Heat dissipation module and electronic device comprising same

Abstract

An electronic device according to one embodiment disclosed herein comprises: a housing including a metal plate; a printed circuit board disposed inside the housing and including a heat source; and a heat dissipation structure disposed between the metal plate and the printed circuit board, wherein the heat dissipation structure includes a heat dissipation member and a first heat transfer member disposed on the heat dissipation member, and the first heat transfer member may include a first portion configured to transfer heat generated from the heat source and a second portion including an adhesive surface.

Description

Heat dissipation module and electronic device including same

[0001] One embodiment disclosed in this document relates to a heat dissipation module and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] An electronic device can refer to any device that performs a specific function based on the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with multiple functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, calendar management, or electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure may include a housing including a metal plate, a printed circuit board disposed inside the housing and including a heat source, and a heat dissipation structure disposed between the metal plate and the printed circuit board. The heat dissipation structure may include a heat dissipation member, and a first heat transfer member disposed on the heat dissipation member. The first heat transfer member may include a first portion configured to transfer heat generated from the heat source, and a second portion including an adhesive surface.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing including a metal plate, a printed circuit board disposed inside the housing and including a heat source, and a heat dissipation structure disposed between the metal plate and the printed circuit board. The heat dissipation structure may include a heat dissipation member disposed on the metal plate, and a first heat transfer member disposed on the heat dissipation member. The first heat transfer member may include a first portion configured to transfer heat generated from the heat source, and a second portion disposed at a lower end of the first portion and including an adhesive surface.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0008] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment disclosed in this document.

[0009] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 3 according to one embodiment disclosed in this document.

[0010] FIG. 4A is a front exploded perspective view of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0011] FIG. 4b is an exploded perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0012] FIG. 5 and FIG. 6 are cross-sectional views schematically showing a heat dissipation structure according to one embodiment disclosed in this document.

[0013] FIG. 7 is a cross-sectional view schematically showing a heat dissipation structure according to one embodiment disclosed in this document.

[0014] FIG. 8 is a cross-sectional view schematically illustrating a heat dissipation structure including a cooling structure according to one embodiment disclosed in this document.

[0015] Electronic devices according to the embodiments disclosed in this document may be one type of device. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0016] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0017] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0018] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0019] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment.

[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] An electronic device according to one embodiment disclosed in this document may be a device of one type. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0043] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0044] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0045] Embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0046] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0047] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2 is a perspective view showing the front of an electronic device (101) according to one embodiment disclosed in this document.

[0049] FIG. 3 is a perspective view showing the rear side of the electronic device (101) illustrated in FIG. 2 according to one embodiment disclosed in this document.

[0050] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0051] In one embodiment, the first side (110A) may be formed by a front plate (122) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (122) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0052] In one embodiment, the front plate (122) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (122) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (122)) at one edge of the first surface (110A). In one embodiment, the front plate (122) or the back plate (111) may be substantially flat and may not include, for example, a curved extending region. When the front plate (122) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than the thickness of other portions.

[0053] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (124), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (128), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include other components.

[0054] The display (115) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (122)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (122) forming the first surface (110A) or through a portion of the side surface (110C). In one embodiment, the edge of the display (115) may be formed to be substantially the same as the adjacent outer shape of the front plate (122). In one embodiment (not shown), in order to expand the area in which the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (122) may be formed to be substantially the same.

[0055] According to one embodiment, a recess or opening may be formed in a part of a screen display area of ​​the display (115), and at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (115). In one embodiment (not shown), the display (115) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0056] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0057] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (124) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (115)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (124).

[0058] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (119).

[0059] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0060] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0061] According to one embodiment, the connector hole (e.g., the first connector hole (128), the second connector hole (109)) may include a first connector hole (128) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (102) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0062] FIG. 4A is a front view of an electronic device (101) illustrated in FIG. 2, in an exploded perspective view according to one embodiment disclosed in this document.

[0063] FIG. 4b is an exploded perspective view showing the rear side of the electronic device (101) illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0064] Referring to FIGS. 4A and 4B , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 , 2 , or 3 ) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (122) of FIG. 2 ), a display (230) (e.g., the display (115) of FIGS. 2 and 3 ), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207), and a rear plate (280) (e.g., the rear plate (111) of FIG. 3 ).

[0065] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0066] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0067] In one embodiment, the first support member (211) and the side structure (210) may be combined to form a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear side of the housing (201)' may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0068] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0069] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0070] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0071] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board not shown. For example, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board not shown or the lower support member (260b) may be arranged corresponding to the audio module (e.g., the microphone hole (103) or the speaker hole (e.g., the external speaker hole (107), the call receiver hole (114))) or the connector hole (e.g., the first connector hole (128), the second connector hole (109)) of FIG. 2.

[0072] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0073] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0074] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0075] Figures 5 and 6 are cross-sectional views schematically showing the heat dissipation structure disclosed in this document.

[0076] Referring to FIGS. 5 and 6, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a housing (e.g., the housing (110) of FIG. 2), a printed circuit board (340) disposed inside the housing, and a heat dissipation structure. The configuration of the printed circuit board (340) of FIGS. 5 and 6 may be identical to all or part of the housing and printed circuit board (240) of FIG. 4. The structures of FIGS. 5 and 6 may be optionally combined with the structures of FIGS. 2 to 4.

[0077] According to one embodiment, the electronic device may include a housing, a printed circuit board (340) disposed within the housing, and a heat dissipation structure. According to one embodiment, the housing may include a metal plate (301). For example, the metal plate may be a front plate (e.g., front plate (220) of FIG. 2) and / or a back plate (e.g., back plate (280) of FIG. 2).

[0078] According to one embodiment, the printed circuit board (340) may include a substrate (341), a heat source (342) in contact with the substrate (341), a shield can (343), and a second heat transfer member (TIM) (344).

[0079] According to one embodiment, the printed circuit board (340) may include a heat source (342). According to one embodiment, a plurality of electrical components may be disposed on at least one side of the circuit board (340). Some of the plurality of electrical components may be heat sources that generate heat. For example, the heat source (342) may be at least one chip disposed on at least one side of the board (341), and may include at least one of a power management integrated circuit (PMIC), a power amplifier (PAM), an application processor (AP), a communication processor (CP), a charger integrated circuit (Charger IC), and a DC converter. In the present embodiment, the electrical component may be an application processor (AP) or a power management integrated circuit (PMIC).

[0080] In one embodiment, the heat dissipation structure may be disposed between the metal plate (301) and the printed circuit board (340). In one embodiment, the heat dissipation structure may include a heat dissipation member (310) (a first heat dissipation member) and a first heat transfer member (320) disposed on the heat dissipation member (310). In one embodiment, the heat dissipation member (310) may be disposed on the metal plate (301). In one embodiment, the heat dissipation member (310) may include the metal plate (301). For example, the metal plate (301) may be capable of dissipating heat by itself. The heat dissipation member (310) and / or the metal plate (301) may receive heat generated from the heat source (342) through the first heat transfer member (320) and spread the heat.

[0081] According to one embodiment, the heat dissipation member (310) can diffuse heat generated from a heat source (342) of a printed circuit board (340). According to one embodiment, the heat dissipation member (310) can efficiently move the heat generated from the heat source (342) from the inside and diffuse it to the outside. The heat dissipation member (310) can be, for example, a graphite sheet. For example, the heat dissipation member (310) can include a water-cooled heat diffusion member, such as a heat pipe or a vapor chamber. A heat diffusion structure, such as a heat pipe or a vapor chamber, can efficiently transfer heat through a continuous phase change in which a small amount of working fluid is injected into a sealed container and vacuumed, causing the fluid to vaporize when heat is absorbed and condense when heat is released. Here, the material of the heat pipe, the heat dissipation sheet, or the heat dissipation paint may include a high thermal conductivity material such as graphite, carbon nanotubes, natural renewable materials, silicon, silicon, and / or graphite. In one embodiment, the carbon fiber TIM may include at least one of a liquid phase thermal interface material and / or a solid phase thermal interface material. In various embodiments of the present disclosure, the carbon fiber TIM may be formed of a solid phase thermal interface material. In one embodiment, the heat dissipation member (310) that spreads heat is placed in contact with the metal plate (301) to directly spread heat to the metal plate (301).

[0082] In one embodiment, the heat dissipation member (310) may be made of a material having a low frictional surface and thus being slippery. In one embodiment, the heat dissipation member (310) may be made of a material having a low adhesive strength. The heat dissipation member (310) may be difficult to surface process and may not be easily attached. In one embodiment, for example, the thermal conductivity of the heat dissipation member (310) may be approximately 1000 W / mK or more.

[0083] According to one embodiment, the electronic device may include a first heat transfer member (320) disposed between a printed circuit board (340) and a heat dissipation member (310) to transfer heat generated in the printed circuit board (340) to the heat dissipation member (310), which is a heat diffusion structure. For example, the first heat transfer member (320) may be composed of a carbon fiber thermal interface material (TIM) capable of transferring heat generated from a heat source. According to one embodiment, the carbon fiber TIM may include at least one of a liquid phase thermal interface material (TIM) and / or a solid phase thermal interface material (TIM). However, the first heat transfer member (320) is not limited to a carbon fiber TIM, and may include various heat dissipation materials or members for transferring heat generated from the heat source to the outside or a cover of the electronic device.

[0084] According to one embodiment, the first heat transfer member (320) may include a first portion (321) configured to transfer heat generated from the heat source (342), and a second portion (322) including an adhesive surface. According to one embodiment, the first heat transfer member (320) may include the first portion (321) and a second portion (322) that is laminated and bonded to the first portion (321). According to one embodiment, the first portion (321) may be formed integrally with the second portion (322). The first portion (321) may be, for example, a thermal interface material (TIM). The first portion (321) may include, for example, at least one of a liquid TIM, a nano TIM, 3W Tim, and 5W Tim. According to one embodiment, as the heat transfer rate of the first portion (321) increases, the adhesive strength may decrease. Therefore, the high-performance first part (321) may have low adhesive strength and may be difficult to attach to the heat dissipation member (310). According to one embodiment, the second part (322) may include a heat dissipation tape. For example, the second part (322) may include a heat dissipation sheet and an adhesive. For example, the second part (322) may include a thermally conductive sheet and an adhesive. For example, the second part (322) may be formed in a thin film form by dispersing and mixing a thermally conductive powder in a silicone resin and may include an adhesive on at least one surface. For example, the second part (322) may include an adhesive on one or both surfaces of the thermally conductive sheet. According to one embodiment, the second part (322) may be described as a heat dissipation tape or an adhesive tape.

[0085] According to one embodiment, the second portion (322) of the first heat transfer member (320) may be disposed on the heat dissipation member (310), and the first portion (321) may be disposed on the second portion (322).

[0086] According to one embodiment, the thicknesses of the first portion (321) and the second portion (322) of the first heat transfer member (320) may be limited depending on the embodiment. When the second portion (322) comes into contact with the first portion (321), heat transfer performance may be affected, so the thickness of the second portion (322) may be formed to be thinner than the thickness of the first portion (321). For example, the thickness of the first portion (321) may be approximately 30 times thicker than the thickness of the second portion (322).

[0087] According to one embodiment, the electronic device may further include a shielding film (330) between the first heat transfer member (320) and the printed circuit board (340). This may be for shielding electromagnetic waves generated from the printed circuit board (340).

[0088] According to one embodiment, the printed circuit board may further include a substrate (341), at least one heat source (342) disposed on one surface of the substrate (341), a shield can (343) mounted on one surface of the substrate (341) to accommodate the heat source (342) and including at least one opening (345) formed in an area corresponding to the heat source (342), and a second heat transfer member (TIM) (344) disposed in contact between the heat source (342) and the shielding film (330). For example, the size of the first heat transfer member (320) may be larger than the size of the second heat transfer member (344).

[0089] According to one embodiment, the shield can (343) may be formed to surround at least a portion of the heat source (342). According to one embodiment, the shield can (343) may have a structure in which an opening (345) is formed in a region where at least a portion of the heat source (342) and the shield can (343) overlap when the heat dissipation structure of the electronic device is viewed from above (e.g., when viewed in the +Z direction), for example, a region where at least a portion of the heat source (342) that can come into contact with another material so that heat generated from the heat source (342) is released to the outside, or a portion that faces the heat source (342). The shield can (343) may be coupled to one surface of the substrate (341) (e.g., one surface facing the -Z direction). At this time, at least a portion of one side of the substrate (341) and the shield can (343) may be coupled by a soldering method. For example, the shield can (343) may include one side including an opening (345) and sides forming a space between the one side and the substrate (341). The opening (345) may provide a path for heat generated from the heat source (342), and the shield can (343) may be manufactured in a shape (e.g., a closed square loop) that surrounds at least a portion of the heat source (342).

[0090] In one embodiment, a shielding film (330) may be disposed on at least a portion of the shield can (343) to close at least a portion of the opening (345). In one embodiment, the shielding film (330) may be composed of a shielding layer (not shown) and a support layer (not shown). The shielding film (330) may be disposed on one side of the heat source (342) and may serve to prevent electromagnetic waves that may be generated from the heat source (342) from affecting other electrical components (not shown) disposed inside the electronic device.

[0091] According to various embodiments, the second heat transfer member (344) may be arranged so that at least a portion thereof is disposed within the opening (345) and at least one surface thereof is in contact with the shielding film (330). The second heat transfer member (344) may be disposed adjacent to the heat source (342) and may be formed of a thermal interface material (TIM) to effectively transfer heat from the heat source (342). For example, the second heat transfer member (344) may be formed of a carbon fiber thermal interface material (TIM). However, the second heat transfer member (344) is not limited to TIM, and may include various heat dissipating materials or members for transferring heat generated from the heat source (342) to the heat dissipating member (310). For example, the various heat dissipating materials or members may include a heat pipe, a heat dissipating sheet, or a heat dissipating paint. Here, the material of the heat pipe, heat dissipation sheet, or heat dissipation paint may include a high thermal conductivity material such as graphite, carbon nanotubes, natural renewable materials, silicon, silicon, graphite, etc. In one embodiment, the carbon fiber TIM may include at least one of a liquid phase thermal interface material (TIM) and / or a solid phase thermal interface material (TIM). In various embodiments of the present disclosure, the carbon fiber TIM may be formed of a solid phase thermal interface material (TIM).

[0092] Figure 7 is a cross-sectional view schematically showing the heat dissipation structure disclosed in this document.

[0093] Referring to FIG. 7, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a housing (e.g., the housing (110) of FIG. 2), a printed circuit board (340) disposed inside the housing, and a heat dissipation structure. The configuration of FIG. 7 may be identical to all or part of FIGS. 5 and 6. The structure of FIG. 7 may be optionally combined with the structures of FIGS. 5 and 6.

[0094] According to one embodiment, the first heat transfer member (320) may include a first portion (321), and a second portion (322) laminated and bonded to the first portion (321). The first portion (321) may be, for example, a thermal interface material (TIM). The first portion (321) may include, for example, at least one of a liquid TIM, a nano TIM, 3W Tim, and 5W Tim. According to one embodiment, the higher the heat transfer rate of the first portion (321), the lower the adhesive strength. Therefore, a high-performance first portion (321) may have low adhesive strength and may be difficult to attach to the heat transfer member (310).

[0095] According to one embodiment, the first part (321) of the first heat transfer member (320) may be disposed on the heat dissipation member (310), and the second part (322) may be disposed on the first part (321). For example, the second part (322) may attach the first part (321) and the printed circuit board (340). For example, the second part (322) may attach the first part (321) and the shielding film (330). For example, the second part (322) may attach the first part (321) and the second heat transfer member (344). The stacking order of the first heat transfer member (320) may be implemented in various ways.

[0096] Figure 8 is a cross-sectional view schematically showing the heat dissipation structure disclosed in this document.

[0097] Referring to FIG. 8, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a housing (e.g., the housing (110) of FIG. 2), a printed circuit board (340) disposed inside the housing, and a heat dissipation structure. The configuration of FIG. 8 may be identical to all or part of FIGS. 5 and 6. The structure of FIG. 7 may be optionally combined with the structures of FIGS. 5 and 6.

[0098] In one embodiment, the second heat dissipation member (311) may be, for example, a cooling material. For example, it may include a cooler. For example, it may include a fan (e.g., an electric fan) that is attached to a component such as a radiator or heat sink to forcefully exhaust hot air.

[0099] According to one embodiment, a manufacturing process of an electronic device including a first heat transfer member (320) of the present invention may include a first process of placing a heat dissipation member (310) on a metal plate (301), a second process of placing a first heat transfer member (320) in which a first part (321) and a second part (322) are joined together on the heat dissipation member (310), and a third process of placing a printed circuit board (340) on the first heat transfer member (320).

[0100] An electronic device according to one embodiment of the present disclosure may include a housing including a metal plate, a printed circuit board disposed inside the housing and including a heat source, and a heat dissipation structure disposed between the metal plate and the printed circuit board. The heat dissipation structure may include a heat dissipation member, and a first heat transfer member disposed on the heat dissipation member. The first heat transfer member may include a first portion (321) configured to transfer heat generated from the heat source, and a second portion (322) including an adhesive surface.

[0101] According to one embodiment, the first portion and the second portion may be formed integrally.

[0102] According to one embodiment, a shielding film may further be included between the first heat transfer member and the printed circuit board.

[0103] In one embodiment, the second portion may be disposed between the first portion and the heat dissipation member.

[0104] In one embodiment, the second portion may be disposed between the first portion and the printed circuit board.

[0105] According to one embodiment, the heat dissipation member may include any one of a graphite sheet, a heat pipe, and a vapor chamber.

[0106] According to one embodiment, the printed circuit board may include a substrate, at least one heat source disposed on one surface of the substrate, a shield can mounted on one surface of the printed circuit board to accommodate the heat source and including at least one opening formed in an area corresponding to the heat source, and a second heat transfer member (TIM) disposed in contact between the heat source and the shielding film.

[0107] According to one embodiment, an electronic device wherein the size of the first heat transfer member is larger than the size of the second heat transfer member.

[0108] In one embodiment, the first portion may be a thermal interface material (TIM).

[0109] In one embodiment, the first portion may include any one of a liquid TIM, a nano TIM, a 3W Tim, and a 5W Tim.

[0110] In one embodiment, the thickness of the first portion may be thicker than the thickness of the second portion.

[0111] In one embodiment, the thickness of the first portion may be at least 30 times thicker than the thickness of the second portion.

[0112] An electronic device according to one embodiment of the present disclosure may include a housing including a metal plate, a printed circuit board disposed inside the housing and including a heat source, and a heat dissipation structure disposed between the metal plate and the printed circuit board. The heat dissipation structure may include a heat dissipation member (310) disposed on the metal plate, and a first heat transfer member (320) disposed on the heat dissipation member. The first heat transfer member may include a first portion (321) configured to transfer heat generated from the heat source, and a second portion (322) disposed at a lower end of the first portion and including an adhesive surface.

[0113] According to one embodiment, the first heat transfer member may be configured such that the first portion and the second portion are laminated.

[0114] According to one embodiment, the device may further include a shielding film disposed between the first heat transfer member and the printed circuit board.

[0115] In one embodiment, the heat dissipating member may be a graphite sheet.

[0116] In one embodiment, the heat dissipation member may be a heat pipe.

[0117] In one embodiment, the heat dissipation member may be a vapor chamber.

[0118] In one embodiment, the first portion may be a thermal interface material (TIM).

[0119] In one embodiment, the first portion may include any one of liquid TIM, nano TIM, 3W Tim, and 5W Tim.

[0120] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0121] Because the first part is generally susceptible to damage, it may require a structure protected by the inside of the shield can or additional support elements. Attaching the first part to a non-adhesive material can lead to peeling and reduced yield, making it difficult to apply a high-performance heat-dissipation structure.

[0122] One embodiment according to the present disclosure can improve the productivity of a first heat transfer member, including a first part (thermal interface material, TIM) and a second part joined together.

[0123] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

Claims

1. In electronic devices, A housing including a metal plate (301); A printed circuit board (340) disposed inside the housing and including a heat source; and A heat dissipation structure disposed between the metal plate and the printed circuit board; The above heat dissipation structure is, Heat dissipation member (310); and Including a first heat transfer member (320) arranged on the above heat dissipation member; An electronic device in which the first heat transfer member comprises a first portion (321) configured to transfer heat generated from the heat source, and a second portion (322) including an adhesive surface.

2. In paragraph 1, An electronic device in which the first part and the second part are formed integrally.

3. In either of paragraphs 1 and 2, An electronic device further comprising a shielding film (330) between the first heat transfer member and the printed circuit board.

4. In any one of paragraphs 1 to 3, The second part is an electronic device disposed between the first part and the heat dissipation member.

5. In any one of paragraphs 1 to 4, The second part is an electronic device disposed between the first part and the printed circuit board.

6. In any one of paragraphs 1 to 5, An electronic device wherein the heat dissipation member comprises one of a graphite sheet, a heat pipe, and a vapor chamber.

7. In paragraph 3, The above printed circuit board, Substrate (341); At least one heat source (342) arranged on one surface of the substrate; An electronic device comprising: a shield can (343) mounted on one surface of the printed circuit board in a state of accommodating the heat source and including at least one opening formed in an area corresponding to the heat source; and a second heat transfer member (TIM) arranged to be in contact between the heat source and the shielding film.

8. In paragraph 7, An electronic device wherein the size of the first heat transfer member is larger than the size of the second heat transfer member.

9. In any one of paragraphs 1 to 8, An electronic device wherein the first part is a thermal interface material (TIM).

10. In any one of paragraphs 1 to 9, Part 1 is an electronic device comprising any one of liquid TIM, nano TIM, 3W Tim, and 5W Tim.

11. In any one of paragraphs 1 to 10, An electronic device wherein the thickness of the first portion is thicker than the thickness of the second portion.

12. In any one of paragraphs 1 to 11, An electronic device wherein the thickness of the first portion is at least 30 times thicker than the thickness of the second portion.

13. In any one of paragraphs 1 to 12, The above heat dissipation member is placed on the metal plate, An electronic device wherein the second portion of the first heat transfer member is disposed below the first portion.

14. In any one of paragraphs 1 to 13, The above first heat transfer member is an electronic device in which the first part and the second part are laminated.

15. In any one of paragraphs 1 to 14, The above heat source is an electronic device including an integrated circuit mounted on one side of the printed circuit board.

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