Substrate processing device and positioning method of conveyance arm

Abstract

This substrate processing device for processing a substrate comprises: a conveyance module for conveying a substrate therein; a conveyance arm disposed inside the conveyance module and provided with at least one holding arm for holding the substrate; and a processing module connected to the conveyance module and including a processing chamber for processing the substrate therein. The processing chamber includes: a substrate support part having a support surface for supporting the substrate; a plate member disposed above the substrate support part; and a lateral wall part constituting an inner surface of the processing chamber. A processing space surrounded by the substrate support part, the plate member, and the lateral wall part is formed in the processing chamber. The conveyance arm includes a sensor for positioning the conveyance arm on the basis of the distances, in the processing space, from the substrate support part, the plate member, and the lateral wall part.

Description

Substrate processing apparatus and transfer arm alignment method

[0001] The present disclosure relates to a substrate processing apparatus and a method for aligning a transfer arm.

[0002] Patent Document 1 discloses a technology for setting the position of a substrate transfer machine in semiconductor manufacturing equipment using a reflective distance detection sensor. The semiconductor substrate position detection device disclosed in Patent Document 1 uses a jig with a pin attached to the center of a plate shaped similar to the semiconductor substrate, and a reflective distance detection sensor. The reflective distance detection sensor detects the side of the jig, reads the vertical position of the semiconductor substrate, and then detects the center of the pin to detect the left-right angular position of the substrate transfer machine and the distance to the pin.

[0003] Japanese Patent Application Publication No. 7-74229

[0004] The technology disclosed herein appropriately aligns a transfer arm within a processing chamber.

[0005] One aspect of the present disclosure is a substrate processing apparatus for processing a substrate, the substrate processing apparatus comprising: a transfer module that transfers the substrate therein; a transfer arm that is disposed within the transfer module and has at least one holding arm that holds the substrate; and a processing module that is connected to the transfer module and has a processing chamber that processes the substrate therein; the processing chamber including a substrate support portion that has a support surface for the substrate, a plate member that is disposed above the substrate support portion, and a sidewall portion that forms an inner surface of the processing chamber; a processing space that is surrounded by the substrate support portion, the plate member, and the sidewall portion is formed in the processing chamber; and the transfer arm has a sensor that aligns the transfer arm in the processing space based on the distance between the substrate support portion, the plate member, and the sidewall portion.

[0006] According to the present disclosure, it is possible to appropriately align a transfer arm within a processing chamber.

[0007] FIG. 1 is a plan view showing an outline of the configuration of a wafer processing apparatus according to this embodiment; FIG. 2 is a perspective view showing the configuration of a transfer arm of a transfer module; FIG. 3 is a schematic plan view showing an example of the configuration of an effector during alignment; FIG. 4 is a schematic explanatory view of an alignment method in a processing module; FIG. 5 is a schematic explanatory view of the rotation direction of a sensor;

[0008] In the manufacturing process of semiconductor devices, a step of etching and removing an oxide film formed on the surface of a semiconductor wafer (hereinafter sometimes referred to as a "wafer") is performed. For example, the oxide film etching step is performed by a COR (Chemical Oxide Removal) process and a PHT (Post Heat Treatment) process.

[0009] In a substrate processing system, the COR process and the PHT process may be performed in different process modules, and in order to properly process the wafer in each process module, it is necessary to accurately transfer the wafer to an appropriate position on a mounting table, etc. For this reason, a process called teaching (also called alignment) is performed in which the transfer position of the wafer on the mounting table, etc. is stored as a target position in the transfer arm that transports the wafer to the process module.

[0010] The above-mentioned Patent Document 1 discloses that the position of a semiconductor substrate is automatically detected using a jig and a sensor, which is said to reduce teaching time and improve work efficiency and performance.

[0011] However, in the technique described in Patent Document 1, semiconductor substrate position detection is performed two-dimensionally (e.g., in the XY plane direction), and teaching is not performed three-dimensionally (e.g., in the XYZ spatial direction). In recent years, it has become known that components included in chambers of processing modules, such as substrate support parts (also called stages) and shower plates, are configured to be freely movable. Until now, the displacement of the substrate support parts and shower plates has been adjusted based on the process conditions of each process, such as COR processing and PHT processing, which can lead to differences between equipment models and between multiple processing modules within the same equipment. Another issue is that the process startup time increases due to the adjustments.

[0012] In the processing modules of recent substrate processing systems, even if a wafer is placed at the center of the stage, the process results are affected by factors such as gas flow and heat from the sidewalls of the chamber, so mounting errors, including those in the height direction of each component such as the stage and shower plate, have a significant impact on the process. Therefore, in order to transport the wafer to the optimal position within the processing space, it is necessary to guide the transfer arm to an arbitrary teaching position in the three-dimensional space within the processing chamber.

[0013] The technology disclosed herein has been developed in consideration of the above circumstances, and provides for proper alignment of a transfer arm within a processing chamber. Hereinafter, a wafer processing apparatus and alignment method according to this embodiment will be described with reference to the drawings. Note that in this specification and the drawings, elements having substantially the same functional configuration are designated by the same reference numerals, and redundant description will be omitted.

[0014] <Wafer Processing Apparatus> First, the configuration of a wafer processing apparatus according to this embodiment will be described. FIG. 1 is a plan view showing an outline of the configuration of the wafer processing apparatus according to this embodiment. In this embodiment, a case will be described in which the wafer processing apparatus 1 includes processing modules for performing substrate processing, cleaning processing, and aligner processing on a wafer W as a substrate. Note that the module configuration of the wafer processing apparatus 1 of the present disclosure is not limited to this and can be selected arbitrarily. In this specification, the width direction of the wafer processing apparatus 1 will sometimes be illustrated and described as the X-axis direction, the longitudinal direction as the Y-axis direction, and the height direction as the Z-axis direction.

[0015] 1, the wafer processing apparatus 1 has a configuration in which an atmospheric section 10 and a reduced pressure section 11 are integrally connected via load lock modules 20a and 20b. The atmospheric section 10 includes a plurality of atmospheric modules that perform desired processing on wafers W in an atmospheric pressure atmosphere. The reduced pressure section 11 includes a plurality of reduced pressure modules that perform desired processing on wafers W in a reduced pressure atmosphere.

[0016] The load lock module 20a temporarily holds the wafer W transferred from a loader module 30 (described later) in the atmospheric section 10, in order to transfer the wafer W to a transfer module 60 (described later) in the decompression section 11. The load lock module 20a has an upper stocker 21a and a lower stocker 22a that hold two wafers W in the vertical direction.

[0017] The load lock module 20a is connected to a loader module 30 (described later) via a gate 24a having a gate valve 23a. This gate valve 23a ensures airtightness between the load lock module 20a and the loader module 30 while allowing communication between them. The load lock module 20a is also connected to a transfer module 60 (described later) via a gate 26a having a gate valve 25a. This gate valve 25a ensures airtightness between the load lock module 20a and the transfer module 60 while allowing communication between them.

[0018] The load lock module 20a is connected to an air supply section (not shown) that supplies gas and an exhaust section (not shown) that exhausts gas, and is configured so that the interior atmosphere can be switched between atmospheric pressure and reduced pressure atmosphere by the air supply section and the exhaust section. That is, the load lock module 20a is configured so that the wafer W can be appropriately transferred between the atmospheric pressure section 10 and the reduced pressure section 11.

[0019] The load lock module 20b has the same configuration as the load lock module 20a, i.e., it has an upper stocker 21b, a lower stocker 22b, a gate valve 23b and a gate 24b on the loader module 30 side, and a gate valve 25b and a gate 26b on the transfer module 60 side.

[0020] The number and arrangement of the load lock modules 20a and 20b are not limited to those in this embodiment, but can be set arbitrarily.

[0021] The atmospheric section 10 has a loader module 30 equipped with a wafer transport mechanism 40 described later, a load port 32 on which a FOUP 31 capable of storing multiple wafers W is placed, a wafer cleaning module 33 that removes fluorine from the wafers W, and an aligner module 34 that adjusts the horizontal orientation of the wafers W.

[0022] The loader module 30, which serves as a wafer W transfer device, is composed of a rectangular housing, the interior of which is maintained at atmospheric pressure. A plurality of, for example, three load ports 32 are arranged side by side on one long side of the loader module 30 housing. Load lock modules 20 a and 20 b are arranged side by side on the other long side of the loader module 30 housing. An atmospheric substrate processing device (e.g., a wafer cleaning module, a wafer cooling module, an optical film thickness measurement device, etc.) 33 may be arranged on one short side of the loader module 30 housing. An aligner module 34 is arranged on the other short side of the loader module 30 housing.

[0023] The number and arrangement of the load ports 32 and aligner modules 34 are not limited to those in this embodiment and may be arbitrarily designed. For example, a plurality of wafer cleaning modules 33 may be provided, one on each side of the load lock modules 20 a, 20 b.

[0024] The FOUP 31 accommodates a plurality of wafers W, for example, 25 wafers per lot, stacked in multiple stages at equal intervals. The interior of the FOUP 31 placed on the load port 32 is filled with, for example, air or nitrogen gas and sealed.

[0025] The atmospheric substrate processing apparatus 33 may cool the wafer W after the COR process or the PHT process, and may measure the film thickness of the wafer W before and after the COR process.

[0026] The aligner module 34 adjusts the horizontal orientation of the wafer W by rotating the wafer W. Specifically, when performing wafer processing on each of the multiple wafers W, the aligner module 34 adjusts the wafer W so that the horizontal orientation from a reference position (e.g., notch position) is the same for each wafer processing.

[0027] A wafer transfer mechanism 40 that transfers wafers W is provided inside the loader module 30. The wafer transfer mechanism 40 has a transfer arm 41 (41a, 41b) that holds and moves the wafer W, a rotary table 42 that rotatably supports the transfer arm 41, and a rotary mounting table 43 on which the rotary table 42 is mounted. The wafer transfer mechanism 40 is configured to be movable in the longitudinal direction inside the housing of the loader module 30.

[0028] The decompression unit 11 includes a transfer module 60 that simultaneously transfers two wafers W, a substrate processing module 61 that performs, for example, COR processing on the wafers W transferred from the transfer module 60, and a substrate processing module 62 that performs, for example, PHT processing on the wafers W transferred from the transfer module 60. The interiors of the transfer module 60, the substrate processing module 61, and the substrate processing module 62 are each maintained in a decompressed atmosphere. A plurality of, for example, three, substrate processing modules 61 and 62 are provided for the transfer module 60.

[0029] The transfer module 60 has an internal rectangular housing and is connected to the load lock modules 20a and 20b via the gate valves 25a and 25b as described above. The transfer module 60 has an internal rectangular housing and transfers a wafer W loaded into the load lock module 20a to one substrate processing module 61 and one substrate processing module 62 in sequence, where the wafer W is subjected to, for example, COR processing and PHT processing, and then transferred to the atmospheric section 10 via the load lock module 20b.

[0030] Two stages 63a and 63b are provided inside the substrate processing module 61, on which two wafers W are placed side by side in a horizontal direction. The substrate processing module 61 simultaneously performs, for example, COR processing on the two wafers W by placing the wafers W side by side on the stages 63a and 63b. The substrate processing module 61 is connected to an air supply unit (not shown) that supplies a processing gas, a purge gas, etc., and an exhaust unit (not shown) that exhausts the gas.

[0031] The substrate processing module 61 is connected to the transfer module 60 via a gate 65 provided with a gate valve 64. This gate valve 64 ensures airtightness between the transfer module 60 and the substrate processing module 61 while also allowing communication between them.

[0032] Two stages 66a, 66b are provided inside the substrate processing module 62, on which two wafers W are placed side by side in a horizontal direction. The substrate processing module 62 simultaneously performs, for example, PHT processing on the two wafers W by placing the wafers W side by side on the stages 66a, 66b. The substrate processing module 62 is connected to an air supply unit (not shown) that supplies gas and an exhaust unit (not shown) that discharges gas.

[0033] The substrate processing module 62 is connected to the transfer module 60 via a gate 68 provided with a gate valve 67. This gate valve 67 ensures airtightness between the transfer module 60 and the substrate processing module 62 while also allowing communication between them.

[0034] A wafer transfer mechanism 70 for transferring wafers W is provided inside the transfer module 60. The wafer transfer mechanism 70 includes transfer arms 71 (71a, 71b) that hold and move two wafers W, a rotary table 72 that rotatably supports the transfer arms 71a, 71b, and a rotary table 73 on which the rotary table 72 is mounted. Also, a guide rail 74 extending in the longitudinal direction of the transfer module 60 is provided inside the transfer module 60. The rotary table 73 is mounted on the guide rail 74, and the wafer transfer mechanism 70 is configured to be movable along the guide rail 74.

[0035] In the transfer module 60, the transfer arm 71a receives two wafers W held in the upper stocker 21a and the lower stocker 22a in the load lock module 20a and transfers them to the substrate processing module 61. Furthermore, the transfer arm 71a holds two wafers W that have been subjected to, for example, COR processing and transfers them to the substrate processing module 62. Furthermore, the transfer arm 71b holds two wafers W that have been subjected to, for example, PHT processing and transfers them to the load lock module 20b.

[0036] The wafer processing apparatus 1 described above is provided with a control unit 80. The control unit 80 is, for example, a computer equipped with a CPU, a memory, etc., and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of wafers W in the wafer processing apparatus 1. The program may control the transfer arm 71 of the wafer processing apparatus 1 and a sensor provided on the transfer arm 71. A correction calculation unit for control may also be provided. The program may be recorded on a computer-readable storage medium H and installed into the control unit 80 from the storage medium H. The storage medium H may be temporary or non-temporary.

[0037] <Transfer Arm Configuration> Figure 2 is a perspective view showing a schematic configuration of the transfer arm 71. As shown in Figure 2, the transfer arm 71a has a first arm 75a having one end rotatably connected to the turntable 72, a second arm 76a having one end rotatably connected to the other end of the first arm 75a, and a third arm 77a having one end rotatably connected to the other end of the second arm 76a. A multi-stage effector 78a serving as a pick for holding a wafer W is connected to the other end of the third arm 77a. The multi-stage effector 78a is configured by stacking multiple effectors in a multi-stage configuration. The number of stages is arbitrary, and may be, for example, a two-stage configuration, in which case the multi-stage effector 78a may be configured with an upper stage effector 78a-1 and a lower stage effector 78a-2.

[0038] The transfer arm 71b has a first arm 75b having one end rotatably connected to the turntable 72, a second arm 76b having one end rotatably connected to the other end of the first arm 75b, and a third arm 77b having one end rotatably connected to the other end of the second arm 76b. A multi-stage effector 78b serving as a pick for holding the wafer W is connected to the other end of the third arm 77b. The multi-stage effector 78b is configured by stacking a plurality of effectors in a multi-stage manner, and the number of stages is arbitrary, and may be, for example, a two-stage type, in which case the multi-stage effector 78b may be configured by an upper-stage effector 78b-1 and a lower-stage effector 78b-2.

[0039] 3 is a schematic plan view showing an example of the configuration of the multi-stage effectors 78a (78a-1, 78a-2) and 78b (78b-1, 78b-2) during alignment, illustrating the upper-stage effector 78b-1 in plan view as a representative of the effectors of each transfer arm 71a, 71b. As shown in FIG. 3, the upper-stage effector 78b-1 includes claws 90 and 91 that are bifurcated around the connection position with the third arm 77a. A sensor 100 is attached to the tip of at least one of the claws 90 (and / or 91).

[0040] The sensor 100 may be, for example, a photoelectric sensor that measures distance by irradiating an object with laser light and detecting the reflected light. Furthermore, the photoelectric sensor 100 may be configured to be rotatable 360° around an axis (ZY plane direction) that is the axis of extension of the transfer arm 71. That is, the sensor 100 may be configured to irradiate laser light in all three dimensions in accordance with the extension of the transfer arm 71. When the transfer arm 71 is inserted into a processing module such as the substrate processing module 61 or 62, the sensor 100 can measure the distance to components such as the substrate support (stage), plate member (gas supply plate), and sidewall of each processing module. The sensor 100 can also measure the shapes of various components, such as the outer shape of the substrate support and the outer shape of the plate member. That is, by laser scanning components such as the substrate support, plate member, and sidewall, the height position and center position of the components, as well as the spatial center position of the processing space formed within the processing module, can be identified. Additionally, the plate member in each processing module may include an upper electrode assembly.

[0041] The sensor 100 may be detachably attached. That is, the sensor 100 may be attached to the effector during alignment and detached during substrate processing. In the configuration according to this embodiment, it is preferable that at least one sensor 100 is attached to each of the multi-stage effectors 78a and 78b. In the multi-stage effectors 78a and 78b, the sensor 100 may be attached to either the upper or lower effector. The attachment position of the sensor 100 on the multi-stage effectors 78a and 78b is arbitrary and is not limited to the position shown in the figure. For example, the sensor 100 may be attached to a position such as the base of the claw portion 90 (and / or 91). However, it is necessary to specify in advance the relationship between the center position of the wafer W when held by the multi-stage effectors 78a and 78b and the attachment position of the sensor 100.

[0042] <Method of Aligning in Processing Module> A transfer arm 71 of a wafer transfer mechanism 70 that is provided inside the transfer module 60 and that transfers a wafer W is inserted into each processing module, such as the substrate processing module 61 and the substrate processing module 62. The insertion of the transfer arm 71 is performed in various cases, such as when holding a wafer W and performing substrate processing in each processing module, or when holding a dummy wafer and aligning the transfer arm 71.

[0043] 4 and 5 are schematic explanatory diagrams of a method for aligning processing modules, and schematically illustrate a state in which a transfer arm 71 is inserted from transfer module 60 of wafer processing apparatus 1 according to this embodiment into each processing module, such as substrate processing module 61 or substrate processing module 62. Note that, as an example, Fig. 4 shows an X-Z cross-sectional view when transfer arm 71 is inserted into substrate processing module 61, and Fig. 5 shows a Y-Z cross-sectional view.

[0044] 4 and 5, the substrate processing module 61 includes a processing chamber 112, which includes a sidewall 113 that forms the inner surface of the processing chamber 112. A stage 63a (63b) serving as a substrate support is provided at the bottom inside the processing chamber 112. A plate member 110 that supplies gas, for example, is disposed above the stage 63a (63b). In a processing space U surrounded by the stage 63a (63b), the plate member 110, and the sidewall 113, a wafer W is subjected to, for example, COR processing.

[0045] When aligning the transfer arm 71, the transfer module 60 and the substrate processing module 61 are first set under a reduced pressure atmosphere. At this time, a processing gas for, for example, COR processing may be supplied to the processing space U.

[0046] Next, the transfer arm 71 is moved in the X-axis direction (left and right direction in the figure) to move the position of the sensor 100, and laser scanning is performed while rotating the sensor 100 in the YZ directions (Z radial directions) as shown by the arrows in Figure 6. This measures the distances between the sensor 100 and the stage 63a (63b), the plate member 110, and the side wall portion 113, and measures the outer shapes of each member.

[0047] Then, based on the measured data, the transfer arm 71 is aligned. This alignment is valid for any teaching position; for example, the optimal position coordinates of the transfer arm 71 are calculated for the processing space U in which the desired processing is performed on the wafer W. Specifically, a corrected position in the XY plane is calculated from the relationship between the center of the stage 63a (63b) in the XY plane and the center of the plate member 110 in the XY plane. Furthermore, the intermediate position between the stage and the plate member is calculated as the corrected position in the Z-axis direction. Then, for example, the ideal center position coordinates of the wafer W are calculated from the relationship between the center position of the transfer arm 71 and the center position of the held wafer W. The optimal position (position P in FIGS. 4 and 5) derived in this manner is calculated as the ideal center position of the wafer W.

[0048] In this way, for each processing module such as the substrate processing module 61 and the substrate processing module 62, for example, the ideal center position coordinates of the wafer W relative to the processing space U are calculated, and the transfer arm 71 is guided.

[0049] The above-described method for aligning the transfer arm 71 may be implemented as an automatic teaching method under automatic control, i.e., may be implemented automatically under the control of the control unit 80 provided in the wafer processing apparatus 1.

[0050] The above alignment method may be performed under the same conditions as those used for substrate processing in each processing module, or under different conditions. For example, when aligning the transfer arm 71, the chamber of each processing module may be open to the atmosphere.

[0051] Furthermore, a substrate support such as stage 63a (63b) provided in each processing module may be provided with a drive mechanism (not shown) that allows it to be moved up and down (in the Z-axis direction in FIGS. 4 and 5). By moving the substrate support, the positional relationship between the plate member 110 and the substrate support can be adjusted. The above-described method of aligning the transfer arm 71, which can be performed at any position in three-dimensional space, is also effective for such a configuration.

[0052] <Effects of the Technique of the Present Disclosure> As described above, in the transfer arm 71 of the wafer transfer mechanism 70 provided in the wafer processing apparatus 1 according to this embodiment, the distances between the sensor 100 and the stage 63 a (63 b), the plate member 110, and the sidewall 113 are measured, and alignment is performed based on the measured data. This allows the transfer arm 71 to be aligned to any position in three-dimensional space within the processing chamber of each processing module, such as the substrate processing module 61 or the substrate processing module 62. In other words, the transfer arm 71 holding the wafer W can be guided to any position in three-dimensional space within the processing chamber, making it possible to place the wafer W at a desired position.

[0053] As in the wafer processing apparatus 1 according to this embodiment, it is common for a plurality of processing modules, such as substrate processing module 61 and substrate processing module 62, to be provided. Errors associated with the assembly of components and process condition errors associated with the installation of other components occur in each processing module and chamber. Specifically, errors due to assembly errors or the installation of other components, such as displacement of the height of stage 63a (63b), displacement of the height of plate member 110, and displacement of the center position of plate member 110, may result in process variations and increased process startup time. According to the alignment method described in this embodiment, the transfer arm 71 is aligned with any position in three-dimensional space within the processing chamber of each processing module, thereby resolving these issues.

[0054] Furthermore, the alignment method described in this embodiment can be performed automatically under conditions that are substantially the same as the process conditions of the wafer processing apparatus 1. In other words, it is no longer necessary to open the wafer processing apparatus 1 to the atmosphere and perform alignment manually, which improves alignment accuracy and improves work efficiency.

[0055] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0056] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0057] For example, in the above embodiment, the wafer processing apparatus 1 is described as including processing modules for performing COR processing, PHT processing, cleaning processing, and aligner processing on wafers W, and the substrate processing modules 61 and 62 are illustrated as having two wafers W arranged horizontally, but the present invention is not limited to this. That is, a so-called multi-wafer configuration in which three or more wafers W are arranged horizontally may also be used.

[0058] REFERENCE SIGNS LIST 1 wafer processing apparatus 61 substrate processing module 62 substrate processing module 63a, 63b stages 66a, 66b stages 71 transfer arm 100 sensor 110 plate member 113 side wall U processing space W wafer

Claims

1. A substrate processing apparatus for processing a substrate, comprising: a transfer module for transferring the substrate therein; a transfer arm disposed inside the transfer module and having at least one holding arm for holding the substrate; and a processing module connected to the transfer module and having a processing chamber therein for processing the substrate, wherein the processing chamber includes a substrate support having a support surface for the substrate, a plate member disposed above the substrate support, and a sidewall portion constituting an inner surface of the processing chamber, wherein a processing space is formed in the processing chamber and is surrounded by the substrate support portion, the plate member, and the sidewall portion, and the transfer arm has a sensor for aligning the transfer arm in the processing space based on the distance between the substrate support portion, the plate member, and the sidewall portion.

2. The substrate processing apparatus of claim 1, wherein the sensor is a photoelectric sensor configured to be freely rotatable around an axis that is the extension direction of the transport arm, scans the inside of the processing chamber, and measures the distance between the substrate support portion, the plate member, and the side wall portion.

3. The substrate processing apparatus according to claim 1 or 2, wherein the substrate support portion is configured to be movable vertically inside the processing chamber.

4. A method for aligning a transport arm that transports a substrate in a substrate processing apparatus, the substrate processing apparatus comprising: a transport module that transports the substrate therein; a transport arm that is disposed inside the transport module and has at least one holding arm that holds the substrate; and a processing module that is connected to the transport module and has a processing chamber that processes the substrate therein; the processing chamber includes a substrate support part having a support surface for the substrate, a plate member that is disposed above the substrate support part, and a sidewall part that constitutes an inner surface of the processing chamber; a processing space that is surrounded by the substrate support part, the plate member, and the sidewall part is formed in the processing chamber; and the transport arm has a sensor that aligns the transport arm in the processing space based on the distance between the substrate support part, the plate member, and the sidewall part.

Images