Electronic device comprising shield can and bracket

Abstract

This electronic device may comprise: a substrate including a first surface facing a first direction; an integrated circuit provided on the first surface of the substrate; a shield can, which is provided on the first surface of the substrate and surrounds at least a portion of the integrated circuit; a bracket provided in the first direction from the shield can; and a shielding sheet provided between the bracket and the shield can. The bracket can include a first protruding area protruding from one surface (352) facing a second direction opposite to the first direction, and the shield can include a first open area provided at a position facing the first protruding area. Various other embodiments are possible.

Description

Electronic devices including shield cans and brackets

[0001] Various embodiments disclosed in this document relate to electronic devices including a shield can and a bracket.

[0002] Electronic devices can overheat due to hardware overheating or external temperature increases. Overheated electronic devices run the risk of hardware performance degradation or internal component damage. As technology advances, electronic devices' hardware performance improves and their miniaturization continues, leading to ongoing research into ways to reduce heat generation in these devices.

[0003] For example, integrated circuits such as application processors (APs) or central processing units (CPUs) in electronic devices used to operate at frequencies in the hundreds of megahertz (MHz), but now they are being released at gigahertz (GHz). Furthermore, noise can be generated during the operation of integrated circuits. If this noise is not shielded and radiates outside the structure, it can affect other electrical components.

[0004] To solve these problems, there is a need for various material applications or structural designs, and research has been conducted to control heat generation in electronic devices and secure shielding performance.

[0005] However, the above-described content should not be construed as the applicant's recognition of the content described in this document as prior art, but should only be construed as technology (related art) related to the invention described in this document.

[0006] To prevent overheating, electronic devices may structurally incorporate heat dissipation structures. For example, in electronic devices containing integrated circuits, such as APs, and heat dissipation structures, the heat dissipation structures must shield noise generated by the AP from being released externally. If noise generated by the AP is released externally, it can, for example, cause interference with communications in the electronic device and lead to communication degradation.

[0007] An electronic device including a shield can and a bracket according to one embodiment of the present invention can improve heat dissipation of the electronic device and also provide improved shielding functionality.

[0008] The technical problems to be achieved through the various embodiments disclosed in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the invention described in this document belongs from the description below.

[0009] An electronic device according to one embodiment may include a substrate including a first surface facing a first direction, an integrated circuit provided on the first surface of the substrate, a shield can provided on the first surface of the substrate and surrounding at least a portion of the integrated circuit, a bracket provided in the first direction from the shield can, and a shielding sheet provided between the bracket and the shield can. In one embodiment, the bracket may include a first protruding area protruding from a surface facing a second direction opposite to the first direction. In one embodiment, the shield can may include a first open area provided at a position facing the first protruding area.

[0010] In addition, an electronic device according to an embodiment of the present document may include a substrate including a first surface facing a first direction, an integrated circuit provided on the first surface of the substrate, a shield can provided on the first surface of the substrate and surrounding at least a portion of the integrated circuit, a bracket including a first protruding area provided in the first direction from the shield can and protruding from a surface facing a second direction opposite to the first direction, and a shielding sheet provided between the bracket and the shield can. In one embodiment, the shield can may include a first open area provided at a position facing the first protruding area and a second protruding area protruding from the surface facing the first direction. In one embodiment, the bracket may further include a second open area provided at a position facing the second protruding area.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0012] FIG. 2A is a front perspective view of an electronic device according to one embodiment.

[0013] FIG. 2b is a rear perspective view of an electronic device according to one embodiment.

[0014] FIG. 2c is an exploded perspective view of an electronic device according to one embodiment.

[0015] FIG. 3A is an exploded perspective view of an electronic device according to one embodiment.

[0016] FIG. 3b is an exploded perspective view of an electronic device according to one embodiment.

[0017] FIG. 3c is a schematic diagram illustrating a cross-section of an electronic device according to one embodiment.

[0018] FIG. 4 is a schematic cross-sectional view of a portion of an electronic device according to one embodiment.

[0019] FIG. 5a is a schematic cross-sectional view of a portion of a bracket according to one embodiment.

[0020] Figure 5b is a schematic diagram of the bottom surface of a portion of a bracket according to one embodiment.

[0021] Figure 6 is a schematic diagram showing the processing state of a bracket according to one embodiment.

[0022] Figure 7a is a schematic diagram showing the processing state of a bracket according to one embodiment.

[0023] Figure 7b is a schematic diagram showing the processing state of a bracket according to one embodiment.

[0024] FIG. 8A is a plan view of an electronic device according to one embodiment.

[0025] FIG. 8b is a plan view of an electronic device according to one embodiment.

[0026] FIG. 9 is a schematic cross-sectional view of a portion of an electronic device according to one embodiment.

[0027] FIG. 10 is a schematic cross-sectional view of a portion of an electronic device according to one embodiment.

[0028] FIG. 11 is a plan view of an electronic device according to one embodiment.

[0029] FIG. 12A is an exploded perspective view of an electronic device according to one embodiment.

[0030] FIG. 12b is a schematic cross-sectional view of a portion of an electronic device according to one embodiment.

[0031] FIG. 12c is a schematic cross-sectional view of a portion of an electronic device according to one embodiment.

[0032] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0033] The various embodiments and terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another component (e.g., a second) with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0034] The term "module" used in various embodiments may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0035] Various embodiments may be implemented as software (e.g., a program (120)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device). For example, a processor of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0036] According to one embodiment, the method according to the various embodiments disclosed in the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0037] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0038] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first mixing surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second mixing surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service on its own, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0061] FIG. 2a is a front perspective view of an electronic device (201) according to one embodiment, FIG. 2b is a rear perspective view of an electronic device (201) according to one embodiment, and FIG. 2c is an exploded perspective view of an electronic device (201) according to one embodiment.

[0062] Referring to FIGS. 2a, 2b, and 2c, an electronic device (201) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that forms an exterior and accommodates components therein, and the housing (210) may include a housing (210) having a front surface (210a), a rear surface (210b), and a side surface (211c) that surrounds an interior space between the front surface (210a) and the rear surface (210b). The housing (210) may include a plurality of side surfaces (211c) extending from the front surface (210a) to the rear surface (210b), and the plurality of side surfaces (211c) may include a lower surface (211c-1), an upper surface (211c-2), a right surface (211c-3), and a left surface (211c-4).

[0063] In one embodiment, the front surface (210a) may be formed by a front plate (211a) that is at least partially substantially transparent. For example, the front plate (211a) may include a glass plate or a polymer plate that includes at least one coating layer. In one embodiment, the back surface (210b) may be formed by a back plate (211b) that is substantially opaque.

[0064] For example, the back plate (211b) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination thereof. The side surface (211c) may be formed by a side member (240) that is joined to the front plate (211a) and the back plate (211b) and includes a metal and / or polymer. In one embodiment, the back plate (211b) and the side member (240) may be formed seamlessly as one piece. In one embodiment, the back plate (211b) and the side member (240) may be formed of substantially the same material (e.g., aluminum).

[0065] In one embodiment, the front plate (211a) may include at least some of a plurality of first edge regions (212a-1), a plurality of second edge regions (212a-2), and a plurality of third edge regions (212a-3).

[0066] For example, a plurality of first edge regions (212a-1) may extend roundly from a portion of the front surface (210a) of the front plate (211a) in one direction (e.g., in the X-axis direction) and toward the rear plate (211b). A plurality of second edge regions (212a-2) may extend roundly from a portion of the front surface (210a) of the front plate (211a) in another direction (e.g., in the Y-axis direction) and toward the rear plate (211b). And, a plurality of third edge regions (212a-3) may extend roundly from a portion of the front surface (210a) of the front plate (211a) toward the rear plate (211b) between the plurality of first edge regions (212a-1) and the plurality of second edge regions (212a-2).

[0067] In one embodiment, the back plate (211b) may include at least some of a plurality of fourth edge regions (212b-1), a plurality of fifth edge regions (212b-2), and a plurality of sixth edge regions (212b-3).

[0068] For example, a plurality of fourth edge regions (212b-1) may extend roundly from a portion of the rear surface (210b) of the rear plate (211b) in one direction (e.g., the X-axis direction) and toward the front plate (211a). A plurality of fifth edge regions (212b-2) may extend roundly from a portion of the rear surface (210b) of the rear plate (211b) in another direction (e.g., the Y-axis direction) and toward the front plate (211a). A plurality of sixth edge regions (212b-3) may extend roundly from a portion of the rear surface (210b) of the rear plate (211b) toward the front plate (211a) between the plurality of fourth edge regions (212b-1) and the plurality of fifth edge regions (212b-2).

[0069] In one embodiment, the side member (240) may surround at least a portion of the interior space between the front (210a) and the rear (210b). The side member (240) may include a first support structure (241) disposed on at least a portion of the side (211c) and a second support structure (242) connected to the first support structure (241) and forming a placement space for components of the electronic device (201).

[0070] In one embodiment, the first support structure (241) may connect the edges of the front plate (211a) and the rear plate (211b) and surround the space between the front plate (211a) and the rear plate (211b) to form a side surface (211c) of the housing (210). In one embodiment, the second support structure (242) may be disposed inside (or a body portion) of the electronic device (201). The second support structure (242) may be formed integrally with the first support structure (241), or may be formed separately and connected to the first support structure (241). In one embodiment, the first support structure (241) and / or the second support structure (241) may be a component of the housing (210).

[0071] In one embodiment, at least one PCB assembly (251, 252) may be disposed on the second support structure (242). The second support structure (242) may be connected to a ground of, for example, at least one PCB assembly (251, 252).

[0072] In one embodiment, a display (261) may be positioned on one surface of the second support structure (242) (e.g., the lower surface (+Z-axis direction surface) of FIG. 2c), and a rear plate (211b) may be positioned on the other surface of the second support structure (242) (e.g., the upper surface (-Z-axis direction surface) of FIG. 2c).

[0073] In one embodiment, the side member (240) may be formed at least in part from a conductive material. For example, the first support structure (241) may be formed from a metal and / or a conductive polymer material. In one embodiment, the second support structure (242) may be formed from a metal and / or a conductive polymer material, similar to the first support structure (241).

[0074] In one embodiment, the rear plate (211b) of the housing (210) may include a camera hole (275) for arranging a second camera module (280b) and a flash (280c), and the housing (210) may include a camera deco (273) that protects the second camera module (280b) and the flash (280c). The camera deco (273) may be coupled to the rear plate (211b) and may be arranged in the camera hole (275) so as to be visually exposed to the outside of the housing (210).

[0075] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be positioned on the front surface (210a). In one embodiment, the display (261) may be exposed through at least a portion of the front plate (211a) (e.g., a plurality of first edge regions (212a-1), a plurality of second edge regions (212a-2), and a plurality of third edge regions (212a-3). In one embodiment, the display (261) may have a shape substantially the same as an outer edge shape of the front plate (211a).

[0076] In one embodiment, the edge of the display (261) may substantially coincide with the outer rim of the front plate (211a). Although not shown in the drawings, the display (261) of various embodiments may include a touch detection circuit (not shown), a pressure sensor (not shown) capable of sensing the intensity (pressure) of a touch, and / or a digitizer (not shown) that detects a magnetic field-type stylus pen (not shown).

[0077] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (261a) may include a sensing area (261a-1) and a camera area (261a-2). In this case, the sensing area (261a-1) may overlap with at least a portion of the screen display area (261a). The sensing area (261a-1) may allow transmission of an input signal related to a sensor module (276) (e.g., the sensor module (176) of FIG. 1). The sensing area (261a-1) may display content similarly to a screen display area (261a) that does not overlap the sensing area (261a-1).

[0078] For example, the sensing region (261a-1) can display content while the sensor module (276) is not operating. The camera region (261a-2) can overlap with at least a portion of the screen display region (261a). The camera region (261a-2) can allow transmission of optical signals related to the camera modules (280a, 280b) (e.g., the camera module (180) of FIG. 1). The camera region (261a-2) can display content similarly to the screen display region (261a) that does not overlap with the camera region (261a-2). For example, the camera region (261a-2) can display content while the camera modules (280a, 280b) are not operating.

[0079] In one embodiment, the electronic device (201) may include a sensor module (276). The sensor module (276) may sense a signal applied to the electronic device (201). The sensor module (276) may be located, for example, on the front surface (210a) of the electronic device (201). The sensor module (276) may form a sensing area (261a-1) in at least a portion of the screen display area (261a). For example, the sensor module (276) may be arranged to perform its function without being visually exposed through the display (261) in the internal space of the electronic device (201). The sensor module (276) may receive an input signal penetrating the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include signals relating to the user's biometric information (e.g., the user's fingerprint, voice, etc.).

[0080] In one embodiment, the electronic device (201) may include a camera module (280a, 280b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera module (280a, 280b) may include a first camera module (280a) and a second camera module (280b), and in various embodiments, may further include a flash (280c).

[0081] In one embodiment, the first camera module (280a) may be arranged to be visually visible to the outside through the front (210a) of the housing (210), and the second camera module (280b) and the flash (280c) may be arranged to be visually visible to the outside through the rear (210b) of the housing (210). In one embodiment, at least a portion of the first camera module (280a) may be arranged in the housing (210) to be covered by the display (261). For example, the first camera module (280a) may include an under-display camera (UDC). In one embodiment, the first camera module (280a) may receive an optical signal that passes through the camera area (261a-2). In one embodiment, the second camera module (280b) may include multiple cameras (e.g., a dual camera, a triple camera, or a quad camera). In one embodiment, the flash (280c) may include a light emitting diode or a xenon lamp.

[0082] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). The input module (250) may receive a user's manipulation signal. The input module (250) may include, for example, at least one key input device that is positioned so as to be exposed on a side surface (211c) of the housing (210).

[0083] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be disposed on an outer surface of the housing (210), for example, may be disposed on a lower surface (211c) of the electronic device (201) as illustrated in FIG. 2A. Specifically, when the electronic device (201) is viewed in one direction (e.g., the +Y-axis direction of FIG. 2A), the connection terminal (278) may be disposed at a central portion of the lower surface (211c).

[0084] As illustrated in FIGS. 2a and 2b, the connection terminal (278) may be disposed on the side (211c) of the housing (210) forming the exterior of the electronic device (201), but in actual implementation, the present invention is not limited thereto, and at least some of the connection terminals may be disposed on the front (210a) or rear (210b) of the housing (210), or may be disposed inside the housing (210). For example, although not illustrated in the drawing, the housing (210) of one embodiment may include a cover (not illustrated) for replacing the battery (289).

[0085] In one embodiment, the electronic device (201) may include at least one PCB assembly (251, 252) made of one or more printed circuit boards and a battery (289) (e.g., battery (189) of FIG. 1).

[0086] In one embodiment, the electronic device (201) may include a plurality of PCB assemblies (251, 252), for example, the plurality of PCB assemblies (251, 252) may be composed of two PCB assemblies that are spaced apart from each other. For example, the plurality of PCB assemblies (251, 252) may include a first circuit board assembly (251) and a second circuit board assembly (252).

[0087] In one embodiment, the first circuit board assembly (251) may be a main board of an electronic device (201) accommodated in a first board slot (242a) of a second support structure (242), and the second circuit board assembly (252) may be a sub-board of an electronic device (201) accommodated in a second board slot (242b) of a second support structure (242).

[0088] In one embodiment, the battery (289) may be accommodated in a battery slot (245) of a second support structure (242) formed between a first substrate slot (242a) and a second substrate slot (242b).

[0089] FIG. 3a is an exploded perspective view of an electronic device (301) according to one embodiment, FIG. 3b is an exploded perspective view of an electronic device according to one embodiment, and FIG. 3c is a schematic diagram illustrating a cross-section of an electronic device (301) according to one embodiment.

[0090] Referring to FIGS. 3A, 3B, and 3C, an electronic device (301) according to one embodiment (e.g., the electronic device (101) of FIG. 1 , the electronic device (201) of FIGS. 2A, 2B, and 2C , or the PCB assembly (251, 252) of FIG. 2C ) may include at least a portion of a substrate (310), an integrated circuit (320), a shield can (330), a shielding sheet (340), and a bracket (350).

[0091] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0092] In one embodiment, the substrate (310) may be a core circuit board or a main circuit board of the electronic device (301). For example, the substrate (310) may be a high-specification or high-integration printed circuit board (310) for controlling the operation of the electronic device (301).

[0093] Hereinafter, the surface of the substrate (310) on which an electronic component such as an integrated circuit (320) is provided will be referred to as the first surface (311) of the substrate (310), and the surface opposite to the first surface (311) of the substrate (310) will be referred to as the second surface (312) of the substrate (310). For example, the first surface (311) of the substrate (310) may be a surface facing a first direction (e.g., +Z direction or upward direction), and the second surface (312) of the substrate (310) may be a surface facing a second direction opposite to the first direction (e.g., -Z direction or downward direction).

[0094] In one embodiment, the integrated circuit (320) may be provided on the first surface (311) of the substrate (310). However, the integrated circuit (320) of this document is an example of one of various electronic components included in the electronic device (301), and in an actual implementation, the electronic device (301) may include one or more electronic components or integrated circuits (320) of various types, structures, and arrangements.

[0095] For example, the integrated circuit (320) may refer to a single component that requires heat dissipation or temperature control. Alternatively, the integrated circuit (320) may be an application processor (AP) or central processing unit (CPU), communication processor (CP), wireless communication circuit, graphic element, or charging circuit that performs major computational processing.

[0096] In one embodiment, a thermal interface material (TIM) (325) may be disposed between the bracket (350) and the integrated circuit (320). The thermal interface material (325) may be made of a thermally conductive material.

[0097] In one embodiment, the thermal interface material (325) can improve thermal conductivity between the bracket (350) and the integrated circuit (320). The thermal interface material (325) can be disposed on one surface of the integrated circuit (320) (e.g., the upper surface or the surface facing the first direction). The thermal interface material (325) can be a solid TIM having a certain shape. Alternatively, the thermal interface material (325) can be formed by applying a liquid TIM to one surface of the integrated circuit (320) and curing it. However, this is exemplary, and the thermal interface material (325) is not limited thereto.

[0098] In one embodiment, a shield can (330) may be provided on a first surface (311) of a substrate (310). The shield can (330) may be positioned between the bracket (350) and the substrate (310), and may be positioned to surround the integrated circuit (320). The shield can (330) may include an opening (333) formed on one surface (e.g., an upper surface or a surface facing the first direction). The opening (333) may be provided at a position facing the integrated circuit (320) in the first direction.

[0099] In one embodiment, the shield can (330) can protect the integrated circuit (320) by preventing foreign substances such as water, water vapor, and dust from entering the space surrounding the shield can (330). Alternatively, the shield can (330) can protect the integrated circuit (320) by preventing external impact from being transmitted to the integrated circuit (320).

[0100] In one embodiment, the shield can (330) can improve the heat dissipation or cooling effect inside the shield can (330) by isolating the integrated circuit (320) and the area adjacent thereto from the outside. Alternatively, the shield can (330) can prevent electromagnetic waves from entering the integrated circuit (320), and / or the shield can (330) can seal the integrated circuit (320) so that electromagnetic waves or noise generated from the integrated circuit (320) are not emitted to the outside.

[0101] In one embodiment, the shield can (330) may be made of an electromagnetic shielding material, a non-conductor, and / or an insulator. For example, the shield can (330) may be made of graphite, a metal compound, or a polymer material.

[0102] Hereinafter, the surface of the shield can (330) facing the first direction or the bracket (350) is referred to as the first surface (331) of the shield can (330), and the surface opposite to the first surface (331) of the shield can (330) or facing the second direction is referred to as the second surface (332) of the shield can (330).

[0103] In one embodiment, a shielding sheet (340) may be provided between the shield can (330) and the bracket (350). For example, the shielding sheet (340) may be placed on the first side (331) of the shield can (330). The shielding sheet (340) may shield the inside of the shield can (330) from the outside of the shield can (330). The shielding sheet (340) may be formed of a conductive tape or a conductive film, or may be formed by applying and curing a conductive paste or cream to the first side (331) of the shield can (330).

[0104] In one embodiment, the bracket (350) may be provided in a first direction from the shield can (330). For example, the bracket (350) may face the first side (331) of the shield can (330) with the shield sheet (340) interposed therebetween.

[0105] In one embodiment, the bracket (350) may be an internal housing disposed inside an external housing of the electronic device (301) (e.g., the housing (210) of FIGS. 2A, 2B, and 2C). However, the bracket (350) may also refer to a metal structure disposed at a position that can come into contact with a thermal interface material (325) disposed on one surface of the integrated circuit (320).

[0106] For example, the bracket (350) may be an outer housing of the electronic device (301), an inner housing, a bezel or a cover of the electronic device (301). Alternatively, the bracket (350) may be thermally connected to a heat dissipation structure.

[0107] In one embodiment, the bracket (350) may be a heat dissipation chamber or heat dissipation structure. For example, as illustrated in FIG. 3b, the bracket (350) may be a vapor chamber (350-1).

[0108] In one embodiment, the vapor chamber (350-1) may be one embodiment of the bracket (350), or may be a part or all of the bracket (350). The vapor chamber (350-1) may include a first plate (353a) and a second plate (353b). The first plate (353a) and the second plate (353b) may be made of a rigid material or a material having heat dissipation performance, and may be made of, for example, a metal material or a synthetic resin.

[0109] In one embodiment, a sealed space may be provided within the first plate (353a) and the second plate (353b). A wick structure may be provided in the sealed space. The wick structure may be formed of a copper screen mesh, a working fluid, or a woven wire.

[0110] In one embodiment, a plurality of fillers (353c) may be formed on one surface of the first plate (353a). The plurality of fillers (353c) may protrude from the first plate (353a) toward the second plate (353b), such that at least a portion of the fillers may contact the wick structure.

[0111] Hereinafter, the electronic device (301) of various embodiments of the present document is described with reference to the bracket (350) illustrated in FIG. 3a, but the structure, shape, and function of the bracket (350) in actual implementation are not limited thereto, and for example, the bracket (350) may be replaced with the vapor chamber (350-1) of FIG. 3b, and the bracket (350) and descriptions related thereto may be applied to the vapor chamber (350-1) in the same or similar manner.

[0112] In one embodiment, the bracket (350) may be made of a conductive material, such as a metallic material. A thermal interface material (325) may be disposed between the bracket (350) and the integrated circuit (320), and at least a portion of the heat generated in the integrated circuit (320) may be transferred to the bracket (350) through the thermal interface material (325).

[0113] Hereinafter, the side of the bracket (350) facing the first direction is referred to as the first side (351) of the bracket (350), and the side opposite to the first side (351) of the bracket (350) or facing the second direction is referred to as the second side (352) of the bracket (350).

[0114] FIG. 4 is a schematic diagram of a cross-section of a portion of an electronic device (301) according to an embodiment. Specifically, FIG. 4 is a diagram illustrating a portion of area A1, which is a portion of area A illustrated in FIG. 3c, according to an embodiment.

[0115] Referring to FIG. 4, an electronic device (301) according to one embodiment may include a first protruding area (361) and a first open area (371).

[0116] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0117] In one embodiment, the first protruding area (361) may be provided on the second face (352) of the bracket (350). The first protruding area (361) may be formed to protrude in a second direction (e.g., in the -Z direction) from the second face (352) of the bracket (350).

[0118] For example, in an embodiment where the bracket (350) is a vapor chamber (e.g., vapor chamber (350-1) of FIG. 3b), the first protruding region (361) may be formed on a second plate (e.g., second plate (353b) of FIG. 3b).

[0119] In one embodiment, the first protruding region (361) can press the shielding sheet (340). The first protruding region (361) can press the shielding sheet (340) and come into contact with the shielding sheet (340) by protruding more than other regions of the second face (352) of the bracket (350).

[0120] In one embodiment, a first open area (371) may be provided in the shield can (330). The first open area (371) may be provided at a position facing the first protruding area (361). The first open area (371) may be a space for positioning the first protruding area (361) and the shielding sheet (340) protruding in the second direction by the first protruding area (361).

[0121] In one embodiment, the first protruding area (361) and the first open area (371) can provide contact stability between the bracket (350) and the shielding sheet (340), and can improve the shielding performance of the shield can (330) and the shielding sheet (340) of the electronic device (301).

[0122] In one embodiment, if the shield sheet (340) and the bracket (350) do not make contact or a poor contact occurs, the shield can (330) and the bracket (350) may not be electrically conductive, and the inside of the shield can (330) may not be shielded from the outside.

[0123] For example, the bracket (350) may be spaced or separated from the shielding sheet (340) by the amount of thermal interface material (325) applied or by the mechanical tolerance of the shield can (330) and the bracket (350). In this case, electromagnetic waves and noise generated from the integrated circuit (320) may be emitted to the outside of the shield can (330) and may affect the operation of other electronic components.

[0124] In one embodiment of the present document, the first protruding area (361) and the first open area (371) can ensure electrical or physical connection between the shielding sheet (340) and the bracket (350), or can improve the shielding performance of the shield can (330). Alternatively, the electronic device (301) can prevent shielding defects due to mechanical tolerances through the first protruding area (361) and the first open area (371), and can improve production yield and efficiency.

[0125] In one embodiment, the first open area (371) may be formed as a hole that opens from the first side (331) facing the first direction of the shield can (330) to the second side (332) facing the opposite direction. The first open area (371) formed as a hole may be relatively easy to manufacture compared to the case where it is formed as a groove, and the design of the electronic device (301) may be facilitated because there are fewer restrictions on the height of the first protruding area (361).

[0126] Although not shown in the drawing, the first open area (371) of one embodiment may be formed as a groove that is sunken inward from the first surface (331) of the shield can (330). The first open area (371) formed as a groove can relatively improve the durability of the shield can (330) compared to the case where it is formed alone.

[0127] Below, a method for calculating the minimum diameter (e.g., diameter in the X direction) of the first open area (371) is exemplarily described.

[0128] In one embodiment, the minimum diameter of the first open area (371) can be calculated as 'a+b+a'. Here, a can be half of the horizontal length (e.g., length in the X direction) of the area in which the shielding sheet (340) is expanded by the first protruding area (361), or can be a horizontal distance from one end (e.g., end in the -X direction) of the first open area (371) to one end (e.g., end in the -X direction) of the first protruding area (361). b can be the horizontal length (e.g., length in the X direction) of the first protruding area (361). c can be half of the diagonal length (e.g., length in the X direction) of the area in which the shielding sheet (340) is expanded by the first protruding area (361). d can be the length (e.g., length in the Z direction) in which the first protruding area (361) is protruded from the second surface (352) of the bracket (350). Additionally, the shielding sheet (340) can have a maximum elasticity of k.

[0129] In one embodiment, b and d are the lengths of the first protruding area (361), and k is a unique value of the shielding sheet (340), so that the minimum diameter a+b+a of the first open area (371) can be calculated using these. For example, c is (a 2 + d 2 ) 1 / 2 may be, and c is the deformation length of the shielding sheet (340), so it may be equal to the product of k and a. In addition, a is (d 2 / (k 2 -1)) 1 / 2 It could be.

[0130] However, this is only an exemplary calculation method, and the diameter of the first open area (371) in actual implementation may vary based on the shape and structure of the first protruding area (361) and the first open area (371), and may be larger or smaller than the calculated minimum diameter.

[0131] In one embodiment, the shield can (330) may include at least two edge regions (e.g., a third edge region (335) and a fourth edge region (336)). The third edge region (335) may refer to an edge surrounding the first open region (371) on the first side (331) of the shield can (330). The fourth edge region (336) may refer to an edge surrounding the first open region (371) on the second side (332) of the shield can (330).

[0132] In one embodiment, the third edge area (335) may be formed into a round shape. For example, the third edge area (335) may be formed into a round shape through a chamfering process or a sanding process.

[0133] In one embodiment, the third edge area (335) is in contact with the expanding area of ​​the shielding sheet (340), so there is a risk that the shielding sheet (340) may be damaged or torn when the third edge area (335) presses the shielding sheet (340). The third edge area (335) can reduce damage to the shielding sheet (340) through its rounded shape, and can provide durability and stability to the electronic device (301).

[0134] In one embodiment, a burr may be formed in the third edge area (335) or the fourth edge area (336) of the shield can (330) during the process of forming the first open area (371). The electronic device (301) may form the first open area (371) such that the burr is formed in the fourth edge area (336). For example, the drilling direction of the shield can (330) may be designed in the second direction so that the burr is not formed in the third edge area (335). Through this, damage caused by the third edge area (335) to the shield sheet (340) can be reduced, and durability and stability of the electronic device (301) can be provided.

[0135] FIG. 5a is a schematic diagram of a cross-section of a portion of a bracket (350) according to one embodiment, and FIG. 5b is a schematic diagram of a bottom surface of a portion of a bracket (350) according to one embodiment.

[0136] Referring to FIGS. 5a and 5b, the first protruding region (361) according to one embodiment may include a first bottom surface (361a), a first side surface (361b), and a first edge region (361c).

[0137] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that some components and structures of the bracket (350) and the electronic device (301) including the same may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the embodiments described above may be combined with the bracket (350) and the electronic device (301) including the same, unless it is technically clearly impossible.

[0138] In one embodiment, the first bottom surface (361a) may be a side of the first protruding region (361) facing downward (e.g., in the -Z direction) or the second direction. The first bottom surface (361a) may be a side that a shielding sheet (e.g., the shielding sheet (340) of FIG. 4) contacts.

[0139] In one embodiment, the first bottom surface (361a) may have a polygonal, circular, or oval shape based on a direction (e.g., a direction viewed in FIG. 5b) when viewed in the first direction (e.g., +Z direction). Since the first bottom surface (361a) is in contact with the expanded area of ​​the shielding sheet (340), there is a risk that the shielding sheet (340) may be damaged or torn when the first bottom surface (361a) presses against the shielding sheet (340).

[0140] In one embodiment, the first bottom surface (361a) may be formed in a circular or oval shape. Alternatively, the first bottom surface (361a) may be formed in a polygonal shape with rounded vertices (361d). For example, as shown in FIG. 5b, the first bottom surface (361a) may have a rectangular shape including four rounded vertices (361d). This can reduce damage caused to the shielding sheet (340) by the first protruding area (361), and provide durability and stability to the electronic device (301).

[0141] In one embodiment, the first side (361b) may be a side extending from the second side (352) of the bracket (350) toward the first bottom surface (361a). As illustrated in FIG. 5A, the first side (361b) may extend substantially perpendicularly in the second direction from the second side (352) of the bracket (350). The substantially perpendicular range may include a range of + / - 3 degrees, + / - 5 degrees, + / - 7 degrees, + / - 10 degrees, or + / - 15 degrees, in addition to 90 degrees.

[0142] Although not shown in the drawing, the first side surface (361b) may extend in an inward direction of the first protruding region (361) based on the second side surface (352) of the bracket (350). For example, referring to the cross-section of FIG. 5A, the side in the +X direction of the first side surface (361b) may be formed in a shape that is simultaneously inclined in the -Z direction and the -X direction from the second side surface (352) of the bracket (350). Alternatively, the side in the -X direction of the first side surface (361b) may be formed in a shape that is simultaneously inclined in the -Z direction and the +X direction from the second side surface (352) of the bracket (350).

[0143] In one embodiment, the first side (361b) is extended in an inclined manner so that at least a portion of the shielding sheet (340) can be in contact with the first side (361b). This can reduce damage caused to the shielding sheet (340) by the first protruding area (361), and provide durability and stability to the electronic device (301).

[0144] In one embodiment, the first edge area (361c) may be a surface where the first bottom surface (361a) and the first side surface (361b) meet. The first edge area (361c) may have a rounded shape. Since the first edge area (361c) comes into contact with the expanded area of ​​the shielding sheet (340), there is a risk that the shielding sheet (340) may be damaged or torn when the first edge area (361c) presses the shielding sheet (340). The first edge area (361c) can reduce damage to the shielding sheet (340) through its rounded shape, and can provide durability and stability to the electronic device (301).

[0145] Figure 6 is a schematic diagram showing the processing state of a bracket (350) according to one embodiment.

[0146] Referring to FIG. 6, the first protruding area (361) may be formed as a single body continuous with the bracket (350).

[0147] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that some components and structures of the bracket (350) and the electronic device (301) including the same may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the embodiments described above may be combined with the bracket (350) and the electronic device (301) including the same, unless it is technically clearly impossible.

[0148] In one embodiment, a first protruding area (361) may be formed in the bracket (350) through at least two cutting or polishing processes. For example, as illustrated in FIG. 6, the raw material (354, 356, 350) of the bracket (350) may be processed at least twice to form the bracket (350) including the first protruding area (361).

[0149] In one embodiment, the raw material (354, 356, 350) of the bracket (350) may be first processed to remove the first processing area (354). Through the first processing, the bottom surface of the first protruding area (361) (e.g., the first bottom surface (361a) of FIGS. 5a and 5b) may be formed.

[0150] In one embodiment, the first processed material (356, 350) of the bracket (350) can be secondarily processed to remove the second processed area (356). Through the second processing, the side surface of the first protruding area (361) (e.g., the first side surface (361b) of FIGS. 5a and 5b) can be formed.

[0151] In one embodiment, the bracket (350) may be made of a metal material, and through at least two processing steps, the first protruding area (361) may be made of one body continuous with the bracket (350).

[0152] FIG. 7a is a schematic diagram showing a processing state of a bracket (350) according to one embodiment, and FIG. 7b is a schematic diagram showing a processing state of a bracket (350) according to one embodiment.

[0153] Referring to FIGS. 7a and 7b, a first protruding region (361) according to one embodiment can be formed by being attached to a bracket (350).

[0154] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that some components and structures of the bracket (350) and the electronic device (301) including the same may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one component or feature of the embodiments described above may be combined with the bracket (350) and the electronic device (301) including the same, unless it is technically clearly impossible.

[0155] In one embodiment, a first protruding area (361) may be formed in the bracket (350) through at least one cutting or polishing process and an attachment process. For example, the raw material (354, 350) of the bracket (350) may be processed at least once, and a conductive material may be attached to form the bracket (350) including the first protruding area (361).

[0156] In one embodiment, as illustrated in FIG. 7a, the raw material (354, 350) of the bracket (350) may be first processed to remove the first processing area (354). Through the first processing, the second surface (352) of the bracket (350) (e.g., the second surface (352) of FIGS. 5a and 5b) may be formed.

[0157] In one embodiment, as illustrated in FIG. 7b, a first protruding area (361) made of a conductive material may be attached to one surface of the bracket (350). For example, a conductive tape or a conductive film may be attached to one surface of the bracket (350) to form the first protruding area (361). Alternatively, for example, a conductive cream or a conductive paste may be dropped onto one surface of the bracket (350) and cured to form the first protruding area (361).

[0158] FIG. 8A is a plan view of an electronic device (301) according to one embodiment. Specifically, FIG. 8A is a plan view of the electronic device (301) viewed in a second direction (e.g., in the -Z direction or downward direction) from a bracket (350) of the electronic device (301).

[0159] Referring to FIG. 8A, an electronic device (301) according to one embodiment may include a plurality of first protruding areas (361).

[0160] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0161] In one embodiment, the electronic device (301) may include a plurality of first protruding areas (361). Additionally, the electronic device (301) may include a plurality of first open areas (371) corresponding to the first protruding areas (361).

[0162] For example, a single first protruding region (361) and a single first open region (371) may form a pair. Hereinafter, the configuration of the electronic device (301) is described based on the first protruding region (361) and the first open region (371) forming a pair, but the actual implementation of the electronic device (301) is not limited thereto, and for example, a single first open region (371) may be formed for at least two first protruding regions (361).

[0163] In one embodiment, the plurality of first protruding regions (361) may be arranged in a direction surrounding the integrated circuit (320). For example, when the electronic device (301) is viewed in a planar direction (e.g., the second direction or the -Z direction), the plurality of first protruding regions (361) may be arranged to surround an outer peripheral surface of the integrated circuit (320). Each of the plurality of first open regions (371) may be provided at a position corresponding to each of the plurality of first protruding regions (361).

[0164] In one embodiment, a plurality of first protruding areas (361) are arranged to surround the integrated circuit (320), thereby ensuring electrical or physical connection between the shielding sheet (340) and the bracket (350), or improving the shielding performance of the shield can (330).

[0165] In one embodiment, the plurality of first protruding regions (361) may be arranged in a plurality of rows surrounding the integrated circuit (320). For example, some of the plurality of first protruding regions (361) may be arranged in one row adjacent to the outer surface of the integrated circuit (320), and other of the plurality of first protruding regions (361) may be arranged in at least one row adjacent to the outer surface of the integrated circuit (320) with another row therebetween. Through this, the electrical or physical connection between the shielding sheet (340) and the bracket (350) can be stably ensured, or the shielding performance of the shield can (330) can be further improved.

[0166] In one embodiment, the plurality of first protruding regions (361) may be arranged in a zigzag pattern when the electronic device (301) is viewed in a planar direction (e.g., the second direction or the -Z direction). Alternatively, the plurality of first protruding regions (361) may be arranged such that at least some of the first protruding regions (361) are spaced apart from each other in the planar direction when the electronic device (301) is viewed in a planar direction (e.g., the second direction or the -Z direction). Alternatively, the plurality of first protruding regions (361) may be arranged irregularly when the electronic device (301) is viewed in a planar direction (e.g., the second direction or the -Z direction). Through this, the electrical or physical connection between the shielding sheet (340) and the bracket (350) can be stably ensured.

[0167] FIG. 8B is a plan view of an electronic device (301) according to one embodiment. Specifically, FIG. 8B is a plan view of the electronic device (301) viewed in a second direction (e.g., in the -Z direction or downward direction) from a bracket (350) of the electronic device (301).

[0168] Referring to FIG. 8b, the first open area (371) can be utilized for the purpose of injecting a heat dissipating material (327) into the inside of the shield can (330).

[0169] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0170] In one embodiment, the first open area (371) may include an injection open area (3711). The injection open area (3711) may refer to the first open area (371) utilized to inject a heat dissipating material (327).

[0171] For example, at least some of the plurality of first open areas (371) may be utilized as injection open areas (3711). Alternatively, if the electronic device (301) includes a single first open area (371), the single first open area (371) may be utilized as the injection open area (3711).

[0172] In one embodiment, the heat dissipation material (327) may be injected into the shield can (330) through the injection opening area (3711). If the heat dissipation material (327) is injected and cured before the shield can (330) is assembled to the substrate (310), additional tolerances may be created due to the heat dissipation material (327), or the heat dissipation material (327) may be injected beyond the position where the shield can (330) is to be assembled, which may affect the assembly of the shield can (330).

[0173] In one embodiment of the present document, the first open area (371) can be utilized as a space for injecting a heat dissipation material (327) into the interior of the shield can (330) after the shield can (330) is assembled. Through this, the heat dissipation performance of the electronic device (301) can be improved, and the production yield and efficiency of the electronic device (301) can be improved.

[0174] In one embodiment, the injection opening area (3711) may be formed to be larger in size than the other first open areas (371). In addition, among the plurality of first protrusion areas (361), any first protrusion area (3611) corresponding to the injection opening area (3711) may be larger in size than the other first protrusion areas (361). By forming the injection opening area (3711) to be large, the injection of the heat dissipation material (327) may be made easier and more convenient. However, this is merely an exemplary embodiment, and the actual implementation of the injection opening area (3711) is not limited thereto, and the injection opening area (3711) may have the same or similar size and shape as the other first open areas (371).

[0175] FIG. 9 is a schematic diagram of a cross-section of a portion of an electronic device (301) according to an embodiment. Specifically, FIG. 9 is a diagram illustrating a portion of area A2, which is a portion of area A illustrated in FIG. 3c, according to an embodiment.

[0176] Including FIG. 9, an electronic device (301) according to one embodiment may include a second protruding area (362) and a second open area (372).

[0177] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0178] In one embodiment of the present document, the A1 area of ​​FIG. 4 and the A2 area of ​​FIG. 9 may be independent embodiments, and the electronic device (301) may include only one of the A1 area and the A2 area. Alternatively, the electronic device (301) may include both the A1 area and the A2 area. Area A3, which is one of the examples including both the A1 area and the A2 area, will be described with reference to FIG. 10.

[0179] In one embodiment, the second protruding area (362) may be provided on the first surface (331) of the shield can (330). The second protruding area (362) may be formed to protrude in the first direction from the first surface (331) of the shield can (330).

[0180] In one embodiment, the second protruding region (362) can press the shielding sheet (340). The second protruding region (362) can press the shielding sheet (340) and come into contact with the shielding sheet (340) by protruding more than other regions of the first surface (331) of the shield can (330).

[0181] In one embodiment, a second open area (372) may be provided in the bracket (350). The second open area (372) may be provided at a position facing the second protruding area (362). The second open area (372) may be a space for positioning the second protruding area (362) and the shielding sheet (340) protruding in the first direction by the second protruding area (362).

[0182] In one embodiment, the second protruding area (362) and the second open area (372) can provide contact stability between the bracket (350) and the shielding sheet (340), and can improve the shielding performance of the shield can (330) and the shielding sheet (340) of the electronic device (301).

[0183] In one embodiment, if the shield sheet (340) and the bracket (350) do not make contact or a poor contact occurs, the shield can (330) and the bracket (350) may not be electrically conductive, and the inside of the shield can (330) may not be shielded from the outside.

[0184] For example, the bracket (350) may be spaced or separated from the shielding sheet (340) by the amount of thermal interface material (325) applied or by the mechanical tolerance of the shield can (330) and the bracket (350). In this case, electromagnetic waves and noise generated from the integrated circuit (320) may be emitted to the outside of the shield can (330) and may affect the operation of other electronic components.

[0185] In one embodiment of the present document, the second protruding region (362) and the second open region (372) can ensure electrical or physical connection between the shielding sheet (340) and the bracket (350), or can improve the shielding performance of the shield can (330). Alternatively, the electronic device (301) can prevent shielding defects due to mechanical tolerances through the second protruding region (362) and the second open region (372), and can improve production yield and efficiency.

[0186] The second open area (372) of one embodiment may be formed as a groove that is sunken inward from the second surface (352) of the bracket (350). The second open area (372) formed as a groove can improve the durability of the bracket (350) and protect it from water or foreign substances from entering from the outside through the second open area (372).

[0187] In one embodiment, the method for calculating the minimum diameter (e.g., diameter in the X direction) of the second open area (372) can be applied with reference to the method for calculating the minimum diameter of the first open area (371) described above in FIG. 4.

[0188] In one embodiment, the bracket (350) may include at least a fifth edge region (355). The fifth edge region (355) may refer to an edge surrounding the second open region (372) on the second side (352) of the bracket (350).

[0189] In one embodiment, the fifth edge area (355) may be formed into a round shape. For example, the fifth edge area (355) may be formed into a round shape through a chamfering process or a sanding process.

[0190] In one embodiment, the fifth edge region (355) is in contact with the expanding region of the shielding sheet (340), so there is a risk that the shielding sheet (340) may be damaged or torn when the fifth edge region (355) presses the shielding sheet (340). The fifth edge region (355) can reduce damage to the shielding sheet (340) through its rounded shape, and can provide durability and stability to the electronic device (301).

[0191] In one embodiment, the second protruding region (362) may include a second bottom surface (362a), a second side surface (362b), and a second edge region (362c).

[0192] In one embodiment, the second bottom surface (362a) may be a side of the second protruding region (362) facing upward (e.g., in the +Z direction) or the first direction. Alternatively, the second bottom surface (362a) may be a side that the shielding sheet (340) contacts.

[0193] In one embodiment, the second bottom surface (362a) may have a polygonal, circular, or oval shape when viewed in the second direction. Since the second bottom surface (362a) is in contact with the expanded area of ​​the shielding sheet (340), there is a risk that the shielding sheet (340) may be damaged or torn when the second bottom surface (362a) presses against the shielding sheet (340).

[0194] In one embodiment, the second bottom surface (362a) may be formed in a circular or oval shape. Alternatively, the second bottom surface (362a) may be formed in a polygonal shape with rounded corners. For example, the second bottom surface (362a) may have a rectangular shape with four rounded corners. This can reduce damage caused to the shielding sheet (340) by the second protruding area (362), and provide durability and stability to the electronic device (301).

[0195] In one embodiment, the second side (362b) may be a side extending from the first side (331) of the shield can (330) toward the second bottom surface (362a). As illustrated in FIG. 9, the second side (362b) may extend substantially perpendicularly in the first direction from the first side (331) of the shield can (330). The substantially perpendicular range may include a range of + / - 3 degrees, + / - 5 degrees, + / - 7 degrees, + / - 10 degrees, or + / - 15 degrees, in addition to 90 degrees.

[0196] Although not shown in the drawing, the second side surface (362b) may extend in an inward direction of the second protruding region (362) based on the first side surface (331) of the shield can (330). For example, referring to the cross-section of FIG. 9, the side in the +X direction of the second side surface (362b) may be formed in a shape that is simultaneously inclined in the +Z direction and the -X direction from the first side surface (331) of the shield can (330). Alternatively, the side in the -X direction of the second side surface (362b) may be formed in a shape that is simultaneously inclined in the +Z direction and the +X direction from the first side surface (331) of the shield can (330).

[0197] In one embodiment, the second side (362b) is extended in an inclined manner so that at least a portion of the shielding sheet (340) can be in contact with the second side (362b). This can reduce damage caused to the shielding sheet (340) by the second protruding area (362), and provide durability and stability to the electronic device (301).

[0198] In one embodiment, the second edge area (362c) may be a surface where the second bottom surface (362a) and the second side surface (362b) meet. The second edge area (362c) may have a rounded shape. Since the second edge area (362c) comes into contact with the expanded area of ​​the shielding sheet (340), there is a risk that the shielding sheet (340) may be damaged or torn when the second edge area (362c) presses the shielding sheet (340). The second edge area (362c) can reduce damage to the shielding sheet (340) through its rounded shape, and can provide durability and stability to the electronic device (301).

[0199] In one embodiment of the present document, the description of the first protruding area (361) described above may be applied to the second protruding area (362) in the same or similar manner. In addition, the description of the first open area (371) described above may be applied to the second open area (372) in the same or similar manner.

[0200] Fig. 10 is a schematic diagram of a cross-section of a portion of an electronic device (301) according to one embodiment. Specifically, Fig. 10 is a diagram illustrating a portion of area A3, which is a portion of area A illustrated in Fig. 3c, according to one embodiment.

[0201] Referring to FIG. 10, an electronic device (301) according to one embodiment may include a first protruding area (361), a second protruding area (362), a first open area (371), and a second open area (372).

[0202] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0203] In one embodiment, a single first protruding region (361) and a single first open region (371) may form a pair. Additionally, a single second protruding region (362) and a single second open region (372) may form a pair.

[0204] In one embodiment, the electronic device (301) may include both a pair of first protruding areas (361) and a first open area (371) and a pair of second protruding areas (362) and a second open area (372).

[0205] For example, a pair of first protruding regions (361) and a first open region (371) may be spaced apart from and adjacent to a pair of second protruding regions (362) and a second open region (372). Through this, the electronic device (301) can ensure electrical or physical connection between the shielding sheet (340) and the bracket (350), or improve the shielding performance of the shield can (330). Alternatively, the electronic device (301) can prevent shielding defects due to mechanical tolerances, and improve production yield and efficiency.

[0206] Fig. 11 is a plan view of an electronic device (301) according to one embodiment. Specifically, Fig. 11 is a plan view of the electronic device (301) viewed in a second direction (e.g., in the -Z direction or downward direction) from a bracket (350) of the electronic device (301).

[0207] Referring to FIG. 11, a plurality of first protruding regions (361) and a plurality of second protruding regions (362) according to one embodiment may be arranged alternately in a direction surrounding the integrated circuit (320).

[0208] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0209] In one embodiment, the electronic device (301) may include a plurality of second protruding areas (362). Additionally, the electronic device (301) may include a plurality of second open areas (372) corresponding to the second protruding areas (362).

[0210] For example, a single second protruding region (362) and a single second open region (372) may form a pair. Hereinafter, the configuration of the electronic device (301) is described based on the second protruding region (362) and the second open region (372) forming a pair, but the actual implementation of the electronic device (301) is not limited thereto, and for example, a single second open region (372) may be formed for at least two second protruding regions (362).

[0211] In one embodiment, the plurality of second protruding regions (362) may be arranged in a direction surrounding the integrated circuit (320). For example, when the electronic device (301) is viewed in a planar direction (e.g., the second direction or the -Z direction), the plurality of second protruding regions (362) may be arranged to surround an outer peripheral surface of the integrated circuit (320). Each of the plurality of second open regions (372) may be provided at a position corresponding to each of the plurality of second protruding regions (362).

[0212] In one embodiment, a plurality of second protruding regions (362) are arranged to surround the integrated circuit (320), thereby ensuring electrical or physical connection of the shielding sheet (340) and the bracket (350), or improving the shielding performance of the shield can (330).

[0213] In one embodiment, the plurality of first protruding regions (361) and the plurality of second protruding regions (362) may be arranged in a plurality of rows surrounding the integrated circuit (320). For example, some of the plurality of first protruding regions (361) and the plurality of second protruding regions (362) may be arranged in one row adjacent to the outer surface of the integrated circuit (320), and other some of the plurality of first protruding regions (361) and the plurality of second protruding regions (362) may be arranged in at least one row adjacent to the outer surface of the integrated circuit (320) with another row therebetween. Through this, the electrical or physical connection of the shielding sheet (340) and the bracket (350) can be stably ensured, or the shielding performance of the shield can (330) can be further improved.

[0214] In one embodiment, at least some of the plurality of first protruding regions (361) and the plurality of second protruding regions (362) may be arranged alternately in a direction surrounding the integrated circuit (320) when the electronic device (301) is viewed in a planar direction (e.g., the second direction or the -Z direction). Through this, a stable electrical or physical connection between the shielding sheet (340) and the bracket (350) can be ensured.

[0215] In one embodiment, the side wall (365) may be a structure that protrudes in the second direction from the bracket (350). The side wall (365) may extend to surround at least a portion of the opening (333). The side wall (365) according to one embodiment of the present document is described in detail with reference to FIGS. 12A, 12B, and 12C.

[0216] In one embodiment, as illustrated in FIG. 11, the side wall (365) may be spaced apart from the plurality of first protruding areas (361) and / or the plurality of second protruding areas (362) by a predetermined distance.

[0217] Without being limited thereto, at least a portion of the side wall (365) may be included in the first protruding region (361). Alternatively, at least a portion of the side wall (365) may be connected to the first protruding region (361). In one embodiment, when the side wall (365) is included in or connected to the first protruding region (361), at least a portion of the opening (333) may be included in or connected to the first open region (371). Through the connection structure of the side wall (365) and the first protruding region (361), electrical and / or physical bonding stability of the bracket (350) and the shield can (330) may be provided.

[0218] FIG. 12a is an exploded perspective view of an electronic device (301) according to one embodiment, FIG. 12b is a schematic diagram of a cross-section of a portion of an electronic device (301) according to one embodiment, and FIG. 12c is a schematic diagram of a cross-section of a portion of an electronic device (301) according to one embodiment.

[0219] Referring to FIGS. 12a, 12b and 12c, a bracket (350) of an electronic device (301) according to one embodiment may include a side wall (365).

[0220] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0221] In one embodiment, the shielding sheet (340) may further include a side region (345). The side region (345) may be a portion of the shielding sheet (340) extending toward the center of the opening (333) of the shield can (330). Alternatively, the side region (345) may be a portion of the shielding sheet (340) facing a side surface surrounding the opening (333) of the shield can (330).

[0222] In one embodiment, a side wall (365) may be provided on the second side (352) of the bracket (350). The side wall (365) may protrude and surround at least a portion of an opening (333) of the shield can (330). For example, the side wall (365) may have a shape corresponding to the shape of the opening (333), and the side wall (365) may have an outer diameter smaller than the opening (333).

[0223] In one embodiment, the side wall (365) can be in contact with the side area (345) of the shield sheet (340). When the bracket (350) is inserted into the shield can (330), the side wall (365) is inserted into the opening (333), and the side area (345) protruding inside the opening (333) can be in contact with the side wall (365).

[0224] For example, FIGS. 12b and 12c are schematic diagrams exemplarily illustrating an operation of assembling a bracket (350) to a shield can (330) during the assembly process of an electronic device (301). Referring to FIGS. 12b and 12c, a side region (345) of a shield sheet (340) can be pressed and folded by a side wall (365) of the bracket (350). The side region (345) can be in close contact with the side wall (365) at least in a portion of the area.

[0225] In one embodiment of the present document, the side wall (365) and the side region (345) can ensure electrical or physical connection between the shielding sheet (340) and the bracket (350), or can improve the shielding performance of the shield can (330). Alternatively, the electronic device (301) can prevent shielding defects due to mechanical tolerances through the side wall (365) and the side region (345), and can improve production yield and efficiency.

[0226] In an electronic device (301) according to one embodiment, the electronic device may include a substrate (310) including a first surface (311) facing a first direction, an integrated circuit (320) provided on the first surface (311) of the substrate (310), a shield can (330) provided on the first surface (311) of the substrate (310) and surrounding at least a portion of the integrated circuit (320), a bracket (350) provided in the first direction from the shield can (330), and a shielding sheet (340) provided between the bracket (350) and the shield can (330). In one embodiment, the bracket (350) may include a first protruding area (361) protruding from a surface (352) facing a second direction opposite to the first direction. In one embodiment, the shield can (330) may include a first open area (371) provided at a position facing the first protruding area (361).

[0227] In one embodiment, the first protruding region (361) may include a first bottom surface (361a) facing the second direction, a first side surface (361b) extending from a second direction-facing side surface (352) of the bracket (350) toward the first bottom surface (361a), and a first edge region (361c) where the first bottom surface (361a) and the first side surface (361b) meet.

[0228] In one embodiment, the first edge region (361c) may be formed in a round shape.

[0229] In one embodiment, the first bottom surface (361a) may be formed into a polygonal shape with a rounded vertex (361d).

[0230] In one embodiment, the first side (361b) may extend in an inward direction of the first protruding region (361) with respect to one side (352) facing the second direction of the bracket (350).

[0231] In one embodiment, the electronic device (301) may include a plurality of first protruding regions (361). In one embodiment, the plurality of first protruding regions (361) may be arranged in a direction surrounding the integrated circuit (320).

[0232] In one embodiment, the shield can (330) may further include a second protruding area (362) protruding from one side (331) facing the first direction. In one embodiment, the bracket (350) may further include a second open area (372) provided at a position facing the second protruding area (362).

[0233] In one embodiment, the second protruding region (362) may include a second bottom surface (362a) facing the first direction, a second side surface (362b) extending from one side (331) of the shield can (330) facing the first direction toward the second bottom surface (362a), and a second edge region (362c) where the second bottom surface (362a) and the second side surface (362b) meet.

[0234] In one embodiment, the second edge region (362c) may be formed in a round shape.

[0235] In one embodiment, the second bottom surface (362a) may be formed in a polygonal shape with rounded vertices.

[0236] In one embodiment, the second side (362b) may extend in an inclined direction in the inward direction of the second protruding region (362) based on one side (331) facing the first direction of the shield can (330).

[0237] In one embodiment, the electronic device (301) may include a plurality of second protruding regions (362). In one embodiment, the plurality of second protruding regions (362) may be arranged in a direction surrounding the integrated circuit (320).

[0238] In one embodiment, the shield can (330) may include a third edge area (335) surrounding the first open area (371) on one side (331) facing the first direction. In one embodiment, the third edge area (335) may have a rounded shape.

[0239] In one embodiment, the shield can (330) may include an opening (333) provided at a position facing the integrated circuit (320). In one embodiment, the bracket (350) may include a side wall (365) protruding from one side (352) facing the second direction and surrounding at least a portion of the opening (333) of the shield can (330).

[0240] In one embodiment, the bracket (350) may be made of a metal material. The first protruding region (361) may be made of a single body that is continuous with the bracket (350).

[0241] In one embodiment, the first protruding region (361) may be made of a conductive material that is attached to a portion of the bracket (350).

[0242] In one embodiment, the first open area (371) may be formed as a hole that opens from one side (331) facing the first direction of the shield can (330) to the other side (332) facing the opposite direction.

[0243] In one embodiment, the first open area (371) may be formed as a groove that is sunken inward from the first direction-facing surface (331) of the shield can (330).

[0244] In addition, an electronic device (301) according to an embodiment of the present document may include a substrate (310) including a first surface (311) facing a first direction, an integrated circuit (320) provided on the first surface (311) of the substrate (310), a shield can (330) provided on the first surface (311) of the substrate (310) and surrounding at least a portion of the integrated circuit (320), a bracket (350) including a first protruding area (361) provided in the first direction from the shield can (330) and protruding from a surface (352) facing a second direction opposite to the first direction, and a shielding sheet (340) provided between the bracket (350) and the shield can (330). In one embodiment, the shield can (330) may include a first open area (371) provided at a position facing the first protruding area (361) and a second protruding area (362) protruding from a side (331) facing the first direction. In one embodiment, the bracket (350) may further include a second open area (372) provided at a position facing the second protruding area (362).

[0245] In one embodiment, the electronic device (301) may include a plurality of first protruding areas (361) and second protruding areas (362).

[0246] In one embodiment, at least some of the plurality of first protruding regions (361) and the plurality of second protruding regions (362) may be arranged alternately in a direction surrounding the integrated circuit (320).

[0247] Although the preferred embodiments have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the scope of the claims. Furthermore, such modifications should not be individually understood from the technical idea or perspective.

Claims

1. In an electronic device (301), A substrate (310) including a first surface (311) facing a first direction; An integrated circuit (320) provided on the first surface (311) of the above substrate (310); A shield can (330) provided on the first surface (311) of the substrate (310) and surrounding at least a portion of the integrated circuit (320); A bracket (350) provided in the first direction from the above shield can (330); and Including a shielding sheet (340) provided between the above bracket (350) and the shield can (330), The above bracket (350) includes a first protruding area (361) protruding from one side (352) facing a second direction opposite to the first direction, An electronic device (301), wherein the shield can (330) includes a first open area (371) provided at a position facing the first protruding area (361).

2. In paragraph 1, The above first protruding area (361) is The first floor surface (361a) facing the second direction, A first side surface (361b) extending from one side (352) facing the second direction of the bracket (350) toward the first bottom surface (361a), and An electronic device (301) including a first edge area (361c) where the first bottom surface (361a) and the first side surface (361b) meet.

3. In paragraph 1 or 2, The above first edge area (361c) is An electronic device (301) having a round shape.

4. In any one of paragraphs 1 to 3, The above first floor surface (361a) is An electronic device (301) formed in a polygonal shape with a rounded vertex (361d).

5. In any one of paragraphs 1 to 4, The above first side (361b) is, An electronic device (301) that extends in an inward direction of the first protruding area (361) based on one side (352) facing the second direction of the bracket (350).

6. In any one of paragraphs 1 to 5, The above electronic device (301) includes a plurality of the first protruding areas (361), The plurality of first protruding areas (361) are An electronic device (301) arranged in a direction surrounding the above integrated circuit (320).

7. In any one of paragraphs 1 to 6, The above shield can (330) further includes a second protruding area (362) protruding from one side (331) facing the first direction, An electronic device (301), wherein the above bracket (350) further includes a second open area (372) provided at a position facing the second protruding area (362).

8. In any one of paragraphs 1 to 7, The above second protruding area (362) is A second floor surface (362a) facing the first direction, A second side surface (362b) extending from one side (331) facing the first direction of the shield can (330) toward the second bottom surface (362a), and An electronic device (301) including a second edge area (362c) where the second bottom surface (362a) and the second side surface (362b) meet.

9. In any one of paragraphs 1 to 8, The above second edge area (362c) is An electronic device (301) having a round shape.

10. In any one of paragraphs 1 to 9, The above second floor surface (362a) is An electronic device (301) formed in a polygonal shape with rounded vertices.

11. In any one of paragraphs 1 to 10, The second side (362b) above is, An electronic device (301) that extends in an inward direction of the second protruding area (362) based on one side (331) facing the first direction of the shield can (330).

12. In any one of paragraphs 1 to 11, The above electronic device (301) includes a plurality of the second protruding areas (362), The plurality of second protruding areas (362) are An electronic device (301) arranged in a direction surrounding the above integrated circuit (320).

13. In any one of paragraphs 1 to 12, The above shield can (330) is On one side (331) facing the first direction, a third edge area (335) surrounding the first open area (371) is included, The above third edge area (335) is an electronic device (301) formed in a round shape.

14. In any one of paragraphs 1 to 13, The above shield can (330) includes an opening (333) provided at a position facing the integrated circuit (320), An electronic device (301), wherein the bracket (350) includes a side wall (365) that protrudes from one side (352) facing the second direction and surrounds at least a portion of the opening (333) of the shield can (330).

15. In any one of paragraphs 1 to 14, The above bracket (350) is made of a metal material, The above first protruding area (361) is an electronic device (301) formed as one body continuous with the bracket (350).

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