Vapor chamber and electronic device

Abstract

The present application relates to a vapor chamber and an electronic device, the vapor chamber being applied to the electronic device. The vapor chamber comprises a first cover plate, a second cover plate, and a capillary structure. The edge of the first cover plate is fixedly connected to the edge of the second cover plate, so as to form a closed cavity between the first cover plate and the second cover plate, the capillary structure being located in the cavity, and the capillary structure being used for guiding a liquid in the cavity to flow. The cavity comprises a first cavity and a second cavity, which are communicated with each other, the first cavity being located in a first region of the vapor chamber, the second cavity being located in a second region of the vapor chamber, the first region being connected to a heating member of the electronic device, the dimension of the second cavity in a first direction being greater than the dimension of the first cavity in the first direction, and the first direction being the arrangement direction of the first cover plate and the second cover plate. In the embodiments of the present application, the increase of the dimension of the second cavity allows a gas to encounter smaller air resistance and have an enhanced flowing-through capability in the second cavity, facilitating the gas to timely and quickly diffuse to the second cavity, thus improving the cooling capacity of the vapor chamber.

Description

Vapor chambers and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on July 31, 2023, with application number 202310962665.X and application name “Heat spreader and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of heat dissipation technology, and in particular to a heat spreader and electronic equipment. Background Art

[0003] The development of electronic devices has changed our way of life, especially the development of tablets, foldable computers, foldable phones, etc. has brought great convenience to our lives.

[0004] Electronic devices are often equipped with vapor chambers to dissipate heat. Existing vapor chambers have low heat dissipation efficiency and limited heat dissipation capacity, hindering performance improvements. Therefore, optimizing vapor chamber design to enhance heat dissipation capabilities is crucial.

[0005] Summary of the Invention

[0006] The present invention provides a vapor chamber and an electronic device. The present invention improves the heat dissipation capacity of the vapor chamber by setting different sizes of different areas of the vapor chamber.

[0007] In the first aspect, an embodiment of the present application provides a heat spreader for use in electronic devices. The heat spreader includes a first cover plate, a second cover plate, and a capillary structure; the edge of the first cover plate is fixedly connected to the edge of the second cover plate to form a closed cavity between the first cover plate and the second cover plate; the capillary structure is located in the cavity, and the capillary structure is used to guide the flow of liquid in the cavity; the cavity includes a first cavity and a second cavity that are interconnected, the first cavity is located in the first area of ​​the heat spreader, the second cavity is located in the second area of ​​the heat spreader, and the first area is used to connect the heating element of the electronic device; the size of the second cavity in the first direction is larger than the size of the first cavity in the first direction, and the first direction is the arrangement direction of the first cover plate and the second cover plate. It can be understood that the first area can be in contact with the heating element and fixedly connected, or other structural members can be set between the first area and the heating element, and the first area and the heating element are connected through other structural members.

[0008] Understandably, the second region is disposed away from the heating element relative to the first region. The first region and the heating element can be fixedly connected, and the heat energy of the heating element is transmitted to the first region, vaporizing the liquid working medium in the first region into gas. The gas fills the cavity, and after contacting the second region with a lower temperature, the gas liquefies into liquid and dissipates the heat energy. The liquid liquefied in the second region flows back to the first region under the capillary force of the capillary structure, and continues to vaporize in the first region, repeating the cycle to achieve continuous heat dissipation.

[0009] It can be understood that the size of the cavity in the first direction may refer to the distance between the structures surrounding the cavity in the first direction. For example, the size of the first cavity in the first direction may refer to the distance between the first cover plate and the second cover plate corresponding to the first area, and the size of the second cavity in the first direction may refer to the distance between the first cover plate and the second cover plate corresponding to the second area.

[0010] In the embodiment of the present application, the size of the second cavity in the first direction is set to be larger than the size of the first cavity in the first direction. Compared with the design in which the sizes of the first cavity and the second cavity in the first direction are the same, the embodiment of the present application increases the size of the second cavity, so that the air resistance of the gas in the second cavity is small and the flow capacity is increased, which is conducive to the timely and rapid diffusion of the gas to the second cavity, and is conducive to improving the heat dissipation efficiency to improve the heat dissipation capacity of the heat spreader.

[0011] In one possible embodiment, in the first direction, the size of the portion of the capillary structure located in the second area is larger than the size of the portion of the capillary structure located in the first area. The size of the capillary structure in the first direction can be understood as the thickness of the capillary structure. In the embodiment of the present application, the size of the second cavity in the first direction is set to be larger than the size of the first cavity in the first direction, which increases the space of the second cavity. By setting a thicker capillary structure in the second cavity with a larger space, the capillary force of the capillary structure in the second cavity can be increased to increase the liquid reflux capacity in the second cavity. When the reverse gravity problem occurs (the reverse gravity problem can be understood as the direction of the liquid in the second cavity being subjected to its own gravity and the capillary force of the capillary structure being different, and causing the liquid to be unable to overcome gravity and flow back to the first cavity through the capillary force), the liquid will accumulate in the second cavity, affecting the liquid from flowing back to the first cavity and reducing the heat dissipation capacity of the heat spreader. In the embodiment of the present application, by setting a thicker capillary structure in the second cavity with a larger space, the capillary force of the capillary structure in the second cavity is increased, which is conducive to the liquid overcoming its own gravity and achieving reflux even in the reverse gravity scenario.

[0012] In one possible embodiment, the capillary structure includes a capillary mesh and capillary wires, the capillary mesh is fixed to the second cover plate, and the capillary wires are fixed to the side of the capillary mesh facing the first cover plate; in the first direction, the size of the portion of the capillary wire located in the second area is larger than the size of the portion of the capillary wire located in the first area, or, in the first direction, the size of the portion of the capillary mesh located in the second area is larger than the size of the portion of the capillary mesh located in the first area. The capillary mesh can be a porous mesh structure for providing capillary force for the capillary structure, and the capillary wires can be used to drain the liquid and increase the capillary force of the capillary structure. The size of the capillary wire in the first direction can be understood as the thickness of the capillary wire, and the size of the capillary mesh in the first direction can be understood as the thickness of the capillary mesh. In the embodiment of the present application, the thickness of the capillary structure in the second area can be increased by increasing the thickness of the capillary wire or capillary mesh in the second area, which is beneficial to providing sufficient capillary force for the liquid in the second cavity, facilitating the backflow of the liquid, and solving the problem of counter-gravity.

[0013] In one possible embodiment, the capillary structure includes a capillary mesh and capillary threads. The capillary mesh is fixed to the second cover plate, and the capillary threads are fixed to the side of the capillary mesh facing the first cover plate. The width of the portion of the capillary threads located in the second region is greater than the width of the portion of the second capillary threads located in the first region. In this embodiment of the present application, the capillary force of the capillary structure in the second region can be increased by increasing the width of the portion of the capillary threads in the second region, which helps provide sufficient capillary force for the liquid in the second cavity, facilitates the backflow of the liquid, and solves the problem of counter-gravity.

[0014] In one possible embodiment, the cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, the third cavity is located in the third area of ​​the heat spreader, the third area is used for heat dissipation, and the size of the third cavity in the first direction is greater than or equal to the size of the first cavity in the first direction. The size of the third cavity in the first direction may refer to the distance between the first cover plate and the second cover plate corresponding to the third area. When the size of the third cavity in the first direction is greater than the size of the first cavity in the first direction, compared with the design in which the first cavity and the third cavity have the same size in the first direction, the embodiment of the present application increases the size of the third cavity, so that the air resistance of the gas in the third cavity is small and the flow capacity is increased, which is conducive to the timely and rapid diffusion of the gas to the third cavity, and is conducive to improving the heat dissipation efficiency to improve the heat dissipation capacity of the heat spreader.

[0015] In one possible embodiment, the capillary structure includes a capillary mesh and capillary threads. The capillary mesh is fixed to the second cover plate, and the capillary threads are fixed to the side of the capillary mesh facing the first cover plate. The number of capillary threads in the second region is greater than or equal to two. If there is a counter-gravity problem in the second region, setting the number of capillary threads in the second region to greater than or equal to two helps provide sufficient capillary force for the liquid in the second cavity, facilitates liquid backflow, and solves the counter-gravity problem.

[0016] In one possible embodiment, the cavity includes a third cavity, interconnected with the first and second cavities, and located in a third region of the vapor chamber. The vapor chamber includes a partition, located between the second and third cavities, for isolating the second and third cavities. It is understood that the third region is located farther away from the heating element relative to the first region. The first, second, and third regions may form a Y-shaped or T-shaped structure. The first region and the heating element may be fixedly connected. Heat energy from the heating element is transferred to the first region, vaporizing the liquid working fluid in the first region into a gas. The gas fills the cavity. Upon contact with the cooler second and third regions, the gas liquefies into a liquid and dissipates heat. The liquefied liquid in the second and third regions flows back to the first region due to capillary forces in the capillary structure, where it continues to vaporize in the first region, repeating the cycle to achieve continuous heat dissipation. The partition may be hollow to reduce the weight of the vapor chamber, or it may be solid. In a reverse gravity scenario, if the second cavity experiences reverse gravity, some of the liquid in the third cavity will flow into the second cavity under its own gravity, causing liquid to accumulate in the second cavity. This makes it more difficult for the liquid in the second cavity to flow back, reducing the heat dissipation capacity of the vapor chamber. In this embodiment of the application, a partition is provided between the second and third cavities to isolate the second and third cavities, preventing the liquid in the third cavity from flowing into the second cavity. This allows the liquid in the third cavity to flow back into the first cavity, achieving circular heat dissipation.

[0017] In one possible embodiment, the surface of the partition member facing the second cavity is a curved surface, or the surface of the partition member facing the third cavity is a curved surface. When the surface of the partition member facing the third cavity is a curved surface, the liquid in the third cavity can flow along the curved surface to the first cavity, avoiding the problem that when the surface of the partition member facing the third cavity is a surface with a large bending angle, the liquid accumulates seriously at the partition member and cannot flow back to the first cavity in time. In addition, the curved surface can reduce the resistance to the gas. The surface of the partition member facing the second cavity is a curved surface, and the surface of the partition member facing the third cavity is a curved surface, which can prevent the partition member from affecting the diffusion of the gas and affecting the heat dissipation effect of the heat spreader.

[0018] In one possible embodiment, the partition member includes a first end and a second end disposed opposite each other, with the first end being closer to the first region than the second end, the first end having a smaller dimension in the second direction than the second end, and the second direction being perpendicular to the first direction. The first end is narrower than the second end, facilitating rapid liquid flow from the second end to the first end and convergence in the first region, thereby improving the heat dissipation capacity of the vapor chamber.

[0019] In one possible embodiment, the capillary structure includes a capillary mesh and capillary threads. The capillary mesh is fixed to the second cover plate, and the capillary threads are fixed to the side of the capillary mesh facing the first cover plate. One side of the partition member abuts the first cover plate, and the other side of the partition member abuts the capillary mesh. The partition member abuts between the capillary mesh and the first cover plate, facilitating separation of the first cavity from the second cavity.

[0020] In one possible embodiment, the partition member and the first cover plate are integrally formed. This integrally formed structure eliminates the need for a fixed connection between the partition member and the first cover plate. Furthermore, the integrally formed structure provides a tight connection between the first cover plate and the partition member, preventing a loose connection between the first cover plate and the partition member, which could create a gap and cause liquid in the third chamber to flow into the second chamber.

[0021] In one possible embodiment, the capillary structure includes a capillary mesh and first capillary threads. The capillary mesh is fixed to the second cover plate, and the first capillary threads are fixed to the side of the capillary mesh facing the first cover plate, with at least a portion of the first capillary threads located in the second region. The second region includes a first side and a second side, the temperature of the first side is lower than that of the second side, and the portion of the second capillary threads located in the second region is located on the first side. In a reverse gravity scenario, when the second cavity faces reverse gravity, placing the first capillary threads on the first side, where the temperature is lower, facilitates rapid reflux of liquid in the second cavity, preventing liquid accumulation in the second cavity, effectively addressing the reverse gravity problem. It is understandable that gas is more easily liquefied into liquid on the first side, where the temperature is lower, than on the second side, where the temperature is higher. By placing the first capillary threads on the first side, where gas is more easily liquefied, liquid liquefied on the first side can be promptly and quickly returned to the first cavity.

[0022] In one possible embodiment, the cavity includes a third cavity, which is interconnected with the first and second cavities and is located in a third region of the vapor chamber. The capillary structure further includes second capillary threads, at least a portion of which is located in the third region. The third region includes a third side and a fourth side, the third side being at a lower temperature than the fourth side, and the portion of the second capillary thread located in the third region is located on the fourth side. The first capillary thread is located on the first side, where the temperature is lower, and the second capillary thread is located on the fourth side, where the temperature is higher. This allows the first and second capillary threads to be staggered. The second capillary thread serves to isolate the second and third cavities, preventing some liquid in the third cavity from flowing into the second cavity. This facilitates the backflow of liquid in the third cavity back into the first cavity, thereby improving the heat dissipation capacity of the vapor chamber. Furthermore, the staggered arrangement of the first and second capillary threads isolates the second and third cavities, facilitating the completion of the vacuuming process, increasing the vacuum level within the cavity, and enhancing the heat dissipation capacity of the vapor chamber.

[0023] In one possible embodiment, the material of the first cover plate or the second cover plate is at least one of stainless steel, copper, and titanium. In the embodiment of the present application, the cavity formed by the first and second cover plates has different thicknesses in different areas, that is, the first cover plate or the second cover plate has an uneven structure, which can be formed by stamping. If the first cover plate or the second cover plate requires high strength, setting the first cover plate or the second cover plate to at least one of the high-strength stainless steel, copper, and titanium material facilitates the processing of the heat sink.

[0024] In a possible implementation manner, the first region is used for absorbing heat, and the second region is used for dissipating heat.

[0025] In a second aspect, the present application provides an electronic device comprising a heating element and a vapor chamber as described in any of the aforementioned embodiments, wherein the heating element is connected to the vapor chamber, and heat energy from the heating element is transferred to the vapor chamber. The electronic device may be a tablet, a foldable computer, a foldable phone, or the like. The heating element may be a central processing unit, for example. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the drawings required for use in the embodiments of the present invention or the background technology will be described below.

[0027] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0028] FIG2 is a schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0029] FIG3 is a schematic structural diagram of the electronic device shown in FIG1 in a horizontal position;

[0030] FIG4 is a schematic diagram of an internal structure of the electronic device shown in FIG1 ;

[0031] FIG5 is a schematic diagram of the heat dissipation principle of a vapor chamber provided in an embodiment of the present application;

[0032] FIG6 is a schematic structural diagram of the vapor chamber shown in FIG1 ;

[0033] FIG7 is a schematic diagram of the exploded structure of the vapor chamber shown in FIG6 ;

[0034] FIG8 is a side view of the vapor chamber shown in FIG6 ;

[0035] FIG9 is a schematic structural diagram of a cavity formed in a vapor chamber according to an embodiment of the present application;

[0036] FIG10 is a schematic structural diagram of another vapor chamber structure provided in an embodiment of the present application;

[0037] FIG11 is a schematic diagram of the internal liquid and gas circulation of a vapor chamber provided in an embodiment of the present application;

[0038] FIG12 is a schematic diagram of a portion of the structure of the vapor chamber shown in FIG6 ;

[0039] FIG13 is a schematic diagram of a partial internal structure of the vapor chamber shown in FIG6 at one angle;

[0040] FIG14 is a schematic diagram of the internal structure of the vapor chamber shown in FIG6 from another angle;

[0041] FIG15 is a schematic diagram of a partial structure of another vapor chamber provided in an embodiment of the present application;

[0042] FIG16 is a schematic diagram of the internal structure of a vapor chamber provided in an embodiment of the present application;

[0043] FIG17 is a schematic structural diagram of a first cover plate provided in an embodiment of the present application;

[0044] FIG18 is a schematic diagram of the internal structure of another hot plate provided in an embodiment of the present application;

[0045] FIG19 is a schematic diagram of a partial structure of another vapor chamber provided in an embodiment of the present application;

[0046] FIG20 is a schematic diagram of the internal structure of another vapor chamber provided in an embodiment of the present application;

[0047] FIG21 is a partial structural diagram of another vapor chamber provided in an embodiment of the present application;

[0048] FIG22 is a schematic diagram of the internal structure of another vapor chamber provided in an embodiment of the present application;

[0049] FIG23 is a schematic structural diagram of another vapor chamber provided in an embodiment of the present application;

[0050] FIG24 is a schematic structural diagram of another heat spreader provided in an embodiment of the present application. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0052] It should be understood that the terms “first”, “second”, etc. used in this application are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0053] In the description of this application, the terms "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on this application.

[0054] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, a conflicting connection or an integrated connection; for ordinary technicians in this field, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0055] As shown in Figures 1, 2, and 3, Figure 1 is a schematic diagram of the structure of an electronic device 100, Figure 2 is a schematic diagram of the structure of another electronic device 100, and Figure 3 is a schematic diagram of the structure of the electronic device 100 shown in Figure 1 in a horizontal position. The electronic device 100 can be a tablet, a foldable computer, a foldable mobile phone, etc. When the electronic device 100 is in operation, some components within the electronic device 100 will generate heat. As the heat energy generated by the electronic device 100 increases, the operating performance of the electronic device 100 is affected and the user experience is reduced. Therefore, heat dissipation of the electronic device 100 is required.

[0056] The embodiment of the present application is introduced by taking the electronic device 100 as a computer as an example. The electronic device 100 may include a first part 101 and a second part 102 that are connected. The first part 101 and the second part 102 may both be display parts that can display text, images, etc. The electronic device 100 may be connected to an external keyboard to control the display of the first part 101 and the second part 102. In other embodiments, the first part 101 may be a display part for displaying text, images, etc., and the second part 102 may be a touch keyboard to control the display of the first part 101. The electronic device 100 may also be in other application forms, which is not limited in this application.

[0057] The electronic device 100 may include a heating element 10 and a vapor chamber 20. The heating element 10 and the vapor chamber 20 may be fixedly connected. Heat energy from the heating element 10 may be transferred to the vapor chamber 20. The vapor chamber 20 is used to dissipate the heat energy from the heating element 10, thereby achieving heat dissipation of the electronic device 100. The heating element 10 may be fixed to a circuit board, and the heating element 10 may be a central processing unit, etc.

[0058] Referring to Figure 1, the heating element 10 can be located in the first part 101, and the heat spreader 20 is arranged in the first part 101 and fixedly connected to the heating element 10, and the heat spreader 20 dissipates heat for the heating element 10. Referring to Figure 2, the heating element 10 can also be located in the second part 102, and the heat spreader 20 is arranged in the second part 102 and fixedly connected to the heating element 10, and the heat spreader 20 dissipates heat for the heating element 10. In other embodiments, the first part 101 and the second part 102 can both be provided with the heating element 10, and the number of the heat spreaders 20 can also be two, and the two heat spreaders 20 are respectively arranged in the first part 101 and the second part 102. The position of the heat spreader 20 can be set according to the heating element to improve the effective and timely heat dissipation of the electronic device 100.

[0059] The electronic device 100 shown in Figures 1 to 3 is merely a schematic representation, and the size, shape, and position of the heating element 10 and the heat spreader 20 can be set as needed. The present application does not limit the specific structure of the electronic device 100.

[0060] Referring to Figures 1 and 4, Figure 4 is a schematic diagram of the internal structure of the electronic device 100 shown in Figure 1, and the arrow in Figure 4 indicates the direction of the wind. The electronic device 100 may include heat dissipation fins 103, a rear shell 104, a heat sink 105 and a fastener 106. The rear shell 104 may be provided with an installation space, and the heating element 10, the heat spreader 20, the heat dissipation fins 103, the heat sink 105 and the fastener 106 are all located in the installation space of the rear shell 104. A gap is provided between the heat spreader 20 and the rear shell 104, and the wind in the environment can pass through the gap to dissipate heat from the heat spreader 20. The heat spreader 20 is fixedly connected to the heating element 10 by fasteners 106. The heat dissipation area of ​​the heat spreader 20 is provided with heat dissipation fins 103, and the air outlet of the heat sink 105 (the heat sink 105 can be a fan) faces the heat dissipation fins, and the heat energy is taken away by the wind to play a heat dissipation role.

[0061] In some embodiments, the fastener 106 may include a main body 1061 and a spring piece 1062 (see subsequent Figure 7), the main body 1061 is welded to the heat spreader 20, and the spring piece 1062 is fixedly connected to the main body 1061 and the circuit board, so that the main body 1061 is tightly arranged with the heating element 10 on the circuit board, that is, the heat spreader 20 is tightly arranged with the heating element 10, which is beneficial for the timely transmission of the heat energy of the heating element 10 to the heat spreader 20, and is beneficial for the rapid heat dissipation of the electronic device 100.

[0062] Refer to Figures 1 and 5. Figure 5 is a schematic diagram of the heat dissipation principle of vapor chamber 20. Figure 5 uses first region 21 and second region 22 as examples to illustrate the heat dissipation principle of vapor chamber 20. Figure 5 does not show the third region. It is understood that the heat dissipation principle of first region 21 and third region is similar to that of first region 21 and second region 22. The black arrows within vapor chamber 20 in Figure 5 indicate the flow direction of liquid, and the white arrows within vapor chamber 20 in Figure 5 indicate the flow direction of gas.

[0063] The heat spreader 20 may include a first area 21, a second area 22 and a third area 23. The first area 21 may be fixedly connected to the heating element 10. It can be understood that the first area 21 may be in contact with and fixedly connected to the heating element 10, or other structural members (such as fasteners 106) may be provided between the first area 21 and the heating element 10, and the first area 21 may be connected to the heating element 10 through other structural members.

[0064] In some embodiments, the first region 21 is used to absorb heat, and the second region 22 and the third region 23 can be arranged away from the heating element 10 relative to the first region 21. The second region 22 and the third region 23 are used for heat dissipation, that is, the second region 22 and the third region 23 dissipate the heat energy of the heating element 10. The first region 21, the second region 22 and the third region 23 can be in a "Y"-shaped structure, or a "T"-shaped structure. The heat energy of the heating element 10 is transmitted to the first region 21, and the heat energy vaporizes the liquid working medium (the liquid working medium can be water) in the first region 21 into a gas. The gas diffuses and fills the cavity of the heat spreader 20. After the gas contacts the second region 22 or the third region 23 with a lower temperature, it liquefies into a liquid and dissipates the heat energy, thereby dissipating the heat of the heating element 10. The liquid after liquefaction in the second region 22 and the third region 23 flows back to the first region 21 under the capillary force of the capillary structure 26 in the heat spreader 20, and continues to vaporize to form gas in the first region 21, repeating the cycle to achieve continuous heat dissipation.

[0065] In some embodiments, heat dissipation fins 103 may be provided outside the second area 22 or the third area 23 , and the air outlet of the heat dissipation element (not shown in FIG5 , refer to FIG4 ) faces the heat dissipation fins, and the heat energy is taken away by the wind, thereby achieving heat dissipation.

[0066] The second region 22 and the third region 23 can be positioned near the air outlet of the electronic device 100 to dissipate heat. For example, referring to FIG1 , the vapor chamber 20 is positioned in the first portion 101 , and the air outlet is typically located at the top 1011 of the first portion 101 . Therefore, the second region 22 and the third region 23 are positioned near the top 1011 of the first portion 101 . Referring to FIG2 , the vapor chamber 20 is positioned in the second portion 102 , and the air outlet is typically located at the junction 1021 between the first and second portions 101, 102 . The second region 22 and the third region 23 are positioned near the junction 1021 between the first and second portions 101, 102 .

[0067] It can be understood that the second area 22 and the third area 23 of the heat spreader 20 in Figures 1 and 2 are arranged left and right. In other embodiments, the second area 22 and the third area 23 of the heat spreader 20 in Figures 1 and 2 can also be arranged up and down.

[0068] It is understandable that in some embodiments, the vapor chamber 20 may not include the third region 23 , and the vapor chamber 20 may have various structural forms. The embodiments of the present application do not limit the specific structure of the vapor chamber 20 .

[0069] As shown in Figures 6, 7 and 8, Figure 6 is a schematic structural diagram of the heat spreader 20 shown in Figure 1, Figure 7 is a schematic exploded structural diagram of the heat spreader 20 shown in Figure 6, and Figure 8 is a side view of the heat spreader 20 shown in Figure 6. Figure 8 is a simplified side view schematic from the perspective of the side where the second area 22 is located. The heat spreader 20 includes a first cover plate 24, a second cover plate 25 and a capillary structure 26. The first cover plate 24 and the second cover plate 25 are arranged along the first direction A1, and the edge of the first cover plate 24 and the edge of the second cover plate 25 are fixedly connected to form a closed cavity 27 between the first cover plate 24 and the second cover plate 25. Exemplarily, the first cover plate 24 and the second cover plate 25 can be fixedly connected by welding. The capillary structure 26 is located in the cavity 27 and is used to guide the flow of the liquid working medium located in the cavity 27. In the embodiment of the present application, the thickness of the cavity 27 can be different in different areas.

[0070] The material of the first cover plate 24 can be at least one of stainless steel, copper, and titanium, and the material of the second cover plate 25 can be at least one of stainless steel, copper, and titanium. For example, the first cover plate 24 can be made of stainless steel, or a composite material of stainless steel and copper, that is, copper is plated on the surface of the stainless steel. The material of the second cover plate 25 can be the same as or different from that of the first cover plate 24. In the embodiment of the present application, the cavity 27 formed by the first cover plate 24 and the second cover plate 25 has different thicknesses in different areas, that is, the first cover plate 24 or the second cover plate 25 has an uneven structure. The first cover plate 24 or the second cover plate 25 can be formed by stamping, and the first cover plate 24 or the second cover plate 25 is required to have high strength performance. By setting the material of the first cover plate 24 or the second cover plate 25 to be at least one of stainless steel, copper, and titanium with high strength, it is beneficial to the processing of the heat spreader 20 and improves the manufacturing yield of the heat spreader 20.

[0071] The capillary structure 26 may include a capillary mesh and a capillary wire. The capillary mesh is used to provide capillary force for the capillary structure. The capillary mesh may be a porous structure. The capillary mesh may be a structure formed by weaving a metal wire (such as a copper wire) or a structure formed by sintering a powder. The present embodiment of the application does not limit the material, structure, and formation method of the capillary mesh. The capillary wire can be used to drain the liquid and improve the capillary force of the capillary structure. The number of capillary meshes may be one layer or two layers. The present embodiment of the application takes the number of capillary meshes as two layers, and the two layers of capillary meshes are stacked as an example. The two layers of capillary meshes are respectively the first capillary mesh 261 and the second capillary mesh 262. The present embodiment of the application takes the capillary wires as the first capillary wire 263 and the second capillary wire 264 as an example. The first capillary mesh 261 and the second capillary mesh 262 are stacked and fixed to the second cover plate 25. The first capillary wire 263 and the second capillary wire 264 are both fixed to the capillary mesh (specifically the second capillary mesh 262) facing the side of the first cover plate 24. The first capillary wire 263 and the second capillary wire 264 may be in contact with the first cover plate 24 and fixedly connected thereto.

[0072] 12 , in some embodiments, a portion of the first capillary wires 263 may be located within the second cavity 272 of the second region 22, another portion of the first capillary wires 263 may be located within the first cavity 271 of the first region 21, a portion of the second capillary wires 264 may be located within the third cavity 273 of the third region 23, and another portion of the second capillary wires 264 may be located within the first cavity 271 of the first region 21. In other embodiments, the capillary structure may not include capillary wires.

[0073] In some embodiments, the first capillary mesh 261 and the second capillary mesh 262 can be pre-fixed to the second cover plate 25 by spot welding, and the first capillary wire 263 and the second capillary wire 264 can be pre-fixed to the second capillary mesh 262 by spot welding, and the first cover plate 24 and the second cover plate 25 are welded and fixed. After welding, the heat spreader 20 is sintered at a high temperature to stably fix the first capillary mesh 261 and the second capillary mesh 262 to the second cover plate 25 and the first capillary wire 263 and the second capillary wire 264 between the second capillary mesh 262 and the first cover plate 24, thereby completing the manufacture of the heat spreader 20.

[0074] Referring to FIG. 8 , the cavity 27 may include a first cavity 271 and a second cavity 272 that are interconnected. The first cavity 271 may be located in the first region 21, and the second cavity 272 may be located in the second region 22. A dimension H2 of the second cavity 272 in the first direction A1 is greater than a dimension H1 of the first cavity 271 in the first direction A1. It is understood that the dimension of a cavity in the first direction A1 may refer to the spacing between structures enclosing the cavity in the first direction A1. For example, the dimension H1 of the first cavity 271 in the first direction A1 may refer to the spacing between the first cover plate 24 and the second cover plate 25 corresponding to the first region 21 in the first direction A1, and the dimension H2 of the second cavity 272 in the first direction A1 may refer to the spacing between the first cover plate 24 and the second cover plate 25 corresponding to the second region 22 in the first direction A1. The dimension H1 of the first cavity 271 in the first direction A1 can be understood as the thickness of the first cavity 271 being H1 , and the dimension H2 of the second cavity 272 in the first direction A1 can be understood as the thickness of the second cavity 272 being H2 .

[0075] In the embodiment of the present application, the thickness of the second cavity 272 is set to be greater than the thickness of the first cavity 271, that is, the cavity 27 is designed with unequal thickness. Compared with the design in which the first cavity 271 and the second cavity 272 are the same size in the first direction A1, the embodiment of the present application increases the size of the second cavity 272 for dissipating heat for the heating element, so that the air resistance of the gas in the second cavity 272 is small and the flow capacity is increased, which is conducive to the timely and rapid diffusion of the gas to the second cavity 272, and is conducive to improving the heat dissipation efficiency of the heat spreader 20 to improve the heat dissipation capacity of the heat spreader 20.

[0076] As shown in Figure 9, a schematic diagram of the structure of the cavity 27 of the vapor chamber 20 is provided. The uneven thickness design of the cavity 27 can be achieved by stamping the second cover plate 25 into a special-shaped structure (special-shaped structure refers to a flat structure) and then fixedly connecting it to the flat first cover plate 24. The two parts of the second cover plate 25 are connected by an inclined surface 251 to facilitate stamping and forming, thereby forming a wedge-shaped transition between the first area 21 and the second area 22.

[0077] As shown in Figure 10, another schematic diagram of the structure of the cavity 27 of the vapor chamber 20 is shown. The uneven thickness design of the cavity 27 can be formed by stamping the first cover plate 24 to form a special-shaped structure (special-shaped structure is relative to a flat structure) and fixedly connecting it to the flat second cover plate 25. The two parts of the first cover plate 24 are connected by an inclined surface 241 to facilitate stamping and forming, forming a wedge-shaped transition between the first area 21 and the second area 22.

[0078] As shown in Figures 3 and 11, Figure 11 is a schematic diagram of the internal liquid and gas circulation of the heat spreader 20. The liquid working medium in the first area 21 is affected by the thermal energy of the heating element and vaporized into gas. The gas can diffuse to the second area 22 and the third area 23 and fill the cavity of the heat spreader 20. After the gas contacts the second area 22 and the third area 23 with lower temperatures, it liquefies into liquid and dissipates the heat energy to achieve heat dissipation of the heating element 10. The liquid after liquefaction in the second area 22 and the third area 23 flows back to the first area 21 under the capillary force of the capillary structure in the heat spreader 20, and continues to vaporize to form gas in the first area 21, circulating back and forth to achieve continuous heat dissipation. When the electronic device 100 is in use, it can be placed horizontally, vertically, or flat. The relative position of the vapor chamber 20 will change in different usage scenarios. When the vapor chamber 20 is in the scenarios shown in Figures 3 and 11, the second region 22 faces the problem of counter-gravity. It is understandable that the liquid in the second region 22 needs to overcome its own gravity and flow back to the first region 21 under the action of the capillary force of the capillary structure. However, if the capillary force applied to the liquid in the second region 22 is not sufficient to overcome its own gravity (i.e., counter-gravity), the liquid in the second region 22 will not be able to flow back to the first region 21, and the liquid will accumulate in the second region 22, reducing the heat dissipation capacity of the vapor chamber 20. Furthermore, some of the liquid that liquefies in the third region 23 flows back to the first region 21 under the action of gravity and capillary forces. Meanwhile, some of the liquid in the third region 23 flows to the second region 22 under the action of gravity, causing liquid accumulation in the second region 22. This makes it difficult for the liquid in the second region 22 to flow back to the first region 21, hindering the gas-liquid circulation in the second region 22 and reducing the heat dissipation capacity of the vapor chamber 20. Therefore, it is necessary to address the reverse gravity problem in the second region 22.

[0079] The embodiment of the present application will introduce the structure of the heat spreader 20 through the following four schemes as an example to solve the counter-gravity problem of the heat spreader 20 and improve the heat dissipation capacity of the heat spreader 20. It is understandable that the heat spreader 20 can also have other structures besides the four schemes, and the present application does not limit the structure of the heat spreader 20. The schemes of the embodiment of the present application include but are not limited to changing the size of the capillary structure of the second region 22 to increase the capillary force of the capillary structure of the second region 22, increasing the number of capillary lines in the second region 22 to increase the capillary force of the capillary structure of the second region 22, providing a partition 28, providing the first capillary line 263 on the first side 221 where the temperature is lower, staggering the first capillary line 263 and the second capillary line 264, etc.

[0080] Solution 1: As shown in Figures 12, 13, and 14, Figure 12 is a schematic diagram of the partial structure of the vapor chamber 20 shown in Figure 6. The structure in Figure 12 is a schematic diagram of the structure of the vapor chamber 20 in Figure 6 without the first cover plate 24, in order to clearly illustrate the internal structure of the vapor chamber 20. Figure 13 is a schematic diagram of the partial internal structure of the vapor chamber 20 shown in Figure 6 from one angle, and Figure 14 is a schematic diagram of the internal structure of the vapor chamber 20 shown in Figure 6 from another angle.

[0081] In some embodiments, in the first direction A1, the size of the portion of the capillary structure 26 located in the second region 22 is larger than the size of the portion of the capillary structure 26 located in the first region 21. In the first direction A1, the size of the portion of the capillary structure 26 located in the second region 22 can be understood as the thickness of the capillary structure in the second region 22, and in the first direction A1, the size of the portion of the capillary structure 26 located in the first region 21 can be understood as the thickness of the capillary structure in the first region 21, that is, the thickness of the capillary structure in the second region 22 is greater than the thickness of the capillary structure in the first region 21.

[0082] In the embodiment of the present application, the thickness of the second cavity 272 is set to be greater than the thickness of the first cavity 271, thereby increasing the space of the second cavity 272. A thicker capillary structure can be set in the second cavity 272 with a larger space, so that the thickness of the capillary structure in the second area 22 is greater than the thickness of the capillary structure in the first area 21, thereby increasing the capillary force of the capillary structure in the second cavity 272. Even in a reverse gravity scenario, it is beneficial for the liquid in the second cavity 272 to overcome its own gravity and achieve reflux, which is beneficial to improving the liquid reflux ability in the second cavity 272 and preventing liquid from accumulating in the second cavity 272, thereby solving the reverse gravity problem and improving the heat dissipation efficiency and heat dissipation capacity of the heat spreader 20.

[0083] In some embodiments, referring to Figure 14, in the first direction A1, the size of the first capillary thread 263 in the second area 22 (i.e., the thickness of the first capillary thread 263 in the second area 22) can be set to be larger than the size of the first capillary thread 263 in the first area 21 (i.e., the thickness of the first capillary thread 263 in the first area 21) to increase the thickness of the capillary structure in the second area 22, so that the thickness of the capillary structure in the second area 22 is greater than the thickness of the capillary structure in the first area 21, which is beneficial to provide sufficient capillary force for the liquid in the second cavity 272, facilitate the reflux of the liquid, and solve the problem of counter-gravity.

[0084] In some embodiments, in the first direction A1, the size of the capillary mesh in the second area 22 can be set to be larger than the size of the capillary mesh in the first area 21 to increase the thickness of the capillary structure in the second area 22, so that the thickness of the capillary structure in the second area 22 is greater than the thickness of the capillary structure in the first area 21, which is beneficial to provide sufficient capillary force for the liquid in the second cavity 272, which is beneficial to the backflow of the liquid and solves the problem of inverse gravity. Taking the stacking of the first capillary mesh 261 and the second capillary mesh 262 as an example, the capillary mesh here refers to the structure after the first capillary mesh 261 and the second capillary mesh 262 are stacked. For example, the thickness of the first capillary mesh 261 in the second area 22 can be increased, the thickness of the second capillary mesh 262 in the second area 22 can also be increased, or the thickness of the first capillary mesh 261 in the second area 22 and the thickness of the second capillary mesh 262 in the second area 22 can both be increased. In other embodiments, the number of layers of the capillary mesh in the second area 22 can also be increased.

[0085] In some embodiments, the width W2 of the portion of the first capillary line 263 located in the second region 22 is greater than the width W1 of the portion of the first capillary line 263 located in the first region 21. In the embodiment of the present application, the width of the portion of the first capillary line 263 located in the second region 22 can be increased to increase the capillary force of the capillary structure in the second region 22, thereby providing sufficient capillary force for the liquid in the second cavity 272, facilitating the backflow of the liquid and solving the problem of counter-gravity.

[0086] In some embodiments, when the vapor chamber 20 includes the third region 23, the third cavity 273 is located in the third region 23. The third cavity 273 is interconnected with the first cavity 271 and the second cavity 272. Gas can diffuse from the first cavity 271 to the second cavity 272 and the third cavity 273, and liquid can flow from the second cavity 272 and the third cavity 273 to the first cavity 271. The thickness of the third cavity 273 can be greater than or equal to the thickness of the first cavity 271.

[0087] In some embodiments, the thickness of the portion of the capillary structure located in the third region 23 may be greater than or equal to the thickness of the portion of the capillary structure located in the first region 21. When the thickness of the portion of the capillary structure located in the third region 23 is greater than the thickness of the portion of the capillary structure located in the first region 21, the thickness of the portion of the capillary line located in the third region 23 may be greater than the thickness of the portion of the capillary line located in the first region 21, or the thickness of the portion of the capillary mesh located in the third region 23 may be greater than the thickness of the portion of the capillary mesh located in the first region 21. The width of the portion of the capillary line located in the third region 23 may be greater than or equal to the width of the portion of the capillary line located in the first region 21.

[0088] Solution 2: Refer to Figures 15 and 16. Figure 15 is a partial structural diagram of another vapor chamber 20. The structure in Figure 15 is a structural diagram of the vapor chamber 20 without the first cover plate 24, in order to clearly illustrate the internal structure of the vapor chamber 20. Figure 16 is a schematic diagram of the internal structure of the vapor chamber 20.

[0089] In some embodiments, the number of first capillary lines 263 in the second region can be greater than or equal to two. In this embodiment of the present application, by increasing the number of capillary lines in the second region 22 of the vapor chamber 20, the capillary force of the capillary structure in the second region 22 can be increased, thereby providing sufficient capillary force for the liquid in the second cavity 272, facilitating liquid reflux, and resolving the problem of counter-gravity.

[0090] In some embodiments, when the vapor chamber 20 is provided with a third region 23, the number of capillaries in the second region 22 may be greater than the number of capillaries in the third region 23. For example, the second region 22 may have two first capillary lines 263, and the third region 23 may have one second capillary line 264. When there is a counter-gravity problem in the second region 22, setting the number of capillaries in the second region 22 greater than the number of capillaries in the third region 23 helps provide sufficient capillary force for the liquid in the second cavity 272, facilitates liquid reflux, and resolves the counter-gravity problem.

[0091] In some embodiments, the vapor chamber 20 may not include the third region 23 , that is, the vapor chamber 20 does not have the third cavity 273 . The embodiment of the present application does not limit the specific structure of the vapor chamber 20 .

[0092] Solution three: as shown in FIG11 , FIG17 and FIG18 , FIG17 is a schematic structural diagram of the first cover plate 24 , and FIG18 is a schematic internal structural diagram of another type of heat spreader 20 .

[0093] The vapor chamber 20 may include a partition 28, which abuts between the second capillary mesh 262 and the first cover plate 24. That is, one side of the partition 28 abuts the first cover plate 24, and the other side of the partition 28 abuts the second capillary mesh 262. The partition 28 is located between the second cavity 272 and the third cavity 273, that is, between the second region 22 and the third region 23, and is used to isolate the second cavity 272 from the third cavity 273.

[0094] The partition 28 can be a hollow structure to reduce the weight of the heat spreader and achieve lightweight. The partition 28 can also be a solid structure. In the reverse gravity scenario, when the second cavity 272 has a reverse gravity problem, part of the liquid in the third cavity 273 will flow to the second cavity 272 under the action of its own gravity, causing the liquid to accumulate in the second cavity 272. The difficulty of the liquid in the second cavity 272 to flow back increases, resulting in a decrease in the heat dissipation capacity of the heat spreader 20. The embodiment of the present application isolates the second cavity 272 and the third cavity 273 by providing a partition 28 between the second cavity 272 and the third cavity 273, preventing the liquid in the third cavity 273 from flowing to the second cavity 272, so that the liquid in the third cavity 273 flows back to the first cavity 271, achieving circulating heat dissipation. In addition, the partition 28 has a diversion effect on the liquid in the third cavity 273.

[0095] In some embodiments, the partition member 28 and the first cover plate 24 are integrally formed. This integrally formed structure can eliminate the need for a fixed connection process between the partition member 28 and the first cover plate 24. Furthermore, the integrally formed structure of the partition member 28 and the first cover plate 24 allows for a tight connection between the first cover plate 24 and the partition member 28, preventing a loose connection between the first cover plate 24 and the partition member 28 from creating a gap that could cause liquid in the third cavity 273 to flow into the second cavity 272. In other embodiments, the partition member 28 and the first cover plate 24 are separate structures and are fixedly connected.

[0096] In some embodiments, the surface of the partition member 28 facing the second cavity 272 is a curved surface, or the surface of the partition member 28 facing the third cavity 273 is a curved surface. Alternatively, the surface of the partition member 28 facing the second cavity 272 and the surface of the partition member 28 facing the third cavity 273 may both be curved surfaces. When the surface of the partition member 28 facing the third cavity 273 is a curved surface, liquid in the third cavity 273 can flow along the curved surface to the first cavity 271, avoiding the problem of severe accumulation of liquid at the partition member 28 and its inability to flow back to the first cavity 271 when the surface of the partition member 28 facing the third cavity 273 is a surface with a large bend angle. In addition, the curved surface can reduce resistance to gas. The curved surface of the second cavity 272 and the curved surface of the partition member 28 facing the third cavity 273 can prevent the partition member 28 from affecting gas diffusion and the heat dissipation effect of the heat sink.

[0097] In some embodiments, referring to Figures 11 and 17 , the partition member 28 includes a first end 281 and a second end 282 disposed opposite each other. The first end 281 is closer to the first region 21 than the second end 282, and the second end 282 is fixedly connected to the inner sidewall of the first cover plate 24. The dimension of the first end 281 in the second direction A2 is smaller than the dimension of the second end 282 in the second direction A2, and the second direction A2 is perpendicular to the first direction A1. The first end 281 is smaller in width than the second end 282, which facilitates rapid flow of liquid from the second end 282 to the first end 281 and convergence in the first region 21, thereby improving the heat dissipation capacity of the vapor chamber 20.

[0098] 11 and 17 , the first cover plate 24 may be provided with a support column 242, one end of the support column 242 being abutted against the side of the first cover plate 24 facing the second cover plate 25, and the other end of the support column 242 being abutted against the second capillary mesh 262, so as to support the space between the first cover plate 24 and the second cover plate 25, thereby forming a stable, closed cavity 27. The support column 242 can enhance the strength of the heat spreader 20. There can be multiple support columns 242, and the multiple support columns 242 can be arranged according to the size and shape of the heat spreader. For example, the support columns 242 can be arranged in an array or in an irregular arrangement. More support columns 242 can be distributed in the central area of ​​the heat spreader 20, and fewer support columns 242 can be distributed in the edge area of ​​the heat spreader 20. The shape of the support column 242 is not limited to a cylindrical structure, and the support column 242 can also be a strip structure.

[0099] In some embodiments, the first capillary wire 263 and the second capillary wire 264 are staggered with the support pillars 242 and the partition 28. For example, the first capillary wire 263 and the second capillary wire 264 can be distributed in the gaps between the plurality of support pillars 242, and the first capillary wire 263 and the second capillary wire 264 can be spaced apart from the partition 28.

[0100] Solution 4: As shown in Figures 19 and 20, Figure 19 is a partial structural diagram of another vapor chamber 20. The structure in Figure 19 is a schematic diagram of the vapor chamber 20 without the first cover plate 24. To clearly illustrate the internal structure of vapor chamber 20, Figure 20 is a schematic diagram of the internal structure of vapor chamber 20. It can be understood that the difference between Figure 20 and Figure 13 is that the first capillary line 263 in Figure 20 is closer to the right.

[0101] The second region 22 may include a first side 221 and a second side 222. The temperature of the first side 221 is lower than that of the second side 222. The portion of the first capillary line 263 located in the second region 22 is located on the first side 221. The first side 221 is closer to the first region 21 than the second side 222. Electronic devices typically include a heat sink 105. The heat sink 105 is located on the first side 221 and directs heat toward the second side 222, thereby dissipating the heat away from the vapor chamber 20. Therefore, the temperature of the first side 221 is lower than that of the second side 222. In a reverse gravity scenario, if the second cavity 272 experiences reverse gravity, positioning the portion of the first capillary line 263 located in the second region 22 on the lower-temperature first side 221 facilitates rapid reflow of liquid within the second cavity 272, preventing liquid accumulation therein and effectively addressing the reverse gravity issue. It can be understood that compared with the second side 222 with a higher temperature, the gas is easier to liquefy into liquid on the first side 221 with a lower temperature. By setting the part of the first capillary 263 located in the second area 22 on the first side 221 where the gas is easier to liquefy, the liquid liquefied on the first side 221 can be promptly and quickly returned to the first cavity 271.

[0102] In some embodiments, the third region 23 may include a third side 231 and a fourth side 232. The temperature of the third side 231 is lower than that of the fourth side 232. The portion of the second capillary line 264 located in the third region 23 is located on the fourth side. The third side 231 is closer to the first region 21 than the fourth side 232. A heat sink 105 is typically provided in an electronic device. The heat sink 105 is disposed on the third side 231 and blows heat toward the second side 222 to move the heat away from the vapor chamber 20. The portion of the first capillary thread 263 located in the second region 22 is located on the first side 221, where the temperature is lower, while the portion of the second capillary thread 264 located in the third region 23 is located on the fourth side 232, where the temperature is higher. This results in a staggered arrangement of the first capillary thread 263 and the second capillary thread 264. The second capillary thread 264 serves to isolate the second cavity 272 from the third cavity 273, preventing some of the liquid in the third cavity 273 from flowing into the second cavity 272. This facilitates the backflow of the liquid in the third cavity 273 back into the first cavity 271, thereby improving the heat dissipation capacity of the vapor chamber 20. Furthermore, the staggered arrangement of the first capillary thread 263 and the second capillary thread 264 isolates the second cavity 272 from the third cavity 273, facilitating the completion of the vacuuming process, increasing the vacuum level within the cavity, and enhancing the heat dissipation capacity of the vapor chamber.

[0103] As shown in Figures 21 and 22, Figure 21 is a schematic diagram of a partial structure of another vapor chamber 20. The structure in Figure 21 is a schematic diagram of the structure of the vapor chamber 20 after removing the first cover plate 24, in order to clearly illustrate the internal structure of the vapor chamber 20. Figure 22 is a schematic diagram of the internal structure of the vapor chamber 20. When the number of first capillaries 263 in the second region 22 is two, both first capillaries 263 can be arranged near the first side 221 to promptly and quickly return the liquid liquefied on the first side 221 to the first cavity 271.

[0104] As shown in Figure 23, Figure 23 is a schematic structural diagram of another heat spreader 20. (a1) in Figure 23 is that the thickness of the second cavity 272 is greater than the thickness of the first cavity 271, and two first capillaries 263 are set in the second area 22, and the two first capillaries 263 can be set close to the first side 221 with a lower temperature, so that the liquid liquefied on the first side 221 can be promptly and quickly returned to the first cavity 271. (a2) in Figure 23 is that the thickness of the second cavity 272 is greater than the thickness of the first cavity 271, and a partition 28 is set to isolate the second cavity 272 and the third cavity 273, preventing the liquid in the third cavity 273 from flowing to the second cavity 272, so that the liquid in the third cavity 273 flows back to the first cavity 271, realizing circulating heat dissipation. In Figure 23 (a3), the thickness of the second cavity 272 is greater than that of the first cavity 271. Positioning the first capillary 263 on the lower-temperature first side 221 facilitates rapid backflow of the liquid within the second cavity 272, preventing liquid accumulation within the second cavity 272 and effectively addressing the inverse gravity problem. Furthermore, the staggered arrangement of the first capillary 263 and the second capillary 264 isolates the second cavity 272 from the third cavity 273, facilitating the completion of the vacuuming process and improving the vacuum level within the cavity.

[0105] The difference between (a1), (a2), and (a3) ​​in Figure 23 and the aforementioned embodiment is that the external shape of the vapor chamber 20 is different. The vapor chamber 20 in the aforementioned embodiment is Y-shaped, while the vapor chamber 20 in Figure 23 is T-shaped. The vapor chamber 20 in the embodiment of the present application can have a variety of shapes, which are not limited in this application. The vapor chamber 20 in Figure 23 can also adopt other aforementioned designs besides (a1), (a2), and (a3) ​​to solve the heat dissipation problem of the vapor chamber 20.

[0106] As shown in Figure 24, Figure 24 is a schematic structural diagram of another heat spreader 20. (b1) in Figure 24 is that the thickness of the second cavity 272 is greater than the thickness of the first cavity 271, and two first capillaries 263 are set in the second area 22, and both first capillaries 263 can be set close to the first side 221 with a lower temperature, so that the liquid liquefied on the first side 221 can be promptly and quickly returned to the first cavity 271. (b2) in Figure 24 is that the thickness of the second cavity 272 is greater than the thickness of the first cavity 271, and a partition 28 is set to isolate the second cavity 272 and the third cavity 273, preventing the liquid in the third cavity 273 from flowing to the second cavity 272, so that the liquid in the third cavity 273 flows back to the first cavity 271, thereby realizing circulating heat dissipation. In Figure 24 (b3), the thickness of the second cavity 272 is greater than that of the first cavity 271. Positioning the first capillary 263 on the lower-temperature first side 221 facilitates rapid backflow of the liquid within the second cavity 272, preventing liquid accumulation within the second cavity 272 and effectively addressing the problem of inverse gravity. Furthermore, the staggered arrangement of the first capillary 263 and the second capillary 264 isolates the second cavity 272 from the third cavity 273, facilitating the completion of the vacuuming process and improving the vacuum level within the cavity.

[0107] The difference between (b1), (b2) and (b3) in Figure 24 and the aforementioned embodiments is that the external shape of the heat spreader 20 is different. The heat spreader 20 in Figure 24 is square as a whole (it can be understood that the square shape can be a rectangle or a square, and the square heat spreader 20 can be provided with a notch as needed). The heat spreader 20 in the embodiment of the present application can be of various shapes, and this application does not limit this. The heat spreader 20 in Figure 24 can also adopt other aforementioned designs other than (b1), (b2) and (b3) to solve the heat dissipation problem of the heat spreader 20.

[0108] In this embodiment of the present application, by making the thickness of the second cavity 272 greater than that of the first cavity 271, i.e., by designing the cavity 27 with unequal thickness, the size of the second cavity 272, which is used to dissipate heat from the heating element, is increased. This reduces the air resistance of the gas in the second cavity 272 and increases the flow capacity, facilitating the timely and rapid diffusion of gas into the second cavity 272. This improves the heat dissipation efficiency and capacity of the vapor chamber 20. In this embodiment of the present application, by increasing the size of the portion of the capillary structure located in the second region 22 to increase the capillary force of the capillary structure in the second region 22, increasing the number of capillary threads in the second region 22 to increase the capillary force of the capillary structure in the second region 22, providing a partition 28, locating the first capillary threads 263 on the lower-temperature first side 221, and staggering the first capillary threads 263 and the second capillary threads 264, the problem of poor heat dissipation of the vapor chamber 20 in reverse gravity scenarios is resolved, thereby improving the heat dissipation efficiency and capacity of the vapor chamber 20. It can be understood that the heat spreader 20 in the embodiment of the present application can achieve good heat dissipation effect for the heating element in both reverse gravity scenarios and non-reverse gravity scenarios, and the user can obtain a good usage experience in any usage scenario.

[0109] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat spreader, applied to electronic equipment, characterized in that: It includes a first cover plate, a second cover plate and a capillary structure; The edge of the first cover plate is fixedly connected to the edge of the second cover plate to form a closed cavity between the first cover plate and the second cover plate; The capillary structure is located in the cavity, and the capillary structure is used to guide the flow of liquid in the cavity; The cavity comprises a first cavity and a second cavity which are interconnected, the first cavity is located in a first area of ​​the vapor chamber, the second cavity is located in a second area of ​​the vapor chamber, and the first area is used to connect a heating element of the electronic device; A size of the second cavity in a first direction is greater than a size of the first cavity in the first direction, and the first direction is an arrangement direction of the first cover plate and the second cover plate.

2. The heat spreader according to claim 1, wherein: In the first direction, a size of a portion of the capillary structure located in the second region is larger than a size of a portion of the capillary structure located in the first region.

3. The heat spreader according to claim 1 or 2, characterized in that: The capillary structure comprises a capillary net and a capillary line, wherein the capillary net is fixed to the second cover plate, and the capillary line is fixed to a side of the capillary net facing the first cover plate; In the first direction, the size of the capillary line in the second area is larger than that in the first area, or, in the first direction, the size of the capillary net in the second area is larger than that in the first area.

4. The heat spreader according to claim 1 or 2, characterized in that: The capillary structure includes a capillary mesh and a capillary wire, the capillary mesh is fixed to the second cover plate, the capillary wire is fixed to the side of the capillary mesh facing the first cover plate, and the width of the portion of the capillary wire located in the second area is greater than the width of the portion of the capillary wire located in the first area.

5. The vapor chamber according to claim 1, wherein: The capillary structure includes a capillary mesh and capillary wires. The capillary mesh is fixed to the second cover plate. The capillary wires are fixed to a side of the capillary mesh facing the first cover plate. The number of the capillary wires in the second area is greater than or equal to two.

6. The vapor chamber according to any one of claims 1 to 5, characterized in that: The cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, and the third cavity is located in a third area of ​​the vapor chamber; The vapor chamber includes a partition member, which is located between the second cavity and the third cavity and is used to isolate the second cavity from the third cavity.

7. The vapor chamber according to claim 6, wherein: The surface of the partition member facing the second cavity is a curved surface, or the surface of the partition member facing the third cavity is a curved surface.

8. The vapor chamber according to claim 7, wherein: The partition member includes a first end and a second end that are arranged opposite to each other, the first end is closer to the first area than the second end, a dimension of the first end in a second direction is smaller than a dimension of the second end in the second direction, and the second direction is perpendicular to the first direction.

9. The vapor chamber according to any one of claims 6 to 8, characterized in that: The capillary structure includes a capillary mesh and a capillary thread, the capillary mesh is fixed to the second cover plate, the capillary thread is fixed to the side of the capillary mesh facing the first cover plate, one side of the partition piece abuts against the first cover plate, and the other side of the partition piece abuts against the capillary mesh.

10. The vapor chamber according to claim 9, wherein: The partition member and the first cover plate are an integrally formed structure.

11. The vapor chamber according to claim 1, wherein: The capillary structure comprises a capillary mesh and a first capillary line, wherein the capillary mesh is fixed to the second cover plate, the first capillary line is fixed to a side of the capillary mesh facing the first cover plate, and at least part of the first capillary line is located in the second area; The second region includes a first side and a second side, the temperature of the first side is lower than the temperature of the second side, and a portion of the first capillary line located in the second region is located on the first side.

12. The vapor chamber according to claim 11, wherein: The cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, and the third cavity is located in a third area of ​​the vapor chamber; The capillary structure further includes a second capillary line, at least part of which is located in the third area; The third region includes a third side and a fourth side, the temperature of the third side is lower than the temperature of the fourth side, and a portion of the second capillary line located in the third region is located on the fourth side.

13. The vapor chamber according to claim 1, wherein: The material of the first cover plate or the second cover plate is at least one of stainless steel, copper, and titanium.

14. The vapor chamber according to claim 1, wherein: The first region is used for absorbing heat, and the second region is used for dissipating heat.

15. An electronic device, characterized in that: It comprises a heating element and a vapor chamber as claimed in any one of claims 1 to 14, wherein the heating element is connected to the vapor chamber, and the heat energy of the heating element is conducted to the vapor chamber.

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