Temperature adjustment device

Abstract

This temperature adjustment device comprises: a flow passage block 40 provided on a front surface and a rear surface and having flow passage grooves through which a fluid flows; a pair of heat transfer plates 11 facing the flow passage grooves 42 provided in the flow passage block 40; a heat transfer chamber 20 formed between the flow passage block 40 and the heat transfer plates 11; a fluid supply port 43 disposed in an outer peripheral part of the heat transfer chamber 20; and a fluid discharge port 44 disposed in the outer peripheral part of the heat transfer chamber. The heat transfer chamber is formed in a circular shape. The fluid supply port 43 and the fluid discharge port 44 are disposed apart from each other in a radial direction across a center part of the heat transfer chamber 20. A plurality of the flow passage grooves 42 are formed so as to connect the fluid supply port 43 and the fluid discharge port 44.

Description

Temperature control device

[0001] The present invention relates to a temperature adjustment device.

[0002] Patent Documents 1 and 2 disclose a fluid temperature control device that heats or cools a treatment liquid using a thermoelectric module and a fluid temperature control device that heats a treatment liquid using a heater. These fluid temperature control devices include a flow path block having a flow path groove formed therein, a heat transfer plate that is installed in the flow path block to form a flow path, and a temperature control means that heats or cools the heat transfer plate, and heat is exchanged between the temperature control means and the treatment liquid passing through the flow path via the heat transfer plate.

[0003] As shown in Patent Document 3, a cooling structure is disclosed for use in cooling electronic devices, power electronic devices, and the like, in which zigzag projections are provided on the back side of a heat transfer surface.

[0004] JP 2008-186913 A JP 2003-338489 A JP 2006-100293 A

[0005] The flow path shape of Patent Document 1 has a flow path outlet located in the center of the heat transfer chamber, making it difficult for air to escape from the flow path, and therefore requires a large flow rate of chemical liquid. This makes it difficult to control the temperature of a low flow rate of chemical liquid. Furthermore, the need for a large flow rate of chemical liquid tends to result in large pressure losses. This requires a more powerful pump, which increases the cost of the pump and the required power.

[0006] The flow channel shape of Patent Document 2 is such that the flow channel is formed widely on the surface of the main body block, and therefore the flow rate of the chemical solution is extremely slow, which tends to deteriorate heat transfer, and this may result in a decrease in heating or cooling capacity.

[0007] In the flow path shape of Patent Document 3, the flow repeatedly meanders inside the flow path, which tends to increase pressure loss.

[0008] An object of an aspect of the present invention is to achieve an improvement in the temperature adjustment capability for a fluid to be temperature adjusted and a reduction in pressure loss at a low flow rate.

[0009] According to one aspect of the present invention, there is provided a temperature control device comprising: a flow path block having flow path grooves on its front and back surfaces through which a fluid flows; a pair of heat transfer plates facing the flow path grooves provided in the flow path block; a heat transfer chamber formed between the flow path block and the heat transfer plates; a fluid supply port arranged on the outer periphery of the heat transfer chamber; and a fluid discharge port arranged on the outer periphery of the heat transfer chamber, wherein the heat transfer chamber is formed in a circular shape, the fluid supply port and the fluid discharge port are arranged radially spaced apart on either side of the center of the heat transfer chamber, and a plurality of the flow path grooves are formed connecting the fluid supply port and the fluid discharge port.

[0010] According to the aspects of the present invention, it is possible to improve the temperature adjustment capability for the fluid to be temperature adjusted and reduce pressure loss at a low flow rate.

[0011] FIG. 1 is a schematic diagram showing an example of a cleaning system according to an embodiment. FIG. 2 is a schematic side view showing an example of a temperature control device according to an embodiment. FIG. 3 is an enlarged cross-sectional view of a portion of a thermoelectric module plate according to an embodiment. FIG. 4 is a perspective view showing an example of a flow path block and a heat transfer plate which are the main body of a temperature control device according to an embodiment. FIG. 5 is a cross-sectional view showing an example of a flow path block and a heat transfer plate which are the main body of a temperature control device according to an embodiment. FIG. 6 is a partially enlarged view of an example of a flow path of a temperature control device according to an embodiment. FIG. 7 is a plan view showing an example of a flow path block which is a temperature control device according to an embodiment. FIG. 8 is a cross-sectional view taken along the line A-A in FIG. 7. FIG. 9 is a cross-sectional view taken along the line C-C in FIG. 8. FIG. 10 is a partially enlarged view of a flow path. FIG. 11 is a graph showing the relationship between flow rate and thermal resistance. FIG. 12 is a graph showing the relationship between flow rate and pressure loss. FIG. 13 is a perspective view showing an example of a main body of a conventional temperature control device as a comparative example. FIG. 14 is a perspective view showing a modified example of the flow path block and the heat transfer plate which are the main body of a temperature control device according to an embodiment.

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The components of the embodiments described below can be combined as appropriate. In addition, some components may not be used.

[0013] In the following description, an XYZ Cartesian coordinate system is set, and the positional relationship of each part is described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis within a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis, which is orthogonal to the X axis within the predetermined plane, is defined as the Y-axis direction. The direction parallel to the Z axis, which is orthogonal to the predetermined plane, is defined as the Z-axis direction. The XY plane including the X and Y axes is parallel to the predetermined plane. The YZ plane including the Y and Z axes is orthogonal to the XY plane. The XZ plane including the X and Z axes is orthogonal to each of the XY and YZ planes. In the embodiment, the XY plane is parallel to the horizontal plane. The Z-axis direction is the vertical direction. The +Z direction (+Z side) is the upward direction (upper side). The -Z direction (-Z side) is the downward direction (lower side). Note that the XY plane may be inclined with respect to the horizontal plane.

[0014] [Embodiment] <Cleaning System> An embodiment will be described. Fig. 1 is a diagram schematically showing an example of a cleaning system 1 according to an embodiment. The cleaning system 1 uses a cleaning liquid LQ to clean a substrate W to be cleaned. The substrate W includes, for example, a semiconductor wafer. The liquid LQ is, for example, pure water or a chemical liquid. The chemical liquid is, for example, an ammonia hydrogen peroxide mixture, a hydrochloric acid hydrogen peroxide mixture, or a sulfuric acid hydrogen peroxide mixture.

[0015] The cleaning system 1 includes a storage tank 2, a temperature adjustment device 3, a substrate holding member 4, a nozzle 5, a first connecting pipe 6, a pump 7, and a second connecting pipe 8. The storage tank 2 stores the liquid LQ. The temperature adjustment device 3 adjusts the temperature of the liquid LQ supplied from the storage tank 2. The substrate holding member 4 holds a substrate W. The nozzle 5 supplies the liquid LQ, the temperature of which has been adjusted by the temperature adjustment device 3, to the substrate W. The first connecting pipe 6 connects the storage tank 2 and the temperature adjustment device 3. The pump 7 is disposed in the first connecting pipe 6. The second connecting pipe 8 connects the temperature adjustment device 3 and the nozzle 5. In the cleaning system 1 configured in this manner, when the pump 7 is driven, the liquid LQ stored in the storage tank 2 is supplied to the temperature adjustment device 3 via the first connecting pipe 6. The liquid LQ, the temperature of which has been adjusted by the temperature adjustment device 3, is supplied to the nozzle 5 via the second connecting pipe 8. The liquid LQ is supplied from the nozzle 5, and thereby the substrate W is cleaned.

[0016] 2 is a side view schematically illustrating an example of a temperature control device 3 according to an embodiment. As shown in FIG. 2, the temperature control device 3 includes a pair of heat transfer plates 11, a thermoelectric module plate 12, a pair of heat exchange plates 13, and a flow path block 40.

[0017] The space surrounded by the flow path block 40 (described later) and the heat transfer plate 11 is a heat transfer chamber 20 through which the liquid LQ flows. The heat transfer chamber 20 is formed between the flow path block 40 and the heat transfer plate 11. The heat transfer chamber 20 is formed on each of the front surface 40A and the back surface 40B of the flow path block 40. The heat transfer chamber 20 is formed in a circular shape when viewed in the Z-axis direction.

[0018] The heat transfer chamber 20, which is a flow path for the liquid LQ, is connected to a supply pipe 21 and a discharge pipe 22. The supply pipe 21 and the discharge pipe 22 are made of PTFE (PTFE: polytetrafluoroethylene) or PFA (perfluoroalkoxy alkane). The liquid LQ supplied to the heat transfer chamber 20 flows through the supply pipe 21 and is discharged to the discharge pipe 22. The supply pipe 21 is connected to the storage tank 2 via a first connecting pipe 6. The supply pipe 21 supplies the liquid LQ from the storage tank 2 to the heat transfer chamber 20. The discharge pipe 22 is connected to the nozzle 5 via a second connecting pipe 8. The liquid LQ, whose temperature has been adjusted by the temperature adjustment device 3, is supplied to the nozzle 5 via the discharge pipe 22.

[0019] Fig. 10 is a partial enlarged view of the flow path. As shown in Fig. 10, in this embodiment, the heat transfer chamber 20 includes a flat portion 20B where the distance between the flow path block 40 and the heat transfer plate 11 is narrow, and a recessed portion 20A where the distance between the flow path block 40 and the heat transfer plate 11 is wider than the flat portion 20B. The recessed portion 20A is formed between the flow path groove 42 and the heat transfer plate 11. By including the recessed portion 20A and the flat portion 20B in the heat transfer chamber 20, deep and shallow portions are formed in the flow path. This configuration causes turbulent flow in the fluid flowing through the flow path. The hydraulic diameter of the flow path at the deep recessed portion 20A is calculated by (area of ​​the portion surrounded by the dashed line in Fig. 10 × 4) / (length of the dashed line).

[0020] The heat transfer plates 11 exchange heat with the liquid LQ flowing through the heat transfer chamber 20 via the corrosion-resistant plates 11P. The heat transfer plates 11 are connected to the front surface 40A and the back surface 40B of the flow path block 40 via the corrosion-resistant plates 11P. The heat transfer plates 11 include one heat transfer plate 11 facing the front surface 40A of the flow path block 40, and the other heat transfer plate 11 facing the back surface 40B of the flow path block 40. The heat transfer plates 11 face the flow path grooves 42 provided in the flow path block 40. The heat transfer plates 11 are made of, for example, aluminum.

[0021] The corrosion-resistant plate 11P includes, for example, amorphous carbon. The corrosion-resistant plate 11P has corrosion resistance against the acidic or alkaline liquid LQ. The corrosion-resistant plate 11P has thermal conductivity.

[0022] The thermoelectric module plate 12 absorbs or generates heat to adjust the temperature of the liquid LQ flowing through the heat transfer chamber 20. The thermoelectric module plate 12 is connected to each of the one heat transfer plate 11 and the other heat transfer plate 11. The thermoelectric module plate 12 includes one thermoelectric module plate 12 connected to the upper surface of one heat transfer plate 11, and the other thermoelectric module plate 12 connected to the lower surface of the other heat transfer plate 11.

[0023] Fig. 3 is an enlarged cross-sectional view of a portion of the thermoelectric module plate 12 according to the embodiment. As shown in Fig. 3, the thermoelectric module plate 12 has a plurality of thermoelectric modules 30 and a case 31. The case 31 houses the plurality of thermoelectric modules 30. The case 31 is made of an insulating material.

[0024] The thermoelectric module 30 absorbs or generates heat when supplied with electric power. The thermoelectric module 30 absorbs or generates heat due to the Peltier effect. The thermoelectric module 30 absorbs heat from the liquid LQ flowing through the heat transfer chamber 20 via the heat transfer plate 11, and provides heat to the liquid LQ flowing through the heat transfer chamber 20. The thermoelectric module 30 adjusts the temperature of the liquid LQ flowing through the heat transfer chamber 20 by absorbing or generating heat.

[0025] The thermoelectric module 30 has thermoelectric semiconductor elements 32, a first electrode 33, and a second electrode 34. The thermoelectric semiconductor elements 32 include p-type thermoelectric semiconductor elements 32P and n-type thermoelectric semiconductor elements 32N. The p-type thermoelectric semiconductor elements 32P and the n-type thermoelectric semiconductor elements 32N are alternately arranged in the XY plane. The first electrode 33 is connected to each of the p-type thermoelectric semiconductor elements 32P and the n-type thermoelectric semiconductor elements 32N. The second electrode 34 is connected to each of the p-type thermoelectric semiconductor elements 32P and the n-type thermoelectric semiconductor elements 32N. The first electrode 33 is adjacent to the heat transfer plate 11. The second electrode 34 is adjacent to the heat exchange plate 13. One end surface of the p-type thermoelectric semiconductor element 32P and one end surface of the n-type thermoelectric semiconductor element 32N are each connected to the first electrode 33. The other end surface of the p-type thermoelectric semiconductor element 32P and the other end surface of the n-type thermoelectric semiconductor element 32N are each connected to a second electrode 34.

[0026] When a potential difference is applied between the first electrode 33 and the second electrode 34, charges move in the thermoelectric semiconductor element 32. The movement of charges causes heat to move in the thermoelectric semiconductor element 32. As a result, the thermoelectric module 30 absorbs or generates heat. For example, when a potential difference is applied between the first electrode 33 and the second electrode 34 so that the first electrode 33 generates heat and the second electrode 34 absorbs heat, the liquid LQ flowing through the heat transfer chamber 20 is heated. When a potential difference is applied between the first electrode 33 and the second electrode 34 so that the first electrode 33 absorbs heat and the second electrode 34 generates heat, the liquid LQ flowing through the heat transfer chamber 20 is cooled.

[0027] The heat exchange plate 13 exchanges heat with the thermoelectric module plate 12. The heat exchange plate 13 is connected to each of the first and second thermoelectric module plates 12. The heat exchange plate 13 includes one heat exchange plate 13 connected to the upper surface of one thermoelectric module plate 12 and the other heat exchange plate 13 connected to the lower surface of the other thermoelectric module plate 12. The heat exchange plate 13 has an internal flow path (not shown) through which a temperature-controlling fluid flows. The temperature-controlling fluid is temperature-controlled by a fluid temperature control device (not shown) and then flows into the internal flow path from an inlet of the internal flow path. The temperature-controlling fluid flows through the internal flow path, removing heat from and providing heat to the heat exchange plate 13. The temperature-controlling fluid flows out from an outlet of the internal flow path and is returned to the fluid temperature control device.

[0028] In the embodiment, each of the flow path block 40, the heat transfer plate 11, the thermoelectric module plate 12, and the heat exchange plate 13 is substantially disk-shaped. In the following description, an imaginary axis that passes through the center of each of the flow path block 40, the heat transfer plate 11, the thermoelectric module plate 12, and the heat exchange plate 13 and is parallel to the Z axis will be referred to as the central axis AX, as appropriate.

[0029] <Flow path block> Fig. 4 is a perspective view showing an example of a flow path block and a heat transfer plate which are the main body of a temperature adjustment device according to an embodiment. Fig. 5 is a cross-sectional view showing an example of a flow path block and a heat transfer plate which are the main body of a temperature adjustment device according to an embodiment. Fig. 6 is a partially enlarged view of an example of a flow path of a temperature adjustment device according to an embodiment. Fig. 7 is a plan view showing an example of a flow path block which is a temperature adjustment device according to an embodiment. Fig. 8 is a cross-sectional view taken along line A-A in Fig. 7. Fig. 9 is a cross-sectional view taken along line C-C in Fig. 8.

[0030] The flow path block 40 is made of, for example, polytetrafluoroethylene (PTFE), perfluoroalkoxy alkane (PFA), or polyvinylidene difluoride (PVDF).

[0031] The flow path block 40 has a front surface 40A and a back surface 40B. The flow path block 40 is sandwiched between a pair of heat transfer plates 11. The pair of heat transfer plates 11 and the flow path block 40 are fixed together by bolts and nuts, which are fastening members not shown.

[0032] The flow path block 40 has flow path grooves 42 provided on the front surface 40A and the back surface 40B. The flow path grooves 42 are provided on the front surface 40A and the back surface 40B of the flow path block 40. A plurality of flow path grooves 42 are formed, connecting fluid supply ports 43 and fluid discharge ports 44.

[0033] The flow path groove 42 of the embodiment will be described. The shape of the flow path groove 42 affects the action and effect of the heat transfer chamber 20. The embodiment is required to achieve an improvement in the temperature adjustment capability for the temperature-adjusted fluid and a reduction in pressure loss at a low flow rate of the fluid LQ, and therefore the configuration of the flow path groove 42 and its surroundings to achieve these will be examined.

[0034] In order to enable the temperature adjustment device 3 to be used at a low flow rate, it is necessary to ensure that the air inside the heat transfer chamber 20, which is the flow path for the fluid LQ, is smoothly discharged. For this reason, it is desirable that the flow path from the fluid supply port 43 to the fluid discharge port 44 is connected in a straight line or an arc shape without being interrupted or spiraling along the way.

[0035] Heat transfer in a channel is better when the flow state in the channel is turbulent than when it is laminar. The flow state in a channel is determined by the Reynolds number, which is calculated by Re = UD / ν. U is the average velocity of the fluid. ν is the kinematic viscosity. D is the hydraulic diameter of the channel, calculated by D = 4A / Pwet. A is the cross-sectional area of ​​the channel. Pwet is the wetted perimeter of the channel. Pwet is, for example, the length of the wall in contact with the fluid in the cross section of the channel taken along a plane perpendicular to the flow. The flow state in a channel is laminar when Re < 2300, and turbulent when Re > 2300.

[0036] In flows with low Reynolds numbers, the flow transitions to laminar flow through the entrance region. It is known that high heat transfer occurs in the very short distance of the entrance region before the transition to laminar flow.

[0037] In order to improve heat transfer while preventing bubbles from remaining in the heat transfer chamber 20, it is conceivable to increase the flow velocity and improve heat transfer by decreasing the depth of the flow path. However, when the depth of the flow path is shallow, pressure loss increases.

[0038] Furthermore, when the flow rate of the liquid LQ is low, the Reynolds number does not increase even if the depth of the flow path is made shallower. For this reason, the flow does not transition to a turbulent flow, and it is difficult to obtain sufficient heat transfer.

[0039] The configuration of the flow channel grooves 42 and the convex portions 41 will be described using Figure 6. The flow channel block 40 is provided with the flow channel grooves 42 and the convex portions 41. In this embodiment, the flow channel grooves 42 are separated from one another by the convex portions 41. In this embodiment, the convex portions 41 do not come into contact with the heat transfer plate 11 when the flow channel block 40 is assembled with the heat transfer plate 11 sandwiched between them. The flow channel grooves 42 provide good heat transfer as turbulence, while the convex portions 41 make the flow channel extremely thin. These features improve heat transfer.

[0040] In this embodiment, the flow channel 42 is formed linearly at the center of the heat transfer chamber 20, and is formed into an arc shape that curves more significantly as it moves away from the center. The flow channel 42 is formed into an arc shape that curves more significantly as it moves away from the straight line connecting the fluid supply port 43 and the fluid discharge port 44. The flow channel 42 is formed smoothly without being interrupted or spiraling. The plurality of flow channel 42 are arranged in a striped pattern.

[0041] In the embodiment, the heat transfer chamber 20 has a supply-side reservoir 20C formed downstream of the fluid supply port 43, and a discharge-side reservoir 20D formed upstream of the fluid discharge port 44. The supply-side reservoir 20C allows the fluid LQ supplied from the fluid supply port 43 to be smoothly diffused throughout the entire heat transfer chamber 20 defined by the convex portions 41, the flow path grooves 42, and the heat transfer plate 11. The discharge-side reservoir 20D allows the fluid LQ to be smoothly discharged to the fluid discharge port 44 from the entire heat transfer chamber 20 defined by the convex portions 41, the flow path grooves 42, and the heat transfer plate 11.

[0042] The heat transfer plate 11 faces the flow channel grooves 42 and the protrusions 41. With the heat transfer plate 11 facing the flow channel grooves 42 and the protrusions 41, the peripheral edges of the front surface 40A and the back surface 40B come into contact with the heat transfer plate 11. The flow channel grooves 42 are covered with the heat transfer plate 11, and the peripheral edges of the front surface 40A and the back surface 40B come into contact with the heat transfer plate 11, thereby forming the heat transfer chamber 20.

[0043] The flow path block 40 has a fluid supply port 43 and a fluid discharge port 44. The fluid supply port 43 supplies the liquid LQ to the flow path groove 42. The fluid supply port 43 is arranged on the outer periphery of the heat transfer chamber 20. The fluid discharge port 44 discharges at least a portion of the liquid LQ from the flow path groove 42. The fluid discharge port 44 is arranged on the outer periphery of the heat transfer chamber 20. The fluid supply port 43 and the fluid discharge port 44 are arranged to be spaced apart in the radial direction, with the center of the heat transfer chamber 20 in between. The flow path groove 42 is formed by connecting the fluid supply port 43 and the fluid discharge port 44.

[0044] The flow path block 40 has a plurality of holes (not shown) penetrating through it in the thickness direction, through which bolts and nuts are inserted.

[0045] The flow path block 40 is connected to a supply pipe 21 and a discharge pipe 22. The liquid LQ that is supplied to the flow path groove 42 flows through the supply pipe 21. At least a portion of the supply pipe 21 is disposed in the flow path block 40.

[0046] The liquid LQ discharged from the flow path groove 42 flows through the discharge pipe 22. At least a portion of the discharge pipe 22 is disposed in the flow path block 40.

[0047] A seal groove 48 in which a seal member 47 is disposed is provided around the flow path groove 42. The seal groove 48 is provided on the front surface 40A and the back surface 40B of the flow path block 40. The seal member 47 includes, for example, an O-ring. When disposed in the seal groove 48, the seal member 47 comes into contact with the heat transfer plate 11 facing the flow path groove 42. The seal member 47 is pressed against the heat transfer plate 11 and crushed when the pair of heat transfer plates 11 and the flow path block 40 are fastened together with bolts and nuts. In this way, the seal member 47 seals the boundaries between the front surface 40A and the back surface 40B of the flow path block 40 and the heat transfer plate 11.

[0048] The sealing member 47 is required to be able to withstand high pressure because the temperature adjustment device 3 is installed on the floor below where the liquid LQ is used, and a filter is installed downstream of the temperature adjustment device 3. By making the sealing member 47 circular, the pressing pressure applied to the sealing surface by the liquid LQ can be received evenly, improving the sealing performance.

[0049] <Operation> Next, the operation of the temperature adjustment device 3 according to this embodiment will be described. The liquid LQ is supplied to the heat transfer chamber 20 via the supply pipe 21 and the fluid supply port 43. The liquid LQ is guided by the recessed portion 20A of the heat transfer chamber 20, and flows toward the fluid discharge port 44. The liquid LQ also flows toward the fluid discharge port 44 in the flat portion 20B of the heat transfer chamber 20, guided by the flow of the fluid LQ flowing through the recessed portion 20A. In this way, the liquid LQ supplied from the fluid supply port 43 to the flow path groove 42 flows through the heat transfer chamber 40, and is discharged from the fluid discharge port 44.

[0050] By applying a potential difference to the thermoelectric module 30, the temperature adjustment device 3 starts adjusting the temperature of the liquid LQ flowing through the flow path groove 42. The temperature of the liquid LQ flowing through the flow path groove 42 is adjusted by the heat absorption or heat generation of the thermoelectric module 30.

[0051] In the heat transfer chamber 20, the convex portions 41 have high resistance, and therefore much of the liquid LQ flows through the flow path grooves 42. Much of the flow concentrates in the concave portions 20A of the heat transfer chamber 20. The flow path grooves 42 can have a large hydraulic diameter. In the concave portions 20A of the heat transfer chamber 20, the flow becomes faster and is more likely to become turbulent, thereby improving heat transfer.

[0052] The flow path is shallow and laminar in the flat portion 20B of the heat transfer chamber 20. In the flat portion 20B of the heat transfer chamber 20, the proportion of the fluid that contributes to heat transfer is increased, and heat transfer is improved.

[0053] In the recessed portion 20A of the heat transfer chamber 20, the fluid flows along the flow path grooves 42. In the flat portion 20B of the heat transfer chamber 20, the fluid flows so as to spread throughout the entire heat transfer chamber 20. Because the shape of the heat transfer chamber 20 is circular, the flow in the flat portion 20B and the flow in the recessed portion 20A intersect with each other. This generates a swirling flow, making the flow more likely to become turbulent.

[0054] As described above, the heat transfer chamber 20 has a recessed portion 20A and a flat portion 20B, so even if the flow rate is low and would result in laminar flow in a flow path of uniform depth, there will be areas where the flow path will become turbulent because there are deep and shallow areas.

[0055] In the heat transfer chamber 20, the fluid supply port 43 and the fluid discharge port 44 are smoothly connected without any interruption, which prevents an increase in pressure loss. In the convex portion 41, LQ becomes a laminar flow, but the depth of the flow path is thin. This results in better heat transfer than a flow path with a uniform depth.

[0056] 11 to 13, the measurement results of the thermal resistance and pressure loss of the flow path for an example of the embodiment and a comparative example having a conventional configuration will be described. FIG. 11 is a diagram showing the relationship between flow rate and thermal resistance. FIG. 12 is a diagram showing the relationship between flow rate and pressure loss. FIG. 13 is a perspective view schematically showing an example of the main body of a conventional temperature control device, which is a comparative example. In FIGS. 11 and 12, Example (1) shows the embodiment, and the comparative example shows the conventional temperature control device shown in FIG. 13.

[0057] 13, components with the same reference numerals as those in the embodiment are the same components as those in the embodiment. In the main body 10 of the conventional temperature control device, the heat transfer chamber 20, which is the flow path, is formed in a spiral shape. The fluid supply port 43 is disposed on the outer periphery of the main body 10, and the fluid discharge port 44 is disposed in the center of the main body 10.

[0058] 11, in both Example (1) and the Comparative Example, the lower the thermal resistance, the better the heat transfer of the flow path. It can be seen that the flow path of Example (1) has heat transfer that is comparable to that of the flow path of the Comparative Example.

[0059] 12, it can be seen that the flow path of Example (1) has a lower pressure loss than the comparative example. No air bubbles remained inside the flow path of Example (1).

[0060] <Effects> As described above, in the embodiment, the heat transfer chamber 20 is formed in a circular shape. In the embodiment, the fluid supply port 43 and the fluid discharge port 44 are arranged at a radial distance from each other across the center of the heat transfer chamber 20. In the embodiment, a plurality of flow path grooves 42 are formed, connecting the fluid supply ports 43 and the fluid discharge ports 44. In the embodiment, in the heat transfer chamber 20, the fluid supply ports 43 and the fluid discharge ports 44 are smoothly connected without being interrupted midway or forming a spiral. This makes it possible to suppress an increase in pressure loss. As such, according to the embodiment, it is possible to achieve improved temperature control capability for the temperature-controlled fluid and reduced pressure loss at a low flow rate.

[0061] In the embodiment, the flow path block 40 includes the flow path grooves 42 and the protrusions 41, so that the heat transfer chamber 20 includes the recesses 20A and the flat portions 20B. The embodiment including such a heat transfer chamber 20 can achieve the following effects.

[0062] In the embodiment, in the heat transfer chamber 20, the resistance of the convex portions 41 is large, and therefore, more of the liquid LQ flows along the flow path grooves 42 in the concave portions 20A than in the flat portions 20B. In the embodiment, much of the flow concentrates in the concave portions 20A of the heat transfer chamber 20. In the embodiment, the flow path grooves 42 can have a large hydraulic diameter. According to the embodiment, the flow is faster in the concave portions 20A of the heat transfer chamber 20, and is more likely to become turbulent, thereby improving heat transfer.

[0063] In the embodiment, the flat portion 20B of the heat transfer chamber 20 has a shallow flow path and a laminar flow. According to the embodiment, the flat portion 20B of the heat transfer chamber 20 has a larger proportion of fluid that contributes to heat transfer, thereby improving heat transfer. As a result, according to the embodiment, better heat transfer can be obtained than with a flow path of uniform depth.

[0064] In the embodiment, in the recessed portion 20A of the heat transfer chamber 20, the fluid flows along the flow channel grooves 42. In the embodiment, in the flat portion 20B of the heat transfer chamber 20, the fluid flows so as to spread throughout the entire heat transfer chamber 20. In the embodiment, because the shape of the heat transfer chamber 20 is circular, the flow in the flat portion 20B and the flow in the recessed portion 20A intersect with each other. This generates a swirling flow in the embodiment, making it easier to generate turbulent flow.

[0065] As described above, in this embodiment, the heat transfer chamber 20 includes the recessed portion 20A and the flat portion 20B. According to this embodiment, even at a flow rate where the flow velocity is low and would result in laminar flow in a flow path of uniform depth, turbulent flow can be generated because the flow path has deep and shallow portions. According to this embodiment, the recessed portion 20A of the heat transfer chamber 20 provides good heat transfer as turbulent flow, while the flat portion 20B allows the flow path to be extremely thin. As a result, this embodiment can improve heat transfer.

[0066] In the embodiment, the flow path grooves 42 are formed linearly in the center of the heat transfer chamber 20, and are formed in arc shapes that curve more significantly as they move away from the center. According to the embodiment, striped flow paths can be appropriately formed throughout the entire circular heat transfer chamber 20. In the embodiment, the fluid supply ports 43 and the fluid discharge ports 44 can be smoothly connected without being interrupted midway or forming a spiral.

[0067] In the embodiment, the heat transfer chamber 20 has a supply-side reservoir 20C formed downstream of the fluid supply port 43, and a discharge-side reservoir 20D formed upstream of the fluid discharge port 44. According to the embodiment, the supply-side reservoir 20C allows the fluid LQ supplied from the fluid supply port 43 to be smoothly diffused throughout the heat transfer chamber 20. According to the embodiment, the discharge-side reservoir 20D allows the fluid LQ to be smoothly discharged from the entire heat transfer chamber 20 to the fluid discharge port 44.

[0068] <Modification> A modification of the embodiment will be described using FIG. 14 . FIG. 14 is a perspective view showing a modification of the flow path block and heat transfer plate, which are the main body of the temperature control device according to the embodiment. As shown in FIG. 14 , the flow path block 40 of the temperature control device 3 may be arranged so that the supply pipe 21 is located on the lower side in the Z-axis direction and the discharge pipe 22 is located on the upper side in the Z-axis direction. The temperature control device 3 shown in FIG. 14 is the temperature control device shown in FIG. 4 rotated 90° around the X-axis in FIG. 4 . In this modification, the fluid supply port 43 is located on the lower side in the Z-axis direction and the fluid discharge port 44 is located on the upper side in the Z-axis direction. The flow path from the fluid supply port 43 to the fluid discharge port 44 is connected in a straight or arc shape without being interrupted or spiraling from the lower side to the upper side in the Z-axis direction. This allows the air inside the heat transfer chamber 20, which is the flow path of the fluid LQ, to be more smoothly discharged from the discharge pipe 22, which is located on the upper side. This allows the temperature control device 3 to be used at a low flow rate.

[0069] Other Embodiments In the above-described embodiment, the temperature adjustment device 3 uses a thermoelectric module to adjust the temperature of the liquid LQ flowing through the heat transfer chamber 20, but this is not limiting. For example, a heater may be built into the heat transfer plate 11 to adjust the temperature of the liquid LQ flowing through the heat transfer chamber 20.

[0070] In the above-described embodiment, the temperature adjustment device 3 adjusts the temperature of the liquid LQ. The temperature adjustment device 3 may adjust the temperature of a gas. By supplying a gas to the flow path groove 42, the temperature adjustment device 3 can adjust the temperature of the gas flowing through the flow path groove 42 using the thermoelectric semiconductor element 32.

[0071] 1... cleaning system, 2... storage tank, 3... temperature control device, 4... substrate holding member, 5... nozzle, 6... first connecting pipe, 7... pump, 8... second connecting pipe, 11... heat transfer plate, 11P... corrosion-resistant plate, 12... thermoelectric module plate, 13... heat exchange plate, 20... heat transfer chamber, 20A... recess, 20B... flat portion, 21... supply pipe, 22... discharge pipe, 30... thermoelectric module, 31... case, 32... thermoelectric semiconductor element, 32P... p-type thermoelectric semiconductor element, 32N... n-type thermoelectric semiconductor element, 33... first electrode, 34... second electrode, 40... flow path block, 40A... front surface, 40B... back surface, 41... convex portion, 42... flow path groove, 43... fluid supply port, 44... fluid discharge port, 47... sealing member, 48... seal groove, LQ... liquid, W... substrate.

Claims

1. A temperature control device comprising: a flow path block having flow grooves provided on its front and back surfaces, through which a fluid flows; a pair of heat transfer plates facing the flow grooves provided in the flow path block; a heat transfer chamber formed between the flow path block and the heat transfer plates; a fluid supply port arranged on the outer periphery of the heat transfer chamber; and a fluid discharge port arranged on the outer periphery of the heat transfer chamber, wherein the heat transfer chamber is formed in a circular shape, the fluid supply port and the fluid discharge port are arranged to be radially spaced apart on either side of the center of the heat transfer chamber, and a plurality of the flow grooves are formed, connecting the fluid supply port and the fluid discharge port.

2. The temperature control device according to claim 1, wherein the flow passage groove is formed in a straight line in the center of the heat transfer chamber, and is formed in an arc shape that curves more significantly as it moves away from the center.

3. A temperature control device as described in claim 1 or 2, wherein the heat transfer chamber comprises a flat portion where the gap between the flow path block and the heat transfer plate is narrow, and a recessed portion where the gap between the flow path block and the heat transfer plate is wider than the flat portion, and the recessed portion is formed between the flow path groove and the heat transfer plate.

4. A temperature control device according to claim 1 or 2, wherein the heat transfer chamber has a supply-side reservoir formed downstream of the fluid supply port and a discharge-side reservoir formed upstream of the fluid discharge port.

5. The temperature control device according to claim 1 or 2, wherein the fluid supply port is positioned on a lower side in the vertical direction, and the fluid discharge port is positioned on an upper side in the vertical direction.

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