Printed circuit board structure comprising thermal interface material and electronic device comprising same

Abstract

A printed circuit board structure (200) according to one embodiment may comprise: a first printed circuit board (210); an interposer (230); a second printed circuit board (220); a shield structure (240); and a guide (250) that is disposed on the first printed circuit board and guides at least a portion of a thermal interface material filled in a first inner space (S1) to a second inner space (S2).

Description

Printed circuit board structure containing thermal interface material and electronic device including same

[0001] Various embodiments of the present disclosure relate to printed circuit board structures and electronic devices, for example, to printed circuit board structures that accommodate thermal interface materials and electronic devices including the same.

[0002] Electronic devices can generate significant heat due to their high performance and diverse functionality. The heat dissipation performance of electronic devices is essential to ensuring product stability and reliability. Accordingly, technologies for heat dissipation within electronic devices within confined spaces are actively being researched.

[0003] A heat dissipation technology is known that injects liquid thermal interface material (TIM) into the internal space of an electronic device and hardens the thermal interface material injected into the internal space.

[0004] According to one embodiment, in the case of an electronic device including a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure (200) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a second printed circuit board body (221) connected to the interposer, a nozzle hole (222) formed penetrating through the second printed circuit board body, a guide hole (223) formed penetrating through the second printed circuit board body and provided at a position spaced apart from the nozzle hole, a second printed circuit board (220) defining a first internal space (S1) together with the first printed circuit board and the interposer, a second internal space connected to the second printed circuit board, accommodates the thermal interface material passing through the guide hole, and is connected to the first internal space through the guide hole. It may include a shield structure (240) defining a space (S2), and a guide (250) arranged on the first printed circuit board and guiding at least a portion of the thermal interface material filled in the first internal space to the second internal space.

[0005] According to one embodiment, a printed circuit board structure for accommodating a thermal interface material (TIM) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a second printed circuit board body (221) connected to the interposer, a nozzle hole (222) formed through the second printed circuit board body, a guide hole (223) formed through the second printed circuit board body and provided at a position spaced from the nozzle hole, a second printed circuit board (220) defining a first internal space (S1) together with the first printed circuit board and the interposer, a shield structure (240) connected to the second printed circuit board, accommodating the thermal interface material passing through the guide hole, and defining a second internal space (S2) connected to the first It may include a guide (250) arranged on a printed circuit board and guiding at least a portion of the thermal interface material filled in the first internal space to the second internal space.

[0006] According to one embodiment, in the case of an electronic device including a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure (200) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a second printed circuit board body (221) connected to the interposer, a nozzle hole (222) formed penetrating through the second printed circuit board body, a guide hole (223) formed penetrating through the second printed circuit board body and provided at a position spaced apart from the nozzle hole, and a vent hole (224) formed penetrating through the second printed circuit board body, and defining a first internal space (S1) together with the first printed circuit board and the interposer, the thermal interface material (TIM) connected to the second printed circuit board and passing through the guide hole A shield structure (240) that defines a second internal space (S2) that accommodates a material and is connected to the first internal space through the guide hole, and a guide (250) that is arranged on the first printed circuit board and guides at least a portion of the thermal interface material filled in the first internal space to the second internal space, and is provided so as to overlap the shield structure and contact the second printed circuit board based on the stacking direction of the first printed circuit board, the interposer, and the second printed circuit board, wherein the vent hole (224) may be located on the opposite side of the nozzle hole (222) based on the guide (250).

[0007] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2 is a perspective view of a printed circuit board structure accommodating a thermal interface material (TIM) according to one embodiment.

[0010] Figure 3 is a cross-sectional view taken along the cut line Ⅲ-Ⅲ of Figure 2.

[0011] FIG. 4 is a cross-sectional view schematically illustrating a thermal interface material being injected into a printed circuit board structure according to one embodiment.

[0012] Figure 5 is an exploded perspective view of a printed circuit board structure according to one embodiment.

[0013] FIG. 6 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0014] FIG. 7 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0015] FIG. 8 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0016] FIG. 9 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0017] Fig. 10 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0018] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0021] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0022] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0023] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0027] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0028] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0032] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0034] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0037] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0038] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0039] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0042] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0043] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0044] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0045] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0046] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0047] FIG. 2 is a perspective view of a printed circuit board structure accommodating a thermal interface material (TIM) according to one embodiment. FIG. 3 is a cross-sectional view taken along the cut line Ⅲ-Ⅲ of FIG. 2. FIG. 4 is a cross-sectional view schematically illustrating a thermal interface material being injected into a printed circuit board structure according to one embodiment. FIG. 5 is an exploded perspective view of a printed circuit board structure according to one embodiment. FIG. 6 is a plan view schematically illustrating an internal appearance of a printed circuit board structure according to one embodiment.

[0048] Referring to FIGS. 2 to 6, a printed circuit board structure (200) according to one embodiment may be provided in an electronic device (e.g., an electronic device (101) of FIG. 1). For example, among electronic devices (e.g., electronic devices (101) of FIG. 1), at least one of a processor (e.g., processor (120) of FIG. 1), an input module (e.g., input module (150) of FIG. 1), an audio output module (e.g., audio output module (155) of FIG. 1), a display module (e.g., display module (160) of FIG. 1), an audio module (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a haptic module (e.g., haptic module (179) of FIG. 1), a camera module (e.g., camera module (180) of FIG. 1), a power management module (e.g., power management module (188) of FIG. 1), a communication module (e.g., communication module (190) of FIG. 1), a subscriber identification module (e.g., subscriber identification module (196) of FIG. 1), or an antenna module (e.g., antenna module (197) of FIG. 1)) is formed on a printed circuit board. It may include a structure (200).

[0049] In one embodiment, the printed circuit board structure (200) can accommodate a thermal interface material (T, TIM). The thermal interface material (T) can be injected into the interior of the printed circuit board structure (200). The thermal interface material (T) can be injected into the interior of the printed circuit board structure (200) in a liquid state and can be cured after injection. The thermal interface material (T) can assist in better heat transfer within the interior of the printed circuit board structure (200).

[0050] In one embodiment, the printed circuit board structure (200) may include a plurality of components requiring cooling. For example, the printed circuit board structure (200) may include an application processor (AP) or a power amplifier (PA). These components generate heat and thus may be heat sources. Sufficient cooling is required for these components to operate normally. A thermal interface material (T) filled within the printed circuit board structure (200) can absorb heat from the heat source and spread the heat over a wide area.

[0051] In one embodiment, the printed circuit board structure (200) may include components that do not generate heat and are sensitive to heat. For example, the printed circuit board structure (200) may include at least one of a crystal or an oscillator. If excessive heat is applied to the crystal or the oscillator, the performance of the crystal or the oscillator may deteriorate. The printed circuit board structure (200) may assist in sufficiently applying a thermal interface material (T) to a heat source through a guide (250) and in preventing the thermal interface material (T) from reaching or not reaching a relatively small amount of the thermal interface material (T) to the heat-sensitive components. The guide (250) may guide the direction of movement of the thermal interface material (T). The guide (250) may guide the flow of the thermal interface material (T).

[0052] In one embodiment, the printed circuit board structure (200) may include a plurality of internal spaces (S1, S2) that are partitioned from each other. The guide (250) may guide the direction of movement of the thermal interface material (T) to assist the thermal interface material (T) to move from the first internal space (S1) to the second internal space (S2). Although the drawing shows one guide (250), the number of guides (250) is not limited thereto. For example, it should be noted that a plurality of guides (250) may be provided depending on the number and arrangement of the second components.

[0053] In one embodiment, the printed circuit board structure (200) may include a first printed circuit board (210), a second printed circuit board (220), an interposer (230), a shield structure (240), a guide (250), a first component (260), a second component (270), and a nozzle block (290). The first printed circuit board (210), the second printed circuit board (220), and the interposer (230) may define a first internal space (S1). The first internal space (S1) may be a space surrounded by the first printed circuit board (210), the second printed circuit board (220), and the interposer (230). The shield structure (240) may define a second internal space (S2). The second internal space (S2) may be a space surrounded by a shield structure (240). The shield structure (240) may include a shield can or a laminated printed circuit board structure. The laminated printed circuit board structure may include a plurality of printed circuit boards and an interposer provided between two adjacent printed circuit boards among the plurality of printed circuit boards. Components may also be arranged within the second internal space (S2). For example, a heat source may be arranged within the second internal space (S2).

[0054] In one embodiment, the first printed circuit board (210) may include a printed circuit board. For example, the first printed circuit board (210) may be a printed circuit board made of a rigid material. For example, the first printed circuit board (210) may be a flexible printed circuit board (FPCB) made of a flexible material. The first printed circuit board (210) may have a flat plate shape. Although the shape of the first printed circuit board (210) is illustrated as a rectangular parallelepiped, it should be noted that the shape is not limited thereto.

[0055] In one embodiment, the second printed circuit board (220) may be provided at a position spaced apart from the first printed circuit board (210). The second printed circuit board (220) may be spaced apart from the first printed circuit board (210) in the z-axis direction. The stacking direction of the first printed circuit board (210), the interposer (230), and the second printed circuit board (220) may be parallel to the z-axis direction. The second printed circuit board (220) may include a second printed circuit board body (221), a nozzle hole (222), a guide hole (223), and a vent hole (224).

[0056] In one embodiment, the second printed circuit board body (221) may include a printed circuit board. For example, the second printed circuit board body (221) may be a printed circuit board made of a rigid material. For example, the second printed circuit board body (221) may be a flexible printed circuit board (FPCB) made of a flexible material. The second printed circuit board body (221) may have a flat plate shape.

[0057] In one embodiment, a nozzle hole (222) may be formed penetrating the second printed circuit board body (221). Through the nozzle hole (222), a thermal interface material (T) may be injected into the first internal space (S1). The thermal interface material (T) injected into the first internal space (S1) may proceed in the x-axis direction and / or the y-axis direction. A nozzle block (290) may be arranged in the nozzle hole (222).

[0058] In one embodiment, a guide hole (223) may be formed penetrating the second printed circuit board body (221). A thermal interface material (T) flowing in the first internal space (S1) may have its path changed by the guide (250) and may enter the guide hole (223). The thermal interface material (T) passing through the guide hole (223) may be injected into the second internal space (S2). The printed circuit board structure (200) may inject the thermal interface material (T) into the first internal space (S1) and the second internal space (S2) at the same time by injecting the thermal interface material (T) through a nozzle hole (222) provided in the second printed circuit board (220).

[0059] In one embodiment, a vent hole (224) may be formed penetrating the second printed circuit board body (221). The vent hole (224) may be provided at a position spaced apart from the shield structure (240). With respect to the shield structure (240), the positions of the vent hole (224) and the nozzle hole (222) may be provided on opposite sides. The thermal interface material (T) injected through the nozzle hole (222) may be injected into the second receiving space (S2) through the guide hole (223) before reaching the vent hole (224). The vent hole (224) may assist in ensuring that the thermal interface material (T) is well injected into the first internal space (S1). For example, the vent hole (224) can discharge air inside the first internal space (S1) to the outside as the thermal interface material (T) fills the first internal space (S1).

[0060] In one embodiment, an interposer (230) may be disposed between a first printed circuit board (210) and a second printed circuit board (220). The interposer (230) may be connected to the first printed circuit board (210). The interposer (230) may be connected to the second printed circuit board (220). The interposer (230) may electrically connect a component disposed on the first printed circuit board (210) and a component disposed on the second printed circuit board (220).

[0061] In one embodiment, a shield structure (240) may be connected to a second printed circuit board (220). The shield structure (240) may accommodate a thermal interface material (T) passing through a guide hole (223). The shield structure (240) may define a second internal space (S2) connected to a first internal space (S1) through the guide hole (223). The shield structure (240) may include a shield structure body (241) defining the second internal space, and an air hole (242) formed penetrating the shield structure body (241). The air hole (242) may connect the second internal space (S2) with the outside, thereby assisting the injection of the thermal interface material (T) into the second internal space (S2). Specifically, when a thermal interface material (T) is injected into the second internal space (S2), air must escape from the second internal space (S2) in an area equal to the area occupied by the thermal interface material (T). The air hole (242) can function as a passage through which the air can escape.

[0062] In one embodiment, the guide (250) may be disposed on the first printed circuit board (210). The guide (250) may guide at least a portion of the thermal interface material (T) filled in the first internal space (S1) to the second internal space (S2). The guide (250) may be disposed on a movement path of the thermal interface material (T) to change the movement path of the thermal interface material (T). For example, the thermal interface material (T) may flow in the xy plane before contacting the guide (250), and may flow in the z-axis direction and pass through the guide hole (223) after contacting the guide (250). The guide (250) may partially block the path of the thermal interface material (T).

[0063] In one embodiment, the guide (250) may be provided at a position adjacent to the guide hole (223). The guide (250) may overlap at least a portion of the shield structure (240) based on the stacking direction of the first printed circuit board (210), the interposer (230), and the second printed circuit board (220). The guide (250) may overlap at least a portion of the shield structure (240) based on the z-axis direction. The guide (250) may not overlap the guide hole (223) based on the z-axis direction. The guide (250) and the nozzle hole (222) may be positioned on opposite sides of the guide hole (223). The thermal interface material (T) flowing toward the guide (250) may pass through the guide hole (223). If there is no guide (250), the thermal interface material (T) flows along one surface of the first printed circuit board (210) due to gravity, and thus may not pass through the guide hole (223). The guide (250) may partially block the flow of the thermal interface material (T) on the xy plane, thereby assisting the thermal interface material (T) to flow in the z-axis direction.

[0064] In one embodiment, the guide (250) may include a first part (251) and a second part (252). The first part (251) may be formed with a longitudinal direction in a first direction. Here, the first direction may be a direction parallel to the x-axis direction. The first part (251) may block a portion of the thermal interface material (T) flowing in the y-axis direction. The first part (251) may guide a portion of the thermal interface material (T) flowing in the y-axis direction to the second internal space (S2). The first part (251) may overlap the shield structure (240) with respect to the z-axis direction. The first part (251) may be provided at a position adjacent to the guide hole (223).

[0065] In one embodiment, the second part (252) may be formed in a second direction with a longitudinal direction. Here, the second direction may be a direction parallel to the y-axis direction. The second part (252) may block a portion of the thermal interface material (T) flowing in the x-axis direction. The second part (252) may guide a portion of the thermal interface material (T) flowing in the x-axis direction to the second internal space (S2). The second part (252) may overlap the shield structure (240) with respect to the z-axis direction. The second part (252) may be provided at a position adjacent to the guide hole (223).

[0066] In one embodiment, the guide (250) may include an elastic material. For example, the guide (250) may include a rubber material. For example, the guide (250) may be compressed while the first printed circuit board (210) and the second printed circuit board (220) are assembled. According to this structure, the gap between the guide (250) and the second printed circuit board (220) can be more reliably eliminated.

[0067] In one embodiment, the guide (250) may have the same height as the interposer (230). The guide (250) may be provided in contact with the second printed circuit board (220). According to this structure, there may be no gap between the guide (250) and the second printed circuit board (220). The phenomenon of the thermal interface material (T) passing over the guide (250) may be prevented. For example, it should be noted that a minute gap may be provided between the guide (250) and the second printed circuit board (220).

[0068] In one embodiment, the first component (260) may be disposed on the first printed circuit board (210). The first component (260) may be located in an area between the nozzle hole (222) and the guide (250) in the first internal space (S1). The first component (260) may include a heat source. For example, the first component (260) may include an application processor (AP), a radio frequency integrated circuit (RFIC), or a power amplifier (PA). The first component (260) may be coated with a thermal interface material (T). The first component (260) may be located in an area of ​​the first internal space (S1) filled with the thermal interface material (T).

[0069] In one embodiment, the second component (270) may be placed on the first printed circuit board (210). The second component (270) may be located in an area opposite the nozzle hole (222) with respect to the guide (250) in the first internal space (S1). The second component (270) may include a component that is relatively sensitive to heat. For example, the second component (270) may include one of a crystal or a vibrator. The second component (270) may not be coated with a thermal interface material (T). The second component (270) may be located in an area of ​​the first internal space (S1) that is not filled with the thermal interface material (T).

[0070] In one embodiment, the guide (250) can prevent the thermal interface material (T) from reaching the area where the second component (270) is located. The guide (250) can guide the direction of movement of the thermal interface material (T) so that it flows into the second internal space (S2) through the guide hole (223).

[0071] In one embodiment, a nozzle block (290) may be disposed on a second printed circuit board (220). The nozzle block (290) may assist the nozzle (N) to stably inject a thermal interface material (T) into the printed circuit board structure (200). The nozzle block (290) may have a hole that accommodates a portion of the nozzle (N). The hole of the nozzle block (290) may be connected to a nozzle hole (222).

[0072] FIG. 7 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0073] Referring to FIG. 7, in the case of the printed circuit board structure (300), it is noted that the second printed circuit board (e.g., the second printed circuit board (220) of FIG. 2) and the shield structure (e.g., the shield structure (240) of FIG. 2) are omitted. It is noted that in FIG. 7, the positions of the nozzle hole (322) and the guide hole (323) are schematically indicated.

[0074] In one embodiment, the printed circuit board structure (300) may include a first printed circuit board (310), a second printed circuit board (not shown), an interposer (330), a shield structure (not shown), a guide (350), a first component (360), and a second component (370).

[0075] In one embodiment, the first printed circuit board (310) may include a printed circuit board. For example, the first printed circuit board (310) may be a printed circuit board made of a rigid material. For example, the first printed circuit board (310) may be a flexible printed circuit board (FPCB) made of a flexible material. The first printed circuit board (310) may have a flat plate shape.

[0076] In one embodiment, the interposer (330) may be connected to the first printed circuit board (310).

[0077] In one embodiment, a second printed circuit board (not shown) may be connected to the interposer (330). The second printed circuit board may include a nozzle hole (322) and a guide hole (323). A thermal interface material may be injected onto the first printed circuit board (310) through the nozzle hole (322).

[0078] In one embodiment, the first component (360) may include a heat source. The second component (370) may include a component that is relatively sensitive to heat.

[0079] In one embodiment, the guide (350) may be disposed on the first printed circuit board (310). The guide (350) may be disposed on a movement path of the thermal interface material, thereby changing the movement path of the thermal interface material. For example, the thermal interface material may flow in the xy plane before contacting the guide (350), and may flow in the z-axis direction after contacting the guide (350). The thermal interface material flowing in the z-axis direction may pass through the guide hole (323). The guide (350) may partially block the path of the thermal interface material.

[0080] In one embodiment, the guide (350) may have an elongated shape. At least one end of the guide (350) may be connected to the interposer (330). In this case, the portion where the guide (350) and the interposer (330) are connected may completely block the path through which the thermal interface material may move. For example, both ends of the guide (350) may be connected to the interposer (330). In this case, the thermal interface material may not move in the area opposite the guide hole (323) with respect to the guide (350). A hole through which air may flow may be provided between the guide (350) and the interposer (330). The thermal interface material may not pass through the hole.

[0081] FIG. 8 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0082] Referring to FIG. 8, in the case of the printed circuit board structure (400), it is noted that the second printed circuit board (e.g., the second printed circuit board (220) of FIG. 2) and the shield structure (e.g., the shield structure (240) of FIG. 2) are omitted. It is noted that in FIG. 8, the positions of the nozzle hole (422) and the guide hole (423) are schematically indicated.

[0083] In one embodiment, the printed circuit board structure (400) may include a first printed circuit board (410), a second printed circuit board (not shown), an interposer (430), a shield structure (not shown), a guide (450), a first component (460), and a second component (470).

[0084] In one embodiment, the first printed circuit board (410) may include a printed circuit board.

[0085] In one embodiment, the interposer (430) may be connected to the first printed circuit board (410).

[0086] In one embodiment, a second printed circuit board (not shown) may be connected to the interposer (430). The second printed circuit board may include a nozzle hole (422) and a guide hole (423). A thermal interface material may be injected onto the first printed circuit board (410) through the nozzle hole (422).

[0087] In one embodiment, the first component (460) may include a heat source. The second component (470) may include a component that is relatively sensitive to heat.

[0088] In one embodiment, a guide (450) may be disposed on the first printed circuit board (410). The guide (450) may be disposed on a movement path of a thermal interface material, thereby changing the movement path of the thermal interface material. For example, the thermal interface material may flow in the xy plane before contacting the guide (450), and may flow in the z-axis direction after contacting the guide (450). The thermal interface material flowing in the z-axis direction may pass through the guide hole (423). The guide (450) may partially block the path of the thermal interface material.

[0089] In one embodiment, the guide (450) may include a first part (451) whose length direction is formed in the x-axis direction, and a second part (452) whose length direction is formed in the y-axis direction. The first part (451) and the second part (452) may surround the second part (470). The first part (451) and the second part (452) may block the movement of the thermal interface material to prevent the thermal interface material from entering the second part (470).

[0090] FIG. 9 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0091] Referring to FIG. 9, it is noted that in the case of the printed circuit board structure (500), the second printed circuit board (e.g., the second printed circuit board (220) of FIG. 2) and the shield structure (e.g., the shield structure (240) of FIG. 2) are omitted. It is noted that in FIG. 9, the positions of the nozzle hole (522) and the guide hole (523) are schematically indicated.

[0092] In one embodiment, the printed circuit board structure (500) may include a first printed circuit board (510), a second printed circuit board (not shown), an interposer (530), a shield structure (not shown), a guide (550), a first component (560), and a second component (570).

[0093] In one embodiment, the first printed circuit board (510) may include a printed circuit board.

[0094] In one embodiment, the interposer (530) may be connected to the first printed circuit board (510).

[0095] In one embodiment, a second printed circuit board (not shown) may be connected to the interposer (530). The second printed circuit board may include a nozzle hole (522) and a guide hole (523). A thermal interface material may be injected onto the first printed circuit board (510) through the nozzle hole (522).

[0096] In one embodiment, the first component (560) may include a heat source. The second component (570) may include a component that is relatively sensitive to heat.

[0097] In one embodiment, a guide (550) may be disposed on the first printed circuit board (510). The guide (550) may be disposed on a movement path of a thermal interface material to change the movement path of the thermal interface material. For example, the thermal interface material may flow in the xy plane before contacting the guide (550), and may flow in the z-axis direction after contacting the guide (550). The thermal interface material flowing in the z-axis direction may pass through the guide hole (523). The guide (550) may partially block the path of the thermal interface material. The guide (550) may be formed such that its length intersects an imaginary line connecting the guide hole (523) and the second component (570). One end of the guide (550) may be connected to the interposer (530).

[0098] Fig. 10 is a plan view schematically illustrating the internal appearance of a printed circuit board structure according to one embodiment.

[0099] Referring to FIG. 10, it is noted that in the case of the printed circuit board structure (600), the second printed circuit board (e.g., the second printed circuit board (220) of FIG. 2) and the shield structure (e.g., the shield structure (240) of FIG. 2) are omitted and illustrated. It is noted that in FIG. 10, the positions of the nozzle hole (622) and the guide hole (623) are schematically indicated.

[0100] In one embodiment, the printed circuit board structure (600) may include a first printed circuit board (610), a second printed circuit board (not shown), an interposer (630), a shield structure (not shown), a guide (650), a first component (660), and a second component (670).

[0101] In one embodiment, the first printed circuit board (610) may include a printed circuit board.

[0102] In one embodiment, the interposer (630) may be connected to the first printed circuit board (610).

[0103] In one embodiment, a second printed circuit board (not shown) may be connected to the interposer (630). The second printed circuit board may include a nozzle hole (622) and a guide hole (623). A thermal interface material may be injected onto the first printed circuit board (610) through the nozzle hole (622).

[0104] In one embodiment, the first component (660) may include a heat source. The second component (670) may include a component that is relatively sensitive to heat.

[0105] In one embodiment, a guide (650) may be disposed on the first printed circuit board (610). The guide (650) may be disposed on a movement path of a thermal interface material, thereby changing the movement path of the thermal interface material. For example, the thermal interface material may flow in the xy plane before contacting the guide (650), and may flow in the z-axis direction after contacting the guide (650). The thermal interface material flowing in the z-axis direction may pass through the guide hole (623). The guide (650) may partially block the path of the thermal interface material.

[0106] In one embodiment, the guide (650) may include a first part (451) whose length direction is formed in the x-axis direction, and a second part (652) whose length direction is formed in the y-axis direction. The first part (451) and the second part (652) may include a plurality of units. For example, the units may be dummy elements. For example, the units may be dummy capacitors. A separate resin may be applied to the units. The resin may be cured while being applied to the units. The resin may reduce a gap between the units and a second printed circuit board (not shown).

[0107] According to one embodiment, in the case of an electronic device including a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure (200) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a second printed circuit board body (221) connected to the interposer, a nozzle hole (222) formed penetrating through the second printed circuit board body, a guide hole (223) formed penetrating through the second printed circuit board body and provided at a position spaced apart from the nozzle hole, a second printed circuit board (220) defining a first internal space (S1) together with the first printed circuit board and the interposer, a second internal space connected to the second printed circuit board, accommodates the thermal interface material passing through the guide hole, and is connected to the first internal space through the guide hole. It may include a shield structure (240) defining a space (S2), and a guide (250) arranged on the first printed circuit board and guiding at least a portion of the thermal interface material filled in the first internal space to the second internal space.

[0108] In one embodiment, the guide (250) may overlap the shield structure (240) based on the stacking direction of the first printed circuit board, the interposer, and the second printed circuit board.

[0109] In one embodiment, the guide (250) may include a first part (251) whose length direction is formed in a first direction, and a second part (252) whose length direction is formed in a second direction intersecting the first direction.

[0110] In one embodiment, the first part (251) can guide a portion of the thermal interface material flowing in the second direction in the first internal space to the second internal space.

[0111] In one embodiment, the second part (252) can guide some of the thermal interface material flowing in the first direction in the first internal space to the second internal space.

[0112] In one embodiment, the guide (250) may include an elastic material and be provided in a compressed state by the first printed circuit board and the second printed circuit board.

[0113] In one embodiment, the guide (250) may be provided in contact with the second printed circuit board.

[0114] In one embodiment, the printed circuit board structure further includes a first component (260) arranged on the first printed circuit board; and a second component (270) arranged on the first printed circuit board and provided at a position spaced apart from the first component, wherein the first component (260) and the second component (270) may be positioned on opposite sides with respect to the guide.

[0115] In one embodiment, the first component (260) may be located in an area between the nozzle hole and the guide in the first internal space.

[0116] In one embodiment, the first component (260) may be positioned in an area of ​​the first internal space filled with the thermal interface material, and the second component (270) may be positioned in an area of ​​the first internal space not filled with the thermal interface material.

[0117] In one embodiment, the first component (260) may include a thermal source, and the second component may include one of a crystal or a vibrator.

[0118] In one embodiment, the second printed circuit board (220) may further include a vent hole formed through the second printed circuit board body and provided at a position spaced apart from the shield structure.

[0119] In one embodiment, the vent hole (224) may be located on the opposite side of the nozzle hole with respect to the guide.

[0120] In one embodiment, the shield structure (240) may include a shield structure body (241) defining the second internal space, and an air hole (242) formed through the shield structure body.

[0121] In one embodiment, the guide (350) may be provided in contact with the interposer.

[0122] According to one embodiment, a printed circuit board structure for accommodating a thermal interface material (TIM) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a second printed circuit board body (221) connected to the interposer, a nozzle hole (222) formed through the second printed circuit board body, a guide hole (223) formed through the second printed circuit board body and provided at a position spaced from the nozzle hole, a second printed circuit board (220) defining a first internal space (S1) together with the first printed circuit board and the interposer, a shield structure (240) connected to the second printed circuit board, accommodating the thermal interface material passing through the guide hole, and defining a second internal space (S2) connected to the first It may include a guide (250) arranged on a printed circuit board and guiding at least a portion of the thermal interface material filled in the first internal space to the second internal space.

[0123] In one embodiment, the guide (250) may overlap the shield structure (240) based on the stacking direction of the first printed circuit board, the interposer, and the second printed circuit board.

[0124] In one embodiment, the guide (250) may include an elastic material and be provided in a compressed state by the first printed circuit board and the second printed circuit board.

[0125] In one embodiment, the guide (350) may be provided in contact with the interposer.

[0126] According to one embodiment, in the case of an electronic device including a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure (200) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a second printed circuit board body (221) connected to the interposer, a nozzle hole (222) formed penetrating through the second printed circuit board body, a guide hole (223) formed penetrating through the second printed circuit board body and provided at a position spaced apart from the nozzle hole, and a vent hole (224) formed penetrating through the second printed circuit board body, and defining a first internal space (S1) together with the first printed circuit board and the interposer, the thermal interface material (TIM) connected to the second printed circuit board and passing through the guide hole A shield structure (240) that defines a second internal space (S2) that accommodates a material and is connected to the first internal space through the guide hole, and a guide (250) that is arranged on the first printed circuit board and guides at least a portion of the thermal interface material filled in the first internal space to the second internal space, and is provided so as to overlap the shield structure and contact the second printed circuit board based on the stacking direction of the first printed circuit board, the interposer, and the second printed circuit board, wherein the vent hole (224) may be located on the opposite side of the nozzle hole (222) based on the guide (250).

[0127] The effects of the electronic device according to the embodiments are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description in the specification.

[0128] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications may be made to the details of the present disclosure, including those encompassed by the appended claims and their equivalents. Any of the embodiments described herein may be used in combination with any other embodiments described herein.

Claims

1. First printed circuit board (210); Second printed circuit board (220); A shield structure (240) surrounding a component placed on the second printed circuit board (220); and Including an interposer (230) connected between the first printed circuit board and the second printed circuit board, The second printed circuit board (220) includes a nozzle hole (222) formed through the second printed circuit board (220) and a guide hole (223) formed through the second printed circuit board (220) and provided at a position spaced from the nozzle hole. The above nozzle hole is configured to inject a thermal interface material that fills at least a portion of a first internal space (S1) defined by the first printed circuit board, the second printed circuit board, and the interposer. An electronic device, wherein at least a portion of a second internal space (S2) defined by the shield structure and the second printed circuit board is provided to be filled with the thermal interface material passing through the guide hole from the first internal space.

2. In paragraph 1, The above guide (250) is an electronic device that guides a portion of the thermal interface material within the first internal space so that, when the thermal interface material is injected through the nozzle hole, the thermal interface material passes through the guide hole and moves into the second internal space.

3. In paragraph 2, The above guide (250) is, A first part (251) formed in a first direction with a longitudinal direction; and An electronic device comprising a second part (252) formed in a second direction whose longitudinal direction intersects the first direction.

4. In paragraph 2 or 3, The above guide is an electronic device placed near the guide hole (223).

5. In any one of paragraphs 2 to 4, The above guide (250) is an electronic device arranged to contact the interposer.

6. In any one of paragraphs 2 to 5, An electronic device in which the above guide (250) includes an elastic material and is compressed by the first printed circuit board and the second printed circuit board.

7. In any one of paragraphs 2 to 6, The above guide (250) is an electronic device arranged to contact the second printed circuit board.

8. In any one of paragraphs 1 to 7, A first component (260) arranged on the first printed circuit board; and It further includes a second component (270) arranged on the first printed circuit board and provided at a position spaced apart from the first component, An electronic device in which the first part (260) and the second part (270) are positioned opposite each other with respect to the guide, so that the thermal interface material received through the nozzle hole is prevented from flowing to the second part.

9. In paragraph 8, The above first component (260) is an electronic device located in an area between the nozzle hole and the guide in the first internal space.

10. In clause 8 or 9, The above first component (260) is located in an area of ​​the first internal space where the thermal interface material is filled, The second component (270) is an electronic device located in an area of ​​the first internal space that is not filled with the thermal interface material.

11. In any one of paragraphs 8 to 10, The above first component (260) is an electronic device including a thermal source.

12. In any one of paragraphs 8 to 11, An electronic device, wherein the second component (270) includes at least one of a crystal and an oscillator.

13. In any one of paragraphs 1 to 12, An electronic device in which the second printed circuit board (220) further includes a vent hole (224) formed penetrating the second printed circuit board and provided at a position spaced from the shield structure.

14. In paragraph 13, The above vent hole (224) is an electronic device located on the opposite side of the nozzle hole with respect to the guide.

15. In any one of paragraphs 1 to 14, An electronic device in which the shield structure (240) includes an air hole (242) formed penetrating the shield structure.

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