Electronic atomization device and control method and apparatus therefor

Abstract

The present application relates to an electronic atomization device and a control method and apparatus therefor. The electronic atomization device comprises: a processing module (120), a power supply module (110) and a heating body (130), wherein the heating body (130) comprises a ceramic substrate, and a plurality of straight-through micro-pores, which penetrate the ceramic substrate, are provided in the ceramic substrate; and the processing module (120) is used for: when the heating body (130) performs heating, controlling the power supply module (110) to provide energy for the heating body (130) on the basis of a frequency of 20 kHz to 30 kHz.

Description

Electronic atomization equipment and control method and device thereof

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 2023107546769, filed on June 25, 2023, entitled “Electronic atomization device and its control method and device,” the entire text of which is hereby incorporated by reference. Technical Field

[0003] The present application relates to the field of atomization equipment, and in particular to an electronic atomization equipment and a control method and device thereof. Background Art

[0004] In traditional technology, electronic atomization equipment is generally composed of a heating element, a battery, a control circuit and other parts. The heating element is the core component of the electronic cigarette, and its characteristics determine the atomization effect and user experience.

[0005] Cotton-core heaters are a common type of heating element, typically consisting of a metal heating wire wrapped around a cotton or fiber rope. The liquid aerosol to be atomized is absorbed by the ends of the cotton rope and then transferred to the central heating wire for heating and atomization. However, the limited surface area at the ends of the cotton rope results in low liquid absorption and transfer efficiency. Furthermore, the cotton rope structure is unstable, and after repeated thermal cycles, it is prone to dry burning, carbon deposits, and a burnt odor.

[0006] Porous ceramic heaters are another widely used type of heater. They typically consist of a porous ceramic substrate and a metal heating film. The porous ceramic provides liquid conduction and storage, while the metal heating film heats and atomizes the liquid aerosol-generating matrix. However, porous ceramics prepared by high-temperature sintering face difficulties in precisely controlling the positional distribution and dimensional accuracy of the micropores.

[0007] In order to solve the above problems, attempts are currently being made to replace the disordered porous structure with a straight microporous structure. However, straight through hole heating elements, especially thin straight through hole heating elements, are prone to generate noise.

[0008] Summary of the Invention

[0009] In a first aspect, the present application provides an electronic atomization device, the electronic atomization device comprising:

[0010] The heating element comprises a ceramic substrate, and the ceramic substrate is provided with a plurality of straight micropores penetrating the ceramic substrate;

[0011] Power modules; and

[0012] The processing module is used to control the power supply module to provide energy to the heating element based on a frequency of 20kHz to 30MHz when the heating element is heated.

[0013] In one embodiment, the processing module is further configured to control the power supply module to provide energy to the heating element based on a frequency greater than or equal to 32 kHz.

[0014] In one embodiment, the processing module is further configured to control the power supply module to provide energy to the heating element based on a frequency less than or equal to 100 kHz.

[0015] In one embodiment, the thickness of the ceramic substrate ranges from 0.1 mm to 2 mm.

[0016] In one embodiment, the through micropores have a pore size range of 1 um to 100 um.

[0017] In one embodiment, the thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm.

[0018] In one embodiment, the through micropores have a pore size ranging from 10 μm to 50 μm.

[0019] In one embodiment, the ratio of the thickness of the ceramic substrate to the diameter of the through micropores ranges from 50:1 to 3:1.

[0020] In one embodiment, each through micropore array is disposed on a ceramic substrate, and a ratio of a hole center distance to a hole diameter of the through micropores ranges from 3:1 to 1.5:1.

[0021] In one embodiment, the heating element includes a first sub-heating element and a second sub-heating element. The first sub-heating element and the second sub-heating element are both provided with a plurality of straight micropores penetrating the ceramic matrix. The straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

[0022] In a second aspect, the present application further provides a control method for an electronic atomization device, wherein the electronic atomization device includes a heating element and a power module, wherein a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate, and the method includes:

[0023] When the heating element is heated, the control power module provides energy to the heating element based on a frequency of 20kHz to 30MHz.

[0024] In one embodiment, controlling the power supply module to provide energy to the heating element based on a frequency of 20 kHz to 30 MHz includes:

[0025] The control power module provides energy to the heating element based on a frequency greater than or equal to 32 kHz.

[0026] In one embodiment, controlling the power supply module to provide energy to the heating element based on a frequency of 20 kHz to 30 MHz includes:

[0027] The control power module provides energy to the heating element based on a frequency less than or equal to 100 kHz.

[0028] In a third aspect, the present application further provides a control device for an electronic atomization device, the electronic atomization device comprising a heating element and a power module, wherein a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate, and the device comprises:

[0029] The control module is used to control the power supply module to provide energy to the heating element based on a frequency of 20kHz to 30MHz when the heating element is heated.

[0030] In one embodiment, the control module is further configured to control the power supply module to provide energy to the heating element based on a frequency less than or equal to 100 kHz when the heating element is heated.

[0031] The details of one or more embodiments of the present application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the disclosed drawings without any creative work.

[0033] FIG1 is a schematic diagram of the three-dimensional structure of a heating element in one embodiment;

[0034] FIG2 is a schematic diagram of the process of generating the bumping phenomenon in one embodiment;

[0035] FIG3 is a schematic structural diagram of an electronic atomization device in one embodiment;

[0036] FIG4 is a schematic side view of a heating element in another embodiment;

[0037] FIG5 is a flow chart of a method for controlling an electronic atomization device in one embodiment; and

[0038] FIG6 is a schematic diagram of the module structure of a control device of an electronic atomization device in one embodiment. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0040] It should be noted that through-hole heaters are more susceptible to air intake than those with disordered porous structures, and this process produces a sound similar to boiling water. If low-frequency and consistent boiling continues, it will also cause vibration and noise, affecting the user experience. The through-hole heater here refers to a hole with a basically straight center line that passes through the substrate.

[0041] As shown in Figure 1, the heating element 130 is a thin heating element (a thin heating element refers to a heating element with a thickness of less than 3 mm), including a ceramic substrate 131, a heating film 132 and an electrode 133, wherein the ceramic substrate 131 has a relative atomizing surface 1311 and a liquid absorption surface 1312, and a plurality of straight-through micropores 1313 are provided on the ceramic substrate 131, and the straight-through micropores 1313 are through holes that pass through the ceramic substrate 131, and the straight-through micropores 1313 connect the liquid absorption surface 1312 and the atomizing surface 1311.

[0042] The through micropores 1313 are used to guide the atomized matrix from the liquid absorption surface 1312 to the atomizing surface 1311. Specifically, the atomized matrix within the electronic atomization device flows through the lower liquid channel to the liquid absorption surface 1312 of the ceramic base 131, where it is guided to the atomizing surface 1311 by the capillary force of the through micropores 1313. In other words, the atomized matrix flows from the liquid absorption surface 1312 to the atomizing surface 1311 under the action of gravity and / or capillary force, where it is heated and atomized on the atomizing surface 1311 of the heating element 130 to generate an aerosol.

[0043] However, during use, it was found that the use of the heating element 130 shown in Figure 1 would cause problems such as loud noise and vibration. The substrate is as follows: the electronic atomization device uses a constant power 100Hz pulse heating method for atomization. Pulsing means that it is not a continuous power output, but an output in the form of a duty cycle, which is convenient for adjusting the duty cycle to adjust the output power. For example, when the output power is 15W, if you want to achieve a constant power output of 7.5W, adjust the duty cycle to 50%. At this time, 50% of the time, the heating element 130 is heated normally, and 50% of the time, the heating element 130 is not heated. The replenishment of the atomization matrix will cause the heating film 132 in the heating element 130 to cool down during the unheated time. This pulse control method can ensure that the temperature of the heating element 130 will not be too high, but the constant power pulse control method is prone to instantaneous high power. And instantaneous high power can cause the boiling phenomenon of the atomization matrix.

[0044] In order to better understand the phenomenon of explosive boiling, let's first explain it: during the heating process, pulsed control will cause instantaneous high power. At this time, the high power will cause the heating element 130 to heat up quickly and heat the atomized matrix to quickly reach the boiling point. Due to the lack of a vaporization core, there is no boiling but the temperature continues to rise to form an overheated liquid. Once this overheated liquid is triggered to boil (it can be triggered by changes in the external environment, such as shaking), it will be very violent, that is, it will form explosive boiling. The vaporization core refers to something that can trigger the boiling of the liquid, such as bubbles. If a zeolite with many tiny pores is used for heating, the air in the pores will escape due to the heat and form small bubbles. These small bubbles can serve as vaporization centers, so that the solution can boil in time after the temperature reaches the boiling point, and the solution temperature will not rise again, and no overheated liquid will be generated, and there will be no explosive boiling. According to the above description, it can be seen that the smoother the surface of the heating film, the easier it is to form an explosive boiling phenomenon.

[0045] At the same time, the straight-through micropores 1313 are easier for air to enter than porous structures. When the temperature of the liquid is much higher than the boiling point, the saturated vapor pressure of the small bubbles in the straight-through micropores 1313 will be higher than the external pressure. The preset bubbles grow and expand rapidly, pushing the straight-through micropores 1313 to spray to the outside world, that is, a liquid spray phenomenon occurs. As shown in Figure 2, the air entering the straight-through micropores 1313 forms small bubbles in the holes. During the heating process, the steam in the bubbles increases and expands, continuously increasing from left to right, and thus ejected from the straight-through micropores 1313, driving other atomized matrices to cause a liquid spray phenomenon, which will be felt by users as obvious vibration and noise. Electronic atomization equipment generally adopts a pulsed control method, so there will be a periodic liquid spray phenomenon, which will cause periodic vibration and noise, affecting the suction experience.

[0046] To solve the above problems, the following embodiments are proposed.

[0047] In one embodiment, an electronic atomization device is provided, as shown in FIG3 , the electronic atomization device includes:

[0048] The processing module 120, the power module 110 and the heating element 130, the heating element 130 includes a ceramic substrate 131, and the ceramic substrate 131 is provided with a plurality of straight micropores 1313 that pass through the ceramic substrate 131. The straight hole heating element refers to a hole that passes through the substrate with a center line that is basically a straight line. The micropore refers to a hole with a pore size less than 200um. The axis of the straight micropore 1313 is perpendicular to the ceramic substrate 131, that is, the extension direction of the straight micropore 1313 is perpendicular to the ceramic substrate 131. In this embodiment, the ceramic substrate 131 is sheet-shaped. It can be understood that the sheet-shaped is relative to the block-shaped body. The ratio of the length to the thickness of the sheet is larger than the ratio of the length to the thickness of the block; for example, a rectangular sheet. The ceramic substrate 131 can also be flat, arc-shaped, cylindrical, etc., and is designed according to specific needs. The other structures of the electronic atomization device are arranged in coordination with the shape of the ceramic substrate 131.

[0049] As an embodiment, the power module 110 may be connected to the processing module 120 and the heating element 130 respectively. In this case, the processing module 120 may send a control instruction to the power module 110 to control the output power and battery frequency of the power module 110 .

[0050] As another embodiment, the power module 110, the processing module 120, and the heating element 130 can be connected in sequence. In this case, the processing module 120 can control the on-off connection between the processing module 120 and the heating element 130 by turning itself on and off, thereby controlling the battery frequency of the power module 120. The battery frequency refers to the number of times the direction of the AC current output by the power module 110 changes within a unit time (1 second).

[0051] The power module 110 is used to provide energy to the heating element 130 and the processing module 120 respectively, so that the processing module 120 and the heating element 130 can operate normally.

[0052] In the present application, the heating element 130 can be a thin heating element. The thickness of the ceramic substrate 131 of the heating element 130 ranges from 0.1mm to 2mm. The thickness of the ceramic substrate 131 can be the distance between the liquid absorption surface 1312 and the atomization surface 1311. When the thickness of the ceramic substrate 131 is greater than 2mm, it cannot meet the liquid supply demand, resulting in a decrease in the amount of aerosol, and causing a lot of heat loss, and the cost of setting up the ceramic substrate 131 is high; when the thickness of the ceramic substrate 131 is less than 0.1mm, the strength of the ceramic substrate 131 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device. In some examples, the thickness of the ceramic substrate 131 can range from 0.3mm to 0.8mm. In specific implementation, the appropriate thickness can be selected according to actual needs.

[0053] The through-holes 1313 on the ceramic substrate 131 have a pore size ranging from 1 μm to 100 μm. When the pore size of the through-holes 1313 is smaller than 1 μm, the liquid supply cannot be met, resulting in a decrease in aerosol production. When the pore size of the through-holes 1313 is larger than 100 μm, the aerosol-generating matrix easily flows out of the through-holes 1313, causing leakage. Preferably, the pore size of the through-holes 1313 ranges from 10 μm to 50 μm. In practice, the appropriate pore size can be selected based on actual needs.

[0054] The ratio of the thickness of the ceramic substrate 131 to the pore diameter of the through-hole 1313 is in the range of 50:1 to 3:1 to improve the liquid supply capacity. When the ratio of the thickness of the ceramic substrate 131 to the pore diameter of the through-hole 1313 is greater than 50:1, the atomizing matrix supplied by the capillary action of the through-hole 1313 is difficult to meet the atomization requirements, which not only easily leads to dry burning, but also reduces the amount of aerosol generated by a single atomization. When the ratio of the thickness of the ceramic substrate 131 to the pore diameter of the through-hole 1313 is less than 3:1, the aerosol-generating matrix easily flows out of the through-hole 1313, resulting in waste, resulting in a decrease in atomization efficiency and, in turn, a decrease in the total aerosol volume. Preferably, each through-hole array is provided on the ceramic substrate, and the ratio of the center distance of the through-hole to the pore diameter of the through-hole is in the range of 3:1 to 1.5:1. In specific implementation, it can be selected according to actual needs.

[0055] The thickness of the heating film 132 is 200 nm to 5 μm. The material of the heating film 132 is one or more of aluminum or its alloys, copper or its alloys, silver or its alloys, nickel or its alloys, chromium or its alloys, platinum or its alloys, titanium or its alloys, zirconium or its alloys, palladium or its alloys, iron or its alloys, gold or its alloys, molybdenum or its alloys, niobium or its alloys, and tantalum or its alloys. In some examples, the thickness of the heating film 132 is 200 nm to 10 μm. The material of the heating film 132 is one or more of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy. The heating film 132 allows the corresponding through micropores 1313 to be exposed.

[0056] The processing module 120 is configured to control the power supply module 110 to provide energy to the heating element 130 based on a frequency of 20 kHz to 30 MHz when the heating element 130 is heated.

[0057] During the process of the user puffing on the electronic atomizing device, the processing module 120 detects the puffing action through the airflow sensor in the electronic atomizing device. As an embodiment, after detecting the puffing action, the airflow sensor sends information that the electronic atomizing device has been puffed to the processing module 120, or the processing module 120 obtains the detection signal from the airflow sensor and detects whether the electronic atomizing device has been puffed based on the signal detected by the airflow sensor. As another embodiment, the user can also trigger the heating start signal / puff start signal through the physical / virtual button in the electronic atomizing device, so that the processing module 120 detects that the electronic atomizing device has been puffed.

[0058] After detecting that the electronic atomization device is being inhaled, the power supply module 110 is controlled to provide energy to the heating element 130, thereby heating the heating element 130. In the process of controlling the power supply module 110 to provide energy to the heating element 130, the power supply module 110 is controlled to provide energy to the heating element 130 in a high-frequency manner. High frequency means that the pulse frequency of the power supply module 110 is greater than or equal to 20,000 Hz. The human ear's perception range is mostly between 20 Hz and 20 kHz, and high-frequency noise is relatively harsh, especially the sound between 2 kHz and 4 kHz, which makes the user most uncomfortable.

[0059] When the same heating element 130 is used and the control power module 110 is tested at different frequencies, the results are shown in the following table:

[0060] According to test results, the noise is basically very small after exceeding 16 kHz, so the frequency range of the power supply module 110 is controlled by the present application to be 20 kHz to 30 MHz.

[0061] In addition, since a certain degree of un-atomized atomized matrix is ​​mixed in the atomized atomized matrix (i.e., aerosol), when the user inhales, he inhales a gas mixed with the un-atomized atomized matrix and the atomized atomized matrix, which can improve the taste such as sweetness. Therefore, if the frequency is too high, the situation of spraying liquid is basically eliminated, which will affect the taste. After many tests, it was found that after adopting a frequency higher than 100kHz, the taste of some atomized matrices will become lighter. Therefore, the present application preferentially controls the frequency range of the power module 110 to be 20kHz to 100kHz.

[0062] The electronic atomization device includes: a processing module, a power module and a heating element, wherein the heating element includes a ceramic substrate having a plurality of straight micropores extending therethrough; and a processing module configured to control the power module to provide energy to the heating element in a high-frequency manner when the heating element is heated. By using the above-mentioned method, the present application controls the power module to provide energy in a high-frequency manner when the heating element is heated, thereby causing the vibration frequency of the heating element to exceed the normal human perception range, thereby reducing the noise caused by the vibration of the heating element.

[0063] As an embodiment, as shown in Figure 4, the heating element 130 includes a first sub-heating element 1301 and a second sub-heating element 1302. The first sub-heating element 1301 and the second sub-heating element 1302 are both provided with a plurality of straight micropores 1313 that penetrate the ceramic matrix (the straight micropores 1313 on the second sub-heating element 1302 are not shown in the figure). The straight micropores 1313 on the first sub-heating element 1301 and the straight micropores 1313 on the second sub-heating element 1302 can be connected to facilitate the transfer of the atomized matrix from the liquid absorption surface of the second sub-heating element 1302 to the atomization surface of the first sub-heating element 1301.

[0064] Based on the same inventive concept, the embodiments of the present application also provide a control method for an electronic atomization device for implementing the electronic atomization device involved above. The implementation solution provided by this method is similar to the implementation solution described in the above electronic atomization device, so the specific limitations in the control method embodiments of one or more electronic atomization devices provided below can be referred to the limitations of the electronic atomization device above, and will not be repeated here.

[0065] In one embodiment, as shown in FIG5 , the present application provides a control method for an electronic atomization device. The electronic atomization device includes a heating element and a power module. The ceramic substrate of the heating element is provided with a plurality of through micropores penetrating the ceramic substrate. Based on the above embodiment, the method includes:

[0066] Step 510 : When the heating element is heated, the power supply module is controlled to provide energy to the heating element based on a frequency of 20 kHz to 30 MHz.

[0067] The execution process of each step in this implementation can refer to the above embodiment and will not be repeated here.

[0068] The control method of the above-mentioned electronic atomization device controls the power module to provide energy in a high-frequency manner when the heating element is heated, so that the vibration frequency of the heating element exceeds the normal perception range of humans, thereby reducing the noise caused by the vibration of the heating element.

[0069] As an embodiment, the control power module provides energy to the heating element based on a frequency of 20kHz to 30MHz, including:

[0070] The control power module provides energy to the heating element based on a frequency of 20kHz to 100kHz.

[0071] As an embodiment, the thickness of the ceramic substrate ranges from 0.1 mm to 2 mm, and the diameter of the through micropores ranges from 1 um to 100 um.

[0072] As an embodiment, the thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm, and the diameter of the through micropores ranges from 10 um to 50 um.

[0073] As an embodiment, the ratio of the thickness of the ceramic substrate to the pore diameter of the through micropores ranges from 50:1 to 3:1.

[0074] As an embodiment, each through micro-hole array is provided on a ceramic substrate, and the ratio of the hole center distance to the hole diameter of the through micro-holes ranges from 3:1 to 1.5:1.

[0075] As an embodiment, the heating element includes a first sub-heating element and a second sub-heating element. The first sub-heating element and the second sub-heating element are both provided with multiple straight micropores passing through the ceramic matrix. The straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

[0076] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0077] Based on the same inventive concept, the embodiments of the present application also provide a control device for an electronic atomizing device for implementing the control method of the electronic atomizing device involved above. The implementation solution provided by the device is similar to the implementation solution described in the control method of the electronic atomizing device described above. Therefore, the specific limitations of the control device embodiments of one or more electronic atomizing devices provided below can be referred to the limitations of the control method of the electronic atomizing device described above, and will not be repeated here.

[0078] In one embodiment, as shown in FIG6 , a control device for an electronic atomization device is provided. The electronic atomization device includes a heating element and a power module. A ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate, including:

[0079] The control module 610 is used to control the power supply module to provide energy to the heating element based on a frequency of 20kHz to 30MHz when the heating element is heated.

[0080] As an embodiment, the control module 610 is used to control the power supply module to provide energy to the heating element based on a frequency of 20 kHz to 100 kHz.

[0081] As an embodiment, the thickness of the ceramic substrate ranges from 0.1 mm to 2 mm, and the diameter of the through micropores ranges from 1 um to 100 um.

[0082] As an embodiment, the thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm, and the diameter of the through micropores ranges from 10 um to 50 um.

[0083] As an embodiment, the ratio of the thickness of the ceramic substrate to the pore diameter of the through micropores ranges from 50:1 to 3:1.

[0084] As an embodiment, each through micro-hole array is arranged on a ceramic substrate, and the ratio of the center distance of the through micro-holes to the hole diameter is in the range of 3:1 to 1.5:1.

[0085] As an embodiment, the heating element includes a first sub-heating element and a second sub-heating element. The first sub-heating element and the second sub-heating element are both provided with multiple straight micropores passing through the ceramic matrix. The straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

[0086] Each module in the control device of the above-mentioned electronic atomization device can be implemented in whole or in part by software, hardware, or a combination thereof. The above-mentioned modules can be embedded in or independent of the processing module in the computer device in hardware form (that is, the control module 610 is equivalent to the processing module 120), or can be stored in the memory of the computer device in software form, so that the processing module can call and execute the corresponding operations of each of the above modules.

[0087] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps of the control method of the electronic atomization device described in any of the above embodiments are implemented.

[0088] The execution process of each step in this implementation can refer to the above embodiment and will not be repeated here.

[0089] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processing modules involved in the various embodiments provided herein may be, but are not limited to, general processing modules, central processing modules, graphics processing modules, digital signal processing modules, programmable logic devices, data processing logic devices based on quantum computing, and the like.

[0090] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An electronic atomization device, comprising: A heating element, the heating element comprising a ceramic substrate, the ceramic substrate being provided with a plurality of straight micropores penetrating the ceramic substrate; Power module; as well as A processing module is used to control the power supply module to provide energy to the heating element based on a frequency of 20kHz to 30MHz when the heating element is heated.

2. The electronic atomization device according to claim 1, wherein: The processing module is further used to control the power supply module to provide energy to the heating element based on a frequency greater than or equal to 32 kHz.

3. The electronic atomization device according to claim 1 or 2, wherein: The processing module is further used to control the power supply module to provide energy to the heating element based on a frequency less than or equal to 100 kHz.

4. The electronic atomization device according to claim 1, wherein: The thickness of the ceramic substrate ranges from 0.1 mm to 2 mm.

5. The electronic atomization device according to claim 1 or 4, wherein: The through micropores have a pore size range of 1 um to 100 um.

6. The electronic atomization device according to claim 1, wherein: The thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm.

7. The electronic atomization device according to claim 1 or 6, wherein: The pore size of the through micropores ranges from 10um to 50um.

8. The electronic atomization device according to claim 1, wherein: The ratio of the thickness of the ceramic substrate to the pore size of the through micropores is in the range of 50:1 to 3:

1.

9. The electronic atomization device according to claim 1, wherein: Each of the through micropore arrays is arranged on the ceramic substrate, and the ratio of the hole center distance of the through micropores to the hole diameter is in the range of 3:1 to 1.5:

1.

10. The electronic atomization device according to claim 1, wherein: The heating element includes a first sub-heating element and a second sub-heating element. The first sub-heating element and the second sub-heating element are both provided with a plurality of straight micropores penetrating the ceramic substrate. The straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

11. A control method for an electronic atomization device, the electronic atomization device comprising a heating element and a power module, a ceramic substrate of the heating element being provided with a plurality of straight micro-holes penetrating the ceramic substrate, the method comprising: When the heating element is heated, the power module is controlled to provide energy to the heating element based on a frequency of 20 kHz to 30 MHz.

12. The method according to claim 11, wherein: The controlling the power module to provide energy to the heating element based on a frequency of 20kHz to 30MHz includes: The power module is controlled to provide energy to the heating element based on a frequency greater than or equal to 32 kHz.

13. The method according to claim 11 or 12, wherein: The controlling the power module to provide energy to the heating element based on a frequency of 20kHz to 30MHz includes: The power module is controlled to provide energy to the heating element based on a frequency less than or equal to 100 kHz.

14. A control device for an electronic atomization device, the electronic atomization device comprising a heating element and a power module, a ceramic substrate of the heating element being provided with a plurality of straight micro-holes penetrating the ceramic substrate, the device comprising: The control module is used to control the power supply module to provide energy to the heating element based on a frequency of 20kHz to 30MHz when the heating element is heated.

15. The control device according to claim 14, wherein: The control module is further used to control the power module to provide energy to the heating element based on a frequency less than or equal to 100 kHz when the heating element is heated.

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