Electronic device comprising microphone module
The integration of a closed air path within the wingtip of wearable electronic devices addresses wind noise issues by guiding and attenuating wind, enhancing audio quality and performance without additional components.
Patent Information
- Application Number
- PCT/KR2024/009864
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-08-24
- Filing Date
- 2024-07-10
- Publication Date
- 2025-01-16
AI Technical Summary
Wearable electronic devices face challenges in reducing wind noise, which affects audio quality and performance, especially due to the miniaturization trend and component integration limitations in microphone chambers.
Incorporating a closed air path or wind path within the wingtip of the device, connected to the microphone hole and chamber, to guide and attenuate wind flowing into the microphone module, thereby reducing wind noise without adding components.
This solution enhances audio performance by effectively reducing wind noise, improving microphone performance and noise cancellation in various environments, including windy conditions.
Smart Images

Figure KR2024009864_16012025_PF_FP_ABST
Abstract
Description
Electronic device including a microphone module
[0001] The present disclosure relates to a wearable electronic device including a microphone module.
[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment features like gaming, multimedia functions like music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.
[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.
[0004] According to one embodiment of the present disclosure, a wearable electronic device may be provided. The electronic device may include a housing forming at least a portion of an exterior of the electronic device and a first microphone module disposed within the housing. The housing may include a first portion including a first microphone hole exposed to the outside of the electronic device, a first microphone chamber extending inwardly from the first microphone hole into the first portion and connected to the first microphone module, and a wing tip formed by extending from the first portion. The wing tip may include a closed air path disposed on the inside of the wing tip and fluidly connected to the first microphone hole. The closed air path of the wing tip may be configured such that a portion of air blown in from the outside of the electronic device through the first microphone hole is introduced into the closed air path.
[0005] According to one embodiment of the present disclosure, a wearable electronic device may be provided. The electronic device may include a housing forming at least a portion of an exterior of the electronic device and a first microphone module disposed within the housing. The housing may include a first microphone hole exposed to the outside of the electronic device, a first microphone chamber extending inwardly of the housing from the first microphone hole and connected to the first microphone module, and a wingtip extending from a portion of the housing. The wingtip may include a closed air path disposed on the inside of the wingtip and communicating with the first microphone chamber. The closed air path of the wingtip may be configured such that a portion of air blown in from the outside of the electronic device through the first microphone hole is introduced into the closed air path.
[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.
[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.
[0008] FIG. 2 is a block diagram of an audio module according to one embodiment of the present disclosure.
[0009] FIG. 3 is a drawing showing an electronic device according to one embodiment of the present disclosure worn on a user's body.
[0010] FIGS. 4, 5, and 6 are perspective views showing an electronic device according to an embodiment of the present disclosure viewed from different angles.
[0011] FIG. 7 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.
[0012] Fig. 8 is a partial cross-sectional view for explaining part C of Fig. 7.
[0013] FIG. 9 is a graph for explaining wind noise changed based on a wind path according to one embodiment of the present disclosure.
[0014] FIG. 10 is a graph for explaining pink noise modified based on a wind path according to one embodiment of the present disclosure.
[0015] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.
[0016] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.
[0017] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.
[0018] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.
[0019] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.
[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).
[0021] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
[0022] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.
[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).
[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).
[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.
[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).
[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
[0032] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.
[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).
[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).
[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.
[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).
[0039] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.
[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
[0042] FIG. 2 is a block diagram of an audio module according to one embodiment. The audio module (170) of the block diagram (200) of FIG. 2 may be referred to as the audio module (170) of the electronic device (101) of FIG. 1.
[0043] Referring to FIG. 2, the audio module (170) may include, for example, an audio input interface (210), an audio input mixer (220), an analog to digital converter (ADC) (230), an audio signal processor (240), a digital to analog converter (DAC) (250), an audio output mixer (260), or an audio output interface (270).
[0044] The audio input interface (210) can receive an audio signal corresponding to a sound acquired from outside the electronic device (101) as part of an input module (e.g., input module (150) of FIG. 1)) or through a microphone (e.g., dynamic microphone, condenser microphone, or piezo microphone) configured separately from the electronic device (e.g., electronic device (101) of FIG. 1). For example, when an audio signal is obtained from an external electronic device (e.g., an external electronic device (102) of FIG. 1) (e.g., a headset or a microphone), the audio input interface (210) may be connected directly to the external electronic device (e.g., the external electronic device (102) of FIG. 1) through a connection terminal (e.g., a connection terminal (178) of FIG. 1) or wirelessly (e.g., Bluetooth communication) through a wireless communication module (e.g., a wireless communication module (192) of FIG. 1) to receive the audio signal. According to one embodiment, the audio input interface (210) may receive a control signal (e.g., a volume adjustment signal received through an input button) related to the audio signal obtained from the external electronic device (102). The audio input interface (210) may include a plurality of audio input channels, and may receive different audio signals for each corresponding audio input channel among the plurality of audio input channels. According to one embodiment, additionally or alternatively, the audio input interface (210) may include an electronic An audio signal can be input from another component of the device (101) (e.g., the processor (120) or memory (130) of FIG. 1).
[0045] The audio input mixer (220) can synthesize a plurality of input audio signals into at least one audio signal. For example, according to one embodiment, the audio input mixer (220) can synthesize a plurality of analog audio signals input through the audio input interface (210) into at least one analog audio signal.
[0046] The ADC (230) can convert an analog audio signal into a digital audio signal. For example, according to one embodiment, the ADC (230) can convert an analog audio signal received through the audio input interface (210), or additionally or alternatively, an analog audio signal synthesized through the audio input mixer (220), into a digital audio signal.
[0047] The audio signal processor (240) may perform various processing on a digital audio signal input through the ADC (230) or a digital audio signal received from another component of an electronic device (e.g., the electronic device (101) of FIG. 1). For example, according to one embodiment, the audio signal processor (240) may change a sampling rate, apply one or more filters, perform interpolation processing, amplify or attenuate all or part of a frequency band, process noise (e.g., reduce noise or echo), change a channel (e.g., switch between mono and stereo), mix, or extract a specified signal on one or more digital audio signals. According to one embodiment, one or more functions of the audio signal processor (240) may be implemented in the form of an equalizer.
[0048] The DAC (250) can convert a digital audio signal into an analog audio signal. For example, according to one embodiment, the DAC (250) can convert a digital audio signal processed by an audio signal processor (240) or a digital audio signal obtained from another component (e.g., a processor (120) or memory (130) of FIG. 1) of an electronic device (e.g., an electronic device (101) of FIG. 1)) into an analog audio signal.
[0049] The audio output mixer (260) can synthesize a plurality of audio signals to be output into at least one audio signal. For example, according to one embodiment, the audio output mixer (260) can synthesize an audio signal converted into analog through the DAC (250) and another analog audio signal (e.g., an analog audio signal received through the audio input interface (210)) into at least one analog audio signal.
[0050] The audio output interface (270) can output an analog audio signal converted by the DAC (250), or additionally or alternatively, an analog audio signal synthesized by the audio output mixer (260) to the outside of the electronic device (e.g., the electronic device (101) of FIG. 1) through an audio output module (e.g., the audio output module (155) of FIG. 1). The audio output module (155) can include, for example, a speaker such as a dynamic driver or a balanced armature driver, or a receiver. According to one embodiment, the audio output module (155) can include a plurality of speakers. In this case, the audio output interface (270) can output an audio signal having a plurality of different channels (e.g., stereo or 5.1 channels) through at least some of the speakers among the plurality of speakers. According to one embodiment, the audio output interface (270) may be connected directly to an external electronic device (e.g., an external speaker or headset) (e.g., an external electronic device (102) of FIG. 1) via a connection terminal (e.g., a connection terminal (178) of FIG. 1) or wirelessly via a wireless communication module (192) to output an audio signal.
[0051] According to one embodiment, the audio module (170) can generate at least one digital audio signal by synthesizing a plurality of digital audio signals using at least one function of the audio signal processor (240) without separately having an audio input mixer (220) or an audio output mixer (260).
[0052] According to one embodiment, the audio module (170) may include an audio amplifier (not shown) (e.g., a speaker amplifier circuit) capable of amplifying an analog audio signal input through the audio input interface (210) or an audio signal to be output through the audio output interface (270). According to one embodiment, the audio amplifier may be configured as a separate module from the audio module (170).
[0053] FIG. 3 is a drawing showing an electronic device according to an embodiment of the present disclosure worn on a user's body. FIGS. 4 to 6 are perspective views showing an electronic device according to an embodiment of the present disclosure viewed from different angles.
[0054] Referring to FIG. 3, the electronic device (101) may include a housing (310) that forms at least a portion of the exterior of the electronic device (101). Components of the electronic device (101) may be accommodated in an internal space surrounded by the housing (310). For example, audio components (e.g., an audio module (170) of FIG. 2) and electrical / electronic components (e.g., a processor (120), a power management module (188), a battery (189), and / or a wireless communication module (192) of FIG. 1) may be disposed inside the housing (310). The configuration of the electronic device (101) of FIG. 3 may be substantially the same as or similar to all or part of the configuration of the electronic device (101) of FIG. 1.
[0055] Referring to FIGS. 3 to 6, the housing (310) of the electronic device (101) may include a first part (311) (or main body), a second part (or stem part) (312), and a wing tip (313). In the present disclosure, the housing (310) is referred to as the first part (311), the second part (312), and the wing tip (313) for the purpose of explanation, but the first part (311), the second part (312), and / or the wing tip (313) may be formed or manufactured integrally as a single component. For example, in the present disclosure, the first part (311) and the second part (312) of the housing (310) may be described by being distinguished by a dotted line A as shown exemplarily in FIG. 4.
[0056] According to one embodiment, the electronic device (101) may be a wearable electronic device. The electronic device (101) may be an earphone, an earset, an in-ear earset, or earbuds that can be worn on a part of a user's body, such as the user's ear (e.g., E of FIG. 3). In one embodiment, the electronic device (101) may be an open-type earset that is worn in a manner in which at least a portion thereof is seated on the user's auricle (or concha). Referring to FIG. 3, in one embodiment, a first portion (311) and a wingtip (313) of the electronic device (101) may be seated on the user's concha (e4 of FIG. 3). For example, the wingtip (313) of the electronic device (101) may be seated on the outer edge region (e4 of the user's conch) adjacent to the antihelix (e1 of FIG. 3) (e.g., the cymba concha). When the first part (311) of the electronic device (101) is seated on the user's conch (e4), at least a portion (e.g., the microphone grille (319)) of the second part (312) may be visually exposed to the outside of the user's ear (E). For example, the first part (311) and / or the second part (312) of the electronic device (101) may be supported by ear structures (e.g., the antitragus (e2) and / or the tragus (e3)) around the user's conch (e4), and thus, the phenomenon of the electronic device (101) being detached from the user's ear (E) may be reduced or prevented. However, the structure in which each part of the electronic device (101) of the present disclosure is placed on the user's ear (e.g., E of FIG. 3) is not limited and may be changed according to the shape of the user's ear and usage habits.
[0057] In the present disclosure, the electronic device (101) is exemplified as an open-type earset, but the structure of the electronic device (101) may be modified. For example, the electronic device (101) may be a canal-type earset primarily intended to be mounted in the external auditory canal extending from the auricle to the eardrum. In this case, the electronic device (101) may further include an ear tip connected to the speaker hole (314).
[0058] According to some embodiments, the electronic device (101) may be electrically connected to an external electronic device (e.g., the electronic device (102) of FIG. 1). For example, the electronic device (101) may function as an audio output interface (e.g., the audio output module (155) of FIG. 1) that outputs an audio signal received from the external electronic device (102) to the outside.
[0059] According to one embodiment, the electronic device (101) may communicate with an external electronic device (102) or be controlled by the external electronic device (102). The electronic device (101) may be an interaction-type electronic device that is paired with an external electronic device (102), such as a smart phone, through a communication method such as Bluetooth, and converts data received from the external electronic device (102) to output sound or receives a user's voice and transmits it to the external electronic device (102).
[0060] In one embodiment, the electronic device (101) may be wirelessly connected to an external electronic device (102). For example, the electronic device (101) may communicate with the external electronic device (102) via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). The network may include, but is not limited to, a mobile or cellular communication network, a local area network (LAN) (e.g., Bluetooth communication), a wireless local area network (WLAN), a wide area network (WAN), the Internet, or a small area network (SAN). In one embodiment, the electronic device (101) may be wiredly connected to the external electronic device (102) using a cable (not shown).
[0061] According to one embodiment, the electronic device (101) may not communicate with an external electronic device (102). In this case, the electronic device (101) may be implemented to receive a signal corresponding to a sound acquired from the outside according to the operation (or control) of the components included in the electronic device (101) itself without being controlled by the external electronic device (102), and to output an acoustic signal to the outside. For example, the electronic device (101) may be a stand-alone electronic device that plays music or a video on its own without communicating with an external electronic device (102), outputs a sound corresponding thereto, or receives and processes a user's voice.
[0062] In one embodiment, an audio module including a speaker module and a microphone module (e.g., an audio module (170) of FIG. 1 or FIG. 2) and electrical / electronic components (e.g., a processor (120), a power management module (188), a battery (189), and a wireless communication module (192) of FIG. 1) may be disposed in the first part (311) of the housing (310) (or the main body).
[0063] In one embodiment, the first part (311) of the housing (310) may include a speaker hole (314) and a first microphone hole (315). According to one embodiment, the speaker hole (314) and the first microphone hole (315) may each be at least one hole formed penetrating through different regions of the first part (311). For example, the interior of the first part (311) of the housing (310) may include a speaker module (e.g., the audio output interface (270), the audio output mixer (230), and / or the DAC (250) of FIG. 2) that outputs sound to the outside of the electronic device (101) through the speaker hole (314). For example, a membrane member including a porous structure for blocking foreign substances from entering the interior of the electronic device (101) may be disposed in the speaker hole (314). According to one embodiment, an external microphone module (e.g., the first microphone module (331) of FIGS. 7 and 8) configured to receive sound from outside the electronic device (101) through a first microphone hole (315) may be disposed inside the first portion (311) of the housing (310). According to one embodiment, the housing (310) or the first portion (311) of the housing (310) may include a microphone chamber (e.g., the first microphone chamber (316) of FIGS. 7 and 8) extending from the first microphone hole (315) and connected to the external microphone module (e.g., the first microphone module (331) of FIGS. 7 and 8).
[0064] In one embodiment, the second part (or stem part) (312) of the housing (310) may refer to a part of the housing (310) that extends from the first part (311). For example, the second part (312) may have a shape that extends or protrudes from a different area than a part of the first part (311) where the wingtip (313) is disposed. For example, the second part (312) of the housing (310) may have a shape that extends in one axial direction. For example, the extension direction of the second part (312) of the housing (310) may be different from the extension or protrusion direction of the wingtip (313) of the housing (310). According to one embodiment, an external microphone module (e.g., a second microphone module (332) of FIGS. 7 and 8) may be disposed inside the second portion (312) so as to be positioned closer to the user's mouth when the user wears the electronic device (101) than an external microphone module (e.g., a first microphone module (331) of FIGS. 7 and 8) disposed inside the first portion (311). In one embodiment, the housing (310) or the second portion (312) may include a microphone hole (e.g., a second microphone hole (317) of FIG. 7) and a microphone chamber (e.g., a second microphone chamber (318) of FIG. 7) for transmitting sound from outside the electronic device (101) to the external microphone module (e.g., a second microphone module (332) of FIGS. 7 and 8). According to one embodiment, a sensor module of the electronic device (101) (e.g., the sensor module (176) of FIG. 1 or the sensor module (360) of FIG. 7) may be placed inside the second portion (312) of the housing (310).
[0065] In one embodiment, the wing tip (313) of the housing (310) may be extended or protruded from the first portion (311). For example, at least a portion (e.g., an end) of the wing tip (313) may be rested on the user's ear when the user wears the electronic device (101). According to one embodiment, the electronic device (101) including the wing tip (313) may be more stably mounted on the user's ear and may reduce the phenomenon of the electronic device (101) being detached from the user's ear, compared to a case in which the electronic device (101) does not include the wing tip (313). According to one embodiment, the wing tip (313) may include at least a partially curved portion. In other words, the wing tip (313) may include at least a partially curved surface. For example, the wing tip (313) may have an entirely curved shape. However, the shape of the wingtip (313) may be changed, and for example, the wingtip (313) may include a portion that is at least partially linearly extended. For example, the wingtip (313) may include a flexible material, and may be formed of a material that is relatively more flexible than the first portion (311) and the second portion (312). For example, the wingtip (313) may be integrally formed or connected to the first portion (311) by injection molding.
[0066] Referring to FIG. 6, the electronic device (101) may further include a microphone grill (319) and / or a light-emitting element (321) disposed on the housing (310). In one embodiment, the microphone grill (319) and / or the light-emitting element (321) may be omitted.
[0067] According to one embodiment, the microphone grill (319) may be arranged to surround a portion of the outer surface of the housing (310) exposed to the outside of the electronic device (101). For example, the microphone grill (319) may be arranged to be visible to the outside when the user wears the electronic device (101). According to one embodiment, the microphone grill (319) may be arranged to cover a first microphone hole (315) formed in the first part (311). According to one embodiment, the microphone grill (319) may be configured to transmit sound or vibration from outside the electronic device (101) to the first microphone hole (315), while attenuating wind that generates wind noise. For example, the microphone grill (319) may weaken or attenuate wind that flows toward an external microphone (e.g., the first microphone module (315) of FIGS. 7 and 8) inside the first part (311) through the first microphone hole (315). For example, the microphone grill (319) may have a porous structure such as a mesh structure.
[0068] In one embodiment, the microphone grille (319) may extend from the first portion (311) of the housing (310) to the second portion (312). For example, the microphone grille (319) may be positioned to cover the light-emitting element (321) positioned in the second portion (312). However, in the present disclosure, the structure of the microphone grille (319) may be changed. For example, the microphone grille (319) may be provided only in the first portion (311) to cover only the first microphone hole (315) formed in the first portion (311), and may not extend to the second portion (312). Alternatively, as an example, the microphone grille (319) may be formed to extend from the first portion (311) to a portion of the second portion (312), but may overlap with the first microphone hole (315) and not overlap with the light-emitting element (321).
[0069] In one embodiment, the light-emitting element (321) may be disposed in the second portion (312) of the housing (310). For example, the light-emitting element (321) may be disposed so as to be visible to the outside when the user wears the electronic device (101). The light-emitting element (321) may include, for example, an LED, an IR LED, and / or a xenon lamp. The light-emitting element (321) may provide, for example, status information of the electronic device (101) in the form of light. For example, the light-emitting element (321) may display status information of the electronic device (101), such as the status of a wireless connection (e.g., a Bluetooth connection) between the electronic device (101) and an external electronic device (e.g., the external electronic device (102) of FIG. 1) (e.g., a smartphone or tablet PC) or the remaining battery power of the battery (e.g., the battery (189) of FIG. 1).
[0070] In the present disclosure, the structure of the electronic device (101) may be modified. For example, while the electronic device (101) has been primarily described as an earphone, the present invention is not limited thereto. For example, the electronic device (101) may be an in-ear headset or a hearing aid.
[0071] Hereinafter, with reference to FIGS. 7 and 8, a wind noise reduction structure including a wind path (3131) formed within a wing tip (313) of a housing (310) and such structure will be described.
[0072] FIG. 7 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure. FIG. 8 is a partial cross-sectional view illustrating portion C of FIG. 7.
[0073] The electronic device (101) of FIG. 7 may be referred to as the electronic device (101) of FIGS. 3 to 6. According to one embodiment of the present disclosure, wind noise that may occur in the first microphone module (331) may be suppressed by using a wind path (3131) within a wingtip (313) that is fluidly connected to the first microphone chamber (316) through an air vent (3111), as described below with reference to FIGS. 7 and 8. In the present disclosure, “wind noise” may mean noise that occurs when turbulence of wind flowing into an external microphone module causes vibration of the external microphone module.
[0074] Referring to FIG. 7, in one embodiment, the electronic device (101) may include a microphone module (330) and a housing (310) (e.g., the housing (310) of FIGS. 3 to 6) that accommodates the microphone module (330). In one embodiment, the electronic device (101) may further include a circuit board assembly (340) and a sensor module (360).
[0075] In one embodiment, the microphone module (330) may include a first microphone module (331) and / or a second microphone module (332). For example, the first microphone module (331) and / or the second microphone module (331) may include the audio input interface (210), the audio input mixer (220), and / or the ADC (230) of FIG. 2. In one embodiment, the first microphone module (331) may be disposed within a first portion (311) of the housing (310) (e.g., the first portion (311) of FIGS. 4 to 6). In one embodiment, the second microphone module (332) may be disposed within a second portion (312) of the housing (310) (e.g., the second portion (312) of FIGS. 4 to 6). According to one embodiment, the first microphone module (331) and the second microphone module (322) can obtain sounds or vibrations outside the electronic device (101) through the first microphone hole (315) and the second microphone hole (317) formed in the housing (310), respectively.
[0076] According to one embodiment, the second microphone module (322) may be placed closer to the user's mouth than the first microphone module (331) when the user wears the electronic device (101) on his or her ear. For example, the second microphone module (322) may correspond to a microphone for transmitting and receiving calls, and the first microphone module (331) may correspond to a microphone for acquiring ambient sounds of the electronic device (101). According to one embodiment, the processor (e.g., the processor (120) of FIG. 1) and / or the audio module (e.g., the audio module (170) of FIGS. 1 and 2) of the electronic device (101) may perform an active noise cancelling (ANC) function using the microphone module (330). For example, the active noise canceling function may be a function to reduce noise by acquiring a sound wave using a microphone module (e.g., the first microphone module (331)), reversing the phase of the acquired wave, and then outputting the phase-reversed wave through a speaker. Noise generated from outside the electronic device (101) can be reduced by destructive interference using the active noise canceling function. According to one embodiment, wind noise can be reduced due to a wind path (3131) in a microphone chamber (e.g., the first microphone chamber (316)) and a wing tip (313) described below, and the performance of the active noise canceling function can be improved.
[0077] According to one embodiment, the housing (310) may include internal support structures (311a, 312a) for supporting components of the electronic device (101). For example, in the present disclosure, the first portion (311) and the second portion (312) of the housing (310) may be described as being distinguished by a dotted line A (e.g., dotted line A in FIG. 4) as exemplarily shown in FIG. 7. For example, the first portion (311) may be understood to include a first internal support structure (311a), and the second portion (312) may be understood to include a second internal support structure (312a).
[0078] According to one embodiment, the housing (310) may include a first microphone hole (315) (e.g., the first microphone hole (315) of FIG. 6) formed penetrating a portion of a first portion (311) of the housing (310) (e.g., the first portion (311) of FIGS. 4 to 6) and a first microphone chamber (316) extending inwardly from the first microphone hole (315) of the first portion (311). In the present disclosure, the first microphone hole (315) and the first microphone chamber (316) may be understood as being included in the housing (310) or the first portion (311) of the housing (310).
[0079] According to one embodiment, the first microphone hole (315) may be formed through a portion of the first part (311) of the housing (310) so as to be exposed to the outside of the electronic device (101). For example, the first microphone hole (315) may be formed on one side or area of the first part (311) that does not come into contact with the user's body (e.g., an ear) while the user is wearing the electronic device (101). According to one embodiment, the first microphone hole (315) may be covered with a microphone grill (319) having a porous structure (e.g., the microphone grill (319) of FIG. 6). For example, sound or vibration from the outside of the electronic device (101) introduced through the microphone grill (319) may be transmitted to the first microphone chamber (316) through the first microphone hole (315). For example, the first microphone hole (315) may be positioned to at least partially face the first microphone module (331) with the first microphone chamber (316) therebetween. Referring to FIG. 7, the first microphone hole (315) may be in a form that extends or expands to a portion of the area indicated by 315a in FIG. 7.
[0080] According to one embodiment, the first microphone chamber (316) may refer to a space formed through a portion of the first internal support structure (311a) of the first portion (311). For example, the first microphone chamber (316) may be positioned between the first microphone hole (315) and the first microphone module (331), and may be fluidly connected to the first microphone hole (315). For example, the first microphone chamber (316) may be arranged to at least partially face the first microphone module (331). According to one embodiment, sound or vibration from outside the electronic device (101) that enters the first microphone chamber (316) through the first microphone hole (315) may resonate in the first microphone chamber (316) and be transmitted to the first microphone module (331). According to one embodiment, the wind (W) blowing toward the first microphone hole (315) may be primarily attenuated by the microphone grill (319) and secondarily reduced by attenuation or canceling interference in the wind path (3131) within the first microphone chamber (316) and the wingtip (313) described below (e.g., the wingtip (313) of FIGS. 4 to 6).
[0081] Referring to FIG. 8, in one embodiment, the wingtip (313) of the housing (310) (e.g., the wingtip (313) of FIGS. 4 to 6) may include at least one wind path (3131) disposed inside. According to one embodiment, the wind path (3131) may be connected or fluidly connected to the first microphone hole (315). According to one embodiment, the first wind chamber (316) may be connected to the first microphone chamber (316) and may be connected to the first microphone hole (315) through the first microphone chamber (316). According to one embodiment, the first internal support structure (311a) of the first portion (311) may include an air vent (3111) for connecting or fluidly connecting the first microphone chamber (316) and the wind path (3131). In one embodiment, the air vent (3111) may be positioned inside the first internal support structure (311a). For example, a first microphone chamber (316) may be formed through a first region of the first internal support structure (311a), and an air vent (3111) may be formed through a second region of the first internal support structure (311a) that is different from the first region. For example, the air vent (3111) may be a space or passage extending from an opening formed in a portion of the first internal support structure (311a) surrounding the first microphone chamber (316) to an opening formed in a portion of the first support structure (311a) facing the wind path (3131) of the wingtip (313). According to one embodiment, the wind path (3131) may be connected to the first microphone chamber (316) to function as an expansion space of the first microphone chamber (316) and may supplement or enhance the wind noise reduction function of the first microphone chamber (316).
[0082] Referring to FIG. 8, according to one embodiment, wind outside the electronic device (101) that has entered the first microphone hole (315) may enter the first microphone chamber (316). At least a portion of the wind that has entered the first microphone chamber (316) may be dispersed to the wind path (3131) of the wingtip (313). According to one embodiment, the wind indicated by W in FIG. 8 may enter the first microphone chamber (316), some of which may move along the first path (g1) toward the first microphone module (331), and some of which may enter the second path (g2) toward the wind path (3131). The wind that has entered the first microphone chamber (316) and the wind path (3131) may be attenuated or canceled and interfered with within the first microphone chamber (316) and the wind path (3131) to be reduced. According to one embodiment, the wind flowing into the first microphone module (331) can be reduced and wind noise generated in the first microphone module (331) can be reduced compared to when the wind path (3131) of the wingtip (313) is not present. According to one embodiment of the present disclosure, since the wind noise generated in the first microphone module (331) is reduced by the wind path (3131) of the wingtip (313), the audio quality or performance (e.g., microphone performance, noise canceling performance, and / or call performance) of the electronic device (101) can be improved in various environments (e.g., windy environments).
[0083] In one embodiment, the wind path (3131) may include at least a partially curved portion. In other words, the wind path (3131) may include at least a partially curved surface. For example, the wind path (3131) may have an entirely curved shape. However, the shape of the wind path (3131) may be changed, for example, the wind path (3131) may include a portion that is at least partially linearly extended. For example, the shape of the wind path (3131) may be formed to correspond to or correspond to the shape of the wing tip (313). For example, the shape of the wind path (3131) may be formed separately from the shape of the wing tip (313). For example, one or more wind paths (3131) may be provided within the wing tip (313).
[0084] Referring to FIG. 7, the first microphone hole (315) may be expanded or extended to a portion of the area indicated by 315a in FIG. 7. For example, if the first microphone hole (315) is expanded or extended to a portion of the area indicated by 315a in FIG. 7, a portion of the first microphone hole (315) indicated by 315a in FIG. 7 may function as an additional wind path. For example, the wind indicated by W in FIG. 8 may flow into the first microphone hole (315), and some of the wind may move toward the first microphone chamber (316) and some of the wind may be dispersed and attenuated to a portion of the first microphone hole (315) indicated by 315a in FIG. 7. For example, a portion of the first microphone hole (315) indicated by 315a in FIG. 7 may provide a wind noise attenuation function by dispersing a portion of the wind moving to the first microphone module (331) through the first microphone chamber (316).
[0085] According to one embodiment, the second microphone hole (317) may be formed through a portion of the second portion (312) of the housing (310) so as to be exposed to the outside of the electronic device (101). According to one embodiment, the second microphone hole (317) may be positioned closer to the user's mouth than the first microphone hole (315) when the user wears the electronic device (101) on his / her ear. For example, the second microphone hole (317) may be formed so as to be open toward the user's face when the user wears the electronic device (101) on his / her ear. For example, the second microphone hole (317) may be formed on one side or area of the second portion (312) that does not come into contact with the user's body (e.g., the ear) when the user wears the electronic device (101). According to one embodiment, the second microphone hole (317) may be covered with a microphone grill (319) having a porous structure (e.g., the microphone grill (319) of FIG. 6). For example, sound or vibration from outside the electronic device (101) that is introduced through the microphone grill (319) can be transmitted to the second microphone module (332) through the second microphone chamber (318) via the second microphone hole (317). For example, the second microphone hole (317) can be arranged to at least partially face the second microphone module (332) with the second microphone chamber (318) interposed therebetween.
[0086] According to one embodiment, the second microphone chamber (318) may refer to a space formed through a portion of the first internal support structure (312a) of the second portion (312). For example, the second microphone chamber (318) may be positioned between the second microphone hole (317) and the second microphone module (332), and may be fluidly connected to the second microphone hole (317). For example, the second microphone chamber (318) may be arranged to at least partially face the second microphone module (332). According to one embodiment, sound or vibration from outside the electronic device (101) that enters the second microphone chamber (318) through the second microphone hole (317) may resonate in the second microphone chamber (318) and be transmitted to the second microphone module (332). According to one embodiment, the second microphone chamber (318) can offset wind introduced into the second microphone hole (317). For example, the second microphone chamber (318) can serve to reduce wind noise generated by vibrating the second microphone module (332).
[0087] According to one embodiment, the electronic device (101) may further include a sensor module (360). According to one embodiment, the sensor module (360) can detect a user's input (e.g., contact or pressure) using a touch pad disposed on a part of the housing (310) (e.g., the second part (312). For example, the sensor module (360) can detect a change in electric capacity generated by the user's body (e.g., a finger) when the user's body approaches or contacts a part of the housing (310) (e.g., the second part (312). The processor of the electronic device (101) (the processor (120) of FIG. 1) can perform a predetermined function based on the user input detected by the sensor module (360). According to one embodiment, the sensor module (360) can be disposed between the first microphone module (331) and the second microphone module (332). According to one embodiment, the electronic device (101) can include a circuit board assembly (340). For example, the printed circuit board (341) of the circuit board assembly (340) and / or a flexible circuit board (342). For example, the sensor module (360) may be connected to a printed circuit board (341) of the circuit board assembly (340) and may be connected to a main circuit board disposed within the first portion (311) of the housing (310) and a processor (120) mounted on the main circuit board via the flexible circuit board (342).
[0088] FIG. 9 is a graph illustrating modified wind noise based on a wind path according to an embodiment of the present disclosure. FIG. 10 is a graph illustrating modified pink noise based on a wind path according to an embodiment of the present disclosure.
[0089] Figures 9 and 10 may represent graphs of frequency-response levels. For example, the horizontal axis of Figures 9 and 10 may represent frequency (Hz), and the vertical axis may represent response level (or response magnitude) (dB).
[0090] FIG. 9 is a graph for comparing the magnitude of wind noise depending on the presence or absence of a wind noise reduction structure (e.g., a wind path (3131) and an air vent (3111) of FIG. 8) according to an embodiment of the present disclosure. Referring to FIG. 9, an electronic device (e.g., an electronic device (101) of FIGS. 1 and 3 to 7) including a wind noise reduction structure (e.g., a wind path (3131) and / or an air vent (3111) of FIG. 8) according to an embodiment of the present disclosure can have reduced wind noise compared to an electronic device that does not include the wind noise reduction structure. According to one embodiment, the response level (P) of the wind noise of the electronic device (101) including the wind path (3131) and the air vent (3111) may be lower than the response level (A) of the electronic device not including the wind path (3131) and the air vent (3111) in a specified frequency range (e.g., 0 to 4000 Hz or 0 to about 5000 Hz). For example, the wind noise may be understood as noise generated when the turbulence of the wind flowing into the electronic device vibrates the microphone module (e.g., the first microphone module (331) of FIGS. 7 and 8).
[0091] FIG. 10 is a graph for comparing the size of pink noise depending on the presence or absence of a wind noise reduction structure (e.g., a wind path (3131) and an air vent (3111) of FIG. 8) according to an embodiment of the present disclosure. Referring to FIG. 10, a response level (P) of pink noise of an electronic device (e.g., an electronic device (101) of FIGS. 1 and 3 to 7) including a wind noise reduction structure (e.g., a wind path (3131) and an air vent (3111) of FIG. 8) according to an embodiment of the present disclosure may be substantially the same as or similar to a response level (A) of pink noise of an electronic device that does not include the wind noise reduction structure in a specified frequency range (e.g., 0 to 4000 Hz or 0 to about 5000 Hz). For example, the pink noise may be a noise level that is substantially evenly reproduced in a reproduction frequency band. For example, pink noise can be white noise attenuated by about 3 decibels (dB) per octave.
[0092] Referring to FIGS. 9 and 10 together, it can be confirmed that, according to an embodiment of the present disclosure, an electronic device (101) including a wind path (3131) and an air vent (3111) maintains a response level of pink noise substantially the same or similar to that of an electronic device not including the wind path (3131) and the air vent (3111) in a specified frequency range (e.g., 0 to 4000 Hz or 0 to about 5000 Hz), while reducing the response level of wind noise. According to an embodiment of the present disclosure, by reducing wind noise, the audio quality or performance (e.g., microphone performance, noise canceling performance, and / or call performance) of the electronic device (101) can be improved in various environments (e.g., windy environments).
[0093] Wireless earphones or earsets typically include one or more external microphone modules as an input device. Typically, the external microphone module can be configured to receive sound or vibration from outside the earset through a microphone hole and microphone chamber exposed to the outside of the earset. The external microphone module of a wireless earset may be positioned relatively farther from the user's mouth than that of a smartphone. Therefore, wireless earsets may be relatively vulnerable to wind noise, which occurs when wind blows through the microphone hole connected to the external microphone module, causing noise. Wind noise refers to noise generated by the turbulence of wind blowing into the external microphone module, causing vibration in the external microphone module. The microphone chamber, which is the empty space connecting the microphone hole and the external microphone module, can serve to attenuate wind noise. While increasing the size of the microphone chamber can improve wind noise attenuation, the trend toward miniaturization and component integration of electronic devices such as earsets may make it difficult to secure a sufficiently large microphone chamber. Therefore, a structure may be required to complement these microphone chambers and reduce wind noise from external microphone modules.
[0094] Aspects of the present disclosure are intended to solve at least the problems and / or disadvantages described above and to provide at least the advantages described below.
[0095] According to one embodiment of the present disclosure, a structure including a wind path formed in a wingtip, which is a structure for improving the wearing comfort of an electronic device (e.g., earphones or earset), and the wind path is connected to a microphone hole leading to an external microphone module and / or a microphone chamber connecting the external microphone module and the microphone hole, so that wind flowing toward the external microphone module can be guided to the wind path, and an electronic device including the same can be provided.
[0096] According to one embodiment of the present disclosure, a structure for reducing wind noise can be implemented without adding parts by forming a wind path within a wingtip, which is a structure for improving the wearing comfort of an electronic device (e.g., earphones or earset), and improved audio performance can be provided by reducing wind noise.
[0097] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.
[0098] The effects that can be obtained from this disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly identified through this document may be provided.
[0099] According to one embodiment of the present disclosure, a wearable electronic device (101) may be provided. The electronic device may include a housing (310) forming at least a portion of an exterior of the electronic device and a first microphone module (331) disposed within the housing. The housing may include a first portion (311) including a first microphone hole (315) exposed to the outside of the electronic device, a first microphone chamber (316) extending inwardly from the first microphone hole to the first portion and connected to the first microphone module, and at least one wingtip (313) extending from the first portion to the outside of the electronic device. The wingtip may include a closed air path (or wind path) (3131) disposed on the inside of the wingtip and fluidly connected to the first microphone hole. The closed air path of the wingtip may be configured such that a portion of the wind blown in through the first microphone hole from outside the electronic device is introduced into the closed air path.
[0100] According to one embodiment, the first portion of the housing may include an air vent (3111) communicating between the first microphone chamber and the closed air path of the wingtip. The closed air path may be communicated with the first microphone chamber and the first microphone hole through the at least one air vent.
[0101] In one embodiment, the first portion of the housing may include a first internal support structure (311a). The air vent may be formed through a portion of the first internal support structure located between the first microphone chamber and the closed air path.
[0102] According to one embodiment, the closed air path of the wingtip may be configured to introduce a portion of wind blowing in through the first microphone hole from outside the electronic device into the closed air path to attenuate the noise effect of the wind detected by the first microphone module.
[0103] In one embodiment, at least one of the wingtips or at least one wind path of the wingtip may include an at least partially curved portion.
[0104] In one embodiment, the first microphone hole may at least partially face the first microphone module.
[0105] According to one embodiment, the first microphone module may be configured to convert external sound of the electronic device transmitted through the first microphone hole and the first microphone chamber into a digital signal.
[0106] According to one embodiment, the housing may further include a microphone grill (319) disposed on a portion of the outer surface thereof. The microphone grill may be disposed to cover the first microphone hole.
[0107] According to one embodiment, the housing may further include a second portion (312) extending from the first portion to the exterior of the electronic device. The second portion may include a second microphone hole (317).
[0108] According to one embodiment, the housing may further include a second microphone module (332) disposed within the second portion. The housing may further include a second microphone chamber (318) extending inwardly of the second portion from the second microphone hole and connected to the second microphone module.
[0109] According to one embodiment, the second portion is spaced apart from the wingtip, and the extension direction of the second portion and the extension direction of the wingtip may be different from each other.
[0110] According to one embodiment, the device may further include a sensor module (360) disposed between the first microphone module and the second microphone module.
[0111] According to one embodiment, the housing may further include a microphone grill that surrounds a portion of an outer surface thereof. The microphone grill may be arranged to cover at least one of the first microphone hole and the second microphone hole.
[0112] According to one embodiment, when the electronic device is worn on the user's ear, the second microphone hole may be positioned closer to the user's mouth than the first microphone hole.
[0113] According to one embodiment, the housing may further include at least one speaker module (230; 250; 270) disposed within the housing. The first portion of the housing may include at least one speaker hole (314) connected to the speaker module.
[0114] According to one embodiment of the present disclosure, a wearable electronic device (101) may be provided. The electronic device may include a housing (310) forming at least a portion of an exterior of the electronic device and a first microphone module (331) disposed within the housing. The housing may include a first microphone hole (315) exposed to the outside of the electronic device, a first microphone chamber (316) extending inwardly from the first microphone hole into the housing and connected to the first microphone module, and at least one wingtip (313) extending from a portion of the housing into the outside of the electronic device. The wingtip may include a closed air path (or wind path) (3131) disposed on the inside of the wingtip and fluidly connected to the first microphone hole. The closed air path of the wingtip may be configured such that a portion of wind blown in from the outside of the electronic device through the first microphone hole is introduced into the closed air path.
[0115] According to one embodiment, the housing may include an air vent (3111) communicating between the first microphone chamber and the closed air path of the wingtip. The closed air path may communicate with the first microphone chamber and the first microphone hole through the air vent.
[0116] In one embodiment, the housing may include an internal support structure (311a). The air vent may be formed through a portion of the internal support structure located between the first microphone chamber and the closed air path.
[0117] According to one embodiment, the closed air path of the wingtip may be configured to introduce a portion of wind blowing in through the first microphone hole from outside the electronic device into the closed air path to attenuate the noise effect of the wind detected by the first microphone module.
[0118] According to one embodiment, the housing may further include a microphone grill (319) disposed on a portion of the outer surface thereof. The microphone grill may be disposed to cover the first microphone hole.
[0119] The wind noise reduction structure including the wind path of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.
[0120] While this disclosure has been described by way of example and example, it should be understood that the embodiments of this disclosure are illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.
[0121] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.
[0122] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.
[0123] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).
[0124] An embodiment of the present document may be implemented as software (e.g., a program (140) of FIG. 1) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138) of FIG. 1) readable by a machine (e.g., an electronic device (101) of FIG. 1). For example, a processor (e.g., a processor (120) of FIG. 1) of the machine (e.g., an electronic device (101) of FIG. 1) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.
[0125] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.
[0126] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.
Claims
1. In an electronic device (101) that can be worn on a user's ear, a housing (310) forming at least a portion of the exterior of the electronic device; and Including a first microphone module (331) arranged within the housing, The above housing, A first part (311) including a first microphone hole (315) exposed to the outside of the electronic device; A first microphone chamber (316) extending inwardly from the first microphone hole of the first section and connected to the first microphone module; and Including a wing tip (313) formed by extending from the first part above, The wingtip comprises a closed air path (3131) disposed on the inner side of the wingtip and fluidly connected to the first microphone hole, An electronic device wherein the closed air path of the wingtip is configured such that a portion of wind blown in through the first microphone hole from the outside of the electronic device is introduced into the closed air path.
2. In paragraph 1, The first part of the housing comprises an air vent (3111) communicating between the first microphone chamber and the closed air path of the wingtip, An electronic device in which the closed air path is connected to the first microphone chamber and the first microphone hole through the air vent.
3. In paragraph 2, The first part of the above housing includes a first internal support structure (311a), An electronic device wherein the air vent is formed through a portion of the first internal support structure located between the first microphone chamber and the closed air path.
4. In any one of paragraphs 1 to 3, An electronic device wherein the closed air path of the wingtip is configured to introduce a portion of wind blown in through the first microphone hole from the outside of the electronic device into the closed air path to attenuate the noise effect of the wind detected by the first microphone module.
5. In any one of paragraphs 1 to 4, An electronic device, wherein at least one of said wingtips or at least one wind path of said wingtip comprises at least a partially curved portion.
6. In any one of paragraphs 1 to 5, An electronic device, wherein the first microphone hole at least partially faces the first microphone module.
7. In any one of paragraphs 1 to 6, An electronic device, wherein the first microphone module is configured to convert external sound of the electronic device transmitted through the first microphone hole and the first microphone chamber into a digital signal.
8. In any one of paragraphs 1 to 7, Further comprising a microphone grill (319) arranged on a portion of the outer surface of the housing, An electronic device wherein the above microphone grill is arranged to cover the first microphone hole.
9. In any one of paragraphs 1 to 8, The housing further includes a second portion (312) extending from the first portion to the outside of the electronic device, An electronic device, wherein the second part includes a second microphone hole (317).
10. In paragraph 9, Further comprising a second microphone module (332) arranged within the second portion, An electronic device, wherein the housing further includes a second microphone chamber (318) extending inwardly of the second portion from the second microphone hole and connected to the second microphone module.
11. In Article 10, An electronic device further comprising a sensor module (360) disposed between the first microphone module and the second microphone module.
12. In any one of paragraphs 9 to 11, An electronic device wherein the second part is spaced apart from the wingtip, and the extension direction of the second part and the extension direction of the wingtip are different from each other.
13. In any one of paragraphs 10 to 12, Further comprising a microphone grill covering a portion of the outer surface of the housing; An electronic device, wherein the microphone grill is arranged to cover at least one of the first microphone hole and the second microphone hole.
14. In any one of paragraphs 10 to 13, An electronic device, wherein the second microphone hole is positioned closer to the user's mouth than the first microphone hole when the electronic device is worn on the user's ear.
15. In any one of paragraphs 1 to 14, Further comprising at least one speaker module (230; 250; 270) arranged within the housing, An electronic device, wherein the first part of the housing includes at least one speaker hole (314) connected to the speaker module.
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