Motherboard structure and chassis matching same

Abstract

Disclosed are a motherboard structure and a chassis matching same. The present invention provides a motherboard structure provided with a PCIE slot and a CPU interface respectively located on the front side and the back side, thereby avoiding heat accumulation generated by a GPU and a CPU, and also avoiding blocking of a PCIE expansion interface on one side of the motherboard structure by a high-performance GPU, better exerting the performance of the CPU and the GPU. Additionally, the present invention provides a chassis matching the motherboard structure, to facilitate installation of the motherboard.

Description

A mainboard structure and a chassis matching the mainboard structure Technical Field

[0001] The present invention relates to the fields of computer equipment technology and motherboard technology, and in particular to a motherboard structure and a chassis matched with the motherboard structure. Background Art

[0002] A computer motherboard, also known as the motherboard, is a printed circuit board (PCB) that connects the CPU (central processing unit), memory, storage devices, power supply, and expansion slots. Typically, PCI-Express (Peripheral Component Interconnect Express) slots are used as the primary expansion channel on desktop computers. Expansion cards such as graphics cards, fiber optic cards, and video capture cards are connected to the computer motherboard using a PCI Add-in-Card (PCIe AIC). The expansion card has gold finger contacts on the bottom. By inserting the gold finger contacts of the PCIe expansion card into the PCIe slot soldered on the PCB, as shown in Figure 1-2, the PCIe bus signals are connected to the computer's CPU or the chipset (usually the PCH chipset) connected to the CPU through the PCIe slot.

[0003] The current ATX (Advanced Technology Extended) layout specification for computer motherboards was established in 1995. Due to its age, this specification failed to account for the increased power consumption and expandability requirements brought about by the rapid iteration of computer technology, making it difficult to adapt to current technological applications and market demands. For example, discrete graphics cards (GPUs), the most commonly used expansion devices, are typically connected to the motherboard via a PCIe AIC connector. Graphics cards shortly after the ATX specification was introduced typically consumed less than 65W of power. Due to this lower power consumption, the heat sink required for discrete graphics cards was smaller, often less than 20mm thick, and did not conflict with the physical space of the PCIe expansion device below. However, with the development of technology, the power and radiator size of independent graphics cards are constantly increasing. Nowadays, the thickness is often more than 60mm, which will take up too much physical space and cause other PCIE expansion slots of the motherboard to be blocked by the graphics card radiator. The blocked slots cannot be inserted with PCIE expansion cards. In addition, the radiators of high-power independent graphics cards usually use heat dissipation metal fins that are perpendicular to the motherboard and PCIE slots. This will cause nearly half of the hot air blown out by the cooling fan to be discharged to the side close to the motherboard by the fan, which will increase the temperature of the graphics card and motherboard, thereby causing the performance of the graphics card to decline and the probability of failures such as cold solder joints or component breakdown at the component contacts to increase.

[0004] Before the PCIE4.0 specification, the slots of PCIE AIC devices all used DIP (dual n-line package) pin packaging. During PCB processing, the pins under the PCIE slot are usually passed through the through-hole pads of the motherboard. The pins exposed on the back of the motherboard are soldered to the through-hole pads through the wave soldering process. Since wave soldering is to immerse the pins exposed on the back in molten liquid tin, double-sided DIP soldering is difficult. For PCIE slots, if there is already a soldered PCIE slot on the front, placing the PCIE slot on the back will make it impossible to insert the pins exposed on the front from the back and solder them using the wave soldering equipment. After the popularization of PCIE4.0 and PCIE5.0 versions of the specification, in order to achieve sufficient electrical signal performance, SMT packaged PCIE slots are usually used to solder the PCIE slots on the PCB through SMT patches. This makes it possible to arrange the PCIE slots on both sides of the PCB separately for soldering.

[0005] The multiple PCIE signals derived from the motherboard chipset (southbridge) typically have low signal bandwidth. Therefore, DIP-packaged slots can be used to be first soldered to the PCIE slots on the front of the motherboard (on the same side as the CPU) using wave soldering equipment. PCIE signals directly connected to the CPU, due to their higher signal bandwidth, can be soldered to PCIE SMT-packaged slots on the back of the motherboard using an SMT placement machine. Alternatively, SMT-packaged PCIE slots can be used on both sides of the motherboard. Both soldering arrangements are not limited by wave soldering equipment, allowing the slots to be soldered separately on both sides of the motherboard.

[0006] Summary of the Invention

[0007] The purpose of the present invention is to provide a motherboard structure and a chassis matched with the motherboard structure, which solves the problem of heat accumulation caused by the motherboard and blocking the PCIE interface in the prior art.

[0008] The present invention is achieved through the following technical solutions:

[0009] In one aspect, the present invention provides a mainboard structure, comprising:

[0010] Mainboard body;

[0011] CPU interface, the CPU interface is provided on one side of the mainboard body;

[0012] At least two PCIE slots are respectively arranged on one side and the other side of the main body of the motherboard, and the PCIE slots are connected to the main body of the motherboard through DIP plug-in or SMT patch.

[0013] In a possible implementation, the method further includes:

[0014] L-shaped adapter;

[0015] The input end of the L-shaped adapter is a connector that matches the PCIE slot on the other side of the motherboard body, and the input end of the L-shaped adapter is plugged into the PCIE slot on the other side of the motherboard body. The output end of the L-shaped adapter is a plug-in slot that matches the socket of the GPU, which is used to extend and redirect the PCIE slot.

[0016] The GPU is mounted on the PCIE slot via an L-shaped adapter so that the GPU is parallel to the motherboard, which is beneficial for heat dissipation and reduces space occupation.

[0017] In a possible implementation, the method further includes:

[0018] PCIE extension cable;

[0019] The input end of the PCIE extension cable is a connector that matches the PCIE slot on the other side of the motherboard body, and the input end of the PCIE extension cable is plugged into the PCIE slot on the other side of the motherboard body. The output end of the PCIE extension cable is a plug-in slot that matches the socket of the GPU, and the plug-in direction corresponding to the output end of the PCIE extension cable is parallel to the motherboard body, which is used to extend and turn the PCIE slot;

[0020] The GPU is mounted on the PCIE slot via a PCIE extension cable so that the GPU is parallel to the mainboard body, which is beneficial to heat dissipation and reduces space occupation.

[0021] In a possible implementation, the method further includes:

[0022] Multiple PCIE expansion interfaces, memory module interfaces, and IO interfaces derived from the CPU;

[0023] The multiple PCIE expansion interfaces, memory module interfaces and IO interfaces are all arranged on one side of the main board body to ensure the heat dissipation effect of the GPU arranged on the other side of the main board body.

[0024] In another aspect, the present invention provides a chassis with a matching mainboard structure, comprising:

[0025] The chassis shell, multiple studs, side heat dissipation vents, side fan mounting ports, a first baffle mounting slot that cooperates with the GPU baffle, multiple second baffle mounting slots that cooperate with the baffles of the PCIE expansion device set on the PCIE expansion interface, a power supply mounting position, and an IO interface mounting slot;

[0026] Both sides of the mainboard body are provided with fixing members, and the mainboard body is fixedly connected to the bottom surface and the top surface of the chassis shell through the fixing members;

[0027] The side heat dissipation vent is provided on a side surface of the chassis shell, and after the mainboard body is installed in the chassis shell, the side heat dissipation vent is adjacent to the GPU installed on the mainboard body;

[0028] The first baffle mounting slot that cooperates with the GPU baffle, multiple second baffle mounting slots that cooperate with the baffles of the PCIE expansion device set on the PCIE expansion interface, the power supply mounting position, the IO interface mounting slot and the side fan mounting port are set on the other side of the chassis shell.

[0029] In a possible implementation, a plurality of supporting feet are provided on the bottom surface of the chassis shell.

[0030] In a possible implementation manner, the number of the side fan installation openings is set to one or more.

[0031] In a possible embodiment, a side air inlet is further provided on the side of the chassis shell, and the side air inlet is different from the surface where the side heat dissipation port is located and the surface where the side fan installation port is located.

[0032] In a possible implementation, an air outlet fan is provided on the side heat dissipation outlet.

[0033] In a possible implementation, a protrusion is provided on a side surface inside the chassis shell. When the motherboard structure carrying the GPU is installed inside the chassis shell, the protrusion supports the GPU.

[0034] The present invention provides a motherboard structure and a chassis matching the motherboard structure, providing a motherboard structure in which PCIE slots and CPU interfaces are located on the front and back sides, respectively. This prevents heat accumulation between the GPU and the CPU, while also preventing the high-performance GPU from blocking the PCIE expansion interface on one side of the motherboard structure, thereby better exerting the performance of the CPU and GPU. At the same time, a chassis matching the motherboard structure is provided to facilitate installation of the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without making any creative efforts.

[0036] In the attached figure:

[0037] FIG1 is a first schematic diagram of the prior art.

[0038] FIG2 is a second schematic diagram of the prior art.

[0039] Figure 3(a) is a first schematic diagram of a case where the GPU provided by the present invention is arranged on the other side of the main body of the motherboard and the mounted GPU is arranged as a computing card. Figure 3(b) is a second schematic diagram of a case where the GPU provided by the present invention is arranged on the other side of the main body of the motherboard and the mounted GPU is arranged as a graphics card.

[0040] Figure 4(a) is a schematic diagram of the mainboard structure when the L-shaped adapter provided by the present invention is set and the loaded GPU is set as a computing card, Figure 4(b) is a schematic diagram of the mainboard structure when the L-shaped adapter provided by the present invention is set and the loaded GPU is set as a graphics card, and Figure 4(c) is a schematic diagram of the mainboard structure when the PCIE expansion card provided by the present invention is loaded.

[0041] Figure 5(a) is a schematic diagram of the mainboard structure when the PCIE extension cable is set and the loaded GPU is set as a computing card provided by the present invention, Figure 5(b) is a schematic diagram of the mainboard structure when the PCIE extension cable is set and the loaded GPU is set as a graphics card provided by the present invention, and Figure 5(c) is a schematic diagram of the mainboard structure when the PCIE extension cable is set provided by the present invention.

[0042] FIG6 is a schematic diagram showing the connection relationship between the mainboard structure and the chassis when the stud provided by the present invention is set on the side of the mainboard including the CPU interface.

[0043] FIG7 is a schematic structural diagram of a stud provided by the present invention disposed on a side of a mainboard that does not include a CPU interface.

[0044] FIG8 is a schematic diagram showing the connection relationship between the mainboard structure provided by the present invention and the studs in the chassis.

[0045] FIG9 is a schematic diagram of the chassis structure provided by the present invention.

[0046] The marks and corresponding parts names in the accompanying drawings are: 1-mainboard body, 2-PCIE slot, 3-IO interface, 4-GPU, 5-L-type adapter, 6-CPU interface, 7-memory stick interface, 8-PCIE expansion card, 9-baffle on the PCIE expansion card, 10-PCIE expansion interface, 11-PCIE extension cable, 12-stud, 13-bottom, 14-power supply mounting position, 15-chassis shell, 16-side heat dissipation vent, 17-support foot, 18-side fan mounting port. DETAILED DESCRIPTION

[0047] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with examples and drawings. The exemplary embodiments of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention.

[0048] Example 1

[0049] In order to facilitate understanding of the present invention, the terms involved in the present invention are explained.

[0050] CPU: The CPU stands for the central processing unit (Central Processing Unit) of a computer. It is one of the main components of a computer and its core component. Its primary function is to interpret computer instructions and process data in computer software. All computer operations are performed by the CPU, the core component responsible for reading, decoding, and executing instructions.

[0051] The CPU interface refers to the interface for installing the CPU. In the prior art, the CPU interface is usually set on the front side of the motherboard, that is, the installation surface of all electronic components.

[0052] GPU: GPU refers to the computer's graphics processing unit (Graphics Processing Unit), also known as display core, visual processor, or display chip. It is a microprocessor specifically designed for image processing on personal computers, workstations, game consoles, and some mobile devices (such as tablets and smartphones).

[0053] The GPU interface refers to the interface for installing the GPU. In the prior art, the GPU interface is usually set on the front side of the motherboard, that is, the installation surface of all electronic components.

[0054] PCIE: PCIE refers to the bus and interface standard (PCI-Express). PCIE is the most commonly used bus and interface standard for connecting expansion devices to the motherboard in existing computers. The PCIE expansion card has gold finger contacts at the bottom and is connected to the CPU or motherboard chipset by inserting it into the PCIE slot on the motherboard.

[0055] In the prior art, multiple PCIE expansion interfaces are usually provided on one side of the motherboard to expand computer performance. However, as GPU performance improves, some PCIE expansion interfaces will be blocked, affecting the release of computer performance. Even if the GPU does not block the PCIE expansion interface, the heat accumulation generated by the GPU and CPU will also cause frequency reduction, thereby affecting the performance release of the computer.

[0056] As shown in Figures 3(a) and 3(b), the present invention provides a motherboard structure comprising: a motherboard body 1; a CPU interface 6, the CPU interface 6 being disposed on one side of the motherboard body 1; at least two PCIE slots 2, the at least two PCIE slots 2 being disposed on one side and the other side of the motherboard body 1 (for example, there are two PCIE slots 2, the two PCIE slots 2 being located on opposite sides of the motherboard body 1), and the PCIE slots 2 being connected to the motherboard body 1 via DIP connectors or SMT (Surface Mounted Technology) patches; the other side of the motherboard body 1 being used to represent the solder joint surface of various interfaces and electronic components on the motherboard body. That is, the configuration of the CPU interface 6 is the same as in the prior art. Typically, electronic components such as an IO interface 3, multiple PCIE expansion interfaces 10, and a memory module interface 7 are also disposed on one side of the motherboard body 1. Other electronic components are conventional devices and configurations and will not be described in detail in this embodiment. The IO interface 3, multiple PCIE expansion interfaces 10, and memory module interface 7 are all disposed on one side of the motherboard body to ensure heat dissipation for the GPU disposed on the other side of the motherboard body.

[0057] Optionally, the PCIE slot 2 that is not located on the same surface as the CPU interface 6 is used to connect the GPU 4, and the PCIE slot 2 that is located on the same surface as the CPU interface 6 can be used to connect the GPU 4, and can also be used to connect a computing card and PCIE expansion components.

[0058] By setting the PCIE slot 2 on the other side of the motherboard body 1, the problems of heat accumulation and blocking of the PCIE expansion interface can be effectively avoided. The PCIE slot 2 can be set in the middle or edge of the other side according to design or actual needs.

[0059] As shown in Figures 4(a), 4(b) and 4(c), the motherboard structure may further include: an L-shaped adapter 5; the input end of the L-shaped adapter 5 is a connector that cooperates with the PCIE slot 2 on the other side of the motherboard body 1, and the input end of the L-shaped adapter 5 is plugged into the PCIE slot 2 on the other side of the motherboard body 1, and the output end of the L-shaped adapter 5 is a plug-in slot that cooperates with the socket of the GPU 4, which is used to extend and turn the PCIE slot 2; the GPU 4 is loaded on the PCIE slot 2 through the L-shaped adapter 5 so that the GPU is parallel to the motherboard, which is beneficial to heat dissipation while reducing space occupancy.

[0060] GPU4 can usually be set as a graphics card, but can also be set as a computing card; and a PCIE expansion card 8 can be set on the PCIE expansion interface 10, and the PCIE expansion card 8 is fixed to the chassis through a baffle 9 set on the PCIE expansion card 8.

[0061] Optionally, screw holes can be set on the vertical side of the L-shaped adapter 5, and then fixed to the side inside the chassis through studs to ensure the strength of the L-shaped adapter 5 and prevent the high-performance GPU from damaging the structure of the L-shaped adapter 5.

[0062] As shown in Figures 5(a), 5(b) and 5(c), the motherboard structure may further include: a PCIE extension cable 11; the input end of the PCIE extension cable 11 is a connector that cooperates with the PCIE slot 2 on the other side of the motherboard body 1, and the input end of the PCIE extension cable 11 is plugged into the PCIE slot 2 on the other side of the motherboard body 1, the output end of the PCIE extension cable 11 is a plug-in slot that cooperates with the socket of GPU4, and the plug-in direction corresponding to the output end of the PCIE extension cable 11 is parallel to the motherboard body, which is used to extend and turn the PCIE slot 2.

[0063] The GPU 4 is mounted on the PCIE slot 2 via a PCIE extension cable 11 so that the GPU is parallel to the main board, which is beneficial for heat dissipation and reduces space occupation.

[0064] In this embodiment, by providing an L-shaped adapter 5 and a PCIE extension cable 11 , the GPU can be turned to meet different heat dissipation requirements and space requirements.

[0065] This embodiment provides a motherboard structure in which the PCIE slot 2 and the CPU interface 6 are located on two sides respectively, which not only avoids heat accumulation between the GPU and the CPU, but also avoids the high-performance GPU from blocking the PCIE expansion interface 10 on one side of the motherboard structure, thereby better exerting the performance of the CPU and GPU.

[0066] Example 2

[0067] As shown in Figures 6 to 9, the present invention provides a chassis supporting the motherboard structure, including:

[0068] The chassis shell 15, fixing parts, side heat dissipation vents 16, side fan mounting ports 18, a first baffle mounting slot that cooperates with the GPU baffle, multiple second baffle mounting slots that cooperate with the baffles of the PCIE expansion device set on the PCIE expansion interface, a power supply mounting position 14 and an IO interface mounting slot.

[0069] The fixing member can be set as a stud 12. Both sides of the mainboard body are provided with fixing members, and the mainboard body is fixedly connected to the bottom surface and the top surface inside the chassis shell through the fixing members.

[0070] The plurality of studs 12 are respectively arranged on the sides of both sides of the mainboard body 1 , and the plurality of studs 12 are arranged on the bottom surface and the top surface inside the chassis shell 15 to achieve the fixation of the mainboard.

[0071] The motherboard body 1 is provided with a plurality of through-holes corresponding to studs 12. The end of the stud 12 closest to the motherboard body 1 is provided with a screw hole. Each stud 12 is provided with a corresponding screw. The screw passes through the through-hole and connects with the screw hole of the stud 12 to secure the motherboard body to the interior of the chassis shell. The end of the stud 12 away from the motherboard body 1 is fixed to the bottom and top surfaces of the interior of the chassis shell 15.

[0072] Optionally, each stud 12 is provided with screw holes at both ends. The studs 12 are first secured to the motherboard body 1 through the screw holes. The chassis housing 15 is then provided with through holes corresponding to the positions of the studs 12. This allows screws to be inserted from the outside of the chassis and secured to the studs 12, thereby securing the motherboard body 1 within the chassis. It is worth noting that, with reference to the detachable structure of existing chassis side panels, both the bottom and top surfaces of the motherboard body 1 in this embodiment can be configured as detachable structures for greater ease of installation.

[0073] In this embodiment, one side of the motherboard body 1 faces downward and the other side faces upward, that is, after the motherboard body 1 is installed, the GPU is located on the top. Since the GPU and CPU are respectively arranged on the front and back sides of the motherboard body 1, and the device with the highest height on both sides is usually the GPU or CPU radiator, it is necessary to set studs 12 to leave space for installing the GPU or CPU radiator. The studs 12 should be at least larger than the height of the GPU or CPU radiator. For example, if the height of the CPU radiator is 15CM, then the studs 12 are at least 15CM or more, that is, the distance between the motherboard body and the bottom surface of the chassis shell 15 is 15CM, to ensure that at least a side-blowing radiator can be installed. If a downward pressure radiator is installed, then the studs 12 are at least 3CM larger than the height of the CPU radiator to ensure the air intake of the radiator.

[0074] At the same time, a certain space should be ensured between the GPU and the upper cover of the chassis shell 15, such as a distance of 3CM or 5CM, so that it can be installed in conjunction with the mainboard body 1 described in Example 1 of the present application to achieve good heat dissipation.

[0075] The side heat dissipation vent 16 is provided on a side surface of the chassis shell 15 , and after the motherboard body 1 is installed in the chassis shell 15 , the side heat dissipation vent 16 is adjacent to the GPU 4 installed on the motherboard body 1 .

[0076] The first baffle mounting slot that cooperates with the baffle of GPU4, multiple second baffle mounting slots that cooperate with the baffle 9 of the PCIE expansion device 8 set on the PCIE expansion interface 10, the power supply mounting position 14, the IO interface mounting slot and the side fan mounting port 18 are all set on the other side of the chassis shell.

[0077] Optionally, an exhaust fan can be provided on the side fan mounting port 18 to discharge the heat generated by the CPU. By respectively arranging the CPU and GPU on the two sides of the main board body 1 and providing corresponding heat exhaust ports, effective heat dissipation can be achieved, which is beneficial to the performance release of the computer.

[0078] In a possible implementation, a plurality of supporting feet 17 are provided on the bottom surface 13 of the chassis shell.

[0079] In a possible implementation manner, the number of the side fan installation openings 18 is set to one or more. If the CPU performance is high, multiple side fan installation openings 18 can be provided to enhance the heat dissipation performance.

[0080] In a possible embodiment, a side air inlet is further provided on the side of the chassis shell 15 , and the side air inlet is located on a different surface from the side heat dissipation vent 16 and the side fan installation port 18 .

[0081] In a possible implementation, an air outlet fan may be provided on the side heat dissipation vent 16 .

[0082] By setting air inlets, GPU air outlets and CPU air outlets on different sides, an air duct is formed to release the heat generated by the GPU and the CPU respectively, ensuring a good working environment. At the same time, multiple second baffle mounting slots are provided to match the baffles of the PCIE expansion device. Since there is no GPU obstruction, the computer can be further expanded through the PCIE expansion interface, further releasing performance.

[0083] In a possible implementation, a protrusion is provided on the inner side of the chassis shell 15 , and when the motherboard structure carrying the GPU is installed inside the chassis shell, the protrusion supports the GPU.

[0084] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A mainboard structure, characterized in that: include: Main board body; A CPU interface, wherein the CPU interface is arranged on one side of the mainboard body; At least two PCIE slots are respectively arranged on one side and the other side of the main board body, and the PCIE slots are connected to the main board body through DIP plug-in or SMT patch.

2. The mainboard structure according to claim 1, characterized in that: Also includes: L-shaped adapter; The input end of the L-shaped adapter is a plug-in component that matches the PCIE slot on the other side of the mainboard body, and the input end of the L-shaped adapter is plugged into the PCIE slot on the other side of the mainboard body, and the output end of the L-shaped adapter is a plug-in slot that matches the socket of the GPU, which is used to extend and turn the PCIE slot; The GPU is mounted on the PCIE slot via an L-shaped adapter so that the GPU is parallel to the motherboard, which is beneficial for heat dissipation and reduces space occupation.

3. The mainboard structure according to claim 1, characterized in that: Also includes: PCIE extension cable; The input end of the PCIE extension cable is a connector that matches the PCIE slot on the other side of the mainboard body, and the input end of the PCIE extension cable is plugged into the PCIE slot on the other side of the mainboard body. The output end of the PCIE extension cable is a plug-in slot that matches the socket of the GPU, and the plug-in direction corresponding to the output end of the PCIE extension cable is parallel to the mainboard body, which is used to extend and turn the PCIE slot; The GPU is mounted on the PCIE slot via a PCIE extension cable so that the GPU is parallel to the main board body, which is beneficial to heat dissipation and reduces space occupation.

4. The mainboard structure according to claim 1, characterized in that: Also includes: Multiple PCIE expansion interfaces, memory stick interfaces, and IO interfaces derived from the CPU; The multiple PCIE expansion interfaces, memory stick interfaces and IO interfaces are all arranged on one side of the main board body to ensure the heat dissipation effect of the GPU arranged on the other side of the main board body.

5. A chassis matching the mainboard structure according to any one of claims 1 to 4, characterized in that: include: A chassis shell, a fixing part, a side heat dissipation port, a side fan mounting port, a first baffle mounting slot matched with a baffle of a GPU, a plurality of second baffle mounting slots matched with baffles of a PCIE expansion device disposed on a PCIE expansion interface, a power supply mounting position, and an IO interface mounting slot; Both sides of the mainboard body are provided with fixing parts, and the mainboard body is fixedly connected to the bottom surface and the top surface of the chassis shell through the fixing parts; The side heat dissipation port is arranged on one side of the chassis shell, and after the mainboard body is installed in the chassis shell, the side heat dissipation port is The GPUs installed on the main body of the motherboard are adjacent; The first baffle mounting slot that cooperates with the baffle of the GPU, multiple second baffle mounting slots that cooperate with the baffles of the PCIE expansion device set on the PCIE expansion interface, the power supply mounting position, the IO interface mounting slot and the side fan mounting port are set on the other side of the chassis shell.

6. The chassis according to claim 5, characterized in that: A plurality of supporting feet are arranged on the bottom surface of the chassis shell.

7. The chassis according to claim 5, characterized in that: The number of the side fan installation openings is set to one or more.

8. The chassis according to claim 5, characterized in that: The side of the chassis shell is also provided with a side air inlet, and the side air inlet is different from the surface where the side heat dissipation port is located and the surface where the side fan installation port is located.

9. The chassis according to claim 5, characterized in that: An air outlet fan is arranged on the side heat dissipation port.

10. The chassis according to claim 5, characterized in that: The inner side of the chassis shell is provided with a protrusion, and when the motherboard structure carrying the GPU is installed inside the chassis shell, the protrusion supports the GPU.

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