Camera module comprising damper and electronic device comprising same

Abstract

A camera module is provided. The camera module comprises: a lens having an optical axis; a first structure for conveying the lens along the optical axis; a second structure configured such that the first structure moves along the second structure; an extension part extending from any one of the first structure and the second structure; a guide tunnel, which is arranged in the other one of the first structure and the second structure and guides the extension part; and a damper for attenuating, in the direction of the optical axis, movement of the extension part.

Description

Camera module including a damper and electronic device including the same

[0001] The disclosure relates to a camera module and an electronic device including the same. More particularly, the disclosure relates to a camera module including a damper and an electronic device including the same.

[0002] To implement autofocus in camera modules, actuators are being developed to move the lens along the optical axis. For example, the lens can be actuated using a spring, a ball, a shape-memory alloy (SMA) wire, or any other actuator.

[0003] The foregoing information is provided solely as background to aid understanding of the disclosure. No determination has been made, nor is any assertion made, that any of the foregoing information constitutes prior art with respect to the disclosure.

[0004] Aspects of the disclosure at least partially address the problems and / or disadvantages mentioned above and provide at least the advantages described below. Accordingly, one aspect of the disclosure provides a camera module including a damper and an electronic device including the same.

[0005] Additional aspects are set forth in part in the description of the invention below, and in part are obvious from the description of the invention or may be learned by practice of the embodiments provided.

[0006] According to one aspect of the disclosure, a camera module is provided. The camera module may include a lens having an optical axis, a first structure configured to transport the lens along the optical axis, a second structure, wherein the first structure is configured to move relative to the second structure, an extension extending from one of the first structure and the second structure, a guide tunnel disposed in the other of the first structure and the second structure and configured to guide the extension, and a damper configured to damp movement of the extension in the direction of the optical axis.

[0007] According to another aspect of the disclosure, an electronic device is provided. The electronic device may include a camera module, wherein the camera module includes a lens having an optical axis, a first structure configured to transport the lens along the optical axis, a second structure, wherein the first structure is configured to move relative to the second structure, an extension extending from one of the first structure and the second structure, a guide tunnel disposed in the other of the first structure and the second structure and configured to guide the extension, and a damper configured to damp movement of the extension in the direction of the optical axis.

[0008] Other aspects, advantages and salient features of the disclosure will become apparent to those skilled in the art from the following description of the invention, which sets forth various embodiments of the disclosure together with the accompanying drawings.

[0009] The above and other aspects, features and advantages of specific embodiments of the disclosure will become apparent from the following detailed description with reference to the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the disclosure.

[0011] FIG. 2 is a block diagram illustrating a camera module according to an embodiment of the disclosure.

[0012] FIG. 3 is a perspective view of a one-way electronic device according to one embodiment of the disclosure.

[0013] FIG. 4 is a perspective view of an electronic device in another direction according to one embodiment of the disclosure.

[0014] FIG. 5 is a perspective view of a camera module according to an embodiment of the disclosure.

[0015] Figure 6 is an exploded perspective view of a camera module according to one embodiment of the disclosure.

[0016] FIG. 7 is a plan view of a camera module according to an embodiment of the disclosure.

[0017] FIG. 8 is a side view of a camera module according to an embodiment of the disclosure.

[0018] FIG. 9 is a cross-sectional view taken along line 9-9 of the camera module of FIG. 7 according to an embodiment of the disclosure.

[0019] FIG. 10 is a cross-sectional view taken along line 10-10 of the camera module of FIG. 7 according to an embodiment of the disclosure.

[0020] FIG. 11 is an enlarged view of part A of the camera module of FIG. 10 according to an embodiment of the disclosure.

[0021] FIG. 12 is a cross-sectional view taken along line 12-12 of the camera module of FIG. 8 according to an embodiment of the disclosure.

[0022] FIG. 13 is a drawing illustrating a camera module according to an embodiment of the disclosure.

[0023] Identical reference numbers are used throughout the drawings to represent identical components.

[0024] To facilitate a comprehensive understanding of the various embodiments of the disclosure as defined by the claims and their equivalents, the following description is provided with reference to the accompanying drawings. While the description includes numerous specific details to facilitate understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and structures may be omitted for clarity and brevity.

[0025] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to facilitate a clear and consistent understanding of the disclosure. Accordingly, the following description of various embodiments of the disclosure is provided solely for illustrative purposes and is not intended to limit the disclosure, as defined by the appended claims and their equivalents.

[0026] The singular forms "a," "an," and "the" should be understood to include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of those surfaces.

[0027] It should be understood that the blocks in each of the flowcharts and combinations of flowcharts can be performed by one or more computer programs containing instructions. The entirety of one or more computers may be stored in a single memory device, or one or more computer programs may be divided into different portions stored in different memory devices.

[0028] Any of the functions and operations described herein may be processed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing, and may be an application processor (AP) (e.g., a central processing unit (CPU)), a communication processor (CP) (e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, or a Bluetooth chip. ® It may include a chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, a connectivity chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on a chip (SoC), an integrated circuit (IC), or the like.

[0029] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the disclosure.

[0030] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0031] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0032] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0033] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0034] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0035] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0036] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0037] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0038] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0039] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0043] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0045] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4th generation (4G) network, for example, new radio access technology (NR). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0048] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0049] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0050] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0051] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0053] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0054] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0055] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0056] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0057] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0058] FIG. 2 is a block diagram illustrating a camera module according to an embodiment of the disclosure.

[0059] Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0060] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0061] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) by using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). In one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) can be configured as at least a portion of the memory (130) or as a separate memory that operates independently therefrom.

[0062] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0063] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0064] FIG. 3 is a perspective view of a one-way electronic device according to one embodiment of the disclosure.

[0065] FIG. 4 is a perspective view of an electronic device in another direction according to one embodiment of the disclosure.

[0066] Referring to FIGS. 3 and 4, an electronic device (301) (e.g., the electronic device (101) of FIG. 1) may include a housing (310) having a first side (310A) (e.g., a front side), a second side (310B) (e.g., a back side), and a third side (310C) (e.g., a side side) surrounding a space between the first side (310A) and the second side (310B). The first side (310A) may be formed by a first plate (311A) that is at least partially transparent. For example, the first plate (311A) may include a glass plate or a polymer plate that includes at least one coating layer. The second side (310B) may be formed by a second plate (311B) that is substantially opaque. For example, the second plate (311B) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination thereof. The third surface (310C) may be formed by a frame (311C) that is joined to the first plate (311A) and the second plate (311B) and includes a metal and / or polymer. The second plate (311B) and the frame (311C) may be formed monolithically. The second plate (311B) and the frame (311C) may be formed of substantially the same material (e.g., aluminum).

[0067] The electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may be disposed on the third surface (310C). The input module (350) may include at least one key input device. For example, the key input device may include one or more mechanical actuators (e.g., buttons), one or more capacitors, and / or one or more inductors.

[0068] The electronic device (301) may include an audio output module (355) (e.g., the audio output module (155) of FIG. 1). The audio output module (355) may be disposed on the third surface (310C). The audio output module (355) may include one or more holes.

[0069] The electronic device (301) may include a display module (361) (e.g., the display module (160) of FIG. 1). The display module (361) may be disposed on the first surface (310A). The display module (361) may be visible through at least a portion of the first plate (311A). The display module (361) may have a shape substantially the same as the shape of the outer edge of the first plate (311A). The edge of the display module (361) may substantially coincide with the outer edge of the first plate (311A). The display module (361) may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. The display module (361) may include a screen display area (361A) that is visually exposed and displays content through pixels. The display area (361A) may include a sensing area (361A-1). The sensing area (361A-1) may overlap with at least a portion of the display area (361A). The sensing area (361A-1) may allow transmission of an input signal related to the sensor module (376) (e.g., the sensor module (176) of FIG. 1 ). The sensing area (361A-1) may display content similarly to the display area (361A) that does not overlap with the sensing area (361A-1). For example, the sensing area (361A-1) may display content while the sensor module (376) is not operating. At least a portion of the camera area (361A-2) may overlap with the display area (361A). The display area (361A) may include the camera area (361A-2). The camera area (361A-2) may allow transmission of an optical signal associated with a first camera module (380A) (e.g., camera module (180) of FIG. 1 and / or camera module (180) of FIG. 2).At least a portion of the camera area (361A-2) overlapping the screen display area (361A) may display content similarly to the screen display area (361A) that does not overlap the camera area (361A-2). For example, the camera area (361A-2) may display content while the first camera module (380A) is not operating.

[0070] The electronic device (301) may include an audio module (370) (e.g., the audio module (170) of FIG. 1). The audio module (370) may be positioned on the third surface (310C). The audio module (370) may obtain sound through at least one hole.

[0071] The electronic device (301) may include a sensor module (376). The sensor module (376) may be disposed on the first surface (310A). The sensor module (376) may form a sensing area (361A-1) in at least a portion of the screen display area (361A). The sensor module (376) may receive an input signal passing through the sensing area (361A-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). The input signal may include a signal related to a user's biometric information (e.g., a fingerprint).

[0072] The electronic device (301) may include a connection terminal (378) (e.g., the connection terminal (178) of FIG. 1). The connection terminal (378) may be positioned on the third surface (310C). For example, when the electronic device (301) is viewed in one direction (e.g., the +Y direction), the connection terminal (378) may be positioned substantially in the center of the third surface (310C), and the audio output module (355) may be positioned on one side (e.g., the right) with respect to the connection terminal (378).

[0073] The electronic device (301) may include a first camera module (380A) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The first camera module (380A) may be disposed on the first surface (310A). At least a portion of the first camera module (380A) may be disposed below the display module (361). The first camera module (380A) may receive an optical signal that passes through the camera area (361A-2).

[0074] The electronic device (301) may include a plurality of second camera modules (380B) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The plurality of second camera modules (380B) may be disposed on the second surface (310B). The plurality of second camera modules (380B) may be arranged in one direction (e.g., the Y direction) of the second plate (311B). The plurality of second camera modules (380B) may have different fields of view. For example, the plurality of second camera modules (380B) may include an ultra wide-angle camera, a wide-angle camera, and / or a tele camera.

[0075] The electronic device (301) may include an optical module (380C) (e.g., the flash (220) of FIG. 2). The optical module (380C) may be disposed on the second surface (310B). The optical module (380C) may include one or more light-emitting diodes or xenon lamps. The optical module (380C) may include a sensor configured to detect external light. For example, the sensor may include a flicker sensor.

[0076] Meanwhile, the embodiments disclosed in this document can be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, rollable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 3 and 4.

[0077] In this document, terms such as "substantially," "approximately," "typically," and "about" when referring to a given parameter, property, or condition may include the extent to which a person of ordinary skill in the art would understand the given parameter, property, or condition to be satisfied with a small degree of variance, such as within acceptable manufacturing tolerances. For example, a particular parameter that is substantially satisfied may be satisfied at least about 90% of the time, or at least about 95% of the time, or at least 99% of the time.

[0078] FIG. 5 is a perspective view of a camera module according to an embodiment of the disclosure.

[0079] Figure 6 is an exploded perspective view of a camera module according to one embodiment of the disclosure.

[0080] FIG. 7 is a plan view of a camera module according to an embodiment of the disclosure.

[0081] FIG. 8 is a side view of a camera module according to an embodiment of the disclosure.

[0082] FIG. 9 is a cross-sectional view taken along line 9-9 of the camera module of FIG. 7 according to an embodiment of the disclosure.

[0083] FIG. 10 is a cross-sectional view taken along line 10-10 of the camera module of FIG. 7 according to an embodiment of the disclosure.

[0084] FIG. 11 is an enlarged view of part A of the camera module of FIG. 10 according to an embodiment of the disclosure.

[0085] FIG. 12 is a cross-sectional view taken along line 12-12 of the camera module of FIG. 8 according to an embodiment of the disclosure.

[0086] Referring to FIGS. 5 to 12 , a camera module (480) (e.g., the camera module (180) of FIG. 1 , the camera module (180) of FIG. 2 , and / or the first camera module (380A) and / or the second camera module (380B) of FIGS. 3 and 4 ) may include a lens assembly (410) (e.g., the lens assembly (210) of FIG. 2 ). The lens assembly (410) may include at least one lens (411) having an optical axis (OA). The optical axis (OA) may be defined as an axis connecting a center of curvature of a first surface of at least one lens (411) and a center of curvature of a second surface opposite to the first surface. The lens assembly (410) may include a lens housing (412) configured to accommodate at least one lens (411). The lens housing (412) may also be referred to as a “lens barrel.” Meanwhile, although the lens assembly (410) is not shown in FIGS. 6 to 12, a person skilled in the art will understand that it is omitted for convenience and / or clarity in describing the camera module (480).

[0087] The camera module (480) may include a first structure (420). The first structure (420) may be referred to as a “movable part,” for example, a moving part of the camera module (480).

[0088] The first structure (420) may include a carrier (421). The carrier (421) may be configured to carry the lens assembly (410). The carrier (421) may be configured to move in a direction along the optical axis (OA) (e.g., in the + / -Z direction) and / or in a direction substantially orthogonal to the optical axis (OA) (e.g., in the + / -X direction and / or in the + / -Y direction). In an embodiment not shown, the first structure (420) may include a plurality of carriers. For example, one carrier may be configured to move in a direction along the optical axis (OA) (e.g., in the + / -Z direction) and another carrier may be configured to move in a direction substantially orthogonal to the optical axis (OA) (e.g., in the + / -X direction and / or in the + / -Y direction). As another example, the first structure (420) may include a carrier configured to move in a direction along the optical axis (OA) (e.g., + / -Z direction), a carrier configured to move in one direction substantially orthogonal to the optical axis (OA) (e.g., + / -X direction), and a carrier configured to move in another direction substantially orthogonal to the optical axis (OA) (e.g., + / -Y direction).

[0089] The carrier (421) may include a first carrier face (421A) (e.g., a +Z-direction face), a second carrier face (421B) opposite the first carrier face (421A) (e.g., a -Z-direction face), at least one third carrier face (421C) (e.g., an inner side face) located between the first carrier face (421A) and the second carrier face (421B), and at least one fourth carrier face (421D) (e.g., an outer side face) opposite the third carrier face (421C) and located between the first carrier face (421A) and the second carrier face (421B).

[0090] The first structure (420) may include a hole (422). The hole (422) may be configured to at least partially receive a lens housing (412). The lens housing (412) may be configured to couple to the carrier (421) and / or the opening (422). The hole (422) may be formed between a first carrier face (421A) and a second carrier face (421B). The hole (422) may be defined by at least one third carrier face (421C).

[0091] The first structure (420) may include a plurality of extensions (423). The extensions (423) may also be referred to as “protrusions.” The extensions (423) may extend away from the fourth carrier face (421D) of the carrier (421). For example, the extensions (423) may extend in a direction substantially perpendicular to the optical axis (OA) and away from the optical axis (OA).

[0092] The plurality of extensions (423) may include a first face (423A) (e.g., a +Z-direction face), a second face (423B) (e.g., a -Z-direction face) opposite the first face (423A) and connected to at least one fourth carrier face (421D), a pair of third faces (423C) between the first face (423A) and the second face (423B) and opposite each other and connected to at least one fourth carrier face (421D) and extending or expanding away from the at least one fourth carrier face (421D), and a fourth face (423D) between the first face (423A) and the second face (423B) and between the pair of third faces (423C).

[0093] At least one region (e.g., the first region (B1)) of the first surface (423A) may be on a different plane from the first carrier surface (421A). For example, the first region (B1) may be a surface that is raised in the +Z direction compared to the first carrier surface (421A). At least one region (e.g., the second region (B2)) of the first surface (423A) may be substantially on the same plane as the first carrier surface (421A).

[0094] The plurality of extensions (423) may be respectively arranged at a plurality of locations of the carrier (421). For example, the plurality of extensions (423) may be respectively arranged at a plurality of corner regions (A1) of the carrier (421) along the circumferential direction of the carrier (421). In the illustrated embodiment, the number of extensions (423) is four. In an unillustrated embodiment, the number of extensions (423) is two. In an unillustrated embodiment, the plurality of extensions (423) may be respectively arranged at a plurality of edge regions (A2) of the carrier (421) if sufficient arrangement space can be secured.

[0095] The plurality of extensions (423) may be arranged substantially symmetrically with respect to one another. For example, the plurality of extensions (423) may be symmetrical around a central axis of the hole (422) (e.g., substantially aligned with the optical axis (OA).

[0096] A plurality of extensions (423) may be arranged in a first section (S1) (e.g., an upper section) of at least one fourth carrier face (421D). The first section (S1) may be a section that directly extends to the first carrier face (421A). In an embodiment not shown, the first section (S1) may be a section adjacent to the first carrier face (421A), but offset from the first carrier face (421A).

[0097] The plurality of extensions (423) may be monolithically formed with the carrier (421). For example, the carrier (421) and the plurality of extensions (423) may be formed by a single injection molding. In an embodiment not shown, the plurality of extensions (423) may be joined to the carrier (421) as separate components.

[0098] The material of at least one of the plurality of extensions (423) may be different from the material of the carrier (421). For example, the carrier (421) may include a non-metallic material (e.g., plastic), and at least one of the extensions (423) may include a metallic material. The material of at least one of the plurality of extensions (423) may be the same as the material of the carrier (421).

[0099] The first structure (420) may include a base (424). The base (424) may extend or protrude away from at least one fourth carrier face (421D). The extension or protrusion length of the base (424) may be less than the extension or protrusion length of the extension portion (423). The base (424) may be positioned to be separated from the plurality of extension portions (423) (e.g., spaced apart from the second face (423B)) in the height direction (e.g., Z-direction) of the carrier (421), which may be defined in the direction from the second carrier face (421B) to the first carrier face (421A). The base (424) may extend entirely or partially along the circumferential direction of the carrier (421). The base (424) may be positioned in a second section (S2) (e.g., a lower section) of at least one fourth carrier face (421D). The second section (S2) may be at least partially different from the first section (S1). The second section (S2) may be a section that leads directly to the second carrier face (421B). In an embodiment not shown, the second section (S2) may be a section adjacent to the second carrier face (421B) but offset from the second carrier face (421B).

[0100] The camera module (480) may include a second structure (430). The second structure (430) may be referred to as a “fixing portion,” for example, a portion that fixes at least one component in the camera module (480), or a “stationary portion,” for example, a portion that does not substantially move in the camera module (480).

[0101] The second structure (430) may include a base frame (431). The base frame (431) may be configured to support the carrier (421). The base frame (431) may include a shape that forms a hole and extends in the circumferential direction.

[0102] The base frame (431) may include a plurality of columns (432). The plurality of columns (432) may protrude in one direction (e.g., +Z direction) of the base frame (431). The plurality of columns (432) may be respectively disposed at corner regions of the base frame (431). The base frame (431) may include at least one wall (433). The at least one wall (433) may extend in a circumferential direction of the base frame (431). The at least one wall (433) may be disposed at at least a portion of an edge region of the base frame (431) and / or at least a portion of a corner region of the base frame (431).

[0103] The second structure (430) may include a cover frame (435). The cover frame (435) may be configured to be coupled to the base frame (431). The base frame (431) and the cover frame (435) may define boundaries that limit the range within which the first structure (420) can move. The cover frame (435) may include a shape that forms a hole and extends in the circumferential direction.

[0104] At least a portion of the first structure (420) and at least a portion of the second structure (430) may form a gap. For example, a corner region of the carrier (421) and a corresponding corner region of the cover frame (435) may be spaced apart from each other with a gap. In an embodiment not shown, an edge region of the carrier (421) and a corresponding edge region of the cover frame (435) may be spaced apart from each other with a gap if no separate component (e.g., a first electromagnetic element (451) and / or a second electromagnetic element (452)) is disposed therebetween.

[0105] The cover frame (435) may include a plurality of legs (436). The plurality of legs (436) may be configured to engage with at least one wall (433) disposed at a corner region of the base frame (431). For example, the plurality of legs (436) may be configured to engage with the inside of at least one wall (433). The plurality of legs (436) may protrude from the cover frame (435) in one direction (e.g., the -Z direction). The plurality of legs (436) may be respectively disposed at corner regions of the cover frame (435).

[0106] The cover frame (435) may include a plurality of guide tunnels (437). Each of the plurality of guide tunnels (437) may be configured to guide a corresponding one of the extensions (423) in a specific direction (e.g., + / -Z direction). Each of the plurality of guide tunnels (437) may at least partially accommodate a corresponding one of the extensions (423). At least a portion of a pair of third faces (423C) and a fourth face (423D) of the extensions (423) may face the guide tunnel (437). The pair of third faces (423C) and the fourth face (423D) of the extensions (423) may be offset from the guide tunnel (437) by a gap. Each of the plurality of guide tunnels (437) may have a width (W2) that is substantially equal to or greater than a width (W1) of a corresponding one of the extensions (423).

[0107] The plurality of guide tunnels (437) may include a curved groove formed on the inner surface of a corresponding leg (436). For example, the groove may include a substantially 'U'-shaped curve. The plurality of guide tunnels (437) may extend between one side (e.g., the +Z-direction side) and the opposite side (e.g., the -Z-direction side) of each corresponding leg (436).

[0108] A plurality of guide tunnels (437) may be respectively arranged on a plurality of legs (436) arranged at corner regions of the cover frame (435). In an embodiment not shown, a plurality of guide tunnels (437) may be respectively arranged on edge regions of the cover frame (435) if sufficient space for arranging a plurality of extensions (423) can be secured.

[0109] The guide tunnel (437) may be configured to accommodate at least a portion of the column (432). The extension (423) may be constrained to move between one face (e.g., the -Z-direction face) of the cover frame (435) and one face (e.g., the +Z-direction face) of the column (432). In an embodiment not shown, if the column (432) is absent, the extension (423) may be constrained to move between one face (e.g., the -Z-direction face) of the cover frame (435) and one face (e.g., the +Z-direction face) of the base frame (431).

[0110] The camera module (480) may include a plurality of dampers (440). The dampers (440) may be configured to dampen the extension (423) from moving in a specific direction (e.g., in the + / -Z direction). This may slow down an undesired movement of the first structure (420) (e.g., in the + / -Z direction), thereby reducing or preventing a specific undesired motion (e.g., an autofocus motion) in a direction along the optical axis (OA) of the lens (411) (e.g., in the + / -Z direction).

[0111] The damper (440) can at least partially surround the extension (423). For example, the damper (440) can contact at least a portion of a first side (423A) of the extension (423) (e.g., at least a portion of the first region (B1)), at least a portion of a second side (423B), at least a portion of a pair of third sides (423C), and a fourth side (423D).

[0112] The damper (440) may be placed in the guide tunnel (437). The damper (440) may be placed between one side (e.g., the -Z direction side) of the cover frame (435) and one side (e.g., the +Z direction side) of the pillar (432). In an embodiment not shown, if the pillar (432) does not exist, the damper (440) may be placed between one side (e.g., the -Z direction side) of the cover frame (435) and one side (e.g., the +Z direction side) of the base frame (431). The damper (440) may not be substantially placed outside the guide tunnel (437).

[0113] The damper (440) can be at least partially filled in the guide tunnel (437). The damper (440) can be filled across the entire width of the guide tunnel (437). The damper (440) can be filled substantially the entire space between one side of the cover frame (435) (e.g., the -Z-direction side) and one side of the pillar (432) (e.g., the +Z-direction side). In an embodiment not shown, if the pillar (432) is not present, the damper (440) can be filled substantially the entire space between one side of the cover frame (435) (e.g., the -Z-direction side) and one side of the base frame (431) (e.g., the +Z-direction side).

[0114] The damper (440) may include a cured damping material. For example, the damping material may be cured to a specific shape by UV curing, thermal curing, and / or any other suitable method. The cured damping material may cause the extension (423) to substantially return to its initial position after being moved to a specific position within the damper (440). For example, the damping material may include a silicone-based resin mixture (e.g., silicone gel), but may include one or more other materials that achieve the desired damping performance.

[0115] The camera module (480) may include an actuator (450). The actuator (450) may be configured to move the first structure (420) in a specific direction (e.g., + / -X direction, + / -Y direction, and / or + / -Z direction) relative to the second structure (430). For example, the actuator (450) may include at least one first electromagnetic element (451) and a plurality of second electromagnetic elements (452) configured to electromagnetically couple with the at least one first electromagnetic element (451). One of the first electromagnetic element (451) and the second electromagnetic element (452) may include a coil, and the other electromagnetic element may include a magnet. The first electromagnetic element (451) may be disposed on the fourth carrier face (421D). A first electromagnetic element (451) may extend in the circumferential direction of the carrier (421). The first electromagnetic element (451) may be disposed on the base (424). A plurality of second electromagnetic elements (452) may be respectively disposed on edge regions of the base frame (431). In an embodiment not shown, the actuator (450) may include a suspension wire, a shape memory alloy (SMA) actuator, at least one ball, at least one bearing, and / or any other suitable actuator.

[0116] The camera module (480) may include an elastic body (460). The elastic body (460) may be configured to elastically support the first structure (420) and / or the second structure (430). For example, the elastic body (460) may include a first elastic body (461) disposed on a carrier (421). The elastic body (460) may include a second elastic body (462) disposed under the carrier (421).

[0117] The camera module (480) may include a camera cover (470). The camera cover (470) may also be referred to as a “shield can.” The camera cover (470) may be configured to at least partially cover the lens assembly (410), the first structure (420), the second structure (430), the damper (440), the actuator (450), and / or the elastic body (460). The base frame (431) and the camera cover (470) may form a space that accommodates at least one camera-related component.

[0118] FIG. 13 is a drawing illustrating a camera module according to an embodiment of the disclosure.

[0119] Referring to FIG. 13, a camera module (480-1) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the first camera module (380A) and / or the second camera module (380B) of FIGS. 3 and 4, and / or the camera module (480) of FIGS. 5 to 12) may include a first structure (420-1) (e.g., the first structure (420) of FIGS. 5 to 12), a second structure (430-1) (e.g., the second structure (430) of FIGS. 5 to 12), and a damper (440). The first structure (420-1) may include a guide tunnel (437-1) (e.g., the guide tunnel (437) of FIGS. 5 to 12). A damper (440) may be positioned in the guide tunnel (437-1). The second structure (430-1) may include an extension (423-1) (e.g., an extension (423)). The extension (423-1) may extend from the second structure (430-1) toward the first structure (420-1). The damper (440) may damp the first structure (420-1) while the first structure (420-1) moves relative to the second structure (430-1) (e.g., moves in the direction along the optical axis (OA) of FIGS. 5 to 12).

[0120] One aspect of the disclosure may provide a camera module and an electronic device including the same that slows down unwanted movement of a lens in the optical axis direction due to an external impact.

[0121] The camera module (180; 380A, 380B; 480; 480-1) may include a lens (411) having an optical axis (OA). The camera module (180; 380A, 380B; 480; 480-1) may include a first structure (420; 420-1) configured to transport the lens (411) along the optical axis (OA). The camera module (180; 380A, 380B; 480; 480-1) may include a second structure (430; 430-1). The first structure (420; 420-1) may be configured to move relative to the second structure (430; 430-1). The camera module (180; 380A, 380B; 480; 480-1) may include an extension portion (423; 423-1) extending from one of the first structure (420; 420-1) or the second structure (430; 430-1). The camera module (180; 380A, 380B; 480; 480-1) may include a guide tunnel (437; 437-1) arranged in the other of the first structure (420; 420-1) or the second structure (430; 430-1) and configured to guide the extension portion (423; 423-1). The camera module (180; 380A, 380B; 480; 480-1) may include a damper (440) configured to damp movement of the extension (423; 423-1) in the direction of the optical axis (OA).

[0122] The above damper (440) can be configured to damp the extension (423; 423-1) moving relative to the guide tunnel (437; 437-1) in the direction along the optical axis (OA).

[0123] The above damper (440) can surround the extension (423; 423-1).

[0124] The above damper (440) can be placed in the guide tunnel (437; 437-1).

[0125] The above damper (440) may include a hardened damping material.

[0126] The above damper (440) can fill the guide tunnel (437; 437-1).

[0127] The above extension portion (423; 423-1) can extend in a direction substantially orthogonal to the optical axis (OA).

[0128] The above extension (423; 423-1) can be placed in a corner area (A1) of one of the first structure (420; 420-1) and the second structure (430; 430-1).

[0129] The above extension (423; 423-1) may include a material different from the material of one of the first structure (420; 420-1) and the second structure (430; 430-1).

[0130] The above extension (423; 423-1) can be monolithically formed with either the first structure (420; 420-1) or the second structure (430; 430-1).

[0131] The width (W1) of the above extension (423; 423-1) may be substantially equal to or smaller than the width (W2) of the above guide tunnel (437; 437-1).

[0132] The above guide tunnel (437; 437-1) may include a curved surface.

[0133] The above guide tunnel (437; 437-1) can be placed in a corner area of ​​the other structure among the first structure (420; 420-1) and the second structure (430; 430-1).

[0134] Any one of the first structure (420; 420-1) and the second structure (430; 430-1) may be configured to move in at least one direction among a direction along the optical axis (OA) and a direction substantially orthogonal to the optical axis (OA).

[0135] The corner area (A1) of the first structure (420; 420-1) and the corner area of ​​the second structure (430; 430-1) may be spaced apart from each other to form a gap.

[0136] One of the first structure (420; 420-1) and the second structure (430; 430-1) may include a base frame (431) configured to support the other structure. One of the first structure (420; 420-1) and the second structure (430; 430-1) may include a cover frame (435) configured to cover the other structure.

[0137] The camera module (180; 380A, 380B; 480; 480-1) may include a first electromagnetic element (451) disposed in one of the first structure (420; 420-1) and the second structure (430; 430-1). The camera module (180; 380A, 380B; 480; 480-1) may include a second electromagnetic element (452) disposed in the other of the first structure (420; 420-1) and the second structure (430; 430-1) and configured to couple with the first electromagnetic element.

[0138] The camera module (180; 380A, 380B; 480; 480-1) may include an elastic body (460) configured to elastically support at least one of the first structure (420; 420-1) and the second structure (430; 430-1).

[0139] The camera module (180; 380A, 380B; 480; 480-1) may include a camera cover (470) configured to cover the first structure (420; 420-1) and the second structure (430; 430-1).

[0140] The electronic device (101; 301) may include a camera module (180; 380A, 380B; 480; 480-1).

[0141] According to one embodiment, lens movement due to external impact can be mitigated, and image quality can be stabilized. The effects of the camera module and electronic device including the same according to the embodiments are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description herein.

[0142] The embodiments disclosed herein are intended to be illustrative and not restrictive. Various modifications to the details of the disclosure, including those encompassed by the appended claims and their equivalents, may be made. Any of the embodiments described herein may be used in combination with any of the embodiments described herein.

[0143] While the disclosure has been illustrated and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.

Claims

1. A lens (411) having an optical axis (OA), A first structure (420; 420-1) configured to transport the lens (411) along the optical axis (OA); As a second structure (430; 430-1), the first structure (420; 420-1) is configured to move relative to the second structure (430; 430-1), An extension (423; 423-1) extending from one of the first structure (420; 420-1) or the second structure (430; 430-1), A guide tunnel (437; 437-1) arranged in one of the first structure (420; 420-1) or the second structure (430; 430-1) and configured to guide the extension (423; 423-1), and A damper (440) configured to damp the movement of the extension (423; 423-1) in the direction of the optical axis (OA). Camera module including (180; 380A, 380B; 480; 480-1).

2. In paragraph 1, A camera module in which the above damper (440) is configured to damp the extension (423; 423-1) moving relative to the guide tunnel (437; 437-1) in the direction along the optical axis (OA).

3. In paragraph 1 or 2, The above damper (440) is a camera module surrounding the extension (423; 423-1).

4. In any one of paragraphs 1 to 3, The above damper (440) is a camera module placed in the guide tunnel (437; 437-1).

5. In any one of paragraphs 1 to 4, The above damper (440) is a camera module including a hardened damping material.

6. In any one of paragraphs 1 to 5, The above damper (440) is a camera module that fills the guide tunnel (437; 437-1).

7. In any one of paragraphs 1 to 6, A camera module in which the above extension portion (423; 423-1) extends in a direction substantially orthogonal to the optical axis (OA).

8. In any one of paragraphs 1 to 7, The above extension part (423; 423-1) is a camera module arranged in a corner area (A1) of one of the first structure (420; 420-1) and the second structure (430; 430-1).

9. In any one of paragraphs 1 to 8, A camera module in which the above extension portion (423; 423-1) includes a material different from the material of one of the first structure (420; 420-1) and the second structure (430; 430-1).

10. In any one of paragraphs 1 to 9, A camera module in which the above extension part (423; 423-1) is monolithically formed with one of the first structure (420; 420-1) and the second structure (430; 430-1).

11. In any one of paragraphs 1 to 10, A camera module in which the first width (W1) of the above extension (423; 423-1) is substantially equal to or smaller than the second width (W2) of the above guide tunnel (437; 437-1).

12. In any one of paragraphs 1 to 11, The above guide tunnel (437; 437-1) is a camera module including a curved surface.

13. In any one of paragraphs 1 to 12, The above guide tunnel (437; 437-1) is a camera module arranged in a corner area of ​​the other structure among the first structure (420; 420-1) and the second structure (430; 430-1).

14. In any one of paragraphs 1 to 13, One of the first structure (420; 420-1) and the second structure (430; 430-1) is configured to move in at least one of a direction along the optical axis (OA) and a direction substantially orthogonal to the optical axis (OA), and / or The corner area (A1) of the first structure (420; 420-1) and the corner area of ​​the second structure (430; 430-1) are spaced apart from each other to form a gap, and / or Among the above first structure (420; 420-1) and the above second structure (430; 430-1), one of the structures is A base frame (431) configured to support the other structure among the first structure (420; 420-1) and the second structure (430; 430-1), and A cover frame (435) configured to cover the other structure among the first structure (420; 420-1) and the second structure (430; 430-1) Including and / or A first electromagnetic element (451) arranged in one of the first structure (420; 420-1) and the second structure (430; 430-1), and A second electromagnetic element (452) arranged in one of the first structure (420; 420-1) and the second structure (430; 430-1) and configured to couple with the first electromagnetic element. Including more and / or, and / or further including an elastic body (460) configured to elastically support at least one of the first structure (420; 420-1) and the second structure (430; 430-1). A camera module further comprising a camera cover (470) configured to cover the first structure (420; 420-1) and the second structure (430; 430-1).

15. An electronic device (101; 301) comprising a camera module (180; 380A, 380B; 480; 480-1) according to any one of claims 1 to 14.

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