Speaker assembly and electronic device comprising same

Abstract

According to one embodiment of the present disclosure, an electronic device can be provided. The electronic device may comprise: a housing including a first speaker hole; and a speaker assembly which is arranged in the housing and which emits sound to the outside of the electronic device through the first speaker hole. The speaker assembly includes: a speaker including a diaphragm; a first speaker cover which faces the diaphragm and which is spaced apart from the diaphragm; an acoustic space formed between the diaphragm and the speaker cover; a first support structure including a first portion surrounding a portion of the acoustic space; and a stepped structure which is arranged to be adjacent to an area in which a part of the first portion of the first support structure and the first speaker cover are in contact with each other, and which is spaced apart from the speaker module.

Description

Speaker assembly and electronic device including same

[0001] Examples disclosed in this document relate to speaker assemblies and electronic devices including the same.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] Aspects of the present disclosure address at least the problems and / or disadvantages mentioned above, and provide at least the advantages described below. Accordingly, an object of the present invention is to provide a speaker assembly and an electronic device including the same.

[0005] Additional aspects will be partly described in the following description, partly will be obvious from the description, or may be learned by reference to the embodiments of the present invention.

[0006] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a first speaker hole, a speaker assembly disposed within the housing and configured to radiate sound to the outside of the electronic device through the first speaker hole. The speaker assembly may include a speaker including a diaphragm, a first speaker cover facing the diaphragm and spaced apart from the diaphragm, an acoustic space formed between the diaphragm and the first speaker cover, a first support structure including a first portion formed to surround a portion of the acoustic space, and a step structure disposed adjacent to an area where a portion of the first portion of the first support structure and the first speaker cover come into contact and spaced apart from the speaker.

[0007] According to one embodiment of the present disclosure, a speaker assembly may be provided. The speaker assembly may include a speaker including a diaphragm, a first speaker cover facing the diaphragm and spaced apart from the diaphragm, an acoustic space formed between the diaphragm and the first speaker cover, a first support structure including a first portion formed to surround a portion of the acoustic space, and a step structure disposed adjacent to a region where a portion of the first portion of the first support structure and the first speaker cover come into contact and spaced apart from the speaker.

[0008] Other aspects, advantages and salient features of the present disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of the present disclosure taken in conjunction with the accompanying drawings.

[0009] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0011] FIG. 2 is a front perspective view of an electronic device according to one embodiment disclosed in this document.

[0012] FIG. 3 is a rear perspective view of an electronic device according to one embodiment disclosed in this document.

[0013] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 6 is a cross-sectional perspective view illustrating a speaker assembly according to one embodiment of the present disclosure.

[0016] FIG. 7A is a cross-sectional side view of an electronic device for illustrating a speaker assembly according to one embodiment of the present disclosure.

[0017] FIG. 7b is an enlarged view of portion B of FIG. 7a according to one embodiment of the present disclosure.

[0018] FIG. 8A is a cross-sectional side view showing a speaker assembly of an electronic device before operation, according to one embodiment of the present disclosure.

[0019] FIG. 8b is a cross-sectional side view showing an operating state of a speaker assembly of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 9 is a cross-sectional perspective view of a speaker assembly according to one embodiment of the present disclosure.

[0021] FIG. 10 is a cross-sectional perspective view of a speaker assembly according to one embodiment of the present disclosure.

[0022] FIG. 11 is a schematic plan view illustrating a portion of a speaker assembly of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 12 is a schematic cross-sectional side view of the speaker assembly of FIG. 11, according to one embodiment of the present disclosure.

[0024] FIG. 13 is a schematic plan view illustrating a portion of a speaker assembly of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 14 is a graph for explaining the change in sound pressure according to frequency by the single-step structure of the speaker assembly according to one embodiment of the present disclosure.

[0026] FIG. 15A is a cross-sectional side view of an electronic device for illustrating a speaker assembly according to one embodiment of the present disclosure.

[0027] FIG. 15b is an enlarged view of portion C of FIG. 15a according to one embodiment of the present disclosure.

[0028] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0029] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0031] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a component" includes reference to one or more of those surfaces.

[0032] It should be understood that each block of the flowchart and the combination of flowcharts can be performed by one or more computer programs containing instructions. The one or more computer programs may be stored entirely in a single memory, or the one or more computer programs may be divided into different parts stored in different memories.

[0033] Any function or operation described herein may be processed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing, and includes circuits such as an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, a connection chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display drive integrated circuit (IC), an audio codec chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on a chip (SoC), and an integrated circuit (IC).

[0034] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0035] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0036] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0037] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0041] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0052] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0053] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0054] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the one embodiment disclosed in this document. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0058] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0059] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0060] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0061] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0062] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0063] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0064] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and speaker holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the speaker holes (207, 214) may include an external speaker hole (207) and a call receiver hole (214). In one embodiment, the speaker holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be included in the audio module without the sound holes (207, 214).

[0065] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0066] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) can receive at least a portion of light incident on the first side (210A) (or front) of the electronic device (101) through the display (201) within the electronic device (101).

[0067] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board (e.g., the printed circuit board (240a) of FIG. 4). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received through a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or a processor (e.g., processor (120) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.

[0068] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0069] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0070] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0071] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0072] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (101) of FIG. 2 or FIG. 3) includes a display (201) (e.g., the display (201) of FIG. 2), a front plate (202) (e.g., the front plate (202) of FIG. 2), a support structure (221) (e.g., a bracket), a side bezel structure (or side bezel structure) (222), a camera module (230) (e.g., the camera module (180) of FIG. 1), at least one printed circuit board (or board assembly) (240a, 240b), a battery (245) (e.g., the battery (189) of FIG. 1), a rear case (250), an antenna (not shown) (e.g., the antenna module (197) of FIG. 1) and / or a rear plate (290) (e.g., the rear of FIG. 3). It may include a plate (211)). According to one embodiment, when including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit boards (240a, 240b) may include a first circuit board (240a) positioned above the battery (245) (e.g., in the +Y-axis direction) and a second circuit board (240b) positioned below the battery (245) (e.g., in the -Y-axis direction), and the flexible printed circuit board (240c) may electrically connect the first circuit board (240a) and the second circuit board (240b).

[0073] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the support structure (221), the rear case (250), or the flexible printed circuit board (240c)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0074] In one embodiment, the support structure (221) may be provided at least in a flat shape. In one embodiment, the support structure (221) may be disposed inside the electronic device (101) and connected to or formed integrally with the side bezel structure (222). For example, the support structure (221) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (221) at least partially includes a conductive material such as a metal, the side bezel structure (222) or a portion of the support structure (221) may function as an antenna. The support structure (221) may include two sides facing opposite directions. The display (201) may be disposed on one of the two sides of the support structure (221), and the printed circuit board (240a, 240b) may be disposed on the other side.

[0075] In one embodiment, the support structure (221) and the side bezel structure (222) may be combined and referred to as a front case or housing (220). In one embodiment, the housing (220) may be generally understood as a structure for accommodating, protecting, or arranging electrical / electronic components, such as printed circuit boards (240a, 240b) or batteries (245). In one embodiment, the housing (220) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side bezel structure (222), a front plate (202), and / or a back plate (290). In one embodiment, the front or back of the housing (220) may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the support structure (221) is disposed between the front plate (202) (e.g., the first side (210A) of FIG. 2) and the back plate (290) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (240a, 240b) or a camera module (230). In the detailed description below, the camera module (230) of the electronic device (101) may be generally illustrated as including a configuration that receives light incident through the second side (210B) of the electronic device (101), but the electronic device (101) may further include a camera module (e.g., the camera module (205) of FIG. 2) and / or a sensor module (e.g., the sensor module (204) of FIG. 2) disposed to be exposed to the outside through at least a portion of the display (201).

[0076] In one embodiment, the camera module (230) may include at least one camera module, for example, at least one of the plurality of camera modules illustrated in FIGS. 4 and 5. In one embodiment, the camera module (230) may be disposed on a portion of the support structure (221) adjacent to the printed circuit board (240a, 240b). In one embodiment, the camera module (230) may be at least partially enclosed by the rear case (250) (e.g., the upper rear case (250a)). In one embodiment, the camera module (230) may receive at least a portion of light incident through an optical hole or a cover window (232, 233) disposed on the rear of the electronic device (101) (e.g., the second side (210B) of FIG. 3) within the electronic device (101). According to one embodiment, the camera module (230) may be aligned with one or more of the cover window(s) (232, 233).

[0077] According to one embodiment, a circuit device (e.g., a processor), a communication module (e.g., a communication module (190) of FIG. 1), a power management module (e.g., a power management module (188)), or a memory (e.g., a memory (130) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), or various electric / electronic components implemented in the form of an integrated circuit chip may be disposed on the printed circuit board (240a, 240b). The processor (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. In some embodiments, the printed circuit board (240a, 240b) may be provided with an electromagnetic shielding environment from the rear case (250).

[0078] According to one embodiment, the battery (245) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (245) may be disposed substantially on the same plane as, for example, the printed circuit boards (240a, 240b). The battery (245) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0079] In one embodiment, the rear case (250) may include an upper rear case (250a) and a lower rear case (250b). In one embodiment, the upper rear case (250a) may be arranged to surround a printed circuit board (240a, 240b) (e.g., a first circuit board (240a)) together with a portion of a support structure (221). For example, the upper rear case (250a) may be arranged to face the support structure (221) with the first circuit board (240a) interposed therebetween.

[0080] In one embodiment, the lower rear case (250b) can be utilized as a structure on which various electrical / electronic components, including interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed. In one embodiment, electrical / electronic components, such as interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed on an additional printed circuit board (not shown). In this case, the lower rear case (250b) can be placed to surround the additional printed circuit board (not shown) together with another part of the support structure (221). For example, the interfaces placed on the additional printed circuit board (not shown) or the lower rear case (250b) (not shown) can be placed corresponding to the sound hole (207) or the connector holes (208, 209) of FIG. 2.

[0081] In one embodiment, the antenna (not shown) may include a conductive pattern implemented on the surface of the rear case (250), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the rear plate (290) and the battery (245). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a part or a combination of the support structure (221) and / or the side bezel structure (222).

[0082] FIG. 6 is a cross-sectional perspective view illustrating a speaker assembly according to an embodiment of the present disclosure. FIG. 7A is a side cross-sectional view of an electronic device for illustrating a speaker assembly according to an embodiment of the present disclosure. FIG. 7B is an enlarged view of portion B of FIG. 7A according to an embodiment of the present disclosure. FIG. 8A is a side cross-sectional view illustrating a state before operation of a speaker assembly of an electronic device according to an embodiment of the present disclosure. FIG. 8B is a side cross-sectional view illustrating a state during operation of a speaker assembly of an electronic device according to an embodiment of the present disclosure.

[0083] The configuration of the electronic device (101) of FIGS. 6 and 7A may be the same as or similar to all or part of the configuration of the electronic device (101) of FIGS. 1 to 5. In the present disclosure, the phrase "A and B face each other" may be understood to include not only a structure in which A and B directly face each other or face each other, but also an example in which other components are arranged between A and B.

[0084] Referring to FIGS. 6 and 7A, in one embodiment, the electronic device (101) may include a display (301) (e.g., the display (201) of FIGS. 2 to 5), a front plate (302) (e.g., the front plate (202) of FIGS. 2 to 5), a housing (310) (e.g., the housing (210) of FIGS. 2 to 5), a rear plate (390) (e.g., the rear plate (211) of FIGS. 2 and 3 and the rear plate (290) of FIGS. 4 and 5), and a speaker assembly (305). According to one embodiment, the housing (310) may include a side frame (322) (e.g., the side frame (222) of FIGS. 4 and 5) and a rear injection structure (324) that constitute a portion of the exterior of the electronic device (101).

[0085] According to one embodiment, the electronic device (101) may include a speaker hole (317) formed in the side frame (322). According to one embodiment, the speaker hole (317) may be an external speaker hole (e.g., the external speaker hole (217) of FIGS. 2 and 3) formed through a portion of the side frame (322). The position of the speaker hole (317) in the present disclosure may be changed. In one embodiment, the speaker hole (317) may be formed on the front surface of the electronic device (101) (e.g., the first surface (210A) of FIG. 2), and for example, the speaker hole (317) may be a speaker hole positioned adjacent to an edge of the display (320) (e.g., the call receiver hole (214) of FIG. 2). According to one embodiment, the speaker assembly (305) may be fluidly connected to the speaker hole (317). The speaker assembly (305) may be configured to radiate sound (or vibration) to the outside of the electronic device (101) through the speaker hole (317).

[0086] Referring to FIGS. 6 to 8B, according to one embodiment, the speaker assembly (305) may include a speaker housing (360) and a speaker (370) (e.g., the audio module (170) of FIG. 1) disposed within the speaker housing (360). According to one embodiment, the speaker assembly (305) may include an acoustic space (A1) which is a space in which sound is primarily radiated from the speaker (370) (e.g., the diaphragm (371)). According to one embodiment, the speaker assembly (305) may include a passage (or acoustic conduit) (A2) connecting the acoustic space (or duct) (A1) and the first speaker hole (317). For example, sound output from the speaker (370) may pass through the acoustic space (A1) and the passage (A2) and be radiated to the outside of the electronic device (101) through the first speaker hole (317). In one embodiment, the speaker assembly (305) may omit at least one of the components or may additionally include other components.

[0087] Referring to FIGS. 6 to 8B, according to one embodiment, the speaker housing (360) may include a first support structure (or speaker case) (361), a first speaker cover (or cover plate) (362), a second support structure (363), a second speaker cover (364), and at least one step structure (366). As described below, the step structure (366) according to one embodiment of the present disclosure may improve the high-frequency performance or sound quality of the speaker assembly (305) by adjusting the frequency of sound output from the speaker (370) and reflected on the step structure (366). Referring to FIGS. 6 to 8B, according to one embodiment, the speaker (370) may include a diaphragm (371), a coil (or voice coil) (373), a suspension (372), a plate (374), a frame (375), a magnetic member (376), and / or a yoke (377).

[0088] In one embodiment, the first support structure (361) may include a first portion (361a) and a second portion (361b). In one embodiment, the first portion (361a) of the first support structure (361) may form a side wall structure disposed around the speaker (370). For example, the first portion (361a) may surround at least a portion of the speaker (370). In one embodiment, the first portion (361a) may be formed to surround at least a portion of an acoustic space (A1) between the first speaker cover (362) and the speaker (370) (e.g., the diaphragm (371)). In one embodiment, the first portion (361a) may be formed to provide an open space (or opening) to lead to a passage (A2) at one side of the acoustic space (A1). For example, the open space may be located on one side facing the first speaker hole (317) (e.g., in the -Y direction) of the acoustic space (A1).

[0089] According to one embodiment, the second part (361b) of the first support structure (361) may be formed to extend from a portion of the first part (361a) toward the first speaker hole (317). For example, the second part (361b) may be substantially positioned between the first speaker hole (317) and the first part (361a). According to one embodiment, a passage (A2) connecting an acoustic space (A1) between the first speaker cover (362) and the speaker (370) (e.g., the diaphragm (371)) and the first speaker hole (317) may be formed on the inside of the second part (361b). In the present disclosure, the first part (361a) and the second part (361b) are only distinguished to describe the first support structure (361), but may be formed integrally with each other. For example, the first portion (361a) may be a part of the first support structure (361), and the second portion (361b) may be the remaining portion of the first support structure (361).

[0090] According to one embodiment, the first speaker cover (362) may be spaced apart from the speaker (370) (e.g., the diaphragm (371)). According to one embodiment, at least a portion of the first speaker cover (362) may face the speaker (370) (e.g., the diaphragm (371)). For example, the first speaker cover (362) and the diaphragm (371) of the speaker (370) may be spaced apart from each other by a first distance (d1). For example, the first distance (d1) may mean an average value of the gap between the first speaker cover (362) and the diaphragm (371) when the speaker (370) is not in operation.

[0091] In one embodiment, the second support structure (363) can be connected to a portion of the first support structure (361) (the first portion (361a) and / or the second portion (361b)) and the second speaker cover (364). For example, the second support structure (363) can be disposed around the periphery of the second speaker cover (364). For example, the second support structure (363) can be connected to or integrally formed with at least a portion of an edge of the yoke (377). In one embodiment, the second speaker cover (364) can face the first speaker cover (362) with the speaker (370) therebetween. For example, one surface (e.g., a +Z direction surface) of the second speaker cover (364) can face a portion (e.g., a yoke (377)) of the speaker (370). For example, the speaker housing (360) can be formed of various materials. For example, the first support structure (361) and / or the first speaker cover (362) may include rubber, synthetic resin, and / or metal.

[0092] In one embodiment, the step structure (366) may be disposed adjacent to an edge where a portion of the first part (361a) of the first support structure (361) and the first speaker cover (362) come into contact. According to one embodiment, the step structure (366) may be a structure that reflects a portion of the sound output from the speaker (370) toward the first speaker hole (317). For example, the frequency of the sound reflected from the step structure (366) and the frequency of the sound reflected from the first part (361a) where the step structure (366) is disposed may be different. For example, the frequency band of the sound reflected from the first part (361a) where the step structure (366) is disposed may be higher than the frequency band of the sound reflected from the step structure (366).

[0093] In one embodiment, the step structure (366) may be spaced apart from the speaker (370) (e.g., the diaphragm (371) and the suspension (372)). For example, referring to FIG. 7B, the step structure (366) may be spaced apart from the suspension (372) of the speaker (370) by a second distance (d2). For example, the second distance (d2) may mean an average value of the gap between the first speaker cover (362) and the speaker (370) when the speaker (370) is not in operation. According to one embodiment, the step structure (366) may be spaced apart from the diaphragm (371) and the suspension (372) so as to come into contact with the diaphragm (371) or the suspension (372) when the speaker (370) is in operation.

[0094] According to one embodiment, the step structure (366) may be in a shape that protrudes from the surface of the first support structure (361) by a specified distance (e.g., L3 in FIG. 7B). According to one embodiment, the step structure (366) may overlap at least a portion of the suspension (372) without overlapping the diaphragm (371) when looking down at the first speaker cover (362) from above (or when looking in the +Z direction). According to one embodiment, the step structure (366) may include two faces (e.g., a +Z direction face and a -Y direction face) that form a non-zero angle (e.g., 90 degrees) with respect to each other. In the present disclosure, the shape of the step structure (366) may be changed, and for example, the step structure (366) may include three or more continuous faces, may include an entirely curved surface, or may have an irregular shape.

[0095] In one embodiment, the step structure (366) may be a part of the first support structure (361). For example, the step structure (366) may be formed integrally with the first support structure (361) and may be formed or manufactured, for example, by injection molding. In one embodiment, the material of the step structure (366) may be similar to or substantially identical to the material of the first support structure (361). For example, the step structure (366) may be formed of various materials such as rubber, synthetic resin, or metal.

[0096] According to one embodiment, the speaker assembly (305) may further include a cap member (380) positioned to block an end of the passage (A2) of the second portion (361b) of the first support structure (361). For example, the cap member (380) may be formed to prevent foreign substances, such as moisture, from outside the electronic device (101) from entering the speaker housing (360) through the first speaker hole (317). For example, the cap member (380) may include a porous structure, such as a mesh. For example, the cap member (380) may be configured to connect the second portion (361b) of the first support structure (361) to a portion of the housing (310) (e.g., the rear injection structure (324)). For example, the cap member (380) can provide a waterproof structure at the connection between the second portion (361b) of the first support structure (361) and a portion of the housing (310) (e.g., the rear injection structure (324)).

[0097] Referring to FIGS. 6 to 8B, according to one embodiment, the speaker (370) may include a diaphragm (371), a coil (or voice coil) (373), a suspension (372), a plate (374), a frame (375), a magnetic member (376), and / or a yoke (377).

[0098] According to one embodiment, the diaphragm (371) can move linearly back and forth in a direction (Z-axis direction) toward or away from the yoke (377) or the first speaker cover (362) based on the electromagnetic force formed by the coil (373) and the magnetic member (376) and / or the elastic force of the suspension (372). For example, the diaphragm (371) can be in the shape of a flat plate. In the present disclosure, the shape of the diaphragm (371) can be changed. For example, the diaphragm (371) can be in the shape of at least a partial curve, and can include, for example, a sunken area (e.g., a recess (3711) of FIG. 15A).

[0099] In one embodiment, the coil (373) may be disposed between the diaphragm (371) and the yoke (377). For example, the coil (373) may contact, be adjacent to, and / or be connected to one side (e.g., the +Z direction side) of the diaphragm (371). The coil (373) may be disposed within a magnetic field formed by the magnetic member (376). For example, the coil (373) may receive an electric signal from a processor (e.g., the processor (120) of FIG. 1) to generate an electric field. For example, the coil (373) may be moved relative to the magnetic member (376) by the interaction of the magnetic field and the electric field. For example, the coil (373) may reciprocate linearly in a direction (Z axis direction) toward or away from the yoke (377) or the first speaker cover (362). For example, the coil (373) can cause a vibration plate (371) that is in contact with or connected to the coil (373) to reciprocate linearly while reciprocating linearly.

[0100] In one embodiment, the speaker (370) may further include a suspension (or edge or surrounder) (372). In one embodiment, the suspension (372) may connect the diaphragm (371) to the magnetic member (376) or the frame (375). In one embodiment, the suspension (372) may be disposed around the periphery of the diaphragm (371), for example, so as to surround at least a portion of an edge of the diaphragm (371). For example, the diaphragm (371) may be referred to as a high-frequency dome of the diaphragm, and the suspension (372) may be referred to as a low-frequency dome of the diaphragm. For example, the suspension (372) may be connected to or formed integrally with the diaphragm (371).

[0101] In one embodiment, the elastic force of the suspension (372) can support the diaphragm (371) that moves in a linear reciprocating motion. For example, when the speaker (370) is operated and the diaphragm (371) moves in a linear reciprocating motion, the suspension (372) can provide an elastic force that moves the diaphragm (371) to its initial position before the speaker (370) is operated. In one embodiment, the suspension (372) can move in a linear reciprocating motion together with the diaphragm (371) in a direction (Z-axis direction) toward or away from the yoke (377) or the first speaker cover (362). For example, the distance or range of the linear reciprocating motion of the suspension (372) can be smaller than the distance or range of the linear reciprocating motion of the diaphragm (371). For example, the suspension (372) may include a bent portion (e.g., the bent portion (3712) of FIG. 7B) that is bent or protrudes in a direction opposite to the position of the diaphragm (371) or toward the magnetic member (376) or the yoke (377). For example, the bent portion (3712) may be a structure that reinforces the elasticity of the suspension (372). For example, the suspension (372) may include metal or synthetic resin.

[0102] In one embodiment, the suspension (372) may be directly connected to the diaphragm (371), but the frame (375) may not be directly connected to the magnetic member (376) or the yoke (377). In one embodiment, the frame (375) is coupled to an edge of the suspension (372) and may be mounted to another structure, for example, either the yoke (377) or the magnetic member (376). For example, the frame (375) and / or the suspension (372) may support the diaphragm (371) so as to be able to move linearly and reciprocally.

[0103] In one embodiment, the magnetic member (376) may be a permanent magnet and may be disposed between the diaphragm (371) and the yoke (377). For example, the magnetic member (376) may provide a magnetic force that interacts with the electric force of the coil (373) to cause the coil (373) to move linearly back and forth. In one embodiment, the magnetic member (376) may include a first magnetic member (376a) surrounded by the coil (373) and a second magnetic member (376b) disposed around the outer periphery of the coil (373). For example, the second magnetic member (376b) may be disposed spaced apart from the first magnetic member (376a) and the coil (373) with the first magnetic member (376a) interposed therebetween. The shape, number, and / or arrangement of the magnetic members (376) may be changed according to the specifications required by the speaker assembly (305) to be actually manufactured and / or the electronic device (101) including the same.

[0104] In one embodiment, the plate (374) can be disposed between the diaphragm (371) and the first magnetic member (376a). In one embodiment, the plate (374) can be disposed on one side (e.g., the -Z direction side) of the first magnetic member (376a). In one embodiment, the frame (375) can be disposed between the diaphragm (371) and the second magnetic member (376b). In one embodiment, the frame (375) can be disposed on one side (e.g., the -Z direction side) of the second magnetic member (376b), and a portion of the frame (375) can be connected to the suspension (372). For example, the plate (374) and / or the frame (375) can align the direction or distribution of a magnetic field generated by the magnetic member (376).

[0105] In one embodiment, the yoke (377) can be positioned to face the diaphragm (371) and the suspension (372) with other components of the speaker (370) interposed therebetween (e.g., the coil (373), the plate (374), the frame (375), and / or the magnetic member (376). For example, the yoke (377) can support the linear reciprocating motion of the coil (373), the diaphragm (371), and / or the suspension (372). For example, the yoke (377) can align the direction or distribution of a magnetic field generated by the magnetic member (376). For example, the yoke (377) can act to focus the magnetic field generated by the magnetic member (376) onto the internal components of the speaker (370) (e.g., the coil (373)) in conjunction with the plate (374) and / or the frame (375).

[0106] Figures 8a and 8b are drawings for comparing and explaining the positions of the diaphragm (371) and suspension (372) before and during operation of the speaker assembly (305).

[0107] According to one embodiment, as described above, when the speaker assembly (305) operates, the diaphragm (371) can linearly reciprocate in a direction (Z-axis direction) toward or away from the yoke (377) or the first speaker cover (362) based on the electromagnetic force formed by the coil (373) and the magnetic member (376) and / or the elastic force of the suspension (372). According to one embodiment, the suspension (372) can linearly reciprocate in a direction (Z-axis direction) toward or away from the yoke (377) or the first speaker cover (362) together with the diaphragm (371). For example, the distance or range of the linear reciprocating movement of the suspension (372) may be smaller than the linear reciprocating movement distance or range of the linear reciprocating movement of the diaphragm (371).

[0108] Referring to FIG. 8A, before the speaker assembly (305) operates, the distance between the first speaker cover (362) and the diaphragm (371) may be a first distance (d1) (e.g., the first distance (d1) of FIGS. 6 to 7B), and the distance between the step structure (366) and the suspension (372) may be a second distance (d2) (e.g., the second distance (d2) of FIGS. 6 to 7B). For example, the first distance (d1) may be in a range of about 0.45 mm to about 0.65 mm, or in a range of about 0.5 mm to about 0.6 mm, and may be about 0.55 mm as an example.

[0109] FIG. 8B may represent, for example, a state in which the diaphragm (371) and the suspension (372) are arranged closest to the first speaker cover (362) or the step structure (366) when the speaker assembly (305) operates. Referring to FIG. 8B, the first-second distance (d12) may be the minimum value of the gap between the first speaker cover (362) and the diaphragm (371) when the speaker assembly (305) operates. According to one embodiment, the step structure (366) may be spaced apart from the diaphragm (371) and the suspension (372) so as to come into contact with the diaphragm (371) or the suspension (372) when the speaker (370) operates. For example, the second-second distance (d22) may be the minimum value of the gap between the step structure (366) and the suspension (372) when the speaker assembly (305) operates. In one embodiment, the second-second distance (d22) may be smaller than the first-second distance (d12). For example, the ratio of the first-second distance (d12) to the second-second distance (d22) may be about 3:2. For example, the first-second distance (d12) may fall within a range of about 0.05 mm to about 0.25 mm, or within a range of about 0.1 mm to about 0.2 mm, and may be about 0.15 mm as an example. For example, the second-second distance (d22) may fall within a range of about 0.01 mm to about 0.2 mm, or within a range of about 0.5 mm to about 0.15 mm, and may be about 0.1 mm as an example. The state of the speaker assembly (305) illustrated in FIG. 8b is exemplary, and the relative positions of the diaphragm (371) and suspension (372) with respect to the yoke (377) or speaker housing (360) may be changed.

[0110] FIG. 9 is a cross-sectional perspective view of a speaker assembly according to one embodiment of the present disclosure. FIG. 10 is a cross-sectional perspective view of a speaker assembly according to one embodiment of the present disclosure.

[0111] The speaker assembly (305) of FIGS. 9 and 10 may be referred to as the speaker assembly (305) of FIGS. 6, 7a, 8a, and 8b.

[0112] Referring to FIG. 9, in one embodiment, the first speaker cover (362) may include a first recess (3621) that is sunken toward the speaker (370) (e.g., the speaker (370) of FIGS. 6 and 7A) in a portion thereof. For example, the edge of the first recess (3621) may have a closed curve shape. For example, another configuration of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 7A) may be disposed on an outer surface of the first recess (3621). For example, an electrical / electronic component or a conductive component may be disposed on the outer surface of the first recess (3621) by interposing an intermediate member having elasticity and / or adhesiveness.

[0113] Referring to FIG. 9, in one embodiment, the gap between the first speaker cover (362) and the speaker (370) may include a first distance (d1) (e.g., the first distance (d1) in FIGS. 6, 7A, and 10) which is a gap between an area around the first recess (3621) of the first speaker cover (362) and a diaphragm (e.g., the diaphragm (371) in FIGS. 6 to 11 and 10) of the speaker (370) and a first-1 distance (d12) which is a gap between the first recess (3621) and the diaphragm (371).

[0114] Referring to FIG. 10, the first speaker cover (362) may not include a sunken area such as the first recess (3621) of FIG. 9. Referring to FIG. 10, the diaphragm (371) may include a second recess (3711) (e.g., 3711 of FIG. 15A) in which a portion of the central portion is sunken toward the yoke (377). According to the embodiment of FIG. 10, the first distance (d1) (e.g., the first distance (d1) of FIGS. 6, 7A, and 10) between the first speaker cover (362) and the diaphragm (371) may be the distance between the first speaker cover (362) and an area around the second recess (3711) of the diaphragm (371).

[0115] FIG. 11 is a schematic plan view illustrating a portion of a speaker assembly of an electronic device according to an embodiment of the present disclosure. FIG. 12 is a schematic cross-sectional side view of the speaker assembly of FIG. 11 according to an embodiment of the present disclosure. FIG. 13 is a schematic plan view illustrating a portion of a speaker assembly of an electronic device according to an embodiment of the present disclosure. FIG. 14 is a graph illustrating a change in sound pressure according to frequency due to a step structure of a speaker assembly according to an embodiment of the present disclosure.

[0116] The first speaker hole (317), the side frame (322), the first support structure (361), the first speaker cover (362), the step structure (366), the diaphragm (371), the suspension (372), the acoustic space (A1) and the passage (A2) illustrated in FIGS. 11, 12 and / or 13 may be referred to as the first speaker hole (317), the side frame (322), the first support structure (361), the first speaker cover (362), the step structure (366), the diaphragm (371), the suspension (372), the acoustic space (A1) and the passage (A2) of the embodiments of FIGS. 6 to 7b.

[0117] Referring to FIGS. 11 to 13, according to one embodiment, the step structure (366) may be in a form that protrudes from the surface of the first support structure (361) by a specified distance (L3) (e.g., L3 in FIG. 7b). According to one embodiment, when looking down at the first speaker cover (362) from above (or when looking in the +Z direction), the step structure (366) may not overlap with the diaphragm (371), but may overlap with at least a portion of the suspension (372).

[0118] Referring to FIGS. 11 to 13, in one embodiment, the step structure (366) can at least partially face an open area formed on one side of an acoustic space (A1) connected to a passage (A2). In one embodiment, the first portion (361a) of the first support structure (361) (e.g., the first portion (361a) of FIGS. 6 to 7B) can include a first sidewall (3611) that at least partially faces an open area formed on one side of an acoustic space (A1) connected to a passage (A2). According to one embodiment, the first support structure (361) can include a second sidewall (3612) extending from one end of the first sidewall (3611) and a third sidewall (3613) extending from the other end of the first sidewall (3611) and at least partially facing the second sidewall (3612). According to one embodiment, at least a portion of the single-pronged structure (366) may be positioned adjacent to an edge where the first side wall (3611) and the first speaker cover (362) meet.

[0119] Referring to FIG. 13, according to one embodiment, the step structure (366) may extend from a portion disposed on the first side wall (3611) to the second side wall (3612) and / or the third side wall (3613). Referring to FIG. 12, according to one embodiment, the step structure (366) may include a portion extending from a portion disposed on the first side wall (3611) to the second side wall (3612) and the third side wall (3613). According to one embodiment, the step structure (366) disposed on the second side wall (3612) may be in a form that protrudes from the second side wall (3612) toward the third side wall (3613) by a specified distance (L3). According to one embodiment, the step structure (366) disposed on the third side wall (3613) may be in a form that protrudes a designated distance (L3) from the third side wall (3613) toward the second side wall (3612). According to one embodiment, the step structure (366) disposed on the second side wall (3612) and / or the third side wall (3613) may overlap at least a portion of the suspension (372) without overlapping the diaphragm (371) when looking down at the first speaker cover (362) from above (or when looking in the +Z direction). The shape or arrangement of the step structure (366) illustrated in FIG. 13 may be changed. For example, the step structure (366) may include a portion that extends from a portion disposed on the first side wall (3611) to either the second side wall (3612) or the third side wall (3613). For example, the protrusion length of the step structure (366) may be at least partially shorter or longer than the specified length (L3).

[0120] Referring to FIG. 12, in one embodiment, sound (or sound wave or vibration) output from the speaker (370) may travel along a first path (S1) toward the first speaker hole (317), or may travel along a second path (S2) toward the first speaker hole (317) by being reflected on the surface of a side wall (e.g., the first side wall (3611)) of the first support structure (361). Here, the sound traveling along the first path (S1) and the sound traveling along the second path (S2) may destructively interfere with each other or constructively interfere with each other. When the sounds traveling along the first path (S1) and the second path (S2) destructively interfere with each other, a dip (e.g., the dip in FIG. 14) may occur in a specific frequency band. According to one embodiment of the present disclosure, the step structure (366) can adjust the frequency of sound that is reflected by the step structure (366) and travels along a second path (S2) toward the first speaker hole (317) and the frequency at which destructive interference occurs. According to one embodiment, the step structure (366) can shift a specific frequency band where a dip occurs to a higher frequency range compared to a specific frequency band where a dip occurs when the step structure (366) is not provided. By shifting the specific frequency band where a dip occurs to a higher frequency range, the high-frequency performance of the speaker assembly (305) can be improved.

[0121] Referring to FIGS. 11 to 13, the first length (L1) is a distance from the first side wall (3611) to the boundary between the acoustic space (A1) and the passage (A2), the second length (L2) is a distance from the first side wall (3611) to the center of the diaphragm (371), and the designated distance (L3) may be a distance from the end of the step structure (366) to the first side wall (3611) or a distance by which the step structure (366) protrudes from the first side wall (3611). Here, the first length (L1), the second length (L2), and the designated distance (L3) may be straight-line distances measured based on the Y-axis.

[0122] In Fig. 14, the horizontal axis (X-axis) may represent the frequency value (Hz) of the sound output from the speaker assembly (305), and the vertical axis (Y-axis) may represent the magnitude (dB) of the response at the frequency value. Graph A in Fig. 14 may represent the response characteristic for frequency of the speaker assembly (305) before adding the single-step structure (366) according to one embodiment of the present disclosure. Graph P in Fig. 14 may represent the response characteristic for frequency of the speaker assembly (305) to which the single-step structure (366) according to one embodiment of the present disclosure is added.

[0123] Referring to FIG. 14, a first resonant frequency at which a first peak occurs due to resonance of sound (or sound wave or vibration) in graph A and graph P and a second resonant frequency at which a second peak occurs are indicated. The following [Mathematical Expression 1] can represent the relationship between the wavelength of the resonant frequency and the length (L1) (the first length (L1) in FIGS. 11 to 13) from the first side wall (3611) to the boundary between the acoustic space (A1) and the passage (A2). For example, in [Mathematical Expression 1], 'λ peak ' can represent the wavelength of the first resonant frequency when n=1, and the wavelength of the second resonant frequency when n=2.

[0124] [Mathematical Formula 1]

[0125]

[0126] (Here, λ represents wavelength, f represents frequency, and c represents the speed of sound in the medium.)

[0127] The above [Mathematical Formula 1] is merely an example to aid understanding and is not limited thereto, and can be modified, applied, or expanded in various ways.

[0128] Referring again to FIG. 11, according to one embodiment, the fourth length (L1') may be the distance from the center of the suspension (372) to the boundary between the acoustic space (A1) and the passage (A2). The fourth length (L1') may be a value obtained by reducing the first length (L1), which is the distance from the first side wall (3611) to the boundary between the acoustic space (A1) and the passage (A2), by a designated distance (L3), which is the distance to the first side wall (3611), by adding a step structure (366) to the first support structure (361). According to one embodiment, the fifth length (L2') may be the distance from the center of the suspension (372) to the center of the diaphragm (371). The fifth length (L2') may be a value obtained by reducing the second length (L2), which is the distance from the first side wall (3611) to the center of the vibration plate (371), by a designated distance (L3), which is the distance to the first side wall (3611), by adding a step structure (366) to the first support structure (361). Here, the fourth length (L1') and the fifth length (L2') may be straight-line distances measured based on the Y-axis.

[0129] Referring to FIGS. 12 and 14 , a dip may occur in a specific frequency band due to destructive interference of sound (or vibration or sound) traveling along the first path (S1) of FIG. 12 and the second path (S2) of FIG. 12 . Referring to FIG. 14 , according to one embodiment, by adding a step structure (366) to the first support structure (361), the frequency at which the dip occurs may be shifted to a higher frequency range. Referring to FIG. 11, according to one embodiment, by adding a step structure (366) to the first support structure (361), a first length (L1), which is a distance from the first side wall (3611) to the boundary between the acoustic space (A1) and the passage (A2), may be reduced to a fourth length (L1'), and a second length (L2), which is a distance from the first side wall (3611) to the center of the diaphragm (371), may be reduced to a fifth length (L2'). The fifth length (L2') of FIG. 11 may be a value that affects a specific frequency band in which a dip occurs. According to one embodiment, the step structure (366) may change the frequency of a sound that is reflected and propagates from the step structure (366) (e.g., a sound that propagates along the second path (S2) of FIG. 12) and thus a specific frequency band in which a dip occurs, by reducing the second length (L2) by a designated distance (L3). [Mathematical expression 2] below can represent the relationship between the wavelength at which a dip occurs and the fifth length (L2'). From [Mathematical expression 2], when the fifth length (L2') is reduced due to the addition of the step structure (366), the frequency (f) at which a dip occurs dip ) can be seen to increase, i.e. move to the high band.

[0130] [Equation 2]

[0131]

[0132] (Here, λ represents wavelength, f represents frequency, and c represents the speed of sound in the medium.)

[0133] The above [Mathematical Formula 2] is merely an example to aid understanding and is not limited thereto, and can be modified, applied, or expanded in various ways.

[0134] Referring to the above-described [Mathematical Formula 2] and the graph of FIG. 14, it can be confirmed that a specific frequency band in which a dip occurs in the speaker assembly (305) to which the step structure (366) is added moves to a higher frequency range compared to graph A before adding the step structure (366) according to one embodiment of the present disclosure. Accordingly, the high-frequency performance or sound quality of the speaker assembly (305) can be improved.

[0135] FIG. 15A is a cross-sectional side view of an electronic device for illustrating a speaker assembly according to one embodiment of the present disclosure. FIG. 15B is an enlarged view of portion C of FIG. 15A according to one embodiment of the present disclosure.

[0136] The speaker assembly (305) of FIGS. 15A and 15B may be referred to as the speaker assembly (305) of FIGS. 6, 7A, 8A to 10. The description given above with reference to FIGS. 11 to 14 may be substantially equally applied to the embodiment of FIGS. 15A and 15B. Hereinafter, the step structure (366) of the embodiment of FIGS. 15A and 15B may be described focusing on the different features from the step structure (366) of the embodiment of FIGS. 6 to 10, and any content overlapping with the description given above with reference to FIGS. 6 to 10 may be omitted.

[0137] Referring to FIGS. 15A and 15B , in one embodiment, the step structure (366) may include a different material from the first support structure (361). For example, the first support structure (361) may include various materials such as synthetic resin or rubber. For example, the step structure (366) may include various materials such as metal (e.g., stainless steel), synthetic resin, or rubber. In one embodiment, the step structure (366) may be manufactured separately from the first support structure (361) and connected to the first support structure (361). In one embodiment, the step structure (366) may be formed integrally with the first support structure (361). For example, the first support structure (361) may be formed integrally with the step structure (366) through various processes such as double injection molding or a cutting process.

[0138] Referring to FIG. 15B, according to one embodiment, the step structure (366) may be connected to the first support structure (361) and / or the first speaker cover (362). For example, the step structure (366) may be arranged at a distance (t1) from the first support structure (361). For example, the distance (t1) between the step structure (366) and the first support structure (361) may be a distance required in the manufacturing process and may be omitted as needed. According to one embodiment, the step structure (366) may be arranged to contact the first support structure (361) without a distance (t1), in which case the step structure (366) may be in a form that protrudes from a portion of the first support structure (361) by a specified distance (L3).

[0139] Typically, a speaker device may have a forward wave, which is output from the diaphragm and travels directly toward the speaker hole, and a reflected wave, which is output from the diaphragm and reflects off the side wall opposite the speaker hole and travels toward the speaker hole. The forward wave and the reflected wave may interfere with each other, resulting in a dip in a specific frequency band. This dip can degrade the high-frequency performance of the speaker device.

[0140] Aspects of the present disclosure are intended to solve at least the problems and / or disadvantages described above and to provide at least the advantages described below.

[0141] According to one embodiment of the present disclosure, by adding a step structure to a side wall disposed opposite a speaker hole in a speaker assembly, the frequency of a reflected wave reflected from the side wall is changed, thereby moving the frequency band where a dip occurs to a high band, thereby improving the high-frequency performance of the speaker assembly.

[0142] However, the challenges addressed by this disclosure are not limited to the aforementioned challenges, and may be determined in various ways without departing from the spirit and scope of this disclosure. The benefits achieved by this disclosure are not limited to the aforementioned benefits, and various benefits may be provided, directly or indirectly, through this document.

[0143] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (210) including a first speaker hole (217; 317), a speaker assembly (305) disposed within the housing and configured to radiate sound to the outside of the electronic device through the first speaker hole. The speaker assembly may include a speaker (370) including a diaphragm (371), a first speaker cover (362) facing the diaphragm and spaced apart from the diaphragm, an acoustic space (A1) formed between the diaphragm and the first speaker cover, a first support structure (361) including a first portion (361a) formed to surround a portion of the acoustic space, and a step structure (366) disposed adjacent to an area where a portion of the first portion of the first support structure and the first speaker cover come into contact and spaced apart from the speaker.

[0144] According to one embodiment, the step structure may be arranged so as not to overlap the diaphragm when viewed from above the speaker cover.

[0145] According to one embodiment, the first support structure may further include a second portion (361b) extending from the first portion and including a passage (A2) connecting the acoustic space and the first speaker hole. The first portion of the first support structure may include a first side wall (3611) at least partially facing the passage. At least a portion of the step structure may be disposed adjacent to an area where the first side wall and the first speaker cover contact each other.

[0146] According to one embodiment, the step structure may be formed to protrude a specified distance (L3) from a portion of the first side wall toward the passage.

[0147] According to one embodiment, the distance between the first side wall and the vibration plate may be greater than the specified distance (L3).

[0148] According to one embodiment, the first support structure may include a second side wall (3612) extending from one end of the first side wall, and a third side wall (3613) extending from the other end of the first side wall and facing the second side wall.

[0149] According to one embodiment, the step structure may include a portion disposed on at least one of the second side wall or the third side wall.

[0150] In one embodiment, the speaker may include a suspension (372) surrounding at least a portion of an edge of the diaphragm.

[0151] According to one embodiment, the step structure may be arranged so that, when viewed from above the speaker cover, at least a portion of the step structure overlaps the suspension and does not overlap the diaphragm.

[0152] In one embodiment, the speaker may be configured to, when in operation, cause the diaphragm to move linearly back and forth toward or away from the first speaker cover.

[0153] In one embodiment, the suspension may be configured to perform the linear reciprocating motion together with the diaphragm. The range of the linear reciprocating motion of the suspension may be smaller than the range of the linear reciprocating motion of the diaphragm.

[0154] In one embodiment, the distance between the position of the suspension when the speaker is not in operation and the position to which the suspension has moved closer to the first speaker cover when the speaker is in operation may be less than the distance (d2) between the step structure and the speaker.

[0155] According to one embodiment, the minimum value of the distance (d1) between the first speaker cover and the diaphragm may be greater than the minimum value of the distance (d2) between the step structure and the speaker.

[0156] According to one embodiment, the step structure may be formed integrally with the first support structure.

[0157] According to one embodiment, the first support structure and the step structure may comprise different materials.

[0158] According to one embodiment of the present disclosure, a speaker assembly (305) may be provided. The speaker assembly may include a speaker (370) including a diaphragm (371), a first speaker cover (362) facing the diaphragm and spaced apart from the diaphragm, an acoustic space (A1) formed between the diaphragm and the first speaker cover, a first support structure (361) including a first portion (361a) formed to surround a portion of the acoustic space, and a second portion (361b) extending from the first portion and including a passage (A2) connecting the acoustic space and the first speaker hole, and a step structure (366) disposed adjacent to an area where a portion of the first portion of the first support structure and the first speaker cover come into contact and spaced apart from the speaker.

[0159] In one embodiment, the first portion of the first support structure may include a first side wall (3611) that at least partially faces the passageway. At least a portion of the step structure may be disposed adjacent to an area where the first side wall and the first speaker cover contact each other.

[0160] According to one embodiment, the step structure is formed to protrude from a portion of the first side wall toward the passage by a specified distance (L3), and the distance between the first side wall and the vibration plate may be greater than the specified distance (L3).

[0161] In one embodiment, the first support structure may include a second side wall (3612) extending from one end of the first side wall, and a third side wall (3613) extending from the other end of the first side wall and facing the second side wall. The step structure may include a portion disposed on at least one of the second side wall or the third side wall.

[0162] According to one embodiment, the speaker may include a suspension (372) surrounding at least a portion of an edge of the diaphragm. The step structure may be arranged so as to overlap at least a portion of the suspension and not overlap the diaphragm when viewed from above the speaker cover.

[0163] According to one embodiment, the step structure may be arranged so as not to overlap the diaphragm when viewed from above the speaker cover.

[0164] In one embodiment, the first portion of the first support structure may include a first side wall (3611) that at least partially faces the passageway. At least a portion of the step structure may be disposed adjacent to an area where the first side wall and the first speaker cover contact each other.

[0165] According to one embodiment, the step structure may be formed to protrude a specified distance (L3) from a portion of the first side wall toward the passage.

[0166] According to one embodiment, the distance between the first side wall and the vibration plate may be greater than the specified distance (L3).

[0167] According to one embodiment, the first support structure may include a second side wall (3612) extending from one end of the first side wall, and a third side wall (3613) extending from the other end of the first side wall and facing the second side wall.

[0168] According to one embodiment, the step structure may include a portion disposed on at least one of the second side wall or the third side wall.

[0169] In one embodiment, the speaker may include a suspension (372) surrounding at least a portion of an edge of the diaphragm.

[0170] According to one embodiment, the step structure may be arranged so that, when viewed from above the speaker cover, at least a portion of the step structure overlaps the suspension and does not overlap the diaphragm.

[0171] In one embodiment, the speaker may be configured to, when in operation, cause the diaphragm to move linearly back and forth toward or away from the first speaker cover.

[0172] In one embodiment, the suspension may be configured to perform the linear reciprocating motion together with the diaphragm. The range of the linear reciprocating motion of the suspension may be smaller than the range of the linear reciprocating motion of the diaphragm.

[0173] In one embodiment, the distance between the position of the suspension when the speaker is not in operation and the position to which the suspension has moved closer to the first speaker cover when the speaker is in operation may be less than the distance (d2) between the step structure and the speaker.

[0174] According to one embodiment, the minimum value of the distance (d1) between the first speaker cover and the diaphragm may be greater than the minimum value of the distance (d2) between the step structure and the speaker.

[0175] According to one embodiment, the step structure may be formed integrally with the first support structure.

[0176] According to one embodiment, the first support structure and the step structure may comprise different materials.

[0177] According to one embodiment of the present disclosure, a speaker assembly (305) may be provided. The speaker assembly may include a speaker (370) including a diaphragm (371), a first speaker cover (362) facing the diaphragm and spaced apart from the diaphragm, an acoustic space (A1) formed between the diaphragm and the first speaker cover, a first support structure (361) including a first portion (361a) formed to surround a portion of the acoustic space, and a step structure (366) disposed adjacent to an area where a portion of the first portion of the first support structure and the first speaker cover come into contact and spaced apart from the speaker.

[0178] According to one embodiment, the first support structure may further include a second portion (361b) extending from the first portion and including a passage (A2) connecting the acoustic space and the first speaker hole. The first portion of the first support structure may include a first side wall (3611) at least partially facing the passage. At least a portion of the step structure may be disposed adjacent to an area where the first side wall and the first speaker cover come into contact.

[0179] According to one embodiment, the step structure is formed to protrude from a portion of the first side wall toward the passage by a specified distance (L3), and the distance between the first side wall and the vibration plate may be greater than the specified distance (L3).

[0180] In one embodiment, the first support structure may include a second side wall (3612) extending from one end of the first side wall, and a third side wall (3613) extending from the other end of the first side wall and facing the second side wall. The step structure may include a portion disposed on at least one of the second side wall or the third side wall.

[0181] According to one embodiment, the speaker may include a suspension (272) surrounding at least a portion of an edge of the diaphragm. The step structure may be arranged so as to overlap at least a portion of the suspension and not overlap the diaphragm when viewed from above the speaker cover.

[0182] According to one embodiment, the step structure may include at least one of stainless steel, synthetic resin, and rubber.

[0183] According to an embodiment, the step structure may be manufactured separately from the first support structure and connected to the first support structure.

[0184] According to one embodiment, the first support structure can be formed integrally with the step structure through double injection or cutting.

[0185] The speaker assembly of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0186] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0187] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0188] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0189] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0190] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0191] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0192] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (210) including a first speaker hole (217; 317); A speaker assembly (305) is disposed within the housing and configured to radiate sound to the outside of the electronic device through the first speaker hole, The above speaker assembly, A speaker (370) including a diaphragm (371); A first speaker cover (362) facing the diaphragm and spaced apart from the diaphragm; An acoustic space (A1) formed between the above diaphragm and the first speaker cover; A first support structure (361) including a first portion (361a) formed to surround a portion of the above acoustic space; and An electronic device comprising a step structure (366) disposed adjacent to a portion of the first part of the first support structure and an area where the first speaker cover comes into contact and spaced apart from the speaker.

2. In paragraph 1, An electronic device in which the above-mentioned step structure is positioned so as not to overlap the above-mentioned vibration plate when viewed from above the above-mentioned speaker cover.

3. In paragraph 1 or 2, The above first support structure further includes a second portion (361b) extending from the first portion and including a passage (A2) connecting the acoustic space and the first speaker hole, The first portion of the first support structure comprises a first side wall (3611) at least partially facing the passageway, An electronic device, wherein at least a portion of the step structure is disposed adjacent to an area where the first side wall and the first speaker cover come into contact.

4. In paragraph 3, An electronic device in which the above-mentioned step structure is formed by protruding a specified distance (L3) from a part of the first side wall toward the passage.

5. In paragraph 4, An electronic device wherein the distance between the first side wall and the vibration plate is greater than the specified distance (L3).

6. In any one of paragraphs 3 to 5, An electronic device, wherein the first support structure comprises a second side wall (3612) extending from one end of the first side wall, and a third side wall (3613) extending from the other end of the first side wall and facing the second side wall.

7. In paragraph 6, An electronic device, wherein the step structure includes a portion disposed on at least one of the second side wall or the third side wall.

8. In any one of paragraphs 1 to 7, The above speaker, An electronic device comprising a suspension (372) surrounding at least a portion of an edge of the diaphragm.

9. In paragraph 8, An electronic device in which the above-mentioned step structure is arranged so as to overlap at least a portion of the suspension and not overlap the diaphragm when viewed from above the speaker cover.

10. In clause 8 or 9, The above speaker is an electronic device configured to, when operating, cause the diaphragm to move linearly back and forth toward or away from the first speaker cover.

11. In clause 10, The above suspension is configured to perform linear reciprocating motion together with the above vibrating plate, An electronic device wherein the range of the linear reciprocating motion of the suspension is smaller than the range of the linear reciprocating motion of the vibration plate.

12. In paragraph 11, An electronic device wherein the distance between the position of the above suspension when the speaker is not in operation and the position to which the speaker has moved closer to the first speaker cover when the speaker is in operation is smaller than the distance (d2) between the step structure and the speaker.

13. In any one of paragraphs 1 to 12, An electronic device, wherein the minimum value of the distance (d1) between the first speaker cover and the diaphragm is greater than the minimum value of the distance (d2) between the step structure and the speaker.

14. In any one of paragraphs 1 to 13, An electronic device wherein the step structure is formed integrally with the first support structure and includes different materials.

15. In the speaker assembly (305), A speaker (370) including a diaphragm (371); A first speaker cover (362) facing the diaphragm and spaced apart from the diaphragm; An acoustic space (A1) formed between the above diaphragm and the first speaker cover; A first support structure (361) including a first portion (361a) formed to surround a portion of the above acoustic space; and A speaker assembly comprising a step structure (366) disposed adjacent to a portion of the first part of the first support structure and an area where the first speaker cover comes into contact and spaced apart from the speaker.

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