Inspection method and device for gold finger design process in printed circuit board design

Abstract

Disclosed in the present invention is an inspection method for a gold finger design process in printed circuit board design. The inspection method comprises: reading CAD data; inspecting target design data comprised in the CAD data to discover a gold finger design defect, and reporting related defect information when a gold finger design defect is detected, wherein the target design data is design data related to the reliability of a gold finger. The present invention can avoid wrong design of gold fingers, improving the reliability of printed circuit boards.

Description

Inspection method and device for gold finger design process in printed circuit board design Technical Field

[0001] The invention belongs to the field of printed circuit board manufacturing, and in particular relates to a method and a device for inspecting a gold finger design process in printed circuit board design. Background Art

[0002] Goldfinger connectors are widely used in plug-in devices such as memory sticks, graphics cards, and storage devices. These devices are frequently plugged and unplugged during use, leading to very high industry requirements for their reliability. Therefore, effectively preventing goldfinger design errors and improving printed circuit board reliability is a pressing technical challenge facing the industry.

[0003] Summary of the Invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a method and device for inspecting the gold finger design process in printed circuit board design.

[0005] The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0006] In a first aspect, the present invention provides a method for inspecting a gold finger design process in a printed circuit board design, comprising:

[0007] Data reading: read CAD data;

[0008] Defect inspection: inspecting the target design data contained in the CAD data to find gold finger design defects, and reporting relevant defect information when gold finger design defects are detected; wherein, the target design data is design data related to gold finger reliability.

[0009] In a second aspect, the present invention provides an inspection device for a gold finger design process in a printed circuit board design, comprising:

[0010] Data reading module, used to read CAD data;

[0011] The defect inspection module is used to inspect the target design data contained in the CAD data to find gold finger design defects and report relevant defect information when gold finger design defects are detected; wherein the target design data is design data related to gold finger reliability.

[0012] In a third aspect, the present invention provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the method steps described in the above-mentioned method for inspecting the gold finger design process in printed circuit board design.

[0013] In a fourth aspect, the present invention provides an electronic device comprising: a processor, a communication interface, a memory, and a communication bus; wherein the processor, the communication interface, and the memory communicate with each other via the communication bus;

[0014] The memory is used to store computer programs;

[0015] The processor is used to implement the method steps described in the above-mentioned method for inspecting the gold finger design process in printed circuit board design when executing the computer program stored in the memory.

[0016] The present invention provides a method for inspecting the gold finger design process in printed circuit board design. By reading CAD data and inspecting the design data related to the gold finger reliability contained therein, gold finger design defects can be discovered in advance, and relevant defect information can be reported when gold finger design defects are detected. Therefore, the method of the present invention can effectively avoid gold finger design errors, thereby improving the reliability of the printed circuit board.

[0017] The present invention will be further described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG1 is a flow chart of a method for inspecting a gold finger design process in a printed circuit board design, provided by an embodiment of the present invention;

[0019] FIG2 is a flow chart of a lead inspection sub-step in the method shown in FIG1 ;

[0020] FIG3 is a flow chart of another lead inspection sub-step in the method shown in FIG1 ;

[0021] FIG4 is a flow chart of a through-hole inspection sub-step in the method shown in FIG1 ;

[0022] FIG5 is a flow chart of another through-hole inspection sub-step in the method shown in FIG1 ;

[0023] FIG6 is a flow chart of another through-hole inspection sub-step in the method shown in FIG1 ;

[0024] FIG7 is a flow chart of a solder mask window inspection sub-step in the method shown in FIG1 ;

[0025] FIG8( a ) is a schematic diagram of an inspection process in another solder mask window inspection sub-step in the method shown in FIG1 ;

[0026] FIG8( b ) is a schematic diagram of the inspection process in FIG8( a );

[0027] 9 is a schematic diagram of determining whether a lead intersects an edge of a gold finger pin pad according to an embodiment of the present invention;

[0028] FIG10 shows a schematic diagram of some unreasonable leads from the gold finger pin pads;

[0029] 11 is a schematic diagram of checking whether the lead is unilaterally led out from the gold finger pin pad according to an embodiment of the present invention;

[0030] FIG12 is a schematic diagram of performing a Dis1 inspection in an embodiment of the present invention;

[0031] 13 is a schematic diagram of checking whether a through-hole pad intersects with a gold finger pin pad according to an embodiment of the present invention;

[0032] 14 is a schematic diagram of calculating the area between gold finger pin pads according to an embodiment of the present invention;

[0033] FIG15 is a schematic diagram of calculating the area between the gold finger pin pads for a tilted gold finger according to an embodiment of the present invention;

[0034] FIG16 is a schematic diagram of calculating the center-to-center distance between multiple through holes between gold finger pin pads according to an embodiment of the present invention;

[0035] FIG17 is a schematic diagram of performing a Dis4 inspection in an embodiment of the present invention;

[0036] FIG18 is another schematic diagram of performing a Dis4 inspection according to an embodiment of the present invention;

[0037] FIG19 is a schematic diagram of performing a Dis3 inspection in an embodiment of the present invention;

[0038] 20 to 26 are exemplary diagrams of a gold finger design process inspection process using a method provided by an embodiment of the present invention;

[0039] FIG27 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The present invention will be further described in detail below with reference to specific examples, but the embodiments of the present invention are not limited thereto.

[0041] In order to avoid incorrect gold finger design and thus improve the reliability of the printed circuit board, an embodiment of the present invention provides a method for inspecting the gold finger design process in printed circuit board design. As shown in FIG1 , the method includes the following steps:

[0042] Data reading: read CAD data;

[0043] Here, CAD data includes PCB design files with suffixes such as .pcb, .brd or .cad generated by PCB design software.

[0044] Defect inspection: The target design data contained in the CAD data is inspected to find gold finger design defects, and relevant defect information is reported when gold finger design defects are detected; wherein, the target design data is design data related to gold finger reliability.

[0045] Specifically, the target design data includes goldfinger data, lead data, device pad data, through-hole data, and PCB outline coordinates. Goldfinger data includes the outline vertex coordinates of the goldfinger pin pad, the goldfinger position number, the goldfinger angle, the outline vertex coordinates of the goldfinger solder mask opening, and the dimensions of the goldfinger solder mask opening. Lead data includes the endpoint coordinates, width, and length of the lead. Device pad data includes the coordinates and dimensions of the device pad. Through-hole data includes the center coordinates and diameter of the through-hole.

[0046] Among them, by checking the device type or device package in the CAD data, the devices and gold fingers contained in the PCB can be determined, so that the gold fingers and devices can be identified from the CAD data according to the device type or device package, and then the corresponding gold finger data and device pad data can be obtained from the CAD data.

[0047] For example, assuming that the suffix of the CAD data is .cad, by checking the device type or package type of the CAD data, if it is found that the device type or package type is GoldFinger, it can be determined that the device is a gold finger, and then the gold finger can be located from the CAD data according to the bit number of the device.

[0048] Lead data, through-hole data, and the coordinates of the PCB frame can be directly obtained from the CAD data. Specifically, the PCB layer data is obtained from the CAD data, and then the length, line width, and endpoint coordinates of the leads on each PCB layer are obtained, as well as the center coordinates and diameter of the through-holes on each PCB layer. The outline vertex coordinates and dimensions of the gold finger solder mask openings are obtained, as well as the coordinates of the PCB frame.

[0049] In one embodiment, the defect inspection step may include a lead inspection sub-step, where the lead is a round lead in the PCB.

[0050] Specifically, as shown in FIG2 , the lead inspection sub-step includes:

[0051] Step a1: Check whether there is a lead extending from the gold finger pin pad according to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad.

[0052] If not, the current check item passes; if so, go to step a2.

[0053] Among them, according to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad, check whether there is a lead extending from the gold finger pin pad, including:

[0054] (1) According to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad, the lead connected to the gold finger pin pad is determined using a collision detection algorithm;

[0055] (2) For the connected gold finger pin pad and lead, according to the outline vertex coordinates of the gold finger pin pad and the endpoint coordinates of the lead, determine whether each edge of the gold finger pin pad intersects with the lead; when the lead intersects with any edge of the gold finger pin pad, determine that the lead is led out from this edge.

[0056] In step (2), for each edge of the gold finger pin pad, the method of determining whether the edge intersects with the lead includes: determining and Is it true? If so, it is determined to be intersecting, otherwise it is determined to be non-intersecting;

[0057] in, is the vector representing the leader line, A and B are the coordinates of the two endpoints of the leader line; It is the vector representing the edge of the current gold finger pin pad, and C and D are the coordinates of the two endpoints of the edge; is the vector from endpoint A to endpoint C, is the vector from endpoint A to endpoint D, is the vector from endpoint C to endpoint B, is the vector from endpoint C to endpoint A.

[0058] As shown in Figure 9, the four endpoints of a gold finger pin pad are points C to F, and the two endpoints of a lead are points A and B. Therefore, a vector can be constructed based on the coordinates of points A, B, C, and D. Then by judging and Is it true? To determine whether the CD edge intersects with the lead.

[0059] Step a2: further checking whether the lead is parallel to the long side of the gold finger pin pad according to the vertex coordinates of the outline of the gold finger pin pad and the endpoint coordinates of the lead.

[0060] If they are not parallel, the current inspection item fails and the defect information is reported: the center coordinates of the lead and the gold finger pin pad and the gold finger position number; if they are parallel, execute step a3.

[0061] It can be understood that by executing step a2, it is possible to effectively detect cases where the lead extends obliquely from the gold finger pin pad, as shown in the three cases in the upper half of Figure 10. After excluding oblique lines, there are two cases where the lead is parallel to the long side of the gold finger pin pad: one in which both endpoints of the lead are within the outline of the gold finger pin pad, and the other in which both endpoints of the lead are outside the outline of the gold finger pin pad. The outline of the gold finger pin pad can be obtained based on the vertex coordinates of the gold finger pin pad outline.

[0062] Among them, checking whether the lead is parallel to the long side of the gold finger pin pad can be determined by judging whether the two straight lines, the end point connecting line of the lead and the long side of the gold finger pin pad, are parallel. The specific judgment is achieved using the parallel theorem of two straight lines.

[0063] Step a3: Further check whether the lead is led out from one side of the gold finger pin pad.

[0064] If it is led out from a single side, the current inspection item passes; if it is not led out from a single side, the current inspection item fails, and the following defect information is reported: the center coordinates of the lead and the gold finger pin pad and the gold finger position number.

[0065] It can be understood that by executing step a3, the non-unilateral lead-out situation shown in the lower half of FIG10 can be effectively detected. In this case, the width of the lead extending from the gold finger pin pad exceeds the edge of the gold finger pin pad.

[0066] Among them, checking whether the lead is led out from one side of the gold finger pin pad specifically includes:

[0067] For the round head at one end of the lead connected to the gold finger pin pad, determine whether the coordinates of the three target points on the circumference of the round head all fall within the outline of the gold finger pin pad. If all fall within the outline of the gold finger pin pad, the lead is led out from a single side of the gold finger pin pad, otherwise the lead is not led out from a single side of the gold finger pin pad; among the above three target points, the line connecting one target point and the center of the round head is parallel to the lead, and the lines connecting the other two target points are perpendicular to the lead and pass through the center of the round head; wherein, the coordinates of the circumference of the round head are obtained by calculating the endpoint coordinates of the lead and the width of the lead, and the outline of the gold finger pin pad is obtained by the coordinates of the vertices of the outline of the gold finger pin pad; wherein, the center coordinates of the lead are obtained by the endpoint coordinates of the lead; and the center coordinates of the gold finger pin pad are obtained by the coordinates of the vertices of the outline of the gold finger pin pad.

[0068] As shown in Figure 11, extend the connecting line of the two endpoints A and B of the lead to point P1, and rotate point P1 45 degrees clockwise and counterclockwise with point B as the center to obtain P2 and P3 respectively; P1, P2 and P3 are three target points, and it is determined whether these three target points are all located within the outline of the gold finger pin pad. If they are all within the outline, as shown in case (b) in Figure 11, the lead is led out from a single side of the gold finger pin pad. Otherwise, as shown in case (a) in Figure 11, the lead is not led out from a single side of the gold finger pin pad.

[0069] In one embodiment, when the lead is led out from one side of the gold finger pin pad, as shown in FIG3 , the lead inspection sub-step may further include:

[0070] Step a4: Based on the endpoint coordinates and width of the lead, the coordinates and size of the device pad, and the center coordinates and diameter of the through hole, further check whether the lead is connected to other objects.

[0071] If the lead is not connected to other objects, the current check item passes; if the lead is still connected to other objects, execute step a5.

[0072] The other objects include: device pads, through-hole pads and / or other leads other than the lead.

[0073] Step a5: further determine the coordinates of the first intersection of the line connecting the endpoint coordinates of the lead and the outline of the gold finger pin pad, and determine the coordinates of at least one second intersection of the outline of other objects connected by the lead and the line connecting the endpoint coordinates; calculate the distance between the coordinates of the first intersection and the coordinates of each second intersection, and take the smallest one as Dis1; then, determine whether Dis1 is greater than the first threshold.

[0074] If Dis1 is greater than the first threshold, the current inspection item passes; if Dis1 is less than or equal to the first threshold, the current inspection item fails, and the following defect information is reported: the center coordinates of the lead and the gold finger pin pad, the gold finger position number, the coordinates of the first intersection, the coordinates of the second intersection, and Dis1.

[0075] The first threshold is the minimum distance that must be avoided when designing a corner for a lead extending from a gold finger pin pad, preferably 0.5 mm. The outline of the gold finger pin pad is obtained by calculating the vertex coordinates of the gold finger pin pad; the outline of the through hole is calculated by calculating the center coordinates and diameter of the through hole; the outline of the device pad is calculated by calculating the device pad coordinates and size; and the outline of the lead is calculated by calculating the lead endpoint coordinates and width.

[0076] As shown in example (a) in Figure 12, after lead L1 extends parallel to the gold finger pin pad Pad and intersects with another external lead L2, a circle is drawn with the endpoint coordinate P5 of the other lead L2 as the center and a radius of half the width of the other lead L2. The intersection point PC1 of this circle and the line connecting the endpoints of lead L1 is the second intersection point. Simultaneously, the outline of the pad can be obtained based on the vertex coordinates of the pad's contour. The intersection point PC2 of the line connecting the endpoints of lead L1 and this outline is the first intersection point. The distance between PC1 and PC2 is calculated as Dis1, and a determination is made as to whether Dis1 is greater than a first threshold.

[0077] As shown in example (b) in Figure 12, after the lead L1 is led out in parallel from the gold finger pin pad Pad, it intersects with the external through-hole pad Dr1. The outline of Dr1 can be calculated using the center coordinates and diameter of Dr1, and its intersection PC1 with the end point connection line of the lead L1 is a second intersection point. At this time, the coordinate acquisition method of the first intersection point is the same as that of example (a), so it will not be repeated.

[0078] In addition, in actual applications, after the lead is led out from the gold finger pin pad, it may be connected to more than one other object. In this case, Dis1 between the lead and each other object can be determined separately, and the minimum of multiple Dis1s can be compared with the first threshold.

[0079] In this embodiment, by performing the inspection of Dis1, problems such as lead warping and falling off caused in the subsequent PCB assembly process can be avoided, and the situation in which the gold finger short circuits caused by lead cracking can be avoided.

[0080] In addition, in one implementation, before executing the above-mentioned lead inspection sub-step, the gold finger pin pads with an aspect ratio greater than the second threshold can be first determined based on the contour vertex coordinates of the gold finger pin pads, so as to execute the above-mentioned lead inspection sub-step for the gold finger pin pads with an aspect ratio greater than the second threshold.

[0081] The second threshold is preferably set to 1.5, but is not limited thereto.

[0082] It is understandable that an unreasonable lead design at the gold finger pin pad may cause damage to the gold finger during the plugging and unplugging process, thereby causing a series of problems such as open circuit, affecting the stability and reliability of use. Therefore, the embodiment of the present invention performs a lead inspection sub-step to find out the gold finger reliability problems caused by poor lead design, thereby solving the problems that may occur in the gold finger assembly process and improving the reliability of the printed circuit board.

[0083] In one embodiment, the defect inspection step may include: a through-hole inspection sub-step. Specifically, as shown in FIG4 , the through-hole inspection sub-step includes:

[0084] Step b1: Determine the outline of the through hole according to the center coordinates and diameter of the through hole, and determine the outline of the gold finger pin pad according to the outline vertex coordinates of the gold finger pin pad; check whether the outline of the gold finger pin pad intersects with the outline of the through hole.

[0085] If not, the current inspection item passes; if so, the current inspection item fails, and the following defect information is reported: the center coordinates and diameter of the through hole on the gold finger pin pad, the center coordinates of the gold finger pin pad, and the gold finger position number.

[0086] The center coordinates of the gold finger pin pad are obtained through the vertex coordinates of the outline of the gold finger pin pad. The situation where the outline of the gold finger pin pad intersects with the outline of the through hole is shown in FIG13 .

[0087] In one embodiment, as shown in FIG5 , the through-hole inspection sub-step may further include:

[0088] Step b2: Check whether there is a through hole between adjacent gold finger pin pads based on the outline vertex coordinates of the gold finger pin pads, the center coordinates of the through hole, and the diameter of the through hole.

[0089] If there is no through hole between adjacent gold finger pin pads, the current inspection item passes; if there is a through hole, go to step b3.

[0090] Specifically, based on the vertex coordinates of the gold finger pin pads, the center coordinates of the through-holes, and the diameter of the through-holes, check whether there are through-holes between adjacent gold finger pin pads, including:

[0091] (1) If the gold finger angle a%90==0, the area between adjacent gold finger pin pads is determined as the first target area according to the contour vertex coordinates of the gold finger pin pads. As shown in FIG14 , the area between the gold finger pin pads Pad1 and Pad2 can be determined according to the two contour vertex coordinates (P9 to P12) of Pad1 and Pad2 respectively. Then, it is determined whether the first target area intersects with the contour of the through hole. If there is an intersection, there is a through hole between the adjacent gold finger pin pads, otherwise there is no through hole.

[0092] The outline of the through hole is calculated based on the center coordinates and diameter of the through hole.

[0093] (2) If a%90!=0, then calculate a2=a%90, rotate the gold finger as a whole clockwise or counterclockwise by a2 degrees; determine the area between the current adjacent gold finger pin pads as the second target area according to the vertex coordinates of the gold finger pin pads after the rotation by a2 degrees; rotate the gold finger back to the angle a, and determine the new coordinates of the second target area after the rotation back to the angle a, and use the area corresponding to the new coordinates as the first target area; determine whether the first target area intersects with the outline of the through hole; if there is an intersection, there is a through hole between the adjacent gold finger pin pads, otherwise there is no through hole.

[0094] As shown in FIG15, the angle of the gold finger in sub-graph (1) is a%90! = 0. At this time, the coordinates of the area between the gold finger pin pads cannot be directly calculated using the method in FIG14. Therefore, the gold finger is twisted clockwise as a2 = a%90, so that the twisted gold finger angle a%90 == 0, forming the state shown in FIG15 (2). At this time, the coordinates of the area between the gold finger pin pads can be directly calculated using the method in FIG14, that is, the coordinates of the second target area are obtained, that is, the coordinates of the shaded part in FIG15 (2). Then, the gold finger is rotated back to the angle a, forming the state shown in FIG15 (3). At this time, the coordinates of the first target area between the gold finger pin pads can be calculated by rotating the coordinates of the shaded part in FIG15 (2). That is, the coordinates of the shaded part in FIG15 (3).

[0095] Step b3: Further check whether the diameter of the through hole is within a preset range.

[0096] If it is within the preset range, the current inspection item passes; if it is not within the preset range, the current inspection item fails, and the defect information is reported: the center coordinates and diameter of the through hole, and the gold finger position number.

[0097] The diameter of the through hole is shown by the white double-headed arrow in FIG13 , and its preset range is preferably 0.2 mm to 0.4 mm.

[0098] In one embodiment, as shown in FIG6 , after the inspection item of checking the diameter of the through hole in step b3 is passed, if there is more than one through hole between adjacent gold finger pin pads, the through hole inspection sub-step may further include:

[0099] Step b4: for every two existing through holes, determine whether the Euclidean distance between the center coordinates of the two through holes is greater than a third threshold.

[0100] Specifically, as shown in FIG16 , if the Euclidean distance Dis2 is greater than the third threshold, the current inspection item passes. If the Euclidean distance Dis2 is less than or equal to the third threshold, the center coordinates of the through-holes with a through-hole spacing less than or equal to the third threshold and the gold finger position numbers are reported. The third threshold is preferably 0.5 mm.

[0101] The Euclidean distance Dis2 between the center coordinates of the two through holes is calculated as follows:

[0102] In this formula, (C1.x, C1.y) is the center coordinate of one of the through holes, and (C2.x, C2.y) is the center coordinate of the other through hole.

[0103] It's understandable that gold fingers sometimes inevitably have through-holes. Improper through-hole design can easily lead to holes breaking, affecting current flow and causing instability in the system housing the printed circuit board. Therefore, the present invention, through the through-hole inspection sub-step, identifies gold finger reliability issues caused by poor through-hole design. This addresses issues such as the current-carrying capacity of gold fingers affected by overly large or undersized through-holes between gold finger pin pads, as well as holes caused by closely spaced through-holes, thereby improving the reliability of the printed circuit board.

[0104] In one embodiment, the defect inspection step in FIG1 may include: a solder mask window inspection sub-step; as shown in FIG7 , the solder mask window inspection sub-step includes:

[0105] c1: Determine the center coordinates and outline of the gold finger according to the vertex coordinates of the outline of each gold finger pin pad.

[0106] c2: Determine the outline of the PCB frame based on the coordinates of the PCB frame.

[0107] c3: Draw rays from the center coordinate of the gold finger to the midpoints of each side of the gold finger outline to obtain four rays. These four rays intersect with the outline of the PCB frame. Each intersection point forms a line segment with the center coordinate of the gold finger, and multiple line segments are obtained. The four shortest line segments of these line segments are determined. The longest line segment of the four line segments intersects with an edge of the gold finger outline, and the edge is determined to be the back end of the gold finger. The endpoint coordinates of the edge are also determined.

[0108] The endpoint coordinates of the edge of the gold finger outline are obtained through the outline vertex coordinates of its gold finger pin pad.

[0109] As shown in Figure 17, with the center coordinate C3 of the gold finger as the center, rays are drawn to the midpoints of each side of the gold finger outline. The intersection points of the four shortest rays with the PCB frame are P13 to P16, which form line segments C3P13, C3P14, C3P15, and C3P16 with C3 respectively. The longest ray C3P16 of the four rays intersects with the top edge of the gold finger outline. Therefore, this edge is the back end of the gold finger. Then, the center coordinates of this edge are obtained according to the upper left contour vertex of the leftmost gold finger pin pad and the upper right contour vertex of the rightmost gold finger pin pad.

[0110] c4: judging whether the distance Dsi4 between the rear end of the gold finger and the solder mask opening of the gold finger is greater than a fourth threshold according to the coordinates of the rear end of the gold finger and the coordinates of the vertices of the outline of the solder mask opening of the gold finger;

[0111] If Dsi4 is greater than the fourth threshold, the current inspection item passes. If Dsi4 is less than or equal to the fourth threshold, the current inspection item fails, and the following defect information is reported: the distance between the rear end of the gold finger and the gold finger solder mask window, and the gold finger position number. The fourth threshold is preferably 0.25mm.

[0112] As shown in Figure 17, the outline of the solder mask opening in the gold finger can be obtained based on the vertex coordinates of the gold finger's outline. There are two edges parallel to the rear end of the gold finger. The edge closer to the rear end of the gold finger is taken, and the distance between this edge and the rear end of the gold finger is calculated as Dsi4. Figure 18 shows a schematic diagram of Dsi4 inspection on another PCB.

[0113] In one embodiment, as shown in FIG8( a ), the solder mask window inspection sub-step may further include:

[0114] Step d1: according to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad, find the lead extending from the gold finger pin pad and parallel to the long side of the gold finger pin pad;

[0115] Step d2: For the lead wire extending from the gold finger pin pad and parallel to the long side of the gold finger pin pad, check whether the lead wire is connected to other leads;

[0116] If the lead is not connected to other leads, the current check item passes;

[0117] If the lead is directly connected to other leads, or the lead is connected to another different lead through at least one other lead, then execute step d3;

[0118] Step d3: Starting from the end point of the lead outside the gold finger solder mask window, a set of preset inspection processes is performed for each other lead in turn.

[0119] As shown in FIG8(b), the above-mentioned preset inspection process includes:

[0120] Step d3-1: for each other lead connected to the lead, determine whether the other lead is parallel to the target edge of the lead extending from the solder mask opening of the gold finger.

[0121] If the other lead is not parallel to the target edge of the lead leading out of the gold finger solder mask opening, the current inspection item passes; if the other lead is parallel to the target edge of the lead leading out of the gold finger solder mask opening, execute step d3-2.

[0122] Among them, the target edge of the lead from the gold finger solder mask opening is the edge of the first gold finger solder mask opening that the lead passes through after being parallel to the long side of the gold finger pin pad and being led out from the gold finger pin pad.

[0123] Step d3 - 2 : further checking whether the length of the other lead is greater than a fifth threshold.

[0124] If the length of the other lead is less than or equal to the fifth threshold, the current inspection item passes; if the length of the other lead is greater than the fifth threshold, step d3-3 is executed.

[0125] Here, the fifth threshold is preferably 0.3 mm.

[0126] Step d3 - 3 : further checking whether the parallel distance Dis3 between the other lead and the target edge is greater than a sixth threshold.

[0127] If it is greater than the sixth threshold, the current check item passes; if it is less than or equal to the sixth threshold, the center coordinates of the target edge, the center coordinates of the other leads, Dis3 and the gold finger position number are reported.

[0128] Among them, the sixth threshold is preferably 0.5mm; the center coordinates of the lead are obtained through the endpoint coordinates of the lead; the center coordinates of the target edge are obtained through the contour vertex coordinates of the gold finger solder mask opening, and Dis3 can be specifically shown in Figure 19.

[0129] It's understandable that gold finger pads are typically manufactured with "windows," meaning no solder mask is applied between the pads to prevent the paint from peeling off during prolonged insertion and removal, which could affect the quality of the printed circuit board itself. Therefore, the present invention uses the solder mask window inspection sub-step to identify gold finger reliability issues caused by poor solder mask window design, thereby improving the pad's adhesion to the PCB and enhancing the reliability of the printed circuit board.

[0130] In practical applications, both the solder mask window inspection sub-step shown in FIG7 and the solder mask window inspection sub-step shown in FIG8(a) can be performed, and the order of execution of the two can be in no particular order. In addition, the solder mask window inspection sub-step shown in FIG8(a) is preferably performed after the lead inspection sub-step, so that step d1 in FIG8(a) can directly obtain the leads extending from the gold finger pin pads and parallel to the long sides of the gold finger pin pads using the inspection results of the above-mentioned step a3.

[0131] The embodiment of the present invention provides a method for inspecting the gold finger design process in printed circuit board design. By reading CAD data and inspecting the design data related to the gold finger reliability contained therein, gold finger design defects can be discovered in advance, and relevant defect information is reported when gold finger design defects are detected. Therefore, the method of the present invention can effectively avoid gold finger design errors, thereby improving the reliability of the printed circuit board.

[0132] The embodiments of the present invention are further illustrated below with specific examples.

[0133] First, let's take an example to illustrate the lead inspection sub-steps:

[0134] As shown in Figure 20, check whether lead L0 extends from gold finger pin pad No. 1 of gold finger J1. The endpoint coordinates of lead L0 are: P1 (116.760, 121.920), P2 (120.570, 125.730). The outline vertex coordinates of gold finger pin pad No. 1 are: P3 (116.460, 122.220), P4 (117.055, 122.220), P5 (116.460, 119.430), and P6 (117.055, 119.430).

[0135] Check whether the lead L0 is led out from the No. 1 gold finger pin pad, that is, check whether the four sides of the No. 1 gold finger pin pad intersect with the end point connection line P1P2 of the lead L0.

[0136] in, and

[0137] Therefore, the edge P3P4 of the No. 1 gold finger pin pad intersects with the endpoint connection line P1P2 of the lead L0, and it is determined that the lead L0 is led out from the No. 1 gold finger pin pad.

[0138] Continue to check whether lead L0 is parallel to the long side of the No. 1 gold finger pin pad:

[0139] First find the long side of the No. 1 gold finger pin pad:

[0140] The length of the side P3P5 of the No. 1 gold finger pin pad is:

[0141] The length of the side P3P4 of the No. 1 gold finger pin pad is:

[0142] Since d1>d2, the longer side is side P3P5. Check whether side P3P5 is parallel to the end point connection line P1P2 of lead L0:

[0143] Take vector and Since x1×y2!=x2×y1, a and b are not parallel, that is, lead L0 is a non-parallel lead and a defect exists. Therefore, the following defect information is reported: the center coordinate of the pad of the gold finger pin No. 1 PadCenter, the gold finger position number J1, and the center coordinate of lead L0 L0Center.

[0144] As shown in Figure 21, lead L1 extends from the No. 1 gold finger pin pad of gold finger J2 and is parallel to the long side of the No. 1 gold finger pin pad. Check whether lead L1 extends from a single side of the No. 1 gold finger pin pad. The endpoint coordinates of lead L1 are: A(178.249, 137.619), B(178.249, 139.511), and the width dw = 0.381. The coordinates of the No. 1 gold finger pin pad are: P7(178.272, 138.895), P8(178.653, 178.895), P9(178.653, 136.355), and P10(178.272, 136.355).

[0145] As shown in Figure 21, extend the endpoints of lead L1 to connect line AB to obtain target point B1 (178.249, 137.429). Draw a circle with a radius of dw / 2 with point B as the center. The two target points on the circumference of the circle that pass through point B and are perpendicular to AB are B2 (178.058, 137.619) and B3 (178.439, 137.619).

[0146] Using the ray method, it is determined that B2 is not within the outline of the No. 1 gold finger pin pad (P7, P8, P9, P10). Therefore, the three target points do not completely fall within the outline of the No. 1 gold finger pin pad. Therefore, lead L1 is a side outlet, not a single-sided outlet. Therefore, the defect information is reported: the center coordinate of lead L1 L1Center, the center coordinate of the No. 1 gold finger pin pad Pad1Center, and the gold finger position number J2.

[0147] As shown in Figure 22, assuming that lead L2 passes the inspection items of steps a1 to a3, the next step is to check whether lead L2 is connected to other objects. The inspection finds that the outline of lead L2 intersects with the outline of lead L3, so further inspection Dis1 is required.

[0148] Specifically, the endpoint coordinates of lead L2 include: C (43.564, 162.204), D (43.564, 163.271); the coordinates of the No. 1 gold finger pin pad PAD2 of gold finger J3 include: P11 (43.411, 162.966), P12 (43.716, 162.966), P13 (43.716, 161.442), P14 (43.411, 161.442); the endpoint coordinates of lead L3 include: E (43.561, 163.341), F (43.857, 163.637), and the line width dw2 = 0.203.

[0149] The point E is the closest to the endpoint D of lead L2. Draw a circle with a radius of dw2 / 2 at the endpoint E of lead L3. The equation of the circle is: (x-43.561) 2 +(y-163.341) 2 =(0.203 / 2) 2 The second intersection point of this circle and the line connecting the endpoints of lead L2 (line equation x = 43.564) is PC1 (43.564, 163.240). The intersection points of CD and each edge of PAD2 are calculated, resulting in the first intersection point PC2 (43.564, 162.966) of CD and edges P11P12 of PAD2. Dis1 is calculated based on PC1 and PC2 to be 0.274mm. Since Dis1 is less than 0.5mm, a defect exists. The defect information is reported as follows: PC1 (43.564, 163.240), PC2 (43.564, 162.966), Dis1 = 0.274mm, and the gold finger position number J3.

[0150] As shown in Figure 23, assuming that lead L4 extending from gold finger pin pad PAD3 of gold finger J3 passes the inspections in steps a1 to a3, the system then checks whether lead L4 is connected to other objects. The inspection finds that the outline of lead L4 intersects the outline of a through-hole pad, necessitating further inspection at step Dis1. Among them, the endpoint coordinates of line L4 include: C2 (99.350, 165.268), D2 (99.350, 167.593); the center coordinates of the through-hole pad are G (99.357, 167.600), and the diameter is Dia = 1.27; the contour vertex coordinates of PAD3 include: P15 (99.159, 166, 538), P16 (99.540, 166.538), P17 (99.540, 163.998), P18 (99.159, 163.998).

[0151] Find the first intersection point PC2 (99.350, 166.538) between the endpoint connection line C2D2 of lead L4 and the outline of PAD3. The calculation method is shown in the embodiment of Figure 22 and will not be repeated here. At the same time, based on the center coordinates G of the through-hole pad and the radius Dia / 2, the second intersection point PC1 (99.350, 166.965) between C2D2 and the outline of the through-hole pad can be calculated. The distance between PC1 and PC2 is 0.427mm, which is less than 0.5mm. Therefore, the defect information is reported: PC1 (99.350, 166.965), PC2 (99.350, 166.538), Dis1 = 0.427mm, and the gold finger position number J3.

[0152] The following is an example of the through-hole inspection sub-steps:

[0153] As shown in Figure 24, the center coordinates of through-hole pad Drill1 are center1 (90.638, 187.036) and its diameter is Dia1 = 0.49mm. The center coordinates of through-hole pad Drill2 are center2 (90.78, 186.927) and its diameter is Dia2 = 0.49mm. The outline vertex coordinates of gold finger pin pad PAD4 (number 1 of gold finger J4) are: Q1 (90.17, 187.96), P19 (90.475, 187.96), P22 (90.475, 185.928), and Q2 (90.17, 185.928). The two outline vertices of gold finger pin pad PAD5 (number 2) close to PAD4 are P20 (91.135, 187.96) and P21 (91.135, 185.928).

[0154] The collision detection algorithm detects that PAD4 intersects with the Drill1 contour, so the defect information is reported: Drill1's center coordinates center1 (90.638, 187.036), Dia1 = 0.49 mm, PAD4's center coordinates Pad4Center, and the gold finger position number J4.

[0155] Then, check whether there is a through hole between PAD4 and PAD5. Since the angle of gold finger J4 is 0°, no rotation is required. The first target area between PAD4 and PAD5 is obtained as follows:

[0156] Area (P19 (90.475, 187.96), P20 (91.135, 187.96), P21 (91.135, 185.928), P22 (90.475, 185.928)). Drill 2 intersects this area, and the diameter of Drill 2, Dia2, is greater than 0.4 mm, which is outside the preset range of 0.2 mm to 0.4 mm. A defect exists, and the defect information reported is: Drill 2 center coordinates (90.78, 186.927), Dia2 = 0.49 mm, and gold finger position number J4.

[0157] Since both Drill1 and Drill2 are located within the Area, the Euclidean distance between their center coordinates is:

[0158] If Dis2 = 0.179 < 0.5 mm, Drill1 and Drill2 are too close to each other, which can easily lead to hole breakage. The following defect information is reported: Dis2 = 0.179, center1 (90.638, 187.036), and center2 (90.78, 186.927).

[0159] The following is an example of the solder mask window inspection sub-steps:

[0160] As shown in Figure 25, the outline vertex coordinates of the solder mask opening of the gold finger J5 include: P27 (18.6, 30.8), P28 (58.0, 30.8), P29 (18.6, 40.2), and P30 (58.0, 40.2). The area of ​​the solder mask opening formed by them is S1.

[0161] First, check that the lead intersecting with the solder mask window S1 is lead L5, whose endpoint coordinates include: H(21.0,34.0), I(21.0,25.5); its endpoint outside the solder mask window is I, and the target edge corresponding to lead L5 is P27P28. Therefore, check in turn whether the other leads connected to lead L5 are parallel to edge P27P28.

[0162] First, check whether the lead L6 is parallel to the edge P27P28. The endpoint coordinates of the lead L6 include: I (21.0, 25.5), J (23.0, 22.3); take the vector Calculate whether c∥d. Since x1×y2!=x2×y1, c is not parallel to d. Then, starting from the endpoint J of lead L6, check whether lead L7 is parallel to the edge P27P28. The endpoint coordinates of lead L7 are: J(23.0,22.3), K(26.4,22.3). Similarly, determine whether lead L7 is parallel to the edge P27P28. If they are parallel, calculate the length of lead L7:

[0163] If Length>0.3mm, use the point-to-line distance formula to calculate the distance from lead L7 to P27P28, that is, calculate the distance Dis3 from point J (23.0, 22.3) to line y=30.8 as 8.5mm. If Dis3>0.5mm, the requirement is met and no defect information is reported.

[0164] As shown in Figure 26, check the distance between the rear edge of the gold finger J5 and the gold finger solder mask opening. Among them, the outermost contour vertex coordinates of all gold finger pin pads include: P31 (19.5, 30.0), P32 (57.8, 30.0), P33 (19.5, 39.2), P34 (57.8, 39.2). The gold finger area defined by these four contour vertex coordinates is S2. First, calculate the center coordinates of S2: C3 = ((P32.x + P33.x) / 2, (P32.y + P33.y) / 2) = (38.65, 34.6);

[0165] Draw rays from C3 to the midpoints of each side of S2 (gold finger outline) to obtain four rays. The four rays intersect with the outline of the PCB frame to obtain four intersection points: P23 (17.6, 34.6), P24 (38.65, 40.2), P25 (58.8, 34.6), and P26 (38.65, 7.2). The lengths of the four line segments formed by C3 and these four intersection points are: d23 = 21.05, d24 = 5.6, and d25 = 2. 0.15, d26=27.4; the edge where the line segment farthest from C3 intersects with S2 is P31P32. Calculate the intersection point PS1 (38.65, 30.8) of the line segment and P31P32, as well as the intersection point PS2 (38.65, 30.0) of the line segment and the rear end edge line of the area S1 where the gold finger solder mask window is located. The distance between the two is Dis4(PS1, PS2)=0.8mm>0.25mm, which meets the requirements and no defect information is reported.

[0166] The above is an example description of the inspection method for the gold finger design process in printed circuit board design provided by the embodiment of the present invention.

[0167] The method provided in the embodiments of the present invention can be applied to electronic devices. Specifically, the electronic devices can be desktop computers, portable computers, smart mobile terminals, servers, etc. This is not limited here; any electronic device that can implement the present invention falls within the scope of protection of the present invention.

[0168] Based on the same inventive concept, an embodiment of the present invention further provides an inspection device for a gold finger design process in printed circuit board design, comprising:

[0169] Data reading module, used to read CAD data;

[0170] The defect inspection module is used to inspect the target design data contained in the CAD data to find gold finger design defects and report relevant defect information when gold finger design defects are detected; wherein the target design data is design data related to gold finger reliability.

[0171] An embodiment of the present invention further provides an electronic device, as shown in FIG27 , including a processor 2701, a communication interface 2702, a memory 2703, and a communication bus 2704, wherein the processor 2701, the communication interface 2702, and the memory 2703 communicate with each other via the communication bus 2704.

[0172] Memory 2703, for storing computer programs;

[0173] The processor 2701 is configured to implement the method steps described in any one of the above methods for inspecting the gold finger design process in printed circuit board design when executing the computer program stored in the memory 2703 .

[0174] The communication bus mentioned in the electronic device mentioned above may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. This communication bus can be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is used in the figure, but this does not mean that there is only one bus or only one type of bus.

[0175] The communication interface is used for communication between the above electronic device and other devices.

[0176] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk memory. Alternatively, the memory may be at least one storage device located away from the processor.

[0177] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.

[0178] The present invention also provides a computer-readable storage medium having a computer program stored therein, which, when executed by a processor, implements the method steps described in any of the above methods for inspecting the gold finger design process in printed circuit board design.

[0179] Optionally, the computer-readable storage medium may be a non-volatile memory (NVM), such as at least one disk memory.

[0180] Optionally, the computer-readable storage medium may also be at least one storage device located away from the aforementioned processor.

[0181] It should be noted that, for the device / electronic device / storage medium embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments.

[0182] In the description of this specification, the reference terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" mean that the specific features or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features or characteristics described can be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0183] Although the present application is described herein in conjunction with various embodiments, in the process of implementing the claimed application, those skilled in the art may understand and implement other variations of the disclosed embodiments by viewing the drawings and the disclosed content. In the description of the present invention, the word "comprising" does not exclude other components or steps, "one" or "a" does not exclude multiple situations, and "multiple" means two or more, unless otherwise clearly and specifically limited. In addition, certain measures are recorded in different embodiments, but this does not mean that these measures cannot be combined to produce good results.

[0184] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A method for checking the gold finger design process in printed circuit board design, characterized in that: include: Data reading: read CAD data; Defect inspection: inspecting the target design data contained in the CAD data to find gold finger design defects, and reporting relevant defect information when gold finger design defects are found; wherein, the target design data is design data related to gold finger reliability.

2. The inspection method according to claim 1, characterized in that: The target design data includes: gold finger data, lead data, device pad data, through hole data and coordinates of the PCB frame; The gold finger data includes: the contour vertex coordinates of the gold finger pin pad, the gold finger bit number, the gold finger angle, the contour vertex coordinates of the gold finger solder mask opening, and the size of the gold finger solder mask opening; The lead data includes: the end point coordinates of the lead, the width and length of the lead; The device pad data includes: coordinates and sizes of the device pad; The through hole data includes: the center coordinates and diameter of the through hole.

3. The inspection method according to claim 2, characterized in that: The leads are all round-headed leads; the defect inspection step includes a lead inspection sub-step; The lead inspection sub-step comprises: According to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad, check whether there is a lead extending from the gold finger pin pad; If not, the current check item passes; If yes, further check whether the lead is parallel to the long side of the gold finger pin pad according to the vertex coordinates of the outline of the gold finger pin pad and the end point coordinates of the lead; If they are not parallel, the current inspection item fails and the following defect information is reported: The center coordinates of the finger pin pad and the gold finger position number; If they are parallel, further check whether the lead is led out from a single side of the gold finger pin pad, including: for the round head at one end of the lead connected to the gold finger pin pad, determine whether the coordinates of the three target points on the circumference of the round head all fall within the outline of the gold finger pin pad. If they all fall within the outline of the gold finger pin pad, the lead is led out from a single side of the gold finger pin pad, otherwise the lead is not led out from a single side of the gold finger pin pad; among the three target points, the line connecting one target point and the center of the round head is parallel to the lead, and the lines connecting the other two target points are perpendicular to the lead and pass through the center of the circle; wherein the coordinates of the circumference are obtained by calculating the end point coordinates of the lead and the width of the lead, and the outline of the gold finger pin pad is obtained by the coordinates of the outline vertices of the gold finger pin pad; If it is derived from a single side, the current check item passes; If it is not led out from one side, the current inspection item fails and the following defect information is reported: the center coordinates of the lead and the gold finger pin pad and the gold finger position number; The center coordinates of the lead are obtained through the end point coordinates of the lead; the center coordinates of the gold finger pin pad are obtained through the outline vertex coordinates of the gold finger pin pad.

4. The inspection method according to claim 3, characterized in that: The step of checking whether a lead is led out from the gold finger pin pad according to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad includes: According to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad, the lead connected to the gold finger pin pad is determined by using a collision detection algorithm; For the connected gold finger pin pad and lead, according to the outline vertex coordinates of the gold finger pin pad and the end point coordinates of the lead, it is judged whether each edge of the gold finger pin pad intersects with the lead; when the lead intersects with any edge of the gold finger pin pad, it is determined that the lead is led out from the edge; Among them, for each edge of the gold finger pin pad, the method of judging whether the edge intersects with the lead includes: Judgment and Is it true? If so, it is determined to be intersecting, otherwise it is determined to be non-intersecting; in, is the vector representing the lead line, A and B are the coordinates of the two endpoints of the lead line; It is the vector representing the edge of the current gold finger pin pad, and C and D are the coordinates of the two endpoints of the edge; is the vector from endpoint A to endpoint C, is the vector from endpoint A to endpoint D, is the vector from endpoint C to endpoint B, is the vector from endpoint C to endpoint A.

5. The inspection method according to claim 4, characterized in that: The lead inspection sub-step further includes: When a lead is led out from a single side of a gold finger pin pad, further check whether the lead is connected to other objects based on the endpoint coordinates and width of the lead, the coordinates and size of the device pad, and the center coordinates and diameter of the through hole; the other objects include: device pads, through hole pads and / or other leads other than the lead; If not, the current check item passes; If yes, further determine the coordinates of the first intersection of the line connecting the endpoint coordinates of the lead and the outline of the gold finger pin pad, and determine the coordinates of at least one second intersection of the outline of other objects connected by the lead and the line connecting the endpoint coordinates; calculate the distance between the coordinates of the first intersection and the coordinates of each second intersection, take the smallest one as Dis1, and judge whether Dis1 is greater than the first threshold; wherein, the outline of the gold finger pin pad is obtained by the coordinates of the contour vertices of the gold finger pin pad; the outline of the through hole is calculated by the center coordinates and diameter of the through hole, and the outline of the device pad is calculated by the coordinates and size of the device pad; the outline of the lead is calculated by the endpoint coordinates and width of the lead; If Dis1 is greater than the first threshold, the current check item passes; If Dis1 is less than or equal to the first threshold, the current inspection item fails, and the following defect information is reported: the center coordinates of the lead and the gold finger pin pad, the gold finger number, the coordinates of the first intersection, the coordinates of the second intersection, and Dis1.

6. The inspection method according to claim 3 or 5, characterized in that: The lead inspection sub-step further includes: Before executing the lead inspection sub-step, the gold finger pin pads with an aspect ratio greater than a second threshold are determined according to the contour vertex coordinates of the gold finger pin pads, so as to execute the lead inspection sub-step for the gold finger pin pads with an aspect ratio greater than the second threshold.

7. The inspection method according to claim 2, characterized in that: The defect inspection step includes: a through-hole inspection sub-step; The through hole inspection sub-step comprises: Determine the outline of the through hole according to the center coordinates and diameter of the through hole, and determine the outline of the gold finger pin pad according to the outline vertex coordinates of the gold finger pin pad; check whether the outline of the gold finger pin pad intersects with the outline of the through hole; If not, the current check item passes; If yes, the current inspection item fails, and the following defect information is reported: the center coordinates and diameter of the through hole on the gold finger pin pad, the center coordinates of the gold finger pin pad, and the gold finger position number; The center coordinates of the gold finger pin pad are obtained through the contour vertex coordinates of the gold finger pin pad.

8. The inspection method according to claim 7, characterized in that: The through hole inspection sub-step further includes: According to the contour vertex coordinates of the gold finger pin pad, the center coordinates of the through hole and the diameter of the through hole, check whether there is a through hole between adjacent gold finger pin pads; If not, the current check item passes; If yes, further check whether the diameter of the through hole is within a preset range; If it is within the preset range, the current check item passes; If it is not within the preset range, the current inspection item fails, and the center coordinates and diameter of the through hole, as well as the gold finger position number, are reported.

9. The inspection method according to claim 8, characterized in that: The through hole inspection sub-step further includes: After the inspection item of checking the diameter of the through hole is passed, if there is more than one through hole between the adjacent gold finger pin pads, for each two through holes, it is determined whether the Euclidean distance between the center coordinates of the two through holes is greater than a third threshold; If it is greater than the third threshold, the current check item passes; If it is less than or equal to the third threshold, the center coordinates of the through holes whose through hole spacing is less than or equal to the third threshold and the gold finger position number are reported.

10. The inspection method according to claim 8, characterized in that: The method of checking whether there is a through hole between adjacent gold finger pin pads according to the contour vertex coordinates of the gold finger pin pad, the center coordinates of the through hole and the diameter of the through hole includes: If the gold finger angle a%90==0, then determine the area between adjacent gold finger pin pads as the first target area according to the contour vertex coordinates of the gold finger pin pads, and determine whether the first target area intersects with the contour of the through hole; If a%90!=0, then calculate a2=a%90, rotate the gold finger as a whole clockwise or counterclockwise by a2 degrees; determine the area between the current adjacent gold finger pin pads as the second target area according to the vertex coordinates of the contour of the gold finger pin pad after rotating a2 degrees; rotate the gold finger back to angle a, and determine the new coordinates of the second target area after rotating back to angle a, and use the area corresponding to the new coordinates as the first target area; determine whether the first target area intersects with the contour of the through hole; The contour of the through hole is calculated based on the center coordinates and diameter of the through hole.

11. The inspection method according to claim 2, characterized in that: The defect inspection step includes: a solder mask window inspection sub-step; The solder mask window inspection sub-step includes: Determine the center coordinates and outline of the gold finger according to the outline vertex coordinates of each gold finger pin pad; Determine the outline of the PCB frame according to the coordinates of the PCB frame; Draw a ray from the center coordinate of the gold finger to the midpoint of each side of the gold finger outline, and get four The four rays intersect with the outline of the PCB frame, each intersection point forms a line segment with the center coordinates of the gold finger, and multiple line segments are obtained. The four shortest line segments among the multiple line segments are determined, and the longest line segment of the four line segments intersects with an edge of the gold finger outline, and the edge is determined to be the rear end of the gold finger, and the endpoint coordinates of the edge are determined; wherein the endpoint coordinates of the edge of the gold finger outline are obtained through the outline vertex coordinates of the gold finger pin pad; According to the coordinates of the rear end of the gold finger and the coordinates of the contour vertices of the gold finger solder resist window, it is determined whether the distance between the rear end of the gold finger and the gold finger solder resist window is greater than a fourth threshold; If it is greater than the fourth threshold, the current check item passes; If it is less than or equal to the fourth threshold, the current inspection item fails and the following defect information is reported: the spacing and the gold finger position number.

12. The inspection method according to claim 11, characterized in that: The solder mask window inspection sub-step further includes: According to the endpoint coordinates of the lead and the outline vertex coordinates of the gold finger pin pad, find the lead that is led out from the gold finger pin pad and is parallel to the long side of the gold finger pin pad; For the lead wire extending from the gold finger pin pad and parallel to the long side of the gold finger pin pad, check whether the lead wire is also connected to other leads; If the lead is not connected to other leads, the current check item passes; If the lead is directly connected to other leads, or the lead is connected to another different lead through at least one other lead, a set of preset inspection processes will be performed for each other lead in turn, starting from the end point of the lead outside the solder mask window of the gold finger: The inspection process includes: For each other lead connected to the lead, determine whether the other lead is parallel to the target edge of the lead from the gold finger solder resist window; wherein the target edge of the lead from the gold finger solder resist window is the first edge of the gold finger solder resist window that the lead passes through after being parallel to the long side of the gold finger pin pad and being led out from the gold finger pin pad; If they are not parallel, the current check item passes; If they are parallel, further checking whether the length of the other lead is greater than a fifth threshold; If the length of the other lead is less than or equal to the fifth threshold, the current check item passes; If the length of the other lead is greater than the fifth threshold, further checking whether the parallel distance between the other lead and the target edge is greater than a sixth threshold; If it is greater than the sixth threshold, the current check item passes; If it is less than or equal to the sixth threshold, report the center coordinate of the target edge, the center coordinate of the other lead, the parallel distance and the gold finger number; The center coordinates of the lead are obtained through the endpoint coordinates of the lead; and the center coordinates of the target edge are obtained through the contour vertex coordinates of the gold finger solder mask opening.

13. An inspection device for gold finger design process in printed circuit board design, characterized in that: include: Data reading module, used for reading CAD data; The defect inspection module is used to inspect the target design data contained in the CAD data to find gold finger design defects, and report relevant defect information when gold finger design defects are detected; wherein the target design data is design data related to gold finger reliability.

14. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for inspecting the gold finger design process in printed circuit board design according to any one of claims 1 to 12 is implemented.

15. An electronic device, characterized in that: include: A processor, a communication interface, a memory and a communication bus; wherein the processor, the communication interface and the memory communicate with each other via the communication bus; The memory is used to store computer programs; The processor is used to implement the inspection method for the gold finger design process in printed circuit board design as described in any one of claims 1 to 12 when executing the computer program stored in the memory.

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