to the cover plate; and step 204, attaching a support layer to the side of the encapsulation layer away from the light-emitting layer.

[0075] For example, the manufacturing method may include: first encapsulating the light-emitting layer 30 to form the encapsulation layer 20; then laminating the cover plate 50 on the side of the light-emitting layer 30 away from the encapsulation layer 20; then bonding the conductive tape 70, wherein the conductive tape 70 is grounded and connected to the cover plate 50; and finally laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30.

[0076] In some embodiments, after step 201 and before step 202, the manufacturing method may include: bonding the circuit board 40 to the edge of the light-emitting layer 30 through the anisotropic conductive adhesive 41, then coating the outside of the bonding area between the circuit board 40 and the light-emitting layer 30 with shadowless adhesive 42, and coating the outside of the shadowless adhesive 42 with waterproof adhesive 43, thereby forming a three-layer adhesive structure consisting of the anisotropic conductive adhesive 41, the shadowless adhesive 42 and the waterproof adhesive 43 from the inside to the outside.

[0077] In some embodiments, the manufacturing method may include laminating a cover plate 50 and a light filter film 60 to a side of the light-emitting layer 30 away from the encapsulation layer 20, wherein the cover plate 50 and the light filter film 60 are attached to the light-emitting layer 30 via an optically transparent adhesive layer 31. In one embodiment, the cover plate 50 may be attached first, followed by the light filter film 60; in another embodiment, the light filter film 60 may be attached first, followed by the cover plate 50. In yet another embodiment, only the cover plate 50 may be attached, without the light filter film 60.

[0078] In some embodiments, step 203 includes bonding a conductive tape 70 to the edge areas of the support layer 10, encapsulation layer 20, light-emitting layer 30, cover plate 50, and film filter 60, with the conductive tape 70 avoiding the contact area between the circuit board 40 and the light-emitting layer 30. In one embodiment, the conductive tape 70 begins 2 mm to one side of the contact area between the circuit board 40 and the light-emitting layer 30, wraps around the perimeter of the lamp module, and reaches 2 mm to the other side of the contact area between the circuit board 40 and the light-emitting layer 30. The two long edges of the conductive tape 70 adhere to the support layer 10 and the cover plate 50, covering the encapsulation layer 20, light-emitting layer 30, and film filter 60 between the support layer 10 and the cover plate 50 with the conductive tape 70, thereby enhancing the sealing performance and durability of the lamp module.

[0079] In some embodiments, the manufacturing method may include: laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30, wherein a double-sided adhesive layer 12 is provided on one side of the support layer 10, and the double-sided adhesive layer 12 is used to achieve lamination and fixation between the support layer 10 and the encapsulation layer 20.

[0080] The present application also discloses a vehicle, comprising the above-mentioned headlight module, which can be applied to the vehicle's rear lights, body decorative lights, roof lights, etc.

[0081] The present application uses conductive tape to ground the cover plate, which can effectively eliminate the static charge generated by the cover plate due to friction and other reasons, and prevent the static charge from damaging the components.

[0082] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the present invention and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present invention being indicated by the following claims.

[0083] It should be understood that the present description is not limited to the exact structure that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0084] The above are only preferred embodiments of this specification and are not intended to limit this specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A vehicle light module, comprising: Support layer; An encapsulation layer, disposed on one side of the support layer; A light-emitting layer is disposed on a side of the encapsulation layer away from the support layer; A cover plate, located on a side of the light-emitting layer away from the encapsulation layer; The conductive tape is connected to the cover plate and is grounded.

2. The vehicle light module according to claim 1, characterized in that: The vehicle lamp module further includes a circuit board. The light-emitting layer comprises a middle area bonded to the packaging layer and an edge area located around the middle area, and the circuit board is bonded to a side of the edge area close to the packaging layer; The conductive tape is arranged on the peripheral sides of the supporting layer, the light-emitting layer, the packaging layer and the cover plate and avoids the circuit board.

3. The vehicle light module according to claim 1, characterized in that: The conductive tape is connected to a side of the cover plate away from the light-emitting layer.

4. The vehicle light module according to claim 3, characterized in that: The conductive tape is connected to a side of the support layer away from the packaging layer, and the conductive tape is directly grounded.

5. The vehicle light module according to claim 3, characterized in that: The conductive tape is connected to a side of the support layer close to the packaging layer.

6. The vehicle light module according to claim 4 or 5, characterized in that: The support layer is provided with a grounding mechanism; a part of the grounding mechanism is located in the connection area between the support layer and the conductive tape; and the part of the grounding mechanism is connected to the conductive tape.

7. The vehicle lamp module according to claim 6, characterized in that: The vehicle lamp module further comprises a circuit board, wherein the circuit board is in contact with an edge of the light-emitting layer, and the grounding mechanism avoids the circuit board.

8. The vehicle light module according to claim 4, characterized in that: The middle portion of the conductive tape is connected to a side of the encapsulation layer away from the light-emitting layer.

9. The vehicle lamp module according to claim 5, characterized in that: The conductive tape is connected to a side of the encapsulation layer away from the light-emitting layer.

10. The vehicle lamp module according to claim 9, characterized in that: Part of the conductive tape is disposed in the interlayer between the support layer and the packaging layer.

11. The vehicle lamp module according to claim 10, characterized in that: A double-sided adhesive layer is provided between the support layer and the packaging layer; the thickness of the conductive tape is not less than the thickness of the double-sided adhesive layer and is not more than 1.5 times the thickness of the double-sided adhesive layer.

12. The vehicle lamp module according to claim 1, characterized in that: A light filter film is disposed on a side of the cover plate close to the light-emitting layer; or a light filter film is disposed on a side of the cover plate away from the light-emitting layer.

13. The vehicle lamp module according to claim 12, characterized in that: An optically transparent adhesive layer is disposed on one side of the light emitting layer close to the cover plate.

14. The vehicle lamp module according to claim 2 or 7, characterized in that: The circuit board and the light-emitting layer are connected via anisotropic conductive adhesive; the outer side of the anisotropic conductive adhesive is coated with shadowless adhesive; the outer side of the shadowless adhesive is coated with waterproof adhesive.

15. A method for manufacturing a vehicle lamp module, comprising: Encapsulating the light-emitting layer to form an encapsulation layer; A support layer is attached to a side of the encapsulation layer away from the light-emitting layer; Laying a cover plate on a side of the light-emitting layer away from the encapsulation layer; A conductive tape is bonded, wherein the conductive tape is grounded and connected to the cover plate.

16. A method for manufacturing a vehicle lamp module, comprising: Encapsulating the light-emitting layer to form an encapsulation layer; Laying a cover plate on a side of the light-emitting layer away from the encapsulation layer; A bonding conductive tape, wherein the conductive tape is grounded and connected to the cover plate; A support layer is attached to a side of the encapsulation layer away from the light-emitting layer.

17. A vehicle, characterized in that: It comprises a vehicle light module as described in any one of claims 1-14.

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