Bendable heat dissipation sheet and electronic device including same

Abstract

An electronic device according to an embodiment may comprise: a first housing; a second housing configured to be rotatable with respect to the first housing; a hinge for connecting the first housing and the second housing; a flexible display disposed in the first housing and the second housing and configured to be at least partially bendable; and a heat dissipation sheet disposed on the rear surface of the flexible display. The heat dissipation sheet may comprise: a first heat dissipation unit; a second heat dissipation unit provided at a portion corresponding to the hinge and configured to be bendable or stretchable; and a bonding unit configured to bond the first heat dissipation unit and the second heat dissipation unit.

Description

Bending heat dissipation sheet and electronic device including same

[0001] Various embodiments of the present disclosure relate to a bendable heat dissipation sheet and an electronic device including the same.

[0002] Mobile electronic devices, such as smartphones, can provide a variety of functions, such as phone calls, video playback, and internet browsing, based on various applications. Users may want to utilize these various functions on a larger screen, but a larger screen can reduce portability. Accordingly, foldable electronic devices that utilize a folding structure to enhance portability have been proposed. For example, a foldable electronic device may include a first housing and a second housing that are connected in opposing directions so as to be rotatable relative to a hinge structure. Such a foldable electronic device may include a foldable display that, when unfolded, extends across the first and second housings.

[0003] In order to effectively dissipate heat generated from components placed inside an electronic device, in the case of a conventional bar-shaped electronic device, it may be possible to attach a heat dissipation sheet to an area close to the entire surface area of ​​the display. However, with the introduction of foldable electronic devices, there is a need to present a separate structure different from the heat dissipation structure applied to a conventional bar-shaped electronic device.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0005] Foldable electronic devices have a bending area due to a hinge structure that folds or unfolds the first and second housings. Therefore, when a non-stretchy, integrated heat dissipation sheet that crosses the first and second housings is attached to the back of the flexible display, not only is it difficult to perform the normal folding or unfolding operation of the flexible display, but durability may also be reduced due to changes in the length of the heat dissipation sheet arranged on the back of the variable area of ​​the flexible display. Therefore, there may be limitations in applying a heat dissipation structure applied to a conventional bar-shaped electronic device to a foldable electronic device.

[0006] Various embodiments of the present disclosure can provide an electronic device including a heat dissipation sheet configured to be bendable in a region where a flexible display is bent. The heat dissipation sheet according to various embodiments of the present disclosure can reduce the space occupied by a foldable electronic device.

[0007] An electronic device according to one embodiment may include a first housing, a second housing configured to be rotatable relative to the first housing, a hinge connecting the first housing and the second housing, a flexible display disposed in the first housing and the second housing and configured to have at least a portion thereof bendable, and a heat dissipation sheet disposed on a back surface of the flexible display. The heat dissipation sheet may include a first heat dissipation portion, a second heat dissipation portion provided at a portion corresponding to the hinge and configured to be bendable or stretchable, and a joining portion configured to join the first heat dissipation portion and the second heat dissipation portion.

[0008] A heat dissipation sheet according to one embodiment may include a first heat dissipation portion, a second heat dissipation portion having a different material from the first heat dissipation portion, being arranged to be spaced apart from the first heat dissipation portion and configured to be bendable or stretchable, and a joint portion configured to join the first heat dissipation portion and the second heat dissipation portion.

[0009] According to various embodiments proposed in the present disclosure, a foldable electronic device can improve the durability of a heat dissipation sheet by having a bendable heat dissipation sheet.

[0010] The effects that can be obtained from the exemplary embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from implementing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0012] FIG. 2A is a perspective view of a foldable electronic device in an unfolding state according to one embodiment.

[0013] FIG. 2b is a perspective view of a foldable electronic device in a folding state according to one embodiment.

[0014] FIG. 3 is an exploded view of a foldable electronic device according to one embodiment.

[0015] Figure 4 is a plan view of a heat dissipation sheet according to one embodiment.

[0016] Fig. 5 is a cross-sectional view of the heat dissipation sheet of Fig. 4 taken along the longitudinal direction.

[0017] FIGS. 6a, 6b, 6c, and 6d are drawings for explaining the bonding structure of a heat dissipation sheet according to various embodiments.

[0018] FIG. 7 is a cross-sectional view of a display assembly according to one embodiment.

[0019] The following description refers to the attached drawings, and specific examples of implementations are illustrated within the drawings. Furthermore, other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0020] The various embodiments used to illustrate the principles of the present disclosure, as illustrated in FIGS. 1 through 7 below and in this patent document, are for illustrative purposes only and should not be construed as limiting the scope of the present disclosure in any way. Those skilled in the art will appreciate that the principles of the present disclosure can be implemented in any appropriately arranged system or device.

[0021] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0022] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0025] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0031] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0032] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0036] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0041] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0042] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0046] FIG. 2A is a perspective view of a foldable electronic device in an unfolded state according to one embodiment. FIG. 2B is a perspective view of a foldable electronic device in a folded state according to one embodiment. FIG. 3 is an exploded view of a foldable electronic device according to one embodiment.

[0047] The electronic devices illustrated in FIGS. 2A to 3 are for illustrative purposes only, and the present disclosure is not limited by the drawings. The XYZ coordinate systems illustrated in FIGS. 2A to 3 are for illustrative purposes only, and do not limit the scope of the invention.

[0048] An electronic device (200) (e.g., electronic device (101) of FIG. 1) may include at least one pair of housings (210, 220). The pair of housings (210, 220) may be rotatably coupled to face each other and folded based on, for example, a hinge (e.g., hinge (240) of FIG. 3). For example, the pair of housings (210, 220) may include a first housing (210) and a second housing (220). The first housing (210) and the second housing (220) may be arranged on both sides with a folding axis (F) as the center. One end region of the first housing (210) and one end region of the second housing (220) may be arranged side by side with the hinge (240) therebetween. The first housing (210) and the second housing (220) may have a shape symmetrical about a plane extending in the Z1-axis direction and including a folding axis (F). Here, the folding axis (F) may be an X1-direction axis formed by a hinge (240).

[0049] The first housing (210) may have substantially the same length (e.g., length in the Y1-axis direction) as the second housing (220), but is not limited thereto. The first housing (210) may have substantially the same width (e.g., width in the X1-axis direction) as the second housing (220), but is not limited thereto.

[0050] Hereinafter, the 'unfolding state' or 'flat state' may refer to a state in which the angle formed by the first housing (210) and the second housing (220) is substantially 180 degrees. The 'folding state' or 'folded state' may refer to a state in which the angle formed by the first housing (210) and the second housing (220) is substantially 0 degrees. The 'intermediate state' may refer to any state between the unfolding state and the folded state. In the electronic device (200), for example, the first housing (210) and the second housing (220) may rotate about the hinge (240) to form an angle of 0 to 180 degrees. In the electronic device (200), for example, the first housing (210) and the second housing (220) may rotate about a hinge (240) between 180 degrees and 360 degrees.

[0051] The first housing (210) may include a first surface (210a) and a second surface (210b). The first surface (210a) may be provided to face, for example, a first direction (e.g., a +Z1 axis direction). The first surface (210a) may be, for example, a surface on which at least a portion of the flexible display (230) is disposed. The first surface (210a) may refer to, for example, a virtual surface that overlaps at least a portion of the flexible display (230). The second surface (210b) may be provided to face, for example, a second direction (e.g., a -Z1 axis direction). The second surface (210b) may be, for example, a surface on which the first rear cover (212) is disposed. The second surface (210b) may be parallel to the first surface (210a). The second surface (210b) may refer to a plane defined by, for example, the first rear cover (212).

[0052] The second housing (220) may include a third surface (220a) and a fourth surface (220b). The third surface (220a) may be provided to face, for example, a first direction (e.g., a +Z1 axis direction). The third surface (220a) may be, for example, a surface on which at least a portion of the flexible display (230) is disposed. The third surface (220a) may refer to, for example, a virtual surface that overlaps at least a portion of the flexible display (230). The fourth surface (220b) may be provided to face, for example, a second direction (e.g., a -Z1 axis direction). The fourth surface (220b) may be, for example, a surface on which the second rear cover (222) is disposed. The fourth surface (220b) may be parallel to the third surface (220a). The fourth surface (220b) may refer to a plane defined by, for example, the second rear cover (222).

[0053] When the electronic device (200) is unfolded, the first side (210a) and the third side (220a) can be positioned within one arbitrary virtual plane (e.g., X1-Y1 plane). For example, the first side (210a) and the third side (220a) can form the same plane when the electronic device (200) is unfolded. For example, the first side (210a) and the third side (220a) can be arranged to form 180 degrees with respect to the X1-Y1 plane when the electronic device (200) is unfolded. When the electronic device (200) is unfolded, the second side (210b) and the fourth side (220b) can be positioned within another arbitrary virtual plane (e.g., X1-Y1 plane). For example, the second side (210b) and the fourth side (220b) can form the same plane when the electronic device (200) is unfolded. For example, the second side (210b) and the fourth side (220b) can be arranged to form 180 degrees with respect to the X1-Y1 plane in an unfolded state.

[0054] In a folded state of the electronic device (200), at least a part of the first side (210a) and at least a part of the third side (220a) may face each other. For example, in a folded state of the electronic device (200), the angle formed by the first side (210a) and the third side (220a) may be 0 degrees with respect to the X1-Y1 plane. As the electronic device (200) is folded from an unfolded state, the angle formed by the first side (210a) and the third side (220a) with respect to the X1-Y1 plane may gradually decrease. For example, in an intermediate state, the angle formed by the first side (210a) and the third side (220a) with respect to the X1-Y1 plane may be determined between about 0 degrees and about 180 degrees. In a folded state of the electronic device (200), the second side (210b) and the fourth side (220b) may be parallel to each other. For example, the second side (210b) and the fourth side (220b) may face opposite directions when the electronic device (200) is folded.

[0055] A pair of housings (210, 220) included in the electronic device (200) are not limited to the illustrated shape and combination, and may be implemented by a combination and / or combination of other shapes or parts.

[0056] The first housing (210) may include a first side frame (211). The first side frame (211) may constitute a side of the first housing (210). The first side frame (211) may constitute a portion of the exterior of the first housing (210). The first side frame (211) may be provided to protect components housed inside the electronic device (200) from the outside.

[0057] The first side frame (211) may include a first side member (211a), a second side member (211b), and / or a third side member (211c). The first side member (211a) may have a first length along a first longitudinal direction (e.g., a Y1-axis direction). The second side member (211b) may extend from the first side member (211a) in a substantially perpendicular direction (e.g., a X1-axis direction). The second side member (211b) may extend to have a second length that is the same as or different from the first length. The third side member (211c) may extend from the second side member (211b) in a substantially perpendicular direction (e.g., a Y1-axis direction). The third side member (211c) may extend in a direction substantially parallel to the first side member (211a). The third side member (211c) may have a first length along a first longitudinal direction (e.g., Y1-axis direction).

[0058] The first side member (211a), the second side member (211b), and the third side member (211c) may be arranged to be visible from the outside. At least a portion of the first side member (211a), the second side member (211b), and / or the third side member (211c) may be formed as a curved surface. The first side frame (211) may be formed into a rectangular shape (e.g., a square or a rectangle) by the first side member (211a), the second side member (211b), and the third side member (211c). The first side member (211a), the second side member (211b), and the third side member (211c) may be formed integrally, but are not limited thereto.

[0059] The second housing (220) may include a second side frame (221). The second side frame (221) may constitute a side of the second housing (220). The second side frame (221) may constitute a part of the exterior of the second housing (220). The second side frame (221) may be provided to protect components housed inside the electronic device (200) from the outside.

[0060] The second side frame (221) may include a fourth side member (221a), a fifth side member (221b), and / or a sixth side member (221c). The fourth side member (221a) may have a third length along a first longitudinal direction (e.g., Y1-axis direction). The fifth side member (221b) may extend from the fourth side member (221a) in a substantially perpendicular direction (e.g., X1-axis direction). The fifth side member (221b) may extend to have a fourth length that is the same as or different from the third length. The sixth side member (221c) may extend from the fifth side member (221b) in a substantially perpendicular direction (e.g., Y1-axis direction). The sixth side member (221c) may extend in a direction substantially parallel to the fourth side member (221a). The sixth side member (221c) may have a third length along the first longitudinal direction (e.g., the Y1-axis direction).

[0061] The fourth side member (221a), the fifth side member (221b), and the sixth side member (221c) may be arranged to be visible from the outside. At least a portion of the fourth side member (221a), the fifth side member (221b), and / or the sixth side member (221c) may be formed as a curved surface. The second side frame (221) may be formed into a rectangular shape (e.g., a square or a rectangle) by the fourth side member (221a), the fifth side member (221b), and the sixth side member (221c). The first length may be substantially the same as the third length. The second length may be substantially the same as the fourth length. The fourth side member (221a), the fifth side member (221b), and the sixth side member (221c) may be formed integrally, but is not limited thereto.

[0062] In the unfolded state of the electronic device (200), the first side member (211a) and the fourth side member (221a) may be positioned substantially in a straight line. In the unfolded state of the electronic device (200), the second side member (211b) and the fifth side member (221b) may be positioned parallel to each other. In the unfolded state of the electronic device (200), the third side member (211c) and the sixth side member (221c) may be positioned substantially in a straight line.

[0063] When the electronic device (200) is folded, the first side member (211a) and the fourth side member (221a) can be positioned to overlap each other. When the electronic device (200) is folded, the second side member (211b) and the fifth side member (221b) can be positioned to overlap each other. When the electronic device (200) is folded, the third side member (211c) and the sixth side member (221c) can be positioned to overlap each other.

[0064] The first housing (210) may include a first rear cover (212). The first rear cover (212) may form at least a portion of the second side (210b) of the first housing (210). The first rear cover (212) may be coupled to a first side frame (211). The first rear cover (212) may be formed integrally with the first side frame (211), for example.

[0065] The second housing (220) may include a second rear cover (222). The second rear cover (222) may form at least a portion of the fourth side (220b) of the second housing (220). The second rear cover (222) may be coupled to the second side frame (221). The second rear cover (222) may be formed integrally with the second side frame (221), for example.

[0066] The first rear cover (212) and / or the second rear cover (222) may be formed of, for example, at least one or a combination of coated or colored glass, ceramic, glassic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0067] The electronic device (200) may include a flexible display (230) (e.g., a foldable display or display). The flexible display (230) may be arranged across a first housing (210), a hinge (240), and a second housing (220). The flexible display (230) may be arranged to extend from a first surface (210a) of the first housing (210) across the hinge (240) to at least a portion of a third surface (220a) of the second housing (220). The flexible display (230) may be arranged such that the first surface (210a) of the first housing (210) and the third surface (220a) of the second housing (220) overlap each other. The flexible display (230) may have a portion corresponding to the hinge (240) that may be bent in accordance with the rotation of the hinge (240).

[0068] The flexible display (230) can be arranged so as to be visible from the outside when in an unfolded state. The flexible display (230) can be arranged so as to be invisible from the outside when in a folded state.

[0069] The electronic device (200) may include a protective cover (231). The protective cover (231) may be positioned to protect an edge portion of the flexible display (230). The protective cover (231) may form part of the exterior of the electronic device (200).

[0070] The electronic device (200) may include at least one of an input device (e.g., a microphone (203)), an audio output device (e.g., a call receiver (201) or a speaker (202)), a sensor module (204), a camera module (a first camera module (205) or a second camera module (208)), a connector port (207), a key input device (not shown), or an indicator (not shown) disposed in a first internal space (214) of a first housing (210) or a second internal space (224) of a second housing (220). The electronic device (200) may be configured such that at least one of the above-described components is omitted, or other components are additionally included.

[0071] The input device may include a plurality of microphones arranged to detect the direction of sound. The audio output device may include, for example, a call receiver (201) and a speaker (202). The audio output devices (201, 202) may be arranged to face the outside through at least one speaker hole formed in the first housing (210) or the second housing (220). The connector port (207) may be arranged to face the outside through a connector port hole formed in the first housing (210) or the second housing (220).

[0072] The sensor module (204) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204) can include at least one of a proximity sensor, an illuminance sensor, a time of flight (TOF) sensor, an ultrasonic sensor, a fingerprint recognition sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, or a humidity sensor.

[0073] The camera module may include a first camera module (205) disposed on the front side (e.g., +Z1-axis direction side) of the electronic device (200) or a second camera module (208) disposed on the rear side (e.g., -Z1-axis direction side). The first camera module (205) and / or the second camera module (208) may include one or more lenses, an image sensor, and / or an image signal processor. As an example, the first camera module (205) may be disposed under the flexible display (230) and configured to capture a subject through a portion of an active area of ​​the flexible display (230). A flash (209) may be positioned in the second camera module (208). The flash (209) may include, for example, a light-emitting diode or a xenon lamp.

[0074] According to one embodiment, the electronic device (200) may further include a heat dissipation sheet (250). The heat dissipation sheet (250) may be positioned on the back surface of the flexible display (230). The heat dissipation sheet (250) may be positioned to be in direct contact with the flexible display (230), but is not limited thereto. For example, other electronic components or components may be provided between the heat dissipation sheet (250) and the flexible display (230). A specific description of the heat dissipation sheet (250) will be provided below.

[0075] Figure 4 is a plan view of a heat dissipation sheet according to one embodiment.

[0076] The heat dissipation sheet (400) illustrated in FIG. 4 may be included in the electronic device (200) illustrated in FIGS. 2A to 3. For example, the heat dissipation sheet (400) of FIG. 4 may have a configuration substantially identical or similar to the heat dissipation sheet (250) of FIG. 3.

[0077] Referring to FIG. 4, the heat dissipation sheet (400) may include at least one of a first heat dissipation portion (410), a second heat dissipation portion (420), or a joint portion (430). The heat dissipation sheet (400) may include a non-flexible region (400a) and a flexible region (400b). As illustrated, the first heat dissipation portion (410) and the joint portion (430) may be positioned in the non-flexible region (400a). As illustrated, the second heat dissipation portion (420) may be positioned in the flexible region (400b). However, the present invention is not limited thereto, and at least a portion of the joint portion (430) may be included within the flexible region (400b).

[0078] A first heat dissipation portion (410) may be positioned in the non-flexible region (400a). Here, the non-flexible region (400a) does not refer to a region that cannot be bent, but rather may refer to a portion that does not bend when placed in an electronic device (e.g., the electronic device (200) of FIG. 2A). Accordingly, the first heat dissipation portion (410) may also be configured to be bendable.

[0079] The area division shown in Fig. 4 is exemplary and may be divided into multiple areas depending on the structure or function of the heat dissipation sheet (400).

[0080] According to an example, the first heat dissipation unit (410) may be a portion that maintains a plane when placed on the electronic device (200). The first heat dissipation unit (410) may be a portion that maintains a plane regardless of whether the electronic device (200) is folded. The first heat dissipation units (410) may be placed on each side of the second heat dissipation unit (420). One first heat dissipation unit (410) may be placed at a location overlapping a first surface (e.g., the first surface (210a) of FIG. 2A) of a first housing (e.g., the first housing (210) of FIG. 2A). The other first heat dissipation unit (410) may be placed at a location overlapping a third surface (e.g., the third surface (220a) of FIG. 2A) of a second housing (e.g., the second housing (220) of FIG. 2A). The first heat dissipation part (410) may also be referred to as a first heat dissipation sheet.

[0081] For example, the first heat dissipation member (410) may include a material having high thermal conductivity. For example, the first heat dissipation member (410) may be a graphite sheet. However, the present invention is not limited thereto, and various materials having high thermal conductivity, such as graphite sheets, may be used.

[0082] In one example, the second heat dissipation member (420) may be configured to be bendable or stretchable. For example, the second heat dissipation member (420) may have a lower elastic modulus than the first heat dissipation member (410). For example, the second heat dissipation member (420) may have a higher elongation than the first heat dissipation member (410). For example, the second heat dissipation member (420) may have a lower stiffness than the first heat dissipation member (410). For example, the second heat dissipation member (420) may have a higher elasticity than the first heat dissipation member (410). For example, the second heat dissipation member (420) may have a higher bending performance than the first heat dissipation member (410).

[0083] The second heat dissipation unit (420) may be positioned at a portion corresponding to a hinge (e.g., hinge (240) of FIG. 3). For example, the second heat dissipation unit (420) and the hinge (240) may be positioned to overlap with each other based on the Z1 axis of FIG. 3. The second heat dissipation unit (420) may be folded together with the flexible display (e.g., flexible display (230) of FIG. 3) when the electronic device (200) is folded. The second heat dissipation unit (420) may also be referred to as a second heat dissipation sheet.

[0084] In one example, the second heat dissipation member (420) may be bent about the folding axis (F). Here, the folding axis (F) may be substantially the same axis as the folding axis (F) of FIG. 2A. For example, the folding axis (F) may refer to an axis located in the center so as to divide the heat dissipation sheet (400) in half. The second heat dissipation member (420) may be arranged symmetrically about the folding axis (F), but is not limited thereto.

[0085] In one example, the second heat dissipation unit (420) may be made of a different material from the first heat dissipation unit (410). For example, the second heat dissipation unit (420) may be made of a metal material. For example, the second heat dissipation unit (420) may include stainless steel or a copper alloy. However, the present invention is not limited thereto, and the second heat dissipation unit (420) may also include other metal materials with excellent thermal conductivity.

[0086] In one example, the second heat dissipation member (420) may form a mesh pattern. The mesh pattern may allow the second heat dissipation member (420) to be configured to be bendable or stretchable.

[0087] According to an example, the second heat dissipation member (420) may include a plurality of holes or slits. When the second heat dissipation member (420) includes a plurality of slits, the slits may have a shape extending in a direction parallel to the folding axis (F). The second heat dissipation member (420) may be configured to be bendable or stretchable by virtue of the plurality of holes or slits.

[0088] According to an example, the first heat dissipation unit (410) and the second heat dissipation unit (420) may be spaced apart from each other. The two first heat dissipation units (410) may be respectively placed on both sides of the second heat dissipation unit (420). One first heat dissipation unit (410) may be placed close to one side of the second heat dissipation unit (420). The other first heat dissipation unit (410) may be placed close to the opposite side of the second heat dissipation unit (420). The two first heat dissipation units (410) may be spaced apart from each other with the second heat dissipation unit (420) interposed therebetween. The spaced portion between the first heat dissipation unit (410) and the second heat dissipation unit (420) may be filled by a joint unit (430) to be described later. However, it is not limited thereto, and parts of the first heat dissipation part (410) and the second heat dissipation part (420) may be arranged to be in contact with each other.

[0089] In one example, the first heat dissipation member (410) may have a higher thermal conductivity than the second heat dissipation member (420). In one example, the second heat dissipation member (420) may have a higher elasticity or bending performance than the first heat dissipation member (410).

[0090] According to an example, the joint (430) may be disposed between the first heat dissipation unit (410) and the second heat dissipation unit (420). The joint (430) may be configured to join the first heat dissipation unit (410) and the second heat dissipation unit (420). The joint (430) may connect the first heat dissipation unit (410) and the second heat dissipation unit (420). The joint (430) may join or couple the first heat dissipation unit (410) and the second heat dissipation unit (420). The joint (430) may be configured to transfer heat between the first heat dissipation unit (410) and the second heat dissipation unit (420), for example. The joint (430) may also be referred to as a joint member, an adhesive member, an adhesive member, or an adhesive.

[0091] In one example, the joint (430) may include a material having high thermal conductivity to transfer heat between the first heat dissipation portion (410) and the second heat dissipation portion (420). As an example, the joint (430) may include, but is not limited to, a silver paste having relatively high thermal conductivity.

[0092] For example, the thermal conductivity of the joint (430) may be lower than the thermal conductivity of the first heat dissipation portion (410) or the thermal conductivity of the second heat dissipation portion (420).

[0093] According to one example, the heat dissipation sheet (400) can be manufactured by applying a joint (430) between a first heat dissipation part (410) and a second heat dissipation part (420), and then hardening the joint (430) through heat treatment. For example, the joint (430) can be applied while the first heat dissipation part (410) and the second heat dissipation part (420) are spaced apart from each other by a predetermined distance. The applied joint (430) is hardened through heat treatment at a high temperature, and during the hardening process, one side of the joint (430) can be bonded to the first heat dissipation part (410), and the other side can be bonded to the second heat dissipation part (420). Through this process, the first heat dissipation part (410), the second heat dissipation part (420), and the joint (430) can be combined to form an integral sheet.

[0094] According to an example, the first heat dissipation unit (410), the second heat dissipation unit (420), and the joint unit (430) may be configured to be positioned substantially on the same plane. For example, the first heat dissipation unit (410), the second heat dissipation unit (420), and the joint unit (430) may be configured to have a two-dimensional structure in an unfolded state. For example, when the heat dissipation sheet (400) is placed on the electronic device (200), and the electronic device (200) is in an unfolded state (or unfolded state), the first heat dissipation unit (410), the second heat dissipation unit (420), and the joint unit (430) may be positioned on the same plane. The first heat dissipation unit (410), the second heat dissipation unit (420), and the joint unit (430) may have substantially the same thickness. Here, the thickness may refer to an average thickness of each configuration. However, this is not limited thereto, and at least one of the first heat dissipation unit (410) or the second heat dissipation unit (420) may be formed to have a thicker or thinner thickness depending on the design. For example, the thickness of the first heat dissipation unit (410) and the second heat dissipation unit (420) may be freely designed depending on the mounting space within the electronic device (200).

[0095] A heat dissipation sheet (400) according to one embodiment of the present disclosure has excellent durability against repeated folding even when placed in a foldable electronic device (200). Even in a folded state of the electronic device (200), a connection is maintained between one first heat dissipation unit (410) located in a first housing (210) and another first heat dissipation unit (410) located in a second housing (220) so that heat transfer is possible through the second heat dissipation unit (420) and the joint (430), thereby enabling excellent heat dissipation performance.

[0096] Fig. 5 is a cross-sectional view of the heat dissipation sheet of Fig. 4 taken along the longitudinal direction.

[0097] Among the configurations of the heat dissipation sheet (400) illustrated in FIG. 5, the same reference numbers are used for configurations that are substantially the same or similar to the configuration described in FIG. 4. Descriptions of overlapping configurations are omitted below.

[0098] Referring to FIG. 5, the heat dissipation sheet (400) may include at least one of a first heat dissipation portion (410), a second heat dissipation portion (420), a joint portion (430), a protective film (440), or an adhesive layer (450).

[0099] According to an example, the first heat dissipation member (410) may include a first surface (411) (or upper surface), a second surface (412) (or side surface) extending from an edge of the first surface (411), and a third surface (413) (or lower surface) located opposite the first surface (411) and extending from the second surface (412). The second surface (412) may be a surface connecting the first surface (411) and the third surface (413). The second surface (412) may be, for example, a surface that is bonded or joined to a bonding portion (430).

[0100] According to an example, the second heat dissipation member (420) may include a fourth surface (421) (or upper surface), a fifth surface (422) (or side surface) extending from an edge of the fourth surface (421), and a sixth surface (423) (or lower surface) located opposite the fourth surface (421) and extending from the fifth surface (422). The fifth surface (422) may be a surface connecting the fourth surface (421) and the sixth surface (423). The fifth surface (422) may be, for example, a surface that is bonded or joined to a bonding portion (430). The fifth surface (422) may be arranged to face the second surface (412).

[0101] According to one example, the protective film (440) may be positioned or attached so as to be in contact with at least one of the first heat dissipation unit (410) or the second heat dissipation unit (420). The protective film (440) may be positioned so as to cover one surface of the first heat dissipation unit (410) and the second heat dissipation unit (420). For example, the protective film (440) may be provided to cover the first heat dissipation unit (410), the second heat dissipation unit (420), and the joint (430). The protective film (440) may include, for example, polyethylene terephthalate (PET), but is not limited thereto. The protective film (440) is provided only on the upper side of the first heat dissipation part (410) and the second heat dissipation part (420) as shown, but is not limited thereto and may be provided on the lower side of the first heat dissipation part (410) and the second heat dissipation part (420).

[0102] According to one example, the adhesive layer (450) may be configured to be arranged or attached to one surface of the first heat dissipation unit (410). For example, the adhesive layer (450) may be arranged or attached to the first heat dissipation unit (410) so as to be in contact with the third surface (413) of the first heat dissipation unit (410). The adhesive layer (450) may be arranged to overlap the first heat dissipation unit (410). Since the second heat dissipation unit (420) is an area that bends according to the folding of the electronic device (200), the adhesive layer (450) may not be attached to the second heat dissipation unit (420). The adhesive layer (450) may be configured to attach the heat dissipation sheet (400) to another adjacent configuration. For example, the adhesive layer (450) may be configured to attach the heat dissipation sheet (400) to a metal plate (e.g., the metal plate (730) of FIG. 7) to be described later.

[0103] FIGS. 6a, 6b, 6c, and 6d are drawings for explaining the bonding structure of a heat dissipation sheet according to various embodiments.

[0104] FIGS. 6A, 6B, 6C, and 6D illustrate the bonding structures of the first heat dissipating portions (410, 410-1, 410-2, 410-3) and the second heat dissipating portions (420, 420-1, 420-2, 420-3) of various shapes. The structures illustrated in FIGS. 6A, 6B, 6C, and 6D are exemplary and do not limit the scope of the present disclosure. The bonding structure illustrated in FIG. 6A may be substantially the same as the structure illustrated in FIG. 5. The bonding structure illustrated in FIGS. 6B, 6C, and 6D may be a structure partially modified from that of FIG. 6A, and such modified structure may be applied to the heat dissipating sheet (400) of FIG. 4 or 5. That is, the heat dissipation sheet (400) illustrated in FIG. 4 or FIG. 5 may have a bonding structure illustrated in one of FIG. 6a, FIG. 6b, FIG. 6c, or FIG. 6d.

[0105] Referring to FIG. 6a, the second surface (412) (or side surface) of the first heat dissipation unit (410) may be a surface connecting the edge of the first surface (411) (or upper surface) and the edge of the third surface (413) (or lower surface). The second surface (412) may be a plane extending in a vertical direction from the first surface (411) or the third surface (413). The fifth surface (422) (or side surface) of the second heat dissipation unit (420) may be a surface connecting the edge of the fourth surface (421) (or upper surface) and the edge of the sixth surface (523) (or lower surface). The fifth surface (422) may be a plane extending in a vertical direction from the fourth surface (421) or the sixth surface (423). The bonding structure illustrated in FIG. 6a is a basic structure that can reduce the manufacturing cost by simplifying the manufacturing process.

[0106] Referring to FIG. 6B, the first heat dissipation unit (410-1) may include a first surface (411-1), a second surface (412-1), and a third surface (413-1). The second surface (412-1) may be a surface connecting the first surface (411-1) and the third surface (413-1). The second heat dissipation unit (420-1) may include a fourth surface (421-1), a fifth surface (422-1), and a sixth surface (423-1). The fifth surface (422-1) may be a surface connecting the fourth surface (421-1) and the sixth surface (423-1).

[0107] According to an example, the first heat dissipation portion (410-1) may include a first protrusion portion (414-1). The first protrusion portion (414-1) may be formed to protrude toward the second heat dissipation portion (420-1). The first protrusion portion (414-1) may be formed to protrude from the side of the first heat dissipation portion (410-1) toward the second heat dissipation portion (420-1).

[0108] According to an example, the second surface (412-1) of the first heat dissipation portion (410-1) may include a second-first surface (412a-1) extending vertically from an edge of the first surface (411-1), a second-second surface (412b-1) extending vertically outwardly from an edge of the second-first surface (412a-1), and a second-third surface (412c-1) extending from an edge of the second-second surface (412b-1) to an edge of the third surface (413-1). The first protrusion (414-1) may be formed, for example, by the second-second surface (412b-1) and the second-third surface (412c-1).

[0109] According to an example, the second heat dissipation portion (420-1) may include a second protrusion portion (424-1). The second protrusion portion (424-1) may be formed to protrude toward the first heat dissipation portion (410-1). The second protrusion portion (424-1) may be formed to protrude from the side of the second heat dissipation portion (420-1) toward the first heat dissipation portion (410-1).

[0110] For example, the fifth surface (422-1) of the second heat dissipation portion (420-1) may include a fifth-first surface (422a-1) extending vertically from an edge of the fourth surface (421-1), a fifth-second surface (422b-1) extending vertically inwardly from an edge of the fifth-first surface (422a-1), and a fifth-third surface (422c-1) extending from an edge of the fifth-second surface (422b-1) to an edge of the sixth surface (423-1). The second protrusion (424-1) may be formed, for example, by the fifth-first surface (422a-1) and the fifth-second surface (422b-1).

[0111] In one example, the first protrusion (414-1) and the second protrusion (424-1) may protrude in opposite directions. For example, the first protrusion (414-1) and the second protrusion (424-1) may protrude so as not to overlap each other.

[0112] For example, when the first heat dissipation part (410-1) and the second heat dissipation part (420-1) are joined by the joint part (430), a part of the first protrusion part (414-1) may come into contact with a part of the second protrusion part (424-1). For example, the 2-2 surface (412b-1) forming the surface of the first protrusion part (414-1) may come into contact with the 5-2 surface (422b-1) forming the surface of the second protrusion part (424-1). Since the thermal conductivity of the joint part (430) is lower than the thermal conductivity of the first heat dissipation part (410-1) or the second heat dissipation part (420-1), the first heat dissipation part (410-1) and the second heat dissipation part (420-1) may be configured to directly exchange heat with each other by directly contacting each other. Therefore, the heat transfer efficiency of the embodiment illustrated in FIG. 6b may be higher than the heat transfer efficiency of the embodiment illustrated in FIG. 6a.

[0113] Referring to FIG. 6c, the first heat dissipation unit (410-2) may include a first surface (411-2), a second surface (412-2), and a third surface (413-2). The second surface (412-2) may be a surface connecting the first surface (411-2) and the third surface (413-2). The second heat dissipation unit (420-2) may include a fourth surface (421-2), a fifth surface (422-2), and a sixth surface (423-2). The fifth surface (422-2) may be a surface connecting the fourth surface (421-2) and the sixth surface (423-2).

[0114] According to an example, the first heat dissipation portion (410-2) may include a first protrusion portion (414-2). The first protrusion portion (414-2) may be formed to protrude toward the second heat dissipation portion (420-2). The first protrusion portion (414-2) may be formed to protrude from the side of the first heat dissipation portion (410-2) toward the second heat dissipation portion (420-2).

[0115] According to an example, the second surface (412-2) of the first heat dissipation portion (410-2) may include a second-first surface (412a-2) extending vertically from an edge of the first surface (411-2), a second-second surface (412b-2) extending vertically outwardly from an edge of the second-first surface (412a-2), and a second-third surface (412c-2) extending from an edge of the second-second surface (412b-2) to an edge of the third surface (413-2). The first protrusion (414-2) may be formed, for example, by the second-second surface (412b-2) and the second-third surface (412c-2).

[0116] According to an example, the second heat dissipation portion (420-2) may include a second protrusion portion (424-2). The second protrusion portion (424-2) may be formed to protrude toward the first heat dissipation portion (410-2). The second protrusion portion (424-2) may be formed to protrude from the side of the second heat dissipation portion (420-2) toward the first heat dissipation portion (410-2).

[0117] According to an example, the fifth surface (422-2) of the second heat dissipation portion (420-2) may include a fifth-first surface (422a-2) extending vertically from an edge of the fourth surface (421-2), a fifth-second surface (422b-2) extending vertically outwardly from an edge of the fifth-first surface (422a-2), and a fifth-third surface (422c-2) extending from an edge of the fifth-second surface (422b-2) to an edge of the sixth surface (423-2). The second protrusion (424-2) may be formed, for example, by the fifth-second surface (422b-2) and the fifth-third surface (422c-2).

[0118] In one example, the first protrusion (414-2) and the second protrusion (424-2) may be protruded so as to overlap each other. For example, the first protrusion (414-2) and the second protrusion (424-2) may be protruded so as to face each other.

[0119] For example, when the first heat dissipation part (410-2) and the second heat dissipation part (420-2) are joined by the joint part (430), a part of the first protrusion part (414-2) may come into contact with a part of the second protrusion part (424-2). For example, the 2-3 surface (412c-2) forming the surface of the first protrusion part (414-2) may come into contact with the 5-3 surface (422c-2) forming the surface of the second protrusion part (424-2). Since the thermal conductivity of the joint part (430) is lower than the thermal conductivity of the first heat dissipation part (410-2) or the second heat dissipation part (420-2), the first heat dissipation part (410-2) and the second heat dissipation part (420-2) may be configured to directly exchange heat with each other by directly contacting each other. Therefore, the heat transfer efficiency of the embodiment illustrated in FIG. 6c may be higher than the heat transfer efficiency of the embodiment illustrated in FIG. 6a.

[0120] Unlike as illustrated in Fig. 6c, a protrusion may be formed only on one of the first heat dissipation portion (410-2) and the second heat dissipation portion (420-2). For example, only the first heat dissipation portion (410-2) may be configured to protrude toward the second heat dissipation portion (420-2) and contact the side surface of the second heat dissipation portion (420-2). For example, only the second heat dissipation portion (420-2) may be configured to protrude toward the first heat dissipation portion (410-2) and contact the side surface of the first heat dissipation portion (410-2).

[0121] Referring to FIG. 6d, the first heat dissipation unit (410-3) may include a first surface (411-3), a second surface (412-3), and a third surface (413-3). The second surface (412-3) may be a surface connecting the first surface (411-3) and the third surface (413-3). The second heat dissipation unit (420-3) may include a fourth surface (421-3), a fifth surface (422-3), and a sixth surface (423-3). The fifth surface (422-3) may be a surface connecting the fourth surface (421-3) and the sixth surface (423-3).

[0122] According to an example, the first heat dissipation portion (410-3) may include a first protrusion portion (414-3). The first protrusion portion (414-3) may be formed to protrude toward the second heat dissipation portion (420-3). The first protrusion portion (414-3) may be formed to protrude from the side of the first heat dissipation portion (410-3) toward the second heat dissipation portion (420-3).

[0123] According to an example, the second surface (412-3) of the first heat dissipation portion (410-3) may include a second-first surface (412a-3) extending vertically from an edge of the first surface (411-3), a second-second surface (412b-3) extending vertically outwardly from an edge of the second-first surface (412a-3), and a second-third surface (412c-3) extending from an edge of the second-second surface (412b-3) to an edge of the third surface (413-3). The first protrusion (414-3) may be formed, for example, by the second-second surface (412b-3) and the second-third surface (412c-3).

[0124] According to an example, the second heat dissipation portion (420-3) may include a second protrusion portion (424-3). The second protrusion portion (424-3) may be formed to protrude toward the first heat dissipation portion (410-3). The second protrusion portion (424-3) may be formed to protrude from the side of the second heat dissipation portion (420-3) toward the first heat dissipation portion (410-3).

[0125] According to an example, the fifth surface (422-3) of the second heat dissipation portion (420-3) may include a fifth-first surface (422a-3) extending vertically from an edge of the fourth surface (421-3), a fifth-second surface (422b-3) extending vertically outwardly from an edge of the fifth-first surface (422a-3), and a fifth-third surface (422c-3) extending from an edge of the fifth-second surface (422b-3) to an edge of the sixth surface (423-3). The second protrusion (424-3) may be formed, for example, by the fifth-second surface (422b-3) and the fifth-third surface (422c-3).

[0126] In one example, the first protrusion (414-3) and the second protrusion (424-3) may be protruded so as to overlap each other. For example, the first protrusion (414-3) and the second protrusion (424-3) may be protruded so as to face each other.

[0127] For example, when the first heat dissipation portion (410-3) and the second heat dissipation portion (420-3) are joined by a joint portion (430), the first protrusion portion (414-3) and the second protrusion portion (424-3) can be brought into contact with each other. The joint portion (430) can be provided between the first protrusion portion (414-3) and the second protrusion portion (424-3). Even if the first heat dissipation portion (410-3) and the second heat dissipation portion (420-3) are not in direct contact, the heat transfer efficiency can be improved by forming the protrusion portions so that they are adjacent to each other. Therefore, the heat transfer efficiency of the embodiment illustrated in FIG. 6d can be higher than the heat transfer efficiency of the embodiment illustrated in FIG. 6a.

[0128] FIG. 7 is a cross-sectional view of a display assembly according to one embodiment.

[0129] The display assembly (700) illustrated in FIG. 7 may include the flexible display (230) and the heat dissipation sheet (250) of the electronic device (200) illustrated in FIG. 3. For example, the flexible display (740) of FIG. 7 may be substantially the same as or similar to the flexible display (230) of FIG. 3. For example, the heat dissipation sheet (720) of FIG. 7 may be substantially the same as or similar to the heat dissipation sheet (250) of FIG. 3. The display assembly (700) of FIG. 7 may be included in the electronic device (200) of FIGS. 2A to 3.

[0130] The heat dissipation sheet (720) illustrated in FIG. 7 may be substantially the same as or similar to the heat dissipation sheet (400) of FIG. 4 or FIG. 5. The heat dissipation sheet (720) illustrated in FIG. 7 may also be configured to be bonded in any one of the structures illustrated in FIGS. 6A to 6D.

[0131] In Fig. 7, the configuration of the adhesive layer for joining each component is omitted, but an adhesive layer may be provided between each component.

[0132] Referring to FIG. 7, the display assembly (700) may include at least one of a support member (710), a heat dissipation sheet (720), a metal plate (730), and a flexible display (740). The display assembly (700) may be arranged such that the support member (710), the heat dissipation sheet (720), the metal plate (730), and the flexible display (740) are sequentially stacked. The display assembly (700) may include a non-flexible region (700a) that does not bend when mounted on the electronic device (200) and a flexible region (700b) that bends. For example, the non-flexible region (700a) may be substantially the same as or similar to the non-flexible region (400a) of FIG. 4. For example, the flexible region (700b) may be an region substantially identical to or similar to the flexible region (400b) of FIG. 4.

[0133] In one example, the support member (710) may be arranged to support the heat dissipation sheet (720). For example, two support members (710) may be arranged or attached to the lower side of the heat dissipation sheet (720). For example, the two support members (710) may be arranged spaced apart from each other about the folding axis.

[0134] According to one example, the support member (710) may be arranged to span or overlap a portion of the first heat dissipation member (721), the second heat dissipation member (722), and the joint member (723).

[0135] In order to secure the length that will increase when the electronic device (200) is folded, if a wrinkle structure or a protruding structure is provided in the second heat dissipation portion (722), the support member (710) cannot be provided in the portion corresponding to the second heat dissipation portion (722). In this case, the support force of the flexible region (700b) is weakened, and as a result, the surface quality of the flexible display (740) may deteriorate. In the present disclosure, as will be described later, since the second heat dissipation portion (722) is configured as a planar structure, the support force can be strengthened by providing a support member (710) for the second heat dissipation portion (722).

[0136] According to an example, the heat dissipation sheet (720) may include at least one of a first heat dissipation portion (721), a second heat dissipation portion (722), or a bonding portion (723).

[0137] According to an example, the first heat dissipation unit (721) may be a portion that maintains a plane when placed on the electronic device (200). The first heat dissipation unit (721) may be a portion that maintains a plane regardless of whether the electronic device (200) is folded. The first heat dissipation units (721) may be placed on each side of the second heat dissipation unit (722). One first heat dissipation unit (721) may be placed at a location overlapping a first surface (e.g., the first surface (210a) of FIG. 2A) of a first housing (e.g., the first housing (210) of FIG. 2A). The other first heat dissipation unit (721) may be placed at a location overlapping a third surface (e.g., the third surface (220a) of FIG. 2A) of a second housing (e.g., the second housing (220) of FIG. 2A). The first heat dissipation part (721) may also be referred to as a first heat dissipation sheet.

[0138] For example, the first heat dissipation member (721) may include a material having high thermal conductivity. For example, the first heat dissipation member (721) may be a graphite sheet. However, the present invention is not limited thereto, and various materials having high thermal conductivity, such as graphite sheets, may be used.

[0139] According to an example, the second heat dissipation unit (722) may be configured to be bendable or stretchable. The second heat dissipation unit (722) may be arranged at a portion corresponding to a hinge (e.g., hinge (240) of FIG. 3). For example, the second heat dissipation unit (722) and the hinge (240) may be arranged to overlap with each other based on the Z1 axis of FIG. 3. The second heat dissipation unit (722) may be folded together with the flexible display (e.g., flexible display (230) of FIG. 3) when the electronic device (200) is folded. The second heat dissipation unit (722) may also be referred to as a second heat dissipation sheet.

[0140] In one example, the second heat dissipation portion (722) may be bent about the folding axis (F). Here, the folding axis (F) may be substantially the same axis as the folding axis (F) of FIG. 2A. For example, the folding axis (F) may refer to an axis located in the center so as to divide the heat dissipation sheet (400) in half. The second heat dissipation portion (722) may be arranged symmetrically about the folding axis (F), but is not limited thereto.

[0141] In one example, the second heat dissipation unit (722) may be made of a different material from the first heat dissipation unit (721). For example, the second heat dissipation unit (722) may be made of a metal material. For example, the second heat dissipation unit (722) may include stainless steel or a copper alloy. However, the present invention is not limited thereto, and the second heat dissipation unit (722) may also include other metal materials with excellent thermal conductivity.

[0142] In one example, the second heat dissipation member (722) may form a mesh pattern. The mesh pattern may allow the second heat dissipation member (722) to be configured to be bendable or stretchable.

[0143] According to an example, the second heat dissipation portion (722) may include a plurality of holes or slits. When the second heat dissipation portion (722) includes a plurality of slits, the slits may have a shape extending in a direction parallel to the folding axis (F). The second heat dissipation portion (722) may be configured to be bendable or stretchable by the plurality of holes or slits.

[0144] According to an example, the first heat dissipation unit (721) and the second heat dissipation unit (722) may be spaced apart from each other. Two first heat dissipation units (721) may be placed on opposite sides of the second heat dissipation unit (722), respectively. One first heat dissipation unit (721) may be placed close to one side of the second heat dissipation unit (722). The other first heat dissipation unit (721) may be placed close to the opposite side of the second heat dissipation unit (722). The two first heat dissipation units (721) may be spaced apart from each other with the second heat dissipation unit (722) interposed therebetween. The spaced portion between the first heat dissipation unit (721) and the second heat dissipation unit (722) may be filled by a joint unit (723) to be described later. However, it is not limited thereto, and parts of the first heat dissipation part (721) and the second heat dissipation part (722) may be arranged to be in contact with each other.

[0145] In one example, the first heat dissipation member (721) may have a higher thermal conductivity than the second heat dissipation member (722). In one example, the second heat dissipation member (722) may have a higher elasticity or bending performance than the first heat dissipation member (721).

[0146] In one example, the joint (723) may be disposed between the first heat dissipation portion (721) and the second heat dissipation portion (722). The joint (723) may be configured to join the first heat dissipation portion (721) and the second heat dissipation portion (722). The joint (723) may connect the first heat dissipation portion (721) and the second heat dissipation portion (722). The joint (723) may join or couple the first heat dissipation portion (721) and the second heat dissipation portion (722). The joint (723) may be configured to transfer heat between the first heat dissipation portion (721) and the second heat dissipation portion (722), for example. The joint (723) may also be referred to as a joint member, an adhesive member, an adhesive member, or an adhesive.

[0147] In one example, the joint (723) may include a material having high thermal conductivity to transfer heat between the first heat dissipation portion (721) and the second heat dissipation portion (722). As an example, the joint (723) may include, but is not limited to, a silver paste having relatively high thermal conductivity.

[0148] For example, the thermal conductivity of the joint (723) may be lower than the thermal conductivity of the first heat dissipation portion (721) or the thermal conductivity of the second heat dissipation portion (722).

[0149] According to one example, the heat dissipation sheet (400) can be manufactured by applying a joint (723) between a first heat dissipation portion (721) and a second heat dissipation portion (722), and then hardening the joint (723) through heat treatment. For example, the joint (723) can be applied while the first heat dissipation portion (721) and the second heat dissipation portion (722) are spaced apart from each other by a predetermined distance. The applied joint (430) is hardened through heat treatment at a high temperature, and during the hardening process, one side of the joint (723) can be bonded to the first heat dissipation portion (721), and the other side can be bonded to the second heat dissipation portion (722). Through this process, the first heat dissipation portion (721), the second heat dissipation portion (722), and the joint (723) can be combined to form an integral sheet.

[0150] According to an example, the first heat dissipation portion (721), the second heat dissipation portion (722), and the joint portion (723) may be configured to be positioned substantially on the same plane. For example, the first heat dissipation portion (721), the second heat dissipation portion (722), and the joint portion (723) may be configured to have a two-dimensional structure in an unfolded state. For example, when the heat dissipation sheet (400) is placed on the electronic device (200), and the electronic device (200) is in an unfolded state (or unfolded state), the first heat dissipation portion (721), the second heat dissipation portion (722), and the joint portion (723) may be positioned on the same plane. The first heat dissipation portion (721), the second heat dissipation portion (722), and the joint portion (723) may have substantially the same thickness. Here, the thickness may refer to an average thickness of each configuration. However, this is not limited thereto, and at least one of the first heat dissipation portion (721) or the second heat dissipation portion (722) may be formed to be thick or thin depending on the design. For example, the thickness of the first heat dissipation portion (721) and the second heat dissipation portion (722) may be freely designed depending on the mounting space within the electronic device (200).

[0151] A heat dissipation sheet (400) according to one embodiment of the present disclosure has excellent durability against repeated folding even when placed in a foldable electronic device (200). Even in a folded state of the electronic device (200), a connection is maintained between one first heat dissipation unit (721) located in a first housing (210) and another first heat dissipation unit (721) located in a second housing (220) so that heat transfer is possible through the second heat dissipation unit (722) and the joint (723), thereby enabling excellent heat dissipation performance.

[0152] According to an example, a metal plate (730) may be placed between a flexible display (740) and a heat dissipation sheet (720). The metal plate (730) may support the flexible display (740). The metal plate (730) may be a flexible metal plate and may be made of stainless steel (STS). The metal plate (730) may have a thin-film shape. For example, the metal plate (730) may be in the form of a metal sheet and may help reinforce the rigidity of the display assembly (700).

[0153] According to an example, the metal plate (730) may include a flat portion (731) and a bending portion (732). The flat portion (731) may be positioned within the non-flexible region (700a). The bending portion (732) may be positioned within the flexible region (700b). A plurality of holes or slits may be formed in the bending portion (732) to secure bending performance or elastic performance.

[0154] In one example, a flexible display (740) may be placed on the upper side of a metal plate (730). The flexible display (740) may be supported by the metal plate (730).

[0155] The flexible display (740) may include multiple layers. In one example, the flexible display (740) may include a cover window (e.g., a polyimide (PI) film or ultra-thin glass (UTG)), a polarizer (POL) (e.g., a polarizing film) disposed on the back of the cover window, a display panel (e.g., a liquid crystal panel or an OLED panel), and / or a touch screen panel.

[0156] An electronic device according to one embodiment may include a first housing (210), a second housing (220) configured to be rotatable with respect to the first housing (210), a hinge (240) connecting the first housing (210) and the second housing (220), a flexible display (230) disposed in the first housing (210) and the second housing (220) and configured to be bendable at least at a portion thereof, and a heat dissipation sheet (250, 400) disposed on a rear surface of the flexible display (230). The heat dissipation sheet (250, 400) may include a first heat dissipation part (410), a second heat dissipation part (420) provided at a portion corresponding to the hinge (240) and configured to be bendable or stretchable, and a joining part (430) configured to join the first heat dissipation part (410) and the second heat dissipation part (420).

[0157] According to one embodiment, the first heat dissipation portion (410), the second heat dissipation portion (420), and the joint portion (430) may be configured to be positioned on the same plane when the electronic device is unfolded.

[0158] According to one embodiment, the second heat dissipation member (420) may have a mesh shape or include a plurality of holes or slits.

[0159] According to one embodiment, the first heat dissipation member (410) and the second heat dissipation member (420) may be made of different materials.

[0160] According to one embodiment, the first heat dissipation member (410) may be a graphite sheet.

[0161] According to one embodiment, the second heat dissipation member (420) may be made of a metal material.

[0162] According to one embodiment, the joint (430) may include silver paste.

[0163] According to one embodiment, the heat dissipation sheet (250, 400) may further include an adhesive layer (450) attached to one surface of the first heat dissipation portion (410).

[0164] According to one embodiment, the heat dissipation sheet (250, 400) may further include a protective film (440) attached to at least one surface of the first heat dissipation portion (410) or the second heat dissipation portion (420).

[0165] According to one embodiment, the first heat dissipation unit (410) may include a first protrusion (414-1, 414-2, 414-3) protruding from a side surface of the first heat dissipation unit (410) toward the second heat dissipation unit (420). The second heat dissipation unit (420) may include a second protrusion (424-1, 424-2, 424-3) protruding from a side surface of the second heat dissipation unit (420) toward the first heat dissipation unit (410).

[0166] According to one embodiment, the heat dissipation sheet (250, 400) may be configured such that a portion of the first protrusion (414-1, 414-2, 414-3) and a portion of the second protrusion (424-1, 424-2, 424-3) are in contact.

[0167] According to one embodiment, the first heat dissipation portion (410) and the second heat dissipation portion (420) may be configured to directly exchange heat through a portion where the first protrusions (414-1, 414-2, 414-3) and the second protrusions (424-1, 424-2, 424-3) come into contact.

[0168] According to one embodiment, the thermal conductivity of the first heat dissipation unit (410) may be configured to be greater than the thermal conductivity of the second heat dissipation unit (420).

[0169] A heat dissipation sheet (250, 400) according to one embodiment may include a first heat dissipation part (410), a second heat dissipation part (420) made of a different material from the first heat dissipation part (410), positioned to be spaced apart from the first heat dissipation part (410), and configured to be bendable or stretchable, and a joint part (430) configured to join the first heat dissipation part (410) and the second heat dissipation part (420).

[0170] According to one embodiment, when the joint (430) is not bent, the first heat dissipation portion (410), the second heat dissipation portion (420), and the joint (430) may be configured to be positioned substantially on the same plane.

[0171] According to one embodiment, the second heat dissipation member (420) may have a mesh shape or include a plurality of holes or slits.

[0172] According to one embodiment, the thermal conductivity of the first heat dissipation unit (410) may be configured to be greater than the thermal conductivity of the second heat dissipation unit (420).

[0173] According to one embodiment, the first heat dissipation unit (410) may include a first protrusion (414-1, 414-2, 414-3) protruding from a side surface of the first heat dissipation unit (410) toward the second heat dissipation unit (420). The second heat dissipation unit (420) may include a second protrusion (424-1, 424-2, 424-3) protruding from a side surface of the second heat dissipation unit (420) toward the first heat dissipation unit (410).

[0174] According to one embodiment, the heat dissipation sheet (250, 400) may be configured such that a portion of the first protrusion (414-1, 414-2, 414-3) and a portion of the second protrusion (424-1, 424-2, 424-3) are in contact.

[0175] The terminology used herein is merely used to describe specific embodiments and is not intended to limit the present disclosure. For example, a singular element should be understood to include plural elements unless the context clearly indicates only a singular element. As used herein, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. It should be understood that the term "and / or" as used herein encompasses any and all possible combinations of one or more of the listed items. The terms "include," "have," "comprise," and the like used in this disclosure are intended to specify only the presence of a feature, component, part, or combination thereof described in this disclosure, and the use of these terms does not exclude the possibility of the presence or addition of one or more other features, components, parts, or combinations thereof. The expressions "first," "second," and the like used in this disclosure can modify various components regardless of order and / or importance, and are only used to distinguish one component from another, without limiting the components.

[0176] The expression "configured to" used in the present disclosure can be appropriately used interchangeably with, for example, "suitable for," "capable of," "designed to," "modified to," "made to," or "capable of." The term "configured to" may not necessarily mean only something "specially designed" in terms of hardware. Instead, in some situations, the expression "a device configured to" may mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a device configured (or set) to perform A, B, and C" may mean a dedicated device for performing the corresponding operations, or a general-purpose device that can perform various operations including the corresponding operations.

[0177] Meanwhile, the terms “upper side,” “lower side,” and “front-rear direction” used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0178] Although the foregoing description in this disclosure has focused on specific embodiments, it should be understood that this disclosure is not limited to such specific embodiments, but rather encompasses various modifications, equivalents, and / or alternatives of the various embodiments.

Claims

1. In electronic devices, First housing (210); A second housing (220) configured to be rotatable relative to the first housing (210); A hinge (240) connecting the first housing (210) and the second housing (220); A flexible display (230) placed in the first housing (210) and the second housing (220); and It includes a heat dissipation sheet (250, 400) arranged to be in contact with the flexible display (230). An electronic device, wherein the heat dissipation sheet (250, 400) includes a first heat dissipation portion (410), a second heat dissipation portion (420) positioned at a portion corresponding to the hinge (240) and having higher elasticity than the first heat dissipation portion (410), and a joining portion (430) configured to join the first heat dissipation portion (410) and the second heat dissipation portion (420).

2. In paragraph 1, An electronic device, wherein the first heat dissipation portion (410), the second heat dissipation portion (420), and the joint portion (430) are configured to be positioned on the same plane when the electronic device is unfolded.

3. In paragraph 1 or 2, An electronic device in which the second heat dissipation member (420) has a mesh shape or includes a plurality of holes or slits.

4. In one of paragraphs 1 to 3, An electronic device in which the first heat dissipation member (410) is a graphite sheet.

5. In one of paragraphs 1 to 4, The above second heat dissipation part (420) is an electronic device made of metal.

6. In one of paragraphs 1 to 5, An electronic device in which the above joint (430) includes silver paste.

7. In one of paragraphs 1 to 6, The above first heat dissipation unit (410) is It includes a first protrusion (414-1, 414-2, 414-3) protruding from the side of the first heat dissipation portion (410) toward the second heat dissipation portion (420), The above second heat dissipation unit (420) is An electronic device including a second protrusion (424-1, 424-2, 424-3) protruding from the side of the second heat dissipation portion (420) toward the first heat dissipation portion (410).

8. In paragraph 7, The above heat dissipation sheet (250, 400) is It is configured so that a part of the first protrusion (414-1, 414-2, 414-3) and a part of the second protrusion (424-1, 424-2, 424-3) are in contact, An electronic device in which the first heat dissipation portion (410) and the second heat dissipation portion (420) are configured to directly exchange heat through a portion where the first protrusions (414-1, 414-2, 414-3) and the second protrusions (424-1, 424-2, 424-3) come into contact.

9. In one of paragraphs 1 to 8, An electronic device, wherein the thermal conductivity of the first heat dissipation unit (410) is configured to be greater than the thermal conductivity of the second heat dissipation unit (420).

10. In the heat-dissipating sheet (250, 400), First heat dissipation unit (410); A second heat dissipation member (420) having higher elasticity than the first heat dissipation member (410); and A heat dissipation sheet including a joining portion (430) configured to join the first heat dissipation portion (410) and the second heat dissipation portion (420).

11. In paragraph 10, In a state where the above joint (430) is not bent, A heat dissipation sheet, wherein the first heat dissipation portion (410), the second heat dissipation portion (420), and the joint portion (430) are configured to be positioned substantially on the same plane.

12. In clause 10 or 11, The second heat dissipation member (420) is a heat dissipation sheet having a mesh shape or including a plurality of holes or slits.

13. In one of paragraphs 10 to 12, A heat dissipation sheet configured such that the thermal conductivity of the first heat dissipation member (410) is greater than the thermal conductivity of the second heat dissipation member (420).

14. In one of the clauses 10 to 13, The above first heat dissipation unit (410) is It includes a first protrusion (414-1, 414-2, 414-3) protruding from the side of the first heat dissipation portion (410) toward the second heat dissipation portion (420), The above second heat dissipation unit (420) is A heat dissipation sheet including a second protrusion (424-1, 424-2, 424-3) protruding from the side of the second heat dissipation portion (420) toward the first heat dissipation portion (410).

15. In paragraph 14, The above heat dissipation sheet (250, 400) is It is configured so that a part of the first protrusion (414-1, 414-2, 414-3) and a part of the second protrusion (424-1, 424-2, 424-3) are in contact, A heat dissipation sheet in which the first heat dissipation portion (410) and the second heat dissipation portion (420) are configured to directly exchange heat through a portion where the first protrusions (414-1, 414-2, 414-3) and the second protrusions (424-1, 424-2, 424-3) come into contact.

Images