Electronic device including fingerprint sensor

Abstract

This electronic device may include a substrate, a fingerprint sensor circuit, an insulating member, a plurality of pads, and a connection member. The substrate may include a first surface including a first area and a second area spaced apart from the first area, a second surface opposite to the first surface, and a third surface extending from an edge of the first surface to an edge of the second surface. The fingerprint sensor circuit may be formed in the first area. The insulating member may include a first portion arranged on the first area to cover the fingerprint sensor circuit and a second portion extending from the first portion to surround the third surface. The plurality of pads may be formed on the second area and may be respectively connected to the fingerprint sensor circuit through an electrical path formed in the substrate. The connection member may be connected to the plurality of pads and may include a portion located on the second area.

Description

Electronic device containing a fingerprint sensor

[0001] The descriptions below relate to electronic devices that include fingerprint sensors.

[0002] Fingerprint sensors are widely used as biometric technology for user authentication or personal identification in various electronic devices. These fingerprint sensors may include, for example, capacitive fingerprint sensors and ultrasonic fingerprint sensors. Capacitive sensors operate by measuring the difference in capacitance between the ridges and valleys of a fingerprint. Ultrasonic fingerprint sensors operate by measuring the frequency of ultrasonic waves emitted from the user's body and returned to the user.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] In one embodiment, an electronic device may include a substrate, a fingerprint sensor circuit, an insulating member, a plurality of pads, and a connecting member. The substrate may include a first surface including a first region and a second region spaced apart from the first region, a second surface opposite the first surface, and a third surface extending from an edge of the first surface to an edge of the second surface. The fingerprint sensor circuit may be formed in the first region. The insulating member may include a first portion disposed on the first region to cover the fingerprint sensor circuit, and a second portion extending from the first portion to surround the third surface. The plurality of pads may be formed on the second region and may be respectively connected to the fingerprint sensor circuit via electrical paths formed in the substrate. The connecting member may include a portion connected to the plurality of pads and positioned on the second region.

[0005] In one embodiment, a method for manufacturing a fingerprint sensor package may include a step of patterning fingerprint sensor circuits including a plurality of pads on a wafer, a step of sealing the fingerprint sensor circuits with an insulating member to form a package, a step of grinding the insulating member of the package to a first thickness, and a step of removing a portion of the ground insulating member to a second thickness so as to expose the plurality of pads. The second thickness may be less than the first thickness.

[0006] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0007] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0008] FIG. 3 is a cross-sectional view illustrating a fingerprint sensor of an exemplary electronic device according to one embodiment.

[0009] FIG. 4 is a plan view illustrating a fingerprint sensor of an exemplary electronic device according to one embodiment.

[0010] Figure 5 illustrates a fingerprint sensor according to a comparative example.

[0011] FIG. 6 is a cross-sectional view illustrating a fingerprint sensor of an exemplary electronic device according to one embodiment.

[0012] FIG. 7 is a plan view illustrating a fingerprint sensor of an exemplary electronic device according to one embodiment.

[0013] Figure 8 illustrates a fingerprint sensor according to a comparative example.

[0014] FIG. 9A is a flowchart illustrating a method for manufacturing a fingerprint sensor according to one embodiment.

[0015] FIG. 9b is a flowchart illustrating a method for manufacturing a fingerprint sensor according to one embodiment.

[0016] FIG. 10A is a drawing showing a method for manufacturing a fingerprint sensor according to one embodiment.

[0017] FIG. 10b is a drawing showing a method for manufacturing a fingerprint sensor according to one embodiment.

[0018] FIG. 11 is a block diagram of an electronic device within a network environment according to various embodiments.

[0019] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0020] Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0021] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0022] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0023] An electronic device (100) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (118). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for another example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0024] Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0025] In one embodiment, the side bezel structure (118) may include a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may include different materials.

[0026] In one embodiment, the electronic device (100) may include a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and a connector hole (108). In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)), or may additionally include other components.

[0027] In one embodiment, the display (101) (e.g., the display module (1160) of FIG. 11) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). The display (101) may be disposed on the back surface of the front plate (102).

[0028] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area where the display (101) is visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0029] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. For example, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0030] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may refer to an area that, like other areas of the screen display area (101A), can display visual information by the display (101) and additionally acquire the user's biometric information (e.g., a fingerprint). Although the sensing area (101B) is illustrated as being formed within the screen display area (101A), it is not limited thereto. For example, the sensing area (101B) may also be formed in the key input device (117).

[0031] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., a camera module (1180) of FIG. 11) is positioned. For example, an opening may be formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0032] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0033] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (1170) of FIG. 11) may include a microphone hole (103, 104) and a speaker hole (107).

[0034] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0035] In one embodiment, the second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to the camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0036] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed in a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be integrated into the microphone hole (103), and the speaker hole (107) and the microphone hole (103) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0037] In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0038] In one embodiment, a sensor module (not shown) (e.g., sensor module (1176) of FIG. 11) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (1180) of FIG. 11) may include a first camera module (105) arranged to face a first side (100A) of an electronic device (100), a second camera module (112) arranged to face a second side (100B), and a flash (113).

[0040] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include one camera.

[0041] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0042] In one embodiment, the flash (113) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0043] In one embodiment, a key input device (117) (e.g., input module (1150) of FIG. 11) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0044] In one embodiment, a connector hole (108) may be formed on the third side (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (1178) of FIG. 11) electrically connected to the connector of the external device may be arranged within the connector hole (108). The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (1177) of FIG. 11) for processing an electrical signal transmitted and received through the connection terminal.

[0045] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0046] FIG. 2 is an exploded perspective view of an electronic device according to an embodiment. Hereinafter, redundant descriptions of components having the same reference numerals as the aforementioned components will be omitted. Referring to FIG. 2, an electronic device (100) according to an embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0047] In one embodiment, the frame structure (140) (e.g., the side bezel structure (118) of FIG. 1) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 1) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)). The support portion (143) of the frame structure (140) may extend from the side wall (141) within the space.

[0048] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction). The display (101) may be supported by a support portion (143) of the frame structure (140). A first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0049] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) through a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0050] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0051] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

[0052] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0053] In one embodiment, the display (101) may be disposed between a frame structure (140) and a front plate (102). For example, the front plate (102) may be disposed on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be disposed on the other side (e.g., in the -z direction).

[0054] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0055] In one embodiment, the front plate (102) may be coupled with the frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be coupled to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

[0056] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., the processor (1120) of FIG. 11), a memory (e.g., the memory (1130) of FIG. 11), and / or an interface (e.g., the interface (1177) of FIG. 11). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0057] In one embodiment, a battery (170) (e.g., battery (1189) of FIG. 11) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell.

[0058] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (1197) of FIG. 11). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0059] In one embodiment, a first camera module (105) (e.g., a front camera) may be positioned on at least a portion of a frame structure (140) (e.g., a support portion (143)) such that the lens can receive external light through a portion of the front plate (102) (e.g., the camera area (137)) (e.g., the front (100A) of FIG. 1).

[0060] In one embodiment, a second camera module (112) (e.g., a rear camera) may be disposed between the frame structure (140) and the rear plate (111). In one embodiment, the second camera module (112) may be electrically connected to the first printed circuit board (150) via a connecting member (e.g., a connector). In one embodiment, the second camera module (112) may be disposed such that the lens can receive external light through the camera area (184) of the rear plate (111) of the electronic device (100).

[0061] In one embodiment, the camera area (184) may be formed on a surface of the rear plate (111) (e.g., the rear surface (100B) of FIG. 1). In one embodiment, the camera area (184) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (112). In one embodiment, at least a portion of the camera area (184) may protrude from the surface of the rear plate (111) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (184) may form a plane substantially coextensive with the surface of the rear plate (111).

[0062] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0063] FIG. 3 is a cross-sectional view illustrating a fingerprint sensor of an exemplary electronic device according to an embodiment. FIG. 4 is a plan view illustrating a fingerprint sensor of an exemplary electronic device according to an embodiment. FIG. 5 illustrates a fingerprint sensor according to a comparative embodiment.

[0064] Referring to FIGS. 3 and 4, an electronic device (e.g., the electronic device (100) of FIG. 2) according to one embodiment may include a fingerprint sensor (1) and a connecting member (60). In one embodiment, the fingerprint sensor (1) may include a substrate (20), a sensor circuit (30), a plurality of pads (40), and an insulating member (50).

[0065] In one embodiment, the substrate (20) may include a first side (21), a second side (22), and a third side (23). The first side (21) may be opposite to the second side (22). For example, the first side (21) may face a first direction (D1), and the second side (22) may face a second direction (D2) opposite to the first direction (D1). The first direction (D1) and the second direction (D2) may be directions perpendicular to the first side (21) and the second side (22). The third side (23) may extend from an edge of the first side (21) to an edge of the second side (22). The third side (23) may face a direction perpendicular to the first direction (D1) and the second direction (D2).

[0066] In one embodiment, the first surface (21) of the substrate (20) may include a first region (211) and a second region (212) spaced apart from the first region (211). A sensor circuit (30) may be formed on the first region (211). For example, the sensor circuit (30) may be disposed on the first region (211). For example, the sensor circuit (30) may be attached to the first region (211). The sensor circuit (30) may include conductive patterns for detecting electrostatic capacitance. A plurality of pads (40) may be formed on the second region (212). For example, the plurality of pads (40) may be exposed through the second region (212). The plurality of pads (40) may be located within the second region (212). The plurality of pads (40) may be connected to the sensor circuit (30). For example, each of the plurality of pads (40) may be connected to the sensor circuit (30). The plurality of pads (40) may be connected to the sensor circuit (30) via an electrical path (35) provided by the substrate (20). For example, the plurality of pads (40) may be electrically connected to the sensor circuit (30) via conductive wires formed on and / or within the substrate (20). The conductive patterns of the sensor circuit (30) and the plurality of pads (40) may be formed of a conductive material (e.g., a conductive metal). The plurality of pads (40) may be referred to as conductive regions, metal pads, or conductive pads. The fingerprint sensor (1) according to one embodiment may further include an insulating layer (25) formed on a first surface (21) of the substrate (20).

[0067] In one embodiment, the second region (212) may include edges (212a, 212b) that define an area of ​​the second region (212). For example, the edges (212a, 212b) of the second region (212) may include a first section (or first edge) (212a) that forms a portion (21a) of an edge of the first surface (21), and a second section (or second edge) (212b) that extends from one end of the first section (212a) to the other end. The shape of the second region (212) defined by the edges (212a, 212b) may be, but is not limited to, a rectangle.

[0068] In one embodiment, the insulating member (50) may include a first portion (51) and a second portion (52). The first portion (51) may be disposed on a portion of the first surface (21) of the substrate (20). For example, the first portion (51) may be disposed on a first area (211) of the first surface (21) so as to cover the sensor circuit (30). The sensor circuit (30) may be protected by the insulating member (50) sealing the sensor circuit (30). For example, the insulating member (50) may protect the sensor circuit (30) from physical impact, corrosion, circuit short-circuiting, and overheating. The second portion (52) extending from the first portion (51) may surround the third surface (23) of the substrate (20). The second portion (52) may be a portion that does not overlap the substrate (20) when viewed in the first direction (D1). In one embodiment, the insulating member (50) may not be formed on the second region (212) of the substrate (20).

[0069] The insulating member (50) may include, but is not limited to, an epoxy molding compound (EMC), for example. The insulating member (50) may be referred to as a non-conductive member, an encapsulant, or an encapsulation member.

[0070] In one embodiment, the insulating member (50) may include a top surface (511). The top surface (511) may be spaced apart from the first surface (21) of the substrate (20). For example, the top surface (511) may be spaced apart from the first surface (21) of the substrate (20) in a first direction (D1). The top surface (511) may be substantially parallel to the first surface (21) of the substrate (20), but is not limited thereto. The top surface (511) may be at least partially formed by the first portion (51) of the insulating member (50). For example, the upper surface (511) may be formed together by the first part (51) and the second part (52) of the insulating member (50), or may be formed only by the first part (51). In one embodiment, the thickness (t1) of the first part (51) of the insulating member (50) may be 30 μm to 60 μm, but is not limited thereto. The thickness (t1) may be the distance from the first side (21) of the substrate (20) to the upper surface (511) of the insulating member (50) with respect to the first direction (D1). In addition, the thickness (t2) of the substrate (20) may be 20 μm to 50 μm, but is not limited thereto.

[0071] In one embodiment, the insulating member (50) may include a side surface (512) extending from the second region (212). The side surface (512) may extend from the second section (212b) of the second region (212) to the edge of the upper surface (511).

[0072] In one embodiment, the side surface (512) of the insulating member (50) may be inclined with respect to the first surface (21) of the substrate (20). For example, the side surface (512) of the insulating member (50) may be extended such that as the height of the insulating member (50) increases in a direction parallel to the first surface (21), the distance from the second region (212) (or the plurality of pads (40)) increases. However, the present invention is not limited thereto, and at least a portion of the side surface (512) of the insulating member (50) may be perpendicular to the first surface (21) of the substrate (20). The side surface (512) of the insulating member (50) may be formed by the first portion (51), but is not limited thereto.

[0073] In one embodiment, the second portion (52) of the insulating member (50) may include a sub-portion (521). The sub-portion (521) may form a surface (521A) extending from the first region (211). For example, the surface (521A) of the sub-portion (521) may extend from the first section (212a) of the first region (211). The surface (521A) of the sub-portion (521) may extend parallel to the first region (211). For example, the surface (521A) may extend from the first region (211) without a step. For example, the surface (521A) and the first region (211) may form one flat region. However, the present invention is not limited to the above-described example. For example, the surface (521A) may be extended to be inclined with respect to the first region (211).

[0074] In one embodiment, the fingerprint sensor (1) may include a recess (55) formed by a substrate (20) and an insulating member (50). The recess (55) may be defined by a side surface (512) and a surface (521A) of the insulating member (50), and a second region (212) of the substrate (20). The recess (55) may be referred to as a recess, an indentation, or a groove.

[0075] In one embodiment, the connecting member (60) may include a portion (61). The portion (61) of the connecting member (60) may be accommodated within the recess (55). The portion (61) of the connecting member (60) may be positioned on the second region (212) of the substrate (20). For example, the portion (61) of the connecting member (60) may be positioned between an imaginary plane including the upper surface (511) of the insulating member (50) and the second region (212) of the substrate (20). In one embodiment, the portion (61) of the connecting member (60) may be a portion that overlaps the substrate (20) with respect to the first direction (D1). For example, the portion (61) of the connecting member (60) may be a portion that overlaps the second region (212) of the substrate (20) with respect to the first direction (D1). The portion (61) may form one end of the connecting member (60), but is not limited thereto. The portion (61) of the connecting member (60) may be electrically connected to a plurality of pads (40). Additionally, an adhesive material (not shown) (e.g., epoxy) for attaching the portion (61) of the connecting member (60) to the second region (212) may be filled into the recess (55).

[0076] In one embodiment, the pads formed on the portion (61) of the connecting member (60) may be respectively bonded to a plurality of pads (40) of the substrate (20). For example, the pads of the connecting member (60) may be soldered to the plurality of pads (40) through a conductive member such as a solder ball, or bonded to the plurality of pads (40) through an anisotropic conductive film (ACF). However, the present invention is not limited to the above-described example, and the bonding between the connecting member (60) and the plurality of pads (40) may be achieved through various methods.

[0077] In one embodiment, the connecting member (60) may include a printed circuit board, a flexible printed circuit board, a rigid-flex printed circuit board, an interposer, or a package substrate.

[0078] In one embodiment, a fingerprint sensor (1) may be operatively or communicatively connected to a processor of an electronic device (e.g., a processor (1120) of FIG. 11). For example, the fingerprint sensor (1) may be connected to a printed circuit board (e.g., a first printed circuit board (150) or a second printed circuit board (152) of FIG. 2) of the electronic device via a connecting member (60). The fingerprint sensor (1) may be electrically connected to the processor on the printed circuit board via an electrical path provided by the printed circuit board.

[0079] In one embodiment, the sensor circuit (30) of the fingerprint sensor (1) can detect electrostatic capacitance from a user's finger that is in contact with or close to the upper surface (511) of the insulating member (50). For example, the fingerprint sensor (1) can detect a difference in electrostatic capacitance between valleys and ridges on the epidermis of the user's finger. The fingerprint sensor (1) or the processor connected to the fingerprint sensor (1) can obtain information about the user's fingerprint (e.g., fingerprint image information) based on the detected difference in electrostatic capacitance.

[0080] In one embodiment, the fingerprint sensor (1) may be coupled to a key button (e.g., a key input device (117) of FIG. 1) installed in a housing (e.g., a housing (110) of FIG. 1) to obtain fingerprint information of a user. For example, the fingerprint sensor (1) may detect fingerprint information of a user that has come into contact with the upper surface (511) by having the upper surface (511) at least partially exposed through the key button. In this case, optionally or additionally, a layer (e.g., an ink layer) for implementing color may be formed on the upper surface (511) of the insulating member (50).

[0081] In one embodiment, when the fingerprint sensor (1) is coupled to the key button, a dome switch that generates an electrical signal by pressing the key button may be disposed below the fingerprint sensor (1). The dome switch may be disposed, for example, below the second surface (22) of the substrate (20) (e.g., in the second direction (D2)). When a user presses the key button, the dome switch may be pressed by the second surface (22) of the substrate (20) to generate an electrical signal.

[0082] Referring to FIG. 5, the fingerprint sensor (501) according to the comparative embodiment has a structure in which the sensor circuit (502) is disposed on a substrate (503) and a connection substrate (503) is connected to the substrate (503) via solder balls (506) below the substrate (503). That is, since the fingerprint sensor (501) of the comparative embodiment has a vertical connection structure, it is difficult to reduce the thickness (t3) of the sensor. The thickness (t3) of the sensor of the comparative embodiment may be 1 mm or more. In addition, since the sensor circuit (502) of the comparative embodiment is bonded via a wire (507), it is also difficult to reduce the thickness of the insulating member (505) for sealing both the sensor circuit (502) and the wire (507).

[0083] In contrast, referring to FIGS. 3 and 4, in a fingerprint sensor (1) according to an embodiment, both the sensor circuit (30) and the plurality of pads (40) can be formed on the first surface (21) of the substrate (20). The connecting member (60) can be bonded on the first surface (21) on which the plurality of pads (40) are formed. That is, since the fingerprint sensor (1) according to an embodiment has a horizontal connecting structure, unlike the comparative embodiment, the thickness of the fingerprint sensor (1) can be reduced. Specifically, since the fingerprint sensor (1) according to an embodiment does not include the solder ball (506) and the connecting substrate (503) below the substrate (20) (e.g., in the second direction (D2)), the thickness occupied by the solder ball (506) and the connecting substrate (503) can be reduced. In addition, since the fingerprint sensor (1) according to one embodiment does not include wire bonding of the sensor circuit (30), the thickness of the insulating member (505) to prevent exposure of the wire (507) may not be required. Accordingly, the thickness of the insulating member (50) can be reduced. In addition, since the fingerprint sensor (1) according to one embodiment has a simpler structure than the comparative embodiment, reduction in component and process costs may be possible.

[0084] FIG. 6 is a cross-sectional view illustrating a fingerprint sensor of an exemplary electronic device according to an embodiment. FIG. 7 is a plan view illustrating a fingerprint sensor of an exemplary electronic device according to an embodiment. FIG. 8 illustrates a fingerprint sensor according to a comparative embodiment.

[0085] Referring to FIGS. 6 and 7, according to one embodiment, the electronic device may include a fingerprint sensor (2). In one embodiment, the fingerprint sensor (2) may include a sensor circuit (30-1). The sensor circuit (30-1) may be formed on a first surface (21) of a substrate (20). For example, the sensor circuit (30-1) may be formed on a first area (211) of the first surface (21). The sensor circuit (30-1) may be disposed on the first area (211). The sensor circuit (30-1) may be attached on the first area (211). The sensor circuit (30-1) on the first area (211) may be sealed by being covered by an insulating member (50).

[0086] In one embodiment, the sensor circuit (30-1) may be connected to a plurality of pads (40). For example, the sensor circuit (30-1) may be connected to each of the plurality of pads (40). The sensor circuit (30-1) may be connected to the plurality of pads (40) via an electrical path (35) provided by the substrate (20). The electrical path (35) may be provided on and / or within the substrate (20).

[0087] In one embodiment, the sensor circuit (30-1) may include a first conductive layer (32), a second conductive layer (34), and a piezoelectric layer (36). The first conductive layer (32) may be formed on a first surface (21) of a substrate (20). The piezoelectric layer (36) may be formed between the first conductive layer (32) and the second conductive layer (34). The second conductive layer (34) may be formed on the piezoelectric layer (36). The first conductive layer (32) and the second conductive layer (34) may be electrically connected to a plurality of pads (40).

[0088] In one embodiment, the first conductive layer (32) and the piezoelectric layer (36) may be configured to generate ultrasound. The second conductive layer (34) and the piezoelectric layer (36) may be configured to receive and / or detect ultrasound. The first conductive layer (32) and the second conductive layer (34) may be referred to as first and second conductive electrodes, or first and second conductive patterns.

[0089] In one embodiment, the first conductive layer (32) and the second conductive layer (34) may be formed of a conductive material (e.g., a conductive metal). The piezoelectric layer (36) may include a piezoelectric material. For example, the piezoelectric layer (36) may be formed of, but is not limited to, lead zirconate titanate (PZT), polyvinylidene fluoride (PVDF), or zinc oxide (ZnO). The fingerprint sensor (2) may include a primer layer (38), which is a seed layer for forming the piezoelectric layer (36).

[0090] In one embodiment, the fingerprint sensor (2) may be operatively or communicatively connected to the processor. For example, the fingerprint sensor (2) may be connected to the printed circuit board via a connecting member (60). The fingerprint sensor (2) may be electrically connected to the processor via an electrical path provided by the printed circuit board.

[0091] In one embodiment, the sensor circuit (30-1) of the fingerprint sensor (2) can detect a fingerprint of a user's finger that is in contact with or close to the second surface (22) of the substrate (20). For example, the first conductive layer (32) and the piezoelectric layer (36) can transmit ultrasonic waves to the user's finger that is in contact with or close to the first surface (21) of the substrate (20). The second conductive layer (34) and the piezoelectric layer (36) can receive or detect at least a portion of the ultrasonic waves reflected from the user's finger. The fingerprint sensor (2) or the processor connected to the fingerprint sensor (2) can obtain information about the user's fingerprint (e.g., fingerprint image information) based on the time it takes for the ultrasonic waves to be reflected from the user's body and return.

[0092] Similar to the fingerprint sensor (1), the fingerprint sensor (2) may be coupled to the key button to obtain the user's fingerprint information through the key button. For example, the fingerprint sensor (2) may be coupled to the key button such that the second surface (22) of the substrate (20) is attached to the key button or is at least partially exposed through the key button. When the fingerprint sensor (2) is coupled to the key button, a dome switch that generates an electrical signal by pressing the key button may be arranged below the fingerprint sensor (2). The dome switch may be arranged, for example, on the upper surface (511) of the insulating member (50) of the substrate (20) (e.g., in the first direction (D1)). When the user presses the key button, the dome switch may be pressed by the upper surface (511) of the insulating member (50) to generate an electrical signal.

[0093] Alternatively or additionally, a fingerprint sensor (2) according to one embodiment may be coupled to a display (e.g., display (101) of FIG. 1). For example, the fingerprint sensor (2) may be attached to the back surface of the display. The fingerprint sensor (2) coupled to the display may detect a fingerprint of a user's finger in contact with a sensing area (e.g., sensing area (101B) of FIG. 1).

[0094] In one embodiment, the fingerprint sensor (1) and / or the fingerprint sensor (2) may be referred to as a sensor unit, a sensor module, a fingerprint sensor module, a sensor package, or a fingerprint sensor package.

[0095] Referring to FIG. 8, a fingerprint sensor (801) according to a comparative example has a sensor circuit (802) formed on a substrate (803) that generates and detects ultrasonic waves. A backer layer (805) covering the sensor circuit (802) is formed of a die attach film or ink. A connection substrate (804) is disposed on the substrate (803) and connected to the sensor circuit (802). A thickness (t4) of the fingerprint sensor (801) may be 160 μm or more. The thickness (t4) of the fingerprint sensor (801) may be a distance from the lower surface of the substrate (803) to the uppermost portion of the connection substrate (804).

[0096] Referring to FIGS. 6, 7, and 8, the substrate (803) of the fingerprint sensor (801) according to the comparative embodiment is exposed, so that the substrate (803) having low rigidity may be broken or chemically damaged. Although the baker layer (805) covers the sensor circuit (802), it may be difficult to protect the sensor circuit (802) from physical damage because it is formed as a thin film. In contrast, the substrate (20) of the fingerprint sensor (2) according to one embodiment and the sensor circuit (30-1) on the substrate (20) may be protected from physical damage by being surrounded by an insulating member (50).

[0097] In a comparative example, since the connecting substrate (804) disposed on the substrate (803) is formed thicker than the sensor circuit (802) and the baker layer (805), the mountability of the fingerprint sensor (801) may be reduced. In contrast, since the portion (61) where the connecting member (60) of the fingerprint sensor (2) according to one embodiment is connected to the substrate (20) is positioned below the upper surface (511) of the insulating member (50) (e.g., in the second direction (D2)), the mountability may not be affected.

[0098] In addition, since it is difficult to adjust the properties of the substrate (803), the sensor circuit (802), and the Becker layer (805) in the fingerprint sensor (801) of the comparative embodiment, it may be difficult to adjust the warpage characteristics of the substrate (803). In contrast, the fingerprint sensor (2) according to one embodiment can adjust the warpage characteristics by adjusting the properties of the insulating member (50) surrounding the substrate (20) and the sensor circuit (30-1) (e.g., resin of the epoxy molding compound, filler contents). The fingerprint sensor (2) according to one embodiment can improve the warpage characteristics by adjusting the properties of the insulating member (50). Accordingly, the visibility and adhesiveness of the fingerprint sensor (2) can be improved.

[0099] According to one embodiment, an electronic device (e.g., an electronic device (100) of FIG. 1) may include a substrate (e.g., a substrate (20) of FIG. 3 or FIG. 6), a fingerprint sensor circuit (e.g., a sensor circuit (30) of FIG. 3 or a sensor circuit (30-1) of FIG. 6), an insulating member (e.g., an insulating member (50) of FIG. 3 or FIG. 6), a plurality of pads (e.g., a plurality of pads (40) of FIG. 3 or FIG. 6), and a connecting member (e.g., a connecting member (60) of FIG. 3 or FIG. 6). The substrate may include a first surface (e.g., the first surface (21) of FIG. 3 or FIG. 6) including a first region (e.g., the first region (211) of FIG. 3 or FIG. 6) and a second region (e.g., the second region (212) of FIG. 3 or FIG. 6) spaced apart from the first region, a second surface opposite to the first surface (e.g., the second surface (22) of FIG. 3 or FIG. 6), and a third surface (e.g., the third surface (23) of FIG. 3 or FIG. 6) extending from an edge of the first surface to an edge of the second surface. The fingerprint sensor circuit may be formed in the first region. The insulating member may include a first portion (e.g., the first portion (51) of FIG. 3 or 6) disposed on the first region to cover the fingerprint sensor circuit, and a second portion (e.g., the second portion (52) of FIG. 3 or 6) extending from the first portion to surround the third surface. The plurality of pads may be formed on the second region and connected to the fingerprint sensor circuit via an electrical path (e.g., the electrical path (35) of FIG. 3 or 6) formed within the substrate, respectively. The connecting member may include a portion (e.g., the portion (61) of FIG. 3 or 6) connected to the plurality of pads and positioned on the second region.

[0100] In one embodiment, the insulating member may not be formed in the second region.

[0101] In one embodiment, the first surface of the substrate may face a first direction (e.g., the first direction (D1) of FIG. 3 or 6). The first portion of the insulating member may include an upper surface (e.g., the upper surface (511) of FIG. 3 or 6) spaced apart from the first surface of the substrate in the first direction. The portion of the connecting member may be positioned between a virtual plane including the upper surface and the second region.

[0102] In one embodiment, the portion of the connecting member may be a portion that overlaps the substrate with respect to the first direction.

[0103] In one embodiment, the second portion of the insulating member may include a lower portion (e.g., lower portion (521) of FIG. 3 or FIG. 6). The second region may form a portion of an edge of the first surface of the substrate (e.g., portion (21a) of FIG. 4 or FIG. 7). The lower portion may form a surface extending from the portion of the edge of the first surface (e.g., surface (521A) of FIG. 3 or FIG. 6).

[0104] In one embodiment, the surface formed by the lower portion may extend parallel to the first surface.

[0105] In one embodiment, the first surface of the substrate may face a first direction. The second region may include an edge extending from one end of the portion of the edge of the first surface to the other end (e.g., the second section (212b) of FIG. 3 or 6). The first portion of the insulating member may include an upper surface spaced apart from the first surface of the substrate in the first direction (e.g., the upper surface (511) of FIG. 3 or 6), and a side surface extending from the edge of the second region to the edge of the upper surface (e.g., the side surface (512) of FIG. 3 or 6).

[0106] In one embodiment, the side surface can be inclined relative to the first surface.

[0107] In one embodiment, the side surface of the insulating member may be formed such that the distance from the plurality of pads relative to the direction parallel to the first surface increases as it gets closer to the upper surface.

[0108] The electronic device according to one embodiment may include a display (e.g., display (101) of FIG. 1). The second surface of the substrate may be attached to the display.

[0109] The electronic device according to one embodiment may include a dome switch disposed below the second surface of the substrate.

[0110] In one embodiment, the insulating member may include an upper surface exposed to the outside of the electronic device (e.g., the upper surface (511) of FIG. 3 or FIG. 6). The fingerprint sensor circuit may be configured to detect electrostatic capacitance with a part of the user's body adjacent to the upper surface.

[0111] In one embodiment, the fingerprint sensor circuit may be configured to transmit an ultrasonic wave to a portion of the user's body through the second surface of the substrate. The fingerprint sensor circuit may be configured to receive at least a portion of the ultrasonic wave reflected from the portion of the user's body.

[0112] In one embodiment, the fingerprint sensor circuit may include a first conductive layer (e.g., the first conductive layer (32) of FIG. 6), a second conductive layer (e.g., the second conductive layer (34) of FIG. 6), and a piezoelectric layer (e.g., the piezoelectric layer (36) of FIG. 6) connected to the first conductive layer and the second conductive layer. The first conductive layer and the piezoelectric layer may be configured to generate the ultrasonic waves. The second conductive layer and the piezoelectric layer may be configured to receive at least a portion of the ultrasonic waves.

[0113] FIGS. 9A and 9B are flowcharts illustrating a method for manufacturing a fingerprint sensor according to one embodiment. FIGS. 10A and 10B are diagrams illustrating a method for manufacturing a fingerprint sensor according to one embodiment.

[0114] Referring to FIGS. 9A, 10A, and 10B, a method for manufacturing a fingerprint sensor (e.g., fingerprint sensor (1) of FIG. 3) according to one embodiment will be described. In the manufacturing method of FIG. 9A, step (903b) of FIG. 10A is not performed, and step (905a) may be performed after step (901a) of FIG. 10A is performed.

[0115] In step (901a), a step of patterning fingerprint sensor circuits including a plurality of pads on a wafer may be performed. For example, sensor circuits (1030) including a plurality of pads (e.g., a plurality of pads (40) of FIG. 3) may be formed on a wafer (1010). The sensor circuits (1030) may include, for example, the sensor circuit (30) of FIG. 3. The wafer (1010) may include, but is not limited to, a silicon wafer. Step (901a) may be referred to as a patterning process.

[0116] In step (905a), a step of forming a package by sealing the fingerprint sensor circuits with an insulating material may be performed. For example, the package may be formed by covering the sensor circuits (1030) on the wafer carrier (1010) with an insulating material (1050) (e.g., the insulating material (50) of FIG. 3). Step (905a) may be performed using, but is not limited to, a method such as spin coating. Step (905a) may be referred to as a molding process.

[0117] In step (907a), a step of grinding the insulating member of the package to a first thickness may be performed. For example, the upper surface (1051) of the insulating member (1050) of the package (e.g., the upper surface (511) of FIG. 3) may be ground to a first thickness (h1). The first thickness (h1) may be, for example, 300 μm to 320 μm, but is not limited thereto. After turning the package over, the lower surface (1022) of the substrate (1020) (e.g., the second surface (22) of the substrate (20) of FIG. 3) may be ground. After grinding the lower surface (1022), the thickness of the substrate (1020) may be, but is not limited thereto, 20 μm to 50 μm. Step (907a) may be referred to as a grinding process.

[0118] In step (909a), a step of removing a portion of the ground insulating material by a second thickness so that a plurality of pads are exposed may be performed. For example, a portion of the insulating material (1050) of the package may be removed by a second thickness (h2) so that a plurality of pads (1040) are exposed. The second thickness (h2) may be smaller than the first thickness (h1). The second thickness (h2) may be, for example, 30 μm to 60 μm, but is not limited thereto. Step (909a) may be referred to as a through mold via (TMV) process.

[0119] In step (911a), a step of cutting a package with a plurality of exposed pads into a plurality of chips may be performed. For example, the package with a plurality of exposed pads (1040) may be cut into a plurality of chips (1060). Through this, a fingerprint sensor package (e.g., the fingerprint sensor (1) of FIG. 3) may be manufactured. Each of the plurality of chips (1060) may include a respective sensor circuit (1040). Step (911a) may be referred to as a package saw process.

[0120] Step (913a) may include a step of connecting a flexible printed circuit board to each of the plurality of chips. For example, a connecting member (1060) (e.g., connecting member (60) of FIG. 3) may be connected to the fingerprint sensor package.

[0121] Referring to FIGS. 9b, 10a, and 10b, a method for manufacturing a fingerprint sensor (e.g., fingerprint sensor (2) of FIG. 6) according to one embodiment will be described.

[0122] In step (901b), a step of patterning fingerprint sensor circuits including a plurality of pads on a wafer may be performed. For example, sensor circuits (1030) including a plurality of pads (e.g., a plurality of pads (40) of FIG. 6) may be formed on a wafer (1010). The sensor circuits (1030) may include, for example, the sensor circuit (30-1) of FIG. 6. Step (901b) includes: forming a first conductive layer (e.g., the first conductive layer (32) of FIG. 6) on the wafer (1010) on which the first conductive layer is formed; coating a primer (e.g., the primer layer (38) of FIG. 6) on the wafer (1010) on which the first conductive layer is formed; depositing a piezoelectric material (e.g., the piezoelectric layer (36) of FIG. 6) on the primer-coated wafer (1010); polarizing electrons inside the deposited piezoelectric material; And it may include a step of forming a second conductive layer (e.g., the second conductive layer (34) of FIG. 6) on the wafer (1010) on which the piezoelectric material is deposited. Step (901b) may be referred to as a patterning process.

[0123] In step (903b), a step of cutting the patterned wafer into a first plurality of chips and placing the cut first plurality of chips on a wafer carrier so as to be spaced apart from each other may be performed. For example, after cutting the patterned wafer (1010) into a first plurality of chips (1032) with sensor circuits (1030), the first plurality of chips (1032) may be placed on the wafer carrier (1012) so as to be spaced apart from each other. Each of the first plurality of chips (1032) may include a respective sensor circuit (1030). Step (903b) may be referred to as a dicing saw and wafer reconstruction process.

[0124] In step (905b), a step of forming a package may be performed by sealing the fingerprint sensor circuits of the first plurality of chips with an insulating material. For example, the package may be formed by covering the first plurality of chips (1032) and the sensor circuits (1030) on the wafer carrier (1010) with an insulating material (1050) (e.g., the insulating material (50) of FIG. 6). Step (905b) may be performed using, but is not limited to, a method such as spin coating, for example. Step (905b) may be referred to as a molding process.

[0125] In step (907b), a step of grinding the insulating member of the package to a first thickness may be performed. For example, the upper surface (1051) of the insulating member (1050) of the package (e.g., the upper surface (511) of FIG. 6) may be ground to a first thickness (h1). The first thickness (h1) may be, for example, 300 μm to 320 μm, but is not limited thereto. After the package is turned over, the lower surface (1022) of the substrate (1020) (e.g., the second surface (22) of the substrate (20) of FIG. 6) may be ground. After grinding the lower surface (1022), the thickness of the substrate (1020) may be, but is not limited thereto, 20 μm to 50 μm. Step (907b) may be referred to as a grinding process.

[0126] In step (909b), a step of removing a portion of the ground insulating material by a second thickness may be performed so that a plurality of pads are exposed. For example, a portion of the insulating material (1050) of the package may be removed by a second thickness (h2) so that a plurality of pads (1040) are exposed. The second thickness (h2) may be less than the first thickness (h1). The second thickness (h2) may be, for example, 30 μm to 60 μm, but is not limited thereto. Step (909b) may be referred to as a TMV process.

[0127] In step (911b), a step of cutting the package with the plurality of pads exposed into a second plurality of chips may be performed. For example, the package with the plurality of pads (1040) exposed may be cut into a second plurality of chips (1061). Through this, a fingerprint sensor package (e.g., the fingerprint sensor (2) of FIG. 6) may be manufactured. Each of the second plurality of chips (1061) may include a respective sensor circuit (1040). The size of each of the second plurality of chips (1061) may be larger than the size of each of the first plurality of chips (1032). Step (911b) may be referred to as a package saw process.

[0128] In step (913b), a step of connecting a flexible printed circuit board to each of the second plurality of chips may be performed. For example, a connecting member (1060) (e.g., connecting member (60) of FIG. 6) may be connected to the fingerprint sensor package.

[0129] According to one embodiment, a method for manufacturing a fingerprint sensor package (e.g., a fingerprint sensor (1) of FIG. 3 or a fingerprint sensor (2) of FIG. 6) may include a step (e.g., steps (901a, 901b) of FIGS. 9A and 9B) of patterning fingerprint sensor circuits (e.g., fingerprint sensor circuits (1030) of FIG. 10A) including a plurality of pads (e.g., a plurality of pads (40) of FIG. 3 or 6) on a wafer (e.g., a wafer (1010) of FIG. 10A). The method may include a step (e.g., steps (905a, 905b) of FIGS. 9A and 9B) of forming a package by sealing the fingerprint sensor circuits with an insulating member (e.g., an insulating member (1050) of FIG. 10A). The manufacturing method may include a step (e.g., steps 907a and 907b of FIGS. 9a and 9b) of grinding the insulating member of the package to a first thickness (e.g., the first thickness (h1) of FIG. 10b). The manufacturing method may include a step (e.g., steps 909a and 909b of FIGS. 9a and 9b) of removing a portion of the ground insulating member to a second thickness (e.g., the second thickness (h2) of FIG. 10b) so as to expose the plurality of pads. The second thickness may be smaller than the first thickness.

[0130] According to one embodiment, the manufacturing method may include a step of cutting the package with the plurality of pads exposed into a plurality of chips (e.g., steps (911a, 911b) of FIGS. 9A and 9B). Each of the plurality of chips may include a respective one of the fingerprint sensor circuits.

[0131] In one embodiment, the manufacturing method may include a step (e.g., step (903b) of FIGS. 9A and 9B) of cutting the patterned wafer into a first plurality of chips (e.g., the first plurality of chips (1032) of FIG. 10A) and placing the cut first plurality of chips on a wafer carrier (e.g., the wafer carrier (1012) of FIG. 10A) so as to be spaced apart from each other. The manufacturing method may include a step (e.g., step (905b) of FIGS. 9A and 9B) of forming the package by sealing the fingerprint sensor circuits of the first plurality of chips with the insulating member. The manufacturing method may include a step (e.g., step (911b) of FIGS. 9A and 9B) of cutting the package with the plurality of pads exposed into a second plurality of chips. Each of the first plurality of chips may include each of the fingerprint sensor circuits. Each of the second plurality of needles may include each of the fingerprint sensor circuits. The size of each of the second plurality of chips may be larger than the size of each of the first plurality of chips.

[0132] In one embodiment, the wafer includes a first surface on which the fingerprint sensor circuits are formed and a second surface opposite to the first surface, and the manufacturing method may include a step of grinding the second surface of the wafer (e.g., steps (907a, 907b) of FIGS. 9A and 9B). The manufacturing method may include a step of connecting a flexible printed circuit board (e.g., a connecting member (1060) of FIG. 10B) to each of the second plurality of chips (e.g., step (911b) of FIGS. 9A and 9B).

[0133] In one embodiment, the step of patterning fingerprint sensor circuits including a plurality of pads on the wafer may include the steps of forming a first conductive layer (e.g., the first conductive layer (32) of FIG. 6) on the wafer, coating a primer (e.g., the primer (35) of FIG. 6) on the wafer on which the first conductive layer is formed, depositing a piezoelectric material (e.g., the piezoelectric layer (36) of FIG. 6) on the wafer coated with the primer, and forming a second conductive layer (e.g., the second conductive layer (34) of FIG. 6) on the wafer on which the piezoelectric material is deposited.

[0134] FIG. 11 is a block diagram of an electronic device within a network environment according to various embodiments. Referring to FIG. 11, in a network environment (1100), an electronic device (1101) may communicate with an electronic device (1102) via a first network (1198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1104) or a server (1108) via a second network (1199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1101) may communicate with the electronic device (1104) via the server (1108). According to one embodiment, the electronic device (1101) may include a processor (1120), a memory (1130), an input module (1150), an audio output module (1155), a display module (1160), an audio module (1170), a sensor module (1176), an interface (1177), a connection terminal (1178), a haptic module (1179), a camera module (1180), a power management module (1188), a battery (1189), a communication module (1190), a subscriber identification module (1196), or an antenna module (1197). In some embodiments, the electronic device (1101) may omit at least one of these components (e.g., the connection terminal (1178)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1176), camera module (1180), or antenna module (1197)) may be integrated into one component (e.g., display module (1160)).

[0135] The processor (1120) may control at least one other component (e.g., hardware or software component) of the electronic device (1101) connected to the processor (1120) by executing, for example, software (e.g., program (1140)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1120) may store commands or data received from other components (e.g., sensor module (1176) or communication module (1190)) in the volatile memory (1132), process the commands or data stored in the volatile memory (1132), and store result data in the non-volatile memory (1134). According to one embodiment, the processor (1120) may include a main processor (1121) (e.g., a central processing unit or an application processor) or an auxiliary processor (1123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1121). For example, when the electronic device (1101) includes the main processor (1121) and the auxiliary processor (1123), the auxiliary processor (1123) may be configured to use less power than the main processor (1121) or to be specialized for a given function. The auxiliary processor (1123) may be implemented separately from the main processor (1121) or as a part thereof.

[0136] The auxiliary processor (1123) may control at least a part of functions or states associated with at least one component (e.g., the display module (1160), the sensor module (1176), or the communication module (1190)) of the electronic device (1101), for example, on behalf of the main processor (1121) while the main processor (1121) is in an inactive (e.g., sleep) state, or together with the main processor (1121) while the main processor (1121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1180) or a communication module (1190)). In one embodiment, the auxiliary processor (1123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0137] The memory (1130) can store various data used by at least one component (e.g., the processor (1120) or the sensor module (1176)) of the electronic device (1101). The data can include, for example, software (e.g., the program (1140)) and input data or output data for commands related thereto. The memory (1130) can include a volatile memory (1132) or a non-volatile memory (1134).

[0138] The program (1140) may be stored as software in memory (1130) and may include, for example, an operating system (1142), middleware (1144), or an application (1146).

[0139] The input module (1150) can receive commands or data to be used in a component of the electronic device (1101) (e.g., a processor (1120)) from an external source (e.g., a user) of the electronic device (1101). The input module (1150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0140] The audio output module (1155) can output audio signals to the outside of the electronic device (1101). The audio output module (1155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0141] The display module (1160) can visually provide information to an external party (e.g., a user) of the electronic device (1101). The display module (1160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (1160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0142] The audio module (1170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1170) can acquire sound through the input module (1150), output sound through the sound output module (1155), or an external electronic device (e.g., electronic device (1102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1101).

[0143] The sensor module (1176) can detect the operating status (e.g., power or temperature) of the electronic device (1101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0144] The interface (1177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1101) with an external electronic device (e.g., the electronic device (1102)). In one embodiment, the interface (1177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0145] The connection terminal (1178) may include a connector through which the electronic device (1101) may be physically connected to an external electronic device (e.g., the electronic device (1102)). According to one embodiment, the connection terminal (1178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0146] The haptic module (1179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0147] The camera module (1180) can capture still images and videos. According to one embodiment, the camera module (1180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0148] The power management module (1188) can manage power supplied to the electronic device (1101). According to one embodiment, the power management module (1188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0149] A battery (1189) may power at least one component of the electronic device (1101). In one embodiment, the battery (1189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0150] The communication module (1190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1101) and an external electronic device (e.g., electronic device (1102), electronic device (1104), or server (1108)), and the performance of communication through the established communication channel. The communication module (1190) may operate independently from the processor (1120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1190) may include a wireless communication module (1192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module can communicate with an external electronic device (1104) via a first network (1198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1192) can verify or authenticate the electronic device (1101) within a communication network such as the first network (1198) or the second network (1199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1196).

[0151] The wireless communication module (1192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1192) may support various requirements specified in the electronic device (1101), an external electronic device (e.g., the electronic device (1104)), or a network system (e.g., the second network (1199)). According to one embodiment, the wireless communication module (1192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0152] The antenna module (1197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (1197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1198) or the second network (1199), may be selected from the plurality of antennas by, for example, the communication module (1190). A signal or power may be transmitted or received between the communication module (1190) and the external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1197).

[0153] According to various embodiments, the antenna module (1197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0154] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0155] According to one embodiment, commands or data may be transmitted or received between the electronic device (1101) and an external electronic device (1104) via a server (1108) connected to a second network (1199). Each of the external electronic devices (1102 or 1104) may be the same or a different type of device as the electronic device (1101). According to one embodiment, all or part of the operations executed in the electronic device (1101) may be executed in one or more of the external electronic devices (1102, 1104, or 1108). For example, when the electronic device (1101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1101). The electronic device (1101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (1104) may include an Internet of Things (IoT) device. The server (1108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1104) or server (1108) may be included in the second network (1199). The electronic device (1101) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0156] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0157] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0158] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0159] Various embodiments of the present document may be implemented as software (e.g., a program (1140)) including one or more instructions stored in a storage medium (e.g., an internal memory (1136) or an external memory (1138)) readable by a machine (e.g., an electronic device (1101)). For example, a processor (e.g., a processor (1120)) of the machine (e.g., an electronic device (1101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0160] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0161] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A substrate comprising a first surface including a first region and a second surface spaced from the first region, a second surface opposite the first surface, and a third surface extending from an edge of the first surface to an edge of the second surface; A fingerprint sensor circuit formed on the first region; An insulating member comprising a first portion arranged on the first region to cover the fingerprint sensor circuit, and a second portion extending from the first portion to surround the third surface; A plurality of pads formed on the second region and each connected to the fingerprint sensor circuit through an electrical path formed within the substrate; and A connecting member including a portion connected to the plurality of pads and positioned on the second region, Electronic devices.

2. In claim 1, The above insulating member is not formed in the second region, Electronic devices.

3. In any one of the claims set forth above, The first surface of the above substrate faces the first direction, The first part of the insulating member includes an upper surface spaced apart in the first direction from the first surface of the substrate, The above part of the connecting member is located between a virtual plane including the upper surface and the second region, Electronic devices.

4. In claim 3, The above part of the above connecting member is a part that overlaps the substrate with respect to the first direction. Electronic devices.

5. In any one of the claims set forth above, The second region forms a part of the edge of the first surface of the substrate, The second portion of the insulating member comprises a sub-portion forming a surface extending from the part of the edge of the first surface. Electronic devices.

6. In claim 5, The surface formed by the above lower portion extends parallel to the first surface, Electronic devices.

7. In claim 5 or claim 6, The first surface of the above substrate faces the first direction, The second region includes an edge extending from one end of the part of the edge of the first surface to the other end, The first part of the above insulating member, an upper surface spaced apart in the first direction from the first surface of the substrate; and Including a side extending from the edge of the second region to the edge of the upper surface, Electronic devices.

8. In claim 7, The above side is inclined with respect to the first surface, Electronic devices.

9. In claim 8, The side surface of the insulating member is formed so that the distance from the plurality of pads increases as the side surface approaches the upper surface. The above distance is based on the direction parallel to the first surface. Electronic devices.

10. In any one of the claims set forth above, Including a display, The second surface of the above substrate is attached to the display, Electronic devices.

11. In any one of claims 1 to 9, comprising a dome switch disposed below the second surface of the substrate; Electronic devices.

12. In any one of claims 1 to 9 and claim 11, The above insulating member includes an upper surface exposed to the outside of the electronic device, The above fingerprint sensor circuit is set to detect electrostatic capacitance with a part of the user's body adjacent to the upper surface. Electronic devices.

13. In any one of claims 1 to 11, The above fingerprint sensor circuit, Transmitting ultrasound to a part of the user's body through the second surface of the above substrate, and is configured to receive at least a portion of said ultrasonic waves reflected from said part of said body of said user; Electronic devices.

14. In claim 13, The above fingerprint sensor circuit, First challenge layer; Second challenge layer; comprising a piezoelectric layer connected to the first conductive layer and the second conductive layer; The first conductive layer and the piezoelectric layer are set to generate the ultrasonic waves, The second conductive layer and the piezoelectric layer are configured to receive at least a portion of the ultrasonic waves. Electronic devices.

15. A method for manufacturing a fingerprint sensor package, A step of patterning fingerprint sensor circuits including a plurality of pads on a wafer; A step of forming a package by sealing the fingerprint sensor circuits with an insulating material; A step of grinding the insulating member of the above package to a first thickness; and A step of removing a portion of the ground insulating material to a second thickness so as to expose the plurality of pads, The above second thickness is smaller than the above first thickness, method.

Images