Display module and electronic device

Abstract

The embodiments of the present application relate to the technical field of display. Provided are a display module and an electronic device including the display module. The electronic device can be thinned. The electronic device comprises a display module and a rotating shaft mechanism, which is arranged on the side of the display module away from a display surface, wherein the rotating shaft mechanism comprises a first door plate, a second door plate, and a driving apparatus which can drive the first door plate and the second door plate to move towards or away from each other so as to drive the display module to switch between a flattened state and a closed state; when the display module moves from the flattened state to the closed state, the motion of the first door plate is rotation of rotating along a first axis, and the motion of the second door plate comprises movement and rotation of rotating along a second axis; and the first axis and the second axis are both parallel to a bending line. By means of changing the motion trajectory of the first door plate, the thickness of the whole device in a folded state is reduced.

Description

Display modules, electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on June 30, 2023, with application number 202310802775.X and invention name “Display module, electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a display module and an electronic device including the display module. Background Art

[0003] With the development of human-computer interaction technology, display has become an important element of human-computer interaction. Therefore, foldable screen electronic devices have emerged, such as foldable mobile phones.

[0004] As user experience improves, the requirements for foldable electronic devices are becoming increasingly stringent. For example, the non-bending part must have high rigidity, the bending part must have good bendability, and the electronic device must be thin.

[0005] When electronic devices are closed, their overall thickness is a major concern for users. Existing technologies can achieve this by reducing the thickness of the display module or the housing, but the reduction is minimal. Therefore, reducing the thickness of foldable electronic devices in the closed state remains a challenge.

[0006] Summary of the Invention

[0007] The present application provides a display module and an electronic device including the display module, such as a foldable electronic device, for the purpose of reducing the thickness of the foldable electronic device in a closed state.

[0008] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0009] In a first aspect, the present application provides an electronic device, which may be a foldable electronic device.

[0010] The electronic device includes a display module and a hinge mechanism, which is arranged on a side of the display module away from the display surface; the hinge mechanism includes: a first door panel, a second door panel and a driving device, the first door panel and the second door panel are both connected to the driving device, and the driving device can drive the first door panel and the second door panel to move toward or away from each other, so that the display module switches between a flattened state and a closed state; when the display module moves from the flattened state to the closed state, the movement of the first door panel is a rotation along the first axis, and the movement of the second door panel includes movement and rotation along the second axis; the first axis and the second axis are both parallel to the bending line.

[0011] In the electronic device covered by this application, the movement of the first door panel is rotational. For example, when the display module is closed, the first door panel can be perpendicular to the middle door panel. The movement of the second door panel includes both rotation and translation. For example, when the display module is closed, the second door panel can be tilted relative to the middle door panel. Compared to a device in which both the first and second door panels involve both rotation and translation, the overall thickness of the device in the folded state can be reduced, and the reduction in thickness can be significant.

[0012] In one achievable embodiment, the second door panel has a first end and a second end relative to each other; when the display module is in a flattened state, the first door panel and the second door panel are located in a first plane, and the first end of the second door panel is closer to the first door panel than the second end; when the display module is in a closed state, the first door panel is perpendicular to the first plane, and the second end of the second door panel is closer to the first door panel than the first end.

[0013] In one achievable method, the driving device includes a first gear structure and a second gear structure, the first gear structure is meshed with the second gear structure; the first gear structure is connected to the first door panel, and the second gear structure is connected to the second door panel; the transmission ratio between the first gear structure and the second gear structure is less than 1.

[0014] The example of this application uses a gear meshing transmission mechanism to realize the rotation of the first door panel and the second door panel, and the transmission ratio of the first gear structure and the second gear structure is less than 1, which can realize that the rotation speed of the first door panel is less than the rotation speed of the second door panel. Under the same rotation time, the rotation angle of the first door panel is less than the rotation angle of the second door panel, so that when the first door panel is perpendicular to the middle door panel, the second door panel is inclined relative to the middle door panel.

[0015] In one possible implementation, the first gear structure includes: a first rocker arm and a first gear; one end of the first rocker arm is fixedly connected to the first gear, and the other end is fixedly connected to the first door panel; the second gear structure includes: a second rocker arm, a second gear and a third gear; one end of the first rocker arm is fixedly connected to the second gear, and the other end is slidingly connected to the second door panel, the second gear is meshed with the third gear, and the third gear is meshed with the first gear; the diameter of the first gear is larger than the diameter of the second gear.

[0016] When the diameter of the first gear is larger than the diameter of the second gear, the rotation speed of the first door panel can be lower than the rotation speed of the second door panel.

[0017] In one achievable method, the driving device also includes a sliding structure; the second door panel is slidingly connected to the second rocker arm through the sliding structure; the sliding structure includes a sliding groove and a sliding rail arranged in the sliding groove, one of the sliding groove and the sliding rail is arranged on the second door panel, and the other is arranged on the second rocker arm.

[0018] By utilizing the sliding structure, the second door panel can be moved while rotating.

[0019] In one possible implementation, the hinge mechanism also includes a middle door panel, and the first door panel and the second door panel are relatively arranged on both sides of the middle door panel; when the display module is in a flattened state, the first door panel, the middle door panel and the second door panel are located in the same plane; when the display module is in a closed state, the first door panel is perpendicular to the middle door panel.

[0020] In one possible implementation, the display module includes a display screen, a support plate arranged on the side of the display screen away from the display surface; a first door panel and a second door panel are arranged on the side of the support plate away from the display screen; and a first hollow structure is provided in the area opposite to the support plate and the second door panel.

[0021] In order to adapt to the rotation and movement of the second door panel, a first hollow structure is provided in the area of ​​the support plate opposite to the second door panel to ensure that the display module has high bendability.

[0022] In one achievable manner, no hollow structure is provided in the area where the support plate faces the first door panel.

[0023] In this implementation structure, since the movement of the first door panel is a rotational movement, a hollow structure may not be provided at the position of the support plate corresponding to the first door panel.

[0024] In one achievable manner, a second hollow structure is provided in an area of ​​the support plate opposite to the first door panel; and the density of the first hollow structure is greater than the density of the second hollow structure.

[0025] In some other structures, a second hollow structure can also be set at the position of the support plate corresponding to the first door panel, and the density of the second hollow structure is less than the density of the first hollow structure, so that the second door panel has better bendability than the first door panel, realizing the composite movement of rotation and movement.

[0026] In one possible implementation, the hinge mechanism also includes a middle door panel, and the first door panel and the second door panel are arranged on both sides of the middle door panel relative to each other; a third hollow structure is provided in the area opposite to the support plate and the middle door panel; the density of the third hollow structure is greater than the density of the first hollow structure.

[0027] In one achievable method, the first hollow structure includes: a plurality of slots parallel to the second axis; the plurality of slots include a first group of slots and a second group of slots, and the first group of slots and the second group of slots are arranged along a direction parallel to the second axis; the plurality of slots in the first group of slots and the plurality of slots in the second group of slots are arranged alternately along the direction of the second axis.

[0028] By arranging a plurality of slots alternately, the bendability of the portion of the display module corresponding to the second door panel can be further improved.

[0029] In one possible implementation, the display module also includes a cover plate, which is arranged on one side of the display surface of the display screen, and the cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area and a second bending area, the first bending area connects the first non-bending area and the second non-bending area, the second bending area connects the second non-bending area and the third non-bending area, and both the first bending area and the second bending area can be bent along a bending line to switch between a flattened state and a closed state; the position of the hinge mechanism corresponds to the first bending area; the thickness of the first non-bending area is not equal to the thickness of the second non-bending area.

[0030] Because the thickness of the first non-bending area and the second non-bending area of ​​the cover plate are not equal, that is, the cover plate is designed with a unequal thickness structure. For example, in some scenarios, to improve the stiffness of the first non-bending area (which is exposed in the closed state (to present the image to the user), the thickness of the first non-bending area is increased. However, the unequal thickness design of the cover plate basically does not affect the bendability of the first bending area due to the increase in the thickness of the first non-bending area.

[0031] The display module provided in this application not only has high rigidity in the non-bending region, but also has excellent bendability in the bending region.

[0032] In one implementation, the thickness of the first non-bending region is greater than the thickness of the second non-bending region.

[0033] In the cover plate, the thickness of the first non-bending region corresponding to the first non-bending portion is greater than the thickness of the second non-bending region corresponding to the second non-bending portion. That is, in the cover plate structure, the first non-bending region is a thick region, the second non-bending region is a thin region, and the first bending region connecting the first and second non-bending regions is a thin-to-thick transition zone.

[0034] In one possible implementation, the cover plate includes a substrate and a first buffer layer, the first buffer layer is closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending area is greater than the thickness of the substrate located in the second non-bending area, and / or; the thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

[0035] In some implementation structures, at least one of the substrate or the buffer layer in the cover plate may be designed to have unequal thickness.

[0036] In one achievable manner, the thickness of the first buffer layer located in the first bending region gradually decreases from the first non-bending region to the second non-bending region.

[0037] In one possible implementation, the cover plate includes a second buffer layer, the second buffer layer includes a first part and a second part; the first part of the second buffer layer is located in the first non-bending area, the second part of the second buffer layer is located in the first bending area, and the elastic modulus of the first part of the second buffer layer is greater than the elastic modulus of the second part of the second buffer layer.

[0038] In order to further improve the bendability of the bending area, the second buffer layer may be designed to have a structure with unequal elastic moduli.

[0039] In the second aspect, the present application provides a hinge mechanism, which is used in a foldable electronic device. The hinge mechanism is arranged on the side of the display module of the electronic device away from the display surface. The hinge mechanism includes: a first door panel, a second door panel and a driving device. The first door panel and the second door panel are both connected to the driving device. The driving device can drive the first door panel and the second door panel to move toward or away from each other, so that the display module switches between a flattened state and a closed state along a bending line; the display module moves from a flattened state to a closed state, the movement of the first door panel is a rotation along a first axis, and the movement of the second door panel includes movement and rotation along a second axis; the first axis and the second axis are both parallel to the bending line.

[0040] In the hinge mechanism of this application, the first door panel's movement is rotational. For example, when the display module is closed, the first door panel can be perpendicular to the middle door panel. The second door panel's movement includes both rotation and translation. For example, when the display module is closed, the second door panel can be tilted relative to the middle door panel. Compared to a mechanism in which both the first and second door panels rotate and translate, this reduces the overall thickness of the device in the folded state.

[0041] In one achievable embodiment, the second door panel has a first end and a second end relative to each other; when the display module is in a flattened state, the first door panel and the second door panel are located in a first plane, and the first end of the second door panel is closer to the first door panel than the second end; when the display module is in a closed state, the first door panel is perpendicular to the first plane, and the second end of the second door panel is closer to the first door panel than the first end.

[0042] In one achievable method, the driving device includes a first gear structure and a second gear structure, the first gear structure is meshed with the second gear structure; the first gear structure is connected to the first door panel, and the second gear structure is connected to the second door panel; the transmission ratio between the first gear structure and the second gear structure is less than 1.

[0043] The example of this application uses a gear meshing transmission mechanism to realize the rotation of the first door panel and the second door panel, and the transmission ratio of the first gear structure to the second gear structure is less than 1, which can achieve that the rotation speed of the first door panel is less than the rotation speed of the second door panel.

[0044] In one possible implementation, the first gear structure includes: a first rocker arm and a first gear; one end of the first rocker arm is fixedly connected to the first gear, and the other end is fixedly connected to the first door panel; the second gear structure includes: a second rocker arm, a second gear and a third gear; one end of the first rocker arm is fixedly connected to the second gear, and the other end is slidingly connected to the second door panel, the second gear is meshed with the third gear, and the third gear is meshed with the first gear; the diameter of the first gear is larger than the diameter of the second gear.

[0045] When the diameter of the first gear is larger than the diameter of the second gear, the rotation speed of the first door panel can be lower than the rotation speed of the second door panel.

[0046] In one achievable method, the driving device also includes a sliding structure; the second door panel is slidingly connected to the second rocker arm through the sliding structure; the sliding structure includes a sliding groove and a sliding rail arranged in the sliding groove, one of the sliding groove and the sliding rail is arranged on the second door panel, and the other is arranged on the second rocker arm.

[0047] By utilizing the sliding structure, the second door panel can be moved while rotating.

[0048] In one possible implementation, the hinge mechanism further includes a middle door panel, and the first door panel and the second door panel are relatively arranged on both sides of the middle door panel; the display module is in a flattened state, and the first door panel, the middle door panel and the second door panel are located in the same plane.

[0049] In the third aspect, the present application provides a display module, which includes a display screen, the display screen includes a display area, an edge bending area located at the outer edge of the display area, and a lower frame area connected to the edge bending area, and the lower frame area is located on the side of the display area away from the display surface; the display module also includes a base film and an adhesive layer, the base film and the adhesive layer are arranged on the outside of the edge bending area, and the base film is connected to the edge bending area through the adhesive layer, or; the display module also includes a reinforcement layer, the reinforcement layer is arranged on the outside of the edge bending area, and the reinforcement layer includes a printed layer; the outside of the edge bending area is the side of the edge bending area away from the center of the arc structure.

[0050] In the display module involved in this application, the reinforcement layer disposed on one side of the display's edge bend region comprises a base film, which is bonded to the edge bend region via an adhesive layer. This means that this application utilizes a lamination process, which, compared to a dispensing coating process, makes it easier to control the thickness of the adhesive layer, thereby achieving a narrow bezel. Alternatively, the reinforcement layer can be produced using a printing technique, such as inkjet printing, which can produce a thinner reinforcement layer, thereby compressing the bezel size and achieving a narrow bezel.

[0051] In one achievable manner, the thickness of the reinforcement layer is 1 um-30 um.

[0052] In one achievable manner, the display module further includes a reinforcement layer, which is disposed on the inner side of the edge bending region; the inner side of the edge bending region is a side of the edge bending region close to the center of the arc structure.

[0053] By combining the reinforcement layer and the enhancement layer, the strength of the edge bending area can be further improved.

[0054] In one achievable manner, when the display module includes a base film and an adhesive layer, the elastic modulus of the reinforcement layer is smaller than that of the base film; when the display module includes a reinforcement layer, the elastic modulus of the reinforcement layer is smaller than that of the reinforcement layer.

[0055] This can prevent the reinforcement layer from affecting the bendability of the edge bending area.

[0056] In one achievable manner, the material of the reinforcement layer includes at least one of polyurethane, acrylate, silicone resin, or epoxy resin.

[0057] In one possible implementation, the display module further includes a buffer layer, which is disposed on a side of the base film away from the edge bending region, and the elastic modulus of the buffer layer is smaller than the elastic modulus of the base film, or the buffer layer is disposed on a side of the reinforcement layer away from the edge bending region, and the elastic modulus of the buffer layer is smaller than the elastic modulus of the reinforcement layer.

[0058] The use of a buffer layer with a smaller elastic modulus can also ensure the bendability of the edge bending area.

[0059] In one achievable manner, the material of the buffer layer includes at least one of polyurethane, acrylate, or silicone.

[0060] In a fourth aspect, the present application provides an electronic device, which includes a display module and a shell, the shell including a frame arranged at the edge of the display module, and a first filling layer is provided at the position where the frame is in contact with the display surface of the display module; the frame and the first filling layer are an integrally molded structure.

[0061] In the electronic device provided in the present application, since the first filling layer used to fill between the frame and the display module is an integrally molded structural component with the frame, in the assembly process, there will be no fitting tolerance between the frame and the first filling layer compared to assembling the first filling layer separately. During the design, there is no need to reserve a fitting tolerance, so the size of the frame can be compressed to achieve the lightweight and thinness of the electronic device.

[0062] In one achievable manner, the frame and the first filling layer are an integrally formed injection-molded structural component.

[0063] For example, an injection molding process may be used to manufacture the integrated frame and the first filling layer.

[0064] In one possible implementation, a second filling layer is provided at a position of the frame opposite to a side surface of the display module, and an elastic modulus of the second filling layer is smaller than an elastic modulus of the frame.

[0065] When an electronic device is in use, the amount of movement of the display module also needs to be considered. Therefore, there is an avoidance gap between the side of the display module and the frame. The example of this application uses a second filling layer with a smaller elastic modulus to be set at a position of the frame opposite to the side of the display module. In this way, the second filling layer is used to act as a buffer, thereby compressing the avoidance gap size between the display module and the frame to compress the size of the entire machine.

[0066] In one practicable manner, the second filling layer and the frame are integrally formed, which can simplify the assembly process.

[0067] In one achievable manner, the frame and the second filling layer are an integrally formed injection-molded structural component.

[0068] In a fifth aspect, the present application provides a display module, which includes a display screen, a support plate, and an electromagnetic induction structure, wherein the electromagnetic induction structure is disposed on the support plate, and the support plate carrying the electromagnetic induction structure is disposed on the back side of the display screen, and the electromagnetic induction structure is closer to the display screen than the support plate; the electromagnetic induction structure includes: a stacked first sensing electrode layer and a second sensing electrode layer, and a first insulating layer, wherein the stacking direction of the first sensing electrode layer and the second sensing electrode layer is consistent with the stacking direction of the display screen and the display cover plate; the first insulating layer is stacked between the first sensing electrode layer and the second sensing electrode layer,

[0069] In the display module involved in this application, the electromagnetic induction structure is formed directly on the support plate. Compared with the example of bonding the electromagnetic induction structure to the support plate with an adhesive layer, the adhesive layer can be omitted, reducing the thickness of the display module, thereby improving the bendability of the display module. In addition, because the electromagnetic induction structure is formed directly on the support plate, the thickness of the electromagnetic induction structure can be compressed from 80μm to 107μm to approximately 5μm. This significantly compresses the thickness of the entire display module and improves the bendability of the display module.

[0070] In one practicable embodiment, the support plate is made of an insulating material; the first sensing electrode layer is disposed on a surface of the support plate; the electromagnetic induction structure further includes a flat layer, which is disposed on a side of the second sensing electrode layer away from the first insulating layer and covers the second sensing electrode layer; and the flat layer is disposed on a back side of the display screen via an adhesive layer.

[0071] When the support plate is made of insulating material, the first sensing electrode layer is directly stacked on the support plate.

[0072] In one practicable embodiment, the support plate is made of a conductive material; the electromagnetic induction structure further includes: a second insulating layer and a planar layer; the second insulating layer is disposed on a surface of the support plate, and the first sensing electrode layer is disposed on a side of the second insulating layer away from the support plate; the planar layer is disposed on a side of the second sensing electrode layer away from the insulating layer and covers the second sensing electrode layer; and the planar layer is disposed on a back side of the display screen via an adhesive layer.

[0073] In this embodiment, since the support plate is made of a conductive material, an insulating layer is provided between the support plate and the first sensing electrode layer to prevent the support plate from affecting the sensing electrodes.

[0074] In one achievable manner, the display module further includes a back protective layer, which is disposed on the back side of the display screen; and the flat layer is connected to the back protective layer via an adhesive layer.

[0075] In a sixth aspect, the present application provides a display module, which includes a display screen, an electromagnetic induction structure, and a support plate, wherein the electromagnetic induction structure is arranged on the back side of the display screen, and the support plate is arranged on the side of the electromagnetic induction structure away from the display screen, wherein the electromagnetic induction structure includes: a substrate, a first sensing electrode layer, a second sensing electrode layer, a first flat layer, and a second flat layer, the first sensing electrode layer is arranged on one side of the substrate, the second sensing electrode layer is arranged on the other side of the substrate, the first flat layer covers the first sensing electrode layer, the first flat layer is arranged on one side of the support plate through a first adhesive layer, the second flat layer covers the second sensing electrode layer, and the second flat layer is connected to the back side of the display screen through a second adhesive layer.

[0076] In the display module disclosed in this application, an electromagnetic induction structure is disposed on the back side of the display screen. The electromagnetic induction structure includes a substrate and sensing electrode layers located on opposite sides of the substrate. Compared to existing display modules that include a backside protective layer (disposed on the back side of the display screen), this application can omit the backside protective layer, thereby reducing the thickness of the entire display module and improving its bendability.

[0077] In one achievable manner, the material of the substrate includes at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0078] In a seventh aspect, the present application also provides an electronic device, comprising a housing and a display module according to any of the above implementations, wherein the display module is arranged on the housing.

[0079] The electronic device provided in the embodiment of the present application includes the above-mentioned display module. Therefore, the electronic device provided in the embodiment of the present application and the display module of the above-mentioned technical solution can solve the same technical problems and achieve the same expected effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] FIG1 is a structural diagram of a foldable electronic device;

[0081] FIG2 is a structural diagram of another foldable electronic device;

[0082] FIG3 is a structural diagram of a display module;

[0083] FIG4A is a schematic diagram of a remote movement trajectory of a door panel in a rotating shaft mechanism provided in an embodiment of the present application;

[0084] FIG4B is a schematic structural diagram of a door panel in a rotating shaft mechanism provided by an embodiment of the present application when the door panel is flattened;

[0085] FIG5 is a schematic diagram of a remote movement trajectory of a door panel in a rotating shaft mechanism;

[0086] 6A and 6B are structural diagrams of a driving device provided in an embodiment of the present application;

[0087] FIG7 is a structural diagram of the connection relationship between a second door panel and a second rocker arm provided in an embodiment of the present application;

[0088] FIG8 is a structural diagram of a support plate provided in an embodiment of the present application;

[0089] FIG9 is a structural diagram of a hollow structure in a support plate provided in an embodiment of the present application;

[0090] FIG10 is a structural diagram of a support plate provided in an embodiment of the present application;

[0091] FIG11 is a structural diagram of a support plate provided in an embodiment of the present application;

[0092] FIG12 is a structural diagram of a display screen in a display module when it is flattened;

[0093] FIG13 is a structural diagram of a display screen in a display module when it is bent;

[0094] FIG14 is a structural diagram of a display screen in a display module when it is bent;

[0095] FIG15 is a structural diagram of a display screen and an enhancement layer in a display module provided in an embodiment of the present application;

[0096] FIG16 is a structural diagram of an enhancement layer provided in an embodiment of the present application;

[0097] FIG17 is a structural diagram of a display module provided in an embodiment of the present application;

[0098] FIG18 is a structural diagram of a display screen and an enhancement layer in a display module provided in an embodiment of the present application;

[0099] FIG19 is a structural diagram of a display module provided in an embodiment of the present application;

[0100] FIG20 is a structural diagram of a display module provided in an embodiment of the present application;

[0101] FIG21 is a structural diagram of a display module provided in an embodiment of the present application;

[0102] FIG22 is a structural diagram of a display module provided in an embodiment of the present application;

[0103] FIG23 is a structural diagram of a display module provided in an embodiment of the present application;

[0104] FIG24 is a schematic diagram showing the connection relationship between the display module and the housing;

[0105] FIG25 is a schematic diagram of the connection relationship between a display module and a housing provided in an embodiment of the present application;

[0106] FIG26 is a schematic diagram of the connection relationship between a display module and a housing provided in an embodiment of the present application;

[0107] FIG27 is a structural diagram of a housing provided in an embodiment of the present application;

[0108] FIG28 is a structural diagram of a display module including an electromagnetic induction structure;

[0109] FIG29 is a structural diagram of a display module including an electromagnetic induction structure provided in an embodiment of the present application;

[0110] FIG30 is a structural diagram of an electromagnetic induction structure provided in an embodiment of the present application;

[0111] FIG31 is a structural diagram of an electromagnetic induction structure provided in an embodiment of the present application;

[0112] FIG32 is a structural diagram of a display module including an electromagnetic induction structure provided in an embodiment of the present application;

[0113] FIG33 is a structural diagram of an electromagnetic induction structure provided in an embodiment of the present application;

[0114] FIG34 is a structural diagram of an induction electrode of an electromagnetic induction structure provided in an embodiment of the present application;

[0115] FIG35 is a structural diagram of an induction electrode of an electromagnetic induction structure provided in an embodiment of the present application;

[0116] FIG36 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0117] FIG37 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0118] FIG38 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0119] FIG39 is a structural diagram of a multi-foldable display module in a folded state provided by an embodiment of the present application;

[0120] FIG40 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0121] FIG41 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0122] FIG42 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0123] FIG43 is a structural diagram of a multi-folding display module provided in an embodiment of the present application;

[0124] FIG44 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0125] FIG45 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0126] FIG46 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0127] FIG47 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0128] FIG48 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0129] FIG49 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0130] FIG50 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0131] FIG51 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0132] FIG52 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0133] FIG53 is a structural diagram of a multi-folding display module provided by an embodiment of the present application, wherein the cover plate is in a flattened state;

[0134] FIG54 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0135] FIG55 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0136] FIG56 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0137] FIG57 is a structural diagram of a multi-folding display module provided by an embodiment of the present application in a flattened state;

[0138] Figure 58 is a structural diagram of a multi-fold display module in a flattened state provided by an embodiment of the present application. DETAILED DESCRIPTION

[0139] The specific embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0140] An embodiment of the present application provides an electronic device, which may be a foldable electronic device.

[0141] The electronic device may include a mobile phone, a tablet computer, a smart wearable product (e.g., a smart watch, a smart bracelet), a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, or other electronic products with a display function. The embodiments of the present application do not impose any particular restrictions on the specific form of the electronic device with a display function.

[0142] For the convenience of explanation, the structure of the electronic device is described below by taking a mobile phone as an example.

[0143] Figure 1 shows a structural diagram of a foldable screen mobile phone, and the exemplary foldable screen mobile phone is a triple-screen foldable phone. The triple-screen foldable screen mobile phone may include a first housing 100a, a second housing 100b, and a third housing 100c, as well as a display module 11. The display module 11 may continuously cover the first housing 100a, the second housing 100b, and the third housing 100c. The foldable screen mobile phone may also include a first hinge mechanism and a second hinge mechanism.

[0144] The first shell 100a and the second shell 100b are arranged on both sides of the first rotating shaft mechanism and are respectively connected to the first rotating shaft mechanism. The first rotating shaft mechanism can move so that the first shell 100a and the second shell 100b are relatively folded or unfolded, thereby realizing the flattening and closing of the display module 11 arranged on the first shell 100a and the second shell 100b.

[0145] The second shell 100b and the third shell 100c are arranged on both sides of the second hinge mechanism and are respectively connected to the second hinge mechanism. The second hinge mechanism can move so that the second shell 100b and the third shell 100c are relatively folded or unfolded, thereby realizing the flattening and closing of the display module 11 arranged on the second shell 100b and the third shell 100c.

[0146] Figure 2 shows the structure of a dual-screen foldable phone, which includes a first housing 100a, a second housing 100b, a display module 11, and a hinge mechanism. The display module 11 can be continuously overlaid on the first and second housings 100a, 100b. The first and second housings 100a, 100b are positioned on either side of the hinge mechanism and are respectively connected to the hinge mechanism. The hinge mechanism can also be used to flatten and close the display module 11.

[0147] A foldable electronic device can unfold into a flattened state, fold into a closed state, or be in an intermediate state between the flattened and closed states. A foldable electronic device has at least two states: a flattened state and a closed state. In some cases, it may further include a third state, an intermediate state between the flattened and closed states. Intermediate states are not unique; they can be any one or more states between the flattened and closed states.

[0148] Figures 1 and 2 above illustrate a three-screen and a dual-screen foldable electronic device. The foldable electronic device involved in the embodiments of the present application can also be a device with more screens, such as a four-screen foldable device, a five-screen foldable device, etc.

[0149] In electronic devices, the demand for thinner devices is becoming increasingly apparent. The following provides various possible structures, such as reducing the size of the frame and the size of the display module to make the entire device lighter and thinner. Specific examples are described below.

[0150] In some examples, as shown in FIG. 3 , the display module 11 may include a support plate (bracket) 111 , a display panel (panel) 112 , and a cover plate 110 .

[0151] The support plate 111 and the cover plate 110 are arranged on opposite sides of the display screen 112. The support plate 111 is located on the back side of the display screen 112 and serves as a supporting structure for supporting the display screen 112; the cover plate 110 is located on the display surface side of the display screen 112 and is used to protect the display screen 112 and reduce the chance of the display screen 112 being damaged.

[0152] Continuing with FIG3 , the cover plate 110 may include a display cover plate 113 and a protective layer 114. The display cover plate 113 is disposed on the display surface side of the display screen 112, and the protective layer 114 is disposed on the side of the display cover plate 113 away from the display screen 112. Both the display cover plate 113 and the protective layer 114 are light-transmissive. Light transmitted from the display surface of the display screen 112 can pass through the display cover plate 113 and the protective layer 114 and be received by the user.

[0153] In some usage scenarios, when the protective layer 114 is damaged or falls off, the display cover 113 can still protect the display screen 112 .

[0154] In the embodiment of the present application, the display screen (panel) 112 may be a flexible display screen, and the cover plate 110 may be a flexible structure to meet folding requirements.

[0155] In the aforementioned foldable electronic device, such as a mobile phone, the display screen 112 can be used to display information and provide an interactive interface for the user. In various embodiments of the present application, the display screen 112 can be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0156] The display surface of the display screen 112 involved in the embodiment of the present application is the side of the display screen 112 used to display images to the user, and the back side of the display screen 112 refers to the side opposite to the display surface of the display screen 112.

[0157] FIG3 shows that in order to enhance the protection and support strength of the display screen 112 , a support plate 111 is provided on the back side of the display screen 112 . The display screen 112 is intended to be placed in a foldable electronic device. Correspondingly, the support plate 111 also includes a bending area and a non-bending area connected to the bending area.

[0158] As shown in FIG4A , a hinge mechanism is provided on a side of the support plate 111 away from the display screen 112 , and the hinge mechanism is used to enable the display module including the display screen 112 and the support plate 111 to be flattened and closed.

[0159] 4A shows the positional relationship between each door panel of the hinge mechanism and the support plate 111. In some examples, the hinge mechanism includes a first door panel 202 and a second door panel 203, and the display module 11 is disposed on one side of the first door panel 202 and the second door panel 203.

[0160] In some other examples, as shown in FIG4A , the hinge mechanism may further include a middle door panel 201 . A first door panel 202 and a second door panel 203 are disposed on opposite sides of the middle door panel 201 . The first door panel 202 , the middle door panel 201 , and the second door panel 203 support the display module 11 .

[0161] In order to make the thickness of the electronic device smaller when it is in the folded state.

[0162] In the example provided in this application, the movement trajectory of the first door panel 202 and the second door panel 203 in the hinge mechanism can be the trajectory path shown in Figures 4A and 4B, which can compress the thickness of the entire machine in the folded state.

[0163] In Figures 4A and 4B , the motion trajectory of the first door panel 202 is a rotation along a first axis. When the display module is in the closed state, the first door panel 202 is substantially perpendicular to a first plane as shown in Figure 4A . The first plane can be the plane in which the first door panel 202 and the second door panel 203 lie when the display module is flattened.

[0164] 4A and 4B , the movement of the second door panel 203 includes rotation and movement. For example, in FIG4B , the second door panel 203 can rotate along a second axis, which is parallel to the first axis and parallel to the bending lines of the display module.

[0165] In some examples, the second door panel 203 can move in a direction parallel to its own surface.

[0166] In some examples provided herein, when the display module is in a flattened state, the first door panel 202 and the second door panel 203 may be completely in a single plane. In other examples, when the display module is in a flattened state, the first door panel 202 and the second door panel 203 may have a relatively small angle therebetween, such as an angle less than or equal to 2°, and in both cases, the first door panel 202 and the second door panel 203 may be considered to be in a single plane.

[0167] As shown in FIG4A , the second door panel 203 has a first end and a second end opposite each other. When flattened, the first end is closer to the first door panel 202 than the second end. When the display module is in the closed state shown in FIG4A (shown by the dotted line), the second end is closer to the first door panel 202 than the first end, and the distance between the first end and the first door panel 202 is greater than the distance between the second end and the first door panel 202.

[0168] When the first door panel 202 and the second door panel 203 move in the manner shown in Figures 4A and 4B , the display module, when in the closed state, will exhibit the shape shown in Figure 4A . This shape can be such that the motion trajectory of the portion of the display module facing the first door panel 202 is a bat trajectory, while the motion trajectory of the portion of the display module facing the second door panel 203 is a water drop trajectory.

[0169] In some examples, as shown in Figure 5 , the motion trajectories of the first door panel 202 and the second door panel 203 are substantially similar, including rotation about their axes and movement. As shown in Figure 5 , the display module including the support plate 111 and the display screen 112 can form a nearly symmetrical teardrop shape in the bending area.

[0170] 4A and 4B shown in the embodiment of the present application, compared with FIG5 , since the embodiment of the present application in FIG4A and 4B changes the movement mode of the first door panel 202, the thickness of the entire machine in the folded state is reduced on the basis of realizing the bending of the display module.

[0171] In the example of the present application, the first door panel 202 and the second door panel 203 are driven by the driving device to move toward or away from each other, so that the display module switches between the flat state and the closed state.

[0172] The present application provides a feasible driving device, which can realize the situation shown in FIG4A , where, in the closed state, the first door panel 202 is perpendicular to the first plane, and the second door panel 203 is inclined relative to the first plane.

[0173] As shown in Figures 6A and 6B, Figures 6A and 6B are simplified structural diagrams of the drive device provided in the embodiment of the present application. In the rotating shaft mechanism illustrated in Figure 6A, a first door panel 202 and a second door panel 203 are included. In the rotating shaft mechanism illustrated in Figure 6B, a first door panel 202, an intermediate door panel 201, and a second door panel 203 are included.

[0174] The drive device shown in Figures 6A and 6B includes a first gear structure 30 and a second gear structure 40, wherein the first gear structure 30 meshes with the second gear structure 40; the first gear structure 30 is connected to the first door panel 202, and the second gear structure 40 is connected to the second door panel 203. The transmission ratio n between the first gear structure and the second gear structure is less than 1.

[0175] The transmission ratio n between the first gear structure and the second gear structure is less than 1. When the rotation time is the same, the rotation angle of the first door panel 202 is smaller than the rotation angle of the second door panel 203. This can achieve that when the first door panel 202 is perpendicular to the first plane as shown in FIG4A , the second door panel 203 is inclined relative to the first plane. For example, the transmission ratio n can be 0.5 to 0.8, and for example, the transmission ratio n is 0.6.

[0176] In some examples, as shown in FIG. 6A and FIG. 6B , the first gear structure 30 includes a first rocker arm 301 and a first gear 302 . One end of the first rocker arm 301 is fixedly connected to the first gear 302 , and the other end is fixedly connected to the first door panel 202 .

[0177] In some structures, the first rocker arm 301 and the first gear 302 can be an integrally formed structure.

[0178] The first gear 302 can be a complete circular gear structure with meshing teeth arranged circumferentially; or, as shown in FIG6A and FIG6B , the first gear 302 has meshing teeth on its outer wall to meet the rotation requirements.

[0179] In some examples, the second gear structure 40 includes: a second rocker arm 401, a second gear 402 and a third gear 403; one end of the second rocker arm 401 is fixedly connected to the second gear 402, and the other end is slidingly connected to the second door panel 203, the second gear 402 is meshed with the third gear 403, and the third gear 403 is meshed with the first gear 302.

[0180] In some structures, the second rocker arm 401 and the second gear 402 can be an integrally formed structure.

[0181] The second gear 402 may also be a complete circular gear structure; or, as shown in FIG6A , the first gear 302 may have meshing teeth on its outer wall to meet the rotation requirements.

[0182] The diameter of the first gear 302 is greater than the diameter of the second gear 402. In some examples of the present application, the diameter of the first gear 302 or the second gear 402 may be a pitch circle diameter of the gear.

[0183] Since the diameter of the first gear 302 is larger than the diameter of the second gear 402, according to the inverse proportional relationship between the transmission ratio and the pitch circle diameter, and the direct proportional relationship between the transmission ratio and the rotational speed, it can be determined that when the rotation time is the same, the rotation angle of the first door panel 202 is smaller than the rotation angle of the second door panel 203, so that when the first door panel 202 is perpendicular to the first plane as shown in Figure 4A, the second door panel 203 is inclined to the first plane.

[0184] As shown in Figure 6B, when the driving device drives the first door panel 202 and the second door panel 203 to move, the middle door panel 201 can be stationary. When the display module is in a closed state, the bent portion of the display module is arranged in the space enclosed by the first door panel 202, the middle door panel 201 and the second door panel 203.

[0185] As shown in Figure 6B , in other examples, while the driving device drives the first door panel 202 and the second door panel 203 to move, the middle door panel 201 can move away from the display module to create more space for the bent display module. The device that drives the middle door panel 201 away from the display module can be a telescopic device, such as a telescopic spring or a telescopic cylinder.

[0186] In the example of the present application, the second door panel 203 can rotate and slide. As shown in Figure 7, Figure 7 shows a sliding structure provided in the present application, in which the second door panel 203 is slidably connected to the second rocker arm 401 via the sliding structure. The sliding structure includes a slide groove 501 and a slide rail 502. One of the slide groove 501 and the slide rail 502 is provided on the second door panel 203, and the other is provided on the second rocker arm 401. For example, in Figure 7, the slide groove 501 is provided on the second door panel 203, and the slide rail 502 is provided on the second rocker arm 401.

[0187] In the embodiment of the present application, in order to adapt to the trajectory shapes of the first door panel 202 and the second door panel 203 shown in Figures 4A and 4B, Figure 8 is a partial structural diagram of a support plate 111 provided in the embodiment of the present application. The support plate 111 has a hollow structure 111A at the position opposite to the middle door panel 201 (the inner R zone of the bend), and a hollow structure 111B at the position opposite to the second door panel 203 (the outer R zone of the first bend).

[0188] In some embodiments of the present application, the position of the support plate 111 relative to the middle door panel 201 can be: when the display module is in a flattened state, the area where the orthographic projection of the middle door panel 201 on the support plate 111 is located, or it can include the area where the orthographic projection is located and some areas outside the area.

[0189] Referring to Figure 8 , the support plate 111 may not have a hollow structure at the position opposite the first door panel 202. When this type of support plate 111 is used in the structure shown in Figures 4A and 4B , the first door panel 202 rotates, and the second door panel 203 undergoes a combination of rotation and movement. The display module including the support plate 111 can match this motion trajectory, presenting the shape shown in Figure 4A .

[0190] The structure of the support plate 111 shown in FIG8 can not only ensure the bendability of the inner bending R zone, the first outer bending R zone and the second outer bending R zone, but also ensure that the second outer bending R zone has sufficient flattening rigidity.

[0191] There are many structures of the hollow structure 111B. FIG9 exemplifies a structure of the hollow structure 111B, including a plurality of slots, each of which extends in a direction parallel to the bending line L (the bending line L is parallel to the first axis and the second axis mentioned above). The plurality of slots can be divided into a first group of slots and a second group of slots adjacent to the first group of slots. The first group of slots and the second group of slots are arranged in a direction perpendicular to the bending line L, and the first group of slots and the second group of slots each contain a plurality of slots, and the plurality of slots in the first group of slots and the plurality of slots in the second group of slots are arranged alternately. This ensures that the outer R zone of the bend not only has sufficient bending performance, but also ensures its flattening stiffness.

[0192] As shown in FIG. 8 , the density of the hollow structures 111A in the inner bending R region is greater than the density of the hollow structures 111B in the second outer bending R region.

[0193] In some embodiments of the present application, the density of the hollow structure can be: the ratio of the area occupied by the hollow structure per unit area of ​​the support plate 111. For example, the hollow structure includes multiple slots, and the spacing between two adjacent slots in the inner R-zone of the bend is smaller than the spacing between two adjacent slots in the outer R-zone of the second bend.

[0194] Figure 10 shows a cross-sectional view of Figure 8. Hollow structures 111A located in the inner bend R region penetrate the support plate 111, while hollow structures 111B located in the outer R region of the second bend do not penetrate the support plate 111. For example, in Figure 10, support plate 111 has a first side and a second side facing each other. Hollow structures 111A penetrate from the first side to the second side, while hollow structures 111B are recessed from the first side toward the second side, with a gap between the bottom surface of hollow structure 111B and the second side.

[0195] In some examples, to improve the bendability of the second outer bending R-zone, the first surface is closer to the center of the arc structure shown in FIG. 4A than the second surface.

[0196] To accommodate the motion trajectories of the first and second door panels 202 and 203 in Figure 4A , Figure 11 illustrates another support plate 111 structure provided herein. A hollow structure 111A is provided in the inner bend R region, a hollow structure 111B is provided in the second outer bend R region, and a hollow structure 111C is further provided in the first outer bend R region opposite the first door panel 202. The density of hollow structure 111C is less than that of hollow structure 111B, and hollow structures 111C and 111B are asymmetrically arranged on either side of hollow structure 111A.

[0197] In some embodiments of the present application, the density of the hollow structure can be: the ratio of the area occupied by the hollow structure per unit area of ​​the support plate 111. For example, the hollow structure includes multiple slots, and the spacing between two adjacent slots in the first bend outer R zone is greater than the spacing between two adjacent slots in the second bend outer R zone.

[0198] In the display module, the display driver integrated circuit (DDIC) and touch panel integrated circuit (TPIC) are very important components of the display touch imaging system. They integrate components such as resistors, regulators, and power transistors, and are responsible for driving the display panel and controlling the driving current.

[0199] 12 and 13 show one packaging structure of a display driver chip DDIC, and FIG. 13 is a cross-sectional view taken along the MM direction of FIG. 12 . This packaging structure may be referred to as a chip on panel (COP) package.

[0200] As shown in FIG12 and FIG13 , the edge portion of the display screen 112 is bent so that the display screen 112 forms a display area AA and a lower frame area CC, and an edge bending area BB connecting the display area AA and the lower frame area CC.

[0201] The display area AA in Figures 12 and 13 includes a curved portion and a non-curved portion connected to the curved portion. Both the curved portion and the non-curved portion connected to the curved portion function as display areas for displaying images to the user. The edge curved area BB and the lower frame area CC in Figures 12 and 13 can also function as non-display areas.

[0202] The display driver chip 13 is arranged on the lower frame area CC, and other electronic devices 14, such as a touch screen chip (TPIC), capacitors, resistors, etc., are integrated on a circuit board 12 electrically connected to the main circuit board, such as a flexible printed circuit (FPC). The circuit board 12 is connected to the lower frame area CC through an electrical connection structure 16 to achieve signal interconnection between the electronic devices 14 on the circuit board 12 and the display driver chip 13.

[0203] When the edge bending area BB of the display screen 112 in FIG. 13 is bent, the bending radius R gradually decreases (for example, the bending radius R is close to 0.2 mm), which increases the stress on the wiring of the display screen 112 and easily causes defects such as wiring cracks and breakage under external impact.

[0204] In order to reduce bending stress and improve the strength of the edge bending area BB to cope with the situation where cracks occur during the bending process, the module or the entire device is subjected to stress. In some examples, as shown in Figure 14, a piezoelectric ceramic spray valve can be used to apply glue to the surface of the edge bending area BB of the display screen 112, the surface of the display area AA and the surface of the lower frame area CC close to the edge bending area BB to form a glue layer 15, and adjust the metal wiring layer of the display screen 112 to a stress-neutral layer. That is, the glue layer 15 is used to improve the stress distribution and improve the strength of the edge bending area BB to protect the display module from damage.

[0205] When performing glue coating, a thicker glue layer 15 is generally used. For example, as shown in FIG14 , the thickness E of the glue layer 15 reaches about 90 μm. To ensure the protective effect, this will increase the frame size of the foldable electronic device. Due to the limitations of the glue coating process, there will be large process tolerances. For example, the tolerance of the thickness E of the glue layer 15 is ±(20 μm-30 μm), which makes the thickness of the glue layer 15 uneven. As shown in FIG14 , the thickness of the glue layer 15 on the side of the display area AA is thicker, while the thickness of the glue layer 15 on the side of the lower frame area CC is thinner. In order to achieve the protective effect, a thicker glue layer 15 needs to be set, which will further increase the frame size.

[0206] To address the issue of thick adhesive layer 15, which widens the bezel, the present application provides several embodiments that, while ensuring the BB strength and protective effect of the edge bending area, can also achieve a thinner adhesive layer and a narrower bezel. The following structures are possible.

[0207] 15 is a structural diagram of a display screen 112 in a bent state according to an embodiment of the present application. The display screen 112 includes a display area AA, a lower frame area CC, and an edge bending area BB connecting the display area AA and the lower frame area CC.

[0208] A reinforcement layer 1 is provided on the display surface side of the edge bending region BB. As shown in FIG16 , which illustrates the structure of the reinforcement layer 1 according to an embodiment of the present application, the reinforcement layer 1 comprises a base film 110A and an adhesive layer 110B. The base film 110A is bonded to the outside of the edge bending region BB via the adhesive layer 110B. The reinforcement layer 1 can be provided on the side of the edge bending region BB that is away from the center of the arc.

[0209] Compared with FIG14 , FIG15 and FIG16 use a base film 110A with uniform thickness to be attached to the display surface side of the edge bending area BB through a lamination process to protect the edge bending area BB.

[0210] In the examples shown in FIG15 and FIG16 , due to the use of a lamination process, the thickness of the reinforcing layer 1 can be effectively controlled while ensuring the BB strength of the edge bending area, thereby controlling the thickness of the edge bending area of ​​the display module and achieving a narrow frame.

[0211] In some examples, the elastic modulus of the base film 110A in the reinforcement layer 1 may be 1 GPa-15 GPa, for example, 5 GPa, 6 GPa, 8 GPa, etc.

[0212] There are various materials that can be selected for the base film 110A, for example, at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI) can be selected.

[0213] In some other examples, the elastic modulus of the adhesive layer 110B in the reinforcement layer 1 may be smaller than the elastic modulus of the base film 110A. For example, the elastic modulus of the adhesive layer 110B may be 150 MPa-2 GPa.

[0214] There are also many materials that can be selected for the adhesive layer 110B, such as pressure-sensitive adhesive, curing adhesive, etc.

[0215] The elongation at break of the adhesive layer 110B is ≥100%, and the adhesive strength is ≥5 MPa.

[0216] When preparing the reinforcement layer 1 shown in FIG. 16 , the adhesive layer 110B may be processed on the base film 110A by knife coating, roller coating, slit coating, or the like.

[0217] The thickness of the reinforcement layer 1 can be 10 μm to 90 μm, and for example, can be 20 μm to 60 μm. The thickness of the base film 110A can be 3 μm to 50 μm, and for example, can be 5 μm to 25 μm. The thickness of the adhesive layer 110B can be 7 μm to 87 μm, and for example, can be 15 μm to 55 μm.

[0218] In a feasible process, the reinforcement layer 1 shown in FIG16 can be pre-laminated and then pressed. For example, it can be pre-pressed and pressed on the surface of the edge bending area BB using a low-pressure press head, and then attached using a higher-pressure press head (which can match a certain temperature) or a pressurized cavity (which can match a certain temperature).

[0219] When high-pressure lamination is used, curing can be performed by matching the pressure with a certain temperature. For example, UV curing, heat curing, moisture curing, etc. can be selected. Alternatively, after high-pressure lamination, the reinforcement layer 1 can be irradiated with UV light (the wavelength of the UV light can be 365nm, 395nm, or 405nm, etc.) for curing, so that the adhesive layer 110B is cross-linked with the display screen to achieve the desired properties such as curing rate, modulus, and bonding strength.

[0220] Figure 17 illustrates the structure of a display module employing the display screen 112 including the enhancement layer 1 shown in Figure 15 . As shown in Figure 17 , the display module comprises a functional layer 120 (e.g., a polarizer) and a display cover 113 disposed on one side of the display area AA of the display screen 112. The display cover 113 is attached to one side of the functional layer 120 via an optically transparent adhesive (OCA) 124.

[0221] Figure 18 is a structural diagram of another display screen 112 in a bent state according to an embodiment of the present application. While ensuring the BB strength of the edge bending area and satisfying the protection effect, the adhesive layer can also be thinner to achieve a narrow frame.

[0222] In the display screen 12 of Figure 18 , a reinforcement layer 1 is provided on the display surface side of the edge bending area BB. For example, the reinforcement layer 1 can be made by using a printing technology, such as ink jet printing (IJP).

[0223] The material selected for the reinforcement layer 1 in Figure 18 has a relatively large elastic modulus, such as 1 GPa to 15 GPa. For example, the elastic modulus may be greater than or equal to 10 GPa.

[0224] The elongation at break of the reinforcement layer 1 in FIG18 is ≥20%, and the bonding strength is ≥5 MPa.

[0225] When a material with a large elastic modulus is selected and the reinforcing layer 1 is produced using an inkjet printing (IJP) method, the thickness of the reinforcing layer 1 can be 1 μm to 30 μm. For example, it can be 3 μm to 20 μm. This can significantly reduce the thickness of the reinforcing layer 1 and further narrow the frame size.

[0226] The materials that can be selected for the reinforcement layer 1 shown in FIG18 include polyurethane, acrylate, silicone resin or epoxy resin.

[0227] When preparing the structure shown in Figure 18 , an inkjet printer can be used to print a high-modulus IJP material. The inkjet-printed material can then be cured using a curing method (UV curing, heat curing, moisture curing, etc.). If UV curing is used, the inkjet-printed material can be cured by irradiating it with UV light (UV light with a wavelength of 365nm, 395nm, or 405nm, etc.), crosslinking the colloid to achieve the desired properties, such as cure rate, modulus, and bond strength.

[0228] FIG19 illustrates a structural diagram of a display screen 112 including a reinforcement layer 1 as shown in FIG18 when applied to a display module. As shown in FIG19 , in this display module, a functional layer 120 (e.g., a polarizer) and a display cover plate 113 are provided on one side of the display area AA of the display screen 112. The display cover plate 113 is provided on one side of the functional layer 120 via an optically transparent adhesive OCA 124. After the edge bending area BB is bent, some film layer structures are stacked in the area between the display area AA and the lower frame area CC. For example, the stacked film layer structure includes a support plate 111 and a screen support layer 123. The screen support layer 123 is connected to the display area AA of the display screen 112 via a filling layer 121. The support plate 111 is connected to the lower frame area CC of the display screen 112 via a filling layer 122.

[0229] Figure 20 is a structural diagram of a display module in a bent state according to an embodiment of the present application. While ensuring the BB strength of the edge bending area and satisfying the protection effect, a thinner adhesive layer can be achieved to achieve a narrow frame.

[0230] In the display screen 112 of the display module shown in FIG20 , not only is the reinforcing layer 1 provided on the display surface side of the edge bending region BB, but a reinforcement layer 17 is also provided on the back side of the edge bending region BB.

[0231] In FIG. 20 , the reinforcement layer 1 includes a laminated base film 110A and an adhesive layer 110B. The base film 110A is adhered to the display surface side of the edge bending area BB via the adhesive layer 110B.

[0232] The materials, elastic modulus, preparation methods, etc. that can be selected for the base film 110A and the adhesive layer 110B can refer to the examples shown in Figures 15 and 16 above, and will not be repeated here.

[0233] The material selected for the reinforcement layer 17 in Figure 20 has an elastic modulus lower than that of the base film 110A. For example, the elastic modulus of the material selected for the reinforcement layer 17 is ≥ 5 MPa. Furthermore, the elongation at break of the reinforcement layer 17 is ≥ 100%, and the adhesive strength is ≥ 1 MPa.

[0234] In this embodiment, by disposing a reinforcement layer 17 on one side of the edge bending region BB close to the center of the arc structure, the impact resistance of the display module can be improved.

[0235] The combination of reinforcement layer 1 and reinforcement layer 17 further enhances the strength of the edge bending region BB. The reinforcement layer 17, with its low elastic modulus, substantially does not affect the bendability of the edge bending region BB. Positioning reinforcement layer 17 near the center of the curved structure of display screen 112 does not increase the thickness of the display module's edge bending region BB, nor does it increase the size of the display frame.

[0236] The reinforcement layer 17 involved in the embodiment of the present application may be made of materials including polyurethane, acrylate, silicone resin or epoxy resin.

[0237] When preparing the structure shown in FIG20 , the enhancement layer 1 shown in FIG20 can be set in the same manner as how the base film 110A and the adhesive layer 110B are set on the display surface side of the edge bending area BB of the display screen 112 in the structure shown in FIG16 .

[0238] Adhesive can be applied by dispensing on the back side of the edge bend area BB to form a reinforcement layer 17. The amount of adhesive used in the reinforcement layer 11 can be precisely calculated based on the inner arc space, allowing for adjustment of the adhesive quantity and filling conditions. UV delayed curing, UV pre-curing, or moisture absorption curing can be used to crosslink the adhesive and achieve the desired properties, such as cure rate, modulus, and bond strength.

[0239] Figure 21 is another structural diagram of a display module in a bent state according to an embodiment of the present application. Similar to Figure 20 above, while ensuring the BB strength of the edge bending area and satisfying the protection effect, a thinner adhesive layer can also be achieved to achieve a narrow frame.

[0240] The difference between the structure shown in Figure 21 and the structure shown in Figure 20 is that: in Figure 20, arranged on the display surface side of the edge bending area BB of the display screen 112 is: a reinforcement layer 1 including a base film 110A and an adhesive layer 110B, and in Figure 21, the reinforcement layer 1 is made of a material with a large elastic modulus and is produced by an inkjet printing IJP method.

[0241] The structure shown in FIG21 is similar to the structure shown in FIG20 in that not only is a reinforcing layer 1 provided on the display surface side of the edge bending region BB of the display screen 112 , but a reinforcement layer 17 is also provided on the back side of the edge bending region BB.

[0242] Figure 22 is a structural diagram of another display module in a bent state according to an embodiment of the present application. This embodiment can also achieve a thinner adhesive layer and a narrow frame.

[0243] As shown in Figure 22 , a reinforcement layer 1 is provided on the display surface side of the edge bend region BB of display screen 112. This reinforcement layer 1 is made of a material with a high elastic modulus and is produced using an inkjet printing (IJP) method. Furthermore, a buffer layer 18 is provided on the side of reinforcement layer 1 away from display screen 112.

[0244] The elastic modulus of the buffer layer 18 is lower than that of the base film 110A. For example, the elastic modulus of the base film 110A is 1 GPa to 15 GPa, while the elastic modulus of the buffer layer 18 is 100 MPa to 1000 MPa. Furthermore, the buffer layer 18 has an elongation at break of ≥ 100% and an adhesive strength of ≥ 5 MPa.

[0245] The thickness of the reinforcement layer 1 may be 1 μm to 30 μm, for example, 3 μm to 20 μm.

[0246] The thickness of the buffer layer 18 may be 1 μm to 50 μm, for example, 5 μm to 30 μm.

[0247] In this embodiment, because the reinforcing layer 1 produced using the inkjet printing (IJP) method is relatively thin, adding the buffer layer 18 does not increase the size of the frame. Furthermore, the buffer layer 18 and the reinforcing layer 1 produced using the inkjet printing (IJP) method further enhance the strength of the edge bending region BB. The use of the buffer layer 18, which has a low elastic modulus, also ensures the bendability of the edge bending region BB.

[0248] There are many materials that can be selected for the buffer layer 18. For example, it can be polyurethane, acrylic acid ester or silicone resin.

[0249] Figure 23 is a structural diagram of another display module in a bent state according to an embodiment of the present application. This embodiment can also achieve a thinner adhesive layer and a narrow frame.

[0250] The structure shown in FIG23 is similar to the structure shown in FIG22 in that a reinforcement layer 1 and a buffer layer 18 are provided on the display surface side of the edge bending area BB of the display screen 112 , and the reinforcement layer 1 is closer to the display screen 112 than the buffer layer 18 .

[0251] The structure shown in FIG23 differs from the structure shown in FIG22 in that, in FIG22 , the reinforcement layer 1 is produced using an inkjet printing (IJP) method. In FIG23 , however, the reinforcement layer 1 comprises a base film 110A and an adhesive layer 110B. Specifically, the adhesive layer 110B, base film 110A, and buffer layer 18 are stacked in this order, moving away from the display screen 112.

[0252] In a feasible process, after the reinforcement layer 1 is formed on the display surface side of the edge bending area BB of the display screen 112, a dispensing process or an inkjet printing process can be used to form a buffer layer, and the buffer layer can be cured. The curing method is UV curing, and the film part is irradiated with UV light (the wavelength of UV light can be 365nm, 395nm or 405nm, etc.) to cure the colloid, so that the colloid is cross-linked to achieve the set curing rate, modulus, bonding strength and other characteristic requirements.

[0253] When preparing the display module shown in Figures 17 to 23, a functional layer 120 can be first set on the display surface side of the display screen 112, for example, a polarizer can be set; then a reinforcement layer 1 can be set in the edge bending area BB of the display screen 112, or a reinforcement layer 17 can be set; then the display screen 112 is cut; then a display driver chip DDIC and a touch chip TPIC, etc. are set in the lower frame area CC of the display screen 112, as well as a connecting circuit board 12, etc.; and then other film layer structures are stacked.

[0254] In a foldable electronic device, as shown in FIG24 , a foam glue 20 is provided between the frame 102 (also referred to as a small A shell) of the foldable shell 100 and the display module 11. The foam glue 20 can prevent external water vapor from entering the shell 100 and corroding some electronic devices or other structural parts in the shell 100.

[0255] In some examples, the foam adhesive 20 is adhered between the frame 102 and the display module 11 by means of adhesive. The assembly tolerance of the foam adhesive 20, the clearance between the display module 11 and other structural components, and the movement of the display module 11 when it is bent are taken into consideration.

[0256] As shown in Figure 24, at least the following factors are involved: the fitting tolerance d of the foam adhesive 20 on the frame 102, the spacing a between the outer end surface of the display module 11 and the frame 102, and the effective overlap width c between the foam adhesive 20 and the display module 11. In some electronic devices, such as mobile phones, a1 = 1.1 mm, c1 = 0.45 mm, and d1 = 0.25 mm. Thus, a1 + c1 + d1 = 1.8 mm, which makes the frame width of the electronic device wider (as shown in the S direction of Figure 24), reduces the screen-to-body ratio, and affects the overall appearance of the device.

[0257] In order to compress the width of the frame, the embodiments of the present application provide some possible structures as follows:

[0258] As shown in FIG25 , FIG25 shows the positional relationship between the frame 102, the middle frame 101, the display module 11, and the first filling layer 601 in an embodiment of the present application. The frame 102 and the first filling layer 601 are an integrally formed structure. For example, the integrally formed frame 102 and the first filling layer 601 can be manufactured using an insert molding process, such as a two-color insert molding process.

[0259] As shown in Figure 25, a first filling layer 601 is provided at the position where the frame 102 of the housing 100 is in contact with the display surface of the display module 11. The first filling layer 601 and the frame 102 are integrally formed structural components.

[0260] In some examples, a first filling layer 601 is provided at the position where the frame 102 of the shell 100 is in contact with the display surface of the display module 11. It can be that: the frame 102 of the shell 100 has a first surface facing the display surface of the display module 11, and the first surface has a first filling layer 601 protruding from the first surface at a position opposite to the display module 1111.

[0261] For example, the material of the first filling layer 601 can be selected from at least one of silicone and thermoplastic polyurethanes (TPU). The material of the frame 102 can be plastic or the like.

[0262] During assembly, since the frame 102 and the first filling layer 601 are an integrally formed structure, there will be no fitting tolerance d between the frame 102 and the foam glue 20 as shown in Figure 24. During design, there is no need to reserve a fitting tolerance, and the width dimension S of the frame can be compressed.

[0263] To further reduce the width S of the frame 102 , the side S1 of the first filling layer 601 away from the outer edge of the electronic device is flush with the side S2 of the frame 102 away from the outer edge of the electronic device, thereby reducing the width of the frame.

[0264] In some embodiments of the present application, the side surface S1 and the side surface S2 being flush with each other may mean that the side surface S1 and the side surface S2 are located in the same plane.

[0265] As shown in Figure 26 , there is a clearance between the display module 11 and the frame 102. Furthermore, the foldable electronic device experiences both tumbling and twisting when folded, resulting in a spacing a1 between the outer end surface of the display module 11 and the frame 102. To prevent the display module from colliding with the middle frame 102 during use, this spacing a1 is relatively large, which is also the primary factor contributing to the larger frame width.

[0266] To reduce the impact of this factor on the width of the frame, Figure 26 shows the positional relationship between the frame 102, the middle frame 101, the display module 11, and the first filling layer 601 in an embodiment of the present application. A second filling layer 602 is provided at a position opposite the side of the frame 102 and the display module 11. The elastic modulus of the second filling layer 602 is smaller than that of the frame 102.

[0267] The side surface of the display module 11 in the example of the present application is: the side surface of the display module 11 opposite to the side surface of the electronic device.

[0268] When the display module 11 moves along the Q direction in Figure 26, it may collide with the second filling layer 602 with a smaller elastic modulus. Since the second filling layer 602 has a smaller elastic modulus than the frame 102, it can cushion the display module 11 and reduce the probability of damage to the display module 11.

[0269] The distance between the outer end surface of the display module 11 and the frame 102 in FIG. 26 can be shortened, and the width dimension S of the frame can be further compressed.

[0270] The second filling layer 602 and the frame 102 can be an integrally formed structure. In some optional processes, an insert molding process (such as a two-color injection molding process) can be used to form the second filling layer 602 and the frame 102 in one piece, thereby simplifying the assembly process.

[0271] For example, the material of the second filling layer 602 can be selected from at least one of silicone and thermoplastic polyurethanes (TPU).

[0272] Referring to Figure 26, when a frame 102 structure including a first filling layer 601 and a second filling layer 602 is adopted, compared with the above-mentioned Figure 24, the effective overlap width b2 between the first filling layer 202 and the display module 11, and the effective overlap width c1 between the foam glue 20 and the display module 11 in Figure 24 are both 0.45 mm. In Figure 26, the distance a2 between the outer end surface of the first filling layer 601 and the frame 102 is 0.85, and the dimension a2+b2=1.3 mm in Figure 26. Compared with Figure 22, the width of one side of the frame 102 can be compressed by 0.3 mm to 0.5 mm.

[0273] As shown in Figure 27, when all four sides of the frame 102 adopt the structure shown in Figure 26, the size along the X direction (such as the width of the electronic device) can be compressed by 0.6mm to 1mm. Similarly, the size along the Y direction (such as the length of the electronic device) can also be compressed by 0.6mm to 1mm. This will significantly increase the screen-to-body ratio, improve the sophistication of the product, and enhance the user experience.

[0274] Folding electronic devices are being used in more and more scenarios. For example, devices with larger displays are being used in business offices, and the demand for styluses is becoming increasingly strong.

[0275] In some examples, an electromagnetic induction structure can be attached to a display module of an electronic display device. When an electromagnetic pen touches the surface of the display module, the electromagnetic pen emits an electromagnetic signal. The electromagnetic induction structure in the display module senses the electromagnetic signal emitted by the electromagnetic pen. The position of the electromagnetic pen can be obtained based on the induction signal, and then the content input by the user through electromagnetic input can be obtained.

[0276] As shown in Figure 28, Figure 28 shows a schematic diagram of the structure of the display module. The display module 11 includes: a display screen (panel) 112, a display cover (cover) 113, and a back protective layer 116. The display cover 113 is arranged on the display surface side of the display screen 112, and the display cover 113 is light-transmissive. The light transmitted by the display surface of the display screen 112 can pass through the display cover 113 and be received by the user; the back protective layer 116 is arranged on the back side of the display screen 112 to support and protect the display screen 112; the display cover 113 and the back protective layer 116 are both connected to the display screen 112 through an adhesive layer to form the core layer structure of the display module.

[0277] When preparing the display module shown in Figure 28, an independent plate-shaped electromagnetic induction structure 125 is set between the support plate 111 and the back protection layer 116, and is connected to the back protection layer 116 through the adhesive layer 1, and is connected to the support plate 111 through the adhesive layer 2.

[0278] In the structure shown in FIG28 , the thickness of the electromagnetic induction structure 125 is generally 80 μm to 107 μm, and the thickness of the adhesive layer 1 and the adhesive layer 2 are respectively 25 μm to 30 μm. This makes the thickness of the entire display module larger, which can reduce the bendability of the display module.

[0279] In order to reduce the thickness of the display module and improve the bendability of the display module, the embodiments of the present application provide some display module structures including electromagnetic induction structures, as described below.

[0280] 29 is a schematic structural diagram of a display module 11 according to an embodiment of the present application. The display module 11 of this example includes a display screen 112 , a display cover 113 , a back protection layer 116 , a support plate 111 and an electromagnetic induction structure 125 .

[0281] In FIG. 29 , the electromagnetic induction structure 125 is disposed on a support plate 111 , and the support plate 111 is used as a carrier of the electromagnetic induction structure 125 .

[0282] FIG30 and FIG31 are two different implementation structures of the electromagnetic induction structure 125 provided in the embodiment of the present application.

[0283] In FIG30 , when the support plate 111 is made of a conductive material, such as metal, the electromagnetic induction structure 125 includes a first sensing electrode layer 1251 , a second sensing electrode layer 1252 , a first insulating layer 1253 , and a second insulating layer 1254 .

[0284] First sensing electrode layer 1251 and second sensing electrode layer 1252 are stacked on one side of support plate 111. Because support plate 111 is made of a conductive material, first insulating layer 1253 is provided between first sensing electrode layer 1251 and support plate 111. First insulating layer 1253 electrically isolates the sensing electrodes from the conductive support plate 111, ensuring the working performance of the sensing electrodes.

[0285] First sensing electrode layer 1251 is disposed on a side of first insulating layer 1253 away from support plate 111. First sensing electrode layer 1251 is disposed on a surface of first insulating layer 1253 away from support plate 111. Second sensing electrode layer 1252 is stacked with first sensing electrode layer 1252. First sensing electrode layer 1251 and second sensing electrode layer 1252 are electrically isolated by second insulating layer 1254. First sensing electrode layer 1251 is covered by second insulating layer 1254, and second sensing electrode layer 1252 is disposed on a surface of second insulating layer 1254.

[0286] As shown in Figure 30 , the electromagnetic induction structure 125 further includes a planar layer 1255, which covers the second sensing electrode layer 1252. The planar layer 1255 not only protects the second sensing electrode 1252 but also improves surface flatness, thereby reducing the appearance of "magic marks" on the display module.

[0287] When the structure shown in FIG30 is applied to the display module 11 shown in FIG29 , in this implementation, the support plate 111 carrying the electromagnetic induction structure 125 is connected to other structures of the display module 11 via the adhesive layer 1. For example, a back protective layer 116 is provided on the back side of the display screen 112, and the flat layer 1255 is bonded to the back protective layer 116 via the adhesive layer 1.

[0288] Compared with the display module shown in FIG28 , the display module shown in FIG29 and FIG30 omits the adhesive layer 2 with a thickness of 25 μm to 30 μm, thereby reducing the thickness of the entire display module.

[0289] Since the electromagnetic induction structure 125 is directly disposed on the support plate 111, the thickness of the electromagnetic induction structure 125 is compressed from 80 μm to 107 μm in FIG29 to about 5 μm, which significantly reduces the thickness of the entire display module and improves the bendability of the display module.

[0290] In a feasible process, the display module shown in FIG. 29 and FIG. 30 can be prepared in the following manner.

[0291] Step 1: Dispose a first insulating layer 1253 on one side of the support plate 111 .

[0292] Step 2: Dispose a first sensing electrode layer 1251 on a side of the first insulating layer 1253 away from the support plate 111. For example, the patterned first sensing electrode layer 1251 may be manufactured by coating, etching, or printing.

[0293] Step 3: Dispose a second insulating layer 1254 so that the second insulating layer 1254 covers the first sensing electrode layer 1251 .

[0294] Step 4: Dispose the second sensing electrode layer 1252 on the side of the second insulating layer 1254 away from the first sensing electrode layer 1251. For example, the patterned second sensing electrode layer 1252 can be manufactured by coating etching or printing.

[0295] Step 5: Dispose a planar layer 1255 so that the second sensing electrode layer 1252 is covered by the planar layer 1255 .

[0296] Step 6: Prepare the stacked display screen 112, display cover 113 and back protection layer 116.

[0297] Step 7: Connect the support plate 111 carrying the electromagnetic induction structure 125 to the multilayer film structure obtained in step 6. For example, the back protection layer 116 and the flat layer 1255 are bonded together using an adhesive layer 1.

[0298] As shown in Figure 31, Figure 31 shows another embodiment of the electromagnetic induction structure provided in the present application. In this example, the support plate 111 is made of insulating material, such as carbon fiber.

[0299] Since the support plate 111 in this example is made of insulating material, the electromagnetic induction structure 125 includes a first sensing electrode layer 1251 , a second sensing electrode layer 1252 , a second insulating layer 1254 and a planar layer 1255 .

[0300] First sensing electrode layer 1251 is disposed on the surface of support plate 111, and second sensing electrode layer 1252 is stacked on a side of first sensing electrode layer 1252 away from support plate 111. First sensing electrode layer 1251 and second sensing electrode layer 1252 are electrically isolated by second insulating layer 1254. First sensing electrode layer 1251 is covered by second insulating layer 1254, and second sensing electrode layer 1252 is disposed on the surface of second insulating layer 1254.

[0301] When the structure shown in FIG31 is applied to the display module 11 shown in FIG29 , in this implementation, the support plate 111 carrying the electromagnetic induction structure 125 is connected to other structures of the display module 11 via the adhesive layer 1. For example, a back protective layer 116 is provided on the back side of the display screen 112, and the flat layer 1255 is bonded to the back protective layer 116 via the adhesive layer 1.

[0302] As shown in FIG30 and FIG31 , compared with the display module shown in FIG28 , the adhesive layer 2 with a thickness of 25 μm to 30 μm is omitted, thereby reducing the thickness of the entire display module.

[0303] Because the electromagnetic induction structure 125 is directly mounted on the support plate 111 and an insulating layer is omitted, the thickness of the electromagnetic induction structure 125 is reduced from 80 μm to 107 μm in FIG. 29 to less than 5 μm. This significantly reduces the thickness of the entire display module and improves its bendability.

[0304] In a feasible process, the display modules shown in FIG. 29 and FIG. 31 can be prepared in the following manner.

[0305] Step 1: Form a first sensing electrode layer 1251 on one side of the support plate 111. For example, the patterned first sensing electrode layer 1251 can be formed by coating, etching, or printing.

[0306] Step 2: Dispose a second insulating layer 1254 so that the second insulating layer 1254 covers the first sensing electrode layer 1251 .

[0307] Step 3: Dispose the second sensing electrode layer 1252 on the side of the second insulating layer 1254 away from the first sensing electrode layer 1251. For example, the patterned second sensing electrode layer 1252 can be manufactured by coating etching or printing.

[0308] Step 4: Dispose a planar layer 1255 so that the second sensing electrode layer 1252 is covered by the planar layer 1255 .

[0309] Step 5: Prepare the stacked display screen 112, display cover 113 and back protection layer 116.

[0310] Step 6: Connect the support plate 111 carrying the electromagnetic induction structure 125 to the multilayer film structure obtained in step 5. For example, the back protection layer 116 and the flat layer 1255 are bonded together using the adhesive layer 1.

[0311] In order to reduce the thickness of the display module and improve its bendability, FIG32 shows another structure that can be realized for a display module according to an embodiment of the present application.

[0312] As shown in FIG32 , the display module includes a display screen 112 and a display cover 113 . The display cover 113 is disposed on one side of the display surface of the display screen 112 .

[0313] The display module further includes an electromagnetic induction structure 125 . The electromagnetic induction structure 125 is disposed on one side of the support plate 111 through an adhesive layer 2 , and is connected to the display screen 112 through an adhesive layer 3 .

[0314] FIG33 shows a structural diagram of the electromagnetic induction structure 125 that can be used in FIG32 . The electromagnetic induction structure 125 includes a first sensing electrode layer 1251 , a second sensing electrode layer 1252 , a substrate 1256 , a first planar layer 1257 , and a second planar layer 1258 .

[0315] First sensing electrode layer 1251 and second sensing electrode layer 1252 are disposed on opposite sides of substrate 1256 . First planar layer 1257 is located on one side of substrate 1256 and covers first sensing electrode layer 1251 . Second planar layer 1258 is located on the other side of substrate 1256 and covers second sensing electrode layer 1252 .

[0316] In some examples, the substrate 1256 may be made of at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0317] When the structure shown in FIG33 is applied to the display module shown in FIG32 , in this implementation structure, the first flat layer 1257 is connected to the support plate 111 via the adhesive layer 2 , and the second flat layer 1258 is connected to the display screen 112 via the adhesive layer 3 .

[0318] As shown in Figures 33 and 32, compared to the display module shown in Figure 28, the back protective layer 116 is omitted because the substrate 1256 in the electromagnetic induction structure 125 has sufficient strength to support and protect the display screen 112. Furthermore, the thickness of the electromagnetic induction structure 125 in this example is 40μm to 60μm, for example, 50μm. Compared to the electromagnetic induction structure in Figure 28, which has a thickness of 80μm to 107μm, the display module shown in Figures 32 and 33 of the present embodiment can significantly reduce the thickness, improving the bendability of the display module.

[0319] Compared with FIG28 , the adhesive layer 1 can be omitted, which can further compress the thickness and optimize the bending performance.

[0320] In a feasible process, the display module shown in FIG. 32 and FIG. 33 can be prepared in the following manner.

[0321] Step 1: Dispose first sensing electrode layer 1251 and first planar layer 1257 on one side of substrate 1256 , with first planar layer 1257 covering first sensing electrode layer 1251 ; and, dispose second sensing electrode layer 1252 and second planar layer 1258 on the other side of substrate 1256 , with second planar layer 1258 covering second sensing electrode layer 1252 .

[0322] Step 2: Use the adhesive layer 3 to bond the second flat layer 1258 to the display screen 112 , and a display cover 113 may be provided on the display surface side of the display screen 112 .

[0323] Step 3: Adhesive layer 2 is used to bond the first flat layer 1257 to the support plate 111. In the above embodiments, the first electromagnetic induction layer 1251 can be an electrode layer for sensing in a first direction, such as an electrode layer for sensing in the X direction, and the second electromagnetic induction layer 1252 can be an electrode layer for sensing in a second direction, such as an electrode layer for sensing in the Y direction perpendicular to the X direction.

[0324] As shown in Figures 34 and 35 , Figure 34 shows the structure of the first sensing electrode layer 1251, and Figure 35 shows the structure of the second sensing electrode layer 1252. The electrodes in the first sensing electrode layer 1251 can extend along the X-direction, with adjacent electrodes connected to form a current loop. The electrodes in the second sensing electrode layer 1252 can extend along the Y-direction, with adjacent electrodes connected to form a current loop.

[0325] Among some selectable materials, the electrodes in the first sensing electrode layer 1251 or the electrodes in the second sensing electrode layer 1252 may be selected from but not limited to at least one of copper, aluminum, iron, tungsten, gold, and silver, and may also be alloy materials.

[0326] The planar layer can be made of an insulating material, such as an organic insulating material.

[0327] The aforementioned foldable electronic devices demonstrate how to reduce overall size. To further enhance product performance, it is also necessary to improve the impact and damage resistance of the non-bending areas and enhance the bendability of the bending areas.

[0328] This application provides some display module embodiments that can not only improve the rigidity of the exposed non-bending area, but also will not weaken the bendability of the bending area.

[0329] Figure 36 is a structural diagram of a display module according to an embodiment of the present application. Display screen 112 in display module 11 includes a first non-bending portion, a second non-bending portion, a third non-bending portion, a first bending portion, and a second bending portion. The first bending portion connects the first and second non-bending portions, and the second bending portion connects the second and third non-bending portions.

[0330] The cover plate 110 in the display module 11 includes a first non-bending area, a second non-bending area and a third non-bending area, a first bending area connecting the first non-bending area and the second non-bending area, and a second bending area connecting the second non-bending area and the third non-bending area.

[0331] The first non-bending portion of the display screen 112 corresponds to the first non-bending area of ​​the cover plate 110, the first bending portion of the display screen 112 corresponds to the first bending area of ​​the cover plate 110, the second non-bending portion of the display screen 112 corresponds to the second non-bending area of ​​the cover plate 110, the second bending portion of the display screen 112 corresponds to the second bending area of ​​the cover plate 110, and the third non-bending portion of the display screen 112 corresponds to the third non-bending area of ​​the cover plate 110.

[0332] The first bending region, the first bending portion, the second bending region and the second bending portion are all capable of bending along a bending line to switch between a flattened state and a closed state.

[0333] Figure 36 takes three-screen folding as an example. In other examples, more bending areas and non-bending areas can be added on the basis of the structure shown in Figure 36 to form electronic devices such as four-screen folding and five-screen folding.

[0334] As shown in FIG36 , the thickness of the first non-bending region of the cover plate 110 is d1 , and the thickness of the second non-bending region is d2 . The thickness d1 is not equal to the thickness d2 . For example, the thickness d1 may be greater than the thickness d2 .

[0335] Figure 37 is a structural diagram of another display module according to an embodiment of the present application. Similar to Figure 36 above, the thickness of the first non-bending region of the cover plate 110 is d1, and the thickness of the second non-bending region is d2. Thickness d1 and thickness d2 are not equal, but are greater than thickness d2.

[0336] Figure 38 is a structural diagram of another display module according to an embodiment of the present application. Similar to Figures 36 and 37 above, in the cover plate 110, the thickness d1 of the first non-bending region is not equal to the thickness d2 of the second non-bending region, with thickness d1 being greater than thickness d2.

[0337] The thickness dimension involved in the embodiment of the present application refers to: the dimension along the stacking direction (P direction) of multiple film layers as shown in Figure 36.

[0338] In the three different examples of the display module 11 shown in Figures 36, 37 and 38, the thickness d4 of the first bending area of ​​the cover plate 110 is not constant, but gradually decreases along the direction away from the first non-bending area, that is, from the first non-bending area to the second non-bending area, so that the thickness d2 is smaller than the thickness d1.

[0339] As shown in Figures 36 to 38, in the cover plate 110, the first non-bending area is a thick area, the second non-bending area is a thin area, and the first bending area connected between the first non-bending area and the second non-bending area is a thin-to-thick transition area.

[0340] The three different examples of the display module 11 shown in FIG36 , FIG37 and FIG38 have the following differences:

[0341] In the cover plate 110 of Figure 36 , the second bending region has a thickness of d5, and the third non-bending region has a thickness of d3. Thicknesses d2, d5, and d3 are equal. The first non-bending region is a thick region, the first bending region is a thick-to-thin transition region, and the second non-bending region, the second bending region, and the third non-bending region are thin regions of equal thickness.

[0342] Compared to FIG36 , FIG37 shows an example in which not only is the thickness d4 of the first bending region not constant, but the thickness d2 of the second non-bending region is also not constant. In some examples, the thickness of the first bending region and the second non-bending region of the cover plate 110 gradually decreases as it moves away from the first non-bending region, thereby masking the visual effect of uneven thickness across the display module.

[0343] In FIG37 , the thicknesses of the second bending region and the third non-bending region of the cover plate 110 are equal, that is, the thickness d5 is equal to the thickness d3.

[0344] In FIG37 , the first non-bending region is a thick region, the first bending region and the second non-bending region are thick-thin transition regions, and the second bending region and the third non-bending region are thin regions with equal thickness.

[0345] Compared to Figures 36 and 37 above, in Figure 38, not only are the thicknesses of the first bending region and the second non-bending region of cover plate 110 not constant, but the thicknesses of the second bending region and the third non-bending region of cover plate 110 are also not constant. As one moves away from the first non-bending region, the thicknesses of the first, second, third, and third non-bending regions of cover plate 110 gradually decrease. This further masks the visual effect of uneven thickness across the display module.

[0346] Figure 39 is a structural diagram of the display module 11 given in the embodiment of the present application of Figure 36 after bending. The thickness of the first non-bending area that is exposed (visible to the user when folded) is greater than the thickness of the second non-bending area that is not exposed (invisible to the user when folded). The first bending area connected to the exposed first non-bending area is designed to have an unequal thickness structure. Even if the thickness of the first non-bending area is increased in order to improve the rigidity and strength of the first non-bending area, it will not affect the bendability of the bending area. The thickness of other areas will not be increased either. When the entire device is in a folded state, the thickness of the folded state will not be significantly increased.

[0347] In some examples, the bending regions illustrated in Figures 36 to 38 can form an inner folding region or an outer folding region. For example, in the folded state shown in Figure 39, the first bending region forms an outer folding region, and the second bending region forms an inner folding region. The first non-bending region is exposed and visible to the user, while the second and third non-bending regions are opposite and invisible to the user.

[0348] As shown in Figure 40, which is a structural diagram of a display module according to an embodiment of the present application, the thickness of the display cover plate 113 in the first non-bending region is greater than that in the second non-bending region. The thickness of the display cover plate 113 in the first bending region gradually decreases as it moves away from the first non-bending region.

[0349] In FIG. 40 , the thickness of the protection layer 114 in each bending region and each non-bending region is equal.

[0350] Figure 40 is a structural diagram of another display module according to an embodiment of the present application. In this structure, the thickness of the protective layer 114 in the first non-bending region is greater than that in the second non-bending region. The thickness of the protective layer 114 in the first bending region gradually decreases as it moves away from the first non-bending region.

[0351] FIG. 41 shows that the thickness of the cover plate 113 in each bending region and each non-bending region is equal.

[0352] Figure 42 is a structural diagram of another display module according to an embodiment of the present application. Compared to Figure 41, in this structure, the thickness of the first bending region and the thickness of the second non-bending region of the protective layer 114 gradually decrease as they move away from the first non-bending region, thereby widening the width of the thin-to-thick transition zone of the protective layer 114.

[0353] Figure 43 is a structural diagram of another display module according to an embodiment of the present application. Compared to Figures 41 and 42 above, in this example, the thickness of the first bending region, the second non-bending region, the second bending region, and the third non-bending region of the protective layer 114 gradually decrease as they move away from the first non-bending region. This further widens the width of the thin-to-thick transition zone of the protective layer 114.

[0354] In the above-mentioned Figures 41 to 43, the protective layer 114 is designed as a structure with uneven thickness. In other examples, the uneven thickness transition zone can be set in other film layer structures, for example, in the display cover 113, the structure shown in Figures 41 to 43 can also be adopted.

[0355] In some examples provided in this application, as shown in FIG. 44 , the display cover 113 or the protective layer 114 may include: a substrate 11D and a buffer layer 11B.

[0356] The substrate 11D and the buffer layer 11B can be connected by an adhesive layer 11C, and the adhesive layer 11A connects these stacked film structures to other layer structures. In some examples, when FIG. 44 shows a protective layer 114, the adhesive layer 11A can be used to connect the structure including the substrate 11D, the adhesive layer 11C, and the buffer layer 11B to the display cover 113.

[0357] Among some selectable materials, the substrate 11D may be made of at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0358] In some examples, the buffer layer 11B is an elastomeric film material, and the elastic modulus of the buffer layer 11B is smaller than the elastic modulus of the substrate 11D. The buffer layer 11B can be made of at least one of thermoplastic polyurethane elastomer TPU, thermoplastic polyamide elastomer TPAE, and other elastomeric film materials.

[0359] The adhesive layer 11A and the adhesive layer 11C may be made of at least one of an optically clear adhesive (OCA), an optically clear resin (OCR), an acrylic resin, an epoxy resin, and the like.

[0360] Referring to Figure 44 , in this embodiment, the buffer layer 11B in the first bending region is designed to have a unequal thickness. The thickness of the buffer layer 11B in the first bending region gradually decreases as it moves away from the first non-bending region, creating a transition zone between thick and thin regions for the protective layer 114 or display cover 113 in the first bending region.

[0361] 44 , the thickness of substrate 11D may be 25 μm to 75 μm, and the thickness of adhesive layer 11A and adhesive layer 11C may be 25 μm to 50 μm.

[0362] The thickness of the buffer layer 11B in the first non-bending region is 75 μm to 150 μm, and the thickness of the buffer layer 11B in the second non-bending region, the second bending region, and the third non-bending region is 25 μm to 75 μm.

[0363] Figure 45 illustrates another structural example of a display cover 113 or protective layer 114 according to an embodiment of the present application. In this example, the substrate 11D located in the first bend region is designed to have varying thicknesses. The thickness of the substrate 11D in the first bend region gradually decreases as it moves away from the first non-bend region, creating a transitional zone between thick and thin layers of the protective layer 114 or display cover 113 located in the first bend region.

[0364] Figure 46 shows another structural diagram of a display cover plate 113 or protective layer 114 according to an embodiment of the present application. Compared to Figure 44 , not only is the buffer layer 11B in the first bending region designed with uneven thickness, but the buffer layer 11B in the second non-bending region is also designed with uneven thickness, thereby reducing the visual effect of uneven thickness across the entire display module.

[0365] Figure 47 shows the structure of another display cover plate 113 or protective layer 114 according to an embodiment of the present application. In some examples, the buffer layer 11B is relatively thick, for example, up to 100 μm. Due to the thick buffer layer, the strain generated on the upper and lower surfaces of the display module when it is bent is more likely to enter the plastic deformation stage.

[0366] When the display module is bent, in order to weaken the strain generated on the upper and lower surfaces of the display module, it enters the plastic deformation stage and improves the bendability. In some examples, as shown in Figure 47, the buffer layer 11B includes a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B is a structure of equal thickness, and the second buffer layer 11B2 located in the first bending area is designed to have an uneven thickness structure. The second buffer layer 11B2 with uneven thickness is farther away from the display screen than the first buffer layer 11B1 with uniform thickness, that is, closer to the interface that the user can see; in other examples, the first buffer layer 11B1 with uniform thickness can also be closer to the interface that the user can see than the second buffer layer 11B2 with uneven thickness.

[0367] 47 , the first buffer layer 11B1 is connected to the second buffer layer 11B2 via an adhesive layer 11E, and the second buffer layer 11B2 is connected to the substrate 11D via an adhesive layer 11C.

[0368] Figure 48 is a structural diagram of another display cover plate 113 or protective layer 114 according to an embodiment of the present application. Among the possible process options, a coating process can be used to bond the buffer layer 11B to the substrate 11D. The adhesive layer connecting the buffer layer 11B and substrate 11D can be removed, reducing the thickness of the entire display module without compromising the rigidity of the non-bending region or the bendability of the bending region.

[0369] The material of the buffer layer 11B in the example of FIG48 can be selected from at least one of thermoplastic polyurethane elastomer, silicone gel, and shear thickening material.

[0370] Referring to FIG. 48 , in this example, the buffer layer 11B located in the first bending region is designed to have an uneven thickness structure, and the thickness of each region of the substrate 11D is equal.

[0371] Figure 49 is a structural diagram of another display cover plate 113 or protective layer 114 according to an embodiment of the present application. In some alternative processes, a coating process can be used to bond the buffer layer 11B to the substrate 11D. In this example, the buffer layer 11B can be made of an adhesive material, such as optically clear adhesive (OCA). This buffer layer 11B is not only an elastomeric film but also serves as a connector, eliminating the need for adhesive layer 11A. This can further reduce the thickness of the display module.

[0372] Referring to FIG. 49 , in this example, the buffer layer 11B located in the first bending region is designed to have an uneven thickness structure, and the thickness of each region of the substrate 11D is equal.

[0373] In order to improve the rigidity of the exposed non-bending area without weakening the bendability of the bending area, the present application also provides some possible structures, which are as follows:

[0374] Figure 50 is a structural diagram of a display module according to an embodiment of the present application. In the cover plate 110 of the display module 11, the elastic modulus in the first non-bending region is greater than the elastic modulus in the first bending region. The cover plate 110 includes a hard region with a higher elastic modulus and a soft region with a lower elastic modulus.

[0375] In some examples, when the cover plate 110 includes a display cover plate or a protective layer, the hard region and the soft region can be provided in at least one of the display cover plate and the protective layer. For example, Figure 50 is a structural diagram of a display cover plate 113 or protective layer 114 according to an embodiment of the present application. The display cover plate 113 or protective layer 114 includes a substrate 11D and a buffer layer 11B, which are connected by an adhesive layer 11C.

[0376] As shown in Figure 51 , buffer layer 11B includes hard region 11B01 (also called the first portion) and soft region 11B02 (also called the second portion). The elastic modulus of hard region 11B01 is greater than that of soft region 11B02. Hard region 11B01 is located in the first non-bending region, while soft region 11B02 can be located in at least one of the first bending region and the second bending region.

[0377] In Figure 51 , the hard region 11B01 and the soft region 11B02 are connected together as a single unit. In some alternative process steps, a buffer layer material can be first coated on the substrate and then cured in different regions using UV (ultraviolet light) to produce buffer materials with varying hardness. In other alternative process steps, the buffer layer material can be heated in different regions to produce sections with different elastic moduli, thereby creating hard and soft regions.

[0378] The buffer layer 11B is divided into a hard area 11B01 and a soft area 11B02 with different elastic moduli. The hard area 11B01 is located in the first non-bending area, which can improve the stiffness of the first non-bending area. The soft area 11B02 with a smaller elastic modulus is located in the bending area to ensure that the bending area has better bendability.

[0379] In FIG51 , the elastic modulus of the buffer layer 11B (which may be called the third portion) located in the second non-bending region and the third non-bending region may be smaller than the elastic modulus of the hard region 11B01 and larger than the elastic modulus of the soft region 11B02.

[0380] In some examples, to improve the stiffness of the second and third non-bending regions, the elastic modulus of the buffer layer 11B in the second and third non-bending regions may be equal to the elastic modulus of the hard region 11B01 .

[0381] When the elastic modulus of the buffer layer 11B located in the second non-bending area and the third non-bending area is smaller than the elastic modulus of the hard area 11B01 and larger than the elastic modulus of the soft area 11B02, the buffer material can be applied first, at which time its modulus is lower, and then cross-linked by local UV curing or heating. By controlling the UV energy or heating temperature, a lower modulus part and a higher modulus part can be obtained.

[0382] 52 is a structural diagram of another display cover 113 or protective layer 114 according to an embodiment of the present application, comprising a substrate 11D and a buffer layer 11B, which are connected via an adhesive layer 11C.

[0383] In this example, buffer layer 11B includes a hard portion 11B11 with a larger elastic modulus and a soft portion 11B12 with a smaller elastic modulus, which are spliced ​​together. Hard portion 11B11 is located in the first non-bending region, and soft portion 11B12 is located in at least one of the first bending region and the second bending region.

[0384] In some examples, as shown in Figure 52, an adhesive layer 11B13 can be used to join the hard portion 11B11 and the soft portion 11B12 together. For example, when the adhesive layer 11C is applied to one side of the buffer layer 11B, the colloid can overflow into the gap between the hard portion and the soft portion, thereby bonding the hard portion and the soft portion together.

[0385] 52 , in order to improve the stiffness of the second and third non-bending regions, the elastic modulus of the buffer layer 11B located in the second and third non-bending regions may be equal to the elastic modulus of the hard portion.

[0386] In some other examples, the elastic modulus of the buffer layer 11B located in the second non-bending region and the third non-bending region may be smaller than the elastic modulus of the hard portion and larger than the elastic modulus of the soft portion.

[0387] In the example of FIG52 , the material of the hard part 11B11 includes at least one of polyethylene terephthalate (PET) and transparent polyimide (CPI), etc. The material of the soft part 11B12 includes at least one of thermoplastic polyurethane elastomer (TPU) and thermoplastic polyamide elastomer (TPAE), etc.

[0388] Figure 53 shows another structural diagram of a display cover plate 113 or protective layer 114 according to an embodiment of the present application. The buffer layer 11B comprises a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B1 includes a hard region 11B01 with a higher elastic modulus and a soft region 11B02 with a lower elastic modulus. The second buffer layer 11B2 has a unequal thickness design in the first bend region. This embodiment combines a unequal buffer layer thickness design with a unequal elastic modulus design.

[0389] When the display module is in the folded state and the first non-bending area is exposed, the first bending area connecting the first non-bending area and the second non-bending area must have sufficient resistance to external impact. For example, if the folded electronic device is dropped, the first bending area may be damaged by the impact of the hinge mechanism on one side and the ground.

[0390] The embodiments of the present application provide some new display modules 11. As shown in FIG54 , a buffer pad 127 is provided on the side of the support plate 111 away from the display screen 112. The buffer pad 127 is provided at a position of the support plate 111 opposite to the first bending area.

[0391] In some examples, in order to improve the bendability of the support plate 111, a hollow structure 111a (which can be called a bamboo book) is opened in the part opposite to the first bending area, and the buffer pad 127 is arranged at a position opposite to the hollow structure 111a.

[0392] The buffer pad 127 may be a one-layer film structure, or a multi-layer film structure.

[0393] For example, the buffer pad 127 can be made of at least one of stainless steel SUS, thermoplastic polyurethane elastomer TPU elastomer, porous foam Foam material, PET film material, and the like.

[0394] Figure 55 is a structural diagram of another display module according to an embodiment of the present application. In this embodiment, the buffer pad 127 is disposed within the support plate 111. For example, a groove can be provided within the support plate 111, and the buffer pad 127 can be disposed within the groove, with the groove being located opposite the first bending region.

[0395] Figure 56 is a structural diagram of another display module according to an embodiment of the present application. In this embodiment, a buffer pad 127 is provided on the hinge mechanism 200 located on one side of the display module.

[0396] As shown in FIG. 54 to FIG. 56 , since the buffer pad 127 is included, when the first bending region is impacted by an external force, the buffering effect of the buffer pad 127 can reduce the degree of damage to the display module.

[0397] Figure 57 is a structural diagram of another display module according to an embodiment of the present application. In this structure, not only is the display cover plate 113 located in the first bending region designed with uneven thickness, but a cushioning pad 127 is also provided on the side of the support plate 111 away from the display screen 112. This not only increases the rigidity of the exposed, non-bending portion without weakening the bendability of the bending portion, but also reduces damage to the bending portion of the display module, thereby improving the performance of the display module.

[0398] In some other examples, various regions of the protection layer 114 may be designed to have unequal thickness structures.

[0399] As shown in Figure 58 , the cover plate (e.g., display cover, protective layer) located on the display surface side of display screen 112 is designed with a structure having unequal elastic moduli. Furthermore, a buffer pad 127 is positioned on the support plate 111 opposite the first bending region. This not only optimizes the bendability of the display module's bending portion but also enhances its resistance to impact and compression.

[0400] The embodiment of the present application shows that the cover plate 110 is designed as a structure of unequal thickness or unequal modulus, which can be applied to the whole machine thinning solution involved in any of the above embodiments.

[0401] In some examples, the hinge mechanism in the foldable electronic device adopts the structure shown in Figures 4A and 4B, and the cover plate in the display module in the electronic device can adopt an unequal thickness structure or an unequal modulus structure.

[0402] In other examples, the edge bending area of ​​the display screen of the display module in the foldable electronic device has a reinforcement layer, or a reinforcement layer, or a buffer layer, and the cover plate in the display module in the electronic device can adopt an unequal thickness structure or an unequal modulus structure.

[0403] In some other examples, the cover plate in the display module of the electronic device may adopt an unequal thickness structure or an unequal modulus structure, and the structures shown in Figures 25 and 26 above may be adopted.

[0404] In some examples, when the cover plate in the display module of the electronic device can adopt a structure of unequal thickness or a structure of unequal modulus, the electromagnetic induction structure 125 in the display module can adopt the above examples.

[0405] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0406] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: Display module; A rotating shaft mechanism, wherein the rotating shaft mechanism is arranged on a side of the display module away from the display surface; The rotating shaft mechanism comprises: A first door panel, a second door panel and a driving device, wherein the first door panel and the second door panel are respectively connected to the driving device; The driving device can drive the first door panel and the second door panel to move toward or away from each other, so that the display module switches between a flattened state and a closed state along the bending line; The display module moves from the flattened state to the closed state, the movement of the first door panel is a rotation along a first axis, and the movement of the second door panel includes movement and a rotation along a second axis; The first axis and the second axis are both parallel to the bending line.

2. The electronic device according to claim 1, characterized in that: The second door panel has opposing first and second ends; The display module is in the flattened state, the first door panel and the second door panel are located in a first plane, and the first end of the second door panel is closer to the first door panel than the second end; The display module is in the closed state, the first door panel is perpendicular to the first plane, and the second end of the second door panel is closer to the first door panel than the first end.

3. The electronic device according to claim 1 or 2, characterized in that: The driving device comprises a first gear structure and a second gear structure, wherein the first gear structure is meshed with the second gear structure; The first gear structure is connected to the first door panel, and the second gear structure is connected to the second door panel; A transmission ratio between the first gear structure and the second gear structure is less than 1.

4. The electronic device according to claim 3, characterized in that: The first gear structure includes: a first rocker arm and a first gear; One end of the first rocker arm is fixedly connected to the first gear, and the other end is fixedly connected to the first door panel; The second gear structure includes: a second rocker arm, a second gear and a third gear; One end of the second rocker arm is fixedly connected to the second gear, and the other end is slidably connected to the second door panel, the second gear is meshed with the third gear, and the third gear is meshed with the first gear; A diameter of the first gear is greater than a diameter of the second gear.

5. The electronic device according to claim 4, characterized in that: The driving device also includes a sliding structure; The second door panel is slidably connected to the second rocker arm via the sliding structure; The sliding structure includes a sliding groove and a sliding rail arranged in the sliding groove, one of the sliding groove and the sliding rail is arranged on the second door panel, and the other is arranged on the second rocker arm.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The rotating shaft mechanism further includes a middle door panel, wherein the first door panel and the second door panel are arranged on both sides of the middle door panel opposite to each other; The display module is in a flattened state, and the first door panel, the middle door panel and the second door panel are located in the same plane; When the display module is in a closed state, the first door panel is perpendicular to the middle door panel.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The display module includes a display screen and a support plate arranged on a side of the display screen away from the display surface; The first door panel and the second door panel are arranged on a side of the support plate away from the display screen; A first hollow structure is arranged in the area where the support plate and the second door panel are opposite, no hollow structure is arranged in the area where the support plate and the first door panel are opposite, or a second hollow structure is arranged in the area where the support plate and the first door panel are opposite, and the density of the first hollow structure is greater than the density of the second hollow structure.

8. The electronic device according to claim 7, characterized in that: The first hollow structure comprises: A plurality of slots are provided, and the extending direction of each slot is the same as the second axis.

9. The electronic device according to claim 7 or 8, characterized in that: The rotating shaft mechanism further includes a middle door panel, wherein the first door panel and the second door panel are arranged on both sides of the middle door panel opposite to each other; The area where the support plate and the middle door plate are opposite is provided with a third hollow structure; the density of the third hollow structure is greater than The density of the first hollow structure.

10. The electronic device according to any one of claims 7 to 9, characterized in that: The display module also includes: A cover plate, the cover plate is arranged on a display surface side of the display screen, the cover plate comprises a first non-bending area, a second non-bending area, a third non-bending area, a first bending area and a second bending area, the first bending area connects the first non-bending area and the second non-bending area, the second bending area connects the second non-bending area and the third non-bending area, and the first bending area and the second bending area can be bent along a bending line to switch between a flattened state and a closed state; The position of the rotating shaft mechanism corresponds to the first bending area; The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

11. The electronic device according to claim 10, characterized in that: The thickness of the first non-bending region is greater than the thickness of the second non-bending region.

12. The electronic device according to claim 11, characterized in that: The cover plate comprises: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate in the first non-bending area is greater than the thickness of the substrate in the second non-bending area, and / or; The thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

13. The electronic device according to claim 12, characterized in that: From the first non-bending area to the second non-bending area, the thickness of the first buffer layer located in the first bending area gradually decreases.

14. The electronic device according to claim 12 or 13, characterized in that: The cover plate comprises: a second buffer layer, the second buffer layer comprising a first portion and a second portion; The first portion of the second buffer layer is located in the first non-bending region, the second portion of the second buffer layer is located in the first bending region, and the elastic modulus of the first portion of the second buffer layer is greater than the elastic modulus of the second portion of the second buffer layer.

15. A display module, characterized in that: include: A display screen, comprising a display area, an edge bending area located at the outer edge of the display area, and a lower frame area connected to the edge bending area, wherein the lower frame area is located at a side of the display area away from a display surface; The display module further includes a base film and an adhesive layer, wherein the base film and the adhesive layer are arranged outside the edge bending region, and the base film is connected to the edge bending region through the adhesive layer, or; The display module further includes a reinforcement layer, the reinforcement layer is arranged outside the edge bending area, and the reinforcement layer includes a printed layer; The outer side of the edge bending region is a side of the edge bending region away from the center of the arc structure.

16. The display module according to claim 15, characterized in that: The display module also includes: A reinforcement layer, the reinforcement layer being arranged on the inner side of the edge bending area; The inner side of the edge bending region is a side of the edge bending region close to the center of the arc structure.

17. The display module according to claim 16, characterized in that: When the display module includes the base film and the adhesive layer, the elastic modulus of the reinforcement layer is smaller than the elastic modulus of the base film; or, When the display module includes the reinforcement layer, the elastic modulus of the reinforcement layer is smaller than the elastic modulus of the reinforcement layer.

18. The display module according to any one of claims 15 to 17, characterized in that: The display module also includes: A buffer layer, wherein the buffer layer is disposed on a side of the base film away from the edge bending region, and the elastic modulus of the buffer layer is smaller than the elastic modulus of the base film; or The buffer layer is arranged on a side of the reinforcement layer away from the edge bending region, and the elastic modulus of the buffer layer is smaller than the elastic modulus of the reinforcement layer.

19. The display module according to any one of claims 15 to 18, characterized in that: The display area includes a first non-bending portion, a second non-bending portion, a third non-bending portion, a first bending portion, and a second bending portion, wherein the first bending portion connects the first non-bending portion and the second non-bending portion, and the second bending portion connects the second non-bending portion and the third non-bending portion, and both the first bending portion and the second bending portion can be bent along a bending line to switch between a flattened state and a closed state; The display module also includes: A cover plate, the cover plate being arranged on a display surface side of the display screen; The cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area and a second bending area, the first bending area connects the first non-bending area and the second non-bending area, and the second bending area connects the second non-bending area and the third non-bending area; The first non-bending region corresponds to the first non-bending portion, the second non-bending region corresponds to the second non-bending portion, the third non-bending region corresponds to the third non-bending portion, the first bending region corresponds to the first bending portion, and the second bending region corresponds to the second bending portion; The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

20. The display module according to claim 19, characterized in that: The thickness of the first non-bending region is greater than the thickness of the second non-bending region.

21. The display module according to claim 20, characterized in that: The cover plate comprises: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate in the first non-bending area is greater than the thickness of the substrate in the second non-bending area, and / or; The thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

22. The display module according to claim 21, characterized in that: From the first non-bending area to the second non-bending area, the thickness of the first buffer layer located in the first bending area gradually decreases.

23. The display module according to claim 21 or 22, characterized in that: The cover plate comprises: a second buffer layer, the second buffer layer comprising a first portion and a second portion; The first portion of the second buffer layer is located in the first non-bending region, the second portion of the second buffer layer is located in the first bending region, and the elastic modulus of the first portion of the second buffer layer is greater than the elastic modulus of the second portion of the second buffer layer.

24. An electronic device, characterized in that: include: case; The display module according to any one of claims 15 to 23; The display module is arranged on the housing.

25. An electronic device, characterized in that: include: Display module; A housing, wherein the housing comprises a frame arranged at the edge of the display module, and a first filling layer is arranged at a position where the frame and the display surface of the display module are in contact with each other; The frame and the first filling layer are an integrally formed structure.

26. The electronic device according to claim 25, characterized in that: The frame and the first filling layer are integrally formed injection-molded structural parts.

27. The electronic device according to claim 25 or 26, characterized in that: A second filling layer is disposed at a position of the frame opposite to the side surface of the display module. The elastic modulus of the second filling layer is smaller than the elastic modulus of the frame.

28. The electronic device according to claim 27, characterized in that: The second filling layer and the frame are an integrally formed structure.

29. The electronic device according to any one of claims 25 to 28, characterized in that: The display module comprises: Display screen; A cover plate is arranged on one side of the display surface of the display screen, and the cover plate includes a first non-bending area, a second non-bending area, a third non-bending region, a first bending region, and a second bending region, wherein the first bending region connects the first non-bending region and the second non-bending region, and the second bending region connects the second non-bending region and the third non-bending region, and both the first bending region and the second bending region can be bent along a bending line to switch between a flattened state and a closed state; The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

30. The electronic device according to claim 29, characterized in that The thickness of the first non-bending region is greater than the thickness of the second non-bending region.

31. The electronic device according to claim 30, characterized in that: The cover plate comprises: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate in the first non-bending area is greater than the thickness of the substrate in the second non-bending area, and / or; The thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

32. The electronic device according to claim 31, characterized in that: From the first non-bending area to the second non-bending area, the thickness of the first buffer layer located in the first bending area gradually decreases.

33. The electronic device according to claim 31 or 32, characterized in that: The cover plate comprises: a second buffer layer, the second buffer layer comprising a first portion and a second portion; The first portion of the second buffer layer is located in the first non-bending region, the second portion of the second buffer layer is located in the first bending region, and the elastic modulus of the first portion of the second buffer layer is greater than the elastic modulus of the second portion of the second buffer layer.

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