Camera unit

Abstract

Provided is a camera unit allowing for improved heat dissipation and reduced risk of operational malfunctioning.　This camera unit is installed in the top face of a refrigerator and comprises a metal plate, a camera, and a first board that controls the camera, wherein the metal plate and the first board are thermally connected via a heat transfer member.

Description

Camera unit

[0001] The present disclosure relates to a camera unit.

[0002] Patent Document 1 discloses a technique in which a camera is provided on the top of a refrigerator, which takes a photograph when it detects an object passing through the opening of the refrigerator.

[0003] Japanese Patent Application Laid-Open No. 2019-070476

[0004] The present disclosure provides a camera unit that can improve heat dissipation and reduce the risk of operational malfunctions.

[0005] This specification includes the entire contents of Japanese Patent Application No. 2023-109891, filed on July 4, 2023. A camera unit in the present disclosure is a camera unit installed on the top surface of a refrigerator, and includes a metal plate, a camera, and a first board that controls the camera, and the metal plate and the first board are thermally connected via a heat transfer member.

[0006] In the camera unit according to the present disclosure, heat generated by the first substrate is conducted to the metal plate via the heat transfer member, thereby improving the heat dissipation performance of the camera unit and reducing the risk of operational malfunctions.

[0007] 1 is a front view of the camera unit and the refrigerator, FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1, FIG. 3 is a front view of the camera unit and the refrigerator with the door open, FIG. 4 is a perspective view of the camera unit seen from above, FIG. 5 is a perspective view of the camera unit seen from below, FIG. 6 is an exploded perspective view of the camera unit, FIG. 7 is an exploded perspective view of the camera unit with the metal plate removed from the case member, FIG. 8 is a plan view of the case member, FIG. 9 is a cross-sectional view of the camera unit, FIG. 10 is a perspective view of the case member cut along the X-X cross section of FIG. 8, FIG. 11 is a plan view of the camera unit in embodiment 2, and FIG. 12 is a plan view of the case in embodiment 2.

[0008] (Knowledge and other information that forms the basis of the present disclosure) At the time the inventors came up with the present disclosure, there was a technology in which a camera was installed on top of a refrigerator and that captured an image when it detected an object passing through the opening of the refrigerator. However, the inventors discovered a problem with the conventional technology in that the circuit board and camera in the camera unit generated heat, causing operational malfunctions. To solve this problem, the inventors came up with the subject matter of the present disclosure. Therefore, the present disclosure provides a camera unit that can improve heat dissipation and reduce the risk of operational malfunctions.

[0009] Hereinafter, embodiments will be described in detail with reference to the drawings. However, more detailed description than necessary may be omitted. For example, detailed description of already well-known matters or redundant description of substantially the same configuration may be omitted. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0010] (Embodiment 1) [1-1. Configuration] FIG. 1 is a front view of a camera unit 1 and a refrigerator 100 according to embodiment 1. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1, showing a cross section perpendicular to the left-right direction. In the following description, the direction indicated by the symbol X in the figure is the leftward direction, the direction indicated by the symbol Y is the forward direction, and the direction indicated by the symbol Z is the upward direction. [1-1-1. Configuration of the Refrigerator] As shown in FIGS. 1 and 2, the refrigerator 100 includes a main box 120 with an open front. The main box 120 includes a refrigerator compartment 121, an ice-making compartment 122, a fresh-freezing compartment 123, a freezer compartment 124, and a vegetable compartment 125. These compartments are cooled by cold air. Side-opening doors 121A and 121B are installed at the opening in the front of the refrigerator compartment 121. FIG. 3 is a front view of the refrigerator 100 with the camera unit 1 and doors 121A and 121B open. Drawers 122A, 123A, 124A, and 125A capable of storing items are installed in ice making compartment 122, fresh freezing compartment 123, freezing compartment 124, and vegetable compartment 125, respectively. Each of drawers 122A to 125A has an open top when installed.

[0011] Camera unit 1 is installed on top surface 120A, which is the outer upper surface of main box body 120 of refrigerator 100. Top surface 120A of main box body 120 is made of metal. Furthermore, the metal that makes up top surface 120A is a metal such as iron that is attracted to magnet 59.

[0012] [1-1-2. Configuration of the Camera Unit] FIG. 4 is a perspective view of the camera unit 1, showing the camera unit 1 as seen from above. FIG. 5 is a perspective view of the camera unit 1, showing the camera unit 1 as seen from below. FIG. 6 is an exploded perspective view of the camera unit 1, showing the camera unit 1 with the cover member 30 removed from the case member 20. FIG. 7 is an exploded perspective view of the camera unit 1, showing the camera unit 1 with the cover member 30 and metal plate 40 removed from the case member 20. The camera unit 1 comprises the case member 20, the cover member 30, and the metal plate 40 housed inside the case member. The case member 20 is a rectangular member in a plan view. The case member 20 is composed of a base 21A located at the rear and installed on the top surface 120A, and a photographing unit 21B extending forward of the base 21A and spaced a predetermined distance from the top surface 120A. The case member 20 is composed of a flame-retardant resin. An example of a flame-retardant resin is an ABS resin to which a flame retardant is added.

[0013] Legs 22A1 are provided at the four outer corners of bottom surface 22A of base 21A. Legs 22A1 are used to install case member 20 with a predetermined gap from top surface 120A, and are formed of, for example, rubber. Position restricting portion 26 extending downward is formed on front end surface 21A1 of base 21A. Position restricting portion 26 is formed in a flat plate shape perpendicular to the front-to-rear direction. Position restricting portion 26 contacts front end edge 120B of main box body 120 of refrigerator 100 from the front. By contacting front end edge 120B, position restricting portion 26 restricts rearward movement of camera unit 1.

[0014] A first positioning portion 26A is provided on the front surface of the position restriction portion 26. In this embodiment, the first positioning portion 26A is a mark that is visible from the front. The first positioning portion 26A is provided in the center of the camera unit 1 in the left-right direction.

[0015] Fig. 8 is a plan view of the case member 20. As shown in Figs. 7 and 8, a power supply board 51 is fixed to the base 21A. The power supply board 51 is connected to an external power source and supplies the power necessary for the operation of each part of the camera unit 1. The power supply board 51 is an example of a "board" in this disclosure.

[0016] The power supply board 51 is connected to a power supply harness 51B capable of transmitting power. The power supply harness 51B is routed inside the case member 20 on the right side of the power supply board 51. The power supply harness 51B extends from the rear end of the case member 20 to the outside of the case member 20 and is connected to an external power supply. Power output from the external power supply is supplied to the power supply board 51 via the power supply harness 51B. In this embodiment, the power supply harness 51B is connected to a 100V commercial power supply. The power supply harness 51B may also be connected to the power supply board of the refrigerator 100. In this case, the camera unit 1 and the refrigerator 100 may be connected via a USB cable or a harness.

[0017] A sensor board 53 is fixed to the base 21A. The sensor board 53 is a board that transmits and receives signals to and from each sensor, such as the distance measurement sensor 65, thermopile 67, and illuminance sensor 69, that are provided in the camera unit 1. The sensor board 53 is located to the left of the power supply board 51. The sensor board 53 is an example of a "board" in this disclosure. Light-emitting units 202 are disposed at each of the two corners on the front side of the case member 20. The light-emitting units 202 are, for example, composed of LEDs (light-emitting diodes) and communicate predetermined information. The light-emitting units 202 may also illuminate, for example, the drawer 125A.

[0018] Buzzer 203 is provided between light-emitting unit 202 on the right side and distance measurement sensor 65. Buzzer 203 emits a sound to alert refrigerator 100 when it reaches a predetermined state. Distance measurement sensor 65, thermopile 67, illuminance sensor 69, light-emitting unit 202, and buzzer 203 are wired and connected to sensor board 53 by cable 81.

[0019] A system on a chip (SoC) board 55 is fixed to the imaging unit 21B. The SoC board 55 controls the wide-angle camera 61 and the narrow-angle camera 63. The SoC board 55 is connected to the wide-angle camera 61 and the narrow-angle camera 63 via two flexible flat cable (FFC) cables 83. The SoC board 55 is an example of a "board" in this disclosure.

[0020] A communication module 201 is disposed in front of the distance measurement sensor 65. The communication module 201 is a wireless communication module having a wireless communication line that complies with, for example, Bluetooth (registered trademark), Wi-Fi (registered trademark), or other wireless communication standards. The communication module 201 is wired and connected to the SoC board 55 by a cable 81.

[0021] Case member 20 has partition 23 formed in a position surrounding power supply board 51 in a plan view. Sensor board 53, SoC board 55, wide-angle camera 61, and narrow-angle camera 63 are arranged inside partition 23. Partition 23 is formed in a shape that protrudes upward from base 21A and imaging unit 21B.

[0022] 7 and 8, a wide-angle camera 61 and a narrow-angle camera 63 are attached to the front end of the imaging section 21B of the case member. Wide-angle camera 61 images each section of refrigerator 100, including refrigeration compartment 121. Narrow-angle camera 63 images an area including drawers 122A, 123A, 124A, and 125A. The camera units may also capture images of items being put into or taken out of refrigeration compartment 121, ice maker compartment 122, fresh freezing compartment 123, freezer compartment 124, and vegetable compartment 125.

[0023] FIG. 9 is a cross-sectional view of the camera unit 1, showing a cross section of the camera unit 1 cut at the center in the left-right direction. FIG. 10 is a perspective view of the camera unit 1, showing the camera unit 1 cut along the X-X cross section of FIG. 8. As shown in FIGS. 7 to 10, the metal plate 40 is a member made of sheet metal. The metal plate 40 is fixed to the imaging unit 21B via fastening members such as screws, bolts, and screws. The metal plate 40 covers the entire inner surface of the partition 23 from above. In other words, the metal plate 40 covers the power supply board 51, the sensor board 53, the SoC board 55, the wide-angle camera 61, and the narrow-angle camera 63, and seals the region R1 surrounded by the partition 23.

[0024] The metal plate 40 has a plate rear portion 40X that overlaps the power supply board 51 and the sensor board 53 in a plan view. A rib 43 is formed at the front end of the plate rear portion 40X. The rib 43 extends upward from the entire width of the front end of the plate rear portion 40X in the left-right direction.

[0025] A plate center portion 40Y is integrally formed at the front end of the plate rear portion 40X, extending forward from the upper end of the rib 43. The plate center portion 40Y is positioned across the base portion 21A and the imaging portion 21B in a plan view. The plate center portion 40Y is positioned higher than the plate rear portion 40X. The plate center portion 40Y covers the SoC substrate 55 from above. A downwardly recessed heat dissipation portion 45 is formed in the approximate center of the plate center portion 40Y. The heat dissipation portion 45 contacts the upper surface of the heat-generating element mounted on the SoC substrate 55 via a thermal conduction sheet 55A. This allows heat from the heat-generating element to be quickly transferred to the metal plate 40.

[0026] A front plate portion 40Z, which is lower in height than the central plate portion 40Y, is integrally formed at the front end of the central plate portion 40Y. The front plate portion 40Z covers the wide-angle camera 61 and the narrow-angle camera 63 from above. The front plate portion 40Z is in contact with the upper surfaces of the wide-angle camera 61 and the narrow-angle camera 63 via a thermally conductive sheet. This allows heat from the wide-angle camera 61 and the narrow-angle camera 63 to be quickly transferred to the metal plate 40.

[0027] 9, heat dissipation holes 31 are formed at the rear of the cover member 30 at a position corresponding to the power supply board 51. The heat dissipation holes 31 are holes that penetrate the cover member 30 and allow communication between the inside and outside of the case member 20. In this embodiment, the heat dissipation holes 31 are holes that are formed with their longitudinal direction extending in the left-right direction, and a plurality of the heat dissipation holes 31 are formed side by side in the front-to-rear direction.

[0028] The heat dissipation holes 31 allow air to pass between the inside and outside of the case member 20. This makes it easier to dissipate heat generated from the power supply board 51 and the like to the outside of the case member 20 by convection heat transfer.

[0029] 6 and 7, the front plate portion 40Z is formed so that the width W1 at the front and rear is greater than the width W2 at the rear and rear. That is, the area of ​​the metal plate 40 is greater in front of the front plate portion 40Z along the front end of the case member 20 than in the rear of the front plate portion 40Z connected to the plate center portion 40Y. The front of the front plate portion 40Z is formed to extend beyond the partition portion 23 in a plan view.

[0030] 7 and 8, the wide-angle camera 61 has a first image sensor board 61B on its upper side. The wide-angle camera 61 also has a lens below the first image sensor board 61B. The narrow-angle camera 63 has a second image sensor board 63B on its upper side. The narrow-angle camera 63 also has a lens below the second image sensor board 63B. The front plate portion 40Z contacts the upper surface of the first image sensor board 61B via a thermally conductive sheet 61A. The front plate portion 40Z contacts the upper surface of the second image sensor board 63B via a thermally conductive sheet 63A.

[0031] As shown in FIGS. 6 and 7 , three heat transfer suppression portions 49 are formed between the plate center portion 40Y and the plate rear portion 40X of the metal plate 40. The heat transfer suppression portions 49 are formed on the plate front portion 40Z. The heat transfer suppression portions 49 are elliptical through-holes, but are not limited thereto and may be, for example, notches or hollowed-out portions. The metal plate 40 may be composed of a first plate covering the first image sensor substrate 61B and the second image sensor substrate 63B and a second plate covering the SoC substrate 55. In this case, in this embodiment, the plate front portion 40Z corresponds to an example of a “first plate,” and the plate center portion 40Y and the plate rear portion 40X correspond to an example of a “second plate.” As described above, a configuration in which the heat transfer suppression portions 49 are formed between the first plate and the second plate may be used.

[0032] The rear plate portion 40X is formed with a protrusion 47. The power supply substrate 51 has a greater height than the other substrates. The protrusion 47 is formed so as not to come into contact with the power supply substrate 51 and components provided on the power supply substrate 51.

[0033] Furthermore, the protrusions 47 are formed at positions that do not overlap the heat dissipation holes 31 in plan view. As shown in Fig. 9, there is a predetermined distance W3 between the lower ends of the heat dissipation holes 31 and the metal plate 40. This makes it possible to prevent static electricity from being generated between the cover member 30 and the metal plate 40. The predetermined distance W3 is, for example, 15 mm.

[0034] The thermal conduction sheets 55A, 61A, and 63A correspond to an example of a "heat transfer member." The wide-angle camera 61 and the narrow-angle camera 63 correspond to an example of a "camera." The SoC board 55 corresponds to an example of a "first board." The power supply board 51 corresponds to an example of a "second board." The first image sensor board 61B and the second image sensor board 63B correspond to an example of an "image sensor board."

[0035] 6 and 7, the operation of the camera unit 1 configured as above will be described. When the camera unit 1 operates, the power supply board 51, the sensor board 53, the SoC board 55, the first image sensor board 61B, and the second image sensor board 63B generate heat.

[0036] Heat generated by the SoC substrate 55 is conducted to the heat dissipation portion 45 of the metal plate 40 via the thermal conduction sheet 55A. The heat transfer suppression portion 49 reduces the heat transfer area between the plate center portion 40Y and the plate rear portion 40X. Therefore, the heat conducted to the heat dissipation portion 45 is conducted mainly to the plate rear portion 40X. If the heat transfer suppression portion 49 were not present, much of the heat generated by the SoC substrate 55 would be conducted to the front of the camera unit 1, which would not promote heat dissipation through heat exchange with the air entering and exiting through the heat dissipation holes 31, and the efficiency of heat dissipation of the entire camera unit 1 would decrease.

[0037] Furthermore, the heat generated by the power supply substrate 51 is conducted mainly to the plate rear portion 40X via the air in region R1. As described above, the heat generated by the SoC substrate 55 and the power supply substrate 51 is dissipated mainly through heat exchange between the air flowing in and out through the heat dissipation holes 31 and the metal plate 40.

[0038] Heat generated by the first image sensor board 61B and the second image sensor board 63B is conducted to the plate front portion 40Z via the thermal conduction sheets 61A and 63A, and then conducted to the plate center portion 40Y.

[0039] Furthermore, heat generated by the first image sensor board 61B and the second image sensor board 63B is conducted to the case member 20 via the plate front portion 40Z. Furthermore, heat generated by the first image sensor board 61B and the second image sensor board 63B is conducted to the cover member 30 by convective heat transfer. The wide-angle camera 61 and the narrow-angle camera 63 are positioned so as to protrude forward from the top surface 120A of the refrigerator 100, in an open space without other components intertwined therein. Furthermore, the plate front portion 40Z has a front width W2 that is larger than its rear width W1. As a result, heat generated by the first image sensor board 61B and the second image sensor board 63B is efficiently dissipated in front of the camera unit 1.

[0040] Furthermore, because the front of the plate front portion 40Z is formed to extend beyond the partition portion 23 in a plan view, heat generated by the first image sensor board 61B and the second image sensor board 63B can also be exchanged in the space outside the partition portion 23 inside the case member 20, improving heat dissipation efficiency. As such, in a plan view, the wide-angle camera 61, the narrow-angle camera 63, the SoC board 55, and the heat dissipation holes 31 are positioned in this order without overlapping each other, so heat dissipation is not concentrated in one part of the camera unit 1. In particular, because the SoC board 55 is most likely to generate heat, it is preferable to separate the heat dissipation areas from the first image sensor board 61B and the second image sensor board 63B.

[0041] It is preferable that camera unit 1 is always operable because it is used to manage items in refrigerator 100. When managing items in refrigerator 100, it is particularly preferable to efficiently dissipate heat from first image sensor board 61B and second image sensor board 63B and reduce the risk of malfunctions in wide-angle camera 61 and narrow-angle camera 63.

[0042] [1-3. Effects, etc.] As described above, camera unit 1 is installed on top surface 120A of refrigerator 100 and includes metal plate 40, wide-angle camera 61, narrow-angle camera 63, and SoC board 55 that controls wide-angle camera 61 and narrow-angle camera 63, and metal plate 40 and SoC board 55 are thermally connected via thermally conductive sheet 55A.

[0043] This allows the heat generated by the SoC board 55 to be conducted to the metal plate 40 via the thermally conductive sheet 55A, improving the heat dissipation performance of the camera unit 1 and reducing the risk of operational malfunctions.

[0044] In addition, the metal plate 40, the first image sensor board 61B provided in the wide-angle camera 61, and the second image sensor board 63B provided in the narrow-angle camera 63 may be thermally connected via thermal conduction sheets 61A and 63A.

[0045] This allows the heat generated by the first image sensor board 61B and the second image sensor board 63B to be conducted to the metal plate 40 via the thermal conduction sheets 61A and 63A, thereby improving the heat dissipation performance of the camera unit 1 and reducing the risk of operational malfunctions.

[0046] It also includes a case member 20 to which the wide-angle camera 61, narrow-angle camera 63 and SoC board 55 are attached, and a cover member 30 that covers the top of the case member 20, and the cover member 30 may have heat dissipation holes 31 that release heat from the metal plate 40 to the outside.

[0047] This allows the metal plate 40 to exchange heat with the air entering and exiting through the heat dissipation holes 31, thereby improving the heat dissipation performance of the wide-angle camera 61, narrow-angle camera 63 and SoC board 55, and reducing the risk of malfunctions in the operation of the camera unit 1.

[0048] Furthermore, in a planar view, the wide-angle camera 61, the narrow-angle camera 63, the SoC board 55, and the heat dissipation holes 31 are positioned in this order from the front, and the wide-angle camera 61, the narrow-angle camera 63, the SoC board 55, and the heat dissipation holes 31 may be arranged so as not to overlap each other in a planar view.

[0049] With this, the SoC substrate 55 is closer to the heat dissipation holes 31 than the wide-angle camera 61 and the narrow-angle camera 63, and therefore the efficiency of heat dissipation from the SoC substrate 55 through the heat dissipation holes 31 can be improved.

[0050] In addition, when viewed in a plan view, the metal plate 40 has a plate front portion 40Z that covers the first image sensor substrate 61B and the second image sensor substrate 63B, and a plate central portion 40Y that covers the SoC substrate 55, and may be provided with a heat transfer suppression portion 49 that suppresses heat transfer from the plate central portion 40Y to the plate front portion 40Z.

[0051] This makes it easier for the heat generated from the SoC substrate 55 and conducted to the metal plate 40 to be conducted toward the wide-angle camera 61 and the narrow-angle camera 63, i.e., toward the rear heat dissipation holes 31, rather than toward the plate front portion 40Z, thereby improving the efficiency of heat dissipation throughout the camera unit 1. Furthermore, because the heat dissipation properties of the wide-angle camera 61 and the narrow-angle camera 63 are improved, the risk of malfunctions during long-term operation of the wide-angle camera 61 and the narrow-angle camera 63 can be reduced.

[0052] The device also includes a power supply substrate 51 that is positioned behind the SoC substrate 55, the power supply substrate 51 being connected to a power supply, the metal plate 40 having a plate rear portion 40X that covers the power supply substrate 51, the plate rear portion 40X having a convex portion 47 formed so as not to come into contact with the power supply substrate 51, and the heat dissipation holes 31 may be formed so as not to overlap the convex portion 47 in a planar view and so as to maintain a predetermined distance W3 from the metal plate 40.

[0053] This allows heat generated by the power supply board 51 to be dissipated via the metal plate 40, reducing the risk of malfunctions in the operation of the power supply board 51. Also, because the distance between the metal plate 40 and the heat dissipation holes 31 is maintained at the predetermined interval W3, static electricity is less likely to occur, improving safety. Furthermore, because the protrusions 47 and the heat dissipation holes 31 do not overlap, the generation of static electricity is suppressed and the camera unit 1 can be made even more compact.

[0054] Furthermore, the plate central portion 40Y may be provided with a heat dissipation portion 45 formed so as to be recessed toward the SoC substrate 55.

[0055] This allows the SoC substrate 55 to be thermally connected to the metal plate 40 without changing the height of the SoC substrate 51 provided in the case member 20, resulting in a good layout.

[0056] The heat transfer suppressing portion 49 may also be formed on the plate front portion 40Z.

[0057] This allows heat generated from the SoC substrate 55 and conducted to the metal plate 40 to be more easily conducted to the heat dissipation holes 31 side rather than to the wide-angle camera 61 and narrow-angle camera 63 side, thereby improving the efficiency of heat dissipation for the entire camera unit 1. Furthermore, because the heat dissipation performance of the wide-angle camera 61 and narrow-angle camera 63 is improved, the risk of malfunction during long-term operation can be reduced.

[0058] Furthermore, the metal plate 40 may be composed of a first plate covering the first image sensor substrate 61B and the second image sensor substrate 63B, and a second plate covering the SoC substrate 55.

[0059] This makes it easier for heat generated from SoC substrate 55 and conducted to metal plate 40 to be conducted toward wide-angle camera 61 and narrow-angle camera 63, i.e., toward rear heat dissipation holes 31, rather than toward the first plate, thereby improving the efficiency of heat dissipation for the entire camera unit. Furthermore, because the heat dissipation properties of wide-angle camera 61 and narrow-angle camera 63 are improved, the risk of malfunction during long-term operation of wide-angle camera 61 and narrow-angle camera 63 can be reduced.

[0060] (Embodiment 2) [2-1. Configuration] [2-1-1. Second Metal Plate] Fig. 11 is a plan view of camera unit 1A in embodiment 2. Although Fig. 11 shows a state in which metal plate 40 has been removed, camera unit 1A is equipped with metal plate 40. Fig. 12 is a plan view of case member 20 in embodiment 2. Configurations similar to those in embodiment 1 are given the same reference numerals, and descriptions thereof will be omitted.

[0061] 11 , the camera unit 1A includes a second metal plate 210 below the power supply board 51, the sensor board 53, and the SoC board 55. The second metal plate 210 is disposed inside the partition section 23. The second metal plate 210 is an example of a "metal plate" or a "second metal plate."

[0062] 12 , the second metal plate 210 has a second plate rear portion 211, a second plate central portion 213, and a second plate front portion 212. The second plate rear portion 211 overlaps the left end of the power supply board 51 and the sensor board 53. The second plate central portion 213 is disposed between the power supply board 51 and the SoC board 55. An earth wire G extending from the power supply board 51 is grounded to the second plate central portion 213. The second metal plate 210 functions as a ground in the camera unit 1A.

[0063] The second plate front portion 212 overlaps the SoC substrate 55. The second plate front portion 212 has a first bent portion 217 formed to rise upward in the center of the area where it overlaps with the SoC substrate 55. A thermally conductive sheet 218 is attached to the upper surface of the first bent portion 217. The thermally conductive sheet 218 is in thermal contact with the SoC substrate 55.

[0064] Furthermore, the second plate front portion 212 has five flange portions 215A, 215B, 215C, 215D, and 215E. The flange portions 215A to 215E are bent and formed so as to rise upward. The flange portions 215A to 215D have through holes 216A, 216B, 216C, and 216D, respectively. The metal plate 40 (not shown) has through holes formed at positions corresponding to the through holes 216A to 216D. The second metal plate 210 and the metal plate 40 can be fastened together by inserting fastening members into the through holes. The metal plate 40 and the second metal plate 210 are electrically connected.

[0065] The metal plate 40 and the second metal plate 210 function as a shield that reduces noise generated from the power supply board 51, the sensor board 53, and the SoC board 55 and strengthens the ground. Furthermore, the metal plate 40 functions as the ground of the camera unit 1A by abutting against the second metal plate 210, thereby strengthening the ground.

[0066] Furthermore, the two flanges 215A and 215B located on the rear side electrically connect the SoC substrate 55 and the second metal plate 210. The flange 215A is located near the left front corner of the SoC substrate 55, and the flange 215B is located near the right front corner of the SoC substrate 55. The flanges 215A and 215B also function as a base for supporting the SoC substrate 55, thereby improving workability during assembly.

[0067] The two flanges 215C and 215D located on the front side electrically connect the second image sensor board 63B and the second metal plate 210. The flange 215C is located near the left rear corner of the second image sensor board 63B, and the flange 215D is located near the right rear corner of the second image sensor board 63B. The flanges 215C and 215D function as a base that supports the second image sensor board 63B, thereby improving the workability of assembly.

[0068] The two flanges 215D and 215E electrically connect the first image sensor board 61B and the second metal plate 210. The flange 215D is located near the left rear corner of the first image sensor board 61B, and the flange 215E is located near the right rear corner of the first image sensor board 61B. The flanges 215D and 215E function as a base that supports the first image sensor board 61B, thereby improving the workability of assembly.

[0069] The metal plate 40 is fixed to the case member 20 by screws that correspond to the male screws. Female threaded holes are formed in the case member 20 at locations that correspond to the screws. The female threaded holes are holes into which the screws that correspond to the male screws are threaded. The relationship between each member and the screws will be described below with reference to Figures 11 and 12.

[0070] The thermally conductive sheet 61A is provided between a screw A300 and a screw B301. The screw A300 is threaded into a female threaded hole provided on the −X direction side, i.e., the right side, of the first image sensor board 61B. The screw B301 is inserted into the through hole 216D and threaded into the female threaded hole.

[0071] Furthermore, a thermally conductive sheet 61A is provided between the metal plate 40 and the first image sensor board 61B. The metal plate 40 is fixed with screws A300 and B301. With the above configuration, the metal plate 40 is fastened with screws A300 and B301, so the distance between the metal plate 40 and the first image sensor board 61B can be made smaller than the thickness of the thermally conductive sheet 61A. This improves the adhesion between the thermally conductive sheet 61A and the metal plate 40, allowing for efficient dissipation of heat generated from the first image sensor board 61B.

[0072] The thermally conductive sheet 63A is provided between the screw B301 and the screw C302. The screw C302 is screwed into a female threaded hole provided on the +X direction side, i.e., the left side, of the second image sensor board 63B.

[0073] A thermally conductive sheet 63A is provided between the metal plate 40 and the second image sensor board 63B. The metal plate 40 is fixed with screws B301 and C302. With the above configuration, the distance between the metal plate 40 and the second image sensor board 63B can be made smaller than the thickness of the thermally conductive sheet 63A. This improves the adhesion between the thermally conductive sheet 63A and the metal plate 40, allowing for efficient dissipation of heat generated from the first image sensor board 63B.

[0074] The second metal plate 210 is connected to the first and second image sensor boards 61B and 63B with screws. Specifically, the first image sensor board 61B is connected to the second metal plate 210 with a sensor screw 310 inserted through the flange portion 215D and a sensor screw 311 inserted through the flange portion 215E. The second image sensor board 63B is connected to the second metal plate 210 with a sensor screw 312 inserted through the flange portion 215D and a sensor screw 313 inserted through the flange portion 215C.

[0075] Furthermore, the metal plate 40 and the second metal plate 210 are fixed together by screws B301 and D303. Screw D303 is inserted through the through hole 216C and threaded into the female threaded hole. With the above configuration, the second metal plate 210, the first image sensor board 61B, the second image sensor board 63B, and the metal plate 40 are electrically connected. This strengthens the grounding of the first image sensor board 61B and the second image sensor board 63B. This reduces noise generated from the first image sensor board 61B and the second image sensor board 63B.

[0076] The screws B301 are provided to efficiently dissipate heat generated from the first image sensor board 61B and the second image sensor board 63B and / or to reduce noise.

[0077] Thermal conduction sheet 55A is provided between screw E304, screw F305, and screw G306. Screw E304 is inserted into through-hole 216B and screwed into the female threaded hole. Screw F305 is inserted into through-hole 216A and screwed into the female threaded hole. Screw G306 is provided on the −Y direction side of SoC substrate 55, i.e., near the rear edge, and is inserted into the through-hole of second metal plate 210 and screwed into the female threaded hole formed in case member 20.

[0078] A thermally conductive sheet 55A is provided between the metal plate 40 and the SoC substrate 55. The metal plate 40 is fixed to the case member 20 by screws E304, F305, and G306. This configuration allows the distance between the metal plate 40 and the SoC substrate 55 to be smaller than the thickness of the thermally conductive sheet 55A. This improves adhesion between the thermally conductive sheet 55A and the metal plate 40, allowing for efficient dissipation of heat generated by the SoC substrate 55. Note that screws A300, B301, C302, D303, E304, F305, and G306 each correspond to an example of a screw used to fix the metal plate 40 to the case member 20.

[0079] The second metal plate 210 and the SoC substrate 55 are connected by board screws 321, 322, and 323, which are configured as male screws. In particular, board screw 321 is connected to the base of flange portion 215A, and board screw 322 is connected to the base of flange portion 215B. Furthermore, screws E 304 and F 305 secure the metal plate 40 to the second metal plate 210. This electrically connects the second metal plate 210, the SoC substrate 55, and the metal plate 40. By strengthening the ground of the SoC substrate 55, noise generated by the SoC substrate 55 can be reduced.

[0080] Furthermore, the SoC substrate 55 is fastened to the second metal plate 210 by the substrate screws 321, 322, and 323, which improves adhesion between the second metal plate 210 and the SoC substrate 55 and allows heat generated from the SoC substrate 55 to be dissipated efficiently.

[0081] [2-1-2. Arrangement] The wiring 65A of the distance measuring sensor 65 on the left side is routed through a first notch 231 formed in the partition part 23. The wiring 202A of the light emitting part 202 on the left side is routed through a second notch 232 formed in the partition part 23.

[0082] The wiring 65A of the right distance measuring sensor 65, the wiring 67A of the thermopile 67, and the wiring 203A of the buzzer 203 are routed through a third notch 234 formed in the partition 23. The wiring 202A of the right light emitting unit 202 is routed through a fourth notch 234 formed in the partition 23.

[0083] The right-side wirings 65A, 67A, 203A, and 202A are gathered together within the partition 23 and sandwiched by a clamp 215 provided on the second plate central portion 213. For example, the clamp 215 has a metal such as copper foil provided therein. The clamp 215 is fixed to the second plate central portion 213 by a clamp fixture 215A. This allows the second metal plate 210 to reduce noise generated from the right-side wirings 65A, 67A, 203A, and 202A.

[0084] The communication wiring 201A of the communication module 201 is routed through a fifth notch 235 formed in the partition 23 located between the communication module 201 and the SoC substrate 55. The communication wiring 201A is routed without being bundled with other wiring, which improves the noise resistance of the communication module 201.

[0085] The wiring 202A of the light-emitting unit 202 and the communication wiring 201A are configured as a so-called twisted cable. Furthermore, the wiring connecting the power supply board 51 and the sensor board 53, and the wiring connecting the sensor board 53 and the SoC board 55 are also configured as a so-called twisted cable. This makes it possible to suppress noise generation.

[0086] Furthermore, the power supply board 51, the sensor board 53, and the SoC board 55 are provided with bypass capacitors used to reduce noise.

[0087] [2-2. Effects] As described above, camera unit 1A is installed on top surface 120A of refrigerator 100 and includes second metal plate 210, wide-angle camera 61, narrow-angle camera 63, and SoC board 55 that controls wide-angle camera 61 and narrow-angle camera 63, and second metal plate 40 and SoC board 55 are thermally connected via thermal conduction sheet 218.

[0088] This allows the heat generated by the SoC board 55 to be conducted to the second metal plate 218 via the thermally conductive sheet 218, improving the heat dissipation performance of the camera unit 1A and reducing the risk of operational malfunctions.

[0089] In addition, a second metal plate 210 may be placed below the SoC substrate 55, and a metal plate 40 may be placed above the SoC substrate 55, with the SoC substrate 55 and the metal plate 40 being thermally connected via a thermal conduction sheet 55A.

[0090] This allows the SoC substrate 55 to be sandwiched between metal members from two directions, strengthening the ground and reducing the risk of malfunctions in the camera unit 1 A. Furthermore, heat generated in the SoC substrate 55 can be dissipated to the metal plate 40 and the second metal plate 210, improving the heat dissipation performance of the camera unit 1 A and reducing the risk of malfunctions in the camera unit 1 A.

[0091] (Other Embodiments) As described above, the above-mentioned embodiments have been described as examples disclosed in the present application. However, the technology in the present disclosure is not limited to these, and can be applied to embodiments in which modifications, substitutions, additions, omissions, etc. are made. Furthermore, it is also possible to combine the components described in the above-mentioned embodiments to create new embodiments. Therefore, other embodiments will be described below as examples.

[0092] In the above-described embodiments, the thermally conductive sheets 55A, 61A, 63A, and 218 are Sarcon® sheet thermal interface material (TIM). However, as long as they efficiently conduct heat between the heat-generating component and the metal plate 40, the thermally conductive sheets 55A, 61A, 63A, and 218 may be made of, for example, gel. This has the advantage of being flexible and therefore less affected by the shape of the heat-generating component. The Sarcon® sheet is made of silicone rubber, which has excellent thermal conductivity, heat resistance, insulation, and flexibility.

[0093] It should be noted that the above-described embodiments are intended to illustrate the technology of the present disclosure, and various modifications, substitutions, additions, omissions, etc. may be made within the scope of the claims or their equivalents.

[0094] [Configurations Supported by the Above-described Embodiments] The above-described embodiments support the following configurations.

[0095] (Additional Notes) (Technology 1) A camera unit to be installed on the top surface of a refrigerator includes a metal plate, a camera, and a first board that controls the camera, and the metal plate and the first board are thermally connected via a heat transfer member. This allows heat generated by the first board to be conducted to the metal plate via the heat transfer member. This improves the heat dissipation of the camera unit 1 and reduces the risk of operational malfunctions.

[0096] (Technology 2) The camera unit according to Technology 1, wherein the metal plate and the image sensor board of the camera are thermally connected via the heat transfer member. This allows heat generated by the image sensor board of the camera to be conducted to the metal plate via the heat transfer member. This improves the heat dissipation of the camera unit 1 and reduces the risk of operational malfunctions.

[0097] (Technology 3) The camera unit according to Technology 1 includes a case member to which the camera and the first board are attached, and a cover member that covers the upper part of the case member, the cover member having a heat dissipation hole that dissipates heat from the metal plate to the outside. With this, the metal plate exchanges heat with the air that flows in and out through the heat dissipation hole, thereby improving the heat dissipation performance of the camera and the first board and reducing the risk of malfunction of the camera unit.

[0098] (Technology 4) The camera unit according to any one of Technologies 1 to 3, wherein the camera, the first substrate, and the heat dissipation holes are positioned in this order from the front, and the camera, the first substrate, and the heat dissipation holes are arranged so as not to overlap one another in a plan view. With this, the first substrate is closer to the heat dissipation holes than the camera, and therefore the efficiency of heat dissipation of the first substrate by the heat dissipation holes can be improved.

[0099] (Technology 5) The camera unit according to any one of Technologies 1 to 4, wherein the metal plate has a front plate portion covering the image sensor substrate and a central plate portion covering the first substrate, and is provided with a heat transfer suppression portion that suppresses heat transfer from the central plate portion to the front plate portion. This allows heat generated from the first substrate and conducted to the metal plate to be more easily conducted to the camera side, i.e., the rear heat dissipation holes side, rather than the front plate side, thereby improving the heat dissipation efficiency of the entire camera unit. Furthermore, improving the heat dissipation performance of the camera reduces the risk of malfunction during long-term camera operation.

[0100] (Technology 6) The camera unit according to any one of Technologies 2 to 5, wherein the metal plate is composed of a first plate covering the image sensor substrate and a second plate covering the first substrate. This allows heat generated from the first substrate and conducted to the metal plate to be more easily conducted to the camera side, i.e., the rear heat dissipation holes, rather than the front side of the plate, thereby improving the heat dissipation efficiency of the entire camera unit. Furthermore, because the heat dissipation performance of the camera is improved, the risk of malfunction during long-term camera operation can be reduced.

[0101] (Technology 7) The camera unit according to any one of Technology 1 to Technology 6 further includes a second substrate disposed rearward of the first substrate, the second substrate being connected to a power source, the metal plate having a rear plate portion covering the second substrate, the rear plate portion having a convex portion formed so as not to come into contact with the second substrate, a case member and a cover member covering the upper portion of the case member, the cover member having a heat dissipation hole for dissipating heat from the metal plate to the outside, the heat dissipation hole being formed so as not to overlap the convex portion in a plan view and so as to maintain a predetermined distance from the metal plate. This allows heat generated by the second substrate to be dissipated through the metal plate, thereby reducing the risk of malfunction of the second substrate. Furthermore, because the distance between the metal plate and the heat dissipation hole is maintained at a predetermined distance, static electricity is less likely to be generated, improving safety. Furthermore, because the convex portion and the heat dissipation hole do not overlap, the camera unit can be further miniaturized while suppressing static electricity generation.

[0102] (Technology 8) The camera unit according to Technology 5 or 7, further comprising a heat dissipation section formed in the center of the plate so as to be recessed toward the first substrate. This allows the first substrate to be thermally connected to the metal plate without changing the height of the first substrate provided in the case member, resulting in a good layout.

[0103] (Technology 9) The camera unit according to any one of Technology 5, 7, and 8, wherein the heat transfer suppressing portion is formed on the front portion of the plate. This allows heat generated from the first substrate that is conducted to the metal plate to be more easily conducted to the heat dissipation holes rather than to the camera, improving the heat dissipation efficiency of the entire camera unit. Furthermore, because the heat dissipation performance of the camera is improved, the risk of operational malfunctions during long-term operation can be reduced.

[0104] (Technology 10) A camera unit according to any one of Technologies 1 to 9, wherein the metal plate is disposed on one side of the first substrate, a second metal plate is disposed on the other side of the first substrate, and the first substrate and the second metal plate are thermally connected via the heat transfer member. This allows the first substrate to be sandwiched between metal members from two directions, strengthening the ground and reducing the risk of operational malfunctions of the camera unit. Furthermore, heat generated on the first substrate can be dissipated to the metal plate and the second metal plate, improving the heat dissipation performance of the camera unit and reducing the risk of operational malfunctions.

[0105] As described above, the camera unit according to the present invention can be used to manage items stored in a refrigerator.

[0106] REFERENCE SIGNS LIST 1 Camera unit 1 20 Case member 30 Cover member 31 Heat dissipation hole 40 Metal plate 40X Rear portion of plate 40Y Central portion of plate 40Z Front portion of plate 45 Heat dissipation portion 47 Convex portion 49 Heat transfer suppression portion 51 Power supply board (second board) 53 Sensor board 55 SoC board (first board) 55A Heat conduction sheet (heat transfer member) 61 Wide-angle camera (camera) 61A Heat conduction sheet (heat transfer member) 61B First image sensor board (image sensor board) 63 Narrow-angle camera (camera) 63A Heat conduction sheet (heat transfer member) 63B Second image sensor board (image sensor board) W3 Spacing

Claims

1. A camera unit to be installed on the top surface of a refrigerator, comprising: a metal plate, a camera, and a first board that controls the camera, the metal plate and the first board being thermally connected via a heat transfer member.

2. The camera unit according to claim 1, wherein the metal plate and an image sensor board provided in the camera are thermally connected via the heat transfer member.

3. A camera unit as described in claim 1 or 2, comprising a case member to which the camera and the first board are attached, and a cover member covering the upper part of the case member, the cover member having a heat dissipation hole for dissipating heat from the metal plate to the outside.

4. A camera unit as described in claim 3, wherein the camera, the first substrate, and the heat dissipation holes are positioned in this order from the front, and the camera, the first substrate, and the heat dissipation holes are arranged so as not to overlap each other in a plan view.

5. A camera unit as described in claim 2, wherein the metal plate has a front portion covering the image sensor board and a central portion covering the first board, and is provided with a heat transfer suppressing portion that suppresses heat transfer from the central portion to the front portion.

6. The camera unit according to claim 2, wherein the metal plate is composed of a first plate covering the image sensor board and a second plate covering the first board.

7. A camera unit as described in claim 5, comprising a second board arranged rearward of the first board, the second board being connected to a power source, the metal plate having a rear plate portion covering the second board, the rear plate portion having a convex portion formed so as not to come into contact with the second board, a case member and a cover member covering the upper side of the case member, the cover member having a heat dissipation hole for dissipating heat from the metal plate to the outside, the heat dissipation hole being formed so as not to overlap the convex portion in a plan view and so as to maintain a predetermined distance from the metal plate.

8. The camera unit according to claim 7, further comprising a heat dissipation section formed in the center of the plate so as to be recessed toward the first substrate.

9. The camera unit according to claim 8, wherein the heat transfer suppressing portion is formed on a front portion of the plate.

10. A camera unit as described in claim 1 or 2, wherein the metal plate is arranged on one side of the first substrate, a second metal plate is arranged on the other side of the first substrate, and the first substrate and the second metal plate are thermally connected via the heat transfer member.

Images