Stacked patch antenna module

Abstract

The present disclosure relates to a stacked patch antenna module in which a first feed pin to a fourth feed pin pass through a first patch antenna and a second patch antenna, wherein the first feed pin to the fourth feed pin pass through the first patch antenna and the second patch antenna, through-holes through which the first feed pin to the fourth feed pin pass are formed in the second patch antenna stacked below the first patch antenna, and an inner metal layer is formed on an inner wall surface of the through-hole through which the third feed pin and / or the fourth feed pin pass / passes.

Description

Stacked patch antenna module

[0001] The present invention relates to a stacked patch antenna module that transmits and receives signals of multiple frequency bands by stacking multiple patch antennas.

[0002] A shark fin antenna for vehicles is installed on the exterior of a vehicle to improve signal reception for electronic devices installed inside the vehicle.

[0003] Recently, various electronic devices are being installed in vehicles, and many antennas are built into vehicle shark antennas to receive signals in frequency bands such as GNSS (e.g. GPS (USA), Glonass (Russia)), SDARS (Sirius, XM), Telematics, Global star, and Thuraya.

[0004] However, there is a problem of insufficient mounting space as multiple antennas are mounted in the limited mounting space of the vehicle shark antenna.

[0005] Accordingly, research is being conducted on a stacked patch antenna module that stacks multiple patch antennas.

[0006] For example, a stacked patch antenna module is configured with an upper patch antenna for receiving a first frequency band signal and a lower patch antenna disposed below the upper patch antenna for receiving a second frequency band signal. The stacked patch antenna module is formed in a structure in which a feed pin for feeding the upper patch antenna penetrates the lower patch antenna. At this time, a parasitic resonance occurs in the stacked patch antenna module due to coupling between the feed pin penetrating the lower patch antenna and the lower patch antenna. That is, a parasitic resonance occurs in the stacked patch antenna module in which a second frequency band signal is received together with a first frequency band signal at the upper patch antenna.

[0007] In addition, the stacked patch antenna module has a problem in that the isolation between the upper patch antenna and the lower patch antenna deteriorates as parasitic resonance occurs. That is, the isolation between the upper patch antenna and the lower patch antenna deteriorates because the first frequency band signal and the second frequency band signal are received from the upper patch antenna.

[0008] Additionally, the stacked patch antenna module has a problem in that the antenna efficiency decreases as the isolation decreases.

[0009] The matters described in the background art above are intended to help understand the background of the invention and may include matters that are not publicly disclosed prior art.

[0010] The present invention has been proposed to solve the above-mentioned conventional problems, and aims to provide a stacked patch antenna module in which the first to fourth feed pins penetrate the first patch antenna and the second patch antenna.

[0011] In addition, another object of the present invention is to provide a laminated patch antenna module in which through holes are formed in a second patch antenna laminated on the lower side through which first to fourth feed pins pass, respectively, and an internal metal layer is formed on the inner wall surface of the through hole through which the third feed pin and / or the fourth feed pin pass.

[0012] In addition, another object of the present invention is to provide a stacked patch antenna module in which the upper patch of the first patch antenna stacked on the upper side is spaced apart from at least one of the first feed pin and the second feed pin to block electrical connection.

[0013] In order to achieve the above object, a stacked patch antenna module according to an embodiment of the present invention includes a first patch antenna, a second patch antenna disposed below the first patch antenna, a first feed pin penetrating the first patch antenna and the second patch antenna, a second feed pin spaced apart from the first feed pin and penetrating the first patch antenna and the second patch antenna, a third feed pin spaced apart from the first feed pin and the second feed pin and penetrating the first patch antenna and the second patch antenna, and a fourth feed pin spaced apart from the first feed pin, the second feed pin, and the third feed pin and penetrating the first patch antenna and the second patch antenna, and the second patch antenna has a plurality of via holes formed through which the first feed pin, the second feed pin, the third feed pin, and the fourth feed pin respectively penetrate, and an internal metal layer is formed on an inner wall surface of at least one via hole among the plurality of via holes.

[0014] The first patch antenna is formed with a first through hole through which a first feed pin passes, a second through hole spaced apart from the first through hole, a second through hole spaced apart from the first through hole and the second through hole, a third through hole through which a third feed pin passes, and a fourth through hole spaced apart from the first, second, and third through holes, and a fourth feed pin passes. At this time, an imaginary straight line connecting the first through hole and the third through hole and an imaginary straight line connecting the second through hole and the fourth through hole may be orthogonal.

[0015] The second patch antenna may be formed with a fifth through hole through which a first feed pin that has penetrated the first through hole penetrates, a sixth through hole that is spaced apart from the fifth through hole and through which a second feed pin that has penetrated the second through hole penetrates, a seventh through hole that is spaced apart from the fifth and sixth through holes and through which a third feed pin that has penetrated the third through hole penetrates, and an eighth through hole that is spaced apart from the fifth, sixth and seventh through holes and through which a fourth feed pin that has penetrated the fourth through hole penetrates.

[0016] The second patch antenna may include a first inner metal layer disposed on the inner wall surface of the seventh through hole and connected to the upper patch and the lower patch of the second patch antenna, and spaced apart from the third feed pin, and a second inner metal layer disposed on the inner wall surface of the eighth through hole and connected to the upper patch and the lower patch of the second patch antenna, and spaced apart from the fourth feed pin.

[0017] The first patch antenna may include a first base substrate having a first-first through hole through which a first feed pin passes, a second-first through hole through which a second feed pin passes, a third-first through hole through which a third feed pin passes, and a fourth-first through hole through which a fourth feed pin passes, a first upper patch disposed on an upper surface of the first base substrate and having a first-second through hole through which a first feed pin passes, a second-second through hole through which a second feed pin passes, a third-second through hole through which a third feed pin passes, and a fourth-second through hole through which a fourth feed pin passes, and a first lower patch disposed on a lower surface of the first base substrate and having a first-third through hole through which a first feed pin passes, a second-third through hole through which a second feed pin passes, a third-third through hole through which a third feed pin passes, and a fourth-third through hole through which a fourth feed pin passes. At this time, the 1-1 through hole, the 1-2 through hole, and the 1-3 through hole overlap to form a first through hole through which the first power supply pin passes, the 2-1 through hole, the 2-2 through hole, and the 2-3 through hole overlap to form a second through hole through which the second power supply pin passes, the 3-1 through hole, the 3-2 through hole, and the 3-3 through hole overlap to form a third through hole through which the third power supply pin passes, and the 4-1 through hole, the 4-2 through hole, and the 4-3 through hole overlap to form a fourth through hole through which the fourth power supply pin passes.

[0018] At least one of the first feed pin and the second feed pin may be spaced apart from the first upper patch to form a spaced apart space, and may not be electrically connected to the first upper patch by the spaced apart space.

[0019] The second patch antenna may include a second base substrate having a 5-1 through hole through which a first feed pin passes, a 6-1 through hole through which a second feed pin passes, a 7-1 through hole through which a third feed pin passes, and an 8-1 through hole through which a fourth feed pin passes, a second upper patch disposed on an upper surface of the second base substrate and having a 5-2 through hole through which a first feed pin passes, a 6-2 through hole through which a second feed pin passes, a 7-2 through hole through which a third feed pin passes, and an 8-2 through hole through which a fourth feed pin passes, and a second lower patch disposed on a lower surface of the second base substrate and having a 5-3 through hole through which a first feed pin passes, a 6-3 through hole through which a second feed pin passes, a 7-3 through hole through which a third feed pin passes, and an 8-3 through hole through which a fourth feed pin passes. At this time, the 5-1 through hole, the 5-2 through hole, and the 5-3 through hole overlap to form a 5th through hole through which the first feed pin that has penetrated the first through hole of the first patch antenna penetrates, the 6-1 through hole, the 6-2 through hole, and the 6-3 through hole overlap to form a 6th through hole through which the second feed pin that has penetrated the second through hole of the first patch antenna penetrates, the 7-1 through hole, the 7-2 through hole, and the 7-3 through hole overlap to form a 7th through hole through which the third feed pin that has penetrated the third through hole of the first patch antenna penetrates, and the 8-1 through hole, the 8-2 through hole, and the 8-3 through hole overlap to form an 8th through hole through which the 4th feed pin that has penetrated the 4th through hole of the first patch antenna penetrates.

[0020] The second patch antenna includes a first inner metal layer disposed on the inner wall surface of the 7-1 through hole, a first inner metal layer disposed on the inner wall surface of the 7-2 through hole, and a first inner metal layer disposed on the inner wall surface of the 7-3 through hole, and the first inner metal layer, the first inner metal layer, and the first inner metal layer can constitute a first inner metal layer connecting the second upper patch and the second lower patch.

[0021] The second patch antenna includes a second-first inner metal layer disposed on the inner wall surface of the 8-1 through hole, a second-second inner metal layer disposed on the inner wall surface of the 8-2 through hole, and a second-third inner metal layer disposed on the inner wall surface of the 8-3 through hole, and the second-first inner metal layer, the second-second inner metal layer, and the second-third inner metal layer can constitute a second inner metal layer connecting the second upper patch and the second lower patch.

[0022] The second upper patch may be spaced apart from the first feed pin penetrating the 5-2 through hole and the second feed pin penetrating the 6-2 through hole, and may be connected to the first feed pin and the second feed pin through electromagnetic coupling.

[0023] A stacked patch antenna module according to an embodiment of the present invention may further include a first hybrid coupler connected to a first feed pin and a second feed pin and outputting a first frequency signal and a second frequency signal, and a second hybrid coupler connected to a third feed pin and a fourth feed pin and outputting a third frequency signal.

[0024] The first hybrid coupler may include a first input terminal connected to a first power supply pin, a second input terminal connected to a second power supply pin, a first output terminal connected to a signal processing element that processes a first frequency signal and a second frequency signal, and a second output terminal connected to a resistor.

[0025] The second hybrid coupler may include a first input terminal connected to a third feed pin, a second input terminal connected to a fourth feed pin, a first output terminal connected to a resistor, and a second output terminal connected to a signal processing element that processes a third frequency signal.

[0026] According to the present invention, a stacked patch antenna module has a second patch antenna arranged below a first patch antenna, and a metal layer is formed in a through hole formed in the second patch antenna through which a third feed pin and a fourth feed pin pass, thereby eliminating parasitic resonance caused by coupling between the third feed pin and the fourth feed pin and the second patch antenna, thereby ensuring isolation of the stacked patch antenna module.

[0027] In addition, the stacked patch antenna module has the effect of controlling the phase of the patch antenna by forming a gap between the upper patch of the first patch antenna and at least one of the first and second feed pins, thereby blocking the electrical connection between at least one of the first and second feed pins and the upper patch.

[0028] In addition, the stacked patch antenna module has the effect of improving the isolation of the patch antenna by adjusting the phase of the patch antenna by forming a gap between the upper patch of the first patch antenna and at least one of the first feed pin and the second feed pin.

[0029] FIG. 1 is a drawing for explaining a stacked patch antenna module according to an embodiment of the present invention.

[0030] FIG. 2 is a cross-sectional view illustrating a stacked patch antenna module according to an embodiment of the present invention.

[0031] FIG. 3 is an exploded perspective view illustrating the first patch antenna illustrated in FIGS. 1 and 2.

[0032] Fig. 4 is a drawing for explaining the positional relationship of through holes formed in the first patch antenna of Fig. 3.

[0033] FIG. 5 is an exploded perspective view illustrating the second patch antenna illustrated in FIGS. 1 and 2.

[0034] Fig. 6 is a drawing for explaining the positional relationship of through holes formed in the second patch antenna of Fig. 5.

[0035] FIGS. 7 to 15 are drawings for explaining modified examples of a stacked patch antenna module according to an embodiment of the present invention.

[0036] FIGS. 8 to 13 are drawings for explaining a modified structure for improving the isolation of a stacked patch antenna module according to an embodiment of the present invention.

[0037] FIG. 14 and FIG. 15 are drawings for explaining a modified structure for minimizing frequency interference of a stacked patch antenna module according to an embodiment of the present invention.

[0038] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0039] These examples are provided to more fully illustrate the present invention to those skilled in the art. The following examples may be modified in various ways, and the scope of the present invention is not limited to the examples described below. Rather, these examples are provided to further faithfully and completely convey the spirit of the present invention.

[0040] The terms used herein are used to describe specific embodiments and are not intended to limit the present invention. Furthermore, the singular forms used herein may include the plural forms, unless the context clearly dictates otherwise.

[0041] In the description of the embodiments, when each layer (film), region, pattern or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad or pattern, "on" and "under" include both being formed "directly" or "indirectly" through another layer. In addition, the reference for above or below each layer is, in principle, based on the drawing.

[0042] The drawings are intended solely to facilitate understanding of the invention and should not be construed as limiting the scope of the invention. Furthermore, relative thicknesses, lengths, and sizes in the drawings may be exaggerated for convenience and clarity of explanation.

[0043] Referring to FIGS. 1 and 2, a stacked patch antenna module according to an embodiment of the present invention is configured to include a first patch antenna (100), a second patch antenna (200), a first feed pin (320), a second feed pin (340), a third feed pin (360), and a fourth feed pin (380). At this time, the first patch antenna (100) is arranged above the second patch antenna (200). The first to fourth feed pins (320 to 380) are configured to penetrate the first patch antenna (100) and the second patch antenna (200), and are arranged to be rotated at a predetermined angle.

[0044] Referring to FIG. 3, the first patch antenna (100) is composed of a laminate in which a first base substrate (110), a first upper patch (120), and a first lower patch (130) are laminated.

[0045] The first base substrate (110) is composed of a dielectric. As an example, the first base substrate (110) is a dielectric substrate made of a ceramic material having characteristics such as a high dielectric constant and a low coefficient of thermal expansion.

[0046] The first base substrate (110) may be composed of a magnetic material. As an example, the first base substrate (110) is a magnetic substrate composed of a magnetic material such as ferrite.

[0047] In the first base material (110), a 1-1 through hole (140a) through which the first power supply pin (320) passes, a 2-1 through hole (150a) through which the second power supply pin (340) passes, a 3-1 through hole (160a) through which the third power supply pin (360) passes, and a 4-1 through hole (170a) through which the fourth power supply pin (380) passes are formed.

[0048] The first through hole (140a), the second through hole (150a), the third through hole (160a), and the fourth through hole (170a) are formed to vertically penetrate the dielectric substrate or the magnetic substrate constituting the first base substrate (110). The first through hole (140a), the second through hole (150a), the third through hole (160a), and the fourth through hole (170a) are formed to form a set angle.

[0049] As an example, the 1-1 through hole (140a), the 2-1 through hole (150a), the 3-1 through hole (160a), and the 4-1 through hole (170a) are formed to form an angle of approximately 90 degrees. At this time, an imaginary straight line connecting the 1-1 through hole (140a) and the 3-1 through hole (160a) and an imaginary straight line connecting the 2-1 through hole (150a) and the 4-1 through hole (170a) are perpendicular to each other. The intersection point of the two imaginary straight lines may overlap with the center point of the first base substrate (110).

[0050] The first upper patch (120) is placed on the upper surface of the first base substrate (110). The first upper patch (120) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The first upper patch (120) can be formed in various shapes, such as a square, triangle, or octagon.

[0051] The first upper patch (120) is formed with a first-second through hole (140b) through which the first power supply pin (320) passes, a second-second through hole (150b) through which the second power supply pin (340) passes, a third-second through hole (160b) through which the third power supply pin (360) passes, and a fourth-second through hole (170b) through which the fourth power supply pin (380) passes.

[0052] The first-second through hole (140b), the second-second through hole (150b), the third-second through hole (160b), and the fourth-second through hole (170b) are formed to vertically penetrate the first upper patch (120). The first-second through hole (140b), the second-second through hole (150b), the third-second through hole (160b), and the fourth-second through hole (170b) are formed to form a set angle.

[0053] As the first upper patch (120) is placed (laminated) on the upper surface of the first base substrate (110), the through holes formed in the first upper patch (120) overlap with the through holes formed in the first base substrate (110). The 1-2 through hole (140b) overlaps with the 1-1 through hole (140a) of the first base substrate (110), the 2-2 through hole (150b) overlaps with the 2-1 through hole (150a) of the first base substrate (110), the 3-2 through hole (160b) overlaps with the 3-1 through hole (160a) of the first base substrate (110), and the 4-2 through hole (170b) overlaps with the 4-1 through hole (170a) of the first base substrate (110).

[0054] For example, the first-second through hole (140b), the second-second through hole (150b), the third-second through hole (160b), and the fourth-second through hole (170b) are formed to form an angle of approximately 90 degrees. At this time, an imaginary straight line connecting the first-second through hole (140b) and the third-second through hole (160b) and an imaginary straight line connecting the second-second through hole (150b) and the fourth-second through hole (170b) are perpendicular to each other. The intersection point of the two imaginary straight lines may overlap the center point of the first upper patch (120).

[0055] The first lower patch (130) is placed on the lower surface of the first base substrate (110). The first lower patch (130) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The first lower patch (130) can be formed in various shapes, such as a square, triangle, or octagon.

[0056] The first lower patch (130) is formed with a 1-3 through hole (140c) through which the first power supply pin (320) passes, a 2-3 through hole (150c) through which the second power supply pin (340) passes, a 3-3 through hole (160c) through which the third power supply pin (360) passes, and a 4-3 through hole (170c) through which the fourth power supply pin (380) passes.

[0057] The first-third through hole (140c), the second-third through hole (150c), the third-third through hole (160c), and the fourth-third through hole (170c) are formed to vertically penetrate the first lower patch (130). The first-third through hole (140c), the second-third through hole (150c), the third-third through hole (160c), and the fourth-third through hole (170c) are formed to form a set angle.

[0058] As the first lower patch (130) is placed (laminated) on the lower surface of the first base substrate (110), the through holes formed in the first lower patch (130) overlap with the through holes formed in the first base substrate (110) and the first upper patch (120).

[0059] The 1-3 through hole (140c) overlaps with the 1-1 through hole (140a) of the first base substrate (110) and the 1-2 through hole (140b) of the first upper patch (120), the 2-3 through hole (150c) overlaps with the 2-1 through hole (150a) of the first base substrate (110) and the 2-2 through hole (150b) of the first upper patch (120), the 3-3 through hole (160c) overlaps with the 3-1 through hole (160a) of the first base substrate (110) and the 3-2 through hole (160b) of the first upper patch (120), and the 4-3 through hole (170c) overlaps with the 4-1 through hole (170a) of the first base substrate (110) and the 4-2 through hole (170b) of the first upper patch (120). It overlaps with the hole (170b).

[0060] For example, the 1st-3rd through hole (140c), the 2nd-3rd through hole (150c), the 3rd-3rd through hole (160c), and the 4th-3rd through hole (170c) are formed to form an angle of approximately 90 degrees. At this time, an imaginary straight line connecting the 1st-3rd through hole (140c) and the 3rd-3rd through hole (160c) and an imaginary straight line connecting the 2nd-3rd through hole (150c) and the 4th-3rd through hole (170c) are orthogonal. The intersection point of the two imaginary straight lines may overlap the center point of the first lower patch (130).

[0061] Through this, the 1-1 through hole (140a), the 1-2 through hole (140b), and the 1-3 through hole (140c) form a first through hole (140) through which the first feed pin (320) passes. The 2-1 through hole (150a), the 2-2 through hole (150b), and the 2-3 through hole (150c) form a second through hole (150) through which the second feed pin (340) passes. The 3-1 through hole (160a), the 3-2 through hole (160b), and the 3-3 through hole (160c) form a third through hole (160) through which the third feed pin (360) passes. The 4-1 through hole (170a), the 4-2 through hole (170b), and the 4-3 through hole (170c) form a third through hole (160) through which the 4th power supply pin (380) passes.

[0062] Referring to Fig. 4, the first through hole (140) to the fourth through hole (170) formed in the first patch antenna (100) are arranged to form an angle of about 90 degrees between each other. An imaginary straight line connecting the first through hole (140) and the third through hole (160) and an imaginary straight line connecting the second through hole (150) and the fourth through hole (170) are orthogonal. The intersection point of the two imaginary straight lines is located on an imaginary straight line that vertically passes through the center point of the first patch antenna (100).

[0063] Referring to FIG. 5, the second patch antenna (200) is configured as a laminate in which a second base substrate (210), a second upper patch (220), and a second lower patch (230) are laminated. The second patch antenna (200) is configured to include a first inner metal layer (280) and a second inner metal layer (290) connecting the second upper patch (220) and the second lower patch (230).

[0064] The second base substrate (210) is composed of a dielectric. As an example, the second base substrate (210) is a dielectric substrate made of a ceramic material having characteristics such as a high dielectric constant and a low coefficient of thermal expansion.

[0065] The second base substrate (210) may be composed of a magnetic material. As an example, the second base substrate (210) is a magnetic substrate composed of a magnetic material such as ferrite.

[0066] In the second base material (210), a 5-1 through hole (240a) through which the first power supply pin (320) passes, a 6-1 through hole (250a) through which the second power supply pin (340) passes, a 7-1 through hole (260a) through which the third power supply pin (360) passes, and an 8-1 through hole (270a) through which the fourth power supply pin (380) passes are formed.

[0067] The 5-1 through hole (240a), the 6-1 through hole (250a), the 7-1 through hole (260a), and the 8-1 through hole (270a) are formed to vertically penetrate the dielectric substrate or the magnetic substrate constituting the second base substrate (210). The 5-1 through hole (240a), the 6-1 through hole (250a), the 7-1 through hole (260a), and the 8-1 through hole (270a) are formed to form a set angle.

[0068] As an example, the 5-1 through hole (240a), the 6-1 through hole (250a), the 7-1 through hole (260a), and the 8-1 through hole (270a) are formed to form an angle of approximately 90 degrees. At this time, an imaginary straight line connecting the 5-1 through hole (240a) and the 7-1 through hole (260a) and an imaginary straight line connecting the 6-1 through hole (250a) and the 8-1 through hole (270a) are perpendicular to each other. The intersection point of the two imaginary straight lines may overlap with the center point of the second base substrate (210).

[0069] The second upper patch (220) is placed on the upper surface of the second base substrate (210). The second upper patch (220) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The second upper patch (220) can be formed in various shapes, such as a square, triangle, or octagon.

[0070] The second upper patch (220) is formed with a 5-2 through hole (240b) through which the first feed pin (320) passes, a 6-2 through hole (250b) through which the second feed pin (340) passes, a 7-2 through hole (260b) through which the third feed pin (360) passes, and an 8-2 through hole (270b) through which the fourth feed pin (380) passes.

[0071] The 5-2 through hole (240b), the 6-2 through hole (250b), the 7-2 through hole (260b), and the 8-2 through hole (270b) are formed to vertically penetrate the second upper patch (220). The 5-2 through hole (240b), the 6-2 through hole (250b), the 7-2 through hole (260b), and the 8-2 through hole (270b) are formed to form a set angle.

[0072] As the second upper patch (220) is placed (laminated) on the upper surface of the second base substrate (210), the through holes formed in the second upper patch (220) overlap with the through holes formed in the second base substrate (210). The 5-2 through hole (240b) overlaps with the 5-1 through hole (240a) of the second base substrate (210), the 6-2 through hole (250b) overlaps with the 6-1 through hole (250a) of the second base substrate (210), the 7-2 through hole (260b) overlaps with the 7-1 through hole (260a) of the second base substrate (210), and the 8-2 through hole (270b) overlaps with the 8-1 through hole (270a) of the second base substrate (210).

[0073] As an example, the 5-2 through hole (240b), the 6-2 through hole (250b), the 7-2 through hole (260b), and the 8-2 through hole (270b) are formed to form an angle of approximately 90 degrees. At this time, an imaginary straight line connecting the 5-2 through hole (240b) and the 7-2 through hole (260b) and an imaginary straight line connecting the 6-2 through hole (250b) and the 8-2 through hole (270b) are perpendicular to each other. The intersection point of the two imaginary straight lines may overlap with the center point of the second upper patch (220).

[0074] The second lower patch (230) is placed on the lower surface of the second base substrate (210). The second lower patch (230) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The second lower patch (230) can be formed in various shapes, such as a square, triangle, or octagon.

[0075] In the second lower patch (230), a 5-3 through hole (240c) through which the first feed pin (320) passes, a 6-3 through hole (250c) through which the second feed pin (340) passes, a 7-3 through hole (260c) through which the third feed pin (360) passes, and an 8-3 through hole (270c) through which the fourth feed pin (380) passes are formed.

[0076] The 5-3 through hole (240c), the 6-3 through hole (250c), the 7-3 through hole (260c), and the 8-3 through hole (270c) are formed to vertically penetrate the second lower patch (230). The 5-3 through hole (240c), the 6-3 through hole (250c), the 7-3 through hole (260c), and the 8-3 through hole (270c) are formed to form a set angle.

[0077] As the second lower patch (230) is placed (laminated) on the lower surface of the second base substrate (210), the through holes formed in the second lower patch (230) overlap with the through holes formed in the second base substrate (210) and the second upper patch (220).

[0078] The 5-3 through hole (240c) overlaps with the 5-1 through hole (240a) of the second base substrate (210) and the 5-2 through hole (240b) of the second upper patch (220), the 6-3 through hole (250c) overlaps with the 6-1 through hole (250a) of the second base substrate (210) and the 6-2 through hole (250b) of the second upper patch (220), the 7-3 through hole (260c) overlaps with the 7-1 through hole (260a) of the second base substrate (210) and the 7-2 through hole (260b) of the second upper patch (220), and the 8-3 through hole (270c) overlaps with the 8-1 through hole (270a) of the second base substrate (210) and the 8-2 through hole (270b) of the second upper patch (220). It overlaps with the hole (270b).

[0079] For example, the 5-3 through hole (240c), the 6-3 through hole (250c), the 7-3 through hole (260c), and the 8-3 through hole (270c) are formed to form an angle of approximately 90 degrees. At this time, the virtual straight line connecting the 5-3 through hole (240c) and the 7-3 through hole (260c) and the virtual straight line connecting the 6-3 through hole (250c) and the 8-3 through hole (270c) are orthogonal. The intersection point of the two virtual straight lines may overlap the center point of the second lower patch (230).

[0080] Through this, the 5-1 through hole (240a), the 5-2 through hole (240b), and the 5-3 through hole (240c) form a 5th through hole (240) through which the 1st feed pin (320) passes. The 6-1 through hole (250a), the 6-2 through hole (250b), and the 6-3 through hole (250c) form a 6th through hole (250) through which the 2nd feed pin (340) passes. The 7-1 through hole (260a), the 7-2 through hole (260b), and the 7-3 through hole (260c) form a 7th through hole (260) through which the 3rd feed pin (360) passes. The 8-1 through hole (270a), the 8-2 through hole (270b), and the 8-3 through hole (270c) form the 8th through hole (270) through which the 4th feed pin (380) passes.

[0081] As the second patch antenna (200) is placed (stacked) on the lower side of the first patch antenna (100), the fifth through hole (240) overlaps with the first through hole (140) to form a through hole through which the first feed pin (320) passes. The sixth through hole (250) overlaps with the second through hole (150) to form a through hole through which the second feed pin (340) passes. The seventh through hole (260) overlaps with the third through hole (160) to form a through hole through which the third feed pin (360) passes. The eighth through hole (270) overlaps with the fourth through hole (170) to form a through hole through which the fourth feed pin (380) passes.

[0082] Referring to Fig. 6, the first through holes (140) to the fourth through holes (170) formed in the second patch antenna (200) are arranged to form an angle of about 90 degrees between each other. An imaginary straight line connecting the first through hole (140) and the third through hole (160) and an imaginary straight line connecting the second through hole (150) and the fourth through hole (170) are orthogonal. The intersection point of the two imaginary straight lines is located on an imaginary straight line that vertically passes through the center point of the first patch antenna (100).

[0083] The first inner metal layer (280) is disposed in the seventh through hole (260) to connect the second upper patch (220) and the second lower patch (230). The first inner metal layer (280) may include a first-first inner metal layer (280a) disposed on the inner wall surface of the seventh-first through hole (260a) forming the seventh through hole (260), a first-second inner metal layer (280b) disposed on the inner wall surface of the seventh-second through hole (260b), and a first-third inner metal layer (280c) disposed on the inner wall surface of the seventh-third through hole (260c) (see FIG. 5). Here, in order to easily explain the first internal metal layer (280), the 1-1 internal metal layer (280a) to the 1-3 internal metal layer (280c) are illustrated as being formed separately, but this is not limited to the first internal metal layer (280a) and the first internal metal layer (280c) may be formed integrally by plating the inner wall surface of the through hole of the first patch antenna (100).

[0084] The first internal metal layer (280) is formed of one material selected from among copper, aluminum, gold, and silver. Of course, the first internal metal layer (280) may also be formed of an alloy including one material selected from among copper, aluminum, gold, and silver.

[0085] The first inner metal layer (280) electrically connects the second upper patch (220) and the second lower patch (230) of the second patch antenna (200). The first inner metal layer (280) forms a coaxial cable with the third feed pin (360). The first inner metal layer (280) is spaced apart from the third feed pin (360) and is not electrically connected to the third feed pin (360). Through this, the first inner metal layer (280) eliminates parasitic resonance generated by coupling between the third feed pin (360) and the second patch antenna (200). Accordingly, the stacked patch antenna can prevent isolation degradation due to parasitic resonance.

[0086] The second inner metal layer (290) is disposed in the eighth through hole (270) to connect the second upper patch (220) and the second lower patch (230). The second inner metal layer (290) may include a 2-1 inner metal layer (290a) disposed on the inner wall surface of the 8-1 through hole (270a) forming the 8th through hole (270), a 2-2 inner metal layer (290b) disposed on the inner wall surface of the 8-2 through hole (270b), and a 2-1 inner metal layer (290a) disposed on the inner wall surface of the 8-3 through hole (270c) (see FIG. 5). Here, in order to easily explain the second internal metal layer (290), the 2-1 internal metal layer (290a) to the 2-3 internal metal layer (290c) are illustrated as being formed separately, but this is not limited thereto, and the second internal metal layer (290) may be formed integrally by plating the inner wall surface of the through hole of the second patch antenna (200).

[0087] The second internal metal layer (290) is formed of one material selected from among copper, aluminum, gold, and silver. Of course, the second internal metal layer (290) may also be formed of an alloy including one material selected from among copper, aluminum, gold, and silver.

[0088] The second inner metal layer (290) electrically connects the second upper patch (220) and the second lower patch (230) of the second patch antenna (200). The second inner metal layer (290) forms a coaxial cable with the fourth feed pin (380). The second inner metal layer (290) is spaced apart from the fourth feed pin (380) and is not electrically connected to the fourth feed pin (380).

[0089] Through this, the second inner metal layer (290) eliminates parasitic resonance caused by coupling between the fourth feed pin (380) and the second patch antenna (200). Accordingly, the stacked patch antenna can prevent isolation degradation due to parasitic resonance.

[0090] The first feed pin (320) is inserted through a through hole formed as the first patch antenna (100) and the second patch antenna (200) are stacked. The first feed pin (320) is inserted through the first through hole (140) of the first patch antenna (100) and the fifth through hole (240) of the second patch antenna (200).

[0091] The second feed pin (340) is inserted through a through hole formed as the first patch antenna (100) and the second patch antenna (200) are stacked. The second feed pin (340) is inserted through the second through hole (150) of the first patch antenna (100) and the sixth through hole (250) of the second patch antenna (200).

[0092] The third feed pin (360) is inserted through a through hole formed as the first patch antenna (100) and the second patch antenna (200) are stacked. The third feed pin (360) is inserted through the third through hole (160) of the first patch antenna (100) and the seventh through hole (260) of the second patch antenna (200).

[0093] The fourth feed pin (380) is inserted through a through hole formed as the first patch antenna (100) and the second patch antenna (200) are stacked. The fourth feed pin (380) is inserted through the fourth through hole (170) of the first patch antenna (100) and the eighth through hole (270) of the second patch antenna (200).

[0094] The first feed pin (320) and the second feed pin (340) are directly connected to the first upper patch (120) of the first patch antenna (100). Accordingly, the first upper patch (120) fed by the first feed pin (320) and the second feed pin (340) operates as a radiator that transmits and receives a first frequency signal, which is a signal in the band of approximately 1.5 GHz to 1.6 GHz (e.g., GNSS L1 RHCP).

[0095] The first feed pin (320) and the second feed pin (340) are indirectly connected to the second upper patch (220) of the second patch antenna (200). The first feed pin (320) and the second feed pin (340) are indirectly connected to the second upper patch (220) through coupling (EM coupling (Electronic and Magnetic coupling)) in region A of FIG. 2. Accordingly, the second upper patch (220) fed by the first feed pin (320) and the second feed pin (340) operates as a radiator that transmits and receives a second frequency signal, which is a signal of approximately 1.2 GHz band (e.g., GNSS L5 RHCP).

[0096] The third feed pin (360) and the fourth feed pin (380) are directly connected to the first upper patch (120) of the first patch antenna (100). The third feed pin (360) is isolated from the second upper patch (220) by the first inner metal layer (280) electrically connecting the second upper patch (220) and the second lower patch (230) of the second patch antenna (200) and the second inner metal layer (290) electrically connecting the second upper patch (220) and the second lower patch (230) of the second patch antenna (200). Accordingly, the first upper patch (120) fed by the first feed pin (320) and the second feed pin (340) operates as a radiator that transmits and receives a third frequency signal, which is a signal in the band of approximately 1.5 GHz to 1.6 GHz (e.g., Global star 1.6 GHz LHCP, Thuraya 1.5 GHz to 1.6 GHz LHCP).

[0097] Referring to FIG. 7, the stacked patch antenna may be configured to further include a first hybrid coupler (420) and a second hybrid coupler (440).

[0098] The first hybrid coupler (420) includes a first input terminal connected to the first power supply pin (320), a second input terminal connected to the second power supply pin (340), a first output terminal connected to a signal processing element that processes a first frequency signal and a second frequency signal, and a second output terminal connected to ground. At this time, a resistance of approximately 50 ohms is connected between the ground and the second output terminal. The first output terminal outputs the first frequency signal and the second frequency signal to the signal processing element.

[0099] The second hybrid coupler (440) includes a first input terminal connected to the third feed pin (360), a second input terminal connected to the fourth feed pin (380), a first output terminal connected to ground, and a second output terminal connected to a signal processing element that processes a third frequency signal. At this time, a resistor of approximately 50 ohms is connected between the ground and the first output terminal. The second output terminal outputs the third frequency signal to the signal processing element.

[0100] The stacked patch antenna may be configured such that a space (S) is formed between at least one of the first feed pin (320) and the second feed pin (340) and the first upper patch (120), so that at least one of the first feed pin (320) and the second feed pin (340) is spaced apart from the first upper patch (120). Accordingly, the first upper patch (120) is electrically disconnected from at least one of the first feed pin (320) and the second feed pin (340), thereby adjusting the phase of the stacked patch antenna module to improve isolation.

[0101] For example, referring to FIGS. 8 and 9, a stacked patch antenna has a space (S) formed between a first feed pin (320) and a first upper patch (120). A first-second through hole (140b), a second-second through hole (150b), a third-second through hole (160b), and a fourth-second through hole (170b) are formed in the first upper patch (120), and the first-second through hole (140b) is formed to have a larger area than the second-second through hole (150b), the third-second through hole (160b), and the fourth-second through hole (170b). The first-second through hole (140b) is formed to have a larger area than the first feed pin (320, i.e., the head of the first feed pin (320). Accordingly, a gap space (S) is formed between the first feed pin (320) and the first upper patch (120).

[0102] As another example, referring to FIGS. 10 and 11, a stacked patch antenna has a space (S) formed between a second feed pin (340) and a first upper patch (120). A first-second through hole (140b), a second-second through hole (150b), a third-second through hole (160b), and a fourth-second through hole (170b) are formed in the first upper patch (120), and the second-second through hole (150b) is formed to have a larger area than the first-second through hole (140b), the third-second through hole (160b), and the fourth-second through hole (170b). The second-second through hole (150b) is formed to have a larger area than the second feed pin (340, i.e., the head of the second feed pin (340). Accordingly, a gap space (S) is formed between the second feed pin (340) and the first upper patch (120).

[0103] As another example, referring to FIGS. 12 and 13, a stacked patch antenna has a space (S) formed between a first feed pin (320) and a first upper patch (120) and between a second feed pin (340) and the first upper patch (120). A first-second through hole (140b), a second-second through hole (150b), a third-second through hole (160b), and a fourth-second through hole (170b) are formed in the first upper patch (120), and the first-second through hole (140b) and the second-second through hole (150b) are formed to have a larger area than the third-second through hole (160b) and the fourth-second through hole (170b). The first-second through hole (140b) is formed to have a wider area than the first feed pin (320, i.e., the head of the first feed pin (320)), and the second-second through hole (150b) is formed to have a wider area than the second feed pin (340, i.e., the head of the second feed pin (340)). Accordingly, a separation space (S) is formed between the first feed pin (320) and the first upper patch (120) and between the second feed pin (340) and the first upper patch (120).

[0104] Referring to FIG. 14, the stacked patch antenna may further include an adhesive substrate (500) interposed between the first patch antenna (100) and the second patch antenna (200) to adhere and separate the first patch antenna (100) and the second patch antenna (200). Since the stacked patch antenna is configured by stacking the first patch antenna (100) and the second patch antenna (200), the first lower patch (130) and the second upper patch (220) may come into contact, causing interference in the frequency band where the second upper patch (220) resonates. The adhesive substrate (500) prevents direct contact between the first lower patch (130) and the second upper patch (220) while adhering the first patch antenna (100) and the second patch antenna (200), thereby preventing interference from occurring in the frequency band.

[0105] Meanwhile, referring to FIG. 15, the stacked patch antenna can also prevent frequency band interference of the second upper patch (220) by the first lower patch (130) by removing the first lower patch (130) of the first patch antenna (100).

[0106] The above description is merely an illustrative illustration of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. 1st patch antenna; A second patch antenna arranged below the first patch antenna; A first feed pin penetrating the first patch antenna and the second patch antenna; A second feed pin spaced apart from the first feed pin and penetrating through the first patch antenna and the second patch antenna; A third feed pin spaced apart from the first feed pin and the second feed pin and penetrating through the first patch antenna and the second patch antenna; and A fourth feed pin spaced apart from the first feed pin, the second feed pin, and the third feed pin, and penetrating through the first patch antenna and the second patch antenna, The second patch antenna is a laminated patch antenna module in which a plurality of via holes are formed through which the first feed pin, the second feed pin, the third feed pin, and the fourth feed pin respectively penetrate, and an internal metal layer is formed on the inner wall surface of at least one of the plurality of via holes.

2. In paragraph 1, In the above first patch antenna, A first through hole through which the first power supply pin passes; A second through hole spaced apart from the first through hole and through which the second power supply pin passes; A third through hole spaced apart from the first through hole and the second through hole and through which the third power supply pin passes; and A laminated patch antenna module having a fourth through hole formed spaced apart from the first through hole, the second through hole, and the third through hole and through which the fourth feed pin passes.

3. In paragraph 2, A stacked patch antenna module in which a virtual straight line connecting the first through hole and the third through hole and a virtual straight line connecting the second through hole and the fourth through hole are orthogonal.

4. In paragraph 2, In the above second patch antenna, A fifth through hole through which the first power supply pin passes through the first through hole; A sixth through hole spaced apart from the fifth through hole and through which the second power supply pin, which has penetrated the second through hole, penetrates; A seventh through hole spaced apart from the fifth through hole and the sixth through hole, and through which the third power supply pin that has passed through the third through hole passes; and A laminated patch antenna module having an eighth through hole formed spaced apart from the fifth through hole, the sixth through hole, and the seventh through hole, and through which the fourth feed pin passing through the fourth through hole passes.

5. In paragraph 4, The above second patch antenna, A first inner metal layer arranged on the inner wall surface of the seventh through hole and connected to the upper patch and lower patch of the second patch antenna and spaced apart from the third feed pin; and A laminated patch antenna module including a second internal metal layer disposed on the inner wall surface of the eighth through hole and connected to the upper patch and lower patch of the second patch antenna, and spaced apart from the fourth feed pin.

6. In paragraph 2, The above first patch antenna, A first base substrate having a 1-1 through hole through which the first feed pin passes, a 2-1 through hole through which the second feed pin passes, a 3-1 through hole through which the third feed pin passes, and a 4-1 through hole through which the fourth feed pin passes formed therein; A first upper patch is formed on the upper surface of the first base substrate, and has a first-second through hole through which the first power supply pin passes, a second-second through hole through which the second power supply pin passes, a third-second through hole through which the third power supply pin passes, and a fourth-second through hole through which the fourth power supply pin passes; and A laminated patch antenna comprising a first lower patch disposed on the lower surface of the first base substrate, and having a 1-3 through hole through which the first feed pin passes, a 2-3 through hole through which the second feed pin passes, a 3-3 through hole through which the third feed pin passes, and a 4-3 through hole through which the fourth feed pin passes.

7. In paragraph 6, The above 1-1 through hole, the 1-2 through hole and the 1-3 through hole overlap to form a first through hole through which the first power supply pin passes, The above 2-1 through hole, the 2-2 through hole and the 2-3 through hole overlap to form a second through hole through which the second power supply pin passes, The above 3-1 through hole, the 3-2 through hole and the 3-3 through hole overlap to form a third through hole through which the third power supply pin passes, A laminated patch antenna in which the above 4-1 through hole, the 4-2 through hole, and the 4-3 through hole overlap to form a fourth through hole through which the fourth feed pin passes.

8. In paragraph 6, At least one of the first feed pin and the second feed pin, A stacked patch antenna module that is spaced apart from the first upper patch to form a spaced apart space, and is not electrically connected to the first upper patch by the spaced apart space.

9. In paragraph 1, The above second patch antenna, A second base substrate having a 5-1 through hole through which the first feed pin passes, a 6-1 through hole through which the second feed pin passes, a 7-1 through hole through which the third feed pin passes, and an 8-1 through hole through which the fourth feed pin passes formed therein; A second upper patch is formed on the upper surface of the second base material, and has a 5-2 through hole through which the first power supply pin passes, a 6-2 through hole through which the second power supply pin passes, a 7-2 through hole through which the third power supply pin passes, and an 8-2 through hole through which the fourth power supply pin passes; and A laminated patch antenna module comprising a second lower patch disposed on the lower surface of the second base substrate and having a 5-3 through hole through which the first feed pin passes, a 6-3 through hole through which the second feed pin passes, a 7-3 through hole through which the third feed pin passes, and an 8-3 through hole through which the fourth feed pin passes.

10. In paragraph 9, The above 5-1 through hole, the 5-2 through hole and the 5-3 through hole overlap to form a fifth through hole through which the first feed pin, which has penetrated the first through hole of the first patch antenna, penetrates. The above 6-1 through hole, the 6-2 through hole and the 6-3 through hole overlap to form a 6th through hole through which the second feed pin, which has penetrated the second through hole of the first patch antenna, penetrates. The above 7-1 through hole, the 7-2 through hole and the 7-3 through hole overlap to form a 7th through hole through which the 3rd feed pin, which has penetrated the 3rd through hole of the 1st patch antenna, penetrates. A laminated patch antenna module in which the above-mentioned 8-1 through hole, the above-mentioned 8-2 through hole, and the above-mentioned 8-3 through hole overlap to form an 8th through hole through which the 4th feed pin, which has penetrated the 4th through hole of the 1st patch antenna, penetrates.

11. In paragraph 9, The above second patch antenna, The 1-1 inner metal layer arranged on the inner wall surface of the above 7-1 through hole; The 1-2 inner metal layer arranged on the inner wall surface of the above 7-2 through hole; and Including the 1-3 inner metal layer arranged on the inner wall surface of the above 7-3 through hole, A laminated patch antenna module in which the first-first inner metal layer, the first-second inner metal layer, and the first-third inner metal layer constitute a first inner metal layer connecting the second upper patch and the second lower patch.

12. In paragraph 9, The above second patch antenna, The 2-1 inner metal layer arranged on the inner wall surface of the above 8-1 through hole; The 2-2 inner metal layer arranged on the inner wall surface of the above 8-2 through hole; and Including a 2-3 inner metal layer arranged on the inner wall surface of the above 8-3 through hole, A laminated patch antenna module in which the 2-1 inner metal layer, the 2-2 inner metal layer, and the 2-3 inner metal layer constitute a second inner metal layer connecting the second upper patch and the second lower patch.

13. In paragraph 9, The above second upper patch, A stacked patch antenna module spaced apart from the first feed pin penetrating the 5-2 through hole and the second feed pin penetrating the 6-2 through hole, and connected to the first feed pin and the second feed pin through electromagnetic coupling.

14. In paragraph 1, A first hybrid coupler connected to the first power supply pin and the second power supply pin and outputting a first frequency signal and a second frequency signal; and A stacked patch antenna module further comprising a second hybrid coupler connected to the third feed pin and the fourth feed pin and outputting a third frequency signal.

15. In paragraph 14, The above first hybrid coupler, A first input terminal connected to the first power supply pin; A second input terminal connected to the second power supply pin; A first output terminal connected to a signal processing element that processes the first frequency signal and the second frequency signal; and A stacked patch antenna module comprising a second output terminal connected to a resistor.

16. In paragraph 14, The above second hybrid coupler, A first input terminal connected to the third power supply pin; A second input terminal connected to the fourth power supply pin; a first output terminal connected to a resistor; and A stacked patch antenna module including a second output terminal connected to a signal processing element for processing the third frequency signal.

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