Display module and manufacturing method therefor

Abstract

Disclosed are a display module and a manufacturing method therefor. The display module comprises: a substrate including a plurality of electrode pads: a first non-conductive adhesive member formed on one surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light-emitting elements bonded to the plurality of electrode pads, wherein electrodes of the plurality of light-emitting elements sequentially pass through the second non-conductive adhesive member and the first non-conductive adhesive member and are bonded to the plurality of electrode pads, respectively, and the second curing temperature may be higher than the first curing temperature.

Description

Display module and manufacturing method thereof

[0001] The present disclosure relates to a display module including a substrate having a plurality of non-conductive adhesive members formed thereon and a method for manufacturing the same.

[0002] With the development of high-brightness, high-resolution, and large-size display devices for various electronic devices, the demand for high efficiency and low power consumption is also increasing. Accordingly, technology is advancing to create display panels by directly mounting red, green, and blue LEDs (Light Emitting Diodes) onto a substrate.

[0003] LEDs are widely used as light sources for lighting devices as well as various display devices in electronic products such as TVs, mobile phones, PCs, laptops, and PDAs. In particular, micro LEDs measuring 100㎛ or less have recently been developed. Compared to conventional LEDs, micro LEDs boast faster response times, lower power consumption, and higher brightness, making them attractive as light-emitting elements for next-generation displays. Furthermore, research is ongoing to improve the manufacturing yield of these display devices.

[0004] One embodiment may provide a display module including: a substrate including a plurality of electrode pads; a first non-conductive adhesive member formed on one surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light-emitting elements bonded to the plurality of electrode pads; wherein electrodes of the plurality of light-emitting elements sequentially pass through the second non-conductive adhesive member and the first non-conductive adhesive member to be bonded to the plurality of electrode pads, respectively, and wherein the second curing temperature is higher than the first curing temperature.

[0005] In addition, one embodiment includes a process for forming a first non-conductive adhesive member having a first curing temperature on a substrate including a plurality of electrode pads; a process for forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; a process for aligning a plurality of electrodes of the light-emitting elements on the plurality of electrode pads; a process for applying heat and pressure to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements pass through the second non-conductive adhesive member in a first temperature range; a process for applying the heat and the pressure to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements are inserted into the first non-conductive adhesive member in a second temperature range and come into contact with the plurality of electrode pads; And, after the plurality of electrodes of the light-emitting elements pass through the second non-conductive film, a process of applying the heat and the pressure to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements are bonded to the plurality of electrode pads within the second non-conductive film; The method of bonding a plurality of light-emitting elements onto a substrate of a display module can be provided, wherein the second curing temperature is higher than the first curing temperature.

[0006] FIG. 1 is a schematic front view showing a display module according to one embodiment of the present disclosure.

[0007] FIG. 2 is a schematic block diagram illustrating a display module according to one embodiment of the present disclosure.

[0008] FIG. 3 is a cross-sectional view showing a portion of a display module including a substrate to which a light-emitting element is bonded according to one embodiment of the present disclosure.

[0009] FIG. 4 is a cross-sectional view showing a portion of a display module including a substrate on which a non-conductive adhesive member including conductive particles is formed according to one embodiment of the present disclosure.

[0010] FIG. 5 is a cross-sectional view showing a portion of a display module including a substrate on which a non-conductive adhesive member including conductive particles and a non-conductive adhesive member having a black color are formed according to one embodiment of the present disclosure.

[0011] FIG. 6 is a drawing showing a process of manufacturing a display module by bonding a plurality of light-emitting elements to a substrate on which a plurality of non-conductive adhesive members are formed according to one embodiment of the present disclosure.

[0012] FIG. 7 is a drawing showing an example of a substrate on which three non-conductive adhesive members are formed according to one embodiment of the present disclosure.

[0013] FIG. 8 is a drawing showing an example of a substrate on which three non-conductive adhesive members are formed according to one embodiment of the present disclosure.

[0014] Below, embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, for the purpose of clearly explaining the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar parts are designated with similar reference numerals throughout the specification.

[0015] The terms used in this disclosure are described as currently common terms, taking into account the functions mentioned herein. However, these terms may mean various other terms depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terms used in this disclosure should not be interpreted solely based on their names, but rather based on the meanings of the terms and the overall content of this disclosure.

[0016] Additionally, while terms such as first, second, etc. may be used to describe various components, the components should not be limited by these terms. These terms are used to distinguish one component from another.

[0017] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the cases where the parts are "directly connected" but also the cases where the parts are "electrically connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise stated.

[0018] The phrases “in one embodiment” and the like appearing in various places throughout this disclosure do not necessarily all refer to the same embodiment.

[0019] An embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various hardware and / or software configurations that perform specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a given function. Furthermore, for example, the functional blocks of the present disclosure may be implemented using various programming or scripting languages. The functional blocks may be implemented by algorithms that execute on one or more processors. Furthermore, the present disclosure may employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as "mechanism," "element," "means," and "configuration" may be used broadly and are not limited to mechanical and physical configurations.

[0020] Additionally, the connecting lines or connecting members between components depicted in the drawings are merely exemplary representations of functional connections and / or physical or circuit connections. In an actual device, connections between components may be represented by various functional connections, physical connections, or circuit connections that may be replaced or added.

[0021] The present disclosure will be described in detail with reference to the attached drawings below.

[0022] FIG. 1 is a schematic front view showing a display module according to one embodiment of the present disclosure, and FIG. 2 is a schematic block diagram showing a display module according to one embodiment of the present disclosure.

[0023] Referring to FIGS. 1 and 2, a display module (10) according to one embodiment of the present disclosure may include a substrate (20) on which a plurality of pixel driving circuits (30) are formed, a plurality of pixels (100) arranged on a front surface of the substrate (20), and a panel driving unit (40) that generates a control signal and provides the generated control signal to the plurality of pixel driving circuits (30).

[0024] In the present disclosure, one pixel (100) may include a plurality of sub-pixels. One sub-pixel may include one light source and a color conversion layer and a color filter corresponding to each light source. Here, the light source may be an inorganic self-light emitting diode, for example, a VCSEL diode (Vertical Cavity Surface Emitting Laser diode) or a micro LED (Micro light emitting diode) having a size of 100 μm or less (preferably 30 μm or less). The VCSEL diode and the micro LED may emit light in the blue wavelength band (450 to 490 nm) or light in the ultraviolet wavelength band (360 to 410 nm). The structure of the pixel (100) will be described in detail below with reference to FIG. 3.

[0025] The substrate (20) may be a support base for attaching a plurality of electrical elements, for example, light-emitting elements of a display, in an aligned state. For example, the substrate (20) may be composed of any one of glass, sapphire, synthetic resin, and ceramic. For example, the substrate (20) may be a TFT substrate. In this case, the substrate (20) may include a glass substrate (21), a TFT layer (23) including a TFT (Thin Film Transistor) circuit on the front surface of the glass substrate (21), and a plurality of side wirings (25) that electrically connect the TFT circuit of the TFT layer (23) to circuits (not shown) arranged on the back surface of the substrate (20). According to one embodiment, the substrate (20) may be formed of a rigid material or a flexible material.

[0026] Meanwhile, the display module (10) of the present disclosure may be formed using a synthetic resin-based substrate instead of a glass substrate (21). The synthetic resin-based substrate may be made of, for example, materials such as PI (Polyimide), PET (Polyethylene Terephthalate), PES (Polyethersulfone), PEN (Polyethylene Naphthalate), and PC (Polycarbonate). The synthetic resin-based substrate may be flexible or have a hardness of a hard degree.

[0027] Although not illustrated in the drawing, when the display module (10) is formed using a synthetic resin substrate instead of a glass substrate (21), a via hole may be formed in the active area (20a) described later, and wiring may be formed within the via hole. In this case, the front and back surfaces of the substrate (20) may be electrically connected to each other through the wiring formed in the via hole, and the plurality of side wirings (25) described above may be omitted from the substrate (20). In addition, the area where the plurality of side wirings (25a) are formed (the inactive area (20b) described later) may be omitted from the substrate (20). In this way, when the inactive area (20b) is omitted from the substrate (20), the active area (20a) described later may be expanded.

[0028] Additionally, the display module (10) of the present disclosure may be formed using a ceramic substrate instead of a glass substrate (21).

[0029] The substrate (20) may include an active area (20a) that displays an image on the front surface and a dummy area (20b) that cannot display an image. The active area (20a) may be divided into a plurality of pixel areas (24) in which a plurality of pixels are respectively arranged. The plurality of pixel areas (24) may be divided in various forms, and as an example, may be divided in a matrix form. One pixel area (24) may include one pixel (100, see FIG. 3). The dummy area (20b) may be included in an edge area of ​​the glass substrate, and a plurality of connection pads (28a) may be formed along the edge area at regular intervals. Each of the plurality of connection pads (28a) may be electrically connected to each pixel driving circuit (30) through a wire (28b).

[0030] The number of connection pads (28a) formed in the inactive area (20b) may vary depending on the number of pixels implemented on the substrate and may vary depending on the driving method of the TFT circuit arranged in the active area (20a). For example, compared to the case where the TFT circuit arranged in the active area (20a) is a PM (Passive Matrix) driving method that drives multiple pixels in horizontal and vertical lines, the AM (Active Matrix) driving method that individually drives each pixel may require more wiring and connection pads.

[0031] The TFT layer (23) may include a plurality of data signal lines arranged horizontally to control a plurality of pixels (100), a plurality of gate signal lines arranged vertically, and a plurality of pixel driving circuits (30) electrically connected to each line.

[0032] The TFT layer (23) may include a plurality of electrode pads (e.g., 22a, 22b, see FIG. 3). The plurality of electrode pads (22a, 22b) may be arranged in a fixed number in each pixel area. For example, when three sub-pixels (e.g., the first to third micro LEDs (50R, 50G, 50B, see FIG. 3)) are included in one pixel area and two electrodes (e.g., 51a, 51b, see FIG. 3) are provided per sub-pixel, six electrode pads (22a to 22f) may be arranged in one pixel area. The micro LEDs (50R, 50G, 50B) may have a flip chip structure in which the anode and cathode electrodes are formed on the same first surface and the light-emitting surface is formed on the second surface opposite the first surface.

[0033] The TFT constituting the TFT layer (or backplane) is not limited to a specific structure or type. For example, the TFT cited in the present disclosure may be implemented as an oxide TFT, a Si TFT (poly silicon, a-silicon), an organic TFT, a graphene TFT, etc. in addition to an LTPS TFT (low-temperature polycrystalline silicon TFT), and may also be applied by making only a P-type (or N-type) MOSFET in a Si wafer CMOS process.

[0034] The panel driver (40) may be directly connected to the substrate by means of a COG (Chip on Glass) or COP (Chip on Plastic) bonding method, or may be indirectly connected to the substrate (20) through a separate FPCB by means of a FOG (Film on Glass) bonding method. The panel driver (40) may drive a plurality of pixel driver circuits (30) to control the light emission of a plurality of micro LEDs electrically connected to each of the plurality of pixel driver circuits (30).

[0035] The panel driver (40) can control a plurality of pixel driver circuits (30) line by line through the first driver (41) and the second driver (42). For example, the first driver (41) can generate a control signal for sequentially controlling a plurality of horizontal lines formed on the TFT substrate (20) one line per image frame, and transmit the generated control signal to the pixel driver circuit (30) connected to each corresponding line. The second driver (42) can generate a control signal for sequentially controlling a plurality of vertical lines formed on the TFT substrate (20) one line per image frame, and transmit the generated control signal to each connected pixel driver circuit (30) connected to the corresponding line.

[0036] In the present disclosure, the display module may be a display panel having micro light emitting diodes, which are self-luminescent elements for image display. For example, the display module may be one of flat panel display panels, and may be composed of a plurality of inorganic light emitting diodes (LEDs), each of which is 100 micrometers or less in size, and may provide better contrast, response time, and energy efficiency compared to a liquid crystal display (LCD) panel that requires a backlight.

[0037] In the present disclosure, the display module can be installed and applied as a single unit in a wearable device, a portable device, a handheld device, and various electronic products or battlefields requiring a display, and can be applied to display devices such as a monitor for a personal computer (PC), a high-resolution TV, and signage (or digital signage), electronic display, etc. through a plurality of assembly arrangements in a matrix type.

[0038] FIG. 3 is a cross-sectional view showing a portion of a display module including a substrate to which a light-emitting element is bonded according to one embodiment of the present disclosure.

[0039] According to one embodiment, a plurality of pixel areas (24, see FIG. 1) may be provided in a grid shape on a substrate (20) of a display module (10). One pixel (100) may be arranged in each pixel area (24). One pixel (100) may include at least three sub-pixels (e.g., micro LEDs) that emit light of different colors.

[0040] Referring to FIG. 3, according to one embodiment, one pixel (100) may include a plurality of light-emitting elements (50R, 50G, 50B). For example, the plurality of light-emitting elements (50R, 50G, 50B) may include a first micro LED (50R) that emits light in a red wavelength band, a second micro LED (50G) that emits light in a green wavelength band, and a third micro LED (50B) that emits light in a blue wavelength band.

[0041] According to one embodiment, a plurality of light emitting elements (50R, 50G, 50B) may be electrically and physically connected to a substrate (20) via solder bumps (75) formed at one end of electrodes (51a to 51b). For example, the first to third micro LEDs (50R, 50G, 50B) may be electrically and physically connected to a TFT substrate via the solder bumps (75). For example, the solder bumps (75) may electrically and physically connect the first to third micro LEDs (50R, 50G, 50B) and the substrate (20) to each other. For example, the electrodes (51a, 51b) of the first micro LED (50R) may be electrically and physically connected to corresponding electrode pads (22a, 22b) of the substrate (20), respectively, via the solder bumps (75). In this case, the electrode pads (22a, 22b) of the substrate (20) may be arranged in a protruding shape or a sunken shape on one surface of the substrate (20). Similarly, the electrodes (51c, 51d, 51e, 51f) of the second and third micro LEDs (50G, 50B) may be electrically and physically connected to the corresponding electrode pads (22c, 22d, 22e, 22f) of the substrate (20), respectively, through solder bumps (75).

[0042] According to one embodiment, a solder bump (75) may be disposed between an electrode (51a, 51b, 51c, 51d, 51e, 51f) of a light-emitting element (50R, 50G, 50B) and an electrode pad (22a, 22b, 22c, 22d, 22e, 22f) of a substrate (20). For example, the solder bump (75) may include a plurality of conductive particles. The conductive particles can form a metal compound together with the electrodes (51a, 51b, 51c, 51d, 51e, 51f) and the substrate electrode pads (22a, 22b, 22c, 22d, 22e, 22f) by melting due to heat (e.g., more than 150°C) applied during the thermal compression bonding process performed after transferring a plurality of micro LEDs to the substrate (20). In this case, for example, the conductive particles can be a material that can form a metal compound with the chip electrodes and the substrate electrode pads at about 150°C or less, but is not limited thereto. For example, the conductive particles can include at least one material selected from the group consisting of In, Sn, Bi, Cu, Ag, Au, Zn, Pd, Pb, and Ni.

[0043] According to one embodiment, the electrodes (51a, 51b, 51c, 51d, 51e, 51f) may include a filler layer and a barrier layer laminated thereon. The filler layer may lower the contact resistance between the p-type semiconductor layer (or n-type semiconductor layer) of the micro LED and the barrier layer, and may improve the adhesion between the p-type semiconductor layer (or n-type semiconductor layer) and the barrier layer. For example, the filler layer may be made of at least one material among Au, Cu, Ni, and Al, but is not limited thereto. For example, the barrier layer may be made of at least one material among Au, Ni, Ti, Cr, Pd, TiN, Ta, TiW, TaN, AlSiTiN, NiTi, TiBN, ZrBN, TiAlN, and TiB2, but is not limited thereto.

[0044] According to one embodiment, the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) of the substrate (20) may be formed of, for example, at least one of Au, Cu, Ag, Ni, Ni / Au, Au / Ni, Ni / Cu, Cu / Ni, but are not limited thereto.

[0045] According to one embodiment, the first to third micro LEDs (50R, 50G, 50B) may be physically fixed to the substrate (20) via solder bumps (75), as well as by a plurality of cured non-conductive adhesive members (91, 92).

[0046] According to one embodiment, a plurality of non-conductive adhesive members (91, 92) may be formed on the substrate (20) before transferring the plurality of micro LEDs to the substrate (20). For example, the plurality of non-conductive adhesive members (91, 92) may be formed on the entire front surface area of ​​the substrate (20). The plurality of non-conductive adhesive members (91, 92) may be formed in a plurality of layers on the substrate (20). The plurality of non-conductive adhesive members (91, 92) may further include a flux to facilitate bonding between the electrodes (51a, 51b, 51c, 51d, 51e, 51f) and the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) by conductive particles.

[0047] According to one embodiment, the plurality of non-conductive adhesive members (91, 92) may include a first non-conductive adhesive member (91) and a second non-conductive adhesive member (92). In this case, the first non-conductive adhesive member (91) may cover the electrode pads (22a, 22b) and the solder bumps (75) formed on the substrate electrode pads. In addition, the second non-conductive adhesive member (92) may be formed on the first non-conductive adhesive member (91).

[0048] In one embodiment, the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) may be non-conductive films. The first non-conductive adhesive member (91) may be formed on the substrate (20) through a lamination process, and the second non-conductive adhesive member (92) may be formed on the first non-conductive adhesive member (91) through a lamination process. In one embodiment, the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) may be non-conductive films of a transparent color.

[0049] According to one embodiment, the first non-conductive adhesive member (91) may be formed of a material that cures at a first curing temperature or higher, and the second non-conductive adhesive member (92) may be formed of a material that cures at a second curing temperature or higher. The second curing temperature may be higher than the first curing temperature. The curing temperature may be a temperature at which curing of the material effectively begins. For example, by making the types and contents of the components of the first non-conductive adhesive member (91) and the second non-conductive adhesive member different, the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) may have different curing temperatures, viscosities, and glass transition temperatures (Tg). For example, by including different types and contents of at least one of an additive, a hardener, a flux, or an epoxy, the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) can have different curing temperatures, viscosities, and glass transition temperatures (Tg).

[0050] According to one embodiment, the second non-conductive adhesive member (92) may be formed of a material having a higher viscosity than the first non-conductive adhesive member (91).

[0051] According to one embodiment, the light emitting elements (50R, 50G, 50B) transferred to the substrate (20) may be in contact with the second non-conductive adhesive member (92) corresponding to the uppermost layer of the plurality of non-conductive adhesive members (91, 92). For example, the plurality of micro LEDs (50R, 50G, 50B) may be in contact with the second non-conductive adhesive member (92). In this state, when the plurality of micro LEDs (50R, 50G, 50B) are thermally compressed toward the substrate (20), the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) are inserted into the second non-conductive adhesive member (92) and may pass through the second non-conductive adhesive member (92).

[0052] Thereafter, the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) can be inserted into the inside of the first non-conductive adhesive member (91) and bonded to the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) within the first non-conductive adhesive member (91).

[0053] According to one embodiment, while the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) are inserted into the second non-conductive adhesive member (92) and the first non-conductive adhesive member (91) and come into contact with the electrode pads (22a, 22b, 22c, 22d, 22e, 22f), since the viscosity of the second non-conductive adhesive member (92) is higher than the viscosity of the first non-conductive adhesive member (91), the film shape of the first non-conductive adhesive member (91) can be maintained during the high-temperature and high-pressure bonding process, and the flatness of the appearance of the display module (10) can be improved.

[0054] According to one embodiment, the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) can be cured by heat. Accordingly, the plurality of micro LEDs can be firmly fixed to the substrate (20) by the cured first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) while being inserted into the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92).

[0055]

[0056] FIG. 4 is a cross-sectional view showing a portion of a display module including a substrate on which a non-conductive adhesive member including conductive particles is formed according to one embodiment of the present disclosure.

[0057] Referring to FIG. 4, a first non-conductive adhesive member (91) according to one embodiment may include a plurality of conductive particles (60). The plurality of conductive particles (60) may be conductive powder and may include, for example, at least one conductive material selected from the group consisting of Sn, Cu, Ni, In, Ag, Au, Carbon, Co, Fe, Cr, Mo, Ti, Bi, Pd, Pb, and Ge. The density of the plurality of conductive particles (60) in the first non-conductive adhesive member (91) may be equal to or lower than a predetermined value, and thus, the first non-conductive adhesive member (91) may maintain non-conductive electrical characteristics.

[0058] According to one embodiment, a first non-conductive adhesive member (91) including a plurality of conductive particles (60) may be formed on the lowermost layer of a plurality of non-conductive adhesive members (91, 92). Accordingly, the conductive particles (60) may be melted by heat (e.g., more than 150° C.) applied in a thermal compression bonding process to form a metal compound together with the electrodes (51a, 51b, 51c, 51d, 51e, 51f) and the substrate electrode pads (22a, 22b, 22c, 22d, 22e, 22f).

[0059] According to one embodiment, the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) may be non-conductive films of transparent color.

[0060] In Fig. 4, it is described that a plurality of conductive particles (60) are included in the first non-conductive adhesive member (91), but this is not limited thereto. The plurality of conductive particles (60) may also be included in another non-conductive adhesive member.

[0061] FIG. 5 is a cross-sectional view showing a portion of a display module including a substrate on which a non-conductive adhesive member including conductive particles and a non-conductive adhesive member having a black color are formed according to one embodiment of the present disclosure.

[0062] Referring to FIG. 5, the second non-conductive adhesive member (92) according to one embodiment may have a black color. For example, the second non-conductive adhesive member (92) may be a black non-conductive film. The black second non-conductive adhesive member (92) may be formed on the uppermost layer of a plurality of non-conductive adhesive members (91, 92), but is not limited thereto.

[0063] As a plurality of micro LEDs (50R, 50G, 50B) are bonded to a substrate (20) on which a second non-conductive adhesive member (92) having a black color is formed, the optical characteristics of the display module (10) can be improved. In addition, for example, by making only some of the plurality of non-conductive adhesive members (91, 92) have a black color, the optical characteristics of the display module (10) can be improved while maintaining surface roughness.

[0064] Referring to FIG. 5, a first non-conductive adhesive member (91) according to one embodiment may include a plurality of conductive particles (60). The plurality of conductive particles (60) may be conductive powder and may include, for example, at least one conductive material selected from the group consisting of Sn, Cu, Ni, In, Ag, Au, Carbon, Co, Fe, Cr, and Mo. The density of the plurality of conductive particles (60) in the first non-conductive adhesive member (91) may be equal to or lower than a predetermined value, and thus, the first non-conductive adhesive member (91) may maintain non-conductive electrical characteristics. The first non-conductive adhesive member (91) including the plurality of conductive particles (60) may be formed on the lowermost layer of the plurality of non-conductive adhesive members (91, 92).

[0065] In Fig. 5, the second non-conductive adhesive member (92) is described as having a black color, but is not limited thereto. For example, the first non-conductive adhesive member (91) including a plurality of conductive particles (60) may also have a black color.

[0066] In FIG. 5, the second non-conductive adhesive member (92) is described as having a black color and the first non-conductive adhesive member (91) includes a plurality of conductive particles (60), but this is not limited thereto. For example, the second non-conductive adhesive member (92) may have a black color and the first non-conductive adhesive member (91) may not include a plurality of conductive particles (60).

[0067] FIG. 6 is a drawing showing a process of manufacturing a display module by bonding a plurality of light-emitting elements to a substrate on which a plurality of non-conductive adhesive members are formed according to one embodiment of the present disclosure.

[0068] The process of manufacturing the display module (10) of FIG. 6 can be used to manufacture the display modules (10) of FIGS. 1 to 5.

[0069] Referring to the identification number 1 of FIG. 6, a plurality of non-conductive adhesive members (91, 92) may be formed on a substrate (20). For example, a first non-conductive adhesive member (91) may be formed on the substrate (20), and a second non-conductive adhesive member (92) may be formed on the first non-conductive adhesive member (91). For example, the first non-conductive adhesive member (91) may be a non-conductive film having a first curing temperature, and the second non-conductive adhesive member (92) may be a non-conductive film having a second curing temperature. The second viscosity of the second non-conductive adhesive member (92) may be higher than the first viscosity of the first non-conductive adhesive member (91), and the second curing temperature may be higher than the first curing temperature. Additionally, for example, the plurality of non-conductive adhesive members (91, 92) may have a thickness of 1 to 10 μm and may have thermally curable and / or UV-curable properties.

[0070] According to one embodiment, a first non-conductive adhesive member (91) may be attached onto a substrate (20) through a lamination process, and a second non-conductive adhesive member (92) may be attached onto the first non-conductive adhesive member (91) through a lamination process.

[0071] Referring to identification number 2 of FIG. 6, a plurality of light-emitting elements (50R, 50G, 50B) may be aligned on a substrate (20). For example, a plurality of micro LEDs (50R, 50G, 50B) may be aligned on a substrate (20) such that electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) face electrode pads (22a, 22b, 22c, 22d, 22e, 22f) on the substrate (20). The plurality of micro LEDs (50R, 50G, 50B) aligned on the substrate (20) may be in contact with a second non-conductive adhesive member (92).

[0072] Referring to identification number 3 of FIG. 6, a plurality of light-emitting elements (50R, 50G, 50B) can be inserted into a second non-conductive adhesive member (92) by a high-temperature and high-pressure bonding process. For example, electrodes (51a, 51b, 51c, 51d, 51e, 51f) of a plurality of micro LEDs (50R, 50G, 50B) can be moved within the second non-conductive adhesive member (92) toward electrode pads (22a, 22b, 22c, 22d, 22e, 22f) on a substrate (20).

[0073] According to one embodiment, the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) can be moved toward the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) within the second non-conductive adhesive member (92) within the first temperature range. In this case, the first temperature range can be lower than the second curing temperature of the second non-conductive adhesive member (92). For example, heat at a temperature higher than the first curing temperature and the second curing temperature may be applied to the substrate (20) and / or the plurality of non-conductive adhesive members (91, 92), and within the first temperature range before the temperature of the second non-conductive adhesive member (92) reaches the second curing temperature by the applied heat, the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) may be moved toward the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) within the second non-conductive adhesive member (92).

[0074] Referring to identification number 4 of FIG. 6, a plurality of light-emitting elements (50R, 50G, 50B) that have passed through a second non-conductive adhesive member (92) by a high-temperature and high-pressure bonding process can be inserted into a first non-conductive adhesive member (91). For example, electrodes (51a, 51b, 51c, 51d, 51e, 51f) of a plurality of micro LEDs (50R, 50G, 50B) can be moved toward electrode pads (22a, 22b, 22c, 22d, 22e, 22f) on a substrate (20) within the first non-conductive adhesive member (91).

[0075] According to one embodiment, the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) can be moved toward the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) within the first non-conductive adhesive member (91) within the second temperature range. In this case, the second temperature range can be lower than the first curing temperature of the first non-conductive adhesive member (91). For example, heat at a temperature higher than the first curing temperature and the second curing temperature may be applied to the substrate (20) and / or the plurality of non-conductive adhesive members (91, 92), and within a second temperature range before the temperature of the first non-conductive adhesive member (91) reaches the first curing temperature by the applied heat, the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) may be brought into contact with the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) or solder bumps on the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) within the second non-conductive adhesive member (92).

[0076] According to one embodiment, the second curing temperature of the second non-conductive adhesive member (92) may be higher than the first curing temperature of the first non-conductive adhesive member (91), and the second viscosity of the second non-conductive adhesive member (92) may be higher than the first viscosity of the first non-conductive adhesive member (91). Accordingly, even if the first viscosity of the first non-conductive adhesive member (91) is low, since the second viscosity of the second non-conductive adhesive member (92) is high, the shape of the second non-conductive adhesive member (92) may be maintained while the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) are moved within the second non-conductive adhesive member (92) and the first non-conductive adhesive member (91). Accordingly, during the high-temperature and high-pressure bonding process, the film shape of the first non-conductive adhesive member (91) can be maintained and the flatness of the appearance of the display module (10) can be improved. In addition, by using the film of the above structure, the plurality of micro LEDs (50R, 50G, 50B) can not rotate or move, and the plurality of micro LEDs (50R, 50G, 50B) can be precisely bonded to the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) at the desired positions.

[0077] Thereafter, the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) can be bonded to the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) of the substrate (20). For example, when the conductive particles included in the solder bumps and / or the second non-conductive adhesive member (92) are melted by heat, a metal compound can be formed together with the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of micro LEDs (50R, 50G, 50B) and the substrate electrode pads (22a, 22b, 22c, 22d, 22e, 22f).

[0078] Thereafter, by heat applied to the substrate (20) and / or the plurality of non-conductive adhesive members (91, 92), the first non-conductive adhesive member (91) can be cured at a first curing temperature, and the second non-conductive adhesive member (92) can be cured at a second curing temperature.

[0079] For example, in a state where electrodes (51a, 51b, 51c, 51d, 51e, 51f) of a plurality of micro LEDs (50R, 50G, 50B) are in contact with electrode pads (22a, 22b, 22c, 22d, 22e, 22f) of a substrate (20) or solder bumps on electrode pads (22a, 22b, 22c, 22d, 22e, 22f), the first non-conductive adhesive member (91) can be cured at a temperature higher than the first curing temperature.

[0080] For example, in a state where electrodes (51a, 51b, 51c, 51d, 51e, 51f) of a plurality of micro LEDs (50R, 50G, 50B) are in contact with electrode pads (22a, 22b, 22c, 22d, 22e, 22f) of a substrate (20) or solder bumps on electrode pads (22a, 22b, 22c, 22d, 22e, 22f), the second non-conductive adhesive member (92) can be cured at a temperature higher than the second curing temperature.

[0081] Accordingly, a plurality of micro LEDs (50R, 50G, 50B) can be firmly fixed to the substrate (20) by the cured first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) while being inserted into the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92).

[0082] In addition, by laminating the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92) having different curing temperatures, viscosities, and glass transition temperatures for the bonding process, the first non-conductive adhesive member (91) and / or the second non-conductive adhesive member (92) can be prevented from being pre-cured during the bonding process, and the first non-conductive adhesive member (91) or the second non-conductive adhesive member (92) can be prevented from being cured without the electrodes (51a, 51b, 51c, 51d, 51e, 51f) of the plurality of light-emitting elements (50R, 50G, 50B) being bonded to the electrode pads (22a, 22b, 22c, 22d, 22e, 22f) of the substrate (20).

[0083] FIG. 7 is a drawing showing an example of a substrate on which three non-conductive adhesive members are formed according to one embodiment of the present disclosure.

[0084] Referring to FIG. 7, a first non-conductive adhesive member (91), a second non-conductive adhesive member (92), and a third non-conductive adhesive member (93) may be formed on a substrate (20) according to one embodiment. The third non-conductive adhesive member (93) may be formed between the first non-conductive adhesive member (91) and the second non-conductive adhesive member (92).

[0085] According to one embodiment, the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), and the third non-conductive adhesive member (92) may be non-conductive films. The first non-conductive adhesive member (91) may be formed on the substrate (20) through a lamination process, the third non-conductive adhesive member (93) may be formed on the first non-conductive adhesive member (91) through a lamination process, and the second non-conductive adhesive member (92) may be formed on the third non-conductive adhesive member (93) through a lamination process.

[0086] According to one embodiment, the first non-conductive adhesive member (91) may be formed of a material that cures at a first curing temperature or higher, the second non-conductive adhesive member (92) may be formed of a material that cures at a second curing temperature or higher, and the third non-conductive adhesive member (93) may be formed of a material that cures at a third curing temperature or higher. The second curing temperature may be higher than the first curing temperature and the third curing temperature. For example, by making the types and contents of the components of the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), and the third non-conductive adhesive member (93) different, the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), and the third non-conductive adhesive member (93) may have different curing temperatures, viscosities, and glass transition temperatures (Tg). For example, by including different types and contents of at least one of an additive, a hardener, a flux, or an epoxy, the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), and the third non-conductive adhesive member (93) can have different curing temperatures, viscosities, and glass transition temperatures (Tg).

[0087] According to one embodiment, the second non-conductive adhesive member (92) may be formed of a material having a higher viscosity than the first non-conductive adhesive member (91) and the third non-conductive adhesive member (92).

[0088] According to one embodiment, the first non-conductive adhesive member (91) and the third non-conductive adhesive member (92) may be, but are not limited to, non-conductive films of transparent color.

[0089]

[0090] FIG. 8 is a drawing showing an example of a substrate on which three non-conductive adhesive members are formed according to one embodiment of the present disclosure.

[0091] Referring to FIG. 8, according to one embodiment, at least one of the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), and the third non-conductive adhesive member (93) may be black in color. For example, among the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), and the third non-conductive adhesive member (93), the second non-conductive member (92) forming the uppermost layer may have a black color.

[0092] According to one embodiment, at least one of the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), or the third non-conductive adhesive member (93) may include a plurality of conductive particles. For example, among the first non-conductive adhesive member (91), the second non-conductive adhesive member (92), and the third non-conductive adhesive member (93), the first non-conductive member (91) forming the uppermost layer may include a plurality of conductive particles.

[0093] The plurality of conductive particles may be conductive powders and may include, for example, at least one conductive material selected from the group consisting of Sn, Cu, Ni, In, Ag, Au, Carbon, Co, Fe, Cr, and Mo. The density of the plurality of conductive particles in the first non-conductive adhesive member (91) may be below a predetermined value, and thus, the first non-conductive adhesive member (91) may maintain non-conductive electrical characteristics.

[0094] Although FIGS. 7 and 8 illustrate that three non-conductive adhesive members (91, 92, 93) are formed on the substrate (20), the present invention is not limited thereto. In addition, although FIG. 8 illustrates that the second conductive member (92) has a black color and the first conductive member (91) includes a plurality of conductive particles, the present invention is not limited thereto.

[0095] For example, four or more non-conductive adhesive members may be formed on the substrate (20). In this case, at least one of the non-conductive adhesive members may have a black color, and at least one of the non-conductive adhesive members may include conductive particles. Preferably, the non-conductive adhesive member of the uppermost layer among the non-conductive adhesive members may have a black color, and the remaining non-conductive adhesive members may have transparent colors. Preferably, the non-conductive adhesive member of the lowermost layer may include conductive particles. In addition, preferably, the non-conductive adhesive member of the uppermost layer among the non-conductive adhesive members may have the highest curing temperature and the highest viscosity, and the curing temperatures and viscosities of the remaining non-conductive adhesive members may be set variously depending on the bonding process.

[0096] One embodiment of the present disclosure provides a display module including: a substrate including a plurality of electrode pads; a first non-conductive adhesive member formed on one surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light-emitting elements bonded to the plurality of electrode pads, wherein electrodes of the plurality of light-emitting elements sequentially pass through the second non-conductive adhesive member and the first non-conductive adhesive member to be bonded to the plurality of electrode pads, respectively, and wherein the second curing temperature is higher than the first curing temperature.

[0097] Additionally, the first non-conductive adhesive member and the second non-conductive adhesive member may be formed in multiple layers on the one surface of the substrate.

[0098] Additionally, the first non-conductive adhesive member has a first viscosity, the second non-conductive adhesive member has a second viscosity, and the second viscosity may be greater than the first viscosity.

[0099] Additionally, the second non-conductive adhesive member may be a black non-conductive film.

[0100] Additionally, the first non-conductive adhesive member may be a non-conductive film containing conductive particles.

[0101] Additionally, the display module may further include a third non-conductive adhesive member formed between the first non-conductive adhesive member and the second non-conductive adhesive member.

[0102] Additionally, the third curing temperature of the third non-conductive adhesive member may be lower than the second curing temperature of the second non-conductive adhesive member.

[0103] Additionally, the electrodes of the plurality of light-emitting elements can be sequentially bonded to the plurality of electrode pads by passing through the second non-conductive adhesive member, the third non-conductive adhesive member, and the first non-conductive adhesive member.

[0104] Additionally, the third viscosity of the third non-conductive adhesive member may be smaller than the second viscosity of the second non-conductive adhesive member.

[0105] Additionally, at least one of the second non-conductive adhesive member and the third non-conductive adhesive member may be a black non-conductive film, and the first non-conductive adhesive member may be a non-conductive film including conductive particles.

[0106] One embodiment of the present disclosure comprises: a process for forming a first non-conductive adhesive member having a first curing temperature on a substrate including a plurality of electrode pads; a process for forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; a process for aligning a plurality of electrodes of the light-emitting elements on the plurality of electrode pads; a process for applying heat and pressure to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements pass through the second non-conductive adhesive member in a first temperature range; a process for applying the heat and the pressure to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements are inserted into the first non-conductive adhesive member in a second temperature range and come into contact with the plurality of electrode pads; And, after the plurality of electrodes of the light-emitting elements pass through the second non-conductive film, a process of applying the heat and the pressure to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements are bonded to the plurality of electrode pads within the second non-conductive film; The method of bonding a plurality of light-emitting elements onto a substrate of a display module can be provided, wherein the second curing temperature is higher than the first curing temperature.

[0107] Additionally, the second viscosity of the second non-conductive adhesive member may be higher than the first viscosity of the first non-conductive adhesive member.

[0108] In addition, the process of forming the first non-conductive adhesive member may include a process of attaching a first non-conductive film having a first curing temperature onto the substrate through a lamination process, and the process of forming the second non-conductive adhesive member may include a process of attaching a second non-conductive film having a second curing temperature onto the first non-conductive film through a lamination process.

[0109] Additionally, the heat and the pressure may be applied to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements pass through the second non-conductive adhesive member in the first temperature range lower than the first curing temperature and the second curing temperature.

[0110] Additionally, in the second temperature range lower than the first curing temperature and the second curing temperature, the heat and the pressure may be applied to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements come into contact with the plurality of electrode pads in the first non-conductive adhesive member.

[0111] In addition, the method may further include a process of curing the first non-conductive adhesive member at a temperature range higher than the first curing temperature while the plurality of electrodes of the light-emitting elements are in contact with the plurality of electrode pads.

[0112] In addition, the method may further include a process of curing the second non-conductive adhesive member at a temperature range higher than the second curing temperature, while the plurality of electrodes of the light-emitting elements are in contact with the plurality of electrode pads.

[0113] Additionally, the second non-conductive adhesive member may be a black non-conductive film.

[0114] The above first non-conductive adhesive member may be a non-conductive film containing conductive particles.

[0115] In addition, the process of forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member may include a process of forming a third non-conductive adhesive member having a third curing temperature on the first non-conductive adhesive member; and a process of forming a second non-conductive adhesive member on the third non-conductive adhesive member.

[0116] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0117] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another component (e.g., a second) with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., by wire), wirelessly, or through a third component. The term "module" as used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integral component or a smallest unit or part of a component that performs one or more functions.For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0118] Various embodiments of the present document may be implemented as software (e.g., a program (#40)) including one or more instructions stored in a storage medium (e.g., an internal memory (#36) or an external memory (#38)) readable by a machine (e.g., an electronic device (#01)). For example, a processor (e.g., a processor (#20)) of the machine (e.g., an electronic device (#01)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0119] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the display module, A substrate comprising a plurality of electrode pads; A first non-conductive adhesive member formed on one surface of the substrate and having a first curing temperature; A second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and A plurality of light-emitting elements joined to the plurality of electrode pads; Including, A display module, wherein the electrodes of the plurality of light-emitting elements are sequentially bonded to the plurality of electrode pads by passing through the second non-conductive adhesive member and the first non-conductive adhesive member, and the second curing temperature is higher than the first curing temperature.

2. In paragraph 1, A display module, wherein the first non-conductive adhesive member and the second non-conductive adhesive member are formed in a plurality of layers on the one surface of the substrate.

3. In paragraph 1, The first non-conductive adhesive member has a first viscosity, and the second non-conductive adhesive member has a second viscosity. A display module wherein the second viscosity is greater than the first viscosity.

4. In paragraph 1, A display module, wherein the second non-conductive adhesive member is a black non-conductive film.

5. In paragraph 1, A display, wherein the first non-conductive adhesive member is a non-conductive film containing conductive particles.

6. In paragraph 1, A display module further comprising a third non-conductive adhesive member formed between the first non-conductive adhesive member and the second non-conductive adhesive member.

7. In paragraph 6, A display module, wherein the third curing temperature of the third non-conductive adhesive member is lower than the second curing temperature of the second non-conductive adhesive member.

8. In paragraph 7, A display module, wherein the electrodes of the plurality of light-emitting elements are sequentially bonded to the plurality of electrode pads by passing through the second non-conductive adhesive member, the third non-conductive adhesive member, and the first non-conductive adhesive member.

9. In paragraph 6, A display module, wherein the third viscosity of the third non-conductive adhesive member is smaller than the second viscosity of the second non-conductive adhesive member.

10. In paragraph 6, At least one of the second non-conductive adhesive member and the third non-conductive adhesive member is a black non-conductive film, A display module, wherein the first non-conductive adhesive member is a non-conductive film containing conductive particles.

11. A method for bonding a plurality of light-emitting elements onto a substrate of a display module, A process for forming a first non-conductive adhesive member having a first curing temperature on a substrate including a plurality of electrode pads; A process of forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; A process of aligning a plurality of electrodes of the above light-emitting elements on the plurality of electrode pads; A process of applying heat and pressure to the plurality of electrodes of the light emitting elements so that the plurality of electrodes of the light emitting elements pass through the second non-conductive adhesive member in a first temperature range; A process of applying heat and pressure to the plurality of electrodes of the light emitting elements so that the plurality of electrodes of the light emitting elements are inserted into a first non-conductive adhesive member in a second temperature range and come into contact with the plurality of electrode pads; and A process of applying heat and pressure to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements are bonded to the plurality of electrode pads within the second non-conductive adhesive member after the plurality of electrodes of the light-emitting elements pass through the second non-conductive adhesive member; Including, A method wherein the second curing temperature is higher than the first curing temperature.

12. In paragraph 11, A method wherein the second viscosity of the second non-conductive adhesive member is higher than the first viscosity of the first non-conductive adhesive member.

13. In paragraph 11, The process of forming the first non-conductive adhesive member includes a process of attaching a first non-conductive film having a first curing temperature onto the substrate through a lamination process, A method according to claim 1, wherein the process of forming the second non-conductive adhesive member includes a process of attaching a second non-conductive film having a second curing temperature onto the first non-conductive film through a lamination process.

14. In paragraph 11, A method wherein the heat and the pressure are applied to the plurality of electrodes of the light-emitting elements so that the plurality of electrodes of the light-emitting elements pass through the second non-conductive adhesive member at the first temperature range lower than the first curing temperature and the second curing temperature.

15. In paragraph 11, A method wherein the heat and the pressure are applied to the plurality of electrodes of the light emitting elements so that the plurality of electrodes of the light emitting elements contact the plurality of electrode pads in the first non-conductive adhesive member at a second temperature range lower than the first curing temperature and the second curing temperature.

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