Plasma processing apparatus, substrate processing system, and fixing implement

Abstract

The purpose of the present invention is to provide a feature for facilitating attachment and detachment between constituent members of a plasma processing apparatus or a substrate processing system. Provided is a plasma processing apparatus comprising a chamber. The apparatus comprises a first member, a second member, and a fixing implement configured to detachably fix the first member and the second member along the axial direction, the fixing implement being provided with a male member to be fixed to the first member and a female member to be fixed to the second member and configured to receive the male member. The male member is provided with a shaft member that extends in the axial direction and expands in diameter at the distal end. The female member comprises a housing member to be fixed to the second member, a holding member disposed inside the housing member, and spherical members held by the holding member. The spherical members are configured so that when the holding member moves in a first direction, which is in the axial direction and is the direction toward the opening, the spherical members are guided by the tapered portion of the inner wall of the housing member and move radially inward.

Description

Plasma processing apparatus, substrate processing system and fixture

[0001] SUMMARY Exemplary embodiments of the present disclosure relate to plasma processing apparatuses, substrate processing systems, and fixtures.

[0002] Patent Document 1 discloses that the electrostatic chuck and the electrostatic chuck mounting plate are fastened together by a plurality of first fasteners, and the mounting table on which the substrate is placed is fastened to a support member by a plurality of second fasteners.

[0003] Japanese Patent Application Laid-Open No. 2019-197830

[0004] The present disclosure provides a technique for facilitating attachment and detachment between components of a plasma processing apparatus or a substrate processing system.

[0005] In one exemplary embodiment of the present disclosure, a plasma processing apparatus including a chamber includes: a first member; a second member; and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member including a shaft member extending in the axial direction and expanding in diameter at a tip end, the female member including a housing member fixed to the second member, a holding member disposed within the housing member, and a retaining member. and a spherical member held by the holding member, wherein the holding member includes an opening for receiving the axial member of the male member and a holding space for accommodating the holding member and the spherical member, an inner wall of the holding member defining the holding space has a tapered portion that reduces in diameter in the radial direction, the holding member is configured to be movable along the axial direction within the holding space while holding the spherical member, and when the holding member moves in a first direction which is the axial direction toward the opening, the spherical member is guided by the tapered portion of the inner wall and moves radially inward.

[0006] According to one exemplary embodiment of the present disclosure, a technique for facilitating attachment and detachment between components of a plasma processing apparatus or a substrate processing system can be provided.

[0007] FIG. 1 is a diagram for explaining an example of the configuration of a plasma processing system. FIG. 2 is a diagram for explaining an example of the configuration of a capacitively coupled plasma processing apparatus. FIG. 3 is a diagram schematically showing an example of a fixing structure FS. FIG. 4 is a diagram for explaining an example of a movement position of a spherical member. FIG. 5 is a diagram for explaining an example of a movement position of a spherical member. FIG. 6 is a diagram for explaining an example of a method of using a fixing device F. FIG. 7 is a diagram for explaining another example of a drive mechanism for a holding member. FIG. 8 is a diagram for explaining another example of a drive mechanism for a holding member. FIG. 9 is a diagram for explaining another example of a fixing device F. FIG. 10 is a diagram for explaining another example of a fixing device F and its operation. FIG. 11 is a diagram for explaining another example of a fixing device F and its operation. FIG. 12 is a diagram for explaining an example of a configuration of a substrate processing system PS. FIG. 13 is a diagram for explaining an application example of a fixing device F.

[0008] Hereinafter, each embodiment of the present disclosure will be described.

[0009] In one exemplary embodiment, a plasma processing apparatus is provided that includes a chamber, the plasma processing apparatus including: a first member; a second member; and a fastener configured to detachably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member including an axial member that extends in the axial direction and expands in diameter at a tip, the female member including an accommodating member fixed to the second member, a holding member disposed within the accommodating member, and a spherical member held by the holding member, the accommodating member including an opening for receiving the axial member of the male member and an accommodating space for accommodating the holding member and the spherical member, an inner wall of the accommodating member that defines the accommodating space includes a tapered portion that decreases in diameter in the radial direction, the holding member is configured to be movable along the axial direction within the accommodating space while holding the spherical member, and the spherical member is configured to be guided by the tapered portion of the inner wall to move radially inward when the holding member moves in a first direction that is the axial direction toward the opening.

[0010] In one exemplary embodiment, the retaining member is moved in the first direction by a resilient member disposed within the receiving space.

[0011] In one exemplary embodiment, the retaining member is moved in a first direction by a first fluid flowing into the receiving space.

[0012] In one exemplary embodiment, the holding member is moved in a second direction opposite to the first direction by a second fluid flowing into the receiving space.

[0013] In one exemplary embodiment, the storage space includes a first space into which a first fluid is introduced and a second space into which a second fluid is introduced, and the first space and the second space are sealed by a sealing member.

[0014] In one exemplary embodiment, the second space is provided closer to the opening than the first space, and the gap between the second space and the opening is sealed by a seal member.

[0015] In one exemplary embodiment, the holding member is configured to receive a force in a first direction or a force in a second direction opposite to the first direction via a cylinder or a motor.

[0016] In one exemplary embodiment, the retaining member further comprises a locking structure that restricts radially inward movement of the spherical member.

[0017] In one exemplary embodiment, at least one of the first member and the second member is a member disposed within the chamber.

[0018] In one exemplary embodiment, at least one of the first member and the second member is a member that constitutes the chamber or is a member that is disposed outside the chamber.

[0019] In one exemplary embodiment, the device further includes a seal member that seals between the opening and the space outside the chamber when the first member and the second member are fixed by the fastener.

[0020] In one exemplary embodiment, at least one of the first member and the second member constitutes an electrode of a plasma processing apparatus, and the fixture is configured such that when the first member and the second member are fixed by the fixture, the male member and the female member are electrically connected to each other, thereby providing a conductive path to the electrode.

[0021] In one exemplary embodiment, a plasma processing apparatus is provided that includes a chamber, the plasma processing apparatus including: a first member; a second member; and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the female member including a first movable body configured to be freely movable along the axial direction between a clamped position and an unclamped position; and a second movable body held by the first movable body, configured to move to a position that restricts axial movement of the male member in the clamped position and to move to a position that does not hinder axial movement of the male member in the unclamped position.

[0022] In one exemplary embodiment, at least one of the first member and the second member constitutes an electrode of a plasma processing apparatus, and the fixture is configured such that, in the clamped position, the male member and the female member are electrically connected to each other, thereby providing a conductive path to the electrode.

[0023] In one exemplary embodiment, a substrate processing system including one or more chambers includes a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member including a shaft member extending in the axial direction and expanding in diameter at a tip, the female member including a receiving member fixed to the second member, a holding member disposed within the receiving member, and a holding portion. a spherical member held by a material, the accommodating member having an opening for receiving the axial member of the male member and an accommodating space for accommodating the holding member and the spherical member, the inner wall of the accommodating member defining the accommodating space having a tapered portion that reduces in diameter in the radial direction, the holding member being configured to be movable axially within the accommodating space while holding the spherical member, the spherical member being guided by the tapered portion of the inner wall and moving radially inward when the holding member moves in a first direction that is the axial direction toward the opening.

[0024] In one exemplary embodiment, the substrate processing system includes a transport chamber having a wall surface with an opening communicating with the chamber, and an opening / closing device configured to be movable inside the transport chamber and having a blocking portion that blocks the opening, wherein the wall surface of the transport chamber constitutes one of the first member and the second member, and the blocking portion of the opening / closing device constitutes the other of the first member and the second member.

[0025] In one exemplary embodiment, there is provided a fixture for a substrate processing system, the fixture comprising: a male member having an axial member; and a female member configured to detachably fix the axial member of the male member, the female member comprising: a first movable body configured to be movable along the axial direction between a clamped position and an unclamped position; a second movable body held by the first movable body, the second movable body configured to move to a position that restricts axial movement of the axial member of the male member in the clamped position and to move to a position that does not hinder axial movement of the male member in the unclamped position; and a third movable body configured to press the axial member of the male member to move along the axial direction in the unclamped position.

[0026] In one exemplary embodiment, there is provided a fixture for a substrate processing system, the fixture comprising: a female member having an inner wall that defines a storage space and an engagement portion provided on a part of the inner wall; a male member having an axial member that is movable axially inside the storage space; and a movable body configured to move between a clamped position in which the axial member engages with the engagement portion of the female member and an unclamped position in which the axial member does not engage with the engagement portion of the female member as the axial member moves in the axial direction, wherein the axial member is configured to be able to move axially to press against the inner wall of the female member when the engagement portion is in the unclamped position.

[0027] In one exemplary embodiment, a substrate processing system is provided, comprising: the above-mentioned fixture; a transport chamber having a wall surface with an opening communicating with the chamber; and an opening / closing device configured to be movable inside the transport chamber and having a blocking portion that blocks the opening, wherein one of the male member or the female member is provided on the wall surface of the transport chamber and the other of the male member or the female member is directed toward the blocking portion of the opening / closing device.

[0028] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are designated by the same reference numerals, and redundant explanations will be omitted. Unless otherwise specified, the positional relationships, such as up, down, left, and right, will be described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and the actual ratios are not limited to the ratios shown in the drawings.

[0029] <Configuration Example of Plasma Processing System> FIG. 1 is a diagram illustrating a configuration example of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing apparatus 1 and a control unit 2. The plasma processing system is an example of a substrate processing system, and the plasma processing apparatus 1 is an example of a substrate processing apparatus. The plasma processing apparatus 1 includes a plasma processing chamber 10, a substrate support 11, and a plasma generation unit 12. The plasma processing chamber 10 has a plasma processing space. The plasma processing chamber 10 also has at least one gas supply port for supplying at least one processing gas to the plasma processing space and at least one gas exhaust port for exhausting gas from the plasma processing space. The gas supply port is connected to a gas supply unit 20 (described later), and the gas exhaust port is connected to an exhaust system 40 (described later). The substrate support 11 is disposed in the plasma processing space and has a substrate support surface for supporting a substrate.

[0030] The plasma generating unit 12 is configured to generate plasma from at least one processing gas supplied into the plasma processing space. The plasma generated in the plasma processing space may be capacitively coupled plasma (CCP), inductively coupled plasma (ICP), electron-cyclotron-resonance plasma (ECR plasma), helicon wave plasma (HWP), surface wave plasma (SWP), or the like. Various types of plasma generators may be used, including alternating current (AC) plasma generators and direct current (DC) plasma generators. In one embodiment, the AC signal (AC power) used in the AC plasma generator has a frequency in the range of 100 kHz to 10 GHz. Thus, AC signals include radio frequency (RF) signals and microwave signals. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.

[0031] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform various processes described in this disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform various processes described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 may be implemented by, for example, a computer 2a. The processing unit 2a1 may be configured to read a program from the storage unit 2a2 and execute the read program to perform various control operations. This program may be stored in the storage unit 2a2 in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit 2a2 and read from the storage unit 2a2 by the processing unit 2a1 for execution. The medium may be various storage media readable by the computer 2a or a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a local area network (LAN).

[0032] The following describes a configuration example of a capacitively coupled plasma processing apparatus as an example of the plasma processing apparatus 1. Fig. 2 is a diagram for explaining a configuration example of a capacitively coupled plasma processing apparatus.

[0033] The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply 20, a power supply 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one process gas into the plasma processing chamber 10. The gas inlet includes a showerhead 13. The substrate support 11 is disposed within the plasma processing chamber 10. The showerhead 13 is disposed above the substrate support 11. In one embodiment, the showerhead 13 forms at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the showerhead 13, a sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 is grounded. The showerhead 13 and the substrate support 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0034] The substrate support 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central region 111a for supporting a substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a plan view. The substrate W is disposed on the central region 111a of the main body 111, and the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. Therefore, the central region 111a is also called a substrate support surface for supporting the substrate W, and the annular region 111b is also called a ring support surface for supporting the ring assembly 112.

[0035] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive member. The conductive member of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic member 1111a and an electrostatic electrode 1111b disposed within the ceramic member 1111a. The ceramic member 1111a has a central region 111a. In one embodiment, the ceramic member 1111a also has an annular region 111b. Note that the annular region 111b may also be provided by another member surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member. In this case, the ring assembly 112 may be disposed on the annular electrostatic chuck or the annular insulating member, or may be disposed on both the electrostatic chuck 1111 and the annular insulating member. Furthermore, at least one RF / DC electrode coupled to an RF power supply 31 and / or a DC power supply 32, which will be described later, may be disposed within the ceramic member 1111a. In this case, the at least one RF / DC electrode functions as a lower electrode. When a bias RF signal and / or a DC signal, which will be described later, is supplied to the at least one RF / DC electrode, the RF / DC electrode is also called a bias electrode. Note that the conductive member of the base 1110 and the at least one RF / DC electrode may function as multiple lower electrodes. Furthermore, the electrostatic electrode 1111b may function as a lower electrode. Therefore, the substrate support 11 includes at least one lower electrode.

[0036] The ring assembly 112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0037] The substrate support 11 may also include a temperature adjustment module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature adjustment module may include a heater, a heat transfer medium, a flow passage 1110a, or a combination thereof. A heat transfer fluid such as brine or a gas flows through the flow passage 1110a. In one embodiment, the flow passage 1110a is formed in the base 1110, and one or more heaters are disposed in the ceramic member 1111a of the electrostatic chuck 1111. The substrate support 11 may also include a heat transfer gas supply configured to supply a heat transfer gas to a gap between the backside of the substrate W and the central region 111a.

[0038] The showerhead 13 is configured to introduce at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The showerhead 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The process gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the multiple gas inlets 13c. The showerhead 13 also includes at least one upper electrode. In addition to the showerhead 13, the gas inlet may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the sidewall 10a.

[0039] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one process gas from a corresponding gas source 21 to the showerhead 13 via a corresponding flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply unit 20 may include at least one flow modulation device that modulates or pulses the flow rate of the at least one process gas.

[0040] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This generates a plasma from at least one processing gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least a part of the plasma generation unit 12. Furthermore, by supplying a bias RF signal to the at least one lower electrode, a bias potential is generated on the substrate W, thereby attracting ion components in the formed plasma to the substrate W.

[0041] In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0042] The second RF generator 31b is coupled to at least one lower electrode via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0043] The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generator 32a and a second DC generator 32b. In one embodiment, the first DC generator 32a is connected to the at least one lower electrode and configured to generate a first DC signal. The generated first DC signal is applied to the at least one lower electrode. In one embodiment, the second DC generator 32b is connected to the at least one upper electrode and configured to generate a second DC signal. The generated second DC signal is applied to the at least one upper electrode.

[0044] In various embodiments, the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses may have a rectangular, trapezoidal, triangular, or combination thereof pulse waveform. In one embodiment, a waveform generator for generating the sequence of voltage pulses from the DC signal is connected between the first DC generator 32a and at least one lower electrode. Thus, the first DC generator 32a and the waveform generator constitute a voltage pulse generator. When the second DC generator 32b and the waveform generator constitute a voltage pulse generator, the voltage pulse generator is connected to at least one upper electrode. The voltage pulses may have either positive or negative polarity. Furthermore, the sequence of voltage pulses may include one or more positive voltage pulses and one or more negative voltage pulses within one period. The first and second DC generating units 32a and 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may be provided instead of the second RF generating unit 31b.

[0045] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is regulated by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0046] <Example of Fixture F> FIG. 3 is a diagram schematically illustrating an example of the fixture F according to one embodiment. In one embodiment, the fixture F may be used to fix components of the plasma processing apparatus 1 shown in FIGS. 1 and 2 together. The fixture F is configured to detachably fix two components of the plasma processing apparatus 1 along an axial direction (the Z-axis direction in FIG. 3). The axial direction may vary depending on the arrangement of the components fixed by the fixture F. The axial direction may be perpendicular (the up-down direction in FIG. 2) to the horizontal plane (the main surface of the substrate support portion 11) of the plasma processing apparatus 1, parallel (the left-right direction in FIG. 2), or oblique.

[0047] 3, the fixture F includes a male member F1 and a female member F2. The male member F1 is fixed to a first member CP1 (not shown), which is a component of the plasma processing apparatus 1. The female member F2 is fixed to a second member CP2 (not shown), which is a component of the plasma processing apparatus 1.

[0048] In one embodiment, at least one of the first member CP1 and the second member CP2 may be a member (e.g., an electrostatic chuck 1111 or a base 1110) disposed in a plasma processing chamber 10 (hereinafter also referred to as the "chamber 10"). For example, the first member CP1 may be the electrostatic chuck 1111, and the second member CP2 may be the base 1110. Alternatively, for example, the first member CP1 may be the base 1110, and the second member CP2 may be the electrostatic chuck 1111. In one embodiment, the first member CP1 and / or the second member CP2 may constitute a lower electrode of the plasma processing apparatus 1. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a member (e.g., a shower head 13 or a sidewall 10a) constituting the chamber 10. For example, the first member CP1 may be the shower head 13, and the second member CP2 may be the sidewall 10a. Alternatively, for example, the first member CP1 may be the sidewall 10a, and the second member CP2 may be the shower head 13. Alternatively, for example, when the shower head 13 is configured with multiple members, the first member CP1 may be one member of the shower head 13 (for example, a top plate facing the plasma processing space 10s), and the second member CP2 may be another member of the shower head 13 (for example, a support for supporting the top plate). In one embodiment, the first member CP1 and / or the second member CP2 may constitute an upper electrode of the plasma processing apparatus 1. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a member external to the chamber 10 (for example, the gas supply unit 20, the exhaust system 40, etc.).

[0049] In one embodiment, the first member CP1 and the second member CP2 may be configured by one or more parts. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a part that is replaced due to wear, modification, or the like.

[0050] As shown in FIG. 3 , the male member F1 includes a shaft member F10 extending along the axial direction (z direction). The shaft member F10 includes a head portion F102 that expands in diameter at one axial end. The male member F1 may include a support member F12 that supports the other end of the shaft member F10. In one embodiment, the support member F12 may be fixed to a first member CP1 (not shown), thereby fixing the male member F1 to the first member CP1. In one embodiment, a first seal member SL1 may be provided on a surface of the support member F12.

[0051] In one embodiment, the male member F1 does not need to include the support member F12. In this case, the other end of the shaft member F10 is fixed to the first member CP1, thereby fixing the male member F1 to the first member CP1.

[0052] As shown in FIG. 3, the female member F2 includes a housing member F20, a holding member F22 disposed in the housing member F20, and a spherical member F24 held by the holding member F22.

[0053] The housing member F20 includes an outer wall W1 and an inner wall W2. In one embodiment, at least a portion of the outer wall W1 of the housing member F20 is fixed to a second member CP2 (not shown).

[0054] In one embodiment, a portion of the second member CP2 may constitute a portion of the outer wall W1 and the inner wall W2 of the housing member F20. For example, the upper end F200 of the housing member F20 in Fig. 3 may be a portion of the second member CP2 or may be integrated with the second member CP2. In this case, a second seal member SL2 may be provided to seal between the upper end F200 of the housing member F20 and the remaining portion thereof.

[0055] The inner wall W2 of the housing member F20 defines a housing space SP and an opening OP. The housing space SP houses the holding member F22, the spherical member F24, and the like. In one embodiment, the housing space SP may be divided into multiple spaces that are sealed from one another. For example, in the example shown in FIG. 3 , the housing space SP is divided into a first space SP1, a second space SP2, and a third space SP3 from the distal side to the proximal side of the opening OP. The first space SP1 and the second space SP2 may be configured to receive a first fluid FL1 and a second fluid FL2, respectively, as described below. In this case, the first space SP1 communicates with an opening through which the first fluid FL1 flows in and / or out. The second space SP2 communicates with an opening through which the second fluid FL2 flows in and / or out. The third space SP3 is a space in which the spherical member F24 is disposed. In one embodiment, a third seal member SL3 may be provided between the first space SP1 and the second space SP2. In one embodiment, a fourth seal member SL4 may be provided between the second space SP2 and the third space SP3.

[0056] The opening OP communicates with the third space SP3. The opening OP has a diameter larger than that of the head F102 of the shaft member F10. This allows the shaft member F10 to be inserted into and removed from the storage space SP through the opening OP. A tapered portion TP is provided on the inner wall W2 defining the third space SP3. As shown in FIG. 3 , the tapered portion TP reduces in diameter along a first direction (direction indicated by Z1 in FIG. 3 ), which is the axial direction toward the opening OP. The tapered portion TP functions as a guide member that guides the spherical member F24 along the radial direction (the Y-axis direction in FIG. 3 ), as will be described later.

[0057] The holding member F22 is configured to be movable within the storage space SP along the axial direction while holding the spherical member F24. Specifically, the holding member F22 is movable within the storage space SP in both a first direction toward the opening OP and a second direction (the direction indicated by Z2 in FIG. 3 ) that is opposite to the first direction. In other words, the holding member F22 is capable of reciprocating movement within the storage space SP along the axial direction. The holding member F22 is an example of a first movable body.

[0058] In one embodiment, a second fluid FL2 may be flowed into the second space SP2, and the movement of the holding member F22 in the second direction may be caused by the second fluid FL2 flowing into the second space SP2 pressing the first surface F220 (the surface facing the first direction) of the holding member F22.

[0059] In one embodiment, an elastic member F26 (e.g., a compression spring) may be disposed in the first space SP1. The movement of the holding member F22 in the first direction may be caused by the elastic member F26 pressing a second surface F222 (a surface facing the second direction) of the holding member F22. In one embodiment, a first fluid FL1 may be flowed into the first space SP1. The movement of the holding member F22 in the first direction may be caused by the first fluid FL1 flowing into the first space SP1 pressing the second surface F222 of the holding member F22. In one embodiment, the movement of the holding member F22 in the first direction may be caused by the elastic member F26 and the second fluid FL2 pressing the second surface F222 of the holding member F22.

[0060] In one embodiment, the holding member F22 may include a locking structure that restricts the inward movement of the spherical member F24 in the radial direction (the Y axis in FIG. 3). The locking structure may be, for example, a protrusion F224 as shown in FIG. 3.

[0061] The spherical member F24 is held by the holding member F22. When the spherical member F24 is moved axially (in the Z-axis direction in FIG. 3 ) by the movement of the holding member F22, it is simultaneously guided by the tapered portion TP of the inner wall W2 and moves radially (in the Y-axis direction in FIG. 3 ). The spherical member F24 is an example of a second moving body. In one embodiment, two or more spherical members F24 are provided.

[0062] As described above, the first member CP1 and the second member CP2 may constitute part of an electrode (upper electrode or lower electrode) of the plasma processing apparatus 1. In one embodiment, including such a case, the male member F1 and the female member F2 of the fixing device F may be configured to be electrically connectable to each other. For example, the support member F12 of the male member F1, the shaft member F10, the spherical member F24 of the female member F2, the holding member F22, the elastic member F26, and the upper end F200 of the accommodating member F20 may be made of conductive materials. As shown in FIG. 5( c ), when the male member F1 is fixed to the female member F2 so as not to move axially, the shaft member F10 and the spherical member F24 come into contact with each other. A current conduction path is formed by the support member F12 of the male member F1, the shaft member F10, the spherical member F24 of the female member F2, the holding member F22, the elastic member F26, and the upper end F200 of the accommodating member F20. This electrically connects the male member F1 and the female member F2. That is, when the first member CP1 and the second member CP2 are fixed to each other, the fastener F can function as a conductive path between the first member CP1 and the second member CP2. For example, when the first member CP1 and the second member CP2 are fixed to each other, a current supplied to the first member CP1 can be supplied to the second member CP2 via the fastener F. Also, for example, when the first member CP1 and the second member CP2 are fixed to each other, a current supplied to the second member CP2 can be supplied to the first member CP1 via the fastener F.

[0063] 4A and 4B are diagrams illustrating an example of the movement position of the spherical member. Fig. 4A shows an example of a state in which the holding member F22 has moved to the maximum in the second direction of the opening OP (a direction away from the opening OP) (hereinafter, this position will also be referred to as the "unclamped position"). Fig. 4B shows an example of a state in which the holding member F22 has moved to the maximum in the first direction (a direction toward the opening OP) (hereinafter, this position will also be referred to as the "clamped position").

[0064] As shown in FIG. 4A, in the unclamped position, the spherical members F24 abut against the upper portion of the tapered portion TP (distal to the opening OP). At this time, the radial distance between the spherical members F24 is D1. D1 is greater than the maximum width of the head F102 of the shaft member F10. As shown in FIG. 4B, in the clamped position, the spherical members F24 abut against the lower portion of the tapered portion TP (proximal to the opening OP). At this time, the radial distance between the spherical members F24 is D2. D2 is less than the maximum width of the head F102 of the shaft member F10.

[0065] <Example of Use of Fixing Device F> Figure 5 is a diagram showing an example of a method of using the fixing device F. Figure 5 shows an example of a method of fixing the male member F1 of the fixing device F (and the first member CP1 fixed to the male member F1) to the female member F2 (and the second member CP2 fixed to the female member F2).

[0066] First, the male member F1 of the fixing tool F is moved in the second direction (the direction indicated by Z2 in FIG. 5 ) toward the female member F2. Alternatively, the female member F2 may be moved in the first direction toward the male member F1. Then, the shaft member F10 of the male member F1 is inserted into the third space SP3 through the opening OP of the housing member F20 (see FIG. 5( a)). At this time, the holding member F22 of the female member F2 is in the unclamped position.

[0067] When the support member F12 of the male member F1 abuts against the outer wall W1 of the housing member F20 of the female member F2, the shaft member F10 of the male member F1 is positioned within the third space SP3 of the housing member F20 (see FIG. 5B). Next, the second fluid FL2 flows out of the second space SP2. This causes the elastic member F26 to move the holding member F22 of the female member F2 in the first direction (the direction indicated by Z1 in FIG. 5). At this time, the first fluid FL1 may flow into the first space SP1 to promote movement in the first direction.

[0068] When the holding member F22 of the female member moves to the clamping position, the radial distance between the spherical members F24 narrows, and the head F102 of the shaft member F10 becomes sandwiched between the spherical members F24 (see FIG. 5(c)). The radial outward movement of the spherical member F24 is restricted by the tapered portion TP of the inner wall W2. Therefore, the axial movement of the shaft member F10 is restricted. This fixes the male member F1 to the female member F2 so that it cannot move axially. As a result, the first member CP1 is fixed to the second member CP2. Note that when removing the male member F1 of the fixing device F from the female member F2 (removing the first member CP1 from the second member CP2), the above procedure may be reversed.

[0069] By using the fixture F, the components of the plasma processing apparatus 1 can be attached and detached by mechanically operating the fixture F without using fasteners (screws). This makes it easy to attach and detach the components of the plasma processing apparatus 1. By using the fixture F, the number of steps and time required for assembling the plasma processing apparatus and for maintenance such as replacing consumables and modifying can be reduced compared to when fasteners are used.

[0070] <Another Example of Drive Mechanism for Holding Member> Figures 6A and 6B are diagrams showing another example of the drive mechanism for the holding member. In one embodiment, the upper end of the holding member F22 of the female member F2 may be connected to a cylinder member F24 as shown in Figure 6A. The cylinder member F24 may be configured to reciprocate along the axial direction, thereby applying forces in the first and second directions to the holding member F22. In one embodiment, the upper end of the holding member F22 of the female member F2 may be connected to a rack of a rack-pinion system F29 as shown in Figure 6B. The rack-pinion system F29 transmits the rotational motion of the motor to the rack via a pinion gear. The rack may be configured to reciprocate along the axial direction depending on the rotation direction of the motor, thereby applying forces in the first and second directions to the holding member F22. <Another Example of Fixture F>

[0071] FIG. 7 is a diagram illustrating another example of the fixing device F. In the example shown in FIG. 7, the other end of the shaft member F10 of the male member F1 is fixed so as to be embedded in the first member CP1. The female member F2 is fixed so as to be entirely embedded in the second member CP2. In one embodiment, a first seal member SL1 may be disposed on the opposing surfaces of the first member CP1 and the second member CP2. The first seal member SL1 seals between the external space SPout (which may be, for example, a space outside the chamber 10) and the opening OP of the containing member F20.

[0072] In one embodiment, each component of the fixture F may be made up of multiple parts. For example, as shown in Fig. 7, the accommodating member F20 of the female member F2 may be made up of multiple parts (F20A to F20C).

[0073] FIG. 8 is a diagram illustrating another example of the fixing device F and its operation. In the example shown in FIG. 8, the female member F2 includes a pressing member F25 that presses the shaft member F10 of the male member F1. The pressing member F25 is disposed within the accommodation space SP of the accommodation member F20 and is configured to be movable in the axial direction. The pressing member F25 includes a head F250 and a shaft portion F252 extending in the axial direction from the center of the head F250. The accommodation space SP includes a fourth space SP4 and a first space SP1 separated by the head F250. The tip of the shaft portion F252 is arranged to penetrate the center of the holding member F22. The pressing member F25 is an example of a third movable body.

[0074] When the holding member F22 moves from the clamped position (see FIG. 8(a)) to the unclamped position (see FIG. 8(b)), the engagement between the spherical member F24 and the head F102 of the shaft member F10 is released. In this state, the fourth fluid FL4 flows into the fourth space SP4. Then, the pressing member F25 moves in the first direction (the direction indicated by Z1 in FIG. 8(b)). At this time, the first fluid FL1 may be allowed to flow out of the first space SP1, or the first space SP1 may be sealed to prevent the first fluid FL1 from flowing out.

[0075] As the pressing member F25 moves in the first direction, the shaft portion F252 comes into contact with the head F102 of the shaft member F10, pushing the shaft member F10 in the first direction (see FIG. 8C), thereby separating the female member F2 (and the second member CP2) from the male member F1 (and the first member CP1) (hereinafter, this position will be referred to as the "pushing position").

[0076] However, when the holding member F22 is in the unclamped position (FIG. 8(b)), the male member F1 and the female member F2 may become stuck to each other, for example, at their interface TH1. In such a case, they cannot be separated unless the sticking is released. Furthermore, it is difficult to detect whether such sticking has actually occurred without contact.

[0077] In this regard, the configuration shown in Figure 8 includes a pressing member F25 that presses the shaft member F10 of the male member F1 in the unclamped position (Figure 8(b)). Therefore, even if the male member F1 and the female member F2 are stuck together, they can be separated (Figure 8(c)).

[0078] In one embodiment, the first space SP1 may be sealed and the pressure in the first space SP1 may be detected during the transition from the unclamped position ( FIG. 8( b) ) to the extrusion position ( FIG. 8( c) ). This makes it possible to detect whether the pressing member F25 has actually reached the extrusion position. For example, if the pressure in the first space SP1 rises to a given pressure after a certain time has elapsed, it is determined that the pressing member F25 has moved to the extrusion position. Furthermore, if the pressure in the first space SP1 does not reach the given pressure after a certain time has elapsed, it is determined that the pressing member F25 has not moved to the extrusion position (the male member F1 and the female member F2 are firmly bonded). This makes it possible to detect whether the male member F1 and the female member F2 have actually been separated.

[0079] 9 is a diagram illustrating another example of the fixture F and its operation. In the example shown in FIG. 9, the fixture F includes a female member F3 and a male member F4. The female member F3 includes an inner wall W3 that defines the accommodation space SP5. A portion of the inner wall W3 includes a tapered engagement portion EG that expands in the radial direction.

[0080] The male member F4 includes a support base F40, a shaft member F42, a spherical member F44, a holding member F46, and a housing member F48.

[0081] The support base F40 is provided within the storage space of the storage member F48 and defines a sixth space SP6 and a seventh space SP7. The support base F40 moves in a first direction (z1 direction) along the axial direction and a second direction (z2 direction) opposite to the first direction in response to the inflow or outflow of fluid into the sixth space SP6 and the seventh space SP7, respectively. The shaft member F42 is fixed on the support base F40 and moves within the storage space SP5 in the first and second directions in response to the movement of the support base F40. The shaft member F42 has a neck portion F420 whose diameter decreases along the axial direction.

[0082] The spherical member F44 moves between a clamped position and an unclamped position in a state in which the female member F3 and the male member F4 are in contact with each other.

[0083] Specifically, when a fluid flows into the sixth space SP6 and the support base F40 and the shaft member F42 move in the first direction (z1 direction), the spherical member F44 moves radially outward (at this time, the axial movement of the spherical member F44 is restricted by the holding member F46). As a result, the spherical member F44 engages with the engaging portion EG of the female member F3 (see FIG. 9A). This position is the clamped position, and the female member F3 and the male member F4 are fixed to each other so that they cannot move axially.

[0084] Furthermore, when fluid flows into the seventh space SP7 and the support base F40 and the shaft member F42 move in the second direction (z2 direction), the spherical member F44 moves radially inward along the neck portion F420 of the shaft member F42 (at this time, the axial movement of the spherical member F44 is restricted by the holding member F46). This disengages the spherical member F44 from the engaging portion EG of the female member F3 (see FIG. 9(b)). This position is the unclamped position, and the female member F3 and the male member F4 become axially movable relative to each other.

[0085] In this state, fluid may further flow into the seventh space SP7. This causes the support base F40 and the shaft member F42 to move further in the second direction. At this time, the fluid may be allowed to flow out of the sixth space SP6, or the sixth space SP6 may be sealed to prevent the fluid from flowing out. As the support base F40 and the shaft member F42 move in the second direction, the shaft member F42 pushes the inner wall W3 of the female member F3 along the second direction (see FIG. 9( c)). This causes the female member F3 and the male member F4 to separate from each other (hereinafter, this position will be referred to as the "separation position").

[0086] However, even when the spherical member F44 is in the unclamped position (FIG. 9B), the female member F3 and the male member F4 may be stuck to each other, for example, at their interface TH2. In such a case, they cannot be separated unless the sticking is released. Furthermore, it is difficult to detect whether such sticking has actually occurred without contact.

[0087] In this regard, in the configuration shown in FIG. 9 , by moving the support base F40 and the shaft member F42 in the second direction from the unclamped position ( FIG. 9( b) ), the inner wall W3 of the female member F3 can be pressed in the second direction ( FIG. 9( c) ). This allows the female member F3 and the male member F4 to be separated even if they are stuck together. Note that, during the transition from the unclamped position ( FIG. 9( b) ) to the separated position ( FIG. 9( c) ), the sixth space SP6 may be sealed and the pressure in the sixth space SP6 may be detected. If the pressure in the sixth space SP6 rises to a given pressure after a certain period of time, it is determined that the support base F40 and the shaft member F42 have moved to the separated position. Furthermore, if the pressure in the sixth space SP6 does not reach a given pressure even after a certain time has elapsed, it is determined that the support base F40 and the shaft member F42 have not been able to move to the separation position (the female member F3 and the male member F4 are firmly fixed together), thereby making it possible to detect whether the female member F3 and the male member F4 have actually been separated.

[0088] <Example of application to a substrate processing system> In one embodiment, the above-described fixture F may be used to fix components of a substrate processing system (hereinafter also referred to as a "substrate processing system PS") that includes one or more chambers.

[0089] 10 is a diagram illustrating an example of the configuration of a substrate processing system PS. The substrate processing system PS includes substrate processing chambers PM1 to PM6 (hereinafter collectively referred to as "substrate processing modules PM"), a transfer module TM, load lock modules LLM1 and LLM2 (hereinafter collectively referred to as "load lock modules LLM"), a loader module LM, and load ports LP1 to LP3 (hereinafter collectively referred to as "load ports LP"). A controller CT controls each component of the substrate processing system PS to perform a given process on a substrate W.

[0090] The substrate processing module PM has a chamber inside which processes such as etching, trimming, film formation, annealing, doping, lithography, cleaning, and ashing are performed on a substrate W. At least one of the substrate processing chambers PM1 to PM6 may be chamber 10 of the plasma processing apparatus 1 shown in FIG. 1 or 2. Furthermore, at least one of the substrate processing chambers PM1 to PM6 may be part of a plasma processing apparatus using any plasma source, such as inductively coupled plasma or microwave plasma. At least one of the substrate processing chambers PM1 to PM6 may be a measurement module, which may measure the film thickness of a film formed on the substrate W or the dimensions of a pattern formed on the substrate W using, for example, an optical technique.

[0091] The transfer module TM has a transfer device for transferring a substrate W between the substrate processing modules PM or between the substrate processing module PM and the load lock module LLM. The substrate processing module PM and the load lock module LLM are arranged adjacent to the transfer module TM. The transfer module TM, the substrate processing module PM, and the load lock module LLM are spatially isolated from or connected to each other by openable and closable gate valves.

[0092] In one embodiment, a transfer device included in the transfer module TM transfers a substrate W from the transfer module TM to a plasma processing space 10s of a plasma processing apparatus 1, which is an example of a substrate processing module PM. The transfer device places the substrate W in a central region 111a of a substrate support 11. The plasma processing apparatus 1 may have a lifter, and the transfer device may place the substrate W on the lifter. The lifter is configured to be able to rise and fall inside a plurality of through-holes formed in the substrate support 11. When the lifter rises, the tip of the lifter protrudes from the central region 111a of the substrate support 11, and the substrate W is held in this position. When the lifter descends, the tip of the lifter is accommodated in the substrate support 11, and the substrate W is placed in the central region 111a of the substrate support 11. As an example, the transfer device may be a handler that transports substrates such as silicon wafers.

[0093] The load lock modules LLM1 and LLM2 are provided between the transfer module TM and the loader module LM. The load lock module LLM can switch its internal pressure between atmospheric pressure and vacuum. "Atmospheric pressure" may be the pressure outside each module included in the substrate processing system PS. "Vacuum" may be a pressure lower than atmospheric pressure, for example, a medium vacuum of 0.1 Pa to 100 Pa. The load lock module LLM transfers a substrate W from the loader module LM, which is at atmospheric pressure, to the transfer module TM, which is at vacuum, and also transfers the substrate W from the transfer module TM, which is at vacuum, to the loader module LM, which is at atmospheric pressure.

[0094] The loader module LM has a transport device for transporting substrates W and transports substrates W between the load lock module LLM and the load board LP. FOUPs (Front Opening Unified Pods) that can store, for example, 25 substrates W or empty FOUPs can be placed inside the load port LP. The loader module LM removes substrates W from the FOUPs in the load port LP and transports them to the load lock module LLM. The loader module LM also removes substrates W from the load lock module LLM and transports them to the FOUPs in the load board LP.

[0095] The controller CT controls each component of the substrate processing system PS to perform a given process on the substrate W. The controller CT stores a recipe in which the process procedure, process conditions, transport conditions, etc. are set, and controls each component of the substrate processing system PS to perform the given process on the substrate W in accordance with the recipe. The controller CT may also perform some or all of the functions of the controller 2 shown in FIG. 1 .

[0096] 11 is a diagram illustrating an example of application of the fixture F in the substrate processing system PS described above. As shown in FIG. 11, the transfer module TM has an opening TM100 in a part of a wall surface TM10 that constitutes a vacuum chamber. In one example, the opening TM100 communicates with a substrate processing module PM. In another example, the opening TM100 communicates with a load lock module LLM.

[0097] An opening / closing device M1 for opening and closing the opening TM100 is provided inside the transport module TM. The opening / closing device M1 includes a closing part M10 and a base M12. The opening / closing device M1 moves on the floor surface TM12 of the transport module TM. The opening TM100 is sealed by the opening device M100 moving to the front of the opening TM100 and pressing the closing part M10 against the opening TM100. When the opening / closing device M1 moves to another position, the sealing of the opening TM100 by the closing part M10 is released.

[0098] In one embodiment, a plurality of coils may be arranged on the floor surface TM12 of the transport module TM, and a permanent magnet may be provided on the base M12 of the opening / closing device M1. In this case, when current is supplied to each coil on the floor surface TM12, a magnetic field is generated on the floor surface TM12, and the opening / closing device M1 magnetically levitates and moves above the floor surface TM12. The position, orientation, and levitation amount of the opening / closing device M1 are controlled by controlling the current value of each coil.

[0099] In one embodiment, the fixture F may be used to fasten the wall surface TM10 of the transport module TM to the opening / closing device M1. For example, the female member F2 (F3) of the fixture F may be provided in a region TM102 surrounding the opening TM100 of the wall surface TM10, and the male member F1 (F4) may be provided at a corresponding position on the closing portion M10. Alternatively, for example, the male member F1 (F4) of the fixture F may be provided in the region TM102, and the female member F2 (F3) may be provided at a corresponding position on the closing portion M10. Note that one or more fixtures F may be provided.

[0100] By using the fixing device F, the closing portion M10 of the opening / closing device M1 and the wall surface TM10 can be fixed more firmly. This prevents fluid from leaking through the opening portion TM100 even when there is a large pressure difference between the communication destination of the opening portion TM100 and the transport module TM. Furthermore, by using the fixing device F, the closing portion M10 and the wall surface TM10 are mechanically fixed together. This reduces the power required to fix the position of the opening / closing device M1, for example, when magnetically driving the opening / closing device M1.

[0101] Embodiments of the present disclosure further include the following aspects.

[0102] (Supplementary Note 1) A plasma processing apparatus having a chamber, comprising: a first member; a second member; and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture comprising a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member comprising an axial member extending in the axial direction and expanding in diameter at a tip, the female member comprising: an accommodating member fixed to the second member, a holding member disposed within the accommodating member, and a spherical member held by the holding member, the accommodating member comprising an opening for receiving the axial member of the male member and an accommodating space for accommodating the holding member and the spherical member, an inner wall of the accommodating member defining the accommodating space comprising a tapered portion whose diameter decreases in a radial direction, the holding member being configured to be movable within the accommodating space along the axial direction while holding the spherical member, the spherical member is configured to move radially inward while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction toward the opening.

[0103] (Supplementary Note 2) The plasma processing apparatus according to Supplementary Note 1, wherein the holding member is moved in the first direction by an elastic member disposed in the accommodation space.

[0104] (Supplementary Note 3) The plasma processing apparatus according to Supplementary Note 1 or Supplementary Note 2, wherein the holding member is moved in the first direction by a first fluid flowing into the accommodation space.

[0105] (Supplementary Note 4) The plasma processing apparatus according to any one of Supplementary Note 1 to Supplementary Note 3, wherein the holding member is moved in a second direction opposite to the first direction by a second fluid flowing into the accommodation space.

[0106] (Appendix 5) The plasma processing apparatus according to any one of appendices 1 to 4, wherein the accommodation space includes a first space into which a first fluid flows and a second space into which a second fluid flows, and the space between the first space and the second space is sealed by a sealing member.

[0107] (Supplementary Note 6) The plasma processing apparatus according to Supplementary Note 5, wherein the second space is provided closer to the opening than the first space, and a gap between the second space and the opening is sealed by a seal member.

[0108] (Supplementary Note 7) The plasma processing apparatus according to any one of Supplementary Note 1 to Supplementary Note 6, wherein the holding member is configured to receive a force in the first direction or a force in a second direction opposite to the first direction via a cylinder or a motor.

[0109] (Supplementary Note 8) The plasma processing apparatus according to any one of Supplementary Note 1 to Supplementary Note 7, wherein the holding member further includes a locking structure that restricts the spherical member from moving inward in the radial direction.

[0110] (Supplementary Note 9) The plasma processing apparatus according to any one of Supplementary Notes 1 to 8, wherein at least one of the first member and the second member is a member disposed in the chamber.

[0111] (Supplementary Note 10) The plasma processing apparatus according to any one of Supplementary Note 1 to Supplementary Note 9, wherein at least one of the first member and the second member is a member that constitutes the chamber or a member that is disposed outside the chamber.

[0112] (Supplementary Note 11) The plasma processing apparatus according to any one of Supplementary Note 1 to Supplementary Note 10, further comprising a sealing member that seals between the space outside the chamber and the opening when the first member and the second member are fixed by the fixing device.

[0113] (Appendix 12) A plasma processing apparatus described in any one of Appendices 1 to 11, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixing device is configured such that when the first member and the second member are fixed by the fixing device, the male member and the female member are electrically connected to each other, thereby providing a conductive path to the electrode.

[0114] (Supplementary Note 13) A plasma processing apparatus having a chamber, comprising: a first member; a second member; and a fixture configured to detachably fix the first member and the second member together in an axial direction, the fixture comprising a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, wherein the female member comprises: a first movable body configured to be freely movable along the axial direction between a clamped position and an unclamped position; and a second movable body held by the first movable body, configured to move to a position that restricts movement of the male member in the axial direction at the clamped position, and to move to a position that does not hinder movement of the male member in the axial direction at the unclamped position.

[0115] (Appendix 14) The plasma processing apparatus of Appendix 13, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixing device is configured such that, in the clamping position, the male member and the female member are electrically connected to each other, thereby providing a conductive path to the electrode.

[0116] (Supplementary Note 15) A substrate processing system having one or a plurality of chambers, comprising: a first member; a second member; and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture comprising: a male member fixed to the first member; and a female member fixed to the second member and configured to receive the male member, the male member comprising an axial member extending in the axial direction and expanding in diameter at a tip, the female member comprising: an accommodating member fixed to the second member, a holding member disposed within the accommodating member, and a spherical member held by the holding member, the accommodating member comprising an opening for receiving the axial member of the male member and an accommodating space for accommodating the holding member and the spherical member, an inner wall of the accommodating member defining the accommodating space comprising a tapered portion whose diameter decreases in a radial direction, the holding member being configured to be movable within the accommodating space along the axial direction while holding the spherical member, the spherical member is configured to move radially inward while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction and toward the opening.

[0117] (Appendix 16) The substrate processing system according to Appendix 15, comprising: a transfer chamber having a wall surface with an opening communicating with a chamber; and an opening / closing device configured to be movable inside the transfer chamber and having a blocking part that blocks the opening, wherein the wall surface of the transfer chamber constitutes one of the first member and the second member, and the blocking part of the opening / closing device constitutes the other of the first member and the second member.

[0118] (Appendix 17) A fixture for a substrate processing system, comprising: a male member having an axial member; and a female member configured to detachably fix the axial member of the male member, wherein the female member comprises: a first movable body configured to be movable along the axial direction between a clamped position and an unclamped position; a second movable body held by the first movable body, configured to move to a position that restricts axial movement of the axial member of the male member at the clamped position, and to move to a position that does not hinder axial movement of the male member at the unclamped position; and a third movable body configured to press the axial member of the male member to move along the axial direction at the unclamped position.

[0119] (Appendix 18) A fixture for a substrate processing system, comprising: a female member having an inner wall that defines a storage space; and an engagement portion provided on a part of the inner wall; a male member having an axial member configured to be movable freely along the axial direction inside the storage space; and a movable body configured to move between a clamped position where the axial member engages with the engagement portion of the female member and an unclamped position where the axial member does not engage with the engagement portion of the female member as the axial member moves in the axial direction, wherein the male member is configured to be able to move in the axial direction to press the inner wall of the female member when the engagement portion is in the unclamped position.

[0120] (Supplementary Note 19) A substrate processing system comprising: a fixing device according to Supplementary Note 17 or Supplementary Note 18; a transfer chamber having a wall surface on which an opening communicating with a chamber is provided; and an opening / closing device configured to be movable inside the transfer chamber and having a blocking part that blocks the opening, wherein one of the male member or the female member is provided on the wall surface of the transfer chamber, and the other of the male member or the female member is directed toward the blocking part of the opening / closing device.

[0121] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to other embodiments. Also, some components in one embodiment can be replaced with corresponding components in other embodiments.

[0122] 1: Plasma processing apparatus, 10: Plasma processing chamber, CP1: First member, CP2: Second member, F: Fixing tool, F1, F4: Male member, F10: Shaft member, F2, F3: Female member, F20: Storage member, F22: Holding member, F24: Spherical member, OP: Opening, SP: Storage space, TP: Tapered portion, W2, W3: Inner wall

Claims

1. A plasma processing apparatus having a chamber, comprising: a first member; a second member; and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture comprising a male member fixed to the first member, and a female member fixed to the second member and configured to receive the male member, the male member comprising an axial member extending in the axial direction and expanding in diameter at a tip, the female member comprising: an accommodating member fixed to the second member, a holding member disposed within the accommodating member, and a spherical member held by the holding member, the accommodating member comprising an opening for receiving the axial member of the male member, and an accommodating space for accommodating the holding member and the spherical member, an inner wall of the accommodating member defining the accommodating space comprising a tapered portion whose diameter decreases in the radial direction, the holding member being configured to be movable within the accommodating space along the axial direction while holding the spherical member, the spherical member is configured to move radially inward while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction toward the opening.

2. The plasma processing apparatus according to claim 1, wherein the holding member is moved in the first direction by an elastic member disposed within the accommodation space.

3. The plasma processing apparatus according to claim 2, wherein the holding member is moved in the first direction by a first fluid flowing into the accommodation space.

4. The plasma processing apparatus according to claim 3, wherein the holding member is moved in a second direction opposite to the first direction by a second fluid flowing into the accommodation space.

5. A plasma processing apparatus as described in claim 4, wherein the storage space includes a first space into which the first fluid flows and a second space into which the second fluid flows, and the space between the first space and the second space is sealed by a sealing member.

6. The plasma processing apparatus according to claim 5, wherein the second space is provided closer to the opening than the first space, and the space between the second space and the opening is sealed by a seal member.

7. The plasma processing apparatus according to claim 1, wherein the holding member is configured to receive a force in the first direction or a force in a second direction opposite to the first direction via a cylinder or a motor.

8. A plasma processing apparatus according to any one of claims 1 to 7, wherein the holding member further comprises a locking structure that restricts the spherical member from moving radially inward.

9. A plasma processing apparatus according to any one of claims 1 to 7, wherein at least one of the first member and the second member is a member disposed within the chamber.

10. A plasma processing apparatus according to any one of claims 1 to 7, wherein at least one of the first member and the second member is a member constituting the chamber or a member disposed outside the chamber.

11. The plasma processing apparatus according to claim 10, further comprising a seal member that seals between the opening and a space outside the chamber when the first member and the second member are fixed by the fixing device.

12. A plasma processing apparatus as described in any one of claims 1 to 7, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixing device is configured such that, when the first member and the second member are fixed by the fixing device, the male member and the female member are electrically connected to each other, thereby providing a conductive path to the electrode.

13. A plasma processing apparatus having a chamber, comprising: a first member, a second member, and a fixing device configured to removably fix the first member and the second member along an axial direction, the fixing device comprising a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the female member comprising: a first moving body configured to be freely movable along the axial direction between a clamped position and an unclamped position, and a second moving body held by the first moving body, configured to move to a position that restricts the axial movement of the male member at the clamped position, and to move to a position that does not hinder the axial movement of the male member at the unclamped position.

14. The plasma processing apparatus of claim 13, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixture is configured such that, in the clamped position, the male member and the female member are electrically connected to each other to provide a conductive path to the electrode.

15. A substrate processing system having one or more chambers, comprising: a first member; a second member; and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture comprising a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member comprising an axial member extending in the axial direction and expanding in diameter at a tip, the female member comprising: an accommodating member fixed to the second member, a retaining member disposed within the accommodating member, and a spherical member held by the retaining member, the accommodating member comprising an opening for receiving the axial member of the male member and an accommodating space for accommodating the retaining member and the spherical member, an inner wall of the accommodating member defining the accommodating space comprising a tapered portion whose diameter decreases in the radial direction, and the retaining member configured to be movable within the accommodating space along the axial direction while holding the spherical member, the spherical member is configured to move radially inward while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction toward the opening.

16. The substrate processing system of claim 15, comprising: a transfer chamber having a wall with an opening communicating with a chamber; and an opening / closing device configured to be movable inside the transfer chamber and having a blocking portion that blocks the opening, wherein the wall of the transfer chamber constitutes one of the first member and the second member, and the blocking portion of the opening / closing device constitutes the other of the first member and the second member.

17. A fixture for a substrate processing system comprising: a male member having an axial member; and a female member configured to detachably fix the axial member of the male member, wherein the female member comprises: a first moving body configured to be movable between a clamped position and an unclamped position along the axial direction; a second moving body held by the first moving body configured to move to a position that restricts the axial movement of the axial member of the male member at the clamped position, and to move to a position that does not hinder the axial movement of the male member at the unclamped position; and a third moving body configured to press the axial member of the male member to move it along the axial direction at the unclamped position.

18. A fixture for a substrate processing system comprising: a female member having an inner wall defining a storage space and an engagement portion provided on a part of the inner wall; a male member having an axial member configured to be freely movable along the axial direction inside the storage space; and a movable body configured to move between a clamped position where it engages with the engagement portion of the female member and an unclamped position where it does not engage with the engagement portion of the female member as the axial member moves in the axial direction, wherein the male member is configured to move in the axial direction to press the inner wall of the female member when the engagement portion is in the unclamped position.

19. A substrate processing system comprising: a fixing device as described in claim 17 or claim 18; a transport chamber having a wall surface on which an opening communicating with a chamber is provided; and an opening / closing device configured to be movable inside the transport chamber and having a blocking portion that blocks the opening, wherein one of the male member or the female member is provided on the wall surface of the transport chamber, and the other of the male member or the female member is directed toward the blocking portion of the opening / closing device.

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