Electronic device comprising block

Abstract

The present disclosure relates to an electronic device. An electronic device according to an embodiment of the present disclosure comprises: a first housing; a second housing rotatably coupled to the first housing; a hinge which connects the first housing and the second housing to be rotatable; a flexible display comprising a region corresponding to the first housing and a region corresponding to the second housing; a hinge cover which covers the hinge and is at least partially disposed between the first housing and the second housing; a flexible circuit board which extends across the hinge cover from the position corresponding to the first housing toward the position corresponding to the second housing; and a block which is arranged to be spaced apart from the flexible circuit board.

Description

Electronic device containing a block

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including blocks.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] An electronic device according to one embodiment of the present disclosure may include: a first housing; a second housing rotatably coupled to the first housing; a hinge rotatably connecting the first housing and the second housing; a flexible display including a region corresponding to the first housing and a region corresponding to the second housing; a hinge cover covering the hinge and having at least a portion disposed between the first housing and the second housing; a flexible circuit board extending across the hinge cover from a position corresponding to the first housing toward a position corresponding to the second housing; and a block spaced apart from the flexible circuit board.

[0005] An electronic device according to one embodiment of the present disclosure may include: a first housing; a second housing rotatably coupled to the first housing; a hinge rotatably connecting the first housing and the second housing; a flexible display including a region corresponding to the first housing and a region corresponding to the second housing; a hinge cover including a cover plate disposed between the first housing and the second housing and a cover wall protruding from the cover plate; a flexible circuit board extending across the hinge cover from a position corresponding to the first housing toward a position corresponding to the second housing; and a block coupled to the cover wall and forming a gap between the cover plate and the hinge cover.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 5 is a part of an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 6 is a part of an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 7A is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 7b is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 8A is an enlarged view of a portion of an electronic device cut out according to an embodiment of the present disclosure.

[0015] FIG. 8b is an enlarged view of a portion of an electronic device cut out according to an embodiment of the present disclosure.

[0016] FIG. 9A is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 9b is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 9c is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 9d is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 10 is a part of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 11 is an enlarged view of a portion of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 12A is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 12b is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 13 is a block diagram illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 14a is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 14b is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 14c is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 14d is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 14e is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 14f is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 14g is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0032] FIG. 14h is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a diagram illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0063] Referring to FIGS. 2 and 3, the electronic device (101) may include a housing (201), a hinge cover (240) covering a foldable portion of the housing (201), and a display (230) disposed within a space formed by the housing (201). According to one embodiment, a surface on which a screen output from the display (230) is exposed is defined as a front surface of the electronic device (101) (e.g., a first front surface (210a) and a second front surface (220a)). A surface opposite to the front surface is defined as a rear surface of the electronic device (101) (e.g., a first rear surface (210b) and a second rear surface (220b)). In addition, a surface surrounding a space between the front surface and the rear surface is defined as a side surface of the electronic device (101) (e.g., a first side surface (210c) and a second side surface (220c)). The side of the electronic device (101) may be at least one side of the first housing (210) or the second housing (220). The electronic device (101) of FIGS. 2 and 3 may be referred to as a foldable electronic device, a portable electronic device, or a portable foldable electronic device. According to one embodiment, the housing (201) may be referred to as a foldable housing. The display (230) may be referred to as a “flexible display.”

[0064] According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatable with respect to the first housing (210), a first rear cover (280), and a second rear cover (290). The housing (201) of the electronic device (101) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by other shapes or combinations and / or combinations of parts. For example, in one embodiment, the first housing (210) and the first rear cover (280) may be formed integrally, and the second housing (220) and the second rear cover (290) may be formed integrally.

[0065] According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge assembly (202) of FIG. 4) and may include a first front surface (210a) facing a first direction and a first rear surface (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to the hinge assembly (202) and includes a second front surface (220a) facing a third direction and a second rear surface (220b) facing a fourth direction opposite to the third direction, and may rotate about the hinge assembly (202) with respect to the first housing (210). Accordingly, the electronic device (101) may be variable between a folded state and an unfolded state. The electronic device (101) may have the first front side (210a) facing the second front side (220a) in a folded state, and the third direction may be the same as the first direction in an unfolded state. In the following, unless otherwise stated, the directions are described based on the unfolded state of the electronic device (101).

[0066] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (A) as the center, and may have an overall symmetrical shape with respect to the folding axis (A). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (101) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment, the second housing (220) additionally includes a sensor area (224) in which sensors (e.g., a front camera) are arranged, but may have a mutually symmetrical shape in other areas.

[0067] According to one embodiment, the folding axis (A) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (A) is provided along the longitudinal direction (Y-axis direction) of the electronic device (101), but the direction of the folding axis (A) is not limited thereto. For example (not shown), the electronic device (101) may include a folding axis (A) extending along the width direction (e.g., X-axis direction).

[0068] According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be attached. For example, the electronic device (101) may include a magnetic body configured to attach the digital pen to a side of the first housing (210) or a side of the second housing (220). According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be inserted. For example, a hole (not shown) into which the digital pen can be inserted may be formed in a side of the first housing (210) or a side of the second housing (220) of the electronic device (101).

[0069] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the display (230). At least a portion formed of the metallic material may provide a ground plane of the electronic device (101) and may be electrically connected to a ground line formed on a printed circuit board (e.g., the board portion (260) of FIG. 4).

[0070] According to one embodiment, the sensor area (224) may be formed to have a predetermined area adjacent to one edge or one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated example. According to one embodiment, the sensor area (224) may be provided in another corner of the second housing (220) or any area between the upper and lower corners or in the first housing (210). In one embodiment, components for performing various functions built into the electronic device (101) may be exposed to the front of the electronic device (101) through the sensor area (224) or through one or more openings provided in the sensor area (224). In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0071] According to one embodiment, the first rear cover (280) is disposed on one side of the folding axis (A) on the rear surface of the electronic device (101) and may have, for example, a substantially rectangular periphery, and the periphery may be wrapped by the first housing (210). Similarly, the second rear cover (290) is disposed on the other side of the folding axis (A) on the rear surface of the electronic device (101) and may have the periphery wrapped by the second housing (220).

[0072] According to one embodiment, the first rear cover (280) and the second rear cover (290) may have substantially symmetrical shapes with respect to the folding axis (A axis). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and according to one embodiment, the electronic device (101) may include the first rear cover (280) and the second rear cover (290) of various shapes.

[0073] According to one embodiment, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may form a space in which various components (e.g., a printed circuit board or a battery) of the electronic device (101) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of a sub-display (e.g., the sub-display (244) of FIG. 4) may be visually exposed through at least a portion of the first rear cover (280). According to one embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear cover (290). In various embodiments, the sensor may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).

[0074] According to one embodiment, a front camera exposed to the front of the electronic device (101) through one or more openings provided in the sensor area (224) or a camera module (206) exposed through at least a portion of the second rear cover (290) may include one or more lenses, image sensors, and / or image signal processors. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0075] According to one embodiment, the hinge cover (240) may be disposed between the first housing (210) and the second housing (220) to cover internal components (e.g., the hinge assembly (202) of FIG. 4). According to one embodiment, the hinge cover (240) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (101) (flat state or folded state).

[0076] According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state, the hinge cover (240) may be covered by the first housing (210) and the second housing (220) and may not be exposed. As another example, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (240) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (240) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than that in the fully folded state. In one embodiment, the hinge cover (240) may include a curved surface.

[0077] According to one embodiment, the display (230) may be placed on a space formed by the housing (201). For example, the display (230) may be mounted on a recess formed by the housing (201) and may constitute most of the front surface of the electronic device (101). Accordingly, the front surface of the electronic device (101) may include the display (230), a portion of the first housing (210) adjacent to the display (230) and a portion of the second housing (220). The rear surface of the electronic device (101) may include a first rear cover (280), a portion of the first housing (210) adjacent to the first rear cover (280), a second rear cover (290), and a portion of the second housing (220) adjacent to the second rear cover (290).

[0078] In one embodiment, the display (230) may include a plurality of displays spaced apart from each other. For example, the display (230) may include a first display area (231) disposed on a first housing (210) and a second display area (232) disposed on a second housing (220). In one embodiment, the first display area (231) and the second display area (232) may rotate about a folding axis (A).

[0079] According to one embodiment, the display (230) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the display (230) may be a foldable or flexible display. According to one embodiment, the display (230) may include a folding area (233), a first display area (231) arranged on one side (e.g., the left side of the folding area (233) illustrated in FIG. 2) with respect to the folding area (233), and a second display area (232) arranged on the other side (e.g., the right side of the folding area (233) illustrated in FIG. 2). However, the division of the areas of the display (230) is exemplary, and the display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the display (230) may be divided into regions by a folding region (233) extending parallel to the Y-axis or a folding axis (A-axis), but according to one embodiment, the display (230) may also be divided into regions based on another folding region (e.g., a folding region parallel to the X-axis) or another folding axis (e.g., a folding axis parallel to the X-axis). According to one embodiment, the display (230) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer (not shown) configured to detect a magnetic field-type stylus pen.

[0080] According to one embodiment, the first display area (231) and the second display area (232) may have an overall symmetrical shape centered on the folding area (233). According to one embodiment (not shown), the second display area (232), unlike the first display area (231), may include a cut notch depending on the presence of the sensor area (224), but may have a shape symmetrical with respect to the first display area (231) in other areas. For example, the first display area (231) and the second display area (232) may include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0081] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the display (230) according to the state of the electronic device (101) (e.g., flat state or unfolded state and folded state) will be described.

[0082] According to one embodiment, when the electronic device (101) is in a flat state (e.g., FIG. 2), the first housing (210) and the second housing (220) may be arranged to face the same direction at a substantially 180-degree angle. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a 180-degree angle with each other and face the same direction (e.g., toward the front of the electronic device). The folding area (233) may form the same plane as the first display area (231) and the second display area (232).

[0083] According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may face each other. The folding area (233) may be formed as a curved surface having at least a portion of a predetermined curvature.

[0084] According to one embodiment, when the electronic device (101) is in an intermediate state (not shown), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form an angle that is greater than the angle in the folded state and less than the angle in the unfolded state. The folding area (233) may be formed as a curved surface having at least a certain curvature, and the curvature at this time may be less than that in the folded state.

[0085] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0086] Referring to FIG. 4, the electronic device (101) may include a housing (201), a display (230), a hinge assembly (202), a battery (250), and a substrate (260). The housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290). The configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 4 may be all or part of the same as the configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 2 and / or FIG. 3.

[0087] According to one embodiment, the first housing (210) and the second housing (220) can be assembled to each other so as to be coupled to both sides of the hinge assembly (202). According to one embodiment, the first housing (210) can include a first support area (212) capable of supporting a component of the electronic device (101) (e.g., the first circuit board (262) and / or the first battery (252)) and a first side wall (211) surrounding at least a portion of the first support area (212). The first side wall (211) can include a first side surface of the electronic device (101) (e.g., the first side surface (210c) of FIG. 2). According to one embodiment, the second housing (220) may include a second support area (222) capable of supporting a component of the electronic device (101) (e.g., a second circuit board (264) and / or a second battery (254)) and a second side wall (221) surrounding at least a portion of the second support area (222). The second side wall (221) may include a second side surface of the electronic device (101) (e.g., the second side surface (220c) of FIG. 2).

[0088] According to one embodiment, the display (230) (e.g., the first display) may include a first display area (231), a second display area (232), a folding area (233), and a sub-display (244) (e.g., the second display). The configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 3 may be all or part of the same as the configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 1 and / or FIG. 2.

[0089] According to one embodiment, the sub-display (244) can display a screen in a different direction from the display areas (231, 232). For example, the sub-display (244) can output a screen in a direction opposite to the first display area (231). According to one embodiment, the sub-display (244) can be disposed on the first rear cover (280).

[0090] In one embodiment, the battery (250) may include a first battery (252) disposed within the first housing (210) and a second battery (254) disposed within the second housing (220). In one embodiment, the first battery (252) may be connected to the first circuit board (262), and the second battery (254) may be connected to the second circuit board (264). In one embodiment, the battery (250) may supply power to at least one component of the electronic device (101). In one embodiment, the battery (250) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0091] In one embodiment, the substrate (260) may include a first circuit board (262) disposed within a first housing (210) and a second circuit board (264) disposed within a second housing (220). In one embodiment, the first circuit board (262) and the second circuit board (264) may be electrically connected by at least one flexible circuit board (266). In one embodiment, at least a portion of the flexible circuit board (266) may be disposed across the hinge assembly (202). In one embodiment, the first circuit board (262) and the second circuit board (264) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (101) can be placed on the first circuit board (262) and the second circuit board (264).

[0092] According to one embodiment, the hinge assembly (202) may include a hinge (2021). The hinge (2021) may rotatably couple the first housing (210) and the second housing (220). A plurality of hinges (2021) may be arranged to be spaced apart from each other in the longitudinal direction of the hinge assembly (202). The hinge assembly (202) may include a support plate (2022). The support plate (2022) may support at least a portion of the display (230). A plurality of support plates (2022) may be arranged to be spaced apart from each other in the longitudinal direction of the hinge assembly (202).

[0093] According to one embodiment, the electronic device (101) may include speakers (208a, 208b). According to one embodiment, the speakers (208a, 208b) may convert electrical signals into sound. According to one embodiment, the speakers (208a, 208b) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). According to one embodiment, the speakers (208a, 208b) may include an upper speaker (208a) positioned at the top (+Y direction) of the electronic device (101) and a lower speaker (208b) positioned at the bottom (-Y direction) of the electronic device (101). In the present disclosure, the speakers (208a, 208b) are illustrated as being positioned within one housing (e.g., the first housing (210) of FIG. 4), but this is an optional structure. For example, the speakers (208a, 208b) may be located within at least one of the first housing (210) or the second housing (220). The configuration of the speakers (208a, 208b) of FIG. 4 may be all or part of the same as the configuration of the sound output module (155) of FIG. 1.

[0094] In one embodiment, the electronic device (101) may include a rear member (270) (or rear case). In one embodiment, the rear member (270) may be disposed within a housing (201) (e.g., a second housing (220)). In one embodiment, the rear member (270) may accommodate at least one antenna (275).

[0095] According to one embodiment, the electronic device (101) may include an antenna (275). The antennas (275a, 275b) may include, for example, an ultra wide band (UWB) antenna (275a), a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna (275b). The antenna (275) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0096] In one embodiment, an antenna structure may be formed by a portion or a combination of the housing (201). For example, the antenna (275) may include a communication antenna (275c) that is at least partially exposed to the exterior of the electronic device (101) and forms at least a portion of the exterior of the electronic device (101). The communication antenna (275c) may be used for communication with an external electronic device (e.g., Wi-Fi). The communication antenna (275c) may be connected to the upper portion (271a) or the lower portion (271b) of the rear member (270).

[0097] In the detailed description below, a configuration in which a pair of housings (or, "housings") are rotatably coupled by a hinge structure (or, "hinge structure") may be exemplified. However, it should be noted that this embodiment does not limit the electronic device according to various embodiments disclosed in the present document. For example, the electronic device according to various embodiments disclosed in the present document may include three or more housings, and "a pair of housings" in the embodiments disclosed below may mean "two housings rotatably coupled to each other among the three or more housings."

[0098] FIG. 5 is an exploded view of a hinge cover (310), a flexible circuit board (320), a block (330), and a support plate (340) according to an embodiment of the present disclosure. FIG. 6 is a drawing of a state in which the hinge cover (310), the flexible circuit board (320), and the block (330) are coupled to a housing (301). The components described with reference to FIGS. 5 and 6 may be partially or entirely the same as the components described with reference to FIGS. 1 to 4. The components described with reference to FIGS. 5 and 6 may be partially or entirely the same as the components described with reference to FIGS. 7 to 14h.

[0099] According to one embodiment, an electronic device (e.g., electronic device (200) of FIG. 4) may include a hinge cover (310). The hinge cover (310) may be coupled to a housing (301). A hinge assembly (e.g., hinge assembly (202) of FIG. 4) may include the hinge cover (310). The hinge cover (310) may be the same as the hinge cover (240) of FIG. 4. A plurality of hinges (e.g., hinge (2021) of FIG. 4) may be mounted on the hinge cover (310). The hinge cover (310) may support a plurality of hinges (e.g., hinge (2021) of FIG. 4).

[0100] According to one embodiment, an electronic device (e.g., electronic device (200) of FIG. 4) may include a flexible circuit board (320). The flexible circuit board (320) may connect a first circuit board (362) and a second circuit board (364). The first circuit board (362) may be identical to the first circuit board (262) illustrated in FIG. 4. The second circuit board (364) may be identical to the second circuit board (264) illustrated in FIG. 4. The flexible circuit board (320) may be identical to the flexible circuit board (266) illustrated in FIG. 4. The flexible circuit board (320) may extend across the hinge cover (310). The first circuit board (362) can be placed on one side with respect to the hinge cover (310), and the second circuit board (364) can be placed on the other side opposite to the first circuit board (362) with respect to the hinge cover (310). The flexible circuit board (320) can connect the first circuit board (362) and the second circuit board (364) that are opposite to the hinge cover (310).

[0101] According to one embodiment, an electronic device (e.g., electronic device (200) of FIG. 4) may include a block (330). The block (330) may be positioned on the inside of a hinge cover (310). The block (330) may support a flexible circuit board (320).

[0102] According to one embodiment, an electronic device (e.g., electronic device (200) of FIG. 4) may include a support plate (340). The support plate (340) can support a display (e.g., a display (230) of FIG. 4). The support plate (340) can be the same as the support plate (2022) illustrated in FIG. 4. The support plate (340) can be mounted on the hinge cover (310). The flexible circuit board (320) and the block (330) can be arranged between the hinge cover (310) and the support plate (340). The support plate (340) can include a first support plate (341) coupled to a first housing (3011) and a second support plate (342) coupled to a second housing (3012). The electronic device (e.g., the electronic device (200) of FIG. 4) can include a housing (301) including a first housing (3011) and a second housing (3012). The housing (301) can include a It may be identical to the housing (201) illustrated in FIG. 4. The first housing (3011) may be identical to the first housing (210) illustrated in FIG. 4. The second housing (3012) may be identical to the second housing (220) illustrated in FIG. 4.

[0103] FIG. 7a is a cross-sectional view taken along line A-A' of the M region shown in FIG. 6 in an unfolded state of an electronic device (e.g., the electronic device (101) of FIG. 2). FIG. 7b is a cross-sectional view taken along line A-A' of the M region shown in FIG. 6 in a folded state of an electronic device (e.g., the electronic device (101) of FIG. 3). FIG. 8a is a perspective view taken along line B-B' of the M region shown in FIG. 6 in an unfolded state of an electronic device (e.g., the electronic device (101) of FIG. 2). FIG. 8b is a perspective view taken along line B-B' of the M region shown in FIG. 6 in a folded state of an electronic device (e.g., the electronic device (101) of FIG. 3). The components described with reference to FIGS. 7a, 7b, 8a, and 8b may be some or all the same as the components described with reference to FIGS. 1 to 6. The components described with reference to FIGS. 7a, 7b, 8a, and 8b may be partially or entirely the same as the components described with reference to FIGS. 9a to 14h.

[0104] According to one embodiment, the first housing (3011) and the second housing (3012) can be rotated about the folding axis (FX). A hinge (e.g., hinge (2021) of FIG. 4) can rotatably couple the first housing (3011) and the second housing (3012) and provide the folding axis (FX). The hinge (2021) can be arranged on the inside of the hinge cover (310). The flexible circuit board (320) can extend across the hinge cover (310) and can extend in a direction intersecting the folding axis (FX). The block (330) can be coupled with the hinge cover (310), and the folding axis (FX) can extend through the block (330). The extension direction of the block (330) and the folding axis (FX) can intersect.

[0105] According to one embodiment, when the first housing (3011) and the second housing (3012) are unfolded as shown in FIG. 7a, the block (330) can be spaced apart from the flexible circuit board (320). A gap (G) can be formed between the block (330) and the flexible circuit board (320). When the first housing (3011) and the second housing (3012) are folded as shown in FIG. 7b, the flexible circuit board (320) can be bent toward the folding axis (FX). When the first housing (3011) and the second housing (3012) are folded based on the folding axis (FX), the flexible circuit board (320) can be moved away from the hinge cover (310). When the first housing (3011) and the second housing (3012) are folded, the block (330) and the flexible circuit board (320) can be in contact. The block (330) can restrict movement of the flexible circuit board (320).

[0106] According to one embodiment, an electronic device (e.g., electronic device (200) of FIG. 4) may include a block (430). Block (430) described with reference to FIGS. 8A and 8B may be identical to block (330) described with reference to FIGS. 5 to 7B except for its shape. The description of block (430) described with reference to FIGS. 8A and 8B may be identical to the description of block (330) described with reference to FIGS. 5 to 7B.

[0107] According to one embodiment, the hinge cover (310) may include a cover plate (311). The cover plate (311) may be disposed between the first housing (3011) and the second housing (3012). The cover plate (311) may be flat or may have a convex shape in a direction opposite to the direction in which the flexible circuit board (320) is positioned. The flexible circuit board (320) may be mounted on the cover plate (311). The hinge cover (310) may include a cover wall (312). The cover wall (312) may be coupled to the cover plate (311). The cover wall (312) may extend from the cover plate (311) in a direction parallel to the folding axis (FX). The blocks (330, 430) may be coupled to the cover wall (312). The hinge cover (310) may include a first side wall (313). The first side wall (313) may extend in a curved manner from the cover plate (311). The first side wall (313) may be curved from the cover plate (311) toward the first housing (3011). The hinge cover (310) may include a second side wall (314). The second side wall (314) may extend in a curved manner from the cover plate (311). The second side wall (314) may be curved from the cover plate (311) toward the second housing (3012).

[0108] According to one embodiment, the flexible circuit board (320) may include a first portion (321), a second portion (322), and a third portion (323). The first portion (321), the second portion (322), and the third portion (323) may be formed integrally. The first portion (321) may be mounted on the cover plate (311). The first portion (321) may be positioned between the cover plate (311) and the blocks (330, 430). The second portion (322) may be arranged to surround the first side wall (313). The second portion (322) may extend in a curved manner from the first portion (321) toward the first housing (3011). The third portion (323) may be arranged to surround the second side wall (314). The third portion (323) can extend in a curved manner from the first portion (321) toward the second housing (3012).

[0109] According to one embodiment, when the electronic device (e.g., the electronic device (101) of FIG. 2) is unfolded, a gap (G) may be formed between the block (430) and the flexible circuit board (320). The block (430) and the first portion (321) may be spaced apart from each other. The second portion (322) may be arranged to surround the first side wall (313). The third portion (323) may be arranged to surround the second side wall (314).

[0110] According to one embodiment, when the electronic device (e.g., the electronic device (101) of FIG. 3) is in a folded state, the flexible circuit board (320) and the block (430) may be in contact. When the electronic device (101) is folded, the second portion (322) may move toward the block (430). When the electronic device (101) is folded, the third portion (323) may move toward the block (430). When the electronic device (101) is folded, the first portion (321) may be spaced apart from the cover plate (311). When the electronic device (101) is folded, a gap (G1) may be formed between the first portion (321) and the cover plate (311). When the electronic device (101) is folded, the second portion (322) may be spaced apart from the first side wall (313). When the electronic device (101) is folded, the third portion (323) can be spaced apart from the second side wall (314).

[0111] FIGS. 9A, 9B, 9C, and 9D are cross-sectional views taken along line A-A' of region M illustrated in FIG. 6, according to various embodiments. The components described with reference to FIGS. 9A, 9B, 9C, and 9D may be partially or entirely identical to the components described with reference to FIGS. 1 to 8B. The components described with reference to FIGS. 9A, 9B, 9C, and 9D may be partially or entirely identical to the components described with reference to FIGS. 10 to 14H.

[0112] According to one embodiment, the blocks (330, 530, 630) may be arranged on the inside of the hinge cover (310). The blocks (330, 530, 630) may be arranged between the first side wall (313) and the second side wall (314). The blocks (330, 530, 630) may be spaced apart from the cover plate (311) of the hinge cover (310) to form a gap (G).

[0113] According to one embodiment, at least a portion of the flexible circuit board (320, 420) may be positioned between the block (330, 530, 630) and the hinge cover (310). A first portion (321, 421) of the flexible circuit board (320, 420) may be positioned between the cover plate (311) and the block (330, 530, 630).

[0114] Referring to FIG. 9A, the block (330) may have a polygonal cross-sectional shape. The block (330) may include a first surface (331). The first surface (331) may be a surface facing the flexible circuit board (320). A gap (G) may be formed between the first surface (331) and the first portion (321). The first surface (331) may be referred to as a “lower surface.” The block (330) may include a second surface (332). The second surface (332) may be a surface opposite to the first surface (331). The second surface (332) may be spaced apart from the first surface (331) in the extension direction of the folding axis (FX). The second surface (332) may be referred to as an “upper surface.” The block (330) may include a first side surface (333). The first side (333) can connect the first side (331) and the second side (332). The first side (333) can face the second part (322) of the flexible circuit board (320). The first side (333) can include a first-first side (3331) and a first-second side (3332). The first-first side (3331) can connect the first side (331) and the first-second side (3332). The first-second side (3332) can connect the second side (332) and the first-first side (3331). The first-first side (3331) and the first-second side (3332) can form an angle therebetween. The block (330) can include a second side (334). The second side (334) can connect the first side (331) and the second side (332). The second side (334) can face the third portion (323) of the flexible circuit board (320). The second side (334) can include a 2-1 side (3341) and a 2-2 side (3342). The 2-1 side (3341) can connect the first side (331) and the 2-2 side (3342). The 2-2 side (3342) can connect the second side (332) and the 2-1 side (3341). The 2-1 side (3341) and the 2-2 side (3342) can form an angle therebetween.

[0115] Referring to FIG. 9B, the block (530) may have a polygonal cross-sectional shape. The block (530) may include a first surface (531). The first surface (531) may be a surface facing the flexible circuit board (320). A gap (G) may be formed between the first surface (531) and the first portion (321). The first surface (531) may be referred to as a “lower surface.” The block (530) may include a second surface (532). The second surface (532) may be a surface opposite to the first surface (531). The second surface (532) may be spaced apart from the first surface (531) in the extension direction of the folding axis (FX). The second surface (532) may be referred to as an “upper surface.” The block (530) may include a first side surface (533). The first side (533) can connect the first side (531) and the second side (532). The first side (533) can face the second part (322) of the flexible circuit board (320). The first side (533) can include a 1-1 side (5331), a 1-2 side (5332), and a 1-3 side (5333). The 1-1 side (5331) can connect the 1-1 side (5331) and the 1-2 side (5332). The 1-2 side (5332) can connect the 1-1 side (5331) and the 1-3 side (5333). The 1-3 side (5333) can connect the 2nd side (532) and the 1-2 side (5332). The first-first side (5331) and the first-second side (5332) can form an angle. The first-second side (5332) and the first-third side (5333) can form an angle. The block (530) can include a second side (534). The second side (534) can connect the first side (531) and the second side (532). The second side (534) can face the second part (322) of the flexible circuit board (320). The second side (534) can include a second-first side (5341), a second-second side (5342), and a second-third side (5343). The second-first side (5341) can connect the first side (531) and the second-second side (5342).The second-second side (5342) can connect the second-first side (5341) and the second-third side (5343). The second-third side (5343) can connect the second side (532) and the second-second side (5342). The second-first side (5341) and the second-second side (5342) can form an angle. The second-second side (5342) and the second-third side (5343) can form an angle.

[0116] Referring to FIG. 9C, the block (630) may have at least a portion of its cross-sectional shape that is curved. The block (630) may include a first surface (631). The first surface (631) may be a surface facing the flexible circuit board (320). A gap (G) may be formed between the first surface (631) and the first portion (321). The first surface (631) may be curved. The first surface (631) may have a convex shape toward the flexible circuit board (320). The first surface (631) may be convex toward the first portion (321) of the flexible circuit board (320). The first surface (631) may be referred to as a “lower surface.” The block (630) may include a second surface (632). The second side (632) may be an opposite side to the first side (631). The second side (632) may be spaced apart from the first side (631) in the extension direction of the folding axis (FX). The second side (632) may be referred to as an “upper side.” The block (630) may include a first side (633). The first side (633) may connect the first side (631) and the second side (632). The first side (633) may face the second portion (322) of the flexible circuit board (320). The first side (633) may include a first-first side (6331) and a first-second side (6332). The first-first side (6331) may connect the first side (631) and the first-second side (6332). The first-second side (6332) can connect the second side (632) and the first-first side (6331). The first-first side (6331) and the first-second side (6332) can form an angle therebetween. The block (630) can include a second side (634). The second side (634) can connect the first side (631) and the second side (632). The second side (634) can face the third portion (323) of the flexible circuit board (320). The second side (634) can include a second-first side (6341) and a second-second side (6342). The second-first side (6341) can connect the first side (631) and the second-second side (6342).The second-second side (6342) can connect the second side (632) and the second-first side (6341). The second-first side (6341) and the second-second side (6342) can form an angle.

[0117] Referring to FIG. 9d, the flexible circuit board (420) may have a shape in which at least a portion thereof is bent toward the block (330). The block (330) may be the same as the block (330) described with reference to FIG. 9a. The flexible circuit board (420) may include a first portion (421). The first portion (421) may be spaced apart from the block (330) and may form a gap (G) with the block (330). The flexible circuit board (420) may include a second portion (422). The second portion (422) may be formed to surround the first side wall (313). The flexible circuit board (420) may include a third portion (423). The third portion (423) may be formed to surround the second side wall (314). The flexible circuit board (420) may include a first curved portion (424). The first curved portion (424) may connect the first portion (421) and the second portion (422). The first curved portion (424) may extend convexly toward the block (330). The flexible circuit board (420) may include a second curved portion (425). The second curved portion (425) may connect the first portion (421) and the third portion (423). The second curved portion (425) may extend convexly toward the block (330). The first curved portion (424) and the second curved portion (425) may extend convexly in opposite directions.

[0118] Fig. 10 is an enlarged view of the M region illustrated in Fig. 6. Fig. 11 is an enlarged view of the joint portion of the cover wall (3121) and the block (330). The components described with reference to Figs. 10 and 11 may be partially or entirely identical to the components described with reference to Figs. 1 to 9d. The components described with reference to Figs. 10 and 11 may be partially or entirely identical to the components described with reference to Figs. 12a to 14h.

[0119] According to one embodiment, the hinge cover (310) may include a cover plate (311) and a cover wall (312). A flexible circuit board (320) may span the space between the cover plate (311) and the block (330). The block (330) may be coupled to the cover wall (312).

[0120] In one embodiment, the cover wall (312) may include a first cover wall (3121). The cover wall (312) may include a second cover wall (3122). The flexible circuit board (320) may be disposed between the first cover wall (3121) and the second cover wall (3122). One end of the block (330) may be coupled to the first cover wall (3121), and the other end may be coupled to the second cover wall (3122). The block (330) may extend between the first cover wall (3121) and the second cover wall (3122).

[0121] According to one embodiment, the first cover wall (3121) may include a groove (3121a). The groove (3121a) may be recessed in a direction in which the block (330) is inserted. The first cover wall (3121) may include a recess (3121b). The recess (3121b) may be recessed in a direction in which the block (330) is inserted. The groove (3121a) and the recess (3121b) may be connected. The recess (3121b) may protrude from the groove (3121a) in a direction intersecting the extension direction of the groove (3121a).

[0122] According to one embodiment, the block (330) can be inserted into at least a portion of the first cover wall (3121). The block (330) can include a first body (335). The first body (335) can be inserted into a groove (3121a). An end of the first body (335) can be inserted into and caught in the groove (3121a). The block (330) can include a second body (336). The second body (336) can protrude from the first body (335). The first body (335) and the second body (336) can be integral. The block (330) can include a third body (337). The third body (337) can connect the first body (335) and the second body (336). The block (330) may include a block protrusion (338). The block protrusion (338) may protrude from the second body (336) toward the recess (3121b). The block protrusion (338) may be inserted into the recess (3121b).

[0123] Fig. 12a is a cross-sectional view taken along the line C-C' shown in Fig. 10. Fig. 12b is a cross-sectional view taken along the line D-D' shown in Fig. 10. The components described with reference to Figs. 12a and 12b may be partly or entirely the same as the components described with reference to Figs. 1 to 11. The components described with reference to Figs. 12a and 12b may be partly or entirely the same as the components described with reference to Figs. 13 to 14h.

[0124] According to one embodiment, the block (330) may be connected to the hinge cover (310) by a hook or screw fastening method. However, the connection method between the block (330) and the hinge cover (310) is not limited to that described above. For example, the block (330) and the hinge cover (310) may be formed as an integral body, or may be connected through a separate adhesive member (not shown).

[0125] According to one embodiment, the first body (335) of the block (330) can be inserted into a groove (3121a) formed in a first cover wall (3121). The first cover wall (3121) can include a brick protrusion (3121c). The brick protrusion (3121c) can be spaced apart from the cover plate (311). The groove (3121a) can be formed between the cover plate (311) and the brick protrusion (3121c). The first body (335) can be inserted into the groove (3121a) and caught in the brick protrusion (3121c). The recess (e.g., the recess (3121b) of FIG. 11) can be formed by being sunken into the brick protrusion (3121c). The block protrusion (338) can be positioned out of alignment with the brick protrusion (3121c) and can be inserted into a recess (e.g., recess (3121b) of FIG. 11).

[0126] According to one embodiment, an electronic device (e.g., electronic device (200) of FIG. 4) may include a fastening member (315). The fastening member (315) may couple a block (330) and a hinge cover (310). The block (330) may include a fastening body (339) protruding from a first body (335). The fastening body (339) may include a body hole (3391). The second cover wall (3122) may include a cover hole (3122a). The body hole (3391) and the cover hole (3122a) may face each other. The fastening member (315) may penetrate the body hole (3391) and the cover hole (3122a). The fastening member (315) may be a screw.

[0127] According to one embodiment, the block (330) can be coupled to each of the first cover wall (3121) and the second cover wall (3122). The block (330) can be coupled to both the first cover wall (3121) and the second cover wall (3122) in the manner as illustrated in FIG. 12a. The block (330) can be coupled to both the first cover wall (3121) and the second cover wall (3122) in the manner as illustrated in FIG. 12b. The block (330) can be coupled to either the first cover wall (3121) or the second cover wall (3122) in the manner as illustrated in FIG. 12a, and to the other in the manner as illustrated in FIG. 12b.

[0128] FIG. 13 is a block diagram illustrating a method of assembling a hinge assembly (e.g., hinge assembly (202) of FIG. 4) according to one embodiment of the present disclosure. FIGS. 14a, 14b, 14c, 14d, 14e, 14f, 14g, and 14h are drawings sequentially illustrating a method of assembling a hinge assembly (e.g., hinge assembly (202) of FIG. 4). The components described with reference to FIGS. 13, 14a, 14b, 14c, 14d, 14e, 14f, 14g, and 14h may be some or all the same as the components described with reference to FIGS. 1 to 12b.

[0129] According to one embodiment, an electronic device (e.g., electronic device (200) of FIG. 4) may have a manufacturing method (S100). An electronic device (e.g., electronic device (200) of FIG. 4) may be manufactured by the manufacturing method (S100).

[0130] According to one embodiment, the method (S100) for manufacturing an electronic device (200) may include a first process (S110) for connecting a substrate. The method (S100) for manufacturing an electronic device (200) may include a second process (S120) for shaping the substrate. The method (S100) for manufacturing an electronic device (200) may include a third process (S130) for pressing the substrate. The method (S100) for manufacturing an electronic device (200) may include a fourth process (S140) for installing a block. The method (S100) for manufacturing an electronic device (200) may include a fifth process (S150) for assembling a plate.

[0131] According to one embodiment, as illustrated in FIG. 14A, the first process (S110) may include a 1-1 process (S111). The 1-1 process (S111) may be a process of connecting a flexible circuit board (320) to a first circuit board (362). The first circuit board (362) may be disposed in a first housing (3011). The first housing (3011) may include a first substrate support portion (3011a) on which at least a portion of the flexible circuit board (320) is disposed. The electronic device (200) may include a first rod (351) disposed in the first substrate support portion (3011a). At least a portion of the flexible circuit board (320) may be disposed between the first rod (351) and the first substrate support portion (3011a).

[0132] According to one embodiment, as illustrated in FIG. 14b, the first process (S110) may include a first-second process (S112). The first-second process (S112) may be a process of connecting a flexible circuit board (320) to a second circuit board (364). The second circuit board (364) may be disposed in a second housing (3012). The second housing (3012) may include a second substrate support (3012a) on which at least a portion of the flexible circuit board (320) is disposed. The electronic device (200) may include a second bar (352) disposed in the second substrate support (3012a). At least a portion of the flexible circuit board (320) may be disposed between the second bar (352) and the second substrate support (3012a). The electronic device (200) may include a rod (350) configured to support a flexible circuit board (320). The rod (350) may include a first rod (351) and a second rod (352).

[0133] According to one embodiment, as illustrated in FIG. 14c, the second process (S120) may include the second-first process (S121). The second-first process (S121) may be a process of folding the first housing (3011) and the second housing (3012). The flexible circuit board (320) may be at least partially folded between the first housing (3011) and the second housing (3012).

[0134] According to one embodiment, as illustrated in FIG. 14d, the second process (S120) may include a second-second process (S122). The second-second process (S122) may be a process of compressing the flexible circuit board (320) between the first mold (P1) and the second mold (P2) to form a shape of the flexible circuit board (320).

[0135] According to one embodiment, as illustrated in FIG. 14e, the second process (S120) may include the second-third process (S113). The second-third process (S123) may be a process of unfolding a shaped flexible circuit board (320). The shaped flexible circuit board (320) may be divided into a first portion (321) mounted on the hinge cover (310), a second portion (322) corresponding to the first housing (3011), and a third portion (323) corresponding to the second housing (3012).

[0136] According to one embodiment, as illustrated in FIG. 14f, the third process (S130) may be a process of pressing the flexible circuit board (320) toward the hinge cover (310). The first portion (321) may be in close contact with the hinge cover (310), and the second portion (322) and the third portion (323) may have a convex shape.

[0137] According to one embodiment, as illustrated in FIG. 14g, the fourth process (S140) may be a process of combining a block (330). The block (330) may be combined with the hinge cover (310) in the manner illustrated in FIGS. 11, 12a, and 12b.

[0138] According to one embodiment, as illustrated in FIG. 14h, the fifth process (S150) may be a process of coupling a support plate (340). The first support plate (341) may be coupled to the first housing (3011). The second support plate (342) may be coupled to the second housing (3012). The support plate (340) may be mounted on the upper side of the hinge cover (310). The support plate (340) may be arranged to cover at least a portion of the flexible circuit board (320).

[0139] An electronic device may include a first housing and a second housing that are rotatably coupled to each other. The electronic device may include a flexible display disposed in the first housing and the second housing. The first housing and the second housing are rotatably coupled to each other via a hinge, and a circuit board is disposed in each of the first housing and the second housing. The electronic device includes a flexible circuit board that connects the circuit boards disposed in each of the first housing and the second housing, and the flexible circuit board extends across a rotational axis where the hinge is located. When the first housing and the second housing are rotated, a portion of the flexible circuit board adjacent to the rotational axis is deformed.

[0140] The problem to be solved in the present disclosure may be to prevent or reduce lifting of a flexible circuit board.

[0141] The problem to be solved in the present disclosure may be to reduce damage to a flexible circuit board.

[0142] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0143] An electronic device according to various embodiments of the present disclosure can prevent or reduce lifting of a flexible circuit board by arranging a block coupled to a hinge cover.

[0144] An electronic device according to various embodiments of the present disclosure can secure a gap between a block and a flexible circuit board by combining the block with a hinge cover.

[0145] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0146] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIGS. 1 to 14h) may include a first housing (210; 3011).

[0147] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIGS. 1 to 14h) may include a second housing (220; 3012) rotatably coupled to the first housing (210; 3011).

[0148] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIGS. 1 to 14h) may include a hinge (2021) that rotatably connects the first housing (210; 3011) and the second housing (220; 3012).

[0149] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIGS. 1 to 14h) may include a flexible display (230) including an area corresponding to the first housing (210; 3011) and an area corresponding to the second housing (220; 3012).

[0150] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIGS. 1 to 14h) may include a hinge cover (310) covering the hinge (2021) and at least a portion of which is disposed between the first housing (210; 3011) and the second housing (220; 3012).

[0151] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIGS. 1 to 14h) may include a flexible circuit board (266; 320) extending across the hinge cover (310) from a position corresponding to the first housing (210; 3011) toward a position corresponding to the second housing (220; 3012).

[0152] An electronic device (e.g., 200 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a block (e.g., 330; 430; 530; 630 of FIGS. 1 to 14h) spaced apart from the flexible circuit board (e.g., 266; 320 of FIGS. 1 to 14h).

[0153] A block according to one embodiment of the present disclosure (e.g., 330; 430; 530; 630 of FIGS. 1 to 14h) may be coupled to a hinge cover (e.g., 2021; 310 of FIGS. 1 to 14h).

[0154] A hinge cover (e.g., 310 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a cover plate (e.g., 311 of FIGS. 1 to 14h) spaced apart from the block (e.g., 330 of FIGS. 1 to 14h).

[0155] A hinge cover (e.g., 310 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a cover wall (e.g., 312 of FIGS. 1 to 14h) protruding from the cover plate (e.g., 311 of FIGS. 1 to 14h) and coupled to the block (e.g., 330 of FIGS. 1 to 14h).

[0156] At least a portion of the flexible circuit board (e.g., 320 of FIGS. 1 to 14h) according to one embodiment of the present disclosure can pass through a space between the cover plate (e.g., 311 of FIGS. 1 to 14h) and the block (e.g., 330 of FIGS. 1 to 14h).

[0157] According to one embodiment of the present disclosure, the flexible circuit board (e.g., 320 of FIGS. 1 to 14h) may be spaced apart from the block (e.g., 330 of FIGS. 1 to 14h) when the first housing (e.g., 3011 of FIGS. 1 to 14h) and the second housing (e.g., 3012 of FIGS. 1 to 14h) are rotated away from each other, and may be spaced apart from the hinge cover (e.g., 310 of FIGS. 1 to 14h) when the first housing (e.g., 3011 of FIGS. 1 to 14h) and the second housing (e.g., 3012 of FIGS. 1 to 14h) are rotated toward each other.

[0158] A hinge cover (e.g., 310 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a support plate (e.g., 311 of FIGS. 1 to 14h) spaced apart from the block (e.g., 330 of FIGS. 1 to 14h) and configured to secure at least a portion of the flexible circuit board (e.g., 320 of FIGS. 1 to 14h).

[0159] A hinge cover (e.g., 310 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a first side wall (e.g., 313 of FIGS. 1 to 14h) extending from the support plate (e.g., 311 of FIGS. 1 to 14h) toward the first housing (e.g., 3011 of FIGS. 1 to 14h).

[0160] A hinge cover (e.g., 310 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a second side wall (e.g., 314 of FIGS. 1 to 14h) extending from the support plate (e.g., 311 of FIGS. 1 to 14h) toward the second housing (e.g., 3012 of FIGS. 1 to 14h).

[0161] A block according to one embodiment of the present disclosure (e.g., 330 of FIGS. 1 to 14h) may be positioned between the first side wall (e.g., 313 of FIGS. 1 to 14h) and the second side wall (e.g., 314 of FIGS. 1 to 14h).

[0162] The flexible circuit board (e.g., 320 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a first portion (e.g., 321 of FIGS. 1 to 14h) mounted on the support plate (e.g., 311 of FIGS. 1 to 14h).

[0163] The flexible circuit board (e.g., 320 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a second portion (e.g., 322 of FIGS. 1 to 14h) that surrounds at least a portion of the first side wall (e.g., 313 of FIGS. 1 to 14h).

[0164] The flexible circuit board (e.g., 320 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a third portion (e.g., 323 of FIGS. 1 to 14h) that surrounds at least a portion of the second side wall (e.g., 314 of FIGS. 1 to 14h).

[0165] A block according to one embodiment of the present disclosure (e.g., 330 of FIGS. 1 to 14h) may be located between the second portion (e.g., 322 of FIGS. 1 to 14h) and the third portion (e.g., 323 of FIGS. 1 to 14h).

[0166] A hinge cover (e.g., 310 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a first cover wall (e.g., 3121 of FIGS. 1 to 14h) protruding from the cover plate (e.g., 311 of FIGS. 1 to 14h).

[0167] A hinge cover (e.g., 310 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a second cover wall (e.g., 3122 of FIGS. 1 to 14h) protruding from the cover plate (e.g., 311 of FIGS. 1 to 14h) and spaced apart from the first cover wall (e.g., 3121 of FIGS. 1 to 14h).

[0168] A block according to one embodiment of the present disclosure (e.g., 330 of FIGS. 1 to 14h) may extend between the first cover wall (e.g., 3121 of FIGS. 1 to 14h) and the second cover wall (e.g., 3122 of FIGS. 1 to 14h).

[0169] A first cover wall (e.g., 3121 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a groove (e.g., 3121a of FIGS. 1 to 14h) into which the block (e.g., 330 of FIGS. 1 to 14h) is inserted.

[0170] A block (e.g., 330 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a first body (e.g., 336 of FIGS. 1 to 14h) inserted into at least a portion of the first cover wall (e.g., 3121 of FIGS. 1 to 14h).

[0171] A first cover wall (e.g., 3121 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a protrusion (e.g., 3121c of FIGS. 1 to 14h) on which the first body (e.g., 336 of FIGS. 1 to 14h) is caught.

[0172] A block according to one embodiment of the present disclosure (e.g., 330 of FIGS. 1 to 14h) may include a body hole (e.g., 3391 of FIGS. 1 to 14h) into which a fastening member (e.g., 315 of FIGS. 1 to 14h) is inserted, which is inserted into at least a portion of the first cover wall (e.g., 3121 of FIGS. 1 to 14h) and penetrates the second cover wall (e.g., 3122 of FIGS. 1 to 14h).

[0173] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIGS. 1 to 14h) may further include a fastening member (e.g., 315 of FIGS. 1 to 14h) penetrating the hinge cover (e.g., 310 of FIGS. 1 to 14h) and the block (e.g., 330 of FIGS. 1 to 14h).

[0174] A block according to one embodiment of the present disclosure (e.g., 630 of FIGS. 1 to 14h) may include a first surface (e.g., 631 of FIGS. 1 to 14h) formed convexly toward the hinge cover (e.g., 310 of FIGS. 1 to 14h).

[0175] A flexible circuit board (e.g., 420 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a first curved portion (e.g., 424 of FIGS. 1 to 14h) formed convexly toward the block (e.g., 330 of FIGS. 1 to 14h).

[0176] A flexible circuit board (e.g., 420 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a second curved portion (e.g., 425 of FIGS. 1 to 14h) that is formed convexly toward the block (e.g., 330 of FIGS. 1 to 14h) and is spaced apart from the first curved portion (e.g., 424 of FIGS. 1 to 14h).

[0177] According to one embodiment of the present disclosure, a plurality of hinges (e.g., 2022 of FIGS. 1 to 14h) may be arranged spaced apart from each other in the direction in which the hinge cover (e.g., 310 of FIGS. 1 to 14h) extends.

[0178] A block according to one embodiment of the present disclosure (e.g., 330 of FIGS. 1 to 14h) may be positioned between the plurality of hinges (e.g., 2022 of FIGS. 1 to 14h).

[0179] An electronic device (e.g., 200 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may include a support plate (e.g., 340 of FIGS. 1 to 14h) covering at least a portion of the block (e.g., 330 of FIGS. 1 to 14h).

[0180] A block (e.g., 330 of FIGS. 1 to 14h) according to one embodiment of the present disclosure may be coupled to the cover wall (e.g., 312 of FIGS. 1 to 14h) and form a gap between the block and the cover plate (e.g., 311 of FIGS. 1 to 14h).

[0181] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101; 200), 1st Housing (210; 3011); A second housing (220; 3012) rotatably coupled to the first housing (210; 3011); A hinge (2021) that rotatably connects the first housing (210; 3011) and the second housing (220; 3012); A flexible display (230) including an area corresponding to the first housing (210; 3011) and an area corresponding to the second housing (220; 3012); A hinge cover (310) covering the above hinge (2021) and at least a portion of which is disposed between the first housing (210; 3011) and the second housing (220; 3012); A flexible circuit board (266; 320) extending across the hinge cover (310) from a position corresponding to the first housing (210; 3011) toward a position corresponding to the second housing (220; 3012); and An electronic device including a block (330; 430; 530; 630) spaced apart from the above flexible circuit board (266; 320).

2. In paragraph 1, The above hinge cover (310) is A cover plate (311) spaced apart from the above block (330); and It includes a cover wall (312) protruding from the cover plate (311) and combined with the block (330), An electronic device in which at least a portion of the above flexible circuit board (320) passes through the space between the cover plate (311) and the block (330).

3. In either of paragraphs 1 and 2, The above flexible circuit board (320) is An electronic device in which the first housing (3011) and the second housing (3012) are rotated away from each other and are spaced apart from the block (330), and in which the first housing (3011) and the second housing (3012) are rotated toward each other and are spaced apart from the hinge cover (310).

4. In any one of paragraphs 1 to 3, The above hinge cover (310) is A cover plate (311) spaced apart from the above block (330) and configured to allow at least a portion of the flexible circuit board (320) to be secured thereto; A first side wall (313) extending from the cover plate (311) toward the first housing (3011); and It includes a second side wall (314) extending from the cover plate (311) toward the second housing (3012), The above block (330) is, An electronic device positioned between the first side wall (313) and the second side wall (314).

5. In paragraph 4, The above flexible circuit board (320) is A first part (321) mounted on the above cover plate (311); A second portion (322) surrounding at least a portion of the first side wall (313); and An electronic device comprising a third portion (323) surrounding at least a portion of the second side wall (314).

6. In paragraph 5, The above block (330) is, An electronic device located between the second part (322) and the third part (323).

7. In any one of paragraphs 1 to 6, The above hinge cover (310) is A cover plate (311) spaced apart from the above block (330); and A first cover wall (3121) protruding from the above cover plate (311); and It includes a second cover wall (3122) protruding from the cover plate (311) and spaced apart from the first cover wall (3121), The above block (330) is, An electronic device extending between the first cover wall (3121) and the second cover wall (3122).

8. In paragraph 7, The above first cover wall (3121) is An electronic device including a groove (3121a) into which the above block (330) is inserted.

9. In either of paragraphs 7 and 8, The above block (330) is, Including a first body (335) inserted into at least a part of the first cover wall (3121), The above first cover wall (3121) is An electronic device including a brick protrusion (3121c) on which the first body (335) is caught.

10. In any one of paragraphs 7 to 9, The above block (330) is, An electronic device including a body hole (3391) into which a fastening member (315) is inserted, which is inserted into at least a portion of the first cover wall (3121) and penetrates the second cover wall (3122).

11. In any one of paragraphs 1 to 10, An electronic device further comprising a fastening member (315) penetrating the hinge cover (310) and the block (330).

12. In any one of paragraphs 1 to 11, The above block (630) is An electronic device including a first surface (631) formed convexly toward the hinge cover (310).

13. In any one of paragraphs 1 to 12, The above flexible circuit board (420) is A first curved portion (424) formed convexly toward the above block (330); and An electronic device including a second curved portion (425) formed convexly toward the above block (330) and spaced apart from the first curved portion (424).

14. In any one of paragraphs 1 to 13, The above hinge (2021) is The above hinge covers (310) are arranged in multiple places spaced apart from each other in the extended direction, The above block (330) is, An electronic device positioned between the plurality of hinges (2021).

15. In any one of paragraphs 1 to 14, The above block (330) is, An electronic device coupled with the above hinge cover (310).

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