Display device, tiled display device, and picture adjusting method

Abstract

The present application relates to the technical field of display, and provides a display device, a tiled display device, and a picture adjusting method. The display device comprises a display panel, a backlight module, and a plurality of light-emitting devices, and the display panel is located on a light exit side of the backlight module; the plurality of light-emitting devices are arranged on at least one side surface of the peripheral side of the display panel; and the orthographic projection of each light-emitting device on the light exit surface of the backlight module does not overlap with the orthographic projection of the display panel on the light exit surface of the backlight module. The display device can be used for manufacturing a tiled display device having "no tiling seam".

Description

Display device, spliced ​​display device and image adjustment method

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on June 30, 2023, with application number 202310800859.X and titled “A display device, spliced ​​display device and picture adjustment method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of display technology, and in particular to a display device, a spliced ​​display device, and a picture adjustment method. Background Art

[0004] With the development of technology, the application of spliced ​​display devices is becoming more and more widespread. A spliced ​​display device is usually composed of multiple independent display devices, each of which includes a display panel and a backlight module.

[0005] However, a black border exists at the seam of a spliced ​​display device, reducing the display quality. The seam width is a key physical parameter of a spliced ​​display device. To reduce the seam width, the borders of spliced ​​display devices have been gradually reduced from 2mm to 0.88mm. However, due to current process limitations, further reducing the seam is difficult to achieve.

[0006] Summary of the Invention

[0007] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0008] In a first aspect, an embodiment of the present application provides a display device, comprising:

[0009] A display panel, the display panel comprising a display area and a peripheral area surrounding the display area;

[0010] a backlight module electrically connected to the display panel, wherein the display panel is located on the light-emitting side of the backlight module;

[0011] A plurality of light emitting devices are arranged on at least one side surface of the peripheral side of the display panel; the orthographic projections of the light emitting devices on the light emitting surface of the backlight module and the orthographic projections of the display panel on the light emitting surface of the backlight module do not overlap with each other.

[0012] In at least one embodiment of the present application, the display panel includes a first side surface, and the first side surface intersects with the light emitting surface of the display panel;

[0013] The display device includes multiple first conductive pad groups, the first conductive pad groups are arranged on the first side surface, and the light-emitting device is located on a side of the first conductive pad group away from the first side surface; one first conductive pad group includes at least two conductive pads, and one light-emitting device is electrically connected to each conductive pad in the same first conductive pad group.

[0014] In at least one embodiment of the present application, the display panel includes an array substrate and a color filter substrate that are oppositely arranged, and the first side surface includes a first area located on the array substrate and a second area located on the color filter substrate;

[0015] The light emitting device and the first conductive pad group are arranged in the first area, and / or the light emitting device and the first conductive pad group are arranged in the second area.

[0016] In at least one embodiment of the present application, the peripheral area includes a binding sub-area, the binding sub-area includes a second side surface, and the second side surface intersects with the light emitting surface of the display panel;

[0017] The display device includes multiple second conductive pad groups, each of which includes at least one conductive pad. The second conductive pad group is arranged on the second side surface. The display panel includes an array substrate and a color filter substrate arranged opposite to each other. The second conductive pad group is electrically connected to the driving circuit on the array substrate.

[0018] In at least one embodiment of the present application, the second side surface includes a third area located on the array substrate and a fourth area located on the color filter substrate;

[0019] The second conductive pad group is disposed in the third area, and / or the second conductive pad group is disposed in the fourth area.

[0020] In at least one embodiment of the present application, the plurality of light-emitting devices include a first light-emitting device, a second light-emitting device, and a third light-emitting device, and the first light-emitting device, the second light-emitting device, and the third light-emitting device emit different colors;

[0021] Among them, one first light-emitting device, one second light-emitting device and one third light-emitting device are packaged into a light-emitting unit, and the light-emitting unit extends from the area of ​​the first side located on the array substrate to the area of ​​the first side located on the color filter substrate.

[0022] In at least one embodiment of the present application, the planar size of each conductive pad in the second conductive pad group is larger than the planar size of each conductive pad in the first conductive pad group, and the conductive pads in the second conductive pad group extend from the area of ​​the second side located on the array substrate to the area of ​​the second side located on the color film substrate.

[0023] In at least one embodiment of the present application, the first side surface and the second side surface are the same side surface, and at least one second conductive pad group is provided in the area between two adjacent light-emitting units;

[0024] The display device further includes a chip-on-film (CFO), which covers the second conductive pad group and extends to a side surface of the backlight module, and an orthographic projection of the CFO on the first side surface does not overlap with an orthographic projection of the light-emitting unit on the first side surface;

[0025] The first conductive pad group is electrically connected to the chip-on-film, and the second conductive pad group is bound to the chip-on-film.

[0026] In at least one embodiment of the present application, the first conductive pad group includes a positive conductive pad and a negative conductive pad, the light-emitting unit includes a first pin, a second pin, a third pin, and a fourth pin, the positive conductive pads of the first light-emitting device, the second light-emitting device, and the third light-emitting device are all electrically connected to the first pin, the negative conductive pad of the first light-emitting device is electrically connected to the second pin, the negative conductive pad of the second light-emitting device is electrically connected to the third pin, and the negative conductive pad of the third light-emitting device is electrically connected to the fourth pin;

[0027] The chip-on-film covers at least a portion of the first pin, the second pin, the third pin, and the fourth pin, and the chip-on-film is bound to the first pin, the second pin, the third pin, and the fourth pin respectively.

[0028] In at least one embodiment of the present application, the first side surface and the second side surface are different sides, and the display device further includes a chip-on-film (COF), which covers the second conductive pad group and extends to a side surface of the backlight module;

[0029] The portion of the array substrate located in the peripheral area further includes a plurality of binding wires. The first conductive pad group is electrically connected to the COF through the binding wires, and the second conductive pad group is bound to the COF.

[0030] In at least one embodiment of the present application, the display device further includes at least one circuit board and at least one L-shaped protective plate, the circuit board being electrically connected to the chip-on-film, and the circuit board and the chip-on-film being disposed on the same side of the backlight module, and the circuit board being electrically connected to the backlight module; the circuit board being configured to simultaneously drive the display panel and the light-emitting device;

[0031] A portion of the protection plate is disposed on a side of the circuit board away from the backlight module, and another portion of the protection plate is disposed on a side of the circuit board away from the COF.

[0032] In at least one embodiment of the present application, the display panel further includes at least one third side surface in addition to the first side surface, and the portion of the third side surface located on the color film substrate is provided with a reflective surface, the angle between the reflective surface and the reference surface is an acute angle, and the reference surface is a plane perpendicular to the light emitting surface of the display panel.

[0033] In at least one embodiment of the present application, the acute angle has an angle range greater than 0° and less than or equal to 30°.

[0034] In at least one embodiment of the present application, the display device further includes a reflective portion, and the reflective portion covers the reflective surface.

[0035] In at least one embodiment of the present application, the light emitting device has a light emitting angle ranging from 30° to 60°.

[0036] In at least one embodiment of the present application, the display device further includes a buffer layer and a plurality of encapsulation parts, the encapsulation part at least covers the light-emitting surface of the light-emitting device, the buffer layer covers the side surface of the display panel on which the light-emitting device is arranged, the buffer layer includes a plurality of openings, and the light-emitting device is arranged in the openings.

[0037] In a second aspect, an embodiment of the present application provides a spliced ​​display device, comprising at least a first display device and a second display device, wherein the first display device and the second display device are both the display devices described in any one of the first aspects;

[0038] The first display device includes a first splicing edge, the second display device includes a second splicing edge, the first splicing edge and the second splicing edge are spliced ​​together; a plurality of the light-emitting devices are arranged on the side of the area where the first splicing edge or the second splicing edge is located.

[0039] In at least one embodiment of the present application, a plurality of the light-emitting devices are provided on a side surface of an area where one of the first splicing edge and the second splicing edge is located, and a reflective surface is provided on a side surface of an area where the other one of the first splicing edge and the second splicing edge is located.

[0040] In at least one embodiment of the present application, the splicing display device further includes a dimming layer and a light-transmitting protective layer, the dimming layer having a curved light-emitting surface, the dimming layer including a light-transmitting material and diffusion particles; the dimming layer is located in the area between the first splicing edge and the second splicing edge, and covers the light-emitting device and the reflective surface; the light-transmitting protective layer covers the dimming layer.

[0041] In at least one embodiment of the present application, a light-shielding layer is provided on an area of ​​the color filter substrate of the first display device close to the first splicing edge and an area of ​​the color filter substrate of the second display device close to the second splicing edge, and the light-shielding layer is configured to block light from the light-emitting device.

[0042] In a third aspect, an embodiment of the present application provides a picture adjustment method, applied to the spliced ​​display device according to any one of the second aspects, the method comprising:

[0043] respectively acquiring brightness data and chromaticity data of the display panel and the light-emitting device under preset conditions; the preset conditions including pure images of the same grayscale or the same color;

[0044] Comparing and calculating the difference in luminance data and chromaticity data of the display panel and the light-emitting device under the same conditions;

[0045] The driving voltage of the display panel and the driving voltage of the light emitting device are adjusted according to the difference of the brightness data and the difference of the chromaticity data.

[0046] In at least one embodiment of the present application, the step of adjusting the driving voltage of the display panel and the driving voltage of the light-emitting device according to the difference in the brightness data and the difference in the chromaticity data includes:

[0047] forming a coded file according to the difference of the luminance data and the difference of the chrominance data;

[0048] Storing the encoding file in a timing controller of a circuit board;

[0049] The timing controller generates a first driving voltage and a second driving voltage according to the coding file; the first driving voltage is configured to drive the display panel, and the second driving voltage is configured to drive the light emitting device.

[0050] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0052] 1 to 5B are schematic structural diagrams of six display devices provided in embodiments of the present application;

[0053] 6 to 8 are schematic diagrams showing arrangements of three light-emitting devices on a first side surface according to embodiments of the present application;

[0054] 9-11 are schematic diagrams showing the distribution positions of the second conductive pad group on the second side surface according to an embodiment of the present application;

[0055] 12-13 are schematic diagrams of two arrangements of the light-emitting unit and the second conductive pad group provided in an embodiment of the present application when they are arranged on the same side of the display panel;

[0056] 14-15 are schematic diagrams of two positional relationships among the chip-on-film, the light-emitting unit, and the second conductive pad according to an embodiment of the present application;

[0057] FIG16 is a schematic diagram of an equivalent circuit of a light-emitting unit provided in an embodiment of the present application;

[0058] 17-18 are schematic structural diagrams of two display devices provided in embodiments of the present application;

[0059] Figures 19, 20, 21A, and 22A are schematic structural diagrams of four splicing display devices provided in embodiments of the present application;

[0060] FIG21B is a diagram illustrating the light emitting angle of the light emitting device at the joint position in the splicing display device shown in FIG21A;

[0061] FIG22B is a diagram illustrating the light emitting angle of the light emitting device at the seam position in the spliced ​​display device shown in FIG22A;

[0062] Figure 23 (1) and Figure 23 (2) are schematic structural diagrams of a preparation process of a second conductive pad set provided in an embodiment of the present application;

[0063] Figure 24 (1), Figure 24 (2) and Figure 24 (3) are schematic structural diagrams of another preparation process of the second conductive pad group provided in an embodiment of the present application;

[0064] FIG25 is a schematic diagram of a configuration of a buffer layer in a display device according to an embodiment of the present application;

[0065] FIG26 is a schematic diagram of a configuration of a light-transmitting protective layer in a spliced ​​display device provided by an embodiment of the present application;

[0066] FIG27 is a flowchart of a method for adjusting an image of a spliced ​​display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0067] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0068] In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings represent the same or similar structures, and their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application and are not necessarily drawn to scale.

[0069] In the embodiments of the present application, words such as "first", "second", "third", and "fourth" are used to distinguish between identical or similar items with basically the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present application, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0070] In the embodiments of the present application, the terms "upper" and "lower" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0071] Throughout the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present application. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0072] In the embodiments of the present application, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0073] The features "parallel," "perpendicular," and "identical" used in the embodiments of the present application include features such as "parallel," "perpendicular," and "identical" in the strict sense, as well as "approximately parallel," "approximately perpendicular," and "approximately identical" that include certain tolerances, taking into account the measurement and tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), and represent within an acceptable range of deviation for a particular value determined by a person of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the stated value.

[0074] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, that is, meaning "including, but not limited to."

[0075] In the embodiments of this application, "same layer" refers to the relationship between multiple film layers formed from the same material after the same step (e.g., a one-step patterning process). "Same layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same. Polygons in this specification are not strictly defined and can be approximate triangles, parallelograms, trapezoids, pentagons, or hexagons, etc., and some small deformations due to tolerances may exist.

[0076] In the embodiments of the present application, the term “electrically connected” may refer to a direct electrical connection between two components, or may refer to an electrical connection between two components via one or more other components.

[0077] With the development of technology, the application of spliced ​​display devices is becoming more and more widespread. Spliced ​​display devices are usually composed of multiple independent display devices, each of which includes a display panel and a backlight module. However, there is a black border at the splicing position of the spliced ​​display device, which reduces the display effect of the spliced ​​display device. Among them, the splicing seam width is an important physical parameter of the splicing display device. In order to reduce the splicing seam width, the border of the splicing display device has been gradually reduced from 2mm to 0.88mm. However, due to the limitations of existing processes, it is difficult to further reduce the splicing seam.

[0078] Based on this, an embodiment of the present application provides a display device, which includes a display panel, a backlight module, and a plurality of light-emitting devices. The display panel is located on the light-emitting side of the backlight module and is electrically connected to the display panel. The plurality of light-emitting devices are arranged on at least one side of the peripheral side of the display panel. The orthographic projection of the light-emitting device on the light-emitting surface of the backlight module and the orthographic projection of the display panel on the light-emitting surface of the backlight module do not overlap. By arranging a plurality of light-emitting devices on at least one side of the display panel, when the display device is used as a spliced ​​display device, the side on which the plurality of light-emitting devices are arranged is spliced ​​with another display device. At this time, the plurality of light-emitting devices arranged at the splicing position can realize the display of the picture, which is conducive to the preparation of a "zero-seam" splicing display device.

[0079] The display device and the spliced ​​display device provided by the embodiments of the present application will be specifically introduced and described below with reference to the accompanying drawings.

[0080] An embodiment of the present application provides a display device, as shown in FIG18 , comprising:

[0081] The display panel 100 includes a display area and a peripheral area surrounding the display area;

[0082] The backlight module 200 is electrically connected to the display panel 100 , and the display panel 100 is located on the light-emitting side of the backlight module 200 ;

[0083] A plurality of light emitting devices Q are arranged on at least one side surface of the peripheral side of the display panel 100; the orthographic projection of the light emitting device Q on the light emitting surface of the backlight module 200 does not overlap with the orthographic projection of the display panel 100 on the light emitting surface of the backlight module 200.

[0084] In an exemplary embodiment, the display panel 100 may be a liquid crystal display panel (LCD). Exemplarily, the liquid crystal display panel may include a twisted nematic (TN) type, a vertical alignment (VA) type, an in-plane switching (IPS) type, and an advanced super-dimensional switch (ADS) type.

[0085] The liquid crystal display panel may include an array substrate 101 and a color filter substrate 102, with a liquid crystal layer LC (not drawn in the figure) located between the array substrate 101 and the color filter substrate 102; and further includes a first polarizer 103 and a second polarizer 104 located on both sides of the array substrate 101 and the color filter substrate 102 respectively.

[0086] The array substrate 101 and the color filter substrate 102 each include a substrate, and the specific material of the substrate is not limited here. For example, the substrate can be any one of silicon, glass, quartz, PET, etc.

[0087] The structures and components included in the array substrate 101 and the color filter substrate 102 of the display panel 100 are not limited here, and can be specifically determined according to the design of the product.

[0088] The active area (AA) is an area used for display, and the peripheral area surrounding the active area AA is used for wiring and binding circuit boards.

[0089] The backlight module 200 is used to provide a light source with sufficient brightness and uniform brightness distribution to the display device. The specific structure of the backlight module 200 and the type of the light source in the backlight module 200 are not limited here.

[0090] For example, as shown in FIG17 , the light-emitting body 208 (light source) in the backlight module 200 may be a light-emitting diode (LED), a sub-millimeter light-emitting diode (Mini Light Emitting Diode, Mini LED) or a micro light-emitting diode (Micro Light Emitting Diode, Micro LED).

[0091] Exemplarily, as shown in FIG17 , the light-emitting body 208 is disposed on the lamp board 205 , and a first reflective layer 207 is further disposed on the lamp board 205 . The first reflective layer 207 is provided with an opening, and the light-emitting body 208 is disposed in the opening of the first reflective layer 207 .

[0092] Exemplarily, the backlight module 200 may also include a back panel 204 as shown in Figure 17, a lamp board 205 fixed to the back panel 204 by a first adhesive layer 206, a middle frame 203 arranged around the light source, one side of the middle frame 203 is fixed to the lamp board 205, and the other side of the middle frame 203 is fixed to the optical film layer 201 by a second adhesive layer 202, wherein the inner side of the middle frame 203 is covered with a second reflective layer 210 to reflect the light emitted by the light-emitting body 208 onto the optical film layer 201 as much as possible, and a corner block 209 is provided on the middle frame 203 to increase the supporting strength of the middle frame 203.

[0093] It should be noted that the optical film layer 201 may include multiple sub-layers, such as a diffuser plate, a quantum dot film, a diffuser sheet, and a composite film. The diffuser plate may be made of any one of glass, polystyrene (PS), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), and acrylic (PMMA). Quantum dot film (QD Enhancement Film, abbreviated as QDEF) is a film formed by uniformly mixing quantum dot phosphor with a polymer. For example, the material of the quantum dot film may include perovskite quantum dot material, and its thickness is generally around 100 μm. The material of the diffuser sheet may be the same as that of the diffuser plate. The composite film, while improving light efficiency, also serves as a protective film for the diffuser plate, quantum dot film, and diffuser sheet, protecting them from scratches or damage.

[0094] In addition, an adhesive layer may be provided between the optical film layer 201 and the display panel 100 for fixing. The adhesive layer is not shown in FIG17 , and for details, reference may be made to the introduction in the related art.

[0095] The backlight module 200 may further include other structures and components. The specific structures and components included in the backlight module 200 may be referred to the introduction in the related art and will not be described in detail here.

[0096] Taking the planar shape of the display panel 100 as an example, the display panel 100 has four side surfaces, and the plurality of light-emitting devices Q are arranged on at least one side surface of the peripheral side of the display panel 100, including but not limited to the following situations:

[0097] First, a plurality of light emitting devices Q are disposed on one side surface of the peripheral side of the display panel 100 .

[0098] Second, multiple light-emitting devices Q are arranged on two side surfaces of the peripheral side of the display panel 100. For example, multiple light-emitting devices Q are arranged on two adjacent side surfaces (i.e., two connected side surfaces) of the peripheral side of the display panel 100; for another example, multiple light-emitting devices Q are arranged on two opposite side surfaces (i.e., two side surfaces that are approximately parallel to each other) of the peripheral side of the display panel 100.

[0099] Third, the plurality of light emitting devices Q are disposed on three side surfaces of the peripheral side of the display panel 100 , that is, the plurality of light emitting devices Q are disposed on three connected side surfaces of the peripheral side of the display panel 100 .

[0100] Fourth, a plurality of light emitting devices Q are disposed on four side surfaces of the peripheral side of the display panel 100 , that is, a plurality of light emitting devices Q are disposed on each side surface of the peripheral side of the display panel 100 .

[0101] The type of the light-emitting device Q is not limited here. For example, the light-emitting device Q can be a sub-millimeter light-emitting diode (Mini Light Emitting Diode, abbreviated as Mini LED in English) or a micro light-emitting diode (Micro Light Emitting Diode, abbreviated as Micro LED in English).

[0102] In some embodiments, the multiple light-emitting devices Q disposed on the side of the display panel 100 can all emit a single color of light, for example, white light; or, alternatively, blue light. In this case, the multiple light-emitting devices Q can serve as light sources, requiring a color conversion layer to achieve display. The color conversion layer can include a color filter layer and a quantum dot layer of different colors. For a detailed description of the color conversion layer, please refer to the relevant art.

[0103] In some embodiments, the multiple light-emitting devices Q arranged on the side of the display panel 100 may include light-emitting devices that emit light of different colors, such as three light-emitting devices that emit red light, green light and blue light. In this case, the multiple light-emitting devices Q can be directly used for display.

[0104] The light emitting surface of the backlight module 200 mentioned above refers to the surface from which light in the backlight module 200 is emitted. The light emitting surface of the display panel 100 and the light emitting surface of the light emitting device Q mentioned below have similar meanings to this and will not be repeated here.

[0105] The light emitting surface includes a flat surface and a curved surface, which is specifically related to the structure of the main body emitting the light and is not limited here.

[0106] It should be noted that the above-mentioned "orthographic projection of the light-emitting device Q on the light-emitting surface of the backlight module 200" refers to the orthographic projection of the light-emitting device Q on the extended plane of the light-emitting surface of the backlight module 200. It can be understood that the light-emitting surface of the backlight module 200 and the extended plane of its light-emitting surface are coplanar.

[0107] In the display device provided in the embodiment of the present application, a plurality of light-emitting devices Q are arranged on at least one side of the display panel 100. When the display device is used as a spliced ​​display device, the side on which the plurality of light-emitting devices Q are arranged is spliced ​​with another display device. At this time, the plurality of light-emitting devices Q arranged at the splicing position can realize the display of the picture, which is conducive to the preparation of a "zero-seam" splicing display device.

[0108] In at least one embodiment of the present application, as shown in FIG1 to FIG4 , FIG5A and FIG5B , the display panel includes a first side surface CM1 , and the first side surface CM1 intersects with the light emitting surface of the display panel;

[0109] The display device includes multiple first conductive pad groups D1, the first conductive pad group D1 is arranged on the first side CM1, and the light-emitting device Q is located on the side of the first conductive pad group D1 away from the first side CM1; one first conductive pad group D1 includes at least two conductive pads (for example, a positive conductive pad electrically connected to the positive electrode of the light-emitting device Q and a negative conductive pad electrically connected to the negative electrode of the light-emitting device Q), and one light-emitting device Q is electrically connected to each conductive pad in the same first conductive pad group D1.

[0110] For example, the conductive pads in the first conductive pad group D1 may be pads electrically connected to the light emitting device Q.

[0111] Exemplarily, the conductive pads in the first conductive pad group D1 may be pins of the light emitting device Q.

[0112] In an exemplary embodiment, when each light-emitting device Q is independently packaged, the conductive pads in the first conductive pad group D1 are solder pads, which are located outside the packaging structure and electrically connected to the light-emitting device Q.

[0113] In an exemplary embodiment, when multiple light-emitting devices Q of different colors are packaged together to form a light-emitting unit P, the conductive pads in the first conductive pad group D1 serve as pins for each light-emitting device Q in the light-emitting unit P, and each pin is located within the packaging structure of the light-emitting unit P. The details of packaging multiple light-emitting devices Q of different colors together to form a light-emitting unit P can be found in the following description.

[0114] It should be noted that in the drawings provided in the embodiments of the present application, the structure of each conductive pad in the first conductive pad group D1 is not drawn, but the conductive pads in the first conductive pad group D1 are simplified as a whole. In actual applications, the conductive pads in the same first conductive pad group D1 are independently arranged, and there is a gap between the conductive pads.

[0115] In at least one embodiment of the present application, as shown in Figures 1 to 4, 5A and 5B, the display panel 100 includes an array substrate 101 and a color filter substrate 102 arranged opposite to each other, and the first side surface CM1 includes a first area Area1 located on the array substrate 101 and a second area Area2 located on the color filter substrate 102; the light-emitting device Q and the first conductive pad group D1 are arranged in the first area, and / or the light-emitting device Q and the first conductive pad group D1 are arranged in the second area.

[0116] The light emitting device Q and the first conductive pad group D1 are arranged in the first area Area1, and / or the light emitting device Q and the first conductive pad group D1 are arranged in the second area Area2, including the following situations:

[0117] First, as shown in FIG. 4 , the light emitting device Q and the first conductive pad group D1 are disposed in the first area Area1 (the portion where the first side surface CM1 is located on the array substrate 101 ).

[0118] Second, as shown in FIG. 2 , the light emitting device Q and the first conductive pad group D1 are disposed in the second area Area2 (the portion where the first side surface CM1 is located on the color filter substrate 102 ).

[0119] Third, as shown in Figures 1, 5A, 5B, 6, 7 and 8, some light-emitting devices Q and the first conductive pad group D1 are arranged in the first area Area1 (the first side surface CM1 is located on the array substrate 101), and some light-emitting devices Q and the first conductive pad group D1 are arranged in the second area Area2 (the first side surface CM1 is located on the color filter substrate 102).

[0120] Fourth, as shown in Figure 3, part of the structure of the light-emitting device Q and part of the structure of the first conductive pad group D1 are arranged in the first area Area1 (the first side surface CM1 is located on the portion of the array substrate 101), and part of the structure of the light-emitting device Q and part of the structure of the first conductive pad group D1 are arranged in the second area Area2 (the first side surface CM1 is located on the portion of the color filter substrate 102).

[0121] The arrangement of the plurality of light emitting devices Q on the first side surface CM1 is not limited here.

[0122] In an exemplary embodiment, when the display device is applied to a spliced ​​display device, in order to improve the display effect at the splicing position and improve the stability of the fixation of the light-emitting device Q on the first side surface CM1, the light-emitting device Q can be distributed as evenly as possible on the first side surface CM1 of the display panel 100.

[0123] Exemplarily, the plurality of light emitting devices Q include a first light emitting device Q1, a second light emitting device Q2 and a third light emitting device Q3 emitting different colors. FIG6 , FIG7 and FIG8 respectively provide arrangements of the plurality of light emitting devices Q on the first side surface CM1.

[0124] In at least one embodiment of the present application, as shown in Figures 5A and 5B, the peripheral area includes a binding sub-area, the binding sub-area includes a second side surface CM2, and the second side surface CM2 intersects with the light-emitting surface of the display panel; the display device includes a plurality of second conductive pad groups D2, the second conductive pad group D2 includes at least one conductive pad, the second conductive pad group D2 is arranged on the second side surface CM2, and the second conductive pad group D2 is electrically connected to the driving circuit on the array substrate 101.

[0125] Illustratively, there are gaps between the conductive pads included in the second conductive pad group D2, and there are also gaps between two adjacent second conductive pad groups D2 to avoid short circuits.

[0126] It should be noted that, in the embodiments of the present application, the second conductive pad group D2 is taken as an example to illustrate and draw the drawings.

[0127] The specific material of the conductive pads included in the second conductive pad group D2 is not limited here. Exemplarily, the material of the conductive pads included in the second conductive pad group D2 includes metal, such as silver (Ag); specifically, it can be a glue or glue containing silver particles (Ag Ink).

[0128] The binding sub-area is used to set a flexible circuit board (FPC), and the flexible circuit board and the second conductive pad group D2 electrically connect the driving circuit and the circuit board in the array substrate 101 of the display panel 100. The circuit board is used to provide a driving signal to the display device.

[0129] Specifically, the driving circuit in the array substrate 101 is electrically connected to the circuit board 2 through the second conductive pad group D2 and the flexible circuit board FPC in sequence; that is, the driving circuit is electrically connected to the second conductive pad group D2 through the wire L1, the second conductive pad group D2 is electrically connected to the flexible circuit board FPC, and the flexible circuit board FPC is electrically connected to the circuit board 2 (driving circuit board).

[0130] It should be noted that the first side surface CM1 of the display panel 100 mentioned above is also located in the peripheral area of ​​the display panel 100 (not shown in the figure), wherein it is not specified in the above description whether the first side surface CM1 is set in the binding sub-area.

[0131] In some embodiments, the first side surface CM1 can be set in an area of ​​the peripheral area except for the binding sub-area. In this case, the first side surface CM1 can be set adjacent to (connected to) the second side surface CM2; or, the first side surface CM1 can be set opposite to the second side surface CM2 (the two are roughly parallel).

[0132] In some embodiments, the first side surface CM1 can be disposed in the binding sub-region. In this case, the first side surface CM1 and the second side surface CM2 are the same side surface, i.e., the first conductive pad group D1 and the second conductive pad group D2 are disposed on the same side surface of the display panel 100 without any overlap. The light-emitting devices Q are located on a side of the first conductive pad group D1 away from the first side surface, and are electrically connected to the first conductive pad group D1. The distribution of the first conductive pad group D1 and the second conductive pad group D2 is not limited herein and can be determined based on the arrangement of the light-emitting devices Q and the placement of the second conductive pad group D2 and the conductive line L1 of the drive circuit on the array substrate 101.

[0133] In at least one embodiment of the present application, as shown in Figures 9, 10 and 11, the second side surface CM2 includes a third area Area3 located on the array substrate 101 and a fourth area Area4 located on the color filter substrate 102; the second conductive pad group D2 is arranged in the third area Area3, and / or the second conductive pad group D2 is arranged in the fourth area Area4.

[0134] The second conductive pad group D2 is disposed in the third area Area3, and / or the second conductive pad group D2 is disposed in the fourth area Area4, including but not limited to the following situations:

[0135] First, as shown in FIG9 , the second conductive pad group D2 is disposed in the third area Area3 (the second side surface CM2 is located in a partial area of ​​the array substrate 101 );

[0136] Second, as shown in FIG. 10 , the second conductive pad group D2 is disposed in the fourth area Area4 (the second side surface CM2 is located in a partial area of ​​the color filter substrate 102 );

[0137] Third, as shown in FIG. 11 , a portion of the second conductive pad set D2 is disposed in the third area Area 3 , and another portion of the second conductive pad set D2 is disposed in the fourth area Area 4 .

[0138] It should be noted that, in actual applications, when the second conductive pad group D2 and the first conductive pad group D1 are arranged on different sides of the display panel 100, the second conductive pad group D2 can be arranged in the third area Area 3 or the fourth area Area 4 according to the design space and the position of the wire L1 of the driving circuit on the array substrate 101.

[0139] When the first conductive pad group D1 and the second conductive pad group D2 are arranged on the same side of the display panel 100, the first area Area1 and the third area Area3 are the same area, and the second area Area2 and the fourth area Area4 are the same area. At this time, while considering the position of the second conductive pad group D2 and the conductive line L1 of the driving circuit on the array substrate 101, it is also necessary to avoid the design position of the first conductive pad group D1 and the light-emitting device Q. Therefore, based on the above two factors, it can be determined that the second conductive pad group D2 is arranged in the third area Area3 or the fourth area Area4.

[0140] Exemplarily, when the first conductive pad group D1 and the second conductive pad group D2 are disposed on the same side of the display panel 100 , the orthographic projection of the second conductive pad group D2 on the first side does not overlap with the orthographic projection of the light emitting device Q on the first side.

[0141] In at least one embodiment of the present application, the plurality of light-emitting devices Q include a first light-emitting device Q1, a second light-emitting device Q2, and a third light-emitting device Q3, and the first light-emitting device Q1, the second light-emitting device Q2, and the third light-emitting device Q3 emit different colors;

[0142] In an exemplary embodiment, one of the first light emitting device Q1 , the second light emitting device Q2 , and the third light emitting device Q3 is a red light emitting device, another is a green light emitting device, and another is a blue light emitting device.

[0143] For example, the first light emitting device Q1 may be a red light emitting device, the second light emitting device Q2 may be a green light emitting device, and the third light emitting device Q3 may be a blue light emitting device.

[0144] As shown in Figures 12 to 15 , a first light-emitting device Q1, a second light-emitting device Q2, and a third light-emitting device Q3 are packaged into a light-emitting unit P, and the light-emitting unit P extends from the area where the first side surface CM1 is located on the array substrate 101 to the area where the first side surface CM1 is located on the color filter substrate 102.

[0145] The packaging method of the light emitting unit P is not limited here.

[0146] In some embodiments, the light-emitting devices Q in the same light-emitting unit P may share a packaging film layer, that is, the packaging film layer covers the light-emitting devices Q in the same light-emitting unit P.

[0147] In some embodiments, when a first light-emitting device Q1, a second light-emitting device Q2, and a third light-emitting device Q3 are packaged into a light-emitting unit P, the first conductive pad group D1 electrically connected to the first light-emitting device Q1, the first conductive pad group D1 electrically connected to the second light-emitting device Q2, and the first conductive pad group D1 electrically connected to the third light-emitting device Q3 can all be packaged inside the same light-emitting unit P, and then the light-emitting unit P is set on the first side CM1.

[0148] Of course, the light emitting unit P may also have other packaging methods. For details, please refer to the introduction of the packaging methods and specific components of the light emitting unit P in the relevant technology, which will not be repeated here.

[0149] In the embodiment of the present application, by first packaging a first light-emitting device Q1, a second light-emitting device Q2 and a third light-emitting device Q3 into a light-emitting unit P, and then disposing the light-emitting unit P on the first side surface CM1, the difficulty of the manufacturing process of the display device can be greatly reduced and the manufacturing efficiency can be improved.

[0150] In at least one embodiment of the present application, the planar size of each conductive pad in the second conductive pad group D2 is larger than the planar size of each conductive pad in the first conductive pad group D1. In addition, as shown in Figures 11 to 15, the conductive pads in the second conductive pad group D2 extend from the area where the second side surface CM2 is located on the array substrate 101 to the area where the second side surface CM2 is located on the color filter substrate 101.

[0151] The above-mentioned “plane size” refers to the side length, diagonal line, radius, diameter, length along any direction or area of ​​the orthographic projection of the conductive pads in the second conductive pad group D2 on the second side surface CM2 .

[0152] Exemplarily, the area of ​​the plane figure of each conductive pad in the second conductive pad group D2 is larger than the area of ​​the plane figure of each conductive pad in the first conductive pad group D1 , where “plane figure” refers to the above-mentioned orthographic projection figure.

[0153] In the embodiment of the present application, since the second conductive pad group D2 needs to be directly bound to the flexible circuit board in the subsequent process, by setting the planar size of each conductive pad in the second conductive pad group D2 to be larger than the planar size of each conductive pad in the first conductive pad group D1, the contact area between the second conductive pad group D2 and the flexible circuit board can be greatly increased, thereby improving the binding stability and the conductive stability, and improving the quality of the display device.

[0154] The flexible circuit board FPC can also be replaced by a chip on film (COF).

[0155] In at least one embodiment of the present application, as shown in Figure 5B and Figures 12 to 15, the first side surface CM1 and the second side surface CM2 are the same side surface, and at least one second conductive pad group D2 is provided in the area between two adjacent light-emitting units Q; as shown in Figures 14 and 15, the display device further includes a chip-on-chip film 1, which covers the second conductive pad group D2 and extends to the side of the backlight module 200, and the orthographic projection of the chip-on-chip film 1 on the first side surface CM1 does not overlap with the orthographic projection of the light-emitting unit P on the first side surface CM1; the first conductive pad group D1 and the chip-on-chip film 1 are electrically connected, and the second conductive pad group D2 and the chip-on-chip film 1 are bound together.

[0156] In at least one embodiment of the present application, the first conductive pad group D1 includes a positive conductive pad and a negative conductive pad. As shown in FIG16 , the light-emitting unit P includes but is not limited to a first pin Y1, a second pin Y2, a third pin Y3, and a fourth pin Y4. The positive conductive pads of the first light-emitting device Q1, the second light-emitting device Q2, and the third light-emitting device Q3 are all electrically connected to the first pin Y1, the negative conductive pad of the first light-emitting device Q1 is electrically connected to the second pin Y2, the negative conductive pad of the second light-emitting device Q2 is electrically connected to the third pin Y3, and the negative conductive pad of the third light-emitting device Q3 is electrically connected to the fourth pin Y4.

[0157] The positive conductive pad can be electrically connected to the positive electrode of the light-emitting device Q, and the negative conductive pad can be electrically connected to the negative electrode of the light-emitting device Q.

[0158] Exemplarily, the positive conductive pad and the negative conductive pad may both be pins of the light emitting device Q.

[0159] As shown in Figures 14 and 15, the chip-on-film 1 covers at least part of the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4, and the chip-on-film 1 is bound to the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 respectively.

[0160] The arrangement positions of the first pin Y1 , the second pin Y2 , the third pin Y3 and the fourth pin Y4 of the light emitting unit P are not limited here.

[0161] Exemplarily, the first pin Y1, the second pin Y1, the third pin Y3 and the fourth pin Y4 can be respectively set on different sides of the light-emitting unit P. For example, one of the above four pins is set on the side of the left side of the light-emitting unit P, and the remaining three are set on the side of the lower side of the light-emitting unit P.

[0162] Exemplarily, the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 can be set on the same side of the light-emitting unit P. For example, the four pins are all set on the lower side of the light-emitting unit P, which facilitates binding between each pin and the chip-on-chip film 1 and avoids short circuit between each pin and the second conductive pad D2.

[0163] The materials of the first pin Y1 , the second pin Y2 , the third pin Y3 and the fourth pin Y4 of the light emitting unit P are not limited here. For example, the materials of the respective pins may include metal.

[0164] In other embodiments, it is also possible to set the negative conductive pads of the first light-emitting device Q1, the second light-emitting device Q2 and the third light-emitting device Q3 in a light-emitting unit P to be electrically connected to the first pin Y1, the positive conductive pad of the first light-emitting device Q1 to the second pin Y2, the positive conductive pad of the second light-emitting device Q2 to the third pin Y3, and the positive conductive pad of the third light-emitting device Q3 to the fourth pin Y4.

[0165] In this specification, the positive conductive pads of the first light-emitting device Q1, the second light-emitting device Q2 and the third light-emitting device Q3 are all electrically connected to the first pin Y1, the negative conductive pad of the first light-emitting device Q1 is electrically connected to the second pin Y2, the negative conductive pad of the second light-emitting device Q2 is electrically connected to the third pin Y3, and the negative conductive pad of the third light-emitting device Q3 is electrically connected to the fourth pin Y4.

[0166] The “chip-on-film 1 covers at least a portion of the first lead Y1, the second lead Y2, the third lead Y3, and the fourth lead Y4” includes but is not limited to the following situations:

[0167] First, as shown in Figures 14 and 15, the chip-on-film 1 covers a portion of the first pin Y1, a portion of the second pin Y2, a portion of the third pin Y3, and a portion of the fourth pin Y4, respectively, so that there is a gap between the chip-on-film 1 and the light-emitting unit P, thereby avoiding a short circuit caused by a small distance between the chip-on-film 1 and other pins or conductive structures of the light-emitting unit P.

[0168] Second, as shown in Figures 14 and 15, when the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 are arranged on the same side of the light-emitting unit P and no other pins or conductive structures are set on the side, the chip-on-film 1 can be set to completely cover the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4, thereby increasing the contact area between the chip-on-film 1 and the above four pins, and improving the binding stability and conductive stability.

[0169] In at least one embodiment of the present application, as shown in Figure 5A, the first side surface CM1 and the second side surface CM2 are different sides, and the display device further includes a chip-on-film 1, which covers the second conductive pad group D2 and extends to the side of the backlight module 200; the portion of the array substrate 102 located in the peripheral area further includes a plurality of binding leads, the first conductive pad group D1 is electrically connected to the chip-on-film 1 through the binding leads, and the second conductive pad group D2 is bound to the chip-on-film 1.

[0170] In an exemplary embodiment, a conductive adhesive, such as anisotropic conductive film (ACF), may be further disposed between the second conductive pad group D2 and the chip-on-film 1 to bond the second conductive pad group D2 and the chip-on-film 1 together.

[0171] The anisotropic conductive film (ACF) is conductive along a direction perpendicular to the second side surface CM2 , but is non-conductive along a direction parallel to the second side surface CM2 .

[0172] It should be noted that the chip-on-chip film 1 is arranged on the side of the binding sub-area in the display panel 100. When the first side CM1 and the second side CM2 are different sides (that is, when there is a light-emitting device Q arranged on a side other than the binding sub-area), it is necessary to wind the binding leads located in the peripheral area to electrically connect the first conductive pad group D1 corresponding to the light-emitting device Q with the chip-on-chip film 1, so that the subsequent circuit board can transmit the driving signal to the light-emitting device Q through the chip-on-chip film 1, thereby realizing simultaneous driving of the display panel 100 and the light-emitting device Q.

[0173] In at least one embodiment of the present application, as shown in Figure 18, the display device also includes at least one circuit board 2 and at least one L-shaped protective plate 3, the circuit board 2 and the chip-on-chip film 1 are arranged on the same side of the backlight module 200, and the circuit board 2 is electrically connected to the backlight module 200 and the chip-on-chip film 1, respectively; the circuit board 2 is configured to simultaneously drive the display panel 100 and the light-emitting device Q; a portion of the protective plate 3 is arranged on a side of the circuit board 2 away from the backlight module 200, and another portion of the protective plate 3 is arranged on a side of the circuit board 2 away from the chip-on-chip film 1.

[0174] Exemplarily, as shown in FIG18 , a flexible film 31 is attached to at least a portion of the side of the L-shaped protection plate 3 away from the backlight module 200 to improve the impact resistance of the protection plate 3 and prevent it from being damaged.

[0175] In some embodiments, the display device may include one circuit board 2; in other embodiments, the display device may include two circuit boards 2; wherein the number of circuit boards 2 included in the display device is less than or equal to the number of chip-on-chip films 1, and each circuit board 2 is electrically connected to at least part of the second conductive pad group D2 and at least part of the light-emitting device Q through at least one chip-on-chip film 1.

[0176] The circuit board 2 can also be electrically connected to the backlight module 200 .

[0177] The circuit board includes a timing controller (TCON). In some embodiments, the timing controller can provide video signals and audio signals to the display panel 100; in other embodiments, the timing controller can also provide a GOA signal to the display panel 100; in still other embodiments, the timing controller can provide a control signal to the backlight module 200 to control the luminous state and brightness of its light source.

[0178] In the embodiment of the present application, the timing controller also simultaneously controls the light-emitting state and brightness of all light-emitting devices Q. The light-emitting state refers to a bright state or a dark state.

[0179] Specifically, according to the requirements of the display image, the circuit board 2 transmits different driving signals to the second pin Y2, the third pin Y3 and the fourth pin Y4 of the light-emitting unit P, so that the first light-emitting device Q1, the second light-emitting device Q2 and the third light-emitting device Q2 display different colors, thereby realizing that the display panel 100 and all the light-emitting devices Q2 are driven at the same time and display the same complete picture.

[0180] In at least one embodiment of the present application, as shown in Figures 17 and 22A, the display panel 100 further includes at least one third side surface CM3 in addition to the first side surface CM1. The portion of the third side surface CM3 located on the color filter substrate 102 is provided with a reflective surface (unmarked). The angle β between the reflective surface and a reference surface (the dotted line position next to the third side surface CM3 in Figure 17 represents the reference surface) is an acute angle. The reference surface is a plane perpendicular to the light-emitting surface of the display panel 100.

[0181] In at least one embodiment of the present application, as shown in FIG. 17 and FIG. 22A , the acute angle β has an angle range greater than 0° and less than or equal to 30°.

[0182] Exemplarily, the acute angle β may be 30°, 28°, 25°, 24°, 22°, 20°, 18°, 15°, 13°, 10°, 8°, 5°, or 3°.

[0183] In an embodiment of the present application, by setting the angle range of the acute angle β to be greater than 0° and less than or equal to 30°, when the display device is applied to a spliced ​​display device as shown in Figure 20 or Figure 22A, the side of one display device provided with a reflective surface and the side of another display device provided with a light-emitting device Q are spliced ​​together, and the reflective surface is steeper. In this way, the reflective surface can reflect more light in a direction similar to the dotted arrow shown in Figure 22A to the area near the left side of the splice, thereby improving the uniformity of light output at the splice position, improving the display effect of the spliced ​​display device, and achieving a display effect approaching "zero splicing".

[0184] In at least one embodiment of the present application, as shown in FIG. 17 and FIG. 22A , the display device further includes a reflective portion F, and the reflective portion F covers the reflective surface.

[0185] In an exemplary embodiment, the reflective portion F may include a reflective sheet or a third reflective layer;

[0186] Exemplarily, the material of the third reflective layer may include white oil, which may include resin (eg, epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and an organic solvent (eg, dipropylene glycol methyl ether).

[0187] Exemplarily, the material of the third reflective layer may further include silicone-based white glue.

[0188] Exemplarily, the material of the third reflective layer may further include silver (Ag).

[0189] For example, the first reflective layer 207 , the second reflective layer 210 , and the third reflective layer may be made of the same material.

[0190] In the display device provided in the embodiment of the present application, by providing a reflective portion F on the third side surface CM3, its reflective ability of the light-emitting device Q can be further improved, so that more light can be reflected in the direction similar to the dotted arrow shown in Figure 22A to the area near the left side of the seam, thereby improving the uniformity of light output at the seam position, improving the display effect of the spliced ​​display device, and achieving a display effect approaching "zero seam".

[0191] In at least one embodiment of the present application, as shown in Figure 25, the display device also includes a buffer layer 8 and a plurality of packaging parts 5, the packaging part 5 at least covers the light-emitting surface of the light-emitting device Q, the buffer layer 8 covers the side of the display panel 100 where the light-emitting device Q is provided, and the buffer layer includes a plurality of openings K, and the light-emitting device Q is provided in the opening K.

[0192] Exemplarily, each packaging portion 5 encapsulates a light emitting device Q. While the packaging portion 5 performs a packaging function for the light emitting device Q, due to its special convex lens structure (Lens), the packaging portion 5 can also improve the light efficiency of the light emitting device Q.

[0193] In some embodiments, the display device may further include an encapsulation layer disposed on a side of the light emitting device Q away from the first side surface CM1 to protect the light emitting device Q. For example, the encapsulation layer may be an entire layer covering the plurality of light emitting devices Q.

[0194] In the embodiment of the present application, the light emitting device Q is packaged by taking the packaging part as an example.

[0195] Exemplarily, the buffer layer 8 may include a buffer material, such as a flexible polymer material or foam, so as to avoid damage to the light emitting device Q during transportation, resulting in poor lighting.

[0196] For example, the material of the buffer layer 8 may include ethylene vinyl acetate copolymer (EVA).

[0197] In some embodiments, when each light-emitting device Q is independently packaged, the above-mentioned opening K corresponds to the light-emitting device Q one by one; when three light-emitting devices Q of different colors are packaged into a light-emitting unit P, the above-mentioned opening K corresponds to the light-emitting unit P one by one.

[0198] In an exemplary embodiment, a distance between an edge of each opening K and an edge of the light emitting device Q located in the opening K is 1-2 μm.

[0199] In an exemplary embodiment, the distance between the edge of each opening K and the edge of the light emitting unit P located in the opening K is 1-2 μm.

[0200] In at least one embodiment of the present application, the light emitting angle γ of the light emitting device Q is in the range of 30° to 60°.

[0201] In an exemplary embodiment, when the display device is applied to a spliced ​​display device as shown in FIG21A , that is, when the side of one display device in which the light-emitting unit Q is not provided and the side of another display device in which the light-emitting device Q is provided are spliced ​​together, in combination with FIG21B , the dotted line with an arrow is the emission direction of the light, the mark a is the maximum dimension of the packaging portion 5 in the horizontal direction, and the mark b is the thickness of the color film substrate 102; wherein, in order to improve the uniformity of light at the splicing position, a part of the light emitted by the light-emitting device Q is set to be directly emitted (light marked LC), and a part is irradiated on the side surface of the color film substrate 102 of the right display device and reflected, so that the reflected light is scattered and then emitted (light marked LB). In this way, the light emitted by the light-emitting device Q can be emitted as uniformly as possible at the splicing position.

[0202] Based on this, combined with Figure 21B, it is necessary to set tanγ≤b / a. At this time, part of the light emitted by the light-emitting device Q is irradiated on the side of the color filter substrate 102 and reflected; where γ is the light-emitting angle of the light-emitting device Q.

[0203] It should be noted that, with reference to FIG21B and FIG22B , the light emitting angle γ of the light emitting device Q refers to the angle between the light emitted laterally and the light emitted forwardly by the light emitting device Q;

[0204] In an exemplary embodiment, when the display device is applied to a spliced ​​display device as shown in FIG22A , that is, when the side of one display device provided with a reflective surface and the side of another display device provided with a light-emitting device Q are spliced ​​together, in combination with FIG22B , the dotted line with an arrow is the emission direction of the light, the mark a is the maximum dimension of the packaging portion 5 in the horizontal direction, the mark b is the thickness of the color filter substrate 102, and the mark c is the dimension of the positive projection of the reflective surface on the surface of the color filter substrate 102 close to the array substrate 101; wherein, in order to improve the uniformity of light at the splicing position, a portion of the light emitted by the light-emitting device Q is set to be directly emitted (light marked LC), and a portion is irradiated on the side surface of the color filter substrate 102 of the right display device and reflected, so that the reflected light is scattered and then emitted (light marked LB). In this way, the light emitted by the light-emitting device Q can be emitted as uniformly as possible at the splicing position.

[0205] Based on this, in combination with FIG22B , it is necessary to set tanγ≤b / (a+c), that is, part of the light emitted by the light emitting device Q is irradiated by the reflective portion F provided on the color filter substrate 102 and is reflected;

[0206] On the basis of satisfying tanγ≤b / a or tanγ≤b / (a+c), a part of the light emitted by the light-emitting device Q is also set to be directly emitted. Based on the fact that the maximum dimension a of the current packaging portion 5 along the horizontal direction is in the range of 0.2~0.4mm and the thickness of the glass of the color film substrate is 0.5~0.8mm, and taking comprehensive considerations, the light-emitting angle γ of the light-emitting device Q is set to be in the range of 30°~60°. In this way, a part of the light emitted by the light-emitting device Q can be directly emitted (the light marked LC), and a part of it can be irradiated on the side of the color film substrate 102 of the right display device and reflected, so that the reflected light is scattered and then emitted (the light marked LB), thereby improving the light uniformity at the splicing position and improving the display effect of the splicing display device prepared by the above-mentioned display device.

[0207] An embodiment of the present application provides a spliced ​​display device, comprising at least a first display device and a second display device, wherein the first display device and the second display device are both the display devices described above;

[0208] 19 , 20 , 21A and 22A , the first display device (e.g., the display device on the left) includes a first splicing edge, the second display device (e.g., the display device on the right) includes a second splicing edge, and the first splicing edge and the second splicing edge are spliced ​​together; a plurality of light-emitting devices Q are arranged on the side of the area where the first splicing edge or the second splicing edge is located.

[0209] It should be noted that, when the spliced ​​display device includes three or more spliced ​​display devices, one of the two spliced ​​edges is provided with a light emitting device Q, while the other is not.

[0210] In at least one embodiment of the present application, as shown in FIG20 and FIG22A , a plurality of light-emitting devices Q are provided on the side surface of the region where one of the first splicing edge and the second splicing edge is located, and a reflective surface F is provided on the side surface of the region where the other is located.

[0211] In at least one embodiment of the present application, as shown in Figures 19, 20, 21A and 22A, the spliced ​​display device also includes a dimming layer 6 and a light-transmitting protective layer 9 as shown in Figure 26, the dimming layer 6 has an arc-shaped light-emitting surface, and the dimming layer 6 includes a light-transmitting material 62 and diffusion particles 61; the dimming layer 6 is located in the area between the first splicing edge and the second splicing edge, and covers the light-emitting device Q and the reflective surface; the light-transmitting protective layer 9 covers the dimming layer 6.

[0212] In an exemplary embodiment, the diffusion particles 61 may include polymer microspheres or inorganic particles;

[0213] For example, the diffusion particles 61 may include at least one of polymethyl methacrylate microspheres and polybutyl methacrylate microspheres.

[0214] In an embodiment of the present application, as shown in FIG21A , by providing a dimming layer 6, a portion of the light emitted by the light-emitting device Q can be directly emitted (the light marked LC), and a portion is irradiated onto the side surface of the color film substrate 102 of the display device on the right and reflected, so that the reflected light is scattered and then emitted (the light marked LB). In this way, the light emitted by the light-emitting device Q can be emitted as evenly as possible at the seam position.

[0215] Exemplarily, the light-transmitting protective layer 9 may be a protective adhesive.

[0216] In actual applications, multiple display devices need to be spliced ​​together for use. When customers install and use them, they first complete the splicing of the display devices, and then apply protective glue to the seams of the spliced ​​display devices. The protective glue here can be in the form of a film, and the upper and lower surfaces of the glue are covered with release paper. After tearing off the release paper, align the edge of the display device from one side to the other and attach it. During the attachment process, use your fingers to smooth it out while attaching to increase the bonding strength between the protective glue and the display device.

[0217] In some embodiments, the dimming layer 6 may cover a portion of the light-emitting side polarizers (the second polarizer 104 ) of the first display device and the second display device.

[0218] In other embodiments, the dimming layer 6 may be tangent to the light-emitting-side polarizers (the second polarizer 104 ) of the first display device and the second display device, respectively.

[0219] In addition, in order to improve the protection effect of the transparent protective layer 9 on the dimming layer 6, the transparent protective layer 9 can cover part of the light-emitting side polarizer (second polarizer 104) of the first display device and the second display device.

[0220] In at least one embodiment of the present application, as shown in Figures 21A and 22A, the area of ​​the color film substrate 102 of the first display device near the first splicing edge and the area of ​​the color film substrate 102 of the second display device near the second splicing edge are both provided with a shading layer 7, and the shading layer 7 is configured to block the light of the light-emitting device Q (the light marked LA) to prevent the light emitted by the light-emitting device Q from interfering with the display panel 100.

[0221] In an exemplary embodiment, the light shielding layer 7 may include one of metal and black resin material.

[0222] Exemplarily, the material of the light shielding layer 7 may be a black matrix material.

[0223] The embodiment of the present application further provides a method for preparing each conductive pad in the second conductive pad group D2, which specifically includes the following two cases:

[0224] The first method: As shown in FIG23 (1), multiple conductive lines L1 electrically connected to conductive pads in the second conductive pad group D2 are exposed on the array substrate 101 from the second side surface CM2 of the display panel 100; multiple conductive pads in the second conductive pad group D2 are pre-formed by patterning; as shown in FIG23 (2), the patterned conductive pads in the second conductive pad group D2 are transferred to the second side surface CM2 by transfer, so that the conductive pads in the second conductive pad group D2 are electrically connected to the corresponding conductive lines L1. Exemplarily, the patterning process may include steps such as exposure using a mask and etching.

[0225] The second method: As shown in Figure (2) in Figure 24, the conductive material is transferred as a whole to the second side surface CM2, and then a patterning process (such as laser processing) is used to obtain a plurality of second conductive pad groups D2 as shown in Figure (3) in Figure 24, wherein the conductive pads in the second conductive pad group D2 are electrically connected to the corresponding wires L1.

[0226] Illustratively, the material of the conductive pads in the second conductive pad group D2 may include glue containing silver particles (Ag Ink).

[0227] In addition, the above-mentioned transfer process is not specifically limited here; for example, during the transfer of the conductive pad, a clamp is required to fix the display panel 100 to prevent the pressure generated during the printing on the side of the display panel 100 from damaging other components in the display panel 100.

[0228] For details, please refer to the transfer process in the relevant technology, which will not be described here.

[0229] In some embodiments, when the light-emitting devices Q are independently packaged (not packaged into an integral light-emitting unit P), the conductive pads in the first conductive pad group D1 may also be prepared in the above manner.

[0230] An embodiment of the present application provides a picture adjustment method, which is applied to the spliced ​​display device described above. As shown in FIG27 , the method includes:

[0231] S801, respectively obtaining brightness data and chromaticity data of the display panel 100 and the light-emitting device Q under preset conditions; the preset conditions include pure images of the same grayscale or the same color;

[0232] In an exemplary embodiment, the luminance data and the chromaticity data may be directly measured manually or automatically using optical equipment.

[0233] The same grayscale means that the display panel 100 and the light emitting device Q are at the same grayscale;

[0234] The pure screen of the same color means that the display panel 100 and the light emitting device Q display a pure screen of the same color.

[0235] Exemplarily, the same grayscale may include L0 grayscale, L156 grayscale, and L255 grayscale.

[0236] Exemplarily, pure pictures of the same color may include a white picture, a black picture, a red picture, a green picture, and a blue picture.

[0237] S802, comparing and calculating the difference in luminance data and chromaticity data of the display panel 100 and the light-emitting device Q under the same conditions;

[0238] S803 : Adjust the driving voltage of the display panel 100 and the driving voltage of the light emitting device Q according to the difference in the brightness data and the difference in the chromaticity data.

[0239] In this way, a display panel 100 and a light-emitting device Q with consistent brightness data and chromaticity data can be obtained, thereby improving the light uniformity at the seam position of the spliced ​​display device, improving the display effect of the spliced ​​display device, and achieving a "zero seam" spliced ​​display effect.

[0240] In at least one embodiment of the present application, step S803 of adjusting the driving voltage of the display panel 100 and the driving voltage of the light-emitting device Q according to the difference in luminance data and the difference in chrominance data includes:

[0241] S8031. Generate a code file (Code) based on the difference in luminance data and the difference in chrominance data.

[0242] S8032. Store the encoding file in the timing controller (TCON) of circuit board 2;

[0243] S8033. The timing controller (TCON) generates a first driving voltage and a second driving voltage according to the coding file; the first driving voltage is configured to drive the display panel 100, and the second driving voltage is configured to drive the light-emitting device Q.

[0244] In an embodiment of the present application, by adopting the above-mentioned picture adjustment method, the brightness and chromaticity of the pictures displayed by two adjacent display devices in the spliced ​​display device and multiple light-emitting devices Q located between the two adjacent display devices can be adjusted to be consistent, thereby improving the overall picture display quality of the spliced ​​display device and further achieving a "zero-seam" splicing display effect.

[0245] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A display device, wherein: include: A display panel, the display panel comprising a display area and a peripheral area surrounding the display area; A backlight module, electrically connected to the display panel, and the display panel is located at the light-emitting side of the backlight module; A plurality of light emitting devices are arranged on at least one side surface of the peripheral side of the display panel; the orthographic projection of the light emitting device on the light emitting surface of the backlight module and the orthographic projection of the display panel on the light emitting surface of the backlight module do not overlap each other.

2. The display device according to claim 1, wherein: The display panel comprises a first side surface, and the first side surface intersects with a light emitting surface of the display panel; The display device includes multiple first conductive pad groups, the first conductive pad groups are arranged on the first side, and the light-emitting device is located on the side of the first conductive pad group away from the first side; one first conductive pad group includes at least two conductive pads, and one light-emitting device is electrically connected to each conductive pad in the same first conductive pad group.

3. The display device according to claim 2, wherein: The display panel comprises an array substrate and a color filter substrate which are arranged opposite to each other, and the first side surface comprises a first area located on the array substrate and a second area located on the color filter substrate; The light emitting device and the first conductive pad group are arranged in the first region, and / or the light emitting device and the first conductive pad group are arranged in the second region.

4. The display device according to claim 2, wherein: The peripheral area includes a binding sub-area, the binding sub-area includes a second side surface, and the second side surface intersects with the light emitting surface of the display panel; The display device includes a plurality of second conductive pad groups, each of which includes at least one conductive pad, and the second conductive pad group is arranged on the second side surface. The display panel includes an array substrate and a color film substrate that are arranged opposite to each other, and the second conductive pad group is electrically connected to a driving circuit on the array substrate.

5. The display device according to claim 4, wherein: The second side surface includes a third area located on the array substrate and a fourth area located on the color filter substrate; The second conductive pad group is disposed in the third region, and / or the second conductive pad group is disposed in the fourth region.

6. The display device according to claim 4, wherein: The plurality of light emitting devices include a first light emitting device, a second light emitting device and a third light emitting device, wherein the first light emitting device, the second light emitting device and the third light emitting device emit different colors of light; Among them, one of the first light-emitting devices, one of the second light-emitting devices, and one of the third light-emitting devices are packaged into a light-emitting unit, and the light-emitting unit extends from a region of the first side located on the array substrate to a region of the first side located on the color film substrate.

7. The display device according to claim 6, wherein: The planar size of each conductive pad in the second conductive pad group is larger than that of each conductive pad in the first conductive pad group, and the conductive pads in the second conductive pad group extend from an area of ​​the second side located on the array substrate to an area of ​​the second side located on the color film substrate.

8. The display device according to claim 7, wherein: The first side surface and the second side surface are the same side surface, and at least one second conductive pad group is disposed in the area between two adjacent light-emitting units; The display device further includes a chip-on-chip film, which covers the second conductive pad group and extends to the side of the backlight module, and the orthographic projection of the chip-on-chip film on the first side does not overlap with the orthographic projection of the light-emitting unit on the first side; The first conductive pad group is electrically connected to the chip-on-film, and the second conductive pad group is bound to the chip-on-film.

9. The display device according to claim 8, wherein: The first conductive pad group includes a positive conductive pad and a negative conductive pad, the light-emitting unit includes a first pin, a second pin, a third pin and a fourth pin, the positive conductive pads of the first light-emitting device, the second light-emitting device and the third light-emitting device are all electrically connected to the first pin, the negative conductive pad of the first light-emitting device is electrically connected to the second pin, the negative conductive pad of the second light-emitting device is electrically connected to the third pin, and the negative conductive pad of the third light-emitting device is electrically connected to the fourth pin; The chip-on-film covers at least a portion of the first pin, the second pin, the third pin and the fourth pin, and the chip-on-film is bound to the first pin, the second pin, the third pin and the fourth pin respectively.

10. The display device according to claim 7, wherein: The first side surface and the second side surface are different sides, and the display device further comprises a chip-on-chip film, which covers the second conductive pad group and extends to a side surface of the backlight module; The portion of the array substrate located in the peripheral area further includes a plurality of binding leads, the first conductive pad group is electrically connected to the chip-on-film through the binding leads, and the second conductive pad group is bound to the chip-on-film.

11. The display device according to claim 8 or 10, wherein: The display device further comprises at least one circuit board and at least one L-shaped protection plate, the circuit board is electrically connected to the chip-on-film, and the circuit board and the chip-on-film are arranged on the same side of the backlight module, and the circuit board is also electrically connected to the backlight module; the circuit board is configured to drive the display panel and the light-emitting device simultaneously; A portion of the protection plate is disposed on a side of the circuit board away from the backlight module, and another portion of the protection plate is disposed on a side of the circuit board away from the chip-on-film.

12. The display device according to any one of claims 2 to 10, wherein: The display panel also includes at least one third side surface in addition to the first side surface, and the third side surface is located on the color film substrate and is provided with a reflective surface. The angle between the reflective surface and the reference surface is an acute angle, and the reference surface is a plane perpendicular to the light emitting surface of the display panel.

13. The display device according to claim 12, wherein: The acute angle has an angle range greater than 0° and less than or equal to 30°.

14. The display device according to claim 12, wherein: The display device further includes a reflective portion, and the reflective portion covers the reflective surface.

15. The display device according to claim 1, wherein: The light emitting angle of the light emitting device is in the range of 30° to 60°.

16. The display device according to claim 1, wherein: The display device further includes a buffer layer and a plurality of encapsulation parts, wherein the encapsulation part at least covers the light emitting surface of the light emitting device, the buffer layer covers the side surface of the display panel where the light emitting device is arranged, and the buffer layer includes a plurality of openings, and the light emitting device is arranged in the openings.

17. A spliced ​​display device, wherein: At least comprising a first display device and a second display device, wherein the first display device and the second display device are both display devices described in any one of claims 1 to 16; The first display device includes a first splicing edge, the second display device includes a second splicing edge, the first splicing edge and the second splicing edge are spliced ​​together; a plurality of the light-emitting devices are arranged on the side of the area where the first splicing edge or the second splicing edge is located.

18. The spliced ​​display device according to claim 17, wherein: A plurality of the light emitting devices are arranged on the side surface of the region where one of the first splicing edge and the second splicing edge is located, and a reflecting surface is arranged on the side surface of the region where the other one of the first splicing edge and the second splicing edge is located.

19. The spliced ​​display device according to claim 17 or 18, wherein: The spliced ​​display device also includes a dimming layer and a light-transmitting protective layer. The dimming layer has an arc-shaped light-emitting surface, and the dimming layer includes a light-transmitting material and diffusion particles. The dimming layer is located in the area between the first splicing edge and the second splicing edge, and covers the light-emitting device and the reflecting surface. The light-transmitting protective layer covers the dimming layer.

20. The spliced ​​display device according to claim 19, wherein: A light shielding layer is provided on a region of the color filter substrate of the first display device close to the first splicing edge and a region of the color filter substrate of the second display device close to the second splicing edge. The light shielding layer is configured to block light from the light emitting device.

21. A method for adjusting a picture, wherein: Applied to the splicing display device according to any one of claims 17 to 20, the method comprising: Respectively acquiring brightness data and chromaticity data of the display panel and the light-emitting device under preset conditions; the preset conditions include pure pictures of the same grayscale or the same color; Comparing and calculating the difference in brightness data and the difference in chromaticity data between the display panel and the light-emitting device under the same conditions; The driving voltage of the display panel and the driving voltage of the light emitting device are adjusted according to the difference of the brightness data and the difference of the chromaticity data.

22. The image adjustment method according to claim 21, wherein: The step of adjusting the driving voltage of the display panel and the driving voltage of the light emitting device according to the difference of the brightness data and the difference of the chromaticity data comprises: Forming a coded file according to the difference of the brightness data and the difference of the chrominance data; Storing the encoding file in a timing controller of a circuit board; The timing controller generates a first driving voltage and a second driving voltage according to the coding file; the first driving voltage is configured to drive the display panel, and the second driving voltage is configured to drive the light emitting device.

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