Computer chassis with add-on modules on external panels

Abstract

This innovative computer case integrates external panel cuts for add-on modules, enhancing customizable capabilities economically. Users can easily incorporate modules like USB Type-C anywhere, benefiting from their independent, removable design. The case supports custom module creation using 3D printing. Convenient access to internal features like SATA ports reduces damage risk during repairs. It includes features such as DC output for external components, fast charging, and customizable RGB lighting, buttons, I / O connections, catering to diverse user preferences. Furthermore, the case supports future technologies such as USB4, offering future proofing options. On top of that, its versatility reduces e-waste by supporting multiple hardware upgrades, making it sustainable for tech enthusiasts seeking user-friendly solutions. This design ensures longevity and adaptability in evolving technological landscapes, making it a sustainable and user-friendly choice for tech enthusiasts.

Description

[0001] 1 Title of the Invention

[0002] Computer chassis with add-on modules on external panels.

[0003] 2 Technical Field

[0004] The present invention pertains to computer chassis design, specifically introducing a modular approach that not only replaces existing I / O ports but also enhances the chassis with additional functionalities.

[0005] 3 Background

[0006] With the advent of new technologies in the computing world, such as USB 4, there is a growing need to update older computer chassis that do not support these advancements. The current design of Input / Output (IO) panels in many computer cases is often limited and fails to meet the diverse needs of users. For instance, typical cases today are equipped with one USB 3.0 port and two USB 2.0 ports, while most motherboards support up to four USB 3.0 ports, six USB 2.0 ports, and one USB Type-C.

[0007] The rapid pace of technological development also renders certain technologies, like 1394 (FireWire), obsolete, making fixed designs for front panel connections impractical. There is a clear demand for a more flexible front panel that can adapt to various needs. One such requirement is a high-current USB port for charging mobile devices, as most motherboards provide a maximum of only 0.5 amps through their USB ports. This invention addresses this issue by allowing the easy addition of a charger module to the front panel, directly connected to the computer's power supply to provide high current.

[0008] Furthermore, users have varying needs that existing designs do not always satisfy. For example, computer maintenance specialists require easy access to SATA power and data cables for testing hard drives. This invention provides a solution by enabling a SATA module that allows a repair technician to connect a hard drive to the motherboard's internal ports externally.

[0009] Additionally, compact computer cases (less than 20 liters) face significant challenges with internal component cooling, particularly for the CPU and GPU. Traditional solutions involve the use of computer fans that require adequate fresh air intake, which is often facilitated by making multiple cuts in the case body. This invention enhances this approach by incorporating hexagon-shaped (honeycomb) perforations on all sides of the computer case, which not only improves airflow but also serves as mounting points for various modules. These perforations can also be designed in other shapes, such as squares, rectangles, circles, or triangles.

[0010] Moreover, with the increasing popularity of RGB lighting in computer cases, these perforations can be adorned with RGB and ARGB LED modules, providing dynamic 3D lighting effects and enhancing the aesthetic appeal of the computer. 4 Disclosure of the Invention

[0011] With the introduction of new generations of computers and increasingly demanding software, most electronic components in computers lose their effectiveness after 5 to 10 years and require upgrades. However, the computer chassis can often support several generations of upgrades. Factors that can reduce the lifespan of a computer chassis include:

[0012] 1. The introduction of new technologies like USB Type C.

[0013] 2. The obsolescence of older technologies such as DVD-ROM and FireWire.

[0014] 3. Outdated and unfashionable chassis designs.

[0015] As shown in Figures 1 and 2, the internal components of the computer occupy nearly all available space, indicating efficient use of the case's volume. Additionally, hexagonal cutouts are used on all sides of the case. In this invention, a honeycomb design was chosen for its aesthetic appeal but, these cutouts can also be rectangular, square, circular, or triangular. These cutouts serve three main purposes:

[0016] 1. Improving airflow for the fans (Figure 3).1

[0017] 2. Accommodating functional modules such as the USB ports (Figure 10A).2

[0018] 3. Creating a location for RGB LEDs to enhance the case's visual appeal (Figure 4).

[0019] No innovation claim is made regarding airflow improvement in this invention, as this design has been previously used by case manufacturers. The main advantage of this case compared to existing market products and previous inventions is the use of cutouts on the case to accommodate functional modules. This feature allows users to customize and expand the capabilities of their case at low cost and without limitations. For example, if a user needs a new technology like USB-C, they can purchase and add this module to their case. On top of that, there are no restrictions on where the modules can be placed. For instance, if a user prefers to place the case on the floor next to their desk, they can position the start button and USB modules on the top sides of the case for easy access. Alternatively, if the user prefers to place the case on their desk, it would be more convenient to place the modules on the front and lower parts of the case. The flexibility in relocating functional modules is one of the innovations of this case.

[0020] As new technologies like USB4 become widespread, they can easily be added to the case with a module. Since the modules are independent, they can be added or removed individually. Furthermore, users with access to a 3D printer, designing and creating each module will be very easy.

[0021] Additional benefits include:

[0022] 1Some sections of the pattern are left uncut, with several additional holes and slots visible for the installation of a 120- millimeter fan and a 240-millimeter radiator. Considering the placement of the power supply unit, the primary method for cooling the CPU in this case is water cooling.

[0023] 2In the illustration, commonly used modules are shown, including the start button, reset button, headphone output, microphone input, USB 2.0, USB 3.0, and USB-C. Easy access to internal features like SATA ports for those who frequently repair or modify their case.

[0024] Reduced need to open case panels, significantly lowering the risk of damaging internal components, especially the motherboard and graphics card.

[0025] The ability to add features like a DC output from the power supply to use with external devices such as monitors and speakers.

[0026] The option to selectively use RGB lights on multiple sides of the case for three-dimensional lighting effects.

[0027] Overall, the use of modular cutouts brings enhanced customization, ease of upgrades, and a reduction in potential damage to internal components, making this case a highly versatile and user-friendly option.

[0028] 5 Brief Description of Drawings

[0029] All dimensions in the drawings are in millimeters unless otherwise indicated.

[0030] Figure 1: A perspective view of the computer case with add-on modules on its panels.

[0031] Figure 2: An isometric view of the position of main computer parts relative to each other.

[0032] Figure 3: Top view of the case, top panel (101) two top 140mm fan (114) and a 280mm radiator (113) are visible.

[0033] Figure 4: Bottom view of the case, the bottom panel (103) is covered with RGB and ARGB

[0034] LED modules (136) for aesthetic.

[0035] Figure 5: Unfolded view of the top panel (101) and front panel (102). The exterior panels are made of 1.5mm thick aluminum Sheetmetal with 2mm bend radius.

[0036] Figure 6: Back view if the case.

[0037] Figure 7: Middle panel unfolded view. Made of steel with 0.5mm thickness.

[0038] Figure 8: Right view of the case.

[0039] Figure 9: Drive cage's drawing.

[0040] Figure 10: Fig. 10A some of the functional modules and their positioning on the case. Fig.

[0041] 10B an isometric view of the empty case.

[0042] Figure 11: The module's dummy holder (120).

[0043] Figure 12: Start button module with LED indicator.

[0044] Figure 13: Reset button module.

[0045] Figure 14: USB 3.0 / USB 2.0 module.

[0046] Figure 15: USB type C module.

[0047] Figure 16: Aux in / out module.

[0048] Figure 17: Fast charger module.

[0049] Figure 18: Volume knob module.

[0050] Figure 19: HDMI module.

[0051] Figure 20: Display port module.

[0052] Figure 21: SATA module VI.

[0053] Figure 22: SATA coupler.

[0054] Figure 23: SATA and IDE sizes comparison with Dummy holder. Figure 24: Modular power and where the 6 pin connectors connect to.

[0055] Figure 25: 6 Pin to SATA and IDE cables.

[0056] Figure 26: 6-pin connector power module.

[0057] Figure 27: Suggested standard for power modules pinout.

[0058] Figure 28: SATA module V2.

[0059] Figure 29: 5.5mm jack power distribution.

[0060] Figure 30: 5.5mm jack connector.

[0061] Figure 31: RJ45 network module.

[0062] Figure 32: Standoff module.

[0063] Figure 33: Headphone holder module.

[0064] Figure 34: RGB module's electronic part.

[0065] Figure 35: ARGB and RGB module.

[0066] Figure 36: RGB module with maximum SMD 5050 LEDs.

[0067] Figure 37: SD card reader module.

[0068] Figure 38: Power inlet module.

[0069] Figure 39: Computer isometric view with a CPU air cooler.

[0070] 6 Detailed Description of the Invention

[0071] For the dimensions and placement of cutouts, refer to Figure 5. As shown in this diagram, the hexagonal cutouts (118) have a side length of 12 millimeters and are spaced 3 millimeters apart. The pattern's cutout area ratio is 76%, calculated as follows: [Area ratio 0.76361

[0072] By adjusting the distance and dimensions of the cutouts in this formula, different area ratios can be achieved. Increasing this number improves fan performance and cools internal components, but reduces the chassis's strength. For example, to achieve an 80% open to chassis area ratio with a fixed 3-millimeter gap (t), each hexagonal side (a) must be increased to 14.67 millimeters. Alternatively, to maintain the same side length but reach an 80% area ratio, the gap must be reduced to 2 millimeters.

[0073] The chosen dimensions of 12 and 3 millimeters for component 18 are the smallest that can accommodate most computer modules like USB 3.0 and audio input modules. Some modules, such as SD card readers, require a minimum edge length of 15 millimeters. The exact number for these values needs to be determined based on the rigidity and electronic modules sizes.

[0074] The only drawback is that the large cutouts may allow fingers to contact the fans. However, typical computer fans are not strong enough to cause injury. On top of that, mesh modules can be used to mitigate this risk.

[0075] The primary innovation of this invention is using these cutouts to accommodate functional modules. Another innovation of this invention is its ability to support technologies that are not yet widespread or even invented. For example, although the USB4 standard was introduced a few years ago, it is not yet commonly used in motherboards. This invention allows the addition of a USB4 module to the case if the technology becomes prevalent, enabling users to take advantage of new technologies without changing the computer chassis.

[0076] 6.1 Chassis parts

[0077] Part (101): Top panel of the case (Figure 3).

[0078] Part (102): Front panel of the case (Figure 5). This panel and the top panel are a single piece and are connected to the rest of the case after cuting and bending.

[0079] Part (103): Botom panel of the case (Figure 4).

[0080] Part (104): Back panel of the case (Figure 6).

[0081] Part (105): Middle panel of the case (Figure 7).

[0082] Part (106): Right panel of the case (Figure 8). One of the issues with modern cases is the low rigidity of this panel. The reason is that, firstly, it is the largest panel of the case, and secondly, unlike other panels, it does not have bends at all corners. To increase the rigidity of this panel and maintain the integrated design, hexagonal-shaped stamps have been applied to this panel according to the plan. These stamps have a depth of 4.5 millimeters (three times the thickness of the sheet) and significantly increase the panel's resistance to bending.

[0083] Part (107): Left Panel of the Case. This panel is made of 5-millimeter tempered glass and is screwed onto parts 101 and 103.

[0084] Part (108): Hard Drive Cage (Figure 9). This cage is designed from 0.5-millimeter-thick steel with a bending radius of 1 millimeter and can hold two 3.5-inch or four 2.5- inch hard drives and SSDs. This part is atached to the middle panel (105) with four M3 screws and to the front panel (part 102) with two screws.

[0085] Part (801): SSD Bracket (Figure 8). This component is placed behind the middle panel (105) and allows for the atachment of one 2.5-inch HDD or SSD to the case. There are three of these brackets on the middle panel.

[0086] 6.2 Computer main components

[0087] Part (110): Motherboard (Figure 2).

[0088] Part (111): Power Supply (Figure 2).

[0089] Part (112): Graphics Card (Figure 2).

[0090] Part (113): 280mm or 240mm Radiator (Figure 2).

[0091] Part (114): 140mm or 120mm Top Case Fans (Figure 2).

[0092] Part (115): Hard Disk (Figure 2). Part (116): SSD (Figure 2).

[0093] Part (117): 140mm or 120mm Bottom Case Fans (Figure 2).

[0094] Part (3901): CPU air cooler (Figure 39).

[0095] 6.3 Modules

[0096] Part (118): 12-millimeter hexagonal cuts with a 3-millimeter spacing (Figure 10).

[0097] Part (119): 15-millimeter hexagonal cuts (Figure 10).

[0098] Part (120): Dummy Holder (Figure 11). As shown in Figure 12, each module consists of a holder (1201) and an electronic component (1202). The holder part is designed with a main hexagonal part with 12 millimeters sides (1101) and a head hexagonal part (1102) with 13.73 millimeters sides. These dimensions are chosen so that when the modules are placed next to each other, they cover the gaps between the cutouts (Figure 10). A locking mechanism (1103) is also designed to secure the modules in place once they are positioned. This mechanism is designed to allow for easy removal and reattachment of the modules to the case with a press from both sides. According to Figure 11 Detail A, the distance of this mechanism (1103) from the head section (1102) is equal to the thickness of the case shell (1.5 millimeters). The method of constructing the modules will be explained in the implementation section.

[0099] Part (121): Start Button Module (Figure 12). The start module is consisting of a holder (1201) and start button and an LED (1202) that indicates system activity by connecting to the motherboard pins.

[0100] Part (122): Reset Button Module (Figure 13). 3 Different shapes of reset bottom presented in this figure. Showing a wide range of options for customization and personal preference.

[0101] Part (123): USB 3.0 and USB 2.0 Module (Figure 14).

[0102] Part (124): USB-C Module (Figure 15).

[0103] Part (125): Headphone Output and Microphone Input (Aux in / out) Module (Figure 16).

[0104] Part (126): Mobile Charger Module (Figure 17). One of the innovations claimed in this invention is this module. It is designed with a printed circuit board (1703) featuring two main chipsets, TPS61088 and FP6601Q, and connects to the computer's power supply using a Berg (floppy) connector (1704). It provides the user with fast charging capabilities for QC2.0, QC3.0, Huawei FCP, and DCP. The input voltage from the power supply is 5 volts, and the output consists of two USB ports with voltages of 5V 3A, 9V 2A, and 12V 2A.

[0105] Part (127): Volume Control and Fan Speed Control Module (Figure 18). Since most computer motherboards cannot directly read analog signals from a potentiometer, an analog-to-digital converter is needed in the volume control module. Consequently, software is also necessary for the proper operation of this module.

[0106] Part (128): HDMI Module (Figure 19). The HDMI and DisplayPort modules are simply a dummy holder (1901 and 2001) a male-to-male adapters (1902 and 2002) that can be used to route the graphics card output to the front of the case with an HDMI cable for ease of access. This feature is very useful for individuals who frequently test monitors.

[0107] Part (129): DisplayPort Module (Figure 20).

[0108] Part (130): SATA Power and Data Module (Figure 21). One of the innovations claimed in this invention is this module. It is designed in two versions. In the first version (Figure 21), there is a SATA connector (2102) and one SATA power connector (2103). This module is merely a connector and does not contain any electronic components. The SATA ports on the motherboard connects to the back of the module using a SATA cable, and the front of the case can easily be used to test hard drives and SSDs without needing to open the case. An example of a SATA coupler can be seen in Figure 22. As shown in Figure 23 due to the large width of the two power connectors, SATA (2301) (32 millimeters) and Molex IDE (2302) (25 millimeters), it is not possible to use these connectors in the design (120). Therefore, inspired by modular power supplies, a connector in the shape of a 6-pin graphics card has been designed (2103). To use this connector in modular power supplies, a 6-pin to 6-pin cable can be used (Figure 24). The pinout of the 6-pin connector in modular power supplies is not standardized and varies between companies. In this module, since this connector only serves to pass the current without changing the position of the pins, there is no need to reconfigure the pin layout of the connector. Consequently, the cable that comes with the modular power supply can also be used on the output side of the module (Figure 25). For non-modular power supplies, SATA to 6-pin adapters can be used.

[0109] Part (131): Power Module with 6-Pin Socket (Figure 26). Another innovation claimed in this invention is this module. As mentioned in the previous module, due to the lack of standardization in the pinout of 6-pin connectors in modular power supplies, a standard needs to be defined for using power supply voltages. After researching the pin configurations of different manufacturers, the proposed standard is shown in Figure 27. The reason for having two 5V pins is that ARGB technology, which uses 5V, will be used in LED modules, necessitating more current on the 5V rail. This module's function is to provide 12V, 5V, and 3.3V DC voltages for devices outside the case. For example, external hard drives can be powered using a 6-pin to 5.5mm jack adapter. It can also be used for testing fans, internal hard drives, typing lights, monitors, networking equipment, etc.

[0110] Part (132): SATA Data Module Version Two (Figure 28). By combining this module with the previous one, more hard drives can be used externally. Part (133): Power Distribution Module (Figure 29). This is one of the innovations and advantages of the claimed invention. This module connects to the computer power supply and provides 12V, 5V, and 3.3V DC voltages through a 5.5mm power jack (Figure 30) for the user. Its uses include powering book-sized external hard drives, monitors, speakers, hubs, switches, network modems, desktop LED lights, and fan testers. This module allows the user to power on and off some external equipment like monitors and speakers with the case. This saves electricity, as computer power supplies typically have an efficiency of over 80% (80 Plus White), thereby increasing the efficiency of other connected external devices. Additionally, eliminating the adapters for these devices saves costs and reduces cabling.

[0111] Part (134): RJ45 Network Module (Figure 31).

[0112] Part (135): Case Stand Module (Standoff) (Figure 32). As shown in Figure 32, the case stand serves only as a support piece and adds 12 millimeters to the case height. This height will be adjusted after testing the performance of the bottom fans.

[0113] Part (136): Headphone Holder Module (Figure 33). This is a simple mechanical module that can hold customer's headphone.

[0114] Part (137): Section (40): ARGB and RGB LED Modules (Figures 34 and 35). These modules are among the most important innovations of this invention. Each module can be individually controlled with ARGB technology, providing a unique aesthetic and three-dimensional lighting to the case. Three-dimensional lighting means that, for example, these modules can be installed on the top, front, and left sides of the case, providing lighting in three directions. By controlling these modules in all three directions and proper programming, beautiful color and light combinations can be achieved. Each module has 7 SMD 5050 LEDs (3402) for the RGB model and WS2812b (3402) for the ARGB models on a PCB (3401). Each of these LEDs has good brightness (16-22 lumens) relative to its power consumption of 0.2-0.24W. As a result, each module provides about 125 lumens of brightness and consumes 1.4-1.7 watts of power. For example, in Figure 4, 72 of these modules (137) are used on the bottom face of the case, resulting in approximately 100 watts of power consumption for these modules. This relatively large amount of power consumption requires active cooling. Therefore, if an entire face of the case is covered with these modules, a fan must be used to cool them. After initial tests and reviewing the results, the number of LEDs per module can be adjusted. The maximum number of SMD 5050 LEDs that can be placed in a 12-millimeter hexagonal module is 10 (3601), resulting in a power consumption of approximately 2 watts per module (Figure 36). As shown in Figures 34 and 35, there are three single-row 4-pin headers (3403) on the back of the module to control the module and to bridge between the LED modules. RGB technology uses a 12-volt voltage, and the pin headers typically handle up to 6 amps of current, allowing for a maximum power consumption of 72 watts per pin header. Given the 1.4-1.7-watt consumption per module, up to 42 modules can be connected in series. In ARGB standards, a 5-volt voltage is used for operation, allowing a maximum of 18 modules to be used in series. The advantage of ARGB is that each module can be individually controlled, resulting in more varied and beautiful color combinations.

[0115] Part (138): SD Card Reader Module (Figure 37). Given the 24-millimeter width of an SD card, it is not possible to fit the SD card reader module into a 12-millimeter hexagon. Similarly, the power input module (next module) cannot fit within these dimensions. To solve this problem, 15-millimeter cuts are made on the back of the case (Part 119). Modules requiring more space will be placed at the back of the case. The SD card reader module features a slot for an SD card and a slot for a micro-SD card. This module connects to a USB 2.0 or USB 3.0 port on the motherboard, depending on the PCB design.

[0116] Part (139): Power Input Module (Figure 38). In small form factor cases, the power supply (111) is typically placed at the front of the case and connected to the back via an extension cable. In this case, for air cooling (Figure 39), the power supply is moved to the front of the case (111), providing space for air coolers up to 150 millimeters in height. The power supply can be connected directly from the top of the case or via the power input module, which routes power internally to the PSU. To eliminate the need for a large cut out for power inlet, and C5 power cable that is common in laptop chargers can be used.

[0117] Additional modules are currently under design and will be added after further research. Some of these modules are:

[0118] 1. VGA Module

[0119] 2. Fan Module

[0120] 3. Graphics Card Support Module

[0121] 4. LED Light Module for Typing at Night

[0122] 5. Buzzer Module (Internal Speaker)

[0123] 6. External Speaker Module

[0124] 7. Microphone Module

[0125] 8. Webcam Module

[0126] 9. Stream Deck

[0127] 10. Mesh Module

[0128] 11. Hexagonal Display Module

[0129] 6.4 How it is made.

[0130] The designed case consists of 7 main panels and several auxiliary components. In Figure 9, the layout of the front and top panels, which are connected, is presented. The external panels of the case (except for the left panel) are made from 1.5-millimeter-thick aluminum sheets with a 2-millimeter bend radius. These panels include:

[0131] 1. Front and top panels (Part 101 and 102) 2. Bottom panel (Part 103, Figure 8)

[0132] 3. Rear panel (Part 104, Figure 10)

[0133] 4. Right panel (Part 106, Figure 12).

[0134] For better aesthetics, these panels undergo brushing (Brushed Aluminum) before cuting and bending. The following explains the reasons for choosing aluminum for the case material:

[0135] 1. The price per kilogram of aluminum and steel is almost the same.

[0136] 2. Steel, with a density of 7.8 grams per cubic centimeter, is three times heavier than aluminum, which has a density of 2.7 grams per cubic centimeter.

[0137] 3. The stiffness (Young's modulus) of steel is 200 GPa, which is nearly three times that of aluminum's 70 GPa.

[0138] In material mechanics, the stiffness of a structure in bending is directly related to the cube of the thickness of the material. Thus, a 3-millimeter aluminum sheet is nine times stiffer than a 1-millimeter steel sheet, while their weights are nearly the same.

[0139] Since large portions of the external panels (more than 60%) are cut out, their stiffness is significantly reduced, making stiffness a critical design factor for this case. Computer cases typically do not experience high stress and strain, so high strength is not necessary. Aluminum cases usually have a beter final appearance compared to steel cases. Due to the complexity of the design of the internal panel (Figure 11), the middle panel of the case is made from 0.5- millimeter-thick steel with a 1-millimeter bend radius. Forming 0.5-millimeter steel sheets is much easier than forming 1.5-millimeter aluminum sheets. Additionally, some design parameters, such as the bend radius, can be smaller. After cuting and bending, these panels are sent for painting. Once painted, the panels are assembled, and 3.3-millimeter holes are connected with 1 / 8-inch rivets. Then, the hard drive cage is placed, and the SSD bracket is mounted on the back of the middle panel. Finally, the right panel is secured, and the left panel, which is made of tempered glass, is installed.

[0140] For the modules, circuits and electronic components are first acquired and tested. Each electronic component is then placed inside a silicone mold based on its size, shape, and the provided Figures. Depending on the module type, transparent or opaque epoxy resin, which is an electrical insulator, is poured into the mold. For most modules it is beter to use hard electrical insulating epoxy resin, but type and color of the epoxy can be altered based on need and preference. Based on the resin's specifications and curing time, the modules are cured under optimal conditions until they harden. This process not only insulates the components electrically but also significantly enhances their mechanical strength and resistance to water and dust. The only downside of this method is that the components cannot be repaired after molding. However, it is worth noting that most of the modules designed above are purely mechanical, and only a few contain electronic components. Furthermore, each module is independent and inexpensive, so the failure of one module incurs minimal cost and is easily replaceable.

Claims

AMENDED CLAIMS received by the International Bureau on 22 October 2024 (22.10.2024)1. A computer chassis (100) with customizable, scalable add-on modules (120-139) on external panels (101, 102, 103, 104 106, 107), comprising:• a plurality of flexibly arranged, variously shaped cutouts such as hexagonal, rectangular, square, triangular, or circular on external panels (101-104) of the chassis, configured to serve as universal mounting points for various independently functional modules (120-139), allowing the user to select the number, position, and arrangement of the modules based on preference and usage requirements;• an external frame (101, 102, 103, 104) supporting the cutouts (118, 119), made of sheet metals enabling both structural rigidity and modular flexibility;• a set of independently configurable functional modules (120-139), each module comprising a holder (120) and an electronic component, configured to be removably attached to the cutouts (118, 119), allowing scalable customization enabling the chassis to be upgraded with future technologies (e.g., USB4 or advanced charging modules), and providing users with the flexibility to modify both the functionality and aesthetic layout of the chassis without replacing the entire case.

2. The computer chassis of claim 1, wherein the chassis allows the addition of modules incorporating currently uncommon technologies, such as USB4 and USB-C (124), providing future technological adaptability for the user.

3. The computer chassis of claim 1, wherein the module holder (120) includes a locking mechanism (1103) that secures the module to the chassis once placed, preventing unintentional dislodgement, and wherein the mechanism is designed so the user can release and remove the modules by pressing the locks (1103), allowing installation on external panels of the case (101, 102, 103, 104) without the need for drilling.

4. The computer chassis of claim 1, further comprising a charger module (126), wherein the charger module includes a printed circuit board (1703) with two USB ports, enabling the computer case to provide fast mobile charging when connected to the computer's power supply (111) with Berg connector (1704).

5. The computer chassis of claim 1, further comprising a power distribution module (133), wherein the power distribution module consists of a six-pin connector and three 5.5mm jacks, allowing external devices such as monitors and speakers to be powered on and off simultaneously with the computer using the computer's power supply (111).

6. The computer chassis of claim 1, further comprising a SATA module (130), wherein the SATA module (130) includes a male-to-male SATA connector (2102) and a six-pin power connector (2103), allowing direct connection of hard drives (115,116) data toAMENDED SHEET (ARTICLE 19)the motherboard's (110) SATA ports and making the necessary power for hard drives (115) and SSDs (116) accessible to the user.

7. The computer chassis of claim 1 and 3, further comprising RGB and ARGB modules (137), wherein placing the RGB and ARGB modules on three external faces (101, 102, 103, 104 106, 107), such as the top (101), front (102), and left (107), enables 3D lighting effects, and wherein controlling these modules can create visually appealing 3D lighting displays such as a character moving across multiple dimensions.

8. The computer chassis of claim 1, wherein a start button module (121) with an LED indicator connected to the motherboard (110) pins and the shape, color and location of the module is customizable based on the ascetics and the costumer's preference and convenient without need of additional tools.

9. The computer chassis of claim 1, wherein a reset button (122) connected to the motherboard (110) pins and the shape, color and location of the module is customizable based on the ascetics and the costumer's preference and convenient without need of additional tools.

10. The computer chassis of claim 1, wherein an USB 3.0 or USB 2.0 modules (123), each comprising a holder and a USB port, configured to connect to the motherboard and location of the module is customizable based on the ascetics and the costumer's preference and convenient without need of additional tools.

11. The computer chassis of claim 1, an aux in / out module (125) for headphone output and microphone input, each module comprising a holder (1601) and corresponding audio jacks (1602) the shape, color and location of the module is customizable based on the ascetics and the costumer's preference and convenient without need of additional tools.

12. The computer chassis of claim 1, wherein a volume control and fan speed control module (127), comprising an analog-to-digital converter (1802) and necessary software for operation and can control any function of the computer such as fan's speed or speaker's volume with a knob which provide the user with unlimited customization options.

13. The computer chassis of claim 1, wherein the functional modules include HDMI and DisplayPort modules, each comprising a holder and a male-to-male adapter, configured to route the graphics card output to the front of the case for ease of access specially for people who do a lot of monitor testing.

14. The computer chassis of claim 1, wherein the cutouts (118, 119) are configured to support mesh modules designed to cover the cutouts, preventing accidental contact with internal fans.AMENDED SHEET (ARTICLE 19)STATEMENT UNDER ARTICLE 19 (1)I confirm that these amendments comply with PCT Article 19 and respectfully request that they be included in the international publication. If you require any further information or clarification regarding these amendments, please do not hesitate to contact me.

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