Quantum structure color converter

Abstract

A display is provided. The display comprises a first light source configured to generate light having a first wavelength. The display also comprises a first plurality of quantum structures, and the first plurality of quantum structures are configured to receive the light having the first wavelength from the first light source and convert the light having the first wavelength to a first output wavelength. The display also comprises a first color filter. The first color filter is separated from the first plurality of quantum structures by an air gap. The air gap is defined by a first distance between the first color filter and the first plurality of quantum structures. The first distance is greater than zero.

Description

QUANTUM STRUCTURE COLOR CONVERTERCROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 63 / 528169 filed on July 21, 2023, the content of which is relied upon and incorporated herein by reference in its entirety.FIELD

[0002] Embodiments relate generally to a display comprising quantum structures for converting light from one color to another.BACKGROUND

[0003] Emission from light emitting diodes (LEDs, including, e.g., organic light emitting diodes (OLEDs), miniLEDs, microLEDs, etc.) is omnidirectional as is re-emission from quantum structures. To maximize display brightness, there is a need to contain the light source and color converter within a reflective box that is open solely on the viewer side. If there is cover glass, maximizing brightness also requires that light is not guided in that glass by total internal reflection. Additionally, light guiding into glass frequently creates undesirable artifacts at the edge where light tends to leak.

[0004] Many proposed quantum dot color conversion designs have quantum structures contained by an absorbing box made of a thick black matrix. Such an approach avoids crosstalk between subpixels, but systems having a thick black matrix typically possess a relatively inefficient design.BRIEF SUMMARY

[0005] In various embodiments, displays are provided having quantum structures for converting light of a first wavelength from a light source to another output wavelength. Quantum structures may be provided in the form of quantum dots. A backplane component and a filter component are provided, and these components are positioned in unique ways that help provide further benefits. The filter component may comprise color filters therein, and the filter component and backplane component may be positioned such that an air gap is positioned between color filters and quantum structures. This air gap may prevent converted light from coupling into a filter glass substrate and being guided into glass, and the air gap also helps to prevent the formation of artifacts. The inclusion of the air gap helps to maintain the brightness and contrast of the display at a high level. Other schemes to avoid light guiding require the useof a highly refractive index material, but this highly refractive index material is difficult to acquire and / or very expensive. The use of air gaps provides an economical approach that improves the brightness and contrast of the display. The inclusion of air gaps may also help avoid light guiding in the cover glass.

[0006] Additionally, quantum structures may be positioned at a distance away from light sources, and this may be accomplished by positioning a transparent resin between a light source and a corresponding set of quantum structures. Spacing quantum structures apart from light sources may allow for improved beam expansion and lower flux density.

[0007] In some embodiments, all of the light sources within a display may be configured to emit light having the same color. For example, the light sources may each be configured to emit blue light when the light sources are provided in isolation. Quantum structures may be positioned relative to some of the light sources in order to change the color that is emitted by the display to a viewer for certain light sources. For example, quantum structures may convert blue light from the light sources to red light, green light, or light having other colors. Various embodiments using these quantum structures have increased brightness and contrast over other displays.

[0008] Instead of using a thick black matrix similar to what others have used, a white solder mask may be used to make the walls reflective so that displays are more efficient. White walls may be made thicker than black walls since the color black absorbs the light used to photolithographically pattern. Thicker walls may offer the potential to separate the light source from the color converter, and this may be particularly important with pseudo-point sources such as miniLEDs and microLEDs.

[0009] In an example embodiment, a display is provided. The display comprises a first light source configured to generate light having a first wavelength. The display also comprises a first plurality of quantum structures, and the first plurality of quantum structures are configured to receive the light having the first wavelength from the first light source and convert the light having the first wavelength to a first output wavelength. The display also comprises a first color filter. The first color filter is separated from the first plurality of quantum structures by an air gap. The air gap is defined by a first distance between the first color filter and the first plurality of quantum structures, with the first distance being greater than zero.

[0010] In some embodiments, the first plurality of quantum structures may be separated from the first light source by a second distance, and the second distance may be greater than zero. Additionally, in some embodiments, the display may also comprise resin that istransparent, the first plurality of quantum structures may be separated from the first light source, and the resin may be positioned between the first plurality of quantum structures and the first light source.

[0011] In some embodiments, the display may also include a first solder mask with an air gap positioned in the first solder mask, and the solder mask may be a color other than black. Furthermore, in some embodiments, the solder mask may be white. Additionally, in some embodiments, the display may also comprise a filter component comprising a first glass substrate, the first color filter, and the first solder mask. The display may comprise a first area in a first plane, the filter component may comprise a second area in a second plane parallel to the first plane, and the first area may be approximately the same as the second area. In some embodiments, the first solder mask may also comprise a first opening, the air gap may be positioned in the first opening, and the air gap may be positioned between the first color filter and the first plurality of quantum structures. Additionally, in some embodiments, the display may also comprise an adhesive, the first solder mask may comprise an adhesive opening, and the adhesive may be positioned in the adhesive opening. Furthermore, in some embodiments, the display may also comprise a second solder mask, and the second solder mask may be a color other than black. The second solder mask may comprise a first cavity, and the second solder mask may be positioned proximate to the first solder mask so that the first cavity aligns with the first opening. Also, in some embodiments, the display may comprise a backplane component comprising a second glass substrate, the first light source, the second solder mask, the resin, and the first plurality of quantum structures. The backplane component may comprise a third area, and the third area may be less than each of the first area and the second area. In some embodiments, the adhesive may be configured to adhere the filter component to the backplane component. Furthermore, in some embodiments, the first light source may be positioned proximate to the first cavity, the first plurality of quantum structures may be positioned proximate to the first cavity, and the resin may be positioned in the first cavity between the first light source and the first plurality of quantum structures. In some embodiments, the first plurality of quantum structures may have a thickness of about 10 microns or more. And the first cavity may have a thickness of about 50 microns or more.

[0012] In some embodiments, the display may also comprise a second light source configured to generate light having the first wavelength. The display may also comprise a second plurality of quantum structures, and the second plurality of quantum structures may beconfigured to receive the light from the second light source and convert the light to a second output wavelength. The display may also comprise a second color filter.

[0013] In some embodiments, the second color filter may be separated from the second plurality of quantum structures by the first distance, and the second plurality of quantum structures may be separated from the second light source by the second distance. The first solder mask may comprise a second opening, a second air gap may be positioned in the second opening, and the second air gap may be positioned between the second color filter and the second plurality of quantum structures. The second solder mask may comprise a second cavity, and the second solder mask may be positioned proximate to the first solder mask so that the second cavity aligns with the second opening.

[0014] In some embodiments, the display also comprises a second light source configured to generate light having the first wavelength, scattering material, and a second color filter. The second color filter may be configured to receive the light from the second light source, the scattering material may be configured to cause the light to scatter, and scattered light may have a second output wavelength that is approximately the same as the first wavelength. Additionally, in some embodiments, the display may also comprise a third light source configured to generate light having the first wavelength, a second plurality of quantum structures, and a third color filter. The second plurality of quantum structures may be configured to receive the light from the third light source and convert the light to a third output wavelength. Furthermore, in some embodiments, the first wavelength may be in a range of about 450 nanometers to about 495 nanometers. In some embodiments, the first output wavelength may be in a range of about 620 nanometers to about 750 nanometers and the third output wavelength may be in a range of about 495 nanometers to about 570 nanometers.

[0015] In another example embodiment, a display assembly is provided comprising a first light source, a first plurality of quantum structures, and a first color filter. The first light source is configured to generate light having a first wavelength. The first plurality of quantum structures are configured to receive the light having the first wavelength from the first light source and convert the light having the first wavelength to a first output wavelength. The first color filter is separated from the first plurality of quantum structures by an air gap, the air gap is defined by a first distance between the first color filter and the first plurality of quantum structures, and the first distance is greater than zero.

[0016] In another example embodiment, a method of manufacturing a display is provided. The method comprises providing an initial filter component, positioning a first solder mask onthe initial filter component to form a filter component, and providing a backplane glass substrate having a light source included thereon. The method also comprises positioning a second solder mask relative to the backplane glass substrate, with the second solder mask defining a cavity and the light source is positioned proximate to the cavity. The method also comprises positioning a set of quantum structures in the cavity and attaching the filter component to a backplane component, with the backplane component comprising the backplane glass substrate, the light source, the second solder mask, and the set of quantum structures. In some embodiments, the method also comprises at least partially filling a cavity of the second solder mask with resin.

[0017] In another example embodiment, a display is provided that is made by a particular process. The process comprises providing an initial filter component, positioning a first solder mask on the initial filter component to form a filter component, and providing a backplane glass substrate having a light source included thereon. The process also comprises positioning a second solder mask relative to the backplane glass substrate, with the second solder mask defining a cavity and the light source being positioned proximate to the cavity. The process also comprises positioning a set of quantum structures in the cavity and attaching the filter component to a backplane component, with the backplane component comprising the backplane glass substrate, the light source, the second solder mask, and the set of quantum structures.

[0018] In another example embodiment, a display is provided. The display comprises a first light source and a first plurality of quantum structures. The first light source is configured to generate light having a first wavelength. The first plurality of quantum structures are configured to receive the light from the first light source and convert the light to a first output wavelength. The first plurality of quantum structures are separated from the first light source by a distance that is greater than zero. Additionally, in some embodiments, the display may also comprise a solder mask and resin. The solder mask may be a color other than black. The solder mask may comprise a first cavity, and the first light source may be positioned proximate to the first cavity. Additionally, the first plurality of quantum structures may be positioned proximate to the first cavity, and the resin may be positioned in the first cavity between the first light source and the first plurality of quantum structuresBRIEF DESCRIPTION OF THE DRAWINGS

[0019] Having thus described the disclosure in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

[0020] FIG. 1A is a perspective view illustrating an example display comprising a backplane component and a filter component, in accordance with some embodiments discussed herein;

[0021] FIG. IB is an enhanced, perspective view illustrating the example backplane component and filter component of FIG. 1 A, in accordance with some embodiments discussed herein;

[0022] FIG. 1C is a side, perspective view illustrating an example display comprising multiple backplane components and a filter component, in accordance with some embodiments discussed herein;

[0023] FIG. 2A is a cross-sectional view illustrating the example display of FIG. 1 A when the backplane component and the filter component abut each other, in accordance with some embodiments discussed herein;

[0024] FIG. 2B is a cross-sectional view illustrating a portion of the example backplane component where quantum structures are positioned within a cavity, in accordance with some embodiments discussed herein;

[0025] FIG. 3 A is a perspective view illustrating an initial filter component, which includes example filter glass substrate, with a black matrix and color filters positioned on the filter glass substrate, in accordance with some embodiments discussed herein;

[0026] FIG. 3B is a top, enhanced view illustrating the color filters of FIG. 3A, in accordance with some embodiments discussed herein;

[0027] FIG. 4A is a perspective view illustrating an example filter component that may be formed by assembling a mask on the black matrix of FIG. 3A, in accordance with some embodiments discussed herein;

[0028] FIG. 4B is an enhanced, perspective view illustrating the filter component of FIG. 4A, in accordance with some embodiments discussed herein;

[0029] FIG. 5 is a perspective view illustrating an example backplane glass substrate of a backplane component, in accordance with some embodiments discussed herein;

[0030] FIG. 6A is a perspective view illustrating an example solder mask positioned on the backplane glass substrate of FIG. 5, in accordance with some embodiments discussed herein;

[0031] FIG. 6B is a enhanced, perspective view illustrating the solder mask of FIG. 6A where cavities within the solder mask may be seen, in accordance with some embodiments discussed herein;

[0032] FIG. 6C is a enhanced, perspective view illustrating quantum structures and scattering material in the cavities, in accordance with some embodiments discussed herein;

[0033] FIG. 7 is a flow chart illustrating an example method for manufacturing a display, in accordance with some embodiments discussed herein;

[0034] FIG. 8 is a flow chart illustrating an example method for manufacturing a filter component of a display, in accordance with some embodiments discussed herein; and

[0035] FIG. 9 is a flow chart illustrating an example method for manufacturing a backplane component of a display, in accordance with some embodiments discussed herein.DETAILED DESCRIPTION

[0036] Example embodiments of the present disclosure now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the disclosure are shown. Indeed, the disclosure may be embodied in many different forms and should not be construed as limited to the example embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference numerals generally refer to like elements throughout. Additionally, any connections or attachments may be direct or indirect connections or attachments unless specifically noted otherwise. The term “approximately”, as used herein accounts for differences due to engineering and manufacturing tolerances.

[0037] FIG. 1A is a perspective view illustrating an example display 100 comprising a backplane component 102 and a filter component 104. The backplane component 102 defines a side 102 A, and the filter component 104 defines a side 104 A. The filter component 104 and the backplane component 102 are oriented so that the side 102 A of the backplane component 102 and the side 104 A of the filter component 104 face each other. The side 102 A of the backplane component 102 may define a first dimension DI and a second dimension D2. The first dimension DI of the backplane component 102 extends in a direction parallel to the Z- axis in FIG. 1A, and the second dimension D2 of the backplane component 102 extends in a direction parallel to the X-axis in FIG. 1 A. Additionally, the side 104A of the filter component 104 may define a first dimension D3 and a second dimension D4. The first dimension D3 of the filter component 104 extends in a direction parallel to the Z-axis in FIG. 1 A, and the second dimension D4 of the filter component 104 extends in a direction parallel to the X-axis in FIG. 1A. The filter component 104 may match the size of an overall display so that the first dimension D3 and the second dimension D4 are equal to the dimensions used for the overall display. In some embodiments, the backplane component 102 may be smaller in size relativeto the filter component 104 such that the first dimension DI of the backplane component 102 is smaller than the first dimension D3 of the filter component 104 and / or such that the second dimension D2 of the backplane component 102 is smaller than the second dimension D4 of the filter component 104.

[0038] Further details regarding the features in the backplane component 102 and the filter component 104 may be seen in the enhanced, perspective view of FIG. IB. In FIG. IB, the backplane component 102 is made semi-transparent so that features on the side 102A of the backplane component 102 may be seen. The backplane component 102 is illustrated in an elevated position over the filter component 104, but these components may be positioned and / or oriented differently in other embodiments. While a gap is illustrated between the side 102 A of the backplane component 102 and the side 104 A of the filter component 104, the backplane component 102 and the filter component 104 may be moved towards each other to eliminate this gap so that the two sides 102A, 104A come in contact with each other.

[0039] The backplane component 102 comprises various cavity sets, with each cavity set including a first cavity 106A, a second cavity 106B, and a third cavity 106C. The cavity sets are arranged in several rows and columns along the side 102 A of the backplane component 102. In the illustrated embodiment, each cavity set comprises three cavities, but this may not be the case in other embodiments. Furthermore, red quantum structures are positioned in the first cavity 106 A, green quantum structures are positioned in the second cavity 106B, and scattering material may be optionally positioned in the third cavity 106C. However, in some embodiments, the scattering material may be omitted from the third cavity 106C.

[0040] As discussed further herein, a light source may be positioned in each of the cavities 106 A, 106B, 106C. The light sources may be provided in the form of an LED such as an OLED, a miniLED, or a microLED, but other types of light sources may be used. In the illustrated embodiment, the light source is configured to generate blue light. The blue light may have a wavelength ranging from about 450 nanometers to about 495 nanometers. Thus, red quantum structures may be configured to convert the blue light from the light source to red light and the higher wavelength associated therewith, the green quantum structures may be configured to convert the blue light from the light source to green light and the higher wavelength associated therewith, and the scattering material may be configured to cause the blue light to scatter without causing any significant adjustment in the wavelength of the blue light. Red light may have a wavelength ranging from about 620 nanometers to about 750 nanometers, and green light may have a wavelength ranging from about 495 nanometers to about 570 nanometers.

[0041] The filter component 104 also comprises a plurality of air gap sets, with each air gap set including a first air gap 108 A, a second air gap 108B, and a third air gap 108C. The air gap sets are arranged in several rows and columns along the side 104 A of the filter component 104. In the illustrated embodiment, each air gap set comprises three air gaps, but this may not be the case in other embodiments. A first color filter 118A is positioned in the first air gap 108A, a second color filter 118B is positioned in the second air gap 108B, and a third color filter 118C is positioned in the third air gap 108C. The inclusion of an air gap between the quantum structures and color filters prevents converted light from coupling into the filter glass substrate 114 and being guided into glass. If this light guiding were to occur, this would potentially result in reduced brightness and the creation of artifacts with light leakage. Other schemes to avoid light guiding require the use of a highly refractive index material, but this highly refractive index material is difficult to acquire and / or very expensive. The use of air gaps provides an economical approach that improves the brightness and contrast of the display. In some embodiments, the “air gap” may be filled with air, insulation, transparent resin, vacuum, or the like.

[0042] The backplane component 102 may be positioned and oriented relative to the filter component 104 such that cavities in the backplane component 102 are aligned with air gaps in the filter component 104. For example, the backplane component 102 may be positioned and oriented relative to the filter component 104 such that the first cavity 106A is aligned with the first air gap 108 A, such that the second cavity 106B is aligned with the second air gap 108B, and such that the third cavity 106C is aligned with the third air gap 108C.

[0043] The filter component 104 also comprises a solder mask 120 at the side 104A. The solder mask 120 comprises an adhesive opening 110A, and adhesive 110 is positioned in the adhesive opening 110A. The adhesive may be a UV curable adhesive, such as 0.5% TPO dissolved in Hexanediol diacrylate (HDDA) monomer, frits sealing, or another suitable adhesive. Upon the side 102A of the backplane component 102 and the side 104A of the filter component 104 coming in contact, the adhesive 110 may assist in retaining the backplane component 102 and the filter component 104 in position relative to each other. Other cavity sets and air gap sets may be aligned in a similar manner.

[0044] As illustrated in FIG. 1C, backplane components 102, 102’ may be tiled within a display 100, and the filter component 104 may be positioned between the viewer 103 and the backplane components 102, 102’ so that the user is unable to see any seams formed between adjacent backplane components 102, 102’. Additionally, because the filter component 104 ispositioned between the viewer 103 and the backplane components 102, 102’, the backplane components 102, 102’ may be manufactured with more lenient manufacturing tolerances without the risk of making large seams between these backplane components 102, 102’ visible. While a first backplane component 102 and a second backplane component 102’ are illustrated in FIG. 1C, additional backplane components may be used to form the display 100. Only two backplane components 102, 102’ are tiled in a direction parallel to the Z-axis in FIG. 1C, but a different number of backplane components may be tiled in this direction in other embodiments. In some embodiments, additional backplane components may be tiled in a direction parallel to the X-axis in FIG. 1C, with this X-axis extending into and out of the page in FIG. 1C. In the illustrated embodiment of FIG. 1C, only one filter component 104 is included, and there is no tiling of multiple filter components along directions parallel to the X-axis or the Z-axis. However, in other embodiments, additional filter components may be included and these filter components may be tiled similar to the tiling approach used for backplane components.

[0045] Further details regarding the backplane component 102 and the filter component 104 may be seen in the cross-sectional view of FIG. 2 A. The side 102 A of the backplane component 102 and the side 104 A of the filter component 104 are oriented such that the two sides 102A, 104A face each other. Adhesive 110 within the adhesive opening 110A may assist in retaining the backplane component 102 and the filter component 104 in position relative to each other. Adhesive 110 may come in contact with the thin film encapsulation 122 where the thin film encapsulation 122 is present, but the adhesive 110 may come in contact with the solder mask 124 at the side 102 A of the backplane component 102 where the thin film encapsulation 122 is not present. The thin film encapsulation 122 may help protect quantum structures and / or scattering material and may assist in maintaining quantum structures and / or scattering material in the appropriate position.

[0046] The backplane component 102 may be positioned and oriented relative to the filter component 104 such that cavities in the backplane component 102 are aligned with air gaps in the filter component 104. For example, the backplane component 102 may be positioned and oriented relative to the filter component 104 such that the first cavity 106A is aligned with the first air gap 108 A, such that the second cavity 106B is aligned with the second air gap 108B, and such that the third cavity 106C is aligned with the third air gap 108C.

[0047] The backplane component 102 comprises backplane glass substrate 112 and a solder mask 124, and the solder mask 124 may be white or another non-black color in some embodiments. The solder mask 124 may be attached directly or indirectly to the backplaneglass substrate 112. However, a reflector 126 may be included between the solder mask 124 and the backplane glass substrate 112. The solder mask 124 defines the cavities 106A, 106B, 106C and other cavities in other cavity sets. These cavities may have a variety of shapes. For example, the cavities may have a rectangular, circular, oval, rounded, asymmetrical, or polygonal shape, but other shapes may also be used. Light sources are positioned in the cavities. The first cavity 106 A includes a first light source 130A, and the first light source 130A may be attached to the backplane glass substrate 112. The second cavity 106B includes a second light source 130B, and the second light source 130B may be attached to the backplane glass substrate 112. The third cavity 106C also includes a third light source 130C, and the third light source 130C may be attached to the backplane glass substrate 112. The reflector 126 may cause light from the light sources 130A, 130B, 130C to be directed towards the quantum structures and the color filters. The other cavities of other cavity sets may also include light sources. Each of these light sources are blue light sources in the illustrated embodiment, but the light sources may have other colors in other embodiments. Additionally, light sources having multiple different colors may be used in different cavities in some embodiments. For example, blue light sources may be used in some cavities while green light sources may be used in other cavities.

[0048] In addition to the light sources, a respective set of quantum structures or scattering material may be positioned in each of the cavities. For example, a first set of quantum structures 128 A may be positioned in the first cavity 106 A, a second set of quantum structures 128B may be positioned in the second cavity 106B, and scattering material 150 may be positioned the third cavity 106C. However, quantum structures and scattering material may be omitted from some cavities. For example, for cavities intended to generate blue light, quantum structures may be omitted so that the color of light is not changed to a different wavelength, and the scattering material may be optionally omitted. Additionally, quantum structures may be included in the third cavity 106C in some embodiments to cause an adjustment in the wavelength of light generated from the third light source 130C in some embodiments.

[0049] Each of the cavities 106 A, 106B, 106C may be filled with resin 129 in some embodiments. This resin 129 may be a transparent resin material in some embodiments. Transparent means transmits at least 80 percent of visible light, e.g. 380-700nm. The resin 129 may be beneficial to space the quantum structures from the light sources, which may be provided as microLEDs. This may allow for improved beam expansion and lower flux density.

[0050] The filter component 104 may comprise a filter glass substrate 114, a black matrix 116, and a solder mask 120, and the solder mask 120 may be white in some embodiments. Thesolder mask 120 defines the first air gap 108A, the second air gap 108B, and the third air gap 108C in one air gap set, and the solder mask 120 also defines air gaps in other air gap sets. These air gaps may have a variety of shapes. For example, the air gaps may have a rectangular, circular, oval, rounded, asymmetrical, or polygonal shape, but other shapes may also be used. In the illustrated embodiment, the shape and size of the air gaps generally matches the shape and size of the cavities in the solder mask 124 of the backplane component 102 in the X-Z plane.

[0051] The black matrix 116 may assist in maintaining a black color for a display 100 when the display 100 is turned off, and the black matrix 116 may do this by absorbing light from external ambient light. The black matrix 116 includes various sets of openings, and one set of openings is illustrated in FIG. 2A. The first set of openings includes a first opening 131 A, a second opening 13 IB, and a third opening 131C. These openings may have a variety of shapes. For example, the openings may have a rectangular, circular, oval, rounded, asymmetrical, or polygonal shape, but other shapes may also be used. The openings match the shape and size of the cavities and the air gaps in the X-Z plane.

[0052] Color filters are positioned in the openings. A first color filter 118A is positioned in the first opening 131 A, with the first color filter being a red color filter. A second color filter 118B is positioned in the second opening 13 IB, with the second color filter being a green color filter. A third color filter 118C is positioned in the third opening 131C, with the third color filter 118C being a blue color filter. Other openings may also include a color filter. The opening sets are arranged in several rows and columns in the black matrix 116. In the illustrated embodiment, each opening set comprises three openings, but this may not be the case in other embodiments.

[0053] Further dimensional details regarding the solder mask 124 of the backplane component 102 are illustrated in FIG. 2B. The first cavity 106 A has a total thickness C extending in a direction parallel to the Y-axis. This thickness C may be about 30 microns to about 70 microns, about 40 microns to about 60 microns, or about 50 microns in some embodiments. In some embodiments, the thickness C may be greater than about 40 microns, greater than about 50 microns, greater than about 60 microns, or greater than about 70 microns. These thicknesses may be beneficial to allow resin 129 and a first set of quantum structures 128A to rest within a cavity. However, other cavities may have similar dimensions, and these thicknesses may allow resin and scattering material to rest in the cavity. The first cavity 106 A has a width F extending in a direction parallel to the X-axis. This width F may be about 70microns to about 130 microns, about 85 microns to about 115 microns, or about 100 microns in some embodiments. The size and shape of the solder mask 124 and the cavities within the solder mask 124 allows the various sets of quantum structures to be positioned within the cavities at high thicknesses. The first set of quantum structures 128A rests within the first cavity 106A and has a thickness A extending in a direction parallel to the Y-axis. This thickness A may be about 5 microns to about 15 microns, about 7 microns to about 13 microns, or about 10 microns in some embodiments. In some embodiments, the thickness A may be greater than about 7 microns, greater than about 10 microns, greater than about 13 microns, or greater than about 15 microns. Resin 129 may extend in the remaining portion of the first cavity 106 A for a thickness B in a direction parallel to the Y-axis. This thickness B may be about 20 microns to about 60 microns, about 30 microns to about 50 microns, or about 40 microns in some embodiments. The first set of quantum structures 128A also has a width that is substantially the same as the width F of the first cavity 106 A. The first light source 130A has a thickness D extending in a direction parallel to the Y-axis. The thickness D may be about 2 microns to about 6 microns, about 3 microns to about 5 microns, or about 4 microns in some embodiments. The first light source 130A has a width E extending in a direction parallel to the X-axis. The width E may be about 5 microns to about 15 microns, about 7 microns to about 13 microns, or about 10 microns in some embodiments. While dimensions for the first cavity 106 A, the first set of quantum structures 128 A, and the first light source 130A are illustrated, these dimensions may be similar for other cavities, other sets of quantum structures, and other light sources. Additionally, where scattering material is provided, the scattering material may also be provided with dimensions similar to the first set of quantum structures 128 A.

[0054] FIG. 3A is a perspective view illustrating an initial filter component 117. The initial filter component 117 may include a filter glass substrate 114 that may be used in an initial filter component 117, with a black matrix 116 and color filters positioned on the filter glass substrate 114. These components may be seen in greater detail in the top, enhanced view of FIG. 3B. Cavities are positioned in various cavity sets as discussed herein. The cavity sets are organized in rows and columns, but the cavity sets may be positioned in other ways in other embodiments. In FIG. 3B, a first cavity set 105, a second cavity set 105’, a third cavity set 105”, and a fourth cavity set 105’” are illustrated. The first cavity set 105 includes a first cavity 106 A, a second cavity 106B, and a third cavity 106C. The second cavity set 105’ includes a first cavity 106A’, a second cavity 106B’, and a third cavity 106C’. The third cavity set 105” includes a first cavity 106A”, a second cavity 106B”, and a third cavity 106C”. The fourth cavity set 105’”includes a first cavity 106A’”, a second cavity 106B’”, and a third cavity 106C’”. Color filters are positioned in each of the cavities as illustrated in FIG. 2A. The cavity sets define a pitch G in a direction parallel to the X-axis, and this pitch G may be about 600 microns. The cavity sets define a pitch H in a direction parallel to the Z-axis, and this pitch H may be about 600 microns. With these dimensions, the final display may have a resolution of about 40 pixels per inch. However, the pitch G, the pitch H, and the resolution may take on a variety of different values.

[0055] The filter component 104 may be formed by assembling the solder mask 120 on the black matrix of FIG. 3 A. An assembled filter component 104 is illustrated in isolation in FIG. 4 A. Features of the filter component 104 may be seen in greater detail in FIG. 4B, where the side 104A of the filter component 104 is illustrated. The first color filter 118A is positioned in the first air gap 108A, the second color filter 118B is positioned in the second air gap 108B, and the third color filter 118C is positioned in the third air gap 108C. The adhesive opening 110A of the solder mask 120 is also illustrated without any adhesive provided in the adhesive opening 110A, and the black matrix 116 of the filter component 104 is visible at the adhesive opening 110A.

[0056] The components that form the backplane component are also illustrated in various figures. FIG. 5 is a perspective view illustrating an example backplane glass substrate 112 of a backplane component. The reflector 126 (see FIG. 2 A) and the light sources (see FIG. 2 A) are assembled on the backplane glass substrate 112 in FIG. 5. After providing the backplane glass substrate 112, the reflector 126, and the light sources, a solder mask 124 may be positioned relative to these components as illustrated in FIG. 6 A. The solder mask 124 may be positioned on the reflector 126 where the reflector 126 is present, but the solder mask 124 may be positioned directly on the backplane glass substrate 112 in some embodiments. FIG. 6B also illustrates an enhanced, perspective view illustrating the solder mask 124 of FIG. 6A where cavities within the solder mask 124 may be seen. As illustrated, the solder mask 124 defines the first cavity 106 A with a first light source 130A positioned therein, the second cavity 106B with a second light source 130B positioned therein, and the third cavity 106C with the third light source 130C positioned therein.

[0057] After the solder mask 124 is positioned relative to the backplane glass substrate 112, the cavities in the solder mask 124 may be partially filled with resin 129. Quantum structures and / or scattering material may then be provided in some or all of the cavities as illustrated in FIG. 6C. For example, a first set of quantum structures 128 A may be positionedin the first cavity 106 A, a second set of quantum structures 128B may be positioned in the second cavity 106B, and scattering material 150 may be positioned in the third cavity 106C.

[0058] Various embodiments are also directed to methods for manufacturing displays and / or display assemblies comprising a filter component and a backplane component. FIG. 7 is a flow chart illustrating an example method 700 for manufacturing a display. At operation 702, one or more assembled backplane component(s) may be provided. In some embodiments, multiple backplane components may be provided and may be tiled across a display, with the backplane components have a smaller length and width relative to the length and width of the display. However, in some embodiments, only one backplane component is provided and the backplane component may substantially match the length and width of the display. Further details regarding the assembly of the backplane components may be seen in FIG. 9.

[0059] At operation 704, one or more assembled filter component(s) may be provided. In some embodiments, only one assembled filter component is being provided and the assembled filter component may substantially match the length and width of the display. However, in some embodiments, multiple assembled filter components may be provided, and the assembled filter components may be tiled across a display, with the assembled filter components having a smaller length and width relative to the display. Accordingly, at operation 706, the assembled backplane component(s) may be attached to the assembled filter component(s).

[0060] Further details regarding manufacture of filter components are described in reference to the flow chart in FIG. 8. At operation 802, an initial filter component may be provided, and the initial filter component may comprise a filter glass substrate, a black matrix, and color filters. At operation 804, solder mask may be positioned on the initial filter component to form a filter component. At operation 806, adhesive may be positioned in adhesive openings of the solder mask. The adhesive may be beneficial to allow assembled backplane component(s) to be easily attached to the assembled filter component(s) so that these components may be possess the desired positioning relative to each other.

[0061] Further details regarding manufacture of backplane components are described in reference to the flow chart in FIG. 9. At operation 902, a backplane glass substrate is provided. At operation 904, a reflector and one or more light sources may be positioned on the backplane glass substrate. However, in some embodiments, the backplane glass substrate may be provided at operation 902 with the reflector and the light source(s) already positioned on the backplane glass substrate. At operation 906, solder mask is positioned relative to the backplane glass substrate. The solder mask defines a cavity, and the solder mask may be positioned so that thelight source is proximate to the cavity. At operation 908, cavities of the solder mask may be partially filled with resin. At operation 910, quantum structures and / or scattering material may be positioned in some or all of the cavities, and these components may be positioned on the resin that is introduced at operation 908 in some embodiments. At operation 912, thin film encapsulation may be positioned on the solder mask. The thin film encapsulation may be used to hold the quantum structures, the scattering material, and / or any resin in cavities of the solder mask until the backplane component may be assembled with a filter component.

[0062] The operations of FIGS. 7-9 and the operations discussed in reference to FIGS. 3 A- 3B, 4A-4B, 5, 6A-6C are provided merely as an example of potential methods. These operations may be performed in any order unless otherwise noted. Certain operations may be performed simultaneously. Certain operations may also be performed in different orders. Additionally, certain operations may be omitted in some embodiments while other operations may be added. In some embodiments, methods described herein may be combined together. For example, FIGS. 7-9 may be combined together to form a single method.

[0063] Many modifications and other embodiments set forth herein will come to mind to one skilled in the art to which these embodiments pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, the disclosure is not limited to the specific embodiments disclosed and modifications and other embodiments are intended to be included within the scope of the disclosure. Moreover, although the foregoing descriptions and the associated drawings describe example embodiments in the context of certain example combinations of elements and / or functions, different combinations of elements and / or functions may be provided by alternative embodiments without departing from the scope of the disclosure. In this regard, different combinations of elements and / or functions than those explicitly described above are also contemplated within the scope of the disclosure. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

WHAT IS CLAIMED IS:

1. A display comprising: a first light source configured to generate light having a first wavelength; a first plurality of quantum structures, wherein the first plurality of quantum structures are configured to receive the light having the first wavelength from the first light source and convert the light having the first wavelength to a first output wavelength; and a first color filter, wherein the first color filter is separated from the first plurality of quantum structures by an air gap, wherein the air gap is defined by a first distance between the first color filter and the first plurality of quantum structures, and wherein the first distance is greater than zero.

2. The display of claim 1, wherein the first plurality of quantum structures are separated from the first light source by a second distance, wherein the second distance is greater than zero.

3. The display of claim 2, further comprising: resin, wherein the first plurality of quantum structures are separated from the first light source, wherein the resin is positioned between the first plurality of quantum structures and the first light source, and wherein the resin is transparent.

4. The display of any of claims 1-3, further comprising: a first solder mask, wherein the air gap is positioned in the first solder mask, wherein the first solder mask is a color other than black.

5. The display of claim 4, wherein the first solder mask is white.

6. The display of claim 4, further comprising: a filter component comprising a first glass substrate, the first color filter, and the first solder mask,wherein the display comprises a first area in a first plane, the filter component comprises a second area in a second plane parallel to the first plane, and the first area is approximately the same as the second area.

7. The display of any of claims 4-6, wherein the first solder mask comprises a first opening, the air gap is positioned in the first opening, wherein the air gap is positioned between the first color filter and the first plurality of quantum structures.

8. The display of claim 7, further comprising: adhesive, wherein the first solder mask comprises an adhesive opening, and wherein the adhesive is positioned in the adhesive opening.

9. The display of any of claims 7 or 8, further comprising: a second solder mask, wherein the second solder mask is a color other than black, wherein the second solder mask comprises a first cavity, wherein the second solder mask is positioned proximate to the first solder mask so that the first cavity aligns with the first opening.

10. The display of claim 9, further comprising: a backplane component comprising a second glass substrate, the first light source, the second solder mask, the resin, and the first plurality of quantum structures, wherein the backplane component comprises a third area, and wherein the third area is less than each of the first area and the second area.

11. The display of claim 10, wherein the adhesive is configured to adhere the filter component to the backplane component.

12. The display of claim 10, wherein the first light source is positioned proximate to the first cavity, wherein the first plurality of quantum structures is positioned proximate to the first cavity, and wherein the resin is positioned in the first cavity between the first light source and the first plurality of quantum structures.

13. The display of claim 12, wherein the first plurality of quantum structures has a thickness of about 10 microns or more.

14. The display of any of claims 12 or 13, wherein the first cavity has a thickness of about 50 microns or more.

15. The display of any of claims 1-12, further comprising: a second light source configured to generate light having the first wavelength; a second plurality of quantum structures, wherein the second plurality of quantum structures are configured to receive the light from the second light source and convert the light to a second output wavelength; and a second color filter.

16. The display of claim 15, wherein the second color filter is separated from the second plurality of quantum structures by the first distance, wherein the second plurality of quantum structures are separated from the second light source by the second distance, wherein the first solder mask comprises a second opening, wherein a second air gap is positioned in the second opening, wherein the second air gap is positioned between the second color filter and the second plurality of quantum structures, wherein the second solder mask comprises a second cavity, and wherein the second solder mask is positioned proximate to the first solder mask so that the second cavity aligns with the second opening.

17. The display of any of claims 1-12 further comprising: a second light source configured to generate light having the first wavelength; scattering material configured to receive the light from the second light source, the scattering material being configured to cause the light to scatter, wherein scattered light has a second output wavelength that is approximately the same as the first wavelength; and a second color filter.

18. The display of claim 17, further comprising: a third light source configured to generate light having the first wavelength;a second plurality of quantum structures, wherein the second plurality of quantum structures are configured to receive the light from the third light source and convert the light to a third output wavelength; and a third color filter.

19. The display of claim 18, wherein the first wavelength is in a range of about 450 nanometers to about 495 nanometers.

20. The display of any of claims 18 or 19, wherein the first output wavelength is in a range of about 620 nanometers to about 750 nanometers and the third output wavelength is in a range of about 495 nanometers to about 570 nanometers.

21. A display assembly comprising: a first light source configured to generate light having a first wavelength; a first plurality of quantum structures, wherein the first plurality of quantum structures are configured to receive the light having the first wavelength from the first light source and convert the light having the first wavelength to a first output wavelength; and a first color filter, wherein the first color filter is separated from the first plurality of quantum structures by an air gap, wherein the air gap is defined by a first distance between the first color filter and the first plurality of quantum structures, and wherein the first distance is greater than zero.

22. A method of manufacturing a display, the method comprising: providing an initial filter component; positioning a first solder mask on the initial filter component to form a filter component; providing a backplane glass substrate having a light source included thereon; positioning a second solder mask relative to the backplane glass substrate, wherein the second solder mask defines a cavity and the light source is positioned proximate to the cavity; positioning a set of quantum structures in the cavity; and attaching the filter component to a backplane component comprising the backplane glass substrate, the light source, the second solder mask, and the set of quantum structures.

23. The method of claim 22, further comprising: at least partially filling a cavity of the second solder mask with resin.

24. A display made by a process comprising: providing an initial filter component; positioning a first solder mask on the initial filter component to form a filter component; providing a backplane glass substrate having a light source included thereon; positioning a second solder mask relative to the backplane glass substrate, wherein the second solder mask defines a cavity and the light source is positioned proximate to the cavity; positioning a set of quantum structures in the cavity; and attaching the filter component to a backplane component comprising the backplane glass substrate, the light source, the second solder mask, and the set of quantum structures.

25. A display comprising: a first light source configured to generate light having a first wavelength; a first plurality of quantum structures, wherein the first plurality of quantum structures are configured to receive the light from the first light source and convert the light to a first output wavelength; and wherein the first plurality of quantum structures are separated from the first light source by a distance that is greater than zero.

26. The display of claim 25, further comprising: a solder mask; and resin, wherein the solder mask is a color other than black, wherein the solder mask comprises a first cavity, the first light source is positioned proximate to the first cavity, the first plurality of quantum structures is positioned proximate to the first cavity, and the resin is positioned in the first cavity between the first light source and the first plurality of quantum structures.

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