Optical module

Abstract

The present disclosure provides an optical module, comprising: a first optical transmitter chip, a second optical transmitter chip, a first amplitude-limiting driver chip, a second amplitude-limiting driver chip, and a micro control unit. A first input end of a third switch is connected to the first amplitude-limiting driver chip, a second input end of the third switch is connected to the micro control unit, and a second output end of the third switch is connected to the first amplitude-limiting driver chip. The second amplitude-limiting driver chip is connected to a first output end of the third switch. At a first temperature, the first optical transmitter chip transmits first wavelength signal light, and the second optical transmitter chip transmits third wavelength signal light. At a second temperature, the first optical transmitter chip transmits second wavelength signal light, and the second optical transmitter chip transmits fourth wavelength signal light. The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light increase sequentially. The ratio of a high temperature difference to an ambient temperature threshold is less than or equal to 40%.

Description

optical modules

[0001] This application claims the Chinese patent application number 202310778953.X filed with the China Patent Office on June 28, 2023, the Chinese patent application number 202321664511.4 filed with the China Patent Office on June 28, 2023, the Chinese patent application number 202310775173.X filed with the China Patent Office on June 28, 2023, and the Chinese patent application number 202310775173.X filed with the China Patent Office on June 28, 2023. The present application claims priority of Chinese patent application No. 8529.5, Chinese patent application No. 202310778304.X filed with the Chinese Patent Office on June 28, 2023, Chinese patent application No. 202310778484.1 filed with the Chinese Patent Office on June 28, 2023, and Chinese patent application No. 2202310778943.6 filed with the Chinese Patent Office on June 28, 2023, all of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0003] Optical communication technology is used in new business models and applications such as cloud computing, mobile internet, and video. In optical communications, optical modules are tools for converting optical and electrical signals and are key components in optical communication equipment. With the rapid development of 5G networks, optical modules, at the core of optical communications, have experienced significant development.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising: a circuit board having a gold finger. A first limiter driver chip is connected to the gold finger, receiving and amplifying a transmission signal. A first input end of a third switch is connected to the first limiter driver chip, a second input end of the third switch is connected to a microcontroller chip, and a second output end of the third switch is connected to the first limiter driver chip. A second limiter driver chip is connected to the first output end of the third switch; a first light emitting chip is connected to the first limiter driver chip; a second light emitting chip is connected to the second limiter driver chip; and a first temperature regulator is thermally connected to the first and second light emitting chips to adjust the wavelengths of the first and second light emitting chips. The microcontroller controls the third switch to input the amplified transmission signal into the first or second limiter driver chip. At a first temperature, the first light emitting chip emits a first wavelength signal light, and the second light emitting chip emits a third wavelength signal light; at a second temperature, the first light emitting chip emits a second wavelength signal light, and the second light emitting chip emits a fourth wavelength signal light. The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase in sequence; the first temperature is lower than the second temperature, and the operating temperature includes: the first temperature and the second temperature; the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%; the ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature, and the high temperature difference is the difference between the maximum ambient temperature and the operating temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0007] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0008] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0009] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0010] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0011] FIG5 is a schematic structural diagram of a light emitting component and a light receiving component according to some embodiments of the present disclosure;

[0012] FIG6 is a schematic diagram of the exploded structure of a light emitting component and a light receiving component according to some embodiments of the present disclosure;

[0013] FIG7 is a cross-sectional schematic diagram of a light emitting component and a light receiving component according to some embodiments of the present disclosure;

[0014] FIG8 is a schematic structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0015] FIG9 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0016] FIG10 is an assembly diagram of a transmitting housing and pins in an optical module according to some embodiments of the present disclosure;

[0017] FIG11 is a structural diagram 1 of a transmitting housing in an optical module according to some embodiments of the present disclosure;

[0018] FIG12 is a partial schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0019] FIG13 is a first optical path diagram of a light emitting component according to some embodiments of the present disclosure;

[0020] FIG14 is a second optical path diagram of a light emitting component according to some embodiments of the present disclosure;

[0021] FIG15 is a third optical path diagram of a light emitting component according to some embodiments of the present disclosure;

[0022] FIG16 is a first circuit diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0023] FIG17 is a circuit diagram of a light emitting component according to some embodiments of the present disclosure;

[0024] FIG18 is a schematic diagram of another circuit of a light emitting component according to some embodiments of the present disclosure;

[0025] FIG19 is a second schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0026] FIG20 is a circuit diagram of a third light emitting component according to some embodiments of the present disclosure;

[0027] FIG21 is a third circuit diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0028] FIG22 is a circuit diagram of a fourth light emitting component according to some embodiments of the present disclosure;

[0029] FIG23 is a schematic diagram of a light emitting component, a light receiving component, and a circuit board according to some embodiments of the present disclosure;

[0030] FIG24 is a circuit diagram of a light emitting component and a light receiving component according to some embodiments of the present disclosure;

[0031] FIG25 is a schematic structural diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0032] FIG26 is a cross-sectional schematic diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0033] FIG27 is a partial schematic diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0034] FIG28 is a partially exploded schematic diagram of a light receiving component according to some embodiments of the present disclosure;

[0035] FIG29 is a second partially exploded schematic diagram of a light receiving component provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0036] Optical communication technology enables information transmission between information processing devices. It loads information onto light and uses the propagation of light to achieve this transmission. Light loaded with information is an optical signal. The propagation of optical signals within information transmission equipment reduces optical power loss, enabling high-speed, long-distance, and low-cost information transmission. The information processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.

[0037] The conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and / or optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or electrical signal output end of the optical module. A first optical signal from the optical fiber is transmitted into the optical module, and the optical module converts the first optical signal into a first electrical signal, which is then transmitted into the optical network terminal. A second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module converts the second electrical signal into a second optical signal, which is then transmitted into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and not all types of information processing devices need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0038] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system partially comprises a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0039] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end connects to the optical interface of optical module 200. Optical signals can undergo total internal reflection within optical fiber 101, maintaining nearly their original optical power as they propagate in the direction of total internal reflection. Multiple total internal reflections within optical fiber 101 transmit optical signals from the direction of remote information processing device 1000 into optical module 200, or transmit light from optical module 200 toward remote information processing device 1000, enabling long-distance, low-power information transmission.

[0040] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0041] The host computer 100 has an optical module interface 102, which is configured to connect to the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0042] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a unidirectional / bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0043] Common host computers include optical network units (ONUs), optical line terminals (OLTs), optical network devices (ONTs), and data center servers. One end of a network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. Network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0044] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0045] For example, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0046] Optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information remains unchanged, but the encoding and decoding methods of the information can change.

[0047] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown) disposed inside the cage 106. The heat sink 107 has a raised structure that increases the heat dissipation area. A fin-like structure is a common raised structure.

[0048] Optical module 200 is inserted into cage 106 of host computer 100. Cage 106 secures optical module 200, and heat generated by optical module 200 is transferred to cage 106 and then dissipated through heat sink 107. After optical module 200 is inserted into cage 106, the electrical interface of optical module 200 connects to the electrical connector inside cage 106.

[0049] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0050] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0051] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, which is covered on the two lower side plates of the lower shell 202 to form the above-mentioned shell.

[0052] In some embodiments, the lower shell 202 includes a base plate and two lower side plates located on both sides of the base plate and arranged perpendicularly to the base plate; the upper shell 201 includes a cover plate and two upper side plates located on both sides of the cover plate and arranged perpendicularly to the cover plate, and the two upper side plates are combined with the two lower side plates to achieve the upper shell 201 covering the lower shell 202.

[0053] The direction of the line connecting the two openings 204 and 205 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical interface, from which the gold finger 301 of the circuit board 300 extends and is inserted into the electrical connector of the host computer; opening 205 is an optical port, configured to receive the optical fiber 101, so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0054] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, light emitting component 400, and light receiving component 500 within the housings. These components are encapsulated and protected by the upper and lower housings 201 and 202. Furthermore, during assembly of the circuit board 300, light emitting component 400, and light receiving component 500, positioning components, heat dissipation components, and electromagnetic shielding components are easily positioned, facilitating automated production.

[0055] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0056] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0057] For example, the unlocking component 600 is located outside the two lower side panels 2022 of the lower housing 202 and includes a locking component that mates with the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection between the locking component and the host computer, thereby releasing the locking connection between the optical module 200 and the host computer, allowing the optical module 200 to be removed from the cage 106. The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chip may include, for example, a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier chip, a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0058] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0059] The circuit board 300 also includes gold fingers 301 formed on its end surface. Gold fingers 301 are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers 301 are electrically connected to the electrical connector inside the cage 106. The gold fingers 301 can be provided only on one side of the circuit board 300 (such as the top surface shown in Figure 4), or they can be provided on both the top and bottom surfaces of the circuit board 300 to provide more pins. The gold fingers 301 are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0060] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0061] The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0062] The optical module's light-emitting component in the ONU must be able to transmit signal light of different wavelengths, but only one wavelength can be transmitted at a time (under normal operating conditions). This function is also called time-division transmission. The optical module's light-receiving component receives signal light of multiple wavelengths, but only converts one wavelength into an electrical signal.

[0063] FIG5 is a schematic diagram of the structure of an optical transmitter and a light receiver according to some embodiments of the present disclosure. FIG6 is a schematic diagram of the exploded structure of an optical transmitter and a light receiver according to some embodiments of the present disclosure. As shown in FIG5 and FIG6, the optical transceiver assembly includes an optical transmitter and a light receiver, and the optical module also includes a first housing 810 and a fiber optic adapter 700. In the embodiment of the present disclosure, the optical transceiver assembly preferably uses a fiber optic adapter to connect to the optical fiber, that is, the fiber optic adapter 700 is embedded in the first housing 810 for connecting to the optical fiber. For example, the first housing 810 is provided with a third port 813 for inserting the fiber optic adapter 700. The fiber optic adapter 700 is embedded in the third port 813. The optical transmitter 400 and the light receiver 500 respectively establish optical connections with the fiber optic adapter. The light emitted and received by the optical transceiver assembly are both transmitted via the same optical fiber in the fiber optic adapter. That is, the same optical fiber in the fiber optic adapter is the transmission channel for light entering and exiting the optical transceiver assembly, and the optical transceiver assembly implements a single-fiber bidirectional optical transmission mode.

[0064] The first housing 810 is used to support the light emitting and receiving components. In this embodiment, the first housing's rectangular tube is made of metal to facilitate electromagnetic shielding and heat dissipation. A first nozzle 811, a second nozzle 812, and a third nozzle 813 are provided on the rectangular tube. The first nozzle 811 and the second nozzle 812 are located on adjacent side walls of the rectangular tube.

[0065] The first pipe opening 811 is provided on the side wall of the square tube in the width direction, and the second pipe opening 812 is provided on the side wall of the first shell 810 in the length direction.

[0066] The light receiving component 500 is embedded in the first nozzle 811. Through the first nozzle 811, the light emitting component 400 is in thermal contact with the first housing 810. The light emitting component 400 is connected to the second nozzle 812 via the connector 820. A heat conducting block 540 is provided on the outside of the light receiving component 500. The heat conducting block 540 is connected to the upper housing to facilitate heat dissipation of the light receiving component 500.

[0067] The light emitting component 400 and the light receiving component 500 are directly pressed into the first shell 810. The first shell 810 is directly connected to the light emitting component 400 and the light receiving component 500 or is connected to them through a heat-conducting medium. The square tube can be used for heat dissipation of the light emitting component 400 and the light receiving component 500 to ensure the heat dissipation effect of the light emitting component 400 and the light receiving component 500.

[0068] The first shell 810 can be a square tube or a hollow shell in other shapes.

[0069] Figure 7 is a schematic cross-sectional view of an optical transmitter and receiver, according to some embodiments of the present disclosure. As shown in Figure 7, a first lens 815 is disposed within the first housing 810 and positioned between the fiber optic adapter 700 and the optical transmitter 400. The fiber optic adapter 700 includes a first optical signal and a second optical signal. The first optical signal originates from an optical fiber and enters the optical transceiver assembly via the optical fiber. The first optical signal originates from the optical transmitter and enters the optical fiber via the optical transmitter.

[0070] The first lens 815 has a semi-transparent and semi-reflective coating, and reflects the first optical signal and transmits the second optical signal. That is, the first lens 815 reflects the light from the optical fiber adapter toward the light emitting component and transmits the light in the opposite direction.

[0071] The first optical signal enters the optical transceiver assembly via the optical fiber, is reflected by the first lens 815, and then travels toward the first nozzle, entering the optical receiving component. The first optical signal may contain signal light of a single wavelength or of two or more wavelengths. The optical receiving component filters the first optical signal, and the optical receiver of the optical receiving component receives only the signal light of a single wavelength and converts it into an electrical signal.

[0072] A plano-convex lens is provided between the optical fiber adapter 700 and the first lens 815. The plano-convex lens collimates the first optical signal so that the first optical signal is transformed from a scattered beam into a parallel beam, and converges the second optical signal. The converged second optical signal enters the optical fiber adapter 700. Alternatively, a plano-convex lens is provided inside the optical fiber adapter 700.

[0073] In some embodiments of the present disclosure, to reduce the size of the first housing, a displacement prism 817 is further provided in the first housing. The displacement prism 817 is located between the first lens 815 and the light receiving component 500 and shifts the first optical signal to the emission window 415 of the light receiving component 500.

[0074] A connector is provided between the light receiving component and the first housing 810. Exemplarily, one end of the connector 820 is connected to the first housing 810 and the other end is connected to the second housing 411. The connector 820 is also connected to the second nozzle. In some embodiments, the cross-sectional area of ​​the connector 820 is smaller than the area of ​​the outer wall of the first housing, and the cross-sectional area of ​​the connector 820 is smaller than the area of ​​one side of the second housing 411. This facilitates the connection between the second housing 411 and the first housing 810 while ensuring a sealed seal within the second cavity 4110.

[0075] In some embodiments, the outer contour of the connection base 820 is cylindrical. When the connection base 820 is connected to the first shell 810 by laser welding, the cylindrical connection base 820 facilitates the operation of the laser welding process, thereby facilitating the connection between the connection base 820 and the first shell 810.

[0076] For example, a single optical module in an ONU can provide four transmission wavelengths, but at the same time, the optical module only transmits signal light of one wavelength.

[0077] Figure 8 is a schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 9 is an exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 8 and 9, the light emitting component includes a second cavity 4110, which includes a second shell 411 and a second upper cover 412. The second shell 411 forms an inner cavity, and the second upper cover 412 covers and connects to the second shell 411, forming a relatively sealed cavity structure with the second shell 411.

[0078] A connecting seat 820 is provided on the side of the second cavity 4110 , and the second cavity 4110 and the first shell 810 are connected through the connecting seat 820 .

[0079] As shown in Figure 9, a fixing surface 4101 is provided on the top of the second shell 411, and the second upper cover 412 is fixedly connected to the fixing surface 4101; the second shell 411 is provided with a first through hole 4103, one end of the first through hole 4103 is connected to the inner cavity of the second shell 411, and the other end of the first through hole 4103 is connected to the connecting seat 820. The first through hole 4103 is connected to the second pipe mouth through the connecting seat 820, and the first through hole 4103 is used to output optical signals.

[0080] Figure 10 is an assembly diagram of an emitting housing and pins in an optical module according to some embodiments of the present disclosure, and Figure 11 is a structural diagram of an emitting housing in an optical module according to some embodiments of the present disclosure. As shown in Figures 10 and 11, the second housing 411 includes a bottom plate 4010, a first side plate 4011, a second side plate 4012, a third side plate 4013, and a fourth side plate 4014. The first side plate 4011, the second side plate 4012, the third side plate 4013, and the fourth side plate 4014 are all connected to the bottom plate 4010. The first side plate 4011 and the third side plate 4013 are arranged opposite each other, and the second side plate 4012 and the fourth side plate 4014 are arranged opposite each other. In this way, the bottom plate 4010, the first side plate 4011, the second side plate 4012, the third side plate 4013, and the fourth side plate 4014 form a housing with an open top.

[0081] A plurality of insertion holes 4016 are formed on the third side plate 4013 , through which the transmitting pins 413 are inserted into the second shell 411 , and the transmitting pins 413 and the insertion holes 4016 are sealed together by an insulating member 4017 , thereby achieving a sealed connection between the transmitting pins 413 and the second shell 411 .

[0082] In some embodiments, since glass PIN packaging is the lowest-cost packaging form in optical devices, the insulating member 4017 is a glass member, and the emitting pin 413 is connected to the second housing 411 through a glass seal.

[0083] In some embodiments, in order to avoid signal crosstalk, the spacing between adjacent jacks 4016 needs to be greater than 0.2 mm. When the optical emission component includes multiple laser groups, multiple laser chips need to be connected to more emission pins 413. There are a large number of jacks 4016 on the third side panel 4013 of the second shell 411. In order to ensure the spacing between adjacent jacks 4016, the inner side surface of the third side panel 4013 is arranged in a stepped shape, that is, the inner side surface of the third side panel 4013 includes a first surface and a second surface, and the second surface can protrude from the first surface, so that the distance between the second surface and the first side panel 4011 is smaller than the distance between the first surface and the first side panel 4011, and jacks 4016 are respectively formed on the first surface and the second surface, thereby increasing the spacing between adjacent jacks 4016, so that more jacks 4016 can be set on the third side panel 4013. After the transmitting pin 413 is inserted into the second housing 411 through the jack 4016 , the transmitting pin 413 is connected to the laser group in the second housing 411 by bonding wires, and the signal transmitted by the transmitting pin 413 drives the laser group.

[0084] In some embodiments, the transmit pins 413 include a high-speed pin group and a low-speed pin group, with the high-speed pin group located below the low-speed pin group. The high-speed pin group provides high-speed signals to the laser group within the second housing 411, while the low-speed signal group provides low-frequency power to the laser group. The high-speed pin group and the laser are located at the same height, reducing the length of the wire bond between the high-speed pin group and the laser, thereby reducing signal loss.

[0085] In some embodiments, a first through hole 4103 is formed on the first side plate 4011 , and the first through hole 4103 passes through the first side plate 4011 so that the first through hole 4103 is connected to the inner cavity of the second shell 411 , and the signal light generated by the laser group is emitted from the second shell 411 through the first through hole 4103 .

[0086] In some embodiments, the light emitting component 400 further includes a light emitting window 415, which is used to transmit the transmitted light signal and seal the light hole in the second housing 411. Exemplarily, the light emitting window 415 is embedded in the first through hole 4103 and is used to relatively seal the first through hole 4103, allowing the transmitted light signal to pass through while also sealing the first through hole 4103 to ensure the sealing performance of the second housing 411. In some embodiments, the light emitting window 415 is made of transparent glass.

[0087] In some embodiments, the emission light window 415 can be tilted within the first through hole 4103. The coaxial arrangement of the emission light window 415 and the first through hole 4103 can reduce the amount of emission light signals reflected by the emission light window 415 that return to the transmission optical path of the emission light signal along the original path, thereby preventing the reflected light from affecting the luminescence performance of the laser group.

[0088] In some embodiments, the optical emission component includes at least one laser group, which is connected to the corresponding emission pin 413 through bonding. The emission pin 413 transmits electrical signals and data signals to the laser chip to drive the laser chip to generate signal light.

[0089] 10 , the transmitting pin 413 includes a high-speed signal transmitting pin 4130, a ground transmitting pin 4131 and a power transmitting pin 4132. When the laser group in the second shell 411 is connected to the transmitting pin 413 inserted into the jack 4016 by bonding, the laser chip is connected to the high-speed signal transmitting pin 4130, the power transmitting pin 4132 and the ground transmitting pin 4131 by bonding, and the laser chip is powered by the power transmitting pin 4132 so that the laser chip generates light. The light generated by the laser chip is modulated by the data signal transmitted by the high-speed signal transmitting pin 4130. In this way, the laser chip generates a modulated optical signal under the action of the electrical signal and the data signal.

[0090] In some embodiments, a transmitting pin 413 is provided at the other end of the second housing 411. The transmitting pin 413 is used to electrically connect the electrical components within the second cavity 4110 to the circuit board 300. Exemplarily, the transmitting pin 413 is embedded in the other end of the second housing 411, such that one end of the circuit board 300 extends into the second housing 411 and the other end of the transmitting pin 413 is located outside the second housing 411. The transmitting pin 413 is electrically connected to the circuit board 300 via a flexible printed circuit board. The transmitting pin 413 can also be soldered to the circuit board 300.

[0091] Figure 12 is a partial schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figure 12, a light emitting assembly and a beam combiner are disposed within the second housing. The light emitting assembly includes: a semiconductor cooler, a light emitting chip, and a beam combiner.

[0092] In some embodiments, the optical transmission component includes: a beam combiner 416, a first optical transmission chip 410, and a second optical transmission chip 420. The first optical transmission chip 410 can be used to emit a first wavelength signal light and a second wavelength signal light; the second optical transmission chip 420 can be used to emit a third wavelength signal light and a fourth wavelength signal light.

[0093] The beam combiner 416 combines the light emitted by the first light emitting chip 410 and the second light emitting chip 420 into a single beam. For example, the beam combiner can be a polarization beam combiner that changes the polarization direction of the signal light from the second light emitting chip 420 and the first light emitting chip 410 and combines the light emitted by the first and second light emitting chips into a single beam.

[0094] The signal light emitted by the first optical transmitter chip 410 is polarized by the polarization beam combiner and then enters the optical fiber adapter through the first housing. The signal light emitted by the second optical transmitter chip is polarized by the polarization beam combiner and then emitted toward the optical fiber adapter.

[0095] In some examples, the polarization beam combining assembly includes a polarization plate and a polarization combiner, with the polarization plate positioned between the second light emitting chip and the polarization combiner. The polarization beam combining assembly includes a second isolator 4161 and a third isolator 4162, wherein the second isolator 4161 is positioned in the light-emitting path of the first light emitting chip 410, and the third isolator 4162 is positioned in the light-emitting path of the second light emitting chip 420. A first polarization plate 41611 is positioned on the light-emitting side of the second isolator 4161, and a second polarization plate 41621 is positioned on the light-emitting side of the third isolator 4162. In some examples, the signal light emitted by the first light emitting chip is parallel to the direction of the circuit board, and is deflected 45° after passing through the second isolator 4161. The signal light emitted by the second light emitting chip is parallel to the direction of the circuit board, and is deflected 45° after passing through the third isolator. To facilitate beam combining, the angle difference between the signal light emitted by the first optical emission chip after being deflected by the first polarization plate and the angle difference between the signal light emitted by the second optical emission chip after being deflected by the second polarization plate is 90°.

[0096] In some embodiments of the present disclosure, in order to ensure that the optical axes of the first light emitting chip, the second light emitting chip, and the polarization beam combining assembly are located in the same plane, a beam combining substrate 4165 is provided under the polarization beam combining assembly.

[0097] A beam combining platform 4167 is located between the beam combining substrate 4165 and the beam combiner. This platform provides a highly flat surface for the beam combiner, second isolator, and third isolator, improving optical coupling accuracy. The cross-sectional area of ​​the beam combining platform is larger than that of the beam combining substrate 4165 and provides mounting space for the beam combiner, second isolator, and third isolator.

[0098] To facilitate installation, a connecting portion 4163 is provided between the second isolator 4161 and the third isolator 4162. One end of the connecting portion 4163 is fixedly connected to the second isolator 4161, and the other end of the connecting portion 4163 is fixedly connected to the third isolator 4162. This allows the connecting portion 4163, the second isolator 4161, and the third isolator 4162 to form a single unit. This allows for simultaneous positioning of the second isolator 4161 and the third isolator 4162 with a single positioning operation, facilitating installation.

[0099] Figure 13 is a schematic diagram of the optical path of a light emitting component according to some embodiments of the present disclosure. As shown in Figure 13 , in some embodiments, the light emitting component includes a first collimating lens 4104 located between the first light emitting chip 410 and the polarization beam combiner. The first collimating lens 4104 collimates the signal light emitted by the first light emitting chip 410.

[0100] The second collimating lens 4105 is located between the second light emitting chip 420 and the polarization beam combining assembly. The second collimating lens 4105 collimates the signal light emitted by the second light emitting chip 420 .

[0101] In some embodiments, the light emitting component includes a second isolator 4161. The second isolator 4161 is located between the first collimating lens 4104 and the polarization beam combiner to prevent light reflected by the polarization beam combiner from entering the first light emitting chip.

[0102] In some embodiments, the light emitting component includes a third isolator 4162. The third isolator 4162 is located between the second collimating lens and the polarization beam combiner to prevent light reflected by the polarization beam combiner from entering the second light emitting chip.

[0103] The first polarization plate 41611 is located between the second isolator 4161 and the polarization combiner; the second polarization plate 41621 is located between the third isolator 4162 and the polarization combiner. For example, the first polarization plate is located on the light-emitting side of the second isolator 4161 and between the second isolator 4161 and the polarization combiner 4164. The second polarization plate is located on the light-emitting side of the third isolator 4162 and between the third isolator 4162 and the polarization combiner.

[0104] In some embodiments, the light emitting component may be provided with two light emitting chips, three light emitting chips, or even more light emitting chips. The number of wavelengths that can be tuned by the light emitting component is greater than the number of light emitting chips. The number of light emitting chips in the light emitting component is not one.

[0105] In this example, the light emitting component includes a first light emitting chip 410, a second light emitting chip 420, a first collimating lens 4104, a second collimating lens 4105, a semiconductor cooler 4106, a polarizer, and a polarization combiner. The semiconductor cooler is thermally connected to the first and second light emitting chips and changes the temperature of the first or second light emitting chip to adjust the tuning wavelength of the first or second light emitting chip. Light emitted by the first light emitting component passes through the first collimating lens 4104 to form collimated light, which then passes through the polarization combiner, the first housing, and the fiber optic adapter. The semiconductor cooler changes the temperature of the first or second light emitting chip to adjust the tuning wavelength of the first or second light emitting chip. Light emitted by the second light emitting component passes through the second collimating lens to form collimated light. After being rotated by a certain angle by the polarizer, it is reflected by the polarization combiner and enters the first housing, and then enters the fiber optic adapter.

[0106] In the normal working state of the ONU optical module, when the first light emitting chip 410 emits light, the second light emitting chip 420 does not emit light; when the second light emitting chip 420 emits light, the first light emitting chip 410 does not emit light. This characteristic is called time-division emission.

[0107] In an ONU, the wavelength of the signal light emitted by the optical transmitter is adjusted by regulating the temperature of the optical transmitter chip. The present disclosure provides an optical module comprising a first optical transmitter chip 410, a second optical transmitter chip 420, a third temperature regulator, a second temperature regulator, a laser driver chip, and a microcontroller unit 460. For example, the first optical transmitter chip 410 and the second optical transmitter chip 420 are electro-absorption modulated lasers. The laser driver chip includes a first differential output pin 451 and a second differential output pin. The first differential output pin 451 is connected to the first optical transmitter chip 410, and the second differential output pin 452 is connected to the second optical transmitter chip 420. The microcontroller unit controls the temperatures of the third temperature regulator and the second temperature regulator to control the coordinated wavelengths of the first optical transmitter chip 410 and the second optical transmitter chip 420, respectively.

[0108] Figure 14 is a second schematic diagram of the optical path of an optical transmission component according to some embodiments of the present disclosure. As shown in Figure 14 , in some embodiments, the optical transmission component includes: a first collimating lens 4104 located between a first optical transmission chip and an optical wavelength division multiplexer 4165. The first collimating lens 4104 collimates the signal light emitted by the first optical transmission chip. A second collimating lens located between a second optical transmission chip and a beam combiner collimates the signal light emitted by the second optical transmission chip.

[0109] The combiner includes an optical wavelength division multiplexer 4165 and a fourth isolator 4166. The optical wavelength division multiplexer 4165 is located between the fourth isolator 4166 and the first and second light emitting chips, and combines the light emitted by the first and second light emitting chips into one beam.

[0110] The optical wavelength division multiplexer 4165 has a first light inlet. Signal light emitted by the first optical transmitter chip 410 enters the optical wavelength division multiplexer 4165 through the first light inlet, is reflected by the first reflective surface to the second transmissive reflective surface, and then is reflected by the second transmissive reflective surface before being emitted through the light outlet. Signal light emitted by the second optical transmitter chip enters the optical wavelength division multiplexer 4165 through the second light inlet, is transmitted through the second transmissive reflective surface, and is emitted through the light outlet.

[0111] Figure 15 is a third schematic diagram of the optical path of a light-emitting component provided according to some embodiments of the present disclosure. As shown in Figure 15 , the first light emitted by the first light-emitting chip 410 directly passes through the second lens 4045. The first light beam passing through the second lens 4045 is incident on the incident light surface of the third lens 4046. A reflective film is provided on the second incident light surface 4073 of the fourth lens 4047. The second light emitted by the second light-emitting chip is reflected by the reflective film on the incident light surface of the fourth lens 4047, changing the emission direction of the second light, so that the second light is reflected by the fourth lens 4047 to the third lens 4046. The first emitted light can be directly transmitted on the first incident light surface 4072 of the third lens 4046, and the reflected second emitted light is reflected on the first incident light surface 4072 of the third lens 4046, so that the reflected second emitted light is reflected again to the second lens 4045 via the third lens 4046; the second emitted light reflected by the third lens 4046 to the exit light surface 4071 of the second lens 4045 is reflected again on the exit light surface 4071 of the second lens 4045, so that the second emitted light is reflected to the third lens 4046 via the second lens 4045, and the second emitted light reflected again to the third lens 4046 can be directly transmitted on the first incident light surface 4072 of the third lens 4046.

[0112] Specifically, an angle-selective film may be provided on the first light-incident surface 4072 of the third lens 4046. This angle-selective film selectively transmits light incident on the first light-incident surface 4072. Specifically, the angle-selective film is configured with a preset angle of incidence. When the angle of incidence of light incident on the first light-incident surface 4072 meets the preset angle of incidence, the light beam may directly transmit through the third lens 4046. When the angle of incidence of light incident on the first light-incident surface 4072 does not meet the preset angle of incidence, the light beam is reflected from the first light-incident surface 4072 to change the angle of incidence of the light beam until the angle of incidence of the light beam meets the preset angle of incidence of the first light-incident surface 4072.

[0113] In the embodiment of the present disclosure, the incident angle of the first emitted light transmitted by the second lens 4045 satisfies the preset incident angle of the first incident light surface 4072 of the third lens 4046, and thus the first emitted light can directly transmit through the third lens 4046. The incident angle of the second emitted light reflected by the fourth lens 4047 onto the first incident light surface 4072 of the third lens 4046 is greater than the preset incident angle of the first incident light surface 4072 of the third lens 4046, and thus the second emitted light is reflected again at the first incident light surface 4072 and then emitted onto the light exit surface 4071 of the second lens 4045.

[0114] In the embodiment of the present disclosure, the preset incident light angle of the angle selection film provided on the first incident light surface 4072 of the third lens 4046 can be 0 to 45°, and the incident angle of the first emitted light passing through the second lens 4045 to the first incident light surface 4072 of the third lens 4046 is 37°, which meets the preset incident light angle of the angle selection film, so the first emitted light can directly pass through the angle selection film; the incident angle of the second emitted light reflected by the fourth lens 4047 to the first incident light surface 4072 of the third lens 4046 is 57°, which exceeds the preset incident light angle of the angle selection film, so the second emitted light is reflected at the angle selection film.

[0115] The first incident light surface 4072 of the third lens 4046 provided in the embodiment of the present disclosure is not limited to being provided with an angle selection film, and other films may also be provided. As long as the film can enable the first emitted light to directly transmit through the first incident light surface 4072 and the second emitted light to be reflected at the first incident light surface 4072, it all falls within the protection scope of the embodiment of the present disclosure.

[0116] In order to allow the second emitted light to pass through the third lens 4046, it is necessary to reduce the incident angle of the second emitted light incident on the first incident light surface 4072 of the third lens 4046. Therefore, the second emitted light reflected on the first incident light surface 4072 of the third lens 4046 can be reflected again. When the second emitted light after re-reflection is incident on the first incident light surface 4072 of the third lens 4046, its incident angle is reduced, which can meet the preset incident light angle of the angle selection film.

[0117] A semi-transparent, semi-reflective film is disposed on the light-emitting surface 4071 of the second lens 4045. This semi-transparent, semi-reflective film is wavelength-selective, meaning that light beams within a certain wavelength range can directly transmit through the semi-transparent, semi-reflective film, while light beams outside this wavelength range are reflected at the semi-transparent, semi-reflective film. In the disclosed embodiment, the wavelength of the first emitted light meets the transmission wavelength range of the semi-transparent, semi-reflective film, and thus the first emitted light can directly transmit through the light-emitting surface 4071 of the second lens 4045. However, the wavelength of the second emitted light does not meet the transmission wavelength range of the semi-transparent, semi-reflective film, and therefore the second emitted light is reflected at the semi-transparent, semi-reflective film, causing the second emitted light to be reflected again from the light-emitting surface 4071 of the second lens 4045 to the first light-incident surface 4072 of the third lens 4046.

[0118] After being reflected by the first incident light surface 4072 of the third lens 4046 and reflected again by the exit light surface 4071 of the second lens 4045, the incident angle of the second emitted light entering the first incident light surface 4072 of the third lens 4046 becomes smaller, so that the incident angle of the second emitted light can meet the preset incident light angle of the angle selection film, so that the reflected second emitted light can be transmitted through the third lens 4046.

[0119] The first emitted light and the second emitted light that enters the third lens 4046 again after reflection can be combined in the third lens 4046, that is, the first emitted light and the second emitted light are combined into a light beam in the third lens 4046, and the light beam is emitted from the third lens 4046 and coupled to the optical fiber adapter.

[0120] In some embodiments of the present disclosure, a second isolator and a third isolator may be further provided. The second isolator is located between the first light emitting chip and the second lens. The third isolator is located between the second light emitting chip and the fourth lens.

[0121] In some embodiments of the present disclosure, a first collimating lens and a second collimating lens may be provided between the first light emitting chip and the second lens; and the second collimating lens may be provided between the second light emitting chip and the fourth lens.

[0122] Figure 16 is a schematic diagram of a light emitting component and circuit board according to some embodiments of the present disclosure. Figure 17 is a schematic diagram of a light emitting component according to some embodiments of the present disclosure. As shown in Figure 14, in some embodiments of the present disclosure, the optical module includes: a first light emitting chip 410, a second light emitting chip 420, a third temperature regulator 441, a second temperature regulator 430, a laser driver chip 450, and a microcontroller unit 460.

[0123] In this example, the first light emitting chip 410 and the second light emitting chip 420 are electro-absorption modulated lasers.

[0124] Laser driver chip 450 outputs differential signals. Specifically, laser driver chip 450 includes a first differential output pin 451 and a second differential output pin 452. The first differential output pin 451 is connected to the first light emitting chip 410, while the second differential output pin 452 is connected to the second light emitting chip 420. The first differential output pin 451 outputs a first differential signal, while the second differential output pin 452 outputs a second differential signal. The first and second differential signals form a differential mode signal pair. Differential transmission ensures that the first and second differential signals have equal amplitudes, a 180-degree phase difference, and opposite polarity.

[0125] The third temperature regulator is thermally connected to the first light emitting chip 410 and is used to adjust the operating temperature of the first light emitting chip 410. The second temperature regulator is thermally connected to the second light emitting chip 420 and is used to adjust the operating temperature of the second light emitting chip 420.

[0126] The micro control unit 460 is electrically connected to the third temperature regulator and the second temperature regulator respectively, and is used to control the power supply current of the third temperature regulator and the second temperature regulator to achieve temperature regulation of the third temperature regulator and the second temperature regulator.

[0127] To achieve temperature control of the third temperature regulator, a first temperature sensor is also included. The first temperature sensor senses the current operating temperature of the first light emitting chip 410 and transmits the current operating temperature of the first light emitting chip 410 to the microcontroller 460. The microcontroller 460 adjusts the supply current to the third temperature regulator based on the current operating temperature. To achieve temperature control of the second temperature regulator, a second temperature sensor is also included. The second temperature sensor senses the current operating temperature of the second light emitting chip 420 and transmits the current operating temperature of the second light emitting chip 420 to the microcontroller 460. The microcontroller 460 adjusts the supply current to the second temperature regulator based on the current operating temperature.

[0128] The first light emitting chip 410 has a first power supply pin, a first modulation pin, and a first ground pin. The first ground pin is electrically connected to the ground line, the first modulation pin is connected to the laser driver chip 450, and the first power supply pin is connected to the first power supply circuit to provide a bias voltage for the first light emitting chip 410. The first power supply pin is the light emitting pin (Laser Diode, LD) of the first light emitting chip 410. The first modulation pin is the electro absorption pin (EA) of the first light emitting chip 410, which receives the first control signal from the laser driver chip 450. The first modulation pin is connected to the first differential output pin 451 of the laser driver chip 450, receiving the first control signal from the laser driver chip 450 to modulate the first light emitting chip 410.

[0129] The second light emitting chip 420 has a second power supply pin, a second modulation pin, and a second ground pin. The second ground pin is electrically connected to the ground line, the second modulation pin is connected to the laser driver chip 450, and the second power supply pin is connected to the second power supply circuit. The second modulation pin is an electrical absorption pin of the second light emitting chip 420 and receives the second control signal from the laser driver chip 450. The second modulation pin is connected to the second differential output pin of the laser driver chip 450 and receives the second control signal from the laser driver chip 450 to modulate the second light emitting chip 420. The first power supply circuit and the second power supply circuit provide bias voltage.

[0130] The optical transmission component circuit also includes a first straight wave filter 401. This filter is located between the laser driver chip 450 and the first optical transmission chip 410. A first end of the filter is connected to the first differential output pin 451, and a second end of the filter is connected to the first optical transmission chip 410. This filter removes the DC signal from the laser driver chip 450 while allowing the AC signal from the laser driver chip 450 to pass through, thereby filtering out clutter and improving the stability of optical communication.

[0131] The optical transmission component circuit also includes a second straight-wave filter 402. This second straight-wave filter 402 is located between the laser driver chip 450 and the second optical transmission chip 420. The first end of the second straight-wave filter 402 is connected to the second differential output pin, while the second end of the first straight-wave filter 401 is connected to the second optical transmission chip 420. This filter removes the DC signal from the laser driver chip 450 while allowing the AC signal from the laser driver chip 450 to pass through, thereby filtering out clutter and improving the stability of optical communication.

[0132] In some embodiments, the first straight wave filter and the second straight wave filter may be capacitors.

[0133] In some embodiments of the present disclosure, the microcontroller unit 460 adjusts the temperature of the first light emitting chip 410 by adjusting the temperatures of the third and second temperature regulators. For light emitting chips, different temperatures correspond to different wavelengths of signal light. For example, the first light emitting chip 410 emits signal light of a first wavelength at a first temperature, and emits signal light of a second wavelength at a second temperature. The second light emitting chip 420 emits signal light of a third wavelength at the first temperature, and emits signal light of a fourth wavelength at the second temperature.

[0134] In some embodiments of the present disclosure, the tuning wavelengths of the first optical transmitter chip 410 are the first wavelength signal light and the second wavelength signal light, and the tuning wavelengths of the second optical transmitter chip 420 are the third wavelength signal light and the fourth wavelength signal light. For example, the tuning wavelength of the first optical transmitter chip 410 is 1532.68 nm or 1533.47 nm, and the tuning wavelength of the second optical transmitter chip 420 is 1534.25 nm or 1535.04 nm; or, the tuning wavelength of the first optical transmitter chip 410 is 1534.25 nm or 1535.04 nm, and the tuning wavelength of the second optical transmitter chip 420 is 1532.68 nm or 1533.47 nm.

[0135] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light are different, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than a minimum threshold. In some embodiments of the present disclosure, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0136] Typically, a temperature adjustment of 8-10°C can change the wavelength of a light-emitting chip. Therefore, in the light-emitting component, adjusting the temperature by only 8°C is sufficient to adjust four wavelengths. At high commercial and industrial temperatures, the temperature regulator only needs to be cooled to 30°C or even lower, significantly reducing power consumption.

[0137] The first temperature and the second temperature are adjacent to the highest operating temperature of the optical module. In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the maximum ambient temperature and the current operating temperature of the optical transmitter chip is the high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%.

[0138] The high temperature difference is the temperature difference that the temperature regulator needs to cool. The ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%, which is conducive to reducing the power consumption of the temperature regulator.

[0139] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 40°C, the maximum ambient temperature of the optical module is 85°C, and the difference between the maximum ambient temperature and the first temperature is 45°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 36%. The second temperature can be set to 50°C, the maximum ambient temperature of the optical module is 85°C, and the difference between the maximum ambient temperature and the first temperature is 35°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 28%.

[0140] In some embodiments of the present disclosure, the first temperature is set to 40±3°C, and the second temperature is set to 50±3°C.

[0141] In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the operating temperature of the transmitting chip and the minimum ambient temperature is a low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0142] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 40°C, the minimum ambient temperature of the optical module is -40°C, and the difference between the first temperature and the minimum ambient temperature is 80°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 64%. The second temperature can be set to 50°C, the minimum ambient temperature of the optical module is -40°C, and the difference between the first temperature and the minimum ambient temperature is 90°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 72%.

[0143] The low temperature difference is the temperature difference that the temperature regulator needs to heat. The ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%, the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%, which helps to reduce the power consumption of the temperature regulator.

[0144] Table 1 is a table of temperature differences that need to be adjusted for the first light emitting component, and Table 2 is a table of temperature differences that need to be adjusted for the second light emitting component. As shown in Table 1, D1 represents the operating temperature of the light emitting chip of the first light emitting component. The first light emitting component is a light emitting chip that emits signal light of different wavelengths at four different temperatures. T1 is the adjustment temperature difference of the temperature regulator when the ambient temperature is 85°C. T2 is the adjustment temperature difference of the temperature regulator when the ambient temperature is -40°C. In Table 2, D2 represents the operating temperature of the second light emitting component. The second light emitting component is when two light emitting chips emit signal light of different wavelengths at two different temperatures. T1 is the adjustment temperature difference of the temperature regulator when the ambient temperature is 85°C, which is called the cooling temperature difference. T2 is the adjustment temperature difference of the temperature regulator when the ambient temperature is -40°C, which is called the heating temperature difference.

[0145] As shown in Table 1, the maximum cooling temperature difference is 55°C and the maximum heating temperature difference is 100°C; as shown in Table 2, the maximum cooling temperature difference is 45°C and the maximum heating temperature difference is 90°C, which helps to reduce power consumption.

[0146] The temperature difference that needs to be adjusted during the operation of the optical transmitter can actually reflect the power consumption of the thermostat. The larger the temperature difference, the greater the power consumption of the thermostat. Under the same temperature difference, the power consumption required for cooling is greater than the power consumption required for heating.

[0147] Comparing Table 1 and Table 2, it can be seen that when an optical module is equipped with two optical transmitter chips, at a first temperature, the first optical transmitter chip emits signal light of a first wavelength, and the second optical transmitter chip emits signal light of a third wavelength. At a second temperature, the first optical transmitter chip emits signal light of a second wavelength, and the second optical transmitter chip emits signal light of a fourth wavelength, with the wavelengths of the first, second, third, and fourth wavelengths increasing in sequence. Furthermore, when the operating temperatures of the optical transmitter chips are the first and second temperatures, the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%, while the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%.

[0148] In some embodiments of the present disclosure, the third temperature regulator and the second temperature regulator are semiconductor coolers.

[0149] The present disclosure provides an optical module, comprising: a first light emitting chip 410, a second light emitting chip 420, a third temperature regulator, a second temperature regulator, a laser driver chip 450, and a microcontroller unit 460. A first differential output pin 451 of the laser driver chip 450 is connected to the first light emitting chip 410, and a second differential output pin 452 of the laser driver chip 450 is connected to the second light emitting chip 420. A third temperature regulator 441 is thermally connected to the first light emitting chip 410 for regulating the operating temperature of the first light emitting chip 410. A second temperature regulator is thermally connected to the second light emitting chip 420 for regulating the operating temperature of the second light emitting chip 420. A microcontroller unit 460 is electrically connected to the first and second temperature regulators, respectively, for controlling the supply currents to the third and second temperature regulators to achieve temperature regulation of the third and second temperature regulators. The microcontroller unit 460 adjusts the temperatures of the first light emitting chip 410 and the second light emitting chip 420 by adjusting the temperatures of the third and second temperature regulators, thereby changing the tuning wavelengths of the first and second light emitting chips 410 and 420. Different temperatures of the light emitting chips correspond to different wavelengths of signal light. The present disclosure utilizes a single laser driver chip 450 connected to the modulation terminals of both light emitting chips, reducing electronic components and facilitating miniaturization of the circuit board. Furthermore, the dual light emitting chip solution only requires adjusting the temperature difference of the light emitting chips to 8°C to achieve four-wavelength tunability, reducing the power consumption of the temperature regulators.

[0150] Figure 18 is a circuit diagram of another optical transmission component provided according to some embodiments of the present disclosure. As shown in Figure 18, in some embodiments of the present disclosure, the optical module includes: a first optical transmission chip 410, a second optical transmission chip 420, a first temperature regulator 440, a laser driver chip 450, and a microcontroller unit 460. When the first and second optical transmission chips 410 and 420 are electro-absorption modulated lasers, the laser driver chip 450 provides differential signal output, that is, the laser driver chip 450 includes: a first differential output pin 451 and a second differential output pin 452. The first differential output pin 451 is connected to the first optical transmission chip 410, and the second differential output pin 452 is connected to the second optical transmission chip 420.

[0151] The first temperature regulator is thermally connected to the first light emitting chip 410 for regulating the operating temperature of the first light emitting chip 410. The first temperature regulator is also thermally connected to the second light emitting chip 420 for regulating the operating temperature of the second light emitting chip 420.

[0152] The micro control unit 460 is electrically connected to the first temperature regulator and is used to control the power supply current of the first temperature regulator to achieve temperature regulation of the first temperature regulator.

[0153] To achieve temperature control of the first temperature regulator, a first temperature sensor is also included. The first temperature sensor senses the current operating temperature of the first light emitting chip 410 and transmits the current operating temperature of the first light emitting chip 410 to the microcontroller unit 460. The microcontroller unit 460 adjusts the supply current to the first temperature regulator based on the current operating temperature.

[0154] The first light emitting chip 410 has a first power supply pin, a first modulation pin, and a first ground pin. The first ground pin is electrically connected to a ground line, the first modulation pin is connected to the laser driver chip 450, and the first power supply pin is connected to a first power supply circuit. The first modulation pin is an electrical absorption pin of the first light emitting chip 410 and receives a first control signal from the laser driver chip 450. The first modulation pin is connected to the first differential output pin 451 of the laser driver chip 450 and receives the first control signal from the laser driver chip 450 to modulate the first light emitting chip 410.

[0155] The second light emitting chip 420 has a second power supply pin, a second modulation pin, and a second ground pin. The second ground pin is electrically connected to the ground line, the second modulation pin is connected to the laser driver chip 450, and the second power supply pin is connected to the second power supply circuit. The second modulation pin is an electrical absorption pin of the second light emitting chip 420 and receives the second control signal from the laser driver chip 450. The second modulation pin is connected to the second differential output pin of the laser driver chip 450 and receives the second control signal from the laser driver chip 450 to modulate the second light emitting chip 420.

[0156] The optical transmission component circuit also includes a first straight wave filter 401. This filter is located between the laser driver chip 450 and the first optical transmission chip 410. A first end of the filter is connected to the first differential output pin 451, and a second end of the filter is connected to the first optical transmission chip 410. This filter removes the DC signal from the laser driver chip 450 while allowing the AC signal from the laser driver chip 450 to pass through, thereby filtering out clutter and improving the stability of optical communication.

[0157] The optical transmission component circuit also includes a second straight-wave filter 402. This second straight-wave filter 402 is located between the laser driver chip 450 and the second optical transmission chip 420. The first end of the second straight-wave filter 402 is connected to the second differential output pin, while the second end of the first straight-wave filter 401 is connected to the second optical transmission chip 420. This filter removes the DC signal from the laser driver chip 450 while allowing the AC signal from the laser driver chip 450 to pass through, thereby filtering out clutter and improving the stability of optical communication.

[0158] In some embodiments of the present disclosure, the microcontroller unit 460 adjusts the temperature of the first light emitting chip 410 by adjusting the temperature of the first temperature regulator. For light emitting chips, different temperatures correspond to different wavelengths of signal light. For example, the first light emitting chip 410 emits signal light of a first wavelength at a first temperature, and emits signal light of a second wavelength at a second temperature. The second light emitting chip 420 emits signal light of a third wavelength at the first temperature, and emits signal light of a fourth wavelength at the second temperature. Therefore, in the light emitting component, only a single temperature change is required to adjust four wavelengths.

[0159] The temperature regulator may be a semiconductor cooler.

[0160] Typically, adjusting the temperature by 8°C can change the wavelength of a light-emitting chip. Therefore, in the light-emitting component, adjusting the temperature by only 8°C is sufficient to adjust four wavelengths. At high commercial and industrial temperatures, the temperature regulator only needs to be cooled to 30°C or even lower, significantly reducing power consumption.

[0161] The cooling temperature value required by the temperature regulator represents the difference between the ambient temperature of the optical module and the operating temperature of the optical transmitter chip.

[0162] The present disclosure provides an optical module comprising: a first light emitting chip 410, a second light emitting chip 420, a first temperature regulator, a laser driver chip 450, and a microcontroller unit 460. A first differential output pin 451 of the laser driver chip 450 is connected to the first light emitting chip 410, and a second differential output pin 452 of the laser driver chip 450 is connected to the second light emitting chip 420. The first temperature regulator is thermally connected to the first and second light emitting chips 410, 420, for regulating the operating temperatures of the first and second light emitting chips 410, 420. The microcontroller unit 460 is electrically connected to each of the first temperature regulators and is configured to control the supply current to each of the first temperature regulators to achieve temperature regulation. By adjusting the temperature of the first temperature regulators, the microcontroller unit 460 changes the temperature of the first and second light emitting chips 410, 420, and thereby changes the tuning wavelengths of the first and second light emitting chips 410, 420. For light emitting chips, different temperatures correspond to different wavelengths of signal light. This disclosure utilizes a single laser driver chip 450 connected to the modulation terminals of two optical transmitter chips, reducing the number of electronic components and contributing to miniaturization of the circuit board. Furthermore, the dual-optical transmitter chip solution only requires adjusting the temperature difference between the optical transmitter chips to 8°C to achieve four-wavelength tunability, reducing the power consumption of the temperature regulator.

[0163] Figure 19 is a second schematic diagram of a light emitting component and circuit board circuit according to some embodiments of the present disclosure. Figure 20 is a circuit diagram of a third light emitting component according to some embodiments of the present disclosure. As shown in Figures 19 and 20, in some embodiments of the present disclosure, the optical module further includes: a first power supply switch 480 and a second channel switch 470. The first input end of the first power supply switch 480 is connected to the light emitting power supply circuit, and the first input end provides a light emitting current for the light emitting chip. The second input end of the first power supply switch 480 is connected to the burst pulse circuit, and the burst pulse circuit provides a burst pulse signal. The first power supply switch 480 has a first output end and a second output end, wherein the first output end of the first power supply switch 480 is connected to the second channel switch 470. The light emitting power supply circuit provides a bias voltage.

[0164] In some embodiments, the first power switch 480 may further include a second output terminal, and the second output terminal of the first power switch 480 is grounded.

[0165] To reduce the current flowing through the second output terminal of the first power switch 480 and thus reduce electromagnetic radiation, a first resistor 403 is provided between the first output terminal of the first power switch 480 and the ground line. A burst pulse signal provided by the burst pulse circuit controls whether the first power switch 480 is connected to channel A or channel B. Specifically, the burst pulse signal controls the connection between the first input terminal of the first power switch 480 and the first or second output terminal. When the first input terminal of the first power switch 480 is connected to the second output terminal of the first switch, current flows through the first resistor 403 and then to the ground line, reducing the current flowing through the first power switch 480.

[0166] The first power switch 480 controls the on / off switching of the bias voltage, while the second channel switch controls the light emission selection of the first and second light emitting chips. When the first input terminal of the first power switch 480 is connected to the second output terminal of the first power switch 480, the bias voltage is not supplied to the first and second light emitting chips 410 and 420. In other words, neither the first or second light emitting chip 410 or 420 emits light, thus turning off the light emitting components.

[0167] The light emitting power supply circuit may be a power supply pin on a gold finger. Usually, the light emitting power supply circuit provides a stable light emitting voltage.

[0168] When the first input terminal of the first power switch 480 is connected to the first output terminal of the first power switch 480, a bias voltage is provided to the second channel switch 470. In the ONU, the optical transmission component only needs to transmit signal light of one wavelength at a time. The second channel switch 470 is configured to select power supply to the first optical transmission chip 410 or the second optical transmission chip 420 based on the control signal of the micro control unit 460.

[0169] The second channel switch 470 has a power supply input terminal, a control input terminal, a third output terminal and a fourth output terminal, wherein the power supply input terminal is electrically connected to the first power supply switch 480, the control input terminal is electrically connected to the micro control unit 460, the third output terminal is electrically connected to the first light emitting chip 410, and the fourth output terminal is connected to the second light emitting chip 420.

[0170] In some embodiments of the present disclosure, the power supply input terminal is electrically connected to the first output terminal of the first power supply switch 480. When the first input terminal of the first power supply switch 480 is connected to the first output terminal of the first power supply switch 480, the bias voltage of the light emitting power supply circuit is provided to the second channel switch 470. The microcontroller unit 460 controls the second channel switch 470 to connect to the first light emitting chip 410 or the second light emitting chip 420.

[0171] The power supply input terminal of the second channel switch 470 is connected to the third output terminal, and the light emission power supply circuit is electrically connected to the first light emission chip 410. At this time, the first light emission chip 410 emits light; the light emission power supply circuit is connected to the second light emission chip 420, and the power supply input terminal of the second channel switch 470 is connected to the fourth output terminal, and the second light emission chip 420 emits light.

[0172] In some embodiments of the present disclosure, the first power supply pin of the first light emitting chip 410 is connected to the third output terminal of the second channel switch 470 , and the second power supply pin of the second light emitting chip 420 is connected to the fourth output terminal of the second channel switch 470 .

[0173] The first light emitting chip 410 has a first power supply pin, a first modulation pin, and a first ground pin. The first ground pin is electrically connected to the ground line, the first modulation pin is connected to the laser driver chip 450, and the first power supply pin is connected to the third output terminal of the second channel switch 470. The first modulation pin is an electrically absorbing pin of the first light emitting chip 410 and receives the first control signal from the laser driver chip 450. The first modulation pin is connected to the first differential output pin 451 of the laser driver chip 450 and receives the first control signal from the laser driver chip 450 to modulate the first light emitting chip 410.

[0174] The second light emitting chip 420 has a second power supply pin, a second modulation pin, and a second ground pin. The second ground pin is electrically connected to the ground line, the second modulation pin is connected to the laser driver chip 450, and the second power supply pin is connected to the fourth output terminal of the second channel switch 470. The second modulation pin is an electrically absorbing pin of the second light emitting chip 420 and receives the second control signal from the laser driver chip 450. The second modulation pin is connected to the second differential output pin of the laser driver chip 450 and receives the second control signal from the laser driver chip 450 to modulate the second light emitting chip 420.

[0175] Microcontrol unit 460 has a preset power supply algorithm, which selects the channel of second channel switch 470 based on the data signal from the host computer. For example, microcontrol unit 460 outputs a first control signal, connecting the power supply input of second channel switch 470 to the third output; and microcontrol unit 460 outputs a second control signal, connecting the power supply input of second channel switch 470 to the fourth output.

[0176] For ease of description, the microcontroller unit 460 has a first control pin and a second control pin. The first control pin is connected to the second channel switch 470, and the signal output by the first control pin is used to control the channel of the second channel switch 470. The second control pin is electrically connected to the first temperature thermostat, and the signal output by the second control pin is used to control the temperature of the first temperature thermostat.

[0177] In some embodiments of the present disclosure, the tuned wavelengths of the first optical transmitter chip 410 are first and second wavelength signal lights, and the tuned wavelengths of the second optical transmitter chip 420 are third and fourth wavelength signal lights. For example, the tuned wavelengths of the first optical transmitter chip 410 are 1532.68 nm or 1533.47 nm, and the tuned wavelengths of the second optical transmitter chip 420 are 1534.25 nm or 1535.04 nm; or, the tuned wavelengths of the first optical transmitter chip 410 are 1534.25 nm or 1535.04 nm, and the tuned wavelengths of the second optical transmitter chip 420 are 1532.68 nm or 1533.47 nm.

[0178] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light are different, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than a minimum threshold. In some embodiments of the present disclosure, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0179] When the first temperature controller is thermally connected to the first light emitting chip 410 and the second light emitting chip 420, and the difference between the first wavelength and the second wavelength is less than a minimum threshold, the wavelength of the first light emitting chip can be adjusted from the first wavelength signal light to the second wavelength signal light by simply controlling the temperature of the first temperature controller using the microcontroller unit 460. When the wavelength needs to be adjusted from the first wavelength to the second wavelength, the wavelength adjustment can be achieved by simply controlling a temperature gradient of the first light emitting chip 410 using the microcontroller unit 460.

[0180] When the first temperature controller is thermally connected to the first light emitting chip 410 and the second light emitting chip 420, and the difference between the third wavelength and the fourth wavelength is less than a minimum threshold, the wavelength of the second light emitting chip 420 can be adjusted from the third wavelength to the fourth wavelength by simply controlling the temperature of the first temperature controller using the microcontroller unit 460. Furthermore, wavelength adjustment can be achieved by simply controlling a temperature gradient of the second light emitting chip 420 using the microcontroller unit 460.

[0181] The temperature gradient is the temperature difference between light emitting chips when tuning to different wavelengths. For example, the temperature of the first light emitting chip 410 when tuning to a first wavelength is the first temperature, and the temperature of the first light emitting chip 410 when tuning to a second wavelength is the second temperature. When the difference between the first and second wavelengths is less than a minimum threshold, the difference between the first and second temperatures is the temperature gradient. Typically, a temperature adjustment of 6-10°C can change the wavelength of a light emitting chip. The temperature gradient can be 6-10°C. In some embodiments of the present disclosure, the temperature gradient is 8°C.

[0182] The first temperature and the second temperature are adjacent to the highest temperature of the operating temperature of the optical module. In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the maximum ambient temperature and the operating temperature of the optical emission chip is a high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%. The difference between the operating temperature of the optical emission chip and the minimum ambient temperature is a low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0183] For light emitting components, the operating temperature of the light emitting chip plus the high temperature difference is the maximum ambient temperature; the operating temperature of the light emitting chip minus the low temperature difference is the minimum ambient temperature.

[0184] The present disclosure provides an optical module, including: a first light emitting chip 410, a second light emitting chip 420, a first temperature regulator, a laser driver chip 450, a first power switch 480, a second channel switch 470, and a microcontroller unit 460. The first input of the first power switch 480 is connected to the light emitting power supply circuit, the second input of the first power switch 480 is connected to the burst pulse circuit, the first output of the first power switch 480 is connected to the second channel switch 470, and the second output of the first power switch 480 is connected to ground. The second channel switch 470 has a power input, a control input, a third output, and a fourth output. The power input is electrically connected to the first power switch 480, the control input is electrically connected to the microcontroller unit 460, the third output is electrically connected to the first light emitting chip 410, and the fourth output is connected to the second light emitting chip 420. The microcontroller unit 460 controls the channels of the first power switch 480. The present disclosure utilizes a single laser driver chip 450 connected to the modulation terminals of two light emitting chips, reducing the number of electronic components and contributing to the miniaturization of the circuit board. The first power switch 480 controls the switch of the light emitting chip, the second channel switch 470 controls the selection of the channel of the first light emitting chip 410 or the second light emitting chip 420, and the temperature of the light emitting chip is controlled by a temperature regulator. The temperature difference of the light emitting chip needs to be adjusted to a temperature gradient to achieve four-wavelength tunability, thereby reducing the power consumption of the temperature regulator.

[0185] Figure 21 is a third schematic diagram of a light emitting component and circuit board circuit according to some embodiments of the present application. Figure 22 is a fourth schematic diagram of a light emitting component circuit according to some embodiments of the present application. As shown in Figures 21 and 22, the optical module includes: a first light emitting chip 410, a second light emitting chip 420, a third switch 490, a first limiter driver chip 491, and a second limiter driver chip 492. In this example, the first light emitting chip 410 and the second light emitting chip 420 are distributed feedback (DFB) lasers. A distributed feedback laser has a positive electrode and a negative electrode.

[0186] The first limiter driver chip 491 has a first pad and a second pad. The first pad is connected to the first transmit pin on the gold finger and receives a first differential signal from the host computer. The second pad is connected to the second transmit pin on the gold finger and receives a second differential signal from the host computer. The first and second differential signals form a pair of differential signals, which are the transmit signals.

[0187] The first limiter driver chip 491 has a third pad and a fourth pad. After being amplified by the first limiter driver chip 491, the first differential signal is outputted via the third and fourth pads. The third and fourth pads are connected to a third switch. After amplification, the first differential signal enters the third switch 490. The first limiter driver chip 491 amplifies the first differential signal, and the amplified signal enters the third switch 490.

[0188] The third switch is a single-pole double-throw switch. The first input end of the third switch includes a first port and a second port, the first port is connected to the third pad, and the second port is connected to the fourth pad.

[0189] The second input end of the third switch is connected to the microcontroller chip, and the second input end receives a control signal from the microcontroller chip, and selects an output channel according to the control signal.

[0190] The first output end of the third switch is connected to the second limiting driver chip 492, and the second output end of the third switch is connected to the first limiting driver chip 491. When the third switch selects the first output end, the first light emitting chip 410 emits light; when the third switch selects the second output end, the second light emitting chip 420 emits light.

[0191] The first output end of the third switch includes a third port and a fourth port, and the second output end of the third switch includes a fifth port and a sixth port.

[0192] The transmit input of the second limiter driver chip 492 includes a first drive pin and a second drive pin. The first drive pin is connected to the third port, and the second drive pin is connected to the fourth port. The second limiter driver chip 492 receives the electrical signal from the first output terminal and converts it into a drive signal to drive the first light emitting chip 410. In this example, the first light emitting chip 410 and the second light emitting chip 420 are distributed feedback lasers that require differential signals to emit light. Therefore, the transmit output of the second limiter driver chip 492 includes a third drive pin and a fourth drive pin. The third drive pin is connected to the positive terminal of the first light emitting chip 410, and the fourth drive pin is connected to the negative terminal of the first light emitting chip 410.

[0193] The third drive pin of the second limiter driver chip 492 is also connected to the first power supply circuit, and the cathode of the first light emitting chip 410 is also connected to the cathode port of the second limiter driver chip 492. The first power supply circuit and the ground output terminal of the second limiter driver chip 492 form a loop to provide bias current for the first light emitting chip 410.

[0194] The fifth port of the third switch is connected to the fifth pad of the first limiter driver chip 491, and the sixth port of the third switch is connected to the sixth pad of the first limiter driver chip 491. When the third switch selects the second output terminal, the differential signal is transmitted to the first limiter driver chip 491. In this example, the first limiter driver chip 491 integrates an optical drive circuit and a limiter amplifier circuit to convert the signal from the third switch into a drive signal. The first limiter driver chip 491 also has seventh and eighth pads, which transmit the converted drive signal to the second light emitting chip 420. The seventh pad of the first limiter driver chip 491 is connected to the positive terminal of the second light emitting chip 420, and the eighth pad of the first limiter driver chip 491 is connected to the negative terminal of the second light emitting chip 420. In this example, the second light emitting chip 420 is a distributed feedback laser that needs to receive a differential signal to emit light. Therefore, the seventh pad of the first limiter driving chip 491 is connected to the positive electrode of the second light emitting chip 420 , and the eighth pad of the first limiter driving chip 491 is connected to the negative electrode of the second light emitting chip 420 .

[0195] The first limiter driver chip 491 further has a cathode pad, and the cathode pad of the first limiter driver chip 491 is connected to the cathode of the second light emitting chip 420 .

[0196] In this example, the wavelengths of the first and second light-emitting chips 410 and 420 can be adjusted by temperature. The first light-emitting chip 410 is tuned to the first and second wavelengths of signal light, while the second light-emitting chip 420 is tuned to the third and fourth wavelengths of signal light. For example, the first light-emitting chip 410 is tuned to 1532.68 nm or 1533.47 nm, while the second light-emitting chip 420 is tuned to 1534.25 nm or 1535.04 nm. Alternatively, the first light-emitting chip 410 is tuned to 1534.25 nm or 1535.04 nm, while the second light-emitting chip 420 is tuned to 1532.68 nm or 1533.47 nm.

[0197] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light are different, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than the minimum threshold. In some embodiments of the present application, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0198] Generally, adjusting the temperature by 8°C can change the wavelength of the light emitting chip. Therefore, in the light emitting component, it is only necessary to adjust the temperature difference by 8°C to achieve the adjustment of four wavelengths. At high commercial and industrial temperatures, the cooling temperature value required by the temperature regulator only needs to be 30°C or even lower, which greatly reduces the power consumption of the temperature regulator. In some embodiments of the present application, the wavelengths of light emitted by the first light emitting chip 410 and the second light emitting chip at the same temperature are inconsistent. For example, at the first temperature, the wavelength of the signal light emitted by the first light emitting chip 410 is the first wavelength, and the wavelength of the signal light emitted by the second light emitting chip is the third wavelength. At the second temperature, the wavelength of the signal light emitted by the first light emitting chip 410 is the second wavelength, and the wavelength of the signal light emitted by the second light emitting chip is the fourth wavelength.

[0199] The first temperature and the second temperature are adjacent to the highest operating temperature of the optical module. In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the maximum ambient temperature and the operating temperature of the optical transmitter chip is the high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%.

[0200] For example, the ambient temperature of the optical module is between 85°C and -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 45°C, the maximum ambient temperature of the optical module is 85°C, and the difference between the maximum ambient temperature and the first temperature is 40°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 32%. The second temperature can be set to 55°C, the maximum ambient temperature of the optical module is 85°C, and the difference between the maximum ambient temperature and the first temperature is 30°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 24%.

[0201] In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the operating temperature of the transmitting chip and the minimum ambient temperature is a low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0202] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 45°C, the minimum ambient temperature of the optical module is -40°C, and the difference between the first temperature and the minimum ambient temperature is 85°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 68%. The second temperature can be set to 55°C, the minimum ambient temperature of the optical module is -40°C, and the difference between the first temperature and the minimum ambient temperature is 95°C. In this case, the ratio of the high temperature difference to the ambient temperature threshold is 76%.

[0203] In the optical module provided herein, a microcontroller chip controls the channel of the third switch. A power supply algorithm is pre-set within the microcontroller chip, and the channel of the third switch is selected based on a data signal from a host computer. For example, when the microcontroller unit 460 outputs a first control signal, the first input terminal of the third switch is connected to the first output terminal of the third switch, causing the first light emitting chip 410 to emit light. When the microcontroller unit 460 outputs a second control signal, the first input terminal of the third switch is connected to the second output terminal of the third switch, causing the second light emitting chip 420 to emit light.

[0204] In some embodiments of the present application, to improve the stability of high-speed signals, multiple DC filters are provided in the differential signal circuit to isolate direct wave signals. The DC filters can be capacitors. For example, a capacitor is provided between the gold finger and the first limiter driver chip 491, a capacitor is provided between the first limiter driver chip 491 and the third switch, a capacitor is provided between the second limiter driver chip 492 and the first light emitting chip 410, and a capacitor is provided between the first limiter driver chip 491 and the second light emitting chip 420.

[0205] For example, a third capacitor 4111 is provided between the first transmit pin and the first pad of the first limiter driver chip 491, and a fourth capacitor 4112 is provided between the second transmit pin and the second pad of the first limiter driver chip 491. A fifth capacitor 4113 is provided between the first port of the third switch and the third pad of the first limiter driver chip 491. A sixth capacitor 4114 is provided between the second port of the third switch and the fourth pad of the first limiter driver chip 491.

[0206] A seventh capacitor 4115 is provided between the third driving pin of the second limiter driver chip 492 and the positive electrode of the first light emitting chip 410 , and an eighth capacitor 4116 is provided between the fourth driving pin of the second limiter driver chip 492 and the negative electrode of the first light emitting chip 410 .

[0207] A ninth capacitor 4117 is provided between the seventh pad of the first limiter driver chip 491 and the positive electrode of the second light emitting chip 420. A tenth capacitor 4118 is provided between the eighth pad of the first limiter driver chip 491 and the negative electrode of the second light emitting chip 420. A second resistor 404 is provided between the ninth pad of the first limiter driver chip 491 and the negative electrode of the second light emitting chip 420.

[0208] In some embodiments of the present application, the bias circuits of the first light emitting chip 410 and the second light emitting chip 420 are further provided with an AC filter, which may be a resistor or an inductor.

[0209] For example, an AC filter is provided between the bias circuit and the differential circuit. A first AC filter and a seventh capacitor are provided between the first power supply circuit and the third drive pin of the second limiter driver chip 492. A second AC filter and an eighth capacitor are provided between the ground output terminal of the second limiter driver chip 492 and the fourth drive pin of the second limiter driver chip 492.

[0210] A third AC filter and a ninth capacitor are provided between the second power supply circuit and the seventh pad of the first limiter driver chip 491. A fourth AC filter and a tenth capacitor are provided between the negative pad of the first limiter driver chip 491 and the eighth pad of the first limiter driver chip 491.

[0211] In some examples of the present application, the first limiter driver chip 491 integrates an optical drive circuit and a signal amplification circuit. The second limiter driver chip 492 also integrates an optical drive circuit and a signal amplification circuit. The optical drive circuit of the second limiter driver chip 492 is connected to the first light emitting chip 410 to drive the first light emitting chip 410. The signal amplification circuit of the second limiter driver chip 492 is connected to the light receiving component, which converts the received optical signal into a received electrical signal. This received electrical signal is amplified by the signal amplification circuit of the second limiter driver chip 492 and then transmitted to the host computer via the gold finger.

[0212] Figure 23 is a schematic diagram of a light emitting component, a light receiving component, and a circuit board according to some embodiments of the present disclosure. Figure 24 is a schematic diagram of a light emitting component and a light receiving component according to some embodiments of the present disclosure. As shown in Figures 23 and 24, the first receiving pin of the light receiving component is connected to the fifth pad of the second limiter driver chip 492, and the second receiving pin of the light receiving component is connected to the sixth pad of the second limiter driver chip 492. The received electrical signal is input to the second limiter driver chip 492 via the fifth pad and the sixth pad of the second limiter driver chip 492. After being amplified by the second limiter driver chip 492, the received electrical signal is output via the seventh pad and the eighth pad of the second limiter driver chip 492.

[0213] The seventh pad of the second limiter driver chip 492 is connected to the first receiving pin of the gold finger, and the seventh pad of the second limiter driver chip 492 is connected to the second receiving pin of the gold finger to transmit the received electrical signal to the gold finger.

[0214] In some embodiments of the present application, the light emitting chip may also be a broadband tunable sampled grating laser, and tuning to different wavelengths may be achieved by adjusting the power supply voltage or current of the light emitting chip.

[0215] In some embodiments of the present application, when the first light emitting chip 410 and the second light emitting chip are broadband tunable sampled grating lasers, the optical module is provided with a voltage control circuit, which achieves tuning of different wavelengths by adjusting the power supply voltage or current of the light emitting chip.

[0216] FIG25 is a schematic diagram of the structure of an optical receiving component provided according to some embodiments of the present disclosure. FIG26 is a schematic cross-sectional diagram of an optical receiving component provided according to some embodiments of the present disclosure. FIG27 is a partial schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure. As shown in FIG25, FIG26 and FIG27, the optical receiving component includes: a tube base 510, a tube cap 520, and other components arranged in the tube cap 520 and the tube base 510. The tube cap 520 is covered at one end of the tube base 510. The tube base 510 includes a plurality of receiving pins 530. The pins are used to realize electrical connection between the flexible circuit board and other electrical components in the optical receiving component 500, thereby realizing electrical connection between the optical receiving component 500 and the circuit board 300. This embodiment only takes the structure shown in FIG22 as an example.

[0217] A tube cap 520 is snapped onto the tube base 510, forming a light receiving space. A filter holder 512, a third temperature regulator 511, an adjustable filter 514, a thermistor 513, a converging lens 515, a light receiving chip 516, and a transimpedance amplifier chip 517 are located within the light receiving space. The centers of the adjustable filter 514, converging lens 515, and light receiving chip 516 are aligned on the same vertical line, indicating a coaxial arrangement.

[0218] The third temperature regulator 511 can be a semiconductor refrigerator. By adjusting the third temperature regulator 511 to control the temperature of the tunable filter, when the temperature of the tunable filter changes, the kinetic energy of the molecules in the tunable filter changes, causing the tunable filter to expand and contract due to heat or undergo a reversible change in its molecular structure, thereby changing the refractive index of the tunable filter. This causes both the wavelength of the optical signal passing through the tunable filter and the wavelength of the optical signal cut off by the tunable filter to change, thereby allowing optical signals with wavelengths corresponding to the changed temperature to pass through the tunable filter while cutting off optical signals of other wavelengths. Therefore, by maintaining different temperatures of the tunable filter using the third temperature regulator 511, optical signals of different wavelengths can pass through the tunable filter.

[0219] Figure 28 is a partially exploded schematic diagram (I) of a light receiving component provided according to some embodiments of the present disclosure. Figure 29 is a partially exploded schematic diagram (II) of a light receiving component provided according to some embodiments of the present disclosure. Figures 28 and 29 illustrate the exploded light receiving component from different angles. As shown in Figures 28 and 29, the third temperature regulator 511 is located on the tube base 510, and the filter holder 512 is located above the third temperature regulator 511. For example, the lower surface of the third temperature regulator 511 is adhered to the surface of the tube holder 510, wherein the lower surface of the third temperature regulator 511 is the negative pole of the third temperature regulator 511, that is, the negative pole of the third temperature regulator 511 in this application is connected to the surface of the vertical tube holder 510; the upper surface of the third temperature regulator 511 is the positive pole of the third temperature regulator 511, and the surface of the tube holder has a TEC pin, and the positive pole of the TEC is electrically connected to the TEC pin; a filter bracket 512 is vertically provided on the upper surface of the TEC, and the filter bracket 512 is used to support the adjustable filter 514 and the thermistor 513.

[0220] The filter holder 512 has stepped surfaces of varying heights for supporting various optoelectronic devices. The filter holder 512 comprises a first frame and a second frame. The top surface of the first frame is lower than the top surface of the second frame. The bottom surface of the first frame is connected to the top surface of the third temperature regulator 511, while the top surface of the second frame is higher than the top surface of the first frame. A converging lens 515 and a light receiving chip 516 are located sequentially below the second frame.

[0221] The upper surface of the filter holder 512 may be a plane or may have different heights.

[0222] The second frame is provided with a through hole 5123 . The first optical signal is reflected by the first lens 815 to the displacement prism, and then enters the converging lens 515 through the receiving light window and the through hole of the adjustable filter 514 .

[0223] The surface temperature of the adjustable filter 514 is collected in real time by the thermistor 513 and fed back to the thermoelectric cooler driving circuit. The thermoelectric cooler driving circuit determines the heating or cooling current to be input to the third temperature regulator based on the received surface temperature of the adjustable filter 514, thereby heating or cooling the adjustable filter 514, thereby making the adjustable filter 514 exhibit different temperatures to receive signal light of different wavelengths.

[0224] The thermistor 513 is located on the upper surface of the first support plate 5121, adjacent to the tunable filter 514. To more accurately reflect the temperature of the tunable filter 514, a gasket 5131 is also provided. The gasket 5131 is positioned between the thermistor 513 and the first support plate 5121. Its upper surface is flush with the upper surface of the second support plate 5122, ensuring that the thermistor 513 and the tunable filter 514 are at the same height. The thermistor 513 abuts the sidewall of the tunable filter 514. The gasket's thermal conductivity is lower than that of the filter support 512.

[0225] To facilitate electrical connection between the thermistor 513 and the outside of the light receiving cavity, a thermal signal line is provided on the gasket 5131, connected to the receiving pin. To reduce wiring length, the light receiving component is equipped with a thermal positive pin 531 and a thermal negative pin 532. These pins protrude above the base 510. Their surfaces are higher than the upper surface of the third temperature regulator 511, shortening the distance between the pins and the thermistor 513.

[0226] The converging lens 515 can converge the signal light from the tunable filter 514 and then transmit it to the optical receiver chip 516. To facilitate the installation of the converging lens 515, the optical receiver component also includes an optical receiver chip 516 and a transimpedance amplifier chip 517 located on the surface of the tube base 510. The converging lens 515 is covered above the optical receiver chip 516. To facilitate the installation of the converging lens 515, the optical receiver component is provided with a lens bracket 518, which supports the converging lens 515. In some embodiments, the lens bracket 518 includes a first lens support 5181 and a second lens support 5182. One end of the first lens support 5181 is connected to the tube base 510, and the other end of the first lens support 5181 is connected to the converging lens 515. One end of the second lens support 5182 is connected to the tube base 510, and the other end of the second lens support 5182 is connected to the converging lens 515. The first lens support and the second lens support are respectively located on both sides of the light receiving chip 516 , so that light can pass through the converging lens 515 and enter the light receiving chip 516 .

[0227] The optical receiving chip 516 can receive the signal light from the converging lens 515. The commonly used optical receiving chip 516 is a photodetector APD, which is used to receive the optical signal sent by the external device and convert the optical signal sent by the external device into an electrical signal. The input pin of the transimpedance amplifier chip 517 is connected to the output pin of the optical receiving chip 516, which is used to convert the electrical signal output by the optical receiving chip 516 into a voltage signal. The high-frequency signal input pin of the limiting amplifier chip is connected to the output pin of the transimpedance amplifier chip 517, which is used to amplify the voltage signal output by the transimpedance amplifier chip 517. The input pin of the clock data recovery chip is connected to the high-frequency signal output pin of the limiting amplifier chip, which is used to shape the voltage signal output by the limiting amplifier chip. The output pin of the clock data recovery chip is connected to the gold finger. The signal received by the optical receiving device can be sent to the host computer through the gold finger.

[0228] In the application example, the converging lens 515 and the light receiving chip 516 are not thermally connected to the upper surface of the third temperature regulator 511, which can effectively reduce the deformation of the converging lens 515 and the light receiving chip 516 during the temperature adjustment process of the third temperature regulator 511 and improve the light coupling efficiency.

[0229] In some embodiments of the present disclosure, the tunable filter 514 may be a single-cavity filter or a dual-cavity filter.

[0230] In the embodiment of the present disclosure, the optical module includes a tunable filter 514, which is a wavelength tunable filter 514. The third temperature regulator 511 can adjust the surface temperature of the tunable filter 514 so that the tunable filter 514 exhibits different surface temperatures. In this way, the tunable filter has the ability to receive signal light of different wavelengths. For example, the TEC adjusts the surface temperature of the tunable filter 514 to a first temperature. At the first temperature, the first wavelength signal light can pass through the tunable filter 514. The TEC can also adjust the surface temperature of the tunable filter 514 to a second temperature. At the second temperature, the second wavelength signal light can pass through the tunable filter 514. Therefore, in the present disclosure, by adjusting the surface temperature of the tunable filter 514, signal light of different wavelengths can pass through the tunable filter 514. The tunable filter 514 in the present disclosure can replace multiple filters in a traditional optical module structure.

[0231] In some embodiments of the present disclosure, the first optical signal includes signal light of at least two wavelengths. For example, the first optical signal includes signal light of a fifth wavelength, signal light of a sixth wavelength, signal light of a seventh wavelength, and signal light of an eighth wavelength. The wavelengths of the fifth, sixth, seventh, and eighth wavelengths are inconsistent, and the wavelengths of the fifth, sixth, seventh, and eighth wavelengths are inconsistent, as are the wavelengths of the first, second, third, and fourth wavelengths. The wavelength of the second optical signal includes 1532.68 nm, 1533.47 nm, 1534.25 nm, and 1535.04 nm; the wavelength of the first optical signal includes two or more of 1596.34 nm, 1597.19 nm, 1598.04 nm, and 1598.89 nm; or the wavelength of the second optical signal includes 1596.34 nm, 1597.19 nm, 1598.04 nm, and 1598.89 nm, and the wavelength of the first optical signal includes two or more of 1532.68 nm, 1533.47 nm, 1534.25 nm, and 1535.04 nm.

[0232] The optical receiving component filters the first optical signal. The optical receiver of the optical receiving component receives only signal light of a single wavelength and converts the signal light into an electrical signal. The tunable filter 514 filters the first optical signal by changing the temperature of the filter, i.e., the tunable filter 514 filters the first optical signal by changing the temperature of the thermoelectric cooler.

[0233] In some embodiments of the present disclosure, the filter temperature of the optical receiving component is designed based on the temperature-wavelength relationship of the optical transmitting component to avoid the simultaneous occurrence of peak power at the transmitting end and peak power at the receiving end. Higher temperatures correspond to larger wavelengths. The greater the adjustment temperature difference, the higher the power consumption of the optical module. Typically, the base temperature of the optical module is higher than the temperature of the filter. Therefore, the lower the temperature of the adjustable filter 514, the greater the power consumption of the temperature regulator.

[0234] According to the communication protocol of the optical module, the wavelength of the optical emitting component corresponds one-to-one to the wavelength of the optical receiving component. For example, the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light increase sequentially, and the wavelengths of the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light and the eighth wavelength signal light increase sequentially.

[0235] The light emitted by the optical emitting component is a first wavelength signal light, and the corresponding light received by the optical receiving component is a sixth wavelength signal light. Correspondingly, the light emitted by the optical emitting component is a second wavelength signal light, and the corresponding light received by the optical receiving component is a seventh wavelength signal light; the light emitted by the optical emitting component is a third wavelength signal light, and the corresponding light received by the optical receiving component is an eighth wavelength signal light; the light emitted by the optical emitting component is a fourth wavelength signal light, and the corresponding light received by the optical receiving component is an eighth wavelength signal light.

[0236] This disclosure designs the filter temperature of the light receiving component based on the temperature-wavelength relationship of the light transmitting component to avoid simultaneous peak power at the transmitting and receiving ends. When the high temperature difference of the light transmitting component is maximum, the high temperature difference of the light receiving component is not maximum; when the high temperature difference of the light transmitting component is minimum, the high temperature difference of the light receiving component is not minimum.

[0237] The light emitted by the optical emitting component is a first wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a first high temperature difference value; the light emitted by the optical emitting component is a second wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a second high temperature difference value; the light emitted by the optical emitting component is a third wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a third high temperature difference value; the light emitted by the optical emitting component is a fourth wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a fourth high temperature difference value.

[0238] For the light receiving component, the maximum ambient temperature is the sum of the high temperature difference and the operating temperature of the tunable filter. The minimum ambient temperature is the tunable filter operating temperature minus the low temperature difference. The tunable filter operating temperature can also be referred to as the light receiving component temperature.

[0239] The accumulated temperature difference is the temperature value that the optical transmitting component and the optical receiving component need to adjust. The larger the accumulated temperature difference is, the higher the power consumption of the optical module is.

[0240] The light received by the light receiving component is the fifth wavelength signal light, and the corresponding high temperature difference of the light emitting component is the fifth high temperature difference;

[0241] The received light of the optical receiving component is the sixth wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is the sixth high temperature difference value; the received light of the optical receiving component is the seventh wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is the seventh high temperature difference value; the received light of the optical receiving component is the eighth wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is the eighth high temperature difference value.

[0242] For example, the first high temperature difference, the second high temperature difference, the third high temperature difference, and the fourth high temperature difference decrease in sequence, and the seventh high temperature difference, the eighth high temperature difference, the fifth high temperature difference, and the sixth high temperature difference increase in sequence.

[0243] Table 3 shows the corresponding operating temperatures for the optical transmitter and receiver components of the first optical module. As shown in Table 3, the maximum ambient temperature of the optical module is 85°C. The wavelength of light emitted by the optical transmitter is 1562.68nm, corresponding to an optical chip temperature of 25°C, and a high-temperature difference of 60°C. The wavelength of light received by the optical receiver is 1596.34nm, corresponding to an operating temperature of the tunable filter of 47°C, and a high-temperature difference of 38°C. At this point, the cumulative temperature difference of the optical module is 98°C.

[0244] The optical transmitter emits light at a wavelength of 1533.47 nm, corresponding to an optical chip temperature of 35°C, with a high-temperature difference of 50°C. The optical receiver receives light at a wavelength of 1597.19 nm, corresponding to an operating temperature of 57°C for the tunable filter, with a high-temperature difference of 28°C. The total temperature difference of the optical module is 78°C.

[0245] The optical transmitter emits light at a wavelength of 1534.25 nm, corresponding to an optical chip temperature of 45°C, with a high-temperature difference of 40°C. The optical receiver receives light at a wavelength of 1598.04 nm, corresponding to an operating temperature of the tunable filter of 25°C, with a high-temperature difference of 60°C. At this point, the cumulative temperature difference of the optical module is 100°C.

[0246] The optical transmitter emits light at a wavelength of 1535.04 nm, corresponding to an optical chip temperature of 55°C, with a high-temperature difference of 30°C. The optical receiver receives light at a wavelength of 1598.59 nm, corresponding to an operating temperature of 35°C for the tunable filter, with a high-temperature difference of 50°C. At this point, the cumulative temperature difference of the optical module is 80°C.

[0247] This disclosure designs the filter temperature of the light receiving component based on the temperature-wavelength relationship of the light emitting component to prevent simultaneous peak power at the transmitting and receiving ends. When the low-temperature difference of the light emitting component is maximum, the low-temperature difference of the light receiving component is not maximum; when the low-temperature difference of the light emitting component is minimum, the low-temperature difference of the light receiving component is not minimum.

[0248] The light emitted by the optical emitting component is a first wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the first low temperature difference; the light emitted by the optical emitting component is a second wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the second low temperature difference; the light emitted by the optical emitting component is a third wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the third low temperature difference; the light emitted by the optical emitting component is a fourth wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the fourth low temperature difference.

[0249] The light received by the light receiving component is a fifth wavelength signal light, and the corresponding low temperature difference of the light emitting component is the fifth low temperature difference;

[0250] The received light of the optical receiving component is the sixth wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the sixth low temperature difference; the received light of the optical receiving component is the seventh wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the seventh low temperature difference; the received light of the optical receiving component is the eighth wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the eighth low temperature difference.

[0251] For example, the first low temperature difference, the second low temperature difference, the third low temperature difference, and the fourth low temperature difference increase in sequence, and the seventh high temperature difference, the eighth high temperature difference, the fifth high temperature difference, and the sixth high temperature difference decrease in sequence.

[0252] Table 4 shows the corresponding operating temperatures for the optical transmitter and receiver components of the second optical module. As shown in Table 4, the optical module's minimum ambient temperature is -40°C. The optical transmitter emits light with a wavelength of 1562.68nm, corresponding to an optical chip temperature of 25°C and a 65°C differential between the low and high transmission temperatures. The optical receiver receives light with a wavelength of 1596.34nm, corresponding to a tunable filter temperature of 47°C and a 87°C differential between the low and high reception temperatures. At this point, the cumulative temperature differential for the optical module is 152°C.

[0253] The optical transmitter emits light at a wavelength of 1533.47 nm, corresponding to an optical chip temperature of 35°C, with a low-temperature difference of 75°C. The optical receiver receives light at a wavelength of 1597.19 nm, corresponding to a tunable filter temperature of 57°C, with a low-temperature difference of 97°C. The total temperature difference of the optical module is 172°C.

[0254] The optical transmitter emits light at a wavelength of 1534.25 nm, corresponding to an optical chip temperature of 45°C, with a high-temperature difference of 85°C. The optical receiver receives light at a wavelength of 1598.04 nm, corresponding to a tunable filter temperature of 25°C, with a low-temperature difference of 65°C. At this point, the cumulative temperature difference of the optical module is 150°C.

[0255] The optical transmitter emits light at a wavelength of 1535.04nm, corresponding to an optical chip temperature of 55°C, with a high-temperature difference of 95°C. The optical receiver receives light at a wavelength of 1598.59nm, corresponding to a tunable filter temperature of 35°C, with a low-temperature difference of 75°C. At this point, the cumulative temperature difference of the optical module is 170°C.

[0256] By staggering the low temperature difference of the optical emitting component and the low temperature difference of the optical receiving component, the peak power at the transmitting end and the peak power at the receiving end are avoided from occurring simultaneously, thereby reducing power consumption. The present disclosure designs the filter temperature of the optical receiving component based on the temperature-wavelength of the optical emitting component to avoid the peak power at the transmitting end and the peak power at the receiving end occurring simultaneously. When the low temperature difference of the optical emitting component is maximum, the low temperature difference of the optical receiving component is not maximum; when the low temperature difference of the optical emitting component is minimum, the low temperature difference of the optical receiving component is not minimum. Avoiding the peak power at the transmitting end and the peak power at the receiving end occurring simultaneously reduces power consumption.

[0257] In another example of the present disclosure, an optical emitting component includes a first optical emitting chip and a second optical emitting chip, wherein: at a first temperature, the first optical emitting chip emits a first wavelength signal light, and the second optical emitting chip emits a third wavelength signal light; at a second temperature, the first optical emitting chip emits a second wavelength signal light, and the second optical emitting chip emits a fourth wavelength signal light; the first temperature is lower than the second temperature; and the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase sequentially.

[0258] The ratio of the high temperature difference of the light emitting component to the ambient temperature threshold is less than or equal to 40%; the ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature, and the high temperature difference of the light emitting component is the difference between the maximum ambient temperature and the operating temperature of the light emitting component. The ratio of the low temperature difference of the light emitting component to the ambient temperature threshold is less than or equal to 80%, where the low temperature difference of the light emitting component is the difference between the operating temperature of the light emitting component and the minimum ambient temperature. In this embodiment, the operating temperatures of the light emitting component are the first temperature and the second temperature.

[0259] The light received by the optical receiving component includes light of increasing wavelengths: a fifth wavelength signal light, a sixth wavelength signal light, a seventh wavelength signal light, and an eighth wavelength signal light. The operating temperature of the optical receiving component corresponding to the fifth wavelength signal light, the eighth wavelength signal light, the seventh wavelength signal light, and the sixth wavelength signal light decreases in that order. The operating temperature of the tunable filter is the operating temperature of the optical receiving component.

[0260] Table 5 shows the corresponding operating temperatures for the optical transmitter and receiver components of another optical module. As shown in Table 5, the maximum ambient temperature of the optical module is 85°C. The wavelength of light emitted by the optical transmitter is 1562.68nm, corresponding to an optical chip temperature of 35°C, with a high-temperature difference of 50°C. The wavelength of light received by the optical receiver is 1596.34nm, corresponding to an operating temperature of the tunable filter of 57°C, with a high-temperature difference of 28°C. At this point, the cumulative temperature difference of the optical module is 88°C.

[0261] The optical transmitter emits light at a wavelength of 1533.47 nm, corresponding to an optical chip temperature of 45°C, with a high-temperature difference of 40°C. The optical receiver receives light at a wavelength of 1597.19 nm, corresponding to an operating temperature of the tunable filter of 25°C, with a high-temperature difference of 60°C. At this point, the cumulative temperature difference of the optical module is 100°C.

[0262] The optical transmitter emits light at a wavelength of 1534.25 nm, corresponding to an optical chip temperature of 35°C, with a high-temperature difference of 50°C. The optical receiver receives light at a wavelength of 1598.04 nm, corresponding to an operating temperature of 35°C for the tunable filter, with a high-temperature difference of 50°C. At this point, the cumulative temperature difference of the optical module is 85°C.

[0263] The optical transmitter emits light at a wavelength of 1535.04 nm, corresponding to an optical chip temperature of 45°C, with a high-temperature difference of 40°C. The optical receiver receives light at a wavelength of 1598.59 nm, corresponding to an operating temperature of the tunable filter of 47°C, with a high-temperature difference of 38°C. The total temperature difference of the optical module is 78°C.

[0264] Alternatively, as shown in Table 6, the optical emitting component includes a first optical emitting chip and a second optical emitting chip, wherein: at a first temperature, the first optical emitting chip emits signal light of a first wavelength, and the second optical emitting chip emits signal light of a third wavelength; at a second temperature, the first optical emitting chip emits signal light of a second wavelength, and the second optical emitting chip emits signal light of a fourth wavelength; the first temperature is lower than the second temperature; and the wavelengths of the first, second, third, and fourth wavelength signal lights increase in sequence. The light received by the optical receiving component includes light of a fifth, sixth, seventh, and eighth wavelengths, respectively, with increasing wavelengths. The operating temperatures of the optical receiving component corresponding to the seventh, sixth, fifth, and eighth wavelength signal lights decrease in sequence. The operating temperature of the tunable filter is the operating temperature of the optical receiving component.

[0265] By staggering the high temperature difference of the optical emitting component and the high temperature difference of the optical receiving component, the peak power at the transmitting end and the peak power at the receiving end are avoided from occurring simultaneously, thereby reducing power consumption. The present disclosure designs the filter temperature of the optical receiving component based on the temperature-wavelength of the optical emitting component to avoid the peak power at the transmitting end and the peak power at the receiving end occurring simultaneously. When the high temperature difference of the optical emitting component is the largest, the high temperature difference of the optical receiving component is not the largest; when the low temperature difference of the optical emitting component is the smallest, the high temperature difference of the optical receiving component is not the smallest. Avoiding the peak power at the transmitting end and the peak power at the receiving end occurring simultaneously reduces power consumption.

Claims

1. An optical module, wherein: include: A circuit board having gold fingers; A first limiter driving chip is connected to the gold finger, and the first limiter driving chip receives the transmission signal and amplifies the transmission signal; A third switch, wherein a first input end of the third switch is connected to the first amplitude limiting driving chip, a second input end of the third switch is connected to the microcontroller chip, and a second output end of the third switch is connected to the first amplitude limiting driving chip; The second limiting driving chip is connected to the first output end of the third switch; The micro control unit controls the third switch to input the amplified transmission signal into one of the first amplitude limiting driving chip or the second amplitude limiting driving chip; a first light emitting chip connected to the first amplitude limiting driving chip, wherein the first light emitting chip receives a driving signal from the first amplitude limiting driving chip; a second light emitting chip connected to the second amplitude limiting driving chip, wherein the second light emitting chip receives a driving signal from the second amplitude limiting driving chip; A first temperature regulator is thermally connected to the first light emitting chip and the second light emitting chip to adjust the wavelengths of the first light emitting chip and the second light emitting chip; At a first temperature, the first light emitting chip emits a signal light of a first wavelength, and the second light emitting chip emits a signal light of a third wavelength; At a second temperature, the first light emitting chip emits a signal light of a second wavelength, and the second light emitting chip emits a signal light of a fourth wavelength; The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase in sequence; The first temperature is lower than the second temperature, and the operating temperature includes: the first temperature and the second temperature; The ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%; the ambient temperature threshold is the difference between the highest ambient temperature and the lowest ambient temperature, and the high temperature difference is the difference between the highest ambient temperature and the operating temperature.

2. The optical module according to claim 1, characterized in that: The first limiting driving chip has a plurality of pads, wherein: the first pad and the second pad are connected to the gold finger; the third pad and the fourth pad are connected to the first input end of the third switch; The fifth pad and the sixth pad are connected to the second output end of the third switch; The seventh pad and the eighth pad are connected to the second light emitting chip.

3. The optical module according to claim 2, characterized in that: The gold finger includes: a first transmitting pin and a second transmitting pin; the first transmitting pin is connected to the first pad; the second transmitting pin is connected to the second pad; The first limiting driving chip has an optical driving circuit and a signal amplifying circuit, and the signal amplifying circuit is connected to the first pad, the second pad, the third pad and the fourth pad; The light driving circuit is connected to the fifth pad, the sixth pad, the seventh pad, the eighth pad, and the cathode pad.

4. The optical module according to claim 2, characterized in that: The positive electrode of the second light emitting chip is connected to the seventh pad, and the negative electrode of the second light emitting chip is connected to the eighth pad; The first limiting driving chip further includes a negative electrode pad connected to the negative electrode of the second light emitting chip; The power supply circuit is connected to the positive electrode of the second light emitting chip.

5. The optical module according to claim 4, characterized in that: Also includes: a ninth capacitor, located between the power supply circuit and the seventh pad; The tenth capacitor is located between the cathode of the second light emitting chip and the eighth pad.

6. The optical module according to claim 5, characterized in that: Also includes: a third AC filter, located between the ninth capacitor and the power supply circuit; The fourth AC filter is located between the tenth capacitor and the negative electrode pad of the first limiting driving chip.

7. The optical module according to any one of claims 1 to 6, characterized in that: The micro control unit is electrically connected to the first temperature regulator; the micro control unit controls the working temperature of the first temperature regulator to adjust the wavelengths of the first light emitting chip and the second light emitting chip.

8. The optical module according to claim 1, characterized in that: The first light emitting chip and the second light emitting chip are feedback distributed lasers.

9. The optical module according to any one of claims 1 to 6, characterized in that: Also includes: A temperature sensor, wherein the temperature sensor is thermally connected to the first temperature regulator; the temperature sensor is also connected to the micro control unit, and the micro control unit adjusts the operating voltage of the first temperature regulator according to the temperature of the temperature sensor; The first temperature regulator is a semiconductor refrigerator.

10. The optical module according to any one of claims 1 to 6, characterized in that: The tuning wavelengths of the first light emitting chip are the first wavelength and the second wavelength; the tuning wavelengths of the first light emitting chip are the third wavelength and the fourth wavelength, the first wavelength, the second wavelength, the third wavelength and the fourth wavelength are different, and the first wavelength, the second wavelength, the third wavelength and the fourth wavelength increase or decrease sequentially.

11. The optical module according to claim 1, wherein: A ratio of a low temperature difference to the ambient temperature threshold is less than or equal to 80%, wherein the low temperature difference is a difference between the operating temperature and the lowest ambient temperature.

12. The optical module according to claim 11, wherein: The ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

13. The optical module according to claim 1, wherein: The first temperature is 40±3°C, and the second temperature is 50±3°C.

14. The optical module according to claim 1, wherein: Also includes: a first shell; An optical fiber adapter, embedded and connected with the third pipe opening of the first shell; The light emitting component is connected to the second nozzle of the first housing; The light emitting component comprises: a fourth isolator; The optical wavelength division multiplexer combines the light emitted by the first light emitting chip and the second light emitting chip into one beam, and the combined light is transmitted through the fourth isolator.

15. The optical module according to claim 14, wherein: The light emitting component comprises: a first collimating lens, located between the first light emitting chip and the optical wavelength division multiplexer; The second collimating lens is located between the second light emitting chip and the optical wavelength division multiplexer.

16. The optical module according to claim 14, wherein: The light emitting component comprises: The second lens is located on the light path of the first light emitting chip. The fourth lens is located on the light path of the second light emitting chip; a reflective film is provided on the second incident light surface of the fourth lens, so that the second emission light emitted by the second light emitting chip is reflected by the fourth lens to the third lens; An angle selection film is disposed on the first incident light surface of the third lens, and the angle selection film selectively transmits the incident light incident on the first incident light surface, so that the first emission light emitted by the first light emitting chip is transmitted on the first incident light surface, and the second emission light is reflected on the first incident light surface.

17. The optical module according to claim 1, wherein: The light emitting component includes: a second housing, the second housing forming an inner cavity; A second upper cover, connected to the second shell body; A transmitting pin is provided at one end of the second shell, one end of the transmitting pin extends into the interior of the second shell, the other end of the transmitting pin is located outside the second shell, and the other end of the transmitting pin is electrically connected to the circuit board.

18. The optical module according to claim 1, further comprising: The light emitting component comprises the first light emitting chip, Wherein, when the light emitted by the optical emitting component is a signal light of a first wavelength, the high temperature difference value of the corresponding optical emitting component is a first high temperature difference value; When the light emitted by the optical emitting component is a signal light of the second wavelength, the high temperature difference value of the corresponding optical emitting component is a second high temperature difference value; A light receiving component, electrically connected to the circuit board, wherein the light receiving component includes a tunable filter, and the receiving wavelength of the tunable filter is adjusted by adjusting the working temperature of the light receiving component; The light received by the light receiving component is a fifth wavelength signal light, and the corresponding high temperature difference value of the light receiving component is a fifth high temperature difference value; The light received by the light receiving component is a sixth wavelength signal light, and the corresponding high temperature difference value of the light receiving component is a sixth high temperature difference value; The wavelength of the fifth wavelength signal light is smaller than the wavelength of the sixth wavelength signal light; When the first high temperature difference is greater than the second high temperature difference, the fifth high temperature difference is less than the sixth high temperature difference.

19. The optical module according to claim 18, wherein: The light receiving component is provided with a third temperature regulator which is thermally connected to the tunable filter. The third temperature regulator is used to adjust the temperature of the tunable filter.

20. The optical module according to claim 19, wherein: When the light emitted by the light emitting component is the signal light of the first wavelength, the light received by the light receiving component is the signal light of the fifth wavelength; When the light emitted by the light emitting component is the signal light of the second wavelength, the light received by the light receiving component is the signal light of the sixth wavelength; When the light emitted by the light emitting component is the signal light of the third wavelength, the light received by the light receiving component is the signal light of the seventh wavelength; When the light emitted by the light emitting component is the signal light of the fourth wavelength, the light received by the light receiving component is the signal light of the eighth wavelength.

21. The optical module according to claim 19, comprising: The light receiving component comprises: Pipe socket; A receiving pin, one end of which passes through the socket and the other end of which is electrically connected to the circuit board; A pipe cap, which is arranged at one end of the pipe base; The tube base is provided with: A temperature regulator is located on the tube seat; The filter support comprises: a first frame plate and a second frame plate, wherein the first frame plate is located on the temperature regulator; the first frame plate and the second frame plate have lower surfaces of different heights; and the second frame plate has a through hole; An adjustable filter, located on the second frame, the adjustable filter receiving signal light of different wavelengths based on different surface temperatures; The light receiving chip is located on the tube seat, the photosensitive surface of the light receiving chip faces the through hole, and receives the signal light filtered by the adjustable filter.

22. The optical module according to claim 21, characterized in that: The light receiving component further includes: a thermistor, located on the first frame plate, and the thermistor is adjacent to the tunable filter, and the thermistor is used to collect the temperature of the tunable filter; a gasket, located between the thermistor and the first frame plate; The heat transfer efficiency of the gasket is lower than the heat transfer efficiency of the filter holder.

23. The optical module according to claim 22, characterized in that: The pins include: a thermistor positive electrode pin, the upper surface of which is higher than the upper surface of the first frame plate, the thermistor positive electrode pin being electrically connected to one end of the thermistor; The thermistor negative electrode pin has an upper surface higher than the upper surface of the first frame plate, and the thermistor negative electrode pin is electrically connected to the other end of the thermistor.

24. The optical module according to claim 22, characterized in that: The circuit board is provided with an MCU, and the MCU is electrically connected to the thermistor and the temperature regulator; The MCU adjusts the temperature regulator according to the temperature of the adjustable filter.

25. The optical module according to any one of claims 21 to 23, characterized in that: The light receiving component further includes: a converging lens located between the second frame plate and the light receiving chip.

26. The optical module according to claim 25, characterized in that: The light receiving component further includes: a first lens support, located at one side of the light receiving chip; The second lens support is located on the other side of the light receiving chip, The converging lens is located above the first lens support and the second lens support.

27. The optical module according to claim 25, characterized in that The light receiving chip, the through hole, and the tunable filter are located on the same axis; and the signal light passes through the tunable filter, the converging lens, and the light receiving chip in sequence.

28. The optical module according to claim 22, characterized in that: The lower surface of the first frame plate is lower than the lower surface of the second frame plate; The upper surface of the first frame plate is lower than the upper surface of the second frame plate; the gasket is located on the first frame plate, and the thermistor is against the side wall of the adjustable filter.

Images